Ultrasonic excitation device

The PCB-based energy transmission assembly addresses thermal management challenges by integrating thermal conduction and insulation regions to efficiently cool ultrasonic transmitters while preserving sensor responsiveness.

JP7864714B2Active Publication Date: 2026-05-25SOFWAVE MEDICAL LTD
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
SOFWAVE MEDICAL LTD
Filing Date
2021-12-30
Publication Date
2026-05-25

AI Technical Summary

Technical Problem

Existing energy transmission assemblies, particularly those involving ultrasonic energy, face challenges in efficiently cooling energy transmitters on printed circuit boards (PCBs) while maintaining precise thermal control to prevent excessive cooling of adjacent components and ensure effective thermal response.

Method used

The assembly incorporates thermal conduction and insulation regions within the PCB to manage heat transfer, using heat-conducting materials and channels, and includes cooling elements on the PCB surface or within it to efficiently cool energy transmitters while isolating sensitive components like temperature sensors.

Benefits of technology

This approach enhances thermal management, allowing for effective cooling of energy transmitters while preventing excessive cooling of adjacent areas, thereby maintaining optimal thermal performance and responsiveness of temperature sensors.

✦ Generated by Eureka AI based on patent content.

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Abstract

The assembly includes a printed circuit board (PCB) having a first surface and a second surface, at least one energy transmitter mounted to the first surface, and at least one cooling element coupled to the second surface of the PCB, the cooling element configured to cool the at least one energy transmitter via the PCB.
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