Component mounting machine and backup pin placement support method

Abstract

To quickly mount a component on a board while suppressing vibration of a board caused by mounting the component on the board.SOLUTION: A mounting head 431 mounts a component P supplied by a component supply unit 44 on a test board B located at the board carry-in position Lb (mounting work position), and the vibration generated on the test board B is detected by a distance sensor Sd (vibration detection unit) (step S104). Then, on the basis of the vibration detected by the distance sensor Sd, pin arrangement data Dp is generated that indicates the position where a backup pin 77 is to be arranged on a push-up plate 711 (pin arrangement plate) (step S112).SELECTED DRAWING: Figure 5

Description

Technical Field

[0001] This invention relates to a technique for suppressing vibrations generated in a substrate when components are mounted on the substrate by supporting the substrate with backup pins.

Background Art

[0002] Patent Document 1 discloses a technique for detecting vibrations generated in a substrate when a component is mounted on the substrate by an adsorption nozzle that adsorbs the component. In particular, in Patent Document 1, the vibration generated in the substrate is suppressed below a threshold value by adjusting the speed at which the adsorption nozzle descends or ascends with respect to the substrate based on the result of detecting the vibration.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, according to the method of Patent Document 1, in order to suppress the vibration of the substrate, it is necessary to reduce the descending speed or ascending speed of the adsorption nozzle. Therefore, it may take time to mount the components on the substrate.

[0005] This invention has been made in view of the above problems, and an object thereof is to enable the rapid mounting of components on a substrate while suppressing the vibration of the substrate caused by the mounting of the components on the substrate.

Means for Solving the Problems

[0006] The component mounting machine according to the present invention comprises a transport unit that transports a substrate to a predetermined mounting work position, a pin placement plate on which backup pins that support the substrate by contacting the substrate from below at the mounting work position are arranged, a component supply unit that supplies components, a mounting head that mounts the components supplied by the component supply unit onto the substrate at the mounting work position, a vibration detection unit that detects vibrations generated in the substrate when the mounting head mounts components onto the substrate, and a control unit that generates pin placement data indicating the position on the pin placement plate where the backup pins should be placed based on the vibrations detected by the vibration detection unit.

[0007] The backup pin placement support method according to the present invention comprises the steps of: transporting a substrate to a predetermined mounting work position; supporting the substrate by bringing backup pins placed on a pin placement plate into contact with the substrate located at the mounting work position from below; supplying components using a component supply unit; mounting the components supplied by the component supply unit onto the substrate located at the mounting work position using a mounting head; detecting vibrations generated on the substrate by the mounting head mounting components onto the substrate using a vibration detection unit; and generating pin placement data indicating the positions on the pin placement plate where backup pins should be placed based on the vibrations detected by the vibration detection unit.

[0008] In the present invention (component mounting machine and backup pin placement support method) configured as described above, vibrations generated in the substrate when the mounting head mounts components supplied by the component supply unit onto the substrate at the mounting work position are detected by the vibration detection unit. Based on the vibrations detected by the vibration detection unit, pin placement data is generated indicating the positions on the pin placement plate where backup pins should be placed. Therefore, by placing backup pins at the positions indicated by the pin placement data, vibrations caused by component mounting can be suppressed without adjusting the speed at which the mounting head mounts components. As a result, it is possible to quickly mount components onto the substrate while suppressing vibrations of the substrate caused by the mounting of components onto the substrate.

[0009] Furthermore, the component mounting machine may be configured to include an image display unit for displaying images to the user, and the control unit may generate an image indicating the position where backup pins should be placed based on pin placement data and display it on the image display unit. In such a configuration, the user can place the backup pins at the positions indicated by the pin placement data by checking the image displayed on the image display unit. As a result, it becomes possible to quickly mount components onto the board while suppressing vibrations of the board caused by the mounting of components onto the board.

[0010] Furthermore, the component mounting machine may be configured to include a pin placement head that places backup pins on a pin placement plate, and the control unit may cause the pin placement head to perform the operation of placing backup pins at the positions indicated by the pin placement data. In such a configuration, the pin placement head places backup pins at the positions indicated by the pin placement data. As a result, it becomes possible to quickly mount components on the board while suppressing vibrations of the board caused by the mounting of components on the board.

[0011] Furthermore, the component mounting machine may be configured such that the control unit performs board mounting, in which components are mounted in a predetermined order to multiple mounting target positions on the board by the mounting head, while simultaneously performing board vibration measurement, in which vibration detection is detected by a vibration detection unit when the mounting head mounts components and the vibration of the board is measured at each of the multiple vibration detection positions corresponding to the multiple mounting target positions, and pin placement data is generated based on the results of the board vibration measurement. In such a configuration, pin placement data is generated based on the vibration of the board that occurs when components are mounted in a predetermined order to multiple mounting target positions on the board by the mounting head. Therefore, by placing backup pins at the positions indicated by this pin placement data, the mounting of components to the multiple mounting target positions that are subsequently executed in the predetermined order can be performed while suppressing the vibration of the board.

[0012] Furthermore, the component mounting machine may be configured to include a user notification unit that notifies the user, and if there are vibration detection locations where the amplitude of vibration detected in a board vibration measurement performed after the backup pins have been placed according to the pin placement data generated based on the results of the board vibration measurement is greater than or equal to a threshold, the control unit may be instructed to notify the user notification unit to perform an operation other than placing the backup pins. In such a configuration, even if board vibration occurs that cannot be adequately addressed by placing the backup pins, it is possible to address the board vibration by prompting the user to perform another operation.

[0013] Furthermore, the transport unit transports the test board as a board to the mounting work position, then transports the production board as a board to the mounting work position, and the control unit performs board mounting on the test board, then performs board mounting on the production board, and performs board vibration measurement and pin placement data generation in accordance with the board mounting of the test board, while not performing board vibration measurement and pin placement data generation in accordance with the board mounting of the production board. With respect to one mounting target position and the next mounting target position where components are mounted consecutively, in the case of board mounting on the test board, components are mounted in a predetermined order to multiple mounting target positions with a predetermined time interval between mounting a component to one mounting target position and mounting a component to the next mounting target position, while in the case of board mounting on the production board, components are mounted in a predetermined order to multiple mounting target positions without a predetermined time interval between mounting a component to one mounting target position and mounting a component to the next mounting target position.

[0014] In this configuration, pin placement data is generated based on the vibrations of the board that occur when components are mounted in a predetermined order to multiple mounting target locations on the test board using a mounting head. Therefore, by placing backup pins at the locations indicated by this pin placement data, the mounting of components to multiple mounting target locations on the production board, which is performed in the predetermined order thereafter, can be carried out while suppressing vibrations of the production board.

[0015] Furthermore, in board mounting on a test board, components are mounted in a predetermined order to multiple mounting locations, with a predetermined time interval between mounting a component to one location and mounting a component to the next. Therefore, vibrations of the test board are detected while mounting a component to the next location is performed, after the vibrations of the test board associated with mounting a component to one location have attenuated. Consequently, vibrations of the test board associated with mounting components to each of the multiple mounting locations can be detected independently. Thus, pin configuration data that effectively suppresses board vibrations can be generated. In addition, in board mounting on a production board, components are mounted in a predetermined order to multiple mounting locations without a predetermined time interval between mounting a component to one location and mounting a component to the next. Therefore, component mounting to multiple mounting locations on the production board can be performed quickly.

[0016] Incidentally, various specific configurations for detecting vibrations on a circuit board are conceivable. For example, the vibration detection unit may have a distance sensor attached to the mounting head, and the component mounting machine may be configured to detect vibrations based on the results of measuring the variation in the distance to the circuit board using the distance sensor. Alternatively, the vibration detection unit may have a load sensor that measures the load applied to the mounting head when mounting components onto the circuit board, and the component mounting machine may be configured to detect vibrations based on the results of measuring the variation in the load applied to the mounting head using the load sensor. [Effects of the Invention]

[0017] As described above, according to the present invention, it is possible to quickly mount components onto a substrate while suppressing vibrations of the substrate caused by the mounting of components onto the substrate. [Brief explanation of the drawing]

[0018] [Figure 1] A schematic plan view of a component mounting machine. [Figure 2] A block diagram showing the electrical configuration of the component mounting machine in Figure 1. [Figure 3]A diagram schematically showing the configuration and operation of a backup mechanism provided in a component mounter. [Figure 4] A diagram schematically showing the operations of a head unit and a distance sensor. [Figure 5] A flowchart showing a first example of backup pin placement support executed by the component mounter of FIG. 1. [Figure 6] A diagram showing an example of substrate vibration distribution data in tabular form. [Figure 7] A flowchart showing an example of substrate production. [Figure 8] A flowchart showing a second example of backup pin placement support executed by the component mounter of FIG. 1. [Figure 9] A flowchart schematically showing an example of the time interval for mounting components on a test substrate or a production substrate.

Embodiments for Carrying Out the Invention

[0019] FIG. 1 is a plan view schematically showing a component mounter, and FIG. 2 is a block diagram showing the electrical configuration of the component mounter of FIG. 1. In FIG. 1 and the following figures, the X direction which is the horizontal direction, the Y direction which is the horizontal direction orthogonal to the X direction, and the Z direction which is the vertical direction are appropriately shown.

[0020] As shown in FIG. 2, the component mounter 4 includes an arithmetic unit 91 and a storage unit 92. The arithmetic unit 91 is a processor such as a CPU (Central Processing Unit), and the storage unit 92 is a storage device such as an SSD (Solid State Drive). The arithmetic unit 91 has a main control unit 910, a UI control unit 911, a head drive control unit 912, a lifting control unit 913, and a distance acquisition unit 914.

[0021] The main control unit 910 comprehensively controls the entire component mounting machine 4. The UI control unit 911 controls the UI (User Interface) 93 provided by the component mounting machine 4. The UI 93 includes, for example, output devices such as a display and input devices such as a mouse or keyboard. However, the output and input devices of the UI 93 do not need to be configured separately; they may be integrated using a touch panel display.

[0022] Furthermore, the memory unit 92 stores board data Db. The board data Db indicates the order in which components P are mounted to each of the multiple mounting target positions Lm (Figure 4) provided on the board B, and the component mounting machine 4 mounts components P to each mounting target position Lm on the board B according to the board data Db. Specifically, the mounting target positions Lm are, for example, pads. In addition, the memory unit 92 stores pin arrangement data Dp, which will be described later.

[0023] As shown in Figure 1, the component mounting machine 4 is equipped with a pair of transport conveyors 41 that transport the substrate B (Figure 3) to a predetermined substrate loading position Lb. These transport conveyors 41 extend parallel to each other in the Y direction and are arranged at intervals corresponding to the width of the substrate B in the X direction, supporting both ends of the substrate B from below in the X direction while transporting the substrate B in the Y direction (transport direction). These transport conveyors 41 hold the substrate B horizontally once it has been loaded to the substrate loading position Lb.

[0024] Furthermore, the component mounting machine 4 is provided with a pair of X-axis rails 421 parallel to the X direction, an X-axis ball screw 422 parallel to the X direction, and an X-axis motor Mx (servo motor) that rotationally drives the X-axis ball screw 422. A Y-axis rail 424 parallel to the Y direction is supported by the pair of X-axis rails 421 so as to be movable in the X direction and is fixed to the nuts of the X-axis ball screw 422. A Y-axis ball screw 425 parallel to the Y direction and a Y-axis motor My (servo motor) that rotationally drives the Y-axis ball screw 425 are attached to the Y-axis rail 424, and a head unit 43 is supported by the Y-axis rail 424 so as to be movable in the Y direction and is fixed to the nuts of the Y-axis ball screw 425. The head drive control unit 912 controls the X-axis motor Mx and the Y-axis motor My. Therefore, the head drive control unit 912 can move the head unit 43 in the X direction by rotating the X-axis ball screw 422 with the X-axis motor Mx, and move the head unit 43 in the Y direction by rotating the Y-axis ball screw 425 with the Y-axis motor My.

[0025] The head unit 43 is a so-called inline type having multiple mounting heads 431 arranged at equal intervals in the Y direction. Multiple Z-axis motors Mz (servo motors) are attached to the head unit 43, each corresponding to one of the multiple mounting heads 431, and each Z-axis motor Mz raises and lowers the corresponding mounting head 431 in the Z direction. Note that in Figure 2, only one Z-axis motor Mz corresponding to one mounting head 431 is shown, and the other Z-axis motors Mz are omitted. The head drive control unit 912 controls each of the multiple Z-axis motors Mz. In other words, the head drive control unit 912 can raise and lower one of the multiple mounting heads 431 in the Z direction using the Z-axis motor Mz corresponding to that mounting head 431. Note that the head unit 43 is not limited to an inline type; it may also be a rotary type with multiple mounting heads 431 arranged circumferentially.

[0026] As shown in Figure 1, on each side of a pair of conveyors 41 in the X direction, two component supply units 44 are arranged in the Y direction. Multiple tape feeders 441 are detachably mounted to each component supply unit 44, arranged in the Y direction. The tape feeders 441 extend in the X direction and have component supply locations 442 at their ends on the conveyor 41 side in the X direction. Component supply reels, around which tape containing small components P such as integrated circuits, transistors, and capacitors at predetermined intervals is wound, are placed for each tape feeder 441, and the tape is loaded into the tape feeder 441 after being pulled from the component supply reels. The tape feeders 441 intermittently feed the tape in the X direction toward the conveyor 41. This causes the components P in the tape to be fed in the X direction (feed direction) and sequentially supplied to the component supply locations 442 of the tape feeders 441.

[0027] Furthermore, the component mounting machine 4 is equipped with a backup mechanism 71 for supporting the substrate B loaded into the substrate loading position Lb from below (Figure 3). Here, Figure 3 is a schematic diagram showing the configuration and operation of the backup mechanism provided in the component mounting machine. The backup mechanism 71 has a horizontally held push-up plate 711 and a lifting drive unit 712 that drives the push-up plate 711 in the Z direction. The lifting drive unit 712 is an actuator such as a solenoid or a cylinder, and raises and lowers the push-up plate 711 in response to a command from the lifting control unit 913. A plurality of backup pins 77 are erected on the upper surface of the push-up plate 711. These backup pins 77 can be fixed to the push-up plate 711 in various ways. For example, one of the push-up plate 711 and the backup pins 77 may be made of iron and the other of the other may be made of magnet, and they may be fixed together by magnetic force. Alternatively, they may be fixed together by engaging the backup pins 77 with engaging parts such as holes or protrusions provided on the upper surface of the push-up plate 711.

[0028] The lifting drive unit 712 then drives the push-up plate 711 in the Z direction, moving the backup pins 77 in the Z direction between the lowered position Ld and the raised position Lu, which is above the lowered position Ld. As shown in the "Lowered Position Ld" column of Figure 3, each backup pin 77 located at the lowered position Ld faces the substrate B, which is supported at the substrate loading position Lb by the transport conveyor 41, from below with a gap between them. When the lifting drive unit 712 raises each backup pin 77 from the lowered position Ld towards the raised position Lu, the upper end of each backup pin 77 contacts the lower surface of the substrate B, lifting the substrate B from the transport conveyor 41 (the "Intermediate" column of Figure 3). In addition, a pair of clamp plates 73 are positioned above the pair of transport conveyors 41, spaced apart in the X direction. When each backup pin 77 rises to the raised position Lu, and the upper surface of the substrate B placed on the upper end of each backup pin 77 contacts the pair of clamp plates 73 from below, the upward movement of each backup pin 77 by the lifting drive unit 712 stops (see the "Raised Position Lu" column in Figure 3).

[0029] Furthermore, the component mounting machine 4 is equipped with a pin stocker 78 for storing backup pins 77. The pin stocker 78 has a plurality of pin holders 781, each pin holder 781 capable of holding a backup pin 77. A pin holder 781 is, for example, a hole extending in the Z direction and opening upwards, and the backup pin 77 can be held in the pin holder 781 by inserting it into the pin holder 781 from above. Alternatively, the backup pin 77 held in the pin holder 781 can be pulled out upwards from the pin holder 781 and placed on the push-up plate 711.

[0030] Furthermore, the component mounting machine 4 is equipped with a distance sensor Sd attached to the head unit 43. The distance sensor Sd is held facing downwards and faces the upper surface of the substrate B at the substrate loading position Lb from above. This distance sensor Sd detects the distance from the distance sensor Sd to the upper surface of the substrate B and outputs the distance to the distance acquisition unit 914. For example, a TOF (Time of Flight) sensor can be used as such a distance sensor Sd.

[0031] Figure 4 is a schematic diagram illustrating the operation of the head unit and distance sensor. As shown in Figure 4, suction nozzles 432 are attached to the lower ends of multiple mounting heads 431 of the head unit 43, and the nozzles 432 of the mounting heads 431 perform the mounting of components P onto the substrate B. Specifically, the head drive control unit 912 controls the X-axis motor Mx and the Y-axis motor My so that the suction nozzles 432 attached to the mounting heads 431 face the component supply location 442 from above. Subsequently, the head drive control unit 912 lowers the suction nozzles 432 toward the component supply location 442 using the Z-axis motor Mz, so that the nozzles 432 come into contact with the components P supplied to the component supply location 442 by the tape feeder 441. Then, the mounting head 431 generates a predetermined negative pressure in the suction nozzles 432, causing the nozzles 432 to pick up (suction) the components P.

[0032] Furthermore, the head drive control unit 912 controls the X-axis motor Mx and the Y-axis motor My to position the suction nozzle 432 holding the component P facing the mounting target position Lm on the substrate B at the substrate loading position Lb from above. Subsequently, the head drive control unit 912 lowers the suction nozzle 432 toward the mounting target position Lm using the Z-axis motor Mz, causing the component P held by the suction nozzle 432 to come into contact with the mounting target position Lm. The component mounting machine 4 is equipped with a load sensor Sl that measures the load applied to the mounting head 431 in the Z direction. In response, the head drive control unit 912 monitors the load measured by the load sensor Sl and lowers the mounting head 431 to bring the component P held by the suction nozzle 432 attached to the mounting head 431 into contact with the mounting target position Lm. As a specific configuration for measuring the load, for example, the configuration proposed in Japanese Patent Application Publication No. 2019-102751 can be used. When the component P comes into contact with the mounting target position Lm, the mounting head 431 generates atmospheric pressure or positive pressure in the suction nozzle 432, causing the component P to detach from the suction nozzle 432 to the mounting target position Lm. As a result, the component P is mounted at the mounting target position Lm. Then, the head drive control unit 912 raises the mounting head 431 to which the suction nozzle 432 is attached using the Z-axis motor Mz.

[0033] Furthermore, the distance acquisition unit 914 causes the distance sensor Sd to detect the vibration of the substrate B at the vibration detection position Ls, thereby measuring the vibration during the period before and after the component P is mounted at the mounting target position Lm, when the component P is mounted on the substrate B. Here, the vibration detection position Ls and the mounting target position Lm do not coincide, and the vibration detection position Ls and the mounting target position Lm are offset from each other depending on the positional relationship between the mounting head 431 that mounts the component P at the mounting target position Lm and the distance sensor Sd.

[0034] Figure 5 is a flowchart showing the first example of backup pin placement support performed by the component mounting machine shown in Figure 1. The flowchart in Figure 5 is executed under the control of the main control unit 910. In this backup pin placement support, the main control unit 910 reads the board data Db from the storage unit 92 (step S101) and causes the transport conveyor 41 to load the test board B (referred to as "test board B" as appropriate) to the board loading position Lb (step S102).

[0035] Here, test board B is a board B used to measure vibrations generated in board B when mounting components P, prior to the production of the board described later, and has the same configuration as board B used in production (production board B). Therefore, test board B and production board B have multiple mounting target positions Lm at the same locations.

[0036] In step S103, the lifting control unit 913 raises the push-up plate 711 using the lifting drive unit 712, thereby raising the backup pins 77 from the lowered position Ld to the raised position Lu. In this way, the test board B at the board loading position Lb is supported (backed up) by the backup pins 77 on the push-up plate 711.

[0037] In step S104, the distance acquisition unit 914 starts measuring the vibration of the test board B using the distance sensor Sd. Specifically, the distance acquisition unit 914 acquires the distance to the test board B detected by the distance sensor Sd at a predetermined sampling period, thereby measuring the change in the distance to the board B, i.e., the vibration of the board B.

[0038] In step S105, the mounting head 431 moves the component P, which has been picked up from the component supply location 442 by the suction nozzle 432, above the mounting target position Lm indicated by the board data Db, so that it faces the mounting target position Lm from above. In step S106, the mounting head 431 descends toward the mounting target position Lm, bringing the component P, which has been picked up by the suction nozzle 432 at the lower end of the mounting head 431, into contact with the mounting target position Lm. In this way, the component P is mounted at the mounting target position Lm. In other words, in steps S105 to S106, the mounting of component P from the component supply location 442 to the mounting target position Lm is performed by the control of the head drive control unit 912 in the manner described above. Then, steps S105 to S106 are repeated until component P is mounted at all mounting target positions Lm on the test board B, which the board data Db indicates as targets for mounting component P (until step S107 is "YES"). At this point, the distance acquisition unit 914 terminates the vibration measurement of the test board B using the distance sensor Sd.

[0039] As steps S104 to S107 are executed, the distance acquisition unit 914 can acquire substrate vibration distribution data Dv (Figure 6). Figure 6 is a table showing an example of substrate vibration distribution data. The substrate vibration distribution data Dv is shown for each of multiple mounting target positions Lm, associating the mounting target position Lm on which the component P is mounted, the vibration detection position Ls where the distance sensor Sd detects vibration when the component P is mounted at the mounting target position Lm, and the amount of vibration (i.e., amplitude A) of the substrate B measured at the vibration detection position Ls. Here, the mounting target position Lm and the vibration detection position Ls are each shown in XY coordinates. Furthermore, the vibration detected by the distance sensor Sd when the component P is mounted at the mounting target position Lm refers to the vibration detected by the distance sensor Sd from the time of mounting of the component P at the mounting target position Lm during a predetermined monitoring period. The monitoring period is shorter than, for example, the period during which the vibration generated at mounting disappears, and can be set in advance by the user.

[0040] In step S109, the main control unit 910 determines whether all of the multiple amplitudes A corresponding to the multiple mounting target positions Lm indicated by the substrate vibration distribution data Dv are below a threshold. If at least one of the multiple amplitudes A is greater than or equal to the threshold (i.e., "NO" in step S109), the process proceeds to step S110. In step S110, the main control unit 910 determines whether the operation of placing the backup pins 77 on the push-up plate 711 (in other words, steps S112 to S113) based on the substrate vibration distribution data Dv obtained by the execution of steps S104 to S107 has been performed in the past. In this example, the operation has not been performed, so "YES" is determined in step S110, and steps S111 to S113 are executed.

[0041] In step S111, the substrate B is transported from the substrate loading position Lb to the outside of the component mounting machine 4. Specifically, the lifting control unit 913 lowers the push-up plate 711 using the lifting drive unit 712, thereby lowering the backup pins 77 from the raised position Lu to the lowered position Ld. Subsequently, the main control unit 910 transports the substrate B from the substrate loading position Lb to the outside of the component mounting machine 4 using the transport conveyor 41.

[0042] In step S112, the main control unit 910 generates pin placement data Dp indicating the position (pin placement position) where the backup pins 77 will be placed. Specifically, the main control unit 910 identifies an excessive amplitude A that exceeds a threshold from among the multiple amplitudes A indicated by the substrate vibration distribution data Dv, and identifies the mounting target position Lm corresponding to the excessive amplitude A. The main control unit 910 then determines the position directly below the mounting target position Lm, i.e., the position directly below the mounting target position Lm where the component P was mounted when the excessive amplitude A was measured, as the pin placement position where the backup mechanism 71 should be placed. If other constraints prohibit the placement of backup pins 77 directly below the mounting target position Lm, the pin placement position is determined to be the position closest to the mounting target position Lm within the range in which the placement of backup pins 77 is permitted by those constraints. Such constraints include, for example, conditions to prevent interference with other backup pins 77. In this way, pin configuration data Dp indicating the pin configuration location for the backup pin 77 is generated and stored in the storage unit 92.

[0043] In step S113, the main control unit 910 instructs the head unit 43 to place the backup pins 77 at the pin placement positions indicated by the pin placement data Dp. Specifically, the operation involves using the suction nozzle 432 to pick up the backup pins 77 stored in the pin stocker 78 and transfer them onto the push-up plate 711, or using the suction nozzle 432 to pick up the backup pins 77 and move them on the push-up plate 711. This operation is performed in the same manner as the mounting of component P described above.

[0044] Once the placement of the push-up plate 711 based on the pin placement data Dp (step S113) is completed, steps S102 to S109 are repeated. In step S109, the main control unit 910 determines whether all of the multiple amplitudes A corresponding to the multiple mounting target positions Lm indicated by the substrate vibration distribution data Dv are below a threshold. If at least one of the multiple amplitudes A is greater than or equal to the threshold (if "NO" is found in step S109), the process proceeds to step S110. In step S110, the main control unit 910 determines whether the operation of placing the backup pins 77 on the push-up plate 711 based on the substrate vibration distribution data Dv obtained by the execution of steps S104 to S107 (in other words, steps S112 to S113) has been performed in the past. In this example, since the operation has been performed, "NO" is determined in step S110, and step S114 is executed.

[0045] In step S114, the UI control unit 911 controls the UI93 to display a message on the UI93's display prompting the user to perform an action different from the placement of the backup pins 77 on the push-up plate 711. The action different from the placement of the backup pins 77 is: • The descent speed of component P when mounting component P at the target mounting position Lm. • The amount by which component P, which is in contact with substrate B, is pushed downwards. • Types of suction nozzles 432 for mounting component P Maintenance of the buffing mechanism of the suction nozzle 432, which uses a spring to mitigate the impact when mounting component P onto circuit board B. These are some examples.

[0046] On the other hand, in step S109, if all amplitudes A shown in the substrate vibration distribution data Dv are below the threshold (YES), the backup pin placement support shown in Figure 5 is terminated. Then, the substrate production shown in Figure 7 is executed at an appropriate timing after the completion of the backup pin placement support.

[0047] Figure 7 is a flowchart showing an example of substrate production. The flowchart in Figure 7 is executed under the control of the main control unit 910. In step S201, the main control unit 910 reads the substrate data Db from the storage unit 92. However, since the substrate data Db used in the substrate production in Figure 7 is the same as the substrate data Db used for backup pin placement support in Figure 5, if the main control unit 910 continues to hold the substrate data Db read in step S101 of the backup pin placement support, step S201 can be omitted.

[0048] In step S202, the main control unit 910 causes the transport conveyor 41 to move the production substrate B (referred to as "production substrate B" as appropriate) to the substrate loading position Lb (step S202). In step S203, the lifting control unit 913 raises the push-up plate 711 with the lifting drive unit 712, thereby raising the backup pins 77 from the lowered position Ld to the raised position Lu. In this way, the production substrate B at the substrate loading position Lb is supported (backed up) by the backup pins 77 on the push-up plate 711.

[0049] In step S204, the mounting head 431 moves the component P, which has been picked up from the component supply location 442 by the suction nozzle 432, above the mounting target position Lm indicated by the board data Db, so that it faces the mounting target position Lm from above. In step S205, the mounting head 431 descends toward the mounting target position Lm, bringing the component P, which has been picked up by the suction nozzle 432 at the lower end of the mounting head 431, into contact with the mounting target position Lm. In this way, the component P is mounted at the mounting target position Lm. In other words, in steps S204 to S205, the mounting of component P from the component supply location 442 to the mounting target position Lm is performed by the control of the head drive control unit 912, etc., in the manner described above. Then, steps S204 to S205 are repeated until component P is mounted at all mounting target positions Lm on the production board B, which the board data Db indicates as targets for mounting component P (until "YES" is reached in step S206). At this point, a component-mounted board, which is production board B with component P mounted, is produced, and board production is completed. Note that if multiple component-mounted boards are to be produced, the board production shown in Figure 7 is executed multiple times.

[0050] In the first example of backup pin placement support, explained using Figures 5 to 7, the vibrations generated in the test board B, located at the board loading position Lb (mounting work position), when the mounting head 431 mounts the component P supplied by the component supply unit 44 onto the test board B, are detected by the distance sensor Sd (vibration detection unit) (step S104). Based on the vibrations detected by the distance sensor Sd, pin placement data Dp is generated indicating the position on the push-up plate 711 (pin placement plate) where the backup pins 77 should be placed (step S112). Therefore, by placing the backup pins 77 at the position indicated by the pin placement data Dp (step S113), vibrations caused by the mounting of component P can be suppressed without adjusting the speed at which the mounting head 431 mounts the component P. As a result, it is possible to quickly mount component P onto the test board B or production board B while suppressing vibrations of the board B caused by the mounting of component P onto the board B.

[0051] Furthermore, the push-up plate 711 is equipped with a mounting head 431 (pin placement head) for placing backup pins 77, and the main control unit 910 of the calculation unit 91 (control unit) causes the mounting head 431 to perform the operation of placing the backup pins 77 at the positions indicated by the pin placement data Dp. In this configuration, the backup pins 77 placed by the mounting head 431 at the positions indicated by the pin placement data Dp make it possible to quickly mount components P onto the board B while suppressing vibrations of the board B caused by the mounting of components P onto the board B.

[0052] Furthermore, the main control unit 910 of the calculation unit 91 performs board mounting in which components P are mounted in a predetermined order to multiple mounting target positions Lm provided on the test board B by the mounting head 431 (steps S105 to S107). At the same time, it performs board vibration measurement, which detects vibrations using a distance sensor Sd when the mounting head 431 mounts components P and measures the vibration of the test board B at each of the multiple vibration detection positions Ls corresponding to the multiple mounting target positions Lm, thereby acquiring board vibration distribution data Dv (steps S104 to S108). Then, the main control unit 910 of the calculation unit 91 generates pin arrangement data Dp based on the board vibration distribution data Dv (step S112). In this configuration, pin arrangement data Dp is generated based on the vibrations of the test board B that occur when components P are mounted in a predetermined order to multiple mounting target positions Lm provided on the test board B by the mounting head 431. Therefore, by placing backup pins 77 at the positions indicated by the pin assignment data Dp (step S113), the mounting of components P to multiple mounting target positions Lm that are subsequently executed in the predetermined order can be performed while suppressing vibrations of the test board B and production board B.

[0053] Furthermore, a UI93 (User Notification Unit) is provided to notify the user. The UI control unit 911 of the calculation unit 91, after the backup pins 77 have been placed according to the pin placement data Dp generated based on the board vibration distribution data Dv, notifies the UI93 to perform an action other than placing the backup pins 77 (step S114) if there is a vibration detection position Ls where the amplitude A of the vibration detected is greater than or equal to a threshold value (YES in step S109). With this configuration, even if vibrations of board B occur that cannot be adequately addressed by placing the backup pins 77, it is possible to address the vibrations of board B by prompting the user to perform other actions.

[0054] Figure 8 is a flowchart showing a second example of backup pin placement support performed by the component mounting machine shown in Figure 1. The flowchart in Figure 8 is executed under the control of the main control unit 910. The difference from the first example in Figure 5 is that steps S115 to S116 are performed instead of step S113; otherwise, it is the same as the first example in Figure 5. Therefore, this explanation will focus on the differences, and the common points will be denoted by corresponding reference numerals and their explanation will be omitted.

[0055] In step S115, the main control unit 910 of the arithmetic unit 91 generates a layout image that displays the pin placement positions indicated by the pin placement data Dp generated in step S112, and the UI control unit 911 displays this layout image on the display of the UI 93 (image display unit). Therefore, the user can perform the pin placement work of placing the backup pins 77 at the pin placement positions indicated in the pin placement image while confirming the pin placement image displayed on the display. Once this pin placement work is completed, the user performs a placement completion input to the UI 93 to indicate that the work has been completed. Then, when the UI control unit 911 confirms the placement completion input performed to the UI 93, the main control unit 910 of the arithmetic unit 910 determines that the user has completed the placement of the backup pins 77 ("YES" in step S116).

[0056] In the second example of backup pin placement support, which will be explained using Figure 8, the pin placement data Dp is generated in the same manner as in the first example (step S112). Therefore, by placing the backup pins 77 at the positions indicated by the pin placement data Dp (steps S115-S116), vibrations caused by the mounting of components P can be suppressed without adjusting the speed at which the mounting head 431 mounts the components P. As a result, it is possible to quickly mount components P onto the test board B or production board B while suppressing vibrations of the board B caused by the mounting of components P onto the board B.

[0057] Furthermore, a UI93 (display) is provided to display images to the user. The main control unit 910 of the arithmetic unit 91 generates a pin arrangement image indicating the position where the backup pins 77 should be placed based on the pin arrangement data Dp and displays it on the UI93 display (step S115). In this configuration, the user can place the backup pins 77 at the positions indicated by the pin arrangement data Dp by checking the pin arrangement image displayed on the UI93 (steps S115-S116). As a result, it is possible to quickly mount the components P onto the board B while suppressing vibrations of the board B caused by the mounting of components P onto the board B.

[0058] As described above, in the first and second examples of backup pin placement support, components P are mounted at multiple mounting target positions Lm on the test board B according to the board data Db, and in board production, components P are mounted at multiple mounting target positions Lm on the production board B according to the board data Db. In the next example, the time interval for mounting components P at multiple mounting target positions Lm differs between backup pin placement support and board production.

[0059] Figure 9 is a flowchart schematically showing an example of the time interval for mounting components on a test board or production board. In Figure 9, a component P is mounted at mounting target position Lm(1) at time T1, a component P is mounted at mounting target position Lm(2) at time T2, and so on, illustrating the operation of sequentially mounting components P at multiple mounting target positions Lm. Furthermore, for one mounting target position Lm(N) and the next mounting target position Lm(N+1) where components P are mounted consecutively, the time T(N) at which component P is mounted at mounting target position Lm(N) and the time T(N+1) at which component P is mounted at mounting target position Lm(N+1) are shown, along with the time interval ΔT(N) between time T(N) and time T(N+1). Here, N is an identifier for identifying the mounting target position Lm, and is an integer of 1 or greater.

[0060] In the first or second example of backup pin placement support, the time interval ΔT(N) for mounting component P onto test board B in steps S105 to S107 is set to be longer than or equal to a predetermined vibration damping period Td. This vibration damping period Td is the period required for the vibration of board B generated by the mounting of component P to attenuate and disappear, and is measured in advance and stored in the memory unit 92. On the other hand, in the board production steps S204 to S206, the time interval ΔT(N) for mounting component P onto production board B is set to be shorter than the vibration damping period Td.

[0061] In other words, according to the embodiment shown in Figure 9, the transport conveyor 41 (transport unit) first transports the test board B to the board loading position Lb (step S102), and then transports the production board B to the board loading position Lb (step S202). Furthermore, the main control unit 910 of the calculation unit 91 (control unit) first performs board mounting on the test board B (steps S105 to S107), and then performs board mounting on the production board B (steps S204 to S206). At this time, board vibration measurement and pin placement data Dp generation are performed in accordance with the board mounting of the test board B (steps S104 to S107, S112). On the other hand, board vibration measurement and pin placement data Dp generation are not performed in accordance with the board mounting of the production board B.

[0062] In this configuration, pin placement data Dp is generated based on the vibration of the test board B that occurs when the mounting head 431 mounts components P to multiple mounting target positions Lm(N) on the test board B in a predetermined order (steps S104-S108, S112). Therefore, by placing backup pins 77 at the positions indicated by this pin placement data Dp (steps S113, S115-S116), the mounting of components P to multiple mounting target positions Lm(N) on the production board B, which is subsequently executed in the predetermined order, can be performed while suppressing vibrations of the production board B.

[0063] Furthermore, with respect to the first mounting target position Lm(N) and the next mounting target position Lm(N+1) where components P are mounted consecutively, during board mounting to the test board B (steps S105-S107), a vibration damping period Td (a predetermined time interval) is left between mounting a component P at the first mounting target position Lm(N) and mounting a component P at the next mounting target position Lm(N+1), while components P are mounted at multiple mounting target positions Lm(N) in a predetermined order. Therefore, vibrations of the test board B are detected (steps S104-S108) while mounting a component P at the next mounting target position Lm(N+1) is performed after the vibration of the test board B associated with the mounting of a component P at the first mounting target position Lm(N) has dampened. Thus, vibrations of the test board B associated with the mounting of a component P at each of the multiple mounting target positions Lm(N) can be detected independently. As a result, pin arrangement data Dp that can effectively suppress vibrations of the board B can be generated. On the other hand, in the board mounting process on the production board (steps S204 to S206), components P are mounted to multiple mounting target positions Lm(N) in a predetermined order without a vibration damping period Td between mounting a component P to one mounting target position Lm(N) and mounting a component P to the next mounting target position Lm(N+1). Therefore, the mounting of components P to multiple mounting target positions Lm(N) on the production board B can be performed quickly.

[0064] As described above, in this embodiment, the component mounting machine 4 corresponds to an example of the "component mounting machine" of the present invention, the transport conveyor 41 corresponds to an example of the "transport unit" of the present invention, the mounting head 431 corresponds to an example of the "mounting head" of the present invention, the mounting head 431 corresponds to an example of the "pin placement head" of the present invention, the component supply unit 44 corresponds to an example of the "component supply unit" of the present invention, the push-up plate 711 corresponds to an example of the "pin placement plate" of the present invention, and the backup pin 77 corresponds to an example of the "backup pin" of the present invention. The calculation unit 91 corresponds to an example of the "control unit" of the present invention, the UI 93 corresponds to an example of the "image display unit" of the present invention, the UI 93 corresponds to an example of the "user notification unit" of the present invention, the substrate B corresponds to an example of the "substrate" of the present invention, the pin arrangement data Dp corresponds to an example of the "pin arrangement data" of the present invention, the mounting target position Lm corresponds to an example of the "mounting work position" of the present invention, the component P corresponds to an example of the "component" of the present invention, the distance sensor Sd corresponds to an example of the "vibration detection unit" of the present invention, and the distance sensor Sd corresponds to an example of the "distance sensor" of the present invention.

[0065] It should be noted that the present invention is not limited to the embodiments described above, and various modifications can be made to those described above without departing from the spirit of the invention. For example, the pin placement position indicated by the pin placement data Dp does not have to be the mounting target position Lm corresponding to the vibration detection position Ls where an amplitude A greater than or equal to a threshold was measured, but may be, for example, the vibration detection position Ls.

[0066] Furthermore, the specific mechanism for detecting vibrations of substrate B does not necessarily have to be a distance sensor Sd. For example, vibrations of substrate B may be detected based on the results of measuring fluctuations in the load applied to the mounting head 431 using a load sensor Sl that measures the load applied to the mounting head 431 when mounting components P onto substrate B. [Explanation of Symbols]

[0067] 4…Component mounting machine 41…Conveyor belt (conveying section) 431... Mounting head (pin configuration head) 44... Parts Supply Department 711... Push-up plate (pin placement plate) 77…Backup pin 91...Calculation unit (control unit) 93...UI (Image display section, user notification section) B... Circuit board Dp...Pin assignment data Lm...Implementation target location P…Parts P Sd... Distance sensor

Claims

1. A transport unit that carries the circuit board to a designated mounting position, A pin arrangement plate on which backup pins supporting the substrate are arranged are provided, which contact the substrate from below at the aforementioned mounting work position, The parts supply unit that supplies parts, A mounting head that mounts components supplied by the component supply unit onto the circuit board located at the mounting work position, The mounting head detects vibrations generated in the substrate when it mounts components onto the substrate, and A control unit generates pin placement data indicating the position on the pin placement plate where the backup pins should be placed, based on the vibration detected by the vibration detection unit. Equipped with, The vibration detection unit has a distance sensor attached to the mounting head, and detects the vibration based on the result of measuring the change in distance to the substrate using the distance sensor. The control unit, While performing substrate mounting in which components are mounted in a predetermined order at a plurality of mounting target positions provided on the substrate by the mounting head, substrate vibration measurement is performed in which the vibration detection unit detects the vibration when the mounting head mounts the components and measures the vibration of the substrate at each of the plurality of vibration detection positions corresponding to the plurality of mounting target positions. The mounting target position, the vibration detection position where the distance sensor detects vibration when a component is mounted at the mounting target position, and the amount of vibration of the substrate measured at the vibration detection position are associated to obtain substrate vibration distribution data for each of the plurality of mounting target positions. Among the multiple amplitudes shown in the aforementioned substrate vibration distribution data, excessive amplitudes exceeding a threshold are identified, and the mounting target position corresponding to such excessive amplitude is identified. A component mounting machine that determines the position for placing the backup pins based on the identified mounting target location.

2. It further includes an image display unit that displays images to the user, The component mounting machine according to claim 1, wherein the control unit generates an image indicating the position where the backup pins should be placed based on the pin placement data and displays it on the image display unit.

3. The pin arrangement plate further comprises a pin arrangement head for arranging the backup pins, The component mounting machine according to claim 1, wherein the control unit causes the pin placement head to perform the operation of placing the backup pins at the positions indicated by the pin placement data.

4. It also includes a user notification unit that notifies the user, The component mounting machine according to claim 1, wherein the control unit causes the user notification unit to perform an operation other than the placement of the backup pins if there is a vibration detection position where the amplitude of the vibration detected in the substrate vibration measurement performed after the backup pins have been placed according to the pin placement data generated based on the results of the substrate vibration measurement is equal to or greater than the threshold.

5. A transport unit for transporting a substrate to a predetermined mounting work position, A pin arrangement plate on which backup pins supporting the substrate are arranged are provided, which contact the substrate from below at the aforementioned mounting work position, The parts supply unit that supplies parts, A mounting head that mounts components supplied by the component supply unit onto the circuit board located at the mounting work position, The mounting head detects vibrations generated in the substrate when it mounts components onto the substrate, and A control unit generates pin placement data indicating the position on the pin placement plate where the backup pins should be placed, based on the vibration detected by the vibration detection unit. Equipped with, The control unit performs board mounting, in which components are mounted in a predetermined order at a plurality of mounting target positions provided on the substrate using the mounting head, and at the same time, it performs board vibration measurement, in which the vibration detection unit detects the vibration when the mounting head mounts the components and measures the vibration of the substrate at each of the plurality of vibration detection positions corresponding to the plurality of mounting target positions, and generates the pin arrangement data based on the results of the board vibration measurement, The transport unit first transports the test board as the board to the mounting work position, and then transports the production board as the board to the mounting work position. The control unit, After performing the board mounting on the test board, the board mounting is performed on the production board, In response to the execution of the board mounting on the test board, the board vibration measurement and the generation of the pin placement data are performed, while in response to the execution of the board mounting on the production board, the board vibration measurement and the generation of the pin placement data are not performed. With respect to a single mounting target position and the next mounting target position on which components are mounted consecutively, in the board mounting on the test board, components are mounted in a predetermined order to the multiple mounting target positions while leaving a predetermined time interval between mounting a component to the first mounting target position and mounting a component to the next mounting target position, whereas in the board mounting on the production board, components are mounted in a predetermined order to the multiple mounting target positions without leaving the predetermined time interval between mounting a component to the first mounting target position and mounting a component to the next mounting target position.

6. A transport unit for transporting a substrate to a predetermined mounting work position, A pin arrangement plate on which backup pins supporting the substrate are arranged are provided, which contact the substrate from below at the aforementioned mounting work position, The parts supply unit that supplies parts, A mounting head that mounts components supplied by the component supply unit onto the circuit board located at the mounting work position, The mounting head detects vibrations generated in the substrate when it mounts components onto the substrate, and A control unit generates pin placement data indicating the position on the pin placement plate where the backup pins should be placed, based on the vibration detected by the vibration detection unit. Equipped with, The vibration detection unit has a load sensor that measures the load applied to the mounting head when mounting components onto the substrate, and the component mounting machine detects the vibration based on the result of measuring the fluctuation of the load applied to the mounting head by the load sensor.

7. The process of transporting the circuit board to the designated mounting work location, A step of supporting the substrate by bringing backup pins arranged on a pin placement plate into contact with the substrate located at the mounting work position from below, The process of supplying parts by the parts supply department, The process involves a mounting head mounting components supplied by the component supply unit onto the substrate located at the mounting work position, The process involves the mounting head mounting components onto the substrate, thereby detecting vibrations generated on the substrate using a vibration detection unit, Based on the vibration detected by the vibration detection unit, the control unit generates pin placement data indicating the position on the pin placement plate where the backup pins should be placed. Equipped with, The vibration detection unit has a distance sensor attached to the mounting head, and detects the vibration based on the result of measuring the change in distance to the substrate using the distance sensor. The control unit, While performing substrate mounting in which components are mounted in a predetermined order at a plurality of mounting target positions provided on the substrate by the mounting head, substrate vibration measurement is performed in which the vibration detection unit detects the vibration when the mounting head mounts the components and measures the vibration of the substrate at each of the plurality of vibration detection positions corresponding to the plurality of mounting target positions. The mounting target position, the vibration detection position where the distance sensor detects vibration when a component is mounted at the mounting target position, and the amount of vibration of the substrate measured at the vibration detection position are associated to obtain substrate vibration distribution data for each of the plurality of mounting target positions. Among the multiple amplitudes shown in the aforementioned substrate vibration distribution data, excessive amplitudes exceeding a threshold are identified, and the mounting target position corresponding to such excessive amplitude is identified. A backup pin placement support method for determining the position to place the backup pin based on the identified mounting target location.

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