DI metal transaction device and method for manufacturing the same

Abstract

To provide a transaction device and a method for manufacturing the transaction device.SOLUTION: A transaction device includes: a metal layer 950 including one or more discontinuities 924 constituting a gap extending from the front surface to the back surface and defining a path from a device peripheral part to an opening 912; a transponder chip module 910 arranged in the opening 912; a booster antenna 942 in communication with the transponder chip module 910; and a reinforcement layer 982 arranged over the whole of the metal layer 950.SELECTED DRAWING: Figure 9C

Description

Technical Field

[0001] Cross - reference to Related Applications This application claims priority to U.S. Provisional Patent Application No. 62 / 971,439, filed on February 7, 2020, entitled "DI Metal Transaction Device and Method of Manufacturing Thereof", which is incorporated herein by reference.

[0002] The present invention relates to a transaction card with electronic components and a method of producing the same. [[ID=...]]

Background Art

[0003] Metal payment cards present unique challenges when they include electronic components such as inductive coupling payment modules, RF electronics, and stand - alone electronic inlays. To accommodate these components, the metal is machined into various geometries, and then the components are installed within cavities and left exposed or hidden under printed plastic sheets or other decorative elements. The decorative elements can be affixed to the card through various processes such as platen lamination, contact adhesives, curable adhesives, or "push - fit" or any bonding method known in the art. RF shielding is often required within the cavities, making card assembly even more complex while maintaining the desired aesthetics of the card.

[0004] Some of these required machined geometries remove a significant amount of metal or leave slits or holes through the card, which reduce the strength of the card and are aesthetically undesirable. Overmolding and insert molding techniques have been developed to encapsulate electronic inlays within the card and reinforce the card geometry for the purpose of strengthening the card and providing a desired surface. Additionally, this development allows for more metal removal within critical RF transmit and receive regions while maintaining structural rigidity and the desired appearance, resulting in improved RF performance compared to existing designs. [Overview of the project]

[0005] Aspects of the present invention relate to a transaction device, a method for manufacturing a transaction device, and a transaction device produced by the disclosed method.

[0006] One aspect of the present invention is a transaction device comprising a metal layer having a front surface, a back surface, a periphery, and an opening within the metal layer, a transponder chip module disposed within the opening, and a booster antenna in communication with the transponder chip module. The transponder chip module and the booster antenna are components in a circuit configured for wireless communication with a device reader. The metal layer has one or more discontinuities, each discontinuity constituting a gap in the metal layer extending from the front surface to the back surface, and including at least one discontinuity defining a passage from the device periphery to the opening. The metal layer is not part of the booster antenna or any component in the circuit.

[0007] Non-metallic molding material may be placed within one or more discontinuities in the metal layer. In some embodiments, a reinforcing layer, such as a layer containing fiberglass, more particularly fiber-reinforced epoxy laminate material, is placed throughout the metal layer. A fiber-reinforced epoxy laminate material layer can be placed on at least one of the front and back surfaces of the metal layer, and in some embodiments, the metal layer is sandwiched between opposing fiber-reinforced epoxy laminate material layers.

[0008] Another aspect of the present invention includes a transaction device comprising a metal layer having one or more discontinuities internally, a first nonmetallic reinforcing layer distributed across the entire front surface of the metal layer, a booster antenna distributed across the entire back surface of the metal layer, a second nonmetallic reinforcing layer distributed across the entire back surface of the metal layer, an opening in the metal layer extending through the first nonmetallic reinforcing layer, and a transponder chip module disposed within the opening. The booster antenna comprises multiple metallizations electrically isolated from the metal layer. The transponder chip module is in communication with the booster antenna and, together with the booster antenna, constitutes a payment circuit configured for wireless communication with a device reader. The first nonmetallic layer and the second nonmetallic layer may each comprise a fiber-reinforced epoxy laminate material.

[0009] One or more discontinuities may include discontinuities extending from the periphery to an opening in the metal layer, discontinuities extending from the periphery to an endpoint not within the opening in the metal layer, discontinuities extending from the intersection with a first discontinuity to an endpoint neither within the opening nor the periphery, or a combination thereof. The metal layer may be electrically insulated from the payment circuit, or may be part of the payment circuit.

[0010] Another aspect of the present invention includes a transaction device comprising a metal layer, an opening in the metal layer extending from the metal layer to the top surface of the device, one or more discontinuities in the metal layer, a back-side fiber-reinforced epoxy laminate layer distributed across the entire back surface of the metal layer, a booster antenna, and a transponder chip module disposed within the opening and having a top surface accessible from the top surface of the device. At least one discontinuity extends between the periphery of the metal layer and the opening in the metal layer. The booster antenna and the transponder chip module in communication state together constitute a payment circuit configured for wireless communication with a device reader. The booster antenna may include the metal layer or be separate from the metal layer, and the metal layer is electrically isolated from the payment circuit. A front-side fiber-reinforced epoxy laminate layer may be distributed across the entire front surface of the metal layer. The front and / or back-side fiber-reinforced epoxy laminate layers may each be directly bonded to the metal layer by the epoxy of their respective fiber-reinforced epoxy laminate layers. In embodiments where the metal layer is electrically isolated from the payment circuit and the booster antenna, the booster antenna may include multiple metallizations embedded on or within the back fiber-reinforced epoxy laminate layer. In embodiments where the multiple metallizations are located on the back surface of the back fiber-reinforced epoxy laminate layer, the device may include a non-metallic layer positioned across the multiple metallizations. Each fiber-reinforced epoxy laminate layer may be positioned across the entire front and back surfaces of the metal layer as a separate layer bonded to the metal layer by a non-epoxy adhesive of the respective fiber-reinforced epoxy laminate layer. In some embodiments, at least a portion of the multiple booster antenna metallizations may be positioned on the front surface of the back fiber-reinforced epoxy laminate layer and separated from the metal layer by a non-metallic layer positioned between the fiber-reinforced epoxy laminate layer and the metal layer.

[0011] Other aspects of the present invention include a method for manufacturing a transaction device as described herein. Such a method includes the steps of providing a metal layer, forming one or more discontinuities within the metal layer, arranging a booster antenna across the entire back surface of the metal layer, arranging a first fiberglass layer across the entire front surface of the metal layer, arranging a second fiberglass layer across the entire back surface of the metal layer, forming an opening within the metal layer extending through the first fiberglass layer to the top surface of the device, and arranging a transponder chip module within the opening. The opening within the metal layer is created in the same step as the discontinuity within the metal layer.

[0012] The method may include the steps of: positioning the booster antenna layer over the entire back surface of a metal layer such that the booster antenna metallization is electrically insulated from the metal layer; and configuring the device such that the metal layer is not included in the payment circuit. The step of positioning the booster antenna over the entire back surface of the metal layer may include forming a plurality of metallizations on or embedded in a second fiberglass layer; and optionally, positioning an additional non-metallic layer over the entire metallization.

[0013] In one method embodiment, the step of arranging first and second fiberglass layers over the entire front and back surfaces of a metal layer includes the step of casting the first and second fiberglass layers together with epoxy to form first and second fiber-reinforced epoxy laminated material layers that are directly bonded to the metal layer.

[0014] In another method embodiment, the step of arranging first and second fiberglass layers over the entire front and back surfaces of a metal layer includes the steps of attaching a first cured fiber-reinforced epoxy laminate to the front surface of the metal layer using a first adhesive layer, and attaching a second cured fiber-reinforced epoxy laminate layer to the back surface of the metal layer using a second adhesive layer. In an embodiment that includes the step of forming a booster antenna over the entire back surface of the metal layer, the multiple metallations may be formed on or embedded within the second cured fiber-reinforced epoxy laminate layer. One such method includes the steps of arranging a metal layer over the entire second cured fiber-reinforced epoxy laminate layer, and etching away a portion of the metal layer to leave the metallations. In a method that includes the step of forming multiple metallations on the internal surface of a second cured fiber-reinforced epoxy laminate layer facing a metal layer, the second adhesive layer may include a non-metallic substrate layer. A method comprising the step of forming a plurality of metallizations on the outer surface of a second cured fiber-reinforced epoxy laminate material layer facing outward with respect to a metal layer, the method may include the step of placing a non-metallic layer over the outer surface of the second cured fiber-reinforced epoxy laminate material and over the plurality of metallizations placed thereon.

[0015] In another aspect of the present invention, a method for manufacturing a transaction device includes providing a prefabricated laminate comprising a metal layer, a first cured fiber-reinforced epoxy laminate layer bonded to the front surface of the metal layer, and a second cured fiber-reinforced epoxy laminate layer bonded to the back surface of the metal layer. One or more discontinuities are formed within the metal layer of the prefabricated laminate, each discontinuity constituting a gap in the metal layer extending from the front surface to the back surface, and including at least one discontinuity extending to the periphery of the metal layer. Each of the one or more discontinuities similarly extends through at least one of the first cured fiber-reinforced epoxy laminate layer or the second cured fiber-reinforced epoxy laminate layer. A booster antenna is positioned across the entire outer surface of one of the first cured fiber-reinforced epoxy laminate layer or the second cured fiber-reinforced epoxy laminate layer. An opening is formed within the metal layer extending through the first fiberglass layer to the top surface of the device, and a transponder chip module is positioned within the opening. A booster antenna can be formed by forming multiple metallizations on the outer surface of one of the fiber-reinforced epoxy laminate layers, either a first cured fiber-reinforced epoxy laminate layer or a second cured fiber-reinforced epoxy laminate layer, or embedded within the one fiber-reinforced epoxy laminate layer. The method may further include the step of placing a nonmetallic layer over the outer surface of each cured fiber-reinforced epoxy laminate material and over the multiple metallizations placed thereon. It should be understood that both the above summary and the following detailed description are illustrative and not limiting to the invention.

[0016] This invention is best understood when the following detailed description is read in conjunction with the accompanying drawings, which have similar elements with the same reference number. Where multiple similar elements exist, a single reference number may be assigned to multiple similar elements, accompanied by a lowercase designation that signifies a specific element. When referring collectively to multiple elements or to one or more non-specific elements among multiple elements, the lowercase designation may be omitted. This emphasizes, in accordance with convention, that various features in the drawings are not depicted to scale unless otherwise indicated. Conversely, the dimensions of various features can be enlarged or reduced for clarity. The following figures are included in the drawings: [Brief explanation of the drawing]

[0017] [Figure 1] Figure 1 is a flowchart of selected steps of a method for manufacturing a transaction card according to an embodiment of the present invention. [Figure 2A-2B] Figure 2A is a photograph showing an electronic component before overmolding according to an embodiment of the present invention. Figure 2B is a photograph showing an electronic component after overmolding according to an embodiment of the present invention. [Figure 3A-3D] Figure 3A is a schematic example of the front side of a transaction card prior to insert molding according to an embodiment of the present invention. Figure 3B is a schematic example of the back side of a transaction card prior to insert molding according to an embodiment of the present invention. Figure 3C is a schematic example of the front side of a transaction card after insert molding according to an embodiment of the present invention. Figure 3D is a schematic example of the back side of a transaction card after insert molding according to an embodiment of the present invention. [Figure 4A-4B] Figures 4A and 4B are schematic examples of selected steps in an overmolding process for manufacturing a transaction card according to an aspect of the present invention. [Figures 5A-5C]Figure 5A is an image showing the front side of an exemplary card having an enclosed antenna surrounding a payment module. Figure 5B is an image showing the back side of the exemplary card in Figure 5A. Figure 5C is a perspective view of the isolated exemplary enclosed antenna prior to the insertion of the payment module into it. [Figure 6A-6C] Figure 6A is a schematic illustrative plan view of an exemplary contactless RFID device according to one embodiment of the present invention, prior to the encapsulation of the chip layer into the opening within the frame. Figure 6B is a schematic illustrative view of the exemplary contactless RFID device of Figure 6A in a cross-section through line 6B-6B after the encapsulation of the chip layer. Figure 6C is a schematic illustrative end view of the exemplary contactless RFID of Figure 6B. [Figure 7A-7C] Figure 7A is a schematic illustrative plan view of an exemplary contactless RFID device according to another embodiment of the present invention, prior to the encapsulation of the chip layer into the opening within the frame. Figure 7B is a schematic illustrative view of the exemplary contactless RFID device of Figure 7A in a cross-section through line 7B-7B after the encapsulation of the chip layer. Figure 7C is a schematic illustrative end view of the exemplary contactless RFID of Figure 7B. [Figures 8A-8C] Figure 8A is a schematic illustrative plan view of an exemplary DI RFID device according to another embodiment of the present invention, prior to the encapsulation of the chip layer into the opening within the frame. Figure 8B is a schematic illustrative view of the exemplary DI RFID device of Figure 8A in cross-section through line 8B-8B after the encapsulation of the chip layer. Figure 8C is a schematic illustrative end view of the exemplary DI RFID of Figure 8B. [Figure 9A-9B] Figure 9A is an example of a schematic plan view of the front side of an exemplary transaction card that includes multiple discontinuities. Figure 9B is an example of a schematic plan view of the back side of the exemplary transaction card shown in Figure 9A. [Figure 9C] Figure 9C is an example of a schematic cross-sectional view of the exemplary transaction card shown in Figure 9A. [Figure 9D] Figure 9D is an example of a schematic cross-sectional view of another exemplary transaction card formed from a pre-fabricated FR-4 / metal laminate. [Figure 9E]FIG. 9E is an illustration of a schematic cross-sectional view of a portion of a transaction card including an individual FR-4 layer attached by an adhesive to a metal layer with a metallization disposed on an inner surface of one of the FR-4 layers. [Figure 9F] FIG. 9F is an illustration of a schematic cross-sectional view of a portion of a transaction card including an FR-4 layer directly adhered to a metal layer with a metallization etched on an outer surface of one of the FR-4 layers, and an additional layer covering the metallization. [Figure 10] FIG. 10 depicts an exemplary method for fabricating a transaction card.

BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Aspects of the present invention relate to a transaction card, a method of manufacturing a transaction card, and a transaction card produced by the disclosed method.

[0019] FIG. 1 shows a flowchart depicting selected steps of a method 100 for producing a transaction card according to aspects of the present invention. It should be noted that with respect to the methods described herein, it is understood from the description herein that one or more steps may be omitted and / or performed out of the order of the described methods and still obtain the desired result.

[0020] In step 110, an opening is formed within the card body of the transaction card. The opening may be sized to accommodate one or more molded electronic components. The opening may extend partially (thus forming a pocket, for example) or completely (thus forming a hole) through the card body. In some embodiments, the hole formed through the card body may then be completely or partially covered on one side with an adhesive-bonded plastic material, such as an application material, for example, element 307c shown in Figure 3D. As depicted in Figure 3D, element 307c overlaps the area surrounding the hole, forming a pocket demarcated at the periphery by the edge of the hole in the card body and at the bottom edge by the application material 307c. The application material may be the same as or compatible with the molded material to be later filled into the pocket. In some embodiments, as shown in Figure 3D, the application material 307c overlapping the area surrounding the hole in the card body may have a through-hole 308 having a smaller area than the hole in the card body, so as to provide a "shelf" 309 of the application material inside the periphery of the hole in the card body.

[0021] The card body of the present invention may be made of any suitable material, including any suitable metal such as stainless steel, bronze, copper, titanium, tungsten carbide, nickel, palladium, silver, gold, platinum, aluminum, or any alloy that gives the card the majority of its body (structure) and weight. Additionally or alternatively, the card body described herein may be made of any suitable polymer material (e.g., polycarbonate, polyester) or inorganic material (e.g., glass, ceramic), or any combination of any of the above materials.

[0022] In step 120, the electronic component is inserted into the opening of the card body.

[0023] In step 130, the molding material is formed around the electronic component. It should be noted that the order of steps 120 and 130 may vary depending on the specific application field.

[0024] In one embodiment, step 130 includes an overmolding process. During the overmolding process, the molding material is molded around (and typically over) the electronic component such that it covers at least a portion of the surface of the electronic component. Overmolding of the electronic component can be achieved using conventional commercially available equipment such as ENGLE inserts (Engel Austria GmbH, Austria) and CavistMoldMan™ (Reno, NV).

[0025] The electronic component 201 is shown before (in Figure 2A) and after (in Figure 2B) the overmolding process. Although the overmolded component 200 is depicted as having the electronic component 201 completely covered by the molding material 205, those skilled in the art will understand that the desired structural rigidity, functionality, and aesthetics of the transaction card can be achieved by overmolding to varying degrees. In detail, as shown in Figures 2A and 2B, the electrical contacts in the form of wires 210 and 220 connected to component 200 each have unsealed ends protruding from the overmolding to enable electrical connection to the component. Although depicted as wires in Figures 2A and 2B, it should be understood that the electrical contacts or other unsealed portions are not limited to electrical contacts and can take any shape or form. Furthermore, it should be understood that in some embodiments, such as embodiments where a technically desirable degree of coupling between the unsealed and sealed components can be achieved through the sealing layer, it is possible to completely encapsulate the components.

[0026] Returning to Figure 1, where the overmolding process is utilized, step 130 can be performed prior to step 120. That is, the electronic component can be overmolded separately prior to insertion into the opening of the card body. Prior to insertion of the overmolded electronic component, the overmolded component can be further machined to remove excess molding material and / or to create features within the molding material that can be used to securely fix the overmolded electronic component into the opening of the card body. For example, referring to Figure 2B, a lip-like portion can be machined into the molding material 205 so that the overmolded component 200 can be securely fixed into the opening of the card body.

[0027] Alternatively, the overmolding in step 130 may be performed after step 120. In this embodiment, the electronic component is inserted into the opening of the card body. The molding material is then forced into the opening of the card body and molded over one or more exposed surfaces, including at least the top surface of the electronic component. Those skilled in the art will understand that when the molding material is forced into the opening of the card body, the card body material can be selected to withstand the pressure and heat associated with overmolding without substantial deformation.

[0028] If an insert molding process is used, step 130 may be performed before step 120. Conventional insert molding processes include the steps of inserting an electronic component into a mold and subsequently injecting molding material into the mold cavity to form a molded electronic component. The molded electronic component may be fully or partially encapsulated by the molding material after the insert molding process.

[0029] Looking at Figures 3A-D, schematic examples of selected steps in an insert molding process for manufacturing a transaction card according to an embodiment of the present invention are depicted. In the figures, areas 305 and 308 in Figures 3A-3D represent holes that penetrate the card. Areas 307a and 307b in Figure 3A and area 307c in Figures 3B and 3D represent partially covered holes (pockets) within the card body for the molded material to bond to and provide a grip. Figure 3B depicts a finished molded card in which the insert-molded material of the molded component 310 is visible. Although the insert-molded material is shown in contrast to the background card material for illustrative purposes, the molded component may include the same material as the front side of the card, or may include a material selected to have a color or shading that is chosen to match the color or shading of the front side in order to minimize its visibility within the finished card, and is not limited to any particular degree of contrast in color or shading in relation to the background card. For example, in a card body containing a material different from the molding material (e.g., a metal or ceramic body and a thermoplastic molding material), the coloring of the molding material may be selected to have a color and tone that matches the material of the body as closely as possible, including the use of components in the molding material that are the same as or similar to the card body material (e.g., inclusion of powder metal in the molding material that is the same as the metal of the body). In other embodiments, a molding material that contrasts with the card body may be used. Figure 3A depicts the front side of a transaction card 300 including an opening 305 that extends through the card body 302. Multiple fixing features 307a, b provide areas to which the molding material can be bonded or otherwise joined. In the embodiment depicted, the fixing features 307a, b are non-penetrating holes (e.g., pockets). A similar set of fixing features 307c is seen on the opposing back side of the transaction card 300 in Figure 3B. The geometry of the opening 305 and the fixing features 307a, b, c were selected to improve the RF performance of the metal transaction card 300.The fixing features 307a, b, and c may include a material that is the same as or otherwise compatible with the molding material and different from the card body material, so that the molding material and the material of the fixing features are joined by melting or other means with a bond that is relatively stronger than any bond created between the molding material and the card body.

[0030] Figure 3C shows the front view of the transaction card 300 after the insert-molded electronic component 310 has been placed in the opening 305. In the depicted embodiment, the molded electronic component 310 is expected to be visible on the transaction card 300. The geometry of the molded electronic component 310 allows it to be securely fixed to the transaction card 300 through the biasing force created by the fixing features 307a, b, and c. Alternatively, or additionally, the molded electronic component 310 can be bonded to the opening 305 of the transaction card 300 using epoxy resins such as bisphenol, novolac, aliphatic, and glycidylamine.

[0031] Excess molding material may be removed from the molded electronic component 310 (for example, by milling or machining) to incorporate additional electronic components or other desired components.

[0032] Figure 4A illustrates an exemplary overmolding process in which a pocket 403 is machined into the card body 402 to accommodate an electronic component 405. In the depicted embodiment, the electronic component 405 is a printed circuit board (PCB), specifically an RFID module. Although the pocket 403 is depicted as traversing a substantial portion of the back of the card body 402, those skilled in the art will understand that smaller openings of various geometric shapes may be preferable, depending on the electronic component to be incorporated.

[0033] The pocket 403 may be sized to accommodate and secure the electronic component 405 in place, or it may be sized to allow for excess molding material between the internal lip-shaped portion of the pocket 403 and the external edge of the electronic component 405. The electronic component 405 may be additionally or alternatively bonded to the pocket 403 using epoxy as described above.

[0034] The overmolded faceplate 410 creates the back surface of the transaction card 400. The overmolded faceplate 410 can completely or partially encapsulate the electronic component 405. The overmolded faceplate 410 may be prepared separately and then mounted in the pocket 403 (for example, using a suitable epoxy as described above), or it may be formed by overmolding a layer of molding material directly into the pocket 403.

[0035] In exemplary embodiments, the molding material used within the overmolded faceplate is a plastic material that can enhance RF transmission if the transaction card 400 is made of metal or other RF interference material.

[0036] As is well known in the art, transaction cards with RFID chip modules for inductive coupling to a point-of-sale (POS) terminal card reader also typically have an embedded booster antenna structure configured to inductively couple an embedded antenna to the RFID chip module, and the coupled antenna, RFID module, and card reader form a circuit for transmitting information from the card to the card reader. Thus, in exemplary embodiments where the RFID module is an enclosed or partially enclosed component (or one of several electronic components processed as described herein), the antenna structure can be provided by any number of methods. In one embodiment, the antenna structure may be embedded in a layer applied to the card after the molding process described herein. The antenna support layer may be laminated onto the card using a non-heating process (e.g., by adhesive) or a thermal lamination process carried out at a temperature, pressure, and duration that does not remelt, deform, or otherwise adversely interfere with the entire electronic component, or a backing sheet (containing metal or some other material unaffected by thermal lamination) may be provided to prevent any remelted or deformed portion of the product from protruding from the opposing surface on which the lamination step is being performed.

[0037] In another embodiment, the molding step may include an overmolding step that covers not only the electronic components described herein but also at least the portion of the card surface in which the antenna structure will later be placed. For example, in addition to encapsulating or partially encapsulating the RFID module, it is possible to perform a flood overmolding step that covers at least one entire surface (typically the back surface, but similarly or alternatively the front surface) within a layer of a desired thickness. The antenna can then be embedded in this overmolded layer using an ultrasonic process known in the art. Any content to be printed on the card surface can also be printed on the surface of the overmolded layer, or an additional printed layer can be attached by adhesive or lamination, etc. In another embodiment, the antenna can be printed on the surface of the molded product or applied as another layer that is attached, for example, by adhesive or lamination, across the entire molded surface. These are non-limiting examples, and it should be understood that there are endless possibilities for downstream processing of the product resulting from the methods described herein to provide the molded electronic components within the card, and that some aspects of the present invention are not limited in any way by later method steps.

[0038] In another embodiment illustrated in Figures 5A–5C, the booster antenna 502 for inductive coupling with the payment module's antenna may take the form of an annular metal frame substantially surrounding the payment module (e.g., a dual-interface (DI) RFID chip). As depicted in Figures 5A–5C, the antenna has a discontinuity or slit 506 extending from the inner edge to the outer edge of the annular antenna. Such antennas are generally described and characterized as “amplifiers” in U.S. Patent No. 8,608,082 ('082 patent) to Le Garrec et al., incorporated herein by reference, and as “coupling frames” in U.S. Patent No. 9,812,782 (and others) to Finn et al. As described above, and as described in U.S. Patent Application No. 15 / 928,813 ('813 application) filed March 22, 2018, entitled “DI Capacitive Embedded Metal Card,” which has been assigned to the common assignee of the present invention and incorporated herein by reference, the metal card itself can function as such an antenna or amplifier, with a discontinuity (e.g., 504 as depicted in Figures 5A and 5B) extending from the periphery of the card to a pocket in which a payment module is assembled. The discontinuity can have any geometry, including, but not limited to, the stepped shape depicted in Figures 5A and 5B, any geometry described in the '813 application and related applications, or any geometry disclosed in the aforementioned references.

[0039] The '813 application also discloses a step of reinforcing a card having discontinuities by using a self-supporting layer such as FR-4 material (a thermosetting laminate made of epoxy resin and woven fiberglass) or polyimide on the back of the card. Printed layers for various indicias, magnetic stripes, etc., can be assembled with the FR-4 layer or printed directly on the FR-4 layer. For example, the '813 application describes one embodiment in which a relatively thin (e.g., 0.009 inch thick) stainless steel substrate is used with an FR-4 backing layer, and another embodiment including an 18 mil stainless steel layer having a 4 mil FR-4 layer attached to the back of the steel layer using a 2 mil adhesive layer, a 5 mil printed sheet on the back of the FR-4 layer (attached via another 2 mil adhesive layer), and a 2 mil overlay layer including a magnetic stripe laminated against the back of the printed sheet layer. The '813 application states that the reference self-supporting (e.g. FR-4) layer is 80 MPa·m 3 ~40 GPa·m 3 It is disclosed that it has the following rigidity.

[0040] In some embodiments described in more detail below herein, a booster antenna may also be provided. In some embodiments, particularly embodiments including a booster antenna, the metal card body can be isolated from a payment circuit for communicating with a card reader, where this circuit houses a transponder module and a booster antenna. In such embodiments, the payment circuit may not function as an antenna or amplifier. In other embodiments, the metal card body, together with the booster antenna, may serve as part of a payment circuit housing a transponder module. In yet another embodiment, the metal card body may be part of a different circuit that harvests energy from a card reader, which may or may not actually communicate with the card reader, as discussed in more detail in U.S. Patent Application No. 16 / 751,285, filed January 24, 2020, “Metal, Ceramic or Ceramic Coated Transaction Card with Window or Window Pattern and Optional Backlighting,” which is incorporated herein by reference.

[0041] As shown in Figure 5C, the metal antenna 502 is surrounded by encapsulating material to form an outer peripheral portion 520 and an inner region 522, the encapsulating material also filling a slit 506 connecting the inner region to the outer peripheral portion. For illustrative purposes, in Figure 5C the antenna is drawn without encapsulating material covering it in the Z direction so that the antenna remains visible in the drawing. In embodiments where the metal body 500 of the card is used for signal amplification, the encapsulating material may also fill a slit 504 within the metal body. However, it should be understood that the slit 504 may not be present in all embodiments. Furthermore, it should be understood that the card body may have more than one slit. The locations of exemplary alternative additional slits 554, 564, and 574 are shown with dashed lines. For example, in one embodiment, a combination of slits 504 and 554 intersecting the chip pocket can form a bisection along the entire length of the card, or a combination of slits 564 and 574 intersecting the chip pocket can together form a bisection along the entire width of the card. Here, it should be noted that the term “bisection” is intended to mean that the lines divide the card into two sections, but these sections are not necessarily of equal size. Although they are aligned on the same line on opposite sides of the antenna and are depicted as being centered on the antenna as a whole, the combined slits can have any relationship with respect to the antenna and to each other, including relationships where the slits on different sides of the antenna lie on parallel or non-parallel lines, relationships where the slits connect to adjacent sides of the antenna rather than opposite sides, relationships where the slits are not parallel to the edges of the card, or relationships where one or both slits are not linear. In embodiments where the card is bisectioned, the remaining parts of the card can be fixed together by overmolding or by other non-conductive adhesives or fillers. A preferred embodiment involves dividing the card body into two separate parts only once, although multiple body slits can also divide the card into three or more separate parts.A bifurcated configuration generally minimizes eddy currents.

[0042] Therefore, the enclosed antenna 502, as depicted in Figure 5C, defines a metal-containing plug 550, which may be created as a whole and then inserted into the opening in the card body, or which may be created in situ within the opening in the card body by, for example, overmolding. After the plug is inserted into the pocket or formed in situ, the pocket can be created within the inner region 522 of the plug (for example, by milling or any process known in the art). An advantage of such a design is that the metal card body can be formed with a through-hole for accommodating the plug 550. Preferably, the through-hole can be formed by methods other than milling, such as stamping, etching, or laser cutting. Alternatively, the card body may be initially formed with through-holes, which may be highly advantageous for a card body made of ceramic, cast metal, or metal-doped epoxy (for example, as described in U.S. PCT application 2019 / 50592 filed September 11, 2019, claiming priority from U.S. Provisional Patent Application No. 62 / 730,282 filed September 12, 2018, entitled “Metal-Doped Epoxy Resin Transaction Card and Method for Manufacturing the Same,” which has been assigned to the co-assignee of this application and incorporated herein by reference). In this case, only the milling step for creating a pocket for housing the payment module needs to be performed within the non-metallic encapsulation material, which is easier and takes less time to mill than metal. As is known in the art, the pocket for housing the payment module may be a stepped hole having a first relatively larger area on the front surface of the card and a second relatively smaller area on the back surface of the card. By increasing the area of ​​the pocket within the card body into which the payment module is inserted, the overall length of the slit 504 that must be cut within the metal card body (in embodiments where a slit exists) can be minimized, and manufacturing time can be saved. The improvements described above result in increased productivity and efficiency.

[0043] In some embodiments, the card body may not need to function as part of the booster antenna, or it may not be desired. In such embodiments, the opening in the card body may be relatively larger than depicted in Figures 5A–5C, and thus the outer periphery 520 will have a width W that separates the metal of the antenna 502 in the plug 550 from the card body, which is operable to minimize electrical / magnetic interference from the card body to an acceptable degree. The geometry of the plug 550 in such embodiments may further be rectangular, and the innermost edge 560 of the plug may be positioned further toward the center of the card body 500 to guide some of the RF signal toward the center of the card, while the location of the DI payment module remains essentially unchanged as depicted to conform to relevant standards for contact positioning.

[0044] Although described herein in relation to metal card bodies, similar geometric shapes can also be used with non-metallic cards. In addition to the manufacturing methods described herein, which are suitable for card bodies of any material (although they are particularly advantageous for metal, ceramic, and ceramic-coated metal bodies), it is possible to deploy the antenna 502 within a plastic (e.g., PVC) card body by, for example, embedding a metal component in plastic as an inlay inside the card using ultrasound (or in other ways), thereby replacing the copper wire or etched antenna inlay. The depicted antenna geometry 502 can be described as a planar annular member having a substantially closed periphery with a slit 506 connecting the inner and outer peripheries of the annular band. Although depicted as a single member in the exemplary embodiment, the antenna structure is not so limited and may include two or more members. In contrast, copper wire or etched antenna inlays typically create a line or wire helical pattern with the helical windings separated radially by space.

[0045] Those skilled in the art will understand that the suitable molding material depends on the type of molding process used in step 130. For example, when insert molding or overmolding is used, thermoplastic materials such as Techno Melt® meltable adhesive (Henkel), which may include one or more materials from the group consisting of EVA, metallocene polyalphaolefins, polyolefins including atactic polyalphaolefins, block copolymers, polyurethane hot melts, epoxys, and polyamides, and thermosetting materials such as fiberglass-reinforced polyester, polyurethane, bakelite, duroplast, melamine, diallyl phthalate, and polyimide can be used. Those skilled in the art will understand that other materials that may be fluid in the overmolding or insert molding process may also be used, including epoxys containing powder metals, including and not limited to any of the above, rhodium, aluminum, titanium, magnesium, copper, brass, nickel, Monel, Inconel, steel, and alloys thereof. Epoxys containing ceramic materials may also be used.

[0046] In another embodiment, the molding material used in the overmolding or insert molding process is a plastic material having a molding temperature range of approximately 150 to 300°C.

[0047] Figures 6A-6C depict a particular embodiment 600 of a metal RFID device, including a body in the form of a metal frame 610 having an outer periphery 611, and an opening in the card body defining the inner periphery 612 of the metal frame. At least one body discontinuity 620 extends from the outer periphery to the inner periphery of the metal frame. At least one electronic component is placed in the opening, and layers of non-conductive material 640, 642 are placed around the electronic component. The electronic component includes an RFID chip 632 placed in a substrate 634, and an antenna 636, also placed in the substrate, is connected to the RFID chip. The RFID chip, antenna, and substrate can be collectively referred to as an RFID module. Thus, the RFID device 600 includes a metal frame 610 having an opening in the metal frame that extends to a certain depth from at least one of the opposing surfaces 614, 615, defining the outer periphery 611 and the inner periphery 612. As shown in Figures 6A-6C, the opening has a depth that coexists with the thickness T of the metal frame from the upper surface 614 to the lower surface 615. A chip layer 630 (including a non-conductive substrate 634, an RFID transponder chip 632 assembled to the substrate 634, and a module antenna 636 in the substrate connected to the RFID transponder chip) is located inside the opening. The module antenna may be etched or may have any structure known in the art for placement in the substrate. One or more filler layers 640, 642 may be placed within the opening of the frame between the chip layer and one of the surfaces of the metal frame. One or more layers 650, 652 may be laminated across at least one entire surface of the metal frame. A single through-hole 660 is preferably aligned across the entire portion of the device located between the inner surface 611 and the outer surface 612 of the metal layer, and extends between the top and bottom surfaces of the device, between the top surface of the top layer 650 and the bottom surface of the bottom layer 652, as depicted in Figure 6B.Although Figures 6A to 6C show both the antenna 636 in the chip layer and the discontinuity 620 in the metal frame, some components may have only one or the other and not both, while other embodiments may have both as depicted.

[0048] One process for creating device 600 may include the steps of: attaching layer 652 to the bottom surface 615 of the metal frame 610 prior to stacking layers 642, 630, and 640 into the opening; then arranging layer 650 across the entire opening; and stacking the layers such that layers 640 and 642 enclose the chip layer 630. The metal frame may be constructed by cutting an opening in a metal blank, shaping metal into a desired form, or cutting a cross section from an extruded rod. Although depicted as having dimensions that extend to the inner periphery 612 of the metal frame 610, it should be understood that the chip layer 630 may have a substantially smaller footprint, so that layers 640 and 642 completely enclose all sides of the chip layer 630. Furthermore, it should be understood that an intermediate layer of non-conductive material (not shown) may be placed between layers 640 and 642, with a notch to accommodate the periphery of the substrate 634, such that the outer periphery of the substrate 634 is smaller than the inner periphery 612 of the frame.

[0049] In another embodiment shown in Figures 7A-7C, the RFID device 700 includes a metal frame 710 having an opening in the metal frame that defines opposing surfaces 714, 715, an outer periphery 711 and an inner periphery 712, and extends from surface 714 to a depth D. As shown in Figures 7A-7C, the opening has a depth D less than the thickness T of the metal frame from the upper surface 714 to the lower surface 715. A chip layer 730 (including a substrate 734, an RFID transponder chip 732 mounted on the substrate 734, and an in-substrate module antenna 736 connected to the RFID transponder chip) is located inside the opening. Thus, the opening includes a pocket having a bottom and a ferrite layer 742 positioned between the chip layer and the bottom of the pocket, with a filler layer 740 positioned between the top surface 714 of the metal frame and the chip layer 730 within the pocket. A layer 750 is laminated over the top surface 714 of the metal frame 710 and the entire filler layer 740.

[0050] One method for fabricating the device 700 may include the steps of defining a metal frame 710 by creating pocket openings in a metal blank (by milling, etching, or laser), stacking layers 742, 730, and 740 within the openings, placing layer 750 across the entire opening, and stacking the stacked components together. As depicted in Figures 7A–7C, the RFID device 700 has through-holes 760 that are aligned within a portion of the device between the top and bottom surfaces of the device, preferably between the inner and outer surfaces 711 and 712 of the metal layers, and extending between the top surface of the top layer 750 and the bottom surface 715 of the metal layer, as depicted in Figure 7A. As further depicted in Figure 7B (and not shown in Figures 7A or 7C for the sake of simplicity, and although similarly applicable to the designs in Figures 6A-6C and 8A-8C, they are not shown), the hole 760 may be particularly suitable for housing a component 780 such as a component of a device configured to hold one or more keys, such as a key ring or key chain. Thus, devices 600 and 700 may be smaller than the size typically associated with credit cards and may have a preferred size that is even more suitable for functioning as a key fob or key tag.

[0051] Although Figures 6A-6C and 7A-7C depict contactless-only RFID devices, it should be understood that any of the RFID devices described above may be dual-interface devices capable of interfacing with both contactless and contact readers. Thus, as depicted in Figures 8A-8C, the RFID device 800 includes a metal frame 810 having an opening in the metal frame that defines opposing surfaces 814, 815, an outer periphery 811, and an inner periphery 812, and extends a certain depth from the surface 814. A chip layer 830 (including a substrate 834, an RFID transponder chip 832 mounted on the substrate 834, and a module antenna 836 in the substrate connected to the RFID transponder chip) is located inside the opening. Thus, in the embodiment depicted in Figure 8B, where the opening includes a pocket with a bottom, a ferrite layer 842 is located between the chip layer and the bottom of the pocket, and a filler layer 840 is located between the top surface 814 of the metal frame and the chip layer 830 within the pocket. Layer 850 is laminated over the top surface 814 of the metal frame 810 and the entire filler layer 840. The DI chip extends to the top surface of the upper layer 850 due to its contact-type functionality.

[0052] One process for device 800 may include defining a metal frame 810 by creating pocket openings in a metal blank (by milling, etching, or laser), stacking layers 842, 830, and 840 (with notches for accommodating chip 832) within the openings, placing layer 850 (with a notch for accommodating chip 832) across the entire opening, and stacking the stacked components together. In another embodiment, when the stacks of layers 842, 830, 840, and 850 are stacked together, only the antenna 836 may be present on the substrate 830, after which a hole for accommodating chip 832 is created and chip 832 is inserted. The subsequent stacking step may be performed at a temperature suitable for reflowing the molten layer to enclose everything except the top contact surface of chip 832.

[0053] Although depicted as a pocket with a depth less than the thickness of the metal frame in Figure 8B, it should be understood that the DI chip (or contact-only) design may be equally suitable for use in designs where the opening extends across the entire thickness of the metal frame, such as the embodiments shown in Figures 6A-6C. Furthermore, substitutions for such embodiments include those with only the antenna 836, those with the antenna 836 and a slit similar to the slit 620, and those with both the antenna and the slit.

[0054] To maintain functionality within a standard card reader intended for credit card-sized payment devices, the orientation of the DI chip (with the short edge of the contact pad of chip 832 parallel to the front edge 870 of the device), the location of the DI chip 832 (to the left of the center), and the dimensions of the metal frame 810 are identical to those of the leftmost portion of a standard DI credit card (viewed from the front or top surface of the card). This configuration allows the device to be inserted into a contact-type card reader in the direction of arrow P with the front edge 870 initially oriented, so that the device 800 is indistinguishable from a standard credit card from the perspective of the card reader.

[0055] In any of embodiments 600, 700, and 800, while the location of the through-hole for housing the key carrier components is not limited to any particular location, it should be understood that within a DI (or contact-only) device, the hole must be positioned in a location that does not interfere with insertion into the card reader. While the upper left or upper right corner of the device (e.g., where hole 860a is shown in Figure 8A) may be acceptable, configurations where the hole is positioned on an attachment 874 protruding from the trailing edge 872 of the card, such as where hole 860b is depicted in Figure 8A, can reduce the overall dimensions of the device in the card insertion direction. Although the geometry depicted in Figure 8A is semicircular, the attachment 874 can have any desired geometry. While only one through-hole may be required per device, some devices may have two or more. Although the drawings depict through-holes 660, 760, 860a, and 860b at specific locations, the holes may be located anywhere that does not interfere with the functional elements of the device (or the intended use of the device, such as for a card reader or contact-containing module). However, it is highly desirable to position them at the metal corners of the frame.

[0056] Although depicted as rectangles, devices 600, 700, and 800 (most specifically devices 600 and 700 not depicted with contact functionality) can have any desired geometric shape. Device 800 requires a geometric shape for insertion into the card reader within its relevant portion, but its overall geometric shape is not limited.

[0057] Although specific embodiments including an opening and a non-conductive laminate and / or a substrate surrounding the RFID transceiver chip are described herein, it should be understood that the RFID chip and / or antenna can be encapsulated using any of the techniques described herein. Furthermore, although some embodiments herein refer to “cards” and others refer to “devices” suitable for use on a keychain, it should be understood that any of the designs disclosed herein may be suitable for use in any size, not limited to the size of a standard transaction card or a smaller size intended for mounting on a keychain. As is well known in the art, a standard transaction card (e.g., credit card, debit card, gift card) conforms to the CR80 or ISO / IEC 7810:2003 standard and has nominal dimensions of approximately 3.5 inches x 2 inches, or more specifically 3.37 inches (85.6 mm) x 2.125 inches (53.98 mm), with a thickness of 0.03125 inches (0.76 mm), with rounded corners of a radius of 3.18 mm. As those skilled in the art will understand, the dimensions described above are nominal dimensions with tolerances for each. Although referred to herein as “key holders,” it should be understood that the devices with through holes discussed herein can be attached to any type of member suitable for passing through the hole, with or without a key attached to the same member, including chains, rings, lanyards, ropes, necklaces, bracelets, posts, etc.

[0058] In yet another embodiment depicted in Figures 9A–9C, the card includes a metal layer 950 which may be formed from a metal foil, a metal sheet, a bulk metal, or other known metal. The metal layer 950 may include a plurality of discontinuities extending from the front surface 902 to the back surface 904 of the metal layer, including at least one first discontinuity 920 which defines a passage from the periphery of the card to an opening 912 in the metal layer for housing a transponder chip module 910. In the embodiments depicted in Figures 9A–9C, other discontinuities 922, 924, and 928 extend from the periphery to an endpoint that does not coincide with the opening 912. Another discontinuity 926 extends from the intersection with discontinuity 920 to an endpoint that does not reach either the opening or the periphery. The metal layer 950 may further include additional discontinuities, such as second discontinuities that define a passage from the card periphery to an opening (similar to the respective combinations of slits 504 and 554 or slits 564 and 574 shown in Figure 5A, although not shown in Figures 9A-9C) and divide the card into two separate parts. The discontinuities may have any shape and may be incorporated into the aesthetic design appearance on one or both sides of the card, including when integrated with printed features, or may be formed in the shape of alphanumeric characters, symbols, etc.

[0059] In the embodiment shown in Figure 9C, the booster antenna layer 942 includes a plurality of metallizations 940, 944 on a substrate (e.g., polyester) forming the booster antenna. A suitable booster antenna may similarly include a metal wire antenna disposed on a non-metallic substrate. The metal portion of the antenna is insulated from the metal layer 950 by an adhesive layer 952 that separates the booster antenna from the metal layer. The booster antenna 942 is configured to communicate with a transponder chip module 910, and both the transponder chip module 910 and the booster antenna 942 include components in a circuit configured for wireless communication with a card reader (not shown). The booster antenna may be connected to the transponder chip module inductively or by physical connections (e.g., wires, traces, contacts). In an exemplary embodiment, the booster antenna layer 942 includes a solid polyester layer (e.g., approximately 25 microns thick), which may be asymmetrically metallized on both sides, with vias penetrating the polyester connecting the respective metallizations located on opposing surfaces.

[0060] A reinforcing layer 982, such as a fiberglass-reinforced epoxy laminate like FR-4, is arranged over the entire front surface 902 of the metal layer 950, and a similarly configured reinforcing layer 984 is arranged over the back surface 904 of the metal layer 950 and the entire booster antenna layer 942. However, the reinforcing layers are not limited to any particular type of glass-reinforced epoxy laminate material, including both flame-retardant (hence the designation "FR (flame retardant)") and non-flammable glass-reinforced epoxy laminates. The term "FR-4" may be used herein as an abbreviation to mean any configuration of reinforcing layer, non-limitingly including flame-retardant and non-flammable fiber-reinforced epoxy laminates. Fibers in the fiber-reinforced laminate may include fiberglass, polymer fibers, or any other type of fiber known in the art for making fiber-reinforced structures. The term "fiber" as used herein may include any type of structure, including fibrous or filamentous members, non-limitingly including mesh or grid structures, woven structures, structures with randomly oriented fibers, etc. The FR-4 layers can be bonded to each other by adhesive layers 981 and 983. The adhesive from the adhesive layers can penetrate into discontinuities 924, 926, and 928 during card formation, and partially or completely fill them. In some embodiments (not shown), the antenna layer 942 and the FR-4 layer 984 can be reversed, with layer 984 as the outermost layer, and the print can be printed directly onto the outer print sheet layer. In embodiments where the antenna layer is adjacent to a metal layer, the antenna metallization is placed on the surface of the antenna substrate opposite the metal layer, or an insulating material (an adhesive and / or non-metallic layer, such as an adhesive placed on a non-metallic substrate) is placed between the metallization and the metal layer. In other embodiments, the metallization can be embedded within the FR-4 layer, for example, using ultrasonic technology.

[0061] While the term "metallization" can typically be understood as referring to a coating on the external surface of a substrate, as used throughout this application, the term means any type of metallic structure, and when referring to a booster antenna structure, it means any metallic structure of the antenna, regardless of its form, including but not limited to structures created using etched films, coatings, depositions, printing, embedded wires, etc.

[0062] For example, positioned above the upper FR-4 layer 982, bonded by an adhesive layer 991, is an arbitrary RF-friendly metallic foil 990 (preferably configured with a metallic appearance), on which a plastic layer 994 is bonded (attached by adhesive 993). In particular, the adhesive layer is pre-formed together with the foil as a composite material, and the foil composite material is hot-stamped onto the FR-4 or rolled onto the FR-4. In embodiments where the foil is rolled on top, the foil composite material includes a release layer which is subsequently removed before attaching the next layer. Printed content 995 is placed on the plastic layer 994. In other embodiments, the printed content is printed directly onto the foil 990, and the plastic layer 994 / adhesive 993 is omitted. Other printed content 996 and / or magnetic stripes (not shown) can be placed on the lower FR-4 layer 986. Embodiments in which the positions of layers 994 and 990 in the stack are reversed (for example, layer 900 is swapped to a position higher relative to layer 994 in the stack) can also be provided.

[0063] In the embodiment shown in Figure 9C, the opening 912 extends through the entire upper layer of the composite card such that the contact surface 911 of the transponder 910 is accessible from the top surface of the card. Such a configuration is preferred in embodiments in which the transponder has contacts configured to be physically contacted by a card reader, such as a dual interface (DI) module. However, it is also possible to provide a configuration that incorporates a contactless-only module in which the opening 912 does not extend to the top surface of the card. The opening 912 may be filled with a non-metallic plug 913 that insulates the transponder from the metal layer. The plug 913 may have a hole 915 in the bottom to accommodate a downwardly projecting region 914 of the transponder having a periphery that is relatively smaller than the periphery of the widest portion of the module. The configuration of the plug within the metal layer may be in accordance with the teachings in U.S. Patent No. 9,390,366, entitled “Metal Smart Card with Dual Interface Capabilities” and / or U.S. Patent No. 10,318,859, entitled “Dual Interface Metal Smart Card with Booster Antenna,” or related applications, which are incorporated herein by reference.

[0064] While not limited to any particular dimension, exemplary embodiments of the aspects of the present invention depicted in Figure 9C may include the exemplary thicknesses and compositions listed in Table 1 below:

[0065] [Table 1]

[0066] Although depicted in Figure 9C, it should be understood that at many interlayer interfaces, adhesives may be optional (or not be separate layers in relation to the layers above or below). For example, as described herein, the FR-4 layer can be cast directly onto a metal layer. Non-metallic layers can be laminated together such that the layer material is bonded to adjacent layers with or without adhesive. The antenna layer may be a separate freestanding layer, or it may include metallization, as further described herein, such as printing with metallic ink placed directly on the FR-4 via an etched metal foil, or embedding wires within the FR-4 layer (e.g., by ultrasound). In embodiments where foil 990 is a “transfer foil”, the adhesive layer 991 may be optional or may represent an adhesive layer integrated into the matrix of the transfer foil 990 that is directly bonded to the lower layer. The positions of the antenna layer 942 and the FR-4 layer 984 in the stack may be reversed in relation to each other, in which case the plastic layer 997 can be omitted and the ink layer 996 can be printed directly onto the FR-4 layer 984. In particular, the above describes only one embodiment, and other embodiments may include more or fewer layers.

[0067] In the embodiments shown in Figures 9A-9C, the booster antenna 942 includes multiple nested semicircular metallizations 944 that concentrate induction to facilitate inductive coupling to the transponder 910. Although shown with inductive coupling, in other configurations, the booster antenna may have a physical connection to the transponder.

[0068] A magnetic stripe 930 can be placed across the entire bottom FR-4 layer 984. The card design may also incorporate other card features, such as holograms, prints, and 2D codes (e.g., barcodes or QR codes®), typically placed across the entire bottom FR-4 layer or on the top plastic layer.

[0069] Referring here to Figure 10, an exemplary process for manufacturing cards described herein, such as the embodiments depicted in Figures 9A-9B, may first include the step of providing a metal sheet 1000 that serves as a metal layer 950 in a cross-section as illustrated herein. The sheet is sized to be cut into multiple cards along lines 1002, 1004, 1006, and 1008. Although Figure 10 depicts only a portion of a sheet having only four cards, it should be understood that the sheet can be sized to be cut into any number of cards. Importantly, regardless of the number of cards per sheet, the size of the sheet is preferably larger than the size of the one or more cards to be cut from the sheet, so that the sheet remains intact when cut to form the desired discontinuity.

[0070] The sheet may be inserted into the mold with a fiberglass or plastic mesh layer distributed throughout the metal layer, and then epoxy may be filled into the mold to pour epoxy over the entire top and / or bottom surface of the metal sheet to form FR-4 layers 982, 984 that are directly bonded to the metal layer, as in the embodiment shown in Figure 9E. In other embodiments, pre-formed FR-4 layers 982, 984 may be adhesively bonded to the top and / or bottom surface of the metal sheet, as in the embodiment shown in Figure 9F.

[0071] It is possible to have more or fewer layers than those shown in Figures 9E and 9F, including, but not limited to, layers described in relation to other embodiments herein. Similarly, it is possible to have more or fewer layers in any of the other embodiments discussed in any section of this disclosure. Similar element numbers for the various layers shown in Figures 9E and 9F are intended to refer to layers having the same function and / or configuration as those referenced by the same number in other drawings, but the function, layers and locations in any of the embodiments depicted are not limited to the illustrated arrangements. Those skilled in the art will recognize that while numerous different arrangements are possible, some of the embodiments discussed herein may be particularly advantageous in terms of considerations such as cost, durability, aesthetics, and thickness minimization. The thickness of layers depicted in any of the figures should not be construed as an indication of the relative thickness of the layers in an actual configuration, as some features may be emphasized or enhanced in the figures for illustrative purposes only.

[0072] The metallization 940 for the booster antenna may be incorporated into the stack as part of an individual layer (e.g., 942), as shown in Figures 9C and 9D, or it may be placed directly on or embedded beneath one of the surfaces of the FR-4 layer (not shown), as shown in Figures 9E and 9F. One method for fabricating the etched booster antenna layer includes the steps of adhesively attaching a metal (e.g., copper) foil layer to one surface of the FR-4 layer, and then removing the unwanted portion of the foil by etching to leave the desired antenna pattern. Other methods for placing the antenna directly on or within the FR-4 include pattern deposition, printing with conductive ink, and embedding copper wires within the FR-4 (e.g., using ultrasonic methods known in the art).

[0073] In embodiments where the pre-formed layer of FR-4 is adhesively fixed to the metal layer, as shown in Figure 9F, a direct-placement antenna can be placed on the inner surface of the FR-4 and attached to the metal layer using a sufficient adhesive layer to insulate the metallization 940 from the metal layer 950 (for example, using layer 960, which includes adhesive layers 962, 964 placed on the opposing surface of the non-metallic substrate 966). In embodiments where the metallization for the antenna includes wires embedded within the FR-4, such an insulating layer may be omitted. In other embodiments, including embodiments where the FR-4 layer is directly cast onto the metal layer, as shown in Figure 9E, the metallization 940 for the antenna may be formed on the outer surface of the FR-4 layer 984 and covered with another non-metallic layer 997e. Embodiments in which one FR-4 layer is directly cast and the other FR-4 layer is attached later are also available. Embodiments in which the metallized FR-4 layer is added to the metal as a separate layer rather than being directly cast into the metal may have metallization on both sides of the FR-4 (optionally connected by vias penetrating the FR-4 layer), in which case the configuration shown in Figure 9F may include an additional layer 997e on the outer surface of layer 984, as shown in Figure 9E. The coating layer 997e is typically an opaque plastic layer, such as a plastic laminated to the FR-4 layer (as shown in Figure 9F) or adhesively bonded to this layer (not shown), but the outer layer may have any configuration, including, but not limited to, ceramic, wood, leather decorative layers, and even other metallic layers such as anodized metal, especially when adhesively bonded to the FR-4. In embodiments in which the antenna metallization includes wires embedded in the FR-4, the additional non-metallic layer 997 may be omitted. Insulation may be omitted.

[0074] An opening 1010 for housing a transponder (corresponding to an opening 912 shown in other figures) can be milled in part or in whole within the metal sheet depicted in Figure 10 at any point during the assembly process. For example, the metal can be pre-cut prior to the step of directly casting a metal layer into epoxy to form the FR-4 so that the epoxy fills the opening in the metal. In such a configuration, the opening in the metal may be large enough to form a plug that can be milled in a later step to house the module, with the epoxy positioned between the transponder and the metal (and the adhesive positioned between the transponder and the epoxy). In embodiments where a pre-formed FR-4 layer is bonded to the metal, the metal may be cut simultaneously with the discontinuity, and the remaining layer may have a pre-cut hole that registers with the hole in the metal, or the opening 1010 in the metal may be milled after the remaining layer has been added, or the opening may be pre-cut in the metal and then milled in the other layer in a later step.

[0075] The step of inserting the transponder into the opening includes the step of inserting a plug made of a non-metallic material surrounding the transponder into the opening. The non-metallic material plug may include an adhesive or a combination of the adhesive and another non-metallic material. In one embodiment, the plug and transponder may be pre-assembled and adhesively fixed within the opening. In another embodiment, the plug may first be placed within the opening and then milled to accommodate the transponder. The interface between the opening and the transponder and the process for creating it are not limited to any particular configuration.

[0076] After the layer stack is assembled and the transponder is inserted, the card sheet can then be cut into multiple individual card blanks, which can be further processed, including customization, as needed. It should be understood that the transaction cards of any embodiment of the embodiments discussed herein can have any shape and size, including the case of a key fob configuration as described herein in relation to Figures 8A-8B.

[0077] While various concepts have been illustrated using specific exemplary embodiments, the features of each embodiment can be mixed and combined as desired by those skilled in the art. For example, the FR-4 and multiple discontinuity architecture described in relation to Figures 9A-9C can be applied to keychain embodiments such as those illustrated in Figures 6A-8A. Similarly, aspects of the configuration described herein in relation to Figures 9A-9C in fiber-reinforced epoxy embodiments (particularly the absence of a metal layer from the payment circuit) can be characterized, either alone or in combination, in other configurations known in the art, including, but not limited to, configurations using other types of overmolding materials or laminated layers.

[0078] The embodiments described above are merely illustrative, and other embodiments may include fewer or more layers stacked in different orders and attached to one another by any method known in the art, not limited to adhesive bonding. One or more functional layers may be formed of an adhesive-coated sheet and a peelable release layer. In other embodiments, the adhesive layer may include an adhesive placed on both sides of a very thin sheet of polyester, with the release layer positioned across both adhesive layers. In such embodiments, the relevant steps in the process for forming the card include removing a first release layer, attaching the exposed adhesive layer to an adjacent layer, and then removing a second release layer for attachment of subsequent layers.

[0079] In the exemplary embodiment shown in Figure 9D, an exemplary card can be formed from a pre-fabricated laminate material including a metal layer 950 to which an upper FR-4 layer 982 and a lower FR-4 layer 984 are attached to both surfaces, which can be formed, for example, by casting epoxy around a structural mesh placed throughout the metal layer. In one method for assembling the card, the pre-fabricated laminate as described above is processed to create discontinuities 924, 926, and 928 and an opening 912 from the bottom of the card. For example, a laser can be used to cut through the metal layer 950 from the lower FR-4 layer 984 without penetrating the upper FR-4 layer, thereby leaving sufficient integrity in the upper FR-4 layer 982 to provide reinforcement to the card with the corresponding discontinuities. Additional layers can be added as described in any embodiment herein, without being limited to the stack shown in Figure 9D. For example, the RF-friendly foil 990 may be placed across the entire pre-fabricated laminate by a rolling or hot stamping process, as described above herein, and the remaining non-ink layers (e.g., the booster antenna layer 942, an optional lower plastic layer 997, and any adhesive layers 983, 985 between adjacent layers) may be added, and then the stack may be laminated. A graphics layer 995 or 996 is printed on the outer surface of the laminated stack. The transponder module may be added before or after printing, including milling of the opening 912, insertion of the plug 913 into the opening 912, milling of the opening in the plug, and insertion of the module 910 into the plug. The plug and module may include a pre-fabricated assembly or may be assembled in place. It should be understood that the combination, the order of the layers in the stack, and the method of attaching the layers to each other (e.g., by adhesive or by adhesive-free lamination between certain adjacent layers, depending on the composition of the layers) may vary in any way known in the art.

[0080] One layer assembly method described in embodiments disclosed herein may include the steps of creating a metal layer with openings and discontinuities for housing a transponder, separately preparing an FR-4 layer without metallization and an FR-4 layer with an etched and metallized antenna, and sandwiching a metal layer between the FR-4 layers to result in a structure including layers 982, 960, 950, 960, 940, and 984 as depicted in Figure 9F. The FR-4 layer placed on the top surface of the metal may have a pre-cut opening that aligns with the opening in the metal layer for the transponder, or the FR-4 layer may be milled after attachment to the metal layer to extend the opening to the top surface of the FR-4 layer. A plug is then placed in the opening, another non-ink layer (e.g., a plastic layer over one or both of the FR-4 layers) is added, and the card is laminated together.

[0081] In another embodiment, the method may include the steps of providing a pre-fabricated FR-4 laminate on both sides of a metal (e.g., layers 982, 950, and 984 as shown in Figure 9E), and then creating an opening 912 and one or more discontinuities (e.g., 920, 922, 924, 926, and 928) within the pre-fabricated laminate. If desired, the discontinuities may be formed such that they penetrate only layers 984 and 950 and not layer 982 (as shown in Figure 9D). In yet another embodiment, the method may include the steps of providing a metal body 950, creating an opening 912 and one or more discontinuities (e.g., 920, 922, 924, 926, and 928), setting a mesh layer on the opposing surfaces of the metal layers, and then casting epoxy over the entire mesh layer to form FR-4 layers 982, 984 fixed to the metal layer 950. The resulting layers 982, 950, and 984, formed by any of the processes described above, are then further processed, for example, by placing copper foil on one side of the FR-4, and any unwanted portions are removed by etching to form the metallization 940. In particular, when starting from a pre-fabricated laminate with a discontinuity penetrating only one FR-4 layer and a metal layer (as depicted in Figure 9D), the foil is preferably placed on an FR-4 layer that does not have a discontinuity. In a modified form, the discontinuity can be filled (for example, with a coating or another non-metallic layer) prior to the formation of the metallization. The above preference may be more desirable for etched or printed metallizations in optimizing the integrity of the metallization than in the case of embedded wire metallization, which can be placed within any of the FR-4 layers with relatively few technical challenges. (Especially in embodiments where the metallization is exposed outside FR-4) layer 997e is added to cover the metallization, resulting in the composition of layers 982, 950, 940, 984, and 997e shown in Figure 9E. Additional layers, including layers 995 and 996, may be optionally included, as further described herein.

[0082] Although the present invention is illustrated and described herein in relation to specific embodiments, it is not intended to be limited to the details shown. Rather, various modifications can be made in detail within the scope of the equivalent claims and without departing from the invention.

Claims

1. A metal layer having a front surface, a back surface, a periphery, an opening within the metal layer, and one or more discontinuities within the metal layer, wherein each discontinuity constitutes a gap within the metal layer extending from the front surface to the back surface and includes at least one discontinuity defining a passage from the device periphery to the opening and at least one discontinuity within the metal layer extending from the device periphery to a location other than within the opening; A transponder chip module disposed within the opening in the metal layer; A booster antenna in communication with the transponder chip module, wherein the transponder chip module and the booster antenna include components in a circuit configured for wireless communication with a device reader, and the metal layer is neither part of the booster antenna nor a component in the circuit; The nonmetallic molding material in one or more discontinuous portions within the metal layer; A reinforcing layer arranged over the entire metal layer; A transaction device that includes this.

2. The transaction device according to claim 1, comprising at least two discontinuities, each defining a passage from the peripheral edge of the device to the opening, wherein the at least two discontinuities and the opening collectively divide the body of the transaction device into at least two separate parts.

3. The transaction device according to claim 1 or 2, wherein the nonmetallic molding material comprises an adhesive or epoxy.

4. The transaction device according to any one of claims 1 to 3, wherein the reinforcing layer includes fiberglass.

5. The transaction device according to any one of claims 1 to 4, wherein the reinforcing layer comprises a fiber-reinforced epoxy laminate material.

6. The transaction device according to claim 4, comprising a fiber-reinforced epoxy laminate material layer disposed on at least one of the front surface and the back surface of the metal layer.

7. The transaction device according to claim 5, wherein the metal layer is sandwiched between opposing fiber-reinforced epoxy laminate material layers.

8. The transaction device according to any one of claims 1 to 7, wherein at least two discontinuous portions within the metal layer intersect with each other.

9. The transaction device according to claim 8, wherein the intersecting discontinuity includes a first discontinuity that defines a passage from the peripheral edge of the device to the opening, and a second discontinuity that extends from the intersection with the first discontinuity to an endpoint that is neither in the opening nor on the peripheral edge.

10. The transaction device according to any one of claims 1 to 9, wherein the booster antenna includes a booster antenna layer comprising a plurality of metallizations.

11. The transaction device according to claim 10, wherein each of the plurality of metallizations is electrically insulated from the metal layer.

12. The transaction device according to any one of claims 1 to 11, further comprising a magnetic stripe disposed on the back layer of the transaction device.

13. A transaction device according to any one of claims 1 to 12, wherein the transaction device includes a first fiber-reinforced epoxy laminate material layer over the entire front surface of the metal layer, but does not include the first fiber-reinforced epoxy laminate material layer on the transponder chip module within the opening.

14. The transaction device according to claim 13, further comprising a second fiber-reinforced epoxy laminated material layer over the entire back surface of the metal layer, including over the opening and the booster antenna.

15. The transaction device according to claim 14, further comprising a magnetic stripe arranged across the entire booster antenna.

16. A transaction device according to any one of claims 1 to 15, comprising a transaction card conforming to at least one of the CR80 or ISO / IEC 7810:2003 standards.

17. The transaction device according to any one of claims 1 to 15, further comprising a hole extending between the front and back surfaces of the transaction device, wherein the hole is sized to accommodate a ring member configured to hold one or more keys.

18. A transaction device, wherein the transaction device is A metal layer having a front surface, a back surface, a periphery, an opening within the metal layer, and one or more discontinuities within the metal layer, wherein each discontinuity constitutes a gap within the metal layer extending from the front surface to the back surface, and includes at least one discontinuity that defines a passage from the device periphery to the opening; A transponder chip module disposed within the opening in the metal layer; A booster antenna in communication with the transponder chip module, wherein the transponder chip module and the booster antenna include components in a circuit configured for wireless communication with a device reader, and the metal layer is neither part of the booster antenna nor a component in the circuit; The nonmetallic molding material in one or more discontinuous portions within the metal layer; A reinforcing layer arranged over the entire metal layer; Includes; a hole extending between the front and back surfaces of the transaction device; The hole is sized to accommodate a ring member configured to hold one or more keys, the ring member is positioned within the hole, and further A transactional device that includes components of a keyring or keychain.

19. The transaction device according to any one of claims 1 to 18, wherein the transponder chip module includes a dual interface module.

20. A metal layer having a front surface, a back surface, a periphery, an opening within the metal layer, and one or more discontinuities within the metal layer, wherein each discontinuity constitutes a gap within the metal layer extending from the front surface to the back surface, and includes at least one discontinuity that defines a passage from the device periphery to the opening; A transponder chip module disposed within the opening in the metal layer; A booster antenna in communication with the transponder chip module, wherein the transponder chip module and the booster antenna include components in a circuit configured for wireless communication with a device reader, and the metal layer is neither part of the booster antenna nor a component in the circuit; The nonmetallic molding material in one or more discontinuous portions within the metal layer; A reinforcing layer arranged over the entire metal layer; A layer of RF-friendly metal foil arranged over the entire metal layer; Transaction devices, including those mentioned above.

21. The transaction device according to claim 7, further comprising a layer of RF-friendly metal foil disposed over the entirety of one of the fiber-reinforced epoxy laminate layers.

22. The transaction device according to claim 21, further comprising a booster antenna layer disposed over the entire other layer of the fiber-reinforced epoxy laminate material layer, or disposed between the metal layer and the other layer of the fiber-reinforced epoxy laminate material layer.

23. The transaction device according to claim 22, further comprising ink on at least one of the outer surfaces of the transaction device.

24. A transaction device, A metal layer having a front surface, a back surface, and a peripheral edge; An opening in the metal layer extending from the metal layer to the front surface of the transaction device; One or more discontinuities within the metal layer, each discontinuity constituting a gap within the metal layer extending from the front surface to the back surface, and including at least one discontinuity extending between the peripheral edge of the metal layer and the opening within the metal layer; A back fiber-reinforced epoxy laminated material layer is arranged over the entire back surface of the metal layer; Multiple metallizations embedded on or within the aforementioned back-side fiber-reinforced epoxy laminate layer; A surface fiber-reinforced epoxy laminated material layer arranged over the entire surface of the metal layer; The transaction device further comprises the fiber-reinforced epoxy laminate material layer, which is arranged across the entire front and back surfaces of the metal layer, and each of these layers is a separate layer fixed to the metal layer by an adhesive other than epoxy, and the transaction device further comprises A separate booster antenna from the aforementioned metal layer; A transponder chip module disposed within the opening and having a front surface accessible from the front surface of the transaction device, the transponder chip module including a payment circuit configured for wireless communication with a device reader, which is in communication with the booster antenna and together with the booster antenna; Includes, A transaction device in which the metal layer is insulated from the payment circuit and the booster antenna.

25. The transaction device according to claim 24, further comprising a non-metallic layer arranged across the entire plurality of metallizations.

26. The transaction device according to claim 25, wherein the nonmetallic layer includes a substrate for the adhesive layer.

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