Structure for light-emitting panel and method for manufacturing the same

Abstract

Provided is a method for producing a structure for light emitting panels, the method making it possible to form a partition wall with excellent resolution. This method for producing a structure for light emitting panels comprises: a step for disposing stacked resin layers, which include a first photosensitive thermosetting resin layer and a second photosensitive thermosetting resin layer, on a base material having a pattern conductor; a step for applying active energy rays to the stacked resin layers so as to expose the stacked resin layers to light and subsequently developing the stacked resin layers so as to form a pattern image on the base material; a step for forming a multilayer partition wall, which comprises a first partition wall and a second partition wall, on the base material by subjecting the pattern image to a heat treatment; and a step for disposing a semiconductor light emitting element, which is connected to the pattern conductor, in a recess that is partitioned by the multilayer partition wall. The first photosensitive thermosetting resin layer is disposed in contact with the base material, and the second photosensitive thermosetting resin layer is disposed on the first photosensitive thermosetting resin layer so as to be separated from the base material. The first partition wall is disposed in contact with the base material, and the second partition wall is disposed on the first partition wall so as to be separated from the base material. The first partition wall has an average reflectance of 30% or more in the wavelength range of 430 nm to 750 nm (inclusive), and the second partition wall has an average absorbance of 0.5 to 10 (inclusive) in the wavelength range of 430 nm to 750 nm (inclusive).

Description

[Technical Field]

[0001] The present invention relates to a structure for light-emitting panels and a method for manufacturing the same. [Background technology]

[0002] As a flat panel display, microLED displays are known, which are constructed by arranging small light-emitting elements on a substrate. For example, Japanese Patent Application Publication No. 2020-205417 proposes a microLED display device in which a partition wall is formed on a microLED array substrate, having a light-shielding portion that is in the shape of an inverted taper or a T shape and a reflective portion provided on the side surface of the light-shielding portion. [Overview of the project] [Problems that the invention aims to solve]

[0003] One aspect of the present invention aims to provide a method for manufacturing a light-emitting panel structure that can form partitions with excellent resolution. [Means for solving the problem]

[0004] The present invention encompasses the following embodiments. [1] A method for manufacturing a light-emitting panel structure, comprising: arranging a laminated resin layer including a first photosensitive thermosetting resin layer and a second photosensitive thermosetting resin layer on a substrate having a pattern conductor; exposing the laminated resin layer by applying an active energy ray, then developing it to form a pattern image on the substrate; heat-treating the pattern image to form a laminated partition wall including a first partition wall and a second partition wall on the substrate; and arranging a semiconductor light-emitting element connected to the pattern conductor in a recess partitioned by the laminated partition wall, wherein the first photosensitive A method for manufacturing a light-emitting panel structure, wherein a photothermosetting resin layer is disposed in contact with the substrate, a second photosensitive thermosetting resin layer is disposed on the first photosensitive thermosetting resin layer at a distance from the substrate, a first partition wall is disposed in contact with the substrate, a second partition wall is disposed on the first partition wall at a distance from the substrate, the first partition wall has an average reflectance of 30% or more in the wavelength range of 430 nm to 750 nm, and the second partition wall has an average absorbance of 0.5 or more to 10 in the wavelength range of 430 nm to 750 nm.

[0005] [2] The method for manufacturing a light-emitting panel structure according to [1], wherein the first photosensitive thermosetting resin layer comprises a white pigment, an alkali-soluble resin, and a thermosetting resin, and the second photosensitive thermosetting resin layer comprises a colorant, an alkali-soluble resin, and a thermosetting resin.

[0006] [3] The laminated resin layer is arranged by a forming method comprising: applying a first photosensitive thermosetting resin composition to the substrate to form a first photosensitive thermosetting resin layer; and applying a second photosensitive thermosetting resin composition to the first photosensitive thermosetting resin layer to form a second photosensitive thermosetting resin layer; the manufacturing method for a light-emitting panel structure according to [1] or [2].

[0007] [4] The laminated resin layer is arranged by a forming method comprising laminating a dry film on the substrate, which is made up of a first photosensitive thermosetting resin layer, a second photosensitive thermosetting resin layer, and a support film, and removing the support film.

[0008] [5] The method for manufacturing a light-emitting panel structure according to any one of [1] to [4], wherein the thickness in the direction perpendicular to the main surface of the base material of the first partition wall is 0.5 μm or more and 50 μm or less, and the thickness in the direction perpendicular to the main surface of the base material of the second partition wall is 0.5 μm or more and 10 μm or less.

[0009] [6] A light-emitting panel structure including a base material having a pattern conductor, a laminated partition wall including a first partition wall and a second partition wall disposed on the base material, and a semiconductor light-emitting element disposed in a recess partitioned by the laminated partition wall and connected to the pattern conductor. The first partition wall is disposed in contact with the base material and has an average reflectance of 30% or more in a wavelength range of 430 nm or more and 750 nm or less. The second partition wall is disposed on the first partition wall and separated from the base material, and has an average absorbance of 0.5 or more and 10 or less in a wavelength range of 430 nm or more and 750 nm or less.

[0010] [7] The light-emitting panel structure according to [6], wherein the thickness in the direction perpendicular to the main surface of the base material of the first partition wall is 0.5 μm or more and 50 μm or less, and the thickness in the direction perpendicular to the main surface of the base material of the second partition wall is 0.5 μm or more and 10 μm or less.

Advantages of the Invention

[0011] According to one aspect of the present invention, it is possible to provide a method for manufacturing a light-emitting panel structure capable of forming partition walls with excellent resolution.

Brief Description of the Drawings

[0012] [Figure 1] It is a cross-sectional view showing an example of a light-emitting panel structure.

Embodiments for Carrying Out the Invention

[0013] In this specification, the term "process" includes not only independent processes but also processes that cannot be clearly distinguished from other processes, as long as their intended purpose is achieved. Furthermore, the content of each component in a composition means the total amount of multiple substances present in the composition, unless otherwise specified, if multiple substances corresponding to each component exist in the composition. In addition, the upper and lower limits of the numerical ranges described herein can be arbitrarily selected and combined from the numerical values ​​exemplified as numerical ranges. The solid content in a composition and its components means the residue after removing volatile components (e.g., organic solvents) from the composition and its components. Embodiments of the present invention will now be described based on the drawings. However, the embodiments shown below are illustrative examples of a light-emitting panel structure and a method for manufacturing the same to embody the technical concept of the present invention, and the present invention is not limited to the light-emitting panel structure and method for manufacturing the same shown below.

[0014] Manufacturing method for structures for light-emitting panels A method for manufacturing a light-emitting panel structure includes a first step of arranging a laminated resin layer including a first photosensitive thermosetting resin layer and a second photosensitive thermosetting resin layer on a substrate having a pattern conductor; a second step of exposing the laminated resin layer to active energy rays, developing it, and forming a pattern image on the substrate; a third step of heat-treating the pattern image to form a laminated partition wall including a first partition wall and a second partition wall on the substrate; and a fourth step of arranging a semiconductor light-emitting element connected to a pattern conductor in a recess partitioned by the laminated partition wall. In the first step, the first photosensitive thermosetting resin layer is arranged in contact with the substrate, and the second photosensitive thermosetting resin layer is arranged on the first photosensitive thermosetting resin layer at a distance from the substrate. The first partition wall formed in the third step is arranged in contact with the substrate and has an average reflectance of 30% or more in the wavelength range of 430 nm to 750 nm. Furthermore, the second partition wall is positioned on the first partition wall at a distance from the substrate, and its average absorbance in the wavelength range of 430 nm to 750 nm is between 0.5 and 10.

[0015] In the manufacturing method for light-emitting panel structures, the laminated resin layers can be exposed to active energy rays and then developed to form laminated partitions with excellent resolution. This is thought to be because, for example, the second photosensitive thermosetting resin layer, which has relatively low reflectivity, suppresses reflection in the first photosensitive thermosetting resin layer, which has high reflectivity. Furthermore, since the semiconductor light-emitting elements are placed after the laminated partitions are formed in advance, it becomes possible to position the semiconductor light-emitting elements with high precision. Moreover, because the position and height of the partitions can be controlled with high precision, light-emitting panel structures that achieve a good color balance and high current efficiency can be efficiently manufactured.

[0016] First step In the first step, a laminated resin layer including a first photosensitive thermosetting resin layer and a second photosensitive thermosetting resin layer is placed on a substrate having a patterned conductor. Examples of substrates on which the laminated resin layer is placed include silicon wafers, silicon oxide wafers, glass substrates, epoxy glass substrates, etc. The thickness of the substrate may be, for example, 0.1 mm or more and 2.5 mm or less. The substrate has a patterned conductor that is connected to a semiconductor light-emitting element. The patterned conductor may be circuit-formed to supply power to the semiconductor light-emitting element. The material used to form the patterned conductor may be, for example, copper. The patterned conductor may also be treated with an antioxidant coating of gold, tin, silver, nickel / gold, nickel / palladium / gold, etc.

[0017] The laminated resin layer placed on the substrate includes a first photosensitive thermosetting resin layer and a second photosensitive thermosetting resin layer. The first photosensitive thermosetting resin layer is placed in contact with the substrate, and the second photosensitive thermosetting resin layer is placed on the first photosensitive thermosetting resin layer, separated from the substrate. The first photosensitive thermosetting resin layer and the second photosensitive thermosetting resin layer may be directly laminated in contact with each other, or they may be laminated via other layers. Furthermore, the first photosensitive thermosetting resin layer may be formed from a first photosensitive thermosetting resin composition, and the second photosensitive thermosetting resin layer may be formed from a second photosensitive thermosetting resin composition. Details of the first photosensitive thermosetting resin composition and the second photosensitive thermosetting resin composition will be described later.

[0018] The thickness of the first photosensitive thermosetting resin layer in the laminated resin layer may be, for example, 0.5 μm or more and 50 μm or less, preferably 5 μm or more, more preferably 10 μm or more. It may also be preferably 30 μm or less, more preferably 20 μm or less. The thickness of the second photosensitive thermosetting resin layer may be, for example, 0.5 μm or more and 10 μm or less, preferably 2 μm or more, more preferably 3 μm or more. It may also be preferably 6 μm or less, more preferably 5 μm or less. The ratio of the thickness of the first photosensitive thermosetting resin layer to the thickness of the second photosensitive thermosetting resin layer may be, for example, 0.5 or more and 10 or less, preferably 1 or more and 5 or less. Here, the thickness of the first photosensitive thermosetting resin layer means the thickness in the direction perpendicular to the main surface of the substrate, and the same applies to the thickness of the second photosensitive thermosetting resin layer and the laminated resin layer.

[0019] One method for arranging the laminated resin layers is to first apply a first photosensitive thermosetting resin composition onto a substrate to form a first photosensitive thermosetting resin layer, and then apply a second photosensitive thermosetting resin composition to form a second photosensitive thermosetting resin layer. The first photosensitive thermosetting resin layer may be a dried film formed by drying the applied first photosensitive thermosetting resin composition by heating, vacuum drying, etc., or it may be a semi-cured film obtained by heat treatment after drying. The second photosensitive thermosetting resin layer may also be a dried film formed by drying the applied second photosensitive thermosetting resin composition by heating, vacuum drying, etc., or it may be a semi-cured film obtained by heat treatment after drying. Furthermore, the laminated resin layers may be arranged by simultaneously applying two layers, with the first photosensitive thermosetting resin composition as the lower layer and the second photosensitive thermosetting resin composition as the upper layer.

[0020] Methods for applying the first photosensitive thermosetting resin composition or the second photosensitive thermosetting resin composition include dip coating, flow coating, roll coating, bar coating, screen printing, curtain coating, die coating, and spin coating. Methods for drying the first photosensitive thermosetting resin composition or the second photosensitive thermosetting resin composition include using a heat source equipped with a steam-heated air heating method, such as a hot air circulation drying oven, an IR oven, a hot plate, or a convection oven, to bring hot air in a countercurrent contact with the dryer, and blowing the hot air onto the support from a nozzle.

[0021] Furthermore, a dry film, which has a resin composition layer on a film, may be used to arrange the laminated resin layer on the substrate. The laminated resin layer can be arranged by sequentially laminating a first photosensitive thermosetting resin composition and a second photosensitive thermosetting resin composition, each in dry film form, onto the substrate. Alternatively, a dry film in which the first photosensitive thermosetting resin composition and the second photosensitive thermosetting resin composition are formed into a two-layer structure may be laminated onto the substrate.

[0022] Commercially available vacuum heating and pressurizing laminators can be used as laminators. Lamination using a laminator can be performed continuously. Alternatively, the lamination process can be carried out using separate devices. In this case, in addition to vacuum laminators, roll laminators, vacuum roll laminators, vacuum presses, etc., can also be used. Standard commercially available vacuum presses can be used, such as multi-stage presses, multi-stage vacuum presses, quick presses, continuous molding machines, and autoclave molding machines. The operating conditions for the laminators, etc., can be, for example, 60°C to 130°C, pressure 0.1 MPa to 0.7 MPa, heating and pressurizing time 1 second to 90 seconds, vacuum degree 10 Pa to 10,000 Pa, and vacuum time 1 second to 90 seconds.

[0023] The film constituting the dry film may be a support film or a protective film. A plastic film that can be peeled from the resin composition layer can be used as the film. There are no particular restrictions on the film thickness, but it may be appropriately selected within a range of, for example, 10 μm to 150 μm. If the resin composition layer consists of two layers, the interfaces between each layer may be flush from the viewpoint of coating strength.

[0024] A dry film is formed in which at least one side of a resin composition layer is supported or protected by a film. The resin composition layer of the dry film may consist of either a first photosensitive thermosetting resin composition or a second photosensitive thermosetting resin composition, or it may be formed by laminating a second photosensitive thermosetting resin layer formed from the second photosensitive thermosetting resin composition on a film, and a first photosensitive thermosetting resin layer formed from the first photosensitive thermosetting resin composition on the second photosensitive thermosetting resin layer. A dry film can be manufactured, for example, as follows: First, the resin composition constituting the resin composition layer is diluted with an organic solvent as needed to adjust to an appropriate viscosity and applied to a support film (also called a carrier film) using a known method such as a comma coater, according to a conventional method. Then, by drying at a temperature of 50°C to 140°C for 1 to 30 minutes, for example, a dry film can be produced in which a resin composition layer, which is a dried coating of the resin composition, is formed on the support film. When the resin composition layer is formed from multiple resin compositions with different properties, the resin composition layers can be formed on the support film in the order of the resin composition forming the upper layer, as described above. A peelable protective film (cover film) can be further laminated on this dry film for purposes such as preventing dust from adhering to the surface of the coating. Conventional plastic films can be used as the support film and protective film, and it is preferable that the protective film has an adhesive force that is weaker than the adhesive force between the resin layer and the support film when the protective film is peeled off.

[0025] Second process In the second step, the laminated resin layer formed on the substrate in the first step is exposed to active energy rays and then developed to form a pattern image with a desired shape on the substrate. By exposing the laminated resin layer, which includes a first photosensitive thermosetting resin layer and a second photosensitive thermosetting resin layer, to active energy rays, a pattern image can be formed with high precision, which can form a laminated partition wall including a first partition wall with a high average reflectivity and a second partition wall with a high average absorbance. Furthermore, since the second photosensitive thermosetting resin layer can suppress the reflection of active energy rays, a pattern image can be formed with high resolution.

[0026] By applying active energy rays in a patterned manner and exposing the material, the exposed areas of the laminated resin layer are photocured, forming a patterned image. The exposure machine used for irradiating with active energy rays can be any device equipped with a high-pressure mercury lamp, ultra-high-pressure mercury lamp, metal halide lamp, mercury short-arc lamp, etc., that irradiates ultraviolet light in the wavelength range of 350 nm to 450 nm. The mask used for forming the patterned image may be a negative-type mask. Furthermore, a direct imaging device (for example, a direct imaging device that directly irradiates with active energy rays based on CAD data from a computer to draw an image) can also be used for irradiating with active energy rays. The light source for the direct imaging device can be any device that uses light with a maximum wavelength in the range of 350 nm to 410 nm. The exposure amount for patterned image formation varies depending on the film thickness, but for example, 20 mJ / cm² is appropriate. 2 More than 800mJ / cm 2 The following may be included, preferably 20 mJ / cm² 2 More than 600mJ / cm 2 It may be within the following range.

[0027] Development methods include dipping, showering, spraying, and brushing. As for the developing solution, alkaline aqueous solutions such as inorganic bases (potassium hydroxide, sodium hydroxide, sodium carbonate, potassium carbonate, sodium phosphate, sodium silicate, etc.) and organic bases (ammonia, amines, tetramethylammonium hydroxide, etc.) can be used.

[0028] Third step In the third step, the pattern image formed on the substrate is heat-treated to form a laminated partition wall including the first and second partition walls on the substrate. In the third step, the thermosetting resin contained in the pattern image hardens, forming the laminated partition wall including the first and second partition walls. Since the hardening of the thermosetting resin is a ring-opening reaction, such as that of epoxy resin, strain and hardening shrinkage can be suppressed compared to cases where hardening proceeds by a photoradical reaction.

[0029] The temperature of the heat treatment in the third step may be, for example, 120°C or higher, preferably 150°C to 190°C. The heat treatment time may be, for example, 20 minutes to 180 minutes, preferably 50 minutes to 100 minutes. The heat treatment can be carried out using, for example, a hot air circulation drying oven or an IR oven.

[0030] The laminated partition wall formed in the third step includes a first partition wall and a second partition wall. The first partition wall is positioned in contact with the substrate, and the second partition wall is positioned on the first partition wall at a distance from the substrate. The first and second partition walls may be laminated in contact with each other, or they may be laminated with an intermediate gap wall in between. The thickness of the first partition wall in the direction perpendicular to the main surface of the substrate (hereinafter also referred to as the "height of the first partition wall") may be, for example, 0.5 μm or more and 50 μm or less, preferably 5 μm or more, more preferably 10 μm or more, and also preferably 30 μm or less, and more preferably 20 μm or less. The thickness of the second partition wall in the direction perpendicular to the main surface of the substrate (hereinafter also referred to as the "height of the second partition wall") may be, for example, 0.5 μm or more and 10 μm or less, preferably 2 μm or more, more preferably 3 μm or more, and also preferably 6 μm or less, and more preferably 5 μm or less. The ratio of the height of the second partition to the sum of the heights of the first and second partitions may be, for example, 0.1 or more and 0.8 or less, preferably 0.15 or more, more preferably 0.2 or more, also preferably 0.6 or less, more preferably 0.4 or less, and even more preferably 0.3 or less.

[0031] In the third step, multiple recesses separated by laminated partitions may be formed on the substrate. The arrangement pattern of the recesses on the substrate may be, for example, a grid pattern.

[0032] The first partition wall has an average reflectance of 30% or more in the wavelength range of 430 nm to 750 nm, preferably 50% or more, and more preferably 60% or more. The average reflectance of the first partition wall may also be, for example, 99% or less. The average reflectance of the first partition wall is measured, for example, as follows: A resin composition layer with a thickness of 10 μm is formed from the first photosensitive thermosetting resin composition forming the first partition wall, and light with a peak wavelength in the wavelength range of 350 nm to 450 nm is applied at a rate of 300 mJ / cm². 2 After photocuring by irradiation, the material is developed with 1% by mass sodium carbonate to remove unexposed areas. After drying, a heat treatment is performed at 150°C for 60 minutes to obtain a cured product. The average reflectance of the obtained cured product is calculated as the arithmetic mean of the reflectance measured at 1 nm intervals over the wavelength range of 430 nm to 750 nm using a spectrophotometer. That is, an average reflectance of 30% or more in the wavelength range of 430 nm to 750 nm means that the average value of the reflectance in the wavelength range of 430 nm to 750 nm is 30% or more. Furthermore, the first partition may have a reflectance of 30% or more over the entire wavelength range of 430 nm to 750 nm.

[0033] The second septum has an average absorbance of 0.5 to 10 in the wavelength range of 430 nm to 750 nm, preferably 0.8 or higher, and more preferably 1.0 or higher. The average absorbance of the second septum is also preferably 5.0 or lower. The average absorbance of the second septum is measured, for example, as follows: A resin composition layer with a thickness of 3 μm is formed from the second photosensitive thermosetting resin composition forming the second septum, and light with a peak wavelength in the wavelength range of 350 nm to 450 nm is applied at a density of 300 mJ / cm². 2After photocuring by irradiation, the material is developed with 1% by mass sodium carbonate to remove unexposed areas. After drying, a heat treatment is performed at 150°C for 60 minutes to obtain a cured product. The absorbance of the obtained cured product is measured at 1 nm intervals in the wavelength range of 430 nm to 750 nm using a UV-Vis spectrophotometer, and the average absorbance is calculated as the arithmetic mean of the measured absorbances.

[0034] Fourth step In the fourth step, semiconductor light-emitting elements are placed in the recesses partitioned by the laminated partitions formed in the third step, and the semiconductor light-emitting elements are electrically connected to the pattern conductors of the substrate. This results in a structure for a light-emitting panel in which semiconductor light-emitting elements are placed in the recesses partitioned by the laminated partitions, achieving good color balance and high current efficiency. Examples of semiconductor light-emitting elements include light-emitting diodes and semiconductor lasers. The emission wavelength of the semiconductor light-emitting elements can be selected as needed. For example, a combination of semiconductor light-emitting elements emitting red, green, and blue light may be used.

[0035] In the fourth step, the semiconductor light-emitting element is positioned such that it is electrically connected to the pattern conductor exposed in the recess, for example. Specifically, the semiconductor light-emitting element and the pattern conductor are connected by, for example, placing the semiconductor light-emitting element in the recess and performing a heat treatment.

[0036] The heat treatment temperature in the fourth step may be, for example, 150°C or higher, preferably 200°C to 300°C. The heat treatment time may be, for example, 1 minute to 30 minutes, preferably 3 minutes to 10 minutes. The heat treatment can be carried out, for example, using a reflow oven.

[0037] The light-emitting panel structure manufactured by the manufacturing method of this embodiment, as described above, can be used in applications such as image display devices such as television receivers, PC monitors, tablets, and smartphones.

[0038] The following describes in detail the first photosensitive thermosetting resin composition that forms the first photosensitive thermosetting resin layer and the second photosensitive thermosetting resin composition that forms the second photosensitive thermosetting resin layer.

[0039] The first photosensitive thermosetting resin composition that forms the first photosensitive thermosetting resin layer only needs to be capable of forming a thermosetting pattern image by exposure and development, and capable of forming a cured product having a desired average reflectivity after thermosetting. The first photosensitive thermosetting resin composition includes, for example, a white pigment, an alkali-soluble resin, and a thermosetting resin, and may optionally contain other components.

[0040] The first photosensitive thermosetting resin composition contains at least one white pigment. Examples of white pigments include zinc oxide, potassium titanate, zirconium oxide, antimony oxide, lead white, zinc sulfide, and lead titanate. From the viewpoint of reflectivity and discoloration suppression effect, the white pigment preferably contains at least titanium dioxide. The titanium dioxide may be produced by methods such as the sulfuric acid method or the chlorine method, or it may be rutile-type titanium dioxide or anatase-type titanium dioxide. Furthermore, titanium dioxide that has been surface-treated with a hydrated metal oxide or an organic compound can be used. From the viewpoint of colorability, opacity, and stability, it is preferable to use rutile-type titanium dioxide. The white pigment may be used alone or in combination of two or more types.

[0041] The volume-average particle size of the white pigment may be, for example, 0.05 μm or more and 10 μm or less, preferably 0.01 μm or more and 5 μm or less. The volume-average particle size of the white pigment is measured, for example, as the particle size corresponding to 50% of the volume accumulation from the small diameter side in a volume-based cumulative particle size distribution measured using a laser diffraction particle size distribution analyzer.

[0042] Examples of commercially available rutile-type titanium dioxide, which is a white pigment, include Typake R-820, Typake R-830, Typake R-930, Typake R-550, Typake R-580, Typake R-630, Typake R-680, Typake R-670, Typake R-680, Typake R-670, Typake R-780, Typake R-820, Typake R- 850, Typeque CR-50, Typeque CR-57, Typeque CR-Super70, Typeque CR-80, Typeque CR-90, Typeque CR-93, Typeque CR-95, Typeque CR-97, Typeque CR-60, Typeque CR-63, Typeque CR-67, Typeque CR-58, Typeque CR-85, Typeque UT771 (all manufactured by Ishihara Sangyo Co., Ltd.) ), TyPure R-100, TyPure R-101, TyPure R-102, TyPure R-103, TyPure R-104, TyPure R-105, TyPure R-108, TyPure R-900, TyPure R-902, TyPure R-960, TyPure R-706, TyPure R-931 (all manufactured by DuPont), R-25, R-21, R-32, R-7E, R-5N, R Examples include -61N, R-62N, R-42, R-45M, R-44, R-49S, GTR-100, GTR-300, D-918, TCR-29, TCR-52, FTR-700 (all manufactured by Sakai Chemical Industry Co., Ltd.), TR-600, TR-700, TR-750, TR-840 (all manufactured by Fuji Titanium Industry Co., Ltd.), KR270, KR310, KR380 (all manufactured by Titanium Industry Co., Ltd.), etc.

[0043] Furthermore, examples of anatase-type titanium dioxide include TITON A-110, TITON TCA-123E, TITON A-190, TITON A-197, TITON SA-1, TITON SA-1L (all manufactured by Sakai Chemical Industry Co., Ltd.), TA-100, TA-200, TA-300, TA-400, TA-500, TP-2 (all manufactured by Fuji Titanium Industry Co., Ltd.), TITANIX JA-1, TITANIX JA-3, TITANIX JA-4, TITANIX JA-5, TITANIX JA-C (all manufactured by Teika Co., Ltd.), KA-10, KA-15, KA-20, KA-30, KA-35, KA-90 (all manufactured by Titanium Industry Co., Ltd.), Typeque A-100, Typeque A-220, Typeque W-10 (all manufactured by Ishihara Sangyo Co., Ltd.).

[0044] The content of the white pigment in the first photosensitive thermosetting resin composition may be, for example, 10% by mass or more and 95% by mass or less as a solid content of the total solid content, preferably 15% by mass or more, more preferably 20% by mass or more, and preferably 80% by mass or less, more preferably 65% ​​by mass or less. When the white pigment content is 10% by mass or more, sufficient reflectivity can be achieved in the cured product. When it is 95% by mass or less, the increase in viscosity of the composition can be suppressed, the coating and moldability are good, and the brittleness of the cured product tends to be suppressed.

[0045] Furthermore, the content of the white pigment in the first photosensitive thermosetting resin composition may be, for example, 20 parts by mass or more and 1800 parts by mass on a solid content basis, preferably 50 parts by mass or more, more preferably 100 parts by mass or more, and preferably 1000 parts by mass or less, and more preferably 500 parts by mass or less, based on 100 parts by mass of the alkali-soluble resin described later.

[0046] Alkali-soluble resin The first photosensitive thermosetting resin composition contains at least one alkali-soluble resin. The alkali-soluble resin can be any resin that can be developed in an alkaline aqueous solution, such as a carboxyl group-containing resin or a phenolic hydroxyl group-containing resin. Carboxyl group-containing resins are preferred due to their excellent developability. The alkali-soluble resin may have an ethylenically unsaturated double bond. One alkali-soluble resin may be used alone, or two or more may be used in combination.

[0047] Specific examples of carboxyl group-containing resins include the following compounds (which may be either oligomers or polymers):

[0048] (1) Carboxylate-containing resins obtained by copolymerization of an unsaturated carboxylic acid such as (meth)acrylic acid with an unsaturated group-containing compound such as styrene, α-methylstyrene, lower alkyl (meth)acrylate, or isobutylene.

[0049] (2) A carboxyl group-containing urethane resin obtained by polyaddition reaction of diisocyanates such as aliphatic diisocyanates, branched aliphatic diisocyanates, alicyclic diisocyanates, and aromatic diisocyanates with carboxyl group-containing dialcohol compounds such as dimethylolpropionic acid and dimethylolbutanoic acid, and diol compounds such as polycarbonate polyols, polyether polyols, polyester polyols, polyolefin polyols, acrylic polyols, bisphenol A alkylene oxide adduct diols, and compounds having phenolic hydroxyl groups and alcoholic hydroxyl groups.

[0050] (3) A urethane resin containing terminal carboxyl groups, obtained by reacting an acid anhydride at the ends of a urethane resin by polyaddition reaction of a diisocyanate compound such as aliphatic diisocyanate, branched aliphatic diisocyanate, alicyclic diisocyanate, or aromatic diisocyanate with a diol compound such as a polycarbonate polyol, polyether polyol, polyester polyol, polyolefin polyol, acrylic polyol, bisphenol A alkylene oxide adduct diol, or a compound having a phenolic hydroxyl group and an alcoholic hydroxyl group.

[0051] (4) Diisocyanate and carboxyl group-containing urethane resins obtained by polyaddition reactions of (meth)acrylates or partially acid anhydride-modified products thereof of bifunctional epoxy resins such as bisphenol A type epoxy resin, hydrogenated bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, bixylenol type epoxy resin, and biphenol type epoxy resin, carboxyl group-containing dialcohol compounds, and diol compounds.

[0052] (5) A carboxyl group-containing urethane resin obtained by adding a compound having one hydroxyl group and one or more (meth)acryloyl groups in the molecule, such as hydroxyalkyl (meth)acrylate, during the synthesis of the resin described in (2) or (4) above, and then (meth)acrylicating the terminal (meth)acrylic.

[0053] (6) A carboxyl group-containing urethane resin obtained by adding a compound having one isocyanate group and one or more (meth)acryloyl groups in the molecule, such as an equimolar reaction product of isophorone diisocyanate and pentaerythritol triacrylate, to the synthesis of the resin of (2) or (4) above, and then (meth)acrylicating the terminals.

[0054] (7) A carboxyl group-containing resin obtained by reacting a polyfunctional epoxy resin with (meth)acrylic acid and adding dibasic acid anhydrides such as phthalic anhydride, tetrahydrophthalic anhydride, and hexahydrophthalic anhydride to the hydroxyl groups present in the side chains.

[0055] (8) A carboxyl group-containing resin obtained by reacting a polyfunctional epoxy resin, in which the hydroxyl groups of a bifunctional epoxy resin are further epoxidized with epichlorohydrin, with (meth)acrylic acid, and then adding a dibasic acid anhydride to the resulting hydroxyl groups.

[0056] (9) A carboxyl group-containing polyester resin obtained by reacting a polyfunctional oxetane resin with a dicarboxylic acid and adding a dibasic acid anhydride to the resulting primary hydroxyl group.

[0057] (10) A carboxyl group-containing resin obtained by reacting a reaction product obtained by reacting a compound having multiple phenolic hydroxyl groups in one molecule with an alkylene oxide such as ethylene oxide or propylene oxide with an unsaturated group-containing monocarboxylic acid, and then reacting the resulting reaction product with a polybasic acid anhydride.

[0058] (11) A carboxyl group-containing resin obtained by reacting a reaction product obtained by reacting a compound having multiple phenolic hydroxyl groups in one molecule with a cyclic carbonate compound such as ethylene carbonate or propylene carbonate with an unsaturated group-containing monocarboxylic acid, and then reacting the resulting reaction product with a polybasic acid anhydride.

[0059] (12) A carboxyl group-containing resin obtained by reacting an epoxy compound having multiple epoxy groups in one molecule with a compound having at least one alcoholic hydroxyl group and one phenolic hydroxyl group in one molecule, such as p-hydroxyphenethyl alcohol, and an unsaturated group-containing monocarboxylic acid such as (meth)acrylic acid, and then reacting the alcoholic hydroxyl group of the resulting reaction product with a polybasic acid anhydride such as maleic anhydride, tetrahydrophthalic anhydride, trimellitic anhydride, pyromellitic anhydride, or adipic anhydride.

[0060] (13) A carboxyl group-containing resin obtained by further adding a compound having one epoxy group and one or more (meth)acryloyl groups in the molecule, such as glycidyl (meth)acrylate or α-methylglycidyl (meth)acrylate, to the carboxyl group-containing resin described in (1) to (12) above.

[0061] The phenolic hydroxyl group-containing resin is not particularly limited as long as it has phenolic hydroxyl groups, i.e., hydroxyl groups bonded to a benzene ring, in its main chain or side chain. Preferably, the resin may contain two or more phenolic hydroxyl groups in one molecule. Resins containing two or more phenolic hydroxyl groups in one molecule include, but are not limited to, resins derived from catechol, resorcinol, hydroquinone, dihydroxytoluene, naphthalenediol, t-butylcatechol, t-butylhydroquinone, pyrogallol, phloroglucinol, bisphenol A, bisphenol F, bisphenol S, biphenol, bixylenol, novolac-type phenol resins, novolac-type alkylphenol resins, novolac resins of bisphenol A, dicyclopentadiene-type phenol resins, Xylok-type phenol resins, terpene-modified phenol resins, polyvinylphenol resins, condensates of phenols and aromatic aldehydes having phenolic hydroxyl groups, and condensates of 1-naphthol or 2-naphthol and aromatic aldehydes.

[0062] Of the alkali-soluble resins described above, the first photosensitive thermosetting resin composition preferably contains the alkali-soluble resin described in (7) from the viewpoint of developability and resolution. In this specification, (meth)acrylate is a general term for acrylate, methacrylate and mixtures thereof, and the same applies to other similar expressions.

[0063] The alkali-soluble resin described above has hydrophilic groups such as carboxyl groups in its main chain or side chains, which allows for development with an alkaline aqueous solution. The acid value of the alkali-soluble resin having the carboxyl group may be, for example, 40 mg KOH / g or more and 200 mg KOH / g or less, preferably 45 mg KOH / g or more and 120 mg KOH / g or less. When the acid value of the carboxyl group-containing resin is within the above range, alkali solubility is good, and patterning by alkaline development becomes easier.

[0064] The weight-average molecular weight of the alkali-soluble resin varies depending on the resin skeleton, but may be, for example, between 2,000 and 150,000, and preferably between 5,000 and 100,000. When the weight-average molecular weight is within the above range, a better balance is achieved between the development speed in the development process and the development resistance of the patterned area.

[0065] The alkali-soluble resin content in the first photosensitive thermosetting resin composition may be, for example, 5% to 75% by mass, preferably 15% to 70% by mass, and more preferably 40% by mass or less, based on solid content relative to the total solid content. When the alkali-soluble resin content is 15% by mass or more, the film strength is good. On the other hand, when it is 75% by mass or less, the viscosity of the composition does not become too high, and the coatability is good.

[0066] thermosetting resin The first photosensitive thermosetting resin composition contains at least one thermosetting resin. Known and commonly used thermosetting resins can be used, including isocyanate compounds, blocked isocyanate compounds, amino resins, maleimide compounds, benzoxazine resins, carbodiimide resins, cyclocarbonate compounds, epoxy resins, polyfunctional oxetane compounds, and episulfide resins. Among these, it is preferable that the thermosetting resin has at least one of multiple cyclic ether groups and a cyclic thioether group (hereinafter abbreviated as cyclic (thio) ether group) in one molecule. Many types of thermosetting components having these cyclic (thio) ether groups are commercially available, and their structure can impart diverse properties. The thermosetting resin may be used alone or in combination of two or more types.

[0067] Thermosetting resins having multiple cyclic (thio) ether groups in their molecules are compounds having multiple cyclic ether groups or cyclic thioether groups of three, four, or five members in their molecules. Examples include compounds having multiple epoxy groups in their molecules, i.e., polyfunctional epoxy compounds; compounds having multiple oxetanyl groups in their molecules, i.e., polyfunctional oxetane compounds; and compounds having multiple thio ether groups in their molecules, i.e., episulfide resins.

[0068] The thermosetting resin is preferably a compound that undergoes a thermosetting reaction with an alkali-soluble resin, and may contain at least an epoxy resin. Examples of epoxy resins include bisphenol A type epoxy resin, brominated epoxy resin, novolac type epoxy resin, bisphenol F type epoxy resin, hydrogenated bisphenol A type epoxy resin, glycidylamine type epoxy resin, hydantoin type epoxy resin, alicyclic epoxy resin, trihydroxyphenylmethane type epoxy resin, bixylenol type or biphenol type epoxy resin or mixtures thereof, bisphenol S type epoxy resin, bisphenol A type novolac epoxy resin, heterocyclic epoxy resin, biphenyl novolac type epoxy resin, naphthalene group-containing epoxy resin, and epoxy resin having a dicyclopentadiene skeleton. Furthermore, epoxy resins in which halogen atoms such as chlorine and bromine, or atoms such as phosphorus have been introduced into their structure may also be used. This can, for example, impart flame retardancy. The epoxy resin may be used alone or in combination of two or more types.

[0069] The content of the thermosetting resin in the first photosensitive thermosetting resin composition may be, for example, 70% by mass or less in terms of solid content relative to the total solid content, preferably 5% by mass or more and 60% by mass or less, and more preferably 20% by mass or less. If the thermosetting resin content is 70% by mass or less, development residue is less likely to occur due to a decrease in the solubility of the unexposed parts in the developer solution.

[0070] Furthermore, the content of the thermosetting resin in the first photosensitive thermosetting resin composition may be, for example, 5 parts by mass or more and 80 parts by mass or less in terms of solid content per 100 parts by mass of the alkali-soluble resin, preferably 10 parts by mass or more, more preferably 30 parts by mass or more, and preferably 60 parts by mass or less.

[0071] Other ingredients The first photosensitive thermosetting resin composition may further contain at least one compound having an ethylenically unsaturated bond. Including a compound having an ethylenically unsaturated bond facilitates viscosity adjustment of the resin composition, leading to effects such as accelerated photocuring and improved developability. The molecular weight of the compound having an ethylenically unsaturated bond may be, for example, 1000 or less.

[0072] Examples of compounds having ethylenically unsaturated bonds include (meth)acrylate monomers such as polyester (meth)acrylate, polyether (meth)acrylate, urethane (meth)acrylate, carbonate (meth)acrylate, and epoxy (meth)acrylate. Specific compounds include hydroxyalkyl (meth)acrylates such as 2-hydroxyethyl (meth)acrylate and 2-hydroxypropyl (meth)acrylate; di(meth)acrylates of glycols such as ethylene glycol, methoxytetraethylene glycol, polyethylene glycol, and propylene glycol; (meth)acrylamides such as N,N-dimethyl(meth)acrylamide, N-methylol(meth)acrylamide, and N,N-dimethylaminopropyl(meth)acrylamide; aminoalkyl (meth)acrylates such as N,N-dimethylaminoethyl (meth)acrylate and N,N-dimethylaminopropyl (meth)acrylate; polyhydric alcohols such as hexanediol, trimethylolpropane, pentaerythritol, dipentaerythritol, and tris-hydroxyethyl isocyanurate, or their ethyl alcohols. Polyvalent (meth)acrylates such as phenol oxide adducts, propylene oxide adducts, or ε-caprolactone adducts; polyvalent (meth)acrylates such as phenoxyacrylate, bisphenol A diacrylate, and ethylene oxide adducts or propylene oxide adducts of these phenols; polyvalent (meth)acrylates of glycidyl ethers such as glycerin diglycidyl ether, glycerin triglycidyl ether, trimethylolpropane triglycidyl ether, and triglycidyl isocyanurate; and, not limited to the above, acrylates obtained by directly (meth)acrylateing polyols such as polyether polyols, polycarbonate diols, hydroxyl-terminated polybutadienes, and polyester polyols, or by urethane (meth)acrylateing via diisocyanate, and melamine (meth)acrylate. Compounds having an ethylenically unsaturated bond may be used individually or in combination of two or more.

[0073] The content of compounds having ethylenically unsaturated bonds in the first photosensitive thermosetting resin composition may be, for example, 50% by mass or less on a solids basis relative to the total solids, preferably 1% by mass or more, more preferably 3% by mass or more, and also preferably 30% by mass or less, and more preferably 10% by mass or less. When the content of compounds having ethylenically unsaturated bonds is 1% by mass or more, it becomes easier to obtain developability upon light irradiation and further improves resolution. On the other hand, when it is 50% by mass or less, the flexibility of the cured product is excellent.

[0074] Furthermore, the content of the compound having an ethylenically unsaturated bond in the first photosensitive thermosetting resin composition may be, for example, 1 part by mass or more and 100 parts by mass or less on a solid content basis per 100 parts by mass of the alkali-soluble resin, preferably 10 parts by mass or more and 50 parts by mass or less, and more preferably 30 parts by mass or less.

[0075] The first photosensitive thermosetting resin composition may further contain at least one photopolymerization initiator. Examples of photopolymerization initiators include benzophenone-based, acetophenone-based, aminoacetophenone-based, benzoin ether-based, benzyl ketal-based, acylphosphine oxide-based, oxime ether-based, oxime ester-based, and titanocene-based photopolymerization initiators. The photopolymerization initiator may be used alone or in combination of two or more.

[0076] Examples of oxime ester-based photopolymerization initiators include compounds having a substructure represented by the following formula (I). Examples of aminoacetophenone-based photopolymerization initiators include α-aminoacetophenone-based photopolymerization initiators having a substructure represented by the following formula (II). Examples of acylphophosphine oxide-based photopolymerization initiators include compounds having a substructure represented by the following formula (III). Examples of titanocene-based photopolymerization initiators include compounds represented by the following formula (IV).

[0077] [ka] TIFF0007834933000002.tif41159

[0078] In formula (I), R 1 represents a hydrogen atom, a phenyl group, an alkyl group, a cycloalkyl group, an alkanoyl group or a benzoyl group. R 2 represents a phenyl group, an alkyl group, a cycloalkyl group, an alkanoyl group or a benzoyl group. R 1 Or the phenyl group represented by R 2 may have a substituent, and examples of the substituent include an alkyl group having 1 to 6 carbon atoms, a phenyl group, a halogen atom, etc. R 1 Or the alkyl group represented by R 2 is preferably an alkyl group having 1 to 20 carbon atoms. The alkyl group may be linear or branched. Further, it may contain one or more oxygen atoms in the alkyl chain and may be substituted with one or more hydroxyl groups. R[[ID=第十八条]] 1 Or the cycloalkyl group represented by R 2 is preferably a cycloalkyl group having 5 to 8 carbon atoms. R 1 Or the alkanoyl group represented by R 2 is preferably an alkanoyl group having 2 to 20 carbon atoms. R 1 Or the benzoyl group represented by R 2 may have a substituent, and examples of the substituent include an alkyl group having 1 to 6 carbon atoms, a phenyl group, etc.

[0079] ]​​​​​​​​​​​​​​​​​​​​​Each of these independently represents an alkyl group having 1 to 10 carbon atoms, a cyclohexyl group, a cyclopentyl group, an aryl group or halogen atom, an aryl group substituted with an alkyl group or alkoxy group, or an acyl group having 2 to 20 carbon atoms (except when both are acyl groups having 2 to 20 carbon atoms).

[0081] In formula (IV), R 9 and R 10 Each of these independently represents a halogen atom, an aryl group, an aryl halide, and a heterocyclic aryl halide.

[0082] Examples of oxime ester-based photopolymerization initiators containing the substructure represented by formula (I) include oxime ester compounds having a thioxanthone skeleton such as 1,2-octanedione-1-[4-(phenylthio)-2-(O-benzoyl oxime)] and 2-(acetyloxyiminomethyl)thioxanthene-9-one, as well as oxime ester compounds having a carbazole skeleton such as 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazole-3-yl]-ethanone-1-(O-acetyl oxime).

[0083] Examples of α-aminoacetophenone-based photopolymerization initiators containing the substructure represented by formula (II) include 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropanone-1, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butan-1-one, 2-(dimethylamino)-2-[(4-methylphenyl)methyl]-1-[4-(4-morpholinyl)phenyl]-1-butanone, and N,N-dimethylaminoacetophenone.

[0084] Examples of acylphosphine oxide-based photopolymerization initiators containing the substructure represented by formula (III) include 2,4,6-trimethylbenzoyldiphenylphosphine oxide, bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide, and bis(2,6-dimethoxybenzoyl)-2,4,4-trimethylpentylphosphine oxide.

[0085] Examples of titanocene-based photopolymerization initiators represented by formula (IV) include bis(η 5 Examples include -2,4-cyclopentadiene-1-yl)-bis(2,6-difluoro-3-(1H-pyrrole-1-yl)-phenyl)titanium.

[0086] The content of the photopolymerization initiator in the first photosensitive thermosetting resin composition may be, for example, 0.01 parts by mass or more and 100 parts by mass on a solid content basis per 100 parts by mass of alkali-soluble resin, preferably 0.5 parts by mass or more, more preferably 1 part by mass or more, and even more preferably 5 parts by mass or more. It may also be preferably 80 parts by mass or less, more preferably 40 parts by mass or less, and even more preferably 20 parts by mass or less. When the content of the photopolymerization initiator is 0.01 parts by mass or more per 100 parts by mass of alkali-soluble resin, the photocurability on copper is good, the coating film is less likely to peel off, and the coating film properties such as chemical resistance are good. On the other hand, when the content of the photopolymerization initiator is 100 parts by mass or less per 100 parts by mass of alkali-soluble resin, the light absorption of the photopolymerization initiator is good, and the deep curing performance is improved.

[0087] The first photosensitive thermosetting resin composition may further contain at least one thermosetting catalyst. Examples of thermosetting catalysts include imidazole derivatives such as imidazole, 2-methylimidazole, 2-ethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 4-phenylimidazole, 1-cyanoethyl-2-phenylimidazole, and 1-(2-cyanoethyl)-2-ethyl-4-methylimidazole; amine compounds such as dicyandiamide, benzyldimethylamine, 4-(dimethylamino)-N,N-dimethylbenzylamine, 4-methoxy-N,N-dimethylbenzylamine, and 4-methyl-N,N-dimethylbenzylamine; hydrazine compounds such as adipic acid dihydrazide and sebacate acid dihydrazide; and phosphorus compounds such as triphenylphosphine. Furthermore, commercially available examples include, for example, 2MZ-A, 2MZ-OK, 2PHZ, 2P4BHZ, and 2P4MHZ (all trade names for imidazole compounds) from Shikoku Chemicals, Inc., and U-CAT3503N and U-CAT3502T (both trade names for dimethylamine blocked isocyanate compounds), DBU, DBN, U-CATSA102, and U-CAT5002 (all bicyclic amidine compounds and their salts) from Sunapro Co., Ltd. However, the catalysts are not limited to these; any thermosetting catalyst for epoxy resins or oxetane compounds, or any catalyst that promotes the reaction between at least one of an epoxy group and an oxetanyl group and a carboxyl group, can be used, and these can be used individually or in combination of two or more. Furthermore, S-triazine derivatives such as guanamine, acetoguanamine, benzoguanamine, melamine, 2,4-diamino-6-methacryloyloxyethyl-s-triazine, 2-vinyl-2,4-diamino-S-triazine, 2-vinyl-4,6-diamino-s-triazine isocyanuric acid adduct, and 2,4-diamino-6-methacryloyloxyethyl-s-triazine isocyanuric acid adduct may also be used. Preferably, these compounds, which also function as adhesion imparters, may be used in combination with the thermosetting catalyst. The thermosetting catalyst may be used alone or in combination of two or more types.

[0088] The content of the thermosetting catalyst in the first photosensitive thermosetting resin composition may be, for example, 0.1 parts by mass or more and 20 parts by mass or less on a solid content basis per 100 parts by mass of alkali-soluble resin, preferably 0.5 parts by mass or more and 15.0 parts by mass or less.

[0089] The first photosensitive thermosetting resin composition may further optionally contain melamine; polymerization inhibitors such as hydroquinone, hydroquinone monomethyl ether, t-butylcatechol, pyrogallol, and phenothiazine; inorganic fillers such as barium titanate, silicon dioxide powder, clay, magnesium carbonate, calcium carbonate, aluminum hydroxide, and mica powder; thickeners such as fine silica, organic bentonite, and montmorillonite; at least one of silicone-based, fluorine-based, or polymer-based defoaming and leveling agents; antioxidants, photopolymerization sensitizers, light stabilizers, dispersants, curing accelerators, flame retardants, flame retardant aids, and silane coupling agents.

[0090] Furthermore, the first photosensitive thermosetting resin composition may contain an organic solvent. Examples of organic solvents include ketones such as methyl ethyl ketone and cyclohexanone; aromatic hydrocarbons such as toluene, xylene, and tetramethylbenzene; glycol ethers such as cellosolve, methyl cellosolve, butyl cellosolve, carbitol, methyl carbitol, butyl carbitol, propylene glycol monomethyl ether, dipropylene glycol monomethyl ether (DPM), dipropylene glycol diethyl ether, and tripropylene glycol monomethyl ether; esters such as ethyl acetate, butyl acetate, butyl lactate, cellosolve acetate, butyl cellosolve acetate, carbitol acetate, butyl carbitol acetate, propylene glycol monomethyl ether acetate, dipropylene glycol monomethyl ether acetate, and propylene carbonate; aliphatic hydrocarbons such as octane and decane; and petroleum-based solvents such as petroleum ether, petroleum naphtha, and solvent naphtha. These organic solvents can be used individually or in combination of two or more.

[0091] Second photosensitive thermosetting resin composition The second photosensitive thermosetting resin composition that forms the second photosensitive thermosetting resin layer only needs to be capable of forming a thermosetting pattern image by exposure and development, and capable of forming a cured product in which the average absorbance in the wavelength range of 430 nm to 750 nm is within a predetermined range after thermosetting. The second photosensitive thermosetting resin composition includes, for example, a colorant, an alkali-soluble resin, and a thermosetting resin, and may optionally contain other components.

[0092] Coloring agents The second photosensitive thermosetting resin composition contains at least one colorant. The colorant only needs to be able to achieve the desired average absorbance and may be a black colorant or a colorant of a color other than black.

[0093] The black coloring agent can be either an organic or inorganic coloring agent. For example, carbon black pigments such as CIPigment black 6, 7, 9, and 18; graphite pigments such as CIPigment black 8 and 10; iron oxide pigments such as CIPigment black 11, 12, 27, and Pigment Brown 35; for example, iron oxide from Toda Kogyo Co., Ltd.'s KN-370; titanium black from Mitsubishi Materials Corporation's 13M-T; anthraquinone pigments such as CIPigment black 20; cobalt oxide pigments such as CIPigment black 13, 25, and 29; copper oxide pigments such as CIPigment black 15 and 28; manganese pigments such as CIPigment black 14 and 26; antimony oxide pigments such as CIPigment black 23; nickel oxide pigments such as CIPigment black 30; perylene pigments such as CIPigment black 31, 32, and BASF Japan's Lumogen Black FK4280; Pigment Black 1. Aniline-based pigments and molybdenum sulfide and bismuth sulfide can also be exemplified as suitable pigments. Preferably, carbon black-based and perylene-based pigments may be used. In the case of carbon black-based and perylene-based pigments, L * a * b* a in color space * Value and b * Since the absolute value of the colorant approaches 0, it is more likely to turn black, which is preferable. These black colorants may be used individually or in combination of two or more.

[0094] The content of the black coloring agent in the second photosensitive thermosetting resin composition may be, for example, 1% by mass or more and 30% by mass or less in terms of solid content relative to the total solid content, preferably 2% by mass or more, more preferably 3% by mass or more, and also preferably 25% by mass or less, and more preferably 20% by mass or less. If the content of the black coloring agent is 1% by mass or more, it is easy to achieve sufficient black coloration. If it is 30% by mass or less, the light transmittance is less likely to deteriorate.

[0095] Furthermore, from the viewpoint of resolution, the content of the black coloring agent in the second photosensitive thermosetting resin composition may be, for example, 1 to 50 parts by mass, preferably 5 to 30 parts by mass, on a solid content basis, per 100 parts by mass of alkali-soluble resin.

[0096] The second photosensitive thermosetting resin composition may contain colorants other than black. Examples of colorants include red, blue, green, and yellow. The colorants other than black may be pigments, dyes, or colorants. Specific examples include those with color index numbers (CI; issued by The Society of Dyers and Colourists) as shown below. However, from the viewpoint of reducing environmental impact and affecting human health, it is preferable that the composition does not contain halogens.

[0097] Examples of red colorants include monoazo, dizazo, azolake, benzimidazolon, perylene, diketopyrrolopyrrole, condensed azo, anthraquinone, and quinacridone. Specifically, those with the following color index numbers can be listed.

[0098] Monoazo type: Pigment Red 1,2,3,4,5,6,8,9,12,14,15,16,17,21,22,23,31,32,112,114,146,147,151,170,184,187,188,193,210,245,253,258,266,267,268,269; Disazo type: Pigment Red 37, 38, 41; Monoazolek system: Pigment Red 48:1,48:2,48:3,48:4,49:1,49:2,50:1,52:1,52:2,53:1,53:2,57:1,58:4,63:1,63:2,64:1,68; Benzimidazolone-based: Pigment Red 171, 175, 176, 185, 208; Perylene series: Solvent Red 135, 179, Pigment Red 123, 149, 166, 178, 179, 190, 194, 224; Diketopyrrolopyrrole series: Pigment Red 254, 255, 264, 270, 272; Condensed azo compounds: Pigment Red 144, 166, 214, 220, 221, 242; Anthraquinone compounds: Pigment Red 168, 177, 216; Solvent Red 149, 150, 52, 207; Quinacridone strains: Pigment Red 122, 202, 206, 207, 209

[0099] The content of the red coloring agent in the second photosensitive thermosetting resin composition may be, for example, 0 parts by mass or more and 1 part by mass on a solid content basis per 100 parts by mass of alkali-soluble resin, preferably 0.1 parts by mass or more and 1 part by mass, and more preferably 0.1 parts by mass or more and 0.8 parts by mass. When the content is 1 part by mass or less, light transmittance is less likely to deteriorate. Also, when it is 0.1 parts by mass or more, it is prone to blackening.

[0100] Blue colorants include compounds classified as pigments (Pigment) and dyes (Solvent), such as phthalocyanine, anthraquinone, dioxazine, and cobalt-based compounds. Specifically, those with the following color index numbers can be cited. In addition, metal-substituted or unsubstituted phthalocyanine compounds can also be used.

[0101] Pigment type: Pigment Blue 15, 15:1, 15:2, 15:3, 15:4, 15:6, 16, 60; Dye system: Solvent Blue 35,45,63,67,68,70,83,87,94,97,104,122,136

[0102] The content of the blue colorant in the second photosensitive thermosetting resin composition may be, for example, 0.1 parts by mass or more and 2.5 parts by mass or less on a solid content basis per 100 parts by mass of alkali-soluble resin, preferably 0.2 parts by mass or more and 1.5 parts by mass or less. If the content is 0.1 parts by mass or more, blackening is likely to occur. If the content is 2.5 parts by mass or less, light transmittance is less likely to deteriorate.

[0103] Examples of yellow colorants include monoazo, disazo, condensed azo, benzimidazolone, isoindolinone, and anthraquinone types, and specifically the following colorants are listed below.

[0104] Monoazo type: Pigment Yellow 1,2,3,4,5,6,9,10,12,61,62,62:1,65,73,74,75,97,100,101,104,105,111,116,167,168,169,182,183; Disazo type: Pigment Yellow 12, 13, 14, 16, 17, 55, 63, 81, 83, 87, 126, 127, 152, 170, 172, 174, 176, 188, 198; Condensed azo compounds: Pigment Yellow 93, 94, 95, 128, 155, 166, 180; Benzimidazolone-based: Pigment Yellow 120, 151, 154, 156, 175, 181; Isoindolinone series: Pigment Yellow 109, 110, 139, 179, 185; Anthraquinone group: Solvent Yellow 163, Pigment Yellow 24, 108, 193, 147, 199, 202;

[0105] The content of the yellow colorant in the second photosensitive thermosetting resin composition may be, for example, 0.1 parts by mass or more and 1.5 parts by mass or less on a solid content basis per 100 parts by mass of alkali-soluble resin. If the content is 0.1 parts by mass or more, blackening is likely to occur. If it is 1.5 parts by mass or less, light transmittance is less likely to be impaired. Furthermore, the total content of the yellow colorant and the red colorant may be, for example, 0.1 parts by mass or more and 2.5 parts by mass or less on a carboxyl group-containing resin. If the total content is 0.1 parts by mass or more, blackening is likely to occur. If it is 2.5 parts by mass or less, light transmittance is less likely to be impaired.

[0106] Examples of green colorants include phthalocyanine-based and anthraquinone-based compounds. Specifically, Pigment Green 7, 36, Solvent Green 3, 5, 20, 28, etc., can be used. In addition to the above, metal-substituted or unsubstituted phthalocyanine compounds can also be used.

[0107] The content of the green coloring agent in the second photosensitive thermosetting resin composition may be, for example, 0.2 parts by mass or more and 2.0 parts by mass or less on a solid content basis per 100 parts by mass of alkali-soluble resin. If the content is 0.2 parts by mass or more, blackening is likely to occur. If the content is 2.0 parts by mass or less, light transmittance is less likely to be impaired.

[0108] Specific examples of purple colorants include Pigment Violet 19, 29, 32, 36, 38, 42; Solvent Violet 13, 36, etc.

[0109] The content of the purple coloring agent in the second photosensitive thermosetting resin composition may be, for example, 0.1 parts by mass or more and 2.5 parts by mass or less on a solid content basis per 100 parts by mass of alkali-soluble resin, preferably 0.2 parts by mass or more and 2.5 parts by mass or less. If the content is 0.1 parts by mass or more, blackening is likely to occur. If the content is 2.5 parts by mass or less, light transmittance is less likely to be impaired.

[0110] Specifically, the orange coloring agent is Pigment Orange 1,5,13,1 4,16,17,24,34,36,38,40,43,46,49,51,61,63 Examples include 64, 71, and 73.

[0111] The content of the orange coloring agent in the second photosensitive thermosetting resin composition may be, for example, 0.05 parts by mass or more and 1 part by mass or less on a solid content basis per 100 parts by mass of alkali-soluble resin, preferably 0.1 parts by mass or more and 0.8 parts by mass or less. If the content is 0.05 parts by mass or more, blackening is likely to occur. If the content is 1 part by mass or less, light transmittance is less likely to be impaired.

[0112] Examples of brown colorants include Pigment brown 23, 25, etc.

[0113] Two or more colorants other than black may be used. The total amount of colorants other than black in the second photosensitive thermosetting resin composition may be, for example, 0.35 parts by mass or more and 9.5 parts by mass or less in terms of solid content per 100 parts by mass of alkali-soluble resin. If the total amount of colorants other than black is 0.35 parts by mass or more, blackening is likely to occur. If it is 9.5 parts by mass or less, light transmittance is less likely to deteriorate.

[0114] The second photosensitive thermosetting resin composition contains at least one alkali-soluble resin. Details of the alkali-soluble resin are as previously described. The second photosensitive thermosetting resin composition preferably contains the alkali-soluble resin described in (7) as the alkali-soluble resin, from the viewpoint of developability and resolution.

[0115] The alkali-soluble resin content in the second photosensitive thermosetting resin composition may be, for example, 15% to 75% by mass, preferably 20% to 70% by mass, on a solids basis relative to the total solids. When the alkali-soluble resin content is 15% by mass or more, the film strength is good. On the other hand, when it is 75% by mass or less, the viscosity of the composition does not become too high, and the coatability is good.

[0116] The second photosensitive thermosetting resin composition contains at least one thermosetting resin. Details of the thermosetting resin are as previously described.

[0117] The content of the thermosetting resin in the second photosensitive thermosetting resin composition may be, for example, 70% by mass or less in terms of solid content relative to the total solid content, and preferably 5% by mass or more and 60% by mass or less. If the thermosetting resin content is 70% by mass or less, development residue is less likely to occur due to a decrease in the solubility of the unexposed parts in the developer solution.

[0118] Furthermore, the content of the thermosetting resin in the second photosensitive thermosetting resin composition may be, for example, 10 parts by mass or more and 100 parts by mass or less, on a solid content basis, per 100 parts by mass of the alkali-soluble resin, preferably 15 parts by mass or more and 60 parts by mass or less.

[0119] The second photosensitive thermosetting resin composition may contain other components as needed. Examples of other components include compounds having ethylenically unsaturated bonds, photopolymerization initiators, thermosetting catalysts, and other additives. Details regarding compounds having ethylenically unsaturated bonds, photopolymerization initiators, thermosetting catalysts, and other additives are as previously described.

[0120] When the second photosensitive thermosetting resin composition contains a compound having an ethylenically unsaturated bond, the content of the compound having an ethylenically unsaturated bond in the first photosensitive thermosetting resin composition may be, for example, 50% by mass or less on a solids basis relative to the total solids, preferably 1% by mass or more, more preferably 3% by mass or more, and preferably 30% by mass or less. When the content of the compound having an ethylenically unsaturated bond is 1% by mass or more, it becomes easier to obtain developability upon light irradiation and further improves resolution. On the other hand, when it is 50% by mass or less, the flexibility of the cured product is excellent.

[0121] Furthermore, the content of the compound having an ethylenically unsaturated bond in the second photosensitive thermosetting resin composition may be, for example, 1 part by mass or more and 100 parts by mass or less, on a solid content basis, per 100 parts by mass of the alkali-soluble resin, preferably 10 parts by mass or more and 50 parts by mass or less.

[0122] When the second photosensitive thermosetting resin composition contains a photopolymerization initiator, the content of the photopolymerization initiator in the second photosensitive thermosetting resin composition may be, for example, 0.01 parts by mass or more and 100 parts by mass on a solid content basis per 100 parts by mass of alkali-soluble resin, preferably 0.5 parts by mass or more, more preferably 1 part by mass or more, also preferably 80 parts by mass or less, more preferably 40 parts by mass or less, and even more preferably 20 parts by mass or less. When the content of the photopolymerization initiator is 0.01 parts by mass or more per 100 parts by mass of alkali-soluble resin, the photocurability on the substrate is good, the coating film is less likely to peel off, and the coating film properties such as chemical resistance are good. On the other hand, when the content of the photopolymerization initiator is 100 parts by mass or less per 100 parts by mass of alkali-soluble resin, the light absorption of the photopolymerization initiator is good, and the deep curing performance is improved.

[0123] If the second photosensitive thermosetting resin composition contains a thermosetting catalyst, the content of the thermosetting catalyst in the second photosensitive thermosetting resin composition may be, for example, 0.1 parts by mass or more and 20 parts by mass or less on a solid content basis per 100 parts by mass of alkali-soluble resin, preferably 0.5 parts by mass or more and 15.0 parts by mass or less.

[0124] Structure for light-emitting panels The structure for the light-emitting panel comprises a substrate having a patterned conductor, a laminated partition wall disposed on the substrate and including a first partition wall and a second partition wall, and a semiconductor light-emitting element disposed in a recess partitioned by the laminated partition wall and connected to the patterned conductor. The first partition wall is disposed in contact with the substrate and has an average reflectance of 30% or more in the wavelength range of 430 nm to 750 nm. The second partition wall is disposed on the first partition wall at a distance from the substrate and has an average absorbance of 0.5 to 10 in the wavelength range of 430 nm to 750 nm.

[0125] In a light-emitting panel structure, a semiconductor light-emitting element is partitioned by a laminated partition wall in which a first partition wall with high reflectivity and a second partition wall with high absorbivity are stacked with the second partition wall on top, thereby achieving a good color balance and high current efficiency. The light-emitting panel structure is manufactured, for example, by the manufacturing method of the light-emitting panel structure described above.

[0126] An example of the configuration of a light-emitting panel structure will be described with reference to the drawings. Figure 1 is a schematic cross-sectional view of a light-emitting panel structure 100. The light-emitting panel structure 100 comprises a substrate 10 having a pattern conductor (not shown), a laminated partition wall 20 disposed on the substrate 10 and including a first partition wall 21 and a second partition wall 22, and semiconductor light-emitting elements 30a, 30b, and 30c disposed in recesses partitioned by the laminated partition wall 20 and connected to the pattern conductor. The substrate 10 may be, for example, a silicon wafer, a silicon oxide wafer, a glass substrate, an epoxy glass substrate, etc. The pattern conductor provided on the substrate is, for example, made of copper and is circuit-formed to supply power to the semiconductor light-emitting elements. The pattern conductor is disposed on the side of the substrate 10 where the semiconductor light-emitting elements are arranged. The laminated partition wall 20 comprises a first partition wall 21 positioned in contact with the substrate 10 and having an average reflectance of 30% or more in the wavelength range of 430 nm to 750 nm, and a second partition wall 22 positioned on the first partition wall 21 at a distance from the substrate 10 and having an average absorbance of 0.5 to 10 in the wavelength range of 430 nm to 750 nm. Multiple recesses are formed on the substrate 10, partitioned by the laminated partition wall 20, and the pattern conductor is exposed. The semiconductor light-emitting elements 30a, 30b, and 30c are each positioned in the recesses partitioned by the laminated partition wall 20 and are electrically connected to the pattern conductor. The semiconductor light-emitting elements 30a, 30b, and 30c may each have different emission peak wavelengths. The semiconductor light-emitting element 30a is a red light-emitting diode, the semiconductor light-emitting element 30b is a green light-emitting diode, and the semiconductor light-emitting element 30c is a blue light-emitting diode. In the light-emitting panel structure 100, adjacent semiconductor light-emitting elements may have different emission peak wavelengths.

[0127] In another aspect, the present invention also includes the use of light-emitting panel structures in the manufacture of image display devices, and light-emitting panel structures used in the manufacture of image display devices. [Examples]

[0128] The present invention will be described in detail below with reference to examples, but the present invention is not limited to these examples. The following materials were prepared for preparing the first photosensitive thermosetting resin composition and the second photosensitive thermosetting resin composition.

[0129] Synthesis example: Alkali-soluble resin 220 g of cresol novolac type epoxy resin (DIC Corporation, EPICLON N-695, epoxy equivalent: 220 g / eq.) was placed in a four-necked flask equipped with a stirrer and reflux condenser, and 214 g of carbitol acetate was added and heated until dissolved. Next, 0.1 g of hydroquinone was added as a polymerization inhibitor and 2.0 g of dimethylbenzylamine was added as a reaction catalyst. This mixture was heated from 95°C to 105°C, and 72 g of acrylic acid was gradually added dropwise, reacting for 16 hours. The reaction product was cooled from 80°C to 90°C, 106 g of tetrahydrophthalic anhydride was added, reacted for 8 hours, cooled, and then removed. The resin solution of the carboxyl group-containing resin obtained in this way had a solid content of 65%, an acid value of 100 mg KOH / g of solids, and a weight-average molecular weight Mw of approximately 3,500.

[0130] White pigment Typeque CR58: Manufactured by Ishihara Sangyo Co., Ltd.; Rutile-type titanium oxide black pigment MA-100: Manufactured by Mitsubishi Chemical Corporation; Carbon Black thermosetting resin jER870: Manufactured by Mitsubishi Chemical Corporation; epoxy equivalent 205g / eq Acrylate monomer DPHA: Manufactured by Daicel Ornex; Dipentaerythritol Hexaacrylate Melamine: Manufactured by Nissan Chemical Corporation Antioxidant IRGANOX 1010: Manufactured by BASF Japan Photopolymerization initiator Omnirad 819: Manufactured by IGM Resins; Bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide Irgacure OXE02: Manufactured by BASF Japan; Oxime ester type

[0131] thermosetting catalyst DICY: Dicyandiamide; manufactured by Mitsubishi Chemical Corporation 1B2PZ: 2-phenyl-1-benzyl-1H-imidazole; manufactured by Shikoku Chemicals Co., Ltd. Leveling agent BYK-361N: Manufactured by Big Chemie Japan Co., Ltd. Wetting and dispersing agent Disperbyk-111: Manufactured by Big Chemie Japan Co., Ltd.

[0132] Preparation Example 1 The alkali-soluble resin of the synthesis example and each material were weighed to the mass parts shown in Table 1, pre-mixed in a stirrer, and then kneaded in a three-roll mill to obtain the first photosensitive thermosetting resin composition of Preparation Example 1. In Table 1, the solid content of the alkali-soluble resin is shown.

[0133] [Table 1]

[0134] Using the first photosensitive thermosetting resin composition of Preparation Example 1, a resin composition layer was formed on a 1.0 mm thick soda-lime glass plate, and light with a peak wavelength of 350 nm to 450 nm was applied at 300 mJ / cm². 2 After photocuring by irradiation, the sample was developed with 1% by mass sodium carbonate to remove unexposed areas, and after drying, it was heat-treated at 150°C for 60 minutes to obtain a cured material with a thickness of 10 μm. The reflectance of the obtained sample was measured using a spectrophotometer in the wavelength range of 430 nm to 750 nm, and the arithmetic mean was calculated. The results are shown in Table 1.

[0135] Preparation Example 2 The alkali-soluble resin of the synthesis example and each material were weighed to the mass parts shown in Table 2, pre-mixed in a stirrer, and then kneaded in a three-roll mill to obtain the second photosensitive thermosetting resin composition of Preparation Example 2. In Table 2, the solid content of the alkali-soluble resin is shown.

[0136] [Table 2]

[0137] Using the second photosensitive thermosetting resin composition of Preparation Example 2, a resin composition layer was formed on a 1.0 mm thick soda-lime glass plate, and light with a peak wavelength of 350 nm to 450 nm was applied at 300 mJ / cm². 2 After photocuring by irradiation, the sample was developed with 1% by mass sodium carbonate to remove unexposed areas, and after drying, it was heat-treated at 150°C for 60 minutes to obtain a cured material with a thickness of 3 μm. The absorbance of the obtained sample was measured from 430 nm to 750 nm using a UV-Vis spectrophotometer, and the average absorbance was calculated as the arithmetic mean of the measured absorbances. The results are shown in Table 2.

[0138] Preparation Example 3: Preparation of Dry Film A PET film (Lumirror T60, manufactured by Toray Industries, Inc.) with a thickness of 25 μm was prepared as a support film. The second photosensitive thermosetting resin composition of Preparation Example 2 was applied to the PET film by die coating and dried in a hot air circulating drying oven at 80°C to 120°C to form a second photosensitive thermosetting resin layer with a thickness of 3 μm. Next, the first photosensitive thermosetting resin composition of Preparation Example 1 was applied to the second photosensitive thermosetting resin layer by die coating and dried in a hot air circulating drying oven at 80°C to 120°C to form a first photosensitive thermosetting resin layer with a thickness of 10 μm, thereby obtaining the dry film of Preparation Example 3 having a laminated resin layer on the PET film.

[0139] Example 1 1st process On a circuit-formed substrate, the first photosensitive thermosetting resin composition of Preparation Example 1 was applied by spin coating and dried in a hot air circulating drying oven at 80°C for 30 minutes to form a first photosensitive thermosetting resin layer with a thickness of 10 μm. Next, the second photosensitive thermosetting resin composition of Preparation Example 2 was applied on the first photosensitive thermosetting resin layer by spin coating and dried in a hot air circulating drying oven at 80°C for 30 minutes to form a second photosensitive thermosetting resin layer with a thickness of 3 μm, thereby obtaining a substrate having a laminated resin layer.

[0140] 2nd process The substrate having the obtained laminated resin layer was exposed to light using a high-pressure mercury lamp (300 mJ / cm²) so that the thickness of the laminated partition wall became 13 μm. 2 After photocuring, the unexposed areas were removed with a 1% by mass sodium carbonate alkaline developer to form a pattern image with rectangular recesses measuring 100 μm on the long side and 50 μm on the short side.

[0141] 3rd process After pattern image formation, the material was heat-cured in a hot air circulating drying oven at 150°C for 60 minutes to form laminated partitions, resulting in a substrate having recesses partitioned by these partitions.

[0142] 4th step In the third step, light-emitting diodes (LEDs) were mounted in the recesses of the substrate obtained using chip bonding to manufacture a structure for a light-emitting panel. Red LEDs (R), green LEDs (G), and blue LEDs (B) were used as the LEDs, and these were mounted alternately and connected in a series circuit.

[0143] Example 2 The structure for the light-emitting panel of Example 2 was manufactured in the same manner as in Example 1, except that in the first step, the dry film obtained in Preparation Example 3 was laminated onto the circuit-formed substrate with the first photosensitive thermosetting resin layer facing downwards under lamination conditions of 80°C, 0.5 MPa, and 30 seconds, and then the PET film was removed to obtain a substrate having a laminated resin layer.

[0144] Example 3 In the first step, the dry film obtained in Adjustment Example 3 was laminated onto a circuit-formed substrate with the first photosensitive thermosetting resin layer facing downwards under lamination conditions of 80°C, 0.5 MPa, and 30 seconds to obtain a substrate having a laminated resin layer. Then, in the second step, the luminescent panel structure of Example 3 was manufactured in the same manner as in Example 1, except that the PET film was removed after photocuring.

[0145] Comparative Example 1 In the first step, the second photosensitive thermosetting resin composition of Preparation Example 2 was applied to the circuit-formed substrate by spin coating, and dried in a hot air circulating drying oven at 80°C for 30 minutes to form a second photosensitive thermosetting resin layer with a thickness of 3 μm. Then, the first photosensitive thermosetting resin composition of Preparation Example 1 was applied to the second photosensitive thermosetting resin layer by spin coating, and dried in a hot air circulating drying oven at 80°C for 30 minutes to form a first photosensitive thermosetting resin layer with a thickness of 10 μm, thereby obtaining a substrate having a laminated resin layer. In addition, the structure for the light-emitting panel of Comparative Example 1 was manufactured in the same manner as in Example 1.

[0146] Comparative Example 2 A substrate with a circuit formed on it was mounted using chip bonding to obtain a substrate with mounted light-emitting diodes. Red light-emitting diodes (R), green light-emitting diodes (G), and blue light-emitting diodes (B) were used as the light-emitting diodes, and these were mounted alternately and connected in a series circuit.

[0147] On a substrate on which a light-emitting diode was mounted, the first photosensitive thermosetting resin composition of Preparation Example 1 was applied by spin coating and dried in a hot air circulating drying oven at 80°C for 30 minutes to form a first photosensitive thermosetting resin layer with a thickness of 10 μm. Next, the second photosensitive thermosetting resin composition of Preparation Example 2- was applied on the first photosensitive thermosetting resin layer by spin coating and dried in a hot air circulating drying oven at 80°C for 30 minutes to form a second photosensitive thermosetting resin layer with a thickness of 3 μm, thereby obtaining a substrate having a laminated resin layer.

[0148] The obtained substrate was exposed to light using a high-pressure mercury lamp (300 mJ / cm²) so that the thickness of the partition wall was 13 μm and the light-emitting diodes were positioned in the recesses. 2 After photocuring, the unexposed areas were removed with a 1% by mass sodium carbonate alkaline developer to form a pattern image with rectangular recesses measuring 100 μm on the long side and 50 μm on the short side.

[0149] After pattern image formation, the structure for a light-emitting panel of Comparative Example 2 was manufactured by thermal curing in a hot air circulation drying oven at 150°C for 60 minutes to form laminated partitions, thereby mounting light-emitting diodes in the recesses partitioned by the laminated partitions.

[0150] evaluation The light-emitting panel structure obtained above was evaluated as follows. However, for resolution, a resolution evaluation substrate was fabricated and evaluated as described below. The results are shown in Table 3.

[0151] Resolution In Examples 1 to 3 and Comparative Examples 1 and 2, resolution evaluation substrates were prepared in the same manner, except that in the third step, a photomask with a design value of line / space = 50 μm / 50 μm was used for photocuring to form a pattern image, and the resolution of the laminated partitions was evaluated according to the following evaluation criteria.

[0152] Evaluation Criteria A: It was possible to form the product according to the design specifications without any undercuts. B: It's almost exactly as designed, but undercut occurred. C: A pattern image with the line / space values ​​specified in the design was not formed.

[0153] Brightness (current efficiency) The brightness of the light-emitting diodes (R, G, B) connected in series was visually evaluated according to the following evaluation criteria after applying a voltage to achieve a current of 10 mA.

[0154] Evaluation Criteria A: It lit up very brightly. B: It lit up, but it was very dim.

[0155] Color shift A voltage was applied to light-emitting diodes (R, G, B) connected in series to produce a current of 10 mA, causing them to light up. The light-emitting panel structure was then visually inspected from a 45-degree angle, and the color shift was evaluated according to the following evaluation criteria.

[0156] Evaluation Criteria A: It looked pure white. B:G,B was very strong.

[0157] Mount alignment accuracy In the manufacturing of the light-emitting panel structures of Examples 1 to 3 and Comparative Examples 1 and 2, the ease of alignment when mounting the light-emitting diodes (R, G, B) was evaluated according to the following evaluation criteria.

[0158] Evaluation Criteria A: It was good. B: It was difficult to pick up.

[0159] Bulkhead height accuracy The height of the laminated partition wall was measured at 50 locations, and the variation in height was evaluated according to the following evaluation criteria.

[0160] Evaluation Criteria A: The variation was very small (σ < 1 μm). B: There was a large variation (σ>1μm).

[0161] [Table 3]

[0162] The disclosure of Japanese Patent Application No. 2023-044588 (filing date: March 20, 2023) is incorporated herein by reference in its entirety. All documents, patent applications, and technical standards described herein are incorporated herein by reference to the same extent as if each individual document, patent application, and technical standard had been specifically and individually noted to be incorporated by reference.

Claims

1. A laminated resin layer including a first photosensitive thermosetting resin layer and a second photosensitive thermosetting resin layer is placed on a substrate having a patterned conductor, The laminated resin layer is exposed to active energy rays, then developed to form a pattern image on the substrate. The aforementioned pattern image is heat-treated to form a laminated partition wall including a first partition wall and a second partition wall on the substrate, A method for manufacturing a light-emitting panel structure, comprising arranging a semiconductor light-emitting element connected to the pattern conductor in a recess partitioned by the laminated partition wall, The first photosensitive thermosetting resin layer is disposed in contact with the substrate, and the second photosensitive thermosetting resin layer is disposed on the first photosensitive thermosetting resin layer, separated from the substrate. The first partition wall is positioned in contact with the substrate, and the second partition wall is positioned on the first partition wall at a distance from the substrate. A method for manufacturing a light-emitting panel structure, wherein the first partition wall has an average reflectance of 30% or more in the wavelength range of 430 nm to 750 nm, and the second partition wall has an average absorbance of 0.5 or more to 10 in the wavelength range of 430 nm to 750 nm.

2. The method for manufacturing a light-emitting panel structure according to claim 1, wherein the first photosensitive thermosetting resin layer comprises a white pigment, an alkali-soluble resin, and a thermosetting resin, and the second photosensitive thermosetting resin layer comprises a colorant, an alkali-soluble resin, and a thermosetting resin.

3. The method for manufacturing a light-emitting panel structure according to claim 1, wherein the laminated resin layer is arranged by a forming method comprising: applying a first photosensitive thermosetting resin composition to the substrate to form a first photosensitive thermosetting resin layer; and applying a second photosensitive thermosetting resin composition to the first photosensitive thermosetting resin layer to form a second photosensitive thermosetting resin layer.

4. The method for manufacturing a light-emitting panel structure according to claim 1, wherein the laminated resin layer is arranged by a forming method that includes laminating a dry film on the substrate, which comprises a first photosensitive thermosetting resin layer, a second photosensitive thermosetting resin layer, and a support film, and removing the support film.

5. A method for manufacturing a light-emitting panel structure according to claim 1, wherein the thickness of the first partition wall in the direction perpendicular to the main surface of the substrate is 0.5 μm or more and 50 μm or less, and the thickness of the second partition wall in the direction perpendicular to the main surface of the substrate is 0.5 μm or more and 10 μm or less.

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