Indication device

Abstract

To provide a display device that can improve the efficiency of cooling a reflection type optical modulation element.SOLUTION: A display device comprises: a base that has a first surface and a second surface on the opposite side of the first surface; a reflection type optical modulation element that is provided on the first surface and electrically connected with the base; a drive circuit board that has a third surface electrically connected with the second surface and a fourth surface on the opposite side of the third surface, and drives the reflection type optical modulation element; a vapor chamber that has a heat receiving unit receiving heat transmitted from the outside, a heat radiation unit radiating heat, and a fluid storage chamber storing working fluid changing from a liquid phase to a gas phase due to the heat received by the heat receiving unit and changing from the gas phase to the liquid phase in the heat radiation unit; and a heat radiation member that is connected with the heat radiation unit so as to transmit heat. The heat receiving unit has a first area opposite to the second surface and a second area opposite to the fourth surface, and the first area projects toward the base side beyond the second area and is connected with the second surface so as to transmit heat.SELECTED DRAWING: Figure 2

Description

Technical Field

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[0003]

[0001] The present disclosure relates to a display device.

Background Art

[0002] Conventionally, a projector that modulates light emitted from a light source by a light modulation element to form image light and projects the formed image light is known. In such a projector, since the light modulation element is a component that is likely to deteriorate due to heat, it is necessary to efficiently cool the light modulation element. In response to such a problem, a projection display device that radiates heat generated in the light modulation element by a heat sink connected to the light modulation element is known (see, for example, Patent Document 1).

[0003] ​​​​​​​​​​​​​​​​​​​​​​​However, in the element rear cooling unit described in Patent Document 1, the surface of the heat sink that connects to the rear surface of the DMD element is only a part of the surface of the heat sink that faces the DMD element. As a result, heat transferred from the DMD element to the heat sink is not easily transferred to the entire heat sink, and there is a risk that the heat dissipation efficiency of the heat transferred from the DMD element may not be sufficiently high. In particular, when the DMD element is small and the heat density at the contact point with the DMD element in the heat sink is high, an uneven distribution of heat is likely to occur in the heat sink, making it difficult to increase the heat dissipation efficiency of the heat transferred from the DMD element. Therefore, there was a demand for a configuration that could improve the cooling efficiency of reflective optical modulation elements. [Means for solving the problem]

[0006] A display device according to one aspect of the present disclosure comprises a base having a first surface and a second surface opposite to the first surface; a reflective optical modulation element provided on the first surface and electrically connected to the base; a third surface electrically connected to the second surface and a fourth surface opposite to the third surface; a drive circuit board for driving the reflective optical modulation element; a vapor chamber having a heat receiving section for receiving heat transmitted from the outside; a heat dissipation section for dissipating heat; and a fluid receiving chamber for containing a working fluid that changes from a liquid phase to a gas phase due to the heat received by the heat receiving section and changes from a gas phase to a liquid phase in the heat dissipation section; and a heat dissipation member connected to the heat dissipation section so as to be heat-transferable, wherein the heat receiving section has a first region facing the second surface and a second region facing the fourth surface, the first region protruding toward the base side than the second region and connected to the second surface so as to be heat-transferable. [Brief explanation of the drawing]

[0007] [Figure 1] A schematic diagram showing the configuration of the projector in the first embodiment. [Figure 2] A cross-sectional view showing the display device in the first embodiment. [Figure 3] A cross-sectional view showing the display device provided by the projector in the second embodiment. [Figure 4] A cross-sectional view showing the display device provided by the projector in the third embodiment. [Modes for carrying out the invention]

[0008] [First Embodiment] Hereinafter, a first embodiment of this disclosure will be described with reference to the drawings. [Projector Configuration] Figure 1 is a schematic diagram showing the general configuration of the projector 1 according to this embodiment. The projector 1 according to this embodiment modulates light emitted from a light source to form image light corresponding to image information, and projects the formed image light onto a projection surface such as a screen. As shown in Figure 1, the projector 1 comprises an outer casing 2 that constitutes the exterior of the projector 1, and an image projection device 3 housed in the outer casing 2. In addition, although not shown, the projector 1 also comprises a power supply unit and a control unit housed in the outer casing 2. The power supply unit supplies power to the electronic components of the projector 1. The control unit controls the operation of the projector 1.

[0009] [Configuration of the image projection device] The image projection device 3 forms image light corresponding to the image signal input from the control device described above, and projects the formed image light. The image projection device 3 comprises an illumination device 31, a relay device 32, a dichroic prism 33, a display device 34 (34R, 34G, 34B), and a projection optical device 35.

[0010] [Lighting system configuration] The lighting device 31 emits illumination light with a substantially uniform illuminance distribution and aligned polarization direction to the relay device 32. That is, the lighting device 31 emits illumination light including red light, green light, and blue light modulated by the display device 34. The lighting device 31 comprises a light source device 31A and a uniformizing device 31B.

[0011] [Configuration of the light source device] The light source device 31A emits light to the uniformizing device 31B. The light source device 31A includes a light-emitting element 311, a light-collecting element 312, a wavelength conversion device 313, and a parallelizing lens 314. The light-emitting element 311 is a laser light source that emits laser light. In this embodiment, the laser light emitted by the light-emitting element 311 is, for example, blue light with a peak wavelength of approximately 445 nm. The light-emitting element 311 may consist of one light-emitting element or may consist of multiple light-emitting elements.

[0012] The light-gathering element 312 focuses the light beam incident from the light-emitting element 311 and directs it into the wavelength conversion device 313. The light-gathering element 312 is composed of two lenses 3121 and 3122, but the number of lenses constituting the light-gathering element 312 is not limited to two.

[0013] The wavelength conversion device 313 converts a portion of the blue light incident as excitation light into green and red light, and emits light containing blue, green, and red light on the opposite side from the blue light incident side. The wavelength conversion device 313 includes a wavelength conversion element 3131 and a motor 3135 that rotates the wavelength conversion element 3131. The wavelength conversion element 3131 is a transmissive wavelength conversion element that emits converted light with a converted wavelength along the direction of incidence of the excitation light. The wavelength conversion element 3131 has a disk 3132, a wavelength conversion layer 3133, and a selective reflection layer 3134, and the wavelength conversion layer 3133 and the selective reflection layer 3134 are formed on the disk 3132 along the circumferential direction of the disk 3132. Of these, the wavelength conversion layer 3133 contains a phosphor that converts the wavelength of incident light. The selective reflection layer 3134 is provided on the blue light incident side relative to the wavelength conversion layer 3133, and transmits blue light and reflects green and red light. The motor 3135 rotates the wavelength conversion element 3131 around a rotation axis that is aligned with the direction of incidence of blue light to the wavelength conversion device 313. The parallelizing lens 314 parallelizes the light emitted from the wavelength conversion element 3131.

[0014] In such a light source device 31A, among the blue light emitted from the light emitting element 311, some of the blue light passes through the wavelength conversion layer 3133, and the other blue light is converted into green light and red light by the wavelength conversion layer 3133. Among the green light and red light emitted from the wavelength conversion layer 3133, the green light and red light emitted on the incident side of the blue light are reflected by the selective reflection layer 3134. As a result, the wavelength conversion element 3131 emits white light including blue light, green light, and red light to the side opposite to the incident side of the blue light. The white light emitted from the wavelength conversion element 3131 is collimated by the collimating lens 314 and then enters the homogenizing device 31B.

[0015] Note that in the light source device 31A, a transmissive wavelength conversion element 3131 is employed. However, the present invention is not limited to this, and the light source device 31A may include a reflective wavelength conversion element that emits conversion light obtained by converting the wavelength of the excitation light in a direction opposite to the incident direction of the excitation light. In this case, the reflective wavelength conversion element may convert substantially all of the incident blue light into red light and green light, or may convert a part of the incident blue light into red light and green light. In the former case, the light source device 31A may be configured to emit white light generated by synthesizing blue light with the green light and red light converted by the reflective wavelength conversion element.

[0016] [Configuration of the homogenizing device] The homogenizing device �B homogenizes the illuminance distribution of the white light incident from the light source device 31A and aligns the polarization directions of the white light to emit it as illumination light. The homogenizing device 31B includes a first lens array 315, a second lens array 316, a polarization conversion element 317, and a superimposing lens 318. Among these, the polarization conversion element 317 emits light with aligned polarization directions by converting one linearly polarized light component among the linearly polarized light components included in the incident light into the other linearly polarized light component. In the present embodiment, the polarization conversion element 317 converts the s-polarized light component and emits the p-polarized light component, but it may be configured to convert the p-polarized light component and emit the s-polarized light component.

[0017] [Configuration of the relay device] The relay device 32 guides the illumination light emitted from the illumination device 31 to the dichroic prism 33. The relay device 32 includes a total reflection mirror 321, a polarization separation device 322, and a collimating lens 323. The total reflection mirror 321 reflects the illumination light incident from the illumination device 31 toward the polarization separation device 322.

[0018] The polarization separation device 322 is a so-called plate-type polarization beam splitter (PBS). The polarization separation device 322 allows one of the p-polarized light and the s-polarized light to pass through and reflects the other polarized light. In the present embodiment, since the polarization component of the light emitted from the homogenizing device 31B is aligned with the p-polarization component, the polarization separation device 322 transmits the p-polarization component and reflects the s-polarization component. Therefore, the light incident from the total reflection mirror 321 to the polarization separation device 322 passes through the polarization separation device 322 and is incident on the dichroic prism 33 through the collimating lens 323. On the other hand, the modulated light incident from the dichroic prism 33, which is modulated by the display device 34 described later, is reflected by the polarization separation device 322 and is incident on the projection optical device 35. The collimating lens 323 is disposed between the polarization separation device 322 and the dichroic prism 33. The collimating lens 323 collimates the light incident from the polarization separation device 322 to the dichroic prism 33.

[0019] [Configuration of Dichroic Prism] The dichroic prism 33 has the function of separating the three colored lights (red light R, green light G, and blue light B) contained in the illumination light incident from the relay device 32 and directing them to each of the three display devices 34 (34R, 34G, 34B). The dichroic prism 33 synthesizes the modulated colored lights R, G, and B from the display devices 34R, 34G, and 34B, and emits image light composed of the three synthesized colored lights R, G, and B. In other words, the dichroic prism 33 can be described as a color separation and synthesis device that separates the three colored lights R, G, and B from the illumination light and synthesizes the three modulated colored lights R, G, and B. The dichroic prism 33 is a so-called gapless prism. The dichroic prism 33 has a first prism 331, a second prism 332, a third prism 333, a first color separation layer 334, and a second color separation layer 335, and has a configuration in which each of the prisms 331 to 333 is combined.

[0020] The first prism 331 is formed in a triangular prism shape and is positioned closest to the parallelizing lens 323 among the prisms 331 to 333. In other words, the first prism 331 is positioned opposite the parallelizing lens 323. The first prism 331 has an input / output surface 3311. Illumination light, parallelized by the parallelization lens 323, is incident on the input / output surface 3311. The input / output surface 3311 also emits image light, which is combined by the dichroic prism 33.

[0021] The first prism 331 is joined to the second prism 332. A first color separation layer 334 is provided between the first prism 331 and the second prism 332. The first color separation layer 334 reflects red light R and transmits green light G and blue light B from the light incident through the input / output surface 3311. The red light R reflected by the first color separation layer 334 is incident on the input / output surface 3311 at an angle greater than or equal to the critical angle. As a result, the red light R is internally reflected at the input / output surface 3311 and then emitted from the output surface 3312 of the first prism 331 toward the display device 34R. The blue light B and green light G that have passed through the first color separation layer 334 are incident on the second prism 332.

[0022] The second prism 332 is formed in the shape of a rectangular prism with a roughly trapezoidal cross-section and is joined to the first prism 331 and the third prism 333. Between the second prism 332 and the third prism 333, a second color separation layer 335 is positioned to reflect blue light B and transmit green light G. The second color separation layer 335 and the first color separation layer 334 are each inclined at different angles with respect to the central axis of the light incident on the input / output surface 3311 from the parallelizing lens 323. Of the blue light B and green light G incident from the first color separation layer 334 to the second prism 332, the blue light B is reflected by the second color separation layer 335, travels through the second prism 332, and is emitted from the exit surface 3321 of the second prism 332 toward the display device 34B. Of the blue light B and green light G incident on the second prism 332 from the first color separation layer 334, the green light G passes through the second color separation layer 335 and is incident on the third prism 333.

[0023] The third prism 333 is formed in the same way as the second prism 332, with a roughly trapezoidal cross-section, and is joined to the second prism 332. The green light G incident on the third prism 333 from the second color separation layer 335 is emitted toward the display device 34G from the emission surface 3331, which is located in the direction of propagation of the green light G and is roughly parallel to the input / output surface 3311. Then, the R, G, and B light wavelengths modulated by the display devices 34R, 34G, and 34B are combined by tracing the paths of the R, G, and B light wavelengths from the input / output surface 3311 to each display device 34R, 34G, and 34B in reverse order, and emitted from the input / output surface 3311 as image light to the parallelization lens 323.

[0024] [Outline configuration of the display device] Multiple display devices 34 modulate the corresponding color light from among the three color lights R, G, and B: red, green, and blue. The multiple display devices 34 include a display device 34R that modulates red light R, a display device 34G that modulates green light G, and a display device 34B that modulates blue light B. Each display device 34R, 34G, and 34B emits the modulated color light in the direction opposite to the direction of incidence of the color light. The configuration of this display device 34 will be described in detail later.

[0025] [Configuration of projection optical system] The projection optical device 35 projects the image light, which has been reflected by the polarization separator 322 and is incident on the projection surface. Although detailed illustrations are omitted, the projection optical device 35 is configured as a lens assembly comprising multiple lenses and a lens barrel that houses the multiple lenses.

[0026] [Detailed configuration of the display device] Figure 2 is a cross-sectional view showing the display device 34. In Figure 2, only some of the fins 591 of the heat dissipation member 59 of the display device 34 are given reference numerals. As described above, the display device 34 modulates the incident color light and emits the modulated color light in the opposite direction to the incident color light. As shown in Figure 2, the display device 34 has a configuration in which a light modulation unit 4 and a cooling unit 5 are combined.

[0027] [Configuration of the optical modulation section] The light modulation unit 4 modulates the incident color light. The light modulation unit 4 includes a base 41, a reflective light modulation element 42, a light-transmitting member 43, a support frame 44, a welded member 45, a drive circuit board 46, a contact 47, and an intervening member 48. In the following explanation, the three mutually orthogonal directions are referred to as the +X direction, the +Y direction, and the +Z direction. The +Z direction is defined as the direction in which colored light is incident on the display device 34, and the two directions that are orthogonal to the +Z direction and mutually orthogonal are defined as the +X direction and the +Y direction. Although not shown in the illustration, the direction opposite to the +Z direction and from which the modulated colored light is emitted is defined as the -Z direction, the direction opposite to the +X direction is defined as the -X direction, and the direction opposite to the +Y direction is defined as the -Y direction.

[0028] [Base configuration] The base 41 is a substrate containing, for example, aluminum nitride, and supports the reflective optical modulation element 42. The base 41 has a support surface 41A and a contact surface 41B. The support surface 41A corresponds to the first surface. The support surface 41A is the surface facing the -Z direction on the base 41, and the base 41 supports the reflective optical modulation element 42 and the support frame 44 on the support surface 41A. The contact surface 41B corresponds to the second surface. The contact surface 41B is the surface facing the +Z direction on the base 41, and the first region 53 of the vapor chamber 51, which will be described later, is in contact with the contact surface 41B.

[0029] [Configuration of a reflective optical modulation element] The reflective optical modulator 42 modulates the incident color light for each pixel and emits the modulated color light in the opposite direction to the incident color light. The reflective optical modulator 42 is positioned on the support surface 41A of the base 41 and is electrically connected to the base 41 via a wire WR. In this embodiment, the reflective optical modulator 42 is composed of a DMD element. The reflective light modulation element 42 has an output surface 42A and an opposing surface 42B. The emission surface 42A is the surface to which colored light is incident and the surface from which modulated colored light is emitted. In other words, the emission surface 42A is the image emission surface from which the image is emitted in the reflective light modulation element 42. The opposing surface 42B is the surface opposite to the ejection surface 42A. The opposing surface 42B faces the support surface 41A of the base 41.

[0030] [Composition of light-transmitting material] The light-transmitting member 43 is a plate-shaped member that is light-transmitting and is formed in a rectangular shape when viewed from the -Z direction. The light-transmitting member 43 is positioned on the optical path of the colored light incident on the reflective light modulation element 42, and also on the optical path of the colored light emitted from the reflective light modulation element 42. That is, the light-transmitting member 43 is positioned opposite the emission surface 42A of the reflective light modulation element 42 and on the side of the reflective light modulation element 42 that is opposite to the base 41. More specifically, when viewed from the -Z direction, the light-transmitting member 43 is positioned to cover the entire reflective light modulation element 42. Such a light-transmitting member 43 is supported by a support frame 44.

[0031] [Configuration of support frame and welded members] The support frame 44 is welded to the base 41 by a welding member 45 while supporting the translucent member 43. That is, the support frame 44 supports the translucent member 43 and is provided on the base 41. The welding member 45 is formed from a metal material such as solder. That is, the welding member 45 has thermal conductivity. The support frame 44 contacts the side surface of the translucent member 43 along the circumferential direction centered on the axis along the +Z direction. That is, the support frame 44 contacts the side surfaces of the rectangular translucent member 43 in the ±X and ±Y directions. In addition, the +Z direction surface of the support frame 44 is welded to the base 41 by a welding member 45. As a result, the space S enclosed by the support surface 41A of the base 41, the translucent member 43, the support frame 44, and the welding member 45 is sealed. Here, the support frame 44 can be formed from a metal with thermal conductivity. As a result, some of the heat generated in the reflective light modulation element 42 is transferred to the translucent member 43 and the support frame 44 via the gas in the space S. The heat transferred to the translucent member 43 is transferred to the support frame 44. The heat transferred to the support frame 44 is transferred to the base 41 via the welded member 45.

[0032] [Drive circuit board and contact configuration] The drive circuit board 46 is electrically connected to the base 41 and is a substrate that drives the reflective optical modulation element 42 provided on the base 41. It is formed of, for example, glass epoxy resin. The drive circuit board 46 is positioned in the +Z direction relative to the base 41. In other words, the drive circuit board 46 is provided on the side of the base 41 opposite to the reflective optical modulation element 42. The drive circuit board 46 has a mounting surface 46A, an opposing surface 46B, and a insertion portion 46C. The mounting surface 46A corresponds to the third surface. The mounting surface 46A is the surface facing the -Z direction on the drive circuit board 46 and is electrically connected to the contact surface 41B of the base 41 via the contact 47. The contact 47 is made of a metal that is both conductive and thermally conductive. The opposing surface 46B corresponds to the fourth surface. The opposing surface 46B is the surface facing the +Z direction on the drive circuit board 46, and faces the vapor chamber 51 of the cooling unit 5 in the +Z direction.

[0033] The inserted portion 46C is the portion of the vapor chamber 51 through which the first region 53, described later, is inserted in the -Z direction. In this embodiment, the inserted portion 46C is a through-hole that penetrates the drive circuit board 46 along the +Z direction. As will be described in detail later, the first region 53 of the vapor chamber 51 is connected to the contact surface 41B of the base 41 by inserting the inserted portion 46C in the -Z direction. Furthermore, the inner surface 46C1 of the inserted portion 46C is connected to the side surface 53B of the first region 53 in a heat-transferable manner. In other words, the inner surface 46C1 of the inserted portion 46C facing the first region 53 is connected to the side surface 53B of the first region 53 in a heat-transferable manner. A flexible substrate, which supplies image signals and power (not shown), is connected to the drive circuit board 46. The flexible substrate may be connected to either the mounting surface 46A or the opposing surface 46B of the drive circuit board 46, but it is preferable to connect it to the mounting surface 46A that does not face the vapor chamber 51.

[0034] [Configuration of the intervening components] The intervening member 48 is provided in the +Z direction relative to the drive circuit board 46. That is, the intervening member 48 is interposed between the drive circuit board 46 and the second region 54, which will be described later, in the vapor chamber 51. The intervening member 48 can be made of, for example, a thermally conductive sheet or an insulating sheet.

[0035] [Cooling Unit Configuration] The cooling unit 5 cools the optical modulation unit 4. More specifically, the cooling unit 5 cools the reflective optical modulation element 42 by dissipating the heat generated by the reflective optical modulation element 42. The cooling unit 5 includes a vapor chamber 51 and a heat dissipation member 59.

[0036] [Vapor Chamber Configuration] The vapor chamber 51 is a heat diffusion element that diffuses the heat from the reflective optical modulation element 42 transmitted from the base 41 and the drive circuit board 46 and transfers it to the heat dissipation member 59. The main part of the vapor chamber 51 is positioned in the +Z direction, opposite to the base 41 with respect to the drive circuit board 46. The vapor chamber 51 has a heat receiving section 52 and a heat dissipation section 55.

[0037] The heat receiving section 52 is the part of the vapor chamber 51 to which heat is transferred from the outside. The heat receiving section 52 is located on the -Z direction surface of the vapor chamber 51. The heat receiving section 52 is connected to the light modulation section 4 in a heat transferable manner and receives heat transferred from the light modulation section 4. The heat receiving section 52 has a first region 53 and a second region 54.

[0038] The first region 53, when viewed from the -Z direction, is the region corresponding to the insertion portion 46C of the drive circuit board 46 and faces the contact surface 41B. The first region 53 protrudes from the second region 54 in the -Z direction toward the base 41, and the insertion portion 46C is inserted in the -Z direction. The connection surface 53A, which is the surface on the base 41 side in the first region 53, is a flat surface, and the connection surface 53A is connected to the contact surface 41B of the base 41 in a heat-transferable manner. A thermally conductive grease GR is interposed between the connection surface 53A and the contact surface 41B. That is, the display device 34 is equipped with a thermally conductive grease GR provided between the contact surface 41B and the connection surface 53A, which is the portion of the first region 53 that faces the contact surface 41B. Heat from the contact surface 41B to the reflective optical modulation element 42 is transferred to the first region 53 via the grease GR. In the first region 53, the side surface 53B facing the direction perpendicular to the +Z direction is connected to the inner surface 46C1 of the insertion portion 46C in a heat-transferable manner. More specifically, in the first region 53, the side surfaces 53B facing the +X direction, -X direction, +Y direction, and -Y direction are connected to the inner surface 46C1 of the insertion portion 46C in a heat-transferable manner. Therefore, some of the heat from the reflective optical modulation element 42 transmitted to the drive circuit board 46 is transferred to the first region 53 via the inner surface 46C1.

[0039] The second region 54, when viewed from the -Z direction, is the region corresponding to the opposing surface 46B of the drive circuit board 46, and faces the opposing surface 46B. An intervening member 48 is connected to the -Z direction connection surface 54A in the second region 54 in a heat-transferable manner. That is, the second region 54 is connected to the opposing surface 46B of the drive circuit board 46 in a heat-transferable manner via the intervening member 48. Therefore, some of the heat from the reflective optical modulation element 42 that is transferred to the drive circuit board 46 is transferred to the second region 54. Furthermore, the distance between the second region 54 and the opposing surface 46B is greater than the distance between the first region 53 and the contact surface 41B. In other words, the distance between the first region 53 and the contact surface 41B is smaller than the distance between the second region 54 and the opposing surface 46B. This makes it easier to connect the first region 53 to the base 41, which is shorter than the drive circuit board 46 and therefore allows for heat transfer, and facilitates the transfer of heat generated in the reflective optical modulation element 42 to the first region 53.

[0040] The heat dissipation section 55 is the part of the vapor chamber 51 that transfers heat to the outside. The heat dissipation section 55 is provided on the surface of the vapor chamber 51 in the +Z direction. The surface of the vapor chamber 51 on which the heat dissipation section 55 is provided is a flat surface, and a heat dissipation member 59 is attached to the heat dissipation section 55 in a way that allows heat to be transferred.

[0041] Inside such a vapor chamber 51 is a fluid storage chamber 56 that contains a working fluid capable of phase change between a gas phase and a liquid phase. Furthermore, a mesh 57 is provided on the inner surface of the fluid storage chamber 56 that can hold the liquid working fluid and transport the liquid working fluid. In other words, the vapor chamber 51 comprises a fluid storage chamber 56 that contains the working fluid and a mesh 57 provided on the inner surface of the fluid storage chamber 56.

[0042] The fluid containment chamber 56 contains the working fluid sealed in a reduced-pressure state. Of the working fluid contained in the fluid containment chamber 56, the liquid phase working fluid vaporizes at the heat transfer points from the outside. For example, the liquid phase working fluid held in the mesh 57 vaporizes due to the heat transferred by the reflective optical modulation element 42 on the inner surface corresponding to the connection surface 53A of the first region 53 connected to the base 41, and on the inner surface corresponding to the side surface 53B of the first region 53 connected to the inner surface 46C1 of the drive circuit board 46. In addition, the liquid phase working fluid vaporizes due to the heat transferred by the reflective optical modulation element 42 on the inner surface corresponding to the connection surface 54A in the second region 54, which is heat-transferably connected to the drive circuit board 46. The vaporized working fluid flows through the fluid containment chamber 56 and condenses in the heat dissipation section 55, which is a low-thermal-density area, changing into a liquid working fluid. The liquid working fluid is held in the mesh 57 and transported by capillary force in the mesh 57 to areas with high thermal density, such as the area where heat from the reflective optical modulation element 42 is transferred. In this way, the heat from the reflective optical modulation element 42 transferred to the vapor chamber 51 is diffused throughout the fluid containment chamber 56 by being transferred to the working fluid and then transferred to the outside in the heat dissipation section 55.

[0043] Furthermore, the fluid containment chamber 56 is provided with a plurality of columnar sections 58 extending along the +Z direction. In other words, the vapor chamber 51 comprises a plurality of columnar sections 58 provided within the fluid containment chamber 56. Each of the multiple column sections 58 connects an inner surface corresponding to the heat receiving section 52 to an inner surface corresponding to the heat dissipation section 55. More specifically, the multiple column sections 58 are provided according to the second region 54 when viewed from the +Z direction or the -Z direction. In other words, the multiple column sections 58 are not provided in the first region 53 when viewed from the +Z direction or the -Z direction. The strength of the vapor chamber 51 can be ensured by these multiple columnar sections 58. In this case, the flatness of the portion where multiple column portions 58 are provided tends to be large. That is, the portion where multiple column portions 58 are provided is difficult to make flat. In contrast, the first region 53 does not have column portions 58. Therefore, the flatness of the connection surface 53A, which is connected to the contact surface 41B of the base 41 in a heat-transferable manner, can be reduced, and the contact area between the contact surface 41B and the connection surface 53A can be increased. Consequently, heat can be easily transferred from the base 41 to the first region 53.

[0044] [Configuration of heat dissipation components] The heat dissipation member 59 is a metal heat sink positioned to transfer heat to the heat dissipation section 55 and dissipates heat transferred from the vapor chamber 51. The heat dissipation member 59 has a plurality of fins 591 extending away from the vapor chamber 51. Each of the plurality of fins 591 dissipates the heat transferred to the heat dissipation member 59. In this way, by providing the heat dissipation member 59 with a plurality of fins 591, the heat dissipation area of ​​the heat transferred to the heat dissipation member 59, i.e., the heat dissipation area of ​​the reflective optical modulation element 42, can be increased.

[0045] [Effects of the First Embodiment] The projector 1 according to this embodiment, as described above, provides the following effects. The display device 34 comprises a base 41, a reflective light modulation element 42, a drive circuit board 46, a vapor chamber 51, and a heat dissipation member 59. The base 41 has a support surface 41A and a contact surface 41B opposite to the support surface 41A. The support surface 41A corresponds to the first surface, and the contact surface 41B corresponds to the second surface. The reflective light modulation element 42 is provided on the support surface 41A and electrically connected to the base 41, and modulates the incident light. The drive circuit board 46 has a mounting surface 46A that is electrically connected to the contact surface 41B, and an opposing surface 46B on the opposite side of the mounting surface 46A, and drives the reflective optical modulation element 42. The mounting surface 46A corresponds to the third surface, and the opposing surface 46B corresponds to the fourth surface. The vapor chamber 51 has a heat receiving section 52, a heat dissipation section 55, and a fluid containment chamber 56. The heat receiving section 52 receives heat transmitted from the outside. The heat dissipation section 55 dissipates heat. The fluid containment chamber 56 contains a working fluid that changes from a liquid phase to a gas phase due to the heat received by the heat receiving section 52, and then changes from a gas phase to a liquid phase in the heat dissipation section 55. The heat dissipation member 59 is connected to the heat dissipation section 55 in a way that allows for heat transfer. The heat receiving section 52 has a first region 53 and a second region 54. The first region 53 faces the contact surface 41B, and the second region 54 faces the opposing surface 46B. The first region 53 protrudes further toward the base 41 than the second region 54 and is connected to the contact surface 41B in a heat transferable manner.

[0046] With this configuration, the heat generated in the reflective optical modulation element 42 is transferred to the base 41 on which the reflective optical modulation element 42 is provided. The heat transferred to the base 41 is then transferred to a first region 53 in the vapor chamber 51 that is heat-transferably connected to the contact surface 41B of the base 41. Since the working fluid is contained in the fluid chamber 56 of the vapor chamber 51, the liquid phase working fluid vaporizes in the portion of the fluid chamber 56 corresponding to the first region 53 due to the heat transferred to the first region 53. As the gaseous working fluid expands in volume and diffuses within the fluid chamber 56, the heat transferred to the first region 53 diffuses within the fluid chamber 56. The gaseous working fluid condenses on the inner surface of the heat dissipation section 55 connected to the heat dissipation member 59, changing into a liquid phase working fluid, and the liquid phase working fluid is then transported again to the portion of the fluid chamber 56 corresponding to the first region 53. In this way, the vapor chamber 51 dissipates the heat from the reflective optical modulation element 42, thereby effectively reducing the heat density of the reflective optical modulation element 42. At this time, since a heat dissipation member 59 is provided in the heat dissipation section 55 of the vapor chamber 51, the vapor chamber 51 can efficiently transfer the heat from the reflective optical modulation element 42 to the heat dissipation member 59. Therefore, the reflective optical modulation element 42 can be effectively cooled. Furthermore, since the configuration of the vapor chamber 51 is such that the working fluid is sealed, the size of the display device 34 can be kept down.

[0047] In the display device 34, the drive circuit board 46 has an insertion portion 46C corresponding to the reflective light modulation element 42. The first region 53 is inserted through the insertion portion 46C and is connected to the contact surface 41B in a heat transfer manner. With this configuration, even if the vapor chamber 51 is positioned on the opposite side of the base 41 from the drive circuit board 46, the first region 53 of the vapor chamber 51 can be connected to the contact surface 41B of the base 41 in a way that allows heat transfer. Therefore, the heat from the reflective optical modulation element 42 that has been transferred to the contact surface 41B can be efficiently transferred to the vapor chamber 51, and the reflective optical modulation element 42 can be effectively cooled.

[0048] In the display device 34, the drive circuit board 46 receives heat generated by the reflective light modulation element 42 via the contact surface 41B on its mounting surface 46A. The drive circuit board 46 then transfers the received heat to the first region 53 at the portion of the insertion portion 46C that faces the first region 53. The portion of the insertion portion 46C that faces the first region 53 includes the portion of the heat receiving portion 52 that faces the protruding side surface 53B of the first region 53. With this configuration, the heat from the reflective optical modulator 42 is transferred not only to the portion of the first region 53 facing the base 41 via the base 41, but also to the portion of the first region 53 facing the insertion portion 46C. This increases the number of paths through which heat is transferred from the reflective optical modulator 42 to the first region 53, allowing the heat from the reflective optical modulator 42 to be transferred to the first region 53 more efficiently. Consequently, the reflective optical modulator 42 can be cooled more effectively.

[0049] The display device 34 includes a heat-conducting grease GR provided between the contact surface 41B and the connecting surface 53A, which is the portion of the first region 53 that faces the contact surface 41B. With this configuration, even if a gap occurs between the contact surface 41B of the base 41 and the first region 53 of the vapor chamber 51, the grease GR facilitates heat transfer from the contact surface 41B to the first region 53. Therefore, the heat from the reflective optical modulation element 42 can be efficiently cooled to the vapor chamber 51, allowing for more effective cooling of the reflective optical modulation element 42.

[0050] In the display device 34, the drive circuit board 46 receives heat generated by the reflective light modulation element 42 via the contact surface 41B on its mounting surface 46A. The drive circuit board 46 then transfers the received heat from the opposing surface 46B to the second region 54 of the vapor chamber 51. With this configuration, in the vapor chamber 51, heat from the reflective optical modulator 42 is transferred to the first region 53 via the base 41, and heat from the reflective optical modulator 42 is also transferred to the second region 54 via the base 41 and the drive circuit board 46. Therefore, the number of heat paths from the reflective optical modulator 42 to the vapor chamber 51 can be increased, allowing the reflective optical modulator 42 to be cooled more effectively.

[0051] In the display device 34, the vapor chamber 51 is located within the fluid containment chamber 56 and has a plurality of columnar sections 58 connecting the inner surface corresponding to the heat receiving section 52 and the inner surface corresponding to the heat dissipation section 55. The plurality of columnar sections 58 are arranged according to the second region 54. With this configuration, the strength of the vapor chamber 51, in which the working fluid vaporizes and condenses, can be ensured by the multiple columnar sections 58. Furthermore, in the portion of the vapor chamber 51 where multiple columnar sections 58 are provided, it is difficult to reduce the flatness. In other words, irregularities are likely to occur in the portion of the vapor chamber 51 where multiple columnar sections 58 are provided. In contrast, since the portion of the vapor chamber 51 where multiple columnar sections 58 are provided is the second region 54, it is possible to reduce the flatness of the connecting surface 53A of the first region 53 that faces the contact surface 41B of the base 41. Therefore, the contact area between the contact surface 41B and the connecting surface 53A can be increased, and heat from the reflective optical modulation element 42 can be efficiently transferred from the contact surface 41B to the first region 53.

[0052] In the display device 34, the distance between the first region 53 and the contact surface 41B is smaller than the distance between the second region 54 and the opposing surface 46B. With this configuration, since the column portion 58 is not provided in the first region 53, the flatness of the first region 53 does not decrease even if multiple column portions 58 are manufactured. Therefore, it is possible to easily connect the first region 53 to the contact surface 41B in a way that allows heat transfer. Consequently, it is possible to easily transfer heat from the reflective optical modulation element 42 to the first region 53 via the base 41.

[0053] In the display device 34, the heat dissipation member 59 has a plurality of fins 591. With this configuration, the heat dissipation area for heat transferred from the vapor chamber 51 can be increased, thereby promoting the condensation of the working fluid in the heat dissipation section 55 of the vapor chamber 51. Consequently, the heat transferred from the reflective optical modulation element 42 can promote the vaporization of the working fluid in the first region 53, and in turn, improve the cooling efficiency of the reflective optical modulation element 42.

[0054] [Second Embodiment] Next, a second embodiment of this disclosure will be described. The projector according to this embodiment has the same configuration as the projector 1 according to the first embodiment, but the configuration of the vapor chamber in the display device is different. In the following description, parts that are the same or substantially the same as those already described are denoted by the same reference numerals and their description is omitted.

[0055] [Projector Configuration Overview] Figure 3 is a cross-sectional view showing the display device 36 included in the projector according to this embodiment. The projector according to this embodiment has the same configuration and functions as the projector 1 according to the first embodiment, except that it includes a display device 36 shown in Figure 3 instead of the display device 34. The display device 36 has the same configuration and functions as the display device 34, except that it is equipped with a vapor chamber 61 instead of a vapor chamber 51. In other words, in this embodiment, the display device 36 is equipped with a light modulation unit 4 and a cooling unit 5 which has a vapor chamber 61 instead of a vapor chamber 51.

[0056] [Vapor Chamber Configuration] The vapor chamber 61, like the vapor chamber 51 according to the first embodiment, is heat-transferably connected to the base 41, the drive circuit board 46, and the intervening member 48, and is a heat diffusion element that diffuses the heat from the reflective optical modulation element 42 transmitted from the base 41, the drive circuit board 46, and the intervening member 48 and transfers it to the heat dissipation member 59. The vapor chamber 61 has the same configuration as the vapor chamber 51, but differs from the vapor chamber 51 in that a part of the vapor chamber 61 is heat-transferably connected to the outer peripheral surface 441 of the support frame 44. Specifically, the vapor chamber 61, like the vapor chamber 51, has a heat receiving section 52, a heat dissipation section 55, a fluid containment chamber 56, a mesh 57, and a plurality of columnar sections 58, and further comprises a plurality of curved sections 62 and a plurality of connecting sections 63.

[0057] Each of the multiple curved sections 62 is a portion that curves in the -Z direction from the end of the second region 54 opposite to the first region 53. In the example of Figure 3, one of the multiple curved sections 62, curved section 62A, extends outward in the -Z direction from the +X direction end of the second region 54, and then extends in the -X direction. Another of the multiple curved sections 62, curved section 62B, extends outward in the -Z direction from the -X direction end of the second region 54, and then extends in the +X direction. Although not shown in the figure, another of the multiple curved sections 62, curved outward in the -Z direction from the +Y direction end of the second region 54, and then extends in the -Y direction. Also, although not shown in the figure, another of the multiple curved sections 62, curved outward in the -Z direction from the -Y direction end of the second region 54, and then extends in the +Y direction. Alternatively, instead of the curved portion 62, a bent portion may be provided in the second region 54 that is bent in the -Z direction from the end opposite to the first region 53, and then bent again toward the base 41 and support frame 44.

[0058] Each of the multiple connection portions 63 is provided on the corresponding curved portion 62 among the multiple curved portions 62. Each of the multiple connection portions 63 is connected to the outer circumferential surface 441 of the support frame 44 that supports the light-transmitting member 43 in a heat-transferable manner. For example, among the multiple connection portions 63, connection portion 63A provided on curved portion 62A is connected to the portion of the outer circumferential surface 441 of the support frame 44 in the +X direction. Also, for example, among the multiple connection portions 63, connection portion 63B provided on curved portion 62B is connected to the portion of the outer circumferential surface 441 of the support frame 44 in the -X direction. The same applies to the connection portions 63 provided on other curved portions 62 among the multiple connection portions 63. The multiple connection points 63 receive heat from the reflective light modulation element 42 transmitted to the support frame 44. In other words, each of the multiple connection points 63 constitutes a heat receiving section 52. The connection portion 63 may be connected to the base 41 in a heat-transferable manner, instead of, or in addition to, the support frame 44, to receive heat from the reflective optical modulation element 42 that is transferred to the base 41. The connection portion 63 may also be connected to the mounting surface 46A of the drive circuit board 46.

[0059] [Effects of the second embodiment] The projector according to this embodiment described above provides the same effects as the projector 1 according to the first embodiment, as well as the following effects. The display device 36 comprises a light-transmitting member 43 and a support frame 44. The light-transmitting member 43 faces the output surface 42A, which serves as the image output surface of the reflective light modulation element 42, and is provided on the side of the reflective light modulation element 42 that is opposite to the base 41. The support frame 44 supports the light-transmitting member 43 and is provided on the base 41. The vapor chamber 61 is connected to the support frame 44 in a heat-transferable manner and receives heat generated in the reflective light modulation element 42. With this configuration, the heat generated in the reflective optical modulation element 42 that is transferred to the translucent member 43 can be transferred to the vapor chamber 61 via the support frame 44. Therefore, the number of heat paths from the reflective optical modulation element 42 to the vapor chamber 61 can be increased, allowing the reflective optical modulation element 42 to be cooled more effectively.

[0060] [Third Embodiment] Next, a third embodiment of this disclosure will be described. The projector according to this embodiment has the same configuration as the projector 1 according to the first embodiment, but the configuration of the heat dissipation member is different. In the following description, parts that are the same or substantially the same as parts already described are denoted by the same reference numerals and their description is omitted.

[0061] [Projector Configuration Overview] Figure 4 shows the display device 37, radiator 71, and piping 72, 73 included in the projector according to this embodiment. The projector according to this embodiment has the same configuration and functions as the projector 1 according to the first embodiment, except that it includes a display device 37 shown in Figure 4 instead of the display device 34, and further includes a radiator 71 and a plurality of pipes 72, 73. The display device 37 has the same configuration and function as the display device 34, except that it is equipped with a heat dissipation member 64 instead of the heat dissipation member 59. That is, in this embodiment, the display device 37 comprises a light modulation unit 4 and a cooling unit 5 having a vapor chamber 51 and a heat dissipation member 64. The display device 37 may also include a vapor chamber 61 according to the second embodiment instead of the vapor chamber 51 according to the first embodiment.

[0062] [Radiator and piping configuration] First, let's describe the radiator 71 and the piping 72 and 73. The radiator 71 cools the coolant flowing from the heat dissipation member 64 via the piping 72 and supplies the cooled coolant to the heat dissipation member 59 via the piping 73. The radiator 71 receives heat from the flowing coolant and transfers the received heat to the flowing cooling gas by a fan (not shown). In this way, the radiator 71 cools the coolant. The cooling gas, which has been heated by the radiator 71, is then discharged to the outside of the outer casing 2.

[0063] [Configuration of heat dissipation components] The heat dissipation member 64, like the heat dissipation member 59, is connected to the heat dissipation section 55 of the vapor chamber 51 in a way that allows heat transfer, and dissipates the heat transferred from the heat dissipation section 55. More specifically, the heat dissipation member 64 dissipates the heat transferred from the heat dissipation section 55 into the cooling liquid flowing into its interior. The heat dissipation member 64 includes a housing 65, an impeller 66, and a motor 67. The housing 65 has a liquid storage section 651, an outlet section 652, and an inlet section 653. The liquid containment section 651 contains the cooling liquid, the impeller 66, and a portion of the motor 67. The outlet section 652 allows the cooling liquid in the liquid reservoir section 651 to flow out when the impeller 66 is rotated by the motor 67. The inlet section 653 allows the cooling liquid flowing from the outside to flow into the liquid storage section 651. The outlet section 652 and the inlet section 653 are connected to the radiator 71 via a plurality of pipes 72 and 73 so that coolant can flow through them. The impeller 66 is located within the liquid reservoir 651 and is rotated by the motor 67.

[0064] The heat transferred from the heat dissipation section 55 of the vapor chamber 51 to the housing 65 is transferred to the cooling liquid in the liquid storage section 651. When the impeller 66 is rotated by the motor 67, the heated cooling liquid flows out of the liquid storage section 651 through the outlet section 652 and the piping 72 to the radiator 71. The heat transferred to the cooling liquid by the radiator 71 is then transferred to the cooling gas circulating in the radiator 71. In other words, a portion of the heat generated by the reflective light modulation element 42 is transferred to the cooling gas via the cooling liquid. This cools the cooling liquid. The coolant cooled by the radiator 71 flows through the piping 73, and the circulating coolant flows into the liquid storage section 651 at the inlet 653. This heat dissipation member 64 allows the heat generated in the reflective optical modulation element 42 and transferred to the vapor chamber 51 to be efficiently transferred to the cooling liquid. Therefore, the reflective optical modulation element 42 can be cooled efficiently.

[0065] In this embodiment, the projector includes three display devices 37, one of which modulates red light R, another modulates green light G, and the remaining display device 37 modulates blue light B. The three heat dissipation members 64 provided on each of the three display devices 37 may be connected to a radiator 71. In this case, the three heat dissipation members 64 may be connected in series or in parallel to the radiator 71.

[0066] [Effects of the third embodiment] The projector according to this embodiment described above provides the same effects as the projector 1 according to the first embodiment, as well as the following effects. In the display device 37, the heat dissipation member 64 has a liquid storage section 651 located inside the heat dissipation member 64 through which a cooling liquid flows between the inside and outside. With this configuration, heat from the reflective optical modulation element 42 can be transferred to the cooling liquid circulating inside and outside the liquid containment section 651, thereby promoting the condensation of the working fluid in the heat dissipation section 55 of the vapor chamber 51. Consequently, the heat transferred from the reflective optical modulation element 42 promotes the vaporization of the working fluid in the first region 53 and the second region 54, and in turn, improves the cooling efficiency of the reflective optical modulation element 42.

[0067] [Variations of the Embodiment] This disclosure is not limited to the embodiments described above, and any modifications and improvements that can achieve the purposes of this disclosure are included. In the embodiments described above, the heat dissipation section 55 in the vapor chambers 51 and 61 is provided in the +Z direction relative to the heat receiving section 52. That is, the heat dissipation section 55 is provided on the surface in the +Z direction in the vapor chambers 51 and 61. However, the heat dissipation section 55 is not limited to this and may be provided in a different part of the vapor chamber. Here, since the heat dissipation section in the vapor chamber is provided in a part with low heat density, the heat dissipation section tends to be the part of the vapor chamber where the heat dissipation member is provided. For this reason, depending on the arrangement position of the heat dissipation member in the vapor chamber, the heat dissipation section may be provided in a different part. For example, if the surface of the vapor chamber in the -Z direction extends outward from the optical modulation section 4 when viewed from the -Z direction, the heat dissipation section may be provided on that surface in the -Z direction.

[0068] In each of the above embodiments, the insertion portion 46C provided on the drive circuit board 46, through which the first region 53 of the vapor chambers 51 and 61 is inserted in the -Z direction, is a through-hole penetrating the drive circuit board 46. However, the embodiment is not limited to this, and the insertion portion 46C may be a notch provided at the end of the drive circuit board 46. In other words, the insertion portion 46C does not necessarily have to be a through-hole surrounded by other objects.

[0069] In each of the above embodiments, the inner surface 46C1 of the insertion portion 46C is assumed to be heat-transferably connected to the side surface 53B of the first region 53. That is, the drive circuit board 46 is assumed to transfer a portion of the heat from the reflective optical modulation element 42 that is transmitted to the drive circuit board 46 to the first region 53. However, the embodiment is not limited to this, and the drive circuit board 46 does not necessarily have to be heat-transferably connected to the first region 53.

[0070] In each of the above embodiments, a thermally conductive grease GR is provided between the contact surface 41B of the base 41 and the connecting surface 53A of the first region 53 provided in the vapor chambers 51 and 61. However, this is not limited to this, and the grease GR may be omitted, and the contact surface 41B and the connecting surface 53A may be in direct contact. Alternatively, instead of grease GR, an adhesive may be provided between the contact surface 41B and the connecting surface 53A to bond them together. In this case, the adhesive may be a thermally conductive adhesive.

[0071] In the above embodiments, the drive circuit board 46 is assumed to transfer heat from the opposing surface 46B to the second region 54 of the vapor chambers 51 and 61 via the intervening member 48. However, the invention is not limited to this, and heat does not necessarily need to be transferred from the opposing surface 46B to the second region 54. Furthermore, the intervening member 48 may be omitted.

[0072] In the embodiments described above, the vapor chambers 51 and 61 have a plurality of columnar sections 58 provided within the fluid containment chamber 56, and the plurality of columnar sections 58 extend along the protruding direction of the first region 53. Furthermore, the plurality of columnar sections 58 are provided in accordance with the second region 54 when viewed from the -Z direction, which is the base 41 side, and are not provided in the first region 53. However, the embodiments are not limited to this, and the columnar sections 58 may be omitted. Also, if columnar sections 58 are provided, they may be provided not only in accordance with the second region 54 but also with the first region 53, and may not be provided in the portion corresponding to the second region 54.

[0073] In each of the above embodiments, the distance between the first region 53 and the contact surface 41B was assumed to be smaller than the distance between the second region 54 and the opposing surface 46B. However, this is not limited to this, and the distance between the first region 53 and the contact surface 41B does not necessarily have to be smaller than the distance between the second region 54 and the opposing surface 46B, as long as heat can be transferred from the contact surface 41B to the first region 53.

[0074] In the first and second embodiments described above, the heat dissipation member 59 was assumed to be a heat sink having a plurality of fins 591. In the third embodiment described above, the heat dissipation member 64 was assumed to transfer heat transmitted from the vapor chambers 51 and 61 to a cooling liquid in a liquid containment section 651 provided inside. However, the configuration of the heat dissipation member connected to the heat dissipation section 55 of the vapor chambers 51 and 61 in a manner that allows heat transfer is not limited to the above. For example, the heat dissipation member 64 may not have an impeller 66 and a motor 67, nor may it have an outlet section 652 and an inlet section 653.

[0075] In the embodiments described above, the display devices 34, 36, and 37 were applied to the projector 1. However, the disclosure is not limited to this, and the display devices may be used in electronic devices other than projectors, or may be used as independent display devices.

[0076] [Summary of this disclosure] A summary of this disclosure is provided below. A display device according to one aspect of the present disclosure comprises a base having a first surface and a second surface opposite to the first surface; a reflective optical modulation element provided on the first surface and electrically connected to the base; a third surface electrically connected to the second surface and a fourth surface opposite to the third surface; a drive circuit board for driving the reflective optical modulation element; a vapor chamber having a heat receiving section for receiving heat transmitted from the outside; a heat dissipation section for dissipating heat; and a fluid receiving chamber for containing a working fluid that changes from a liquid phase to a gas phase due to the heat received by the heat receiving section and changes from a gas phase to a liquid phase in the heat dissipation section; and a heat dissipation member connected to the heat dissipation section so as to be heat-transferable, wherein the heat receiving section has a first region facing the second surface and a second region facing the fourth surface, the first region protruding toward the base side than the second region and connected to the second surface so as to be heat-transferable.

[0077] In this configuration, the heat generated in the reflective optical modulator is transferred to the base on which the reflective optical modulator is mounted. The heat transferred to the base is then transferred to a first region in the vapor chamber that is heat-transferably connected to the second surface of the base. Since the working fluid is contained in the fluid chamber of the vapor chamber, the liquid phase working fluid vaporizes in the portion of the fluid flow chamber corresponding to the first region due to the heat transferred to the first region. As the gaseous working fluid expands in volume and diffuses within the fluid chamber, the heat transferred to the first region diffuses within the fluid chamber. The gaseous working fluid condenses on the inner surface of the heat dissipation section connected to the heat dissipation member and changes into a liquid phase working fluid, which is then transported again to the portion of the fluid flow chamber corresponding to the first region. In this way, the vapor chamber dissipates the heat from the reflective optical modulator, effectively reducing the heat density of the reflective optical modulator. Since a heat dissipation member is provided in the heat dissipation section of the vapor chamber, the heat from the reflective optical modulator can be efficiently transferred to the heat dissipation member. Therefore, the reflective optical modulator can be effectively cooled. Furthermore, because the vapor chamber's configuration seals the working fluid, it helps to suppress the need for larger display devices. Furthermore, the term "opposing" as used in "the first region facing the second surface" and "the second region facing the fourth surface" is not limited to cases where surfaces are directly opposite each other, but also includes cases where an inclusion is present.

[0078] In one embodiment described above, the drive circuit board has an insertion portion corresponding to the reflective optical modulation element, and the first region may be connected to the second surface in a heat-transferable manner by inserting the insertion portion. With this configuration, even if the vapor chamber is positioned on the opposite side of the base from the drive circuit board, the first region of the vapor chamber can be connected to the second surface of the base in a heat-transferable manner. Therefore, the heat from the reflective optical modulation element that has been transferred to the second surface can be efficiently transferred to the vapor chamber, and the reflective optical modulation element can be effectively cooled.

[0079] In one embodiment described above, the drive circuit board may receive heat generated by the reflective optical modulation element via the second surface on the third surface, and transfer the received heat to the first region at the portion of the insertion area facing the first region. With this configuration, the heat from the reflective optical modulator is transferred not only to the portion facing the base in the first region via the base, but also to the portion facing the insertion portion in the first region. This increases the number of paths through which heat is transferred from the reflective optical modulator to the first region, allowing for more efficient heat transfer from the reflective optical modulator to the first region. Consequently, the reflective optical modulator can be cooled more effectively.

[0080] In one embodiment described above, the vapor chamber may be connected to the support frame in a heat-transmissive manner to receive heat generated by the reflective light modulation element. The vapor chamber is provided opposite the image output surface of the reflective light modulation element and on the side opposite to the base with respect to the reflective light modulation element. With this configuration, the heat generated in the reflective optical modulator that is transferred to the translucent member can be transferred to the vapor chamber via the support frame. Therefore, the number of heat paths from the reflective optical modulator to the vapor chamber can be increased, allowing the reflective optical modulator to be cooled more effectively.

[0081] In one embodiment described above, a heat-conducting grease may be provided between the second surface and the portion of the first region facing the second surface. With this configuration, even if a gap occurs between the second surface of the base and the first region of the vapor chamber, the grease facilitates heat transfer from the second surface to the first region. Therefore, the heat from the reflective optical modulator can be efficiently cooled to the vapor chamber, resulting in more effective cooling of the reflective optical modulator.

[0082] In one embodiment described above, the drive circuit board may receive heat generated by the reflective optical modulation element via the second surface on the third surface, and transfer the received heat from the fourth surface to the second region of the vapor chamber. With this configuration, in the vapor chamber, heat from the reflective optical modulator is transferred to the first region via the base, and heat from the reflective optical modulator is also transferred to the second region via the base and the drive circuit board. Therefore, the number of heat paths from the reflective optical modulator to the vapor chamber can be increased, allowing the reflective optical modulator to be cooled more effectively.

[0083] In one embodiment described above, the vapor chamber is provided within the fluid containment chamber and has a plurality of columnar sections connecting the inner surface corresponding to the heat receiving section and the inner surface corresponding to the heat dissipation section, and the plurality of columnar sections may be provided according to the second region. With this configuration, the strength of the vapor chamber, where the working fluid vaporizes and condenses internally, can be ensured by multiple columnar sections. Furthermore, in areas of the vapor chamber where multiple columns are provided, it is difficult to reduce the flatness. In other words, irregularities tend to occur in areas of the vapor chamber where multiple columns are provided. In contrast, since the area of ​​the vapor chamber where multiple columns are provided is a second region, it is easier to reduce the flatness of the first region that faces the second surface of the base. Therefore, the contact area between the second surface and the first region can be increased, and heat from the reflective optical modulation element can be efficiently transferred from the second surface to the first region.

[0084] In the above embodiment, the distance between the first region and the second surface may be smaller than the distance between the second region and the fourth surface. With this configuration, since the column section is not provided in the first region, the flatness of the first region does not decrease even if multiple column sections are manufactured. Therefore, it is possible to easily connect the first region to the second surface in a way that allows heat transfer. Consequently, it is possible to easily transfer heat from the reflective optical modulation element to the first region via the base.

[0085] In the above embodiment, the heat dissipation member may have a plurality of fins. With this configuration, the heat dissipation area for heat transferred from the vapor chamber can be increased, thereby promoting the condensation of the working fluid on the sixth surface of the vapor chamber. Consequently, the heat transferred from the reflective optical modulator can promote the vaporization of the working fluid in the first region, and in turn, improve the cooling efficiency of the reflective optical modulator.

[0086] In one embodiment described above, the heat dissipation member may have a liquid reservoir provided inside the heat dissipation member through which a cooling liquid flows between the inside and outside. With this configuration, heat from the reflective optical modulator can be transferred to the cooling liquid circulating inside and outside the liquid containment section, thereby promoting the condensation of the working fluid in the heat dissipation section of the vapor chamber. Consequently, the heat transferred from the reflective optical modulator can promote the vaporization of the working fluid in the first region, and in turn, improve the cooling efficiency of the reflective optical modulator. [Explanation of Symbols]

[0087] 1...Projector, 34, 34B, 34G, 34R, 36, 37...Display device, 4...Light modulation unit, 41...Base, 41A...Support surface (1st surface), 41B...Contact surface (2nd surface), 42...Reflective light modulation element, 42A...Emission surface (image emission surface), 42B...Opposite surface, 43...Translucent member, 44...Support frame, 441...Outer peripheral surface, 45...Welded member, 46...Drive circuit board, 46A...Mounting surface (3rd surface), 46B...Opposite surface (4th surface), 46C...Inserted part, 46C1...Inner surface, 47...Contact, 48...Interfacing member, 5...Cooling section, 51...Vapor chamber, 52...Heat receiving section, 53...First region, 53A...Connection surface, 53B...Side surface, 54...Second region, 54A...Connection surface, 55...Heat dissipation section, 56...Fluid containment chamber, 57...Mesh, 58...Column section, 59...Heat dissipation member, 591...Fin, 61...Vapor chamber, 62...Bent section, 63...Connection section, 64...Heat dissipation member, 65...Housing, 651...Liquid containment section, 652...Outlet section, 653...Inlet section, 71...Radiator, 72,73...Piping, S...Space, WR...Wire.

Claims

1. A base having a first surface and a second surface opposite to the first surface, A reflective optical modulation element provided on the first surface and electrically connected to the base, A drive circuit board for driving the reflective optical modulation element has a third surface electrically connected to the second surface and a fourth surface opposite to the third surface, A vapor chamber having a heat receiving section that receives heat transmitted from the outside, a heat dissipation section that dissipates heat, and a fluid receiving chamber that contains a working fluid that changes from a liquid phase to a gas phase due to the heat received in the heat receiving section and changes from a gas phase to a liquid phase in the heat dissipation section, The heat dissipation section comprises a heat dissipation member that is heat-transferably connected to the heat dissipation section, The heat receiving portion has a first region facing the second surface and a second region facing the fourth surface. The first region protrudes further toward the base than the second region and is connected to the second surface in a heat-transferable manner. The vapor chamber is provided within the fluid containment chamber and has a plurality of columnar portions connecting the inner surface corresponding to the heat receiving portion and the inner surface corresponding to the heat dissipation portion. The display device is characterized in that the plurality of columnar portions are provided according to the second region and not provided in the first region.

2. In the display device according to claim 1, A display device characterized in that the distance between the first region and the second surface is smaller than the distance between the second region and the fourth surface.

3. A base having a first surface and a second surface opposite to the first surface, A reflective optical modulation element provided on the first surface and electrically connected to the base, A drive circuit board for driving the reflective optical modulation element has a third surface electrically connected to the second surface and a fourth surface opposite to the third surface, A vapor chamber having a heat receiving section that receives heat transmitted from the outside, a heat dissipation section that dissipates heat, and a fluid receiving chamber that contains a working fluid that changes from a liquid phase to a gas phase due to the heat received in the heat receiving section and changes from a gas phase to a liquid phase in the heat dissipation section, A heat dissipation member connected to the heat dissipation section in a heat transferable manner, A light-transmitting member is provided opposite the image emission surface of the reflective light modulation element and on the side opposite to the base of the reflective light modulation element, The light-transmitting member is supported by a support frame provided on the base, The heat receiving portion has a first region facing the second surface and a second region facing the fourth surface. The first region protrudes further toward the base than the second region and is connected to the second surface in a heat-transferable manner. The display device is characterized in that the vapor chamber is heat-transferably connected to the support frame and receives heat generated by the reflective light modulation element.

4. A base having a first surface and a second surface opposite to the first surface, A reflective optical modulation element provided on the first surface and electrically connected to the base, A drive circuit board for driving the reflective optical modulation element has a third surface electrically connected to the second surface and a fourth surface opposite to the third surface, A vapor chamber having a heat receiving section that receives heat transmitted from the outside, a heat dissipation section that dissipates heat, and a fluid receiving chamber that contains a working fluid that changes from a liquid phase to a gas phase due to the heat received in the heat receiving section and changes from a gas phase to a liquid phase in the heat dissipation section, The heat dissipation section comprises a heat dissipation member that is heat-transferably connected to the heat dissipation section, The heat receiving portion has a first region facing the second surface and a second region facing the fourth surface. The first region protrudes further toward the base than the second region and is connected to the second surface in a heat-transferable manner. The display device is characterized in that the drive circuit board receives heat generated by the reflective light modulation element via the second surface on the third surface, and transmits the received heat from the fourth surface to the second region of the vapor chamber.

5. In the display device according to any one of claims 1 to 4, The heat dissipation member is characterized by having a plurality of fins.

6. A base having a first surface and a second surface opposite to the first surface, A reflective optical modulation element provided on the first surface and electrically connected to the base, A drive circuit board for driving the reflective optical modulation element has a third surface electrically connected to the second surface and a fourth surface opposite to the third surface, A vapor chamber having a heat receiving section that receives heat transmitted from the outside, a heat dissipation section that dissipates heat, and a fluid receiving chamber that contains a working fluid that changes from a liquid phase to a gas phase due to the heat received in the heat receiving section and changes from a gas phase to a liquid phase in the heat dissipation section, The heat dissipation section comprises a heat dissipation member that is heat-transferably connected to the heat dissipation section, The heat receiving portion has a first region facing the second surface and a second region facing the fourth surface. The first region protrudes further toward the base than the second region and is connected to the second surface in a heat-transferable manner. The display device is characterized in that the heat dissipation member is provided inside the heat dissipation member and has a liquid storage section through which a cooling liquid flows between the inside and outside.

7. In the display device according to any one of claims 1 to 6, The drive circuit board has an insertion portion corresponding to the reflective optical modulation element, The display device is characterized in that the first region is connected to the second surface in a heat-transferable manner by inserting the insertion portion.

8. A base having a first surface and a second surface opposite to the first surface, A reflective optical modulation element provided on the first surface and electrically connected to the base, A drive circuit board for driving the reflective light modulation element has a third surface electrically connected to the second surface, a fourth surface opposite to the third surface, and a portion to be inserted corresponding to the reflective light modulation element, A vapor chamber having a heat receiving section that receives heat transmitted from the outside, a heat dissipation section that dissipates heat, and a fluid receiving chamber that contains a working fluid that changes from a liquid phase to a gas phase due to the heat received in the heat receiving section and changes from a gas phase to a liquid phase in the heat dissipation section, The heat dissipation section comprises a heat dissipation member that is heat-transferably connected to the heat dissipation section, The heat receiving portion has a first region facing the second surface and a second region facing the fourth surface. The first region protrudes further toward the base than the second region, and is connected to the second surface in a heat-transferable manner by inserting the insertion portion. The display device is characterized in that the drive circuit board receives heat generated by the reflective light modulation element via the second surface on the third surface, and transmits the received heat to the first region at the portion of the insertion area that faces the first region.

9. In the display device according to claim 8, The heat dissipation member is characterized by having a plurality of fins.

10. In the display device according to any one of claims 1 to 9, A display device characterized by comprising a heat-conducting grease provided between the second surface and the portion of the first region facing the second surface.

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