Processing equipment

Abstract

To provide a processing apparatus which has a simple structure and can prevent processing water from being scattered to the outside of a processing chamber.SOLUTION: A processing chamber cover of a processing apparatus is provided with a first transverse part extending from a position between a first side plate and a first delivery port defined in the first side plate to the outside of a first processing chamber. Thus, in the processing apparatus, a width of a gap between the transverse part and a pedestal positioned in the delivery port when a workpiece is processed in the processing chamber, i.e., a length of the gap along a direction toward the outside of the processing chamber, is large. In this case, when processing water that is scattered passes through the gap, the processing water will likely contact the pedestal or the transverse part and stay in the gap. As a result, in the processing apparatus, the processing water is effectively prevented from being scattered to the outside of the processing chamber by a simple structure, compared to a case where water supply means for forming a water film is provided in the gap.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present invention relates to a processing apparatus for processing a workpiece in a processing chamber.

Background Art

[0002] Chips of devices such as ICs (Integrated Circuits) are essential components in various electronic devices such as mobile phones and personal computers. Such chips are manufactured, for example, in the following order.

[0003] First, a plurality of devices are formed by performing photolithography or the like to form a large number of elements on the surface of a workpiece such as a wafer. Next, the back surface side of the workpiece is ground to thin the workpiece. Next, the workpiece is cut along the boundaries of the plurality of devices to divide the workpiece into a plurality of chips.

[0004] In a processing apparatus such as a grinding apparatus for grinding a workpiece or a cutting apparatus for cutting, generally, the workpiece is processed while being held by a chuck table. Further, when the workpiece is processed, processing chips are generated. And if this processing chip adheres to the workpiece, there is a risk that the quality of the chip manufactured from this workpiece will deteriorate.

[0005] Therefore, in a processing apparatus, generally, the chuck table for holding the workpiece is positioned in the processing chamber, and the workpiece is processed in a state where processing water for washing away the processing chips is supplied. The processing chamber is a space surrounded by a processing chamber cover, and the processing chamber cover has side plates in which transfer ports for enabling transfer of the chuck table for holding the workpiece to or from the processing chamber are formed.

[0006] However, the processing of workpieces in the processing chamber is not always carried out in a sealed state; for example, it may be carried out with the transport port open. Therefore, when workpieces are processed in the processing chamber, there is a risk that processing water may be scattered through this transport port, etc. In view of this, a processing apparatus has been proposed that is equipped with a sealing mechanism to seal the transport port when processing workpieces in the processing chamber (see, for example, Patent Document 1).

[0007] Specifically, this sealing mechanism has a water supply means that supplies water into the gap between the upper surface of a base positioned at the transport opening when processing a workpiece in the processing chamber, and the lower surface of the side wall of the processing chamber cover that faces this upper surface. In this processing apparatus, the transport opening is sealed by supplying water from this water supply means into the gap to form a water film. [Prior art documents] [Patent Documents]

[0008] [Patent Document 1] Japanese Patent Publication No. 2012-76171 [Overview of the Initiative] [Problems that the invention aims to solve]

[0009] However, if a sealing mechanism including a water supply means is provided in the processing apparatus, the structure of the processing apparatus becomes more complex and its manufacturing cost increases. In view of this, the object of the present invention is to provide a processing apparatus with a simple structure that can suppress the scattering of processing water to the outside of the processing chamber. [Means for solving the problem]

[0010] According to the present invention, a processing apparatus for processing a workpiece in a first processing chamber comprises: a chuck table for holding the workpiece; a processing chamber cover having a first side plate formed with a first transport opening for enabling the chuck table for holding the workpiece to or from the first processing chamber; a first processing unit for processing the workpiece transported to the first processing chamber with a first processing tool; a first processing water supply unit for supplying first processing water to at least one of the workpiece or the first processing tool when processing the workpiece in the first processing chamber; and a base positioned at the first transport opening when processing the workpiece in the first processing chamber, wherein the processing chamber cover comprises the first side plate of The first transport port and overlapping areas of lower end A first lateral section is provided that extends outward from the first processing chamber. When the workpiece is processed in the first processing chamber with the base and the first horizontal section facing each other, the first processing water that is scattered remains in the gap between the base and the first horizontal section. A processing device is provided.

[0011] Furthermore, the processing apparatus of the present invention is a processing apparatus that processes a workpiece in a second processing chamber in addition to the first processing chamber, further comprising: a second processing unit for processing the workpiece transported to the second processing chamber with a second processing tool; and a second processing water supply unit for supplying second processing water to at least one of the workpiece or the second processing tool when processing the workpiece in the second processing chamber, wherein the processing chamber cover further has a second side plate having a second transport opening formed therein for enabling the transport of the chuck table holding the workpiece from the first processing chamber to the second processing chamber or from the second processing chamber to the first processing chamber, and the base is positioned at the second transport opening when processing the workpiece in the second processing chamber, and the processing chamber cover has the second side plate of The second transport port and overlapping areas of lower end A second lateral section is provided that extends from the first processing chamber toward both the inside of the first processing chamber and the inside of the second processing chamber. When the workpiece is processed in the second processing chamber with the base and the second horizontal section facing each other, the second processing water that is scattered remains in the gap between the base and the second horizontal section. It is preferable that the processing device is capable of performing the following. [Effects of the Invention]

[0012] In the processing apparatus of the present invention, a first lateral section is provided on the processing chamber cover that extends from between the first side plate and the first transport opening formed in the first side plate toward the outside of the first processing chamber. Therefore, in this processing apparatus, the width of the gap between this lateral section and the base positioned at the transport opening when processing a workpiece in the processing chamber (length along the direction toward the outside of the processing chamber) becomes longer.

[0013] In this case, the scattered processing water is more likely to come into contact with the base or lateral section as it passes through the gap, and remain in the gap. As a result, this processing apparatus makes it possible to suppress the scattering of processing water to the outside of the processing chamber with a simpler structure compared to a case where a water supply means for forming a water film in the gap is provided. [Brief explanation of the drawing]

[0014] [Figure 1] Figure 1 is a schematic perspective view showing an example of a processing apparatus used to process workpieces in a processing chamber. [Figure 2] Figure 2 is a schematic perspective view showing an example of a workpiece. [Figure 3] Figure 3 is a schematic top view showing the processing chamber cover and the like. [Figure 4] Figure 4(A) is a schematic partial cross-sectional side view showing the structure of the processing chamber cover, etc., along the A1A2 line shown in Figure 3, and Figure 4(B) is a schematic partial cross-sectional side view showing the structure of the processing chamber cover, etc., along the B1B2 line shown in Figure 3. [Figure 5] Figure 5 is a schematic perspective view showing another example of a processing apparatus used to process a workpiece in a processing chamber. [Figure 6] Figure 6 is a schematic perspective view showing an example of a frame unit including a workpiece. [Figure 7] Figure 7 is a schematic top view showing the cassette, transport unit, chuck table, cutting unit, and cleaning unit mounted on the cassette table. [Figure 8] Figure 8 is a schematic cross-sectional side view showing the structure of the cutting chamber cover and other components along the C1C2 line shown in Figure 7.

Best Mode for Carrying Out the Invention

[0015] Embodiments of the present invention will be described with reference to the accompanying drawings. FIG. 1 is a perspective view schematically showing an example of a processing apparatus for processing a workpiece in a processing chamber. Specifically, in this processing apparatus, the workpiece can be roughly ground in a rough grinding chamber, the roughly ground workpiece can be finish ground in a finish grinding chamber, and the finish ground workpiece can be polished in a polishing chamber.

[0016] Note that the X-axis direction (front-rear direction) and the Y-axis direction (left-right direction) shown in FIG. 1 are directions orthogonal to each other on a horizontal plane, and the Z-axis direction (up-down direction) is a direction (vertical direction) orthogonal to the X-axis direction and the Y-axis direction.

[0017] The processing apparatus 2 shown in FIG. 1 has a base 4 that supports each structure. An opening 4a is formed on the upper surface of the front end portion of the base 4, and a transport unit 6 for transporting a plate-shaped workpiece is provided inside the opening 4a.

[0018] FIG. 2 is a perspective view schematically showing an example of a workpiece transported by the transport unit 6. The workpiece 11 shown in FIG. 2 is, for example, a wafer made of a semiconductor material such as silicon (Si) and has a circular front surface 11a and a back surface 11b. The workpiece 11 is partitioned into a plurality of regions by a plurality of division planned lines 13 set in a grid pattern, and devices 15 such as ICs are formed in each region.

[0019] Also, a film-like tape having a diameter approximately equal to the diameter of the workpiece 11 may be adhered to the front surface 11a of the workpiece 11. This tape is made of, for example, resin and protects the device 15 by alleviating the impact applied to the front surface 11a side when grinding the back surface 11b side of the workpiece 11.

[0020] There are no restrictions on the material, shape, structure, or size of the workpiece 11. For example, the workpiece 11 may be a substrate made of other semiconductor materials, ceramics, resin, or metal. Similarly, there are no restrictions on the type, quantity, shape, structure, size, or arrangement of the devices 15. Furthermore, the workpiece 11 does not necessarily need to have the devices 15 formed on it.

[0021] Furthermore, as shown in Figure 1, a pair of cassette tables 8a and 8b are provided in front of the opening 4a. Each of these cassette tables 8a and 8b is fitted with a cassette 10a and 10b capable of accommodating multiple workpieces 11. Additionally, a position adjustment mechanism 12 for adjusting the position of the workpieces 11 is provided diagonally behind the opening 4a.

[0022] This position adjustment mechanism 12 includes, for example, a table 12a capable of supporting the central region of the workpiece 11, and a plurality of pins 12b arranged at approximately equal intervals along the circumferential direction of the table 12a so as to surround the table 12a, and the distance between the pins and the table 12a can be adjusted. For example, when the workpiece 11 is placed on the table 12a by the transport unit 6, the plurality of pins 12b move closer to the table 12a so as to bring the plurality of pins 12b into contact with the workpiece 11. As a result, the center of the workpiece 11 is aligned with the center of the table 12a.

[0023] Furthermore, a loading unit 14 capable of rotating while holding the workpiece 11 is provided near the position adjustment mechanism 12. This loading unit 14 has a suction pad that can suck the upper surface of the workpiece 11 and transports the workpiece 11, whose position has been adjusted by the position adjustment mechanism 12, to the rear. Behind the loading unit 14, a disc-shaped turntable 16 is provided.

[0024] On the upper surface of the turntable 16, four chuck tables 18 are provided at roughly equal intervals along the circumferential direction of the turntable 16 for sucking and holding the workpiece 11 during machining. In addition, a cross-shaped base 20 is provided on the upper surface of the turntable 16 to demarcate the four chuck tables 18. The upper surface of this base 20 is located above the upper surfaces of the four chuck tables 18.

[0025] Furthermore, the turntable 16 is connected to a rotational drive source (not shown), such as a motor. When this rotational drive source operates, the turntable 16, the four chuck tables 18, and the base 20 rotate along the arrow shown in Figure 1, with a rotation axis that passes through the center of the turntable 16 and is parallel to the Z-axis direction.

[0026] Furthermore, a machining chamber cover (not shown in Figure 1) 22 is provided on the upper surface of the base 4, surrounding the turntable 16, four chuck tables 18, and base 20. Figure 3 is a schematic top view showing the machining chamber cover 22, etc. Figure 4(A) is a schematic partial cross-sectional side view showing the structure of the machining chamber cover 22, etc. along the A1A2 line shown in Figure 3, and Figure 4(B) is a schematic partial cross-sectional side view showing the structure of the machining chamber cover 22, etc. along the B1B2 line shown in Figure 3.

[0027] Each of the four chuck tables 18 has a disc-shaped frame 18a made of ceramics or the like. This frame 18a has a disc-shaped bottom wall and cylindrical side walls that rise from the outer peripheral region of the bottom wall. That is, a disc-shaped recess is formed on the upper surface of the frame 18a, defined by the bottom wall and the side walls. In addition, a flow channel (not shown) is formed in the bottom wall of the frame 18a, which opens at the bottom surface of the recess, and this flow channel communicates with a suction source (not shown), such as an ejector.

[0028] Furthermore, a disc-shaped porous plate 18b having a diameter approximately equal to the diameter of the recess is fixed to a recess formed on the upper surface of the frame 18a. This porous plate 18b is made of, for example, porous ceramics. In addition, the upper surface of the porous plate 18b and the upper surface of the side wall of the frame 18a have a shape corresponding to the side surface of a cone (a shape in which the center protrudes beyond the outer circumference).

[0029] When the suction source, which communicates with the flow path formed in the bottom wall of the frame 18a, is activated, a suction force acts on the space near the upper surface of the porous plate 18b. As a result, the upper surface of the porous plate 18b and the upper surface of the side wall of the frame 18a function as holding surfaces of the chuck table 18. For example, when the suction source is activated with the workpiece 11 placed on the holding surface of the chuck table 18, the workpiece 11 is held by the chuck table 18.

[0030] The processing chamber cover 22 has a top plate 24 that, when viewed from above, has a shape resembling a quarter circle cut out from a perfect circle. This top plate 24 has through holes 24a that overlap with and have a larger diameter than the grinding wheel 54a for rough grinding (described later), through holes 24b that overlap with and have a larger diameter than the grinding wheel 54b for finish grinding (described later), and through holes 24c that overlap with and have a larger diameter than the polishing pad 88 (described later).

[0031] In the processing apparatus 2, processing chambers are provided below the quarter-circular region of the top plate 24 in which one of the three through holes 24a, 24b, or 24c is formed. Specifically, a rough grinding chamber is provided below the quarter-circular region of the top plate 24 in which through hole 24a is formed. A finish grinding chamber is provided below the quarter-circular region of the top plate 24 in which through hole 24b is formed. A polishing chamber is provided below the quarter-circular region of the top plate 24 in which through hole 24c is formed.

[0032] Furthermore, in the processing apparatus 2, the chuck table 18 is positioned in a quarter-circular area that is exposed without overlapping with the top plate 24, and the workpiece 11 is loaded into and unloaded from the chuck table 18. Hereafter, this quarter-circular area will also be referred to as the loading / unloading area.

[0033] A side plate 26a is provided at the lower part of the arc-shaped outer edge of the top plate 24, extending in an arc shape when viewed from above. The lower end of this side plate 26a is fixed to the upper surface of the base 4. The upper end of the side plate 26a is fixed to the lower side of the portion of the outer edge of the top plate 24 that extends in an arc shape when viewed from above. One end and the other end of the side plate 26a are connected to one end of a pair of side plates 26b and 26c, respectively.

[0034] Side plate 26b is located between the rough grinding chamber and the loading / unloading area. Side plate 26c is located between the polishing chamber and the loading / unloading area. In addition, in a top view, each of the pair of side plates 26b and 26c extends linearly from one end or the other end of side plate 26a toward the center of the top plate 24. That is, in a top view, the pair of side plates 26b and 26c extend perpendicularly to each other.

[0035] Furthermore, at the lower part of each of the pair of side plates 26b and 26c, transport openings 28a and 28b are formed so as not to obstruct the movement of the four chuck tables 18 and the base 20 when the turntable 16 is rotated along the arrows shown in Figure 3. The lower ends of the areas of each of the pair of side plates 26b and 26c that are located outside the transport openings 28a and 28b are fixed to the upper surface of the base 4.

[0036] Furthermore, the upper ends of the pair of side plates 26b and 26c are fixed to the underside of the portion of the outer edge of the top plate 24 that extends linearly when viewed from above. In addition, the lower end of the region of the side plate 26b that overlaps with the transport opening 28a and the inner end of the region located outside the transport opening 28a are provided with a lateral portion 30a that extends outward from the rough grinding chamber.

[0037] Similarly, the lower end of the region of the side plate 26c that overlaps with the transport opening 28b and the inner end of the region located outside the transport opening 28b are provided with lateral sections 30b that extend outward from the polishing chamber. In other words, the processing chamber cover 22 is provided with lateral sections 30a, 30b that extend outward from between the side plates 26b, 26c and the transport openings 28a, 28b towards the outside of the rough grinding chamber and the polishing chamber.

[0038] Furthermore, one end of each of the pair of side plates 26d and 26e is connected to the other end of each of the pair of side plates 26b and 26c, which overlap the center of the top plate 24. Side plate 26d is located between the rough grinding chamber and the finish grinding chamber. Side plate 26e is located between the finish grinding chamber and the polishing chamber.

[0039] Furthermore, the side plate 26d extends from the other end of each of the pair of side plates 26b and 26c to the side plate 26a so as to be perpendicular to the side plate 26b, that is, parallel to the side plate 26c. Similarly, the side plate 26e extends from the other end of each of the pair of side plates 26b and 26c to the side plate 26a so as to be parallel to the side plate 26b, that is, perpendicular to the side plates 26c and 26d.

[0040] Furthermore, at the lower part of each of the pair of side plates 26d and 26e, transport openings 28c and 28d are formed so as not to obstruct the movement of the four chuck tables 18 and the base 20 when the turntable 16 is rotated along the arrows shown in Figure 3. The lower ends of the areas of each of the pair of side plates 26d and 26e that are located outside the transport openings 28c and 28d are fixed to the upper surface of the base 4.

[0041] Furthermore, the upper ends of the pair of side plates 26d and 26e are fixed to the lower part of the top plate 24. In addition, the lower end of the area of ​​the side plate 26d that overlaps with the transport opening 28c and the inner end of the area located outside the transport opening 28c are provided with a lateral section 30c that extends toward both the inside of the rough grinding chamber and the inside of the finish grinding chamber.

[0042] Similarly, the lower end of the region of the side plate 26e that overlaps with the transport opening 28d and the inner end of the region located outside the transport opening 28b are provided with lateral sections 30d that extend toward both the inside of the finish grinding chamber and the inside of the polishing chamber. In other words, the processing chamber cover 22 is provided with lateral sections 30c, 30d that extend from between the side plates 26d, 26e and the transport openings 28c, 28d toward the inside of each of the adjacent pairs of processing chambers (rough grinding chamber and finish grinding chamber or finish grinding chamber and polishing chamber).

[0043] Then, rough grinding, finish grinding, and polishing of the workpiece 11 are performed with the base 20 and the four horizontal sections 30a, 30b, 30c, and 30d facing each other. That is, when rough grinding, finish grinding, and polishing of the workpiece 11 are performed, the base 20 is positioned at the four transport openings 28a, 28b, 28c, and 28d.

[0044] Referring again to Figure 1, the remaining components of the processing apparatus 2 will be described. A support structure 32 is provided behind each of the rough grinding chamber and the finish grinding chamber. A Z-axis moving mechanism 34 is provided on the front of this support structure 32. The Z-axis moving mechanism 34 has a pair of guide rails 36 that are fixed to the front of the support structure 32 and extend along the Z-axis direction.

[0045] A movable plate 38 is connected to the front side of a pair of guide rails 36 in a manner that allows it to slide along the pair of guide rails 36. A screw shaft 40 extending along the Z-axis direction is positioned between the pair of guide rails 36. A motor 42 for rotating the screw shaft 40 is connected to the upper end of this screw shaft 40.

[0046] Furthermore, a nut portion (not shown) is provided on the surface of the screw shaft 40, where a helical groove is formed, to accommodate a ball that rolls on the surface of the rotating screw shaft 40, thus forming a ball screw. That is, when the screw shaft 40 rotates, the ball circulates within the nut portion, causing the nut portion to move along the Z-axis direction.

[0047] Furthermore, this nut portion is fixed to the rear (back) side of the movable plate 38. Therefore, when the screw shaft 40 is rotated by the motor 42, the movable plate 38 moves along the Z-axis direction together with the nut portion. In addition, a fixing device 44 is provided on the front surface of the movable plate 38.

[0048] The fixture 44 supports a grinding unit (processing unit) 46 for grinding the workpiece 11. This grinding unit 46 includes a spindle housing 48 fixed to the fixture 44. The spindle housing 48 houses a spindle 50 that extends along the Z-axis direction in a rotatable manner.

[0049] A rotational drive source (not shown), such as a motor, is connected to the upper end of the spindle 50, and the spindle 50 rotates due to the power of this rotational drive source. The lower end of the spindle 50 is exposed from the lower surface of the spindle housing 48, and a disc-shaped mount 52 is fixed to this lower end.

[0050] Then, a grinding wheel (working tool) 54a for rough grinding is mounted on the lower surface of the mount 52 of the grinding unit 46 on the rough grinding chamber side. This grinding wheel 54a for rough grinding has a wheel base that is approximately the same diameter as the mount 52. This wheel base is made of a metal material such as stainless steel or aluminum.

[0051] Furthermore, multiple grinding wheels containing abrasive grains suitable for rough grinding are fixed to the underside of this wheel base. The underside (grinding surface) of each of the multiple grinding wheels is a surface that is generally perpendicular to the Z-axis direction, and it rough grinds the workpiece 11 that is held by suction on the chuck table 18 located in the rough grinding chamber.

[0052] Similarly, a grinding wheel (working tool) 54b for finish grinding is mounted on the lower surface of the mount 52 of the grinding unit 46 on the finish grinding chamber side. This grinding wheel 54b for finish grinding has a wheel base that is approximately the same diameter as the mount 52. This wheel base is made of a metal material such as stainless steel or aluminum.

[0053] Furthermore, multiple grinding wheels containing abrasive grains suitable for finish grinding are fixed to the underside of this wheel base. The underside (grinding surface) of each of the multiple grinding wheels is a surface that is generally perpendicular to the Z-axis direction, and it finish grinds the workpiece 11 that is held by suction on the chuck table 18 located in the finish grinding chamber. The particle size of the abrasive grains contained in these finish grinding wheels is generally smaller than the particle size of the abrasive grains contained in the grinding wheels used for rough grinding.

[0054] Furthermore, the processing apparatus 2 is provided with a first processing water supply unit (not shown) for supplying processing water to at least one of the workpiece 11 or the grinding wheel 54a when rough grinding the workpiece 11 in the rough grinding chamber, and a second processing water supply unit (not shown) for supplying processing water to at least one of the workpiece 11 or the grinding wheel 54b when finish grinding the workpiece 11 in the finish grinding chamber.

[0055] Each of the first and second processing water supply units has, for example, a nozzle (not shown) for supplying processing water to the area (processing point) of the workpiece 11 that is in contact with the grinding wheel. Alternatively, each of the first and second processing water supply units may supply processing water to the processing point via water channels formed in the grinding wheels 54a and 54b, instead of or in addition to this nozzle.

[0056] Furthermore, a support structure 56 is provided on the side of the polishing chamber. An X-axis movement mechanism 58 is provided on the side of this support structure 56 that faces the turntable 16. The X-axis movement mechanism 58 has a pair of guide rails 60 that are fixed to the side of the support structure 56 that faces the turntable 16 and extend along the X-axis direction.

[0057] A movable plate 62 is connected to the turntable 16 side of the pair of guide rails 60 in a manner that allows it to slide along the pair of guide rails 60. A screw shaft 64 extending along the X-axis direction is positioned between the pair of guide rails 60. A motor 66 for rotating the screw shaft 64 is connected to the front end of this screw shaft 64.

[0058] Furthermore, a nut portion (not shown) is provided on the surface of the screw shaft 64, where a helical groove is formed, to accommodate a ball that rolls on the surface of the rotating screw shaft 64, thus forming a ball screw. That is, when the screw shaft 64 rotates, the ball circulates within the nut portion, causing the nut portion to move along the X-axis direction.

[0059] Furthermore, this nut portion is fixed to the side (back) of the movable plate 62 that faces the support structure 56. Therefore, when the screw shaft 64 is rotated by the motor 66, the movable plate 62 moves along the X-axis direction together with the nut portion. In addition, a Z-axis movement mechanism 68 is provided on the side (front) of the movable plate 62 that faces the turntable 16.

[0060] This Z-axis movement mechanism 68 has a pair of guide rails 70 fixed to the surface of the moving plate 62 and extending along the Z-axis direction. The moving plate 72 is connected to the turntable 16 side of the pair of guide rails 70 in a manner that allows it to slide along the pair of guide rails 70.

[0061] Furthermore, a screw shaft 74 extending along the Z-axis direction is positioned between the pair of guide rails 70. A motor 76 for rotating the screw shaft 74 is connected to the upper end of this screw shaft 74. A nut portion (not shown) for housing balls that roll on the surface of the rotating screw shaft 74 is provided on the surface of the screw shaft 74, where a helical groove is formed, thus forming a ball screw.

[0062] In other words, when the screw shaft 74 rotates, the balls circulate within the nut portion, causing the nut portion to move along the Z-axis direction. Furthermore, this nut portion is fixed to the side of the movable plate 72 that faces the movable plate 62 (the back side). Therefore, when the screw shaft 74 is rotated by the motor 76, the movable plate 72 moves along the Z-axis direction together with the nut portion.

[0063] A fixing device 78 is provided on the side (surface) of the movable plate 72 that faces the turntable 16. This fixing device 78 supports a polishing unit (processing unit) 80 for polishing the workpiece 11. The polishing unit 80 has a spindle housing 82 that is fixed to the fixing device 78.

[0064] The spindle housing 82 houses a spindle 84 that extends along the Z-axis direction in a rotatable manner. A rotational drive source (not shown), such as a motor, is connected to the upper end of the spindle 84, and the spindle 84 rotates due to the power of this rotational drive source.

[0065] Furthermore, the lower end of the spindle 84 is exposed from the lower surface of the spindle housing 82, and a disc-shaped mount 86 is fixed to this lower end. A disc-shaped polishing pad (working tool) 88 is mounted on the lower surface of this mount 86. This polishing pad 88 has a diameter longer than, for example, the workpiece 11 that is held by suction on the chuck table 18.

[0066] Furthermore, the circular lower surface (polishing surface) of the polishing pad 88 is a surface that is generally perpendicular to the Z-axis direction, and it wet polishes the workpiece 11 that is held by suction on the chuck table 18 located in the polishing chamber. This polishing pad 88 is manufactured, for example, by impregnating a polyester nonwoven fabric with a urethane solution in which abrasive grains with an average particle size of 20 μm or less are dispersed, and then drying it.

[0067] The abrasive particles dispersed within the polishing pad 88 consist of materials such as silicon carbide, cBN, diamond, or metal oxide fine particles. Examples of these metal oxide fine particles include silica, ceria, zirconia, or alumina. Furthermore, the polishing pad 88 is flexible and flexes slightly in response to the load applied when polishing the workpiece 11.

[0068] Furthermore, the processing apparatus 2 is provided with a third processing water supply unit (not shown) for supplying processing water to at least one of the workpiece 11 or the polishing pad 88 when polishing the workpiece 11 in the polishing chamber.

[0069] The third processing water supply unit has, for example, a nozzle (not shown) for supplying processing water to the area (processing point) of the workpiece 11 that is in contact with the polishing pad 88. Alternatively, the third processing water supply unit may supply processing water to the processing point via a water channel formed in the polishing pad 88, instead of or in addition to this nozzle.

[0070] Furthermore, a loading unit 90 is provided to the side of the loading unit 14, which can hold and rotate the workpiece 11 placed on the chuck table 18 located in the loading / unloading area. This loading unit 90 transports the workpiece 11 forward by holding and rotating the workpiece 11 that has been polished in the polishing chamber, for example.

[0071] Furthermore, a washing unit 92 is positioned in front of the unloading unit 90 and behind the opening 4a, configured to wash the workpiece 11 unloaded by the unloading unit 90. The workpiece 11, washed by the washing unit 92, is then transported by the transport unit 6 and, for example, stored in a cassette 10b.

[0072] In the processing apparatus 2 described above, lateral sections 30a and 30b are provided on the processing chamber cover 22, extending outwards from between the side plates 26b and 26c and the transport openings 28a and 28b formed in the side plates 26b and 26c towards the outside of the processing chamber (rough grinding chamber or polishing chamber). In the processing apparatus 2, the workpiece 11 is processed (rough grinding or polishing) with the base 20 and the lateral sections 30a and 30b facing each other.

[0073] Therefore, in the processing apparatus 2, the width of the gap between the base 20 and the lateral sections 30a and 30b (the length along the direction toward the outside of the processing chamber) becomes longer. In this case, the likelihood of the scattered processing water coming into contact with the base 20 or the lateral sections 30a and 30b as it passes through the gap and remaining in the gap increases.

[0074] As a result, in processing apparatus 2, compared to the case where a water supply means for forming a water film in this gap is provided, it is possible to suppress the scattering of processing water to the outside of the processing chamber with a simpler structure. In processing apparatus 2, a water film may be formed by the processing water remaining in the gap. In this case, the scattering of processing water to the outside of the processing chamber can be further suppressed.

[0075] Furthermore, in the processing apparatus 2 described above, lateral sections 30c and 30d are also provided at the ends of the side plates 26d and 26e on the side of the transport openings 28c and 28d of the processing chamber cover 22, where the transport openings 28c and 28d of the processing chamber cover 22 are formed. These lateral sections 30c and 30d extend toward the inside of each of the adjacent pairs of processing chambers (rough grinding chamber and finish grinding chamber or finish grinding chamber and polishing chamber).

[0076] In the processing apparatus 2, the workpiece 11 is processed (rough grinding, finish grinding, or polishing) with the base 20 and the lateral sections 30c and 30d facing each other. Therefore, as described above, the processing apparatus 2 makes it possible to suppress the scattering of processing water from one processing chamber (e.g., rough grinding chamber) to another adjacent processing chamber (e.g., finish grinding chamber).

[0077] Figure 5 is a schematic perspective view showing another example of a processing apparatus for processing a workpiece in a processing chamber. Specifically, this processing apparatus is a cutting apparatus capable of cutting a workpiece in a cutting chamber.

[0078] Note that the U-axis direction (forward / backward direction, machining feed direction) and the V-axis direction (left / right direction, indexing feed direction) shown in Figure 5 are mutually orthogonal directions on the horizontal plane, and the W-axis direction (up / down direction) is perpendicular to the U-axis and V-axis directions (vertical direction, cutting feed direction).

[0079] The cutting apparatus 94 shown in Figure 5 includes a base 96 on which each component is mounted. A cassette table 98 is installed at the corner of the base 96. A cassette 100 capable of housing a frame unit including the workpiece 11 is placed on the upper surface of this cassette table 98.

[0080] Figure 6 is a schematic perspective view showing an example of a frame unit including a workpiece 11. The frame unit 17 shown in Figure 6 has the workpiece 11 shown in Figure 2. In addition, the central region of a disc-shaped support member 19, which has a larger diameter than the workpiece 11, is attached to the back surface 11b of the workpiece 11.

[0081] The support member 19 comprises, for example, a flexible film-like base layer and an adhesive layer (glue layer) provided on one side of the base layer (the side facing the workpiece 11). Specifically, the base layer is made of polyolefin (PO), polypropylene (PP), polyethylene terephthalate (PET), polyvinyl chloride (PVC), or polystyrene (PS), etc. The adhesive layer is made of UV-curable silicone rubber, acrylic material, or epoxy material, etc.

[0082] Furthermore, an annular frame 21 is attached to the outer periphery of the support member 19, having a circular opening 21a with a diameter longer than that of the workpiece 11. This frame 21 is made of a metal material such as aluminum or stainless steel.

[0083] Furthermore, the cassette table 98 shown in Figure 5 is connected to a W-axis movement mechanism (not shown). This W-axis movement mechanism adjusts the height of the cassette 100 placed on the cassette table 98 so that the frame unit 17 can be properly loaded and unloaded.

[0084] Furthermore, above the base 96, there is a transport unit (not shown in Figure 5) 102, a chuck table 104, a slide cover 106, a base 108, a pair of cutting units (processing units) 110, a spinner table (not shown in Figure 5) 112, and a cleaning unit (not shown in Figure 5) 114. Also above the base 96, there is a cutting chamber cover (processing chamber cover) (not shown in Figure 5) 116 that surrounds the chuck table 104, slide cover 106, base 108, and the pair of cutting units 110.

[0085] Figure 7 is a schematic top view showing the cassette 100, transport unit 102, chuck table 104, slide cover 106, base 108, pair of cutting units 110, spinner table 112, and cleaning unit 114 mounted on the cassette table 98. Figure 8 is a schematic partial cross-sectional side view showing the structure of the cutting chamber cover 116 and other components along the C1C2 line shown in Figure 7.

[0086] The transport unit 102 is connected to a V-axis movement mechanism (not shown) and a W-axis movement mechanism (not shown). The V-axis movement mechanism moves the transport unit 102 from the area above the spinner table 112 to the area near the cassette 100 placed on the cassette table 98.

[0087] Furthermore, the W-axis movement mechanism adjusts the height of the transport unit 102 so that the frame unit 17 is properly loaded into, for example, the spinner table 112, or properly unloaded from the spinner table 112. The transport unit 102 also has a gripping part (not shown) for grasping the frame 21 and a suction pad for sucking the upper surface of the frame 21.

[0088] The chuck table 104 is connected to a U-axis movement mechanism (not shown) and a rotational drive source (not shown). The U-axis movement mechanism moves the chuck table 104 from the cutting chamber enclosed by the cutting chamber cover 116 to the area between the cassette table 98 and the spinner table 112.

[0089] In the following, the area between the cassette table 98 and the spinner table 112 will also be referred to as the loading / unloading area. The rotational drive source rotates the chuck table 104 using a straight line passing through the center of the upper surface of the chuck table 104 and along the W-axis as the axis of rotation.

[0090] Furthermore, the chuck table 104 has a disc-shaped frame 104a made of ceramics or the like. This frame 104a has a disc-shaped bottom wall and cylindrical side walls that rise from the outer peripheral region of the bottom wall. That is, a disc-shaped recess is formed on the upper surface of the frame 104a, defined by the bottom wall and the side walls.

[0091] Furthermore, a channel (not shown) is formed in the bottom wall of the frame 104a, opening at the bottom surface of the recess, and this channel communicates with a suction source (not shown), such as an ejector. In addition, a disc-shaped porous plate 104b having a diameter approximately equal to the diameter of the recess is fixed to the recess formed on the upper side of the frame 104a. This porous plate 104b is made of, for example, porous ceramics.

[0092] When the suction source, which communicates with the flow path formed in the bottom wall of the frame 104a, is activated, a suction force acts on the space near the upper surface of the porous plate 104b. As a result, the upper surface of the porous plate 104b and the upper surface of the side wall of the frame 104a function as holding surfaces of the chuck table 18. For example, when the suction source is activated with the frame unit 17 placed on the holding surface of the chuck table 104, the workpiece 11 is held by the chuck table 104 via the support member 19.

[0093] Furthermore, four clamps 104c are provided around the frame 104a at approximately equal intervals along the circumferential direction of the frame 104a. Each of the four clamps 104c holds the frame 21 at a position lower than the holding surface of the chuck table 104 when the chuck table 104 holds the workpiece 11.

[0094] The slide cover 106 is provided around the chuck table 104 and moves along the U-axis with the chuck table 104. The base 108 is located behind the chuck table 104 and is fixed to the upper surface of the slide cover 106. The base 108 extends along the V-axis, and its upper surface is positioned above the upper surface of the chuck table 104.

[0095] Each of the pair of cutting units 110 is connected to a V-axis movement mechanism (not shown) and a W-axis movement mechanism (not shown). The V-axis movement mechanism moves the cutting unit 110 along the V-axis direction inside the cutting chamber. The W-axis movement mechanism moves the cutting unit 110 along the W-axis direction inside the cutting chamber.

[0096] Furthermore, each of the pair of cutting units 110 has a spindle that extends along the V-axis direction. A cutting blade (working tool) is mounted on the tip of this spindle. The base end of the spindle is connected to a rotational drive source (not shown), such as a motor. When this rotational drive source is operated, the cutting blade rotates together with the spindle, with the axis of rotation being a straight line along the V-axis direction.

[0097] Furthermore, near each of the pair of cutting units 110, a processing water supply unit (not shown) is provided for supplying processing water to at least one of the workpiece 11 or the cutting blade when cutting the workpiece 11 in the cutting chamber. This processing water supply unit has, for example, a nozzle (not shown) for supplying processing water to the area (processing point) of the workpiece 11 that comes into contact with the cutting blade.

[0098] The spinner table 112 is connected to a rotational drive source (not shown). This rotational drive source rotates the spinner table 112 using a straight line passing through the center of the upper surface of the spinner table 112 and along the W-axis as the axis of rotation. Since the spinner table 112 has the same structure as the chuck table 104, a detailed explanation of it will be omitted.

[0099] The cleaning unit 114 has a pipe-shaped shaft that extends along the W-axis. A rotational drive source, such as a motor, is connected to the lower end of this shaft. An arm is connected to the upper end of the shaft.

[0100] This arm is a pipe-shaped member that extends in a direction perpendicular to the W-axis direction, with a length corresponding to the distance from the upper end of the shaft to the center of the upper surface of the spinner table 112. A cleaning nozzle is provided at the tip of the arm to discharge cleaning water downward.

[0101] Furthermore, the shaft is in communication with the cleaning water supply source. Therefore, for example, after rotating the shaft so that the nozzle is positioned above the spinner table 112, when cleaning water is supplied to the shaft and arm from the cleaning water supply source, the cleaning water is supplied from the cleaning nozzle to the upper surface of the spinner table 112.

[0102] The cutting chamber cover 116 has a side plate 116a located between the cutting chamber and the loading / unloading area. A transport opening 118 is formed at the bottom of this side plate 116a so as not to obstruct the movement of the chuck table 104, slide cover 106, and base 108 along the U-axis.

[0103] Furthermore, the lower end of the side plate 116a is provided with a lateral portion 116b that extends outward from the cutting chamber. In other words, the cutting chamber cover 116 is provided with a lateral portion 116b that extends outward from between the side plate 116a and the transport opening 118.

[0104] In the cutting device 94 described above, a lateral section 116b is provided on the cutting chamber cover 116, extending from between the side plate 116a and the transport opening 118 toward the outside of the cutting chamber. In the cutting device 94, the workpiece 11 is cut with the upper surface of the base 108 and the lower surface of the lateral section 116b facing each other.

[0105] Therefore, in the cutting device 94, the width of the gap between the base 108 and the lateral section 116b (the length along the direction toward the outside of the cutting chamber) becomes longer. In this case, the likelihood of the scattered processing water coming into contact with the base 108 or the lateral section 116b as it passes through the gap and remaining in the gap increases.

[0106] As a result, the cutting device 94 can suppress the scattering of processing water to the outside of the cutting chamber with a simpler structure compared to the case where a water supply means for forming a water film in this gap is provided. In addition, in the cutting device 94, a water film may be formed by the processing water remaining in the gap. In this case, the scattering of processing water to the outside of the cutting chamber can be further suppressed.

[0107] Furthermore, the structures and methods of the embodiments described above can be modified as appropriate without departing from the scope of the present invention. [Explanation of Symbols]

[0108] 2: Processing equipment 4: Base (4a: Opening) 6: Conveyor Unit 8a, 8b: Cassette table 10a, 10b: Cassette 11: Workpiece (11a: front side, 11b: back side) 12: Position adjustment mechanism (12a: Table, 12b: Pin) 13: Planned division line 14: Delivery Unit 15: Device 16: Turntable 17: Frame Unit 18: Chuck table (18a: frame, 18b: porous plate) 19: Support member 20: Pedestal 21: Frame (21a: Opening) 22: Processing room cover 24: Top plate (24a, 24b, 24c: through holes) 26a, 26b, 26c, 26d, 26e: Side plate 28a, 28b, 28c, 28d, 28e: Conveyor ports 30a, 30b, 30c, 30d: Horizontal section 32:Support structure 34:Z-axis movement mechanism 36: Guide rail 38: Mobile Plate 40: Screw shaft 42: Motor 44: Fixture 46: Grinding unit (processing unit) 48: Spindle Housing 50: Spindle 52: Mount 54a, 54b: Grinding wheels (machining tools) 56 :Support structure 58:X-axis movement mechanism 60: Guide rail 62: Mobile Plate 64: Screw shaft 66: Motor 68:Z-axis movement mechanism 70: Guide rail 72: Mobile Plate 74: Screw shaft 76: Motor 78: Fixtures 80: Polishing unit (processing unit) 82: Spindle Housing 84: Spindle 86: mount 88: Polishing pad (working tool) 90: Loading Unit 92: Washing Unit 94: Cutting equipment (processing equipment) 96: Base 98: Cassette Table 100: Cassette 102: Conveyor unit (102a: Suction pad) 104: Chuck Table (104a: Frame, 104b: Porous plate, 104c: Clamp) 106: Slide cover 108: Pedestal 110: Cutting unit (machining unit) 112: Spinner Table 114: Washing Unit 116: Cutting chamber cover (processing chamber cover) (116a: side plate, 116b: lateral section) 118: Transport Port

Claims

1. A processing apparatus for processing a workpiece in the first processing chamber, A chuck table for holding the workpiece, A processing chamber cover having a first side plate having a first transport opening formed therein for enabling the transport of the workpiece to or from the first processing chamber of the chuck table that holds the workpiece, A first processing unit for processing the workpiece transported to the first processing chamber using a first processing tool, A first processing water supply unit for supplying first processing water to at least one of the workpiece or the first processing tool when processing the workpiece in the first processing chamber, The first processing chamber includes a base that is positioned at the first transport port when processing the workpiece, The processing chamber cover is provided with a first lateral portion that extends from the lower end of the area of ​​the first side plate that overlaps with the first transport opening toward the outside of the first processing chamber. A processing apparatus in which the base and the first horizontal section are facing each other, and the first processing water scattered when the workpiece is processed in the first processing chamber remains in the gap between the base and the first horizontal section.

2. A processing apparatus according to claim 1, wherein the workpiece is processed in a second processing chamber in addition to the first processing chamber, A second processing unit for processing the workpiece transported to the second processing chamber using a second processing tool, The system further comprises a second processing water supply unit for supplying second processing water to at least one of the workpiece or the second processing tool when processing the workpiece in the second processing chamber, The processing chamber cover further has a second side plate having a second transport opening formed therein for enabling the transport of the workpiece from the first processing chamber to the second processing chamber or from the second processing chamber to the first processing chamber of the chuck table that holds the workpiece. The base is positioned at the second transport opening when processing the workpiece in the second processing chamber. The processing chamber cover is provided with a second lateral portion that extends from the lower end of the area of ​​the second side plate that overlaps with the second transport opening toward both the inside of the first processing chamber and the inside of the second processing chamber. A processing apparatus in which the base and the second horizontal section are facing each other, and the second processing water scattered when the workpiece is processed in the second processing chamber remains in the gap between the base and the second horizontal section.

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