Camera modules, electronic devices, and vehicle tools

Abstract

To provide a camera module.SOLUTION: A camera module includes: an imaging lens module; a photoelectric converting layer for converting an optical signal of imaging light to an electric signal; a microlens array layer for converging energy of the imaging light into the photoelectric converting layer; a filter layer arranged between the photoelectric converting layer and the microlens array layer for absorbing light at a specific wavelength region of the imaging light; an anti-reflecting layer disposed on a surface of at least one of the filter layer and the microlens array layer; and an electronic photosensitive element arranged on an imaging surface of the imaging lens module. Imaging quality is improved by the camera module.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present disclosure relates to a camera module, an electronic device, and a vehicle tool, and particularly to a camera module, an electronic device, and a vehicle tool provided with an anti-reflection film layer.

Background Art

[0002] In recent years, camera modules have developed rapidly, permeated modern people's lives, and become widely used in various fields. For example, they are mounted on portable electronic devices, head-mounted devices, vehicle tools, etc. Camera modules and electronic photosensitive elements have also grown rapidly accordingly. However, with the progress of technology, users' requirements for the quality of camera modules are also increasing. Among them, the microlens array layer is one of the main factors affecting imaging quality.

[0003] Please refer to FIGS. 13A, 13B, 13C, and 13D. FIG. 13A is a schematic diagram showing a conventional camera module, FIG. 13B is a photograph showing the microlens array layer ML in the camera module of FIG. 13A, FIG. 13C is a photograph showing stray light SL generated by the microlens array layer ML in the camera module of FIG. 13A, and FIG. 13D is a schematic diagram showing the intensity simulation of the stray light SL in FIG. 13C. In the conventional technology as shown in FIGS. 13A, 13B, 13C, and 13D, when imaging light L enters the camera module, the electronic photosensitive element I of the camera module undergoes a diffraction phenomenon of light due to the microlens array layer ML provided on the object side surface thereof, so that the imaging light L is reflected between the microlens array layer ML and the optical flat plate F along the optical path L2, and further generates stray light SL. Paddle flare is one form of the stray light SL and has a serious impact on imaging quality. Therefore, the development of a camera module that can effectively remove the stray light of the camera module and enhance the light-gathering ability has become an important and urgent issue in the industry.

Summary of the Invention

Problems to be Solved by the Invention

[0004] The present disclosure provides a camera module, an electronic device, and a vehicle tool. By providing an anti-reflection film layer on the electronic photosensitive element of the camera module, stray light of the camera module can be effectively removed, the light-gathering ability can be enhanced, and the color reproducibility of the electronic photosensitive element can be strengthened.

Means for Solving the Problem

[0005] According to an embodiment of the present disclosure, a camera module is provided, which includes an imaging lens module and an electronic photosensitive element provided on the imaging surface of the imaging lens module. The electronic photosensitive element includes a photoelectric conversion layer for converting the optical signal of the imaging light into an electronic signal, a microlens array layer for concentrating the energy of the imaging light on the photoelectric conversion layer, a filter layer provided between the photoelectric conversion layer and the microlens array layer and for absorbing light in a specific wavelength band in the imaging light, an irregular nanoparticle structure layer, and an optical connection film layer connected to the irregular nanoparticle structure layer, and further includes an anti-reflection film layer provided on at least one surface of the filter layer and the microlens array layer.

[0006] According to the camera module of the embodiment described in the previous paragraph, the anti-reflection film layer may be provided on the object-side surface of the microlens array layer.

[0007] According to the camera module of the embodiment described in the previous paragraph, the anti-reflection film layer may be provided between the filter layer and the microlens array layer.

[0008] According to the camera module of the embodiment described in the previous paragraph, the irregular nanoparticle structure layer may be made of a metal oxide.

[0009] According to the camera module of the embodiment described in the previous paragraph, the refractive index of the material of the irregular nanoparticle structure layer is Nc, the refractive index of the material of the optical connection film layer is Nf, and the condition Nf < Nc may be satisfied.

[0010] According to the camera module of the embodiment described in the previous paragraph, the height of the irregular nanoparticle structure layer is Hc, the film thickness of the optical connection film layer is Hf, the total height of the antireflection film layer is H, and the conditions Hf + Hc = H and Hf < Hc may be satisfied. Further, the condition 20 nm < Hf < 120 nm may be satisfied. Further, the condition 120 nm < Hc < 350 nm may be satisfied.

[0011] According to the camera module of the embodiment described in the previous paragraph, the top of the optical connection film layer may be partially in contact with air.

[0012] According to the camera module of the embodiment described in the previous paragraph, the size of each microlens in the microlens array layer is Dp, and the condition 0.2 μm < Dp < 10 μm may be satisfied.

[0013] According to the camera module of the embodiment described in the previous paragraph, the number of a plurality of microlenses in the microlens array layer is PN, and the condition 7 million < PN < 1 billion may be satisfied.

[0014] According to the camera module of the embodiment described in the previous paragraph, a driving device for driving the electronic photosensitive element may be further provided.

[0015] <​​​​​​​​According to an embodiment of the present disclosure, there is provided an imaging lens module, and an electronic photosensitive element provided on an imaging surface of the imaging lens module. The electronic photosensitive element includes a photoelectric conversion layer for converting an optical signal of imaging light into an electronic signal, a microlens array layer for concentrating the energy of the imaging light on the photoelectric conversion layer, a filter layer provided between the photoelectric conversion layer and the microlens array layer and for absorbing light in a specific wavelength band in the imaging light, an irregular nanostructure layer having a plurality of hole structures, and an antireflection film layer provided on at least one surface of the filter layer and the microlens array layer.

[0018] According to the camera module of the embodiment described in the previous paragraph, the size of each microlens in the microlens array layer may be Dp, and may satisfy the condition of 0.2 μm < Dp < 10 μm.

[0019] According to the camera module of the embodiment described in the previous paragraph, the number of a plurality of microlenses in the microlens array layer may be PN, and may satisfy the condition of 7 million < PN < one billion.

[0020] According to the camera module of the embodiment described in the previous paragraph, a driving device for driving the electronic photosensitive element may be further provided.

[0021] According to an embodiment of the present disclosure, there is provided an imaging lens module, and an electronic photosensitive element provided on an imaging surface of the imaging lens module. The electronic photosensitive element includes a photoelectric conversion layer for converting an optical signal of imaging light into an electronic signal, a microlens array layer for concentrating the energy of the imaging light on the photoelectric conversion layer, a filter layer provided between the photoelectric conversion layer and the microlens array layer and for absorbing light in a specific wavelength band in the imaging light, an optical multilayer stack structure alternately laminated by a plurality of film layers having a step in the refractive index of the material and having at least three times of alternating high and low times, and an antireflection film layer provided on at least one surface of the filter layer and the microlens array layer.

[0022] According to the camera module of the embodiment described in the previous paragraph, the size of each microlens in the microlens array layer is Dp, and the condition of 0.2 μm < Dp < 10 μm may be satisfied.

[0023] According to the camera module of the embodiment described in the previous paragraph, the number of a plurality of microlenses in the microlens array layer is PN, and the condition of 7 million < PN < 1 billion may be satisfied.

[0024] According to the camera module of the embodiment described in the previous paragraph, a driving device for driving the electronic photosensitive element may be further provided.

[0025] According to an embodiment of the present disclosure, an electronic device including the camera module of the foregoing embodiment is provided.

[0026] According to an embodiment of the present disclosure, a vehicle tool including the camera module of the foregoing embodiment is provided.

[0027] According to an embodiment of the present disclosure, a camera module is provided, which includes an imaging lens module, an electronic photosensitive element provided on an imaging surface of the imaging lens module, and the electronic photosensitive element includes a photoelectric conversion layer for converting an optical signal of imaging light into an electronic signal, a microlens array layer for concentrating the energy of the imaging light on the photoelectric conversion layer, a filter layer provided between the photoelectric conversion layer and the microlens array layer and for absorbing light in a specific wavelength band in the imaging light, and a protective glass in which an internal space layer isolated from the external space of the electronic photosensitive element is formed between the microlens array layer and the protective glass, an irregular nanoparticle structure layer, and an optical connection film layer connected to the irregular nanoparticle structure layer, and an antireflection film layer provided on at least one surface of the protective glass.

[0028] According to the camera module of the embodiment described in the previous paragraph, the protective glass may include a surface on the object side and a surface on the image side, and the antireflection film layer is provided on the surface on the object side and the surface on the image side of the protective glass.

[0029] According to the camera module of the embodiment described in the previous paragraph, the size of each microlens in the microlens array layer is Dp, and the condition 0.2 μm < Dp < 10 μm may be satisfied.

[0030] According to the camera module of the embodiment described in the previous paragraph, the number of a plurality of microlenses in the microlens array layer is PN, and the condition 7 million < PN < 1 billion may be satisfied.

[0031] According to the camera module of the embodiment described in the previous paragraph, a driving device for driving the electronic photosensitive element may be further provided.

Brief Description of Drawings

[0032] [Figure 1] It is a schematic diagram showing a camera module in a first example according to a first embodiment of the present disclosure. [Figure 2A] It is a schematic diagram showing an electronic photosensitive element in a first example according to a first embodiment of FIG. 1. [Figure 2B] It is a photograph taken with an electron microscope of a microlens array layer in a first example according to a first embodiment of FIG. 2A. [Figure 2C] It is another photograph taken with an electron microscope of a microlens array layer in a first example according to a first embodiment of FIG. 2A. [Figure 2D] It is a photograph taken with an electron microscope of a side cross-sectional view of an electronic photosensitive element in a first example according to a first embodiment of FIG. 2A. [Figure 3] It is a schematic diagram showing an antireflection film layer in a second example according to a first embodiment of FIG. 1. [Figure 4] It is a schematic diagram showing an antireflection film layer in a third example according to a first embodiment of FIG. 1. [[ID=3⑧]] [Figure 5] It is a schematic diagram showing an antireflection film layer in a fourth example according to a first embodiment of FIG. 1. [Figure 6]This is a schematic diagram showing a camera module according to a second embodiment of the contents of this disclosure. [Figure 7] This is a schematic diagram showing a camera module according to a third embodiment of the contents of this disclosure. [Figure 8A] This is a schematic diagram showing a camera module according to the fourth embodiment of the contents of this disclosure. [Figure 8B] Figure 8A is a schematic diagram showing an electronic photosensitive element according to the fourth embodiment. [Figure 9] This is a schematic diagram showing a camera module according to the fifth embodiment of the present disclosure. [Figure 10A] This is a schematic diagram showing an electronic device according to the sixth embodiment of the contents of this disclosure. [Figure 10B] Figure 10A is another schematic diagram showing an electronic device according to the sixth embodiment. [Figure 10C] Figure 10A is a schematic diagram of an image taken with the ultra-wide-angle camera module according to the sixth embodiment. [Figure 10D] Figure 10A is a schematic diagram of an image captured by a high-pixel camera module according to the sixth embodiment. [Figure 10E] Figure 10A is a schematic diagram of an image taken with the telephoto camera module according to the sixth embodiment. [Figure 11] This is a schematic diagram showing an electronic device according to the seventh embodiment of the present disclosure. [Figure 12A] This is a schematic diagram showing a vehicle tool according to the eighth embodiment of the disclosed information. [Figure 12B] Figure 12A is a top view showing a vehicle tool according to the eighth embodiment. [Figure 12C] Figure 12B is a partially enlarged schematic diagram showing a vehicle tool according to the eighth embodiment. [Figure 12D] Figure 12A is another schematic diagram showing a vehicle tool according to the eighth embodiment. [Figure 13A] This is a schematic diagram showing a camera module related to conventional technology. [Figure 13B] Figure 13A is a photograph showing the microlens array layer in the camera module. [Figure 13C] Figure 13A is a photograph of stray light generated by the microlens array layer in the camera module. [Figure 13D] Figure 13C is a schematic diagram showing a simulation of stray light intensity. [Modes for carrying out the invention]

[0033] This disclosure provides a camera module comprising an imaging lens module and an electronic photosensitive element. The electronic photosensitive element is provided on the imaging surface of the imaging lens module and includes a photoelectric conversion layer, a microlens array layer, a filter layer, and an anti-reflective coating layer. The photoelectric conversion layer is used to convert the optical signal of the imaging light into an electronic signal. The microlens array layer is used to concentrate the energy of the imaging light onto the photoelectric conversion layer. The filter layer is provided between the photoelectric conversion layer and the microlens array layer and is used to absorb light in a specific wavelength band in the imaging light. The anti-reflective coating layer is provided on at least one surface of the filter layer and the microlens array layer. The electronic photosensitive element provided with the anti-reflective coating layer can effectively remove stray light from the camera module, further enhance its light-gathering ability, and improve the transmittance of the filter layer, thereby enhancing the color reproducibility of the electronic photosensitive element. This can improve the image quality.

[0034] Specifically, the photoelectric conversion layer may include a photodiode for converting optical signals into electronic signals, and a circuit structure used for transmitting the electronic signals and gaining signal gain.

[0035] The filter layer may consist of filter materials of various wavelength ranges arranged in a two-dimensional array. Specifically, the filter layer may be arranged in an RGGB configuration or an RYYB configuration, but is not limited to these. As a result, the filter layer can transmit light in a specific wavelength range, such as red light, yellow light, green light, blue light, infrared light, or a combination of the above, but is not limited to these.

[0036] The anti-reflective coating layer may include an irregular nanoparticle structure layer and an optical connection layer connected to the irregular nanoparticle structure layer. Specifically, the irregular nanoparticle structure layer may be made of a metal oxide. More specifically, the irregular nanoparticle structure layer may be made of alumina (Al2O3). This helps to accelerate the process and facilitate mass production.

[0037] Alternatively, the anti-reflective coating layer may include an irregular nanostructure layer having multiple pore structures. This allows the anti-reflective coating layer to be manufactured by plasma etching.

[0038] Furthermore, the anti-reflective coating layer may include an optical multilayer laminated structure in which multiple coating layers with step differences in the refractive index of the materials are alternately laminated, and the number of alternating high and low refractive indices is at least three. Specifically, the coating layer with a high refractive index of the material may be made of alumina, and the coating layer with a low refractive index of the material may be made of silica (SiO2), but the disclosure is not limited thereto. Thus, the anti-reflective coating layer may be manufactured by chemical vapor deposition or physical vapor deposition.

[0039] The photosensitive element may further include protective glass. An internal space layer is formed between the protective glass and the microlens array layer, isolated from the external space of the photosensitive element. The anti-reflective film layer includes an irregular nanoparticle structure layer and an optical connection film layer connected to the irregular nanoparticle structure layer, and is provided on at least one surface of the protective glass. Specifically, the protective glass may be a plate glass, and the plate glass and the photosensitive chip are assembled on a substrate to form the photosensitive element, and the substrate may be a circuit board, but the disclosure is not limited thereto.

[0040] The anti-reflective coating layer may be provided on the object-side surface of the microlens array layer. This reduces the probability of generating large-angle non-imaging light.

[0041] An anti-reflective coating layer may be provided between the filter layer and the microlens array layer. This can enhance the color discrimination effect of the filter layer.

[0042] When the refractive index of the material of the irregular nanoparticle structure layer is Nc and the refractive index of the material of the optical connection film layer is Nf, the condition Nf < Nc may be satisfied. By using the irregular nanoparticle structure layer with a higher refractive index of the material as the outer layer and improving the transmittance, the reflection of the imaging light can be reduced.

[0043] When the height of the irregular nanoparticle structure layer is Hc, the film thickness of the optical connection film layer is Hf, and the total height of the antireflection film layer is H, the conditions Hf + Hc = H and Hf < Hc may be satisfied. Thereby, there is no gap between the top of the optical connection film layer and the bottom of the irregular nanoparticle structure layer, the two layers are adhered closely, and it has higher structural stability.

[0044] When the film thickness of the optical connection film layer is Hf, the condition 20 nm < Hf < 120 nm may be satisfied. By providing an optical connection film layer with a specific thickness range, the plating yield and the optical transmittance of the irregular nanoparticle structure layer can be improved simultaneously.

[0045] When the height of the irregular nanoparticle structure layer is Hc, the condition 120 nm < Hc < 350 nm may be satisfied. Thereby, a height range with optical alignment between the optical connection film layer and the optical connection film layer can be provided.

[0046] The top of the optical connection film layer may be partially in contact with the air. It has a fine hole structure as a whole in accordance with the irregular nanoparticle structure layer, and thereby, the optical alignment of the optical interface between the optical connection film layer and the irregular nanoparticle structure layer can be adjusted.

[0047] When the size of each microlens in the microlens array layer is Dp, the condition 0.2 μm < Dp < 10 μm may be satisfied. Thereby, a microlens size range considering both the light collection amount and the image analysis ability can be provided.

[0048] When the number of a plurality of microlenses in the microlens array layer is PN, it may satisfy the condition of 7 million < PN < 1 billion. Thereby, a camera module with high image resolution can be provided.

[0049] The camera module may further include a driving device for driving the electronic photosensitive element. By arranging the driving device, a driving ability to stabilize the image can be provided to the electronic photosensitive element. Thereby, an image stabilization effect is achieved on the electronic photosensitive element.

[0050] The protective glass may include an object side surface and an image side surface, and an antireflection film layer is provided on the object side surface and the image side surface of the protective glass. Thereby, the reflection on the surface and the secondary reflection inside the protective glass can be effectively reduced.

[0051] Each technical feature in the camera module of the above disclosure content can achieve the corresponding effect by being arranged in combination.

[0052] Specifically, the camera module may be a camera module for vehicles, a camera module for mobile devices, or a camera module for head-mounted devices, but the disclosure content is not limited thereto.

[0053] The anti-reflective coating layer may be plated at any stage in the manufacturing process of the electronic photosensitive element. Specifically, the anti-reflective coating layer may be plated on the photosensitive chip before it is attached to the circuit board, or it may be plated during the manufacturing stage of the entire wafer, or it may be plated during the manufacturing stage of crystal grain formation after the wafer has been cut, or the protective glass may be removed after the crystal grain packaging is complete, the crystal grains may be exposed to the external environment and then plated, followed by repackaging of the protective glass, and finally the subsequent processes may be performed on the photosensitive chip with the anti-reflective coating layer plated. Alternatively, the anti-reflective coating layer may be plated on the photosensitive chip after it has been attached to the circuit board, or the photosensitive chip may be attached to the circuit board in the form of crystal grains, then the photosensitive chip and circuit board as a whole may be plated, the coating area may be defined according to the shielding plate as needed, and finally the subsequent processes may be performed. Furthermore, the anti-reflective coating layer plating process involves, at the stage where the photosensitive chip is attached to the circuit board and the wire bonding process is completed, electrically connecting the photosensitive chip to the circuit board with gold wire, then plating the wire-bonded photosensitive chip and circuit board as a whole, and finally performing the subsequent processes. The process for the electronic photosensitive element may include, but is not limited to, die bonding, wire bonding, packaging, embedded injection molding of the circuit board, and cutting. The wafer manufacturing stages may include, but is not limited to, photosensitive layer processes, filter layer processes, microlens layer processes, optical film processes, protective coating layer processes, meta-lens processes, and light-shielding layer processes.

[0054] This disclosure provides an electronic device equipped with the aforementioned camera module.

[0055] This disclosure provides a vehicle tool equipped with the aforementioned camera module.

[0056] According to the above embodiment, specific embodiments and examples will be described in detail below with reference to the drawings.

[0057] <First Embodiment>

[0058] Please refer to Figure 1, a schematic diagram showing a camera module 10 in a first embodiment according to the first embodiment of the present disclosure. As shown in Figure 1, the camera module 10 comprises an imaging lens module (not shown in the drawing), an optical flat plate 120, and an electronic photosensitive element 130. The imaging lens module has an optical axis X. The optical flat plate 120 is provided between the imaging lens module and the electronic photosensitive element 130. The electronic photosensitive element 130 includes a substrate 131, a photoelectric conversion layer 132 (shown in Figure 2A), a microlens array layer 134, a filter layer 133 (shown in Figure 2A), and an anti-reflective coating layer 135 (shown in Figure 2A), and is provided on the imaging surface (not shown) of the imaging lens module. The photoelectric conversion layer 132 is provided on the object-side surface of the substrate 131. The photoelectric conversion layer 132 is used to convert the optical signal of the imaging light L into an electronic signal. The microlens array layer 134 is used to concentrate the energy of the imaging light L into the photoelectric conversion layer 132. The filter layer 133 is provided between the photoelectric conversion layer 132 and the microlens array layer 134 and is used to absorb light in a specific wavelength band in the imaging light L. When the imaging light enters the camera module, the electronic photosensitive element equipped with an anti-reflective coating layer effectively removes stray light from the camera module, further enhancing its light-gathering ability, improving the transmittance of the filter layer, and strengthening the color reproduction of the electronic photosensitive element. This improves the image quality.

[0059] Specifically, the imaging lens module may include a lens barrel 111 and a plurality of lenses 112 arranged sequentially within the lens barrel 111 from the object side to the image side of the imaging lens module. Furthermore, other optical elements such as light-shielding sheets, spacing rings, and fixing rings may be installed in the lens barrel 111 as needed, but these will not be described separately here.

[0060] Please refer to Figures 2A, 2B, 2C, and 2D together. Figure 2A is a schematic diagram showing the photosensitive element 130 in the first embodiment according to the first embodiment of Figure 1. Figure 2B is a photograph of the microlens array layer 134 in the first embodiment according to the first embodiment of Figure 2A, taken with an electron microscope. Figure 2C is another photograph of the microlens array layer 134 in the first embodiment according to the first embodiment of Figure 2A, taken with an electron microscope. Figure 2D is a photograph of a side cross-sectional view of the photosensitive element 130 in the first embodiment according to the first embodiment of Figure 2A, taken with an electron microscope. It is necessary to explain that in the first embodiment, the photosensitive element can be provided with four different structures of photosensitive elements 130, 230 (shown in Figure 3), 330 (shown in Figure 4), and 430 (shown in Figure 5), according to different optical design requirements, but the other elements and their configuration relationships in the first, second, third, and fourth embodiments of the first embodiment are all the same and will not be explained again.

[0061] The anti-reflective coating layer 135 is provided on at least one surface of the filter layer 133 and the microlens array layer 134 and includes an irregular nanoparticle structure layer 1351 and an optical connection coating layer 1352 connected to the irregular nanoparticle structure layer 1351. As shown in Figures 2A and 2D, in the first embodiment, the anti-reflective coating layer 135 is provided on the object-side surface of the microlens array layer 134. Furthermore, the optical connection coating layer 1352 of the anti-reflective coating layer 135 is provided on the object-side surface of the microlens array layer 134. Figures 2B and 2C show the structure of each microlens 1341 of the microlens array layer 134 as observed with an electron microscope at different magnifications.

[0062] Specifically, the irregular nanoparticle structure layer 1351 may be made of a metal oxide. In the first embodiment, the irregular nanoparticle structure layer 1351 may be made of alumina. Furthermore, the optical connection film layer 1352 may be made of silica. This helps to accelerate the process and facilitate mass production.

[0063] In the first embodiment, the top of the optical connection film layer 1352 is partially in contact with air. That is, the surface of the optical connection film layer 1352 that contacts the irregular nanoparticle structure layer 1351 has an exposed portion 1353 that is partially in contact with air. Furthermore, the entire irregular nanoparticle structure layer 1351 has a microporous structure. This allows for adjustment of the optical alignment of the photointerface between the optical connection film layer 1352 and the irregular nanoparticle structure layer 1351.

[0064] The filter layer 133 may consist of filter materials of various wavelength ranges arranged in a two-dimensional array. Specifically, the filter layer 133 may consist of RGGB or RYYB arrangements, but the disclosure is not limited thereto. In the first embodiment, the filter layer 133 consists of three filter materials, red, green, and blue, arranged in a two-dimensional array. This allows the filter layer 133 to pass light in a specific wavelength range.

[0065] In the first embodiment, the refractive index of the material of the irregular nanoparticle structure layer 1351 is Nc, the refractive index of the material of the optical connection film layer 1352 is Nf, the height of the irregular nanoparticle structure layer 1351 is Hc, the film thickness of the optical connection film layer 1352 is Hf, the total height of the anti-reflective film layer 135 is H, the size of each microlens 1341 in the microlens array layer 134 is Dp, and the number of microlenses 1341 in the microlens array layer 134 is PN, and the above parameters satisfy the conditions in Table 1 below. [Table 1]

[0066] Incidentally, the refractive index Nc of the irregular nanoparticle structure layer 1351 refers to the refractive index of the irregular nanoparticle structure layer 1351 made of alumina when it is represented in the form of an optical film layer. When the irregular nanoparticle structure layer 1351 forms a film in the form of an irregular nanoparticle structure, due to the shape of the structure, part of the volume is replaced by air, and the equivalent refractive index of the film changes towards 1.00 according to the density of the crystal grain structure.

[0067] Please also refer to Figure 3, which is a schematic diagram showing the electronic photosensitive element 230 in the second embodiment according to the first embodiment of Figure 1. As shown in Figure 3, in the second embodiment, the electronic photosensitive element 230 includes a substrate 231, a photoelectric conversion layer 232, a microlens array layer 234, a filter layer 233, and an anti-reflective film layer 235. The structure and configuration of the substrate 231, photoelectric conversion layer 232, filter layer 233, and microlens array layer 234 are the same as those of the substrate 131, photoelectric conversion layer 132, filter layer 133, and microlens array layer 134 in the first embodiment, and will not be explained separately here.

[0068] The filter layer 233 consists of three filter materials—red, yellow, and blue—arranged in a two-dimensional array. This allows the filter layer 233 to pass light within a specific wavelength range.

[0069] The anti-reflective coating layer 235 is provided on at least one surface of the filter layer 233 and the microlens array layer 234 and includes an irregular nanoparticle structure layer 2351 and an optical connection coating layer 2352 connected to the irregular nanoparticle structure layer 2351. Specifically, the irregular nanoparticle structure layer 2351 may be made of a metal oxide. In the second embodiment, the irregular nanoparticle structure layer 2351 may be made of alumina. Furthermore, the optical connection coating layer 2352 may be made of silica. This helps to accelerate the process and facilitate mass production.

[0070] Specifically, the anti-reflective coating layer 235 is provided between the filter layer 233 and the microlens array layer 234, and the optical connection coating layer 2352 is provided on the object-side surface of the filter layer 233. This enhances the color discrimination effect of the filter layer 233.

[0071] In the second embodiment, the refractive index of the material of the irregular nanoparticle structure layer 2351 is Nc, the refractive index of the material of the optical connection film layer 2352 is Nf, the height of the irregular nanoparticle structure layer 2351 is Hc, the film thickness of the optical connection film layer 2352 is Hf, the total height of the anti-reflective film layer 235 is H, the size of each microlens in the microlens array layer 234 is Dp, and the number of microlenses in the microlens array layer 234 is PN, and the above parameters satisfy the conditions in Table 2 below. [Table 2]

[0072] Please also refer to Figure 4, which is a schematic diagram showing the electronic photosensitive element 330 in the third embodiment according to the first embodiment of Figure 1. As shown in Figure 4, in the third embodiment, the electronic photosensitive element 330 includes a substrate 331, a photoelectric conversion layer 332, a microlens array layer 334, a filter layer 333, and an anti-reflective film layer (not shown in the drawing). The structure and configuration of the substrate 331, photoelectric conversion layer 332, filter layer 333, and microlens array layer 334 are the same as those of the substrate 131, photoelectric conversion layer 132, filter layer 133, and microlens array layer 134 in the first embodiment, and will not be explained separately here.

[0073] The filter layer 333 consists of three filter materials—red, green, and blue—arranged in a two-dimensional array. This allows the filter layer 333 to pass light within a specific wavelength range.

[0074] The anti-reflective coating layer is provided on at least one surface of the filter layer 333 and the microlens array layer 334 and includes an irregular nanostructure layer 335 having a plurality of pore structures. This allows the anti-reflective coating layer to be manufactured by plasma etching. Specifically, the anti-reflective coating layer is provided on the object-side surface of the microlens array layer 334. This reduces the probability of generating large-angle non-imaging light.

[0075] In the third embodiment, the overall structure of the photosensitive element 330 is a curved structure. Specifically, the object-facing surface of the photosensitive element 330 is a curved surface with a recessed aperture. The size of each microlens in the microlens array layer 334 is Dp, where Dp = 2.2 μm, and the number of microlenses in the microlens array layer 334 is PN, where PN = 70 million.

[0076] Please also refer to Figure 5, which is a schematic diagram showing the electronic photosensitive element 430 in the fourth embodiment according to the first embodiment of Figure 1. As shown in Figure 5, in the fourth embodiment, the electronic photosensitive element 430 includes a substrate 431, a photoelectric conversion layer 432, a microlens array layer 434, a filter layer 433, and an anti-reflective film layer 435. The structure and configuration of the substrate 431, photoelectric conversion layer 432, filter layer 433, and microlens array layer 434 are the same as those of the substrate 131, photoelectric conversion layer 132, filter layer 133, and microlens array layer 134 in the first embodiment, and will not be explained separately here.

[0077] The filter layer 433 consists of infrared filter material arranged in a two-dimensional array. This allows the filter layer 433 to pass light within a specific wavelength range.

[0078] The anti-reflective coating layer 435 is formed by alternately stacking a plurality of coating layers 4351 and 4352 having a step in the refractive index of the materials, and includes an optical multi-layer stacked structure (not shown in the drawings) in which the high and low refractive indices are alternated at least 3 times, and is provided on at least one surface of the filter layer 433 and the microlens array layer 434. Specifically, coating layer 4351 has a high refractive index, coating layer 4352 has a low refractive index, and the number of alternating high and low refractive indices is the number of interfaces formed between the coating layers 4351 and 4352. Specifically, coating layer 4351 with a high refractive index may be made of alumina, and coating layer 4352 with a low refractive index may be made of silica (SiO2), but the disclosure is not limited to these. In the fourth embodiment, the number of alternating high and low refractive indices of coating layers 4351 and 4352 is 7 times. Thus, the anti-reflective coating layer 435 may be manufactured by chemical vapor deposition or physical vapor deposition.

[0079] In the fourth embodiment, the size of each microlens in the microlens array layer 434 is Dp, where Dp = 1.7 μm, and the number of microlenses in the microlens array layer 434 is PN, where PN = 8 million.

[0080] <Second Embodiment>

[0081] Please refer to Figure 6, a schematic diagram showing a camera module 10a according to a second embodiment of the present disclosure. As shown in Figure 6, the camera module 10a comprises an imaging lens module (not shown in the drawing), an optical flat plate 120a, an electronic photosensitive element 130a, and an optical bending element 140a. The imaging lens module has an optical axis X. The optical flat plate 120a is provided between the imaging lens module and the electronic photosensitive element 130a. The electronic photosensitive element 130a is provided on the imaging surface (not shown) of the imaging lens module and may be any one of the electronic photosensitive elements 130, 230, 330, and 430 in the first to fourth embodiments of the first embodiment described above, but the present disclosure is not limited to these. The optical bending element 140a is provided on the object-side surface of the imaging lens module and is used to bend the imaging light from the optical path L1 to the optical axis X. When imaging light enters the camera module, the electronic photosensitive element equipped with an anti-reflective coating layer can effectively remove stray light from the camera module, thereby increasing its light-gathering ability and enhancing the color reproduction of the electronic photosensitive element.

[0082] Specifically, the imaging lens module includes a lens barrel 111a and a plurality of lenses 112a arranged sequentially within the lens barrel 111a from the object side to the image side of the imaging lens module. The lens barrel 111a may also be fitted with other optical elements as needed, such as a light-shielding sheet, spacing rings, and fixing rings, but these will not be described separately here. By arranging the imaging lens module, optical flat plate 120a, electronic photosensitive element 130a, and optical bending element 140a, the camera module 10a can capture images of distant objects and magnify them to a high magnification, thereby realizing the function of a telephoto camera.

[0083] <Third Embodiment>

[0084] Please refer to Figure 7, a schematic diagram showing a camera module 10b according to a third embodiment of the present disclosure. As shown in Figure 7, the camera module 10b includes an imaging lens module (not shown in the drawing), an optical flat plate 120b, and an electronic photosensitive element 130b. The imaging lens module has an optical axis X. The optical flat plate 120b is provided between the imaging lens module and the electronic photosensitive element 130b. The electronic photosensitive element 130b is provided on the imaging surface (not shown) of the imaging lens module and may be any one of the electronic photosensitive elements 130, 230, 330, and 430 in the first to fourth embodiments of the first embodiment described above, but the present disclosure is not limited to these. When imaging light enters the camera module, the electronic photosensitive element provided with an anti-reflective coating layer can effectively remove stray light from the camera module, thereby increasing the light-gathering ability and enhancing the color reproducibility of the electronic photosensitive element.

[0085] Specifically, the imaging lens module includes a lens barrel 111b and a plurality of lenses 112b provided inside the lens barrel 111b and arranged sequentially from the object side to the image side of the imaging lens module. The lens barrel 111b may also be fitted with other optical elements as needed, such as a light-shielding sheet, spacing rings, and fixing rings, but these will not be described separately here. By arranging the imaging lens module, optical flat plate 120b, and electronic photosensitive element 130b, a camera module 10b applicable to vehicle tools can be provided.

[0086] <Fourth Embodiment>

[0087] Please refer to Figure 8A, a schematic diagram showing a camera module 10c according to a fourth embodiment of the present disclosure. As shown in Figure 8A, the camera module 10c includes an imaging lens module (not shown in the drawing), an optical flat plate 120c, and an electronic photosensitive element 530. The imaging lens module has an optical axis X. The optical flat plate 120c is provided between the imaging lens module and the electronic photosensitive element 530. The electronic photosensitive element 530 is provided on the imaging surface (not shown) of the imaging lens module and includes a substrate 531, a photoelectric conversion layer 532 (shown in Figure 8B), a microlens array layer 534, a filter layer 533 (shown in Figure 8B), a protective glass 536, and two anti-reflective film layers 535 and 537 (shown in Figure 8B). The photoelectric conversion layer 532 is provided on the object-side surface of the substrate 531. The photoelectric conversion layer 532 is used to convert the optical signal of the imaging light L into an electronic signal. The microlens array layer 534 is used to concentrate the energy of the imaging light L into the photoelectric conversion layer 532. The filter layer 533 is provided between the photoelectric conversion layer 532 and the microlens array layer 534 and is used to absorb light in a specific wavelength band in the imaging light L. An internal space layer 5341 (shown in Figure 8B) is formed between the protective glass 536 and the microlens array layer 534, isolated from the external space of the photosensitive element 530. When imaging light enters the camera module, the photosensitive element with the anti-reflective coating layer effectively removes stray light from the camera module, further enhancing its light-gathering ability, improving the transmittance of the filter layer, and enhancing the color reproducibility of the photosensitive element. This improves the image quality.

[0088] Specifically, the imaging lens module may include a lens barrel 111c and a plurality of lenses 112c provided inside the lens barrel 111c so as to be arranged sequentially from the object side to the image side of the imaging lens module. In addition, other optical elements such as light-shielding sheets, spacing rings, and fixing rings may be installed in the lens barrel 111c as needed, but these will not be described separately here.

[0089] Please also refer to Figure 8B, which is a schematic diagram showing the electronic photosensitive element 530 according to the fourth embodiment shown in Figure 8A. As shown in Figure 8B, the anti-reflective coating layer 535 is provided on the object-side surface of the microlens array layer 534. The anti-reflective coating layer 537 is provided on at least one surface of the protective glass 536. The anti-reflective coating layer 535 includes an irregular nanoparticle structure layer 5351 and an optical connection coating layer 5352. The anti-reflective coating layer 537 includes an irregular nanoparticle structure layer 5371 and an optical connection coating layer 5372. The optical connection coating layers 5352 and 5372 are connected to the irregular nanoparticle structure layers 5351 and 5371, respectively.

[0090] Specifically, the irregular nanoparticle structural layers 5351 and 5371 may be manufactured from a metal oxide. In a fourth embodiment, the irregular nanoparticle structural layers 5351 and 5371 may be manufactured from alumina. Furthermore, the optical connection film layers 5352 and 5372 may be manufactured from silica. This helps to accelerate the process and enable mass production.

[0091] Furthermore, the protective glass 536 includes an object-side surface and an image-side surface, and the anti-reflective coating layer 537 is provided on both the object-side and image-side surfaces of the protective glass 536. This effectively reduces surface reflection and internal secondary reflection of the protective glass 536.

[0092] In a fourth embodiment, the protective glass 536 may be a plate glass, and the plate glass and the photosensitive chip may be assembled on a substrate 531 to form an electronic photosensitive element 530, and the substrate 531 may be a circuit board, but the disclosure is not limited thereto.

[0093] The filter layer 533 consists of three filter materials—red, green, and blue—arranged in a two-dimensional array. This allows the filter layer 533 to pass light within a specific wavelength range.

[0094] In the fourth embodiment, the refractive index of the material of the irregular nanoparticle structure layers 5351 and 5371 is Nc, the refractive index of the material of the optical connection film layers 5352 and 5372 is Nf, the height of the irregular nanoparticle structure layers 5351 and 5371 is Hc, the film thickness of the optical connection film layers 5352 and 5372 is Hf, the total height of the anti-reflective film layer 535 is H, the size of each microlens in the microlens array layer 534 is Dp, and the number of microlenses in the microlens array layer 534 is PN, and the above parameters satisfy the conditions in Table 3 below. [Table 3]

[0095] <Fifth Embodiment>

[0096] Please refer to Figure 9, a schematic diagram showing a camera module 10d according to the fifth embodiment of this disclosure. As shown in Figure 9, the camera module 10d comprises an imaging lens module 110d, an optical flat plate 120d, an electronic photosensitive element 130d, and four drive devices 140d. The imaging lens module 110d has an optical axis X. The optical flat plate 120d is provided between the imaging lens module 110d and the electronic photosensitive element 130d. The electronic photosensitive element 130d is provided on the imaging surface (not shown) of the imaging lens module and may be any one of the electronic photosensitive elements 130, 230, 330, 430 in the first to fourth embodiments of the first embodiment and the electronic photosensitive element 530 in the fourth embodiment, but this disclosure is not limited to these. The drive devices 140d are used to drive the electronic photosensitive element 130d. By arranging the drive unit 140d, the electronic photosensitive element 130d can be provided with the driving capability to stabilize the image. This allows the electronic photosensitive element 130d to achieve an image stabilization effect.

[0097] <Sixth Embodiment>

[0098] Please refer to Figures 10A and 10B, where Figure 10A is a schematic diagram showing an electronic device 20 according to a sixth embodiment of the present disclosure, and Figure 10B is another schematic diagram showing the electronic device 20 according to the sixth embodiment of Figure 10A. As can be seen from Figures 10A and 10B, the electronic device 20 of the sixth embodiment is a smartphone equipped with at least one camera module, and in the sixth embodiment, there are three camera modules, these three camera modules being an ultra-wide-angle camera module 22, a high-pixel camera module 23, and a telephoto camera module 24, respectively. Furthermore, the camera modules may be any one of the camera modules of the first to fifth embodiments described above, but the present disclosure is not limited thereto. This helps to meet the demands for mass production and appearance requirements of camera modules mounted in the current electronic device market.

[0099] Furthermore, the user enters shooting mode via the user interface 21 of the electronic device 20, and the user interface 21 according to the sixth embodiment may be a touchscreen, used for displaying the screen, having touch functionality, and can be used to manually adjust the shooting angle and switch between different camera modules. At this time, the camera module focuses imaging light onto an electronic photosensitive element and outputs electronic signals related to the image to an image signal processor (ISP) 25.

[0100] The electronic device 20 may further include, but is not limited to, a display, a control unit, a storage unit, a temporary memory unit (RAM), a read-only memory unit (ROM), or a combination thereof.

[0101] Figure 10C is a schematic diagram of an image taken with the ultra-wide-angle camera module 22 according to the sixth embodiment of Figure 10A. As can be seen from Figure 10C, the ultra-wide-angle camera module 22 can capture images of a wide area and has the function of capturing more scenery.

[0102] Figure 10D is a schematic diagram of an image captured by the high-pixel camera module 23 according to the sixth embodiment of Figure 10A. As can be seen from Figure 10D, the high-pixel camera module 23 can capture images with a certain range and high pixel count, and is equipped with high resolution and low distortion functions.

[0103] Figure 10E is a schematic diagram of an image taken by the telephoto camera module 24 according to the sixth embodiment of Figure 10A. As can be seen from Figure 10E, the telephoto camera module 24 is equipped with a high-magnification function and can capture images of distant objects and enlarge them to high magnification.

[0104] As can be seen from Figures 10C to 10E, images can be captured using camera modules with different focal lengths, and the zoom function can be implemented in the electronic device 20 according to the image processing technology.

[0105] <Seventh Embodiment>

[0106] Please refer to Figure 11, a schematic diagram showing an electronic device 30 according to the seventh embodiment of this disclosure. As can be seen from Figure 11, the electronic device 30 of the seventh embodiment is a smartphone equipped with at least one camera module, and in the seventh embodiment, there are nine camera modules, each consisting of two ultra-wide-angle camera modules 31, two wide-angle camera modules 32, two high-pixel camera modules 33, two telephoto camera modules 34, and one TOF module 35 (Time-Of-Flight). Furthermore, the camera modules may be any one of the camera modules of the first to fifth embodiments described above, but this disclosure is not limited to these. This helps to meet the demands for mass production and appearance requirements of camera modules mounted in the current electronic device market.

[0107] Depending on the camera specifications of the electronic device 30, the electronic device 30 may further include at least one auxiliary optical element (not shown in the drawings). In the seventh embodiment, the auxiliary optical element is a flash module 36. The flash module 36 can be used to compensate for color temperature, thereby providing a better shooting experience in conjunction with the camera module of this disclosure.

[0108] <Eighth Embodiment>

[0109] Please refer to Figure 12A, a schematic diagram showing a vehicle tool 40 according to the eighth embodiment of this disclosure. As shown in Figure 12A, the vehicle tool 40 comprises a plurality of camera modules 41. The camera modules 41 may be any one of the first to fifth embodiments described above, but this disclosure is not limited to these.

[0110] In the eighth embodiment, the two camera modules 41 are each located below the left and right rearview mirrors of the vehicle tool 40 and capture image information at the viewing angle θ. Specifically, the viewing angle θ may satisfy the condition 40 degrees < θ < 90 degrees. This makes it possible to capture image information within the lane range on both the left and right sides.

[0111] Please refer together to Figures 12B, 12C, and 12D, where Figure 12B is a top view showing the vehicle tool 40 according to the eighth embodiment of Figure 12A, Figure 12C is a partially enlarged schematic diagram showing the vehicle tool 40 according to the eighth embodiment of Figure 12B, and Figure 12D is another schematic diagram showing the vehicle tool 40 according to the eighth embodiment of Figure 12A. As shown in Figures 12B and 12C, two camera modules 41 may be provided in the space within the vehicle tool 40. Specifically, the two camera modules 41 are provided in positions close to the rearview mirror and close to the rear window, respectively. Furthermore, the two camera modules 41 may be provided on the non-mirror surfaces of the left and right rearview mirrors of the vehicle tool 40, respectively. As shown in Figure 12D, the arrangement of the camera modules 41 helps the driver to acquire external spatial information other than the driver's cabin, for example, external spatial information S1, S2, S3, S4, but the disclosure is not limited to these. This allows for a wider field of view, reducing blind spots and further improving driving safety.

[0112] While the embodiments of this invention have been disclosed as described above, this does not limit the invention, and those skilled in the art may make minor changes or modifications as long as they do not deviate from the spirit and scope of the invention. Accordingly, the scope of protection of this invention shall be limited to what is specified in the subsequent claims. [Explanation of Symbols]

[0113] 10, 10a, 10b, 10c, 10d, 41 Camera Modules 111, 111a, 111b, 111c Telescope tubes 112, 112a, 112b, 112c lenses 120, 120a, 120b, 120c, 120d Optical flat plates 130, 130d, 230, 330, 430, 530 Electronic photosensitive element 131, 231, 331, 431, 531 circuit boards 132, 232, 332, 432, 532 Photoelectric conversion layer 133, 233, 333, 433, 533 filter layers 134, 234, 334, 434, 534 microlens array layers 1341 Microlens 135, 235, 435, 535, 537 Anti-reflection coating layer 1351, 2351, 5351, 5371 Irregular nanoparticle structure layer 1352, 2352, 5352, 5372 Optical connection film layer 140a Optical bending element 140d drive unit 20, 30 Electronic equipment 21 User Interface 22, 31 Ultra-wide-angle camera module 23, 33 High-Pixel Camera Module 24, 34 Telephoto Camera Module 32 Wide-angle camera module 335 Irregular nanostructure layer 35 TOF modules 36 Flash Modules 40 Vehicle Tools 4351, 4352 Membrane layer 536 Protective Glass L imaging light L1, L2 optical path H Total height of anti-reflective coating layer Height of the irregular nanoparticle structure layer of Hc Hf Optical Connecting Layer Thickness S1, S2, S3, S4 External spatial information X optical axis θ viewing angle

Claims

1. Imaging lens module and An image sensor provided on the imaging surface of the imaging lens module, Equipped with, The aforementioned image sensor is A photoelectric conversion layer for converting the optical signal of imaging light into an electronic signal, A microlens array layer for concentrating the energy of the imaging light on the photoelectric conversion layer, An optical filter layer is provided between the photoelectric conversion layer and the microlens array layer, and is used to absorb light in a specific wavelength band in the imaging light. A protective glass, and an internal space layer formed between the protective glass and the microlens array layer, which is isolated from the external space of the image sensor, Two anti-reflective layers, one of which is disposed on at least one surface of the optical filter layer and the microlens array layer, the other anti-reflective layer being disposed between the optical filter layer and the microlens array layer, and the other anti-reflective layer being disposed on at least one surface of the protective glass. Each of the two anti-reflective layers includes an optical multilayer structure formed by stacking multiple film layers having different refractive indices, and the multiple film layers are stacked at least three times so that the refractive indices alternate. The two anti-reflective layers and Having, Camera module.

2. The size Dp of each microlens in the microlens array layer satisfies 0.2 μm < Dp < 10 μm. The camera module according to claim 1.

3. The size Dp satisfies 1.7 μm < Dp < 10 μm, The camera module according to claim 2.

4. The number of microlenses PN in the aforementioned microlens array layer satisfies 7 million < PN < 1 billion. The camera module according to claim 1.

5. Of the aforementioned multiple film layers, the film layer with a relatively high refractive index is composed of alumina. The camera module according to claim 1.

6. Of the aforementioned multiple film layers, the film layer with a relatively low refractive index is composed of silica. The camera module according to claim 1.

7. A drive device for driving the aforementioned image sensor Furthermore, The camera module according to claim 1.

8. An electronic device comprising the camera module described in claim 1.

9. A vehicle tool comprising the camera module described in claim 1.

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