Imaging device

Abstract

To provide an image capturing apparatus capable of positively dissipating heat from an image sensor without increasing a driving load of a movable part including the image sensor or moving the image sensor to a particular position.SOLUTION: A digital camera 100 includes: an image sensor unit 230 in which a movable part having an image sensor 231 is swingably held to a fixed part; a cooling plate 252 connected to the movable part; and a heat dissipation unit 250 attached to the fixed part. The heat dissipation unit 250 includes: a heat dissipation rubber 256 disposed movable in an image capturing optical axis direction between a contact position in contact with the cooling plate 252 and a spaced position spaced from the cooling plate; and a graphite sheet 264 that connects between the heat dissipation rubber 256 and a predetermined member. In a state where the heat dissipation rubber 256 is at the contact position, heat generated from the image sensor 231 is transferred to the predetermined member through the cooling plate 252, the heat dissipation rubber 256, and the graphite sheet 264.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to an imaging device capable of swinging an imaging element, and more particularly to a technique for dissipating heat from the imaging element. [Background technology]

[0002] The market is actively promoting the introduction of imaging devices equipped with image sensor-shifting image stabilization mechanisms. Furthermore, the increasing number of pixels in image sensors and faster readout speeds have made it easier for the temperature of the image sensor to rise. Therefore, imaging devices equipped with image sensor-shifting image stabilization mechanisms require an image sensor unit that can efficiently dissipate heat from the image sensor.

[0003] In response to such demands, for example, Patent Document 1 discloses a configuration in which a ring-shaped metal member is placed near an image sensor unit, and the image sensor unit and the metal member are connected by a flexible member to dissipate heat from the metal member. Also, Patent Document 2 discloses a configuration in which a heat dissipation member is placed around an image sensor unit equipped with an image shake correction mechanism, and the image shake correction mechanism is driven to bring the image sensor unit into contact with the heat dissipation member, thereby transferring heat generated by the image sensor to the heat dissipation member. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent No. 5168047 [Patent Document 2] Japanese Patent Application Publication No. 2019-145929 Summary of the Invention [Problem to be solved by the invention]

[0005] However, in the technology disclosed in Patent Document 1, the imaging element unit and the metal member are connected by a flexible member, and the elasticity of the flexible member becomes a driving load when the imaging element is swung. Also, in the technology disclosed in Patent Document 2, when the imaging element unit is brought into contact with the heat dissipation member, the imaging element unit is moved outside the image shake correction area during imaging, and imaging cannot be performed until the imaging element unit is returned to the image shake correction area.

[0006] The present invention aims to provide an imaging device that can actively dissipate heat from an imaging element without increasing the driving load of a movable part that has the imaging element and without moving the imaging element to a special position. [Means for solving the problem]

[0007] The imaging device according to the present invention includes a movable section having an imaging element, a fixed section that holds the movable section so that the movable section can swing within a plane perpendicular to an imaging optical axis, and a Money an imaging device comprising a metal member and a heat dissipation unit attached to the fixing part, Receipt a contact member arranged to be movable in the imaging optical axis direction between a contact position and a separation position with respect to the metal member; another metal member that is held by the housing of the imaging device and is not connected to the movable portion and the fixed portion; and 、 and a heat conducting member connecting the contact member to the image sensor, and the heat generated by the image sensor is conducted to the contact member when the contact member is in the contact position. 、 before Receipt A metal member, the contact member, and the heat conducting member and via 、 The aforementioned Another metal part The present invention is characterized in that the signal is transmitted to the [Effects of the Invention]

[0008] According to the present invention, heat can be actively dissipated from the imaging element without increasing the driving load of the movable part having the imaging element and without moving the imaging element to a special position. [Brief explanation of the drawings]

[0009] [Figure 1] 1 is a block diagram showing a schematic configuration of a digital camera according to an embodiment. [Figure 2] FIG. 2 is an exploded perspective view of the imaging unit and its vicinity. [Figure 3] FIG. 2 is a perspective view showing the arrangement of the imaging unit, the holding metal plate, and the printed circuit board. [Figure 4] FIG. 2 is a cross-sectional view of a heat dissipation unit according to the first embodiment. [Figure 5] FIG. 10 is a cross-sectional view of a heat dissipation unit according to a second embodiment. [Figure 6] FIG. 10 is a cross-sectional view of a heat dissipation unit according to a third embodiment. [Figure 7] FIG. 11 is a cross-sectional view of another heat dissipation unit according to the third embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0010] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0011] 1 is a block diagram showing the schematic configuration of a digital camera 100, which is an example of an imaging device according to an embodiment. The digital camera 100 includes a photographing lens 20, a shutter 12, a distance measurement control unit 66, an aperture control unit 65, a shutter control unit 68, an imaging unit 200, a gyro 82, a system control unit 50, a memory 52, an image processing unit 60, a thermometer 58, and an operation member 80. The digital camera 100 also includes a display unit 54, a timer 56, a power switch 84, a power control unit 86, a battery 88, and a storage medium 500.

[0012] The photographing lens 20 has a plurality of lens groups including at least an AF lens 24, and an aperture 26. The imaging unit 200 has an imaging element unit 230 (see FIG. 2), an imaging element image shake correction unit 240 (hereinafter referred to as the "image shake correction unit 240"), and an imaging element heat dissipation unit 250 (hereinafter referred to as the "heat dissipation unit 250"). The imaging element unit 230 has an imaging element 231.

[0013] The photographing lens 20 forms an image of incident light on the imaging surface of the image sensor 231. The diaphragm 26 adjusts the amount of light incident on the image sensor 231. The shutter 12 controls the amount of exposure to the image sensor 231 by opening and closing. The image sensor 231 is a photoelectric conversion element such as a CCD sensor or CMOS sensor that converts an optical image into an electrical signal. The light beam incident on the photographing lens 20 is guided to the image sensor 231 via the diaphragm 26 and the shutter 12, and forms an optical image on the imaging surface of the image sensor 231.

[0014] In accordance with instructions from the system control unit 50, the distance measurement control unit 66 controls the movement of the AF lens 24 in the optical axis direction, the aperture control unit 65 controls the driving of the aperture 26, and the shutter control unit 68 controls the opening and closing operation of the shutter 12.

[0015] The gyro 82 detects the amount of shake (the direction and magnitude of the shake) of the digital camera 100. The image shake correction unit 240 performs image shake correction using an image sensor shift method, which corrects image shake by driving the image sensor 231 at least within a plane perpendicular to the optical axis in accordance with the amount of shake detected by the gyro 82. The heat dissipation unit 250 suppresses a rise in temperature of the image sensor 231 by receiving heat from the image sensor 231 under imaging conditions in which the amount of heat generated by the image sensor 231 is large (in other words, imaging conditions in which power consumption is large).

[0016] The system control unit 50 is composed of a CPU or the like, and controls the overall operation of the digital camera 100 by executing a predetermined program stored in the memory 52. ​​For example, the system control unit 50 controls the shutter 12, the AF lens 24, and the aperture 26 to perform AF processing and AE processing based on the results of calculations performed by the image processing unit 60 on image data acquired by the image sensor 231. The system control unit 50 is also used as a determination unit that determines whether or not various operations of the digital camera 100 can be performed.

[0017] The memory 52 includes a ROM that stores constants, variables, programs, etc. for the operation of the system control unit 50, and a RAM that is used to expand the programs and save temporary data. The memory 52 also stores the state of the image sensor unit 230 held by the image stabilization unit 240. The thermometer 58 measures the temperature of the image sensor 231 and other heat-generating components installed inside the digital camera 100.

[0018] The operation members 80 are composed of buttons, switches, etc. for selecting and setting various functions, and for instructing the system control unit 50 to perform shooting operations, image playback display, etc. The power switch 84 turns the power of the digital camera 100 on and off. The power control unit 86 is composed of a battery detection circuit, a DC / DC converter, a switch circuit that switches between power-conducting blocks, etc. The battery 88 supplies power to the digital camera 100. The power control unit 86 detects the type and remaining charge of the battery 88, and supplies the necessary voltage for the necessary period to each unit, including the storage medium 500, based on the detection results and instructions from the system control unit 50. The storage medium 500 is detachable from the digital camera 100, and stores image data such as captured images.

[0019] First Embodiment 2 is a perspective view showing the schematic configuration of the imaging unit 200, and the holding metal plate 300 and printed circuit board 310 arranged on the back side of the imaging unit 200. As described above, the imaging unit 200 is generally composed of the image sensor unit 230, the image shake correction unit 240, and the heat dissipation unit 250.

[0020] A holding metal plate 300 (a third metal member in the first embodiment) arranged on the rear side of the imaging unit 200 holds a printed circuit board 310, and is connected (fixed) to a housing (not shown) of the digital camera 100. Various electric and electronic components, including a system control unit 50 and an image processing unit 60, are mounted on the printed circuit board 310. The imaging element unit 230 and the printed circuit board 310 are electrically connected by a flexible substrate 280, and an image signal output from the imaging element 231 is transmitted to the printed circuit board 310 via the flexible substrate 280. The holding metal plate 300 is not connected (coupled) to the imaging unit 200.

[0021] Next, we will explain the configurations of the image stabilization unit 240 and the heat dissipation unit 250 that make up the imaging unit 200. Figure 3 is an exploded perspective view of the imaging unit 200, and the imaging unit 200 is viewed from different directions in Figure 3(a) and Figure 3(b).

[0022] The imaging unit 200 has a structure in which an imaging element unit 230, which is a movable part, is movably sandwiched between a front plate 210 and a rear plate 220, which constitute a fixed part. The front plate 210 and the rear plate 220 are formed from metal plates. The rear plate 220 is fixed to a housing (not shown) of the digital camera 100. The front plate 210 is fixed to the rear plate 220 with the imaging element unit 230 sandwiched between them.

[0023] The imaging element unit 230 has an imaging element 231 and an imaging element holder 232 that holds the imaging element 231. Three balls 242 are arranged around the imaging element 231 between the imaging element holder 232 and the rear plate 220 so as to surround an imaging optical axis (not shown). The three balls 242 are free to roll, and this allows the imaging element unit 230 to be held between the front plate 210 and the rear plate 220 so as to be swingable within a plane perpendicular to the imaging optical axis.

[0024] A plurality of magnets 244 are arranged on the rear plate 220, and a plurality of coils 246 are arranged on the image sensor holder 232 so as to face the magnets 244. Power is supplied to the coils 246 from a power supply circuit (not shown), and the repulsive and attractive forces generated by the interaction between the magnetic field generated in the coils 246 and the magnetic field of the magnets 244 are used to control the vibration of the image sensor unit 230. In general, the image stabilization unit 240 is controlled so that the image sensor unit 230 is maintained at the center position of imaging, and is also controlled so that the image sensor unit 230 is moved in a direction that cancels out image shake of the digital camera 100 caused by the photographer.

[0025] A metal plate 248 is disposed on the front surface (front surface) of coil 246, and magnet 244 attracts metal plate 248, thereby maintaining imaging element holder 232 and rear plate 220 in contact with ball 242. This determines the flange focal length position of imaging element 231 within digital camera 100 to a specified position.

[0026] The heat dissipation unit 250 will be described in detail below with reference to Figures 3 and 4. As shown in Figure 3, the heat dissipation unit 250 has an image sensor cooling plate 252, a heat dissipation base 254, a graphite sheet 264, an image sensor heat dissipation rubber 256, and a heat dissipation plate 262. In the following description, the image sensor cooling plate 252 will be referred to as the "cooling plate 252," and the image sensor heat dissipation rubber 256 will be referred to as the "heat dissipation rubber 256."

[0027] The cooling plate 252 (first metal member in the first embodiment) has legs 252a, 252b, and 252c. The imaging element holder 232 is provided with holding portions 232a, 232b, and 232c. retention Part 2 33(b), 2c is hidden by the rear plate 220 and is not shown. The cooling plate 252 is fixed to the imaging element holder 232 by fastening the legs 252a to 252c to the holding portions 232a to 232c with screws. In this way, heat generated by the imaging element 231 is transferred to the cooling plate 252 via the imaging element holder 232.

[0028] The heat dissipation base 254 holds a gear 257, a cam 258, a motor 259, and a heat transfer plate 260, and is fixed to the rear plate 220. The graphite sheet 264 is a heat conducting member that is held between the heat transfer plate 260 and a heat dissipation rubber 256 (contact member) and connected to the heat dissipation plate 262. For the heat dissipation rubber 256, an elastic material with high thermal conductivity (high thermal conductivity) is preferably used.

[0029] The heat dissipation plate 262 (the second metal member in the first embodiment) is disposed on the rear side of the heat dissipation base 254, and is fixed to the rear plate 220 together with the heat dissipation base 254. Here, a connector 280a of the flexible substrate 280 is connected to a connector 231a of the imaging element 231. The flexible substrate 280 extends from the connection position with the connector 231a in the imaging optical axis direction. To, The heat dissipation base 254 and the heat dissipation plate 262 are pulled out to the rear side of the heat dissipation unit 250 so as to straddle the upper side of the heat dissipation unit 250. Therefore, the heat dissipation base 254 and the heat dissipation plate 262 are fixed to the rear side plate 220 in the horizontal direction.

[0030] By energizing the motor 259 to drive it, the heat dissipation rubber 256 can be moved in the imaging optical axis direction between a contact position and a separation position with respect to the cooling plate 252. In other words, by driving the motor 259, the heat dissipation rubber 256 advances and retreats in the imaging optical axis direction so as to come into contact with and separate from the cooling plate 252 via the gear 257, cam 258, heat transfer plate 260, and graphite sheet 264.

[0031] 4A and 4B are cross-sectional views of the heat dissipation unit 250 according to the first embodiment. More specifically, Fig. 4A shows a state in which heat from the cooling plate 252 is not transferred to the heat dissipation rubber 256. Fig. 4B shows a state in which heat from the cooling plate 252 is transferred to the heat dissipation rubber 256.

[0032] In the state shown in Figure 4(a) where the heat dissipation rubber 256 is not in contact with the cooling plate 252, the heat dissipation unit 250 does not become a driving load on the image sensor unit 230, which is a movable part, and therefore the image stabilization unit 240 can function fully.

[0033] On the other hand, in the state shown in FIG. 4(b) where the heat dissipation rubber 256 is in contact with the cooling plate 252, heat from the image sensor 231 is transferred to the rear plate 220 via the cooling plate 252, the heat dissipation rubber 256, the graphite sheet 264, and the heat dissipation plate 262. In this way, heat generated by the image sensor 231 can be transferred to the rear plate 220 via the heat dissipation unit 250, thereby suppressing temperature rise of the image sensor 231. In the state shown in FIG. 4(b), the heat dissipation rubber 256 comes into contact with the cooling plate 252, making it virtually impossible to oscillate the image sensor unit 230. In other words, when the heat dissipation unit 250 is operating, the drive of the image stabilization unit 240 is restricted. However, since the image sensor unit 230 is held at the imaging center position, image capture is possible. It should be noted that the image sensor unit 230 does not need to be held at the imaging center position, as long as it is held at a position within the imaging range. The imaging range is a position where no vignetting occurs due to a member disposed in front of the imaging element 231. Furthermore, by holding the imaging element unit 230 at a position within the imaging range, even if imaging is not performed while the heat dissipation unit 250 is in operation, imaging can be performed immediately after the operation of the heat dissipation unit 250 is deactivated.

[0034] When the heat-dissipating rubber 256 is in contact with the cooling plate 252, it is desirable that the heat-dissipating rubber 256 be pressed against the cooling plate 252 to increase adhesion and efficiently transfer heat. In this embodiment, heat transfer is achieved through contact between the cooling plate 252 and the heat-dissipating rubber 256. However, the graphite sheet 264 and the heat-dissipating rubber 256 may be interchanged. In this case, the heat-dissipating rubber 256 is movable between a pressing position where the graphite sheet 264 is in close contact with the cooling plate 252 and a spaced position where the graphite sheet 264 is spaced apart from the cooling plate 252. When in the pressing position, the heat-dissipating rubber 256 functions as a pressing member that presses the graphite sheet 264 against the cooling plate 252 to bring the graphite sheet 264 into close contact with the cooling plate 252. In this case, the heat-dissipating rubber 256 is required to have elasticity, but does not necessarily need to be made of a material with high thermal conductivity. Furthermore, in this configuration, the frictional resistance is smaller than in a configuration in which the heat dissipation rubber 256 is in contact with the cooling plate 252, so it is possible to move the image sensor unit 230 with the graphite sheet 264 in contact with the cooling plate 252. In other words, although the drive load is greater than when there is no contact, it is possible to drive the image stabilization unit 240 and perform imaging.

[0035] In this embodiment, the heat dissipation plate 262 is in thermal contact with the rear plate 220, but if the heat dissipation plate 262 is not provided, the graphite sheet 264 can be in contact with the rear plate 220.

[0036] Second Embodiment The heat dissipation unit of the second embodiment, like the heat dissipation unit 250 of the first embodiment, transfers heat generated by the imaging element 231 to the rear plate 220, but in the second embodiment, heat is also transferred to the holding metal plate 300.

[0037] 5 is a cross-sectional view of the heat dissipation unit of the second embodiment, and corresponds to FIG. 4(b). In the heat dissipation unit of the second embodiment, a graphite sheet 266 is disposed between the heat transfer plate 260 and the heat dissipation rubber 256, and is connected to the holding metal plate 300.

[0038] By driving the motor 259, the heat dissipation rubber 256 can be moved back and forth between a contact position and a separated position relative to the cooling plate 252 via the gear 257, the cam 258, the heat transfer plate 260, and the graphite sheet 266. Heat from the cooling plate 252 is transferred to the holding metal plate 300 via the heat dissipation rubber 256 and the graphite sheet 266.

[0039] That is, in the second embodiment, compared to the first embodiment, heat generated by the imaging element 231 is transferred not only to the rear plate 220 but also to the holding metal plate 300. Here, the holding metal plate 300 is not connected to the imaging unit 200, and therefore can be a relatively large metal member. In this way, it is possible to obtain a greater effect of suppressing the temperature rise of the imaging element 231.

[0040] <Third embodiment> The heat dissipation unit according to the third embodiment transfers the heat generated by the imaging element 231 and the heat generated by the printed circuit board 310 to the holding metal plate 300 .

[0041] Fig. 6 is a cross-sectional view of the heat dissipation unit in the third embodiment, and is a view corresponding to Fig. 4(b). Of the configuration of the heat dissipation unit in the third embodiment, the description of the same configuration as the heat dissipation unit in the second embodiment will be omitted.

[0042] The heat dissipation unit in the third embodiment has a board heat dissipation plate 268 (second metal member in the third embodiment), a graphite sheet 270, and a board heat dissipation rubber 272 (second contact member). The board heat dissipation plate 268 holds a heat dissipation rubber 256 (first contact member) and is held by a heat dissipation base 254 so as to be movable in the imaging optical axis direction. The graphite sheet 270 connects the board heat dissipation plate 268 to a holding metal plate 300 (third metal member in the first embodiment). The board heat dissipation rubber 272 is attached to the board heat dissipation plate 268 between the board heat dissipation plate 268 and the printed circuit board 310 so as to transfer heat from the printed circuit board 310 to the graphite sheet 270.

[0043] Driven by the motor 259, the heat dissipation rubber 256 (first contact member) can advance and retreat between a contact position and a separated position relative to the cooling plate 252 (first metal member in the third embodiment) via the gear 257, the cam 258, and the board heat dissipation plate 268. At this time, the board heat dissipation plate 268 advances and retreats integrally with the heat dissipation rubber 256, and simultaneously with this advance and retreat, the board heat dissipation plate 268 and the board heat dissipation rubber 272 advance and retreat integrally relative to the printed circuit board 310. When the heat dissipation rubber 256 is in the contact position where it contacts the cooling plate 252, the board heat dissipation rubber 272 also contacts the printed circuit board 310.

[0044] When the heat dissipation rubber 256 comes into contact with the cooling plate 252, the heat generated by the image sensor 231 is transferred to the holding metal plate 300 via the cooling plate 252, the heat dissipation rubber 256, the board heat dissipation plate 268, and the graphite sheet 270. When the board heat dissipation rubber 272 comes into contact with the printed circuit board 310, Mounted on a printed circuit board 310 Heat generated by the heat-generating components is transferred to the holding metal plate 300 via the printed circuit board 310, the board heat dissipation rubber 272, and the graphite sheet 270. When the board heat dissipation rubber 272 is in contact with the printed circuit board 310, it is desirable that the board heat dissipation rubber 272 be pressed against the printed circuit board 310 in order to improve adhesion and efficiently transfer heat.

[0045] In this way, in the third embodiment, Heat The heat generated by the image pickup element 231 and the printed circuit board 310 can be transmitted to the holding metal plate 300, and the heat generated by the printed circuit board 310 can be transmitted to the holding metal plate 300, making it possible to suppress temperature increases in the image pickup element 231 and the printed circuit board 310.

[0046] In the heat dissipation unit of the third embodiment, heat is transferred simultaneously from the image sensor 231 and the printed circuit board 310 to the holding metal plate 300. However, heat may be transferred in stages from the image sensor 231 and the printed circuit board 310 to the holding metal plate 300. For example, as shown in FIG. 7 , the thicknesses of the heat dissipation rubber 256 and the board heat dissipation rubber 272 are adjusted. Then, the board heat dissipation plate 268 is moved so that the board heat dissipation rubber 272 comes into contact with the printed circuit board 310, and the heat dissipation rubber 256 does not come into contact with the cooling plate 252. After that, the board heat dissipation plate 268 is further moved so that the board heat dissipation rubber 272 is deformed, and the heat dissipation rubber 256 comes into contact with the cooling plate 252. This allows heat to be transferred from the printed circuit board 310 before the image sensor 231.

[0047] Note that by reversing the thickness relationship between the heat dissipation rubber 256 and the board heat dissipation rubber 272, heat can be transferred from the image sensor 231 before the printed circuit board 310. Also, instead of adjusting the thicknesses of the heat dissipation rubber 256 and the board heat dissipation rubber 272, adjusting the shape of the board heat dissipation plate 268 can also achieve gradual heat transfer from the image sensor 231 and the printed circuit board 310 to the holding metal plate 300. The same effect can be achieved by changing the arrangement and dimensions of other components. In other words, by maintaining the position of the board heat dissipation plate 268 with only one of the board heat dissipation rubber 272 and the heat dissipation rubber 256 in contact with each other, it is possible to transfer heat from only one of the image sensor 231 and the printed circuit board 310 to the holding metal plate 300.

[0048] Generally, in imaging devices such as digital cameras, heat dissipation paths from the printed circuit board 310 are set so that the temperature of the exterior (not shown) of the digital camera 100 does not rise under normal imaging conditions. However, under imaging conditions in which electrical components such as the system control unit 50 mounted on the printed circuit board 310 become hot, it may be desirable to increase the number of heat dissipation paths. The heat dissipation unit of the third embodiment increases the number of heat dissipation paths from the printed circuit board 310 to the holding metal plate 300, thereby achieving the effect of suppressing local temperature increases inside the digital camera 100.

[0049] While the present invention has been described in detail above based on preferred embodiments thereof, the present invention is not limited to these specific embodiments, and various forms within the scope of the gist of the present invention are also included in the present invention. Furthermore, each of the above-described embodiments merely represents one embodiment of the present invention, and each embodiment can be combined as appropriate. [Explanation of symbols]

[0050] 100 digital cameras 200 Imaging unit 220 Rear plate 231 Image sensor 250 heat dissipation unit 252 Cooling Plate 256 Heat dissipation rubber 262 Heat sink plate 264,266,270 Graphite Sheet 268 PCB heat sink plate 272 PCB heat dissipation rubber 300 Holding Sheet Metal 310 Printed Circuit Board

Claims

1. a movable part having an imaging element; a fixed portion that holds the movable portion so that the movable portion can swing within a plane perpendicular to the imaging optical axis; a metal member connected to the movable part; a heat dissipation unit attached to the fixing portion, The heat dissipation unit is a contact member that is arranged to be movable in the imaging optical axis direction between a contact position with respect to the metal member and a separation position; a heat conduction member connecting the contact member and another metal member that is held by a housing of the imaging device and is not connected to the movable portion and the fixed portion, An imaging device characterized in that, when the contact member is in the contact position, heat generated by the imaging element is transferred to the other metal member via the metal member, the contact member, and the heat conduction member.

2. 2. The imaging device according to claim 1, wherein the contact member has elasticity and thermal conductivity.

3. 3. The imaging device according to claim 1, wherein the imaging element is capable of capturing an image with the contact member in the contact position.

4. a movable part having an imaging element; a fixed portion that holds the movable portion so that the movable portion can swing within a plane perpendicular to the imaging optical axis; a first metal member connected to the movable part; a heat dissipation unit attached to the fixing portion, The heat dissipation unit is a first contact member arranged to be movable in the imaging optical axis direction between a contact position with respect to the first metal member and a spaced position; a second metal member that is disposed so as to face the first metal member in the imaging optical axis direction, and that is connected to the first contact member and disposed so as to be movable in the imaging optical axis direction integrally with the first contact member; a third metal member that is held by a housing of the imaging device and is not connected to the movable portion and the fixed portion; a heat conduction member connecting the second metal member and the third metal member; A substrate on which heat-generating components are mounted, a second contact member disposed on the second metal member and contacting the substrate when the first contact member is in the contact position; An imaging device characterized in that, when the first contact member is in the contact position, heat generated by the imaging element is transferred to the third metal member via the first metal member, the first contact member, the second metal member and the heat conduction member, and heat generated by the heat-generating component is transferred to the third metal member via the substrate, the second contact member and the heat conduction member.

5. 5. The imaging device according to claim 4, wherein the first contact member and the second contact member have elasticity and thermal conductivity.

6. 6. The imaging device according to claim 4, wherein the imaging element is capable of capturing an image in the state where the first contact member is in the contact position.

7. 7. The imaging device according to claim 1, wherein the heat conducting member is a graphite sheet.

8. a first unit having an imaging element and movable in a direction perpendicular to an imaging optical axis; A heat dissipation member; a second unit including a thermally conductive sheet member arranged alongside the first unit in a direction parallel to the imaging optical axis and connected to the heat dissipation member; the thermally conductive sheet member is held movably in a direction parallel to the imaging optical axis between a first position where the thermally conductive sheet member contacts the flat plate portion of the first unit and a second position where the thermally conductive sheet member is spaced apart from the first unit; The imaging device, wherein the first position is farther from the imaging element than the second position in a direction parallel to the imaging optical axis.

9. 9. The imaging device according to claim 8, wherein the imaging element is capable of capturing an image with the thermally conductive sheet member in the first position.

10. 10. The imaging device according to claim 8, wherein the heat-conductive sheet member is a graphite sheet.

11. 11. The imaging device according to claim 8, wherein the second unit is disposed between the imaging element and the flat plate portion in a direction parallel to the imaging optical axis.

12. 12. The imaging device according to claim 8, wherein the first unit is movable relative to the second unit in a direction perpendicular to the imaging optical axis.

13. 13. The imaging device according to claim 8, wherein the thermally conductive sheet member is movable between the first position and the second position by being driven by a motor provided in the second unit.

14. A first unit having an imaging element and movable in a direction perpendicular to the imaging optical axis; A heat dissipation member; a second unit including a thermally conductive sheet member arranged alongside the first unit in a direction parallel to the imaging optical axis and connected to the heat dissipation member; the thermally conductive sheet member is held movably in a direction parallel to the imaging optical axis between a first position where the thermally conductive sheet member contacts the flat plate portion of the first unit and a second position where the thermally conductive sheet member is spaced apart from the first unit; The imaging device, wherein the second unit is disposed between the imaging element and the flat plate portion in a direction parallel to the imaging optical axis.

15. The imaging device described in Claim 14, characterized in that the first unit is movable relative to the second unit in a direction perpendicular to the imaging optical axis.

16. An imaging device as described in Claim 14 or 15, characterized in that the thermal conductive sheet member is movable between the first position and the second position by driving a motor possessed by the second unit.

17. A first unit having an imaging element and movable in a direction perpendicular to the imaging optical axis; A heat dissipation member; a second unit including a thermally conductive sheet member arranged alongside the first unit in a direction parallel to the imaging optical axis and connected to the heat dissipation member; the thermally conductive sheet member is held movably in a direction parallel to the imaging optical axis between a first position where the thermally conductive sheet member contacts the flat plate portion of the first unit and a second position where the thermally conductive sheet member is spaced apart from the first unit; The imaging device, wherein the thermally conductive sheet member is movable between the first position and the second position by being driven by a motor provided in the second unit.

Images