Polyethylene naphthalate resin composition and molded article thereof

A resin composition of polyethylene naphthalate and polyetherimide with specific colorants addresses the issues of scratch resistance and heat resistance, providing wavelength-selective absorption for infrared sensor covers in automotive and industrial applications.

JP7853173B2Active Publication Date: 2026-04-28TEIJIN LTD
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
TEIJIN LTD
Filing Date
2022-08-10
Publication Date
2026-04-28

AI Technical Summary

Technical Problem

Existing transparent resins used in infrared sensing systems, such as polyethylene naphthalate and polycarbonate, lack sufficient scratch resistance and heat resistance, and do not effectively control wavelength-selective absorption, making them unsuitable for automotive interior applications and infrared sensor covers.

Method used

A resin composition comprising polyethylene naphthalate and polyetherimide resins with specific ratios and the addition of colorants providing absorption characteristics, resulting in a resin with enhanced scratch resistance and heat resistance, and wavelength-selective absorption properties.

Benefits of technology

The resin composition achieves excellent scratch resistance and heat resistance, enabling it to be used as a cover material for infrared sensors in automotive and industrial applications with controlled light transmission properties.

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Abstract

To provide a polyethylenenaphthalate resin composition that excels in excoriation resistance and in heat resistance, and materializes a molded article thereof having wavelength selective absorption characteristic.SOLUTION: A resin composition is provided, containing: 45-90 pts.wt. of (A) polyethylenenaphthalate resin (component A); 55-10 pts.wt. of (B) polyether imide resin (component B); and 0.055-1.3 pts.wt. of (C) coloring agent (component C) with respect to 100 pts.wt. of the total of the component A and the component B, wherein the average value of light transmittance at 400-700 nm in the thickness direction of a molded article formed in thickness of 1 mm is 1.5% or less, and the average value of light transmittance at 1050-1100 nm in the thickness direction of the molded article formed in thickness of 1 mm is 80% or more, and wherein the resin composition does not include polycarbonate resin.SELECTED DRAWING: None
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Description

Technical Field

[0001] The present invention relates to a polyethylene naphthalate resin composition having excellent scratch resistance and heat resistance, and a molded product made therefrom having wavelength-selective absorption characteristics.

Background Art

[0002] In recent years, autonomous driving technology has been developing rapidly. In autonomous driving technology, an infrared sensing system plays an important role. Examples of infrared sensing systems include a driver monitoring system for monitoring a driver and LiDAR for detecting other vehicles and buildings, and near-infrared light in the vicinity of 800 to 1100 nm is generally used for sensing. However, when performing infrared sensing, light in the visible to near-infrared range becomes noise, so a cover material that transmits the wavelength range used for sensing and cuts off transmission in the wavelength range below that is required. As the cover material, glass or resin is used, and among resins, acrylic resin and polycarbonate resin, which are transparent materials, are generally used. On the other hand, these transparent resins have low scratch resistance, and when placed on the exterior as a cover material, the surface is damaged during use, resulting in problems such as impaired appearance and infrared transmission ability.

[0003] Studies on wavelength-selective controlled resins have been conducted in the past. These technologies involve using multiple colorants with different absorption wavelength bands to cut out the visible light region and some near-infrared regions (see Patent Documents 1 and 2). However, these resin compositions mainly consist of polycarbonate resin, and their scratch resistance is insufficient for use as cover materials. Another example of a transparent resin is polyethylene naphthalate resin. Polyethylene naphthalate resin has a slower crystallization rate in a static environment compared to polyethylene terephthalate resin, so transparent molded products can be easily obtained by injection molding, and it is used for transparent injection molded product applications. However, polyethylene naphthalate resin has inferior heat resistance compared to polycarbonate resin, making it difficult to apply to automotive interior applications exposed to high-temperature environments. In addition, transparency may decrease depending on the molding conditions and the shape of the molded product, and ensuring stable transparency has also been a challenge. As a means of improving heat resistance, a method of adding polyetherimide resin, which is compatible with polyester resin, has been disclosed (see Patent Documents 3 and 4). However, no studies had been conducted on the wavelength-selective control and scratch resistance of these resin compositions. [Prior art documents] [Patent Documents]

[0004] [Patent Document 1] Japanese Patent Publication No. 2008-9222 [Patent Document 2] Patent No. 6658942 [Patent Document 3] Japanese Patent Publication No. 2018-76430 [Patent Document 4] Japanese Patent Application Publication No. 7-228761 [Overview of the Initiative] [Problems that the invention aims to solve]

[0005] The object of the present invention is to provide a polyethylene naphthalate resin composition that has excellent scratch resistance and heat resistance, and in which molded articles made therefrom have wavelength-selective absorption properties. [Means for solving the problem]

[0006] As a result of diligent research to achieve the above objective, the inventors have found that by adding a specific amount of colorant to a resin component containing polyethylene naphthalate resin and polyetherimide resin in a specific ratio, it is possible to provide a polyethylene naphthalate resin composition that is excellent in scratch resistance and heat resistance, and in which molded articles thereof have wavelength-selective absorption characteristics, thereby solving the above problem. In other words, the inventors have found that the above problem can be achieved by the following polyethylene naphthalate resin composition and molded articles thereof.

[0007] 1. A resin composition comprising 100 parts by weight in total (A) polyethylene naphthalate resin (component A) 45 to 90 parts by weight and (B) polyetherimide resin (component B) 55 to 10 parts by weight, wherein (C) colorant (component C) is contained in an amount of 0.055 to 1.3 parts by weight, characterized in that the average light transmittance in the thickness direction of a molded product molded to a thickness of 1 mm at 400 to 700 nm is 1.5% or less, the average light transmittance in the thickness direction of a molded product molded to a thickness of 1 mm at 1050 to 1100 nm is 80% or more, and the composition does not contain polycarbonate resin, excluding applications for laser welding. 2. The resin composition according to item 1 above, which contains 5 to 50 parts by weight of (D) polyethylene terephthalate resin (component D) per 100 parts by weight of the total of components A and B. 3. The resin composition according to item 1 or 2 above, wherein component C is a colorant comprising (C1) a colorant having an absorption maximum at less than 650 nm (component C1) and (C2) a colorant having an absorption maximum at 650 to 880 nm (component C2). 4. The resin composition according to item 3 above, characterized in that the C2 component is at least one colorant selected from the group consisting of anthraquinone-based colorants, phthalocyanine-based colorants, perylene-based colorants, and heterocyclic colorants. 5. The resin composition according to item 3 above, characterized in that the C2 component is at least one colorant selected from the group consisting of anthraquinone-based colorants, perylene-based colorants, and heterocyclic colorants. 6. A molded article formed by molding the resin composition according to any one of the preceding items 1 to 5. 7. The molded article according to the preceding item 6, which is a cover material for covering an infrared sensor. 8. The molded article according to the preceding item 7, which is a cover material for covering an infrared sensor used in a driver monitoring system for monitoring a driver and a LiDAR for detecting other vehicles and buildings.

Advantages of the Invention

[0008] The resin composition of the present invention is excellent in scratch resistance and heat resistance, and since the molded article made therefrom is a polyethylene naphthalate resin composition having wavelength-selective absorption characteristics, the molded article made therefrom is a cover material for covering an infrared sensor mounted on an automobile, industrial machine, household electric appliance, camera, etc. Among them, it is useful as a cover material for covering an infrared sensor used in a driver monitoring system for monitoring a driver and a LiDAR for detecting other vehicles and buildings, and can contribute to a future safe autonomous driving system.

Embodiments for Carrying Out the Invention

[0009] Hereinafter, the details of the present invention will be further described.

[0010] <Regarding Component A> The polyethylene naphthalate resin, which is Component A of the present invention, can be produced using a dicarboxylic acid component mainly composed of naphthalenedicarboxylic acid and / or an ester-forming derivative of naphthalenedicarboxylic acid, and a glycol component mainly composed of ethylene glycol. By using a polyethylene naphthalate resin as Component A, high scratch resistance can be imparted.

[0011] The naphthalenedicarboxylic acid components are mainly 2,6-naphthalenedicarboxylic acid and 2,7-naphthalenedicarboxylic acid, but other dicarboxylic acids can be used in combination as long as the properties are not impaired. Examples of other carboxylic acids include aromatic dicarboxylic acids such as terephthalic acid, isophthalic acid, 4,4′-diphenyldicarboxylic acid, diphenoxyethane-4,4′-dicarboxylic acid, diphenylsulfone-4,4′-dicarboxylic acid, and diphenyl ether-4,4′-dicarboxylic acid; aliphatic dicarboxylic acids such as adipic acid, sebacic acid, succinic acid, and oxalic acid; and alicyclic dicarboxylic acids such as cyclohexanedicarboxylic acid. One or more of these may be used, and can be arbitrarily selected depending on the purpose. The amount of other carboxylic acids used is preferably 30 mol% or less, more preferably 20 mol% or less, particularly preferably 10 mol% or less, and most preferably 5 mol% or less, relative to the total acid component. The main esterifying derivatives of naphthalenedicarboxylic acid are dimethyl 2,6-naphthalenedicarboxylic acid and dimethyl 2,7-naphthalenedicarboxylic acid, but other esterifying derivatives of dicarboxylic acids can be used in combination as long as the properties are not impaired. Examples of other esterifying derivatives of dicarboxylic acids include lower dialkyl esters of aromatic dicarboxylic acids such as terephthalic acid, isophthalic acid, 4,4′-diphenyldicarboxylic acid, diphenoxyethane-4,4′-dicarboxylic acid, diphenylsulfone-4,4′-dicarboxylic acid, and diphenyl ether-4,4′-dicarboxylic acid; lower dialkyl esters of alicyclic dicarboxylic acids such as cyclohexanedicarboxylic acid; and lower dialkyl esters of aliphatic dicarboxylic acids such as adipic acid, sebacic acid, succinic acid, and oxalic acid. One or more of these may be used, and can be arbitrarily selected depending on the purpose. The amount of other esterifying derivatives of dicarboxylic acids used is preferably 30 mol% or less, more preferably 20 mol% or less, particularly preferably 10 mol% or less, and most preferably 5 mol% or less, relative to the total esterifying derivative component of dicarboxylic acids.

[0012] Furthermore, small amounts of trifunctional or higher carboxylic acid components such as trimellitic acid may be used, as may small amounts of acid anhydrides such as trimellitic anhydride. In addition, small amounts of hydroxycarboxylic acids such as lactic acid and glycolic acid, or their alkyl esters, may be used, and these can be arbitrarily selected depending on the purpose.

[0013] The glycol component is primarily ethylene glycol, but other glycol components can be used in combination as long as they do not impair the properties. Other glycol components may include, for example, one or more alkylene glycols such as 1,4-butanediol, 1,3-propylene glycol, 1,2-propylene glycol, neopentylene glycol, hexamethylene glycol, decamethylene glycol, cyclohexanedimethanol, diethylene glycol, triethylene glycol, poly(oxy)ethylene glycol, poly(oxy)tetramethylene glycol, and poly(oxy)methylene glycol, which can be arbitrarily selected depending on the purpose. Furthermore, a small amount of polyhydric alcohol component such as glycerin may be used. A small amount of epoxy compound may also be used. The amount of other glycol components used is preferably 30 mol% or less, more preferably 20 mol% or less, particularly preferably 10 mol% or less, and most preferably 5 mol% or less, relative to the total glycol component.

[0014] The polyethylene naphthalate resin described above can be produced by conventionally known manufacturing methods. Specifically, it can be produced by a direct esterification method in which a dicarboxylic acid component and a diol component are directly reacted, water is removed by distillation to esterify, and then polycondensation is carried out under reduced pressure, or by a transesterification method in which a dimethyl dicarboxylic acid ester is reacted with a diol component, methyl alcohol is removed by distillation to transesterify, and then polycondensation is carried out under reduced pressure. Furthermore, solid-phase polymerization can be carried out to increase the intrinsic viscosity number.

[0015] During the above-mentioned transesterification reaction, esterification reaction and polycondensation reaction, it is preferable to use a catalyst and a stabilizer. As the transesterification catalyst, Mg compounds, Mn compounds, Ca compounds, Zn compounds, Ti compounds, etc. are used. For example, acetates, monocarboxylates, alcoholates, and oxides of these can be mentioned. Also, the esterification reaction can be carried out only with dicarboxylic acid and diol without adding a catalyst, but it can also be carried out in the presence of the polycondensation catalyst described later. As the polycondensation catalyst, Ge compounds, Ti compounds, Sb compounds, etc. can be used. For example, germanium dioxide, germanium hydroxide, germanium alcoholate, titanium tetrabutoxide, titanium tetraisopropoxide, and titanium oxalate can be mentioned. It is preferable to use a phosphorus compound as the stabilizer. Preferred phosphorus compounds include phosphoric acid and its esters, phosphorous acid and its esters, and hypophosphorous acid and its esters. Also, during the esterification reaction, a tertiary amine such as triethylamine, a quaternary ammonium hydroxide such as tetraethylammonium hydroxide, and a basic compound such as sodium carbonate can be added to suppress the by-production of diethylene glycol. In addition, various stabilizers and modifiers can be blended into the obtained polyester resin.

[0016] The intrinsic viscosity of Component A is preferably 0.5 to 1.0 dl / g, more preferably 0.55 to 0.95 dl / g, and even more preferably 0.6 to 0.85 dl / g. If the intrinsic viscosity of Component A is less than 0.5 dl / g, the toughness may be inferior, and if it exceeds 1.0 dl / g, the fluidity during injection molding may be insufficient.

[0017] <Regarding Component B> The polyetherimide resin, which is Component B of the present invention, is a resin containing a cyclic imide structure and is not particularly limited as long as it can be used for the purpose of the present invention. However, a polyetherimide resin containing an aliphatic or aromatic ether unit and a cyclic imide group as repeating units is preferred. Further, as long as it does not inhibit the effects of the present invention, the main chain of the polyimide may contain structural units other than cyclic imide and ether units, such as aromatic, aliphatic, aliphatic ester units, oxycarbonyl units, and the like.

[0018] Specific examples of the polyetherimide resin that can be preferably used in the present invention include the polyetherimide resin represented by the following formula (1).

[0019]

Chemical formula

[0020] Examples of the above R1 and R2 include aromatic residues and alkylene groups represented by the following formulas (2) to (8).

Chemical formula

[0021] In the present invention, from the viewpoint of compatibility with the polyethylene naphthalate resin, the polyetherimide resin represented by the following formula (9) is more preferred.

Chemical formula

[0022] Examples of such polyetherimide resins include "ULTEM 1010" manufactured by SABIC Japan Co., Ltd.

[0023] The content of component B is 10 to 55 parts by weight, preferably 12 to 45 parts by weight, and more preferably 15 to 40 parts by weight in 100 parts by weight in total of components A and B. When the content of component B is less than 10 parts by weight, the heat resistance is insufficient and the light transmittance in the near-infrared region decreases. On the other hand, when it exceeds 55 parts by weight, the scratch resistance decreases.

[0024] <Regarding component C> The colorant, which is component C of the present invention, can be selected from dyes (organic, inorganic), pigments (organic, inorganic), etc., and is not particularly limited as long as the resin composition aimed at by the present invention can be obtained. Specifically, the average value of the light transmittance in the thickness direction of a molded product formed into a thickness of 1 mm at 400 to 700 nm composed of the resin composition of the present invention is 1.5% or less, and the average value of the light transmittance in the thickness direction of a molded product formed into a thickness of 1 mm at 1050 to 1100 nm is 80% or more, and it can be appropriately selected. As one embodiment for imparting such wavelength selectivity, it is preferable that the colorant is a colorant containing a colorant (C1 component) having an absorption maximum at less than 650 nm and a colorant (C2 component) having an absorption maximum at 650 to 880 nm. As the colorant, it is preferable to use a dye because there is no light scattering reflection on the surface of the particles. Examples of dye-based colorants include anthraquinone-based colorants, perinone-based colorants, perylene-based colorants, methine-based colorants, azo-based colorants, quinoline-based colorants, phthalocyanine-based colorants, squarylium-based colorants, heterocyclic-based colorants, etc. Among them, anthraquinone-based colorants, phthalocyanine-based colorants, perylene-based colorants, and heterocyclic-based colorants with high heat resistance are more preferable, and anthraquinone-based colorants, perylene-based colorants, and heterocyclic-based colorants are particularly preferable.

[0025] The content of Component C is 0.055 to 1.3 parts by weight, preferably 0.08 to 1.0 parts by weight, and more preferably 0.1 to 0.5 parts by weight with respect to a total of 100 parts by weight of Component A and Component B. When the content of Component C is less than 0.055 parts by weight, sufficient cut-off properties at 400 to 700 nm cannot be obtained. On the other hand, when it exceeds 1.3 parts by weight, the scratch resistance of the resin composition deteriorates.

[0026] <Regarding Component D> The present invention preferably contains a polyethylene terephthalate resin as Component D. The polyethylene terephthalate resin can be produced using a dicarboxylic acid component mainly composed of terephthalic acid and / or an ester-forming derivative of terephthalic acid, and a glycol component mainly composed of ethylene glycol.

[0027] The dicarboxylic acid component is primarily terephthalic acid, but other dicarboxylic acids can be used in combination as long as they do not impair the properties. Examples of other carboxylic acids include aromatic dicarboxylic acids such as isophthalic acid, 2,6-naphthalenedicarboxylic acid, 2,7-naphthalenedicarboxylic acid, 4,4′-diphenyldicarboxylic acid, diphenoxyethane-4,4′-dicarboxylic acid, diphenylsulfone-4,4′-dicarboxylic acid, and diphenyl ether-4,4′-dicarboxylic acid; aliphatic dicarboxylic acids such as adipic acid, sebacic acid, succinic acid, and oxalic acid; and alicyclic dicarboxylic acids such as cyclohexanedicarboxylic acid. One or more of these may be used, and can be arbitrarily selected depending on the purpose. The amount of other carboxylic acids used is preferably 30 mol% or less, more preferably 20 mol% or less, particularly preferably 10 mol% or less, and most preferably 5 mol% or less, relative to the total acid component. Dimethyl terephthalate is the main component of the ester-forming derivative of dicarboxylic acid, but other ester-forming derivatives of dicarboxylic acids can be used in combination as long as the properties are not impaired. Examples of other ester-forming derivatives of dicarboxylic acids include lower dialkyl esters of aromatic dicarboxylic acids such as isophthalic acid, 2,6-naphthalenedicarboxylic acid, 2,7-naphthalenedicarboxylic acid, 4,4′-diphenyldicarboxylic acid, diphenoxyethane-4,4′-dicarboxylic acid, diphenylsulfone-4,4′-dicarboxylic acid, and diphenyl ether-4,4′-dicarboxylic acid; lower dialkyl esters of alicyclic dicarboxylic acids such as cyclohexanedicarboxylic acid; and lower dialkyl esters of aliphatic dicarboxylic acids such as adipic acid, sebacic acid, succinic acid, and oxalic acid. One or more of these may be used, and can be arbitrarily selected depending on the purpose. The amount of other esterifying derivatives of dicarboxylic acids used is preferably 30 mol% or less, more preferably 20 mol% or less, particularly preferably 10 mol% or less, and most preferably 5 mol% or less, relative to the total esterifying derivative component of dicarboxylic acids.

[0028] Furthermore, small amounts of trifunctional or higher carboxylic acid components such as trimellitic acid may be used, as may small amounts of acid anhydrides such as trimellitic anhydride. In addition, small amounts of hydroxycarboxylic acids such as lactic acid and glycolic acid, or their alkyl esters, may be used, and these can be arbitrarily selected depending on the purpose.

[0029] The glycol component is primarily ethylene glycol, but other glycol components can be used in combination as long as they do not impair the properties. Other glycol components may include, for example, one or more alkylene glycols such as 1,4-butanediol, 1,3-propylene glycol, 1,2-propylene glycol, neopentylene glycol, hexamethylene glycol, decamethylene glycol, cyclohexanedimethanol, diethylene glycol, triethylene glycol, poly(oxy)ethylene glycol, poly(oxy)tetramethylene glycol, and poly(oxy)methylene glycol, which can be arbitrarily selected depending on the purpose. Furthermore, a small amount of polyhydric alcohol component such as glycerin may be used. A small amount of epoxy compound may also be used. The amount of other glycol components used is preferably 30 mol% or less, more preferably 20 mol% or less, particularly preferably 10 mol% or less, and most preferably 5 mol% or less, relative to the total glycol component.

[0030] The polyethylene terephthalate resin described above can be produced by conventionally known manufacturing methods. Specifically, it can be produced by a direct esterification method in which a dicarboxylic acid component and a diol component are directly reacted, water is removed by distillation to esterify, and then polycondensation is carried out under reduced pressure, or by a transesterification method in which a dimethyl dicarboxylic acid ester is reacted with a diol component, methyl alcohol is removed by distillation to transesterify, and then polycondensation is carried out under reduced pressure. Furthermore, solid-phase polymerization can be carried out to increase the intrinsic viscosity number.

[0031] In the transesterification, esterification, and polycondensation reactions described above, it is preferable to use catalysts and stabilizers. Transesterification catalysts include Mg compounds, Mn compounds, Ca compounds, Zn compounds, and Ti compounds, such as their acetates, monocarboxylates, alkoxides, and oxides. Esterification reactions can be carried out using only dicarboxylic acids and diols without the addition of a catalyst, but they can also be carried out in the presence of a polycondensation catalyst, as described later. Polycondensation catalysts include Ge compounds, Ti compounds, and Sb compounds, such as germanium dioxide, germanium hydroxide, germanium alkoxide, titanium tetrabutoxide, titanium tetraisopropoxide, and titanium oxalate. As stabilizers, phosphorus compounds are preferred. Preferred phosphorus compounds include phosphoric acid and its esters, phosphorous acid and its esters, and hypophosphorous acid and its esters. Furthermore, during esterification reactions, tertiary amines such as triethylamine, quaternary ammonium hydroxides such as tetraethylammonium hydroxide, and basic compounds such as sodium carbonate can be added to suppress the by-product of diethylene glycol. Furthermore, various stabilizers and modifiers can be added to the resulting polyester resin.

[0032] The intrinsic viscosity of component D is preferably 0.5 to 1.0 dl / g, more preferably 0.6 to 0.95 dl / g, and even more preferably 0.65 to 0.85 dl / g. If the intrinsic viscosity of component D is less than 0.5 dl / g, the toughness may be poor, and if it exceeds 1.0 dl / g, the fluidity during injection molding may be insufficient.

[0033] The content of component D is preferably 5 to 50 parts by weight, more preferably 7 to 40 parts by weight, and even more preferably 10 to 35 parts by weight, based on 100 parts by weight of the total of components A and B. Including component D within this range may improve scratch resistance and impact resistance.

[0034] (Regarding other ingredients) The resin composition in this invention is substantially free of polycarbonate resin. The polycarbonate resin referred to herein is a high molecular weight material obtained by reacting a divalent phenol with a carbonate precursor, and having carbonate bonds in its main chain. The divalent phenol used is not particularly limited, with bisphenol A being a typical example. The inclusion of polycarbonate resin in the resin composition is undesirable because it impairs scratch resistance. Furthermore, the resin composition of the present invention may contain various additives such as antioxidants and mold release agents, to the extent that it does not contradict the spirit of the present invention.

[0035] <Antioxidant> The resin composition of the present invention may contain at least one antioxidant selected from the group consisting of hindered phenol compounds, phosphite compounds, phosphonite compounds, and thioether compounds. By incorporating antioxidants, not only are the hue and fluidity stabilized during molding, but hydrolysis resistance is also improved.

[0036] The antioxidant content is preferably 0.01 to 2 parts by weight, more preferably 0.03 to 1 part by weight, and even more preferably 0.05 to 0.5 parts by weight, per 100 parts by weight of the total of components A and B. If the antioxidant content is less than 0.01 parts by weight, the antioxidant effect will be insufficient, which may lead to instability in hue and fluidity during molding, as well as deterioration of hydrolysis resistance. Conversely, if the content is more than 2 parts by weight, reactive components derived from the antioxidant may worsen hydrolysis resistance.

[0037] Furthermore, it is preferable to use a combination of the hindered phenol compound with two or more of the phosphite compound, phosphonite compound, and thioether compound. By using a combination of the hindered phenol compound with two or more of the phosphite compound, phosphonite compound, and thioether compound, a synergistic effect as a stabilizer is achieved, which is effective in further stabilizing the hue and fluidity during molding and improving hydrolysis resistance.

[0038] <Method for producing resin compositions> Any method can be used to produce the resin composition of the present invention. For example, one method involves pre-mixing each component, and optionally other components, then melt-kneading and pelletizing them. Means of pre-mixing include a Nauter mixer, a V-type blender, a Henschel mixer, a mechanochemical device, and an extruder mixer. Granulation may also be performed during pre-mixing using an extruder granulator or a briquetting machine. After pre-mixing, the mixture is melt-kneaded in a melt-kneader, such as a vented twin-screw extruder, and then pelletized using equipment such as a pelletizer. Other melt-kneaders include a Banbury mixer, kneading rolls, and a constant-temperature stirring vessel, but a vented twin-screw extruder is preferred. Alternatively, each component, and optionally other components, can be supplied independently to a melt-kneader, such as a twin-screw extruder, without pre-mixing.

[0039] <About molded products> A molded article using the resin composition of the present invention can be obtained by molding pellets manufactured as described above. Preferably, it can be obtained by injection molding or extrusion molding. In injection molding, in addition to conventional molding methods, examples include injection compression molding, injection press molding, gas-assisted injection molding, foam molding (including the method of injecting supercritical fluid), insert molding, in-mold coating molding, heat-insulating mold molding, rapid heating and cooling mold molding, two-color molding, multi-color molding, sandwich molding, and ultra-high-speed injection molding. Furthermore, either a cold runner method or a hot runner method can be selected for molding. In extrusion molding, a molded article can be obtained by extruding a round bar and then cutting it into a disc shape, or by extruding a thick sheet and then punching it into a predetermined shape. [Examples]

[0040] The embodiments of the present invention will be described below with reference to examples, but the present invention is not limited to these examples. Furthermore, the evaluation of various physical properties was carried out by the following methods.

[0041] [Evaluation of resin compositions] (1) Scratch resistance The pellets obtained by the method described below were dried at 130°C for 7 hours, and then injection molded using an injection molding machine (EC130SXII-4Y, manufactured by Toshiba Machine Co., Ltd.) under conditions of cylinder temperature 305°C and mold temperature 80°C to obtain plate-shaped test specimens with a thickness of 2 mm and width and length of 50 mm. A sliding test was performed on these test specimens using a reciprocating friction tester (Tribogear TYPE-40, manufactured by Shinto Kagaku Co., Ltd.) under conditions of load 0.5 kg, speed 100 mm / s, and 1500 reciprocations, with a 10 mm diameter SUS304 metal ball covered with canvas as the indenter. After the test, the arithmetic mean roughness Ra of the sliding surface was determined in accordance with JIS-01 / 13 using a surface roughness shape measuring machine (SURFCOM NEX001 SD2-12, manufactured by Tokyo Seimitsu Co., Ltd.) in a direction perpendicular to the sliding direction. The test was performed three times, and the average value was used as an indicator of the scratch resistance of the composition. The arithmetic mean roughness must be 0.1 μm or less.

[0042] (2)Light transmittance The pellets obtained by the method described below were dried at 130°C for 7 hours, and then injection molded using an injection molding machine (EC130SXII-4Y, manufactured by Toshiba Machine Co., Ltd.) under conditions of cylinder temperature 305°C and mold temperature 80°C to obtain plate-shaped test specimens with a thickness of 1 mm, a width of 50 mm, and a length of 25 mm. For these test specimens, the spectral light transmittance in the range of 300 to 2500 nm was measured at 1 nm intervals using an ultraviolet-visible-near-infrared spectrophotometer (V-770, manufactured by JASCO Corporation). From the obtained spectral data, the average values ​​of the light transmittance in the range of 400 to 700 nm and 1050 to 1100 nm were calculated.

[0043] (3) Heat resistance The pellets obtained by the method described below were dried at 130°C for 7 hours. Test specimens were then prepared using an injection molding machine (EC130SXII-4Y, manufactured by Toshiba Machine Co., Ltd.) at a cylinder temperature of 305°C and a mold temperature of 80°C. The temperature of deflection under load was measured according to ISO 75-1 and 75-2 and used as an indicator of heat resistance. The temperature of deflection under load must be 95°C or higher under a load condition of 1.8 MPa.

[0044] (4) Impact resistance The pellets obtained by the method described below were dried at 130°C for 7 hours. Test specimens were then prepared using an injection molding machine (EC130SXII-4Y, manufactured by Toshiba Machine Co., Ltd.) at a cylinder temperature of 305°C and a mold temperature of 80°C. The Charpy impact strength without notches was measured according to ISO 179 and used as an indicator of impact resistance. N indicates that the failure mode was undestructive.

[0045] [Examples 1-12, Comparative Examples 1-4, Reference Example 1] According to the content shown in Table 1, components A and C were mixed using a tumbler, and components B and D were supplied separately to the twin-screw extruder from the first feed port and melt-kneaded and extruded at a temperature of 300°C to form pellets. Here, the first feed port refers to the feed port at the base. A 30mm diameter vented twin-screw extruder (manufactured by Japan Steel Works Ltd.: TEX30α-31.5BW-2V) was used.

[0046] The following materials were used in the examples and comparative examples of the present invention. (Component A) A-1: Polyethylene naphthalate resin obtained in Production Example I <Manufacturing example I> 100 parts by weight of dimethyl naphthalenedicarboxylic acid and 60 parts by weight of ethylene glycol were transesterified by a conventional method in the presence of 0.010 parts by weight (10 mmol%) of cobalt acetate tetrahydrate and 0.030 parts by weight (30 mmol%) of manganese acetate tetrahydrate. After 20 minutes of methanol distillation, 0.012 parts by weight (10 mmol%) of antimony trioxide were added, and before the completion of the transesterification reaction, 0.020 parts by weight (50 mmol%) of orthophosphoric acid were added. Subsequently, a polycondensation reaction was carried out at 295°C under high vacuum to obtain polyethylene naphthalate resin (a) with an intrinsic viscosity of 0.51 dl / g. The obtained polyethylene naphthalate resin (a) was subjected to solid-phase polymerization at a temperature of 227°C and a vacuum of 0.5 Torr for 8 hours to obtain polyethylene naphthalate resin with an intrinsic viscosity of 0.68 dl / g. A-2 (Reference Example): Polycarbonate resin: Panlite L-1225WX (manufactured by Teijin Limited, viscosity-average molecular weight: 19,700)

[0047] (B component) B-1: ULTEM1010 (manufactured by SABIC Japan LLC) (C1 component) C1-1: NUBIAN BLACK PC-5857 (manufactured by Orient Chemical Industries, Ltd., absorption maximum wavelength 599nm) (C2 component) C2-1: Phthalocyanine-based colorant FDR-004 (manufactured by Yamada Chemical Industry Co., Ltd., absorption maximum wavelength 720nm) C2-2: Anthraquinone-based colorant SDO-7 (manufactured by Arimoto Chemical Industry Co., Ltd., absorption maximum wavelength 676nm) C2-3: Anthraquinone-based colorant SDO-11 (manufactured by Arimoto Chemical Industry Co., Ltd., absorption maximum wavelength 761 nm) C2-4: Heterocyclic colorant SDO-C33 (manufactured by Arimoto Chemical Industry Co., Ltd., absorption maximum wavelength 847nm) C2-5: Perylene-based colorant Lumogen IR-765 (manufactured by BASF Japan Ltd., absorption maximum wavelength 769nm) (D component) D-1: PET resin TRN-8550FF (manufactured by Teijin Limited, intrinsic viscosity: 0.77)

[0048] [Table 1]

[0049] <Examples 1-12> Because the composition falls within the scope of this claim, we were able to obtain a molded article that has excellent scratch resistance and heat resistance, as well as wavelength-selective absorption properties. <Comparative Example 1> Because the C component content was below the lower limit, the average light transmittance in the 400-700nm range was high. <Comparative Example 2> Because the content of component C exceeded the upper limit, the scratch resistance was poor. <Comparative Example 3> Because the content of component A exceeded the upper limit, the heat resistance was poor, and the average light transmittance in the 1050-1100 nm range was low. <Comparative Example 4> Because the content of component A was below the lower limit, the scratch resistance was poor. <Reference example 1> Because component A is polycarbonate resin, the scratch resistance was poor.

Claims

1. A resin composition comprising 100 parts by weight in total, comprising 45 to 90 parts by weight of (A) polyethylene naphthalate resin (component A) and 55 to 10 parts by weight of polyetherimide resin (component B), wherein the composition contains 0.055 to 1.3 parts by weight of (C) a colorant (component C) and 5 to 50 parts by weight of (D) polyethylene terephthalate resin (component D), characterized in that the average light transmittance in the thickness direction of a molded product molded to a thickness of 1 mm at 400 to 700 nm is 1.5% or less, the average light transmittance in the thickness direction of a molded product molded to a thickness of 1 mm at 1050 to 1100 nm is 80% or more, and the composition does not contain polycarbonate resin, excluding applications for laser welding.

2. The resin composition according to claim 1, wherein component C is a colorant comprising (C1) a colorant having an absorption maximum at less than 650 nm (component C1) and (C2) a colorant having an absorption maximum at 650 to 880 nm (component C2).

3. The resin composition according to claim 2, characterized in that the C2 component is at least one colorant selected from the group consisting of anthraquinone-based colorants, phthalocyanine-based colorants, perylene-based colorants, and heterocyclic colorants.

4. The resin composition according to claim 2, characterized in that the C2 component is at least one colorant selected from the group consisting of anthraquinone-based colorants, perylene-based colorants, and heterocyclic colorants.

5. A molded article obtained by molding the resin composition according to claim 1 or 2.

6. A molded article according to claim 5, which is a cover material for an infrared sensor.

7. The molded article according to claim 6, which is a cover material for an infrared sensor used in a driver monitoring system for monitoring drivers and in a LiDAR for detecting other vehicles and buildings.

Citation Information

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