Laminate for packaging containers with RFIC elements, packaging container, and method for manufacturing laminate for packaging containers.

Abstract

To provide an RFIC element-equipped packaging container laminate which has a beautiful metallic appearance and has an antenna with good accuracy in reading a modulated signal generated by the RFIC element, a packaging container, and a method for manufacturing the packaging container laminate.SOLUTION: In an RFIC element-equipped packaging container laminate 160, a base layer 121, an adhesive layer 122 partially laminated on one surface of the base layer 121, a conductor layer 123 having conductivity, and a peelable layer 124 provided in an area where the conductor layer 123 is provided and having peelability are laminated in this order. The conductor layer 123 comprises a first conductor unit 123a and a second conductor unit 123b electrically isolated from each other. In the conductor layer 123, an RFIC element 150 is provided at a position where the first conductor unit 123a and the second conductor unit 123b are arranged close to each other, using the first conductor unit 123a and the second conductor unit 123b as antennas.SELECTED DRAWING: Figure 6

Description

Technical Field

[0001] The present disclosure relates to a laminate for a packaging container with an RFIC element, a packaging container, and a method for manufacturing the laminate for a packaging container.

Background Art

[0002] In recent years, as non-contact short-range communication using radio waves or the like, IC tags using RFID (radio frequency identifier) technology have been used. For example, various articles and packaging containers of articles are circulated for transportation, sales, etc. with IC tags attached. In this case, if necessary, by holding the article in front of an external device (reader / writer), the article information recorded in the RFIC element of the IC tag can be read by non-contact communication and various information can be written into the RFIC element. Thereby, efficient logistics management becomes possible.

[0003] Conventionally, when using RFID technology in a packaging container, an IC tag was attached to the packaging container as described above. Also, for the purpose of reducing manufacturing costs, a form in which an RFIC element and an antenna pattern are directly provided on a packaging cardboard has been proposed in Patent Document 1. Patent Document 1 discloses a technique for printing an antenna pattern on a sheet serving as a base material by gravure printing, screen printing, inkjet printing, or the like.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, in the case of a configuration in which the antenna pattern is placed between two sheets, as disclosed in Patent Document 1, there was a problem in that the accuracy of reading the modulated signal generated by the RFIC element was significantly reduced in packaging containers with a beautiful metallic appearance, such as those with metal foil placed near the outermost surface.

[0006] This disclosure provides a laminate for packaging containers with an RFIC element, a packaging container, and a method for manufacturing a laminate for packaging containers, which have an attractive metallic appearance and an antenna with good reading accuracy of the modulated signal generated by the RFIC element, by using a conductive layer with a metallic luster placed near the outermost surface of the packaging container as an antenna. In other words, by forming a gap in the conductive layer located near the outermost surface of the packaging container, and providing a slit structure that divides the conductive layer into two or more conductive layers, a packaging container is provided that has an antenna capable of receiving signals from a reader / writer while maintaining a beautiful metallic appearance. Furthermore, compared to printing methods such as gravure printing, screen printing, and inkjet printing, packaging containers modified by hot stamping of metal vapor-deposited films have high gloss and superior design. However, the pressure during the thermal transfer process causes fine cracks to form in the metal film, impairing reading accuracy due to changes in resistance. This disclosure further provides a method for manufacturing a laminate for packaging containers that suppresses crack formation in the conductive layer and improves the reading accuracy of the modulated signal generated by the RFIC element. [Means for solving the problem]

[0007] This disclosure solves the aforementioned problems by the following solutions. For ease of understanding, the embodiments of this disclosure will be described using corresponding reference numerals, but are not limited thereto.

[0008] The first disclosure describes a material in which a base layer (121), an adhesive layer (122) partially laminated on one side of the base layer (121), a conductive conductor layer (123), and a release layer (124) provided in the region where the conductive layer (123) is located are laminated in this order, and the conductive layer (123) comprises electrically isolated first conductive portions (123a, 223a, 323a, 423a) and second conductive portions (123b, 223b, 323b, 423b) The laminate (160) for packaging containers with RFIC elements is provided, wherein the conductive layer (123) has RFIC elements (150) that are directly or capacitively coupled to the first conductive parts (123a, 223a, 323a, 423a) and the second conductive parts (123b, 223b, 323b, 423b) arranged in close proximity to the first conductive parts (123a, 223a, 323a, 423a) and the second conductive parts (123b, 223b, 323b, 423b).

[0009] The second disclosure is a laminate (160) for a packaging container with an RFIC element as described in the first disclosure, wherein the thickness of the conductive layer (123) comprising a first conductive portion (123a, 223a, 323a, 423a) and a second conductive portion (123b, 223b, 323b, 423b) is 15 nm or more and 100 nm or less.

[0010] The third disclosure is a laminate (160) for packaging containers with RFIC elements described in the first or second disclosure, wherein the surface smoothness (JIS P 8155) of the base layer (121) is 20 seconds or more.

[0011] The fourth disclosure is a laminate (160) for a packaging container with an RFIC element, as described in any of the first to third disclosures, wherein at least one printed layer (125a, 125b) is laminated on a surface side further than the release layer (124).

[0012] The fifth disclosure is a laminated packaging container (160) with an RFIC element, as described in any of the first to fourth disclosures, wherein the laminated packaging container can be assembled into a box shape by folding it at predetermined positions, and has lid portions (104, 105) that can be opened and closed to close the opening of the box shape, and flap portions (107, 108, 109, 110) that are folded inward from the lid portions (104, 105), and terminal portions for connecting the RFIC element (150) are provided on the flap portions (107, 108, 109, 110).

[0013] The sixth disclosure is a laminate (160) for packaging containers with RFIC elements, as described in any of the first to fifth disclosures, wherein the RFIC element (150) is an RFIC element (150) that includes an impedance matching circuit.

[0014] The seventh disclosure is a laminate (160) for a packaging container with an RFIC element, as described in any of the first to sixth disclosures, wherein the conductive layer (123) is laminated in a region where the adhesive layer (122) is provided, and the adhesive layer (122) has a marginal zone (122c) formed in at least a portion of its outer periphery.

[0015] The eighth disclosure is a laminate (160) for packaging containers with RFIC elements as described in the seventh disclosure, wherein the antenna formed by the first conductive portion (123a, 223a, 323a, 423a) and the second conductive portion (123b, 223b, 323b, 423b) has a slit structure with an elongated groove-shaped gap, and when the direction substantially parallel to the slit of the antenna is defined as the first direction and the direction substantially perpendicular to the slit is defined as the second direction, the width of the marginal zone (122c) along the first direction is smaller than the width of the marginal zone (122c) along the second direction.

[0016] The ninth disclosure is a packaging container (1, 2, 3, 4) assembled from a laminate (160) for packaging containers with RFIC elements described in any of the first to tenth disclosures.

[0017] The tenth disclosure is a method for manufacturing a laminate (160) for a packaging container with an RFIC element as described in any of the first to eighth disclosures, comprising: an adhesive layer printing step of printing the adhesive layer (122) onto the base layer (121); a conductive layer lamination step of laminating a conductive layer (123) laminated on a release sheet via the release layer (124) onto the adhesive layer (122); a step of curing or drying the adhesive layer (122); and a peeling step of peeling off the release sheet.

[0018] The eleventh disclosure is a method for manufacturing a laminate (160) for packaging containers with RFIC elements as described in the tenth disclosure, wherein the adhesive layer printing step is to print the adhesive layer (122) by flexographic printing.

[0019] The twelfth disclosure is a method for manufacturing a laminate (160) for a packaging container with an RFIC element as described in any of the first to sixth disclosures, comprising: a conductive layer lamination step of laminating a conductive layer (123) and an adhesive layer (122), which are laminated on a release sheet via a release layer (124), onto a base layer (121); and a peeling step of peeling off the release sheet.

[0020] The 13th disclosure is a method for manufacturing a laminate (160) for packaging containers with RFIC elements as described in the 8th disclosure, wherein the adhesive layer (122) is printed along the first direction. [Effects of the Invention]

[0021] According to the present disclosure, it is possible to provide a laminate for a packaging container with an RFIC element, a packaging container, and a method for manufacturing the laminate for a packaging container, which have a beautiful metallic appearance and good reading accuracy of a modulation signal generated by the RFIC element.

Brief Description of the Drawings

[0022] [Figure 1] It is a perspective view showing the packaging container 1 of the first embodiment. [Figure 2] It is a developed view of the laminate 100 for a packaging container for assembling the packaging container 1 of the first embodiment. [Figure 3] It is a cross-sectional view obtained by cutting the laminate 100 for a packaging container at the position of the arrow A-A in FIG. 2. [Figure 4] It is a view showing the manufacturing process of the laminate 100 for a packaging container. [Figure 5] It is a view showing the manufacturing process of the laminate 100 for a packaging container. [Figure 6] It is a view showing the laminate 160 for a packaging container with an RFIC element. [Figure 7] It is a perspective view showing the packaging container 2 of the second embodiment. [Figure 8] It is a developed view of the laminate 200 for a packaging container for assembling the packaging container 2 of the second embodiment. [Figure 9] It is a perspective view showing the packaging container 3 of the third embodiment. [Figure 10] It is a developed view of the laminate 300 for a packaging container for assembling the packaging container 3 of the third embodiment. [Figure 11] It is a perspective view showing the packaging container 4 of the fourth embodiment. [Figure 12] It is a developed view of the laminate 400 for a packaging container for assembling the packaging container 4 of the fourth embodiment.

Modes for Carrying Out the Invention

[0023] Hereinafter, the best mode for carrying out the present disclosure will be described with reference to the drawings and the like.

[0024] (First Embodiment) Figure 1 is a perspective view showing the packaging container 1 of the first embodiment. Figure 2 is an unfolded view of the laminated body 100 for packaging containers used to assemble the packaging container 1 of the first embodiment. Figure 2 shows an example of an inverted sack shape, but other shapes such as straight sack, seal end, auto bottom, and lock bottom are also possible. The unfolded view in Figure 2 is shown as viewed from the surface side of the packaging container 1. In the unfolded views such as Figure 2, mountain folds are indicated by dashed lines. Furthermore, "mountain fold" refers to the direction of the fold when viewed from the surface side, as in the unfolded view in Figure 2. Furthermore, in the following explanation, we will use the front / back, left / right, and up / down directions indicated by arrows in Figure 1, but this does not mean that the orientation of the packaging container 1 when in use is limited to these orientations. The following figures, including Figures 1 and 2, are schematic representations, and the size and shape of each part have been exaggerated or omitted as appropriate to facilitate understanding. Furthermore, the following explanation will include specific numerical values, shapes, materials, etc., but these may be changed as appropriate.

[0025] Packaging container 1 can be used as an outer box for storing various products and displaying them for sale in stores, etc., and also has an RFIC (Radio Frequency Integrated Circuit) element directly mounted on it, as described later, and also functions as an RFID device. As shown in Figure 2, the packaging container 1 is composed of a single sheet-like laminated packaging container 100. The layer structure of the laminated packaging container 100 will be described later. The packaging container 1 is configured as a roughly rectangular box shape, comprising a front 101, a back 103, a top 104a, a bottom 105a, a left side 102, and a right side 106. The inside of this box serves as a storage area for goods and other items.

[0026] The front surface 101 is located on the front side of the packaging container 1. A glued portion 111 is connected to the right side of the front surface 101 via a fold line L1. This glued portion 111 is glued to the inner surface of the right side surface 106, which will be described later, thereby forming the box shape of the packaging container 1. In the following explanation, "connected" refers to the fact that each part is connected to the others, as shown in the unfolded diagram in Figure 2. The left side 102 is connected to the left edge of the front 101 via a fold line L2 that is formed by a mountain fold. The top lid portion 104 is connected to the upper edge of the front surface 101 via a fold line L6 that is folded in a mountain shape.

[0027] The left side 102 is connected to the front 101 via a fold line L2 that is formed by a mountain fold. The upper left flap portion 107 is connected to the upper edge of the left side surface 102 via a fold line L3 that is folded in a mountain fold. The upper left flap portion 107 closes together with the upper surface 104a when the upper cover portion 104, which closes the opening in an openable and closable manner, is closed, and is folded inward into the upper cover portion 104. The lower left flap portion 108 is connected to the lower edge of the left side surface 102 via a fold line L4 that is folded in a mountain fold. The lower left flap portion 108 closes together with the lower surface 105a when the lower cover portion 105, which closes the opening in an openable and closable manner, is closed, and is folded inward into the lower cover portion 105. The rear edge of the left side 102 is connected to the back surface 103 via a fold line L5 that is folded in a mountain fold.

[0028] The back surface 103 is connected to the left side surface 102 via a fold line L5 that is folded in a mountain fold. The lower edge of the back surface 103 is connected to the lower cover portion 105 via a fold line L7 that is folded in a mountain fold. The right side of the back surface 103 is connected to the right side surface 106 via a fold line L8 that is formed by a mountain fold.

[0029] The top cover portion 104 comprises an upper surface 104a and an upper insertion piece 104b. The top surface 104a is connected to the front surface 101 via a fold line L6, and the upper insertion piece 104b is connected to the top surface 104a via a fold line L9. When the upper insertion piece 104b is inserted into the inside of the packaging container 1, the top surface 104a closes the upper opening of the packaging container 1.

[0030] The lower cover portion 105 comprises a lower surface 105a and a lower insertion piece 105b. The bottom surface 105a is connected to the back surface 103 via a fold line L7, and the bottom insertion piece 105b is connected to the bottom surface 105a via a fold line L10. When the bottom insertion piece 105b is inserted into the inside of the packaging container 1, the bottom surface 105a closes the lower opening of the packaging container 1.

[0031] The right side 106 is connected to the back surface 103 via a fold line L8 that is formed by a mountain fold. The upper right side 106 is connected to the upper right flap portion 109 via a fold line L11 that is folded in a mountain fold. The upper right flap portion 109 closes together with the upper surface 104a when the top lid portion 104 is closed, and folds inward into the top lid portion 104. The lower right flap portion 110 is connected to the lower edge of the right side surface 106 via a fold line L12 that is folded in a mountain fold. The lower right flap portion 110 closes together with the bottom surface 105a when the bottom cover portion 105 is closed, and is folded inward into the bottom cover portion 105. The adhesive portion 111 is glued to the inner surface of the right side surface 106.

[0032] The adhesive portion 111 is connected to the front surface 101 via a fold line L1. The adhesive portion 111 is also glued to the inner surface of the right side surface 106.

[0033] In the first embodiment, the packaging container 1 has a conductive layer 123 visibly provided over substantially the entire surface. The conductive layer 123 has a first conductive portion 123a and a second conductive portion 123b that are electrically isolated from each other. In the packaging container 1 of the first embodiment, the gap (slit) 126 between the first conductive portion 123a and the second conductive portion 123b is configured as a long, narrow straight line with a width of approximately 2 mm. This is intended to increase the area of ​​the conductive layer 123 that is visible as part of the exterior of the packaging container 1. With this configuration, substantially the entire exterior of the packaging container 1 can have a beautiful metallic appearance.

[0034] As described above, in this embodiment, the packaging container 1 is intended to have a design with many metallic glossy surfaces on its exterior, so the gaps 126 are configured to be close together. However, the greater the distance between the first conductive part 123a and the second conductive part 123b (the width of the gap 126), the better the antenna characteristics and the easier the manufacturing process becomes. Therefore, the gap 126 is not limited to the elongated straight shape exemplified in the first embodiment. For example, the gap 126 may be wider than in this embodiment, or it may be provided in a wavy or bent shape, or it may not be provided in a linear shape at all. Furthermore, in this embodiment, the area of ​​the first conductive portion 123a is the same as that of the second conductive portion 123b. However, the areas of the first conductive portion 123a and the second conductive portion 123b may be different.

[0035] Furthermore, as described above, the first conductive portion 123a and the second conductive portion 123b are electrically completely separated in the state of the laminated packaging container 100. On the other hand, in the state of the laminated packaging container 160 with the RFIC element and the packaging container 1, the RFIC element 150 is mounted in a manner that is directly or capacitively coupled to both the first conductive portion 123a and the second conductive portion 123b. Here, direct coupling refers to a state in which the conductive terminal portion provided on the RFIC element is in direct contact with the first conductive portion or the second conductive portion. Capacitive coupling refers to a state in which the conductive terminal portion provided on the RFIC element is coupled to the first conductive portion or the second conductive portion via a dielectric thin film that does not conduct electricity. In the state of the packaging container 1, the first conductive portion 123a and the second conductive portion 123b function as antennas for wireless communication with an external reader / writer. Furthermore, by including an impedance matching circuit in the RFIC element, the antenna formed by the first conductive part 123a and the second conductive part 123b becomes able to efficiently capture the power emitted by the reader / writer.

[0036] Figure 3 is a cross-sectional view of the laminated packaging container 100 cut at the position indicated by arrow AA in Figure 2. The top of Figure 3 is the surface side. The laminated packaging container 100 is constructed by laminating a base layer 121, an adhesive layer 122, a conductive layer 123, a release layer 124, a visible printing layer 125a, and a protective printing layer 125b in this order. Note that "laminated in this order" only indicates the order in which the layers are laminated, and is not limited to a form in which the layers are directly stacked on top of each other, but also includes cases where other layers are laminated in between so that each layer is laminated in the same order. Therefore, for example, a printing layer or a coating layer may be provided between the base layer 121 and the adhesive layer 122.

[0037] The base layer 121 can be made of cardboard, card stock, or other thick paper, for example. However, the paper material usable for the packaging container 1 is not limited to the above; any paper material that can maintain its shape even when filled with contents such as goods may be selected. Furthermore, the base layer 121 is not limited to paper; a sheet-like material made of resin may also be used. The thickness of the base layer 121 is 0.1 mm to 1.0 mm, or the basis weight (weight per unit area) of the base layer 121 is 100 g / m². 2 More than 700g / m 2 The following conditions are desirable for maintaining the carton shape. Here, it is desirable that the surface of the base material layer 121 (the surface when assembled into the packaging container 1, and the side on which the adhesive layer 122 etc. is laminated) be smooth in order to suppress the occurrence of pinholes and cracks in the conductive layer 123 and to achieve a beautiful glossy finish. More specifically, it is desirable that the surface of the base material layer 121 has a smoothness (JIS P 8155) of 20 seconds or more, and more preferably 40 seconds or more, before the adhesive layer 122 etc. is laminated.

[0038] The adhesive layer 122 is partially laminated on the surface side of the substrate layer and is formed of varnish or heat sealant. As the varnish, for example, FD IF Adhesive 1 manufactured by Toyo Ink Co., Ltd. can be used, and as the heat sealant, for example, PETHP65 adhesive varnish manufactured by Toyo Ink Co., Ltd. can be used. For electrical properties and foil transfer suitability, it is desirable that the thickness of the adhesive layer 122 be between 1 μm and 50 μm.

[0039] The conductive layer 123 is laminated in the region where the adhesive layer 122 is provided. The conductive layer 123 is composed of a conductive metal foil such as gold, silver, aluminum, tin, copper, brass, iron, and their alloys. The conductive layer 123 is a transfer foil formed by transfer through a conductive layer lamination process described later, and is a metal foil formed by metal vapor deposition or the like. As explained earlier, the conductive layer 123 has a first conductive portion 123a and a second conductive portion 123b that are electrically isolated from each other. Furthermore, the conductive layer 123 is provided with a terminal portion 123c for connecting the RFIC element 150 using the first conductive portion 123a and the second conductive portion 123b as antennas, located in close proximity to each other. The thickness of the conductive layer 123 is preferably 15 nm to 100 nm for optimal electrical properties and foil transfer suitability. Moreover, by setting the thickness of the conductive layer 123 to 15 nm to 50 nm, the transmittance of UV light is increased, allowing the use of a UV-curing resin that hardens upon UV irradiation in the adhesive layer 122, enabling adhesion between the conductive layer 123 and the substrate 121 without heating, which is even more preferable. In this embodiment, the terminal portion 123c is provided on the adhesive portion 111. As a result, when the packaging container 1 is formed, the RFIC element 150 is not exposed on the exterior, and a beautiful metallic appearance can be provided to the entire packaging container 1.

[0040] The release layer 124 is laminated on the conductive layer 123 in the region where the conductive layer 123 is provided, and is therefore peelable. The release layer 124 is laminated with the conductive layer 123 in the state of a transfer sheet 130 in order to facilitate the peeling of the release sheet 131 in the peeling process described later. The release layer 124 can be formed using a methacrylic resin, a modified acrylic resin, etc. The thickness of the release layer 124 is preferably 10 μm or less for electrical properties. Furthermore, if it is 0.1 μm or more, the release layer 124 will not be partially missing, and a stable layer can be formed. The presence of the release layer 124 makes it possible to manufacture the conductive layer 123 by transfer.

[0041] The visible printing layer 125a is provided on the release layer 124 and is printed with colored ink that is visible to the naked eye. In this embodiment, the visible printing layer 125a is provided on the front 101 and back 103, illustrating an example of displaying the letters "ABC" in a visible manner. The visible printing layer 125a is not limited to letters; it may also be a pattern or a combination of letters and patterns. Furthermore, the visible printing layer 125a may be provided using more ink, or multiple layers may be stacked on top of each other.

[0042] The protective printing layer 125b is provided on top of the release layer 124 and the visible printing layer 125a, and is printed using transparent ink. The protective printing layer 125b has functions such as protecting the conductive layer 123 and adjusting the surface gloss. For appearance (transparency), it is desirable that the thickness of the protective printing layer 125b be between 1 μm and 50 μm.

[0043] Next, we will describe the manufacturing method when varnish is used in the adhesive layer of the packaging container 1 of this embodiment. First, the manufacturing method for the laminated body 100 for packaging containers will be explained. Figures 4 and 5 show the manufacturing process of the laminated packaging container 100. In practice, the manufacturing process for the laminated packaging container 100 involves continuously producing it using a long base material layer 121 as the raw material, along with a relief printing plate H or a long transfer sheet 130. However, for the sake of easier understanding, this explanation will use a diagram showing the laminate in a flat form.

[0044] First, an adhesive is printed to form an adhesive layer 122 on one side of the base layer 121 (Figures 4(a) to 4(c)) (adhesive layer printing process). More specifically, an adhesive is printed to form an adhesive layer 122 on one side of the base layer 121 by flexographic printing using a resin relief plate H. It is preferable to use a UV-curing varnish as the adhesive. In this embodiment, FD IF Adhesive 1 manufactured by Toyo Ink Co., Ltd. was used as the adhesive.

[0045] Flexographic printing is a type of relief printing in which, as shown in Figures 4(a) and 4(b), an uncured adhesive is placed on a relief plate H and pressed onto a substrate layer 121. At this time, a marginal zone 122c (described later) is formed at the edge of the relief plate H. The marginal zone 122c remains even after the relief plate is removed from the substrate layer 121. In the example shown in Figures 4(b) and 4(c), the marginal zone 122c is formed at the end of the portion where the first adhesive layer region 122a and the second adhesive layer region 122b face each other.

[0046] Next, a conductive layer lamination process is performed in which the conductive layer 123 is laminated onto the adhesive layer 122 while the adhesive forming the adhesive layer 122 is still in an uncured state. More specifically, a transfer sheet 130 is prepared in which a release sheet 131, a release layer 124, and a conductive layer 123 are laminated in that order. Then, the transfer sheet 130 is laminated in a direction in which the conductive layer 123 is in contact with the adhesive layer 122 (Figure 5(d)).

[0047] With the conductive layer 123 and the adhesive layer 122 in contact, the adhesive layer 122 is cured (Figure 5(e)). In this embodiment, since a UV-curing varnish is used for the adhesive layer 122, ultraviolet light is irradiated from the transfer sheet 130 side. The ultraviolet light penetrates the transfer sheet 130 and reaches the adhesive layer 122, curing the adhesive layer 122. In this embodiment, an example of curing the adhesive layer 122 has been described, but the adhesive layer 122 may also be dried.

[0048] After the adhesive layer 122 has hardened, a peeling step is performed to peel off the release sheet 131 (Figure 5(f)). At this time, the conductive layer 123 remains on the substrate layer 121 side because it is bonded to the adhesive layer 122. Although the conductive layer 123 is laminated with the release sheet 131 via the release layer 124, the release layer 124 remains on top of the conductive layer 123 because the bonding force between the conductive layer 123 and the release sheet 131 is stronger (Figure 5(g)). By performing the peeling step, the conductive layer 123 is torn at the edge of the marginal zone where the first adhesive layer region 122a and the second adhesive layer region 122b face each other, forming the first conductive portion 123a and the second conductive portion 123b.

[0049] In this embodiment, an adhesive layer 122 (first adhesive layer region 122a and second adhesive layer region 122b) was formed using the above-described flexographic printing method, and a conductive layer 123 (first conductive portion 123a and second conductive portion 123b) was formed by transferring the conductive layer 123 onto it. With this manufacturing method, in this embodiment, the conductive layer 123 can have a beautiful metallic appearance and good antenna characteristics.

[0050] In this embodiment, the antenna formed by the first conductive portion 123a and the second conductive portion 123b has a slit structure that forms an elongated groove-shaped gap. When the direction substantially parallel to the slit (gap portion 126) of this antenna is defined as the first direction, and the direction substantially perpendicular to the slit is defined as the second direction, the width of the marginal zone along the first direction is smaller than the width of the marginal zone along the second direction. This is a characteristic that arises from printing the adhesive layer along the first direction. By making the width of the marginal zone in the first direction along the slit smaller than the width in the second direction perpendicular to the slit, the first conductive portion 123a and the second conductive portion 123b are less likely to come into partial proximity. As a result, unwanted parasitic capacitance formed between the first conductive portion 123a and the second conductive portion 123b is reduced, further improving the antenna characteristics. In this embodiment, the marginal zone along the second direction is formed in the adhesive portion 111 in the example shown in Figure 2. Furthermore, the width of the marginal zone mentioned above originally represents the dimensional difference between the shape of the relief plate H and the formed conductive portion 123, but for simplicity, it can be substituted with the line edge roughness (width of the undulation) of the edge of the conductive portion 123.

[0051] The transfer method described above is also called cold stamping, and it performs the transfer without heating. Another transfer method that differs from cold stamping is hot stamping, which involves heating, and either method can be selected. However, with hot stamping, the heat and pressure during processing can form fine cracks in the conductive layer 123, which may impair reading accuracy due to changes in resistance, so cold stamping is preferable.

[0052] Furthermore, even with cold stamping, using flexographic printing for printing the adhesive layer 122 is important for giving the conductive layer 123 a beautiful metallic appearance and for improving antenna characteristics. In addition to flexographic printing, other methods such as offset printing and inkjet printing can be used for printing cold stamps. However, if the adhesive layer 122 is printed using other printing methods such as offset printing or inkjet printing, the adhesive layer 122 cannot be applied uniformly and stably over a wide area. As a result, the transferred conductive layer 123 will have many minute pinholes and many minute cracks connecting the pinholes. The presence of pinholes and cracks not only results in cosmetic defects, but also changes the resistance value of the conductive layer 123 that forms the antenna, making it impossible to satisfy the desired characteristics as an antenna. Moreover, in the conductive layer lamination process that follows flexographic printing, the pressure can be reduced, thus reducing the risk of damaging the conductive layer 123. Therefore, it is desirable to use flexographic printing for printing the adhesive layer 122.

[0053] When flexographic printing is used to print the adhesive layer 122, a marginal zone 122c is formed in a part of the outer periphery. The marginal zone 122c is a characteristic region that occurs when relief printing is performed. The marginal zone 122c is slightly thicker (for example, about 1 μm to 2 μm) and raised compared to other areas of the adhesive layer 122. Also, the inner part of the marginal zone 122c is often formed with a slightly thinner layer thickness, as shown in Figure 3. Even after the completion of the laminate for the packaging container 100 and the packaging container 1, the conductive layer 123 and release layer 124 on top of it may also be transferred along roughly the shape of the marginal zone 122c, and its presence can be easily confirmed by observation using a magnifying glass or the like. The marginal zone 122c is provided on the outer periphery of the first adhesive layer region 122a and the second adhesive layer region 122b. However, for example, the lower end of the front surface 101 and the upper end of the back surface 103 are cut when the laminated packaging container 100 is separated into individual pieces, so the marginal zone 122c is not provided at these points.

[0054] In the state shown in Figure 5(g), by performing necessary printing such as the visible printing layer 125a and the protective printing layer 125b on the release layer 124, the laminated body 100 for packaging containers as shown in Figures 2 and 3 is completed. Note that the visible printing layer 125a and the protective printing layer 125b are not printed on the terminal portion 123c.

[0055] Figure 6 shows a laminate 160 for packaging containers with RFIC elements. Once the laminated packaging container 100 is completed, the RFIC element 150 is then connected and fixed to the terminal portion 123c using a conductive adhesive or the like, thereby completing the laminated packaging container 160 with the RFIC element. In this embodiment, the RFIC element 150 includes an impedance matching circuit.

[0056] Finally, by folding each fold line at the designated position and gluing the adhesive portion 111 to the inner surface of the right side 106, and closing the top lid portion 104 and the bottom lid portion 105, the packaging container 1 shown in Figure 1 is completed.

[0057] As described above, according to this embodiment, it is possible to provide a laminated packaging container 100 having a beautiful metallic appearance and equipped with an antenna with good antenna characteristics, a laminated packaging container 160 with an RFIC element, a packaging container 1, and a method for manufacturing the laminated packaging container 100. Furthermore, according to the manufacturing method described above, the laminate for packaging containers 100, the laminate for packaging containers with RFIC elements 160, and the packaging container 1 can be manufactured inexpensively and stably using conventional printing equipment. Furthermore, since the RFIC element 150 is mounted on the packaging container 1 itself, there is no need to prepare an IC tag separately from the packaging container or to attach the IC tag to the packaging container. Furthermore, because it is difficult to separate the RFID function from the packaging container 1, there is no risk of the IC tag falling off during product distribution or in-store display, or of malicious third parties replacing or counterfeiting it. Furthermore, despite the packaging container 1 having a metallic appearance for improved aesthetics, the antenna sensitivity is not reduced due to adverse effects from conductive materials such as the metal vapor deposition layer that constitute the metallic appearance.

[0058] (Second Embodiment) Figure 7 is a perspective view showing the packaging container 2 of the second embodiment. Figure 8 is an unfolded view of the laminated body 200 for assembling the packaging container 2 of the second embodiment. The unfolded view in Figure 8 is shown as a view of the front side of the packaging container 2. The packaging container 2 of the second embodiment has the same form as the packaging container 1 of the first embodiment, except that the lengths of each side are different, and the manufacturing method is also the same, including the manufacturing method of the first conductive part 223a and the second conductive part 223b. Therefore, the redundant explanation of the parts that perform the same function as in the first embodiment described above will be omitted.

[0059] The packaging container 2 of the second embodiment has a roughly rectangular parallelepiped shape that is elongated in the vertical direction, as shown in Figures 7 and 8. The areas of the first conductive portion 223a and the second conductive portion 223b are the same, but they may be different. The packaging container 2 of this second embodiment can achieve the same effects as the first embodiment.

[0060] (Third embodiment) Figure 9 is a perspective view showing the packaging container 3 of the third embodiment. Figure 10 is an unfolded view of the laminated body 300 for assembling the packaging container 3 of the third embodiment. The unfolded view in Figure 10 is shown as a view of the front side of the packaging container 3. The packaging container 3 of the third embodiment has the same form as the first embodiment, except that the arrangement of the first conductive part 323a and the second conductive part 323b differs from that of the first conductive part 223a and the second conductive part 223b of the packaging container 1 of the first embodiment. Therefore, the redundant explanation of the parts that perform the same functions as those of the first embodiment described above will be omitted.

[0061] In the third embodiment, the first conductive portion 323a and the second conductive portion 323b are provided only in the adhesive portion 111 and not in any other part of the laminated packaging container 300. In this embodiment, the areas of the first conductive portion 323a and the second conductive portion 323b are the same. However, the areas of the first conductive portion 323a and the second conductive portion 323b may be different.

[0062] In the third embodiment, the packaging container 3 is configured such that the first conductive portion 323a and the second conductive portion 323b are provided only in the adhesive portion 111. Therefore, the presence of the antenna is not noticed by the user, and a design other than metallic can be provided on the exterior of the packaging container 3. Furthermore, since the packaging container 3 of the third embodiment is manufactured by the same manufacturing method as in the first and second embodiments, the first conductive portion 323a and the second conductive portion 323b can be made into antennas with good antenna characteristics.

[0063] (Fourth Embodiment) Figure 11 is a perspective view showing the packaging container 4 of the fourth embodiment. Figure 12 is an unfolded view of the laminated body 400 for assembling the packaging container 4 of the fourth embodiment. The unfolded view in Figure 12 is shown as a view of the front side of the packaging container 4. The packaging container 4 of the fourth embodiment has the same form as the packaging container 3 of the third embodiment, except that the lengths of each side are different, and the manufacturing method is also the same, including the manufacturing method of the first conductive part 423a and the second conductive part 423b. Therefore, the redundant explanation of the parts that perform the same function as the third embodiment described above will be omitted.

[0064] The packaging container 4 of the fourth embodiment has a roughly rectangular parallelepiped shape that is elongated in the vertical direction, as shown in Figures 11 and 12. The areas of the first conductive portion 423a and the second conductive portion 423b are the same, but they may be different. In addition, the packaging container 4 of the fourth embodiment is provided with a terminal portion 423c, similar to the third embodiment. This packaging container 4 of the fourth embodiment can achieve the same effects as the third embodiment.

[0065] (Transformed form) The embodiments described above are not limited to those described above, and various modifications and changes are possible, which are also within the scope of this disclosure.

[0066] (1) In each embodiment, a rectangular parallelepiped packaging container was described as an example, but the invention is not limited to this, and may be a prism-shaped packaging container with other polygons as its base, such as a triangular prism or a pentagonal prism, or a columnar packaging container, such as a cylindrical or elliptical prism. Furthermore, the shape of the packaging container is not limited to the above, and may be a more complex shape such as a quadrilateral pyramidal shape or a cone shape, or any shape that can be constructed by assembling a sheet-like base material.

[0067] (2) Each embodiment has been described with an example of providing a printed layer. However, the description is not limited to this, and for example, the printed layer may be omitted.

[0068] (3) In each embodiment, the terminal portions 123c, 223c, 323c, and 423c were described in an example where they are provided on the adhesive portion 111. However, the invention is not limited to this, and for example, the terminal portions 123c, 223c, 323c, and 423c may be provided on the upper left flap portion 107 or the lower right flap portion 110, or other flap portions.

[0069] While each embodiment and its variations can be used in combination as appropriate, a detailed explanation is omitted. Furthermore, this disclosure is not limited to the embodiments described above. [Explanation of symbols]

[0070] 1, 2, 3, 4 Packaging container 100 Laminates for packaging containers 101 Front 102 Left side 103 Back 104 Top lid 104a Top side 104b Upper insert piece 105 Lower lid part 105a Bottom side 105b Lower insert piece 106 Right side 107 Upper left flap section 108 Lower left flap section 109 Upper right flap section 110 Lower right flap section 111 Adhesive part 121 Base material layer 122 Adhesive layer 122a 1st adhesive layer area 122b 2nd adhesive layer area 122c Marginal Zone 123 Conductive layer 123a First conductive part 123b Second conductor part 123c terminal section 124 Exfoliation layer 125a Visible printing layer 125b Protective printing layer 126 Gap 130 Transfer Sheets 131 Release sheet 150 RFIC elements 160 Laminates for packaging containers 200 Laminates for packaging containers 223a First conductor part 223b Second conductor part 223c terminal section 300 Laminates for packaging containers 323a First conductive part 323b Second conductor part 323c terminal section 400 Laminates for packaging containers 423a First conductive part 423b Second conductor part 423c terminal section

Claims

1. A base layer and An adhesive layer partially laminated on one side of the substrate layer, A conductive layer having electrical conductivity, A release layer having peelability is provided in the region where the conductive layer is provided, They are stacked in this order, The conductive layer is laminated in the region where the adhesive layer is provided. The adhesive layer has a marginal zone formed in at least a portion of its outer periphery. The conductive layer comprises a first conductive portion and a second conductive portion that are electrically isolated from each other. A laminate for a packaging container with an RFIC element, wherein the conductive layer has an RFIC element that is directly or capacitively coupled to the first conductive portion and the second conductive portion at a position where the first conductive portion and the second conductive portion are arranged in close proximity.

2. In the laminate for packaging containers with RFIC elements according to claim 1, A laminate for packaging containers with RFIC elements, comprising a first conductive portion and a second conductive portion, wherein the thickness of the conductive layer is 15 nm or more and 100 nm or less.

3. In the laminate for packaging containers with RFIC elements according to claim 1 or claim 2, A laminate for packaging containers with RFIC elements, wherein the surface smoothness (JIS P 8155) of the base layer is 20 seconds or more.

4. In a laminate for packaging containers with RFIC elements according to any one of claims 1 to 3, A laminate for a packaging container with an RFIC element, wherein at least one printed layer is laminated on the surface side of the aforementioned release layer.

5. In a laminate for packaging containers with RFIC elements according to any one of claims 1 to 4, The laminated material for the packaging container can be assembled into a box shape by folding it at predetermined positions. A lid portion that can be opened and closed to close the box-shaped opening, The flap portion that is folded inward into the lid portion, It has, The terminal portion for connecting the RFIC element is provided in the flap portion, and the laminated body for packaging containers with an RFIC element is provided in the flap portion.

6. In a laminate for packaging containers with RFIC elements according to any one of claims 1 to 5, The RFIC element is an RFIC element that includes an impedance matching circuit, and the laminate is for a packaging container with an RFIC element.

7. In the laminate for packaging container with RFIC element according to any one of claims 1 to 6, The antenna formed by the first conductive portion and the second conductive portion has a slit structure having an elongated groove-shaped gap, When the direction substantially parallel to the slit of the antenna is defined as the first direction, and the direction substantially perpendicular to the slit is defined as the second direction, A laminate for packaging containers with RFIC elements, wherein the width of the marginal zone along the first direction is smaller than the width of the marginal zone along the second direction.

8. A packaging container assembled from a laminate for packaging containers with RFIC elements according to any one of claims 1 to 7.

9. A method for manufacturing a laminate for a packaging container with an RFIC element according to any one of claims 1 to 7, An adhesive layer printing step is performed in which the adhesive layer is printed on the substrate layer by flexographic printing. A conductive layer lamination step is performed by laminating a conductive layer, which is laminated on a release sheet via the release layer, onto the adhesive layer, The steps include curing or drying the adhesive layer, A peeling step of peeling off the aforementioned release sheet, A method for manufacturing a laminate for packaging containers equipped with an RFIC element.

10. A method for manufacturing a laminate for a packaging container with an RFIC element according to claim 7, A method for manufacturing a laminate for a packaging container with an RFIC element, comprising printing the adhesive layer along the first direction.

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