Appearance inspection device, cutting device, and method for manufacturing semiconductor components

Abstract

The present invention provides an appearance inspection apparatus, a cutting apparatus, and a semiconductor material manufacturing method that can capture multiple images of semiconductor materials at a relatively high speed during the appearance inspection of semiconductor materials. [Solution] The appearance inspection device inspects the appearance of one surface of a semiconductor material. This appearance inspection device comprises a first illuminator, a second illuminator, and an imaging unit. Each of the first and second illuminators irradiates light onto the semiconductor material from the direction normal to the surface of the semiconductor material, or from an oblique direction inclined with respect to the normal direction. The imaging unit photographs the semiconductor material. The light intensity of each of the first and second illuminators can be adjusted individually. The imaging unit continuously performs a first photograph, in which the semiconductor material is photographed with light irradiation from the first illuminator, and a second photograph, in which the semiconductor material is photographed with light irradiation from the second illuminator.

Description

Technical Field

[0001] The present invention relates to an appearance inspection device, a cutting device, and a method for manufacturing a semiconductor member.

Background Art

[0002] Japanese Patent Application Laid-Open No. 10-24442 (Patent Document 1) discloses a resin sealing device for resin-sealing a semiconductor device mounted on a lead frame. This resin sealing device has an appearance inspection device for inspecting the appearance of the resin-sealed lead frame. In this appearance inspection device, the lead frame irradiated with illumination light is photographed by a TV camera.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In the inspection of the appearance of a semiconductor member (hereinafter, also referred to as "appearance inspection"), for example, a plurality of images are photographed under different shooting conditions. If it takes a long time to shoot a plurality of images, the time required for the appearance inspection of the semiconductor member also becomes long. In the above Patent Document 1, no solution to such a problem is disclosed.

[0005] The present invention has been made to solve such problems, and an object thereof is to provide an appearance inspection device, a cutting device, and a method for manufacturing a semiconductor member capable of relatively quickly photographing a plurality of images in the appearance inspection of a semiconductor member.

Means for Solving the Problems

[0006] An appearance inspection apparatus according to a certain aspect of the present invention inspects the appearance of one surface of a semiconductor material. This appearance inspection apparatus comprises a first illuminator, a second illuminator, and an imaging unit. Each of the first and second illuminators irradiates light onto the semiconductor material from the direction normal to the surface of the semiconductor material, or from an oblique direction inclined with respect to the normal direction. The imaging unit photographs the semiconductor material. The light intensity of each of the first and second illuminators can be adjusted individually. The imaging unit continuously performs a first photograph, in which the semiconductor material is photographed with light irradiation from the first illuminator, and a second photograph, in which the semiconductor material is photographed with light irradiation from the second illuminator.

[0007] Furthermore, a cutting apparatus according to another aspect of the present invention comprises the above-mentioned visual inspection apparatus, a cutting mechanism, a table, a plurality of storage members, and a transport body. The cutting mechanism cuts the object to be cut, thereby dividing it into a plurality of semiconductor members. Each of the plurality of semiconductor members is placed on the table. The transport body holds one of the plurality of semiconductor members placed on the table, moves while holding the semiconductor member, and transports the held semiconductor member to one of the plurality of storage members. The first and second images are taken while the transport body is moving.

[0008] Furthermore, a method for manufacturing a semiconductor member according to another aspect of the present invention uses the above-described cutting apparatus. This method for manufacturing a semiconductor member includes preparing an object to be cut and cutting the object to be cut to divide it into a plurality of semiconductor members. [Effects of the Invention]

[0009] According to the present invention, it is possible to provide an appearance inspection apparatus, a cutting apparatus, and a method for manufacturing semiconductor materials that can capture multiple images of semiconductor materials at a relatively high speed during appearance inspection. [Brief explanation of the drawing]

[0010] [Figure 1] This is a schematic plan view of the cutting device. [Figure 2]This diagram schematically shows a partial cross-section of the second optical inspection camera and illumination unit. [Figure 3] This is a schematic plan view of the lighting unit. [Figure 4] This is a schematic diagram showing the hardware configuration of a computer. [Figure 5] This diagram illustrates the characteristics of images obtained through photography accompanied by the illumination of a coaxial illuminator. [Figure 6] This diagram illustrates the characteristics of images obtained through photography accompanied by the illumination of a ring illuminator. [Figure 7] This diagram includes a plan view and a side view illustrating an electronic component. [Figure 8] This diagram schematically shows images of electronic components obtained through the first imaging process. [Figure 9] This diagram schematically shows images of electronic components obtained through the second imaging process. [Figure 10] This diagram illustrates the problems that arise when one of the ring illuminators is not installed. [Figure 11] This is a diagram illustrating the images captured through the first and second imaging processes. [Figure 12] This flowchart shows the procedure for photographing electronic components being transported by a transport unit. [Figure 13] This flowchart shows the procedure for visual inspection of electronic components transported by a transport unit. [Figure 14] This is a schematic plan view showing a lighting unit including a linear illuminator. [Modes for carrying out the invention]

[0011] Hereinafter, an embodiment according to one aspect of the present invention (hereinafter also referred to as "this embodiment") will be described in detail with reference to the drawings. In the drawings, the same or corresponding parts are denoted by the same reference numerals and their description will not be repeated. Also, for ease of understanding, each drawing is schematically drawn with appropriate omissions or exaggerations of the subject. In the drawings, the X-axis and the Y-axis are orthogonal to each other, the X-axis and the Z-axis are orthogonal to each other, and the Y-axis and the Z-axis are orthogonal to each other. The X-axis and the Y-axis are orthogonal to each other, for example, in a horizontal plane.

[0012] [1. Configuration] <1-1. Configuration of Cutting Device> FIG. 1 is a plan view schematically showing a cutting device 1 according to this embodiment. The cutting device 1 is configured to cut a package substrate to individualize the package substrate into a plurality of electronic components (an example of a "semiconductor member"). In the package substrate, a substrate on which a semiconductor chip is fixed is resin-sealed. As an example of a substrate on which a semiconductor chip is fixed, a lead frame can be mentioned. Note that the object to be cut does not necessarily have to be a package substrate, and for example, a substrate that is not resin-sealed (including a wafer) may be used. Substrates individualized by cutting a substrate that is not resin-sealed are also included in the "semiconductor member".

[0013] Examples of the package substrate include a BGA (Ball Grid Array) package substrate, an LGA (Land Grid Array) package substrate, a CSP (Chip Size Package) package substrate, an LED (Light Emitting Diode) package substrate, and a QFN (Quad Flat No-leaded) package substrate.

[0014] Also, the cutting device 1 is configured to perform an appearance inspection on each of the plurality of individualized electronic components. In the cutting device 1, an image of each electronic component is captured, and an appearance inspection of each electronic component is performed based on the captured images. Inspection data is generated through the appearance inspection, and each electronic component is classified as a "good product" or a "defective product". Specific inspection procedures will be described later.

[0015] In this example, a package substrate P1 is used as the object to be cut, and the package substrate P1 is separated into a plurality of electronic components S1 by the cutting device 1. Hereinafter, of the two surfaces of the package substrate P1, the resin-sealed surface is referred to as the mold surface, and the surface opposite to the mold surface is referred to as the ball / lead surface. When the object to be cut is a substrate that is not resin-sealed, the surface facing upward (cutting surface) during cutting corresponds to the ball / lead surface in the present embodiment, and the surface opposite to the cutting surface corresponds to the mold surface in the present embodiment.

[0016] As shown in FIG. 1, the cutting device 1 includes, as components, a cutting module A1 and an inspection / storage module B1. The cutting module A1 is configured to manufacture a plurality of electronic components S1 by cutting the package substrate P1. The inspection / storage module B1 inspects each of the plurality of manufactured electronic components S1 and then stores the electronic components S1 in a storage member (for example, a tray). In the cutting device 1, each component is detachable and replaceable with respect to other components.

[0017] The cutting module A1 mainly includes a substrate supply unit 3, a positioning unit 4, a cutting table 5, a cutting mechanism 6, and a transfer unit 7. The substrate supply unit 3 supplies the package substrate P1 to the positioning unit 4 one by one by pushing out the package substrate P1 from a magazine M1 that houses a plurality of package substrates P1. At this time, the package substrate P1 is arranged with the ball / lead surface facing upward.

[0018] The positioning unit 4 positions the package substrate P1 by arranging the package substrate P1 pushed out from the substrate supply unit 3 on the rail unit 4a. Then, the positioning unit 4 transfers the positioned package substrate P1 to the cutting table 5.

[0019] The cutting table 5 holds the package substrate P to be cut. In this example, a cutting device 1 with a twin-cut table configuration having two cutting tables 5 is shown. The cutting table 5 includes a holding member 5a, a rotating mechanism 5b, and a moving mechanism 5c. The holding member 5a holds the package substrate P1, which has been transported by the positioning unit 4, by suction from below. The rotating mechanism 5b rotates the holding member 5a in the direction θ1 in the figure. In the figure, the direction θ1 is the direction of rotation around the Z axis. The moving mechanism 5c moves the holding member 5a along the Y axis in the figure.

[0020] The cutting mechanism 6 cuts the package substrate P1, thereby separating it into multiple electronic components S1. In this example, a cutting apparatus 1 is shown in which two cutting mechanisms 6 cut one package substrate P1. The cutting mechanisms 6 are movable along the X and Z axes in the figure.

[0021] The cutting mechanism 6 includes a blade 6a, a rotating shaft 6c extending along the X-axis, and a spindle portion 6d that rotates the rotating shaft 6c. The blade 6a is, for example, a disc-shaped blade having a cutting edge on its outer circumference. The central portion of the blade 6a is connected to the end of the rotating shaft 6c. In the cutting mechanism 6, the spindle portion 6d rotates the rotating shaft 6c, causing the blade 6a to rotate at high speed around the rotating shaft 6c. As a result, the blade 6a cuts the package substrate P1, separating the package substrate P1 into multiple electronic components S1. The blade 6a is mounted on the rotating shaft 6c while being held between first and second flanges (not shown). The first and second flanges are fixed to the rotating shaft 6c by fastening members (not shown), such as nuts.

[0022] The cutting mechanism 6 is equipped with nozzles for cutting fluid, cooling water, and cleaning water (none of which are shown). The cutting fluid nozzles spray cutting fluid towards the high-speed rotating blade 6a. The cooling water nozzles spray cooling water. The cleaning water nozzles spray cleaning water to wash away cutting debris and the like.

[0023] After the cutting table 5 picks up the package substrate P1, the package substrate P1 is photographed by the first position confirmation camera 5d to confirm its position. The confirmation using the first position confirmation camera 5d is, for example, to confirm the position of a mark provided on the package substrate P1. This mark is, for example, a mark used to determine the cutting position of the package substrate P1.

[0024] Subsequently, the cutting table 5 moves along the Y-axis in the figure toward the cutting mechanism 6. After the cutting table 5 moves below the cutting mechanism 6, alignment is performed, and then the package substrate P1 is cut by moving the cutting table 5 and the cutting mechanism 6 relative to each other. Each time the package substrate P1 is cut by the blade 6a of the cutting mechanism 6, the package substrate P1 is photographed by the second position confirmation camera 6b provided in the cutting mechanism 6 and confirmation is performed. Confirmation using the second position confirmation camera 6b is, for example, to confirm the cut position and the cut width of the package substrate P1.

[0025] After the cutting of the package substrate P1 is complete, the cutting table 5 moves away from the cutting mechanism 6 along the Y-axis in the figure, while holding the multiple individual electronic components S1. During this movement process, the first cleaner 5e cleans and dries the upper surfaces (ball / lead surfaces) of the multiple electronic components S1.

[0026] The transport unit 7 picks up the multiple electronic components S1 held on the cutting table 5 from above and transports the multiple electronic components S1 to the flipper 11 of the inspection and storage module B1. During this transport process, the second cleaner 7a cleans and dries the lower surface (molded surface) of the multiple electronic components S1.

[0027] The inspection and storage module B1 mainly includes a flipper 11, a first optical inspection camera 12, an index table 14, a transport unit 15, a second optical inspection camera 13, a lighting unit 17, and a storage member 16. The first optical inspection camera 12 may be provided in the cutting module A1.

[0028] The flipper 11 receives multiple electronic components S1 from the transport unit 7 and holds the received multiple electronic components S1. The flipper 11 is movable along the X-axis in the figure. The flipper 11 can also invert the orientation of the multiple electronic components S1 it is holding. The flipper 11 is provided with a holding member that holds the multiple electronic components S1 by attracting them. The flipper 11 inverts the orientation of the multiple electronic components S1 by rotating the holding member around the Y-axis.

[0029] The first optical inspection camera 12 photographs the molded surfaces of multiple electronic components S1. The first optical inspection camera 12 is equipped with an illumination unit (not shown), and when the first optical inspection camera 12 takes a photograph, light is shone onto the molded surfaces of the multiple electronic components S1. Based on the captured image (image data) generated by the first optical inspection camera 12, various visual inspections of the molded surfaces of the multiple electronic components S1 are performed. The first optical inspection camera 12 is positioned near the flipper 11 to photograph upwards. The first optical inspection camera 12 is movable along the Y-axis in the figure. The captured image generated by the first optical inspection camera 12 is, for example, a grayscale image. Each of the multiple pixel values ​​that make up this grayscale image is represented by, for example, a value of 256 levels.

[0030] The transport unit 7 stops moving along the X-axis above the first optical inspection camera 12. The first optical inspection camera 12 photographs the molded surfaces of the multiple electronic components S1 held by the transport unit 7 while the transport unit 7 is stopped moving along the X-axis. Subsequently, the transport unit 7 places the multiple electronic components S1 onto the holding member of the flipper 11. After the flipper 11 picks up the multiple electronic components S1, it inverts the multiple electronic components S1 held by the holding member. At this time, the lower surface of the electronic component S1 is the ball / lead surface. The flipper 11 places the held multiple electronic components S1 onto the index table 14.

[0031] Multiple electronic components S1 that have been inspected with respect to the molded surface are placed on the index table 14 by the flipper 11. The index table 14 is movable along the Y-axis in the figure.

[0032] The transport unit 15 holds a plurality of electronic components S1 placed on the index table 14 from above, moves while holding the electronic components S1, and stores the held plurality of electronic components S1 into the storage member 16. When the electronic components S1 are held by the transport unit 15, the lower surface of the electronic component S1 is the ball / lead surface, and the upper surface of the electronic component S1 is the molded surface. A second optical inspection camera 13 and an illumination unit 17 are provided between the index table 14 and the storage member 16.

[0033] The second optical inspection camera 13 photographs the ball / lead surface of the electronic component S1. The illumination unit 17 illuminates the ball / lead surface of the electronic component S1 with light when the second optical inspection camera 13 is taking an image. Based on the captured image (image data) generated by the second optical inspection camera 13, various visual inspections of the ball / lead surface of the electronic component S1 are performed. The second optical inspection camera 13 is positioned between the transport unit 15 and the storage member 16 to photograph upwards. The second optical inspection camera 13 is movable along the Y-axis in the figure. The captured image generated by the second optical inspection camera 13 is, for example, a grayscale image. Each of the multiple pixel values ​​that make up this grayscale image is represented by, for example, a value of 256 levels. The photographing of the electronic component S1 by the second optical inspection camera 13 is performed while the electronic component S1 is still moving, not when it has stopped moving. Thus, in the cutting device 1, the photographing by the second optical inspection camera 13 is performed while the electronic component S1 is moving. Therefore, with the cutting device 1, the visual inspection of the ball / lead surface of the electronic component S1 and the transport of the electronic component S1 are performed in parallel. Compared to the case where the second optical inspection camera 13 takes pictures while the electronic component S1 is stopped moving, the manufacturing of the electronic component S1 can be performed at a higher speed.

[0034] Figure 2 is a schematic diagram showing a partial cross-section of the second optical inspection camera 13 and the illumination unit 17. Referring to Figure 2, the second optical inspection camera 13 includes a camera body 13a and a reflector 13b, and the illumination unit 17 includes a coaxial illuminator 17a and ring illuminators 17b and 17c. The illumination unit 17 is positioned above the second optical inspection camera 13, and the transport unit 15 passes above the illumination unit 17. At the time the transport unit 15 passes above the illumination unit 17, the electronic component S1, ring illuminator 17c, ring illuminator 17b, and coaxial illuminator 17a are aligned in this order in the direction normal to the ball / lead surface of the electronic component S1. That is, at the time the transport unit 15 passes above the illumination unit 17, the coaxial illuminator 17a and the ring illuminators 17b and 17c are each located below the electronic component S1. In the example shown in Figure 2, at the point when the transport unit 15 passes above the lighting unit 17, the ball / lead surface is aligned horizontally, and the normal direction of the ball / lead surface is vertical. Here, "horizontal direction" has a practical meaning. That is, if the angle between the ball / lead surface and the horizontal plane is within the margin of error, the ball / lead surface is aligned horizontally. Therefore, even if the ball / lead surface is slightly curved, it is still aligned horizontally.

[0035] The transport unit 15 includes a base 15a extending along the X-axis and a plurality of pickers PC1, each connected to the base 15a. Each of the plurality of pickers PC1 is connected to the base 15a via a rod-shaped member (not shown) extending along the Y-axis from the base 15a. Each of the plurality of pickers PC1 includes a columnar picker body PC1a extending along the Z-axis and a circular member PC1b projecting radially outward from the picker body PC1a. Each picker PC1 holds one electronic component S1. The electronic component S1 is held by the tip of the picker body PC1a, which is located below the circular member PC1b. Each of the plurality of pickers PC1 holds one of the plurality of electronic components S1 placed on the index table 14, moves while holding the electronic component S1, and stores the held electronic component S1 in the storage member 16. The circular component PC1b is white in color, and its shape in plan view is a perfect circle. The diameter of the circular component PC1b is longer than the length of the diagonal of the rectangular electronic component S1 in plan view. Therefore, when the electronic component S1 is photographed by the second optical inspection camera 13, the background of the electronic component S1 appears white in the grayscale image.

[0036] The camera body 13a photographs the ball / lead surface of the electronic component S1 held by the picker PC1. The reflector 13b is composed of, for example, a prism and has a reflective surface tilted, for example, 45 degrees with respect to the observation axis C1 of the camera body 13a. The camera body 13a photographs the electronic component S1 reflected by the reflective surface of the reflector 13b.

[0037] The coaxial illuminator 17a has a rectangular parallelepiped shape and includes a plurality of light-emitting elements LT1 arranged on planes along the Y and Z axes, and a half-mirror HM1 tilted at 45 degrees with respect to the observation axis C1 of the camera body 13a. The direction in which the half-mirror HM1 is tilted with respect to the observation axis C1 is the same as the direction in which the reflective surface of the reflector 13b is tilted with respect to the observation axis C1. Light emitted from the plurality of light-emitting elements LT1 is incident on the half-mirror HM1 along the X axis, and the light reflected by the half-mirror HM1 is irradiated onto the electronic component S1 along the Z axis. In other words, the coaxial illuminator 17a is configured to irradiate the electronic component S1 with light from the direction normal to the electronic component S1. The light irradiated by the coaxial illuminator 17a propagates along the Z axis. The image captured by the second optical inspection camera 13 is the image transmitted through the half-mirror HM1.

[0038] Each of the ring illuminators 17b and 17c is composed of, for example, a strobe. Each of the ring illuminators 17b and 17c has a ring shape and includes a plurality of light-emitting elements LT1 arranged in the circumferential direction. Each of the ring illuminators 17b and 17c is configured to irradiate light onto the electronic component S1 from an oblique direction that is inclined with respect to the normal direction of the electronic component S1, neither from the normal direction of the electronic component S1 nor from the horizontal direction. The light irradiated by each of the ring illuminators 17b and 17c propagates in an oblique direction that is neither from the normal direction of the electronic component S1 nor from the horizontal direction. The light intensity of each of the coaxial illuminator 17a and the ring illuminators 17b and 17c can be adjusted individually. The angle between the direction in which the ring illuminator 17b irradiates light and the normal direction may be the same as or different from the angle between the direction in which the ring illuminator 17c irradiates light and the normal direction. Luminous intensity is the total amount of light energy passing through a given surface within a given time, and is also called luminous energy. The unit of luminous intensity is the lumen-second (lm·s).

[0039] Figure 3 is a schematic plan view of the lighting unit 17. Referring to Figure 3, the centers of the ring illuminators 17b and 17c overlap, and the diameter of ring illuminator 17c is longer than the diameter of ring illuminator 17b. That is, in a plan view, ring illuminator 17b is located in the area inside ring illuminator 17c. Coaxial illuminator 17a is located in an area even further inside ring illuminator 17b. When the electronic component S1 is located above the lighting unit 17, in a plan view, of the coaxial illuminator 17a and the ring illuminators 17b and 17c, the coaxial illuminator 17a is closest to the electronic component S1, and of the coaxial illuminator 17a and the ring illuminators 17b and 17c, ring illuminator 17c is furthest from the electronic component S1. In other words, the lowest-positioned illuminator among the coaxial illuminator 17a and the ring illuminators 17b and 17c is closest to the electronic component S1 in a plan view, and the highest-positioned illuminator among the coaxial illuminator 17a and the ring illuminators 17b and 17c is furthest from the electronic component S1 in a plan view. Since the coaxial illuminator 17a illuminates the electronic component S1 with light propagating along the Z-axis, the light illuminated by the coaxial illuminator 17a is not blocked by the ring illuminators 17b and 17c. Also, since the ring illuminator 17b illuminates the inside in a plan view, the light illuminated by the ring illuminator 17b is not blocked by the ring illuminator 17c.

[0040] Referring again to Figure 1, the electronic components S1 are sorted into "good" or "defective" based on the results of visual inspection using the first optical inspection camera 12 and the second optical inspection camera 13. The storage member 16 is provided as a storage member 16a for good products and a storage member 16b for defective products. Each of the storage member 16a for good products and the storage member 16b for defective products is movable along the Y axis. The transport unit 15 transports each electronic component S1 to either the storage member 16a for good products or the storage member 16b for defective products based on the sorting results. That is, good electronic components S1 are stored in the storage member 16a for good products, and defective electronic components S1 are stored in the storage member 16b for defective products. In other words, the picker PC1 stores the held electronic components S1 in either the storage member 16a for good products or the storage member 16b for defective products. When each of the storage members for good products 16a and defective products 16b is filled with the electronic component S1, it is replaced with a new storage member.

[0041] The cutting device 1 further includes a computer 50 and a monitor 20. The monitor 20 is configured to display an image. The monitor 20 is composed of a display device such as a liquid crystal monitor or an organic EL (Electro-Luminescence) monitor.

[0042] The computer 50 controls, for example, the operation of each part of the cutting module A1 and the inspection / storage module B1. The computer 50 controls, for example, the operation of the substrate supply unit 3, positioning unit 4, cutting table 5, cutting mechanism 6, transport unit 7, flipper 11, first optical inspection camera 12, index table 14, transport unit 15, second optical inspection camera 13, lighting unit 17, storage member 16, and monitor 20.

[0043] Furthermore, the computer 50 performs various visual inspections of the electronic component S1 based on image data generated by, for example, the first optical inspection camera 12 and the second optical inspection camera 13. Next, the computer 50 will be described in detail.

[0044] <1-2. Computer Configuration> Figure 4 is a schematic diagram showing the hardware configuration of computer 50. As shown in Figure 4, computer 50 includes a control unit 70, an input / output interface 90, a reception unit 95, and a storage unit 80, and each component is electrically connected via a bus.

[0045] The control unit 70 includes a CPU (Central Processing Unit) 72, RAM (Random Access Memory) 74, and ROM (Read Only Memory) 76, etc. The control unit 70 is configured to control each component in the computer 50 and each component in the cutting device 1 according to information processing.

[0046] The input / output interface 90 is configured to communicate with each component included in the cutting device 1 via signal lines. The input / output interface 90 is used to transmit data from the computer 50 to each component in the cutting device 1 and to receive data transmitted from each component in the cutting device 1 to the computer 50. The reception unit 95 is configured to receive instructions from the user. The reception unit 95 is composed of, for example, some or all of a touch panel, keyboard, mouse, and microphone.

[0047] The storage unit 80 is, for example, an auxiliary storage device such as a hard disk drive or a solid-state drive. The storage unit 80 is configured to store, for example, a control program 81. Various functions of the cutting device 1 are realized when the control program 81 is executed by the control unit 70. When the control unit 70 executes the control program 81, the control program 81 is loaded into the RAM 74. The control unit 70 then controls each component by having the CPU 72 interpret and execute the control program 81 loaded into the RAM 74.

[0048] [2. Visual inspection of ball / lead surfaces of semiconductor components] In the cutting device 1 according to this embodiment, each electronic component S1 is photographed by the second optical inspection camera 13 under two different shooting conditions for visual inspection of the ball / lead surface. Specifically, for visual inspection of the ball / lead surface, each electronic component S1 is photographed by the second optical inspection camera 13 with the illumination of the coaxial illuminator 17a and the ring illuminator 17c (hereinafter also referred to as "first photography"), and photographed by the second optical inspection camera 13 with the illumination of the ring illuminator 17b (hereinafter also referred to as "second photography"). Note that the ring illuminator 17b does not emit light during the first photography, and neither the coaxial illuminator 17a nor the ring illuminator 17c emits light during the second photography. Furthermore, the light intensity of the ring illuminator 17c during the first photography is different from the light intensity of the ring illuminator 17b during the second photography. The reason why each electronic component S1 is photographed under two different shooting conditions will be explained below.

[0049] Figure 5 is a diagram illustrating the characteristics of an image obtained through imaging accompanied by the illumination of a coaxial illuminator 17a. Referring to Figure 5, in this example, the object to be imaged OJ1 is imaged by the second optical inspection camera 13 accompanied by the illumination of a coaxial illuminator 17a. The object to be imaged OJ1 has a rectangular shape in plan view. The lower surface of the object to be imaged OJ1 includes a flat portion PT1 and an uneven portion PT2. The light irradiated by the coaxial illuminator 17a is irradiated onto the object to be imaged OJ1 from the direction normal to the object to be imaged OJ1. Light incident on the flat portion PT1 is reflected, for example, toward the camera body 13a. On the other hand, light incident on the uneven portion PT2 is reflected, for example, in a direction different from the direction toward the camera body 13a. Therefore, in the image obtained through imaging accompanied by the illumination of a coaxial illuminator 17a, the characteristics of the flat portion PT1 are strongly reflected, while the characteristics of the uneven portion PT2 are not reflected to the extent of the flat portion PT1.

[0050] Figure 6 is a diagram illustrating the characteristics of images obtained through imaging accompanied by the illumination of the ring illuminator 17b. Referring to Figure 6, in this example, the object to be imaged OJ1 is imaged by the second optical inspection camera 13 accompanied by the illumination of the ring illuminator 17b. The light emitted by the ring illuminator 17b is directed onto the object to be imaged OJ1 from an oblique direction, neither normal to nor horizontal to the electronic component S1. Light incident on the flat portion PT1 is reflected in a direction different from, for example, the direction toward the camera body 13a. On the other hand, light incident on the uneven portion PT2 is reflected toward, for example, the camera body 13a. Therefore, in the image obtained through imaging accompanied by the illumination of the ring illuminator 17b, the characteristics of the uneven portion PT2 are strongly reflected, while the characteristics of the flat portion PT1 are not reflected to much extent. This is also true when the ring illuminator 17c is used instead of the ring illuminator 17b.

[0051] Multiple inspections are performed for the visual appearance of the electronic component S1. Some inspections are performed with high precision by observing both the flat and uneven parts of the electronic component S1. For example, this includes checking for stains on the ball / lead surface. Other inspections are performed with high precision by observing the uneven parts of the electronic component S1 in more detail. For example, this includes checking for scratches on the ball / lead surface. In the first imaging, the coaxial illuminator 17a and the ring illuminator 17c emit light, so the image obtained through the first imaging (hereinafter also referred to as the "first image") reflects the characteristics of both the flat and uneven parts of the electronic component S1. For example, the visual inspection for stains on the ball / lead surface is performed based on the first image. On the other hand, in the second imaging, only the ring illuminator 17b emits light, so the image obtained through the second imaging (hereinafter also referred to as the "second image") reflects the characteristics of the uneven parts of the electronic component S1 in more detail. For example, visual inspection for scratches on the ball / lead surface is performed based on the second image.

[0052] Figure 7 is a diagram that includes a schematic plan view and a side view of the electronic component S1. Referring to Figure 7, the upper diagram is a plan view of the electronic component S1, and the lower diagram is a side view of the electronic component S1. The electronic component S1 includes a rectangular substrate portion ST1 in plan view and a plurality of ball terminal portions BL1, each of which is arranged on the substrate portion ST1. Each ball terminal portion BL1 protrudes upward from the substrate portion ST1.

[0053] Figure 8 schematically shows an image of the electronic component S1 obtained through the first imaging. Referring to Figure 8, the image IM1 is an image captured by the second optical inspection camera 13. In the image IM1, the image of the electronic component S1 is included on the near side, and the image of the circular member PC1b is included on the far side. In the first imaging, the coaxial illuminator 17a and the ring illuminator 17c emit light, so in the image IM1, the flat substrate portion ST1 and the ball terminal portion BL1 protruding from the substrate portion ST1 are both brightly visible.

[0054] Figure 9 schematically shows an image of the electronic component S1 obtained through the second imaging. Referring to Figure 9, the image IM2 is an image captured by the second optical inspection camera 13. In the image IM2, the image of the electronic component S1 is included on the near side, and the image of the circular member PC1b is included on the far side. In the second imaging, only the ring illuminator 17b emits light, so in the image IM2, the flat substrate portion ST1 appears dark, while the ball terminal portion BL1 protruding from the substrate portion ST1 appears bright.

[0055] Thus, in the cutting device 1, both first and second imaging are performed for each electronic component S1 in order to capture an appropriate image according to the type of visual inspection. Then, for each electronic component S1, a visual inspection is performed using the first image and a visual inspection is performed using the second image.

[0056] The first and second imaging are performed continuously while the electronic component S1 is moving during transport from the index table 14 to the storage member 16. The faster the electronic component S1 moves, the shorter the time interval between the first and second imaging needs to be. In the cutting device 1 according to this embodiment, a ring illuminator 17c used for the first imaging and a ring illuminator 17b used for the second imaging are provided separately.

[0057] Figure 10 illustrates the problem that arises when one of the ring illuminators 17c is not provided. Referring to Figure 10, in this example, only the coaxial illuminator 17a and the ring illuminator 17b are provided as illuminators. As described above, the required light intensity of the ring illuminator differs between the first and second imaging. For example, suppose the light intensity of the ring illuminator required for the first imaging is the first light intensity, and the light intensity of the ring illuminator required for the second imaging is the second light intensity, which is different from the first light intensity. In this case, it is necessary to perform the first imaging with the light intensity of the ring illuminator 17b changed to the first light intensity, and then perform the second imaging after changing the light intensity of the ring illuminator 17b from the first light intensity to the second light intensity. Changing the light intensity of the ring illuminator 17b requires a certain amount of time. According to this example, it is not possible to perform the first and second imaging consecutively at a time interval shorter than the time interval required for the ring illuminator 17b to emit light of the first light intensity and then emit light of the second light intensity.

[0058] In the cutting apparatus 1 according to this embodiment, both a ring illuminator 17b and a ring illuminator 17c are provided. Therefore, for example, by pre-adjusting the light intensity of the ring illuminator 17c used for the first imaging to a first light intensity, and pre-adjusting the light intensity of the ring illuminator 17b used for the second imaging to a second light intensity, the first and second imaging can be performed continuously at a shorter time interval than the time interval required for the ring illuminator 17b to irradiate with light of the first light intensity, then change the light intensity to the second light intensity, and irradiate with light of the second light intensity. In other words, in the cutting apparatus 1 according to this embodiment, for example, the control unit 70 of the computer 50 controls the second optical inspection camera 13 and the illumination unit 17 respectively so that the first and second imaging are performed at a shorter time interval than the time interval required for the ring illuminator 17b to irradiate with light of the first light intensity, then change the light intensity to the second light intensity, and irradiate with light of the second light intensity.

[0059] Figure 11 is a diagram illustrating the images captured through the first and second imaging processes. Referring to Figure 11, in this example, electronic components S1A, S1B, S1C, and S1D are transported by the transport unit 15 from left to right in the figure, and the first and second imaging processes are performed while the electronic components S1A, S1B, S1C, and S1D are being transported. In the cutting device 1, the first and second imaging processes are performed alternately each time the transport unit 15 arrives at a predetermined position.

[0060] In this example, one or two electronic components S1 are captured in the first and second imaging processes. Specifically, the image IM3 generated through the first imaging process includes an image of electronic component S1A, and the image IM4 generated through the second imaging process includes images of electronic components S1A and S1B. The image IM5 generated through the first imaging process includes images of electronic components S1B and S1C, and the image IM6 generated through the second imaging process includes images of electronic components S1C and S1D. Furthermore, the image generated through the subsequent first imaging process includes an image of electronic component S1D. Note that images IM3, IM4, IM5, and IM6 are captured in this order.

[0061] Thus, each of the first and second images, which are generated consecutively, contains two or more electronic components S1 that are partially common to each other. Therefore, when performing visual inspection of multiple electronic components S1, the cutting device 1 can reduce the number of first and second images compared to when each of the first and second images contains only an image of one electronic component S1, thus enabling more efficient visual inspection of multiple electronic components S1.

[0062] [3. Operation] <3-1. Photography operation of ball / lead surfaces of semiconductor components> Figure 12 is a flowchart showing the procedure for photographing the electronic component S1 being transported by the transport unit 15. Referring to Figure 12, the process shown in this flowchart is performed while the electronic component S1 is being transported from the index table 14 to the storage member 16. The photography by the second optical inspection camera 13 and the illumination of light by the lighting unit 17 are each performed in response to instructions via a hardware trigger, which is given in accordance with the arrival of the transport unit 15 at a predetermined position.

[0063] After the transfer of the electronic component S1 from the index table 14 to the storage member 16 begins, and the transfer unit 15 arrives at a predetermined position, the second optical inspection camera 13 and the illumination unit 17 perform a first image (step S100). That is, the second optical inspection camera 13 performs an image accompanied by the emission of light from the coaxial illuminator 17a and the ring illuminator 17c.

[0064] Subsequently, when the transport unit 15 arrives at another predetermined location, a second image is taken by the second optical inspection camera 13 and the illumination unit 17 (step S110). That is, the second optical inspection camera 13 takes an image accompanied by the illumination of the ring illuminator 17b. Each predetermined location is a location in which a desired number of electronic components S1 are included in the desired position in the captured image. The process shown in this flowchart is repeated until the first and second images for each electronic component S1 transported by the transport unit 15 are completed.

[0065] <3-2. Visual Inspection Procedure for Ball / Lead Surfaces of Semiconductor Components> Figure 13 is a flowchart showing the visual inspection procedure for electronic components S1 transported by the transport unit 15. Referring to Figure 13, the process shown in this flowchart is performed by the control unit 70 of the computer 50 as the first and second imaging are completed during the transport of the electronic components S1 from the index table 14 to the storage member 16.

[0066] The control unit 70 extracts an image of the target component from the first image which contains the electronic component S1 (hereinafter also referred to as the "target component") that is the subject of the visual inspection (step S200). As described above, the image captured by the second optical inspection camera 13 (for example, the first image) is a grayscale image, and the pixel value of each pixel is shown in 256 gradations. In the first image, the area of ​​the electronic component S1 is shown in black or gray, and the background of the electronic component S1 (circular component PC1b) is shown in white. In the first image, the left and right edges of the electronic component S1 in the first image are identified by scanning the pixel values ​​of each row and extracting pixels whose pixel values ​​change rapidly. In the first image, the top and bottom edges of the electronic component S1 in the first image are identified by scanning the pixel values ​​of each column and extracting pixels whose pixel values ​​change rapidly. As a result, if the first image contains an image of only one electronic component S1, the area of ​​the target component is identified. If the first image contains images of two electronic components S1, the position of the target component (left or right) in both the first and second images is stored in advance, and the region of the target component is identified according to that information.

[0067] The control unit 70 extracts an image of the target component from the second image which contains the target component (step S210). The extraction of the image of the target component from the second image is performed in the same manner as the extraction of the image of the target component from the first image. The control unit 70 performs the visual inspection performed using the first image by using the image of the target component extracted from the first image (step S220). The control unit 70 also performs the visual inspection performed using the second image by using the image of the target component extracted from the second image (step S230). The process shown in this flowchart is repeated until all visual inspections of each electronic component S1 transported by the transport unit 15 are completed.

[0068] [4. Features] As described above, in the cutting device 1 according to this embodiment, the first image is taken with illumination by the coaxial illuminator 17a and the ring illuminator 17c, and the second image is taken with illumination by the ring illuminator 17b. Therefore, with the cutting device 1, even if it is necessary to use different light intensity levels for the illuminators for the first and second images, it is not necessary to change the light intensity level of the illuminators between the first and second images. Thus, compared to cases where it is necessary to change the light intensity level of the illuminators between the first and second images, two types of images can be captured at high speed.

[0069] The inspection and storage module B1 is an example of a "visual inspection device" in the present invention. The electronic component S1 is an example of a "semiconductor member" in the present invention. The coaxial illuminator 17a is an example of a "first illuminator" in the present invention. The ring illuminator 17b is an example of a "second illuminator" in the present invention. The ring illuminator 17c is an example of a "third illuminator" in the present invention. The second optical inspection camera 13 is an example of an "imaging unit" in the present invention. The control unit 70 is an example of an "inspection unit" in the present invention. The cutting mechanism 6 is an example of a "cutting mechanism" in the present invention. The index table 14 is an example of a "table" in the present invention. The storage member 16 is an example of a "multiple storage members" in the present invention. The picker PC1 is an example of a "transporter" in the present invention.

[0070] [5. Other Embodiments] The concept of the above embodiments is not limited to those described above. Examples of other embodiments to which the concept of the above embodiments can be applied will be described below.

[0071] <5-1> In the above embodiment, ring illuminators 17b and 17c were provided as illuminators that illuminate the electronic component S1 held by the transport unit 15 from an oblique direction. However, the illuminators that illuminate the electronic component S1 held by the transport unit 15 from an oblique direction do not necessarily have to be ring illuminators. For example, the illuminators that illuminate the electronic component S1 held by the transport unit 15 from an oblique direction may be line illuminators.

[0072] Figure 14 is a schematic plan view showing a lighting unit including line illuminators. Referring to Figure 14, in this example, a line illuminator 17bA is provided instead of a ring illuminator 17b, and a line illuminator 17cA is provided instead of a ring illuminator 17c. Each of the line illuminators 17bA and 17cA irradiates light onto the electronic component S1 from an oblique direction inclined with respect to the normal direction of the electronic component S1. In the direction normal to the electronic component S1, the electronic component S1, line illuminator 17cA, line illuminator 17bA, and coaxial illuminator 17a are arranged in this order. Also, in a plan view, the coaxial illuminator 17a, line illuminator 17bA, and line illuminator 17cA are closest to the electronic component S1 in this order. Such a configuration is also acceptable.

[0073] <5-2> In the above embodiment, the appearance of the electronic component S1 cut by the cutting device 1 was inspected by using the second optical inspection camera 13 and the illumination unit 17. However, the objects of appearance inspection are not limited to this. For example, the appearance of a resin molded product (an example of a "semiconductor component") manufactured by a molding device may be inspected by using the second optical inspection camera 13 and the illumination unit 17.

[0074] <5-3> In the above embodiment, the coaxial illuminator 17a and the ring illuminator 17c emitted light in the first shot, and the ring illuminator 17b emitted light in the second shot. However, the combination of illuminators that emit light in each shot is not limited to this. For example, only the ring illuminator 17c may emit light in the first shot and only the ring illuminator 17b may emit light in the second shot; only the coaxial illuminator 17a may emit light in the first shot and only the ring illuminator 17b may emit light in the second shot; or both the coaxial illuminator 17a and the ring illuminator 17b may emit light in the first shot and the ring illuminator 17c may emit light in the second shot. In addition, another coaxial illuminator may be added, and different coaxial illuminators may emit light in the first and second shots, respectively.

[0075] <5-4> In the above embodiment, a tray for storing electronic components S1 was exemplified as the storage member 16. The tray, for example, has a plurality of recesses, and an electronic component S1 is stored in each of the plurality of recesses. However, the storage member 16 does not necessarily have to be a tray. The storage member 16 may be composed of, for example, an adhesive member including an adhesive sheet to which a plurality of electronic components S1 are attached. In this case, the plurality of electronic components S1 are stored in the adhesive member by being attached to the adhesive sheet.

[0076] Embodiments of the present invention have been described illustratively above. That is, a detailed description and accompanying drawings have been disclosed for illustrative purposes. Therefore, some of the components described in the detailed description and accompanying drawings may not be essential for solving the problem. Consequently, the mere fact that these non-essential components are described in the detailed description and accompanying drawings does not mean that they should be immediately assumed to be essential.

[0077] Furthermore, the above embodiments are merely illustrative in every respect of the present invention. The above embodiments can be improved or modified in various ways within the scope of the present invention. For example, at least a part of the configuration of one embodiment may be combined with at least a part of the configuration of any other embodiment. In other words, in carrying out the present invention, specific configurations can be appropriately adopted depending on the embodiment.

[0078] [6. Addendum] This specification discloses a variety of technical ideas, including at least the following technologies:

[0079] <Technology 1> (composition) An appearance inspection device for inspecting the appearance of one surface of a semiconductor material, Each of the first and second illuminators irradiates the semiconductor member with light from the direction normal to one surface of the semiconductor member, or from an oblique direction inclined with respect to the normal direction, The system includes an imaging unit for photographing the semiconductor component, The light intensity of each of the first and second illuminators can be adjusted individually. An appearance inspection apparatus in which the imaging unit continuously performs a first imaging, in which the semiconductor member is imaged with light irradiation from the first illuminator, and a second imaging, in which the semiconductor member is imaged with light irradiation from the second illuminator. (Effects, etc.) In this visual inspection device, the first image is taken with illumination from a first illuminator, and the second image is taken with illumination from a second illuminator, which is different from the first illuminator. Therefore, with this visual inspection device, even if it is necessary to use different light intensity levels for the first and second images, it is not necessary to change the light intensity level of the illuminator between the first and second images. As a result, two types of images can be captured at high speed compared to cases where it is necessary to change the light intensity level of the illuminator between the first and second images.

[0080] <Technology 2> (composition) The first illuminator irradiates the semiconductor member with light from the normal direction, The second illuminator irradiates the semiconductor member with light from an oblique direction tilted with respect to the normal direction, The system further includes a third illuminator that irradiates the semiconductor member with light from an oblique direction inclined with respect to the normal direction, The light intensity of each of the second and third illuminators can be adjusted individually. The appearance inspection apparatus according to Technical Reference 1, wherein the first photograph is further performed accompanied by irradiation with light from the third illuminator. (Effects, etc.) In this visual inspection apparatus, the first image is taken with illumination from the first and third illuminators, and the second image is taken with illumination from the second illuminator. Therefore, even if it is necessary to use different light intensity levels for the first and second images, this visual inspection apparatus does not require changing the light intensity level between the first and second images. As a result, it is possible to capture two types of images at high speed compared to cases where it is necessary to change the light intensity level between the first and second images.

[0081] <Technology 3> (composition) The light intensity of the second illuminator is pre-adjusted to the first light intensity. The light intensity of the third illuminator is pre-adjusted to the second light intensity. The first light intensity and the second light intensity are different from each other. The appearance inspection apparatus according to Technical Reference 2, wherein the imaging unit performs the first imaging and the second imaging continuously at a time interval shorter than the time interval required for the second illuminator to irradiate with light of the first light intensity, then change the light intensity to the second light intensity, and irradiate with light of the second light intensity. (Effects, etc.) In this visual inspection device, the second illuminator emits light at a first intensity, then changes the light intensity to a second intensity, and the first and second images are taken continuously at a time interval shorter than the time interval required for the second intensity light to be emitted. Therefore, this visual inspection device makes it possible to capture two types of images at a speed that cannot be achieved by using a single illuminator to capture two types of images.

[0082] <Technology 4> (composition) When the imaging unit is used to photograph the semiconductor component, Each of the first illuminator, the second illuminator, and the third illuminator is located below the semiconductor member. Of the first, second, and third illuminators, the lowest illuminator is closest to the semiconductor member in a plan view. The appearance inspection apparatus according to Technology 2 or Technology 3, wherein the uppermost of the first, second, and third illuminators is the one furthest from the semiconductor member in a plan view. (Effects, etc.) In this visual inspection apparatus, the lowest of the first, second, and third illuminators is closest to the semiconductor component in a plan view, and the highest of the first, second, and third illuminators is furthest from the semiconductor component in a plan view. Therefore, with this visual inspection apparatus, for example, the light irradiated onto the semiconductor component by the lower illuminator is less likely to be blocked by the upper illuminator.

[0083] <Technology 5> (composition) An appearance inspection apparatus according to any one of the technologies 1 to 4, wherein each of the first and second imaging is performed while the semiconductor component is moving. (Effects, etc.) In this visual inspection apparatus, the first and second images are taken while the semiconductor material is in motion. Therefore, with this visual inspection apparatus, the visual inspection of the semiconductor material and the transport of the semiconductor material are performed in parallel, which allows for faster manufacturing of semiconductor materials compared to cases where the first and second images are taken while the semiconductor material is stopped moving.

[0084] <Technology 6> (composition) Each of the first and second imaging is performed while the plurality of semiconductor members are moving in one direction. Each of the first image captured through the first imaging and the second image captured through the second imaging includes two or more of the semiconductor members. Parts of two or more of the semiconductor components included in the first image and parts of two or more of the semiconductor components included in the second image are common, The appearance inspection apparatus according to Technical Reference 5, further comprising an inspection unit for inspecting the appearance based on the first and second images. (Effects, etc.) In this visual inspection apparatus, when inspecting the appearance of multiple semiconductor components, each of the first and second images used for inspecting the appearance of the semiconductor components includes two or more semiconductor components that are partially common to each other. Therefore, with this visual inspection apparatus, when inspecting the appearance of multiple semiconductor components, the number of first and second images can be reduced compared to when each of the first and second images includes only one semiconductor component, thus enabling more efficient inspection of the appearance of multiple semiconductor components.

[0085] <Technology 7> (composition) An appearance inspection apparatus described in any one of Technology 1 to Technology 6, A cutting mechanism that cuts an object to be cut, thereby dividing the object into multiple semiconductor components, A table on which each of the plurality of semiconductor members is arranged, Multiple storage components, The system includes a transporter that holds one of the plurality of semiconductor members arranged on the table, moves the semiconductor member while holding it, and stores the held semiconductor member in one of the plurality of storage members, A cutting device in which the first and second imaging are performed while the transport body is moving. (Effects, etc.) In this cutting apparatus, the first and second images are taken while the semiconductor material is moving from the table to the storage component. Therefore, with this cutting apparatus, the inspection of the appearance of the semiconductor material and the transport of the semiconductor material are performed in parallel, which allows for faster manufacturing of semiconductor material compared to cases where the first and second images are taken while the semiconductor material is stopped moving.

[0086] <Technology 8> (composition) A method for manufacturing a semiconductor component using the cutting apparatus described in Technical 7, The process involves preparing the object to be cut, A method for manufacturing a semiconductor member, comprising cutting the object to be cut to separate the object into a plurality of semiconductor members. (Effects, etc.) In this semiconductor material manufacturing method, the first image is taken with light irradiation from a first illuminator, and the second image is taken with light irradiation from a second illuminator different from the first illuminator. Therefore, according to this semiconductor material manufacturing method, even if it is necessary to use different light intensity levels from the illuminators for the first and second images, it is not necessary to change the light intensity level of the illuminators between the first and second images. As a result, two types of images can be captured at a higher speed compared to methods where it is necessary to change the light intensity level of the illuminators between the first and second images. Consequently, this semiconductor material manufacturing method allows for faster manufacturing of semiconductor materials. [Explanation of Symbols]

[0087] 1 Cutting device, 3 Substrate supply unit, 4 Positioning unit, 4a Rail unit, 5 Cutting table, 5a Holding member, 5b Rotation mechanism, 5c Moving mechanism, 5d First position confirmation camera, 5e First cleaner, 6 Cutting mechanism, 6a Blade, 6b Second position confirmation camera, 6c Rotation axis, 6d Spindle unit, 7 Transport unit, 7a Second cleaner, 11 Flipper, 12 First optical inspection camera, 13 Second optical inspection camera, 13a Camera body, 13b Reflector, 14 Index table, 15 Transport unit, 15a Base, 16 Storage member, 16a Storage member for good products, 16b Storage member for defective products, 17 Lighting unit, 17a Coaxial illuminator, 17b, 17c Ring illuminator, 17bA, 17cA Line illuminator, 20 Monitor, 50 Computer, 70 Control unit, 72 CPU, 74 RAM, 76 ROM, 80 Storage unit, 81 Control program, 90 Input / Output I / F, 95 Reception unit, A1 Cutting module, B1 Inspection / Storage module, BL1 Ball terminal unit, C1 Observation axis, HM1 Half mirror, IM1-IM6 Captured image, LT1 Light-emitting element, M1 Magazine, OJ1 Target to be photographed, P1 Package substrate, PC1 Picker, PC1a Picker body, PC1b Circular component, PT1 Flat part, PT2 Uneven part, S1 Electronic component, ST1 Substrate part.

Claims

1. A cutting apparatus equipped with an appearance inspection device for inspecting the appearance of one surface of a semiconductor material, The aforementioned visual inspection device, A first illuminator that irradiates light onto the semiconductor member from the direction normal to one surface of the semiconductor member, A second illuminator that irradiates the semiconductor member with light from an oblique direction inclined with respect to the normal direction, It includes an imaging unit for photographing the semiconductor component, The light intensity of each of the first and second illuminators can be adjusted individually. The imaging unit continuously performs a first imaging operation, in which the semiconductor member is imaged with light irradiation from the first illuminator, and a second imaging operation, in which the semiconductor member is imaged with light irradiation from the second illuminator. The aforementioned appearance inspection device further includes an inspection unit that inspects the appearance based on a first image captured through the first shooting and a second image captured through the second shooting, A cutting mechanism that cuts an object to be cut, thereby dividing the object into multiple semiconductor components, A table on which each of the plurality of semiconductor members is arranged, Multiple storage members, including storage members for good products and storage members for defective products, Each further comprises at least one transporter that holds one of the plurality of semiconductor members arranged on the table, moves while holding the semiconductor member, and stores the held semiconductor member in one of the plurality of storage members, A cutting device in which each of the first and second imaging is performed while the movement of at least one transporter is in motion.

2. The visual inspection apparatus further includes a third illuminator that irradiates the semiconductor member with light from an oblique direction inclined with respect to the normal direction, The light intensity of each of the second and third illuminators can be adjusted individually. The cutting apparatus according to claim 1, wherein the first photograph is further performed accompanied by irradiation with light from the third illuminator.

3. The light intensity of the second illuminator is pre-adjusted to the first light intensity. The light intensity of the third illuminator is pre-adjusted to the second light intensity. The first light intensity and the second light intensity are different from each other. The cutting apparatus according to claim 2, wherein the imaging unit performs the first imaging and the second imaging continuously at a time interval shorter than the time interval required for the second illuminator to irradiate with light of the first light intensity, then change the light intensity to the second light intensity, and irradiate with light of the second light intensity.

4. When the imaging unit is used to photograph the semiconductor component, Each of the first illuminator, the second illuminator, and the third illuminator is located below the semiconductor member. Of the first, second, and third illuminators, the illuminator located at the bottom is closest to the semiconductor member in a plan view. The cutting apparatus according to claim 2, wherein the uppermost of the first, second, and third illuminators is the furthest from the semiconductor member in a plan view.

5. The at least one conveyor is a plurality of conveyors, Each of the first and second imaging is performed while the plurality of transporters are moving in one direction. Each of the first and second images includes two or more of the semiconductor members, The cutting apparatus according to claim 1, wherein a portion of two or more semiconductor members included in the first image and a portion of two or more semiconductor members included in the second image are common.

6. A method for manufacturing a semiconductor member using a cutting apparatus according to any one of claims 1 to 5, The process involves preparing the object to be cut, A method for manufacturing a semiconductor member, comprising cutting the object to be cut to separate the object into a plurality of semiconductor members.

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