Inspection device and stamp inspection device using the same

Abstract

To provide an inspection device capable of accurately inspecting whether or not a chip component is adhered to the predetermined place of a stamp, with a compact device configuration, even when the chip component is small and to provide a stamp inspection device using the inspection device.SOLUTION: The inspection device includes a photographing unit which includes a light source for irradiating the surface of an inspection object with light and a line scan camera for imaging the surface of the inspection object and moving means which moves at least one of the inspection object and the photographing unit in a direction crossing the scan direction of the line scan camera on the surface of the inspection object and acquires the two-dimensional image of the surface of the inspection object, to inspect the surface state.SELECTED DRAWING: Figure 4

Description

Technical Field

[0001] The present invention relates to an inspection device for inspecting the surface state of an inspection object, and particularly to a stamp inspection device for inspecting a state in which a chip component adheres to a stamp used when picking up a chip component from a transfer source substrate and transferring it to a transfer destination substrate.

Background Art

[0002] These days, as the practical application of μLED displays progresses, there is an increasing interest in chip transfer that picks up chip components arranged in a dense state on a transfer source substrate, widens the pitch, and mounts them on a transfer destination substrate.

[0003] As one method of performing such chip transfer, a stamp method capable of simultaneously detaching and attaching a plurality of chip components on a sticky surface is known. (For example, Patent Document 1) As shown in the cross-sectional view of FIG. 9(a), the stamp 2 used in the stamp method is provided with an adhesive portion 21 on a plate-shaped stamp body 20, and the interval of the adhesive portions 21 is an integer multiple of the pitch of the chip components C on the transfer source substrate S0.

[0004] As shown in FIG. 9(a), after the stamp 2 held by the pickup head 101 is aligned so that the chip component C is disposed directly below the adhesive portion 21, the adhesive portion 21 is brought into close contact with the chip component C as shown in FIG. 9(b). At this stage, if the adhesive force of the adhesive portion 21 with respect to the chip component C exceeds the adhesive force with respect to the transfer source substrate S0, when the stamp 2 is lifted (separated from the transfer source substrate S0), the chip component C adhered to the adhesive portion 21 is picked up from the transfer source substrate S0 (FIG. 9(c)).

[0005] The stamp 2, which has picked up the chip component C, is held by the mounting head 102 and, after being positioned at a predetermined location on the transfer destination substrate S1 as shown in Figure 10(a), is pressed onto the transfer destination substrate S1 as shown in Figure 10(b). At this stage, if the adhesive force of the adhesive portion 21 to the chip component C is weakened by heating or other means to lessen than the bonding force to the transfer destination substrate S1, the stamp 2 can be raised (separated from the transfer destination substrate S1), and the chip component C will be separated from the stamp 2 and mounted on the transfer destination substrate S1 (Figure 10(c)). Here, the adhesive force of the adhesive portion 21 may be weakened by heating the chip component C, while the bonding force between the chip component C and the transfer destination substrate S1 may be strengthened.

[0006] As described above, stamp 2 transfers the chip component C picked up from the source substrate S0 to the destination substrate S1 with the adhesive portion 21 attached, as shown in Figure 11(a), and the chip component C is no longer attached to the adhesive portion 21 after the transfer, as shown in Figure 11(b). Figure 11(c) shows the configuration of a chip transfer device that performs this operation, and includes a pickup device 5 and a mounting device 6.

[0007] In such a chip transfer apparatus, the pickup device 5 should hold all the chip components C on the adhesive parts 21, and the mounting device 6 should transfer all the chip components C that were attached to the adhesive parts 21 to the transfer destination substrate S1. However, in the pickup device 5, as shown in Figure 12(a), chip components C may not adhere to some of the adhesive parts 21. Also, in the mounting device 6, chip components C that could not be mounted on the transfer destination substrate S1 may remain on the adhesive parts 21, as shown in Figure 12(b).

[0008] Overlooking phenomena like those shown in Figures 12(a) and 12(b) poses a significant problem in the chip transfer process. Therefore, it is preferable to place the stamp inspection device 7 between the pickup device 5 and the mounting device 6, as shown in Figure 13. The stamp inspection device 7 checks whether chip components C are attached to a predetermined location (adhesive portion 21) of the stamp 2 in the state shown in Figure 11(a), and inspects whether there are any chip components C remaining on the stamp 2 in the state shown in Figure 11(b).

[0009] Figure 14 shows a configuration using a general visual inspection device for observing the state of the chip component holding surface of stamp 2. In Figure 14, the chip component holding surface of stamp 2, illuminated by light emitted from a reflective light source 402, is photographed by an area camera 42, which is a two-dimensional imaging means, and the presence or absence of chip component C is determined by analyzing the image. For example, Figure 15(a) shows the state of the chip component holding surface after pickup and before mounting, where the IRC corresponding to the part holding chip component C is bright, and the part corresponding to the adhesive part 21 that does not hold chip component C is dark. Figure 15(b) shows the state of the chip component holding surface after mounting, where it can be seen that chip component C remains in the bright area. [Prior art documents] [Patent Documents]

[0010] [Patent Document 1] Japanese Patent Publication No. 2019-175961 [Overview of the project] [Problems that the invention aims to solve]

[0011] When performing inspections with a configuration like that shown in Figure 14, the state of the reflected image will differ depending on the light intensity and direction of the reflective light source 402. If one attempts to determine the presence or absence of chip component C based on the brightness of the image, setting a threshold becomes difficult, which can lead to misjudgments.

[0012] Therefore, it is necessary to illuminate the entire object being inspected uniformly. To achieve this, it is desirable to increase the distance from the object being inspected to the reflective light source 402 and illuminate from multiple directions, which inevitably leads to a larger illumination system.

[0013] Furthermore, as chip components C are further miniaturized and the number of chip components C attached to a single stamp 2 increases, the number of pixels in the area camera 42 per chip component C decreases, making accurate detection difficult. For this reason, one method is to narrow the field of view of the area camera 42 and image a single stamp 2 in multiple locations, but this has the drawback of increasing the number of images taken, which lengthens the inspection cycle time.

[0014] The present invention has been made in view of the above problems, and provides an inspection device that enables accurate inspection of whether or not a chip component is attached to a predetermined location on a stamp, even if the chip component is small, using a compact device configuration, and a stamp inspection device using the same. [Means for solving the problem]

[0015] To solve the above problems, the invention of claim 1 is: An inspection device for inspecting the surface condition of an object to be inspected, The system comprises a light source that irradiates light onto the surface to be inspected, a shooting unit having a line scan camera that images the surface to be inspected, and a moving means for moving at least one of the object to be inspected and the shooting unit in a direction intersecting the scanning direction of the line scan camera on the surface to be inspected. This is an inspection device that acquires a two-dimensional image of the surface to be inspected and inspects the surface condition.

[0016] The invention described in claim 2 is the inspection apparatus described in claim 1, The inspection apparatus is configured such that the irradiation direction of the light source is inclined with respect to the perpendicular direction of the surface to be inspected, and the line scan camera captures the light that has been specularly reflected by the surface to be inspected.

[0017] The invention described in claim 3 is the inspection apparatus described in claim 2, The inspection device has a light source with a horizontally elongated irradiation area that irradiates light onto the surface of the object to be inspected, within the field of view of the line scan camera.

[0018] The invention according to claim 4 is the inspection apparatus according to claim 2 or claim 3, wherein the imaging unit has a mirror disposed on the optical axis of the line scan camera, and the inspection apparatus is configured such that light specularly reflected from the inspection target surface is imaged by the line scan camera via the mirror.

[0019] The invention according to claim 5 is the inspection apparatus according to claim 4, further comprising a stage for arranging the light source, the line scan camera, and the mirror of the imaging unit, and the inspection apparatus is configured to obtain a two-dimensional image of the inspection target by performing imaging at regular intervals while the moving means moves the stage.

[0020] The invention according to claim 6 is the inspection apparatus according to claim 5, wherein imaging is performed at a regular time interval after moving a certain distance or after elapse of a certain time since the start of the movement of the stage.

[0021] The invention according to claim 7 is a stamp used when transferring chip components on a transfer substrate to a transfer destination substrate, and the inspection apparatus according to claim 5 is a stamp inspection apparatus for inspecting the chip component holding surface of the stamp.

[0022] The invention according to claim 8 is the stamp inspection apparatus according to claim 7, further comprising a control unit connected to the camera and having an image processing function, and the stamp inspection apparatus is configured to determine whether or not chip components are held at predetermined locations on the chip component holding surface from the two-dimensional image.

Advantages of the Invention

[0023] ​This invention makes it possible to accurately inspect whether or not a chip component is attached to a predetermined location on a stamp, even if the chip component is small, using a compact device configuration. [Brief explanation of the drawing]

[0024] [Figure 1] (a) is a cross-sectional view showing the configuration of the inspection apparatus according to Embodiment 1 of the present invention, and (b) is a diagram illustrating the region where an image is acquired and the region where light is irradiated. [Figure 2] This is a cross-sectional view showing an example of a light source arrangement when acquiring an image from a direction perpendicular to the surface to be inspected, in relation to the present invention. [Figure 3] (a) is a cross-sectional view showing the configuration of the inspection apparatus according to Embodiment 2 of the present invention, and (b) is a diagram illustrating the region where an image is acquired and the region where light is irradiated. [Figure 4] This is a cross-sectional view showing the configuration of the inspection apparatus according to Embodiment 3 of the present invention. [Figure 5] This figure shows an example of the inspection preparation stage of the inspection apparatus according to Embodiment 3 of the present invention. [Figure 6] (a) is a cross-sectional view of the inspection device and (b) is a diagram illustrating the region where an image is acquired and the region where light is irradiated, in a state where inspection has started using the inspection device of Embodiment 3 of the present invention for stamp inspection. [Figure 7] (a) is a cross-sectional view of the inspection device and (b) is a diagram illustrating the region where an image is acquired and the region where light is irradiated, showing the inspection being carried out using the inspection device of Embodiment 3 of the present invention for stamp inspection. [Figure 8] This figure illustrates the depth of field required by the inspection device according to an embodiment of the present invention. [Figure 9] This diagram illustrates the operation of the pickup device that makes up the chip transfer apparatus, showing (a) the state in which the stamp is approaching the chip component on the source substrate, (b) the state in which the stamp is in close contact with the chip component, and (c) the state in which the stamp has picked up the chip component from the source substrate. [Figure 10]This diagram illustrates the operation of the mounting device that constitutes the chip transfer apparatus, showing (a) the state in which the stamp holding the chip component is approaching the transfer destination substrate, (b) the state in which the chip component is in close contact with the transfer destination substrate, and (c) the state in which the stamp is moving away after the chip component has been mounted on the transfer destination substrate. [Figure 11] This diagram illustrates the state of the stamp, showing (a) the stamp after the pickup operation, (b) the stamp after the implementation operation, and (c) the stamp before the pickup operation and before the implementation operation. [Figure 12] This is a cross-sectional diagram illustrating defects that occur in stamps, showing (a) a state where the pickup operation is incomplete and (b) a state where the mounting operation is incomplete. [Figure 13] This diagram illustrates stamp inspection after the pickup operation and the implementation operation. [Figure 14] This diagram shows a device configuration in which light is shone onto the surface of a stamp and an area camera is used to perform a visual inspection. [Figure 15] This figure shows (a) an example of an image of the stamp surface after pickup and (b) an example of an image of the stamp surface after mounting, obtained by irradiating the stamp surface with light. [Modes for carrying out the invention]

[0025] Embodiments of the present invention will be described with reference to the figures. Figure 1 is a diagram illustrating Embodiment 1 of the present invention, where Figure 1(a) is a cross-sectional view of the apparatus configuration, and Figure 1(b) is a view of the stamp 2 in the inspection state as seen from below.

[0026] In Figure 1(a), the stamp 2 to be inspected holds a chip component C on the lower surface of the stamp body 20, and an adhesive portion 21 is provided in the part that holds the chip component C. The imaging unit 410 consists of a reflective light source 400 that illuminates the lower surface of the stamp 2 with light and a line scan camera 41. The line scan camera 41 has pixels arranged linearly in the Y direction and measures light intensity by scanning in the Y direction.

[0027] Here, it is desirable that the light intensity irradiated by the reflective light source 400 onto the lower surface of the stamp 2 be uniform in the Y direction in the figure. By orienting the longitudinal direction of a linear bar illumination such as an LED array or fluorescent tube in the Y direction in the figure, the light intensity distribution in the Y direction becomes almost constant. Note that, as shown in Figure 1(b), the light irradiation area AL in Embodiment 1 extends in the X direction as well, but it is not necessary for the intensity to be uniform in the X direction.

[0028] Incidentally, when observing the underside of stamp 2, it is generally desirable to point the field of view of the camera placed below stamp 2 vertically upward. For this reason, as shown in Figure 2, a line scan camera 41 and a reflective light source 400 were positioned and imaging was performed, but the brightness and contrast of the acquired image were low. Therefore, the position was adjusted to obtain an image of the area where the light illuminating stamp 2 is strong (corresponding to the strong light illumination area ALs in the light illumination area AL in Figure 1(b)), but there was no significant effect.

[0029] This is likely because, in order to position the reflective light source 400 while avoiding the line scan camera 41, it is not possible to illuminate the bottom surface of the stamp 2 from a direction perpendicular to it, and therefore the line scan camera 41 can only capture diffused light (from the light reflected off the surface of the stamp 2).

[0030] As a result of various studies, it was found that brightness and contrast were greatly improved by imaging specularly reflected light, as shown in Figure 1(a). Specifically, when the light irradiation angle of the light source 400 (with the Y direction as the axis of rotation) is angle θ400, by setting the angle θ41 of the optical axis (relative to the vertical direction of the stamp's lower surface 2) with the linear field of view direction (Y direction) of the line scan camera 41 as the axis of rotation to θ41 = θ400 as shown in Figure 1(a), it was possible to increase the contrast of the light reflected by the chip component C and the adhesive part 21 (and the surface of the stamp body 20). In particular, in stamp inspection, when the flat surface of the metallic-lustered chip component C is held parallel to the lower surface of the stamp 2, the component of specularly reflected light is large and the component of diffused light is small (unlike observation of a surface with irregularities), so the difference in light intensity between the presence and absence of the chip component C on the lower surface of the stamp 2 becomes large. Note that a smaller θ41 is desirable if specular reflection can be obtained, but it is determined by the focal length, the space occupied by the line scan camera 41 and the light source 400, etc. Furthermore, a difference of approximately ±5° between the values ​​of θ41 and θ400 is acceptable.

[0031] Incidentally, as shown in Figure 1(b), since the light illumination area AL of the reflective light source 400 is wide in the X direction, if θ41 = θ400, the camera field of view V4 of the line scan camera 41 (the area where the light sensor receives light) can receive specularly reflected light without precisely adjusting the X-direction position of the line scan camera 41. However, if the image sensor is the same, a stronger light illumination intensity can also shorten the exposure time, which helps to shorten the inspection cycle time. On the other hand, in general bar illumination, the light illumination area AL in Figure 1(b) is strong in the strong light illumination area ALs, and the light illumination intensity weakens as you move away from the strong light illumination area ALs in the X direction. For this reason, it is desirable to align the camera field of view V4 with the specular reflection of the strong light illumination area ALs.

[0032] Furthermore, by using a moving means (moving means 32 in the case of stamp 2, moving means 34 in the case of shooting unit 410) to move at least one of stamp 2 and shooting unit 410 in the X direction (intersecting the linear camera field of view V4) and moving them relative to each other, the line scan camera 41 captures an image at regular intervals, thereby obtaining a two-dimensional image of the bottom surface of stamp 2. In this process, the bottom surface of stamp 2 moves relative to the camera within the camera field of view V4, but the focus in the camera field of view V4 remains.

[0033] Incidentally, in Figure 1(a), if the area camera 42 is used instead of the line scan camera 41, only a very small portion of the image is in focus in the X direction, and the intensity of the reflected light also changes significantly in the X direction (even if the condition of the bottom surface of stamp 2 is the same). For this reason, it is difficult to use the acquired images for inspection.

[0034] On the other hand, by using the line scan camera 41 to move the relative position of the stamp 2 in the X direction and capturing focused specular reflection, a clear two-dimensional image can be obtained, making it suitable for surface inspection.

[0035] Here, since the line scan camera 41 has a one-dimensional sensor array, increasing the pixel size in the direction orthogonal to the sensor array direction can increase the sensor sensitivity or the number of sensors in the line direction compared to a two-dimensional image sensor. However, care must be taken because increasing the pixel size too much in the direction orthogonal to the line direction (Y direction) will reduce the resolution.

[0036] In Embodiment 1 shown in Figure 1, when the camera field of view V4 is aligned with the specular reflection of the strongly illuminated areas ALs, light to the light-illuminated areas AL other than the strongly illuminated areas ALs results in energy loss. Therefore, Embodiment 2, shown in Figure 3, narrows the X-direction of the light-illuminated areas AL and increases the light intensity within the area. Figure 3(a) is a cross-sectional view showing the apparatus configuration of Embodiment 2, which is the same configuration as Embodiment 1 except that it uses a shooting unit 411 with a concentrated illumination 401 as the light source. In this way, energy loss required for light irradiation can be reduced.

[0037] In Embodiment 2, the focused illumination 401 narrows and linearizes the light irradiation area AL in the X direction, as shown in Figure 3(b), and consequently increases the light intensity within the area. Here, the focused illumination 401 is composed of a reflective light source 400 consisting of bar illumination and a focusing lens (placed on the specular reflection optical path leading to the stamp 2), narrowing the light irradiation area AL in the X direction, but not focusing in the Y direction, thus maintaining uniformity in the light intensity distribution in the Y direction of the light irradiation area AL. Note that a focusing lens is not necessarily required for the focused illumination 401; if the original irradiation area AL is narrow in the X direction and the light intensity is uniform in the Y direction, such as an LED array with narrowly directional LEDs arranged horizontally or fiber optic illumination, a focusing lens is unnecessary. Incidentally, in Figure 3(b), the light irradiation area AL represents the area where sufficient reflected light for inspection can be obtained, and (weak) illumination light may also be distributed outside the light irradiation area AL.

[0038] In Embodiment 2 of Figure 3, the camera field of view V4 of the line scan camera 41 must be within the light illumination area AL and receive specular reflection. Therefore, the narrower the X-direction spread of the light illumination area AL, the more precise the adjustment required. In other words, the angle adjustment and X-direction position (and / or Z-direction position) of the line scan camera 41 (for optical axis adjustment) must be precisely adjusted and fixed. However, adjusting the angle of the line scan camera 41 (relative to the Y-axis) is time-consuming, and when moving the imaging unit 411, the line scan camera 41 must be fixed to prevent vibration, which can complicate the adjustment mechanism.

[0039] Therefore, as the third embodiment shown in Figure 4, a device configuration may be used in which a mirror 8 is placed on the optical axis of the line scan camera 41 and a shooting unit 4 is used in combination with a focusing light illuminator 401. In this configuration, the optical path of the light that is specularly reflected from the surface of the object to be inspected (stamp 2) after being illuminated by the focusing light illuminator 401 can be adjusted by the mirror 5 to be directed toward the optical axis of the line scan camera 41.

[0040] In the inspection apparatus 1 shown in Figure 4, the focusing illuminator 401, line scan camera 41, and mirror 8 that constitute the imaging unit 4 are arranged on the stage 31, and the mirror 8 can be fixed by adjusting its position in the X direction and its rotation angle (with the Y axis as the axis of rotation). Since the mirror 8 is smaller and lighter than the line scan camera 41, fine adjustment of its angle and fixing it are easy, thus reinforcing the weakness of Embodiment 2.

[0041] Furthermore, in the inspection apparatus 1 shown in Figure 4, the stage 31 is mounted on a slide mechanism 30 so that it can be moved to any position in the X direction, and the moving means 3, consisting of the slide mechanism 30 and the stage 31, can move the imaging unit 4 in the X direction.

[0042] In the inspection apparatus 1 shown in Figure 4, the control unit 10 is connected to the moving means 3 and can control the operation of the moving means 3. The control unit 10 is also connected to the line scan camera 41 and has the function of acquiring a 2D image by capturing an image each time the moving means moves a certain distance. To recognize the movement of a certain distance, an encoder may be mounted on the stage 31 on the slide mechanism 30 to detect the actual distance moved, or an image may be acquired at regular intervals while moving at a constant speed. If the method of acquiring an image at regular intervals while moving at a constant speed is used, as shown in Figure 5, a run-up distance Xa may be set before starting the inspection, and the movement speed may be considered constant if the run-up distance Xa has been traveled after starting movement in the X direction. Alternatively, instead of setting a certain distance Xa, an image may be acquired at regular intervals after a certain run-up time. In Figure 4, the stage 31 is configured to move in the X direction, but the apparatus may also be configured to have a moving means that moves the stamp 2 in the X direction.

[0043] Furthermore, in the imaging unit 4 shown in Figure 4, the configuration in which the mirror 8 is used as a reflective light source 400 (which becomes the light-illuminated area AL shown in Figure 1(b)) is also effective. In other words, it becomes easier to align the camera field of view V4 within the strongly illuminated area ALs.

[0044] Figures 6 and 7 illustrate the operation of the inspection device 1 shown in Figure 4. Figure 6 shows the state when the inspection of stamp 2 has started, and Figure 7 shows the state when the inspection of stamp 2 has progressed. Figures 6(a) and 7(a) are cross-sectional views of the device, and Figures 6(b) and 7(b) show the light irradiation area AL on the lower surface of stamp 2 and the camera field of view V4.

[0045] Here, if the control unit 10 in Figure 4 has an image processing function, it can be used as a stamp inspection device to check whether a chip component C is held at a predetermined location on the lower surface of the stamp 2 by determining that the location in the 2D image obtained through the process from Figure 6 to Figure 7 where "the reflected light intensity is above a certain level and forms a certain area" is holding the chip component C.

[0046] Although the above describes an embodiment primarily focused on stamp inspection, the inspection apparatus of the present invention can be adapted to inspect the surface condition of various objects by adjusting the image processing program of the control unit to suit the object being inspected. For example, when evaluating the flatness of a measurement object, the surface condition can be inspected by utilizing the fact that if the surface has irregularities, the amount of light diffused in directions other than specular reflection increases.

[0047] Incidentally, in general inspection of uneven surfaces, it is necessary to adjust the aperture of the camera lens so that the range from the deepest to the highest point of the unevenness falls within the depth of field of the camera. On the other hand, in an embodiment of the present invention, if the angle relative to the vertical when capturing an image of the camera field of view V4 of the stamp surface 2 is defined as the image capture angle θ, then in Figure 8, the deepest point is the surface of the stamp body 20, and the highest point is the surface of the chip component C held by the adhesive part 21, and the distance ΔFL1 from the deepest point to the highest point is as follows.

[0048] ΔFL1=(dC+d21) / cosθ (1) Here, dC is the thickness of the chip component C, and d21 is the thickness of the adhesive portion 21. Therefore, in the present invention, it is preferable that the depth of field (DOF) of the camera be greater than or equal to ΔFL1, which is calculated by formula (1). However, in the stamp inspection device of the present invention, it is not necessary for the depth of field (DOF) to be greater than or equal to ΔFL1. In other words, in the stamp inspection targeted by the present invention, it is sufficient to determine whether or not a chip component C is held in the stamp 2, so it is sufficient that the surface of the chip component C held in the adhesive portion 21 of the stamp 2 is within the depth of field.

[0049] However, although rare, chip components C that have detached from the adhesive part 21 may adhere to the surface of the stamp body 20, so it is desirable that the surface of chip components C that are attached to the stamp body 20 also be included in the depth of field. For this reason, it is desirable that the depth of field DOF of the line sensor camera 41 be greater than or equal to ΔFL2 in Figure 8, and the light intensity illuminating the camera field of view 4 and the aperture (F-number) of the line sensor camera 41 are set so as to satisfy this condition and ensure a difference in brightness between the surface of chip components C and other parts. Note that ΔFL2 is shown by the following formula.

[0050] ΔFL2=(dC+d21-dC) / cosθ=d21 / cosθ (2) As shown above, since ΔFL2 is smaller than ΔFL1, in the case of a stamp inspection device, the F-number can be lowered compared to inspection devices for other purposes, allowing inspection to be performed with a brighter image. [Explanation of Symbols]

[0051] 1. Inspection device 2 stamps 3. Means of transportation 4. Shooting Unit 5. Pickup device 6. Mounting device 7 Stamp inspection device 8 Mirrors 10 Control means 20 stamp bodies 21 Adhesive part 30. Slide mechanism 31 stages 41 Line Scan Camera 42 Area Cameras 101 Pickup Head 102 Mounting Head 400 Reflection light source 401 Concentrated lighting AL light irradiation area ALs Strong light irradiation area C chip component S0 Source substrate for transfer S1 Transfer destination substrate V4 Camera field of view (sensor light receiving area) Xa Approach distance

Claims

1. A stamp inspection device for inspecting the chip component holding surface of a stamp used when transferring a chip component from a transfer substrate to a transfer destination substrate, A shooting unit comprising: a light source that irradiates light onto the chip component holding surface; a line scan camera that images the chip component holding surface; and a mirror positioned on the optical axis of the line scan camera. The system includes a stage for moving the imaging unit in a direction intersecting the scanning direction of the line scan camera on the chip component holding surface, The irradiation direction of the light source is inclined with respect to the perpendicular direction of the chip component holding surface, While moving the stage, the line scan camera captures, via the mirror, the light irradiated from the light source and specularly reflected from the chip component holding surface at regular intervals. A stamp inspection device that acquires a two-dimensional image of the chip component holding surface and inspects the chip component holding surface.

2. A stamp inspection device according to claim 1, A stamp inspection apparatus in which the light source has a horizontally elongated irradiation area and irradiates light into the field of view area of ​​the line scan camera on the chip component holding surface.

3. A stamp inspection device according to claim 1, After the movement of the aforementioned stage begins, after moving a certain distance or after a certain amount of time has elapsed, A stamp inspection device that takes images at regular intervals.

4. A stamp inspection device according to claim 1, The camera is further connected to a control unit having an image processing function, A stamp inspection device that determines from the two-dimensional image whether or not a chip component is held at a predetermined location on the chip component holding surface.

Images