Sound generation unit

Abstract

The sound generating unit according to one or more embodiments of the present specification includes a vibrating membrane, a magnetic circuit assembly, a coil, and a support frame arranged to surround the magnetic circuit assembly, the coil is connected to the vibrating membrane and at least a portion of which is located in a magnetic gap formed by the magnetic circuit assembly, the coil vibrates the vibrating membrane when current is applied to the coil to generate sound, the vibrating membrane includes a main body region and an edge region surrounding the main body region, a first portion of the support frame is connected to the edge region, a thickness of the first portion is within a range of 0.3 mm to 3 mm, and the thickness of the first portion is the minimum distance in the vibration direction of the vibrating membrane between a connection region between the support frame and the edge region and a region of the support frame directly attached to the magnetic circuit assembly.

Description

[Technical Field]

[0001] This specification relates to the field of acoustics, and more particularly to sound generation equipment.

[0002] [References] This application claims priority to the Chinese patent application filed on 28 October 2022, application number 202211336918.4, the Chinese patent application filed on 1 December 2022, application number 202223239628.6, and the international application filed on 30 December 2022, application number PCT / CN2022 / 144339, all of which are incorporated into this application by reference. [Background technology]

[0003] With the advancement of acoustic output technology, acoustic generating devices (e.g., earphones) have become widely applied in people's daily lives. When used with electronic devices such as mobile phones and computers, users can enjoy an auditory feast. The output performance of an acoustic generating device greatly affects the user's comfort level. The structure of the diaphragm in an acoustic generating device and the support structure that works in cooperation with the diaphragm usually affect the output performance of the acoustic generating device. [Overview of the project] [Problems that the invention aims to solve]

[0004] Therefore, it is necessary to submit an acoustic generation unit with high output performance. [Means for solving the problem]

[0005] The sound generating unit according to the embodiment of this specification includes a diaphragm, a magnetic circuit assembly, a coil, and a support frame installed surrounding the magnetic circuit assembly, wherein the coil is connected to the diaphragm and at least a portion of it is located in a magnetic gap formed by the magnetic circuit assembly, and the coil generates sound by vibrating the diaphragm when energized, the diaphragm includes a main body region and an edge region surrounding the main body region, a first portion of the support frame is connected to the edge region, the thickness of the first portion is in the range of 0.3 mm to 3 mm, and the thickness of the first portion is the minimum distance between the connection region between the support frame and the edge region and the region of the support frame directly attached to the magnetic circuit assembly in the vibration direction of the diaphragm.

[0006] In some embodiments, the main body region includes a first inclined portion and a first connecting portion connected to the coil, wherein the first inclined portion is bonded to a portion of the edge region, and the first inclined portion is inclined away from the coil with respect to the first connecting portion.

[0007] In some embodiments, the edge region includes a second inclined portion, the second inclined portion being at least partially bonded to the first inclined portion.

[0008] In some embodiments, the second inclined portion is located on the side of the first inclined portion away from the coil.

[0009] In some embodiments, the edge region includes an arc-shaped portion, and the ratio of the height of the arc-shaped portion to the span of the arc-shaped portion is in the range of 0.35 to 0.4.

[0010] In some embodiments, the inclination angle of the first inclined portion with respect to the first connection portion is in the range of 5° to 30°, and the first connection portion is perpendicular to the vibration direction of the vibrating membrane.

[0011] In some embodiments, the body region includes a dome located at one end away from the first inclined portion of the first connection portion. The span of the dome is within the range of 2 mm to 8 mm, and the height of the dome is within the range of 0.7 mm to 1.2 mm.

[0012] In some embodiments, the ratio of the height to the span of the dome is within the range of 0.1 to 0.3.

[0013] In some embodiments, the frequency at which high-frequency splitting vibration appears is 20 kHz or higher.

[0014] In some embodiments, the magnetic circuit assembly includes a housing member. Within the input voltage range of 0.1 V to 0.7 V and the frequency range of 20 Hz to 6.1 kHz, the distance from the bottom of the coil to the bottom of the housing member is within the range of 0.8 mm to 0.9 mm.

[0015] In some embodiments, the acoustic generating portion further includes a support frame installed to surround the magnetic circuit assembly. The first portion of the support frame is connected to the second connection portion of the edge region.

[0016] In some embodiments, the second connection portion of the edge region is connected to the first portion of the support frame by a fixing ring.

[0017] In some embodiments, the acoustic generating portion further includes a housing provided with a decompression hole. A back cavity is formed between the decompression hole and the back surface of the diaphragm, and the resonance frequency of the back cavity is 3.3 kHz or higher.

[0018] In some embodiments, the volume of the back cavity is 60 mm 3 ~110 mm 3 within the range.

[0019] In some embodiments, the sound generating unit further includes a housing having a depressurization hole, the support frame having a plurality of vents, the sound on the back of the diaphragm is transmitted to the depressurization hole through the plurality of vents, the plurality of vents include at least a first vent and a second vent, the distance from the center of the first vent to the center of the depressurization hole is greater than the distance from the center of the second vent to the center of the depressurization hole, and the area of ​​the first vent is greater than the area of ​​the second vent.

[0020] In some embodiments, the sound generating unit further includes a housing with a depressurization hole, a plurality of ventilation holes formed in the support frame, sound from the back of the vibrating membrane is transmitted to the depressurization hole through the plurality of ventilation holes, and in the direction of vibration of the vibrating membrane, the ratio of the total area of ​​the plurality of ventilation holes to the projected area of ​​the vibrating membrane is in the range of 0.008 to 0.3.

[0021] In some embodiments, the projected area of ​​the vibrating membrane in the direction of vibration of the vibrating membrane is 90 mm². 2 ~560mm 2 It is within the range, and the total area of ​​the multiple ventilation holes is 4.54 mm 2 ~12.96mm 2 It is within the range.

[0022] In some embodiments, the sound generating unit further includes a housing, and the ratio of the projected area of ​​the diaphragm to the projected area of ​​the housing in the vibration direction of the diaphragm is 0.5 or more.

[0023] In some embodiments, the ratio of the projected area of ​​the vibrating membrane to the projected area of ​​the housing in the vibration direction of the vibrating membrane is within the range of 0.8 to 0.95.

[0024] In some embodiments, the vibrating diaphragm has a long axis dimension in the range of 13 mm to 25 mm and a short axis dimension in the range of 4 mm to 13 mm.

[0025] In some embodiments, a plurality of ventilation holes are formed in the bottom wall of the housing member of the magnetic circuit assembly or in the side wall attached to the support frame.

[0026] In some embodiments, the dome is woven by interlacing carbon fibers, with at least some of the carbon fibers interlacing at a first angle in the range of 45° to 90°.

[0027] In some embodiments, the thickness of the dome in the vibration direction of the vibrating membrane is less than 80 μm.

[0028] In some embodiments, the minimum distance from the coil to the first inclined portion is 0.3 mm or more.

[0029] In some embodiments, the magnetic circuit assembly includes a permeable plate and a magnet, the permeable plate being positioned between the magnet and the diaphragm and attached to the surface of the magnet, and the distance between the center of the coil and the center of the permeable plate in the direction of vibration of the diaphragm is less than 0.3 mm.

[0030] In some embodiments, the distance from the lowest point of the dome to the upper surface of the permeable plate in the vibration direction of the vibrating membrane is greater than 0.8 mm.

[0031] In some embodiments, the magnetic circuit assembly includes a housing member, and the distance between the bottom of the coil and the bottom wall of the housing member in the vibration direction of the diaphragm is in the range of 0.2 mm to 4 mm.

[0032] In some embodiments, the distance between the coil and the side wall of the housing member is in the range of 0.1 mm to 0.5 mm.

[0033] This specification will be further described by exemplary embodiments, which will be described in detail with reference to the drawings. These embodiments are not limiting, and in these embodiments, the same reference numerals indicate the same structure. [Brief explanation of the drawing]

[0034] [Figure 1] This is a schematic diagram of an exemplary ear according to some embodiments of the present application. [Figure 2] This is an illustrative schematic diagram of how an open-type earphone fits according to some embodiments of this specification. [Figure 3] This is an illustrative schematic diagram of how an open-type earphone fits according to some embodiments of this specification. [Figure 4] This is an illustrative diagram of another open-type earphone according to some embodiments of this specification. [Figure 5] This is an illustrative schematic distribution diagram of a case in which a cavity structure is installed around one of the sound sources in a dual sound source, according to some embodiments of this specification. [Figure 6] This is a schematic diagram of an exemplary internal structure of an acoustic generating unit according to some embodiments of this specification. [Figure 7] This is an illustrative external view of a transducer according to some embodiments of this specification. [Figure 8] This is an illustrative exploded view of a transducer according to some embodiments of this specification. [Figure 9] This is an illustrative internal structure diagram of an acoustic generating unit according to some embodiments of this specification. [Figure 10] This is an illustrative structural diagram of a vibrating membrane according to some embodiments of this specification. [Figure 11A] This is a schematic diagram illustrating the exemplary high-frequency bandwidth of an acoustic generating unit according to some embodiments of this specification. [Figure 11B] This is a schematic diagram of an exemplary carbon fiber weave structure according to some examples of this specification. [Figure 12] This is a schematic diagram of the amplitude of the sound generation unit at different drive voltages according to some embodiments of this specification. [Figure 13] This is an illustrative structural diagram of a back cavity according to some embodiments of this specification. [Figure 14] These are frequency response curve diagrams of back cavities corresponding to different thicknesses of the first portion, according to some embodiments of this specification. [Figure 15] These are frequency response curve diagrams of an acoustic generator at different drive voltages, according to some embodiments of this specification. [Figure 16] This is an illustrative schematic diagram of the support frame, the first decompression port, and the second decompression port according to some embodiments of this specification. [Figure 17] These are frequency response curves of back cavities corresponding to different total areas of vents, according to some embodiments of this specification. [Modes for carrying out the invention]

[0035] To more clearly illustrate the technical means of the embodiments described herein, the drawings necessary for describing the embodiments are briefly described below. Clearly, the drawings described below are only a part of the examples or embodiments of this specification, and those skilled in the art can apply this specification to other similar scenarios based on these drawings without requiring any creative effort. Unless otherwise stated or otherwise evident from the language context, the same reference numerals in the figures represent the same structure or operation.

[0036] It should be understood that the terms “system,” “apparatus,” “unit,” and / or “module” as used herein are ways of distinguishing various assemblies, elements, components, parts, or assemblies of different levels. However, other terms may be used in place of the above terms if they can achieve the same purpose.

[0037] As used herein and in the claims, unless the context explicitly indicates otherwise, terms such as “one,” “one,” “one kind,” and / or “the” do not specifically refer to the singular form, but may include the plural form. Generally, the terms “includes” and “contains” merely indicate the inclusion of clearly identified steps and elements, which are not an exclusive list, and the method or apparatus may include other steps or elements.

[0038] In this specification, terms such as "first," "second," "third," and "fourth" are for descriptive purposes only and should not be understood as indicating or suggesting relative importance or implicitly representing the quantity of the technical features described. Therefore, features limited by "first," "second," "third," and "fourth" may be explicitly or implicitly indicated to include at least one such feature. In this specification, unless otherwise clearly and specifically limited, "plural" means at least two, for example, two, three, etc.

[0039] In this specification, unless otherwise explicitly stated and limited, the terms “connection,” “fixed,” etc., should be understood in a broad sense. For example, unless otherwise explicitly stated, the term “connection” may be a fixed connection, a removable connection, or an integral connection; it may be a mechanical connection or an electrical connection; it may be a direct connection or an indirect connection via an intermediate medium; it may be an internal communication between two elements or an interaction relationship between two elements. Those skilled in the art will be able to understand the specific meaning of the above terms in this specification depending on the specific circumstances.

[0040] This specification uses flowcharts to illustrate the operations performed by the systems in the embodiments described herein. It should be understood that the preceding and succeeding operations are not necessarily performed in exact order. Instead, each step may be performed in reverse order or simultaneously. Furthermore, other operations may be added to these processes, or one or more operations may be removed from these processes.

[0041] Figure 1 is a schematic diagram of an exemplary ear according to some embodiments of the present application. As shown in Figure 1, the ear 100 may include the external auditory canal 101, the conchaecular cavity 102, the conchaecular scaphoid 103, the triangular fossa 104, the antihelix 105, the scaphoid fossa 106, the helix 107, the earlobe 108, and the crura of the helix 109. In some embodiments, one or more parts of the ear 100 can be used to provide mounting and stability for an acoustic device. In some embodiments, parts such as the external auditory canal 101, the conchaecular cavity 102, the conchaecular scaphoid 103, and the triangular fossa 104 have a certain depth and volume in three-dimensional space, and can meet the mounting needs for an acoustic device. For example, an acoustic device (e.g., an in-ear earphone) may be mounted in the external auditory canal 101. In some embodiments, mounting of an acoustic device can be achieved by parts of the ear 100 other than the external auditory canal 101. For example, the acoustic device can be attached to parts such as the conchae scaphoides 103, triangular fossa 104, antihelix 105, scaphoid fossa 106, and helix 107, or a combination thereof. In some embodiments, parts such as the user's earlobe 108 may be further utilized to improve the comfort and reliability of the acoustic device. Other parts of the ear 100, other than the external auditory canal 101, can be used to attach the acoustic device and transmit sound, "freeing" the user's external auditory canal 101 and reducing the impact of the acoustic device on the user's ear health. When a user is wearing an acoustic device on the road, the acoustic device does not block the user's external auditory canal 101, allowing the user to hear sounds from the acoustic device as well as sounds from the environment (e.g., car horns, bicycle bells, voices of people around, traffic controllers, etc.), thereby reducing the probability of traffic accidents. For example, when a user is wearing an acoustic device, the entire or partial structure of the acoustic device may be located in front of the helix crus 109 (e.g., the area J enclosed by the dashed line in Figure 1). Furthermore, for example, if the user is wearing an acoustic device, the entire or partial structure of the acoustic device may be in contact with the upper part of the external auditory canal 101 (for example, the location of one or more parts such as the crus of the helix 109, the conchae-scaphelix 103, the triangular fossa 104, the antihelix 105, the scaphoid fossa 106, and the helix 107).Furthermore, for example, if the user is wearing an acoustic device, the entire or partial structure of the acoustic device may be located within one or more parts of the ear (e.g., the conchaecular cavity 102, the conchaecular scapula 103, and the triangular fossa 104, etc.) (e.g., regions M1 and M2 enclosed by dashed lines in Figure 1).

[0042] Furthermore, due to individual differences among users, there may be dimensional differences in ear shape, size, and other characteristics. For the sake of clarity and ease of explanation, unless otherwise specified, this specification will primarily use an ear model with "standard" shape and dimensions as a reference to further describe how acoustic devices are fitted to the ear model in different embodiments. For example, a simulator including a head and its (left and right) ears manufactured according to ANSI:S3.36, S3.25, and IEC:60318-7 standards, such as GRAS KEMAR, HEAD Acoustics, B&K 4128 series, or B&K 5128 series, can be used as a reference for fitting the acoustic device, thereby demonstrating how most users can properly fit the acoustic device. Taking GRAS KEMAR as an example, the ear simulator may be any of the GRAS 45AC, GRAS 45BC, GRAS 45CC, or GRAS 43AG. Using HEAD Acoustics as an example, the ear simulator may be any of the following: HMS II.3, HMS II.3 LN, HMS II.3LN HEC, etc. Note that in the examples herein, the measured data range was measured based on GRAS 45BC KEMAR, but differences may exist between different head models and ear models, and other models may have a ±10% variation in the relevant data range. For example, the reference ear may have the characteristic that the vertical axis dimension of the projection of the auricle onto the sagittal plane is in the range of 49.5 mm to 74.3 mm, or the sagittal axis dimension of the projection of the auricle onto the sagittal plane is 36.6 mm to 55 mm. The projection of the auricle onto the sagittal plane is the projection of the auricle margin onto the sagittal plane. The auricle margin consists of at least the outer contour of the helix, the contour of the earlobe, the contour of the tragus, the intertragal notch, the antitragal apex, the antitragal helix notch, etc. Therefore, the descriptions in this application such as "attached by the user," "in an attached state," and "in an attached state" may refer to the acoustic device described in this application being attached to the ear of the aforementioned simulator.Naturally, considering that there are individual differences among different users, the structure, shape, size, and thickness of one or more parts of the ear 100 can be differentiated according to ears of different shapes and dimensions. These differentiated designs can be expressed to adapt to different ears by having characteristic parameters of one or more parts of the acoustic device (e.g., the sound generating part, ear hook, etc.) have different ranges of values.

[0043] In fields such as medicine and anatomy, three basic planes of the human body—the sagittal plane, coronal plane, and horizontal plane—and three basic axes—the sagittal axis, coronal axis, and vertical axis—can be defined. The sagittal plane is a cross-section perpendicular to the ground, cut along the anterior-posterior direction of the body, dividing the body into two parts, left and right. The coronal plane is a cross-section perpendicular to the ground, cut along the lateral direction of the body, dividing the body into two parts, anterior and posterior. The horizontal plane is a cross-section parallel to the ground, cut along the vertical direction perpendicular to the body, dividing the body into two parts, upper and lower. Accordingly, the sagittal axis is the axis perpendicular to the coronal plane, running along the anterior-posterior direction of the body; the coronal axis is the axis perpendicular to the sagittal plane, running along the lateral direction of the body; and the vertical axis is the axis perpendicular to the horizontal plane, running along the vertical direction of the body. Furthermore, the term "anterior side of the ear" as used in this application refers to the side of the ear that is aligned with the sagittal axis and facing the facial region of the human body. By viewing the ear of the simulator from the direction in which the coronal axis of the human body is located, a schematic diagram of the anterior contour of the ear shown in Figure 1 can be obtained.

[0044] The above description of ear 100 is for illustrative purposes only and is not intended to limit the scope of this application. Those skilled in the art can make various changes and modifications based on the description of this application. For example, a part of the structure of the acoustic device may shield part or all of the external auditory canal 101. These changes and modifications remain within the scope of protection of this application.

[0045] Figure 2 is an exemplary schematic fitting diagram of an open-type earphone according to some embodiments of this specification, Figure 3 is an exemplary schematic fitting diagram of an open-type earphone according to some embodiments of this specification, and Figure 4 is an exemplary fitting diagram of another open-type earphone according to some embodiments of this specification. In some embodiments, the open-type earphone 10 may include, but is not limited to, air conduction earphones and bone conduction earphones. In some embodiments, the open-type earphone 10 may be combined with products such as glasses, headphones, head-mounted displays, and AR / VR helmets. As shown in Figures 2 to 4, the open-type earphone 10 may include an acoustic generating unit 11 and an ear hook 12. In some embodiments, the open-type earphone 10 may be attached to the user's body (e.g., the head, neck, or upper torso) by the ear hook 12, with the acoustic generating unit 11 attached.

[0046] In some embodiments, when the open-type earphone 10 is worn, the first portion of the ear hook 12 is placed between the user's auricle and head, and the second portion extends away from the head from the auricle and connects to the sound generating unit 11, fixing the sound generating unit 11 in a position near the ear canal that does not obstruct the ear canal. In some embodiments, the ear hook 12 may have an arc-shaped structure that conforms to the user's auricle so that it is suspended from the user's upper auricle. In some embodiments, the ear hook 12 may have a clamping structure that conforms to the user's auricle so that it is clamped to the user's auricle. In some embodiments, the ear hook 12 may include, but is not limited to, a hook structure, an elastic band, etc., to better secure the open-type earphone 10 to the user's body and prevent it from falling off during use.

[0047] In some embodiments, the sound generating unit 11 may be attached to the user's body, and the sound generating unit 11 may be provided with a transducer (e.g., transducer 112) for generating sound and inputting it to the user's ear 100. In some embodiments, the open-type earphone 10 may be combined with products such as glasses, headphones, head-mounted displays, or AR / VR helmets, in which case the sound generating unit 11 may be attached near the user's ear 100 by suspension or clamping. In some embodiments, the sound generating unit 11 may be annular, elliptical, (regular or irregular) polygonal, U-shaped, V-shaped, semicircular, etc., so that it can be directly attached to the user's ear 100.

[0048] As shown in Figures 1 and 2, in some embodiments, when a user wears the open-type earphone 10, at least a portion of the sound generating unit 11 may be located in the anterior tragus region J or the intraauricle regions M1 and M2 of the user's ear 100 as shown in Figure 1. Different mounting positions of the sound generating unit 11 (11A, 11B, and 11C shown in Figure 2) are described below illustratively. Note that the anterolateral surface of the auricle referred to in the embodiments of this specification is the side away from the head along the coronal axis of the auricle, and correspondingly, the posteromedial surface of the auricle is the side toward the human head along the coronal axis of the auricle. In some embodiments, the sound generating unit 11 being located at 11A means that the sound generating unit 11 is located on the side toward the face region of the human body along the sagittal axis of the user's ear 100, that is, the sound generating unit 11 is located in the anterior region J of the ear 100.

[0049] Furthermore, a transducer (e.g., transducer 112) may be provided inside the housing of the sound generating unit 11, and at least one sound vent (e.g., sound vent 111a, not shown in Figure 2) may be installed in the housing of the sound generating unit 11 (e.g., housing 111), the sound vent may be located on a side wall of the housing of the sound generating unit facing or adjacent to the user's ear canal 101, and the transducer may output sound to the user's ear canal 101 through the sound vent. A transducer is an element that can receive an electrical signal and convert it into an audio signal for output. In some embodiments, distinguished according to frequency, the type of transducer 112 may include a low-frequency (e.g., 30Hz~150Hz) speaker, a mid-low-frequency (e.g., 150Hz~500Hz) speaker, a mid-high frequency (e.g., 500Hz~5kHz) speaker, a high frequency (e.g., 5kHz~16kHz) speaker, or a wideband (e.g., 30Hz~16kHz) speaker, or any combination thereof. Here, "low frequency," "high frequency," etc., merely refer to a frequency range, and different application scenarios may have different distinctions. For example, if a crossover frequency is determined, "low frequency" refers to the frequency range below the crossover frequency, and "high frequency" refers to frequencies above the crossover frequency. The crossover frequency may be any value within the range of human hearing, such as 500Hz, 600Hz, 700Hz, 800Hz, or 1000Hz.

[0050] In some embodiments, the transducer may include a diaphragm (e.g., diaphragm 1121). When the diaphragm vibrates, sound is emitted from the front and rear sides of the diaphragm, respectively. The cavity inside the housing of the sound generating unit 11 is divided by the diaphragm into at least a front cavity (e.g., front cavity 114) located in front of the diaphragm and a back cavity (e.g., back cavity 116) located behind the diaphragm. The sound vents are acoustically coupled to the front cavity, and the diaphragm vibrates to vibrate the air in the front cavity, generating air-conducted sound, which is then propagated to the outside through the sound vents. In some embodiments, the housing of the sound generating unit 11 may further include one or more depressurization holes (for example, a first depressurization hole 111c and a second depressurization hole 111d), the depressurization holes may be located on side walls adjacent to or facing the side walls where the sound emission holes are located in the housing, the depressurization holes may be acoustically coupled to the back cavity, causing the diaphragm to vibrate and the air in the back cavity to vibrate, thereby generating air-conducted sound, and the air-conducted sound generated in the back cavity may be transmitted to the outside through the depressurization holes. Exemplary, in some embodiments, a transducer within the sound generating unit 11 can output sound with a phase difference (for example, inverse phase) through a sound emission port and a depressurization port, the sound emission port may be located on the side wall of the housing of the sound generating unit 11 facing the user's ear canal 101, and the depressurization port may be located on the side of the housing of the sound generating unit 11 away from the user's ear canal 101, in which case the housing can function as a baffle, increasing the difference in acoustic distance from the sound emission port and the depressurization port to the ear canal 101, thereby increasing the intensity of the sound in the ear canal 101 and reducing the volume of far-field sound leakage.

[0051] In some embodiments, the sound generating unit 11 may have a major axis Y and a minor axis Z perpendicular to the thickness direction X and orthogonal to each other. The major axis Y may be defined as the direction having the largest extending dimension in the shape of the two-dimensional projection plane of the sound generating unit 11 (for example, a projection onto the plane on which the outer surface of the sound generating unit 11 is located, or a projection onto the sagittal plane) (for example, if the projection shape is rectangular or approximately rectangular, the major axis is the longitudinal direction of the rectangle or approximately rectangle), and the minor axis Z may be defined as the direction perpendicular to the major axis Y in the shape of the projection of the sound generating unit 11 onto the sagittal plane (for example, if the projection shape is rectangular or approximately rectangular, the minor axis is the width direction of the rectangle or approximately rectangle). The thickness direction X may be defined as the direction perpendicular to the two-dimensional projection plane, for example, coinciding with the direction of the coronal axis, and both are oriented in the left-right direction of the body. In some embodiments, when the sound generating unit 11 is inclined when mounted, the longitudinal axis Y and the minor axis Z are still parallel or substantially parallel to the sagittal plane, and the longitudinal axis Y may have a constant angle with respect to the direction of the sagittal axis, i.e., the longitudinal axis Y is also installed at an inclination accordingly, and the minor axis Z may have a constant angle with respect to the direction of the vertical axis, i.e., the minor axis Z is also installed at an inclination, such as the situation in which the sound generating unit 11 is mounted on 11B shown in Figure 2 and the mounting situation of the sound generating unit 11 shown in Figure 4. In some embodiments, the entire or partial structure of the sound generating unit 11 may be inserted into the concha, i.e., the projection of the sound generating unit 11 onto the sagittal plane and the projection of the concha onto the sagittal plane have an overlapping portion. For specific details regarding the situation in which the sound generating unit 11 is mounted on 11B, refer to other contents of this specification, for example, Figure 3 and its related description. In some embodiments, the sound generating unit 11 in the attached state may be in a horizontal or substantially horizontal state. For example, as shown in Figure 2 where the sound generating unit 11 is attached to 11C, and as shown in Figure 3 where the sound generating unit 11 is attached, the long axis Y may coincide with or substantially coincide with the sagittal axis direction and both point in the front-to-back direction of the body, and the short axis Z may coincide with or substantially coincide with the vertical axis direction and both point in the up-to-down direction of the body.Furthermore, when worn, the acoustic generating unit 11 being in a substantially horizontal position may be defined as the angle between the long axis of the acoustic generating unit 11 and the sagittal axis shown in Figure 2 being within a specific range (for example, 20° or less). Also, the mounting position of the acoustic generating unit 11 is not limited to 11A, 11B, and 11C shown in Figure 2, but may be any region J, region M1, or region M2 shown in Figure 1. For example, the entire or partial structure of the acoustic generating unit 11 may be located in region J enclosed by the dashed line in Figure 1. Also, for example, the entire or partial structure of the acoustic generating unit 11 may be in contact with one or more locations of the external auditory canal 101, such as the crus 109 of the helix, the conchae-scaphelix 103, the triangular fossa 104, the antihelix 105, the scaphoid fossa 106, and the helix 107. Furthermore, for example, the entire or partial structure of the sound generating unit 11 may be located within a cavity formed by one or more parts of the ear 100 (e.g., the conchaeary cavity 102, the conchaeary septum 103, and the triangular fossa 104, etc.) (for example, region M1 including at least the conchaeary septum 103 and the triangular fossa 104, and region M2 including at least the conchaeary cavity 102, enclosed by the dashed line in Figure 1).

[0052] In some embodiments, to improve the stability of the open-type earphone 10 when worn, the open-type earphone 10 may be equipped with one or a combination of the following methods. For example, at least a portion of the ear hook 12 may be installed as a conforming structure attached to the back of the ear and at least one of the head, thereby increasing the contact area between the ear hook 12 and the ear and / or head, and thereby increasing the resistance of the open-type earphone 10 to fall out of the ear. For example, at least a portion of the ear hook 12 may be installed as an elastic structure that has a certain amount of deformation when worn, thereby increasing the positive pressure of the ear hook 12 on the ear and / or head, and thereby increasing the resistance of the open-type earphone 10 to fall out of the ear. For example, at least a portion of the ear hook 12 may be installed to contact the head when worn, generating a reaction force that presses against the ear, thereby increasing the resistance of the open-type earphone 10 to fall out of the ear by pressing the sound generating part 11 to the front of the ear. For example, the sound generating unit 11 and the ear hook 12 are positioned to clamp physiological areas such as the area where the antihelix is ​​located and the area where the concha is located, from both the front and back of the ear when worn, thereby increasing the resistance to the open-type earphone 10 falling out of the ear. Furthermore, for example, the sound generating unit 11 or the auxiliary structure connected thereto is positioned so that at least a portion of it is inserted into physiological areas such as the concha, conchaeoflavone, triangular fossa, and scaphoid fossa, thereby increasing the resistance to the open-type earphone 10 falling out of the ear.

[0053] The sound generating unit 11 may have a connecting end CE connected to the ear hook 12 and a free end FE not connected to the ear hook 12. Exemplarily, as shown in Figure 4, when worn, the free end FE of the sound generating unit 11 may be inserted into the concha. Preferably, the sound generating unit 11 and the ear hook 12 are positioned to clamp the ear region corresponding to the concha from both the front and rear sides, thereby increasing the resistance to the open-type earphone 10 falling out of the ear and further improving the stability of the open-type earphone 10 when worn. For example, the free end FE of the sound generating unit 11 is pressed into the concha in the thickness direction X. Alternatively, for example, the free end FE is in contact with the concha in the long axis direction Y and / or the short axis direction Z (for example, in contact with the inner wall of the concha facing the free end FE). The free end FE of the sound generating unit 11 is the end positioned in the sound generating unit 11 opposite the fixed end connected to the ear hook 12. The sound generating unit 11 may be a regular or irregular structure, and here, to further explain the free end FE of the sound generating unit 11, it will be described illustratively. For example, if the sound generating unit 11 is a rectangular parallelepiped structure, the end wall surface of the sound generating unit 11 is a plane, and in this case, the free end FE of the sound generating unit 11 is the end side wall installed opposite the fixed end connected to the ear hook 12 in the sound generating unit 11. Also, for example, if the sound generating unit 11 is a sphere, ellipsoid, or irregular structure, the free end FE of the sound generating unit 11 may be a specific region away from the fixed end obtained by cutting the sound generating unit 11 along the YZ plane (a plane formed by the short axis Z and the long axis Y). When worn, the free end FE of the sound generating unit 11 may be inserted into the concha cavity, or its orthogonal projection may be located on both the left and right sides of the head and in front of the ear on the sagittal axis of the human body. In other words, the ear hook 12 can support the sound generating unit 11 so that it is attached to a mounting position such as the concha, antihelix, or the front of the ear.

[0054] Below, we will describe the open-type earphone 10 in detail, using the open-type earphone 10 shown in Figure 4 as an example. It should be noted that, provided that it does not contradict the corresponding acoustic principles, the structure of the open-type earphone 10 shown in Figure 4 and its corresponding parameters can also be applied to other open-type earphone configurations described above.

[0055] By inserting at least a portion of the sound generating unit 11 into the concha, the auditory volume at the listening position (especially the ear canal opening), particularly the auditory volume at mid- and low frequencies, can be improved, while still maintaining the effect of reducing sound leakage volume at a distance. For illustrative purposes only, when the entire or partial structure of the sound generating unit 11 is inserted into the concha, the sound generating unit 11 and the concha form a structure similar to a cavity (hereinafter abbreviated as a similar cavity), and in the embodiments of the specification, the similar cavity may be understood as a semi-sealed structure surrounded by the side wall of the sound generating unit 11 and the structure of the concha, and this semi-sealed structure does not completely seal and isolate the internal and external environments, but has a leakage structure (e.g., openings, gaps, conduits, etc.) that allows acoustic communication with the external environment. When a user wears the open-type earphone 10, one or more sound vents may be provided on the side of the housing of the sound generating unit 11 that is close to or facing the user's ear canal, and one or more decompression holes may be provided on the other side wall of the housing of the sound generating unit 11 (for example, the side wall away from the user's ear canal), the sound vents being acoustically coupled to the front cavity of the open-type earphone 10, and the decompression holes being acoustically coupled to the back cavity of the open-type earphone 10. As an example, if the sound generating unit 11 includes one sound vent and one decompression hole, the sound output from the sound vent and the sound output from the decompression hole can be considered as approximately two sound sources, the phases of the sound waves of the two sound sources are opposite, the sound generating unit 11 and the inner wall corresponding to the concha cavity form a similar cavity structure, the sound source corresponding to the sound vent is located within the similar cavity structure, and the sound source corresponding to the decompression hole is located outside the similar cavity structure, forming the acoustic model shown in Figure 5.

[0056] Figure 5 is an exemplary schematic distribution diagram of a case in which a cavity structure is installed around one of two sound sources according to some embodiments of this specification. As shown in Figure 5, the similar cavity structure 502 may include a listening position and at least one sound source 501A. Here, "includes" may indicate that at least one of the listening position and the sound source 501A is inside the similar cavity structure 502, or that at least one of the listening position and the sound source 501A is located on the edge inside the similar cavity structure 502. The listening position may be equivalent to the entrance of the ear canal, or it may be an acoustic reference point of the ear, such as an ear reference point (ERP), an ear-drum reference point (DRP), or an entrance structure that guides the listener. Because the sound source 501A is enclosed in the similar cavity structure 502, most of the radiated sound reaches the listening position by direct or reflected means. In contrast, without the similar cavity structure 502, most of the sound radiated from the sound source 501A does not reach the listening position. Therefore, by installing the cavity structure, the volume of sound reaching the listening position can be significantly increased. At the same time, only a small portion of the out-of-phase sound radiated from the out-of-phase sound source 501B outside the similar cavity structure 502 enters the similar cavity structure 502 through the leakage structure 503 of the similar cavity structure 502. This corresponds to the generation of a secondary sound source 501B' in the leakage structure 503, and the intensity of the secondary sound source 501B' is significantly lower than that of sound source 501B, and also significantly lower than that of sound source 501A. The sound generated by the secondary sound source 501B' has a weak effect of canceling out the sound generated from sound source 501A within the cavity, thereby significantly increasing the listening volume at the listening position. Regarding sound leakage, the fact that sound source 501A radiates sound to the outside through the cavity's leakage structure 503 is equivalent to the generation of a secondary sound source 501A' in the leakage structure 503. Almost all of the sound radiated from sound source 501A is output from the leakage structure 503, and since the structural scale of the similar cavity structure 502 is much smaller (at least an order of magnitude smaller) than the spatial scale used to evaluate sound leakage, the intensity of the secondary sound source 501A' is considered to be equivalent to that of sound source 501A.A dual sound source is formed in the external space by the secondary sound source 501A' and sound source 501B, which cancel each other out to reduce sound leakage.

[0057] In a specific application scenario, the outer wall surface of the housing of the sound generating unit 11 is usually flat or curved, and the contour of the user's concha 102 is an uneven structure. By inserting part or all of the structure of the sound generating unit 11 into the concha 10, a similar cavity structure that communicates with the outside is formed between the sound generating unit 11 and the contour of the concha 10. Furthermore, by placing a sound emission hole in the housing of the sound generating unit 11 at a position close to the edge of the concha 102 toward the user's ear canal opening, and a depressurization hole at a position away from the ear canal opening of the sound generating unit 11, the acoustic model shown in Figure 5 can be constructed. This increases the volume of sound heard in the user's ear canal and reduces sound leakage in the far field when the user wears the open-type earphone 10.

[0058] Figure 6 is a schematic diagram of an exemplary internal structure of an acoustic generating unit according to some embodiments of this specification. As shown in Figure 6, in some embodiments, the acoustic generating unit 11 may include a transducer 112 and a housing 111 that houses the transducer 112, and the transducer 112 may include a diaphragm 1121. Between the diaphragm 1121 and the housing 111, a front cavity 114 located in front of the diaphragm 1121 and a back cavity 116 located behind the diaphragm 1121 may be formed. The housing 111 may be provided with a sound emission hole 111a acoustically coupled to the front cavity 114 and a depressurization hole (e.g., a first depressurization hole 111c and a second depressurization hole 111d not shown in Figure 6) acoustically coupled to the back cavity 116. A connecting frame 115 may be installed inside the housing 111. The connecting frame 115 is provided with an acoustic passage 1151 for connecting the first depressurization hole 111c and the back cavity 116, facilitating communication between the back cavity 116 and the external environment, that is, allowing air to freely enter and exit the back cavity 116, thereby helping to reduce resistance in the vibration process of the transducer 112's diaphragm.

[0059] Figure 7 is an exemplary external view of a transducer according to some embodiments of this specification, and Figure 8 is an exemplary exploded view of a transducer according to some embodiments of this specification. As shown in Figures 7 and 8, in some embodiments the sound generating unit 11 may include a diaphragm 1121, a coil 1122, a support frame 1123, terminals 1124 and a magnetic circuit assembly 1125. The support frame 1123 provides a mounting and fixing platform, and the sound generating unit 11 may be connected to the housing 111 by the support frame 1123, and the terminals 1124 may be fixed to the support frame 1123 and used for circuit connections (e.g., lead wire connections). The coil 1122 is connected to the diaphragm 1121 and at least a portion of it is located in a magnetic gap formed by the magnetic circuit assembly 1125, and the magnetic circuit assembly 1125 drives the diaphragm 1121 to generate mechanical vibrations by generating a force acting on the energized coil 1122, and further generates sound through propagation in a medium such as air. The magnetic circuit assembly 1125 may include a permeable plate 11251, a magnet 11252, and a housing member 11253. The permeable plate 11251 is located between the magnet 11252 and the vibrating diaphragm 1121 and is attached to the surface of the magnet 11252.

[0060] Figure 9 is an exemplary internal structure diagram of an acoustic generating unit according to some embodiments of this specification, and Figure 10 is an exemplary structural diagram of a diaphragm according to some embodiments of this specification. The acoustic generating unit 11 includes a diaphragm 1121, a coil 1122, a support frame 1123, and a magnetic circuit assembly 1125. The support frame 1123 is installed surrounding the diaphragm 1121, the coil 1122, and the magnetic circuit assembly 1125 and provides a mounting and fixing platform. The acoustic generating unit 11 may be connected to a housing 111 by the support frame 1123, the coil 1122 is inserted into the magnetic circuit assembly 1125 and connected to the diaphragm 1121, the magnetic circuit assembly 1125 drives the diaphragm 1121 to generate mechanical vibration by generating a force acting on the energized coil 1122, and further generates sound through propagation in a medium such as air, and the sound is output through sound outlets. In some embodiments, the magnetic circuit assembly 1125 includes a permeable plate 11251, a magnet 11252, and a housing member 11253, wherein the permeable plate 11251 and the magnet 11252 are connected to each other, and the side of the magnet 11252 away from the permeable plate 11251 is attached to the bottom wall of the housing member 11253, with a gap between the circumferential side of the magnet 11252 and the inner circumferential side of the housing member 11253. In some embodiments, the outer circumferential side of the housing member 11253 is connected to and fixed to a support frame 1123. In some embodiments, both the housing member 11253 and the permeable plate 11251 can be made of a permeable material (e.g., iron). In some embodiments, the circumferential side of the vibrating diaphragm 1121 may be connected to the support frame 1123 by a fixing ring 1155. In some embodiments, the material of the fixing ring 1155 may include stainless steel or other metallic materials to suit the processing and manufacturing process of the vibrating diaphragm 1121. As shown in Figure 8, the magnetic circuit assembly 1125 may include a permeable plate 11251, a magnet 11252, and a housing member 11253. Both the housing member 11253 and the permeable plate 11251 can be made of a permeable material (e.g., iron). In some embodiments, the housing member 11253 includes a bottom portion 11253a and a circumferential side wall 11253b.The housing space is enclosed by the bottom 11253a and side wall 11253b of the housing member, and the permeable plate 11251 and magnet 11252 are housed within this housing space. The permeable plate 11251 and magnet 11252 are connected to each other, and the side of magnet 11252 away from the permeable plate 11251 is attached to the bottom 11253a of the housing member, and there is a gap between the circumferential side of magnet 11252 and the circumferential side wall 11253b of housing member 11253. In some embodiments, a coil 1122 may be inserted into the gap between magnet 11252 and side wall 11253b.

[0061] In some embodiments, during the process of the vibrating diaphragm 1121 vibrating up and down, at least some of the coils 1122 are located in a region of high magnetic flux density within the magnetic circuit assembly 1125, and in order to improve the magnetic field utilization efficiency of the magnetic circuit assembly 1125, the distance dd between the center point J of the coils 1122 and the center point K of the permeable plate 11251 is less than 0.3 mm in the direction of vibration of the vibrating diaphragm 1121. For example, the center point J of the coils 1122 and the center point K of the permeable plate 11251 may be located on approximately the same horizontal line, thereby causing the magnetic circuit assembly 1125 to generate a greater force on the coils 1122 and provide power for the vibration of the vibrating diaphragm 1121.

[0062] As shown in Figures 9 and 10, in some embodiments, the vibrating membrane 1121 may include a main body region 11211 and an edge region 11212 installed surrounding the main body region 11211. In some embodiments, the main body region 11211 includes a first inclined portion 11211a and a first connection portion 11211b connected to a coil 1122. As shown in Figure 9, the first connection portion 11211b is used to connect the coil 1122, and is installed parallel to the minor axis Z and perpendicular to the vibration direction of the vibrating membrane. The first inclined portion 11211a is bonded to a portion of the edge region 11212. In some embodiments, the first inclined portion 11211a is inclined away from the coil 1122 with respect to the first connection portion 11211b. As shown in Figures 9 and 10, the coil 1122 is located below the first connection portion 11211b, and the first inclined portion 11211a is inclined upward relative to the first connection portion 11211b (i.e., away from the coil 1122). This arrangement prevents the adhesive used for bonding the coil 1122 from overflowing into the edge region 11212 when the coil 1122 is bonded to the vibrating membrane 1121, thereby preventing the adhesive from corroding the edge region 11212 and affecting the vibration performance of the vibrating membrane 1121.

[0063] In some embodiments, the magnetic circuit assembly 1125 mainly includes a permeable plate 11251, a magnet 11252, and a housing member 11253, wherein the permeable plate 11251 and the magnet 11252 are connected to each other, and the side of the magnet 11252 away from the permeable plate 11251 is attached to the bottom wall of the housing member 11253, with a gap between the circumferential side of the magnet 11252 and the inner circumferential side of the housing member 11253. The coil 1122 may be inserted into the gap between the magnet 11252 and the housing member 11253. If the distance between the coil 1122 and the side wall of the housing member 11253 is too large, the coil will not be located in a region of high magnetic flux density in the magnetic circuit assembly 1125, weakening the power supplied from the magnetic circuit assembly 1125 to the diaphragm 1121, and if the distance is too small, there is a risk that the coil 1122 will collide with the housing member 11253. Therefore, in order to avoid collisions of the coil 1122 and to ensure that power is supplied from the magnetic field to the vibrating membrane 1121, in some embodiments, the distance wt between the coil 1122 and the side wall of the magnet 11252 may be 0.1 mm to 0.25 mm in the gap described above, and the distance ww between the coil 1122 and the inner wall on the circumferential side of the housing member 11253 may be 0.1 mm to 0.5 mm. In some embodiments, the distance wt between the coil 1122 and the side wall of the magnet 11252 may be 0.12 mm to 0.24 mm, and the distance ww between the coil 1122 and the inner wall on the circumferential side of the housing member 11253 may be 0.15 mm to 0.3 mm. In some embodiments, in the gap described above, the distance wt between the coil 1122 and the side wall of the magnet 11252 may be 0.17 mm to 0.21 mm, and the distance ww between the coil 1122 and the inner wall on the circumferential side of the housing member 11253 may be 0.19 mm to 0.23 mm. In some embodiments, the distance wt between the coil 1122 and the side wall of the magnet 11252 may be 0.2 mm, and the distance ww between the coil 1122 and the inner wall on the circumferential side of the housing member 11253 may be 0.2 mm.If the distance h3 between the coil 1122 and the bottom 11253a of the housing member 11253 is too large, the overall volume of the sound generating unit 11 will increase. Conversely, if the distance h3 between the coil 1122 and the bottom 11253a of the housing member 11253 is too small in the vibration direction of the diaphragm 1121, there is a risk that the coil 1122 will collide with the housing member 11253. Therefore, in order to avoid the volume of the sound generating unit 11 being too large and to avoid the collision of the coil 1122, in some embodiments, the distance h3 between the coil 1122 and the bottom 11253a of the housing member 11253 (i.e., the distance between one end of the coil 1122 away from the diaphragm 1121 and the bottom wall of the housing member 11253) may be 0.2 mm to 4 mm. In some embodiments, the distance h3 between the coil 1122 and the bottom wall of the housing member 11253 may be 0.6 mm to 3 mm. In some embodiments, the distance h3 between the coil 1122 and the bottom wall of the housing member 11253 may be 1 mm to 2 mm. In some embodiments, the distance h3 between the coil 1122 and the bottom wall of the housing member 11253 may be 1.4 mm to 1.6 mm.

[0064] In some embodiments, the relative position between the coil 1122 and the magnetic circuit assembly 1125 can be changed by designing the inclination angle β of the first inclined portion 11211a relative to the first connection portion 11211b, thereby nearly matching the thrust received by the coil 1122, further adjusting the low-frequency distortion of the sound generating portion 11, and enriching the low-frequency sound perception. Also, by designing the inclination angle β of the first inclined portion 11211a relative to the first connection portion 11211b, it is possible to avoid the adhesive overflowing onto the edge region 11212 due to the coil 1122, corroding the edge region 11212 and affecting the vibration of the edge region 11212. As shown in Figure 10, the inclination angle β of the first inclined portion 11211a with respect to the first connecting portion 11211b is the angle between the first inclined portion 11211a and the line on which the first connecting portion 11211b are located, in the direction away from the first connecting portion 11211b.

[0065] In some embodiments, the inclination angle β of the first inclined portion 11211a relative to the first connection portion 11211b may be in the range of 5° to 30° in order to reduce the degree of distortion of the sound generating portion 11 and avoid corrosion of the edge region 11212 and affecting the vibration of the edge region 11212. In some embodiments, the inclination angle β of the first inclined portion 11211a relative to the first connection portion 11211b may be in the range of 10° to 25° in order to further reduce the degree of distortion of the sound generating portion 11. For example, the inclination angle β of the first inclined portion 11211a relative to the first connection portion 11211b may be 15°. Alternatively, for example, the inclination angle β of the first inclined portion 11211a relative to the first connection portion 11211b may be 22°.

[0066] In some embodiments, the minimum distance from the coil 1122 to the first inclined portion 11211a is 0.3 mm or more, that is, the distance between the connection point between the first inclined portion 11211a and the first connecting portion 11211b and the connection area between the coil 1122 and the first connecting portion 11211b is 0.3 mm or more, thereby maintaining a safe distance between the edge region 11212 and the mounting position of the coil 1122 and preventing the adhesive for mounting the coil 1122 from overflowing into the edge region 11212.

[0067] In some embodiments, the edge region 11212 includes a second inclined portion 11212a, the second inclined portion 11212a being at least partially bonded to the first inclined portion 11211a. The main body region 11211 and the edge region 11212 are connected by the first inclined portion 11211a and the second inclined portion 11212a. In some embodiments, to simplify the bonding process, the first inclined portion 11211a and the second inclined portion 11212a may be connected by adhesive. In some embodiments, to achieve the connection between the main body region 11211 and the edge region 11212, the second inclined portion 11212a may be located on the side of the first inclined portion 11211a closer to the coil 1122. In some embodiments, the second inclined portion 11212a may be positioned on the side of the first inclined portion 11211a away from the coil 1122 in order to connect the main body region 11211 and the edge region 11212, and to reduce corrosion of the edge region 11212 by adhesive when bonding the coil 1122.

[0068] Because the amplitude of the vibrating membrane 1121 is large at low frequencies, if the edge region 11212 uses a planar structure, its deformation capacity is low, which affects the amplitude of the vibrating membrane 1121 during vibration. Therefore, in order to give the vibrating membrane 1121 excellent deformation capacity, in some embodiments the edge region 11212 may include an arc-shaped portion 11212c.

[0069] In some embodiments, the ratio of the height h1 to the span w1 of the arc-shaped portion 11212c can affect the deformation capacity of the arc-shaped portion 11212c. The height of the arc-shaped portion 11212c is the distance between the highest point and the lowest point of the arc-shaped portion 11212c in the vibration direction of the vibrating membrane 1121. As shown in Figure 10, the height of the arc-shaped portion 11212c is denoted as h1. The span of the arc-shaped portion 11212c is the maximum distance between two points in the arc-shaped portion 11212c. As shown in Figure 10, the span of the arc-shaped portion 11212c is denoted as w1. If the ratio of the height h1 to the span w1 of the arc-shaped portion 11212c is too small, the degree of projection of the arc-shaped portion 11212c will be too small, the shape will become closer to a planar structure, and the deformation capacity may decrease. If the ratio of the height h1 to the span w1 of the arc-shaped portion 11212c is too large, the protrusion of the arc-shaped portion 11212c will be too large, resulting in a large resistance when the diaphragm 1121 vibrates, which will affect the output of the sound generating unit 11. Therefore, in some embodiments, in order to give the sound generating unit 11 excellent output and low distortion, the ratio of the height h1 to the span w1 of the arc-shaped portion 11212c may be in the range of 0.35 to 0.4. In some embodiments, in order to further improve the output of the sound generating unit 11, the ratio of the height h1 to the span w1 of the arc-shaped portion 11212c may be in the range of 0.36 to 0.39. In some embodiments, in order to further reduce the distortion of the sound generating unit 11, the ratio of the height h1 to the span w1 of the arc-shaped portion 11212c may be in the range of 0.37 to 0.38. For example, the ratio of the height h1 to the span w1 of the arc-shaped portion 11212c may be 0.38.

[0070] In some embodiments, the height h1 of the arc-shaped portion 11212c may be in the range of 0.5 mm to 0.7 mm. For example, the height h1 of the arc-shaped portion 11212c may be in the range of 0.55 mm to 0.65 mm. In some embodiments, the height h1 of the arc-shaped portion 11212c may be 0.6 mm. Taking tolerances into account, in some embodiments, the height h1 of the arc-shaped portion 11212c may be 0.6 mm ± 0.05 mm. In some embodiments, the span (width) w1 of the arc-shaped portion 11212c of the edge region 11212 may be less than twice the radius of curvature r1. In some embodiments, the radius of curvature r1 of the arc-shaped portion 11212c of the edge region 11212 may be 0.7 mm to 0.9 mm. In some embodiments, the radius of curvature r1 of the arc-shaped portion 11212c of the edge region 11212 may be 0.75 mm to 0.88 mm. In some embodiments, the radius of curvature r1 of the arc-shaped portion 11212c of the edge region 11212 may be 0.8 mm to 0.83 mm. In some embodiments, the span w1 of the arc-shaped portion 11212c of the edge region 11212 may be 1.2 mm to 1.7 mm. In some embodiments, the span w1 of the arc-shaped portion 11212c of the edge region 11212 may be 1.3 mm to 1.65 mm. In some embodiments, the span w1 of the arc-shaped portion 11212c of the edge region 11212 may be 1.5 mm to 1.6 mm. In some embodiments, the radius of curvature r1 of the arc-shaped portion 11212c of the edge region 11212 may be 0.82 mm, and the span w1 of the arc-shaped portion 11212c of the edge region 11212 may be 1.58 mm. Taking into account the tolerances, in some embodiments, the radius of curvature r1 of the arc-shaped portion 11212c of the edge region 11212 may be 0.82 mm ± 0.05 mm, and the span w1 of the arc-shaped portion 11212c of the edge region 11212 may be 1.58 mm ± 0.1 mm.

[0071] In some embodiments, the edge region 11212 may include a wave-like structure consisting of multiple arc-shaped portions 11212c, where any two adjacent arc-shaped portions 11212c are oriented in opposite directions. The installation of the wave-like structure makes the degree of resistance to upward and downward vibrations during the vibration process of the diaphragm 1121 as symmetrical as possible, reduces the degree of distortion of the sound generating unit 11, and improves the low-frequency output of the sound generating unit 11. In some embodiments, the ratio of height to span of each arc-shaped portion 11212c among the multiple arc-shaped portions 11212c may be the same as the ratio of height to span of a single arc-shaped portion 11212c described above. In some embodiments, the ratio of height to span of each arc-shaped portion 11212c among the multiple arc-shaped portions 11212c may be different. For example, in the radial direction of the vibrating membrane 1121, the height of each of the multiple arc-shaped portions 11212c may gradually decrease from the center to the edge of the vibrating membrane 1121, and the span of each arc-shaped portion 11212c may be the same.

[0072] In some embodiments, to restrain the diaphragm 1121 when it vibrates significantly and to prevent the coil 1122 from colliding with the magnetic circuit assembly 1125, the main body region 11211 may include an arched dome 11211c located at one end of the first connection portion 11211b away from the first inclined portion 11211a, where the arched dome 11211c and the arc portion 11212c have the same arch direction, i.e., the arched dome 11211c protrudes toward the side away from the coil 1122. The arched dome 11211c can prevent the diaphragm 1121 from vibrating significantly and ensure that the coil 1122 and the magnetic circuit assembly 1125 do not collide. At the same time, the arched dome 11211c also has high strength and rigidity, and improves the high-frequency vibration characteristics of the transducer 112 by suppressing partial vibrations of the main body region 11211 to some extent. Without a front cover, the dome's aspect ratio (i.e., the ratio of height to span) increases, resulting in a higher high-frequency bandwidth. However, if the dome's aspect ratio is too high, the degree of non-uniformity increases, and the overall dimensions increase.

[0073] In some embodiments, the height h2 of the dome 11211c is related to the dimension of the dome 11211c in the arch extension direction (i.e., span dimension w2). The height of the dome 11211c is the distance between the highest point of the dome 11211c and the lowest point of the dome 11211c (i.e., the endpoint connected to the first connection 11211b) in the vibration direction of the vibrating membrane 1121. As shown in Figure 10, the height of the dome 11211c is h2. The span of the dome 11211c is the maximum distance between two points in the dome 11211c. As shown in Figure 10, the span of the dome 11211c is w2. As the span dimension w2 of the dome 11211c increases, the height h2 of the dome 11211c also increases in order to maintain the arch structure of the dome 11211c (for example, to maintain the radians corresponding to the dome 11211c within a preset radian range), which may cause the overall thickness dimension of the transducer 112 to become too large. Considering the overall thickness and structural design of the transducer 112, in some embodiments, the preset radian range of the body region 11211 of the vibrating membrane 1121 corresponding to the dome 11211c may be 0.5263rad to 3.1416rad. In some embodiments, the preset radian range of the body region 11211 of the vibrating membrane 1121 corresponding to the dome 11211c may be 0.7869rad to 3.1416rad. In some embodiments, the preset radian range corresponding to the dome 11211c of the main body region 11211 of the vibrating membrane 1121 may be 1.0526 rad to 3.1416 rad. In some embodiments, the preset radian range corresponding to the dome 11211c of the main body region 11211 of the vibrating membrane 1121 may be 1.5789 rad to 3.1416 rad. In some embodiments, the preset radian range corresponding to the dome 11211c of the main body region 11211 of the vibrating membrane 1121 may be 2.1053 rad to 3.1416 rad. In some embodiments, the preset radian range corresponding to the dome 11211c of the main body region 11211 of the vibrating membrane 1121 may be 2.6316 rad to 3.1416 rad. In some embodiments, the width dimension w2 of the dome 11211c of the main body region 11211 may be 2 mm to 8 mm.In some embodiments, the width dimension w2 of the dome 11211c of the main body region 11211 may be 3 mm to 7 mm. In some embodiments, the width dimension w2 of the dome 11211c of the main body region 11211 may be 4 mm to 6 mm. In some embodiments, the width dimension w2 of the dome 11211c of the main body region 11211 may be 4.8 mm. In some embodiments, the height h2 of the dome 11211c of the main body region 11211 (i.e., the distance between the highest and lowest points of the dome 11211c in the vibration direction of the vibrating membrane) may be in the range of 0.7 mm to 1.2 mm. In some embodiments, the height h2 of the dome 11211c of the main body region 11211 may be 0.9 mm to 1.1 mm. In some embodiments, the height h2 of the dome 11211c of the main body region 11211 may be 1 mm to 1.05 mm. In some embodiments, the height h2 of the dome 11211c of the main body region 11211 may be 0.8 mm. In some embodiments, due to machining tolerances, the height h2 of the dome 11211c of the main body region 11211 may be 0.8 mm ± 0.08 mm.

[0074] In some embodiments, the ratio of the height h2 to the span w2 of the dome 11211c may affect the overall dimensions of the sound generating section 11 and the vibration of the diaphragm 1121. If the ratio of the height h2 to the span w2 of the dome 11211c is too small, the protrusion of the dome 11211c is too small, the shape of the dome 11211c becomes closer to a planar structure, the strength and rigidity of the dome 11211c are low, partial vibrations are more likely to appear in the dome 11211c, many peaks and bottoms appear in the high-frequency region, and affect the high-frequency vibration characteristics of the transducer 112. If the ratio of the height h2 to the span w2 of the dome 11211c is too large, the protrusion of the dome 11211c is too large, the overall thickness dimension of the transducer 112 may be too large, and the non-uniformity and overall dimensions also increase. Therefore, the entire sound generating section 11 has an appropriate thickness dimension, and in order to improve the high-frequency vibration characteristics of the sound generating section 11, the ratio of the height h2 to the span w2 of the dome 11211c may be in the range of 0.1 to 0.6. In some embodiments, in order to further improve the high-frequency vibration characteristics of the transducer 112, the ratio of the height h2 to the span w2 of the dome 11211c may be in the range of 0.1 to 0.4. In some embodiments, in order to further improve the high-frequency vibration characteristics of the transducer 112, the ratio of the height h2 to the span w2 of the dome 11211c may be in the range of 0.1 to 0.3.

[0075] In some embodiments, considering the structural strength, the difficulty of process implementation, and the limitation of the overall thickness of the acoustic generating unit 11 comprehensively, and to satisfy the maximum amplitude of the diaphragm 1121 and prevent the diaphragm 1121 from colliding with the pole piece 11251 during vibration, in the vibration direction of the diaphragm, the distance (the distance hd shown in FIG. 9) from the lowest point of the dome 11211c of the main body region 11211 of the diaphragm 1121 to the top of the pole piece 11251 in the magnetic circuit assembly 1125 may be greater than 0.8 mm. In some embodiments, the distance hd from the lowest point of the dome 11211c of the main body region 11211 of the diaphragm 1121 to the top of the pole piece 11251 in the magnetic circuit assembly 1125 may be 0.85 mm to 0.95 mm, that is, it may be 0.9 mm ± 0.05 mm. 0.9 mm is the structural dimension, and 0.05 mm is the error range dimension. In some embodiments, the distance hd from the lowest point of the dome 11211c of the main body region 11211 of the diaphragm 1121 to the top of the pole piece 11251 in the magnetic circuit assembly 1125 may be 0.86 mm to 0.93 mm. In some embodiments, the distance hd from the lowest point of the dome 11211c of the main body region 11211 of the diaphragm 1121 to the top of the pole piece 11251 in the magnetic circuit assembly 1125 may be 0.88 mm to 0.92 mm.

[0076] FIG. 11A is a schematic diagram of an exemplary high-frequency bandwidth of an acoustic generating unit according to some embodiments of the present specification. As shown in FIG. 11A, in the frequency response curve of the acoustic generating unit 11, there is a first inflection point f0 in the low-frequency region, and f0 is around about 300 Hz. f0 is related to the hardness and softness of the edge region 11212 of the diaphragm 1121 and the vibration weight (mainly the weight of the main body region 11211). The second inflection point f h is around 25 kHz, and f h may be determined based on the overall trend of the frequency response curve. After f h = 25 kHz, there are locally small peaks in the curve, but the overall trend is decreasing. Select the peak value of the frequency band between f0 and f h (that is, between 300 Hz and 25 kHz) and take the average value to obtain the first reference line Lm This forms the upper straight line in Figure 11A, and by lowering this reference line by 10 dB, we get the second straight line L n This forms the straight line at the bottom of Figure 11A, meaning the selected bandwidth is 100Hz to 45kHz.

[0077] In some embodiments, the frequency of the high-frequency divided vibration of the vibrating membrane 1121 is proportional to E / ρ, where E is the Young's modulus of the vibrating membrane 1121 and ρ is the equivalent density of the vibrating membrane 1121. Therefore, the high-frequency bandwidth can be determined by E / ρ. When E is constant, the smaller the mass of the vibrating membrane 1121, the smaller the equivalent density ρ of the vibrating membrane 1121, the larger E / ρ becomes, and the wider the high-frequency bandwidth. When ρ is constant, the larger the Young's modulus E of the vibrating membrane 1121, the larger E / ρ becomes, the higher the frequency of the high-frequency divided vibration of the vibrating membrane 1121, and the wider the high-frequency bandwidth.

[0078] In some embodiments, the high-frequency divided vibration region of the sound generation unit 11 is the region where the frequency response curve reaches its highest peak, then the frequency response drops sharply, and peak and bottom values ​​alternate. As shown in Figure 11A, the frequency response curve reaches its highest peak (i.e., f h After reaching the corresponding sound pressure level, the frequency response drops sharply, and peak and bottom values ​​appear alternately, f h The region on the right is the high-frequency divided oscillation region. The frequency at which the corresponding curve reaches its highest peak is the frequency at which high-frequency divided oscillations appear (shown in Figure 11A). h) In some embodiments, the vibration of different parts within the main body region 11211 differs greatly, and in order to avoid low high-frequency effect, the frequency of the high-frequency divided vibration of the main body region 11211 (dome 11211c) is designed so that the diaphragm 1121 has a wide high-frequency bandwidth and the number of occurrences of high-frequency divided vibration within the bandwidth region can be reduced. In some embodiments, the frequency of the high-frequency divided vibration of the dome 11211c may be 20 kHz or higher. For example, the frequency of the high-frequency divided vibration of the dome 11211c may be 25 kHz or higher. In some embodiments, in order to ensure that the output of the main body region 11211 is high in the effective frequency band, it is necessary to reduce the mass of the main body region 11211, thereby reducing the vibration hardness of the main body region 11211 in the effective frequency band. Therefore, the material and structure of the main body region 11211 can be selected to have low density and high strength. Therefore, the Young's modulus of the dome 11211c may be 6 GPa or higher. In some embodiments, the Young's modulus of dome 11211c may be in the range of 6 GPa to 7 GPa. For example, the Young's modulus of dome 11211c may be 6.5 GPa. The Young's modulus of dome 11211c can be measured by static or dynamic methods (e.g., pulse excitation method, acoustic resonance method, sound velocity method, etc.).

[0079] In some embodiments, the main body region 11211 may be made of carbon fiber material. Figure 11B is a schematic diagram of an exemplary carbon fiber woven structure according to some embodiments of this specification. Carbon fiber material has low density and high strength, which helps to attenuate higher-order modes of speaker 112. In some embodiments, in order to further improve the strength of the main body region 11211 and reduce the equivalent density of the main body region 11211, the main body region 11211 may be woven by interlacing carbon fibers, with at least some of the carbon fibers interlacing at a first angle. In some embodiments, the first angle is in the range of 45° to 90°. For example, when weaving multiple independent carbon fibers, the warp and weft threads can be interlaced at any angle such as 45°, 60°, or 90°. As shown in Figure 11B, multiple carbon fibers 112111 and multiple carbon fibers 112112 may be woven interlaced at an angle close to 90°. In some embodiments, because the carbon fibers are very thin, multiple carbon fibers 112111 and multiple carbon fibers 112112 may be laid at an angle close to 90° and connected by adhesive. In some embodiments, the main body region 11211 may include multiple layers (e.g., two or three layers) of structures woven by interlacing carbon fibers. To facilitate the interlacing and weaving of carbon fibers, in some embodiments, the length of a single carbon fiber is 5 mm or more. In some embodiments, the length of a single carbon fiber may be in the range of 5 mm to 10 mm. For example, the length of a single carbon fiber may be 7 mm. Because the single carbon fibers are too thin, weaving them one by one is difficult and impractical. In some embodiments, multiple carbon fibers can be laid and connected (e.g., connected by adhesive) to form multiple sets of carbon fibers, and the warp and weft threads are interlaced and woven between the multiple sets of carbon fibers.

[0080] In some embodiments, the thickness of the main body region 11211 can be designed using a very smoothly aligned carbon fiber structure to reduce the weight of the main body region 11211 and to obtain a selected high-frequency bandwidth. In some embodiments, the thickness of the main body region 11211 may be less than 80 μm. In some embodiments, the thickness of the main body region 11211 may be in the range of 10 μm to 60 μm. In some embodiments, the thickness of the main body region 11211 may be 25 μm.

[0081] Figure 12 is a schematic diagram of the amplitude of the sound generating unit at different driving voltages according to some embodiments of this specification. As shown in Figure 12, at the same voltage, the amplitude of vibration of the diaphragm 1121 of the transducer 112 in two opposite directions (positive and negative directions in the thickness direction X shown in Figure 6, i.e., positive and negative directions of the vertical coordinate axis in Figure 12) is different, which is due to the asymmetry of the diaphragm 1121. In Figure 12, the unit Vrms indicates the effective voltage value of the sinusoidal AC signal, for example, 0.7Vrms indicates that the effective voltage value of the input sinusoidal AC signal is 0.7V. As shown in Figure 12, in the input voltage range of 0.4V to 0.7V, the amplitude of vibration of the diaphragm 1121 downward (negative direction of the vertical coordinate axis) (approximately 0.8 mm) is greater than the amplitude of vibration upward (positive direction of the vertical coordinate axis) (approximately 0.6 mm). When the diaphragm 1121 vibrates upward, it vibrates toward the front cavity 114, and when the diaphragm 1121 vibrates downward, it vibrates toward the back cavity 116 (towards the magnetic circuit assembly 1125). As shown in Figure 12, as the input voltage continues to increase (for example, from 0.7V to 1V), the amplitude change of the diaphragm 1121 gradually decreases and eventually approaches a threshold, with the downward vibration amplitude of the diaphragm 1121 approaching a first threshold (approximately 0.9 mm) and the upward vibration amplitude approaching a second threshold (approximately 0.8 mm). Since the downward vibration amplitude of the diaphragm 1121 is larger than the upward vibration amplitude, all amplitudes of the diaphragm 1121 as used herein refer to the larger downward vibration amplitude of the diaphragm 1121. In some embodiments, the maximum amplitude of the diaphragm 1121 may be designed not to exceed 0.8 mm in order to avoid the coil 1122 colliding with the magnetic circuit assembly 1125 when the diaphragm 1121 vibrates; that is, the amplitude of the diaphragm 1121 may be in the range of 0 mm to 0.8 mm. In some embodiments, the amplitude of the diaphragm 1121 may be in the range of 0 mm to 0.75 mm. In some embodiments, the amplitude of the diaphragm 1121 may be in the range of 0 mm to 0.7 mm.

[0082] In some embodiments, within the amplitude range of 0 mm to 0.8 mm, the difference in amplitude between the two opposing vibrations of the diaphragm 1121 (i.e., upward vibration and downward vibration) may be less than 0.05 mm, thereby reducing the degree of strain on the transducer 112. In some embodiments, to further reduce the degree of strain on the transducer 112, the difference in amplitude between the two opposing vibrations of the diaphragm 1121 (i.e., upward vibration and downward vibration) may be less than 0.04 mm. In some embodiments, to further reduce the degree of strain on the transducer 112, the difference in amplitude between the two opposing vibrations of the diaphragm 1121 (i.e., upward vibration and downward vibration) may be less than 0.03 mm.

[0083] As shown in Figures 8 and 9, in some embodiments, the support frame 1123 is installed surrounding the magnetic circuit assembly 1125. As shown in Figure 9, in the vibration direction of the vibrating membrane, the support frame 1123 may include a first portion 112311, a second portion 11232, and a third portion 11233. The first portion 112311 is the portion between the highest point D of the connection area between the support frame 1123 and the vibrating membrane 1121 and the highest point of the connection area between the support frame 1123 and the housing member 11253 in the vibration direction of the vibrating membrane 1121. The second portion 11232 is the region in the support frame 1123 where ventilation holes are formed. As shown in Figure 9, the second portion 11232 is the portion between the highest point of the connection region between the support frame 1123 and the housing member 11253 and the side wall where the bottom of the ventilation holes in the support frame 1123 is located (i.e., toward the bottom 11253a of the housing member 11253), in the vibration direction of the vibrating membrane 1121. The third portion 11233 is the portion between the side wall where the bottom of the ventilation holes in the support frame 1123 is located and the bottom of the support frame 1123 that is close to the magnetic circuit assembly 1125 (i.e., close to the bottom 11253a of the housing member 11253). As shown in Figure 10, a second connection portion 11212b for connecting the support frame 1123 is provided at one end of the edge region 11212 away from the main body region 11211. The second connection portion 11212b described above is positioned parallel to the minor axis Z and perpendicular to the vibration direction of the vibrating membrane. In some embodiments, the first portion 112311 of the support frame 1123 is connected to the second connection portion 11212b of the edge region 11212. In some embodiments, the second connection portion 11212b of the edge region 11212 is connected to the first portion 112311 of the support frame 1123 by a fixing ring 1155, thereby achieving fixation between the vibrating membrane 1121 and the support frame 1123.

[0084] Figure 13 is an illustrative structural diagram of a substructure of a back cavity according to some embodiments of this specification. As shown in Figures 6 and 13, in some embodiments, a connecting frame 115 may be installed within the housing 111, and a second acoustic cavity may be surrounded by the connecting frame 115 and the support frame 1123 of the transducer 112, and the second acoustic cavity may function as a back cavity 116. The back cavity 116 is separated from other structures within the housing 111 (e.g., the main control circuit board), which helps to improve the acoustic expressiveness of the sound generating unit 11. The housing 111 is provided with depressurization holes (for example, a first depressurization hole 111c and / or a second depressurization hole 111d), and the connecting frame 115 is provided with an acoustic passage 1151 for connecting the depressurization holes and the back cavity 116, facilitating communication between the back cavity 116 and the external environment, that is, allowing air to freely enter and exit the back cavity 116, thereby helping to reduce resistance in the vibration process of the diaphragm 1121 of the transducer 112.

[0085] In some embodiments, the cross-section of the back cavity 116 may consist of two perpendicular sides and one curved side, connecting the two endpoints of the curved side, and the cross-section (e.g., cross-section ABC) may be considered substantially triangular. The hypotenuse AC is a line connecting two endpoints formed by the contact between a curved surface formed on the connecting frame 115 and two perpendicular sides of the support frame 1123. In some embodiments, the thickness h4 of the first portion 112311 of the support frame 1123 in the vibration direction of the diaphragm 1121 can affect the volume of the back cavity 116. If the thickness h4 of the first portion 112311 is increased, the volume of the back cavity 116 decreases, provided that the overall volume of the sound generating unit 11 does not change, and conversely, if the thickness h4 of the first portion 112311 is decreased, the volume of the back cavity 116 increases. In some embodiments, the thickness of the first portion 112311 of the support frame 1123 can affect the volume of the back cavity 116, thereby affecting the resonant frequency of the back cavity 116. In some embodiments, the back cavity 116 may be a cavity located behind the diaphragm, in which case, if the thickness h4 of the first portion 112311 of the support frame 1123 increases, the volume of the back cavity 116 increases, provided that the overall volume of the sound generating unit 11 does not change, and conversely, if the thickness h4 of the first portion 112311 decreases, the volume of the back cavity 116 decreases.

[0086] In some embodiments, the combination of a back cavity 116 and a depressurization hole (e.g., a first depressurization hole 111c and / or a second depressurization hole 111d) installed in the housing 111 can be considered a Helmholtz resonant cavity model. The back cavity 116 can function as a cavity in the Helmholtz resonant cavity model, and the depressurization hole can function as the neck of the Helmholtz resonant cavity model, in which case the resonant frequency of the Helmholtz resonant cavity model is the resonant frequency f2 of the back cavity 116. In the Helmholtz resonant cavity model, the volume of the cavity (e.g., the back cavity 116) can affect the resonant frequency f of the cavity (e.g., the back cavity 116), and the specific relationship is shown in equation (1).

[0087]

number

[0088] Here, c represents the speed of sound, S represents the cross-sectional area of ​​the neck (e.g., the decompression port), V represents the volume of the cavity (e.g., back cavity 116), and L represents the depth of the neck (e.g., the decompression port).

[0089] As can be seen from equation (1), if the cross-sectional area S of the decompression holes (for example, the first decompression hole 111c and / or the second decompression hole 111d) and the depth L of the decompression holes do not change, then as the volume of the back cavity 116 increases, the resonant frequency f2 of the back cavity 116 decreases, that is, it shifts to a lower frequency.

[0090] Figure 14 is a frequency response curve diagram of the back cavity corresponding to different thicknesses of the first portion 112311 according to some embodiments of this specification. As can be seen from Figure 14, as the thickness h4 of the first portion 112311 of the support frame 1123 gradually increases from 0.3 mm to 3 mm, the volume of the back cavity 116 gradually increases, the resonance peak of the back cavity 116 gradually shifts to lower frequencies, the flat range of the frequency response curve decreases, and this affects the output performance of the sound generator 11.

[0091] If the thickness h4 of the first portion 112311 is too small, the amplitude of the diaphragm 1121 will be limited by the support frame 1123. If the thickness h4 of the first portion 112311 is too large, the overall dimensions of the sound generating unit 11 will be too large, the resonance peak of the back cavity 116 will shift to a lower frequency, the range of the flat region of the frequency response curve of the back cavity 116 will decrease, and the sound quality of the sound generating unit 11 will be affected. The thickness of the first portion 112311 is the minimum distance between the connection region between the support frame 1123 and the edge region 11212 and the region directly bonded to the magnetic circuit assembly 1125 in the vibration direction of the diaphragm 1121.

[0092] In some embodiments, the thickness h4 of the first portion 112311 of the support frame 1123 may be in the range of 0.3 mm to 3 mm in order to give the sound generation unit 11 a high low-frequency output and to increase the range of the flat region of the frequency response curve of the back cavity 116. In some embodiments, the thickness h4 of the first portion 112311 may be in the range of 0.5 mm to 2 mm in order to further improve the low-frequency output of the sound generation unit 11. In some embodiments, the thickness h4 of the first portion 112311 may be in the range of 0.8 mm to 1 mm in order to further increase the range of the flat region of the frequency response curve of the back cavity 116. In some embodiments, the thickness h4 of the first portion 112311 may be 0.9 mm, in which case the resonance peak of the back cavity 116 is around 6.1 kHz, the sound generation unit 11 has excellent low-frequency output, and the frequency response curve of the back cavity 116 has a wide flat region.

[0093] In some embodiments, the weight of the transducer 112 is mainly related to the support frame 1123 and the magnetic circuit assembly 1125, with the magnetic circuit assembly 1125 accounting for a larger proportion of the weight. In some embodiments, if the material of the support frame 1123 does not change, an increase in the weight of the support frame 1123 means an increase in the dimensions of the support frame 1123, which may correspond to an increase in the area of ​​the diaphragm 1121. In some embodiments, an increase in the weight of the magnetic circuit assembly 1125 increases the magnetic induction strength near the coil 1122, resulting in a greater driving force generated on the coil, a larger amplitude of the diaphragm 1121, and a transducer 112 having higher sensitivity and better low-frequency effect. However, if the weight of the transducer 112 is too large, the weight of the sound generating unit 11 becomes too large, affecting the wearing stability and comfort of the open-type earphone 10.

[0094] Considering the two types of wearing conditions, where at least a portion of the sound generating unit 11 shown in Figure 3 covers the antihelix region, and where all or part of the sound generating unit 11 shown in Figure 4 is inserted into the concha, the volume audible to the ear 100 increases (corresponding to higher sound generation efficiency). Therefore, the weight of the transducer 112 can be reduced by reducing the dimensions of the diaphragm 1121 or the weight of the magnetic circuit assembly 1125, thereby giving the transducer 112 high sensitivity and low-frequency output, and the open-type earphone 10 high wearing stability and comfort. In some embodiments, the weight of the transducer 112 may be in the range of 1.1g to 3.3g. In some embodiments, in order to further improve the sensitivity and low-frequency output of the transducer 112, the weight of the transducer 112 may be in the range of 1.5g to 3g. In some embodiments, the weight of the transducer 112 may be in the range of 2g to 2.5g in order to further improve the wearing stability and comfort of the open-type earphone 10. In some embodiments, the weight of the transducer 112 may be 2.2g.

[0095] Figure 15 shows the frequency response curves of an acoustic generating unit at different drive voltages according to some embodiments of this specification. When the surface of the diaphragm of the speaker 112 is directly facing the measurement microphone at a distance of 4 mm, a voltage in the range of 0.1 V to 0.7 V is applied to the speaker 112, and the measurement frequency range is set to 20 Hz to 20000 Hz, frequency response curves of the speaker 112 at different drive voltages (shown in Figure 15) are obtained. As shown in Figures 12 and 15, when the input voltage is in the range of 0.1 V to 0.7 V and the frequency is in the range of 20 Hz to 6.1 kHz, the amplitude of the diaphragm 1121 is in the range of 0 mm to 0.8 mm. In this case, in order to prevent the coil 1122 from contacting the bottom 11253a of the housing member during vibration, the distance h3 (shown in Figure 9) between the bottom of the coil 1122 and the bottom 11253a of the housing member may be greater than 0.8 mm. In some embodiments, in order to reduce the dimensions of the sound generating unit 11 and improve user comfort, the distance h3 (shown in Figure 9) between the bottom of the coil 1122 and the bottom of the housing member 11253a may be 0.9 mm or less. Therefore, within the range of an input voltage of 0.1 V to 0.7 V and a frequency range of 20 Hz to 6.1 kHz, the distance h3 (shown in Figure 9) from the bottom of the coil 1122 to the bottom of the housing member 11253a may be within the range of 0.8 mm to 0.9 mm.

[0096] As shown in Figure 15, as the input voltage gradually increases from 100mV to 700mV, the output of the sound generator 11 gradually increases, and the sensitivity gradually increases, but the frequency of the resonance peak hardly changes and remains around 6.1kHz. Considering the two types of mounting conditions, where at least a part of the sound generator 11 shown in Figure 3 covers the antihelix region, and where all or part of the sound generator 11 shown in Figure 4 is inserted into the concha, the sound generator 11 has high sensitivity by controlling the distance h3 (shown in Figure 9) from the bottom of the coil 1122 to the bottom of the housing member 11253a to within the range of 0.8mm to 0.9mm. As shown in Figure 15, when the input voltage is 100mV to 700mV, the sound pressure level (SPL) of the sound generator 11 is in the range of 85dB to 103dB at a frequency of 1kHz.

[0097] In some embodiments, as can be seen from the above, the thickness h4 of the first portion 112311 of the support frame 1123 is in the range of 0.3 mm to 3 mm. When the thickness h4 of the first portion 112311 increases to 3 mm, the resonant frequency f2 of the corresponding back cavity 116 decreases to 3.3 kHz, reducing the range of the flat region and affecting the sound quality. In some embodiments, in order to increase the range of the flat region and improve the sound quality of the sound generating unit 11, the thickness h4 of the first portion 112311 may be less than 3 mm, and the resonant frequency f2 of the back cavity 116 may be 3.3 kHz or higher. In some embodiments, in order to further improve the sound quality of the sound generating unit 11, the resonant frequency f2 of the back cavity 116 may be 3.5 kHz or higher. In some embodiments, in order to further improve the sound quality of the sound generating unit 11, the resonant frequency f2 of the back cavity 116 may be 4 kHz or higher. In some embodiments, the resonant frequency f2 of the back cavity 116 may be 6 kHz or higher in order to further improve the sound quality of the sound generating unit 11.

[0098] In some embodiments, according to formula (1), the volume of the back cavity 116 can affect the resonant frequency f2 of the back cavity 116. The volume of the back cavity 116 is affected by the thickness h4 of the first portion 112311 of the support frame 1123. Based on the range of values ​​for the thickness h4 of the first portion 112311 and the range of values ​​for the resonant frequency f2 of the back cavity 116, a range of values ​​for the volume of the back cavity 116 can be determined. In some embodiments, the volume of the back cavity 116 is 60 mm 3 ~110mm 3 That's fine.

[0099] Figure 16 is an exemplary schematic positional diagram of a support frame, a first decompression hole, and a second decompression hole according to some embodiments of this specification. As shown in Figure 16, in some embodiments, the support frame 1123 is formed with a plurality of ventilation holes 11231. The installation of ventilation holes 11231 allows sound from the back of the vibrating membrane 1121 to be transmitted to the back cavity 116 and decompression holes via the plurality of ventilation holes 11231 and propagated to the outside, providing a good passage for radiating sound to both sides of the vibrating membrane 1121.

[0100] In some embodiments, the multiple vents 11231 may be designed asymmetrically to better balance the airflow and the air pressure within the back cavity 116. For example, the multiple vents 11231 may be positioned asymmetrically around the minor axis of the support frame 1123. Specifically, the support frame 1123 has a first vent 11231a and a second vent 11231b. As shown in Figure 16, the distance La between the center of the first vent 11231a and the center of the second depressurization hole 111d is greater than the distance Lb between the center of the second vent 11231b and the center of the second depressurization hole 111d. In some embodiments, the air pressure in the back cavity 116 is higher at positions further from the second pressure relief port 111d, so the area of ​​the first vent 11231a is larger than the area of ​​the second vent 11231b in order to balance the air pressure in the back cavity 116. In other words, to balance the air pressure in the back cavity 116, the area of ​​the vent becomes smaller closer to the second pressure relief port 111d (or the first pressure relief port 111c) and larger further away from the second pressure relief port 111d (or the first pressure relief port 111c). The distance between the vent 11231 and the pressure relief port is the distance between the center of the vent 11231 and the center of the corresponding pressure relief port. In this specification, the center of the vent or pressure relief port is the geometric center of the pore structure.

[0101] In the back cavity 116, the area of ​​the ventilation holes 11231 can be set larger at positions far from the first depressurization hole 111c and / or the second depressurization hole 111d because the air pressure is higher there. At positions close to the first depressurization hole 111c and / or the second depressurization hole 111d, the area of ​​the ventilation holes 11231 can be set smaller because the air pressure is lower there. If the areas of the multiple ventilation holes 11231 are the same, then in the back cavity 116, the air pressure is higher at positions far from the first depressurization hole 111c and / or the second depressurization hole 111d, and the area of ​​the ventilation holes 11231 at these positions is smaller. As a result, the air pressure in the back cavity 116 cannot be well balanced, and the air resistance experienced by the vibrating membrane 1121 at these positions becomes larger. Similarly, in the back cavity 116, the resistance experienced by the vibrating membrane 1121 at positions close to the first depressurization hole 111c and / or the second depressurization hole 111d is smaller. As a result, the force acting on the vibrating membrane 1121 becomes uneven, and the vibration of the vibrating membrane 1121 becomes unstable. Therefore, by adjusting the size of the area of ​​the ventilation holes 11231, the low-frequency vibrations of the sound generating unit 11 can be made more stable.

[0102] In some embodiments, the vents 11231 can balance the air pressure in the back cavity 116 and affect the uniformity of the air resistance experienced by the diaphragm 1121 when it vibrates, so the total area of ​​the vents 11231 can affect the output performance of the sound generating unit 11. The ratio of the total area of ​​the multiple vents 11231 to the projected area of ​​the diaphragm 1121 in the direction of vibration can affect the air resistance when the diaphragm 1121 vibrates. If the ratio of the total area of ​​the multiple vents 11231 to the projected area of ​​the diaphragm 1121 in the direction of vibration is too small, the air pressure in the back cavity 116 will increase, the air resistance experienced by the diaphragm 1121 when it vibrates will increase, and the low-frequency output performance of the diaphragm 1121 will be affected. After the ratio of the total area of ​​the multiple ventilation holes 11231 to the projected area of ​​the vibrating membrane 1121 in the direction of vibration reaches a certain threshold, further increasing this ratio reduces the change in the influence of air in the back cavity 116 on the vibration of the vibrating membrane 1121, and also affects the structural strength of the support frame. Therefore, in some embodiments, in order to ensure that the vibrating membrane 1121 receives uniform and small air resistance when it vibrates and to ensure excellent output performance of the sound generating unit 11, the ratio of the total area of ​​the multiple ventilation holes 11231 to the projected area of ​​the vibrating membrane 1121 in the direction of vibration may be in the range of 0.008 to 0.3. In some embodiments, in order to further reduce the air resistance received when the vibrating membrane 1121 vibrates, the ratio of the total area of ​​the multiple ventilation holes 11231 to the projected area of ​​the vibrating membrane 1121 in the direction of vibration may be in the range of 0.1 to 0.25. In some embodiments, in order to further reduce the air resistance experienced when the vibrating membrane 1121 vibrates, the ratio of the total area of ​​the multiple ventilation holes 11231 to the projected area of ​​the vibrating membrane 1121 in the direction of vibration may be in the range of 0.11 to 0.23.

[0103] Figure 17 shows the frequency response curves of the back cavity corresponding to different total areas of the vents in some embodiments of this specification. Different total areas of the vents 11231 can be achieved by blocking the vents 11231 with rubber clay. When the surface of the diaphragm of speaker 112 is directly facing the measurement microphone at a distance of 4 mm, a voltage of 0.4 V is applied to speaker 112, and the measurement frequency range is set to 20 Hz to 20000 Hz, the frequency response curves (shown in Figure 17) for different vent areas of speaker 112 are obtained. 0 mm 2 This means that the ventilation holes 11231 are completely sealed, that is, no holes are formed in the support frame. As shown in Figure 17, the total area of ​​the ventilation holes 11231 is 0 mm². 2 From 4.54mm 2 As the volume gradually increases, the frequency response curve of the back cavity 116 gradually shifts upward in the low-frequency region (e.g., 100Hz to 1000Hz), meaning that the low-frequency response of the back cavity 116 gradually increases. The total area of ​​the ventilation holes 11231 is 4.54 mm². 2 From 12.96mm 2 During the process of gradually increasing to this point, the change in the low-frequency response of the back cavity 116 is not apparent. This is because the total area of ​​the vent holes 11231 remains constant (for example, 4.54 mm²). 2 After increasing to the specified area, the influence of the air in the back cavity 116 on the vibration of the diaphragm 1121 gradually weakens in low-frequency vibrations. Therefore, even if the total area of ​​the ventilation holes 11231 is further increased, the effect on the frequency response curve of the back cavity 116 in the low-frequency region is not significant.

[0104] As shown in Figure 17, the total area of ​​the ventilation holes 11231 is 0 mm². 2 From 12.96mm 2 As the frequency increases, the resonance peak of the back cavity 116 gradually shifts to higher frequencies, and the frequency response curve in the low-frequency range (e.g., 100 Hz to 1000 Hz) gradually flattens. In some embodiments, to give the back cavity 116 a good low-frequency response, the total area of ​​the vents 11231 is 4.54 mm². 2 ~12.96mm2 It may be within the range. In some embodiments, in order to give the back cavity 116 a good low-frequency response, the total area of ​​the vents 11231 is 5 mm 2 ~11mm 2 It may be within the range. In some embodiments, in order to give the back cavity 116 a good low-frequency response, the total area of ​​the vents 11231 is 7 mm 2 ~10mm 2 It may be within the range. In some embodiments, in order to give the back cavity 116 a good low-frequency response, the total area of ​​the vents 11231 is 8 mm 2 ~10mm 2 It may be within the range.

[0105] In some embodiments, multiple ventilation holes 11231 may be formed in the support frame 1123 to improve structural strength, and reinforcing ribs may be formed at the connections between the multiple ventilation holes 11231. In some embodiments, the number of ventilation holes 11231 may be set to only one to simplify the process of forming the holes, provided that the total area of ​​the ventilation holes 11231 is filled.

[0106] In some embodiments, multiple vents may also be formed in the bottom 11253a or side wall 11253b of the housing member 11253 of the magnetic circuit assembly 1125. Sound from the back of the diaphragm 1121 may be transmitted to the back cavity 116 and depressurization holes through the multiple vents, which provide good passages for radiating sound to both sides of the diaphragm 1121.

[0107] In some embodiments, the projected area of ​​the vibrating membrane 1121 in the direction of vibration affects the amount of air pushed through when the vibrating membrane 1121 vibrates, which in turn affects the efficiency of the vibrating membrane 1121 in vibrating to generate sound, and thus affects the acoustic output effect of the sound generating unit 11. If the projected area of ​​the vibrating membrane 1121 in the direction of vibration is too small, the amount of air pushed through when the vibrating membrane 1121 vibrates decreases, resulting in a low acoustic output effect of the sound generating unit 11. If the projected area of ​​the vibrating membrane 1121 in the direction of vibration is too large, the dimensions of the support frame 1123 become too large, increasing the weight of the support frame 1123, which in turn increases the weight of the sound generating unit 11, affecting the structure and weight of the sound generating unit 11, and thus affecting the comfort and stability of wearing it. Considering the two types of mounting conditions, where at least a portion of the sound generating unit 11 shown in Figure 3 covers the antihelix region, and where all or part of the sound generating unit 11 shown in Figure 4 is inserted into the concha cavity, the volume audible to the ear 100 increases (corresponding to higher sound emission efficiency), so the dimensions of the diaphragm 1121 do not need to be excessively large. In some embodiments, the sound emission holes 111a are located on the side wall of the housing 111 of the sound generating unit 11 closest to the user's ear, the sound emission holes 111a are located on the front side of the diaphragm 1121 and communicate with the front cavity 114, the vibration direction of the diaphragm 1121 is the thickness direction X of the sound generating unit 11 or approximately equivalent thereto, the projected area of ​​the diaphragm 1121 in the vibration direction is the projected area of ​​the diaphragm 1121 in the sagittal plane or approximately equivalent thereto, and the projected area of ​​the diaphragm 1121 in the vibration direction affects the projected area of ​​the sound generating unit 11 in the sagittal plane for the user. The overlap ratio between the projected area of ​​the sound generating unit 11 on the user's sagittal plane and the projected area of ​​the concha cavity on the sagittal plane affects the similar cavity structure formed when the sound generating unit 11 is inserted into the concha cavity, thereby affecting the sound output effect of the sound generating unit 11. Furthermore, the major and minor axis dimensions of the diaphragm 1121 can affect the major and minor axis dimensions of the projection of the sound generating unit 11 on the sagittal plane.

[0108] In some embodiments, considering two situations comprehensively, such as at least a portion of the sound generating unit 11 shown in Figure 3 covering the antihelix region, and all or part of the sound generating unit 11 shown in Figure 4 being inserted into the concha, the projected area of ​​the vibrating membrane 1121 in the vibration direction is 90 mm², in order to ensure that the sound generating unit 11 has excellent acoustic output and that the projection of the sound generating unit 11 into the sagittal plane has an appropriate area or that the sound generating unit 11 has an appropriate thickness. 2 ~560mm 2 This may also be the case. Preferably, the projected area of ​​the vibrating membrane 1121 in the direction of vibration is 120 mm². 2 ~300mm 2 This may also be the case. More preferably, the projected area of ​​the vibrating membrane 1121 in the direction of vibration is 150 mm². 2 ~200mm 2 That's fine.

[0109] Considering comprehensively two types of situations, namely that at least a portion of the sound generating unit 11 shown in Figure 3 covers the antihelix region, and that all or part of the sound generating unit 11 shown in Figure 4 is inserted into the concha, in order to improve the acoustic output performance of the sound generating unit 11 by ensuring that the vibrating membrane 1121 has as large an area as possible within the limited dimensions of the sound generating unit 11, in some embodiments, when the vibration direction of the vibrating membrane 1121 is parallel to the thickness direction X of the sound generating unit 11, the ratio of the projected area of ​​the vibrating membrane 1121 in the vibration direction (i.e., the projected area of ​​the vibrating membrane 1121 in the sagittal plane) to the projected area of ​​the housing 111 in the vibration direction (i.e., the projected area of ​​the housing 111 in the sagittal plane) may be 0.5 or more. In some embodiments, in order to improve the acoustic output performance of the acoustic generation unit 11 by ensuring that the vibrating membrane 1121 has as large an area as possible within the limited dimensions of the acoustic generation unit 11, the ratio of the projected area of ​​the vibrating membrane 1121 in the direction of vibration to the projected area of ​​the vibrating membrane of the housing 111 in the direction of vibration may be 0.8 or more. In some embodiments, in order to improve the acoustic output performance of the acoustic generation unit 11 by ensuring that the vibrating membrane 1121 has as large an area as possible, the ratio of the projected area of ​​the vibrating membrane 1121 in the direction of vibration to the projected area of ​​the vibrating membrane of the housing 111 in the direction of vibration may be in the range of 0.8 to 0.95.

[0110] In some embodiments, in combination with a mounting method in which at least a portion of the sound generating unit 11 shown in Figure 3 covers the antihelix region, the long axis dimension of the vibrating membrane 1121 may be in the range of 13 mm to 25 mm, and the short axis dimension of the vibrating membrane may be in the range of 4 mm to 13 mm. In combination with a mounting method in which all or part of the sound generating unit 11 shown in Figure 4 is inserted into the concha, the short axis dimension of the vibrating membrane 1121 may be in the range of 4 mm to 13 mm in order to facilitate the insertion of all or part of the sound generating unit 11 into the concha to form an effective similar cavity. Based on the short axis dimension, the projected area of ​​the vibrating membrane 1121 (for example, the projected area of ​​the vibrating membrane 1121 in the direction of vibration is 52 mm²) 2 ~325mm 2Based on the above (within the range), it is further determined that the long axis dimension of the vibrating membrane 1121 is within the range of 13 mm to 25 mm. For example, the long axis dimension of the vibrating membrane 1121 may be within the range of 15 mm to 20 mm, and the short axis dimension of the vibrating membrane may be within the range of 5 mm to 10 mm. Alternatively, for example, the long axis dimension of the vibrating membrane 1121 may be within the range of 17 mm to 18 mm, and the short axis dimension of the vibrating membrane may be within the range of 7 mm to 8 mm.

[0111] Having explained the basic concepts above, it will be clear to those skilled in the art that the above detailed disclosures are merely illustrative and do not limit the present application. Although not explicitly stated herein, those skilled in the art can make various changes, improvements, and modifications to the present application. These changes, improvements, and modifications are intended to be suggested by the present application and remain within the spirit and scope of the exemplary embodiments of the present application.

[0112] Furthermore, certain terms are used in this Application to describe the embodiments thereof. For example, “one embodiment,” “one embodiment,” and / or “several embodiments” mean certain features, structures, or characteristics relating to at least one embodiment of this Application. Therefore, it should be emphasized and understood that two or more references to “one embodiment,” “one embodiment,” or “one alternative embodiment” in various parts of this Specification do not necessarily all refer to the same embodiment. Also, certain features, structures, or characteristics in one or more embodiments of this Application can be appropriately combined.

[0113] Furthermore, as will be understood by those skilled in the art, each aspect of this Application may be illustrated and described in several patentable classes or contexts, including any novel and useful combination of processes, machines, products or materials, or any novel and useful improvement thereto. Thus, each aspect of this Application may be executed entirely by hardware, entirely by software (including firmware, resident software, microcode, etc.), or by a combination of hardware and software. Any of the above hardware or software may be referred to as “data blocks,” “modules,” “engines,” “units,” “assemblies,” or “systems.” Also, each aspect of this Application may take the form of a computer program product embodied in one or more computer-readable media, including computer-readable program code.

[0114] A computer storage medium may include propagated data signals that are propagated over a baseband or as part of a carrier wave for carrying computer program code. These propagated signals may take various forms, such as electromagnetic signals, optical signals, or appropriate combinations thereof. The computer storage medium may be any computer-readable medium other than a computer-readable storage medium, which, when connected to an instruction execution system, device, or apparatus, can enable communication, propagation, or transmission of the program being used. Program code on the computer storage medium can be propagated via any appropriate medium, including wireless, cable, fiber optic cable, RF, or similar media, or any combination of the above media.

[0115] The computer program code required to operate each part of this application may be coded in one or more programming languages, including object-oriented programming languages ​​such as Java, Scala, Smalltalk, Eiffel, JADE, Emerald, C++, C#, VB.NET, and Python; traditional procedural programming languages ​​such as C, Visual Basic, Fortran 2003, Perl, COBOL 2002, PHP, and ABAP; dynamic programming languages ​​such as Python, Ruby, and Groovy; or other programming languages. The program code may run entirely on the user's computer, run as a standalone software package on the user's computer, run partially on the user's computer and partially on a remote computer, or run entirely on a remote computer or processing device. In the latter case, the remote computer may be connected to the user's computer via any network configuration such as a local area network (LAN) or wide area network (WAN), connected to an external computer (e.g., via the Internet), in a cloud computing environment, or used as a service such as Software as a Service (SaaS).

[0116] Furthermore, unless explicitly stated in the claims, the enumerated order, use of alphanumeric characters, or use of other names of the processing elements or sequences described herein is not limited to the order of the procedures and methods of this application. While various examples illustrate what are currently considered useful embodiments of the invention in the above disclosure, such details are for illustrative purposes only, and it should be understood that the attached claims are not limited to the disclosed embodiments, but rather are intended to cover all modifications and equivalent combinations that fall within the spirit and scope of the embodiments of this application. For example, the system assembly described above may be implemented by hardware devices, but may also be implemented by software-only solutions, such as installing the described system on an existing server or mobile device.

[0117] Similarly, in the foregoing description of embodiments of the present application, various features may be grouped into a single embodiment, drawing, or description thereof for the purpose of simplifying the description of the disclosure and aiding in the understanding of embodiments of one or more inventions. However, such a method of disclosure should not be interpreted as reflecting an intention that the subject matter of the present application requires more features than are enumerated in each claim. Rather, the claimed subject matter may be fewer than all the features of the single disclosed embodiment described above.

[0118] In some embodiments, numbers are used to describe the number of components and attributes, and it should be understood that in some examples, these numbers describing such embodiments are modified by the modifiers “about,” “approximately,” or “generally.” Unless otherwise specified, “about,” “approximately,” or “substantial” indicates that a variation of ±20% of the value described by the above numbers is acceptable. Accordingly, in some embodiments, the numerical parameters used in the specification and claims are all approximations that may vary depending on the characteristics required for a particular embodiment. In some embodiments, the numerical parameters should be rounded using standard rounding techniques, taking into account the specified number of significant figures. In some embodiments of this application, the numerical ranges and parameters for determining their ranges are approximations, but in specific embodiments, such numbers are set as precisely as possible.

[0119] All patents, patent applications, published patent gazettes, and other materials such as articles, books, specifications, publications, and documents referenced herein are incorporated in their entirety by reference, with the exception of any prosecution history documents that are inconsistent with or contradict the content of this Application, and any documents that may have a limited effect on the broadest scope of the claims of this Application (currently or later relating to this Application). In the event of any inconsistency or contradiction between the descriptions, definitions, and / or use of terms in the appendices to this Application and the content of this Application, the descriptions, definitions, and / or use of terms in this Application shall prevail.

[0120] Finally, it should be understood that the embodiments described herein are merely illustrative of the principles of the embodiments herein. Other modifications may also be within the scope of this application. Therefore, alternative configurations of the embodiments herein may be considered consistent with the teachings herein, not as an extension but as an example. Accordingly, the embodiments herein are not limited to those explicitly introduced and described herein. [Explanation of Symbols]

[0121] 11. Sound generation unit 112 transducers 11211 Body area 11212 Edge region 1122 Coil 1123 Support frame 1124 terminals 1125 Magnetic Circuit Assembly 11251 Magnetic permeable plate 11252 Magnet 11253 Containing member 1155 Fixing ring 111 Housing 111a Sound emission hole 111c First depressurization port 111d Second depressurization hole 114 Front Cavity 115 Connection Frames 1151 Acoustic Corridor 116 Back Cavity 12 Ear hooks

Claims

1. The diaphragm and, It includes a magnetic circuit assembly, a coil, and a support frame installed surrounding the magnetic circuit assembly, The coil is connected to the diaphragm and at least a portion of it is located in the magnetic gap formed by the magnetic circuit assembly, and the coil generates sound by vibrating the diaphragm when energized, and the diaphragm includes a main body region and an edge region surrounding the main body region. The first portion of the support frame is connected to the edge region, and the thickness of the first portion is in the range of 0.5 mm to 2 mm, and the thickness of the first portion is the minimum distance between the connection region between the support frame and the edge region and the region of the support frame that is directly bonded to the magnetic circuit assembly in the vibration direction of the vibrating membrane. The housing further includes a depressurization port, An acoustic generating unit characterized in that a connecting frame is arranged inside the housing, the space inside the housing includes a back cavity provided behind the diaphragm, the back cavity includes a first cavity portion surrounded by the diaphragm, the support frame and the magnetic circuit assembly and a second cavity portion surrounded by the connecting frame, the support frame and the magnetic circuit assembly, the first cavity portion and the second cavity portion are in communication with each other by a ventilation hole provided in the support frame, and the resonant frequency of the back cavity is 3.3 kHz or higher.

2. The sound generating unit according to claim 1, characterized in that the main body region includes a first inclined portion and a first connecting portion connected to the coil, the first inclined portion is bonded to a portion of the edge region, and the first inclined portion is inclined with respect to the first connecting portion in a direction away from the coil.

3. The sound generating unit according to claim 2, characterized in that the edge region includes an arc-shaped portion, and the ratio of the height of the arc-shaped portion to the span of the arc-shaped portion is in the range of 0.35 to 0.

4.

4. The sound generating unit according to claim 2, characterized in that the inclination angle of the first inclined portion with respect to the first connecting portion is within the range of 5° to 30°, and the first connecting portion is perpendicular to the vibration direction of the vibrating membrane.

5. The sound generating unit according to claim 2, characterized in that the main body region includes a dome located at one end away from the first inclined portion of the first connecting portion, the span of the dome is in the range of 2 mm to 8 mm, and the height of the dome is in the range of 0.7 mm to 1.2 mm.

6. The sound generating unit according to claim 5, characterized in that the ratio of the height to the span of the dome is within the range of 0.1 to 0.

3.

7. The sound generating unit according to claim 1, characterized in that the first portion of the support frame is connected to a second connection portion of the edge region, a plurality of ventilation holes are formed in the support frame, sound from the back of the diaphragm is transmitted to the decompression hole through the plurality of ventilation holes, the plurality of ventilation holes include at least a first ventilation hole and a second ventilation hole, the distance from the center of the first ventilation hole to the center of the decompression hole is greater than the distance from the center of the second ventilation hole to the center of the decompression hole, and the area of ​​the first ventilation hole is greater than the area of ​​the second ventilation hole.

8. The sound generating unit according to claim 1, characterized in that, in the vibration direction of the vibrating membrane, the ratio of the projected area of ​​the vibrating membrane to the projected area of ​​the housing is 0.5 or more.

9. The sound generating unit according to claim 8, characterized in that, in the vibration direction of the vibrating membrane, the ratio of the projected area of ​​the vibrating membrane to the projected area of ​​the housing is within the range of 0.8 to 0.

95.

10. The sound generating unit according to claim 1, characterized in that the first portion of the support frame is connected to a second connection portion of the edge region, the magnetic circuit assembly includes a housing member, and a plurality of ventilation holes are formed in the bottom wall of the housing member of the magnetic circuit assembly or in the side wall bonded to the support frame.

11. The sound generating unit according to claim 2, characterized in that the minimum distance from the coil to the first inclined portion is 0.3 mm or more.

12. The sound generating unit according to claim 1, characterized in that the magnetic circuit assembly includes a permeable plate and a magnet, the permeable plate is located between the magnet and the vibrating membrane and is attached to the surface of the magnet, and the distance between the center of the coil and the center of the permeable plate in the vibration direction of the vibrating membrane is less than 0.3 mm.

13. The sound generating unit according to claim 1, characterized in that the magnetic circuit assembly includes a housing member, and in the vibration direction of the diaphragm, the distance between the bottom of the coil and the bottom wall of the housing member is in the range of 0.2 mm to 4 mm.

14. The sound generating unit according to claim 13, characterized in that the distance between the coil and the side wall of the housing member is within the range of 0.1 mm to 0.5 mm.

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