Imaging device

Abstract

To improve the air-cooling efficiency while suppressing mixing of dust and liquid like water due to air intake.SOLUTION: An imaging apparatus comprises: a first image pick-up device; an image processing chip which performs signal processing on an output signal of the first image pick-up device; a first member which surrounds the first image pick-up device and the image processing chip; a first heat conduction member whose portion is provided on the outside of the first member and which conducts the heat generated in the first image pick-up device to the first direction side where the first image pick-up device is arranged relative to the image processing chip; a second heat conduction member whose portion is provided on the outside of the first member and which conducts the heat generated in the image processing chip to the first direction side; and a second member which covers the first heat conduction member and the second heat conduction member provided on the outside of the first member from the first direction such that the air flows in contact with the first heat conduction member and the second heat conduction member.SELECTED DRAWING: Figure 13

Description

[Technical Field]

[0001] The present invention relates to an imaging device. [Background technology]

[0002] A spherical imaging device has multiple imaging optical systems, each of which has a wide-angle lens and an imaging sensor that captures an image through the wide-angle lens. The spherical imaging device combines the images captured by each imaging optical system to obtain an image within a solid angle of 4π steradians (see, for example, Patent Document 1 below).

[0003] However, the spherical imaging device of Patent Document 1 does not take into consideration a configuration for dissipating heat from a heat source such as an imaging sensor. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2013-25255 Summary of the Invention

[0005] The imaging device disclosed in the present application has a housing having an air intake port and an air exhaust port, and a flow path through which air flows between the air intake port and the air exhaust port. Cylindrical body a heat dissipation structure; and a plurality of heat sources provided in the housing and isolated from the flow path. The heat dissipation structure surrounds the flow path in a cross section in a direction intersecting the direction of air flow in the flow path, and includes a plurality of regions each connected to the heat source, and a connecting member having a thermal conductivity lower than that of the heat dissipation structure and connecting two adjacent regions, and at least one of the plurality of heat sources is disposed in contact with the heat dissipation structure. .

[0006] The imaging device disclosed in the present application includes a first imaging element, an image processing chip that processes an output signal of the first imaging element, a first member that surrounds the first imaging element, the image processing chip, and wiring that connects the first imaging element and the image processing chip, a first heat transfer member that is partially exposed to the outside of the first member and that conducts heat generated by the first imaging element, and a second heat transfer member that is partially exposed to the outside of the first member and that conducts heat generated by the image processing chip, and the first member, together with the first heat transfer member and the second heat transfer member, forms a flow path through which air flows from an intake port to an exhaust port.

[0007] The imaging device disclosed in the present application has a housing having an air intake port and an exhaust port, a heat dissipation structure having a flow path through which air flows between the air intake port and the exhaust port, and a plurality of heat sources provided within the housing and isolated from the flow path. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a perspective view of an imaging device according to a first embodiment. [Figure 2] FIG. 2 is a plan view or a bottom view of the imaging device according to the first embodiment. [Figure 3] FIG. 3 is a cross-sectional view of the imaging device according to the first embodiment. [Figure 4] FIG. 4 is a perspective view illustrating an example of arrangement of cooling fans on the heat sink according to the first embodiment. [Figure 5] FIG. 5 is a side cross-sectional view showing another example of the arrangement of the heat source according to the first embodiment. [Figure 6] FIG. 6 is a cross-sectional plan view of an imaging device showing another configuration example 1 of the heat sink according to the first embodiment. [Figure 7] FIG. 7 is a cross-sectional plan view of an imaging device showing another configuration example 2 of the heat sink according to the first embodiment. [Figure 8] FIG. 8 is a cross-sectional plan view of an imaging device showing another configuration example 3 of the heat sink according to the first embodiment. [Figure 9]FIG. 9 is a cross-sectional plan view of an imaging device showing another configuration example 4 of the heat sink according to the first embodiment. [Figure 10] FIG. 10 is a cross-sectional plan view of an imaging device showing another configuration example 5 of the heat sink according to the first embodiment. [Figure 11] FIG. 11 is an external view of the imaging device according to the second embodiment. [Figure 12] FIG. 12 is an exploded perspective view of the imaging device according to the second embodiment. [Figure 13] FIG. 13 is a cross-sectional view of the imaging device according to the second embodiment. [Figure 14] FIG. 14 is a perspective view illustrating an example of mounting a cooling device to an imaging device according to a second embodiment. DETAILED DESCRIPTION OF THE INVENTION [Example]

[0009] <External view of the imaging device> FIG. 1 is a perspective view of an imaging device according to a first embodiment, and FIG. 2 is a plan view or a bottom view of the imaging device according to the first embodiment. In FIG. 1, (A) is a front perspective view, and (B) is a rear perspective view. The imaging device 100 has a housing 101. A wide-angle lens 102A is provided on a front plate 101A of the housing 101.

[0010] Wide-angle lens 102B is provided on back plate 101B of housing 101. Vent 103C is provided on top plate 101C of housing 101. Vent 103D is provided on bottom plate 101D of housing 101. Slits are formed in vents 103C and 103D, and air passes through between the slits.

[0011] Wide-angle lens 102A is provided in housing 101 so as to protrude from housing 101. Wide-angle lens 102A receives light from outside housing 101 and outputs the light to image sensor 302A (see FIG. 3) arranged downstream. Wide-angle lens 102B is provided in housing 101 so as to protrude from housing 101 in the opposite direction from the direction in which wide-angle lens 102A protrudes. Wide-angle lens 102B receives light from outside housing 101 and outputs the light to image sensor 302B (see FIG. 3) arranged downstream.

[0012] At least one of the wide-angle lenses 102A and 102B has an angle of view of 180 degrees or more. The imaging device 100 arranges the two imaging elements 302A and 302B so that they face opposite directions, and arranges the wide-angle lenses 102A and 102B in front of the imaging elements 302A and 302B, respectively, to capture an image of a subject over a solid angle of 4π steradians.

[0013] <Internal structure of the imaging device 100> 3A and 3B are cross-sectional views of the imaging device 100 according to the first embodiment. FIG. 3A is a plan cross-sectional view of the imaging device 100, and FIG. 3B is a side cross-sectional view of the imaging device 100. The imaging device 100 includes lens barrels 301A and 301B, imaging elements 302A and 302B, a circuit board 303, a circuit 304, a heat transfer sheet 305, and a heat sink 306, which is an example of a heat dissipation structure. The imaging elements 302A and 302B and the circuit 304 are heat sources. X is an optical axis common to the wide-angle lenses 102A and 102B. The direction from the rear plate 101B toward the front plate 101A is defined as +X, and the direction from the front plate 101A toward the rear plate 101B is defined as -X.

[0014] Lens barrels 301A and 301B hold wide-angle lenses 102A and 102B at one end exposed to the outside, and hold image pickup elements 302A and 302B at the other end inside housing 101, respectively.

[0015] Image pickup elements 302A and 302B are disposed behind wide-angle lenses 102A and 102B, respectively, and receive light collected by wide-angle lenses 102A and 102B and convert it into an electrical signal. Image pickup element 302A is connected to heat sink 306 via heat transfer sheet 305. Image pickup element 302B is also connected to heat sink 306.

[0016] Furthermore, the imaging elements 302A and 302B are electrically connected to the circuit 304 via the circuit board 303 by a flexible wiring board (not shown) present in the internal space 300. This allows image signals from the imaging elements 302A and 302B to be output to the circuit 304. The internal space 300 is an enclosed space within the imaging device 100 excluding the heat sink 306 and the through-hole 306a.

[0017] The imaging elements 302A and 302B may be, for example, XY address type solid-state imaging elements (for example, CMOS (Complementary Metal-Oxide Semiconductor) sensors) or progressive scan type solid-state imaging elements (for example, CCD (Charge Coupled Device)).

[0018] A plurality of light receiving elements (pixels) are arranged in a matrix on the light receiving surfaces of the image sensors 302A and 302B. The pixels of the image sensors 302A and 302B are fitted with a plurality of types of color filters, each of which transmits light of a different color component, and are arranged in a predetermined color array (e.g., a Bayer array). Therefore, each pixel of the image sensors 302A and 302B outputs an analog electrical signal corresponding to each color component to the circuit 304 through color separation by the color filters. The amounts of heat generated by the image sensors 302A and 302B may differ as long as they are smaller than the amount of heat generated by the circuit 304.

[0019] The image sensors 302A and 302B each have an AFE (Analog Front End). The AFE is an analog front-end circuit that processes analog electrical signals from the image sensors 302A and 302B. The AFE sequentially performs gain adjustment of the electrical signals, analog signal processing (correlated double sampling, black level correction, etc.), A / D conversion processing, and digital signal processing (defective pixel correction, etc.) to generate RAW image data and output it to the circuit 304.

[0020] The circuit board 303 is a board on which the circuit 304 is mounted. The circuit board 303 is disposed between the image sensor 302A and the heat sink 306 along a direction perpendicular to the optical axis X. The circuit board 303 has wiring that electrically connects the circuits 304 to each other. The circuit board 303 electrically connects the image sensor 302A, 302B to the circuit 304 via a flexible wiring board (not shown). The circuit 304 is a device mounted on the circuit board 303, and is connected to the heat sink 306 directly or via a heat transfer pad (not shown). This allows heat generated in the circuit 304 to be transferred to the heat sink 306.

[0021] Specifically, the circuit 304 includes, for example, a processor, a memory, and an LSI such as an ASIC (Application Specific Integrated Circuit) or an FPGA (Field-Programmable Gate Array).

[0022] The processor performs overall control of the imaging device 100. The processor executes programs. The memory stores the programs executed by the processor, prepared data, and data obtained by execution processing by the processor and LSI.

[0023] The LSI performs specific signal processing, such as image processing and compression / decompression processing, using electrical signals from the image sensors 302A and 302B. This specific signal processing may be realized by a processor executing a program stored in memory. For example, the LSI that performs image processing and the processor that executes the image processing program stored in memory are image processing chips. As such, because the circuit 304 performs various processes, the amount of heat generated by the circuit 304 is greater than that of the image sensors 302A and 302B. The LSI that performs image processing is referred to as an image processing chip.

[0024] The heat transfer sheet 305 is a sheet that has thermal conductivity and flexibility. The heat transfer sheet 305 is, for example, a copper foil or a graphite sheet. One end of the heat transfer sheet 305 is connected to the image sensor 302A directly or via a heat transfer pad (not shown). The other end of the heat transfer sheet 305 is connected to the outer surface of the heat sink 306. This allows the heat transfer sheet 305 to absorb heat generated by the image sensor 302A and transfer the heat to the heat sink 306.

[0025] The heat sink 306 is provided between the circuit 304 and the image sensor 302B. The heat sink 306 is a thermally conductive heat dissipation member such as aluminum. The heat sink 306 is cylindrical, and its through hole 306a extends in a direction perpendicular to the optical axis X. Specifically, for example, one end of the through hole 306a communicates with the ventilation hole 103D of the bottom plate 101D, and the other end of the through hole 306a communicates with the ventilation hole 103C of the top plate 101C.

[0026] Lower edge 306c of heat sink 306 contacts the surface of bottom plate 101D facing the housing 101 and covers vent hole 103D. Similarly, upper edge 306b of heat sink 306 contacts the surface of top plate 101C facing the housing 101 and covers vent hole 103C. This separates housing 101 into through hole 306a and internal space 300 excluding heat sink 306 and through hole 306a. In other words, internal space 300 is sealed by the inner wall surface of housing 101 and the outer wall surface of heat sink 306, preventing the intrusion of dust, water, and other liquids through vent holes 103C, 103D, and through hole 306a during air cooling.

[0027] Heat sink 306 is fixed to circuit 304 and imaging element 302B directly or via a heat transfer pad (not shown). Therefore, heat sink 306 can absorb heat generated by circuit 304 and imaging element 302B. In addition, heat sink 306 is connected to heat transfer sheet 305 on its outer surface. This allows heat sink 306 to absorb heat generated by imaging element 302A via heat transfer sheet 305.

[0028] Suppose that air outside the housing 101 flows in through the ventilation hole 103D in the bottom panel 101D due to, for example, the wind direction or the movement of the imaging device 100. As described above, the heat sink 306 absorbs heat from the circuit 304 and the imaging elements 302A and 302B, and so the air that has flowed in is heated by the heat from the inner wall surface of the heat sink 306, flows in the direction of the thick arrow in (B), and is discharged through the ventilation hole 103C.

[0029] As a result, the circuit 304 and the image pickup elements 302A and 302B in the internal space 300 are cooled by the air flowing outside the internal space 300 (through-hole 306a). Therefore, even if dust or liquid such as water flows into the through-hole 306a together with the air, it does not enter the internal space 300. This makes it possible to prevent malfunctions and lens contamination caused by the intrusion of dust, water, or other liquid.

[0030] The air may flow in through the ventilation hole 103C and be discharged through the ventilation hole 103D. The heat sink 306 may be disposed so that the through-hole 306a faces in a direction perpendicular to both side surfaces of the housing 101.

[0031] <Cooling fan placement example> 4 is a perspective view illustrating an example of arrangement of a cooling fan on a heat sink 306 according to the first embodiment. In the first embodiment, the imaging device 100 may not include a cooling fan as illustrated in FIG. 3, or may include a cooling fan 400 as illustrated in FIG. 4. The cooling fan 400 is arranged in a through-hole 306a of the heat sink 306. The cooling fan 400 is electrically connected to the circuit 304 via the circuit board 303 by wiring (not shown) that is routed from the inner wall surface of the through-hole 306a, where the cooling fan 400 and the heat sink 306 come into contact, to the inside of the heat sink 306. This allows the imaging device 100 to drive and control the cooling fan 400 from the circuit 304.

[0032] 4A to 4C, the rotation axis of cooling fan 400 is in the same direction as through-hole 306a, and cooling fan 400 draws air in from bottom opening 306e of heat sink 306 and exhausts air from top opening 306d.

[0033] 1A shows a configuration in which the cooling fan 400 is disposed at the upper end opening 306d of the heat sink 306. As a result, the cooling fan 400 draws air into the heat sink 306 from the lower end opening 306e. The air absorbs heat from the inner wall surface of the through-hole 306a of the heat sink 306. The cooling fan 400 then expels the heated air to the outside of the housing 101.

[0034] 1B shows a configuration in which cooling fan 400 is disposed at bottom opening 306e of heat sink 306. As a result, cooling fan 400 draws air from outside housing 101 through bottom opening 306e and causes the air to flow into heat sink 306. The air that has flowed in absorbs heat from the inner wall surfaces of through-holes 306a while heading toward top opening 306d and is then exhausted to the outside of housing 101.

[0035] 1C shows a configuration in which the cooling fan 400 is disposed inside the through-hole 306a of the heat sink 306. As a result, the cooling fan 400 causes air to flow in from the lower end opening 306e inside the through-hole 306a and discharge it to the upper end opening 306d. The air absorbs heat from the inner wall surface of the through-hole 306a from the lower end opening 306e to the upper end opening 306d.

[0036] In this way, by installing cooling fan 400, it is possible to forcibly air-cool the inside of housing 101. Note that since the arrangement position of cooling fan 400 differs in configurations (A) to (C), one of configurations (A) to (C) is adopted in consideration of the weight balance with other parts inside housing 101.

[0037] <Other examples of heat source placement> 5 is a side cross-sectional view showing another example of the arrangement of the heat sources according to the first embodiment. In FIG. 5, the vent hole 103D is an intake hole, and the vent hole 103C is an exhaust hole. In FIG. 3, the circuit 304 and the imaging element 302B are connected at positions at the same distance from the bottom plate 101D on opposite sides of the heat sink 306. In FIG. 5, the circuit 304 and the imaging element 302B are connected at positions at different distances from the bottom plate 101D on opposite sides of the heat sink 306.

[0038] Specifically, image sensor 302B generates less heat than circuit 304. For this reason, image sensor 302B is connected upstream of circuit 304 in the air flow, for example, to the lower end of heat sink 306 near vent 103D. On the other hand, circuit 304 generates more heat than image sensor 302B. For this reason, circuit 304 is connected downstream of image sensor 302B in the air flow, for example, to the upper end of heat sink 306 near vent 103C.

[0039] In this way, the heat source (image pickup elements 302A and 302B) that generates a relatively small amount of heat is connected to the outer surface of the heat sink 306 that is upstream of the air flow, and the heat source (circuit 304) that generates a relatively large amount of heat is connected to the outer surface of the heat sink 306 that is downstream of the air flow. This allows the air that absorbs heat upstream of the through-hole 306a to flow downstream, but it is still able to absorb the heat dissipated from the circuit 304 and suppress the temperature rise of the downstream heat source (circuit 304) due to heat transfer from the downstream air. This allows for efficient air cooling. Furthermore, in the configuration of FIG. 5, a cooling fan 400 may be installed as shown in FIGS. 4A to 4C. This allows for rapid air cooling.

[0040] <Other Configuration Examples of Heat Sink 306> Next, another example of the configuration of the heat sink 306 will be described.

[0041] 6 is a plan cross-sectional view of the imaging device 100 illustrating another configuration example 1 of the heat sink 306 according to the first embodiment. The heat sink 306 has shielding members 601 to 603. The shielding members 601 to 603 extend in the penetrating direction of the through-hole 306a from the upper end opening 306d to the lower end opening 306e. The shielding members 601 to 603 divide the heat sink 306 into sections 612, 613, and 623 corresponding to the heat sources. The shielding members 601 to 603 are made of a material having lower thermal conductivity than the heat sink 306, such as plastic. This suppresses heat transfer between the sections 612, 613, and 623, making it easier to accumulate heat in each of the sections 612, 613, and 623.

[0042] The positions of the shielding members 601-603 are determined by the heat sources (circuit 304, image pickup elements 302A, 302B) connected to sections 612, 613, 623. The larger the section connected to a heat source that generates a larger amount of heat, the larger the area should be to increase the amount of heat stored. For this reason, the positions of the shielding members 601-603 are determined so that the greater the amount of heat generated, the longer the distance between the shielding members 601-603 (for example, so that it is proportional to the power consumption of the heat source). Here, the distance between the shielding members 601 and 602 along the heat sink 306 is D12, the distance between the shielding members 601 and 603 is D13, and the distance between the shielding members 602 and 603 is D23.

[0043] For example, the circuit 304 generates more heat than the imaging elements 302A and 302B. Therefore, the distance D12 of the section 612 to which the circuit 304 is connected is longer than the distances D12 and D23 of the sections 612 and 613 to which the imaging elements 302A and 302B are connected. As a result, the shielding members 601 to 603 are arranged so that the area of ​​the heat sink 306 to which the circuit 304 is connected is larger than the area of ​​the heat sink 306 to which the imaging elements 302A and 302B are connected.

[0044] In this way, by providing shielding members 601-603 on the heat sink 306 and forming compartments 612, 613, and 623, it is possible to suppress the exchange of heat between heat sources via the heat sink, and for example, it is possible to prevent a heat source with a large amount of heat generation from heating a heat source with a small amount of heat generation, thereby enabling efficient air cooling according to the amount of heat generation. Note that in the configuration of Figure 6, a cooling fan 400 may be mounted as shown in Figures 4(A)-(C). This allows for rapid air cooling.

[0045] 7 is a plan cross-sectional view of the imaging device 100 illustrating another configuration example 2 of the heat sink 306 according to the first embodiment. The other configuration example 2 is a configuration in which a partition plate 700 is further provided in addition to the other configuration example 1 of FIG. 6. The partition plate 700 is a plate-like member that connects the shielding members 601 to 603 and extends in the penetration direction of the through-hole 306a from the upper end opening 306d to the lower end opening 306e. Like the shielding members 601 to 603, the partition plate 700 is made of a material that has lower thermal conductivity than the heat sink 306, such as plastic. The partition plate 700 divides the through-hole 306a into three through-holes 712, 713, and 723.

[0046] As a result, the air flowing through through-hole 712 cools section 612 to which heat generated from circuit 304 is conducted. The air flowing through through-hole 713 cools section 613 to which heat generated from image sensor 302A is conducted via heat transfer sheet 305. The air flowing through through-hole 723 cools section 623 to which heat generated from image sensor 302B is conducted.

[0047] In this way, by providing the partition plate 700 inside the heat sink 306, it is possible to suppress the exchange of heat between the through holes 712, 713, and 723, and it is possible to air-cool each of the sections 612, 613, and 623 independently. In the configuration of Fig. 6, a cooling fan 400 may be mounted as shown in Figs. 4(A) and (B). This allows for rapid air-cooling.

[0048] FIG. 8 is a plan cross-sectional view of the imaging device 100 illustrating another configuration example 3 of the heat sink 306 according to the first embodiment. In this configuration example 3, the heat sink 306 is recessed in the optical axis X direction. The heat sink 306 has recesses 800A and 800B at the connection points between the circuit 304 and the image sensor 302B. The distance D1 between the recesses 800A and 800B is shorter than the width D2 of the through-hole 306a in the optical axis X direction where the recesses 800A and 800B are not formed. Therefore, when air flows into the through-hole 306a, the air flows faster in the space 801 between the recesses 800A and 800B than in the space 802 of the through-hole 306a where the recesses 800A and 800B are not formed, and heat is more easily absorbed from the inner wall surfaces of the recesses 800A and 800B. This improves the air-cooling efficiency in the space 801.

[0049] Furthermore, since the circuit 304 and the image sensor 302B are housed in the recesses 800A and 800B outside the heat sink 306, the thickness of the housing 101 in the direction of the optical axis X is reduced accordingly. This allows the image pickup device 100 to be made more compact. In the configuration of FIG. 8, a cooling fan 400 may be mounted as shown in FIGS. 4(A) to 4(C). This allows for rapid air cooling.

[0050] 9 is a plan cross-sectional view of the imaging device 100 showing another configuration example 4 of the heat sink 306 according to the first embodiment. Another configuration example 4 is an example in which another configuration example 1 (FIG. 6) and another configuration example 3 (FIG. 8) are combined. As in another configuration example 1 (FIG. 6), the heat sink 306 is provided with shielding members 601 to 603 and compartments 612, 613, and 623 are formed, so that heat transfer between heat sources via the heat sink can be suppressed, and for example, it is possible to prevent a heat source with a large heat generation amount from heating a heat source with a small heat generation amount, thereby enabling efficient air cooling according to the heat generation amount.

[0051] As in the third configuration example (FIG. 8), the air flows faster in the space 801 than in the space 802, improving the cooling efficiency in the space 801. Furthermore, since the circuit 304 and the image sensor 302B are housed in the recesses 800A and 800B outside the heat sink 306, the thickness of the housing 101 in the direction of the optical axis X is reduced accordingly. This allows the image pickup device 100 to be made more compact. In the configuration of FIG. 9, the cooling fan 400 may be mounted as shown in FIGS. 4A to 4C. This allows for rapid air cooling.

[0052] 10 is a plan cross-sectional view of the imaging device 100 showing Alternative Configuration Example 5 of the heat sink according to Example 1. Alternative Configuration Example 5 is an example in which Alternative Configuration Example 2 (FIG. 7) and Alternative Configuration Example 3 (FIG. 8) are combined. As in Alternative Configuration Example 2 (FIG. 7), by providing the partition plate 700 inside the heat sink 306, it is possible to suppress the exchange of heat between the through-holes 712, 713, and 723, and it is possible to air-cool each of the sections 612, 613, and 623 independently.

[0053] As in the third configuration example (FIG. 8), the air flows faster in the space 801 than in the space 802, improving the cooling efficiency in the space 801. Furthermore, since the circuit 304 and the image sensor 302B are housed in the recesses 800A and 800B outside the heat sink 306, the thickness of the housing 101 in the direction of the optical axis X is reduced accordingly. This allows the image pickup device 100 to be made more compact. In the configuration of FIG. 10, the cooling fan 400 may be mounted as shown in FIGS. 4A and 4B. This allows for rapid air cooling.

[0054] As described above, according to the first embodiment, it is possible to improve the air-cooling efficiency within the imaging device 100 while suppressing the intrusion of dust, water, and other liquids due to intake air into the space in which the circuit 304, the image sensors 302A and 302B, etc. are present. Furthermore, in the imaging device 100, the wide-angle lens 102A, the image sensor 302A, the circuit 304, the heat sink 306, the image sensor 302B, and the wide-angle lens 102B are arranged on the X axis in this order in the -X direction. The imaging device 100 in which the combination of the wide-angle lens 102A and the image sensor 302A and the combination of the wide-angle lens 102B and the image sensor 302B are arranged back-to-back in opposite directions captures an image of a subject over a solid angle of 4π steradians.

[0055] Therefore, when a new mechanism such as the heat sink 306 is added to the inside of the imaging device 100, it is necessary to expand the housing 101 to accommodate the new mechanism. For example, if the housing 101 is lengthened in a direction perpendicular to the optical axis X (for example, toward the bottom panel 101D) without changing the thickness of the housing 101 in the optical axis X direction, an image of the expanded part of the housing 101 will be reflected.

[0056] For this reason, it is preferable to arrange the heat sink 306, the circuit 304, and the circuit board 303 on the optical axis X and between the image pickup elements 302A and 302B. By arranging them in this manner, it is possible to suppress the reflection of the image of the housing 101. [Example]

[0057] Next, a second embodiment will be described. The imaging device 100 according to the first embodiment has a heat sink 306 having a through-hole 306a serving as an air flow path, as a heat dissipation structure, and the through-hole 306a is isolated from an internal space 300 of a housing 101 that accommodates heat sources such as a circuit 304 and image sensors 302A and 302B. In contrast, the imaging device according to the second embodiment has a heat dissipation structure in which the circuit 304 and image sensors 302A and 302B, which are heat sources, are accommodated in a storage case and sealed, and heat generated by the heat source in the storage case is dissipated to the outside of the imaging device in the space outside the storage case within the imaging device. Note that the same components as those in the first embodiment are denoted by the same reference numerals, and their description will be omitted.

[0058] <External View of Imaging Device 1100> 11A and 11B are external views of an imaging device 1100 according to a second embodiment. FIG. 11A is a perspective view of the imaging device 1100, and FIG. 11B is a front view of the imaging device 1100. The imaging device 1100 has a front panel 1101A, a housing 1101, and a rear panel 1101B, which constitute a housing. A wide-angle lens 102A is inserted into the center of the front panel 1101A and is exposed to the outside. Ventilation holes 1102 to 1104 are provided on the left, right, and below the wide-angle lens 102A of the front panel 1101A. The front panel 1101A and the rear panel 1101B sandwich the housing 1101, and form a top surface 1101C, a bottom surface 1101D, and a side surface 1101E of the imaging device 1100.

[0059] <Internal structure of the imaging device 1100> Fig. 12 is an exploded perspective view of the imaging device 1100 according to the second embodiment. Fig. 13 is a cross-sectional view of the imaging device 1100 according to the second embodiment. In Fig. 13, (A) is a side cross-sectional view taken along line AA in Fig. 11, (B) is a plan cross-sectional view taken along line BB in Fig. 11, and (C) is a side cross-sectional view taken along line CC in Fig. 11. The storage case 1101 has a box portion 1200A and a lid portion 1200B. An opening 1200A0 of the box portion 1200A is sealed by the lid portion 1200B.

[0060] Box 1200A has holder 1200Aa and openings 1200Ab2 to 1200Ab4. Holder 1200Aa is, for example, hollow cylindrical, and has through-hole 1200Aa1 into which barrel 1201A can be inserted. Holder 1200Aa holds barrel 1201A by inserting barrel 1201A into through-hole 1200Aa1.

[0061] This seals the through-hole 1200Aa1. Therefore, the image of the subject can be captured by the image sensor 302A while preventing dust, water, and other liquids from entering the housing case 1101 through the through-hole 1200Aa1. The holder 1200Aa is inserted into the opening 1105A of the front plate 1101A.

[0062] The openings 1200Ab2 to 1200Ab4 are provided at positions facing the ventilation holes 1102 to 1104, respectively. The opening 1200Ab2 is sealed by a first heat transfer plate 1212, which will be described later. The opening 1200Ab3 is sealed by a second heat transfer plate 1213. The opening 1200Ab4 is sealed by a fourth heat transfer plate 1215, which will be described later. Therefore, heat can be dissipated from inside the housing case 1101 to outside the housing case 1101 while preventing dust, water, and other liquids from entering the housing case 1101 through the openings 1200Ab2 to 1200Ab4.

[0063] Heat sinks 1202 to 1204 are housed in the space between the front plate 1101A and the box portion 1200A. The heat sink 1202 is disposed between the ventilation hole 1102 and the opening 1200Ab2 of the front plate 1101A. The heat sink 1203 is disposed between the ventilation hole 1103 and the opening 1200Ab3 of the front plate 1101A. The heat sink 1204 is disposed between the ventilation hole 1104 and the opening 1200Ab4 of the front plate 1101A. The front plate 1101A is fixed to the box portion 1200A. The back plate 1101B is also fixed to the box portion 1200A.

[0064] 13(C), a vent 1302 serving as an exhaust port is provided near the heat sink 1204. The vent 1302 communicates with the space between the front plate 1101A and the casing 1101. This forms a flow path F (see FIG. 14) that runs from the vents 1102-1104 to the vent 1302 via the heat sinks 1202-1204. Therefore, the heat sinks 1202-1204 are cooled by the air that flows in through the vents 1102-1104. The air that has received heat from the heat sinks 1202-1204 is then exhausted through the vent 1302.

[0065] Accommodating case 1101 accommodates imaging elements 302A and 302B, circuit board 303, circuit 304, first heat transfer plate 1212, second heat transfer plate 1213, third heat transfer plate 1214, and fourth heat transfer plate 1215. Circuit board 303 electrically connects imaging elements 302A and 302B to circuit 304 via a flexible wiring board (not shown). This flexible wiring board is also accommodated in accommodating case 1101. First heat transfer plate 1212, second heat transfer plate 1213, third heat transfer plate 1214, and fourth heat transfer plate 1215 are thermally conductive plates such as copper plates, for example.

[0066] A lens barrel 1201A is attached to the imaging element 302A. The lens barrel 1201A is inserted into the through-hole 1200Aa1 of the holder 1200Aa. This causes the through-hole 1200Aa1 of the lens barrel 1201A to be sealed with the imaging element 302A.

[0067] The first heat transfer plate 1212 is disposed parallel to the circuit board 303 so as to be perpendicular to the optical axis X. The first heat transfer plate 1212 is fixed to the imaging element 302A directly or via a heat transfer pad (not shown). This allows the first heat transfer plate 1212 to absorb heat from the imaging element 302A. The first heat transfer plate 1212 is also fixed to the back surface of the box part 1200A and seals the opening 1200Ab2 of the box part 1200A. This prevents dust, water, and other liquids from entering the inside of the housing case 1101 through the opening 1200Ab2.

[0068] By sealing opening 1200Ab2, a portion of first heat transfer plate 1212 is exposed through opening 1200Ab2. As a result, first heat transfer plate 1212 conducts heat absorbed from image sensor 302A to heat sink 1202 from this exposed surface. In other words, first heat transfer plate 1212 and heat sink 1202 serve as heat transfer members that conduct heat generated by image sensor 302A inside casing 1101 to the outside of casing 1101. Heat transfer path R2 is formed from image sensor 302A to heat sink 1202. Therefore, heat generated by image sensor 302A is conducted to the air outside casing 1101 via heat sink 1202, and the air is discharged to the outside of image sensor 1100 through vent 1102.

[0069] The second heat transfer plate 1213 is disposed parallel to the optical axis X and perpendicular to the circuit board 303. One end 1213a and the other end 1213b of the second heat transfer plate 1213 are bent so as to be parallel to the circuit board 303. The bent end 1213a of the second heat transfer plate 1213 is fixed to the image sensor 302B directly or via a heat transfer pad (not shown). This allows the second heat transfer plate 1213 to absorb heat from the image sensor 302B. The other bent end 1213b of the second heat transfer plate 1213 is fixed to the rear surface of the box section 1200A and seals the opening 1200Ab3 of the box section 1200A. This prevents dust, water, and other liquids from entering the housing case 1101 through the opening 1200Ab3.

[0070] By sealing opening 1200Ab3, the other end 1213b of second heat transfer plate 1213 is exposed through opening 1200Ab3. As a result, second heat transfer plate 1213 conducts heat absorbed from image sensor 302B to heat sink 1203 from this exposed other end 1213b. In other words, second heat transfer plate 1213 and heat sink 1203 serve as heat transfer members that conduct heat generated by image sensor 302B inside casing 1101 to the outside of casing 1101. The path from image sensor 302B to heat sink 1203 forms heat transfer path R3. Therefore, the heat generated by image sensor 302B is conducted to the air outside casing 1101 via heat sink 1203, and the air is discharged to the outside of image sensor 1100 through vent 1103.

[0071] The third heat transfer plate 1214 is disposed parallel to the circuit board 303 so as to be perpendicular to the optical axis X. The third heat transfer plate 1214 connects the imaging element 302B and the second heat transfer plate 1213. The third heat transfer plate 1214 conducts heat generated by the imaging element 302B to the second heat transfer plate 1213.

[0072] The fourth heat transfer plate 1215 is disposed parallel to the circuit board 303 so as to be perpendicular to the optical axis X. The fourth heat transfer plate 1215 is fixed to the circuit 304 via a heat transfer pad 1303 (see FIG. 13). This allows the fourth heat transfer plate 1215 to absorb heat generated from the circuit 304. The fourth heat transfer plate 1215 is also fixed to the box part 1200A and seals the opening 1200Ab4. This prevents dust, water, and other liquids from entering the inside of the housing case 1101 through the opening 1200Ab4.

[0073] By sealing the opening 1200Ab4, the fourth heat transfer plate 1215 is exposed from the opening 1200Ab4. As a result, the fourth heat transfer plate 1215 conducts heat absorbed from the circuit 304 to the heat sink 1204 from its exposed surface. That is, the fourth heat transfer plate 1215 and the heat sink 1204 serve as heat transfer members that conduct heat generated in the circuit 304 inside the casing 1101 to the outside of the casing 1101. The heat transfer path R4 is from the circuit 304 to the heat sink 1204. Therefore, the heat generated from the circuit 304 is conducted to the air outside the casing 1101 via the heat sink 1203, and the air is discharged to the outside of the imaging device 1100 through the ventilation hole 1104.

[0074] Furthermore, the first heat transfer plate 1212, the second heat transfer plate 1213, the third heat transfer plate 1214, and the fourth heat transfer plate 1215 do not contact one another. This suppresses the transfer of heat between the first heat transfer plate 1212, the second heat transfer plate 1213, the third heat transfer plate 1214, and the fourth heat transfer plate 1215. In particular, this suppresses the transfer of heat from the circuit 304, which generates a relatively large amount of heat, to the image pickup elements 302A and 302B, which generate a relatively small amount of heat. This suppresses a decrease in air-cooling efficiency.

[0075] 13A and 13C, a battery 1300 is accommodated in the accommodation case 1101. The battery 1300 supplies power to the circuit 304 and the image pickup elements 302A and 302B via a flexible wiring board (not shown) in the accommodation case 1101 and a circuit board 303. The battery 1300 may be rechargeable. In the second embodiment, the battery 1300 is disposed at a position where it does not overlap with the heat sink 1202, the heat sink 1203, and the heat sink 1204 in the optical axis X direction. This makes it possible to prevent the image pickup device 1100 from becoming large. Also, in FIG. 13A, a screw groove 1301 is provided near the heat sink 1204.

[0076] <Example of installing a cooling fan 400> 14 is a perspective view showing an example of mounting a cooling device to an imaging device 1100 according to Example 2. Fig. 14 shows the internal structures of the imaging device 1100 and the cooling device 1400. The cooling device 1400 is detachable from the imaging device 1100.

[0077] The cooling device 1400 accommodates the cooling fan 400 in a housing 1401. The housing 101 has, for example, a rectangular parallelepiped shape and has an attachment / detachment mechanism 1403 on one side thereof. The attachment / detachment mechanism 1403 has a structure including a dial 1403a and a screw (not shown) attached to its rotation axis. When the dial 1403a is rotated in one direction, the screw enters the screw groove 1301 shown in FIG. 13 and engages with the screw groove 1301, and when the dial 1403a is rotated in the other direction, the screw retracts and disengages from the screw groove 1301. Note that the attachment / detachment mechanism 1403 is not limited to a latch mechanism or the like that can engage / detach the screw and the screw groove 1301, as long as it is detachable from the imaging device 1100.

[0078] An air intake 1401a is provided on the side surface of the housing 101 on which the attachment / detachment mechanism 1403 is provided. The air intake 1401a communicates with the air vent 1302 when the cooling device 1400 is attached to the imaging device 1100. An exhaust vent 1401b is provided on another side surface of the housing 101 different from the side surface on which the attachment / detachment mechanism 1403 is provided.

[0079] The cooling fan 400 forcibly draws in air to which heat has been transferred inside the imaging device 1100 through an air intake port 1401a as the fan rotates, and exhausts the air through an exhaust port 1401b. The cooling fan 400 is supplied with power from a power source (not shown) inside the housing 101 or a battery 1300 of the imaging device 1100, and the fan is driven to rotate or stopped by pressing an operation button 1404.

[0080] In this way, the cooling device 1400 is detachable from the imaging device 1100. This allows the cooling device 1400 to be detached when forced air cooling is not required, thereby reducing the weight of the imaging device 1100. In other words, when air cooling becomes necessary, the cooling device 1400 can be attached to the imaging device 1100 and the cooling fan 400 can be driven.

[0081] In this way, according to the second embodiment, it is possible to improve the air-cooling efficiency within the imaging device 1100 while suppressing the intrusion of dust and liquids such as water into the space where the circuit 304, imaging elements 302A, 302B, etc. are present due to the intake of air.

[0082] Furthermore, heat sinks 1202 and 1203 that radiate heat from heat sources (imaging elements 302A and 302B) that generate a relatively small amount of heat are disposed near vents 1102 and 1103 on the upstream side of flow path F. A heat sink 1204 that radiates heat from a heat source (circuit 304) that generates a relatively large amount of heat is disposed near vent 1302 on the downstream side of flow path F. This allows air that has absorbed heat on the upstream side of flow path F to flow downstream, and is able to sufficiently absorb the heat radiated from circuit 304, thereby suppressing a temperature rise in the downstream heat source (circuit 304) due to heat transfer from the downstream air. Therefore, efficient air cooling can be achieved.

[0083] Furthermore, by providing the ventilation hole 1104, the heat sink 1204 absorbs heat not only with the air heated by the heat sinks 1202 and 1203, but also with air from outside the imaging device 1100 that has not been heated by the heat sinks 1202 and 1203. This improves the cooling efficiency of the circuit 304.

[0084] Furthermore, in imaging device 1100, wide-angle lens 102A, imaging element 302A, heat sinks 1202-1204, circuit 304, imaging element 302B, and wide-angle lens 102B are arranged on the X axis in this order facing the -X direction. Imaging device 1100, in which a combination of wide-angle lens 102A and imaging element 302A and a combination of wide-angle lens 102B and imaging element 302B are arranged back-to-back in opposite directions, images a subject over a solid angle of 4π steradians.

[0085] Therefore, when a new mechanism such as heat sinks 1202 to 1204 is added to the inside of the imaging device 1100, it is necessary to expand the imaging device 1100 to accommodate the new mechanism. For example, if the imaging device 1100 is lengthened in a direction perpendicular to the optical axis X (for example, toward the bottom panel 101D) without changing the thickness of the imaging device 1100 in the optical axis X direction, an image of the expanded part of the imaging device 1100 will be reflected.

[0086] For this reason, it is preferable to arrange the heat sinks 1202 to 1204, the circuit 304, and the circuit board 303 on the optical axis X and between the image pickup elements 302A and 302B. By arranging them in this manner, it is possible to suppress reflection of the image of the image pickup device 1100.

[0087] In addition, the vents 1102 to 1104 that supply air from outside the imaging device 1100 are concentrated on the front panel 1101A as air intakes. As a result, the front panel 1101A receives the wind and draws in air, allowing the imaging elements 302A and 302B and the circuit 304 on the front panel 1101A side to be air-cooled collectively.

[0088] For example, when imaging device 1100 mounted on a moving object (a person, a bicycle, or an automobile) moves together with the moving object with the +X direction as its travel direction, air flows into the space between front panel 1101A and casing 1101 from ventilation holes 1102 to 1104. The air that has flowed in is then exhausted from ventilation hole 1302 without flowing into casing 1101. Therefore, it is possible to improve the air-cooling efficiency inside imaging device 1100 while suppressing the intrusion of dust or liquids such as water due to intake air.

[0089] 11 to 14, the heat sink 1202 and the heat sink 1203 are disposed on either side of the optical axis X. The heat sink 1204 is disposed between the heat sink 1202 and the heat sink 1203 and the vent 1302. This configuration prevents the image pickup device 1100 from becoming large and enables efficient air cooling.

[0090] 11 to 14, the heat sink 1202, the heat sink 1203, and the heat sink 1204 are all configured to be disposed on one lens barrel 1201A side of the imaging device 1100. However, this is not limiting, and one or two of the heat sink 1202, the heat sink 1203, and the heat sink 1204 may be configured to be disposed on the other lens barrel 1201B side.

[0091] For example, in a configuration in which heat sink 1202 is arranged on the other lens barrel 1201B side, heat transfer plate 1212 is formed so that heat is transferred to heat sink 1202 arranged on the other lens barrel 1201B side, and an air intake is provided on the other lens barrel 1201B, and heat is dissipated by an air flow formed from this air intake toward exhaust port 1401b. Similarly, in a configuration in which heat sinks 1203 and 1204 are arranged on the other lens barrel 1201B side, heat transfer plates 1213 and 1214 and air intakes are formed.

[0092] 11 to 14, the heat sink 1204 is arranged on the opposite side of the optical axis X from the battery 1300, but this is not limiting, and the heat sink 1204 may be arranged on the same side as the battery 1300. In this case, the ventilation hole 1302 is provided on the end face of the casing 1101 opposite to the end face in the examples in FIGS. 11 to 14.

[0093] As described above, the imaging devices 100 and 1100 according to the first and second embodiments radiate heat transferred from a heat source sealed inside the imaging device 100 or 1100 to an open portion inside the imaging device 100 or 1100 to the outside of the imaging device. This prevents the heat source from being directly exposed to wind, improving dustproofness and waterproofness.

[0094] The present invention is not limited to the above-described contents, and may be implemented by any combination thereof. Furthermore, other embodiments conceivable within the scope of the technical concept of the present invention are also included in the scope of the present invention. [Explanation of symbols]

[0095] 100 imaging device, 101 housing, 103C, 103D ventilation hole, 300 internal space, 302A, 302B imaging element, 303 circuit board, 304 circuit, 305 heat transfer sheet, 306 heat sink, 306a through hole, 400 cooling fan, 601 to 603 shielding member, 1100 imaging device, 1101 storage case, 1101A front panel, 1101B rear panel, 1102 to 1104 ventilation hole, 1200A box part, 1200Aa holding part, 1200B lid part, 1202 to 1204 heat sink, 1212 to 1215 heat transfer plate, 1300 battery, 1302 ventilation hole, 1400 cooling device

Claims

1. a housing having an intake port and an exhaust port; a cylindrical heat dissipation structure having a flow path through which air flows between the intake port and the exhaust port; a plurality of heat sources provided in the housing and isolated from the flow path; The heat dissipation structure includes: a plurality of regions surrounding the flow path in a cross section in a direction intersecting a direction in which air flows through the flow path, the regions being connected to the heat source; a connecting member having a thermal conductivity lower than that of the heat dissipation structure and connecting two adjacent regions, At least one of the plurality of heat sources is disposed in contact with the heat dissipation structure.

2. 2. The imaging device according to claim 1, an imaging device having a cooling fan that draws in air through the intake port and exhausts it to the exhaust port through the flow path;

3. An imaging device according to claim 1, The heat dissipation structure of the imaging device is formed of a heat transfer member.

4. An imaging device according to claim 1, At least one of the plurality of heat sources is disposed in the heat dissipation structure via a heat transfer member.

5. An imaging device according to claim 1, The imaging device, wherein the plurality of heat sources are arranged on an upstream side of the flow path of the heat dissipation structure so that the heat generated by the heat sources is smaller.

6. An imaging device according to any one of claims 1 to 5, the heat dissipation structure includes a first plate-shaped portion extending from the air intake port to the air exhaust port, and a second plate-shaped portion facing the first plate-shaped portion and extending from the air intake port to the air exhaust port, An imaging device in which, in the heat dissipation structure, the heat source is positioned at a position a specific distance from the air intake port of the first plate-shaped portion, and the heat source is not positioned at the specific distance from the air intake port of the second plate-shaped portion.

7. An imaging device according to claim 1, The heat dissipation structure includes a partition plate extending in a direction in which air flows through the flow path and dividing the flow path into the regions.

8. The imaging device according to claim 7, an area of ​​the flow path in the cross section for each of the regions partitioned by the partition plate being proportional to the amount of heat generated by the heat source disposed in each of the regions;

9. The imaging device according to claim 1, the heat dissipation structure includes a first plate-shaped portion extending from the air intake port to the air exhaust port, and a second plate-shaped portion facing the first plate-shaped portion and extending from the air intake port to the air exhaust port, An imaging device in which the width of the flow path between a first specific region of the first plate-shaped portion and a second specific region of the second plate-shaped portion opposite the first specific region is narrower than the width between another region of the first plate-shaped portion and another region of the second plate-shaped portion opposite the other region of the first plate-shaped portion.

10. The imaging device according to claim 9, an imaging device, wherein a first heat source of the plurality of heat sources is disposed in the first specific area, and a second heat source of the plurality of heat sources is disposed in the second specific area; 11. The imaging device according to claim 1, the plurality of heat sources include an image sensor that converts light from outside the housing into an electrical signal, and a signal processing unit that processes the electrical signal; The heat dissipation structure is provided between the plurality of heat sources.

12. The imaging device according to claim 1, a first lens that is provided on the housing so as to be exposed from the housing and that receives light from outside the housing and outputs the light to a first heat source among the plurality of heat sources; a second lens that is provided on the housing so as to be exposed from the housing on the opposite side to the first lens, and that receives light from outside the housing and emits the light to a second heat source among the plurality of heat sources, the first heat source is a first image sensor that converts light from the first lens into an electrical signal; the second heat source is a second image sensor that converts light from the second lens into an electrical signal; an imaging device, wherein a third heat source among the plurality of heat sources is a signal processing unit that processes electrical signals from the first imaging element and the second imaging element; 13. The imaging device according to claim 12, an angle of view of at least one of the first lens and the second lens is 180 degrees or more; 14. The imaging device according to claim 12, an imaging device that combines images obtained from the first imaging element and the second imaging element to form a spherical image; 15. The imaging device according to claim 12 or 13, An imaging device in which a cooling fan that takes in air through the intake port and exhausts it to the exhaust port through the flow path can be disposed on the optical axis of the first lens and the second lens.

16. The imaging device according to claim 1, a housing provided within the housing and configured to hermetically house the plurality of heat sources; The heat dissipation structure of the imaging device comprises the flow path formed by the interior of the housing and the container.

17. The imaging device according to claim 16, a heat dissipation member provided on the outside of the housing within the housing; a heat transfer member connecting the heat source and the heat dissipation member in the flow path; An imaging device having the above configuration.

18. The imaging device according to claim 17, The heat dissipation member is provided on the intake side of the housing.

19. The imaging device according to claim 16, the housing has another air intake; an imaging device, wherein the heat dissipation structure has a first flow path that draws in air from the intake port, passes through a first surface of the housing, and exhausts it to the exhaust port, and a second flow path that draws in air from the other intake port, passes through a second surface of the housing that is different from the first surface, and exhausts it to the exhaust port.

20. The imaging device according to claim 19, The imaging device, wherein the housing has the air intake and the other air intake on a specific surface on the outside of the housing.

21. The imaging device according to claim 16, The imaging device, wherein the plurality of heat sources include an imaging element that converts light from outside the housing into an electrical signal, and a signal processing unit that processes the electrical signal.

22. The imaging device according to claim 21, a first lens that is provided on the housing so as to be exposed from the housing and that receives light from outside the housing and outputs the light to a first heat source among the plurality of heat sources; a second lens that is provided on the housing so as to be exposed from the housing on the opposite side to the first lens, and that receives light from outside the housing and emits the light to a second heat source among the plurality of heat sources, the first heat source is a first image sensor that converts light from the first lens into an electrical signal; the second heat source is a second image sensor that converts light from the second lens into an electrical signal; an imaging device, wherein a third heat source among the plurality of heat sources is a signal processing unit that processes electrical signals from the first imaging element and the second imaging element; 23. The imaging device according to claim 22, an angle of view of at least one of the first lens and the second lens is 180 degrees or more; 24. The imaging device according to claim 22, an imaging device that combines images obtained from the first imaging element and the second imaging element to form a spherical image; 25. The imaging device according to claim 22, wherein: An imaging device in which a cooling fan that takes in air through the intake port and exhausts it to the exhaust port through the flow path can be disposed at a position off the optical axis of the first lens and the second lens.

Images