Composition, cured body, display device, and solar cell

Abstract

To provide a composition that exhibits improved adhesion to a substrate, and a cured body, a display, and a solar cell employing the composition.SOLUTION: A composition comprising a cationically polymerizable compound (A), a cationic polymerization initiator (B), and an inorganic filler (C), wherein the inorganic filler (C) comprises one or more components selected from talc, alumina, silica, zeolite, and titanium oxide, and wherein the total content of one or more components selected from the talc and the alumina is 1 pt.mass or more and 100 pts.mass or less when the total amount of the inorganic filler (C) is 100 pts.mass.SELECTED DRAWING: None

Description

[Technical Field]

[0001] The present invention relates to a composition, a cured body, a display device, and a solar cell. [Background technology]

[0002] In recent years, research has been progressing on organic photodevices using organic thin-film elements such as organic electroluminescent (OLED) display elements and organic thin-film solar cell elements. Organic thin-film elements can be easily fabricated by methods such as vacuum deposition and solution coating, resulting in excellent productivity. Examples of technologies relating to such encapsulants for organic electroluminescent display elements include those described in Patent Documents 1 and 2.

[0003] Patent Document 1 discloses an organic electroluminescent display element encapsulant containing a cationic polymerizable compound having a hydrogenated bisphenol skeleton and a thermal cationic polymerization initiator having a cationic part represented by a specific chemical formula, wherein the content of the thermal cationic polymerization initiator having a cationic part represented by a specific chemical formula is less than 0.1 parts by weight per 100 parts by weight of the cationic polymerizable compound, and it is stated that the encapsulant has excellent low-temperature curability, storage stability, and flatness of the cured film.

[0004] Patent Document 2 discloses a curable resin composition containing a cationic polymerizable resin, an acid generator, and a metal alkoxide, wherein the acid generator is a quaternary ammonium salt, and it is stated that the progress of the curing reaction is less likely to be inhibited. [Prior art documents] [Patent Documents]

[0005] [Patent Document 1] Japanese Patent Publication No. 2016-051602 [Patent Document 2] Japanese Patent Publication No. 2022-182017 [Overview of the project] [Problems that the invention aims to solve]

[0006] The present invention provides a composition with improved adhesion to a substrate, and a cured body, a display device, and a solar cell using the said composition. [Means for solving the problem]

[0007] The inventors of the present invention conducted extensive research to achieve the above objectives. As a result, they discovered that the adhesion of the composition to the substrate can be improved by including one or more selected elements from talc and alumina in predetermined amounts, thus completing the present invention.

[0008] The present invention provides the following compositions, cured bodies, display devices, and solar cells.

[0009] [1] Cationic polymerizable compound (A), Cationic polymerization initiator (B), Inorganic filler (C), Includes, The inorganic filler (C) comprises one or more selected from talc, alumina, silica, zeolite, and titanium oxide. A composition in which the total amount of one or more materials selected from talc and alumina is 1 part by mass or more and 100 parts by mass or less, when the total amount of the inorganic filler (C) is 100 parts by mass. [2] The composition according to [1], wherein the inorganic filler (C) comprises one or more selected from talc and alumina. [3] The composition according to [2], wherein the inorganic filler (C) comprises talc and silica. [4] The composition according to [3], wherein the ratio of the silica content to the talc content in the inorganic filler (C) (silica content / talc content) is 1.0 or more. [5] A composition according to any one of [1] to [4], wherein the viscosity measured under the following <Measurement Condition 1> is 113,400 mPa·s or more and 1,134,000 mPa·s or less. <Measurement Condition 1> Equipment: Cone plate viscometer Temperature: 25℃ Cone: Radius 12mm, angle 3° Shear rate: 0.0417s -1 Sample volume: 0.5 mL Atmosphere: Under the air [6] A composition according to any one of [1] to [5], wherein the viscosity measured under the following <Measurement Condition 2> is 31,750 mPa·s or more and 317,000 mPa·s or less. <Measurement Conditions 2> Equipment: Cone plate viscometer Temperature: 25℃ Cone: Radius 12mm, angle 3° Shear rate: 0.0117s -1 Sample volume: 0.5 mL Atmosphere: Under the air [7] Shear rate of 0.0417 s⁻¹ according to <Measurement Condition 3> below. -1 Viscosity η1 (mPa·s) and shear rate 0.0117s when measured. -1 The composition according to any one of [1] to [6], wherein the thixotropy index, expressed as the ratio (η1 / η2) to the viscosity η2 (mPa·s) measured by [method], is 0.5 or more and 4.0 or less. <Measurement Condition 3> Equipment: Cone plate viscometer Temperature: 25℃ Cone: Radius 12mm, angle 3° Shear rate: 0.0417s -1 or 0.0117s -1 Sample volume: 0.5 mL Atmosphere: Under the air [8] The composition is exposed to light with a wavelength of 365 nm at a rate of 6,000 mJ / cm using a high-pressure mercury lamp. 2The cured product obtained by irradiating under the conditions of and then heating at 85°C for 1 hour, wherein the glass transition temperature measured by dynamic viscoelasticity measurement under the condition of a heating rate of 5°C / min is 70°C or higher and 150°C or lower, is the composition according to any one of [1] to [7]. [9] The composition is irradiated with light of wavelength 365 nm using a high-pressure mercury lamp at 6,000 mJ / cm 2 In the cured product obtained by irradiating under the conditions of and then heating at 85°C for 1 hour, the water vapor permeability measured in accordance with JIS Z 0208:1976 is 40 g / (m 2 ·24 h) or less, and it is the composition according to any one of [1] to [8].

[10] The composition according to any one of [1] to [9], wherein the tensile shear strength by <tensile shear strength> below is 15.0 MPa or higher and 45.0 MPa or lower. <Tensile shear strength> The composition is applied to the center of the surface of a 25 mm square non-alkali glass to a diameter of 8 mm and a thickness of 8 mm, another non-alkali glass is bonded, the two non-alkali glasses are clamped, and light of wavelength 365 nm is irradiated using a high-pressure mercury lamp at 6,000 mJ / cm 2 After irradiating under the conditions of and heating at 85°C for 1 hour to prepare a test piece, removing the clamp, and bonding SPCC plates with a length of 100 mm, a width of 25 mm, and a thickness of 1.6 mm to the non-alkali glasses on both sides of the test piece using a two-component acrylic adhesive, the tensile shear strength (MPa) when pulling by grasping the two SPCC plates under the conditions of a temperature of 23°C and a tensile speed of 10 mm / min is measured in accordance with JIS K 6850:1999.

[11] The composition according to any one of [1] to

[10] , wherein the reduction rate of tensile shear strength (%) after storage in an environment of 85°C and 85% RH by <reduction rate of tensile shear strength> below is 40% or less. <Reduction rate of tensile shear strength> The composition is applied to the center of a 25mm square piece of alkali-free glass to create a surface with a diameter of 8mm and a thickness of 8mm. Another piece of alkali-free glass is then bonded to it. The two pieces of alkali-free glass are clamped together, and a high-pressure mercury lamp is used to expose them to light of 365nm wavelength at a rate of 6,000mJ / cm². 2 The specimen is irradiated under the specified conditions, heated at 85°C for 1 hour to prepare a test specimen, the clamp is removed, and SPCC plates measuring 100 mm in length, 25 mm in width, and 1.6 mm in thickness are bonded to the alkali-free glass on both sides of the test specimen using a two-part acrylic adhesive. Then, in accordance with JIS K 6850:1999, the tensile shear strength obtained by pulling the two SPCC plates at a temperature of 23°C and a tensile speed of 10 mm / min is defined as the initial tensile shear strength A1 (MPa). The specimen is then left to stand in an environment of 85°C and 85% RH relative humidity for 7 days, and the tensile shear strength measured in the same manner as the initial tensile shear strength A1 is defined as the tensile shear strength A2 (MPa). The percentage decrease in tensile shear strength before and after storage is calculated using the formula: ((A1-A2) / A1)×100.

[12] A composition according to any one of [1] to

[11] that can be applied using a dispenser.

[13] The composition according to any one of [1] to

[12] , wherein the content of the inorganic filler (C) is 10 parts by mass or more and 300 parts by mass or less per 100 parts by mass of the cationic polymerizable compound (A).

[14] The composition according to any one of [1] to

[13] , wherein the content of the cationic polymerizable compound (A) is 20% by mass or more and 90% by mass or less when the entire composition is considered to be 100% by mass.

[15] The composition according to any one of [1] to

[14] , wherein the content of the cationic polymerization initiator (B) is 0.01 parts by mass or more and 5.0 parts by mass or less per 100 parts by mass of the cationic polymerizable compound (A).

[16] The composition according to any one of [1] to

[15] , wherein the cationic polymerizable compound (A) contains an epoxy group.

[17] The composition according to

[16] , wherein the cationic polymerizable compound (A) comprises one or more selected from the group consisting of an alicyclic compound having an epoxy group (A1), an aromatic compound having an epoxy group (A2), and a glycidyl ether compound (A3).

[18] The composition according to any one of [1] to

[17] , wherein the cationic polymerizable compound (A) contains a bromine atom.

[19] The composition according to any one of [1] to

[18] , wherein the cationic polymerization initiator (B) comprises one or more selected from the group consisting of a photocatalytic cationic polymerization initiator (B1) and a thermal cationic polymerization initiator (B2).

[20] The composition according to

[19] , wherein the cationic polymerization initiator (B) comprises an onium salt compound. [twenty one] A composition according to any one of [1] to

[20] , which can be used in a display device as one or two selected from the group consisting of damming agents and filler agents. [twenty two] The composition according to any one of [1] to

[21] , which can be used to encapsulate a light-emitting diode element or a solar cell. [twenty three] The composition according to

[22] , wherein the light-emitting diode element comprises an organic electroluminescent display element or a microLED. [twenty four] The composition according to

[22] , wherein the solar cell comprises a perovskite-type solar cell. [twenty five] A cured body obtained by curing any of the compositions described in [1] to

[24] .

[26] A display device comprising a light-emitting diode element, a substrate, and a cured sealing layer between the light-emitting diode element and the substrate containing the cured body described in

[25] .

[27] The display device according to

[26] , which includes an organic electroluminescent display element or a microLED.

[28] A solar cell comprising a solar cell, a substrate, and a cured sealing layer between the solar cell and the substrate containing the cured body described in

[25] .

[29] The solar cell according to

[28] , wherein the solar cell includes a perovskite type solar cell. [Effects of the Invention]

[0010] According to the present invention, it is possible to provide a composition with improved adhesion to a substrate, and a cured body, a display device, and a solar cell using the composition. [Modes for carrying out the invention]

[0011] 1. Composition The composition of this embodiment comprises a cationic polymerizable compound (A), a cationic polymerization initiator (B), and an inorganic filler (C), wherein the inorganic filler (C) comprises one or more selected from talc, alumina, silica, zeolite, and titanium oxide, and the total amount of one or more selected from talc and alumina is 1 part by mass or more and 100 parts by mass or less when the total amount of the inorganic filler (C) is 100 parts by mass.

[0012] In organic electroluminescent display devices, the organic light-emitting material layer (organic electroluminescent display element) on the substrate is sealed with an inorganic film, filler, and damming agent. However, a problem arose where moisture could penetrate the organic light-emitting material layer through defects in the inorganic film or electrodes in contact with the organic electroluminescent display element, resulting in the formation of non-luminescent areas (dark spots). Therefore, there was a challenge in improving and maintaining the adhesion between the aforementioned filler and damming agents and the substrate.

[0013] The inventors of the present invention investigated the above problem and found that by including a predetermined amount of one or more selected from talc and alumina in the composition, the adhesive strength between the substrate and the composition can be improved. Although the reason for this is not clear, it is presumed that when these inorganic fillers are included, the distance between oxygen and hydrogen in the hydrogen bonds on the surface of the inorganic fillers becomes shorter, and a strong hydrogen bond layer is formed on the surface of the inorganic fillers, thereby improving the adhesive strength between the substrate and the composition.

[0014] The following describes each component contained in the composition of this embodiment.

[0015] [(C) Component: Inorganic filler] In the composition of this embodiment, (C) the inorganic filler comprises one or more selected from talc and alumina. In the composition of this embodiment, the total amount of one or more selected from talc and alumina is, from the viewpoint of improving adhesion to the substrate, 1 part by mass or more, preferably 3 parts by mass or more, more preferably 5 parts by mass or more, even more preferably 7 parts by mass or more, even more preferably 10 parts by mass or more, even more preferably 13 parts by mass or more, even more preferably 15 parts by mass or more, even more preferably 18 parts by mass or more, even more preferably 20 parts by mass or more, even more preferably 30 parts by mass or more, and 100 parts by mass or less, when the total amount of inorganic filler (C) is 100 parts by mass.

[0016] The inorganic filler (C) may also contain talc and silica. The inorganic filler (C) containing talc can further improve adhesion to the substrate. Furthermore, the inorganic filler (C) containing silica can further improve water vapor barrier properties, thereby further suppressing the intrusion of moisture from the outside. In other words, the inorganic filler (C) containing both talc and silica can further improve the balance between adhesion to the substrate and moisture permeability.

[0017] When the inorganic filler (C) contains talc and silica, the ratio of silica content to talc content in the inorganic filler (C) (silica content / talc content) is preferably 1.0 or higher, more preferably 1.5 or higher, even more preferably 2.0 or higher, and still more preferably 2.5 or higher, from the viewpoint of further improving the balance of adhesion to the substrate and water vapor barrier properties. The upper limit is not particularly limited, but may be, for example, 50.0 or lower, 30.0 or lower, 25.0 or lower, 20.0 or lower, 10.0 or lower, 8.0 or lower, 6.0 or lower, or 4.0 or lower.

[0018] In the composition of this embodiment, the inorganic filler (C) preferably comprises one or more selected from the group consisting of talc, alumina, silica, zeolite, and titanium oxide. In the composition of this embodiment, it is preferable to use a combination of two or more inorganic fillers (C). The combination of inorganic fillers (C) is preferably one selected from the group consisting of a combination of silica and talc, a combination of alumina and talc, a combination of titanium oxide and talc, and a combination of silica, talc, and zeolite. Among these, a combination of silica and talc is more preferable from the viewpoint of further improving the balance between adhesion to the substrate and water vapor barrier properties. On the other hand, from the viewpoint of further improving adhesion to the substrate, it is preferable to include talc alone. However, while talc can improve the adhesive strength to the substrate, it is difficult to improve water vapor barrier properties. Therefore, from the viewpoint of further improving the balance between adhesive strength and water vapor barrier properties, it is preferable to combine it with silica, alumina, or the like, which can improve water vapor barrier properties. While silica can improve water vapor barrier properties, it does not easily increase adhesive strength to the substrate. Therefore, it is preferable to combine it with talc, alumina, or other materials that can improve adhesive strength. In the composition of this embodiment, the talc content is preferably 1 part by mass or more, more preferably 3 parts by mass or more, even more preferably 5 parts by mass or more, even more preferably 7 parts by mass or more, even more preferably 10 parts by mass or more, even more preferably 13 parts by mass or more, even more preferably 15 parts by mass or more, even more preferably 18 parts by mass or more, and even more preferably 20 parts by mass or more, from the viewpoint of improving adhesion to the substrate and further improving viscosity and thixotropy, and also preferably 100 parts by mass or less, more preferably 80 parts by mass or less, even more preferably 50 parts by mass or less, and even more preferably 40 parts by mass or less, from the viewpoint of further improving moisture permeability and further suppressing dripping. In the composition of this embodiment, the silica content is preferably 0 parts by mass or more, more preferably 30 parts by mass or more, even more preferably 50 parts by mass or more, and even more preferably 70 parts by mass or more, from the viewpoint of further improving the balance of performance between adhesion to the substrate and water vapor barrier properties, when the total amount of inorganic filler (C) is 100 parts by mass. Furthermore, from the viewpoint of improving adhesion to the substrate, the silica content is preferably 99 parts by mass or less, more preferably 95 parts by mass or less, even more preferably 90 parts by mass or less, even more preferably 85 parts by mass or less, and even more preferably 80 parts by mass or less. In the composition of this embodiment, the alumina content is preferably 50 parts by mass or more, more preferably 70 parts by mass or more, even more preferably 90 parts by mass or more, and preferably 100 parts by mass or less, when the total amount of inorganic filler (C) is 100 parts by mass. In the composition of this embodiment, the zeolite content is preferably 0 parts by mass or more, more preferably 0.1 parts by mass or more, even more preferably 0.2 parts by mass or more, and preferably 1 part by mass or less, when the total amount of inorganic filler (C) is 100 parts by mass, from the viewpoint of further improving the balance of performance in adhesion to the substrate, curability and storage stability. In the composition of this embodiment, the titanium dioxide content is preferably 1 part by mass or more, more preferably 3 parts by mass or more, and preferably 10 parts by mass or less, and more preferably 8 parts by mass or less, when the total amount of inorganic filler (C) is 100 parts by mass. Furthermore, surface-treated titanium oxide can also be used, with alumina-treated titanium oxide being particularly preferred.

[0019] In the composition of this embodiment, the content of inorganic filler (C) is preferably 10 parts by mass or more, more preferably 20 parts by mass or more, even more preferably 30 parts by mass or more, even more preferably 40 parts by mass or more, even more preferably 50 parts by mass or more, even more preferably 70 parts by mass or more, even more preferably 90 parts by mass or more, and preferably 300 parts by mass or less, more preferably 280 parts by mass or less, even more preferably 250 parts by mass or less, even more preferably 200 parts by mass or less, and even more preferably 150 parts by mass or less, from the viewpoint of further improving adhesion to the substrate and further improving water vapor barrier properties, relative to 100 parts by mass of cationic polymerizable compound (A).

[0020] [(A) Component: Cationic polymerizable compound] Component (A) is a compound that is cationically polymerizable, or can be described as a compound having a cationically polymerizable group. Examples of cationically polymerizable groups include cyclic ether groups such as epoxy groups (oxirane rings) and oxetane groups (oxetane rings); and cationically polymerizable vinyl groups. It is preferable that component (A) contains an epoxy group. In other words, component (A) preferably comprises one or more selected from the group consisting of epoxy compounds, oxetane compounds, and cationic polymerizable vinyl compounds, and more preferably comprises an epoxy compound. Examples of epoxy compounds include alicyclic compounds having an epoxy group (A1) (alicyclic epoxy compound), aromatic compounds having an epoxy group (A2) (aromatic epoxy compound), and glycidyl ether compounds (A3).

[0021] Component (A) may be a compound having one cationic polymerizable group, or it may be a compound having two or more cationic polymerizable groups. Component (A) preferably has two or more cationic polymerizable groups, and more preferably has two cationic polymerizable groups.

[0022] Component (A) preferably comprises one or more compounds selected from the group consisting of an alicyclic compound having an epoxy group (A1), an aromatic compound having an epoxy group (A2), and a glycidyl ether compound (A3), from the viewpoint of further improving coatability and further improving the balance of adhesion to the substrate and transparency, and more preferably comprises an alicyclic compound having an epoxy group (A1), an aromatic compound having an epoxy group (A2), and a glycidyl ether compound (A3). Furthermore, component (A) preferably comprises an alicyclic compound having an epoxy group (A1) and an aromatic compound having an epoxy group (A2).

[0023] Component (A) preferably contains a bromine atom from the viewpoint of further improving water vapor barrier properties. Here, component (A) containing a bromine atom means containing a bromine atom-containing compound.

[0024] Component (A) is preferably thermopolymerizable.

[0025] (Component A1: Alicyclic compound containing an epoxy group) Component (A1) is a compound having an epoxy group and an alicyclic group. Component (A1) may be a compound having one epoxy group, or it may be a compound having two or more epoxy groups. Component (A1) preferably has two or more epoxy groups, more preferably has two epoxy groups. Component (A1) may be a compound that does not have an aromatic ring. Component (A1) can be used alone or in combination of two or more.

[0026] Component (A1) may be, for example, a compound obtained by epoxidizing a compound having a cycloalkene ring, or a derivative thereof. Examples of cycloalkene rings include cyclohexene rings, cyclopentene rings, and pinene rings. Epoxidation can be carried out, for example, using an oxidizing agent. Examples of oxidizing agents include hydrogen peroxide and peracids. Examples of such (A1) components include one or more selected from the group consisting of 3',4'-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, 3,4-epoxycyclohexylalkyl (meth)acrylate (e.g., 3,4-epoxycyclohexylmethyl (meth)acrylate), and (3,3',4,4'-diepoxy)bicyclohexyl.

[0027] Component (A1) may be, for example, a compound obtained by hydrogenating a compound having an epoxy group and an aromatic ring, or a derivative thereof. Examples of compounds having an epoxy group and an aromatic ring include bisphenol A type epoxy resin and bisphenol F type epoxy resin. Examples of such a (A1) component include hydrogenated bisphenol A type epoxy resin and hydrogenated bisphenol F type epoxy resin.

[0028] Component (A1) is preferably a compound having a 1,2-epoxycyclohexane structure. As a compound having a 1,2-epoxycyclohexane structure, for example, a compound represented by formula (A1-1) is preferred.

[0029] [ka]

[0030] In formula (A1-1), X represents a single bond or a linking group (a divalent group having one or more atoms).

[0031] When X is a single bond, the compound represented by formula (A1-1) is (3,3',4,4'-diepoxy)bicyclohexyl.

[0032] The linking group may be, for example, a divalent hydrocarbon group, a carbonyl group, an ether bond, an ester bond, a carbonate group, an amide bond, or a group formed by linking multiple such groups. X is preferably a linking group. The linking group is preferably a group having an ester bond, and more preferably a group linking an ester bond and a divalent hydrocarbon group. An example of a compound having a group with an ester bond as a linking group is 3',4'-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate (molecular weight 252).

[0033] The divalent hydrocarbon group is preferably an alkanediyl group, and more preferably an alkanediyl group having 1 to 3 carbon atoms.

[0034] The compound represented by formula (A1-1) is preferably 3',4'-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate.

[0035] The molecular weight of component (A1) is preferably 1000 or less, more preferably 800 or less, even more preferably 500 or less, and even more preferably 300 or less, from the viewpoint of further improving the applicability and storage stability. Furthermore, the molecular weight of component (A1) may be, for example, 100 or more, 150 or more, or 200 or more.

[0036] If component (A1) has a molecular weight distribution, the number-average molecular weight of component (A1) is preferably within the above range. In this specification, the number-average molecular weight is the polystyrene-converted value measured by gel permeation chromatography (GPC) under the following measurement conditions. • Solvent (mobile phase): THF • Degassing device: ERMA ERC-3310 • Pump: PU-980 manufactured by JASCO Corporation ·Flow rate: 1.0ml / min • Autosampler: Tosoh Corporation AS-8020 • Column oven: Hitachi L-5030 ·Set temperature: 40℃ • Column configuration: Two Tosoh TSKguardcolumnMP (×L) 6.0mm ID × 4.0cm columns, and two Tosoh TSK-GELMULTIPORE HXL-M 7.8mm ID × 30.0cm columns, for a total of four columns. • Detector: RI Hitachi L-3350 • Data processing: SIC480 data station

[0037] From the viewpoint of further improving the balance of coating properties and durability, the content of component (A1) in the composition of this embodiment is preferably 5 parts by mass or more, more preferably 10 parts by mass or more, even more preferably 15 parts by mass or more, even more preferably 20 parts by mass or more, and preferably 60 parts by mass or less, more preferably 50 parts by mass or less, even more preferably 40 parts by mass or less, and even more preferably 30 parts by mass or less, when the total amount of component (A) in the composition of this embodiment is 100 parts by mass.

[0038] (Component A2: Aromatic compound containing an epoxy group) Component (A2) is a compound having an epoxy group and an aromatic ring. Component (A2) may be a compound having one epoxy group, or it may be a compound having two or more epoxy groups. Component (A2) preferably has two or more epoxy groups, and more preferably has two epoxy groups. Component (A2) may be a compound that does not have an alicyclic group. Component (A2) can be used alone or in combination of two or more.

[0039] Component (A2) can be a monomer, oligomer, or polymer, and examples include one or more selected from the group consisting of bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, biphenyl type epoxy resin, naphthalene type epoxy resin, fluorene type epoxy resin, novolac phenol type epoxy resin, cresol novolac type epoxy resin, and modified versions thereof. Furthermore, component (A2) can be one or more selected from the group consisting of halophenyl glycidyl ethers such as bromophenyl glycidyl ether and dibromophenyl glycidyl ether; bromine atom-containing epoxy resins such as brominated bisphenol A type epoxy resin, brominated bisphenol F type novolac type epoxy resin, and brominated phenol novolac type epoxy resin; and bromine atom-containing aromatic epoxy compounds. Halophenyl glycidyl ether is preferred as the bromine atom-containing aromatic epoxy compound. Dibromophenyl glycidyl ether is preferred as the halophenyl glycidyl ether.

[0040] Component (A2) preferably comprises one or more compounds selected from the group consisting of compounds having a bisphenol structure (e.g., bisphenol A structure, bisphenol F structure, bisphenol S structure, etc.) and bromine atom-containing aromatic epoxy compounds, more preferably comprising one or more compounds selected from the group consisting of bisphenol A type epoxy resin, bisphenol F type epoxy resin and halophenyl glycidyl ether, even more preferably comprising one or more compounds selected from the group consisting of bisphenol A type epoxy resin, bisphenol F type epoxy resin and dibromophenyl glycidyl ether, and even more preferably comprising at least one compound selected from the group consisting of bisphenol F type epoxy resin and dibromophenyl glycidyl ether.

[0041] (A2) The molecular weight of component (A2) is preferably 100 or more, more preferably 150 or more, even more preferably 200 or more, even more preferably 300 or more, and preferably 5000 or less, more preferably 1000 or less, even more preferably 800 or less, and even more preferably 700 or less, from the viewpoint of further improving the balance of performance in terms of applicability and storage stability.

[0042] If component (A2) has a molecular weight distribution, it is preferable that the number-average molecular weight of component (A2) is within the above range. In this specification, the number-average molecular weight refers to the polystyrene-converted value measured by gel permeation chromatography (GPC) under the measurement conditions described above.

[0043] From the viewpoint of improving the balance of coating properties and durability, the content of component (A2) in the composition of this embodiment is preferably 5 parts by mass or more, more preferably 10 parts by mass or more, preferably 30 parts by mass or more, even more preferably 50 parts by mass or more, even more preferably 60 parts by mass or more, even more preferably 70 parts by mass or more, and preferably 90 parts by mass or less, more preferably 85 parts by mass or less, when the total amount of component (A) in the composition of this embodiment is 100 parts by mass.

[0044] ((A3) component: glycidyl ether compound) Component (A3) is a compound having a glycidyl ether group. Component (A3) may be a compound having one epoxy group, or it may be a compound having two or more epoxy groups. Component (A3) preferably has two or more epoxy groups, and more preferably has two epoxy groups. Component (A3) may be a compound that does not have an alicyclic group or an aromatic ring. Component (A3) can be used alone or in combination of two or more. Component (A3) preferably excludes components (A1) and (A2).

[0045] (A3) Component is preferably a diglycidyl ether compound. The diglycidyl ether compound preferably includes one or more selected from the group consisting of: diglycidyl ethers of alkylene glycols such as ethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, 1,6-hexanediol diglycidyl ether, and neopentyl glycol diglycidyl ether; polyglycidyl ethers of polyhydric alcohols such as di or triglycidyl ether of glycerin or its alkylene oxide adduct; and diglycidyl ethers of polyalkylene glycols such as polyethylene glycol or its alkylene oxide adduct, and diglycidyl ether of polyalkylene glycols such as polypropylene glycol or its alkylene oxide adduct, and preferably includes diglycidyl ether of alkylene glycol. The diglycidyl ether of alkylene glycol preferably includes one or more selected from the group consisting of diglycidyl ether of ethylene glycol, diglycidyl ether of propylene glycol, diglycidyl ether of 1,6-hexanediol, and diglycidyl ether of neopentyl glycol, and more preferably includes one or more selected from the group consisting of diglycidyl ether of 1,6-hexanediol and diglycidyl ether of neopentyl glycol. Examples of alkylene glycols include ethylene glycol, propylene glycol, 1,6-hexanediol, and neopentyl glycol. Examples of polyalkylene glycols include polyethylene glycol or its alkylene oxide adducts, and polypropylene glycol or its alkylene oxide adducts. Examples of alkylene oxides include ethylene oxide and propylene oxide.

[0046] From the viewpoint of further improving the balance of coating properties and durability, the content of component (A3) in the composition of this embodiment is preferably 0.1 parts by mass or more, more preferably 0.2 parts by mass or more, even more preferably 0.5 parts by mass or more, even more preferably 1.0 part by mass or more, even more preferably 1.5 parts by mass or more, and preferably 20 parts by mass or less, more preferably 15 parts by mass or less, even more preferably 10 parts by mass or less, even more preferably 5 parts by mass or less, and even more preferably 3 parts by mass or less.

[0047] The total content of components (A1), (A2), and (A3) in the composition of this embodiment is preferably 60 parts by mass or more, more preferably 70 parts by mass or more, even more preferably 80 parts by mass or more, even more preferably 95 parts by mass or more, even more preferably 98 parts by mass or more, and for example, 100 parts by mass or less, when the total amount of component (A) in the composition of this embodiment is 100 parts by mass.

[0048] In the composition of this embodiment, the content of the cationic polymerizable compound (A) is preferably 20% by mass or more, more preferably 25% by mass or more, even more preferably 30% by mass or more, even more preferably 35% by mass or more, even more preferably 40% by mass or more, and preferably 90% by mass or less, more preferably 85% by mass or less, even more preferably 80% by mass or less, even more preferably 75% by mass or less, and even more preferably 70% by mass or less, when the entire composition is considered as 100% by mass.

[0049] [(B) Cationic polymerization initiator] Component (B) can be one or more selected from the group consisting of a photocatalytic polymerization initiator (B1) that can be activated by light to initiate the cationic polymerization of component (A), and a thermal cationic polymerization initiator (B2) that can be activated by heat to initiate the cationic polymerization of component (A), with the photocatalytic polymerization initiator (B1) being preferred.

[0050] Examples of photocationic polymerization initiators (B1) include aryl sulfonium salt derivatives (e.g., Dow Chemical's Cyracure UVI-6990, Cyracure UVI-6974; ADEKA's ADEKA Optomer SP-150, ADEKA Optomer SP-152, ADEKA Optomer SP-170, ADEKA Optomer SP-172; Sunapro's CPI-100P, CPI-101A, CPI-200K, CPI-210S, CPI-310FG, LW-S1; Doublebond's CibaCure-1190, etc.), aryl iodonium salt derivatives (e.g., Ciba Specialty Chemicals' Irgacure 250; Rhodia Japan's RP-2074, etc.), allen-ion complex derivatives, diazonium salt derivatives, triazine-based initiators, and other acid generators such as halides.

[0051] Examples of thermal cationic polymerization initiators (B2) include any thermal cationic polymerization initiator that is activated by heating and induces ring-opening of ring-opening polymerizable groups. Examples of thermal cationic polymerization initiators include onium salt compounds such as quaternary ammonium salts, phosphonium salts, and sulfonium salts. Examples of commercially available thermal cationic polymerization initiators (B2) include ADEKA-Opton CP-66, ADEKA-Opton CP-77 (manufactured by ADEKA Corporation), San-Aid SI-60L, San-Aid SI-80L, San-Aid SI-100L (manufactured by Sanshin Chemical Industry Co., Ltd.), and the CI series (manufactured by Nippon Soda Co., Ltd.).

[0052] (B) Component preferably includes an onium salt compound, from the viewpoint of obtaining the above-mentioned effects by using two or more curing retarders. The onium salt compound preferably includes one or more selected from the group consisting of arylsulfonium salt derivatives, aryliodonium salt derivatives, and diazonium salt derivatives, and more preferably includes an arylsulfonium salt derivative. The anion preferably includes one or more selected from the group consisting of antimonates and gallates.

[0053] Component (B) may be used in a state where it is dissolved in a solvent beforehand in order to facilitate mixing with other components such as component (A). The solvent is not particularly limited, but examples include carbonates such as propylene carbonate, ethylene carbonate, 1,2-butylene carbonate, dimethyl carbonate, and diethyl carbonate.

[0054] The content of component (B) in the composition of this embodiment is preferably 0.01 parts by mass or more, more preferably 0.05 parts by mass or more, even more preferably 0.10 parts by mass or more, even more preferably 0.30 parts by mass or more, even more preferably 0.50 parts by mass or more, and even more preferably 0.80 parts by mass or more, per 100 parts by mass of component (A), from the viewpoint of further improving curability, and preferably 5.0 parts by mass or less, more preferably 4.0 parts by mass or less, even more preferably 3.0 parts by mass or less, and even more preferably 2.5 parts by mass or less, from the viewpoint of further improving the adhesive durability of the cured product.

[0055] [(X) Ingredient: Curing retarder] The composition of this embodiment preferably includes a curing retarder as component (X). Component (X) preferably comprises one or more selected from the group consisting of a phosphate-based curing retarder (component (D)), an ether-based curing retarder (component (E)), a thioether-based curing retarder (component (F)), a metal complex-based curing retarder (component (G)), and a nitroxyl radical-based curing retarder (component (H)), and more preferably comprises one or more selected from the group consisting of a phosphate-based curing retarder (component (D)) and an ether-based curing retarder (component (E)).

[0056] The content of component (X) in the composition of this embodiment is preferably 0.10 parts by mass or more, more preferably 0.20 parts by mass or more, even more preferably 0.50 parts by mass or more, even more preferably 0.80 parts by mass or more, even more preferably 1.0 part by mass or more, and even more preferably 2.0 parts by mass or more, per 100 parts by mass of component (A), from the viewpoint of obtaining a longer pot life, and preferably 10.0 parts by mass or less, more preferably 8.0 parts by mass or less, and even more preferably 5.0 parts by mass or less, from the viewpoint of further improving the balance of moisture permeability and adhesiveness performance of the cured body.

[0057] (Component D: Phosphate-based curing retarder) The phosphate-based curing retarder is a curing retarder selected from the group consisting of phosphate esters (component (D1)) and phosphite esters (component (D2)). Component (D) can be used alone or in combination of two or more.

[0058] Examples of component (D1) include diethylbenzyl phosphate, trimethyl phosphate, triethyl phosphate, tri-n-butyl phosphate, tris(butoxyethyl) phosphate, tris(2-ethylhexyl) phosphate, (RO)3P=O (where R is a lauryl group, cetyl group, stearyl group, or oleyl group), tris(2-chloroethyl) phosphate, tris(2-dichloropropyl) phosphate, triphenyl phosphate, butyl pyrophosphate, tricresyl phosphate, trixylenyl phosphate, octyldiphenyl phosphate, cresyldiphenyl phosphate, xylenyldiphosphate, monobutyl phosphate, dibutyl phosphate, di-2-ethylhexyl phosphate, monoisodecyl phosphate, ammonium ethyl acid phosphate, and 2-ethylhexyl acid phosphate salts. Component (D1) can be used individually or in combination of two or more.

[0059] Component (D1) preferably comprises one or more compounds selected from the group consisting of compounds represented by formula (D1-1), compounds represented by formula (D1-2), and compounds represented by formula (D1-3), from the viewpoint of moderate reactivity to cations and reduction of outgassing, and more preferably comprises a compound represented by formula (D1-2).

[0060] [ka]

[0061] [ka]

[0062] [ka]

[0063] In equations (D1-1), (D1-2), and (D1-3), R 1 , R 2 , R 3 , R 4 , R 5 and R 6 Each of these independently represents a hydrocarbon group which may have substituents.

[0064] R in equation (D1-2) 2 , R 3 and R 4 , and also R in equation (D1-3) 5 and R 6 It is preferable that the group is the same in each formula.

[0065] R 1 , R 2 , R 3 , R 4 , R 5 and R 6 Examples of substituents that the hydrocarbon group in R may have include oxyalkyl groups. 1 , R 2 , R 3 , R4 , R 5 and R 6 The hydrocarbon group in this is preferably an unsubstituted hydrocarbon group.

[0066] R 1 , R 2 , R 3 , R 4 , R 5 and R 6 The hydrocarbon group in is preferably an alkyl group or an aryl group, more preferably an alkyl group or a phenyl group, and even more preferably an alkyl group. The number of carbon atoms in the alkyl group may be, for example, 1 to 18, and preferably 4 to 13.

[0067] Examples of compounds represented by formula (D1-1) include monoalkyl phosphates (i.e., R 1 This may be a compound in which the parent molecule is an alkyl group, and specific examples include monoethyl phosphate, mono-n-butyl phosphate, mono(butoxyethyl) phosphate, mono(2-ethylhexyl) phosphate, etc.

[0068] Compounds represented by formula (D1-2) include trialkyl phosphates (i.e., R 2 , R 3 and R 4 A compound in which R is an alkyl group is preferred. 2 , R 3 and R 4 The number of carbon atoms in the alkyl group is preferably 1 to 18, more preferably 4 to 12, and even more preferably 8.

[0069] Specific examples of trialkyl phosphates include triethyl phosphate, tri-n-butyl phosphate, tris(butoxyethyl) phosphate, tris(2-ethylhexyl) phosphate, and (RO)3P=O (where R is a lauryl group, cetyl group, stearyl group, or oleyl group).

[0070] Compounds represented by formula (D1-3) include, for example, dialkyl phosphates (i.e., R 5 and R 6 Examples include compounds in which the parent molecule is an alkyl group. Specific examples of dialkyl phosphates include dibutyl phosphate and bis(2-ethylhexyl) phosphate.

[0071] The (D2) component is a phosphite ester. Examples of the (D2) component include trimethyl phosphite, triethyl phosphite, tri-n-butyl phosphite, tris(2-ethylhexyl) phosphite, triisooctyl phosphite, tridecyl phosphite, triisodecyl phosphite, tris(tridecyl) phosphite, trioleyl phosphite, tristearyl phosphite, triphenyl phosphite, tris(nonylphenyl) phosphite, tris(2,4-di-t-butylphenyl) phosphite, phenyldiisooctyl phosphite, phenyldiisodecyl phosphite, diphenyl mono(2-ethylhexyl) phosphite, diphenylisooctyl phosphite, diphenyl monodecyl phosphite, diphenyl monoisodecyl phosphite, diphenyl mono(tridecyl) phosphite, bis(nonylphenyl)dinonylphenyl phosphite, and tetraphenyldipropylene glycoside. Examples include di(D2) diphosphite, poly(dipropylene glycol)phenyl phosphite, diisodecyl pentaerythritol diphosphite, bis(tridecyl) pentaerythritol diphosphite, distearyl pentaerythritol diphosphite, bis(nonylphenyl) pentaerythritol diphosphite, tetraphenyltetra(tridecyl) pentaerythritol tetraphosphite, tetra(tridecyl)-4,4'-isopropylidene diphenyl phosphite, trilauryl trithiophosphite, dimethyl hydrogen phosphite, dibutyl hydrogen phosphite, di(2-ethylhexyl) hydrogen phosphite, dilauryl hydrogen phosphite, dioleyl hydrogen phosphite, diphenyl hydrogen phosphite, diphenyl mono(2-ethylhexyl) phosphite, diphenyl mono(tridecyl) phosphite, etc. Component (D2) can be used alone or in combination of two or more.

[0072] Component (D2) preferably includes one or more compounds selected from the group consisting of the compound represented by formula (D2-1), the compound represented by formula (D2-2), the compound represented by formula (D2-3), the compound represented by formula (D2-4), the compound represented by formula (D2-5), and the compound represented by formula (D2-6), from the viewpoint of appropriate reactivity to cations.

[0073] [ka]

[0074] [ka]

[0075] [ka]

[0076] [ka]

[0077] [ka]

[0078] [ka]

[0079] In formulas (D2-1) to (D2-6), R 7 , R 8 , R 9 , R 10 , R 11 , R 12 , R 13 , R 14 , R 15 , R 16 and R 17 Each of these independently represents a hydrocarbon group which may have substituents.

[0080] R 7 、R 8 、R 9 、R 10 、R 11 、R 12 、R 13 、R 14 、R 15 、R 16 and R 17 Examples of the substituent that the hydrocarbon group in may have include, for example, an oxyalkyl group and the like. R 7 、R 8 、R 9 、R 10 、R 11 、R 12 、R 13 、R 14 、R 15 、R 16 and R 17 The hydrocarbon group in and is preferably an unsubstituted hydrocarbon group.

[0081] R 7 、R 8 、R 9 、R 10 、R 11 、R 12 、R 13 、R 14 、R 15 、R 16 and R 17 The hydrocarbon group in and is preferably an alkyl group or an aryl group, more preferably an alkyl group or a phenyl group, and still more preferably an alkyl group. The number of carbon atoms of the alkyl group may be, for example, 1 or more and 30 or less, preferably 1 or more and 18 or less. As the aryl group, a phenyl group is preferred.

[0082] R in formula (D2-2) 8 and R 9 、R in formula (D2-3) 10 、R 11 and R 12 、R in formula (D2-4) 13 and R 14 、and R in formula (D2-5) 15 and R 16It is preferable that these elements are identical to each other in each formula.

[0083] Examples of compounds represented by formula (D2-1) include monoalkyl phosphites (i.e., R 7 Examples include compounds in which the alkyl group is.

[0084] Examples of compounds represented by formula (D2-2) include dialkylphosphites (i.e., R 8 and R 9 Examples include compounds in which the alkyl group is.

[0085] Examples of compounds represented by formula (D2-3) include trialkylphosphites (i.e., R 10 , R 11 and R 12 Compounds in which R is an alkyl group), phenyl phosphite (i.e., R 10 , R 11 and R 12 Examples include compounds in which one or more of the groups are phenyl groups. Specific examples of trialkyl phosphites include triethyl phosphite, tris(2-ethylhexyl) phosphite, tridecyl phosphite, trilauryl phosphite, tris(tridecyl) phosphite, and trioleyl phosphite. Specific examples of phenyl phosphites include diphenyl monodecyl phosphite.

[0086] Examples of compounds represented by formula (D2-4) include bis(alkyl)pentaerythritol diphosphite (i.e., R 13 and R 14 Examples include compounds in which the parentheses are alkyl groups. Specific examples of compounds represented by formula (D2-4) include bis(decyl)pentaerythritol diphosphite, bis(tridecyl)pentaerythritol diphosphite, and distearylpentaerythritol diphosphite.

[0087] Compounds represented by formula (D2-5) include, for example, dialkylhydrogen phosphates (i.e., R15 and R 16 Examples include compounds in which the parentheses are alkyl groups. Specific examples of compounds represented by formula (D2-5) include diethyl hydrogen phosphite, bis(2-ethylhexyl) hydrogen phosphite, dilauryl hydrogen phosphite, and dioleyl hydrogen phosphite.

[0088] Examples of compounds represented by formula (D2-6) include monoalkyl hydrogen phosphates (i.e., R 17 Examples include compounds in which the parentheses are alkyl groups. Specific examples of compounds represented by formula (D2-6) include monoethyl hydrogen phosphite, mono(2-ethylhexyl) hydrogen phosphite, monolauryl hydrogen phosphite, and monooleyl hydrogen phosphite.

[0089] (D2) Components include trimethyl phosphite, triethyl phosphite, tri-n-butyl phosphite, tris(2-ethylhexyl) phosphite, triisooctyl phosphite, tridecyl phosphite, triisodecyl phosphite, tris(tridecyl) phosphite, trioleyl phosphite, tristearyl phosphite, triphenyl phosphite, tris(nonylphenyl) phosphite, diisodecyl pentaerythritol diphosphite, bis(tridecyl)pentaerythritol diphosphite, distearyl pentaerythritol diphosphite, bis(nonylphenyl)pentaerythritol diphosphite, dimethylhydrogen phosphite, dibutylhydrogen It is preferable to include one or more selected from the group consisting of hydroxylogen phosphite, di(2-ethylhexyl)hydrogen phosphite, dilaurylhydrogen phosphite, and dioleylhydrogen phosphite, and more preferably to include one or more selected from the group consisting of trimethyl phosphite, triethyl phosphite, tri-n-butyl phosphite, tris(2-ethylhexyl) phosphite, triisooctyl phosphite, tridecyl phosphite, triisodecyl phosphite, tris(tridecyl) phosphite, trioleyl phosphite, tristearyl phosphite, triphenyl phosphite, and tris(nonylphenyl) phosphite.

[0090] When the composition of this embodiment contains component (D), the content of component (D) in the composition of this embodiment is preferably 0.001 parts by mass or more, more preferably 0.005 parts by mass or more, even more preferably 0.01 parts by mass or more, even more preferably 0.02 parts by mass or more, even more preferably 0.05 parts by mass or more, even more preferably 0.10 parts by mass or more, and even more preferably 0.30 parts by mass or more, from the viewpoint of obtaining a longer pot life, and from the viewpoint of further improving the balance of moisture permeability and adhesiveness performance of the cured body, it is preferably 5.0 parts by mass or less, more preferably 3.0 parts by mass or less, and even more preferably 2.0 parts by mass or less.

[0091] (Component (E): Ether-based curing retarder) Component (E) is a curing retarder having an ether bond. Component (E) can be used alone or in combination of two or more types.

[0092] Component (E) may be a linear ether or a cyclic ether. Examples of linear ethers include polyalkylene oxides such as polyethylene glycol, polypropylene glycol, and polyoxytetramethylene glycol. Examples of polyalkylene oxides include polyoxyethylene-dimethyl ether. Examples of cyclic ethers include crown ethers. Examples of crown ethers include 18-crown-6-ether and 15-crown-5-ether.

[0093] Component (E) is preferably a cyclic ether, more preferably a crown ether, and even more preferably an 18-crown-6-ether, from the viewpoint of appropriate reactivity to cations.

[0094] When the composition of this embodiment contains component (E), the content of component (E) in the composition of this embodiment is preferably 0.01 parts by mass or more, more preferably 0.05 parts by mass or more, even more preferably 0.10 parts by mass or more, even more preferably 0.50 parts by mass or more, even more preferably 0.80 parts by mass or more, and even more preferably 1.0 part by mass or more, per 100 parts by mass of component (A), from the viewpoint of obtaining a longer pot life, and preferably 10.0 parts by mass or less, more preferably 8.0 parts by mass or less, even more preferably 5.0 parts by mass or less, and even more preferably 3.0 parts by mass or less, from the viewpoint of further improving the balance of moisture permeability and adhesiveness performance.

[0095] (Component (F): Thioether-based curing retarder) Component (F) is a curing retarder having a thioether bond. Component (F) can be used alone or in combination of two or more types.

[0096] Component (F) may be a linear thioether or a cyclic thioether. Examples of linear thioethers include diethyl thioether, isobutyl sulfide, and dithiaoctanediol. Examples of cyclic thioethers include 1,3-dithiane, 1,3,5-trithiane, 1,4,7-trithiacyclononane, and 1,4,8,11-tetrathiacyclotetradecane.

[0097] (Component (G): Metal complex-based curing retarder) Component (G) can be any metal complex that functions as a curing retarder. Examples of component (G) include metal acetylacetonates. Component (G) can be used alone or in combination of two or more.

[0098] Examples of metal acetylacetonates include aluminum, titanium, zinc, zirconium, or copper acetylacetonates. Of these, aluminum or zinc acetylacetonates are preferred, and aluminum acetylacetonates are more preferred.

[0099] (Component (H): Nitroloxyl radical-based curing retarder) Component (H) is a curing retarder having a nitroxide group. Component (H) can be used alone or in combination of two or more types.

[0100] (H) Component includes, for example, 2,2,6,6-tetramethyl-1-piperidinyloxy (hereinafter referred to as TEMPO) or its derivatives such as 4-benzooxyloxy-TEMPO, 4-methoxy-TEMPO, 4-carboxyl-4-amino-TEMPO, 4-chloro-TEMPO, 4-hydroxyruymine-TEMPO, 4-hydroxy-TEMPO, 4-oxo-TEMPO, 4-amino-TEMPO, etc.; 2,2,5,5-tetramethyl-1-pyrrolidinyloxy (hereinafter referred to as PROXYL) or its derivatives such as 3-carboxyl-PROXYL, 3-carbamoyl-PROXYL, 2,2-dimethyl-4,5-cyclohexyl-PROXYL, 3-oxo-PROXYL, 3-hydroxyruymine- Examples include PROXYL, 3-aminomethyl-PROXYL, 3-methoxy-PROXYL, 3-t-butyl-PROXYL, 3-maleimide-PROXYL, 3,4-di-t-butyl-PROXYL, 3-carboxylic-2,2,5,5-tetramethyl-1-pyrrolidinyloxy, etc.; dialkylnitroxide radicals or their derivatives such as di-t-butylnitroxide and t-butyl-t-amylnitroxide; diarylnitroxide radicals or their derivatives such as diphenylnitroxide; 4,4-dimethyl-1-oxazolidinyloxy (DOXYL) or its derivatives such as 2-di-t-butyl-DOXYL, 5-decane-DOXYL, and 2-cyclohexane-DOXYL; and so on.

[0101] (H) component is preferably 2,2,6,6-tetramethyl-1-piperidinyloxy.

[0102] When the composition of this embodiment contains component (H), the content of component (H) in the composition of this embodiment is preferably 0.01 parts by mass or more, more preferably 0.02 parts by mass or more, per 100 parts by mass of component (A), from the viewpoint of obtaining a longer pot life, and preferably 2.0 parts by mass or less, more preferably 1.0 part by mass or less, from the viewpoint of further improving the balance of moisture permeability and adhesiveness performance.

[0103] The composition of this embodiment preferably contains component (D) and component (E) as component (X). When the composition of this embodiment contains component (D) and component (E), the mass ratio (D1 / E1) of the content of component (D) D1 to the content of component (E) E1 is preferably 0.001 or more, more preferably 0.005 or more, even more preferably 0.01 or more, even more preferably 0.05 or more, even more preferably 0.10 or more, and even more preferably 0.20 or more from the viewpoint of further improving the balance of moisture permeability and adhesiveness performance, and is preferably 2.0 or less, more preferably 1.5 or less, and even more preferably 1.0 or less from the viewpoint of further improving the balance of moisture permeability and adhesiveness performance.

[0104] The total content of components (A), (B), and (X) in the composition of this embodiment is preferably 20% by mass or more, more preferably 25% by mass or more, even more preferably 30% by mass or more, even more preferably 35% by mass or more, even more preferably 40% by mass or more, even more preferably 45% by mass or more, and preferably 100% by mass or less, more preferably 90% by mass or less, and even more preferably 80% by mass or less, when the total amount of the composition of this embodiment is considered as 100% by mass, from the viewpoint of further improving the applicability.

[0105] [(I) Ingredient: Photosensitizer] The composition of this embodiment preferably includes a photosensitizer as component (I). By using a photocationic polymerization initiator (B1) and a photosensitizer (I) in combination, the photopolymerizability can be further improved. The photosensitizer (I) is not particularly limited and any known one can be used, for example, 9-hydroxymethylanthracene, 9,10-dimethoxyanthracene, 9,10-diethoxyanthracene, 9,10-dipropoxyanthracene, 9,10-dibutoxyanthracene, 9,10-dimethoxy-2-ethylanthracene, 9,10-diethoxy-2-ethylanthracene, 9,10-dipropoxy-2-ethylanthracene, 9,10-dimethoxy-2-chloroanthracene, 9,10-bis(octanoyloxy)anthracene, 9,10-dimethoxyant Examples include methyl spiral-2-sulfonate, methyl 9,10-diethoxyanthracene-2-sulfonate, methyl 9,10-dimethoxyanthracene-2-carboxylate, thioxanthone, 2-isopropylthioxanthone, 4-isopropylthioxanthone, 2-chlorothioxanthone, 2,4-dimethylthioxanthone, 2,4-diethylthioxanthone, 2,4-diisopropylthioxanthone, anthraquinone, 1,2-dihydroxyanthraquinone, 2-ethylanthraquinone, and 1,4-diethoxynaphthalene.

[0106] In the composition of this embodiment, the content of the photosensitizer (I) is preferably 0.01% by mass or more, more preferably 0.03% by mass or more, even more preferably 0.05% by mass or more, even more preferably 0.08% by mass or more, and preferably 5% by mass or less, more preferably 3% by mass or less, even more preferably 1.5% by mass or less, and even more preferably 1% by mass or less, when the entire composition is considered as 100% by mass, from the viewpoint of further improving curability.

[0107] [(J) Component: Silane coupling agent] The composition of this embodiment preferably contains a silane coupling agent as component (J). Examples of component (J) include epoxysilane, isocyanatesilane, aminosilane, mercaptosilane, vinylsilane, and methacrylicsilane. Among these, from the viewpoint of further improving adhesion, component (J) preferably includes one or two selected from the group consisting of epoxysilane and aminosilane.

[0108] Examples of epoxysilanes include 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, and 3-glycidoxypropylmethyldiethoxysilane. Examples of aminosilanes include 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, N-2(aminoethyl)3-aminopropylmethyldimethoxysilane, N-2(aminoethyl)3-aminopropyltrimethoxysilane, and N-phenyl-3-aminopropyltrimethoxysilane.

[0109] In the composition of this embodiment, the content of the silane coupling agent (J) is preferably 0.1% by mass or more, more preferably 0.3% by mass or more, even more preferably 0.5% by mass or more, even more preferably 0.8% by mass or more, and preferably 10% by mass or less, more preferably 5% by mass or less, even more preferably 3% by mass or less, and even more preferably 1.5% by mass or less, when the entire composition is considered as 100% by mass, from the viewpoint of further improving adhesion.

[0110] (Other ingredients) The composition of this embodiment may further contain other components besides components (A), (B), and (X).

[0111] Other components include, for example, antioxidants, resin particles, metal deactivators, fillers, stabilizers, neutralizing agents, lubricants, and antibacterial agents.

[0112] The method for producing the composition of this embodiment is not particularly limited as long as the above components are sufficiently mixed. The method for mixing each component is not particularly limited, but examples include a stirring method that utilizes the stirring force associated with the rotation of a propeller, and a method that utilizes a conventional disperser such as a planetary agitator that rotates and revolves. These mixing methods are preferred because they are low-cost and allow for stable mixing.

[0113] The composition of this embodiment can be cured by a curing method corresponding to its composition.

[0114] For example, in the case of a thermosetting composition, it can be cured by heating. From the viewpoint of further improving curability, the heating temperature of the composition is preferably 45°C or higher, more preferably 50°C or higher, even more preferably 55°C or higher, even more preferably 60°C or higher, even more preferably 65°C or higher, even more preferably 70°C or higher, even more preferably 75°C or higher, even more preferably 80°C or higher, and even more preferably 85°C or higher. From the viewpoint of preventing deterioration, it is, for example, 200°C or lower, preferably 150°C or lower, more preferably 120°C or lower, even more preferably 110°C or lower, even more preferably 105°C or lower, even more preferably 100°C or lower, and even more preferably 95°C or lower.

[0115] For example, if it is a light-curing composition, it can be cured by light irradiation. The light source used for irradiation is not particularly limited and includes, for example, halogen lamps, metal halide lamps, high-power metal halide lamps (containing indium, etc.), low-pressure mercury lamps, high-pressure mercury lamps, ultra-high-pressure mercury lamps, xenon lamps, xenon excimer lamps, xenon flash lamps, LEDs, etc. Each of the above light sources has a different emission wavelength and energy distribution. Therefore, the light source can be appropriately selected depending on the reaction wavelength of the photocationic polymerization initiator. Natural light (sunlight) can also be used as a reaction initiation light source. Irradiation methods may include direct irradiation, focused irradiation using reflectors, or focused irradiation using fibers. Irradiation using low-wavelength cut filters, heat-cut filters, cold mirrors, etc., is also possible.

[0116] The amount of light irradiation is not particularly limited and may be adjusted as appropriate depending on the thickness of the coating film of the composition. For example, the amount of light irradiation may be 50 mJ / cm². 2 More than 20000mJ / cm 2 It may be less than or equal to 100 mJ / cm², preferably 100 mJ / cm². 2 More than 10000mJ / cm 2 The following applies:

[0117] Next, the physical properties of the composition of this embodiment will be described.

[0118] In the composition of this embodiment, the shear rate is 0.0417 s. -1 The viscosity η1 measured is preferably 113,400 mPa·s or higher, more preferably 130,000 mPa·s or higher, even more preferably 150,000 mPa·s or higher, even more preferably 180,000 mPa·s or higher, and preferably 1,134,000 mPa·s or lower, more preferably 1,000,000 mPa·s or lower, even more preferably 900,000 mPa·s or lower, even more preferably 800,000 mPa·s or lower, even more preferably 700,000 mPa·s or lower, and even more preferably 600,000 mPa·s or lower, from the viewpoint of further improving coatability.

[0119] In the composition of this embodiment, the shear rate is 0.0117 s. -1 The viscosity η2 measured is preferably 31,750 mPa·s or higher, more preferably 50,000 mPa·s or higher, even more preferably 80,000 mPa·s or higher, even more preferably 100,000 mPa·s or higher, even more preferably 120,000 mPa·s or higher, and preferably 317,000 mPa·s or lower, more preferably 300,000 mPa·s or lower, from the viewpoint of further improving coatability.

[0120] In the composition of this embodiment, the shear rate is 0.0417 s. -1 Viscosity η1 (mPa·s) and shear rate 0.0117s when measured. -1The thixotropy index, expressed as the ratio (η1 / η2) to the viscosity η2 (mPa·s) measured by [method], is preferably 0.5 or higher, more preferably 0.7 or higher, even more preferably 1.0 or higher, and preferably 4.0 or lower, more preferably 3.5 or lower, even more preferably 3.0 or lower, even more preferably 2.5 or lower, and even more preferably 2.0 or lower, from the viewpoint of further improving coatability and further suppressing sagging.

[0121] The viscosity and thixotropy of the composition of this embodiment described above can be adjusted by adjusting the type and content of the inorganic filler (C) in the composition of this embodiment. The composition of this embodiment has viscosity and thixotropy within the range described above, which improves its applicability and makes it suitable for dispenser application. More specifically, it provides an optimal balance between good spreadability during application and suppression of sagging after application.

[0122] The viscosity and thixotropy of the composition of this embodiment described above are measured under the following conditions. Shear rate 0.0417s -1 Viscosity η1 and 0.0117s -1 The viscosity η2 in is measured as follows: Equipment: Cone plate viscometer Temperature: 25℃ Cone: Radius 12mm, angle 3° Shear rate: 0.0417s -1 or 0.0117s -1 Sample volume: 0.5 mL Atmosphere: Under the air Furthermore, the thixotropic index (η1 / η2) can be calculated from the obtained η1 and η2. For example, a cone-plate viscometer such as the BROOKFIELD DV3T can be used, with a CPA-52Z cone plate and a CPA-44YZ (standard cup) cup.

[0123] In the composition of this embodiment, the glass transition temperature measured by dynamic viscoelasticity measurement is preferably 70°C or higher, more preferably 75°C or higher, even more preferably 80°C or higher, even more preferably 85°C or higher, even more preferably 90°C or higher, and preferably 150°C or lower, more preferably 145°C or lower, and even more preferably 140°C or lower, from the viewpoint of further improving heat resistance. The glass transition temperature of the composition of this embodiment is measured as follows. The composition of this embodiment is applied to a substrate (e.g., polyethylene terephthalate film), another substrate is placed on top to sandwich it, and then it is pressed and spread into a circle with a thickness of 100 μm and a diameter of 9 cm. Light at a wavelength of 365 nm is then applied at 6,000 mJ / cm using a high-pressure mercury lamp. 2 The material is irradiated under these conditions, and then heated at 85°C for 1 hour to obtain a cured product. The glass transition temperature (°C) of the obtained cured product is measured by dynamic viscoelasticity measurement under a heating rate of 5°C / min.

[0124] In the composition of this embodiment, the moisture permeability measured in accordance with JIS Z 0208:1976 is preferably 40 g / (m³) from the viewpoint of further suppressing the intrusion of moisture. 2 • 24h) or less, more preferably 38g / (m²) 2 • 24h) or less, more preferably 35g / (m 2 • 24h) or less, more preferably 33g / (m³) 2 • 24h) or less, more preferably 30g / (m 2 • 24h) or less. In the composition of this embodiment, there is no limit to the lower limit of moisture permeability measured in accordance with JIS Z 0208:1976, but for example 1 g / (m³) 2 It may be 24 hours or longer, but 5g / (m 2 It may be 24 hours or longer, or 10g / (m 2 It may be 24 hours or longer. The water vapor permeability of the composition is measured as follows: The composition of this embodiment is applied to a substrate (e.g., polyethylene terephthalate film), another substrate is placed on top to sandwich it, and then it is pressed and spread into a circle with a thickness of 100 μm and a diameter of 9 cm. Light at a wavelength of 365 nm is then applied at 6,000 mJ / cm using a high-pressure mercury lamp. 2 The cured product was irradiated under the specified conditions, then heated at 85°C for 1 hour, and the resulting cured product was then subjected to a moisture permeability test (g / m³) in accordance with JIS Z 0208:1976. 2 Measure 24 hours.

[0125] In the composition of this embodiment, the tensile shear strength A1 is preferably 15.0 MPa or higher, more preferably 20.0 MPa or higher, even more preferably 23.0 MPa or higher, even more preferably 25.0 MPa or higher, and preferably 45.0 MPa or lower, more preferably 40.0 MPa or lower, even more preferably 38.0 MPa or lower, and even more preferably 35.0 MPa or lower, from the viewpoint of further improving adhesion to the substrate.

[0126] In the composition of this embodiment, the tensile shear strength A2 after storage at 85°C and 85% RH for 7 days is preferably 16.0 MPa or higher, more preferably 20.0 MPa or higher, even more preferably 23.0 MPa or higher, and even more preferably 25.0 MPa or higher, from the viewpoint of further improving adhesion to the substrate after storage. In the composition of this embodiment, there is no upper limit to the tensile shear strength A2 after storage at 85°C and 85% RH for 7 days, but it may be, for example, 45.0 MPa or lower, or 40.0 MPa or lower.

[0127] In the composition of this embodiment, the rate of decrease in tensile shear strength before and after storage at 85°C and 85% RH for 7 days is preferably 40% or less, more preferably 38% or less, even more preferably 35% or less, even more preferably 30% or less, even more preferably 25% or less, even more preferably 20% or less, even more preferably 15% or less, even more preferably 10% or less, and even more preferably 6% or less. For example, it may be -50% or more, -35% or more, -10% or more, -5% or more, or 0% or more.

[0128] The tensile shear strength A1, the tensile shear strength A2 after 7 days of storage at 85°C and 85%RH, and the rate of decrease in tensile shear strength before and after 7 days of storage at 85°C and 85%RH in the composition of this embodiment are measured as follows. The composition of this embodiment is applied to the center of a 25 mm square piece of alkali-free glass to a diameter of 8 mm and a thickness of 8 mm. Another piece of alkali-free glass is bonded to it, the two pieces of alkali-free glass are clamped together, and a high-pressure mercury lamp is used to expose them to light with a wavelength of 365 nm at a rate of 6,000 mJ / cm². 2 The specimen is prepared by irradiating under the specified conditions and heating at 85°C for 1 hour. Next, the clamp is removed, and cold-rolled steel plates (compliant with JIS G3141 SPCC-SD), each 100 mm long, 25 mm wide, and 1.6 mm thick, are bonded to alkali-free glass on both sides of the specimen using a two-part acrylic adhesive. Then, in accordance with JIS K 6850:1999, the initial tensile shear strength A1 (MPa) is measured when the two SPCC plates are gripped and pulled using a tensile testing machine under the conditions of a temperature of 23°C, a tensile speed of 10 mm / min, and a distance of 70 mm between fixtures. Furthermore, after leaving the above test specimens undisturbed in an environment of 85°C and 85% RH relative humidity for 7 days, the tensile shear strength A2 (MPa) is measured in the same manner as the initial tensile shear strength A1. From the obtained A1 and A2 values, the percentage reduction in tensile shear strength before and after storage is calculated using the formula: ((A1-A2) / A1)×100.

[0129] The composition of this embodiment has excellent applicability and can be applied using a dispenser. More specifically, the composition of this embodiment has the viscosity and thixotropy described above, making it suitable for dispenser application.

[0130] The use of the composition of this embodiment is not particularly limited, but because the composition of this embodiment has good adhesion to the substrate, it can be used in a display device as one or two selected from the group consisting of damming agents and fillers. Furthermore, the composition of this embodiment can be used to encapsulate light-emitting diode elements. The light-emitting diode elements preferably include organic electroluminescent display elements or micro-LEDs. Furthermore, the composition of this embodiment can be used to encapsulate solar cells. The solar cells preferably include perovskite solar cells.

[0131] Furthermore, the composition of this embodiment may be cured into a predetermined shape (for example, a film, a sheet, etc.) to form a cured sealing layer having a predetermined shape. In this case, for example, when assembling a display device, the light-emitting diode element can be sealed by placing the cured sealing layer on the light-emitting diode element.

[0132] 2.Cured body The cured body of this embodiment is obtained by curing the composition of this embodiment.

[0133] Since the composition of this embodiment has good adhesion to the substrate, the cured body of this embodiment, obtained by curing the composition of this embodiment, can be suitably used as a cured encapsulation layer (particularly a cured encapsulation layer for light-emitting diode elements).

[0134] The conditions for obtaining the cured product of this embodiment are not particularly limited, and the above-described conditions can be applied as conditions for curing the composition of this embodiment.

[0135] 3.Display device The display device of this embodiment comprises a light-emitting diode element, a substrate, and a cured sealing layer containing the above-mentioned cured body between the light-emitting diode element and the substrate.

[0136] The light-emitting diode element in the display device of this embodiment preferably includes an organic electroluminescent display element or a microLED, and more preferably includes a microLED.

[0137] The substrate of the display device of this embodiment includes, for example, one or more selected from the group consisting of a color filter, a glass substrate, a silicon substrate, and a plastic substrate, and preferably includes a color filter.

[0138] 4. Solar cells The solar cell of this embodiment comprises a solar cell, a substrate, and a cured sealing layer containing the cured body of this embodiment between the solar cell and the substrate. The solar cell of this embodiment preferably includes a perovskite-type solar cell.

[0139] Although embodiments of the present invention have been described above, these are merely examples, and various other configurations can be adopted. Furthermore, the present invention is not limited to the embodiments described above, and modifications, improvements, etc., within the scope that can achieve the objectives of the present invention are included in the present invention. [Examples]

[0140] The present invention will be described in more detail below with reference to examples, but the present invention is not limited to these examples. Unless otherwise specified, the examples were tested at 23°C and 50% RH relative humidity.

[0141] (Examples 1-17, Comparative Examples 1-2) <Preparation of Composition> The components shown in Tables 1 to 3 were mixed in the compositional ratios (parts by mass) listed in Tables 1 to 3 to prepare the compositions for the examples and comparative examples. Each component shown in Tables 1-3 has the following meaning:

[0142] (Component A1: Alicyclic compound containing an epoxy group) (a1-1)(3,3',4,4'-diepoxy)bicyclohexyl (Daicel Chemicals, "Celoxide 8010") (a1-2) 3',4'-Epoxycyclohexylmethyl-3,4-Epoxycyclohexanecarboxylate (Daicel Chemicals, "Celoxide 2021P", Molecular weight: 252.31)

[0143] (Component A2: Aromatic compound containing an epoxy group) (a2-1) Dibromophenylglycidyl ether (BR-250H, manufactured by Nippon Kayaku Co., Ltd., molecular weight 308) (a2-2) Tetrabromobisphenol A type epoxy resin (DIC Corporation's "EPICLON 152") (a2-3) Tetrabromobisphenol A type epoxy resin (DIC Corporation's "EPICLON 153", molecular weight 636) (a2-4) Phenol novolac type epoxy resin (DIC Corporation's "N-775") (a2-5) Bisphenol F type epoxy resin (molecular weight: 320 to 340, manufactured by Mitsubishi Chemical Corporation, "jER806") (a2-6) Bisphenol A type epoxy resin (molecular weight: 360 to 390, manufactured by Mitsubishi Chemical Corporation, "jER828")

[0144] (Component (B): Cationic polymerization initiator) ((B1) component: photocationic polymerization initiator) (b1-1) Triarylsulfonium-tetrakispentafluorophenylgallate (SunApro Co., Ltd. "CPI-310FG") (b1-2) Triarylsulfonium salt hexafluoroantimonate (ADEKA Optomer SP-170, manufactured by ADEKA Corporation; anionic species is hexafluoroantimonate)

[0145] ((C) component: inorganic filler) ((C1) component) (c-1) Spherical alumina (DAW-03, manufactured by Denka Co., Ltd.) (c-2) Spherical alumina (DAW-05, manufactured by Denka Co., Ltd.) (c-3) Scaly talc ("High Filler 5PA" manufactured by Matsumura Sangyo Co., Ltd.) (c-4) Talc (MY4000, manufactured by Matsumura Sangyo Co., Ltd.) (c-5) Nano-sized zeolite ("Zeoal(registered trademark) 5A" manufactured by Nakamura Superhard Co., Ltd., primary particle size: 300 nm, Ca 2+ Ionic coordination) (C components other than C1) (c-6) Spherical silica (FB-5SDC, manufactured by Denka Co., Ltd.)

[0146] ((X) component: curing retarder) (Component D: Phosphate-based curing retarder) (d-1) Phosphate-based curing retarder, tris(2-ethylhexyl) phosphate (manufactured by Daihachi Chemical Industry Co., Ltd., "TOP") (Component (E): Ether-based curing retarder) (e-1) Ether-based curing retarder, 18-crown-6-ether ("Crown Ether O-18" manufactured by Tokyo Chemical Industry Co., Ltd.)

[0147] ((I) Ingredient: Sensitizer) (i-1) Photosensitizer, 9,10-diethoxyanthracene (manufactured by Air Water Performance Chemicals Inc., "Anthracure® UVS-1101")

[0148] (Component (J): Silane coupling agent) (j-1) Epoxysilane coupling agent, 3-glycidoxypropyltrimethoxysilane (Shin-Etsu Chemical Co., Ltd. "KBM-403")

[0149] For each of the obtained compositions, the glass transition temperature, viscosity and thixotropy, water vapor permeability, and tensile shear strength were measured as follows. Interfacial adhesion was also evaluated.

[0150] <Glass transition temperature> Each example composition was coated onto a polyethylene terephthalate film (manufactured by Toyobo Co., Ltd., E7002, thickness: 38 μm), then another polyethylene terephthalate film was placed on top to sandwich it, and the film was then spread out to form a circle with a thickness of 100 μm and a diameter of 9 cm. A high-pressure mercury lamp was used to expose the area to light at a wavelength of 365 nm at a rate of 6,000 mJ / cm². 2 The material was irradiated under the specified conditions, and then heated at 85°C for 1 hour to obtain a cured product. The glass transition temperature (°C) of the obtained cured product was measured using a dynamic viscoelasticity analyzer (DMS7100 (EXSTAR), manufactured by Hitachi High-Tech Corporation) under a heating rate of 5°C / min.

[0151] <Viscosity and thixotropy> For each example composition, the following <Measurement Condition 1> was used to measure a shear rate of 0.0417 s. -1 The viscosity η1 was measured. <Measurement Condition 1> Equipment: Cone-plate viscometer (BROOKFIELD, product name "DV3T") Temperature: 25℃ Cone plate: CPA-52Z (manufactured by Eiko Seiki Co., Ltd.) Cone: Radius 12mm, angle 3° Shear rate: 0.0417s -1 Sample volume: 0.5 mL Atmosphere: Under the air Furthermore, in the above <Measurement Condition 1>, the shear rate was set to 0.0117s. -1 Except for the above, the conditions were the same as in <Measurement Condition 1>, with a shear rate of 0.0117 s². -1 The viscosity η2 was measured. The thixotropy index (η1 / η2) was calculated from the obtained values ​​of η1 and η2.

[0152] <Moisture permeability> Each example composition was coated onto a polyethylene terephthalate film (manufactured by Toyobo Co., Ltd., E7002, thickness: 38 μm), then another polyethylene terephthalate film was placed on top to sandwich it, and the film was then spread out to form a circle with a thickness of 100 μm and a diameter of 9 cm. A high-pressure mercury lamp was used to expose the area to light at a wavelength of 365 nm at a rate of 6,000 mJ / cm². 2 The cured product was irradiated under the following conditions and then heated at 85°C for 1 hour. The obtained cured product was subjected to a moisture permeability test (g / m³) in accordance with JIS Z 0208:1976. 2 The measurement was taken over 24 hours. The average of the results from two measurements was used as the measured value.

[0153] <Tensile shear strength> The tensile shear strength of each example composition was measured as follows. The composition for each example is applied to the center of a 25mm square piece of alkali-free glass to create a surface with a diameter of 8mm and a thickness of 8mm. Another piece of alkali-free glass is then bonded to it, and the two pieces of alkali-free glass are clamped together. A high-pressure mercury lamp is used to expose the glass to light at a wavelength of 365nm at a rate of 6,000mJ / cm². 2 The specimens were prepared by irradiating under the specified conditions and heating at 85°C for 1 hour. Next, the clamps were removed, and cold-rolled steel plates (compliant with JIS G3141, SPCC-SD) measuring 100 mm in length, 25 mm in width, and 1.6 mm in thickness were bonded to alkali-free glass on both sides of the specimen using a two-part acrylic adhesive (SGA adhesive, manufactured by Cemedyne Co., Ltd.). Then, in accordance with JIS K 6850:1999, the initial tensile shear strength A1 (MPa) was measured by gripping and pulling the two SPCC plates using a tensile testing machine (Autograph AGX-VD, manufactured by Shimadzu Corporation) under the conditions of 23°C, tensile speed of 10 mm / min, and a distance of 70 mm between fixtures. The average value of 5 measurements was used as the measured value. The fracture state of the specimen (cohesive fracture or interfacial fracture) was also evaluated. Furthermore, after leaving the above test specimens in an environment of 85°C and 85% RH relative humidity for 7 days, the tensile shear strength A2 (MPa) was measured in the same manner as the initial tensile shear strength A1. The fracture state of the test specimens (cohesive fracture or interfacial fracture) was also evaluated. From the obtained A1 and A2 values, the percentage reduction in tensile shear strength before and after storage was calculated using the formula: ((A1-A2) / A1)×100. Regarding the fracture state, "cohesive fracture" refers to a fracture state in which the hardened material of the composition fractures within the hardened material of the test specimen. "Interfacial fracture" refers to a fracture state in which the hardened material of the composition delaminates at the interface between the hardened material of the composition and the alkali-free glass of the test specimen. Furthermore, "thin-layer cohesive fracture" refers to a cohesive fracture that occurs in a part very close to the alkali-free glass, in contrast to "cohesive fracture" which occurs in the central part of the hardened material, and describes a state in which the hardened material adheres to the extent that the alkali-free glass is translucent. Finally, "substrate cracking" refers to a state in which the alkali-free glass cracks. Furthermore, in the table, for example, "Agglutination 9 / Interface 1" indicates that 90% of the test specimen's area was due to cohesive failure, and 10% was due to interfacial failure. Cohesive failure is preferable because it results in less variation in tensile shear strength and enables high-quality bonding, and a large ratio of the area of ​​the cohesive failure portion to the total area is also preferable.

[0154] [Table 1]

[0155] [Table 2]

[0156] [Table 3]

Claims

1. Cationic polymerizable compound (A), Cationic polymerization initiator (B), Inorganic filler (C), Includes, The inorganic filler (C) comprises one or more selected from talc, alumina, silica, zeolite, and titanium oxide. The total amount of one or more substances selected from the talc and alumina is 1 part by mass or more and 100 parts by mass or less when the total amount of the inorganic filler (C) is 100 parts by mass. The cationic polymerizable compound (A) comprises an alicyclic compound (A1) having an epoxy group and an aromatic compound (A2) having an epoxy group. The content of the cationic polymerization initiator (B) is 0.01 parts by mass or more and 5.0 parts by mass or less per 100 parts by mass of the cationic polymerizable compound (A). The amount of the inorganic filler (C) is 10 parts by mass or more and 300 parts by mass or less per 100 parts by mass of the cationic polymerizable compound (A). The inorganic filler (C) comprises talc and silica, A composition in which the ratio of silica content to talc content (silica content / talc content) in the inorganic filler (C) is 2.0 or more and 8.0 or less.

2. The composition according to claim 1, wherein the inorganic filler (C) further comprises alumina.

3. A cationic polymerizable compound (A), Cationic polymerization initiator (B), Inorganic filler (C), Silane coupling agent (J), Includes, The inorganic filler (C) comprises one or more selected from talc, alumina, silica, zeolite, and titanium oxide. The total amount of one or more substances selected from the talc and alumina is 1 part by mass or more and 100 parts by mass or less when the total amount of the inorganic filler (C) is 100 parts by mass. The cationic polymerizable compound (A) comprises an alicyclic compound (A1) having an epoxy group and an aromatic compound (A2) having an epoxy group. The content of the cationic polymerization initiator (B) is 0.01 parts by mass or more and 5.0 parts by mass or less per 100 parts by mass of the cationic polymerizable compound (A). The amount of the inorganic filler (C) is 10 parts by mass or more and 300 parts by mass or less per 100 parts by mass of the cationic polymerizable compound (A). The aforementioned aromatic compound (A2) having an epoxy group includes a bisphenol F type epoxy resin. A composition in which the content of the silane coupling agent (J) is 1.5% by mass or less when the total mass of the composition is 100% by mass.

4. A cationic polymerizable compound (A), Cationic polymerization initiator (B), Inorganic filler (C), Curing retarder (X), Includes, The inorganic filler (C) comprises one or more selected from talc, alumina, silica, zeolite, and titanium oxide. The total amount of one or more substances selected from the talc and alumina is 1 part by mass or more and 100 parts by mass or less when the total amount of the inorganic filler (C) is 100 parts by mass. The cationic polymerizable compound (A) comprises an alicyclic compound (A1) having an epoxy group and an aromatic compound (A2) having an epoxy group. The content of the cationic polymerization initiator (B) is 0.01 parts by mass or more and 5.0 parts by mass or less per 100 parts by mass of the cationic polymerizable compound (A). The amount of the inorganic filler (C) is 10 parts by mass or more and 300 parts by mass or less per 100 parts by mass of the cationic polymerizable compound (A). The curing retarder (X) is a composition comprising a phosphate-based curing retarder (D) and an ether-based curing retarder (E).

5. The composition according to claim 3 or 4, wherein the inorganic filler (C) comprises one or more selected from talc and alumina.

6. The composition according to claim 5, wherein the inorganic filler (C) comprises talc and silica.

7. The composition according to claim 6, wherein the ratio of the silica content to the talc content in the inorganic filler (C) (silica content / talc content) is 1.0 or more.

8. The composition according to any one of claims 1 to 4, wherein the viscosity measured under the following <Measurement Condition 1> is 113,400 mPa·s or more and 1,134,000 mPa·s or less. <Measurement Condition 1> Equipment: Cone-plate viscometer Temperature: 25℃ Cone: Radius 12 mm, angle 3° Shear rate: 0.0417 s －１ Sample volume: 0.5 mL Atmosphere: Under the air

9. The composition according to any one of claims 1 to 4, wherein the viscosity measured under the following <Measurement Condition 2> is 31,750 mPa·s or more and 317,000 mPa·s or less. <Measurement Condition 2> Equipment: Cone-plate viscometer Temperature: 25℃ Cone: Radius 12 mm, angle 3° Shear rate: 0.0117 s －１ Sample volume: 0.5 mL Atmosphere: Under the air

10. The shear rate was 0.0417 s, according to the measurement conditions 3 below. －１ viscosity η when measured １ (mPa·s) and shear rate 0.0117s －１ viscosity η when measured ２ Ratio (η) to (mPa·s) １ / η ２ The composition according to any one of claims 1 to 4, wherein the thixotropy index represented by ) is 0.5 or more and 4.0 or less. <Measurement Condition 3> Equipment: Cone-plate viscometer Temperature: 25℃ Cone: Radius 12 mm, angle 3° Shearing speed: 0.0417 s －１ or 0.0117 s －１ Sample volume: 0.5 mL Atmosphere: Under the air

11. The above composition is exposed to light with a wavelength of 365 nm at a rate of 6,000 mJ / cm using a high-pressure mercury lamp. ２ The composition according to any one of claims 1 to 4, wherein the cured product obtained by irradiating under the following conditions and then heating at 85°C for 1 hour has a glass transition temperature of 70°C or higher and 150°C or lower, as measured by dynamic viscoelasticity measurement under the condition of heating rate: 5°C / min.

12. The above composition is exposed to light with a wavelength of 365 nm at a rate of 6,000 mJ / cm using a high-pressure mercury lamp. ２ In a cured product obtained by irradiating under the specified conditions and then heating at 85°C for 1 hour, the moisture permeability measured in accordance with JIS Z 0208:1976 was 40 g / (m³). ２ The composition according to any one of claims 1 to 4, wherein the duration is 24 hours or less.

13. The composition according to any one of claims 1 to 4, wherein the tensile shear strength, as defined below, is 15.0 MPa or more and 45.0 MPa or less. <Tensile shear strength> The composition is applied to the center of a 25 mm square piece of alkali-free glass to a diameter of 8 mm and a thickness of 8 mm. Another piece of alkali-free glass is bonded to it, the two pieces of alkali-free glass are clamped together, and a high-pressure mercury lamp is used to expose them to light of 365 nm wavelength at a rate of 6,000 mJ / cm². ２ The specimen is irradiated under the specified conditions, heated at 85°C for 1 hour to prepare a test piece, the clamp is removed, and SPCC plates measuring 100 mm in length, 25 mm in width, and 1.6 mm in thickness are bonded to the alkali-free glass on both sides of the test piece using a two-part acrylic adhesive. Then, in accordance with JIS K 6850:1999, the tensile shear strength (MPa) is measured when the two SPCC plates are grasped and pulled at a temperature of 23°C and a tensile speed of 10 mm / min.

14. The composition according to any one of claims 1 to 4, wherein the tensile shear strength reduction rate (%) after storage in an 85°C 85% RH environment is 40% or less, as shown below in <Tensile Shear Strength Reduction Rate>. <Tensile shear strength reduction rate> The composition is applied to the center of a 25 mm square piece of alkali-free glass to a diameter of 8 mm and a thickness of 8 mm. Another piece of alkali-free glass is bonded to it, the two pieces of alkali-free glass are clamped together, and a high-pressure mercury lamp is used to expose them to light of 365 nm wavelength at a rate of 6,000 mJ / cm². ２ The specimen was irradiated under the specified conditions, heated at 85°C for 1 hour to prepare a test piece, the clamp was removed, and SPCC plates measuring 100 mm in length, 25 mm in width, and 1.6 mm in thickness were bonded to the alkali-free glass on both sides of the test piece using a two-part acrylic adhesive. Then, in accordance with JIS K 6850:1999, the tensile shear strength of the two SPCC plates when pulled at a temperature of 23°C and a tensile speed of 10 mm / min was measured, and the initial tensile shear strength A １ (MPa) The test specimen was left standing in an environment of 85°C and 85% relative humidity RH for 7 days, and the initial tensile shear strength A １ The tensile shear strength measured in the same manner is tensile shear strength A. ２ Let (MPa) be used to express the tensile shear strength reduction rate (%) before and after storage as follows: ((A １ -A ２ ) / A １ Calculate using the formula: () × 100.

15. A composition according to any one of claims 1 to 4, which can be applied using a dispenser.

16. The composition according to any one of claims 1 to 4, wherein the content of the cationic polymerizable compound (A) is 20% by mass or more and 90% by mass or less when the entire composition is considered to be 100% by mass.

17. The composition according to claim 16, wherein the cationic polymerizable compound (A) further comprises a glycidyl ether compound (A3).

18. The composition according to any one of claims 1 to 4, wherein the cationic polymerizable compound (A) contains a bromine atom.

19. The composition according to any one of claims 1 to 4, wherein the cationic polymerization initiator (B) comprises one or more selected from the group consisting of a photocatalytic cationic polymerization initiator (B1) and a thermal cationic polymerization initiator (B2).

20. The composition according to claim 19, wherein the cationic polymerization initiator (B) comprises an onium salt compound.

21. A composition according to any one of claims 1 to 4, which can be used in a display device as one or two selected from the group consisting of damming agents and filler agents.

22. The composition according to any one of claims 1 to 4, wherein the composition can be used to encapsulate a light-emitting diode element or a solar cell.

23. The composition according to claim 22, wherein the light-emitting diode element includes an organic electroluminescent display element or a microLED.

24. The composition according to claim 22, wherein the solar cell includes a perovskite-type solar cell.

25. A cured body obtained by curing the composition according to any one of claims 1 to 4.

26. A display device comprising: a light-emitting diode element; a substrate; and a cured sealing layer between the light-emitting diode element and the substrate containing the cured body described in claim 25.

27. The display device according to claim 26, wherein the light-emitting diode element includes an organic electroluminescent display element or a microLED.

28. A solar cell comprising a solar cell, a substrate, and a cured sealing layer between the solar cell and the substrate containing the cured body described in claim 25.

29. The solar cell according to claim 28, wherein the solar cell includes a perovskite-type solar cell.

Images