Multilayer Devices

Abstract

To provide a multilayer device capable of forming a rejection band depending on a required specification.SOLUTION: A multilayer device 300A comprises: a dielectric body 310; a signal line 320 provided inside the dielectric body 310; a ground electrode 330 provided inside the dielectric body 310 or on an outer surface of the same; a plurality of plane electrodes 340 provided inside the dielectric body 310, arranged in parallel to the ground electrode 330 and directing in a first direction d1 from an input side of the signal line 320 toward an output side of the same; a plurality of connection electrodes 350 provided inside the dielectric body 310 so as to connect the plurality of plane electrodes 340 and the ground electrode 330; a plurality of signal terminals 360 provided on the outer surface of the dielectric body 310 and connected with the signal line 320; and a plurality of ground terminals 370 provided on the outer surface of the dielectric body 310 and connected with the ground electrode 330. Each connection electrode 350 has at least partially a coil shape or a meander shape.SELECTED DRAWING: Figure 5A

Description

[Technical Field]

[0001] The present disclosure relates to multilayer devices. [Background technology]

[0002] Conventionally, functional substrates that control the passing characteristics of high-speed digital signals and high-frequency signals (hereinafter referred to as high-speed / high-frequency signals) have been known. As an example of this type of functional substrate, Patent Document 1 discloses a functional substrate that includes a mushroom structure composed of conductor elements (planar electrodes) and through vias (connection electrodes), and a conductor (ground electrode) that functions as ground. This functional substrate has a structure in which mushroom structures are periodically arranged, and can suppress the passing of high-speed / high-frequency signals of specific frequencies. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] International Publication No. 2011 / 111311 Summary of the Invention [Problem to be solved by the invention]

[0004] However, while conventional functional substrates can block the passage of specific high-speed and high-frequency signals, they may not be able to form a stopband that blocks the passage of high-speed and high-frequency signals depending on the required specifications of multilayer devices.

[0005] An object of the present disclosure is to provide a multilayer device that can form stop bands according to required specifications. [Means for solving the problem]

[0006] A multilayer device according to one embodiment of the present disclosure comprises a dielectric, a signal line disposed inside the dielectric such that a portion of the signal line is exposed on an outer surface of the dielectric, a ground electrode disposed inside or on an outer surface of the dielectric such that at least a portion of the signal line is exposed on the outer surface of the dielectric, a plurality of planar electrodes disposed inside the dielectric, parallel to the ground electrode and arranged along a first direction from the input side to the output side of the signal line, a plurality of connection electrodes disposed inside the dielectric and connecting the plurality of planar electrodes and the ground electrode, a plurality of signal terminals disposed on the outer surface of the dielectric and connected to the signal line, and a plurality of ground terminals disposed on the outer surface of the dielectric and connected to the ground electrode, wherein at least a portion of the connection electrodes has a coil shape or a meander shape.

[0007] A multilayer device according to one embodiment of the present disclosure includes a signal line for transmitting a signal, a ground electrode set to ground potential, a plurality of planar electrodes parallel to the ground electrode and arranged along a first direction from the input side to the output side of the signal line, a dielectric provided between each of the signal line, the plurality of planar electrodes, and the ground electrode, and a plurality of connection electrodes located between the plurality of planar electrodes and the ground electrode and connecting the plurality of planar electrodes and the ground electrode, wherein at least a portion of the connection electrodes has a coil shape or a meander shape. [Effects of the Invention]

[0008] The multilayer device of the present disclosure allows for the formation of stop bands according to required specifications. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1 is a perspective view showing an example of a multilayer device. [Figure 2] FIG. 2 is a diagram showing an example of an equivalent circuit of the multilayer device shown in FIG. [Figure 3] 1 is an external view of a multilayer device according to a first embodiment. [Figure 4]2 is a diagram showing a signal line, a planar electrode, a ground electrode, and a connection electrode of the multilayer device according to the first embodiment. FIG. [Figure 5A] 1 is a plan view of a signal line and the like of a multilayer device according to a first embodiment, as viewed from above. [Figure 5B] 5B is a cross-sectional view of the multilayer device according to the first embodiment taken along line VB-VB in FIG. 5A. FIG. [Figure 5C] FIG. 2 is a bottom view of the multilayer device according to the first embodiment. [Figure 6] 3A to 3C are diagrams illustrating an example of a manufacturing process for the multilayer device according to the first embodiment. [Figure 7] 10 is a diagram showing connection electrodes and the like of a multilayer device according to a first modification of the first embodiment. FIG. [Figure 8] FIG. 1 is a diagram showing the transmission characteristics of the multilayer devices according to the first embodiment and the first modification. [Figure 9] 10 is a diagram illustrating a signal line, a planar electrode, a ground electrode, and a connection electrode of a multilayer device according to a second modification of the first embodiment. FIG. [Figure 10A] 10 is a plan view of a signal line and the like of a multilayer device according to a second modification of the first embodiment, as viewed from above. FIG. [Figure 10B] 10B is a cross-sectional view of the multilayer device according to the second modification of the first embodiment, taken along the line XB-XB shown in FIG. 10A. FIG. [Figure 10C] FIG. 10 is a bottom view of a multilayer device according to a second modification of the first embodiment. [Figure 11] 10 is a diagram illustrating a signal line, a planar electrode, a ground electrode, and a connection electrode of a multilayer device according to a third modification of the first embodiment. FIG. [Figure 12] 10A and 10B are diagrams illustrating signal lines, planar electrodes, ground electrodes, and connection electrodes of a multilayer device according to a reference example. [Figure 13] 10 is a diagram showing the transmission characteristics of multilayer devices according to Modifications 2 and 3 of Embodiment 1 and a reference example. FIG. [Figure 14] FIG. 10 is an external view of a multilayer device according to a second embodiment. [Figure 15]10 is a diagram showing a signal line, a planar electrode, a ground electrode, and a connection electrode of a multilayer device according to a second embodiment. FIG. [Figure 16] 10 is a diagram illustrating a signal line, a planar electrode, a ground electrode, and a connection electrode of a multilayer device according to a first modification of the second embodiment. FIG. DETAILED DESCRIPTION OF THE INVENTION

[0010] (Background to this disclosure) The background to the present disclosure will be described with reference to FIGS. 1 and 2. FIG.

[0011] FIG. 1 is a perspective view showing an example of a multilayer device 1. As shown in FIG.

[0012] 1, the multilayer device 1 includes a signal line 20 that transmits high-speed, high-frequency signals, a ground electrode 30 set to ground potential, a plurality of planar electrodes 40 arranged along the signal line 20, and a plurality of connection electrodes 50 that connect the ground electrode 30 and the plurality of planar electrodes 40. The signal line 20, the ground electrode 30, the planar electrode 40, and the connection electrodes 50 are provided inside or on the surface of a dielectric (not shown). The connection electrodes 50 are an example of via electrodes.

[0013] This multilayer device 1 has a structure in which a plurality of mushroom structures, each consisting of a planar electrode 40 and a connection electrode 50, are arranged at intervals sufficiently small relative to the wavelength of electromagnetic waves. Such a structure in which a plurality of mushroom structures are arranged at intervals sufficiently small relative to the wavelength of electromagnetic waves is also called an EBG (Electromagnetic Band Gap) structure. In the multilayer device 1 having an EBG structure, it is possible to make the effective permittivity and permeability in the medium negative values.

[0014] FIG. 2 is a diagram showing an example of an equivalent circuit of the multilayer device 1 shown in FIG.

[0015] 2 is composed of an inductive component L20 of the signal line 20 and a parallel circuit (parallel resonant circuit) provided in the path connecting the signal line 20 and the ground electrode 30. The parallel circuit is composed of a capacitive component C40 based on the signal line 20 and the planar electrode 40, an inductive component L50 due to the connection electrode 50, and a capacitive component C20 based on the signal line 20 and the ground electrode 30.

[0016] In the multilayer device 1, by arranging multiple mushroom structures as shown in Fig. 1, it is possible to control the admittance of the parallel circuit shown in Fig. 2 and make the permittivity a negative value. In the band where the permittivity is negative, high-speed and high-frequency signals cannot propagate through the signal line, and the multilayer device 1 functions as a band-stop filter.

[0017] The multilayer device of this embodiment has the following configuration to enable the formation of a stop band that blocks the passage of high-speed, high-frequency signals according to required specifications.

[0018] Hereinafter, the embodiments will be described in more detail with reference to the drawings.

[0019] Note that the embodiments described below each illustrate a specific example of the present disclosure. The numerical values, shapes, materials, components, component placement positions, connection configurations, steps, and step sequences shown in the following embodiments are examples and are not intended to limit the present disclosure. Furthermore, among the components in the following embodiments, components that are not recited in independent claims are described as optional components.

[0020] Furthermore, in this specification, terms indicating the relationship between elements, such as parallelism, terms indicating the shape of elements, such as rectangular parallelepiped, and numerical ranges are not expressions that only express a strict meaning, but are expressions that also include a substantially equivalent range, for example, a difference of about a few percent.

[0021] In addition, each drawing is a schematic diagram in which emphasis, omission, or adjustment of proportions has been appropriately made to illustrate the present disclosure, and is not necessarily an exact illustration, and may differ from the actual shape, positional relationship, and proportion. In each drawing, substantially the same configuration is assigned the same reference numeral, and duplicated explanations may be omitted or simplified.

[0022] Furthermore, in this specification, the terms "top surface" and "bottom surface" in the configuration of a multilayer device do not refer to the top surface (the surface on the vertically upper side) and bottom surface (the surface on the vertically lower side) in absolute spatial recognition, but are used as terms defined by the relative positional relationship of the components of the multilayer device.

[0023] (Embodiment 1) [Multi-layer device configuration] The configuration of the multilayer device 300A according to the first embodiment will be described with reference to the drawings.

[0024] FIG. 3 is an external view of the multilayer device 300A according to the first embodiment. FIG. 4 is a diagram showing the signal line 320, planar electrodes 341, 342, and 343, the ground electrode 330, and connection electrodes 351, 352, and 353 of the multilayer device 300A. FIG. 5A is a plan view of the signal line 320 and the like of the multilayer device 300A, as viewed from above. FIG. 5B is a cross-sectional view of the multilayer device 300A taken along line VB-VB in FIG. 5A. FIG. 5C is a bottom view of the multilayer device 300A.

[0025] Fig. 4 shows the multilayer device 300A without the signal terminals 361 and 362, the ground terminals 371, 372, 373, and 374, and the dielectric 310. In Fig. 5A, the signal line 320 is shown by a solid line. In Fig. 5C, the signal line, the planar electrode, and the connection electrode are not shown.

[0026] 3, 4, and 5A to 5C includes a dielectric 310, a signal line 320, a ground electrode 330, a plurality of planar electrodes 341, 342, and 343, and a plurality of connection electrodes 351, 352, and 353. The multilayer device 300A also includes a plurality of signal terminals 361 and 362, and a plurality of ground terminals 371, 372, 373, and 374.

[0027] In the following, some or all of the plurality of planar electrodes 341-343 may be referred to as planar electrodes 340, and some or all of the plurality of connection electrodes 351-353 may be referred to as connection electrodes 350. Furthermore, some or all of the plurality of signal terminals 361, 362 may be referred to as signal terminals 360, and some or all of the plurality of ground terminals 371-374 may be referred to as ground terminals 370.

[0028] For example, the signal line 320, the ground electrode 330, the planar electrode 340, and the connection electrode 350 are made of a metal material such as silver or copper. The signal line 320, the ground electrode 330, the planar electrode 340, and the connection electrode 350 may be made of the same material or the same composition ratio, or may be made of different materials or different composition ratios.

[0029] The dielectric 310 is formed, for example, by stacking multiple dielectric layers. The dielectric 310 is formed, for example, from a dielectric material such as low-temperature co-fired ceramics (LTCC). To miniaturize the multilayer device 300A, it is desirable to use a material with a high relative dielectric constant for the dielectric 310. The dielectric 310 is provided between the signal line 320, the ground electrode 330, and the planar electrode 340. The dielectric 310 is also formed so as to cover the outer peripheral surface of the signal line 320 excluding both end faces, the outer peripheral surface of the ground electrode 330 excluding both end faces, and the electrode structure consisting of the planar electrode 340 and the connection electrode 350.

[0030] Dielectric 310 has a rectangular parallelepiped shape and includes bottom surface 316, top surface 317 facing away from bottom surface 316, and multiple side surfaces 311, 312, 313, and 314 connecting bottom surface 316 and top surface 317. Multiple side surfaces 311 to 314 include side surfaces 311 and 312 facing away from each other, and side surfaces 313 and 314 perpendicular to both side surfaces 311 and 312. Bottom surface 316 and top surface 317 are parallel to each other, side surfaces 311 and 312 are parallel to each other, and side surfaces 313 and 314 are parallel to each other. Corners (ridges) where the surfaces of dielectric 310 intersect may be rounded.

[0031] Here, the direction in which side surface 311 and side surface 312 face each other is called the first direction d1, the direction in which side surface 313 and side surface 314 face each other is called the second direction d2, and the direction in which bottom surface 316 and top surface 317 face each other is called the third direction d3. In the following, the negative side of first direction d1 may be called "one side," and the positive side opposite to the negative side may be called "the other side."

[0032] The signal line 320 is linear and extends along a first direction d1. The signal line 320 is provided inside the dielectric 310 so that both ends of the signal line 320 are exposed on the outer surfaces (side surfaces 311, 312) of the dielectric 310. The signal line 320 is strip-shaped and disposed parallel to the planar electrode 340 and the ground electrode 330. When the multilayer device 300A is mounted in an electronic device, high-speed, high-frequency signals are input to and output from the signal line 320 via a signal terminal 360.

[0033] Signal terminal 360 is provided on side surfaces 311 and 312, which are the outer surfaces of dielectric 310. Of two signal terminals 361 and 362, one signal terminal 361 is provided on side surface 311, and the other signal terminal 362 is provided on side surface 312. One end of signal line 320 is connected to one signal terminal 361, and the other end of signal line 320 is connected to the other signal terminal 362.

[0034] The ground electrode 330 is provided inside the dielectric 310 so that a portion of the ground electrode 330 is exposed on the outer surface (side surfaces 311 and 312) of the dielectric 310. The ground electrode 330 has rectangular cutouts 331 at both ends in the first direction d1 so as not to come into contact with the signal terminal 360, and is disposed at a predetermined distance from the signal terminal 360. The ground electrode 330 is also disposed at a predetermined distance from the side surfaces 313 and 314 so as not to be exposed on the side surfaces 313 and 314. The ground electrode 330 may be provided on the bottom surface 316 of the dielectric 310 instead of inside the dielectric 310. The ground electrode 330 may have an open pattern, such as a mesh structure, instead of a solid pattern. By providing the ground electrode 330 with a mesh structure, the dielectrics 310 can be joined together, thereby increasing the joining strength.

[0035] When the multilayer device 300A is mounted in an electronic device, the ground electrode 330 is set to the ground potential via the ground terminal 370.

[0036] The ground terminal 370 is provided on side surfaces 311 and 312, which are the outer surfaces of the dielectric 310. Of the four ground terminals 371 to 374, one ground terminal 371 and 373 are provided on the side surface 311, and the other ground terminals 372 and 374 are provided on the side surface 312. One end of the ground electrode 330 is connected to one ground terminal 371 and 373, and the other end of the ground electrode 330 is connected to the other ground terminals 372 and 374. One ground terminal 371 and 373 are arranged on both sides of one signal terminal 361 in the second direction d2. The other ground terminals 372 and 374 are arranged on both sides of the other signal terminal 362 in the second direction d2. In other words, one signal terminal 361 is disposed between two ground terminals 371 and 373 , and the other signal terminal 362 is disposed between two ground terminals 372 and 374 .

[0037] The number of ground terminals 370 is not limited to four and may be two. The ground terminals 370 may be provided on each of the side surfaces 311 and 312 or the side surfaces 313 and 314 of the dielectric 310. For example, the ground terminals 370 may be provided on each of the side surfaces 311 and 312. In this case, it is desirable to arrange the ground terminals 370 diagonally so that the mounting orientation does not need to be considered. The ground terminals 370 may also be provided on the side surfaces 313 and 314 in addition to the side surfaces 311 and 312. The ground terminals 370 may also be provided on only the side surfaces 313 and 314. In this case, a portion of the ground electrode 330 may be exposed on the side surfaces 313 and 314, and the ground terminals 370 may be connected to the exposed ground electrode 330.

[0038] The planar electrode 340 is disposed within the dielectric 310 so as to be located between the signal line 320 and the ground electrode 330 in the third direction d3. The planar electrode 340 is disposed parallel to the signal line 320 and the ground electrode 330. The gap between the planar electrode 340 and the signal line 320 is smaller than the gap between the ground electrode 330 and the signal line 320. In this embodiment, the gap between the planar electrode 340 and the signal line 320 is, for example, 0.1 to 0.5 times the gap between the ground electrode 330 and the signal line 320. The size of this gap is appropriately set depending on the stopband required for the multilayer device 300A, etc. The multiple planar electrodes 340 are planar electrodes having a rectangular shape. Note that the shape of the planar electrode 340 is not limited to a rectangle and may be a square, polygon, circle, or ellipse. The multiple planar electrodes 341, 342, and 343 are disposed at equal intervals in this order along the first direction d1. The planar electrodes 341, 342, and 343 have the same shape and size, and the gap between each of the planar electrodes 341, 342, and 343 and the signal line 320 is the same.

[0039] The connection electrode 350 is a conductor that connects the planar electrodes 340 and the ground electrode 330, and is provided inside the dielectric 310. The connection electrode 350 is located between the planar electrodes 340 and the ground electrode 330. The connection electrodes 351, 352, and 353 are arranged in this order at equal intervals along the first direction d1. The connection electrodes 351, 352, and 353 have the same shape and size. The connection electrodes 351 to 353 are provided along the first direction d1 in one-to-one correspondence with the planar electrodes 341 to 343. Specifically, the connection electrode 351 is provided to connect the planar electrode 341 and the ground electrode 330, the connection electrode 352 is provided to connect the planar electrode 342 and the ground electrode 330, and the connection electrode 353 is provided to connect the planar electrode 343 and the ground electrode 330.

[0040] At least a portion of the connection electrode 350 has a coil shape. The connection electrode 350 shown in FIG. 4 has a rectangular coil shape. The coil shape is not limited to a rectangular shape and may be a circular shape. At least a portion of the connection electrode 350 may have a meander shape. The meander shape is a serpentine shape. The meander shape may be a square wave shape, a triangular wave shape, a sine wave shape, or a circular arc wave shape. The meander shape may be provided on a patterned electrode 350p, which will be described later.

[0041] The connection electrode 350 is composed of a plurality of via electrodes 350v and one or more patterning electrodes 350p. In Fig. 5B, eight via electrodes are shown as an example of the plurality of via electrodes 350v, and seven patterning electrodes 350p are shown as an example of the one or more patterning electrodes 350p.

[0042] Each via electrode 350v is cylindrical and formed to penetrate the dielectric layer. The via diameter of the via electrode 350v is, for example, 50 μm. Each via electrode 350v is located between the planar electrode 340 and the ground electrode 330. As shown in FIG. 5A , each via electrode 350v is arranged at a corner of the outer periphery of each planar electrode 340 when viewed from a third direction d3 perpendicular to the planar electrode 340. The multiple via electrodes 350v are alternately arranged at diagonal corners of the planar electrode 340 in the third direction d3 from the ground electrode 330 toward the planar electrode 340. The multiple via electrodes 350v are not directly connected to each other but are connected via patterned electrodes 350p.

[0043] One or more patterning electrodes 350p are provided between the dielectric layers and electrically connect the via electrodes 350v scattered in the third direction d3. The width of the patterning electrodes 350p is, for example, 100 μm. Each patterning electrode 350p is L-shaped and has a pattern shape consisting of 0.5 turns.

[0044] Thus, the connection electrode 350 has a 3.5-turn spiral coil shape formed by eight via electrodes 350v and seven patterned electrodes 350p. The connection electrode 350 is not limited to a spiral coil, and may have a spiral coil shape. In this case, the ends of the via electrodes 350v and the patterned electrodes 350p may be disposed at the outer peripheral edge and center of each planar electrode 340, respectively. Land patterns for connection to the via electrodes 350v may be formed on both ends of the patterned electrodes 350p. The inductive component L50 (see FIG. 2) in the multilayer device 300A is generated by the connection electrodes 350.

[0045] In this embodiment, the connection electrode 350 of the multilayer device 300A has at least a portion that is coil-shaped or meander-shaped. Therefore, the connection electrode 350 can generate an inductive component L50 that corresponds to the coil or meander shape. For example, the inductance value of the connection electrode 350 can be increased by increasing the coil diameter or the number of turns of the coil, and the inductance value can be decreased by decreasing the coil diameter or the number of turns of the coil. Changing the inductance value can change the value of the inductive component L50, thereby changing the frequency of the stopband of the multilayer device 300A. This allows the stopband to be formed according to the required specifications.

[0046] Although the above example shows the multilayer device 300A as a chip component mounted on a printed circuit board or the like, the present invention is not limited to this. For example, the multilayer device 300A may have a configuration in which the dielectric 310, the signal line 320, the ground electrode 330, the planar electrode 340, and the connection electrode 350 are provided inside the printed circuit board as part of the printed circuit board.

[0047] [Manufacturing method for multilayer devices] FIG. 6 is a diagram showing an example of a manufacturing process for the multilayer device 300A.

[0048] First, one or more green sheets without an electrode pattern are stacked to form a lower layer sheet. The green sheets are dielectric sheets that will become dielectric layers after sintering. Next, green sheets with ground electrode patterns are stacked on top of the lower layer sheets. The ground electrode patterns are printed patterns that will become ground electrodes 330 after sintering. Next, multiple green sheets with via electrode patterns and patterned electrode patterns are stacked on top of the green sheets with the ground electrode patterns. The via electrode patterns and patterned electrode patterns are printed patterns that will become connection electrodes 350 (see FIG. 6(a)) after sintering. Next, green sheets with via electrode patterns and planar electrode patterns are stacked on top of the multiple stacked green sheets. The planar electrode patterns are printed patterns that will become planar electrodes 340 (see FIG. 6(b)) after sintering. Next, green sheets with signal line patterns are stacked on top of the green sheets with the via electrode patterns and planar electrode patterns. The signal line patterns are printed patterns that will become signal lines 320 (see FIG. 6(c)) after sintering. Next, one or more green sheets without electrode patterns are laminated on the green sheet with the signal line pattern to form an upper layer sheet.

[0049] The stacked sheets are pressed to form a mother laminate. The mother laminate is then cut into individual pieces, and the individual pieces are sintered. Signal terminals 360 and ground terminals 370 are then formed on the side surfaces of the sintered laminate. This completes the multilayer device 300A.

[0050] [First Modification of First Embodiment] A description will be given of the configuration of a multilayer device 300B according to Modification 1 of Embodiment 1. In Modification 1, an example will be described in which the width of a patterned electrode 350p is narrower than that of Embodiment 1.

[0051] The multilayer device 300B according to the first modification includes a dielectric 310, a signal line 320, a ground electrode 330, a plurality of planar electrodes 340, and a plurality of connecting electrodes 350. The multilayer device 300B also includes a plurality of signal terminals 360 and a plurality of ground terminals 370. The configurations of the dielectric 310, the signal line 320, the ground electrode 330, the plurality of planar electrodes 340, the plurality of signal terminals 360, and the plurality of ground terminals 370 of the multilayer device 300B are the same as those of the first embodiment.

[0052] 7 is a diagram showing connection electrodes 350 and the like of a multilayer device 300B according to Modification 1. The drawing also shows a ground electrode 330.

[0053] 7, the width of the patterned electrode 350p of Modification 1 is narrower than the width of the patterned electrode 350p of Embodiment 1. The width of the patterned electrode 350p of Modification 1 shown in the figure is 25 μm, and as a result, the inductance value of the connection electrode 350 in Modification 1 is higher than the inductance value of the connection electrode 350 in Embodiment 1.

[0054] In the first modification, at least a portion of the connection electrode 350 of the multilayer device 300B also has a coil shape. For example, by increasing the width of the patterned electrode 350p of the connection electrode 350, the inductance value of the connection electrode 350 can be reduced, and by decreasing the width of the patterned electrode 350p, the inductance value can be increased. Changing the inductance value can change the value of the inductive component L50, which in turn can change the frequency of the stop band of the multilayer device 300B. This makes it possible to form a stop band according to the required specifications.

[0055] [Effects of the First Embodiment and Modification 1] The effects of the multilayer devices 300A and 300B having the above configuration will be described with reference to FIG.

[0056] The design conditions for the multilayer devices 300A and 300B are as follows:

[0057] The dimensions of the multilayer device are: length 0.8 mm, width 0.6 mm, height 0.45 mm Signal line 320 width: 0.05 mm Width of the planar electrode 340 (length in the second direction d2): 0.5 mm Length of the planar electrode 340 (length in the first direction d1): 0.2 mm Distance between adjacent planar electrodes 340 in the first direction d1: 0.05 mm Number of turns of connecting electrode 350: 3.5 turns Via electrode 350v via diameter: 100 μm Width of patterned electrode 350p of multilayer device 300A: 100 μm Width of patterned electrode 350p of multilayer device 300B: 25 μm The thickness of each of the signal line 320, the ground electrode 330, and the planar electrode 340: 10 μm Thickness of the dielectric 310 below the ground electrode 330: 35 μm Distance between ground electrode 330 and flat electrode 340: 320 μm Distance between the planar electrode 340 and the signal line 320: 25 μm Thickness of the dielectric 310 above the signal line 320: 70 μm Dielectric constant of dielectric 310: 4.1 Dielectric tangent of dielectric 310: 0.015

[0058] The transmission characteristics of the multilayer device under these design conditions will be explained.

[0059] 8 is a diagram showing the transmission characteristics of the multilayer devices according to the first embodiment and the first modification, in which the vertical axis represents the S parameter (S21).

[0060] As shown in FIG. 8 , the multilayer device 300A of the first embodiment has an attenuation pole near a frequency of 20.5 GHz, where the insertion loss is greatest. The multilayer device 300A is capable of blocking signals at a frequency of 20.5 GHz. The multilayer device 300B of the first modification has an attenuation pole near a frequency of 11 GHz, which is lower than the stop band of the multilayer device 300A, where the insertion loss is greatest. The multilayer device 300B is capable of blocking signals at a frequency of 11 GHz.

[0061] As in these multilayer devices 300A and 300B, the frequency of the stop band of the multilayer device can be changed by changing the coil shape of the connection electrode 350. This makes it possible to form the stop band according to the required specifications.

[0062] [Modification 2 of Embodiment 1] A description will be given of the configuration of a multilayer device 300C according to Modification 2 of Embodiment 1. In Modification 2, an example will be described in which the signal line 320 has a meander shape.

[0063] The multilayer device 300C according to the second modification includes a dielectric 310, a signal line 320, a ground electrode 330, a plurality of planar electrodes 340, and a plurality of connecting electrodes 350. The multilayer device 300C also includes a plurality of signal terminals 360 and a plurality of ground terminals 370. The configurations of the dielectric 310, the ground electrode 330, the plurality of planar electrodes 340, the plurality of connecting electrodes 350, the plurality of signal terminals 360, and the plurality of ground terminals 370 of the multilayer device 300C are the same as those of the first embodiment.

[0064] Fig. 9 is a diagram showing a signal line 320, a planar electrode 340, a ground electrode 330, and a connection electrode 350 of a multilayer device 300C according to Modification 2. Fig. 10A is a plan view of the signal line 320 and the like of the multilayer device 300C as viewed from above. Fig. 10B is a cross-sectional view of the multilayer device 300C as viewed from line XB-XB shown in Fig. 10A. Fig. 10C is a bottom view of the multilayer device 300C.

[0065] Fig. 9 shows the multilayer device 300C excluding signal terminals 361 and 362, ground terminals 371, 372, 373, and 374, and dielectric 310. Fig. 10A shows the signal line 320 with a solid line, and does not show the planar electrode, connecting electrode, or ground electrode. Fig. 10C does not show the signal line, planar electrode, or connecting electrode.

[0066] The signal line 320 of Modification 2 has at least a portion having a meander shape. The meander shape is a serpentine shape. The signal line 320 shown in FIG. 9 has a square-wave meander shape. Note that the meander shape is not limited to a square wave shape, and may be a triangular wave shape, a sinusoidal wave shape, or a circular arc wave shape. Furthermore, the meander shape may be a pulse wave shape that is convex or concave in the second direction d2.

[0067] The signal line 320 has meander line portions 321, 322, and 323, which are meander-shaped regions. The meander line portions 321, 322, and 323 are arranged in this order along a first direction d1 from the input side toward the output side of the signal line 320. The meander line portions 321, 322, and 323 are provided in one-to-one correspondence with the planar electrodes 341, 342, and 343. Specifically, the meander line portion 321 corresponds to the planar electrode 341, the meander line portion 322 corresponds to the planar electrode 342, and the meander line portion 323 corresponds to the planar electrode 343.

[0068] In other words, the meander line portions 321, 322, and 323 are provided at positions facing the planar electrodes 341, 342, and 343, respectively. That is, when viewed from a direction perpendicular to the planar electrode 340, i.e., the third direction d3, the meander line portion 321 overlaps the planar electrode 341, the meander line portion 322 overlaps the planar electrode 342, and the meander line portion 323 overlaps the planar electrode 343. In this example, the length in the second direction d2 of each of the meander line portions 321 to 323 is the same as the length in the second direction d2 of each of the planar electrodes 341 to 343. The length in the first direction d1 of each of the meander line portions 321 to 323 is shorter than the length in the first direction d1 of each of the planar electrodes 341 to 343. The capacitive component C40 (see FIG. 2) in the multilayer device 300C is generated in the areas where the meander line portions 321, 322, and 323 and the planar electrodes 341, 342, and 343 face each other.

[0069] The signal line 320 also has a plurality of linear coupling line portions 326, 327, 328, and 329. The coupling line portion 326 connects the signal terminal 361 and the meander line portion 321. The coupling line portion 327 connects the meander line portions 321 and 322 that are adjacent to each other in the first direction d1. The coupling line portion 328 connects the meander line portions 322 and 323 that are adjacent to each other in the first direction d1. The coupling line portion 329 connects the meander line portion 323 and the signal terminal 362. The meander line portions 321 to 323 are connected in series by the coupling line portions 326 to 329.

[0070] In the second modification, the connection electrode 350 of the multilayer device 300C also has at least a portion that is coil-shaped or meander-shaped. Therefore, the connection electrode 350 can generate an inductive component L50 that corresponds to the coil or meander shape. For example, the value of the inductive component L50 can be changed by changing the inductance value, thereby changing the frequency of the stop band of the multilayer device 300C. This makes it possible to form a stop band according to the required specifications.

[0071] Furthermore, in Modification 2, the signal line 320 of the multilayer device 300C has at least a portion that is meander-shaped. Therefore, the signal line 320 and the planar electrode 340 can generate a capacitive component C40 that corresponds to the meander shape. For example, increasing the area formed by the meander shape can increase the opposing area between the signal line 320 and the planar electrode 340, and decreasing the area formed by the meander shape can decrease the opposing area between the signal line 320 and the planar electrode 340. Changing the opposing area can change the value of the capacitive component C40, thereby changing the frequency of the stopband of the multilayer device 300C. This allows the stopband to be formed according to the required specifications.

[0072] [Third Modification of First Embodiment] A description will be given of the configuration of a multilayer device 300D according to Modification 3 of Embodiment 1. In Modification 3, an example will be described in which the width of the patterned electrode 350p is narrower than that of Modification 2.

[0073] The multilayer device 300D according to the third modification includes a dielectric 310, a signal line 320, a ground electrode 330, a plurality of planar electrodes 340, and a plurality of connecting electrodes 350. The multilayer device 300D also includes a plurality of signal terminals 360 and a plurality of ground terminals 370. The configurations of the dielectric 310, the signal line 320, the ground electrode 330, the plurality of planar electrodes 340, the plurality of signal terminals 360, and the plurality of ground terminals 370 of the multilayer device 300D are the same as those of the second modification.

[0074] FIG. 11 is a diagram showing a signal line 320, a planar electrode 340, a ground electrode 330, and a connection electrode 350 of a multilayer device 300D according to the third modification.

[0075] 11, the width of the patterned electrode 350p of Modification 3 is narrower than the width of the patterned electrode 350p of Modification 2. The width of the patterned electrode 350p of Modification 3 shown in the figure is 25 μm, and as a result, the inductance value of the connection electrode 350 in Modification 3 is higher than the inductance value of the connection electrode 350 in Modification 2.

[0076] In the third modification, the connection electrode 350 of the multilayer device 300D also has at least a portion that is coil-shaped. For example, by increasing the width of the patterned electrode 350p of the connection electrode 350, the inductance value of the connection electrode 350 can be reduced, and by decreasing the width of the patterned electrode 350p, the inductance value can be increased. Changing the inductance value can change the value of the inductive component L50, which in turn can change the frequency of the stopband of the multilayer device 300D. This allows the stopband to be formed according to the required specifications.

[0077] [Effects of Modifications 2 and 3] A multilayer device 300Z as a reference example will be described below to confirm the effects of Modifications 2 and 3. In the multilayer device 300Z as a reference example, the connection electrodes 350 are linear via conductors rather than coil-shaped.

[0078] FIG. 12 is a diagram showing a signal line 320, a planar electrode 340, a ground electrode 330, and a connection electrode 350Z of a multilayer device 300Z according to a reference example.

[0079] The connection electrodes 350Z of the reference example are via conductors that connect the plurality of planar electrodes 340 and the ground electrode 330, and are provided inside the dielectric 310 (not shown). The connection electrodes 350Z are columnar and are formed to penetrate the dielectric 310 located between the plurality of planar electrodes 340 and the ground electrode 330. Each connection electrode 350Z has the same shape and size. The connection electrodes 350Z are arranged in this order at equal intervals along the first direction d1 so as to correspond one-to-one to each planar electrode 340.

[0080] The effects of the multilayer devices 300C, 300D, and 300Z having the above configuration will be described with reference to the drawings.

[0081] The design conditions for the multilayer devices 300C, 300D, and 300Z are as follows:

[0082] The dimensions of the multilayer device are: length 0.8 mm, width 0.6 mm, height 0.45 mm Signal line 320 width: 0.05 mm Meander L / S: 0.025mm / 0.025mm Length of each connecting line portion 326, 329: 0.0625 mm Length of each connecting line portion 327, 328: 0.1 mm Width of the planar electrode 340 (length in the second direction d2): 0.5 mm Length of the planar electrode 340 (length in the first direction d1): 0.2 mm Distance between adjacent planar electrodes 340 in the first direction d1: 0.05 mm Number of turns of connecting electrode 350: 3.5 turns Via electrode 350v via diameter: 100 μm Width of patterned electrode 350p of multilayer device 300C: 100 μm Width of patterned electrode 350p of multilayer device 300D: 25 μm The thickness of each of the signal line 320, the ground electrode 330, and the planar electrode 340: 10 μm Thickness of the dielectric 310 below the ground electrode 330: 35 μm Distance between ground electrode 330 and flat electrode 340: 320 μm Distance between the planar electrode 340 and the signal line 320: 25 μm Thickness of the dielectric 310 above the signal line 320: 70 μm Dielectric constant of dielectric 310: 4.1 Dielectric tangent of dielectric 310: 0.015

[0083] The transmission characteristics of the multilayer device under these design conditions will be explained.

[0084] 13 is a diagram showing the transmission characteristics of the multilayer devices according to Modifications 2 and 3 of Embodiment 1 and a reference example, in which the vertical axis represents the S parameter (S21).

[0085] 13 , the multilayer device 300C of the second modification has attenuation poles near 14 GHz, which is lower than the stopband of the multilayer device 300Z of the reference example, and near 29 GHz, which is higher. Furthermore, the multilayer device 300C has a greater amount of attenuation at the attenuation poles than the multilayer device 300Z. The multilayer device 300C is capable of blocking signals at frequencies of 14 GHz and 29 GHz.

[0086] The multilayer device 300D of Variation 3 has an attenuation pole near 7.5 GHz, which is lower than the stopband of the multilayer device 300C, and the insertion loss is greatest at this attenuation pole. The multilayer device 300D has a greater amount of attenuation at the attenuation pole than the multilayer device 300Z. The multilayer device 300D is capable of blocking the passage of signals at a frequency of 7.5 GHz.

[0087] Even when the signal line 320 has a meandering shape, as in the multilayer devices 300C and 300D, the frequency of the stopband of the multilayer device can be changed by changing the coil shape of the connection electrode 350. This allows the stopband to be formed according to the required specifications. Furthermore, because the connection electrode 350 of the multilayer devices 300C and 300D has a coil shape, the attenuation at the attenuation pole can be increased compared to the multilayer device 300Z of the reference example.

[0088] (Embodiment 2) [Multi-layer device configuration] The configuration of a multilayer device 300E according to the second embodiment will be described with reference to Figures 14 and 15. In the second embodiment, an example in which the multilayer device 300E is a common mode filter will be described.

[0089] Fig. 14 is an external view of a multilayer device 300E according to Embodiment 2. Fig. 15 is a diagram showing a signal line 320, a planar electrode 340, a ground electrode 330, and a connection electrode 350 of the multilayer device 300E.

[0090] 14 and 15 includes a dielectric 310, a signal line 320, a ground electrode 330, a plurality of planar electrodes 341, 342, and 343, and a plurality of connecting electrodes 351, 352, and 353. The multilayer device 300E also includes a plurality of signal terminals 361, 362, 363, and 364, and a plurality of ground terminals 371, 372, 373, and 374. The configurations of the dielectric 310, the ground electrode 330, the planar electrode 340, the connecting electrode 350, and the ground terminals 371 to 374 of the multilayer device 300E are the same as those in the first embodiment.

[0091] The signal line 320 of the second embodiment is a differential line configured by two parallel signal lines 320a and 320b provided inside the dielectric 310. Each of the signal lines 320a and 320b is linear and provided along the first direction d1. Each of the signal lines 320a and 320b is strip-shaped and arranged parallel to the planar electrode 340 and the ground electrode 330. When the multilayer device 300E is mounted in an electronic device, a differential signal is transmitted through the two signal lines 320a and 320b.

[0092] Four signal terminals 361 to 364 are provided on side surfaces 311 and 312 of dielectric 310. Of the four signal terminals 361 to 364, signal terminals 361 and 363 are provided on side surface 311, and signal terminals 362 and 364 are provided on side surface 312. One end of signal line 320a is connected to one signal terminal 361, and one end of signal line 320b is connected to one signal terminal 363. The other end of signal line 320a is connected to the other signal terminal 362, and the other end of signal line 320b is connected to the other signal terminal 364. One signal terminal 361 and 363 are disposed between two ground terminals 371 and 373, and the other signal terminals 362 and 364 are disposed between two ground terminals 372 and 374.

[0093] In the second embodiment, the connection electrode 350 of the multilayer device 300E also has at least a portion that is coil-shaped or meander-shaped. Therefore, the connection electrode 350 can generate an inductive component L50 that corresponds to the coil or meander shape. For example, the inductance value of the connection electrode 350 can be increased by increasing the coil diameter or the number of turns of the coil, and the inductance value can be decreased by decreasing the coil diameter or the number of turns of the coil. Changing the inductance value can change the value of the inductive component L50, which allows the frequency of the stop band of the multilayer device 300E to be changed. This allows the stop band to be formed according to the required specifications.

[0094] [Modification 1 of Embodiment 2] A description will be given of the configuration of a multilayer device 300F according to Modification 1 of Embodiment 2. In Modification 1, an example will be described in which the signal line 320 has a meander shape.

[0095] The multilayer device 300F according to the first modification includes a dielectric 310, a signal line 320, a ground electrode 330, a plurality of planar electrodes 340, and a plurality of connecting electrodes 350. The multilayer device 300F also includes a plurality of signal terminals 360 and a plurality of ground terminals 370. The configurations of the dielectric 310, the ground electrode 330, the plurality of planar electrodes 340, the plurality of connecting electrodes 350, the plurality of signal terminals 360, and the plurality of ground terminals 370 of the multilayer device 300F are the same as those of the second embodiment.

[0096] FIG. 16 is a diagram showing a signal line 320, a planar electrode 340, a ground electrode 330, and a connection electrode 350 of a multilayer device 300F according to the first modification.

[0097] The signal line 320 is a differential line composed of two parallel signal lines 320a and 320b provided inside the dielectric 310. At least a portion of each of the signal lines 320a and 320b has a meander shape. Each of the signal lines 320a and 320b is arranged parallel to the planar electrode 340 and the ground electrode 330. When the multilayer device 300F is mounted in an electronic device, a differential signal is transmitted through the two signal lines 320a and 320b.

[0098] In the first modification of the second embodiment, the signal line 320 of the multilayer device 300F has at least a portion having a meander shape. Therefore, the signal line 320 and the planar electrode 340 can generate a capacitive component C40 corresponding to the meander shape. For example, increasing the area formed by the meander shape can increase the opposing area between the signal line 320 and the planar electrode 340, and decreasing the area formed by the meander shape can decrease the opposing area between the signal line 320 and the planar electrode 340. Changing the opposing area can change the value of the capacitive component C40, thereby changing the frequency of the stopband of the multilayer device 300F. This allows the stopband to be formed according to the required specifications.

[0099] (summary) A multilayer device 300A according to this embodiment includes a dielectric 310, a signal line 320 provided inside the dielectric 310 so as to be partially exposed on the outer surface of the dielectric 310, a ground electrode 330 provided inside or on the outer surface of the dielectric 310 so as to be at least partially exposed on the outer surface of the dielectric 310, a plurality of planar electrodes 340 provided inside the dielectric 310, parallel to the ground electrode 330, and arranged along a first direction d1 from the input side to the output side of the signal line 320, a plurality of connection electrodes 350 provided inside the dielectric 310 and connecting the plurality of planar electrodes 340 and the ground electrode 330, a plurality of signal terminals 360 provided on the outer surface of the dielectric 310 and connected to the signal line 320, and a plurality of ground terminals 370 provided on the outer surface of the dielectric 310 and connected to the ground electrode 330. At least a portion of the connection electrode 350 has a coil shape or a meander shape.

[0100] Because the connection electrode 350 has at least a portion in a coil or meander shape, the connection electrode 350 can generate an inductive component L50 corresponding to the coil or meander shape. For example, the inductance value of the connection electrode 350 can be increased by increasing the coil diameter or the number of turns of the coil, and the inductance value can be decreased by decreasing the coil diameter or the number of turns of the coil. Changing the inductance value can change the value of the inductive component L50, thereby changing the frequency of the stop band of the multilayer device 300A. This makes it possible to form a stop band according to the required specifications of the multilayer device 300A.

[0101] Furthermore, when an electrode structure consisting of the signal line 320, the ground electrode 330, the planar electrode 340, and the connection electrode 350 is formed inside a printed circuit board, the printed circuit board must have a multilayer structure. However, by using the multilayer device 300A including the electrode structure as an electronic component mounted on the printed circuit board, rather than forming the electrode structure inside the printed circuit board, the number of layers of the printed circuit board on which the multilayer device 300A is mounted can be reduced. This prevents the cost of the printed circuit board from increasing.

[0102] Furthermore, the connection electrode 350 may be configured by a plurality of via electrodes 350v located between the planar electrode 340 and the ground electrode 330, and one or more patterned electrodes 350p that electrically connect the plurality of via electrodes 350v.

[0103] This allows the connection electrode 350, which is composed of the via electrode 350v and the patterned electrode 350p, to form a coil shape. Therefore, the connection electrode 350 can generate an inductive component L50 according to the coil shape. For example, the value of the inductive component L50 can be changed by changing the coil diameter or the number of turns of the coil shape, thereby changing the frequency of the stop band of the multilayer device 300A. This makes it possible to form a stop band according to the required specifications of the multilayer device 300A.

[0104] Furthermore, the dielectric 310 provided between the plurality of planar electrodes 340 and the ground electrode 330 may be formed by a plurality of dielectric layers, the via electrode 350v may penetrate the dielectric layers, and the patterned electrode 350p may be provided between the plurality of dielectric layers.

[0105] This allows the connection electrode 350 to form a spiral coil shape. Therefore, the connection electrode 350 can generate an inductive component L50 according to the coil shape. For example, the value of the inductive component L50 can be changed by changing the coil diameter or the number of turns of the coil shape, thereby changing the frequency of the stop band of the multilayer device 300A. This makes it possible to form a stop band according to the required specifications of the multilayer device 300A.

[0106] Furthermore, at least a portion of the signal line 320 may have a meander shape.

[0107] By providing the signal line 320 with a meander shape in this manner, a capacitive component C40 corresponding to the meander shape can be generated between the signal line 320 and the planar electrode 340. For example, increasing the area defined by the meander shape can increase the opposing area between the signal line 320 and the planar electrode 340, and decreasing the area defined by the meander shape can decrease the opposing area between the signal line 320 and the planar electrode 340. Changing the opposing area can change the value of the capacitive component C40, thereby changing the frequency of the stopband of the multilayer device 300C. This makes it possible to form a stopband according to the required specifications of the multilayer device 300C.

[0108] The signal line 320 may also include a meander line portion (for example, 321) having a meander shape, and the meander line portion may be provided at a position facing the planar electrode (for example, 341).

[0109] In this way, by providing the meander line portion (e.g., 321) at a position facing the planar electrode (e.g., 341), the meander line portion 321 and the planar electrode 341 can generate a capacitive component C40 according to the meander shape. For example, by changing the value of the capacitive component C40 according to the meander shape, the frequency of the stop band of the multilayer device 300C can be changed. This makes it possible to form a stop band according to the required specifications of the multilayer device 300C.

[0110] Alternatively, the signal line 320 may be configured by two parallel lines provided in the dielectric body 310.

[0111] This allows the multilayer device 300E to be used as a common mode filter.

[0112] The two parallel lines may also be differential lines through which differential signals are transmitted.

[0113] This makes it possible to provide a multilayer device 300E that functions as a common mode filter.

[0114] A multilayer device 300A according to this embodiment includes a signal line 320 that transmits a signal, a ground electrode 330 that is set to ground potential, a plurality of planar electrodes 340 that are parallel to the ground electrode 330 and arranged along a first direction d1 from the input side to the output side of the signal line 320, a dielectric 310 provided between the signal line 320, the plurality of planar electrodes 340, and the ground electrode 330, and a plurality of connection electrodes 350 that are located between the plurality of planar electrodes 340 and the ground electrode 330 and connect the plurality of planar electrodes 340 to the ground electrode 330. At least a portion of the connection electrode 350 has a coil shape or a meander shape.

[0115] Because the connection electrode 350 has at least a portion in a coil or meander shape, the connection electrode 350 can generate an inductive component L50 corresponding to the coil or meander shape. For example, the inductance value of the connection electrode 350 can be increased by increasing the coil diameter or the number of turns of the coil, and the inductance value can be decreased by decreasing the coil diameter or the number of turns of the coil. Changing the inductance value can change the value of the inductive component L50, thereby changing the frequency of the stop band of the multilayer device 300A. This makes it possible to form a stop band according to the required specifications of the multilayer device 300A.

[0116] Furthermore, the connection electrode 350 may be configured by a plurality of via electrodes 350v located between the planar electrode 340 and the ground electrode 330, and one or more patterned electrodes 350p that electrically connect the plurality of via electrodes 350v.

[0117] This allows the connection electrode 350, which is composed of the via electrode 350v and the patterned electrode 350p, to form a coil shape. Therefore, the connection electrode 350 can generate an inductive component L50 according to the coil shape. For example, the value of the inductive component L50 can be changed by changing the coil diameter or the number of turns of the coil shape, thereby changing the frequency of the stop band of the multilayer device 300A. This makes it possible to form a stop band according to the required specifications of the multilayer device 300A.

[0118] Furthermore, the dielectric 310 provided between the plurality of planar electrodes 340 and the ground electrode 330 may be formed by a plurality of dielectric layers, the via electrode 350v may penetrate the dielectric layers, and the patterned electrode 350p may be provided between the plurality of dielectric layers.

[0119] This allows the connection electrode 350 to form a spiral coil shape. Therefore, the connection electrode 350 can generate an inductive component L50 according to the coil shape. For example, the value of the inductive component L50 can be changed by changing the coil diameter or the number of turns of the coil shape, thereby changing the frequency of the stop band of the multilayer device 300A. This makes it possible to form a stop band according to the required specifications of the multilayer device 300A.

[0120] Furthermore, at least a portion of the signal line 320 may have a meander shape.

[0121] By providing the signal line 320 with a meander shape in this manner, a capacitive component C40 corresponding to the meander shape can be generated between the signal line 320 and the planar electrode 340. For example, increasing the area defined by the meander shape can increase the opposing area between the signal line 320 and the planar electrode 340, and decreasing the area defined by the meander shape can decrease the opposing area between the signal line 320 and the planar electrode 340. Changing the opposing area can change the value of the capacitive component C40, thereby changing the frequency of the stopband of the multilayer device 300C. This makes it possible to form a stopband according to the required specifications of the multilayer device 300C.

[0122] The signal line 320 may also include a meander line portion (for example, 321) having a meander shape, and the meander line portion may be provided at a position facing the planar electrode (for example, 341).

[0123] In this way, by providing the meander line portion (e.g., 321) at a position facing the planar electrode (e.g., 341), the meander line portion 321 and the planar electrode 341 can generate a capacitive component C40 according to the meander shape. For example, by changing the value of the capacitive component C40 according to the meander shape, the frequency of the stop band of the multilayer device 300C can be changed. This makes it possible to form a stop band according to the required specifications of the multilayer device 300C.

[0124] (Other embodiments, etc.) Although the multilayer devices and the like according to the embodiments and modifications of the present disclosure have been described above, the present disclosure is not limited to the above-described embodiments and modifications. As long as they do not deviate from the gist of the present disclosure, various modifications conceivable by those skilled in the art to the embodiments and modifications, as well as other forms constructed by combining some of the components of the embodiments and modifications, are also included within the scope of the present disclosure.

[0125] In the first embodiment, an example has been shown in which three planar electrodes 341-343 and three connection electrodes 351-353 are arranged along the first direction d1, but this is not limiting. The number of pairs of one planar electrode and one connection electrode may be two, or four or more. That is, the multilayer device may have a configuration in which four or more planar electrodes and four or more connection electrodes are arranged along the first direction d1.

[0126] In the first embodiment, the connection electrodes 351, 352, and 353 have the same shape and size. However, the present invention is not limited to this. The size of each of the connection electrodes 351, 352, and 353 may be changed depending on the required specifications. For example, the stop band frequency can be broadened by changing the diameter or length of the via electrode 350v to change the inductive component L50. For example, the stop band frequency can be broadened by changing the width or length of the patterned electrode 350p to change the inductive component L50.

[0127] In the first embodiment, the planar electrodes 341, 342, and 343 have the same shape and size, but the present invention is not limited to this and the size of each of the planar electrodes 341, 342, and 343 may be changed depending on the required specifications. For example, by changing the capacitive component C40 generated by the opposing area between the signal line 320 and the planar electrode 340, the stopband frequency can be broadened.

[0128] In the first embodiment, an example has been described in which the gaps between the planar electrodes 341, 342, and 343 and the signal line 320 are the same, but this is not limiting, and the gaps between the planar electrodes 341, 342, and 343 and the signal line 320 may be changed depending on required specifications. For example, by changing the gap between the planar electrode 341 and the signal line 320, the gap between the planar electrode 342 and the signal line 320, and the gap between the planar electrode 343 and the signal line 320 to change the capacitive component C40, the frequency of the stopband can be broadened. [Industrial Applicability]

[0129] The multilayer device according to the present disclosure is useful as a multilayer device for use in various electronic devices and communication systems. [Explanation of symbols]

[0130] 1, 300A, 300B, 300C, 300D, 300E, 300F multilayer devices 310 Dielectric 311, 312, 313, 314 Side 316 bottom 317 Top 320, 320a, 320b signal line 321, 322, 323 Meander Track Section 326, 327, 328, 329 Connecting track section 330 Ground electrode 331 Notch 340, 341, 342, 343 Planar electrode 350, 351, 352, 353 connecting electrodes 350p patterned electrode 350v via electrode 360, 361, 362, 363, 364 signal terminals 370, 371, 372, 373, 374 Ground terminals d1 1st direction d2 2nd direction d3 Third direction

Claims

1. a dielectric; a signal line provided inside the dielectric so that a portion of the signal line is exposed on an outer surface of the dielectric; a ground electrode provided inside or on an outer surface of the dielectric so that at least a portion of the ground electrode is exposed on the outer surface of the dielectric; a plurality of planar electrodes provided inside the dielectric, parallel to the ground electrode, and arranged along a first direction from the input side toward the output side of the signal line; a plurality of connection electrodes provided inside the dielectric body and connecting the plurality of planar electrodes and the ground electrode; a plurality of signal terminals provided on an outer surface of the dielectric body and connected to the signal line; a plurality of ground terminals provided on an outer surface of the dielectric body and connected to the ground electrode; Equipped with The connection electrode has at least a part in a coil shape or a meander shape. Multilayer devices.

2. The connection electrode is composed of a plurality of via electrodes located between the planar electrode and the ground electrode, and one or more patterned electrodes that electrically connect the plurality of via electrodes. The multilayer device of claim 1 .

3. the dielectric provided between the plurality of planar electrodes and the ground electrode is formed by a plurality of dielectric layers; the via electrode penetrates the dielectric layer, the patterning electrode is provided between the plurality of dielectric layers; The multilayer device of claim 2 .

4. The signal line has at least a portion having a meander shape. The multilayer device of claim 1 .

5. the signal line includes a meander line portion having the meander shape, The meander line portion is provided at a position facing the planar electrode. The multilayer device of claim 4 .

6. The signal line is composed of two parallel lines provided on the dielectric. The multilayer device according to any one of claims 1 to 5.

7. The two parallel lines are differential lines through which differential signals are transmitted. The multilayer device of claim 6 .

8. a signal line for transmitting a signal; a ground electrode set to a ground potential; a plurality of planar electrodes arranged parallel to the ground electrode and along a first direction from the input side toward the output side of the signal line; a dielectric provided between the signal line, the plurality of planar electrodes, and the ground electrode; a plurality of connection electrodes located between the plurality of planar electrodes and the ground electrode, the connection electrodes connecting the plurality of planar electrodes and the ground electrode; Equipped with The connection electrode has at least a part in a coil shape or a meander shape. Multilayer devices.

9. The connection electrode is composed of a plurality of via electrodes located between the planar electrode and the ground electrode, and one or more patterned electrodes that electrically connect the plurality of via electrodes. The multilayer device of claim 8.

10. the dielectric provided between the plurality of planar electrodes and the ground electrode is formed by a plurality of dielectric layers; the via electrode penetrates the dielectric layer, the patterning electrode is provided between the plurality of dielectric layers; The multilayer device of claim 9.

11. The signal line has at least a portion having a meander shape. The multilayer device according to any one of claims 8 to 10.

12. the signal line includes a meander line portion having the meander shape, The meander line portion is provided at a position facing the planar electrode. The multilayer device of claim 11 .

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