Evaporation device

The deposition apparatus addresses non-uniform deposition issues by employing a chamber with strategically arranged nozzles and tailored nozzle shapes, resulting in improved uniformity and reduced material waste.

JP7768668B2Active Publication Date: 2025-11-12SAMSUNG DISPLAY CO LTD
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Patent Information

Application Number
JP2020140078
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Priority Date
2019-09-03
Filing Date
2020-08-21
Publication Date
2025-11-12
Estimated Expiration
2040-08-21

AI Technical Summary

Technical Problem

Existing deposition apparatuses face challenges in achieving uniform deposition of materials on substrates, leading to non-uniform layer formation and inefficiencies in material use.

Method used

The apparatus features a chamber with a crucible covered by a cover portion from which nozzles protrude, arranged in a specific pattern with varying distances and angles, and nozzles with unique inlet and outlet shapes to enhance deposition uniformity and material linearity.

Benefits of technology

This configuration improves deposition uniformity and reduces material wastage by minimizing shadow areas and optimizing the deposition process, enhancing material utilization efficiency.

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Smart Images

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Patent Text Reader

Abstract

To provide a vapor deposition apparatus capable of improving uniformity of vapor deposition.SOLUTION: A display device includes a chamber, a crucible arranged inside the chamber, a cover part for covering the crucible, and 2n nozzles (n is a positive integer) projecting from the cover part, and arrayed along a first direction, in which a distance between an n-th nozzle and a (n+1)-th nozzle is larger than a distance between a (2n-1)-th nozzle and a 2n-th nozzle.SELECTED DRAWING: Figure 6
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Citation Information

Patent Citations

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    JP2011012309A

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    JP2011168805A

  • Nozzles for distribution assembly of material deposition source configurations, material deposition source configurations, vacuum deposition systems, and methods for depositing materials.

    JP2018532876A

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    US20160214133A1

  • Vapor deposition source, vapor deposition device, and method for manufacturing vapor deposition film

    WO2019064426A1