Footwear assembly with 3D printed sole assembly

The additive manufacturing of a sole assembly with a grid structure and integral anchoring mechanisms addresses the labor-intensity and recyclability issues of conventional footwear, facilitating quick assembly and disassembly.

JP7836121B2Active Publication Date: 2026-03-26HILOS INC
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2023-05-23
Publication Date
2026-03-26

AI Technical Summary

Technical Problem

Conventional footwear assembly is labor-intensive, requires numerous components, and is difficult to disassemble for recycling due to cement bonding, necessitating lower labor cost manufacturing.

Method used

A sole assembly manufactured via additive manufacturing with a grid structure and integral anchoring mechanisms, allowing for quick assembly and disassembly, using fewer components and recyclable materials.

Benefits of technology

Simplifies footwear assembly, reduces component count, and enables easier recycling while maintaining comfort and durability.

✦ Generated by Eureka AI based on patent content.

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Abstract

Footwear comprising a sole assembly secured to a lower portion of an upper. The sole assembly is at least partially made by an additive manufacturing process. The sole assembly has a platform layer and a lattice including interconnected laths extending away from the platform layer at least in a forefoot and heel portion. The lattice and platform layer support a wearer's foot, and the laths in the lattice provide cushioning for the foot. A plurality of spaced apart internal support structures extending away from the platform layer and defining voids within the sole assembly. The internal support structures also provide cushioning for the wearer's foot. The sole assembly has a peripheral portion coupled within the sole assembly, and an integral anchoring mechanism is adjacent the peripheral portion and adjacent at least one of the voids. The upper is secured to the peripheral portion with a fastening mechanism that is secured in a secure engagement with the anchoring mechanism without penetrating into the void. An outsole portion is connected to a bottom of the sole assembly and forms a ground-engaging surface.
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Description

Technical Field

[0001] [Cross - Reference to Related Applications] This non - provisional patent application claims the benefit and priority of U.S. Provisional Patent Application No. 63 / 345,833, entitled "FOOTWEAR ASSEMBLY WITH 3 - D PRINTED SOLE ASSEMBLY", filed on May 25, 2022, which is hereby incorporated by reference in its entirety.

[0002] This patent application generally relates to footwear, and more specifically to footwear having a 3D - printed or additive - manufactured structure.

Background Art

[0003] Typically, footwear is assembled by joining or bonding together several separate layers (e.g., insole, midsole, and outsole), with the upper attached to the sole and fitted between the midsole and outsole, or midsole and insole, depending on the lamination method. The upper covers the top and sides of the user's foot, and the sole covers the bottom of the user's foot and makes contact with the ground. The upper and sole components, and / or their parts, may be assembled together during or after the manufacture of each component. Conventional footwear has a large number of components that must be created, finished, and assembled into a final product. As a result, each of these many parts must be handled during assembly, which can make the assembly process labor-intensive. Furthermore, the large number of components results in a large inventory of parts that must be managed. In addition, the cement used to bond these layers together prevents the product from being disassembled for recycling. The process of creating, lasting, assembling, and finishing footwear with so many components is labor-intensive, which increases the complexity of constructing conventional footwear and, at the same time, necessitates moving its manufacture to areas with lower labor costs. There is a need for footwear assemblies with significantly fewer components that can be manufactured and assembled quickly, easily, and inexpensively, while still providing more fashionable, functional, durable, and comfortable products that can adapt to the higher labor costs in advanced economic zones. [Overview of the Initiative]

[0004] The footwear assemblies and related methods disclosed herein overcome the shortcomings of the prior art and provide additional benefits. One embodiment of the art provides a footwear assembly comprising an upper defining an internal area configured to receive the wearer's foot. A sole assembly is fixed to the lower portion of the upper. The sole assembly is manufactured by an additive manufacturing process. The sole assembly has a heel portion and a forefoot portion. The sole assembly has an insole portion comprising a platform layer and a grid having interconnected laths extending away from the platform layer in at least the forefoot and heel portions. The grid and platform layer are positioned on the sole assembly to support the wearer's foot, and the laths in the grid are configured to flex or bend to provide a first cushioning effect to the wearer's foot. The sole assembly has a plurality of spaced internal support structures extending downward away from the platform layer and defining voids within the sole assembly. The internal support structures are located at least within the heel portion or the forefoot portion, and the support structures are configured to flex or bend to provide a second cushioning effect to the wearer's foot. The sole assembly has a peripheral portion coupled within the sole assembly, and the sole assembly has a plurality of integral anchoring mechanisms positioned adjacent to the peripheral portion and adjacent to at least one of the voids. The lower portion of the upper is fastened to the peripheral portion of the sole assembly by fastening mechanisms that are securely engaged and fixed to the anchoring mechanisms without penetrating into the voids. The sole assembly has an outsole portion that connects to the bottom of the sole assembly and forms a ground engagement surface, and the outsole portion is positioned to close and seal the voids within the sole assembly.

[0005] In some embodiments, the sole assembly comprises an insole portion integrally connected to a midsole portion having one or more integral first mounting mechanisms. The outsole portion has one or more second mounting mechanisms that engage mateably with the first mounting mechanisms and fix the outsole portion to the bottom of the midsole portion, enclosing the void within the midsole portion. This allows for quick, easy, and accurate assembly of the outsole portion relative to the midsole portion, thereby closing and sealing the void within the midsole portion.

[0006] Another embodiment of the present technology provides a footwear assembly comprising an upper and a sole assembly fixed to the lower portion of the upper. The sole assembly is manufactured by an additive manufacturing process. The sole assembly has a heel portion, a forefoot portion, and a peripheral portion around the heel and forefoot portions. The sole assembly has a midsole portion, an insole portion above the midsole portion, and an outsole portion connected to the bottom of the midsole portion. The insole portion includes a grid having a plurality of interconnected laths. The grid is positioned at least in the forefoot and heel portions. The grid is positioned to support the wearer's foot, and the laths within the grid are configured to flex and provide cushioning to the wearer's foot. The sole assembly has a plurality of internal support structures extending downward relative to the grid and defining a void within the sole assembly. The internal support structures are located at least in the heel or forefoot portion, and the support structures are configured to flex in response to loads applied from the wearer's foot during use. The sole assembly has a plurality of integral anchoring mechanisms positioned radially outward in the void and support structures. The lower portion of the upper is secured to the periphery of the sole assembly using fastening mechanisms embedded in the anchor mechanism. The outsole portion is positioned to close at least a portion of the void within the sole assembly and form a ground engagement surface.

[0007] Another embodiment of the present technology provides a footwear sole assembly comprising an insole portion and a midsole portion formed as a single structure by an additive manufacturing process. The outsole portion is attached to the midsole portion. The sole assembly has a heel portion, a forefoot portion, and a peripheral portion around the heel and forefoot portions, the peripheral portion being configured to connect to the lower portion of the upper. The insole portion includes a platform layer and a grid, the platform layer being located above the midsole portion. The grid has a plurality of interconnected laths extending away from the platform layer. The grid is positioned at least in the forefoot and heel portions. The laths within the grid are configured to flex to provide cushioning to the wearer's foot. The midsole portion has a plurality of internal support structures extending downward relative to the platform layer and defining voids within the midsole portion. The internal support structures are located at least in the heel portion or the forefoot portion. The support structures are configured to flex in response to loads applied by the wearer's foot during use. The upper insole or midsole portion has multiple integrated anchoring mechanisms positioned radially outward within the voids and support structure. The peripheral portion of the sole assembly is configured to be attached to the lower portion of the upper using fastening mechanisms embedded in the anchoring mechanisms. The outsole portion is positioned to close at least a portion of the voids within the sole assembly to form a ground engagement surface.

[0008] Another embodiment of the present technology provides a sole assembly for footwear having an upper. The sole assembly is formed by additive manufacturing and has an insole portion, a midsole portion, and an outsole portion. The midsole portion and the outsole portion are formed together as a single structure, and the upper insole portion is mounted on top of the midsole portion. The sole assembly has a heel portion, a forefoot portion, and a peripheral portion around the heel and forefoot portions. The insole portion is located above the midsole portion and comprises a platform layer and a grid. The grid has a plurality of interconnected laths extending away from the platform layer. The grid is positioned at least in the forefoot and heel portions, and the laths within the grid are configured to flex to provide cushioning to the wearer's foot. The midsole portion has a plurality of internal support structures extending downward relative to the platform layer and defining voids within the midsole portion. The internal support structures are located at least in the heel portion or the forefoot portion. The support structures are configured to flex in response to loads applied from the wearer's foot during use. The upper insole portion or midsole portion has a plurality of integrated anchoring mechanisms positioned radially outward in the gap and support structure, and the sole assembly is configured to be attached to the lower portion of the upper using fastening mechanisms embedded in the anchoring mechanisms. The insole portion is positioned to close at least a portion of the gap of the sole assembly when attached to the midsole portion.

[0009] Another embodiment of the present technology provides a method for manufacturing a footwear assembly having an upper and a sole assembly. The method comprises a step of forming the sole assembly via additive manufacturing. The sole assembly includes an outsole portion, a midsole portion, and an insole portion. The outsole portion is connected to the bottom of the midsole portion, and the insole portion is positioned on top of the midsole portion. The sole assembly has a heel portion, a forefoot portion, and a peripheral portion around the heel and forefoot portions, the peripheral portion being configured to connect to the lower portion of the upper. The insole portion has a grid including a plurality of interconnected laths. The grid is positioned at least in the forefoot and heel portions and is positioned to support the wearer's foot. The laths within the grid are configured to flex to provide cushioning to the wearer's foot. The midsole portion has a plurality of spaced internal support structures that extend downward relative to the grid and define gaps within the sole. The internal support structures are located at least in the heel portion or the forefoot portion. The support structures are configured to flex in response to loads applied from the wearer's foot during use. The midsole portion has one or more first mounting mechanisms, and the insole portion or outsole portion has one or more second mounting mechanisms that are mateably connected to the first mounting mechanisms. The other insole or outsole portion is integrally formed with the midsole portion. The sole assembly has a plurality of integral anchoring mechanisms positioned radially outward in the gaps and support structures. The method also includes the step of connecting the other of the insole or outsole portion to the sole portion by mateably interconnecting the first and second mounting mechanisms. The method also includes the step of attaching the upper to the sole assembly.

[0010] Embodiments of footwear assemblies and manufacturing processes introduced herein can be better understood by referring to the following detailed description in conjunction with the accompanying drawings, where similar reference numerals in the accompanying drawings indicate identical or functionally similar elements. [Brief explanation of the drawing]

[0011] Embodiments of footwear assemblies and manufacturing processes introduced herein can be better understood by referring to the following detailed description in conjunction with the accompanying drawings, where similar reference numerals in the accompanying drawings indicate identical or functionally similar elements.

[0012] [Figure 1A] This is a side view of a footwear assembly according to one or more embodiments of the present technology. [Figure 1B] This is a side view of a footwear assembly according to one or more embodiments of the present technology.

[0013] [Figure 2] This is an isometric view of the sole assembly, shown detached from the upper of the footwear assembly in Figure 1A.

[0014] [Figure 3] This is a cross-sectional view taken essentially along line 3-3 in Figure 2.

[0015] [Figure 4] This is a cross-sectional view taken essentially along line 4-4 in Figure 2.

[0016] [Figure 5] This is a cross-sectional view of an alternative embodiment of the sole assembly shown in Figure 2.

[0017] [Figure 6] Figure 5 shows a partially exploded view and a transparent isometric view of the sole assembly.

[0018] [Figure 7A] This is a partially exploded isometric view of the sole assembly of another embodiment of this technology. [Figure 7B] This is a partially exploded isometric view of the sole assembly of another embodiment of this technology.

[0019] [Figure 7C] These are cross-sectional views of Figure 7A, taken substantially along the line 7C-7C. [Figure 7D] They are cross-sectional views of FIG. 7A taken substantially along line 7D-7D, respectively.

[0020] [Figure 8A] It is a partially exploded isometric view of a sole assembly according to an embodiment of the present technology. [Figure 8B] It is a partially exploded isometric view of a sole assembly according to an embodiment of the present technology.

[0021] [Figure 8C] They are cross-sectional views of FIG. 8A taken substantially along line 8C-8C, respectively. [Figure 8D] They are cross-sectional views of FIG. 8A taken substantially along line 8D-8D, respectively.

[0022] [Figure 9A] It is a partially exploded plan view of a sole assembly according to another embodiment of the present technology.

[0023] [Figure 9B] It is a partially exploded cross-sectional view of the sole assembly of FIG. 19A. [Figure 9C] It is a partially exploded cross-sectional view of the sole assembly of FIG. 19A. [Figure 9D] It is a partially exploded cross-sectional view of the sole assembly of FIG. 19A.

[0024] [Figure 10] It is a cross-sectional view of the sole assembly of FIG. 10B shown in a non-exploded view.

[0025] [Figure 11A] It is a partially exploded isometric view of a sole assembly according to another embodiment of the present technology. [Figure 11B] It is a partially exploded isometric view of a sole assembly according to another embodiment of the present technology.

[0026] [Figure 11C] It is a cross-sectional view of the embodiment of FIG. 11A. [Figure 11D] This is a cross-sectional view of the embodiment shown in Figure 11A.

[0027] [Figure 12A] This is a partially exploded plan view of a sole assembly of another embodiment of the present technology.

[0028] [Figure 12B] Figure 12A is a partially exploded cross-sectional view of the sole assembly. [Figure 12C] Figure 12A is a partially exploded cross-sectional view of the sole assembly. [Figure 12D] Figure 12A is a partially exploded cross-sectional view of the sole assembly.

[0029] [Figure 13A] These are plan and cross-sectional views of the sole assembly in Figure 12A, in an exploded view. [Figure 13B] These are plan and cross-sectional views of the sole assembly in Figure 12A, in an exploded view.

[0030] [Figure 14A] This is an isometric view of a sole assembly of another embodiment of the present technology.

[0031] [Figure 14B] Figure 14A is a cross-sectional view of the sole assembly. [Figure 14C] Figure 14A is a cross-sectional view of the sole assembly.

[0032] [Figure 15A] This is a partially exploded top isometric view of the sole assembly of another embodiment of the present technology.

[0033] [Figure 15B] Figure 15 shows a partially disassembled bottom isometric view of the sole assembly.

[0034] [Figure 16A] This is an isometric view of a sole assembly of another embodiment of the present technology.

[0035] [Figure 16B] Figure 16A is a cross-sectional view of the sole assembly.

[0036] The headings provided herein are for convenience only and do not necessarily affect the scope or meaning of the claimed embodiments. Furthermore, the drawings are not necessarily drawn to scale. For example, some dimensions of elements in the drawings may be enlarged or reduced to help improve the understanding of the embodiments. Also, although the disclosed technology is adaptable to various modifications and alternative forms, specific embodiments are shown by example in the drawings and described in detail below. However, this is not intended to limit the embodiments described. On the contrary, the embodiments are intended to cover all modifications, equivalents, and alternatives that fall within the scope of the embodiments. [Modes for carrying out the invention]

[0037] Various examples of footwear assemblies introduced above are described in more detail here. The following descriptions provide specific details for a thorough understanding of these examples and for the explanations that make them possible. However, those skilled in the art will understand that the techniques discussed herein can be practiced without many of these details. Similarly, those skilled in the art will understand that the art may include many other features not described in detail herein. Furthermore, in order to avoid unnecessarily obscuring the relevant descriptions, some well-known structures or functions may not be shown or described in detail below. For the purpose of brevity of the discussion, footwear assemblies are described herein with reference to top and bottom, upper and lower, up and down, and / or left or right, with respect to the spatial orientation of the embodiments shown in the figures. However, it should be understood that footwear assemblies can be moved to or used in different spatial orientations without changing the structure of the system.

[0038] The terms used herein should be interpreted in their broadest reasonable form, even when used in conjunction with detailed descriptions of some specific examples of embodiments. Indeed, some terms may be further emphasized below, but any term intended to be interpreted in any restrictive form is defined so clearly and specifically in this section.

[0039] Figures 1A and 1B show footwear assemblies 10 according to one or more embodiments of the present technology. The footwear assembly 10 has an upper 12 attached to a sole assembly 14 to define an internal area 16 configured to receive the wearer's foot. The upper 12 has a lower portion 18 that extends over the sole assembly 14 and is integrally connected to a toe portion 20 that forms the top of the internal area 16. The footwear assemblies 10 shown in Figures 1A and 1B are wooden clogs and sliding shoes, respectively. These are just two examples of styles of footwear that may include the present technology. It should be understood that the footwear assembly 10 of the present technology may include other styles of footwear, such as styles that may have a heel strap, an enclosed heel cup, an open-toe configuration, or other configurations. Furthermore, the footwear assembly 10 according to the present technology may be a shoe, a boot, a sandal, or other style of footwear.

[0040] The sole assembly 14 is fixed to or otherwise connected to the lower portion 18 of the upper 12. In the embodiments of Figures 1A and 1B, the lower edge of the upper 12 is fixed to the periphery 22 of the sole assembly. In other embodiments, the lower portion 18 of the upper 12 may wrap around a portion of the sole assembly so that the actual edge area of ​​the upper 12 can be captured on or within a portion of the sole assembly 10, which will be discussed in more detail below. The upper 12 can be attached to the sole assembly 14 using fasteners 23 such as staples, nails, rivets, or stitching, or via adhesive, or by a combination of fastening techniques.

[0041] Figure 2 is an isometric view of the sole assembly 14 with the upper removed, and Figures 3 and 4 are cross-sectional views of the sole assembly of Figure 2 taken substantially along lines 3-3 and 4-4, respectively. The sole assembly 14 is configured to support the wearer's foot on an insole portion 24 connected to a midsole portion 26. The outsole portion 28 is connected to the bottom area of ​​the midsole portion 26 and defines a durable ground-engaging bottom surface. In some embodiments, an insole 30 (Figure 1B) may be positioned on the insole portion 24 to form an upper surface that engages with the wearer's foot. In the embodiments illustrated, the sole assembly 14 is a whole-foot assembly having a heel portion 32, an arch portion 34 in front of the heel portion, and a forefoot portion 36 in front of the arch portion. In other embodiments, the sole assembly 10 may have a section structure in which the heel section is connected to one or more forefoot sections via a spanning arch structure or the like.

[0042] The insole portion 24, the midsole portion 26, and / or the outsole portion 28 may be manufactured via 3D printing and / or other additive manufacturing processes. As will be discussed in more detail below, the insole portion 24, the midsole portion 26, and the outsole portion 28 may be manufactured via additive manufacturing such as selective laser melting (SLM), selective laser sintering (SLS), electron beam melting (EBM), or other powder bed fusion techniques, or other additive manufacturing techniques for forming a single, integrated sole assembly 14. The sole assembly 14 may be made from recycled and / or recyclable materials. In some embodiments discussed below, the insole portion 24 and the midsole portion 26 are formed together or otherwise manufactured together and are integrally connected to one another as a single component assembled with the outsole portion 28, which is manufactured separately via additive manufacturing. In other embodiments discussed below, the midsole portion 26 is integrally formed and connected with the outsole portion 28 as a single component, while the insole portion 24 is formed separately and attached to the top of the midsole portion 26 during assembly. This manufacturing process reduces the number of separate parts that need to be assembled to construct the sole assembly 14, thereby simplifying the assembly process, reducing the number of parts for assembly, reducing assembly time, and lowering the cost of the footwear assembly 10 (Figure 1).

[0043] As shown in Figures 3 and 4, the insole portion 24 of the illustrated embodiment has an integral grid 38 connected to a platform layer 40. The grid 38 comprises a plurality of interconnected laths 42 extending away from the platform layer 40. The laths 42 are provided at least in the heel portion 32 and the forefoot portion 36 (Figure 4) so ​​that the grid 38 and the platform layer 40 support the wearer's foot on the insole portion 24. The laths 42 are configured to bend or flex to provide cushioning to the wearer's foot in the insole portion 42. In the illustrated embodiment, the insole portion 24 has a full-foot grid 38 and platform layer 40 structure extending across the heel, arch, and forefoot portions 32, 34, and 36 (Figure 4). The platform layer 40 may be a single integral component or may be formed by a plurality of segments in the heel, arch, or forefoot portions 32, 34, and 36. In some embodiments, the platform layer 40 may be provided only in the heel portion 32, or in the arch portion 34, or in the forefoot portion 36, or in any combination thereof.

[0044] The platform layer 40 may be solid or it may have multiple pores, thereby reducing weight and facilitating the removal of excess material, such as powder or other materials used in the additive manufacturing process. For example, the platform layer 40 and / or grid 38 are configured to allow pressurized air or other cleaning medium to remove excess material from the insole portion 24 before the final assembly of the sole assembly 14 and / or footwear assembly 10 (Figure 1B). The embodiment shown has a grid 38 extending upward from the platform layer 40 so that the grid 38 is between the wearer's foot and the platform layer 40. Accordingly, the platform layer 40 is supported on the midsole portion 26. In other embodiments discussed below, the insole portion 24 may be inverted so that the platform layer 40 is above the grid 38 so that the lath 42 extends downward away from the platform toward the midsole portion 26.

[0045] In some embodiments, the grid 38 may define the uppermost surface of the sole assembly 14 so that the wearer's foot rests directly on the grid 38. In other embodiments, an insole 30 (Figure 1B) may cover the grid 38 and be fixed to the sole assembly 14. The insole 30 may be made by additive manufacturing, but in other embodiments, the insole may be made of other materials, such as leather, fabric, or synthetic material. The insole 30 is fixed to the periphery of the sole assembly 14 so that at least a portion of the insole 30 is captured between the edge portion of the upper and the periphery portion 56 of the sole assembly 14. In other embodiments, the insole portion 24 may have one or more retaining mechanisms 52 on the insole portion, for example, on the grid 38 and / or on the platform layer, for capturing the insole 30. The retaining mechanism 52 overlaps with the insole 30 and may include a lip around the insole portion 24 that captures the edge of the insole between the lip and the surface of the insole portion 24 that supports the wearer's foot. In some embodiments, the insole 30 may be captured and held in place below the retaining mechanism 52 via adhesive or other fastening techniques.

[0046] As shown in Figure 3, the midsole portion 26 of the sole assembly has a plurality of internal supports 44 extending between the insole portion 24 and the outsole portion 28. The internal supports 44 are spaced apart from each other, defining a void 46 within the sole assembly 14. The internal supports 44 are positioned at least in the heel portion 32 and / or forefoot portion 36 and are configured to support portions of the insole portion 24. In the illustrated embodiment, the internal supports 44 are oriented substantially vertically and extend between the lateral and central side walls 48 and 50 of the midsole portion. In other embodiments, some or all of the internal supports 44 may extend in the anterior-posterior direction. The internal supports 44 are shaped, sized and positioned so that they can also flex or bend to provide additional cushioning to the wearer's foot in addition to the cushioning from the grid 38. The midsole portion 26 and internal supports 40 may have different configurations in different portions of the midsole portion 26 to provide different levels of cushioning. For example, the internal support 44 in the heel portion 32 may be configured to provide a greater degree of cushioning in the heel portion 32 to adapt to the load during the heel strike phase of the walking cycle, while the internal support 44 in the forefoot portion 36 may provide less cushioning. In some embodiments, the internal support 44 may be provided only in the heel portion 32 for cushioning during heel strike.

[0047] Internal supports 44 and gaps 46 may be positioned to help control the flexion of the sole assembly 14 over the walking cycle when the wearer walks or runs. The internal supports 44 and gaps 46 may form flex grooves for controlled flexion of the sole assembly 14 at locations corresponding to a selected part of the wearer's foot, such as in the midfoot area on the forefoot portion 28. The gaps 46 may provide an integrated hollow area within the midsole portion 26 for a lightweight sole assembly 14. Accordingly, the footwear assembly 10 may have the appearance of a shoe style such as a clog, which is usually heavy, inflexible, and provides little cushioning. However, the sole assembly 14 of this technology allows the sole assembly 14 to be 3D printed to look like a clog, while still being lightweight, flexible, and having controlled flexibility.

[0048] As shown in Figure 3, the sole assembly 14 of the illustrated embodiment has a plurality of internal anchoring mechanisms 54 located around the peripheral portion 56 of the sole assembly 10. In the illustrated embodiment, the anchoring mechanisms 54 are positioned inward adjacent to the side walls of the midsole portion 26 and / or the periphery of the insole portion 24. The anchoring mechanisms 54 are configured to allow the upper 12 (Figure 1A) to be securely fastened to the sole assembly 14 even if the midsole portion adjacent to the side wall inward is hollow. The anchoring mechanisms 54 provide an integral internal structure in which fasteners 23 (Figure 1B), such as staples, nails, or rivets, can be embedded without penetrating into the void 46. In the illustrated embodiment, the anchoring mechanisms 54 are integrally connected to the periphery of the insole portion below the platform layer 40. In another embodiment, the anchor mechanism 54 may be integrally connected to the inner surface of the midsole side wall so that the fastener 23 can secure the lower portion 18 of the upper 12 (Figure 1A) to the sole assembly 14 by extending through the side wall of the midsole and through the upper material and being fully embedded within the anchor mechanism 54. In yet another embodiment, the integral anchor mechanism 54 may be connected around the insole portion 24 so that the lower portion of the upper can be sewn to the insole portion 24. In other embodiments, the upper 12 may be attached to at least a portion of the sole assembly 14 via strings or cables to apply tension to the attachment, either directly, through an internal cavity in the sole assembly, or via an anchor mechanism as described in more detail below. In some embodiments, the upper may be attached to at least a portion of the sole assembly by "string lasting" such that the strings or cables or other tension-applying lines are configured to overlast the upper over the associated portion of the sole assembly.A form of string lasting is disclosed in U.S. Patent Application Publication No. 2021 / 033003, filed April 23, 2021, entitled "System and Methods for Lasting an Upper to a 3D Printed Platform," which is incorporated herein by reference in its entirety. In some embodiments of the Art, the upper may be strobel-stitched and then string-lasted directly to the sole assembly via a lattice-like insole lath, as discussed below. Alternatively, the upper may be overlasted to the sole assembly via engagement with strings (or other tension-applying lines) in combination with internal or external channels and cavities formed on the sole assembly. Other embodiments may utilize combinations of these techniques.

[0049] As shown in Figures 1A, 2, and 3, the sole assembly 10 has one or more alignment mechanisms 58 configured to receive the lower portion 18 of the upper 12 and align it along a selected portion of the sole assembly and adjacent to the anchor mechanism 54 (Figure 3). Accordingly, the lower portion 18 of the upper 12 can be easily and quickly positioned relative to the sole assembly and aligned with the alignment mechanism 58, so that the fastener 23 (Figure 1A) can be attached to and embedded in the anchor mechanism, thereby securely fastening the upper 12 to the sole assembly 14. In the embodiment shown, the alignment mechanism 58 is integrally formed in at least a portion of the peripheral area of ​​the insole portion 24 so that the edge of the upper 12 is laterally aligned with the anchor mechanism 54. In other embodiments, the alignment mechanism 58 may be provided on the midsole portion 26, or on both the insole and the midsole portions 24 and 26. The alignment mechanism 58 may be provided on the outer surface of the insole or midsole portion 24 or 26, or the alignment mechanism 58 may be formed on the inner portion of the insole or midsole portion 24 or 26 and configured to align with the upper 12 for connection with the sole assembly 14.

[0050] Figures 5 and 6 are cross-sectional and exploded isometric views of a sole assembly 60 according to an alternative embodiment of the sole assembly 14 shown in Figure 2. Figures 7A–7D are additional views of the sole assembly 60 of Figure 5. This sole assembly 60, as an example, has an insole portion 24 formed integrally with a midsole portion 26 by additive manufacturing. The midsole portion 26 has internal supports 44 that extend downward from the insole portion 24 and define spaced gaps 46. As seen in Figure 6, the internal supports 44 may be arranged to form honeycomb-shaped gaps, but the internal supports 44 may be positioned to form gaps having other shapes, which may be symmetrical or uniform or not.

[0051] The outsole portion 28 is formed as a separate component from the integrated insole and midsole portions 24 / 26 by additive manufacturing or other manufacturing techniques. The outsole portion 28 is configured to be fixedly attached to the bottom portion of the midsole portion 26 such that the outsole portion 28 extends over and closes the gap 46. This structure is designed to control the weight of the sole assembly 10 and to control the flow of air or other media in a cleaning process for the removal of excess material such as powder or other materials used in the additive manufacturing process. For example, the integrated insole / midsole portion 24 / 26 is configured to allow pressurized air or other cleaning media to flow into and through the sole assembly component to easily and quickly remove excess powder or other material from the sole assembly before the insole portion 28 is assembled on top of the bottom of the midsole portion 26. In other embodiments, the midsole / insole portion 24 / 26 may be cleaned using suction or other vacuum techniques. The structure of the midsole portion 26 may also be configured to accommodate a separate material within the void 46, such as foam, a non-Newtonian material, or other cushioning or energy-returning material. This cushioning or energy-returning material, or a combination thereof, may be added at a selected location within the midsole portion 26, for example, at the heel or forefoot portion 32 or 36, before the outsole portion 28 is attached and the void 46 is closed and sealed.

[0052] In the illustrated embodiments, the bottoms of the outsole portion 28 and the midsole portion 26 have fitting attachment mechanisms 62 and 64 extending around at least a portion of their respective peripheries. For example, the attachment mechanism 62 around the outsole portion 28 includes a projection 66 extending upward from the surface of the outsole portion 28. The projection 66 may be a continuous projection or multiple segments positioned around the outsole portion 28. The attachment mechanism 64 at the bottom of the midsole portion 26 has a groove 68 that securely receives the projection 66 in a fitting snap-fit ​​engagement. While the illustrated embodiments show a projection 66 on the outsole portion 28 and a groove 68 on the midsole portion 26, in other embodiments the projection 66 may be at the bottom of the midsole portion 26 and the groove 68 may be on the outsole portion 28.

[0053] The interlocking mechanisms 62 / 64 act to precisely align the outsole portion 28 with the midsole portion 26 for easy and quick assembly. In some embodiments, as shown in Figure 5, the internal support 44 is shaped, sized, and positioned so that its lower edge 70 is received within a plurality of channels 72 formed at the top of the outsole portion 28. The interlocking mechanisms 62 / 64 and / or the internal support 44 and channels 72 may be fixed to each other via adhesive, tight friction fit, physical mechanical attachment, or a combination of attachment techniques. In another embodiment, as seen in Figures 7A–7D, the internal support 44 of the midsole portion 26 is shaped, sized, and positioned so that their lower edges 70 engage with the top outsole portion 28 without being fitted into interlocking channels.

[0054] In the embodiments shown in Figures 7A-7D, the insole portion 24, integrally formed with the midsole portion, may include a platform layer 40 having a grid 38 on top of the platform layer 40 to form a foot support surface. In other embodiments, the insole portion 24 does not have to include a grid, as shown, for example, in Figure 5. The periphery of the upper of the insole portion 24 may include an attachment mechanism 75, such as a groove 76 between a pair of flanges 78 that receive the lower portion 18 (not shown) of the upper 12. This attachment mechanism 75 can be used to fasten an insole to the insole portion on the grid. The insole can be fastened to the insole portion 24 by sewing, adhesive, fasteners, or other attachment techniques. This structure provides a very strong, quick, and inexpensive installation of the insole to the insole portion 24. As shown in Figures 7A and 7D, the midsole portion 26 has an alignment mechanism 58 configured to receive and align the upper 12 on the sole assembly 14, such that the fastener extends through the upper and through the side wall of the midsole and can be embedded in the anchor mechanism 54 (Figure 7D) without protruding into the gap 46.

[0055] Figures 8A–8D are exploded isometric and cross-sectional views of a sole assembly 80 according to another embodiment of the present technology. The sole assembly 80 has a structure similar to the sole assembly 60 discussed above, having an integral, unified insole portion 24 and a midsole portion 26 attached to a separate outsole portion 28. However, the main difference between these embodiments is the structure of the insole portion 24. In this embodiment, the integral insole portion 24 is constructed to have a platform layer 40 above a grid 38. The lath 42 of the grid 38 (Figures 8C and 8D) extends downward and is supported on the midsole portion 26, including by internal supports 44. The platform layer 40 may be constructed so that its top surface supports the wearer's foot. Thus, the insole may not be assembled on the insole portion so that the insole portion 24 does not include mounting mechanisms such as grooves and flanges 74 and 76 shown in Figures 7A and 7D around the periphery of the insole portion 24.

[0056] Figures 9A-9D are partially exploded isometric and cross-sectional views of a sole assembly 90 of one embodiment of the present technology. Figure 10 is a cross-sectional view of the sole assembly 90 of Figure 9B in an unexploded view. In this embodiment, the insole and midsole portions 24 and 26 of the sole assembly 90 are either integrally printed or otherwise additively manufactured as a single structure, respectively, and the outsole portion 28 is either separately printed or otherwise formed. Accordingly, the bottom of the midsole portion 26 is initially open and accessible before the outsole portion 28 is attached, so that any excess powder used in the additive manufacturing process, or other materials, can be removed from the voids 46 and / or grid, via pressurized air or other fluids, or by suction or other vacuum techniques. The outsole portion 28 is joined to the bottom of the midsole portion via a fitting attachment mechanism 92 (Figures 9B and 9D) positioned around the midsole and the periphery of the outsole portions 26 and 28, respectively. In the illustrated embodiment, the mounting mechanism 92 on the outsole portion 28 is formed by a plurality of hook flanges 94 extending upward from the upper surface of the outsole portion 28. In the illustrated embodiment, the hook flanges 94 comprise a plurality of hook flange segments positioned around the periphery of the outsole portion 28. In other embodiments, the hook flanges 94 may be a single, unified mechanism around the periphery of the outsole.

[0057] The interlocking attachment mechanism at the bottom of the midsole portion 26 is a hook-shaped lip 96 configured to extend over and be captured by a hook flange 94, as shown in Figure 10. When the outsole portion 28 is assembled with the insole / midsole portion, the outsole portion 28 and the midsole portion 26 are aligned together and pressed against each other. The hook-shaped lip 96 slides on the hook flange 94, thereby slightly bending the hook flange 94 and then snapping it into place on the hook-shaped lip 96, thereby capturing the hook-shaped lip under the hook portion of the flange 94. Accordingly, the outsole portion 26 can be assembled quickly and easily with the insole / midsole portion 24 / 26 by snapping the outsole portion 28 into place manually or via an automated tool. Although the illustrated embodiment utilizes an interlocking hook configuration, other attachment mechanisms may be used to easily and quickly connect the outsole portion 28 to the bottom of the midsole portion 26 during the formation of the sole assembly 90.

[0058] As shown in Figures 9A and 9D, the sole assembly 90 has an internal alignment mechanism 98 configured to receive and align the lower portion (not shown) of the upper 12 for attachment to the insole / midsole portion 24 / 26. In the illustrated embodiment, the insole portion 24 and the midsole portion 26 are configured to provide an open slot 100 between the edge of the insole portion 24 and the side wall of the midsole portion 26. The slot 100 can receive a portion of the upper for aligning the upper to the sole assembly for final attachment. The bottom of the midsole portion 26 may also have a recessed area 102 or other shaped portion that receives and aligns the edge of the upper so that the upper extends through the slot 98, wraps around the midsole portion 26, and is received within the recessed area 102. The aligned upper can then be securely fixed in place by fasteners, adhesive, or other preferred bonding techniques. Once the upper is attached to the insole / midsole portion 24 / 26, the outsole portion 28 can be snap-fitted to the bottom of the midsole portion 26, as discussed above. This structure, including the slot 100 and recessed area 102, is particularly well suited to uppers formed by straps, such as sandals, slides, or other open-toe style footwear. However, this structure may be used for other upper configurations or styles of footwear.

[0059] Figures 11A–11D are exploded isometric and cross-sectional views of a sole assembly 110 according to another embodiment of the present technology. In this embodiment, the midsole portion 26 may be printed integrally with the outsole portion 28 or otherwise manufactured additionally, and the insole portion 24 may be printed separately or otherwise formed. The bottom of the void 46 of the midsole portion 26 is closed by the outsole portion 28, and the top of the void 46 is open until the insole portion 24 is mounted on top of the midsole portion 26. In the illustrated embodiment, the void 46 has a honeycomb shape, but in other embodiments the void 46 may have a different shape, size, or configuration. In the illustrated embodiment, a separate insole portion 24 is constructed including a grid 38 (Figure 11C)) extending downward from the platform layer 40 and is supported on the internal support 44 of the midsole portion 26. In other embodiments, the insole portion 24 may have the reverse configuration in which the grid 38 extends upward from the platform layer 40. Access to the open gap 46 and the grid 38 before the insole and midsole portions 24 and 26 are joined allows for the easy and rapid removal of excess powder or other materials through the top of the midsole portion 26 and the bottom of the insole portion 24, respectively.

[0060] The insole portion 24 and the midsole portion 26 have a fitting attachment mechanism 112 around some or all of their periphery to securely interconnect the insole portion with the integrated midsole / outsole portion 26 / 28 to form an assembled sole assembly 110. As shown in Figure 11D, the fitting attachment mechanism 112 includes a flange 114 extending downward from the periphery of the platform layer 40 and a fitting groove 116 around the top of the midsole portion 26. Accordingly, the attachment mechanism 112 provides a fuss connection between the insole and midsole portions 24 and 26 for secure interconnection between the components. In other embodiments, the fuss configuration of the attachment mechanism 112 may be the reverse configuration in which the flange 114 extends upward around the midsole portion 26, and the groove 116 may be provided around the insole portion 24. In the illustrated embodiment, the mounting mechanism 112 is substantially continuous around the periphery of the insole and midsole portions 24 and 26, but the mounting mechanism 92 may be segmented to include a plurality of mounting mechanism segments positioned around the periphery of the insole and midsole portions. The mounting mechanisms 112 of the insole and midsole portions 24 and 26 may be permanently joined together using adhesive, stitching, fasteners, welding, or other suitable joining techniques.

[0061] As shown in Figure 11D, the insole portion 24 of the illustrated embodiment includes an integral anchoring mechanism 54 extending downward from the grid 38 and / or platform layer 40. The anchoring mechanism 54 extends to the open top of the midsole portion 26 and is positioned laterally inward on the alignment mechanism 58 on the side wall of the midsole portion 26. Accordingly, when the insole portion 24 is assembled with the midsole portion 26, the upper (not shown) is positioned within the alignment mechanism 58 and joined to the sole assembly 110 using staples, nails, rivets, stitching, or other fasteners that extend through the upper and the side wall of the midsole and are fixed and embedded within the anchoring mechanism 54. In other embodiments, the attachment mechanism 54 may be integrally formed within the midsole portion 26, such as facing inward on the alignment mechanism 58.

[0062] Figures 12A to 12D are exploded plan and cross-sectional views of a sole assembly 120 of one embodiment of the present technology. Figures 13A and 13B are plan and cross-sectional views of the sole assembly 120 in a non-disassemblable configuration. Similar to the embodiments discussed above and shown in Figures 11A to 11D, the midsole portion 26 of this embodiment is either printed integrally with the outsole portion 28 or otherwise manufactured additionally, and the insole portion 24 is either printed separately or otherwise formed. The voids 46 of the midsole portion 26 and the tops of the grid 38 of the insole portion 24 are left open until the insole portion 24 is mounted on top of the midsole portion 26, thereby allowing for the easy and rapid removal of excess manufacturing material during assembly, as discussed above.

[0063] The insole portion 24 and the midsole portion 26 have a fitting mechanism 58 around part or all of their periphery to securely interconnect the insole portion with the integrated midsole / outsole portion 26 / 28 to form an assembled sole assembly 120. In the illustrated embodiment, the fitting mechanism on the insole portion 24 is a hook flange 122 including a hook-shaped bottom edge that fits into a shaped retaining channel 124 formed around all or part of the upper periphery of the midsole portion 26. When the insole portion 24 is assembled with the midsole / outsole portion 26 / 28, the insole portion 24 is positioned above the midsole gap 46 such that the grid 38 is above and supported by the internal support 44. The hook flange 122 is pushed into the retaining channel 124 such that the hook flange is slightly bent until the hook-shaped bottom edge snaps into place within the channel 124. Accordingly, the mounting mechanism 122 provides locking hook engagements between the insole and midsole portions 24 and 26, respectively, for secure interconnection between the components. In other embodiments, the locking hook configuration may be inverted, with the hook flange 122 extending upward around the midsole portion 26 and the retaining channel 124 provided around the insole portion 24. The locking hook configuration may be continuous or segmented around the insole and midsole portions 24 and 26.

[0064] The illustrated embodiment, similar to the embodiments in Figures 9A-9D and 10, has an alignment mechanism 98 including an open slot 126 and a receptive channel 128. However, in this embodiment, the lateral and / or central sides of the insole portion 24 and / or midsole portion 26 have an outline such that an open slot 126 is formed between the components when the insole portion 24 is snap-fitted into place on the midsole portion 26. The open slot 126 is aligned with a receptive channel 128 (Figure 12D) integrally formed on the central and lateral sides of the midsole portion. The slot 126 and receptive channel 128 are configured to receptive to the lower area of ​​the upper so that the upper extends through the slot 126 into the receptive channel 128. The upper can then be fixed to the sole assembly 120 via adhesive, fasteners, or other retention techniques. In another embodiment, the slot 126 and the receiving channel 128 are configured to allow the upper to be stapled to itself or otherwise joined to form a band supplied through the slot and the core of the midsole portion. These structures may be particularly applicable to sandals, slides, or other open-toe style footwear. However, the structures may be used for other footwear styles, including closed-toe styles.

[0065] Figures 14A–14C are isometric and cross-sectional views of a sole assembly 140 of another embodiment of the present technology. In this embodiment, the sole assembly 140 is a single unit comprising integrally formed insole, midsole, and outsole portions, made by 3D printing or other additive manufacturing processes. While the sole assembly 140 of the illustrated embodiment is particularly suitable for sandal configurations, similar structures may be used for different styles of footwear assemblies. In the illustrated embodiment, the sole assembly 140 has an attachment flap 142 integrally connected to the sides of the midsole portion 26 and / or insole portion 24 and extending upward therefrom. The attachment flap 142 is configured to be attached to an upper formed by a toe cap portion, by straps riveted, glued, fastened, or otherwise attached to the flap. The insole portion 24 also has a scalloped retaining mechanism 52 positioned on an area of ​​the grid 38, such that the insole can be held in place under a retaining mechanism 52 on a scallop positioned in the edge area of ​​the grid 38. In the illustrated embodiments, the retaining mechanism 52 may be bonded to or otherwise connected to the insole to hold it in place. Other embodiments may have a retaining mechanism 52 having a different shape or configuration.

[0066] As shown in Figures 14B and 14C, the midsole portion 26 of the illustrated embodiment has an integral internal support 44 and a gap 46 formed at least in the heel area to provide some additional cushioning and shock absorption for the wearer's foot, particularly during the heel strike phase of the wearer's walking cycle. Because the sole assembly 140 has a fairly low profile, the internal support 44 and gap 46 are not provided in the forefoot area. However, other embodiments may include the internal support 44 and gap 46 in the forefoot area of ​​the sole assembly 140, as shown in Figure 15A.

[0067] Figures 15A and 15B are partially exploded top and bottom isometric views of a sole assembly 150 of another embodiment of the present technology. As seen in Figure 15A, the sole assembly 150 has a midsole portion 24 which is 3D printed integrally with or otherwise additionally manufactured with the outsole portion 28, and an insole portion 24 which is printed separately or otherwise formed. The midsole portion also has an integral attachment flap 142 for connection to the upper, as discussed above in relation to Figures 14A-14C. The insole portion 24 is constructed such that the grid 38 (Figure 15B) extends downward from the platform layer 40. Accordingly, the grid 138 (Figure 15B) of the insole portion 24 and the voids 46 (Figure 15A) of the midsole portion 26 can be stripped of excess material before the final assembly of the insole portion 24 with the midsole / insole portion 26 / 28. The insole portion 24 can be fixed to the midsole portion 26 using an interconnection configuration similar to that described in Figures 11A-11D and 12A-12D, or other interconnection systems, for the purpose of aligning and securely attaching the insole portion 24 to the midsole portion 26.

[0068] Figures 16A and 16B are isometric and cross-sectional views of a sole assembly 160 of another embodiment of the Art. The sole assembly 160 of this embodiment is also a low-profile structure, such as for footwear 10 in Figure 1B. The shown sole assembly 160 has a gap 46 (Figure 16B) and internal support 44 in the midsole portion 26 in the heel area 32. In the embodiment shown, the sole assembly 160 is a one-piece member including integrally formed midsole, insole, and outsole portions 26, 24, and 28. The insole portion 24 has an integral grid 38 projecting upward from the midsole portion 26. The insole portion 24 has a mounting flange 162 that extends laterally around its periphery. The mounting flange 162 may be used to connect to an upper around part or all of the sole assembly 160. For example, the lower edge of the upper may be attached to the flange 162 by sewing, adhesive, staples, rivets, and / or any other preferred attachment technique. In some embodiments, the insole may also be positioned on the grid 38 and attached to the mounting flange 162 so that it is captured between the upper and the flange. Other embodiments may have other configurations that provide a single low-profile sole assembly 160 for footwear according to the art. Note

[0069] The above description and drawings are illustrative and should not be construed as limiting. Numerous specific details have been described to provide a full understanding of this disclosure. However, in some cases, well-known details have not been described to avoid obscuring the description. Furthermore, various modifications can be made without departing from the scope of the embodiments.

[0070] Any reference in this specification to “one embodiment” means that certain features, structures, or characteristics described in relation to an embodiment are included in at least one embodiment of this disclosure. The phrase “in one embodiment” appearing in various parts of this specification does not necessarily refer to the same embodiment, nor does it refer to a separate or alternative embodiment that is mutually exclusive with the other embodiments. Furthermore, various features that may be presented in some embodiments but not in others are described. Similarly, various requirements that may be required in some embodiments but not in others are described.

[0071] The terms used herein generally have their usual meanings in the art within the context of this disclosure and in the context in which each term is used. It is understood that the same thing may be described in more than one way. Consequently, alternative languages ​​and synonyms may be used for any one or more of the terms discussed herein, and no special advantage is placed on whether a term is detailed or discussed herein. Synonyms for some terms are provided. The citation of one or more synonyms does not preclude the use of other synonyms. The use of examples anywhere in this specification, including examples of any terms discussed herein, is merely illustrative and is not intended to further limit the scope and meaning of any terms in this disclosure or any examples provided herein. Similarly, this disclosure is not limited to the various embodiments provided herein. Unless otherwise defined, all technical and scientific terms used herein have the same meaning as generally understood by those skilled in the art to which this disclosure belongs. In case of any conflict, the definitions in this document shall prevail.

Claims

1. An upper defining an internal area configured to receive the wearer's foot, the upper having a lower portion; A sole assembly fixed to the lower portion of the upper, at least a portion of the sole assembly is manufactured by an additive manufacturing process, the sole assembly has a heel portion and a forefoot portion, the sole assembly has a platform layer and a grid including interconnected laths extending away from the platform layer at least in the forefoot portion and heel portion, the grid and platform layer are positioned to support the wearer's foot on the sole assembly, the laths in the grid are configured to bend or flex to provide a first cushioning effect to the wearer's foot. Equipped with, The sole assembly has a plurality of spaced internal support structures that extend downward away from the platform layer and define a void within the sole assembly, the internal support structures being located at least in the heel portion or the forefoot portion, and the internal support structures are configured to flex or bend to provide a second cushioning effect to the wearer's foot; The sole assembly has a peripheral portion coupled within the sole assembly, and the sole assembly has a plurality of integral anchoring mechanisms positioned adjacent to the peripheral portion and adjacent to at least one of the voids, and the lower portion of the upper is fastened to the peripheral portion of the sole assembly using fastening mechanisms that are securely engaged and fixed to the plurality of integral anchoring mechanisms without penetrating into the voids; The sole assembly has an outsole portion connected to the bottom of the sole assembly and forming a ground engagement surface, and the outsole portion is positioned to close and seal the void within the sole assembly. Footwear assembly.

2. The footwear assembly according to claim 1, wherein the outsole portion is integrally connected to the sole assembly, and a single sole is formed through the additive manufacturing process.

3. The footwear assembly according to claim 1, wherein the grid is formed on the platform layer such that the lath extends upward from the platform layer.

4. The footwear assembly according to claim 1, wherein the internal support structure is oriented substantially parallel, perpendicular, or at an angle to the platform layer.

5. The footwear assembly according to claim 1, wherein the outsole portion is manufactured separately from the sole assembly and is connected to the lower edge of the sole assembly, and the outsole portion closes the lower ends of at least a plurality of gaps.

6. The footwear assembly according to claim 1, wherein the sole assembly has an insole portion integrally connected to a midsole portion, the midsole portion has one or more integral first mounting mechanisms, and the outsole portion has one or more second mounting mechanisms that engage with the first mounting mechanisms in a fitable manner and fix the outsole portion to the bottom of the midsole portion, thereby surrounding the gap within the midsole portion.

7. The footwear assembly according to claim 1, wherein the fastening mechanism is a stitch, staple, nail, or rivet.

8. The footwear assembly according to claim 1, further comprising an insole fixed to the peripheral portion of the sole assembly and covering the grid, wherein at least a portion of the insole is trapped between the lower portion of the upper and the peripheral portion of the sole assembly.

9. The footwear assembly according to claim 1, further comprising an insole covering the grid, wherein the sole assembly has an integral retaining mechanism extending over the portion of the grid, and the insole is trapped between the integral retaining mechanism and the grid.

10. Upper having a lower portion; and A sole assembly fixed to the lower portion of the upper, at least a portion of the sole assembly being manufactured by an additive manufacturing process, the sole assembly having a heel portion, a forefoot portion, and a peripheral portion around the heel portion and the forefoot portion, Equipped with, The sole assembly comprises a midsole portion, an insole portion located above the midsole portion, and an outsole portion connected to the bottom of the midsole portion, wherein the insole portion includes a grid having a plurality of interconnected ribs, the grid being positioned at least within the forefoot portion and heel portion, the grid being positioned to support the wearer's foot, and the ribs within the grid being configured to bend to provide cushioning to the wearer's foot; The midsole portion of the sole assembly has a plurality of spaced internal support structures that extend downward relative to the grid and define voids within the sole assembly, the internal support structures being located at least in the heel portion or the forefoot portion, and the internal support structures being configured to flex in response to loads applied by the wearer's foot during use; The sole assembly has a plurality of integral anchoring mechanisms positioned radially outward from the gap and the internal support structure, and the lower portion of the upper is fastened to the peripheral portion of the sole assembly using fastening mechanisms that pass through the plurality of integral anchoring mechanisms without penetrating into the gap; The outsole portion is positioned to close at least a portion of the gap within the sole assembly and form a ground engagement surface. Footwear assembly.

11. The footwear assembly according to claim 10, wherein the outsole portion is integrally connected to the sole assembly, and a single sole is formed through the additive manufacturing process.

12. The footwear assembly according to claim 10, wherein the midsole portion is integrally formed with either the insole portion or the outsole portion, the midsole portion has one or more first attachment mechanisms, and the other of the insole portion or the outsole portion has one or more second attachment mechanisms that are fitted into the first attachment mechanism and fix the other of the insole portion or the outsole portion to the midsole portion.

13. The footwear assembly according to claim 10, wherein the internal support structure is oriented substantially parallel, perpendicular, or at an angle to the top surface of the sole assembly.

14. The footwear assembly according to claim 10, wherein the sole assembly has a platform layer positioned between the grid and the internal support structure, the grid protruding upward away from the platform layer, and the internal support structure extending downward from the platform layer.

15. The footwear assembly according to claim 10, wherein the sole assembly has a platform layer adjacent to the grid, the lath of the grid extends away from the platform layer, and the internal support structure extends downward away from the platform layer.

16. The footwear assembly according to claim 10, wherein the sole assembly has an alignment mechanism configured to receive the lower portion of the upper and align it along the sole assembly and adjacent to the plurality of integral anchoring mechanisms.

17. A sole assembly for footwear having an upper, wherein the sole assembly is: An upper insole portion, a midsole portion attached to the upper insole portion, and an outsole portion attached to the midsole portion, wherein the midsole portion is formed as a single structure with the upper insole portion or the outsole portion. Equipped with, The sole assembly comprises a heel portion, a forefoot portion, and a peripheral portion around the heel portion and the forefoot portion, the peripheral portion being configured to connect to the lower portion of the upper. The upper insole portion has a platform layer and a grid, the platform layer is located above the midsole portion, the grid includes a plurality of interconnected lashes extending away from the platform layer, the grid is positioned at least within the forefoot and heel portions, and the lashes within the grid are configured to flex to provide cushioning to the wearer's foot. The midsole portion has a plurality of internal support structures that extend downward relative to the platform layer and define a void within the midsole portion, the internal support structures are located at least within the heel portion or the forefoot portion, and the internal support structures are configured to flex in response to the load applied by the wearer's foot during use; The upper insole portion or the midsole portion has a plurality of integral anchoring mechanisms positioned radially outward from the gap and the internal support structure, and the peripheral portion of the sole assembly is configured to be attached to the lower portion of the upper using fastening mechanisms that securely engage with the plurality of integral anchoring mechanisms; The outsole portion is positioned within the sole assembly to close at least a portion of the gap and form a ground engagement surface. Sole assembly.

18. The sole assembly according to claim 17, wherein the outsole portion is integrally connected to the midsole portion, providing a single sole formed by an additive manufacturing process.

19. The sole assembly according to claim 17, further comprising an insole that covers the grid and is fixed to the peripheral portion of the sole assembly.

20. The sole assembly according to claim 17, wherein the upper insole portion or the midsole portion has an alignment mechanism configured to receive the lower portion of the upper and to align it along the sole assembly and adjacent to the plurality of integral anchoring mechanisms.

Citation Information

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