Pretreatment apparatus and pretreatment method

Abstract

To provide a cooling module, a pre-treatment device and a pre-treatment method which can properly perform a pre-treatment of a sample.SOLUTION: A cooling module 100 includes a base part 10, a cooling surface part 20 and a hinge part 30. The cooling surface part 20 cools a processing target placed on an upper surface in a state of being in the first posture. The hinge part 30 is attached to the base part 10. The hinge part 30 rotatably supports the cooling surface part 20 between the first posture and the second posture. In the second posture, the cooling surface part 20 is greatly inclined relative to a horizontal surface in comparison to the first posture.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention 、 relates to a pretreatment device and a pretreatment method.

Background Art

[0002] In the analysis of a sample using an analyzer such as a chromatograph, the sample may be pretreated by a pretreatment device. For example, in the sample pretreatment device described in Patent Document 1, a vial rack that holds a plurality of vials containing the sample is placed on a temperature control plate. Thereby, the sample contained in each vial is cooled. Thereafter, the sample is sequentially conveyed to a plurality of processing units by a conveyance device mechanism. Thereby, predetermined pretreatment is sequentially performed on the sample. The pretreated sample is conveyed to an autosampler of an analyzer by a conveyance device mechanism.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In the sample pretreatment device of Patent Document 1, dew condensation occurs on the temperature control plate, so that water droplets adhere to the vial rack placed on the temperature control plate. Therefore, when the vial rack is carried out from the temperature control plate and water droplets fall from the vial rack onto a microplate or the like placed on another processing unit, pretreatment failure due to contamination occurs. Further, when water droplets due to dew condensation accumulate on the temperature control plate, temperature unevenness occurs on the temperature control plate. In this case, the samples in a plurality of vials cannot be cooled uniformly.

[0005] An object of the present invention is to be able to appropriately perform pretreatment of a sample BeforeThe objective is to provide an processing apparatus and a pretreatment method. [Means for solving the problem]

[0006] One aspect of the present invention is, A preprocessing device for performing preprocessing on a target to be processed, comprising a cooling module and a transport unit including an arm that transports the target to be processed by the arm, wherein the cooling module is The base portion and, in the first position, the upper surface is The aforementioned The device comprises a cooling surface for cooling the object to be processed, and a hinge attached to the base portion, which supports the cooling surface so as to be rotatable between a first position and a second position that is more inclined with respect to the horizontal plane than the first position. The arm of the transport unit rotates the cooling surface of the cooling module between the first and second positions. ru, Pre-treatment device Regarding.

[0009] This invention of In another embodiment, the cooling surface portion, supported by a hinge attached to the base of a cooling module that cools the object to be processed, is in a first position. The arms of the transport unit Rotating the aforementioned hinge, By the arm of the transport unit The object to be processed is placed on the upper surface of the cooling surface portion. Transport To place, By the arm of the transport unit From the cooling surface portion, the object to be processed Transport To remove the unit and to ensure that the cooling surface supported by the hinge is in a second position in which it is more inclined with respect to the horizontal plane than in the first position. By the arm of the transport unit The present invention relates to a pre-processing method that includes rotating the hinge portion. [Effects of the Invention]

[0010] According to the present invention, sample pretreatment can be performed appropriately. [Brief explanation of the drawing]

[0011] [Figure 1] This is a diagram showing a schematic configuration of a preprocessing apparatus according to one embodiment of the present invention. [Figure 2] Figure 1 is an external perspective view showing the cooling module. [Figure 3] Figure 2 is a plan view showing the cooling module. [Figure 4]This is a diagram illustrating the operation of the cooling module. [Figure 5] This is a diagram illustrating the operation of the cooling module. [Figure 6] This diagram shows the configuration of the control device shown in Figure 1. [Figure 7] This flowchart shows an example of the control operation of a control device. [Modes for carrying out the invention]

[0012] (1) Configuration of the pretreatment device The cooling module, preprocessing apparatus, and preprocessing method according to embodiments of the present invention will be described below with reference to the drawings. Figure 1 is a block diagram showing the schematic configuration of a preprocessing apparatus according to one embodiment of the present invention. As shown in Figure 1, the preprocessing apparatus 200 comprises a cooling module 100, a plurality of processing modules 110, a transport unit 120, a pump 130, and a control device 140.

[0013] A plate containing reagents to be added to the sample is placed on the cooling module 100. The cooling module 100 cools the placed plate, thereby cooling the reagents contained in the plate to a predetermined temperature. Multiple processing modules 110 perform different pretreatments on the sample to be processed. Pretreatments include dispensing, reagent addition, stirring, and filtration. The transport unit 120 transports the plate containing the reagents or sample between the cooling module 100 and the multiple processing modules 110. This allows the sample to undergo predetermined pretreatments sequentially.

[0014] Pump 130 is, for example, a tube pump and is used to remove water droplets generated by condensation in the cooling module 100. The detailed configuration of the cooling module 100 will be described later. The control device 140 includes, for example, a CPU (central processing unit) and memory, or a microcomputer, and controls the operation of the cooling module 100, each processing module 110, the transport unit 120, and the pump 130.

[0015] (2) Configuration of the cooling module FIG. 2 is an external perspective view showing the cooling module 100 of FIG. 1. As shown in FIG. 2, the cooling module 100 includes a base portion 10, a cooling surface portion 20, a hinge portion 30, a cooling portion 40, and a fan 50. In this example, the base portion 10 is a substantially rectangular parallelepiped-shaped casing with a space formed inside and has an opening at the upper part.

[0016] The cooling surface portion 20 is a substantially rectangular flat plate member. A recess 21 is formed at the central portion of the upper surface of the cooling surface portion 20. Thereby, the edge portion of the upper surface of the cooling surface portion 20 protrudes upward more than the central portion. A plate in which a processing target such as a sample or a reagent is accommodated is placed on the edge portion of the upper surface of the cooling surface portion 20. The cooling surface portion 20 cools the plate placed on the edge portion of the upper surface.

[0017] The hinge portion 30 has a rotation axis 31. The hinge portion 30 is provided on the upper edge portion of the base portion 10 in a state where the rotation axis 31 extends along one side of the upper edge portion surrounding the opening at the upper part of the base portion 10. The hinge portion 30 supports the cooling surface portion 20 so as to be rotatable between a first posture and a second posture about the rotation axis 31. In the second posture, the cooling surface portion 20 is inclined more greatly with respect to the horizontal plane than in the first posture. In this example, the first posture is a substantially horizontal posture.

[0018] The cooling portion 40 and the fan 50 are accommodated in the space inside the base portion 10. In this example, the cooling portion 40 is a Peltier element and has a heat absorption surface and a heat dissipation surface facing opposite directions. The cooling portion 40 is attached to the cooling surface portion 20 by screws or the like in a state where the heat absorption surface is in contact with the lower surface of the cooling surface portion 20. When the cooling portion 40 operates, the cooling surface portion 20 is cooled. The fan 50 is held by a holding member on the cooling surface portion 20 so as to be close to the heat dissipation surface of the cooling portion 40. When the fan 50 operates, the heat generated from the heat dissipation surface of the cooling portion 40 is dissipated.

[0019] Figure 3 is a plan view showing the cooling module 100 of Figure 2. As shown in Figure 3, a hole 22 is formed in the recess 21 of the cooling surface 20, penetrating in the vertical direction. One end of a tube 131 (see Figure 4, described later) is connected to the lower surface of the cooling surface 20 so as to be connected to the hole 22. The other end of the tube 131 is connected to the pump 130 of Figure 1. The hole 22 is located in the part of the recess 21 closest to the hinge 30 in a direction perpendicular to the pivot axis 31 of the hinge 30. This position is the lowest point in the recess 21 when the cooling surface 20 is in the second position.

[0020] In this example, the cooling surface portion 20 has a rectangular shape in plan view. The recess 21 has a trapezoidal shape in plan view, divided by four outer edges 21a to 21d. The outer edges 21a and 21b face each other and extend parallel to the long side of the cooling surface portion 20. Outer edge 21b is longer than outer edge 21a. Outer edge 21c extends parallel to the short side of the cooling surface portion 20 and connects one end of outer edge 21a to one end of outer edge 21b. Outer edge 21d connects the other end of outer edge 21a to the other end of outer edge 21b. Outer edge 21d is located closer to the hinge portion 30 than outer edge 21c.

[0021] In this configuration, the area near the corner formed by the outer edges 21b and 21d of the recess 21 is the part of the recess 21 closest to the hinge 30 in a direction perpendicular to the pivot axis 31 of the hinge 30. Therefore, in this example, the hole 22 is formed near the corner formed by the outer edges 21b and 21d of the trapezoidal recess 21.

[0022] (3) Operation of the cooling module Figures 4 and 5 illustrate the operation of the cooling module 100. As shown in Figure 4, the transport unit 120 has a pair of arms 121. When the cooling surface unit 20 is in a first position, the transport unit 120 uses the pair of arms 121 to grip the side of the plate 210 containing the object to be processed and transports the plate 210 into the cooling module 100, placing the plate 210 on the cooling surface unit 20. In this state, the cooling module 100 operates, cooling the plate 210 and the object to be processed.

[0023] Here, condensation may cause water droplets to adhere to the recesses 21 of the cooling surface 20. Even in this case, the recesses 21 do not come into contact with the plate 210, so very few water droplets adhere to the bottom surface of the plate 210. After cooling is complete, the transport unit 120 grips the side of the plate 210 with the arm 121 and removes the plate 210 from the cooling module 100, and transports the plate 210 to another processing module 110 (Figure 1).

[0024] As shown in Figure 5, after the transport unit 120 unloads the plate 210 from the cooling module 100, it grips the side of the cooling surface unit 20 with the arm 121 and pulls it upward. In this case, the cooling surface unit 20 rotates around the pivot axis 31 of the hinge unit 30, resulting in a second orientation inclined with respect to the horizontal plane. In this example, the hinge unit 30 is a torque hinge with a free-stop function. Therefore, the orientation of the cooling surface unit 20 is maintained even after the transport unit 120 releases its grip on the cooling surface unit 20.

[0025] When the cooling surface 20 is in the second position, the holes 22 are located in the lowest part of the recess 21. Therefore, water droplets adhering to the recess 21 are guided by gravity along the bottom surface, outer edge 21a, outer edge 21b, and outer edge 21c of the recess 21 to the holes 22 and collected in the holes 22. The angle of the cooling surface 20 with respect to the horizontal plane when in the second position is, for example, 10 degrees or more and 90 degrees or less, but this angle is not particularly limited as long as water droplets adhering to the recess 21 can be collected in the holes 22.

[0026] The water droplets collected in the holes 22 are sucked up by the pump 130 through the tube 131 and then discarded. This allows the water droplets adhering to the recess 21 to be removed through the holes 22. After the water droplets are removed from the recess 21, the transport unit 120 grips the side of the cooling surface unit 20 with the arm 121 and pulls it downward. In this case, the cooling surface unit 20 rotates around the pivot axis 31 of the hinge unit 30, taking on a first position where it is placed approximately horizontally on top of the base unit 10.

[0027] (4) Control Unit Figure 6 shows the configuration of the control device 140 in Figure 1. As shown in Figure 6, the control device 140 includes a transport control unit 141, a rotation control unit 142, a processing control unit 143, and a pump control unit 144 as functional units. The functional units of the control device 140 are realized when the CPU of the control device 140 executes a control program for the preprocessing device 200 stored in memory. Some or all of the functional units of the control device 140 may be realized by hardware such as electronic circuits.

[0028] The transport control unit 141 controls the operation of the transport unit 120 to transport plates containing reagents or samples between the cooling module 100 and the multiple processing modules 110. The rotation control unit 142 controls the operation of the transport unit 120 so that the cooling surface portion 20 (Figure 2) of the cooling module 100 rotates between a first position and a second position.

[0029] The processing control unit 143 controls the operation of each part of the cooling module 100, such as the cooling unit 40 or the fan 50, so that the reagent is cooled. The processing control unit 143 also controls the operation of each processing module 110 so that the sample is pre-treated. The pump control unit 144 controls the operation of the pump 130 so that water droplets collected in the holes 22 (Figure 3) of the cooling surface 20 of the cooling module 100 are sucked through the tube 131.

[0030] Figure 7 is a flowchart illustrating an example of the control operation of the control device 140. The control operation of the control device 140 related to the cooling module 100 will be explained below using the cooling module 100 in Figure 2, the control device 140 in Figure 6, and the flowchart in Figure 7. Initially, the cooling surface 20 is assumed to be in the first position.

[0031] First, the transport control unit 141 transports the plate 210 into the cooling module 100 by controlling the transport unit 120 (step S1). The transported plate 210 is placed on the edge of the upper surface of the cooling surface 20 of the cooling module 100. Next, the processing control unit 143 cools the plate 210 that was transported in step S1 by controlling the operation of the cooling module 100 (step S2). In this state, the cooling of the plate 210 is completed after a predetermined time has elapsed.

[0032] Next, the transport control unit 141 controls the transport unit 120 to remove the plate 210 from the cooling module 100 (step S3). The removed plate 210 is then transported to another processing module 110. Subsequently, the rotation control unit 142 controls the transport unit 120 to rotate the cooling surface 20 to a second position (step S4). In this case, water droplets adhering to the recesses 21 of the cooling surface 20 due to condensation are collected in the holes 22.

[0033] The pump control unit 144 controls the pump 130 to suck the water droplets collected in the holes 22 through the tube 131 (step S5). The sucked water droplets are discharged to the outside. Finally, the rotation control unit 142 controls the transport unit 120 to rotate the cooling surface unit 20 to the first position (step S6), and the process returns to step S1.

[0034] In the control operation of the control device 140 described above, the cooling unit 40 and fan 50 of the cooling module 100 are turned on during the period of step S2, but the embodiment is not limited thereto. The cooling unit 40 or fan 50 may be turned on before step S2, turned off after step S2, or kept on at all times. Similarly, the pump 130 is turned on during the period of step S5, but the embodiment is not limited thereto. The fan 50 may be turned on before step S5, turned off after step S5, or kept on at all times.

[0035] (5) Effects In the cooling module 100 according to this embodiment, the plate 210 can be cooled by placing the plate 210 on the upper surface of the cooling surface 20 in a first position. Water droplets may adhere to the cooling surface 20 due to condensation. Even in this case, the water droplets adhering to the cooling surface 20 can be removed by changing the cooling surface 20 to a second position. Therefore, the accumulation of water droplets on the cooling surface 20 is prevented.

[0036] With this configuration, water droplets generated by condensation do not adhere to the plate 210. Therefore, even when the plate 210 is removed from the cooling module 100, water droplets do not fall from the object being processed, and other objects being processed are not contaminated. In addition, temperature unevenness on the cooling surface 20 caused by the adhesion of water droplets does not occur, making it possible to cool the plate 210 appropriately. As a result, sample pretreatment can be performed appropriately in the processing module 110. Furthermore, failure of the cooling module 100 or the pretreatment device 200 caused by the adhesion of water droplets can be prevented.

[0037] In the first orientation, the cooling surface 20 is approximately horizontal, allowing the object to be processed to be stably placed on the upper surface of the cooling surface 20. Therefore, the object to be processed can be properly cooled.

[0038] In a direction perpendicular to the pivot axis 31 of the hinge portion 30, a hole 22 is formed in the portion of the recess 21 closest to the hinge portion 30, penetrating the cooling surface portion 20. In this case, when the cooling surface portion 20 is in the second position, the hole 22 is located in the lowest part of the recess 21. Therefore, by positioning the cooling surface portion 20 in the second position, water droplets adhering to the cooling surface portion 20 can be removed more reliably through the hole 22. Furthermore, since the liquid collected in the hole 22 is sucked up by the pump 130, the water droplets can be removed efficiently.

[0039] The rotation of the cooling surface 20 is performed by the arm 121 of the transport unit 120 that transports the plate 210. Therefore, there is no need to provide a separate configuration for rotating the cooling surface 20 of the cooling module 100. This reduces the cost of the pre-processing device 200.

[0040] (6) Other embodiments (a) In the above embodiment, the cooling module 100 is provided as part of the pretreatment device 200, but the embodiment is not limited thereto. The cooling module 100 may be provided separately from the pretreatment device 200.

[0041] (b) In the above embodiment, the cooling surface 20 is substantially horizontal in the first position, but the embodiment is not limited thereto. The cooling surface 20 may be slightly inclined with respect to the horizontal plane in the first position, as long as the plate 210 can be stably placed on the upper surface of the cooling surface 20.

[0042] (c) In the above embodiment, the hinge portion 30 is a torque hinge having a free-stop function, but the embodiment is not limited thereto. If the posture of the cooling surface portion 20 is maintained by the arm 121 of the transport portion 120, the hinge portion 30 does not need to have a free-stop function.

[0043] (d) In the above embodiment, the hole 22 is formed in the lowest part of the recess 21 when the cooling surface 20 is in the second position, but the embodiment is not limited thereto. The hole 22 may be formed in other locations on the cooling surface 20, or the recess 21 and hole 22 may not be formed, as long as water droplets adhering to the cooling surface 20 can be removed. Alternatively, the pretreatment device 200 may not be provided with a pump 130.

[0044] (e) In the above embodiment, the rotation of the cooling surface 20 is performed by the arm 121 of the transport unit 120 that transports the plate 210, but the embodiment is not limited thereto. The rotation of the cooling surface 20 may be performed by an arm provided separately from the arm 121 of the transport unit 120 that transports the plate 210. Alternatively, the rotation of the cooling surface 20 may be performed by an actuator provided in the cooling module 100 or the preprocessing device 200, or it may be performed manually.

[0045] (7) Appearance Those skilled in the art will understand that the above-described exemplary embodiments are specific examples of the following embodiments.

[0046] (Article 1) A cooling module relating to one embodiment is: Base and In the first position, a cooling surface portion for cooling the object to be processed placed on the upper surface, The base portion may include a hinge portion that is attached to the base portion and supports the cooling surface portion so as to be rotatable between the first position and a second position which is more inclined with respect to the horizontal plane than the first position.

[0047] In this cooling module, the object to be processed can be cooled by placing it on the upper surface of the cooling surface in a first orientation. Water droplets may adhere to the cooling surface due to condensation. Even in this case, the water droplets adhering to the cooling surface can be removed by changing the cooling surface to a second orientation. Therefore, the accumulation of water droplets on the cooling surface is prevented.

[0048] With this configuration, water droplets generated by condensation do not adhere to the object being processed. Therefore, even when the object being processed is removed from the cooling module, no water droplets fall from the object, preventing contamination of other objects being processed. In addition, temperature unevenness on the cooling surface caused by water droplet adhesion does not occur, making it possible to cool the object being processed appropriately. As a result, sample pretreatment can be performed properly.

[0049] (Article 2) In the cooling module described in Article 1, The first posture may be a horizontal posture.

[0050] In this case, by positioning the cooling surface in the first orientation, the object to be processed can be stably placed on the upper surface of the cooling surface. This allows the object to be cooled more effectively.

[0051] (3) In the cooling module described in paragraph 1 or 2, The aforementioned hinge may be a torque hinge.

[0052] In this case, the cooling surface can be easily maintained in any desired position.

[0053] (Article 4) In the cooling module described in any one of paragraphs 1 to 3, The cooling surface portion has a recess on its upper surface, A hole may be formed within the recess that penetrates the cooling surface.

[0054] In this case, water droplets adhering to the cooling surface can be easily removed through the holes.

[0055] (Article 5) In the cooling module described in Article 4, The hole may be located in the portion of the recess closest to the hinge in a direction perpendicular to the pivot axis of the hinge.

[0056] In this case, when the cooling surface is in the second position, the holes are located at the lowest point within the recess. Therefore, water droplets adhering to the cooling surface can be removed more effectively through the holes.

[0057] (Section 6) The pretreatment device is: A preprocessing device that performs preprocessing on a target to be processed, A cooling module as described in any one of paragraphs 1 to 5, The cooling module may also include an arm that rotates the cooling surface portion between the first and second positions.

[0058] In this sample pretreatment device, an arm rotates the cooling surface of the cooling module to a first position, thereby cooling the sample to be processed placed on the upper surface of the cooling surface. Furthermore, by rotating the cooling surface to a second position, the arm removes any water droplets adhering to the cooling surface. This allows for proper cooling of the sample to be processed. As a result, the sample pretreatment can be performed appropriately.

[0059] (Section 7) The pretreatment device is: A preprocessing device that performs preprocessing on a target to be processed, The cooling module described in paragraph 4 or 5, The cooling module may also include a pump for sucking up the liquid collected in the holes of the cooling surface.

[0060] In this sample pretreatment device, water droplets adhering to the cooling surface can be efficiently removed by a pump through holes. This allows for proper cooling of the sample to be treated. As a result, sample pretreatment can be performed appropriately.

[0061] (Clause 8) The pretreatment device described in paragraph 7 is: The cooling module may further include an arm for rotating the cooling surface portion between the first and second positions.

[0062] In this case, the arm rotates the cooling surface of the cooling module to a first position, thereby cooling the object to be processed placed on the upper surface of the cooling surface. Furthermore, the arm rotates the cooling surface to a second position, removing any water droplets adhering to the cooling surface. This allows for proper cooling of the object to be processed. As a result, the sample pretreatment can be performed appropriately.

[0063] (Paragraph 9) The pretreatment apparatus described in paragraph 6 or 8 is: The system may further include a conveying unit that includes the aforementioned arm and uses the arm to transport the object to be processed.

[0064] In this case, the arm of the transport unit that transports the object to be processed can rotate the cooling surface of the cooling module. Therefore, there is no need to provide a separate configuration for rotating the cooling surface of the cooling module. This reduces the cost of the pre-processing device.

[0065] (Section 10) The pretreatment method is: The cooling module, which cools the object to be processed, is rotated so that the cooling surface supported by the base is in a first position, The object to be processed is placed on the upper surface of the cooling surface, To remove the object to be processed from the cooling surface, The method may also include rotating the base portion so that the cooling surface portion supported by the base portion is in a second position in which it is more inclined with respect to the horizontal plane than the first position.

[0066] In this pretreatment method, the object to be treated placed on the upper surface of the cooling surface can be cooled by rotating the cooling surface of the cooling module to a first position. Furthermore, by rotating the cooling surface to a second position, any water droplets adhering to the cooling surface are removed. This makes it possible to properly cool the object to be treated. As a result, the sample can be properly pretreated. [Explanation of symbols]

[0067] 10…Base section, 20…Cooling surface section, 21…Recess, 21a~21d…Outer edge, 22…Hole, 30…Hinge section, 31…Rotating shaft, 40…Cooling section, 50…Fan, 100…Cooling module, 110…Processing module, 120…Conveying section, 121…Arm, 130…Pump, 131…Tube, 140…Control device, 141…Conveying control section, 142…Rotation control section, 143…Processing control section, 144…Pump control section, 200…Preprocessing device, 210…Plate

Claims

1. A preprocessing device that performs preprocessing on a target to be processed, Cooling module and It includes an arm and a transport unit that transports the object to be processed by the arm, The cooling module is Base and In the first position, a cooling surface portion for cooling the object to be processed placed on the upper surface, The base portion is attached to a hinge portion that supports the cooling surface portion so as to be rotatable between a first position and a second position which is more inclined with respect to the horizontal plane than the first position, The arm of the transport unit rotates the cooling surface of the cooling module between the first and second positions, as a pre-processing device.

2. The preprocessing apparatus according to claim 1, wherein the first posture is a horizontal posture.

3. The preprocessing apparatus according to claim 1 or 2, wherein the hinge portion is a torque hinge.

4. The cooling surface portion has a recess on its upper surface, A pre-processing apparatus according to any one of claims 1 to 3, wherein a hole is formed in the recess that penetrates the cooling surface.

5. The preprocessing apparatus according to claim 4, wherein the hole is located in the portion of the recess closest to the hinge in a direction perpendicular to the rotation axis of the hinge.

6. The pretreatment apparatus according to claim 4 or 5, further comprising a pump for sucking up the liquid collected in the holes of the cooling surface portion of the cooling module.

7. The arm of the transport unit rotates the hinge portion so that the cooling surface portion, which is supported by a hinge portion attached to the base portion of the cooling module that cools the object to be processed, is in a first position. The arm of the transport unit transports and places the object to be processed onto the upper surface of the cooling surface, The arm of the transport unit transports and removes the object to be processed from the cooling surface, A pre-processing method comprising rotating the hinge portion by the arm of the transport portion such that the cooling surface portion supported by the hinge portion is in a second position in which it is more inclined with respect to the horizontal plane than the first position.

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