Book mounting cards with IC tags and books

Abstract

To provide a mount with an IC tag that can be easily manufactured and can prevent excessive pressure from acting on an IC chip.SOLUTION: In a mount 10A with an IC tag for a book in which an IC tag 20 including an IC chip 25 is attached to a mount 11, the mount 11 is folded over a surface attached with the IC tag.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to a base paper with an IC tag for books. The present invention also refers to a book to which the base paper with an IC tag for books is attached.

Background Art

[0002] By attaching an IC tag using an IC inlay to booklets such as books and magazines, it is becoming possible to perform overall logistics management including production history management and sales management at retail stores. This enables more detailed management and is expected to enhance the convenience for consumers who purchase the booklet.

[0003] Patent Document 1 discloses an electronically tagged book produced by perfect binding. In this book, a part of the throat of the cover that becomes the binding edge of the text is removed to form a recess, and a chip is placed inside to prevent deterioration of the performance of the electronic tag.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] In Patent Document 1, due to its structure, a part of the pressure acting on the chip can be reduced, but since it is necessary to process a part of the text that has no direct relation to the electronic tag, the manufacturing process becomes complicated for the entire book.

[0006] In view of the above circumstances, an object of the present invention is to provide a base paper with an IC tag that can be easily manufactured and can suppress excessive pressure from acting on the IC chip.

Means for Solving the Problems

[0007] A first aspect of the present invention is a book-use IC tag holder on which an IC tag having an IC chip is attached. In this book-compatible cardboard backing with an IC tag, the backing is folded over the side to which the IC tag is attached.

[0009] A second aspect of the present invention is a book equipped with a book-type IC tag holder according to the present invention. [Effects of the Invention]

[0010] According to the present invention, it is possible to provide a tagged backing that can be easily manufactured and that can suppress excessive pressure being applied to the IC chip. [Brief explanation of the drawing]

[0011] [Figure 1] (a) is a plan view of a book mount with an IC tag according to the first embodiment of the present invention. (b) is a plan view of the mount according to the book mount with an IC tag. [Figure 2] This is a plan view of a book mount with an IC tag according to a second embodiment of the present invention. [Figure 3] This is a plan view showing a modified example of the IC tag-equipped mounting board for the book. [Figure 4] This figure shows an example of the process of attaching the IC tag-equipped mounting sheet for books to a book. [Figure 5] This figure shows an example of the process of attaching the IC tag-equipped mounting sheet for books to a book. [Figure 6] This figure shows an example of the process of attaching the IC tag-equipped mounting sheet for books to a book. [Figure 7] This is a schematic cross-sectional view showing a modified example of the IC tag according to the present invention. [Figure 8] This is a schematic cross-sectional view showing a modified example of the IC tag according to the present invention. [Figure 9] This is a schematic cross-sectional view showing a modified example of the IC tag according to the present invention. [Modes for carrying out the invention]

[0012] A first embodiment of the present invention will be described with reference to Figure 1. Figure 1(a) is a plan view showing the IC tag-equipped book mount 10 (hereinafter simply referred to as "tag-equipped mount") according to this embodiment.

[0013] The tagged card holder 10 comprises a card holder 11 and an IC tag 20 attached to the card holder 11. Various types of paper can be used for the backing board 11, and the dimensions of each part, including the planar shape and thickness, can be appropriately determined according to the booklet or other item to be attached.

[0014] The basic configuration of the IC tag 20 is known and includes a substrate 21 on which an antenna 22 is provided on one side, and an IC chip 25 electrically connected to the antenna. The base material 21 can be a sheet made of paper, plastic, or the like. The antenna 22 can be formed by etching a metal layer or arranging metal wires. The IC chip 25 stores various types of information, including basic information of the booklet to which it is attached and individual information for identifying each booklet, which are selected as appropriate according to the management method and purpose.

[0015] As shown in Figure 1(b), the mounting board 11 is provided with a hole 12 that is larger than the planar shape of the IC chip 25. The hole 12 only needs to be slightly larger than the planar shape of the IC chip 25, and there are no particular restrictions on its size, but it is preferable that it be large enough not to significantly reduce the contact area between the IC tag 20 and the backing paper 11. Making the hole 12 circular with a diameter of about 6 to 8 mm is preferable because it allows for efficient production of the backing paper 11 by drilling holes in a bundle of backing paper all at once using a general drilling machine or the like.

[0016] The IC tag 20 is attached to the backing paper 11 such that the IC chip 25 is positioned within the range of the hole 12 in a plan view of the tagged backing paper 10. There are no particular restrictions on how the IC tag 20 is attached to the backing paper 11, but a simple method is to provide an adhesive layer on one side of the base material 21 to form a label and attach it to the backing paper 11.

[0017] In the tagged mount 10 according to this embodiment configured as described above, the hole 12 is located under the IC chip 25. Therefore, when the tagged mounts 10 are stacked, or when books to which the tagged mounts 10 are attached are stacked, etc., when pressure acts on the IC chip 25, a part of the IC chip 25 and its surroundings in the IC tag 20 can be deformed so as to enter the hole 12, and a part of the acting pressure can be absorbed. As a result, it is possible to suitably suppress an excessive pressure from acting on the IC chip 25, and prevent the occurrence of breakage, malfunction, etc. In addition, it can be easily manufactured simply by attaching the IC tag 20 to the mount 11 having the hole 12.

[0018] In this embodiment, the IC tag 20 may be attached to the mount with the surface provided with the IC chip 25 facing the mount 11. In this case, since at least a part of the IC chip 25 enters the hole 12 from the beginning, the protective effect of the IC chip 25 can be enhanced.

[0019] A second embodiment of the present invention will be described with reference to FIG. 2. In the following description, for components that are the same as those already described, the same reference numerals will be used and duplicate descriptions will be omitted.

[0020] In the tagged mount 10A of this embodiment shown in FIG. 2, a part of the mount 11 is folded along the fold line 11a and overlaps the surface to which the IC tag 20 is attached. As a result, a part of the mount 11 protrudes upward and is thicker than the surface to which the IC tag 2 is attached. Therefore, by receiving a part of the pressure acting on the IC chip 25 when stacked, etc., by the thicker part, it is possible to suitably suppress an excessive pressure from acting on the IC chip 25. In the tagged mount 10A, this effect can be further enhanced by making the thickness of the part of the mount 11 that protrudes upward and is thicker equal to or greater than the thickness of the part where the IC chip 25 of the IC tag 20 is arranged. Furthermore, it can be easily manufactured by simply attaching the IC tag 20 to the folded cardboard backing 11, or by folding back the cardboard backing 11 with the IC tag 20 attached.

[0021] The tagged backing paper 10A can be efficiently manufactured by supplying the folded backing paper 11, as shown in Figure 2, to a labeler and attaching the IC tag 20, which serves as the label, with the labeler. In the tagged backing paper 10A, a portion of the backing paper that is overlapped will always be smaller than the rest, but by appropriately setting the dimensions of the portion of the backing paper that does not overlap, the IC tag 20 can be reliably attached to the portion of the backing paper that does not overlap using a general-purpose labeler. Specifically, it is preferable to set the dimensions of the portion that does not overlap and the attachment orientation of the IC tag 20 so that a gap of 3 mm or more is secured on both sides of the IC tag 20 in the direction of travel of the backing paper in the labeler.

[0022] In the modified tagged backing 10B shown in Figure 3, a portion of the backing 11 that is folded back along the fold line 11a is cut out, forming a window portion 13 that is larger than the planar shape of the IC tag. The IC tag 20 is mounted inside the window portion 13. In the tagged backing 10B, a portion of the backing 11 that protrudes above and is thicker than the surface on which the IC tag 20 is mounted surrounds the IC chip 25 in a planar view. Even with this configuration, it is possible to effectively suppress excessive pressure on the IC chip 25, similar to the tagged backing 10B.

[0023] In the tagged card 10B, since the IC tag 20 is placed within the window portion 13, the portion of the card that is stacked does not necessarily have to be smaller than the rest, and the portion of the card that is stacked and the rest may be the same size and completely folded over. When producing a tagged backing sheet 10B using a general-purpose labeler, the dimensions of the window portion 13 and the orientation of the IC tag 20 should be set so that, similar to the tagged backing sheet 10A, a gap of 3 mm or more is secured on both sides of the IC tag 20 in the direction of backing sheet movement in the labeler, and a gap of 1.5 mm or more is secured on both sides of the IC tag 20 in the direction perpendicular to the direction of movement. In another embodiment, the window portion may be made to be approximately the same size as the hole 12 in the first embodiment, and in a plan view of the tagged backing, only the IC chip 25 and its surroundings, rather than the entire IC tag 20, may be positioned within the window portion.

[0024] In the tagged cardboard of this embodiment, the portion to which the IC tag is attached and the folded portion may be joined by adhesive or the like, or they may be left unjoined.

[0025] By attaching the tagged backing described above to a book, the book according to this embodiment can be formed. In the case of books using perfect binding or collating, a book according to the present invention can be produced by stacking a tagged backing sheet (in Figure 4, a tagged backing sheet 10A is shown as an example) on top of the folded signatures 101 that make up the regular pages and binding them together, as shown in the procedure in Figure 4. It is preferable that the IC tagged backing sheet be located at the beginning or end of the book. Therefore, it is preferable to place the IC tagged backing sheet either before stacking the folded signatures 101 or after all the folded signatures 101 have been stacked.

[0026] The tagged backing does not necessarily have to be bound together with the folded signature. For example, as shown in the procedure in Figure 5, glue 102 may be applied linearly to the folded signature 101, and the tagged backing (in Figure 5, tagged backing 10A is shown as an example) may be joined to the folded signature 101 with the glue 102. Even in this configuration, a book according to the present invention can be produced.

[0027] In this embodiment, the tagged backing of the book has the above-described configuration, which effectively prevents excessive pressure from being applied to the IC chip 25 even when many books are stacked during the manufacturing and distribution processes. As a result, good contactless communication becomes possible, and various management tasks related to the books can be performed effectively.

[0028] As shown in Figures 3 and 4, a tagged cardboard base 11 in which the size of the part where the IC tag is attached and the folded part are not the same can also be applied to books made by saddle stitching. In this case, as shown in Figure 6, after all the folded signatures 101, except for the cover, have been stacked in an open state, the tagged backing card (in Figure 6, the tagged backing card 10B is shown as an example) is opened and placed on top. After that, the cover is opened and placed on top, and then the binding can be done with wire.

[0029] When using tagged backing cards for saddle-stitched binding, it is preferable to have a dimensional difference of approximately 7 to 10 mm between the portion where the IC tag is attached and the folded portion. In books made with saddle-stitch binding, the IC tag and the folded portion of the backing paper are separated. However, when viewed as a whole book, the difference in thickness caused by the folded portion is maintained. Therefore, when books are stacked, excessive pressure on the IC chip 25 can be effectively suppressed, just as with other books.

[0030] Although various embodiments of the present invention have been described, the specific configuration is not limited to these embodiments, and modifications and combinations of the configuration that do not depart from the spirit of the present invention are also included. Some modifications are given below as examples, but these are not exhaustive, and other modifications are also possible. Two or more of these modifications may be combined as appropriate.

[0031] As shown in Figure 7, a spacer 26 may be placed in the area of ​​the IC tag where the IC chip 25 is not provided. In this way, the spacer 26 will receive some of the pressure generated when other objects are stacked on top of the tagged backing, further reducing damage to the IC chip 25. The spacer 26 may or may not completely surround the IC chip 25 in a plan view of the IC tag. Furthermore, while it is preferable that the thickness of the spacer 26 be greater than or equal to the thickness of the IC chip 25, a difference of less than the thickness of the IC chip 25 will still provide a certain effect.

[0032] In the tagged backing paper according to the present invention, a paper layer may be attached so as to cover the IC tag. This makes it possible to print various characters and labels on the area where the IC tag is attached, making it easier to adapt to booklets. Covering the formed printed layer with an overcoat layer made of resin or the like prevents ink from bleeding through to the other pages of the booklet when they come into contact with it. Alternatively, the IC tag base material 21 can be made of paper, and as shown in Figure 8, an adhesive layer 30 can be provided on the surface where the antenna 22 and IC chip 25 are located, thereby enabling printing on the area where the IC tag is attached without the need for a separate paper layer. This configuration also has the advantage of enabling printing without increasing the thickness of the IC tag.

[0033] When an adhesive layer is provided on an IC tag, as shown in Figure 9, a non-adhesive portion 40 may be provided on the peripheral edge of the surface of the base material 21 on which the adhesive layer 30 is provided in plan view. In this case, even if the plan view area of ​​the adhesive layer 30 increases due to the pressure applied during attachment and spreads onto the non-adhesive portion 40, the adhesive layer 30 will not stick to the non-adhesive portion 40, and when the pressure is released, the plan view area will return to its original size. As a result, it is possible to suppress the adhesive layer 30 from protruding from the base material 21 in the plan view of the IC tag, and to effectively prevent problems such as the protruding adhesive layer sticking to other pages. The non-adhesive portion 40 can be formed by applying and drying an easy-release agent, or by known adhesive-killing treatments, etc. This effect can be further enhanced by setting the area where the adhesive layer is applied to be slightly smaller than the planar dimensions of the substrate, so that even when the maximum expected pressure is applied, the adhesive layer 30 does not extend beyond the substrate 21 in the planar view of the IC tag.

[0034] The shape of the IC tag antenna is not limited to that shown in the above embodiment, and can be set as appropriate according to the required communication characteristics, etc.

[0035] The number of times the backing paper is folded over the surface on which the IC chip is attached is not limited to just once. Therefore, by folding it multiple times, the thickness of the folded portion may be adjusted to a desired value. [Explanation of Symbols]

[0036] 10, 10A, 10B Cardboard inserts with IC tags for books 11 Mounting board 12 holes 13 Window section 20 IC tags 21 Base material 22 Antennas 25 IC chips

Claims

1. A book-type IC tag holder in which an IC tag having an IC chip is attached to the holder, The aforementioned backing paper is folded over the surface on which the IC tag is attached. Book mounting cards with IC tags.

2. The aforementioned backing paper has a window portion in the part that is folded over the surface on which the IC tag is attached. Of the IC tag, at least a portion including the IC chip is located within the window portion in a plan view of the book-type IC tag holder. A book-mounted IC tag card according to claim 1.

3. A book comprising a book-type IC tag holder as described in Claim 1 or 2.

Images