Temperature measuring device

Abstract

To provide a temperature measurement device capable of performing highly accurate measurement of a temperature in comparison with conventional temperature measurement devices while having high assembly efficiency.SOLUTION: A temperature measurement device 1 comprises: a distance sensor 40; a first waveguide 10 guiding light received by the distance sensor 40; a temperature sensor 50; a second waveguide 20 guiding light received by the temperature sensor 50; and a plate-shaped fitting member 30 attached to a body case 70 integrally with the first waveguide 10 and the second waveguide 20. A depth of the first waveguide 10 in an axis direction is set smaller than a depth of the second waveguide 20 in an axis direction. In the plate-shaped fitting member 30, the first waveguide 10 and the second waveguide 20 are formed integrally with the plate-shaped fitting member 30 in such a manner that a first hollow portion 13 and a second hollow portion 23 penetrate the plate-shaped fitting member 30, and positions of a front surface 31 and a rear surface 32 of the plate-shaped fitting member 30 are disposed so as to be located closer to a second front end opening 21.SELECTED DRAWING: Figure 4

Description

Technical Field

[0001] The present invention relates to a temperature measuring device.

Background Art

[0002] As a temperature measuring device for non-contact measurement of the temperature of a measurement object, a temperature sensor (including an infrared detection element) for detecting infrared rays radiated from the measurement object is provided, and in order to perform temperature measurement more accurately and with high precision, a distance sensor (including a light emitting element and a light receiving element) is further provided. The distance between the measurement object and the temperature measuring device is measured by the distance sensor, and a configuration is known in which temperature measurement is performed at an appropriate distance within a predetermined range (see, for example, Patent Document 1).

[0003] In addition, a configuration is also known in which a waveguide is introduced into a temperature measuring device, infrared rays incident from the outside are converged by a substantially parabolic inner wall surface, and infrared rays for temperature measurement are guided to a temperature sensor disposed near the base end opening (near the rear opening) of the waveguide (see, for example, Patent Document 2). With such a configuration, infrared rays radiated from the measurement object can be efficiently guided to the temperature sensor.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, in conventional temperature measuring devices, components such as temperature sensors, distance sensors, and waveguides are handled individually, resulting in a complex overall structure and requiring numerous assembly steps during manufacturing. Furthermore, a process of relative alignment between these components was necessary to ensure that the optical axis direction sensed by the temperature sensor matches the optical axis direction sensed by the distance sensor.

[0006] Furthermore, because the combination of the individual components described above is inevitable, variations in the relative positional relationship between the temperature sensor and the distance sensor inevitably remain, no matter how carefully the assembly is carried out. This problem of variations in positional relationship was one of the reasons that hindered improvements in measurement accuracy.

[0007] This invention has been made in view of the above circumstances, and aims to provide a temperature measuring device that can perform highly accurate temperature measurement while having higher assembly efficiency compared to conventional temperature measuring devices. [Means for solving the problem]

[0008] According to one aspect of the present invention, a temperature measuring device is provided that measures the temperature of an object in a non-contact manner using a distance sensor for measuring the distance to the object and a temperature sensor for detecting infrared radiation emitted from the object.

[0009] The temperature measuring device has a substantially cylindrical shape and includes a first front end opening that opens to the outside and a first base end opening on the opposite side of the first front end opening that opens into the interior of the temperature measuring device, and includes a first waveguide whose first inner wall forms a first hollow section formed from the first front end opening to the first base end opening, guiding the light received by the distance sensor. It also includes a second waveguide which has a substantially cylindrical shape and includes a second front end opening that opens to the outside and a second base end opening on the opposite side of the second front end opening that opens into the interior of the temperature measuring device, and includes a second inner wall forming a second hollow section formed from the second front end opening to the second base end opening, guiding the light received by the temperature sensor. It also includes a distance sensor which has a light-emitting element and a light-receiving element, and is positioned opposite the first base end opening in such a positional relationship that the light-emitting surface of the light-emitting element and the light-receiving surface of the light-receiving element face outwards. It also includes a temperature sensor which has an infrared detection element, and is positioned opposite the second base end opening in such a positional relationship that the light-receiving surface of the infrared detection element faces outwards. Furthermore, it includes a plate-shaped mounting member that is roughly plate-shaped and attached to the main body case such that at least a portion of its surface or back surface abuts against the main body case.

[0010] In this case, the axial depth from the first front opening to the first base opening in the first waveguide is set to be smaller than the axial depth from the second front opening to the second base opening in the second waveguide.

[0011] Furthermore, in the plate-shaped mounting member, the first waveguide and the second waveguide are formed integrally with the plate-shaped mounting member such that the first hollow portion of the first waveguide penetrates between the front surface and the back surface, and the second hollow portion of the second waveguide penetrates between the front surface and the back surface, and the plate-shaped mounting member is positioned relative to the second waveguide such that the positions of the front surface and the back surface are closer to the second front end opening than to the second base end opening.

[0012] The temperature measuring device of the present invention offers higher assembly efficiency compared to conventional temperature measuring devices while enabling highly accurate temperature measurement. [Brief explanation of the drawing]

[0013] [Figure 1] This is a perspective view illustrating the appearance of the temperature measuring device 1 according to the embodiment. [Figure 2] This is a perspective view illustrating the sensor introduction unit 100 of the embodiment. [Figure 3] This is a cross-sectional view illustrating the sensor introduction unit 100 of the embodiment. [Figure 4] This is a cross-sectional view showing the sensor introduction unit 100 of the embodiment with the distance sensor 40, temperature sensor 50, main body case 70, etc., mounted on a printed circuit board 75 attached to it. [Figure 5] This is a cross-sectional view illustrating the sensor introduction unit 100 of the embodiment. [Figure 6] This is a cross-sectional view of a modified sensor introduction unit 100'. [Modes for carrying out the invention]

[0014] The temperature measuring device according to the present invention will be described below with reference to the figures. Reference numerals common to all figures will not be explained in other figures, as the explanations already given for these numerals can be applied to the explanations of other figures. In this specification, "external" refers to the external area as viewed from the temperature measuring device 1 (outside the outer surface of the main body case 70), and "internal" refers to the area inside the inner surface of the main body case 70.

[0015] [Embodiment] 1. Configuration of the temperature measuring device 1 according to the embodiment (1) Overview of temperature measuring device 1 The temperature measuring device 1 according to this embodiment is a temperature measuring device that measures the temperature of an object in a non-contact manner by using a distance sensor 40 that measures the distance to the object to be measured and a temperature sensor 50 that detects infrared radiation emitted from the object to be measured.

[0016] FIG. 1 is a perspective view showing the appearance of the temperature measuring device 1 according to the embodiment. FIG. 1(a) is a perspective view showing the front side of the temperature measuring device 1, and FIG. 1(b) is a perspective view showing the back side. Note that the plate-shaped mounting member 30 is hidden by the main body case 70 and is not visible from the outside, so it is shown by a virtual line (two-dot chain line).

[0017] As shown in FIG. 1, the temperature measuring device 1 includes a distance sensor 40, a temperature sensor 50, a first waveguide 10, a second waveguide 20, and a plate-shaped mounting member 30 (for details, refer to FIG. 2 and the like). The first waveguide 10 and the second waveguide 20 are prepared corresponding to the distance sensor 40 and the temperature sensor 50 respectively, and these first waveguide 10 and second waveguide 20 are integrally formed together with the plate-shaped mounting member 30 (also refer to FIG. 4) to which they are attached to the main body case 70 (details will be described later).

[0018] The temperature measuring device 1 shown in FIG. 1 has a human I / F (Interface) surface 81 on which an operation switch 88, a display 89, etc. are mounted, a sensing light input surface 82 on the opposite side of the human I / F surface 81, and a gripping portion 83 by which an operator of the temperature measuring device 1 grips. The temperature measuring device 1 is housed by a main body case 70. The main body case 70 has a notch hole corresponding to the shape of the first front-end opening and the shape of the second front-end opening (described later) so that at least the first front-end opening and the second front-end opening (described later) are opened to the outside on the sensing light input surface 82. However, on the sensing light input surface 82, a part of the first waveguide 10 and the second waveguide 20 (the first inner wall 14 and the second inner wall 24 described later), and a part of the distance sensor 40 and the temperature sensor 50 arranged inside corresponding to them are exposed toward the outside.

[0019] Note that reference numerals AX1 and AX2 indicate the optical axes of the first waveguide 10 and the second waveguide respectively. Also, the configuration of the appearance, component arrangement, etc. of the temperature measuring device 1 shown in FIG. 1 is merely an example, and the present embodiment is not limited to the configuration shown in FIG. 1.

[0020] (2) Sensor introduction unit 100 The "sensor introduction unit 100" consists of a first waveguide 10, a second waveguide 20, and a plate-shaped mounting member 30. Figure 2 is a perspective view illustrating the sensor introduction unit 100 of the embodiment. Figure 2 is an enlarged perspective view of the sensor introduction unit 100 in the area enclosed by the dotted line A (see Figure 1), and the distance sensor 40 and temperature sensor 50 are also shown using dashed lines to facilitate understanding. Figure 3 is a cross-sectional view illustrating the sensor introduction unit 100 of the embodiment. Figure 3 is a cross-sectional view taken when the sensor introduction unit 100 is cut in the direction of arrow C by a virtual plane B (see Figure 2) including optical axes AX1 and AX2.

[0021] (3) Waveguide 10 The first waveguide 10 is a waveguide that guides the light received by the distance sensor 40. The first waveguide 10 has a substantially cylindrical shape. In this specification, "substantially cylindrical shape" is not limited to a strictly cylindrical shape based on a perfect circle, but may also be a slightly distorted shape or have some irregularities on its outer surface, as long as it achieves the effects of this embodiment. The first waveguide 10 has a first front end opening 11 that opens to the outside (opens so as to face the outside) and a first base end opening 12 on the opposite side of the first front end opening 11 that opens into the interior of the temperature measuring device 1. The area near the first base opening 12 becomes a distance sensor placement area 19 where the distance sensor 40 should be placed. The first waveguide 10 guides the light received by the distance sensor 40 through the first inner wall 14 that constitutes the first hollow section 13 formed from the first front opening 11 to the first base opening 12.

[0022] As shown in the example in the figure, the first hollow portion 13 of the first waveguide 10 may be configured as a cylindrical space in which the inner diameter of the first inner wall 14 is substantially the same from the first base end opening 12 to the first front end opening 11.

[0023] Furthermore, it is preferable that the first inner wall 14 of the first waveguide 10 is mirror-finished.

[0024] (4) Second waveguide 20 The second waveguide 20 is a waveguide that guides the light received by the temperature sensor 50. The second waveguide 20 has a roughly cylindrical shape. The second waveguide 20 has a second front end opening 21 that opens to the outside (opens so as to face the outside) and a second base end opening 22 on the opposite side of the second front end opening 21 that opens into the interior of the temperature measuring device 1. The area near the second base opening 22 becomes a temperature sensor placement area 29 where the temperature sensor 50 should be placed. The second waveguide 20 guides the light received by the temperature sensor 50 through the second inner wall 24 that constitutes the second hollow section 23 formed from the second front opening 21 to the second base opening 22.

[0025] As shown in the example in the figure, the second inner wall 24 of the second waveguide 20 may be configured such that its inner diameter increases along the optical axis AX2 from the second base opening 22 to the second front opening 21. Furthermore, the second inner wall 24 of the second waveguide 20 may be configured to be substantially parabolic.

[0026] The axial depth D1 from the first front opening 11 to the first base opening 12 in the first waveguide 10 (depth in the optical axis AX1 direction) is set to be smaller than the axial depth D2 from the second front opening 21 to the second base opening 22 in the second waveguide 20 (depth in the optical axis AX2 direction) (see Figure 3).

[0027] Preferably, the outermost layer of the second inner wall 24 of the second waveguide 20 is a metal plating layer. Furthermore, it is more preferable that the metal plating layer is a gold plating layer.

[0028] (5) Distance sensor 40 and temperature sensor 50 Figure 4 is a cross-sectional view showing the sensor introduction unit 100 of the embodiment with the distance sensor 40, temperature sensor 50, main body case 70, etc., mounted on the printed circuit board 75 attached. Figure 5 is a cross-sectional view illustrating the sensor introduction unit 100 of the embodiment. Figure 5 is a cross-sectional view of the sensor introduction unit 100 near the optical axis AX1 when viewed from the direction of arrow D (see Figures 2 to 4).

[0029] (5-1) The distance sensor 40 is a sensor for measuring the distance between the object to be measured and the temperature measuring device 1. When measuring the temperature of an object, if the distance between the object and the temperature sensor 50 is inappropriate, the temperature may not be measured properly. Therefore, the distance sensor 40 is used to measure the distance while ensuring that the temperature of the object is measured properly.

[0030] As shown in Figures 4 and 5, the distance sensor 40 has a light-emitting element 41 and a light-receiving element 42. The light-emitting element 41 outputs measurement light for distance measurement. The light-receiving element 42 has a light-receiving element that receives reflected light generated when the measurement light is reflected by the object to be measured. The distance sensor 40 measures the distance to the object to be measured by measuring the reflected light input to the light-receiving element 42.

[0031] The distance sensor 40 is positioned opposite the first base opening 12 of the first waveguide 10 by some mounting method, such that the light-emitting surface 41a of the light-emitting element 41 and the light-receiving surface 42a of the light-receiving element 42 face outwards (see also Figure 2). In other words, when the first base opening 12 is considered a window, the light-emitting surface 41a of the light-emitting element 41 and the light-receiving surface 42a of the light-receiving element 42 are positioned near the window, and when the first waveguide 10 is viewed from the outside, the light-emitting surface 41a of the light-emitting element 41 and the light-receiving surface 42a of the light-receiving element 42 are positioned to face outwards from the position of the window.

[0032] In the example shown in the figure, the distance sensor 40 is mounted on a printed circuit board 75, and the printed circuit board 75 is fixed to a plate-shaped mounting member 30, which will be described later, so that the distance sensor 40 is positioned in the distance sensor placement section 19 near the first base end opening 12. The distance sensor 40 may be positioned inside the first hollow section 13 surrounded by the first inner wall 14 (see figure), or it may be positioned slightly outside.

[0033] (5-2) The temperature sensor 50 is a sensor that measures the temperature of an object by detecting infrared radiation emitted from the object using an infrared detection element 51. The temperature sensor 50 has an infrared detection element 51 and is positioned opposite the second base end opening 22 of the second waveguide 20 by some mounting method (for example, by fixing the lead terminals 58 of the temperature sensor 50 to a printed circuit board not shown) such that the light-receiving surface 51a of the infrared detection element 51 faces outward (see also Figure 2). In the example shown in the figure, the temperature sensor 50 is placed in the temperature sensor placement section 29 of the second waveguide 20, where the second inner wall 24 is substantially parabolic, and the light-receiving surface 51a of the infrared detection element 51 of the temperature sensor 50 is positioned near the focal point FC of the parabolic surface.

[0034] (6) Integration of the plate-shaped mounting member 30, the first waveguide 10, and the second waveguide 20 (6-1) The plate-shaped mounting member 30 is a member that is attached to the main body case 70 while structurally connecting the first waveguide 10 and the second waveguide 20. The plate-shaped mounting member 30 is substantially plate-shaped and is attached to the main body case 70 such that at least a part of the surface 31 or back surface 32 is in contact with the main body case 70 (see Figure 4). In the example shown in the figure, the plate-shaped mounting member 30 has fixing screw holes 33, and the plate-shaped mounting member 30 is fixed to the main body case 70 by inserting screws 78 through the fixing screw holes 33 (see Figure 4).

[0035] The thickness of the plate-shaped mounting member 30 (dimension from position P1 on the surface to position P2 on the back surface; see Figure 3) is set to be smaller than the axial depth D2 from the second front end opening 21 to the second base end opening 22 in the second waveguide 20. In the plate-shaped mounting member 30, the first hollow portion 13 of the first waveguide 10 penetrates between the front surface 31 and the back surface 32 of the plate-shaped mounting member 30, and the second hollow portion 23 of the second waveguide 20 also penetrates between the front surface 31 and the back surface 32 of the plate-shaped mounting member 30, so that the first waveguide 10 and the second waveguide 20 are integrally formed with the plate-shaped mounting member 30. In other words, when the sensor introduction unit 100 is viewed from above, the first hollow portion 13 and the second hollow portion 23 penetrate through it, and the first waveguide 10 and the second waveguide 20 are integrated with the plate-shaped mounting member 30 while maintaining spatial communication between the front surface 31 and the back surface 32 of the plate-shaped mounting member 30.

[0036] At this time, the plate-shaped mounting member 30 is positioned relative to the second waveguide 20 such that the position P1 of the surface 31 and the position P2 of the back surface 32 of the plate-shaped mounting member 30 are closer to the second front end opening 21 than to the second base end opening 22. In other words, the second front end opening 21 of the second waveguide 20 is positioned on the outer surface side of the main body case 70 (see Figure 3).

[0037] Furthermore, it is preferable that the first waveguide 10 and the second waveguide 20 are integrated together with the plate-shaped mounting member 30 such that the edge 11a of the first front end opening 11 of the first waveguide 10 and the edge 21a of the second front end opening 21 of the second waveguide 20 are positioned on substantially the same virtual plane VS (see Figure 3). The virtual plane VS is a plane in the figure, but is not limited to this and may be a curved surface.

[0038] (6-2) In the example shown in the figure, the plate-shaped mounting member 30 has a notch 35 in the thickness direction for arranging the printed circuit board 75. By utilizing such a notch 35, as shown in Figures 4 and 5, the printed circuit board 75 on which the distance sensor 40 is mounted is positioned between the position of the first base end opening 12 of the first waveguide 10 and the position P2 (Figure 3) of the back surface 32 of the plate-shaped mounting member 30, improving ease of assembly and saving space.

[0039] (6-3) Any method may be used to integrate the first waveguide 10, the second waveguide 20, and the plate-shaped mounting member 30. For example, the first waveguide 10, the second waveguide 20, and the plate-shaped mounting member 30 may be integrally formed from resin.

[0040] Specifically, the first waveguide 10, the second waveguide 20, and the plate-shaped mounting member 30 may be integrally formed from, for example, so-called ABS resin, and then, if necessary, an undercoat such as chrome plating may be applied, and further, a highly reflective plating such as gold plating may be applied to the outermost layer to form a gold plating layer. For the outermost metal plating, other platings such as silver plating, aluminum, nickel-chromium, or rhodium may be used as long as they have high reflectivity. The plating may be applied only to the first inner wall 14 of the first waveguide 10 and the second inner wall 24 of the second waveguide 20.

[0041] Alternatively, a metal plating layer may be formed on the entire surface of the integrated first waveguide 10, second waveguide 20, and plate-shaped mounting member 30.

[0042] 2. Effects of the temperature measuring device 1 according to the embodiment (1) In the temperature measuring device 1 according to Embodiment 1, the first waveguide 10 and the second waveguide 20 are integrally formed with the plate-shaped mounting member 30 such that the first hollow portion 13 of the first waveguide 10 penetrates between the surface 31 and the back surface 32, and the second hollow portion 23 of the second waveguide 20 penetrates between the surface 31 and the back surface 32.

[0043] Therefore, the first waveguide 10 and the second waveguide 20 can be treated as a single unit via the plate-shaped mounting member 30, dramatically improving the workability when attaching the first waveguide 10 and the second waveguide 20 (and consequently the distance sensor 40 and temperature sensor 50) to the main body case 70.

[0044] Furthermore, regarding optical alignment, since the positional relationship and distance between the first waveguide 10 and the second waveguide 20 are already fixed, only the mounting positions of the distance sensor 40 and temperature sensor 50 need to be managed, thereby improving assembly efficiency. Moreover, assembly accuracy is also improved, which ultimately contributes to the realization of highly accurate temperature measurement.

[0045] Furthermore, the temperature measuring device 1 has the first waveguide 10, the second waveguide 20, and the plate-shaped mounting member 30 integrated into one unit, and the entire unit can have a relatively large heat capacity. Therefore, even if the area around the temperature sensor placement section 29 (near the second base end opening 22), where infrared rays are focused to a considerable extent, generates heat, it is possible to prevent heat from accumulating only around the temperature sensor placement section 29.

[0046] Furthermore, since the first front end opening 11 and the subsequent first inner wall 14, the second front end opening 21 and the subsequent second inner wall 24, and the portion of the plate-shaped mounting member 30 facing the outside are in contact with the outside air, the heat generated by the convergence of infrared rays described above can be dissipated over a relatively large surface area. As a result, even if the area around the temperature sensor placement section 29 (near the second base end opening 22) generates heat, this configuration allows for rapid heat dissipation, bringing the temperature of the temperature sensor 50 and the second waveguide 20 closer to the ambient temperature. Furthermore, if there is a change in ambient temperature, the system can quickly dissipate or absorb heat to quickly match (approach) the ambient temperature. This contributes to achieving highly accurate temperature measurement with minimal error.

[0047] In the temperature measuring device 1 according to Embodiment 1, the axial depth D1 from the first front end opening 11 to the first base end opening 12 in the first waveguide 10 is set to be smaller than the axial depth D2 from the second front end opening 21 to the second base end opening 22 in the second waveguide 20. From another perspective, the axial length of the first inner wall 14 of the first waveguide 10 is set to be relatively small, and the distance sensor is positioned close to the outer surface of the main body case. However, since the first waveguide 10 is a relatively short tube and the length of the first inner wall 14 is also short, the probability of diffuse reflection by the first inner wall 14 can be reduced. Therefore, the probability that the measurement light emitted from the light-emitting element 41 of the distance sensor 40 is diffusely reflected by the inner wall and a portion of it returns to the light-receiving element 42 can be reduced, and as a result, the accuracy of distance measurement can be improved. This can ultimately contribute to the realization of highly accurate temperature measurement.

[0048] Based on the above, the temperature measuring device 1 according to Embodiment 1 can perform highly accurate temperature measurement while having higher assembly efficiency compared to conventional temperature measuring devices.

[0049] (2) In the temperature measuring device 1, the first waveguide 10, the second waveguide 20, and the plate-shaped mounting member 30 are integrally formed from resin, the first inner wall 14 of the first waveguide 10 is mirror-finished, and the outermost layer of the second inner wall 24 of the second waveguide 20 is a metal plating layer.

[0050] By giving the first inner wall 14 of the first waveguide 10 a mirror finish, it is possible to suppress diffuse reflection (scattering of light) when the distance sensor 40 receives and emits light. Furthermore, by making the outermost layer of the second inner wall 24 of the second waveguide 20 a metal plating layer, infrared rays can be efficiently collected near the temperature sensor placement area 29. Since metal, which has a higher thermal conductivity than resin, is placed on the outermost layer, and this outermost layer is in contact with the outside air, it is possible to efficiently dissipate the heat generated near the temperature sensor placement area 29 (near the second base end opening 22) to the outside through this metal plating layer.

[0051] (3) By using a gold plating layer instead of a metal plating layer, it becomes possible to provide high heat dissipation efficiency due to high light reflectivity and high thermal conductivity, as well as a robust temperature measuring device that is resistant to corrosion and erosion by air.

[0052] (4) By forming a metal plating layer on the entire surface of the integrated first waveguide 10, second waveguide 20, and plate-shaped mounting member 30, it becomes possible to perform the mirror-finishing treatment of the first waveguide 10 and the treatment to increase the reflectivity of the second waveguide in a single common plating process without having to perform complex partial plating, thereby further increasing manufacturing efficiency (assembly efficiency).

[0053] (5) By configuring the second inner wall 24 of the second waveguide 20 such that its inner diameter increases from the second base opening 22 towards the second front opening 21 along the optical axis AX2, infrared rays can be efficiently focused near the temperature sensor placement area 29. Furthermore, by configuring the second inner wall 24 of the second waveguide 20 to be substantially parabolic, infrared rays can be focused even more efficiently near the temperature sensor placement area 29.

[0054] (6) In the temperature measuring device 1, the first waveguide 10 and the second waveguide 20 are integrated together with the plate-shaped mounting member 30 such that the edge 11a of the first front end opening 11 of the first waveguide 10 and the edge 21a of the second front end opening 21 of the second waveguide 20 are arranged on substantially the same virtual plane. By configuring it in this way, the edge 11a of the first front opening 11 and the edge 21a of the second front opening 21 are aligned on the same virtual plane, improving ease of assembly and allowing for a smooth external design when the temperature measuring device 1 is assembled.

[0055] Although the present invention has been described above based on the embodiments described above, the present invention is not limited to the embodiments described above. It can be implemented in various forms without departing from the spirit of the invention, and for example, the following modifications are also possible.

[0056] (1) In the description of the embodiment, the substantially cylindrical second waveguide 20 was given as an example in which, in addition to the second hollow portion 23 that constitutes the substantially waveguide, the internal space also surrounds the vicinity of the infrared detection element 51 of the temperature sensor 50, and the vicinity of the infrared detection element 51 is also housed in this internal space (see Figure 4). However, the present invention is not limited thereto. For example, the temperature measuring device may be configured in such a way that the temperature sensor 50 (infrared detection element 51) is positioned outside the second base end opening 22, as shown in Figure 6. Figure 6 is a cross-sectional view of a modified sensor introduction unit 100'. Figure 6 is a cross-sectional view corresponding to Figure 3, but the temperature sensor 50 is also shown to facilitate understanding.

[0057] (2) Figures 2 to 5 depict the distance sensor 40 as a unit component in which the light-emitting element 41 and the light-receiving element 42 are integrated. However, the present invention is not limited to this. The light-emitting element 41 and the light-receiving element 42 may be prepared as separate components.

[0058] (3) As a configuration to give the first inner wall 14 of the first waveguide 10 a mirror finish, for example, this configuration may be achieved by attaching a pipe (not shown) with a plated inner surface to the plate-shaped mounting member 30. Alternatively, for example, the function of giving the first inner wall 14 a mirror finish may be substantially achieved by embedding an optical fiber having an outer diameter corresponding to the inner diameter of the first waveguide 10 in the first hollow section 13 coaxially with the first waveguide 10, and reflecting the measurement light on the inner surface of the optical fiber.

[0059] (4) Although the temperature measuring device 1 shown in Figure 1 was described using a portable temperature measuring device as an example, the present invention is not limited thereto. For example, it can also be applied to fixed, installed temperature measuring devices, etc. [Explanation of symbols]

[0060] 1...Temperature measuring device, 10...First waveguide, 11...First front end opening, 11a...Edge of the first front end opening, 12...First base end opening, 13...First hollow section, 14...First inner wall, 19...Distance sensor placement section, 20...Second waveguide, 21...Second front end opening, 21a...Edge of the second front end opening, 22...Second base end opening, 23...Second hollow section, 24...Second inner wall, 29...Temperature sensor placement section, 30...Plate-shaped mounting member, 31...Surface of plate-shaped mounting member, 32...Back surface of plate-shaped mounting member, 33...Fixing screw hole, 35 ...notch in the thickness direction, 40...distance sensor, 41...light-emitting element, 41a...light-emitting surface, 42...photodetector, 42a...photodetector surface of the photodetector, 50...temperature sensor, 51...infrared detection element, 51a...photodetector surface of the infrared detection element, 58...lead terminals of the temperature sensor, 70...main case, 75...printed circuit board, 78...screw, 81...human interface surface, 82...sensing light input surface, 83...grip part, 88...operation switch, 89...display, 100,100'...sensor introduction unit,

Claims

1. A temperature measuring device that measures the temperature of an object without contact, using a distance sensor to measure the distance to the object and a temperature sensor to detect infrared radiation emitted from the object, A first waveguide having a substantially cylindrical shape, a first front end opening that opens to the outside, and a first base end opening on the opposite side of the first front end opening that opens into the interior of the temperature measuring device, and a first inner wall that constitutes a first hollow portion formed from the first front end opening to the first base end opening guides the light received by the distance sensor, A second waveguide having a substantially cylindrical shape, a second front end opening that opens to the outside, and a second base end opening on the opposite side of the second front end opening that opens into the interior of the temperature measuring device, and a second inner wall that constitutes a second hollow portion formed from the second front end opening to the second base end opening guides the light received by the temperature sensor, The distance sensor has a light-emitting element and a light-receiving element, and is positioned opposite the first base end opening such that the light-emitting surface of the light-emitting element and the light-receiving surface of the light-receiving element face outward, The temperature sensor has an infrared detection element and is positioned opposite the second base end opening such that the light-receiving surface of the infrared detection element faces outward, It comprises a plate-shaped mounting member that is roughly plate-shaped and attached to the main body case such that at least a portion of its surface or back surface abuts against the main body case, The axial depth from the first front end opening to the first base end opening in the first waveguide is set to be smaller than the axial depth from the second front end opening to the second base end opening in the second waveguide. In the plate-shaped mounting member, the first waveguide and the second waveguide are integrally formed with the plate-shaped mounting member such that the first hollow portion of the first waveguide penetrates between the front surface and the back surface, and the second hollow portion of the second waveguide penetrates between the front surface and the back surface, and the plate-shaped mounting member is positioned relative to the second waveguide such that the positions of the front surface and the back surface are closer to the second front end opening than to the second base end opening. A temperature measuring device characterized by the following features.

2. In the temperature measuring device according to claim 1, The first waveguide, the second waveguide, and the plate-shaped mounting portion are integrally formed from resin. The first inner wall of the first waveguide is mirror-finished. The outermost layer of the second inner wall of the second waveguide is a metal plating layer. A temperature measuring device characterized by the following features.

3. The temperature measuring device according to claim 2, characterized in that the metal plating layer is a gold plating layer.

4. The temperature measuring device according to claim 2 or 3, characterized in that a plating layer of the metal is formed on the entire surface of the integrated first waveguide, the second waveguide, and the plate-shaped mounting portion.

5. In the temperature measuring device according to claim 1, A temperature measuring device characterized in that the second inner wall of the second waveguide is configured such that its inner diameter increases along the optical axis from the second base end opening to the second front end opening.

6. In the temperature measuring device according to claim 5, The second inner wall of the second waveguide is substantially parabolic, A temperature measuring device characterized in that the light-receiving surface of the infrared detection element of the temperature sensor is positioned near the focal point of the parabolic surface.

7. In the temperature measuring device according to claim 1, A temperature measuring device characterized in that the first waveguide and the second waveguide are integrated such that the edge of the first front end opening of the first waveguide and the edge of the second front end opening of the second waveguide are positioned on substantially the same virtual plane.

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