Wire connection structure, wire connection method, medical device, and method for manufacturing a medical device.

Abstract

To provide a wire connection structure capable of easily connecting multiple wires and a substrate, a wire connection method, a piece of medical equipment, and a manufacturing method of medical equipment.SOLUTION: In a wire connection structure, a plurality of core wires 21 is connected to multiple pads 61 provided to a substrate 6 with solder 8 at each longitudinal tip of multiple insulated wires 2, in which an outer periphery of the core wires 21 is covered by an insulation coating 22. At each tip of the multiple insulated wires 2, an end face 21a of the core wire 21 and an end face 22a of the insulation coating 22 are positioned at a same longitudinal position, and the solder 8 is attached to the end face 21a and the pad 61 of the core wires 21. A wire connection method to connect the core wire 21 to the pad 61 of the substrate 6 includes: an alignment step of arranging the multiple insulated wires 2 parallel to each other; a cutting step of trimming each of the multiple insulated wires 2 so that the end face 21a of the core wire 21 and the end face 22a of the insulation coating 22 are in the same position; and a connecting step of connecting the end face 21a of the core wire 21 of the multiple insulated wires 2 to the pad 61.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present invention relates to a wire connection structure, a wire connection method, a medical instrument, and a method for manufacturing a medical instrument.

Background Art

[0002] Conventionally, a signal transmission cable having a plurality of wires whose outer periphery of the core wire is covered with an insulating coating, and the plurality of wires are collectively accommodated in a tubular outer jacket, is used in various devices such as medical instruments. In such a cable, there is one in which the core wires of the plurality of wires led out from the outer jacket at the end of the cable are soldered to the pads on the substrate.

[0003] In the cables described in Patent Documents 1 and 2, the insulating coating of each of the plurality of wires led out from the outer jacket is removed and the core wire is exposed over a predetermined length, and the exposed core wire is soldered to the plurality of pads provided on the surface of the substrate.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0005] For example, in a medical catheter cable inserted into the human body, extremely thin wires are used to reduce the outer diameter of the cable, and the interval between the pads on the substrate is also narrowed. Therefore, for example, a short circuit between the plurality of wires is likely to occur due to the core wire exposed from the insulating coating being bent, and the difficulty of connecting the plurality of wires to the substrate is high. And this difficulty of the connection work also becomes a factor in increasing the cost of the device using the cable.

[0006] Therefore, the present invention aims to provide a wire connection structure, a wire connection method, a medical device, and a method for manufacturing a medical device that can easily connect multiple wires to a circuit board. [Means for solving the problem]

[0007] The present invention aims to solve the above problems and provides a wire connection structure in which, at the longitudinal end of each of a plurality of insulated wires, the outer circumference of the core wire is covered with an insulating coating, the core wire is connected to a plurality of pads provided on a substrate by a conductive bonding material, The plurality of insulated wires extend parallel to the surface of the substrate on which the pad is provided, and the tip of each of the plurality of insulated wires is located on the pad. The present invention provides a wire connection structure in which, in each of the plurality of insulated wires, the end face of the core wire and the end face of the insulating coating are located at the same position in the longitudinal direction at the tip, and the conductive bonding material is attached to the end face of the core wire and the pad.

[0008] Furthermore, the present invention aims to solve the above problems and provides a wire connection method for connecting a plurality of insulated wires, each having a core wire covered with an insulating coating, to a plurality of pads provided on a substrate at the longitudinal end of each of the plurality of insulated wires, comprising: an alignment step of arranging the plurality of insulated wires parallel to each other along a predetermined alignment direction; and a cutting step of trimming each of the plurality of insulated wires so that the end face of the core wire and the end face of the insulating coating are at the same position in the longitudinal direction at the end of the tip. The plurality of insulated wires extend parallel to the surface of the substrate on which the pad is provided, and the tip of each of the plurality of insulated wires is positioned on the pad. The present invention provides a wire connection method comprising the steps of arranging the plurality of insulated wires on the substrate and connecting the end faces of the core wires to each of the plurality of pads.

[0009] Furthermore, the present invention aims to solve the above problems and provides a medical device comprising a catheter cable having a plurality of insulated wires whose core wires are covered with an insulating coating, and a substrate having a plurality of pads to which the core wires of the plurality of insulated wires are connected, wherein one end of the longitudinal ends of the catheter cable is inserted into the human body, and the core wires of each of the plurality of insulated wires and the plurality of pads of the substrate are connected by the above-described wire connection structure.

[0010] Furthermore, the present invention aims to solve the above problems and provides a method for manufacturing a medical device comprising a catheter cable having a plurality of insulated wires whose core wires are covered with an insulating coating, and a substrate having a plurality of pads to which the core wires of the plurality of insulated wires are connected, wherein one end of the longitudinal ends of the catheter cable is inserted into the human body, and the method for manufacturing a medical device is provided, wherein each core wire of the plurality of insulated wires and the plurality of pads are connected by the wire connection method described above. [Effects of the Invention]

[0011] According to the wire connection structure, wire connection method, medical device, and method for manufacturing a medical device of the present invention, it becomes possible to easily connect multiple wires to a circuit board. [Brief explanation of the drawing]

[0012] [Figure 1] (a) is an explanatory diagram showing the usage state of a multi-electrode catheter as an example of a medical device according to an embodiment of the present invention. (b) is a cross-sectional view of the catheter cable. [Figure 2] (a) is a plan view showing one side of the circuit board to which multiple insulated wires of the console cable are connected. (b) is a plan view showing the other side of the circuit board. [Figure 3] (a) is a plan view showing a wire connector assembled from multiple insulated wires and a substrate. (b) is a view of the wire connector from the longitudinal direction of the multiple insulated wires, as seen from arrow A in (a). (c) is a cross-sectional view of (a) along line BB. [Figure 4] (a) and (b) are explanatory diagrams showing the state before and after the cutting process. (c) and (d) are explanatory diagrams showing the state before and after the connecting process. [Figure 5] This is a plan view showing a wire connector related to a comparative example. [Figure 6](a) is a plan view showing a modified example in which the end faces of the core wires of a plurality of insulated electric wires on a substrate are arranged in a straight line inclined with respect to the longitudinal direction of the plurality of insulated electric wires. (b) is a cross-sectional view taken along the line C-C of (a). [Figure 7] (a) is a perspective view showing a modified example in which the end face of each core wire of a plurality of insulated electric wires is an inclined surface inclined so as to point toward the pad side with respect to the direction perpendicular to the substrate. (b) is a cross-sectional view taken along the line D-D of (a). [Figure 8] (a) is a perspective view showing a modified example in which the end face of each core wire of a plurality of insulated electric wires is an inclined surface inclined so as to point toward the pad side with respect to the direction perpendicular to the substrate. (b) is a cross-sectional view taken along the line E-E of (a). [Figure 9] The wire connector according to the second embodiment is shown. (a) is a configuration diagram viewed from one surface side of the substrate, (b) is a side view viewed from the direction of arrow F in (a), and (c) is a configuration diagram viewed from the other surface side of the substrate. [Figure 10] (a) is a cross-sectional view taken along the line G-G of FIG. 9(a), and (b) is a cross-sectional view taken along the line H-H of FIG. 9(a). [Figure 11] (a) is a cross-sectional view taken along the line I-I in FIG. 10(b). (b) is a cross-sectional view taken along the line J-J in FIG. 10(b). [Figure 12] It is an explanatory view showing the alignment step and the integration step according to the second embodiment. [Figure 13] It is an explanatory view showing the removal step according to the second embodiment. [Figure 14] It is an explanatory view showing the cutting step according to the second embodiment. [Figure 15] It is an explanatory view showing the connection step according to the second embodiment. [Figure 16] (a) is a configuration diagram of a wire connector according to a modified example of the second embodiment viewed from one surface side of the substrate. (b) is a cross-sectional view taken along the line K-K of (a), and (c) is a cross-sectional view taken along the line L-L of (a).

Embodiments for Carrying Out the Invention

[0013] [First Embodiment] Figure 1(a) is an explanatory diagram showing the usage state of a multi-electrode catheter as an example of a medical device according to an embodiment of the present invention. Figure 1(b) is a cross-sectional view of the catheter cable.

[0014] The multi-electrode catheter 1 comprises a catheter cable 10 and a handle 11 operated by an operator such as a physician. One end of the catheter cable 10 in the longitudinal direction is housed within the handle 11, and the other end in the longitudinal direction is inserted into the body of the subject P undergoing examination or treatment. In Figure 1(a), the portion of the catheter cable 10 inserted into the body of subject P is shown by a dashed line.

[0015] As shown in Figure 1(b), the catheter cable 10 comprises a wire bundle 20 consisting of multiple insulated wires 2, a binding tape 3 wrapped around the outer circumference of the wire bundle 20, a shield conductor 4 arranged on the outer circumference of the binding tape 3, and a tubular jacket 5 as an outer covering arranged on the outer circumference of the shield conductor 4. The jacket 5 is made of, for example, fluororesin and houses the wire bundle 20, the binding tape 3, and the shield conductor 4. The wire bundle 20 is composed of, for example, five or more insulated wires 2 bundled together, and in this embodiment, twelve insulated wires 2 are bundled together. A fibrous or string-like interposition may be placed between the multiple insulated wires 2 inside the binding tape 3.

[0016] Each insulated wire 2 has a core wire 21 made of a highly conductive metal such as copper, and an insulating coating 22 that covers the outer circumference of the core wire 21. In this embodiment, the insulated wire 2 is an enameled wire, and the outer circumference of the core wire 21, which is a single wire with a circular cross-section, is covered with an insulating coating 22 made of a resin composition such as polyurethane. The diameter D of the core wire 21 21 For example, the thickness is between 0.02 mm and 0.10 mm. In this embodiment, the core wire 21 corresponds to AWG48 according to the AWG (American Wire Gauge) standard, and the conductor diameter is 0.032 mm (32 μm). The thickness of the insulating coating 22 is, for example, 0.008 mm (8 μm).

[0017] Multiple insulated wires 2 are led out from the jacket 5 within the handle 11. A console cable 12 is led out from the handle 11, and this console cable 12 connects the handle 11 to a console (not shown). The console is an information processing device equipped with a microprocessor, memory, etc., and for example, amplifies the signals sent from the subject P's body via the multiple insulated wires 2, and outputs an image signal to display the internal state of the subject P obtained from the amplified signals on a display.

[0018] The handle 11 houses a circuit board having multiple pads to which the core wires 21 of multiple insulated wires 2 are connected. Signals sent from the subject P's body are relayed by this circuit board and sent to the console via the console cable 12. Next, the wire connection structure in which the core wires 21 of multiple insulated wires 2 are connected to the multiple pads on the circuit board will be described.

[0019] Figure 2(a) is a plan view showing one side 6a of the substrate 6 to which multiple insulated wires 2 of the catheter cable 10 are connected. Figure 2(b) is a plan view showing the other side 6b of the substrate 6. Figure 3(a) is a plan view showing the wire connector 100, which is a combination of multiple insulated wires 2 and the substrate 6. Figure 3(b) is a view of the wire connector 100 from the longitudinal direction of the multiple insulated wires 2, as seen from the direction of arrow A in Figure 3(a). Figure 3(c) is a cross-sectional view of Figure 3(a) along line BB.

[0020] Multiple insulated wires 2 are integrated on a substrate 6 to form a strip-shaped multi-core wire array 200. Here, "on the substrate 6" refers to a position adjacent to and facing the substrate 6. In this embodiment, as shown in Figure 3(b), the multiple insulated wires 2 are integrated by bonding the insulating coatings 22 of the multiple insulated wires 2 together with an adhesive 71. Note that the adhesive 71 is not shown in Figure 3(a) and Figures 4 to 7 described later.

[0021] In each of the multiple insulated wires 2, the core wire 21 is cut at the same position as the insulating coating 22 at the longitudinal end of each wire, and the end face 21a of the core wire 21 and the end face 22a of the insulating coating 22 are at the same position in the longitudinal direction of the insulated wire 2, as shown in Figure 3(c).

[0022] Furthermore, the multiple insulated wires 2 are arranged parallel to each other on the substrate 6, and as shown in Figure 3(a), when the multiple insulated wires 2 are viewed from a direction perpendicular to one side 6a of the substrate 6, the end faces 21a of each core wire 21 are aligned in a straight line. In this embodiment, the positions of the end faces 21a of the core wires 21 of the multiple insulated wires 2 on the substrate 6 are aligned in a straight line perpendicular to the longitudinal direction of the multiple insulated wires 2.

[0023] The substrate 6 is an FPC (flexible printed circuit board), and a plurality of pads 61 are provided on the surface of a flat base material 60. The pads 61 are electrodes to which the core wires 21 are connected. The base material 60 is made of an insulator such as polyimide and is flexible. The substrate 6 is provided with through-holes 62 that penetrate the base material 60 in the thickness direction, and linear wiring patterns 63. The core wires 21 of the plurality of insulated wires 2 are connected to the plurality of pads 61. Note that the substrate 6 may also be a solid substrate that does not have flexibility.

[0024] The pads 61 and wiring patterns 63 are metal foils formed by etching, with a thickness of, for example, 1 μm to 16 μm. The core wire 21 of the insulated wire 2 is electrically connected to the terminals of an electronic component (not shown) mounted on, for example, a substrate 6, via the pads 61, through-holes 62, and wiring patterns 63.

[0025] In the examples shown in Figures 2(a) and 2(b), multiple pads 61 are provided only on one side 6a of the substrate 6, and these pads 61 are connected to a wiring pattern 63 provided on the other side 6b of the substrate 6 by through-holes 62. However, multiple pads 61 may also be provided on the other side 6b of the substrate 6, and the core wires 21 of multiple insulated wires 2 may be connected to these pads 61.

[0026] Furthermore, in the example shown in Figure 2(a), the pad 61 is formed in a rectangular shape that is long in the longitudinal direction of the multiple insulated wires 2, but the pad 61 only needs to be formed in the part where the core wire 21 is connected. Also, the shape of the pad 61 is not limited to a rectangle, but may be a square, circular, or elliptical shape, for example. The width W of the pad 61 in a direction perpendicular to the longitudinal direction of the multiple insulated wires 2 is equal to the diameter D of the core wire 21. 21 This is equivalent to the above, and a predetermined gap is provided between adjacent pads 61.

[0027] As shown in Figure 3(c), each of the multiple insulated wires 2 has an end face 21a of the core wire 21 exposed from the insulating coating 22 at its longitudinal tip, which is connected to a pad 61 by solder 8 as a conductive bonding material. The solder 8 adheres to the end face 21a of the core wire 21 and the connection surface 61a of the pad 61, electrically connecting and fixing the core wire 21 to the pad 61. Note that the conductive bonding material is not limited to solder; for example, a conductive adhesive may be used.

[0028] In this embodiment, the entire circumference of the circumferential surface 21b of the core wire 21 at the longitudinal end of each of the multiple insulated wires 2 is covered with insulating coating 22. The end surface 2a of the insulated wire 2 forms a single continuous plane with the end surface 22a of the insulating coating 22 and the end surface 21a of the core wire 21. In this embodiment, the end surface 21a of the core wire 21 and the end surface 22a of the insulating coating 22 are perpendicular to the longitudinal direction of the insulated wire 2 and one side 6a of the substrate 6. Also in this embodiment, the insulating coatings 22 of adjacent insulated wires 2 are in contact with each other at the end surface 2a of the insulated wire 2.

[0029] Next, a wire connection method for connecting the core wires 21 of each of the multiple insulated wires 2 to the pads 61 provided on the substrate 6 will be described. This wire connection method includes an alignment step of arranging the multiple insulated wires 2 parallel to each other along a predetermined alignment direction, an integration step of integrating the multiple insulated wires 2 arranged in the alignment step, a cutting step of trimming the ends of the multiple insulated wires 2, and a connection step of arranging the multiple insulated wires 2 on the substrate 6 and connecting the core wires 21 to each of the multiple pads 61. The multi-electrode catheter 1 is manufactured using this wire connection method.

[0030] Figures 4(a) and 4(b) are explanatory diagrams showing the state before and after the cutting process. In the cutting process, multiple insulated wires 2 are trimmed so that the end face 21a of the core wire 21 and the end face 22a of the insulating coating 22 are at the same position at the longitudinal end of each wire. As a result, the end face 21a of the core wire 21 is exposed at the longitudinal end of each wire 2, and the circumferential surface 21b of the core wire 21 is covered with the insulating coating 22. In this embodiment, after the multiple insulated wires 2 have been integrated into a multi-core wire array 200 through the integration process, the ends of the multiple insulated wires 2 are cut collectively by a cutting tool 91. The cutting tool 91 cuts both the core wire 21 and the insulating coating 22 of each of the multiple insulated wires 2. At the end of each of the multiple insulated wires 2, the core wire 21 and the insulating coating 22 are cut at the same position in the longitudinal direction.

[0031] Figures 4(c) and 4(d) are explanatory diagrams showing the state before and after the connection process. In the connection process, the multi-core wire array 200 is fixed to the substrate 6, for example by adhesive, and the end faces 21a of the core wires 21 are connected to the pads 61 with solder 8. The specific method of soldering is not particularly limited, but may be done by heating and melting solder paste applied to the pads 61, by heating and melting spherical solder balls placed on the pads 61, by applying solder to the end faces 21a of the core wires 21 of the insulated wires 2, or by spraying molten solder. Alternatively, the end faces 21a of the core wires 21 may be connected to the pads 61 with conductive adhesive instead of solder 8.

[0032] (Comparative example) Figure 5 is a plan view showing a multi-core wire array 200A according to a comparative example together with a substrate 6. Similar to the multi-core wire array 200 according to the above embodiment, this multi-core wire array 200A has insulated wires 2 having core wires 21 and insulating coatings 22 integrated in parallel to each other, but the insulating coatings 22 are removed over a predetermined length at the tip of the insulated wire 2, exposing the circumferential surface 21b of the core wire 21.

[0033] In this multi-core wire array 200A, the bending and tilting of the core wires 21 in the parts where the insulating coating 22 has been removed makes it easy for short circuits to occur between the core wires 21 of adjacent insulated wires 2 when soldering. In particular, when the diameter of the core wire 21 is 0.1 mm or less, the rigidity of the core wire 21 itself is low and bending occurs easily, and the spacing of the pads 61 is also narrow, so short circuits due to solder bridges etc. occur frequently during the connection process.

[0034] (Effects of the first embodiment) According to the first embodiment of the present invention described above, the circumferential surface 21b of the core wire 21 at the tip of the multiple insulated wires 2 is covered with insulating coating 22, and only the end face 21a of the core wire 21 is exposed. Since this end face 21a is connected to the pad 61 of the substrate 6, it is possible to easily connect the multiple insulated wires 2 to the substrate 6 while suppressing the occurrence of short circuits during the connection process. Furthermore, unlike the comparative example above, it is not necessary to remove the insulating coating 22 over a predetermined length, and processing of the insulated wires 2 is also made easier. Moreover, since the multiple insulated wires 2 are integrated, the ends of the multiple insulated wires 2 can be cut and trimmed all at once during the cutting process.

[0035] (Modified version of the first embodiment) Next, wire connectors 101 to 103 relating to modifications of the first embodiment will be described with reference to Figures 6 to 8. In these modifications, the shape of the ends of the multiple insulated wires 2 cut in the cutting process differs from that of the above embodiment. In Figures 6 to 8, components corresponding to those described in the first embodiment are given the same reference numerals as those in Figures 2 to 5, and redundant explanations are omitted.

[0036] Figure 6(a) is a plan view showing a modified example in which the end faces 21a of each core wire 21 of the multiple insulated wires 2 on the substrate 6 are arranged in a straight line inclined with respect to the longitudinal direction of the multiple insulated wires 2. Figure 6(b) is a cross-sectional view of Figure 6(a) along line CC.

[0037] As shown in Figure 6(a), when multiple insulated wires 2 are viewed from a direction perpendicular to one side 6a of the substrate 6, the end faces 2a of each of the multiple insulated wires 2 are aligned along a straight line inclined at an angle θ1 with respect to the longitudinal direction of the multiple insulated wires 2. The angle θ1 is less than 90°, for example, between 30° and 70°.

[0038] In the wire connection method for manufacturing the wire connector 101 according to this modified example, in the cutting step, one end of each of the multiple insulated wires 2 is trimmed so that the end faces 21a of each core wire 21 of the multiple insulated wires 2 on the substrate 6 are aligned in a straight line that is inclined with respect to the longitudinal direction and alignment direction of the multiple insulated wires 2.

[0039] According to this modified version, in addition to the effects of the above embodiment, the distance between the end faces 21a of adjacent insulated wires 2 becomes longer, making it easier to connect the core wires 21 to the pad 61.

[0040] Figure 7(a) is a perspective view showing a modified example in which the end faces 21a of each core wire 21 of multiple insulated wires 2 are inclined surfaces with respect to the direction perpendicular to the substrate 6, and these inclined end faces 21a are facing the pad 61 side. Figure 7(b) is a cross-sectional view along the DD line of Figure 7(a). In Figure 7(a), the connection between the core wire 21 and the pad 61 by solder 8 is incomplete for one of the multiple insulated wires 2.

[0041] As shown in Figure 7(b), the end face 21a of each core wire 21 of the multiple insulated wires 2 is inclined with respect to the longitudinal direction of the multiple insulated wires 2. The inclination angle θ2 of the end face 21a with respect to the longitudinal direction of the insulated wires 2 is, for example, 30° or more and 60° or less.

[0042] In the wire connection method for manufacturing the wire connector 102 according to this modified example, in the cutting step, the end face 21a of each core wire 21 of the multiple insulated wires 2 is made into an inclined surface with respect to the longitudinal direction of the multiple insulated wires 2. In the connection step, the multiple insulated wires 2 are arranged on the substrate 6 so that the end faces 21a of the core wires 21 face towards the pad 61, and the end faces 21a of the core wires 21 are connected to the pad 61 with solder 8. At this time, as shown by the dashed line in Figure 7(b), a spherical solder ball 80 is placed between the end face 21a of the core wire 21 and the pad 61, and soldering is performed by heating and melting this solder ball 80. In the cutting step, the multiple insulated wires 2 may be cut diagonally with respect to the longitudinal direction of each of the multiple insulated wires 2 to make the end face 21a of the core wire 21 an inclined surface, or the multiple insulated wires 2 may be cut perpendicular to the longitudinal direction and then the core wires 21 may be shaved to make the end face 21a an inclined surface.

[0043] According to this modified example, in addition to the effects of the above embodiment, the area of ​​the end face 21a of the core wire 21 is increased, making it easier to connect the core wire 21 to the pad 61.

[0044] Figure 8(a) is a perspective view showing a modified example in which the end faces 21a of each core wire 21 of the multiple insulated wires 2 are inclined surfaces with respect to the direction perpendicular to the substrate 6, and these inclined end faces 21a are facing away from the pad 61. Figure 8(b) is a cross-sectional view along line EE of Figure 8(a). In Figure 8(a), the connection between the core wire 21 and the pad 61 by solder 8 is incomplete for one of the multiple insulated wires 2.

[0045] As shown in Figure 8(b), the end face 21a of each core wire 21 of the multiple insulated wires 2 is inclined with respect to the longitudinal direction of the multiple insulated wires 2. The inclination angle θ3 of the end face 21a with respect to the longitudinal direction of the insulated wires 2 is, for example, 30° or more and 60° or less.

[0046] In the wire connection method for manufacturing the wire connector 103 according to this modified example, in the cutting step, the end face 21a of each core wire 21 of the multiple insulated wires 2 is made into an inclined surface that is inclined with respect to the longitudinal direction of the multiple insulated wires 2. In the connection step, the multiple insulated wires 2 are arranged on the substrate 6 such that the end face 21a of the core wires 21 faces away from the pad 61, and the end face 21a of the core wires 21 is connected to the pad 61.

[0047] According to this modified version, in addition to the effects of the above embodiment, the area of ​​the end face 21a of the core wire 21 is increased, making it easier to connect the core wire 21 to the pad 61. Also, since the end face 21a of the core wire 21 faces away from the pad 61, it becomes easier to check the connection status of the core wire 21 and the pad 61 after the connection process.

[0048] [Second Embodiment] Next, a second embodiment of the present invention will be described with reference to Figures 9 to 15. In Figures 9 to 15, components corresponding to those described in the first embodiment above are denoted by the same reference numerals as those used in Figures 2 to 5, and redundant descriptions are omitted.

[0049] The wire connection structure according to this embodiment is similar to the wire connection structure according to the first embodiment in which the core wires 21 of each of the longitudinal ends of a plurality of insulated wires 2 are connected to a plurality of pads 61 provided on a substrate 6 by solder 8 as a conductive bonding material. However, in this embodiment, the plurality of insulated wires 2 are arranged parallel to each other with a gap between them on the substrate 6. In addition, in this embodiment, a portion of the circumferential insulation coating 22 at the end of each of the plurality of insulated wires 2 is removed so that the circumferential surface 21b of the core wire 21 is exposed, and solder 8 as a conductive bonding material is attached to this exposed circumferential surface 21b of the core wire 21.

[0050] Figure 9 shows a wire connector 110 according to this embodiment, where (a) is a configuration diagram viewed from one side 6a of the substrate 6, (b) is a side view viewed from the direction of arrow F in (a), and (c) is a configuration diagram viewed from the other side 6b of the substrate 6. Figure 10(a) is a cross-sectional view of Figure 9(a) along line GG, and Figure 10(b) is a cross-sectional view of Figure 9(a) along line HH. Figure 11(a) is a cross-sectional view of Figure 10(b) along line II, and Figure 11(b) is a cross-sectional view of Figure 10(b) along line JJ. Figures 12 to 15 are explanatory diagrams showing a wire connection method according to this embodiment.

[0051] The wire connector 110 is used in the multi-electrode catheter 1, similar to the wire connector 100 according to the first embodiment. Multiple insulated wires 2 are cut at the same position in the longitudinal direction at the tip of each wire, with the end face 21a of the core wire 21 and the end face 22a of the insulating sheath 22 located at the same position in the longitudinal direction of the insulated wire 2.

[0052] Multiple insulated wires 2 are fixed to the substrate 6 with adhesive 72. In Figures 9 and 10, the adhesive 72 is shown in dark gray. The adhesive 72 is attached to the other surface 6b at the edge of the substrate 6, and to some of the multiple insulated wires 2 near the edge of the substrate 6. Alternatively, the adhesive 72 may be attached to one surface 6a of the substrate 6.

[0053] In this embodiment, multiple insulated wires 2 are fixed and integrated together by wire fixing members 73 at predetermined intervals in the direction of alignment. In Figures 9 to 15, the wire fixing members 73 are shown in light gray. Note that the wire fixing members 73 are not shown in Figure 11. The wire fixing members 73 are made of, for example, resin.

[0054] In this embodiment, since multiple insulated wires 2 are fixed at predetermined intervals in the parallel direction, the spacing between the pads 61 is increased, making it possible to more reliably prevent short circuits between the pads 61. Furthermore, even if the diameter of each of the multiple insulated wires 2 is formed to be larger than the standard dimension within the tolerance range, the position of each core wire 21 of the multiple insulated wires 2 can be aligned with the position of the pad 61.

[0055] The spacing S between multiple insulated wires 2 in the direction of alignment (see Figure 10(a)) of the multiple insulated wires 2 integrated by the wire fixing member 73 is smaller than the diameter D2 of the insulated wire 2. The desirable range for the spacing S relative to the diameter D2 of the insulated wire 2 is 7% to 25%. If the ratio of the spacing S to the diameter D2 of the insulated wire 2 is less than 7%, the above effect is difficult to obtain by spacing out the multiple insulated wires 2, and if this ratio exceeds 25%, it will lead to an increase in the size of the substrate 6.

[0056] Furthermore, in this embodiment, a portion of the insulating coating 22 in the circumferential direction at the tip of each of the multiple insulated wires 2 is removed, exposing the circumferential surface 21b of the core wire 21, and solder 8 is attached to this exposed circumferential surface 21b of the core wire 21. The insulating coating 22 is removed in the portion of the core wire 21 that is on the pad 61 side. By attaching solder 8 to the circumferential surface 21b of a portion of the core wire 21 in the circumferential direction, in addition to the end face 21a of the core wire 21, the fixing strength of the core wire 21 to the pad 61 is increased.

[0057] Furthermore, in this embodiment, the core wires 21 at the ends of each of the multiple insulated wires 2 are bent to approach the pad 61. The amount by which the core wires 21 approach the pad 61 due to this bending corresponds to the thickness of the insulating coating 22. By bending the core wires 21 in this way, the distance between the end face 21a and the pad 61 is shortened, allowing the core wires 21 to be joined to the pad 61 more reliably.

[0058] Next, the wire connection method of this embodiment will be described. Similar to the first embodiment, the wire connection method of this embodiment includes an alignment step of arranging a plurality of insulated wires 2 parallel to each other along a predetermined alignment direction, an integration step of integrating the plurality of insulated wires 2 arranged in the alignment step, a cutting step of trimming the ends of the plurality of insulated wires 2 so that the end face 21a of the core wire 21 and the end face 22a of the insulating coating 22 are at the same position in the longitudinal direction, and a connection step of arranging the plurality of insulated wires 2 on a substrate 6 and connecting the core wires 21 to each of the plurality of pads 61. Furthermore, it includes a removal step of removing a part of the insulating coating 22 in the circumferential direction at the ends of the plurality of insulated wires 2 to expose the circumferential surface 21b of the core wire. These steps will be described in more detail below.

[0059] Figure 12 is an explanatory diagram showing specific examples of the alignment process and the integration process. In the alignment process, an alignment jig 92 is used, which has multiple holding grooves 921 extending parallel to each other to hold a portion of each of the multiple insulated wires 2. By holding each of the multiple insulated wires 2 in the multiple holding grooves 921, the multiple insulated wires 2 are arranged parallel to each other with a gap between them. The groove depth D of the holding grooves 921 from the surface 92a on the multiple insulated wires 2 side of the alignment jig 92. 92 The groove is shallower than the diameter D2 of the insulated wire 2, and a portion of the insulated wire 2 protrudes from the retaining groove 921.

[0060] In the integration process, while holding multiple insulated wires 2 in multiple holding grooves 921 of the alignment jig 92, a liquid wire fixing member 73, before solidification, is applied to the side of the multiple insulated wires 2 opposite to the alignment jig 92 and allowed to solidify. It is desirable that the wire fixing member 73 has sufficient heat resistance to not be affected by the heat generated when the insulated wires 2 are heated by the current flowing through the core wire 21. It is also desirable that the wire fixing member 73 has sufficient viscosity to not adhere to the side 92a of the alignment jig 92 on the side of the multiple insulated wires 2 during the integration process. For example, a cyanoacrylate-based adhesive can be suitably used as the wire fixing member 73.

[0061] For the sake of explanation, the side of the wire fixing member 73 facing the alignment jig 92 will be referred to as the lower surface 73a, and the opposite side as the upper surface 73b. The wire fixing member 73 does not adhere to the alignment jig 92, and a gap (space) is formed between the lower surface 73a of the wire fixing member 73 and the surfaces 92a of the alignment jig 92 facing the multiple insulated wires 2. Parts of each of the multiple insulated wires 2 protrude from the lower surface 73a of the wire fixing member 73, and gaps (spaces) are also formed between these protruding parts in the direction in which the multiple insulated wires 2 are aligned.

[0062] Figure 13 is an explanatory diagram showing a specific example of the removal process. In the removal process, the insulating coating 22 on multiple insulated wires 2 that protrude from the lower surface 73a of the wire fixing member 73 is removed over a predetermined length in the longitudinal direction of the insulated wires 2. Figure 13 shows an example in which the insulating coating 22 is removed by irradiating with laser light Lr. However, the method of removing the insulating coating 22 is not limited to laser irradiation; for example, the insulating coating 22 may be removed using a cutting tool. The circumferential surface 21b of the core wire 21 exposed in the portion where the insulating coating 22 has been removed will face the pad 61 in the connection process described later.

[0063] Figure 14 is an explanatory diagram showing a specific example of the cutting process. In the cutting process, multiple insulated wires 2 are integrated by wire fixing members 73, and the multiple insulated wires 2 are cut together with the wire fixing members 73 by a cutting tool 93. In the example shown in Figure 14, the multiple insulated wires 2 and wire fixing members 73 are cut along a direction perpendicular to the longitudinal direction of the multiple insulated wires 2. However, as shown in the modified example described with reference to Figure 6, the multiple insulated wires 2 and wire fixing members 73 may be cut along a direction inclined with respect to the longitudinal direction of the multiple insulated wires 2. Also, as shown in the modified example described with reference to Figures 7 and 8, the end faces 21a of each core wire 21 of the multiple insulated wires 2 may be inclined surfaces inclined with respect to a direction perpendicular to the substrate 6. Note that the cutting process may be performed after the removal process or before the removal process.

[0064] Figure 15 is an explanatory diagram showing a specific example of the connection process. In the connection process, at least a portion of the circumferential surface 21b of the core wire 21 exposed in the removal process is connected to the pad 61 together with the end face 21a of the core wire 21. The length of the portion of the insulated wire 2 in the longitudinal direction of the exposed circumferential surface 21b of the core wire 21 is, for example, 0.5 mm or more.

[0065] Furthermore, during the connection process, soldering is performed with the tips of multiple insulated wires 2, from which a portion of the circumferential insulation coating 22 has been removed, pressed toward the pad 61 by a pressing jig 94. The pressing jig 94 contacts the upper surface 73b of the wire fixing member 73 and presses the multiple insulated wires 2 through the wire fixing member 73. By pressing the tips of the multiple insulated wires 2 with the pressing jig 94, the core wires 21 in the portion from which a portion of the circumferential insulation coating 22 has been removed are bent so as to approach the pad 61.

[0066] Soldering the core wire 21 to the pad 61 may be performed by heating and melting a spherical solder ball 80 placed on the connection surface 61a of the pad 61, as shown in Figure 15, but is not limited to this. It may also be performed by heating and melting solder paste applied to the pad 61, by applying a welcoming solder to the end face 21a of the core wire 21 of the insulated wire 2, or by spraying molten solder.

[0067] This second embodiment, like the first embodiment, makes it possible to easily connect multiple insulated wires 2 to the substrate 6 while suppressing the occurrence of short circuits. Furthermore, according to the second embodiment, since the multiple insulated wires 2 are arranged in parallel with intervals between them, the spacing between the pads 61 is widened, making it possible to more reliably prevent short circuits between the pads 61. In addition, even if the diameter of the insulated wires 2 is formed to be larger than the standard dimension, the position of each core wire 21 of the multiple insulated wires 2 can be aligned with the position of the pad 61. Moreover, since the core wires 21 at the ends of the multiple insulated wires 2 are covered with insulating coating 22 except for a part in the circumferential direction, it is possible to suppress bending of the core wires 21, for example, as shown in the comparative example in Figure 5. Furthermore, since the core wires 21 in the portion where the insulating coating 22 has been removed are bent to approach the pad 61, the distance between the end face 21a of the core wire 21 and the pad 61 is shortened, and the core wires 21 can be joined to the pad 61 more reliably.

[0068] (Modified version of the second embodiment) Next, a modified wire connector 111 according to the second embodiment will be described with reference to Figure 16. Figure 16(a) is a configuration diagram of the modified wire connector 111 as seen from one side 6a of the substrate 6. Figure 16(b) is a cross-sectional view of Figure 16(a) along line KK, and Figure 16(c) is a cross-sectional view of Figure 16(a) along line LL.

[0069] The wire connector 111 in this modified example is manufactured without performing the removal process of the second embodiment, and a portion of the circumferential insulation coating 22 is not removed at the tips of the multiple insulated wires 2. The other configurations are the same as in the second embodiment.

[0070] This modified configuration also allows for easy connection of multiple insulated wires 2 to the substrate 6 while suppressing the occurrence of short circuits, and prevents short circuits between the pads 61. Furthermore, even when the diameter of the insulated wires 2 is formed to be larger than the standard dimension, the position of each core wire 21 of the multiple insulated wires 2 can be aligned with the position of the pad 61.

[0071] (Summary of embodiments and modified examples) Next, the technical concept understood from the first and second embodiments and modifications described above will be described using the reference numerals, etc., from these embodiments and modifications. However, the reference numerals in the following description are not limited to the components in the claims that are specifically shown in the embodiments.

[0072] [1] A wire connection structure in which a plurality of insulated wires (2), each having a core wire (21) whose outer circumference is covered with an insulating coating (22), have the core wire (21) connected to a plurality of pads (61) provided on a substrate (6) by a conductive bonding material (solder 8) at the longitudinal end of each of the plurality of insulated wires (2), wherein at the end of each of the plurality of insulated wires (2), the end face (21a) of the core wire (21) and the end face (22a) of the insulating coating (22) are in the same position in the longitudinal direction, and the conductive bonding material (8) is attached to the end face (21a) of the core wire (21) and the pads (61).

[0073] [2] The wire connection structure according to [1], wherein the circumferential surface (21b) of the core wire (21) at the tip of each of the plurality of insulated wires (2) is covered with the insulating coating (22).

[0074] [3] The wire connection structure according to [1] above, wherein a portion of the circumferential insulation coating (22) at the tip of each of the plurality of insulated wires (2) is removed to expose the circumferential surface (21b) of the core wire (21), and the conductive bonding material (8) is attached to the exposed circumferential surface (21b) of the core wire (21).

[0075] [4] The wire connection structure according to [3], wherein each of the plurality of insulated wires (2) is bent such that the core wire (21) at the tip approaches the pad (61).

[0076] [5] The wire connection structure according to [1] above, wherein the plurality of insulated wires (2) are arranged parallel to each other on the substrate (6), and the end faces (21a) of each of the core wires (21) are aligned in a straight line.

[0077] [6] The wire connection structure according to [5], wherein the positions of the end faces (21a) of each of the multiple insulated wires (2) on the substrate (6) are arranged in a straight line inclined with respect to the longitudinal direction of the multiple insulated wires (2).

[0078] [7] The wire connection structure according to [1], wherein the end face (21a) of each of the core wires (21) of the plurality of insulated wires (2) is an inclined surface that is inclined with respect to a direction perpendicular to the substrate (6), and the inclined surface is directed toward the pad (61).

[0079] [8] The wire connection structure according to [1], wherein the end face (21a) of each of the core wires (21) of the plurality of insulated wires (2) is an inclined surface that is inclined with respect to a direction perpendicular to the substrate (6), and the inclined surface faces away from the pad (6).

[0080] [9] The wire connection structure according to [1] above, wherein the plurality of insulated wires (2) are integrated on the substrate (6).

[0081]

[10] The wire connection structure according to [9] above, wherein the plurality of insulated wires (2) are arranged parallel to each other with a gap between them.

[0082]

[11] The diameter (D) of the core wire (21) 21 The wire connection structure described in [1] above, wherein the diameter is 0.10 mm or less.

[0083]

[12] A wire connection method comprising: connecting a plurality of insulated wires (2), each having a core wire (21) whose outer circumference is covered with an insulating coating (22), to a plurality of pads (61) provided on a substrate (6) at the longitudinal end of each of the plurality of insulated wires (2), the method comprising: an alignment step of arranging the plurality of insulated wires (2) parallel to each other along a predetermined alignment direction; a cutting step of cutting each of the plurality of insulated wires (2) so that the end face (21a) of the core wire (21) and the end face (22a) of the insulating coating (22) are in the same position in the longitudinal direction at the end of the tip; and a connection step of arranging the plurality of insulated wires (2) on the substrate (6) and connecting the end face (21a) of the core wire (21) to each of the plurality of pads (61).

[0084]

[13] The wire connection method according to

[12] , further comprising a removal step of removing a portion of the circumferential insulating coating (22) at the tip of the plurality of insulated wires (2) to expose the circumferential surface (21b) of the core wire (21), and in the connection step, connecting at least a portion of the circumferential surface (21b) of the core wire (21) exposed in the removal step to the pad (61) together with the end face (21a) of the core wire (21).

[0085]

[14] The wire connection method according to

[12] , further comprising an integration step of integrating the plurality of insulated wires (2) arranged in the alignment step, wherein in the cutting step, the core wire (21) and the insulating coating (22) are trimmed while the plurality of insulated wires (2) are integrated.

[0086]

[15] The wire connection method according to

[14] above, wherein in the alignment step, the plurality of insulated wires (2) are arranged with a gap between them.

[0087]

[16] The wire connection method according to

[14] , wherein in the cutting step, one end of each of the plurality of insulated wires (2) is trimmed so that the positions of the end faces (21a) of each of the core wires (21) of the plurality of insulated wires (2) on the substrate (6) are aligned in a straight line inclined with respect to the longitudinal direction of the plurality of insulated wires (2).

[0088]

[17] The wire connection method according to

[12] , wherein in the cutting step, the end face (21a) of each of the plurality of insulated wires (2) is made into an inclined surface with respect to the longitudinal direction, and in the connection step, the plurality of insulated wires (2) are arranged on the substrate (6) such that the end face (21a) of the core wire (21) faces the pad (61) and the end face (21a) of the core wire (21) is connected to the pad (6).

[0089]

[18] The wire connection method according to

[12] , wherein in the cutting step, the end face (21a) of each of the multiple insulated wires (2) is made into an inclined surface with respect to the longitudinal direction, and in the connection step, the multiple insulated wires (2) are arranged on the substrate (6) such that the end face (21a) of the core wire (21) faces away from the pad (6), and the end face (21a) of the core wire (21) is connected to the pad (61).

[0090]

[19] A medical device (multi-electrode catheter 1) comprising a catheter cable (10) having a plurality of insulated wires (2) whose core wires (21) are covered with an insulating coating (22), and a substrate (6) having a plurality of pads (61) to which the core wires (21) of the plurality of insulated wires (2) are connected, wherein one end of the longitudinal ends of the catheter cable (10) is inserted into the human body, and the core wires (21) of each of the plurality of insulated wires (2) and the plurality of pads (61) of the substrate (6) are connected by the wire connection structure described in any one of [1] to

[11] above.

[0091]

[20] A method for manufacturing a medical device (1) comprising a catheter cable (10) having a plurality of insulated wires (2) whose core wires (21) are covered with an insulating coating (22), and a substrate (6) having a plurality of pads (61) to which the core wires (21) of the plurality of insulated wires (2) are connected, wherein one end of the longitudinal ends of the catheter cable (10) is inserted into the human body, wherein the core wires (21) of each of the plurality of insulated wires (2) and the plurality of pads (61) are connected by the wire connection method described in any one of

[12] to

[18] above.

[0092] Although the first and second embodiments of the present invention and their modifications have been described above, these embodiments and modifications do not limit the invention as defined in the claims. Furthermore, it should be noted that not all combinations of features described in the embodiments are necessarily essential for solving the problem of the invention.

[0093] Furthermore, while the first and second embodiments and their modifications described above describe the application of the present invention to a multi-electrode catheter 1, which is a type of medical device, the present invention is not limited to this. For example, the present invention may be applied to an endoscope, or to devices other than medical devices. [Explanation of symbols]

[0094] 1…Multi-electrode catheter (medical device) 10…Catheter cable 2...Insulated wire 200...Multi-core wire array 21...Core wire 21a...End face 21b...Surface 22...Insulating coating 22a...End face 6...Substrate 61...Pad 71...Adhesive 73…Wire fixing component 8…Solder (conductive bonding material)

Claims

1. A wire connection structure in which, at the longitudinal end of each of a plurality of insulated wires, the outer circumference of the core wire is covered with an insulating coating, the core wire is connected to a plurality of pads provided on a substrate by a conductive bonding material, The plurality of insulated wires extend parallel to the surface of the substrate on which the pads are provided. Each of the aforementioned multiple insulated wires has its tip positioned on the pad. In each of the plurality of insulated wires, the end face of the core wire and the end face of the insulating coating are at the same position in the longitudinal direction at the tip. The conductive bonding material is attached to the end face of the core wire and the pad. Wire connection structure.

2. The circumferential surface of the core wire at the tip of each of the plurality of insulated wires is covered with the insulating coating. The wire connection structure according to claim 1.

3. A portion of the circumferential insulation coating at the tip of each of the plurality of insulated wires is removed, exposing the circumferential surface of the core wire. The conductive bonding material is attached to the circumferential surface of the exposed core wire. The wire connection structure according to claim 1.

4. Each of the plurality of insulated wires is bent such that the core wire at the tip approaches the pad, and the amount by which the core wire approaches the pad due to the bending corresponds to the thickness of the insulating coating. The wire connection structure according to claim 3.

5. The plurality of insulated wires are arranged parallel to each other on the substrate, and the end faces of each of the core wires are aligned in a straight line. The wire connection structure according to claim 1.

6. The positions of the end faces of the core wires of each of the plurality of insulated wires on the substrate are arranged in a straight line that is inclined with respect to the longitudinal direction of the plurality of insulated wires. The wire connection structure according to claim 5.

7. Each of the end faces of the core wires of the plurality of insulated wires is an inclined surface that is tilted with respect to a direction perpendicular to the substrate, and the inclined surface is facing the pad side. The wire connection structure according to claim 1.

8. Each of the end faces of the core wires of the plurality of insulated wires is an inclined surface that is tilted with respect to a direction perpendicular to the substrate, and the inclined surface faces away from the pad. The wire connection structure according to claim 1.

9. The plurality of insulated wires are integrated on the substrate. The wire connection structure according to claim 1.

10. The aforementioned plurality of insulated wires are arranged parallel to each other with a gap between them. The wire connection structure according to claim 9.

11. The diameter of the aforementioned core wire is 0.10 mm or less. The wire connection structure according to claim 1.

12. A wire connection method in which a plurality of insulated wires, each having a core wire whose outer circumference is covered with an insulating coating, are connected to a plurality of pads provided on a substrate at the longitudinal end of each of the plurality of insulated wires, Alignment step of arranging the plurality of insulated wires parallel to each other along a predetermined alignment direction, A cutting step of trimming each of the plurality of insulated wires so that the end face of the core wire and the end face of the insulating coating are at the same position in the longitudinal direction at the tip, The process includes arranging the plurality of insulated wires on the substrate such that the plurality of insulated wires extend parallel to the surface of the substrate on which the pads are provided, and the tip of each of the plurality of insulated wires is located on the pad, and connecting the end faces of the core wires to each of the plurality of pads. Method of connecting electrical wires.

13. The process further includes a removal step of removing a portion of the circumferential insulation coating at the tip of the plurality of insulated wires to expose the circumferential surface of the core wire, In the connection step, at least a portion of the circumferential surface of the core wire exposed in the removal step is connected to the pad together with the end face of the core wire. The wire connection method according to claim 12.

14. The process further includes an integration step in which the plurality of insulated wires arranged in the alignment step are integrated, In the cutting process, the core wire and the insulating coating are trimmed while the multiple insulated wires are integrated together. The wire connection method according to claim 12.

15. In the alignment process, the plurality of insulated wires are arranged with a gap between them. The wire connection method according to claim 14.

16. In the cutting process, one end of each of the multiple insulated wires is trimmed so that the end faces of the core wires of each of the multiple insulated wires on the substrate are aligned in a straight line inclined with respect to the longitudinal direction of the multiple insulated wires. The wire connection method according to claim 14.

17. In the cutting process, the end face of each of the core wires of the plurality of insulated wires is made into an inclined surface with respect to the longitudinal direction. In the connection step, the plurality of insulated wires are arranged on the substrate so that the end faces of the core wires face the pad side, and the end faces of the core wires are connected to the pad. The wire connection method according to claim 12.

18. In the cutting process, the end face of each of the core wires of the plurality of insulated wires is made into an inclined surface with respect to the longitudinal direction. In the connection step, the plurality of insulated wires are arranged on the substrate such that the end faces of the core wires face away from the pad, and the end faces of the core wires are connected to the pad. The wire connection method according to claim 12.

19. A medical device comprising a catheter cable having multiple insulated wires, the core wires of which are covered with an insulating coating, and a substrate having multiple pads to which the core wires of the multiple insulated wires are connected, wherein one end of the longitudinal ends of the catheter cable is inserted into the human body, Each of the core wires of the plurality of insulated wires and the plurality of pads of the substrate are connected by the wire connection structure described in any one of claims 1 to 11. Medical devices.

20. A method for manufacturing a medical device comprising a catheter cable having a plurality of insulated wires whose core wires are covered with an insulating coating, and a substrate having a plurality of pads to which the core wires of the plurality of insulated wires are connected, wherein one end of the longitudinal ends of the catheter cable is inserted into the human body, The core wires of each of the plurality of insulated wires and the plurality of pads are connected by the wire connection method described in any one of claims 12 to 18. A method for manufacturing medical devices.

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