Valve device
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- AISAN IND CO LTD
- Filing Date
- 2022-10-24
- Publication Date
- 2026-05-15
AI Technical Summary
【0008】 第1技術によると、流体導入路である一次側通路(弁体より上流側の通路)だけでなく、流体導出路である二次側通路(弁体より下流側の通路)についても、凍結した流体(以下、凍結流体と称する)を解凍することができる。すなわち、バルブ装置内の流体流路全体において、凍結流体を解凍することができる。低温環境下において流体流路内に凍結流体が生じても、凍結流体を効率的に解凍することができ、バルブ装置の機能が損なわることを抑制することができる。
Smart Images

Figure 0007859946000001 
Figure 0007859946000002
Abstract
Claims
1. A valve device for opening and closing a fluid passage, Housing and A primary side passage is provided within the housing through which fluid is introduced from the outside, A first outlet is provided at the downstream end of the primary side passage, A secondary passage is provided within the housing, is in communication with the first outlet section, extends in a direction different from the primary passage, and discharges fluid to the outside. A communication chamber is provided between the first outlet and the secondary passage, and is in communication with the first outlet and the secondary passage. The valve seat formed in the first outlet portion, A valve body that can contact the valve seat and opens and closes the first outlet portion, Heater and, A heat transfer plate is provided within the housing and extends along the primary side passage, transferring heat from the heater to the fluid, It is equipped with, The primary side passage is formed such that it approaches the secondary side passage as it approaches the first outlet side. The end of the heat transfer plate extends along the side wall of the secondary passage, The primary passage has an end face facing the side wall of the secondary passage, A valve device in which the end portion of the heat transfer plate extends between the end face of the primary passage and the side wall of the secondary passage.
2. A valve device according to claim 1, The aforementioned primary passage extends in a substantially horizontal direction. A valve device in which at least a portion of the heat transfer plate is provided below the primary side passage.