Inductor components

Abstract

To enlarge a region where inductor wiring can be distributed.SOLUTION: An inductor component comprises: an element body having a first main surface; a first inter-layer insulation layer 31; a wiring inter-layer insulation layer 32; and inductor wiring 50. The first inter-layer insulation layer 31 is extended in parallel to the first main surface in the element body. The wiring inter-layer insulation layer 32 is extended to a first positive direction X1 orthogonal to the first main surface of the first inter-layer insulation layer 31. The inductor wiring 50 is extended into a region segmented by the wiring inter-layer insulation layer 32. In a specific cross section orthogonal to a center line of the inductor wiring 50, the plurality of wiring inter-layer insulation layers 32 is existed in a non-continuous state to a direction along the first main surface. For instance, a surface directed to a direction in parallel to the main surface from an outer surface of the first inter-layer insulation layer 31 is an end surface EF, and a place where a surface directed to the direction parallel to the first main surface from each portion of the wiring inter-layer insulation layer 32 is contacted to the element is an outer side insulation layer 32A. At the time, the outer side insulation layer 32A is contacted to the end surface EF of the first inter-layer insulation layer 31.SELECTED DRAWING: Figure 5

Description

Technical Field

[0001] The present invention relates to an inductor component.

Background Art

[0002] The inductor component described in Patent Document 1 includes a body, a substrate, a resin wall, and a coil. The body is in the shape of a rectangular parallelepiped. The body contains a magnetic material. The substrate is plate-shaped. The substrate is located inside the body. The resin wall is located on the main surface of the substrate. The resin wall extends in the normal direction of the main surface. In a cross-sectional view along the normal of the main surface of the substrate, a plurality of resin walls are arranged at intervals. Here, in this cross-sectional view, the dimension of the resin wall in the arrangement direction of the resin walls is defined as the thickness dimension. At this time, in this cross-sectional view, the thickness dimension of the resin wall located most outward in the arrangement direction of the resin walls is larger than the thickness dimension of the resin wall located inward. The coil is located on the main surface of the substrate. The coil is filled between adjacent resin walls.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In the invention described in Patent Document 1, the volume ratio of the resin wall in the body is large by the amount that the thickness dimension of the resin wall located most outward is large. Therefore, it is difficult to increase the volume ratio of the coil in the body.

Means for Solving the Problems

[0005] To solve the above problems, the present invention provides an inductor component comprising: a base body having a main surface; an interlayer insulating layer extending within the base body parallel to the main surface; an interwiring insulating layer extending from the interlayer insulating layer in a first positive direction perpendicular to the main surface; and an inductor wiring extending within a region partitioned by the interwiring insulating layer, in contact with the first positive direction side surface of the interlayer insulating layer. In a specific cross section perpendicular to the center line of the inductor wiring, the interwiring insulating layer exists discontinuously in multiple locations along the main surface. The outer surface of the interlayer insulating layer is defined as an end face, and the location where the surface of the interwiring insulating layer facing parallel to the main surface is in contact with the base body is defined as the outer insulating layer. The outer insulating layer is an inductor component in contact with the end face of the interlayer insulating layer. [Effects of the Invention]

[0006] The above configuration allows for a larger area where inductor wiring can be placed. [Brief explanation of the drawing]

[0007] [Figure 1] Figure 1 is a perspective view of an inductor component. [Figure 2] Figure 2 is a transparent side view of an inductor component. [Figure 3] Figure 3 is a transparent top view of an inductor component. [Figure 4] Figure 4 is a cross-sectional view of the inductor component along line 4-4 in Figure 3. [Figure 5] Figure 5 is an enlarged view of a portion of Figure 4. [Figure 6] Figure 6 is an explanatory diagram of the manufacturing method for inductor components. [Figure 7] Figure 7 is an explanatory diagram of the manufacturing method for inductor components. [Figure 8] Figure 8 is an explanatory diagram of the manufacturing method for inductor components. [Figure 9] Figure 9 is an explanatory diagram of the manufacturing method for inductor components. [Figure 10] Figure 10 is an explanatory diagram of the manufacturing method for inductor components. [Figure 11] FIG. 11 is an explanatory diagram of a method for manufacturing an inductor component. [Figure 12] FIG. 12 is an explanatory diagram of a method for manufacturing an inductor component. [Figure 13] FIG. 13 is an explanatory diagram of a method for manufacturing an inductor component. [Figure 14] FIG. 14 is an explanatory diagram of a method for manufacturing an inductor component. [Figure 15] FIG. 15 is an explanatory diagram of a method for manufacturing an inductor component. [Figure 16] FIG. 16 is an explanatory diagram of a method for manufacturing an inductor component. [Figure 17] FIG. 17 is an explanatory diagram of a method for manufacturing an inductor component. [Figure 18] FIG. 18 is an explanatory diagram of a method for manufacturing an inductor component. [Figure 19] FIG. 19 is an explanatory diagram of a method for manufacturing an inductor component. [Figure 20] FIG. 20 is an explanatory diagram of a method for manufacturing an inductor component. [Figure 21] FIG. 21 is an explanatory diagram of a method for manufacturing an inductor component. [Figure 22] FIG. 22 is an explanatory diagram of a method for manufacturing an inductor component. [Figure 23] FIG. 23 is a cross-sectional view of a modified inductor component.

Embodiments for Carrying Out the Invention

[0008] Hereinafter, an embodiment of the inductor component will be described with reference to the drawings. Note that the drawings may show the components enlarged for ease of understanding. The dimensional ratios of the components may be different from the actual ones or those in another drawing.

[0009] <Regarding the Overall Configuration> As shown in FIG. 1, the inductor component 10 is generally in the shape of a substantially rectangular parallelepiped. As shown in FIG. 2, the inductor component 10 includes a body 11 and an inductor wiring 50.

[0010] As shown in FIG. 1, the base body 11 has six planar outer surfaces. Among these six outer surfaces, a specific one of the surfaces is defined as the first main surface 11A. Also, a surface located on the side opposite to the first main surface 11A and parallel to the first main surface 11A is defined as the second main surface 11B. The outer shape of the first main surface 11A and the outer shape of the second main surface 11B are both rectangular. In this embodiment, the first main surface 11A is the mounting surface that faces the substrate when mounting the inductor component 10 on the substrate.

[0011] Here, an axis orthogonal to the first main surface 11A is defined as the first axis X. Also, an axis orthogonal to the first axis X and parallel to a specific side of the first main surface 11A, in this embodiment, the long side of the first main surface 11A, is defined as the second axis Y. Further, an axis orthogonal to the first axis X and the second axis Y is defined as the third axis Z. Also, the direction in which the first main surface 11A faces among the directions along the first axis X is defined as the first positive direction X1, and the direction opposite to the first positive direction X1 is defined as the first negative direction X2. Also, a specific one of the directions along the second axis Y is defined as the second positive direction Y1, and the direction opposite to the second positive direction Y1 is defined as the second negative direction Y2. Further, a specific one of the directions along the third axis Z is defined as the third positive direction Z1, and the direction opposite to the third positive direction Z1 is defined as the third negative direction Z2.

[0012] As shown in Figure 4, the base body 11 has magnetic layers 20, which are arranged in order from the first negative direction X2 side: a first magnetic layer 21, a first interlayer magnetic layer 22, a second magnetic layer 23, a second interlayer magnetic layer 24, and a third magnetic layer 25. In Figure 4, the boundaries of each magnetic layer 20 are virtually shown by dashed lines, but clear boundaries may not be observed between these magnetic layers 20. The material of these magnetic layers 20 is an organic resin containing metallic magnetic powder. That is, the base body 11 contains a magnetic material. In this embodiment, the metallic magnetic powder is a metallic magnetic powder made of an Fe-based alloy or amorphous alloy. More specifically, the metallic magnetic powder is an FeSiCr-based metal powder containing iron. Note that the metallic magnetic powder is not limited to FeSiCr-based magnetic powder, but may also be FeCo-based, FeSiAr-based, iron oxide-based, or combinations thereof. The organic resin may also be epoxy-based, imide-based, liquid crystal polymer-based, acrylic-based, phenol-based, or combinations thereof. Furthermore, in addition to the above-mentioned materials, an inorganic filler may be mixed in with the organic resin.

[0013] As shown in Figure 2, the inductor wiring 50 is located inside the base body 11. As shown in Figure 4, the inductor wiring 50 is located in the same place as the second magnetic layer 23 in the first positive direction X1. The material of the inductor wiring 50 is a conductive material. In this embodiment, the composition of the inductor wiring 50 is, for example, a copper ratio of 99 wt% or more and a sulfur ratio of 0.1 wt% to 1.0 wt%. Note that the inductor wiring 50 is not limited to a conductor mainly composed of copper, but may also be a conductor mainly composed of Ag, Al, and Au.

[0014] As shown in Figure 3, the inductor wiring 50 extends parallel to the first main surface 11A and in a spiral shape. As shown in Figure 4, the inductor wiring 50 includes a seed layer 51A. The seed layer 51A constitutes a part of the surface of the inductor wiring 50 on the first negative direction X2 side. The material of the seed layer 51A is copper. By performing electrolytic copper plating on the seed layer 51A, copper grows on the seed layer 51A, and the entire inductor wiring 50 is formed.

[0015] As shown in Figure 3, the inductor wiring 50 has a pair of pad portions 51P and a wiring body 51L. The pair of pad portions 51P are located at both ends of the inductor wiring 50. One of the pair of pad portions 51P is designated as the inner pad portion 51PA. The other of the pair of pad portions 51P is designated as the outer pad portion 51PB. When viewed through in the first negative direction X2, the inner pad portion 51PA is located on the second positive direction Y1 side with respect to the geometric center of the element 11. When viewed through in the first negative direction X2, the inner pad portion 51PA is approximately circular in shape. The outer pad portion 51PB is located on the second negative direction Y2 side with respect to the geometric center of the element 11. When viewed through in the first negative direction X2, the outer pad portion 51PB is approximately square in shape.

[0016] The wiring body 51L connects a pair of pad sections 51P. Specifically, when viewing the element 11 through the first negative direction X2, the wiring body 51L extends counterclockwise from the inner pad section 51PA toward the outer pad section 51PB, with the diameter increasing as the number of turns increases. The number of turns of the inductor wiring 50 is 2.5 turns.

[0017] The number of turns in the inductor wiring 50 is determined based on a virtual vector. The starting point of the virtual vector is located on the center line of the inductor wiring 50. When the virtual vector is viewed facing the first negative direction X2, and its starting point is located at the first end of the center line, moving it to the second end of the center line, the number of turns is determined to be 1.0 turn when the angle of rotation of the direction of the virtual vector is 360 degrees. However, if the direction of the virtual vector involves multiple windings, the number of turns will increase if the windings are consecutive and in the same direction.

[0018] Furthermore, the centerline of the inductor wiring 50 is determined as follows: When viewing through the first negative direction X2, the shortest line segment that can be drawn from any point on the edge of the inductor wiring 50 to the opposite edge is identified. The line connecting the points passing through the center of this identified line segment is defined as the centerline of the inductor wiring 50 when viewing through the first negative direction X2.

[0019] As shown in Figure 4, the inductor component 10 comprises an insulating layer 30 consisting of a first interlayer insulating layer 31, an interwiring insulating layer 32, and a second interlayer insulating layer 33. The material of these insulating layers 30 is an insulating resin. In this embodiment, for example, it is a polyimide resin.

[0020] As shown in Figure 4, the first interlayer insulating layer 31 extends parallel to the first main surface 11A within the element 11. The first interlayer insulating layer 31 is in contact with the surface of the first magnetic layer 21 on the first positive direction X1 side. The first interlayer insulating layer 31 is also in contact with the surface of the inductor wiring 50 on the first negative direction X2 side. In other words, the inductor wiring 50 extends on the first interlayer insulating layer 31. Therefore, the first interlayer insulating layer 31 is located at the same location as the first interlayer magnetic layer 22 in the first positive direction X1.

[0021] The second interlayer insulating layer 33 extends within the base body 11 parallel to the first main surface 11A. Furthermore, the second interlayer insulating layer 33 is in contact with the surface of the inductor wiring 50 on the first positive direction X1 side. Also, the second interlayer insulating layer 33 is in contact with the surface of the third magnetic layer 25 on the first negative direction X2 side. Therefore, in the first positive direction X1, the second interlayer insulating layer 33 is located at the same position as the second interlayer magnetic layer 24.

[0022] When the side of the inductor wiring 50 facing parallel to the first main surface 11A is considered the side surface, the inter-wiring insulation layer 32 covers the side surface of the inductor wiring 50. Therefore, the inter-wiring insulation layer 32 has a portion located in the same place as the inductor wiring 50 in the first positive direction X1. Furthermore, in a specific cross-section perpendicular to the center line of the inductor wiring 50, the inter-wiring insulation layer 32 exists discontinuously in multiple locations along the first main surface 11A. For example, in the specific cross-section shown in Figure 4, the inter-wiring insulation layer 32 exists discontinuously in seven locations along the first main surface 11A.

[0023] Here, in a specific cross-section, the portion of the inter-wiring insulation layer 32 where the surface facing parallel to the first main surface 11A is in contact with the base body 11 is defined as the outer insulation layer 32A. In addition, the portion of the inter-wiring insulation layer 32 in a specific cross-section where the surface facing parallel to the first main surface 11A is not in contact with the base body 11 is defined as the inner insulation layer 32B. For example, in the specific cross-section shown in Figure 4, there are four outer insulation layers 32A. Also, in the specific cross-section, there are three inner insulation layers 32B. Specifically, in the specific cross-section, two outer insulation layers 32A are located on the third positive direction Z1 side with respect to the geometric center of the base body 11, and two inner insulation layers 32B are located between these outer insulation layers 32A. The inductor wiring 50 is located between each of these inter-wiring insulation layers 32. Furthermore, two outer insulating layers 32A are located on the third negative direction Z2 side with respect to the geometric center of the element 11, and one inner insulating layer 32B is located between these outer insulating layers 32A. The inductor wiring 50 is located between each of these inter-wiring insulating layers 32. That is, the inductor wiring 50 extends in the first positive direction X1 side with respect to the first inter-layer insulating layer 31 within the region demarcated by the inter-wiring insulating layers 32.

[0024] Furthermore, as shown in Figure 5, the outer surface of the first interlayer insulating layer 31 that faces in a direction parallel to the first main surface 11A is defined as the end surface EF. The "surface facing in a direction parallel to the first main surface 11A" refers to the surface visible when viewing the first interlayer insulating layer 31 in a direction parallel to the first main surface 11A. In this case, the outer insulating layer 32A can be broadly divided into a contact end BP located at the same position as the first interlayer insulating layer 31 in the first positive direction X1, and a main body AP located on the first positive direction X1 side relative to the contact end BP. Details of the contact end BP and the main body AP will be described later.

[0025] As shown in Figure 2, the inductor component 10 comprises two columnar wires 40 and two external electrodes 60. Each columnar wire 40 extends in a direction intersecting the first main surface 11A. In this embodiment, each columnar wire 40 extends in a direction perpendicular to the first main surface 11A. Each columnar wire 40 is located on the first positive direction X1 side with respect to the inductor wire 50. Each columnar wire 40 is electrically connected to the inductor wire 50.

[0026] Specifically, the first columnar wiring 41, which is one of the two columnar wirings 40, consists of a first via 41A and a first lead wiring 41B. The material of the first columnar wiring 41 is the same as the material of the inductor wiring 50. The first via 41A is substantially cylindrical. As shown in Figure 4, the first via 41A penetrates the second interlayer insulating layer 33. Therefore, in the first positive direction X1, the first via 41A is located at the same location as the second interlayer insulating layer 33 and the second interlayer magnetic layer 24. The side of the first via 41A facing the first negative direction X2 is connected to the inner pad portion 51PA of the inductor wiring 50.

[0027] As shown in Figure 3, the first lead wire 41B is approximately cylindrical. As shown in Figure 2, the diameter of the first lead wire 41B is slightly larger than the diameter of the first via 41A. The surface of the first lead wire 41B facing the first negative direction X2 is connected to the first via 41A. Therefore, the first lead wire 41B is located in the same place as the third magnetic layer 25 in the first positive direction X1. The surface of the first lead wire 41B facing the first positive direction X1 is exposed from the first main surface 11A.

[0028] As shown in Figure 2, the second columnar wiring 42, which is the other of the two columnar wirings 40, consists of a second via 42A and a second lead wire 42B. The material of the second columnar wiring 42 is the same as the material of the inductor wiring 50. The second columnar wiring 42 is located on the second negative direction Y2 side relative to the first columnar wiring 41. The second via 42A is approximately rectangular prism-shaped. The second via 42A penetrates the second interlayer insulating layer 33. Therefore, in the first positive direction X1, the second via 42A is located at the same location as the second interlayer insulating layer 33 and the second interlayer magnetic layer 24. The side of the second via 42A facing the first negative direction X2 side is connected to the outer pad portion 51PB of the inductor wiring 50.

[0029] As shown in Figure 3, the second lead wire 42B is approximately rectangular prism-shaped. As shown in Figure 2, the dimensions of each side of the second lead wire 42B are slightly larger than the dimensions of each side of the second via 42A. The side of the second lead wire 42B facing the first negative direction X2 is connected to the second via 42A. Therefore, the second lead wire 42B is located in the same place as the third magnetic layer 25 in the first positive direction X1. The side of the second lead wire 42B facing the first positive direction X1 is exposed from the first main surface 11A.

[0030] As shown in Figure 1, each external electrode 60 is exposed from the base body 11. Specifically, each external electrode 60 is located on the first main surface 11A of the base body 11. That is, each external electrode 60 covers a portion of the outer surface of the base body 11.

[0031] As shown in Figure 2, the first external electrode 61, one of the two external electrodes 60, is located on the first main surface 11A, on the second positive direction Y1 side with respect to the geometric center of the first main surface 11A. The first external electrode 61 is in contact with the surface of the first lead wiring 41B facing the first positive direction X1. The second external electrode 62, the other of the two external electrodes 60, is located on the first main surface 11A, on the second negative direction Y2 side with respect to the geometric center of the first main surface 11A. The second external electrode 62 is in contact with the surface of the second lead wiring 42B facing the first positive direction X1.

[0032] The inductor component 10 is equipped with a solder resist 70. The solder resist 70 covers the portion of the surface of the base body 11 facing the first positive direction X1, excluding the two external electrodes 60. In other words, the first main surface 11A of the base body 11 is covered by the external electrodes 60 and the solder resist 70 and is not exposed. The solder resist 70 has higher insulating properties than the base body 11.

[0033] <Regarding the insulation layer between wiring> As described above, the outer insulating layer 32A of the inter-wiring insulating layer 32 can be broadly divided into a contact end BP located in the same position as the first inter-layer insulating layer 31 in the first positive direction X1, and a main body AP located on the first positive direction X1 side relative to the contact end BP. The main body AP is located in the same position as the inductor wiring 50 in the first positive direction X1.

[0034] As shown in Figure 5, the contact end BP is in contact with the end face EF of the first interlayer insulating layer 31. In a specific cross-section, the outer surface of the contact end BP opposite to the first interlayer insulating layer 31 is an inclined surface SF that approaches the first interlayer insulating layer 31 as it moves toward the first negative direction X2. That is, the contact end BP is approximately triangular in a specific cross-section.

[0035] The main body AP is in contact with the surface of the first interlayer insulating layer 31 on the first positive direction X1 side. As a result, the dimension of the main body AP at the end on the first negative direction X2 side in the direction along the third axis Z is larger than the dimension of the contact end BP on the first positive direction X1 side in the direction along the third axis Z. That is, when viewing the first interlayer insulating layer 31 facing the first positive direction X1, a portion of the main body AP protrudes from the contact end BP toward the inductor wiring 50 side. The portion of the main body AP that protrudes from the contact end BP is in contact with the surface of the first interlayer insulating layer 31 facing the first positive direction X1. In this way, the outer insulating layer 32A is in contact with the surface of the first interlayer insulating layer 31 facing the first positive direction X1, in addition to the end face EF of the first interlayer insulating layer 31.

[0036] Furthermore, in a specific cross-section, the dimensions of the main body AP in the outer insulating layer 32A along the third axis Z are the same as the dimensions of the inner insulating layer 32B along the third axis Z. In other words, except for the contact end BP of the first interlayer insulating layer 31, the outer insulating layer 32A and the inner insulating layer 32B have substantially the same shape.

[0037] Furthermore, the distance V1 between the outer insulating layer 32A and the inner insulating layer 32B facing the outer insulating layer 32A is greater than the distance V2 between two opposing inner insulating layers 32B. In other words, the distance V1 between the outer insulating layer 32A and the inner insulating layer 32B in the direction parallel to the first main surface 11A is greater than the distance V2 between two inner insulating layers 32B in the direction parallel to the first main surface 11A. As a result, the wiring width of the inductor wiring 50 located between the outer insulating layer 32A and the inner insulating layer 32B is greater than the wiring width of the inductor wiring 50 located between the inner insulating layers 32B.

[0038] <About the manufacturing method> Next, we will describe the manufacturing method of the inductor component 10. As shown in Figure 6, first, the base preparation process is carried out. Specifically, a plate-shaped base member 101 is prepared. The material of the base member 101 is ceramic. When viewed in the first negative direction X2, the base member 101 has a rectangular shape. The dimensions of each side of the base member 101 are such that multiple inductor components 10 can be accommodated. Next, a dummy insulating layer 102 is applied to the entire upper surface of the base member 101. In Figure 6, the dummy insulating layer 102 is shown with a thick line.

[0039] Next, as shown in Figure 7, a first insulating layer processing step is performed to form the first interlayer insulating layer 31. The first interlayer insulating layer 31 is formed on the first positive X1 side surface of the base member 101. Specifically, the first interlayer insulating layer 31 is patterned. The patterning is performed in an area slightly wider than the area where the inductor wiring 50 is arranged. Specifically, the first interlayer insulating layer 31 is formed by photolithography.

[0040] Next, as shown in Figure 8, a seed formation process is performed to form the seed layer 51A. Specifically, copper seed portions 103 are formed on the first positive X1 side of the first interlayer insulating layer 31 and the dummy insulating layer 102 by sputtering.

[0041] Next, as shown in Figure 9, a photosensitive resist 104 is laminated onto the upper surface of the seed portion 103. Then, only the area of ​​the upper surface of the seed portion 103 in which the seed layer 51A of the inductor wiring 50 is to be formed is exposed to light. The exposed areas of the resist 104 harden. These hardened areas are formed as the covering portion 105. After that, the unhardened parts of the resist 104, i.e., the parts other than the covering portion 105, are removed.

[0042] Next, as shown in Figure 10, the seed portion 103 is etched. This removes the seed portion 103 that is exposed from the covering portion 105. Then, as shown in Figure 11, the coating portion 105 is wet-etched using chemicals. This causes the coating portion 105 to peel off. As a result, the seed layer 51A is formed.

[0043] Subsequently, as shown in Figure 12, a second insulating layer processing step is performed to form the inter-wiring insulating layer 32. Specifically, first, a photosensitive permanent resist 106 is laminated to the dummy insulating layer 102, the seed layer 51A, and the first positive X1 side of the first inter-layer insulating layer 31. Next, the area where the inter-wiring insulating layer 32 will be formed, that is, the areas located on both sides of the seed layer 51A, is exposed. Specifically, a portion of the first positive X1 side of the first inter-layer insulating layer 31 and the area including the position on the first positive X1 side with respect to the end face EF of the first inter-layer insulating layer 31 are exposed. At this time, the exposure amount of the area including the position on the first positive X1 side with respect to the end face EF of the first inter-layer insulating layer 31 is made less than the exposure amount of other areas. By controlling the exposure amount in this way, as shown in Figure 13, in the area including the first positive direction X1 side of the end face EF of the first interlayer insulating layer 31, a portion of the first negative direction X2 side of the permanent resist 106 remains unhardened, and the inclined surface SF of the contact end BP is formed.

[0044] Next, as shown in Figure 13, the uncured portion of the permanent resist 106 is peeled off using a chemical solution. This forms the inter-wiring insulating layer 32. Next, as shown in Figure 14, a first wiring formation step is performed to form the inductor wiring 50. Specifically, electrolytic copper plating is performed, and copper is grown from the portion where the seed layer 51A is exposed on the first positive direction X1 side surface of the first interlayer insulating layer 31. This forms the inductor wiring 50. During the process of forming the inductor wiring 50, since the seed layer 51A is located between the inter-wiring insulating layers 32, the copper plating grows along the inter-wiring insulating layers 32. As a result, the cross-section of the inductor wiring 50 becomes approximately rectangular. In addition, during the process of promoting the growth of copper plating on the seed layer 51A, the first positive direction X1 side surface of the inductor wiring 50 may become a curved surface that is convex toward the first positive direction X1.

[0045] Next, as shown in Figure 15, a third insulating layer processing step is performed to form the second interlayer insulating layer 33. The area in which the second interlayer insulating layer 33 is formed is the area on the first positive direction X1 side of the inductor wiring 50 and the inter-wiring insulating layer 32, excluding the areas where the first via 41A and the second via 42A are formed. The second interlayer insulating layer 33 is formed in this area by the same photolithography method used to form the first interlayer insulating layer 31. The dimensions of the second interlayer insulating layer 33 in the direction along the first axis X are the same as the dimensions of the first interlayer insulating layer 31 in the direction along the first axis X. Also, when viewed in the first negative direction X2, the outer shape of the second interlayer insulating layer 33 matches the outer shape of the first interlayer insulating layer 31.

[0046] Next, as shown in Figure 16, a second wiring formation step is performed to form columnar wiring 40. The area in which columnar wiring 40 is formed includes the area in which the inductor wiring 50 is exposed from the second interlayer insulating layer 33. First, a columnar seed layer 107 is formed in the above area in the same manner as in the seed formation step described above. Note that the columnar seed layer 107 is not shown in Figures 2 to 5. Then, a resist is exposed to the area outside the above area by photolithography using the same method as in the first insulating layer processing step. Then, the columnar wiring 40 is formed by copper plating using the same process as in the first wiring formation step. After that, the resist is removed. As a result, the first columnar wiring 41 and the second columnar wiring 42 are formed.

[0047] Next, as shown in Figure 17, a first magnetic material formation step is performed to form magnetic layers 20 other than the first magnetic layer 21. First, a resin containing magnetic powder, which is the material for the magnetic layer 20, is applied to the dummy insulating layer 102 on the first positive direction X1 side. At this time, the resin containing magnetic powder is applied so as to cover the surface of each columnar wiring 40 on the first positive direction X1 side. Next, the resin containing magnetic powder is hardened by press processing to form the first interlayer magnetic layer 22, the second magnetic layer 23, the second interlayer magnetic layer 24, and the third magnetic layer 25 on the surface of the dummy insulating layer 102 on the first positive direction X1 side.

[0048] Then, the portion of the third magnetic layer 25 on the first positive direction X1 side is scraped until the surface of each columnar wiring 40 on the first positive direction X1 side is exposed. Note that in Figure 17, the first interlayer magnetic layer 22, the second magnetic layer 23, the second interlayer magnetic layer 24, and the third magnetic layer 25 are all shown together as magnetic layer 20.

[0049] Next, as shown in Figure 18, a base member cutting process is performed. Specifically, the base member 101 and the dummy insulating layer 102 are completely removed by cutting. As a result of cutting the base member 101 and the dummy insulating layer 102, a portion of the first interlayer insulating layer 31 on the first negative direction X2 side may be removed, but the inductor wiring 50 is not removed.

[0050] Next, as shown in Figure 19, a second magnetic material forming step is performed to form the first magnetic layer 21. Specifically, first, a resin containing magnetic powder, which is the material for the first magnetic layer 21, is applied to the first negative direction X2 side surface of the first interlayer insulating layer 31 and the first interlayer magnetic layer 22. Then, the resin containing magnetic powder is hardened by press working. After that, the portion of the resin on the first negative direction X2 side is machined. For example, the portion of the resin on the first negative direction X2 side is machined so that the dimension in the direction along the first axis X of the inductor component 10 becomes a desired value. As a result, the first magnetic layer 21 is formed on the first negative direction X2 side surface of the first interlayer insulating layer 31 and the first interlayer magnetic layer 22. Note that in Figure 19, the first magnetic layer 21, the first interlayer magnetic layer 22, the second magnetic layer 23, the second interlayer magnetic layer 24, and the third magnetic layer 25 are all shown together as magnetic layer 20 without distinction.

[0051] Next, as shown in Figure 20, a main surface processing step is performed to form the solder resist 70. Specifically, an insulator is patterned by photolithography on the surface of the third magnetic layer 25 on the first positive direction X1 side and on the surface of each columnar wiring 40 on the first positive direction X1 side, in the areas where the external electrodes 60 are not formed. This forms the solder resist 70.

[0052] Next, as shown in Figure 21, an electrode processing step is performed to form the external electrodes 60. The area in which the external electrodes 60 are formed is the area of ​​the third magnetic layer 25 on the first positive direction X1 side and the area of ​​each columnar wiring 40 on the first positive direction X1 side that is not covered by the solder resist 70. Copper, nickel, and gold are electroless plated into this area, respectively. As a result, the first external electrode 61 and the second external electrode 62 are formed. Note that in Figure 21, the copper, nickel, and gold layers are shown without distinction. Also, as shown in Figure 21, a part of the external electrode 60 may cover a part of the area of ​​the solder resist 70 on the first positive direction X1 side. Next, as shown in Figure 22, a dicing process is performed. Specifically, the parts are diced along the broken line DL. This allows the inductor component 10 to be obtained.

[0053] <Effects of this embodiment> (1) According to the above embodiment, the interwiring insulation layer 32 is in contact with the end face EF of the first interlayer insulation layer 31. That is, when viewed through in the first positive direction X1, at least a portion of the interwiring insulation layer 32 protrudes outward from the surface of the first interlayer insulation layer 31 on the first positive direction X1 side. Therefore, compared to a configuration in which the entire interwiring insulation layer 32 is located within the range of the surface of the first interlayer insulation layer 31 on the first positive direction X1 side, the area demarcated by the interwiring insulation layer 32, i.e., the area in which the inductor wiring 50 can be arranged, can be made larger.

[0054] (2) If the outer insulating layer 32A is in contact with the first interlayer insulating layer 31 on only one surface, then when an external force acting on the outer insulating layer 32A in a direction parallel to the contact surface between the outer insulating layer 32A and the first interlayer insulating layer 31, it is prone to peeling from the inter-wiring insulating layer 32. On the other hand, in the above embodiment, the outer insulating layer 32A is in contact with the end face EF of the first interlayer insulating layer 31 as well as the surface of the first interlayer insulating layer 31 facing the first positive direction X1. That is, in the above embodiment, the outer insulating layer 32A is in contact with the first interlayer insulating layer 31 on two surfaces. Therefore, when an external force acts on the outer insulating layer 32A, the external force can be distributed across the two surfaces in contact with the first interlayer insulating layer 31. Therefore, according to the above configuration, peeling of the outer insulating layer 32A from the first interlayer insulating layer 31 can be suppressed.

[0055] (3) In the above embodiment, in a specific cross section, the distance V1 between the outer insulating layer 32A and the inner insulating layer 32B in the direction parallel to the first main surface 11A is greater than the distance V2 between the inner insulating layers 32B in the direction parallel to the first main surface 11A. As described above, the outer insulating layer 32A is in a state where it protrudes outward with respect to the first positive direction X1 side surface of the first interlayer insulating layer 31. Therefore, a large distance V1 between the outer insulating layer 32A and the inner insulating layer 32B can be secured. As a result, the DC resistance in the inductor wiring 50 can be reduced.

[0056] (4) In the above embodiment, the columnar wiring 40 is located on the first positive direction X1 side with respect to the inductor wiring 50. That is, in the above embodiment, the outer insulating layer 32A of the inter-wiring insulating layer 32 is in contact with the end face EF of the first inter-layer insulating layer 31 on the side furthest from the external electrode 60. Therefore, even if the inductor wiring 50 protrudes from between the outer insulating layer 32A and the inter-wiring insulating layer 32, there is little risk of the protruding inductor wiring 50 short-circuiting to the external electrode 60.

[0057] (5) In the above embodiment, the inductor wiring 50 has a seed layer 51A that contacts the first interlayer insulating layer 31 in the first positive direction X1. That is, in the above embodiment, the outer insulating layer 32A of the inter-wiring insulating layer 32 is in contact with the end face EF of the first interlayer insulating layer 31 at a position close to the seed layer 51A. Therefore, even if the position of the seed layer 51A is shifted from the design position during the manufacturing process, there is little risk of the inductor wiring 50 protruding from between the outer insulating layer 32A and the inter-wiring insulating layer 32.

[0058] (6) In the above embodiment, the outer surface of the contact end BP opposite to the first interlayer insulating layer 31 is an inclined surface SF that approaches the first interlayer insulating layer 31 as it moves toward the first negative direction X2. With this configuration, the volume of the first interlayer magnetic layer 22 can be increased compared to a configuration in which there is no inclined surface SF and the dimension of the outer insulating layer 32A in the direction along the third axis Z is constant.

[0059] <Example of changes> The above embodiments and the following modifications can be combined and implemented to the extent that they do not contradict each other technically.

[0060] In the above embodiment, the inductor component 10 does not need to have external electrodes 60. In that case, the portion of the columnar wiring 40 that is exposed from the first main surface 11A can be used as an electrode.

[0061] In the above embodiment, each columnar wiring 40 is not limited to extending in a direction perpendicular to the first main surface 11A, but may extend in a direction intersecting the first main surface 11A. In the above embodiment, the shape of each columnar wiring 40 when viewed through in a direction perpendicular to the first main surface 11A is not limited to the example of the above embodiment. For example, the shapes of each columnar wiring 40 when viewed through in a direction perpendicular to the first main surface 11A may all be the same.

[0062] In the above embodiment, the material of the insulating layer 30 is not limited to the example of the above embodiment. For example, the material of the insulating layer 30 may be epoxy resin or the like. In the above embodiment, the number of turns and shape of the inductor wiring 50 are not limited to the examples of the above embodiment. For example, the inductor wiring 50 may be a straight line with 0 turns.

[0063] In the above embodiment, a portion of the inductor wiring 50 may not be covered by the insulating layer 30 and may be in contact with the magnetic layer 20. For example, in the above embodiment, the second interlayer insulating layer 33 can be omitted. Note that "of each portion of the inter-wiring insulating layer 32, the surface facing parallel to the first main surface 11A is in contact with the base body 11" refers to the case where 90% or more of the surfaces of the inter-wiring insulating layer 32 facing parallel to the first main surface 11A are in contact with the base body 11. In a configuration without the second interlayer insulating layer 33, due to manufacturing errors, etc., a portion of the surface of the inner insulating layer 32B facing parallel to the first main surface 11A may be in contact with the base body 11. Even in that case, if the proportion of the surfaces of the inter-wiring insulating layer 32 facing parallel to the first main surface 11A that are in contact with the base body 11 is less than 90%, that portion does not correspond to the outer insulating layer 32A.

[0064] In the above embodiment, the inductor component 10 may include a plurality of inductor wirings 50. For example, suppose the inductor wiring 50 in the above embodiment is the first inductor wiring 50, the inter-wiring insulation layer 32 is the first inter-wiring insulation layer 32, and the outer insulation layer 32A is the first outer insulation layer 32A. In the example shown in Figure 23, the outer insulation layer 32A of the first inter-wiring insulation layer 32 extends entirely from the surface of the first inter-layer insulation layer 31 on the first positive direction X1 side. In the example shown in Figure 23, the inductor component 10 further includes a second inductor wiring 52, a second inter-wiring insulation layer 34, and a third inter-layer insulation layer 35. In the example shown in Figure 23, the second inter-wiring insulation layer 34 extends from the second inter-layer insulation layer 33 in the first positive direction X1. The second inductor wiring 52 extends in the first positive direction X1 side relative to the second inter-layer insulation layer 33 within the region demarcated by the second inter-wiring insulation layer 34. The third interlayer insulating layer 35 extends along the first positive direction X1 side of the second inductor wiring 52 and the second inter-wiring insulating layer 34. In the example shown in Figure 23, the columnar wiring 40 is connected to the second inductor wiring 52.

[0065] In the example shown in Figure 23, similar to the first inter-wiring insulation layer 32, the second inter-wiring insulation layer 34 exists discontinuously in seven locations along the first main surface 11A in a specific cross-section. Note that Figure 23 shows four of the seven locations of the second inter-wiring insulation layer 34.

[0066] Here, the outer surface of the second interlayer insulating layer 33 that faces parallel to the first main surface 11A is defined as the end surface EF, and the portion of the second interwiring insulating layer 34 in a specific cross-section where the surface facing parallel to the first main surface 11A is in contact with the base body 11 is defined as the second outer insulating layer 34A. In a specific cross-section, the second outer insulating layer 34A located furthest towards the third positive direction Z1 is in contact with the end surface EF of the second interlayer insulating layer 33 and the surface of the first outer insulating layer 32A facing the base body 11. With this configuration, the contact surface of the second outer insulating layer 34A can be increased compared to a configuration in which the second outer insulating layer 34A is in contact only with the second interlayer insulating layer 33. In other words, the adhesion of the second outer insulating layer 34A is improved.

[0067] Furthermore, in the example shown in Figure 23, the first outer insulating layer 32A of the first inter-wiring insulating layer 32 may also be in contact with the end face EF of the first inter-layer insulating layer 31. Also, in the example shown in Figure 23, while the first outer insulating layer 32A of the first inter-wiring insulating layer 32 is in contact with the end face EF of the first inter-layer insulating layer 31, the second outer insulating layer 34A of the second inter-wiring insulating layer 34 does not have to be in contact with the end face EF of the second inter-layer insulating layer 33.

[0068] In the above embodiment, of the multiple outer insulating layers 32A, at least one outer insulating layer 32A that contacts the end face EF of the first interlayer insulating layer 31 is sufficient. In the above embodiment, the outer insulating layer 32A only needs to be in contact with the end face EF of the first interlayer insulating layer 31 or the second interlayer insulating layer 33. In other words, the outer insulating layer 32A does not need to be in contact with the surface of the first interlayer insulating layer 31 facing the first positive direction X1.

[0069] In the above embodiment, the columnar wiring 40 may be located on the first negative direction X2 side relative to the inductor wiring 50. Similarly, the external electrode 60 may be exposed from the second main surface 11B. In other words, the mounting surface of the inductor component 10 may be the second main surface 11B.

[0070] In the above embodiment, the distance V1 between the outer insulating layer 32A and the inner insulating layer 32B in a specific cross-section may be the same as or smaller than the distance V2 between the inner insulating layers 32B.

[0071] In the above embodiment, the outer surface of the contact end BP opposite to the first interlayer insulating layer 31 does not have to be an inclined surface SF. For example, in a particular cross-section, the dimensions of the contact end BP may be constant in the direction along the third axis Z.

[0072] In the above embodiment, the material of the base member 101 is not limited to the example of the above embodiment. For example, the material of the base member 101 may be glass epoxy resin, glass, or the like. In the wiring formation process of the above embodiment, dummy wiring may be formed to connect to the inductor wiring 50. For example, the dummy wiring can be used as wiring for power supply when forming copper plating.

[0073] <Note> The technical concepts that can be derived from the above embodiments and modifications are described below. [1] An inductor component comprising: a body having a main surface; an interlayer insulating layer extending within the body parallel to the main surface; an interwiring insulating layer extending from the interlayer insulating layer in a first positive direction perpendicular to the main surface; and an inductor wiring extending in the first positive direction relative to the interlayer insulating layer within a region partitioned by the interwiring insulating layer, wherein in a specific cross section perpendicular to the center line of the inductor wiring, the interwiring insulating layer exists discontinuously in multiple locations along the main surface, and the outer surface of the interlayer insulating layer having an end face, and the location of each of the locations of the interwiring insulating layer where the surface parallel to the main surface is in contact with the body is defined as the outer insulating layer, the outer insulating layer being in contact with the end face of the interlayer insulating layer.

[0074] [2] The inductor component according to [1], wherein the outer insulating layer is in contact with the first positive-facing surface of the interlayer insulating layer in addition to the end face of the interlayer insulating layer. [3] When the portion of the inter-wiring insulating layer in which the surface facing in a direction parallel to the main surface is not in contact with the base body is defined as the inner insulating layer, in the specific cross section, the distance between the outer insulating layer and the inner insulating layer in the direction parallel to the main surface is greater than the distance between the inner insulating layers in the direction parallel to the main surface. The inductor component as described in [1] or [2].

[0075] [4] An inductor component according to any one of [1] to [3], comprising a columnar wiring electrically connected to the inductor wiring and extending in a direction intersecting the main surface, wherein the columnar wiring is located on the first positive side with respect to the inductor wiring.

[0076] [5] The inductor component according to any one of [1] to [4], wherein the inductor wiring has a seed layer that contacts the interlayer insulating layer on the first positive side. [6] The inductor component according to any one of [1] to [5], wherein the direction opposite to the first positive direction is defined as the first negative direction, and the portion of the outer insulating layer that is in the same position as the interlayer insulating layer in the first positive direction is defined as the contact end, and the outer surface of the contact end that is opposite to the interlayer insulating layer is an inclined surface that approaches the interlayer insulating layer as it moves toward the first negative direction.

[0077] [7] When the inductor wiring is defined as the first inductor wiring, the interlayer insulating layer as the first interlayer insulating layer, the wiring insulating layer as the first wiring insulating layer, and the outer insulating layer as the first outer insulating layer, the inductor wiring comprises: a second interlayer insulating layer extending on the first positive side surface of the first inductor wiring and the first wiring insulating layer; a second wiring insulating layer extending from the second interlayer insulating layer in the first positive direction; and a second inductor wiring extending in the first positive direction relative to the second interlayer insulating layer within the region demarcated by the second wiring insulating layer. In the specified cross section, the second inter-wiring insulating layer exists discontinuously in multiple locations along the main surface, and the outer surface of the second inter-layer insulating layer facing in a direction parallel to the main surface is defined as the end face, and the location of each of the locations of the second inter-wiring insulating layer where the surface facing in a direction parallel to the main surface is in contact with the base body is defined as the second outer insulating layer, and the second outer insulating layer is in contact with the end face of the second inter-layer insulating layer and the surface of the first outer insulating layer facing the base body side, as described in any one of [1] to [6]. [Explanation of symbols]

[0078] BP…Contact end EF...End face SF…Slanted surface V1…interval V2...interval X1…first positive direction X2…1st negative direction 10…Inductor components 11... Base body 11A…1st main surface 31…First interlayer insulating layer 32…Insulation layer between wiring 32A…Outer insulation layer 32B...Inner insulating layer 40...Column wiring 50...Inductor wiring 51A... Seed layer

Claims

1. A base body having a main surface, Within the aforementioned substrate, an interlayer insulating layer extending parallel to the main surface, A wiring insulation layer extending from the interlayer insulation layer in a first positive direction perpendicular to the main surface, Within the region demarcated by the inter-wiring insulating layer, an inductor wiring extending in the first positive direction relative to the inter-layer insulating layer, Equipped with, In a specific cross-section perpendicular to the center line of the inductor wiring, the inter-wiring insulating layer exists discontinuously in multiple locations along the main surface. Of the outer surfaces of the interlayer insulating layer, the surface facing in a direction parallel to the main surface is defined as the end face. When the portion of the aforementioned wiring insulation layer in which the surface facing parallel to the main surface is in contact with the base body is defined as the outer insulation layer, The outer insulating layer is in contact with the end face of the interlayer insulating layer. The direction opposite to the first positive direction is defined as the first negative direction. When the portion of the outer insulating layer that is in the same position as the interlayer insulating layer in the first positive direction is defined as the contact end, The outer surface of the contact end opposite to the interlayer insulating layer is an inclined surface that approaches the interlayer insulating layer as it moves in the first negative direction. Inductor components.

2. The outer insulating layer is in contact with the surface of the interlayer insulating layer facing the first positive direction, in addition to the end face of the interlayer insulating layer. The inductor component according to claim 1.

3. When the portion of the aforementioned wiring insulation layer whose surface facing parallel to the main surface is not in contact with the base body is defined as the inner insulation layer, In the aforementioned specific cross-section, the distance between the outer insulating layer and the inner insulating layer in the direction parallel to the main surface is greater than the distance between the inner insulating layers in the direction parallel to the main surface. The inductor component according to claim 1.

4. It is provided with columnar wiring that is electrically connected to the inductor wiring and extends in a direction intersecting the main surface, The columnar wiring is located on the first positive side relative to the inductor wiring. The inductor component according to claim 1.

5. The inductor wiring has a seed layer that contacts the interlayer insulating layer on the first positive side. The inductor component according to claim 1.

6. A base body having a main surface, Within the aforementioned substrate, a first interlayer insulating layer extends parallel to the main surface, A first inter-wiring insulating layer extending from the first inter-layer insulating layer in a first positive direction perpendicular to the main surface, Within the region demarcated by the first inter-wiring insulating layer, a first inductor wiring extends in the first positive direction relative to the first inter-layer insulating layer, A second interlayer insulating layer that is in direct contact with the first positive-direction surface of the first inductor wiring and the first inter-wiring insulating layer and extends on the said first positive-direction surface, A second inter-wiring insulating layer extending in the first positive direction from the second inter-layer insulating layer, Within the region demarcated by the second inter-wiring insulating layer, a second inductor wiring extends in the first positive direction relative to the second inter-layer insulating layer, Equipped with, In a specific cross-section perpendicular to the center line of the first inductor wiring, the first inter-wiring insulating layer exists discontinuously in multiple locations along the main surface. Of the outer surfaces of the first interlayer insulating layer, the surface facing in a direction parallel to the main surface is defined as the end face. When the portion of the first inter-wiring insulating layer in which the surface facing parallel to the main surface is in contact with the base body is defined as the first outer insulating layer, The first outer insulating layer is in contact with the end face of the first interlayer insulating layer. In the aforementioned specific cross-section, the second inter-wiring insulating layer exists discontinuously in multiple locations along the main surface. Of the outer surfaces of the second interlayer insulating layer, the surface facing in a direction parallel to the main surface is defined as the end face. When the portion of the second inter-wiring insulating layer in which the surface facing parallel to the main surface is in contact with the base body is defined as the second outer insulating layer, The second outer insulating layer is in contact with the end face of the second interlayer insulating layer and the surface of the first outer insulating layer facing the substrate side. Inductor components.

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