Anisotropic conductive film and display device containing the same

Abstract

To provide an anisotropic conductive film capable of preventing screen defects or corrosion of a device.SOLUTION: One embodiment provides an anisotropic conductive film containing a compound represented by chemical formula 1. In chemical formula 1, R is any one of a halogen element, a hydroxy group, a substituted or unsubstituted imine group, a substituted or unsubstituted silyl group, a substituted or unsubstituted C1 to C10 alkoxy group, a substituted or unsubstituted C1 to C10 carbonyl group, a substituted or unsubstituted C2 to C10 alkenyl group, and a substituted or unsubstituted C2 to C10 alkynyl group.SELECTED DRAWING: None

Description

[Technical Field]

[0001] This disclosure relates to anisotropic conductive films and display devices including the same. [Background technology]

[0002] A display device refers to a device that displays video signals. Examples of such display devices include televisions, computer monitors, PDAs, and smart devices, which have seen a recent explosion in demand. It encompasses all devices that display video signals input from an external source.

[0003] The display device may include a display panel and a printed circuit board for driving the display device, and an anisotropic conductive film (ACF) or the like may be used to electrically connect the printed circuit board and the display panel.

[0004] On the other hand, if the display panel becomes contaminated with electrolytes or other substances, the metal components of the panel will corrode in a high-temperature, high-humidity environment, causing screen defects in the display device. Therefore, technology is needed to solve these problems. [Overview of the Initiative] [Problems that the invention aims to solve]

[0005] An object of this disclosure according to one embodiment is to provide a display device capable of preventing corrosion of the display panel or screen defects.

[0006] An object of this disclosure according to one embodiment is to provide an anisotropic conductive film capable of preventing corrosion of devices such as display panels. [Means for solving the problem]

[0007] As one means to achieve the above objective, this embodiment provides an anisotropic conductive film containing a compound represented by the following chemical formula 1. [ka]

[0008] In the above chemical formula 1, R is one of the following: a halogen element, a hydroxyl group, a substituted or unsubstituted imine group, a substituted or unsubstituted silyl group, a substituted or unsubstituted C1-C10 alkoxy group, a substituted or unsubstituted C1-C10 carbonyl group, a substituted or unsubstituted C2-C10 alkenyl group, or a substituted or unsubstituted C2-C10 alkynyl group.

[0009] In one embodiment, R of the compound represented by chemical formula 1 may be represented by any one of the following: a halogen element, a hydroxyl group, a substituted or unsubstituted imine group, a substituted or unsubstituted C2-C10 alkenyl group, a substituted or unsubstituted C2-C10 alkynyl group, or the following chemical formulas R-1 to R-3. [ka]

[0010] Each of the above R1, R2, and R3 is independently one of the following: hydrogen, deuterium, a substituted or unsubstituted C1-C10 alkyl group, a substituted or unsubstituted C2-C10 alkenyl group, a substituted or unsubstituted C2-C10 alkynyl group, a substituted or unsubstituted C6-C10 aryl group, a substituted or unsubstituted C3-C10 heteroaryl group, or a substituted or unsubstituted C3-C10 heterocyclyl group. [ka]

[0011] The aforementioned R4 is one of the following: a substituted or unsubstituted C1-C10 alkyl group, a substituted or unsubstituted C2-C10 alkenyl group, a substituted or unsubstituted C2-C10 alkynyl group, a substituted or unsubstituted C6-C10 aryl group, a substituted or unsubstituted C3-C10 heteroaryl group, or a substituted or unsubstituted C3-C10 heterocyclyl group. [ka]

[0012] R5, R6, R7, and R8 are each independently hydrogen, deuterium, a substituted or unsubstituted C1-C10 alkyl group, a substituted or unsubstituted C2-C10 alkenyl group, a substituted or unsubstituted C2-C10 alkynyl group, a substituted or unsubstituted C6-C10 aryl group, a substituted or unsubstituted C3-C10 heteroaryl group, and a substituted or unsubstituted C3-C10 heterocyclyl group.

[0013] The anisotropic conductive film according to one embodiment may further include a binder resin, a cationic polymerizable resin, and conductive particles.

[0014] The anisotropic conductive film according to one embodiment may include 10-70% by weight of a binder resin, 1-45% by weight of a cationic polymerizable resin, 10-35% by weight of conductive particles, and 0.1-10% by weight of the compound represented by Chemical Formula 1, based on the total solid content weight of the anisotropic conductive film.

[0015] The anisotropic conductive film according to one embodiment may further include an inorganic filler.

[0016] The anisotropic conductive film according to one embodiment may further include a cationic polymerization initiator.

[0017] As another means for achieving the above object, the present embodiment provides a display device including the anisotropic conductive film of the above embodiment.

Effects of the Invention

[0018] The present disclosure provides an anisotropic conductive film containing a compound represented by the following Chemical Formula 1, which can prevent corrosion of a display panel and prevent screen defects of a display device. Specifically, the compound represented by the following Chemical Formula 1 can block the contact between various electrolyte ions that induce corrosion and the display panel by forming chemical bonds such as back bonding between the lone pair of nitrogen atoms in the compound and the metal surface layer of the display panel, or hydrogen bonds between compounds represented by Chemical Formula 1 that are chemically bonded to the metal surface layer of the display panel. Thereby, the compound represented by Chemical Formula 1 can exert an anti-corrosion effect of preventing corrosion of the display panel. [Chemical Formula]

[0019] In Chemical Formula 1, R is any one of a halogen element, a hydroxy group, a substituted or unsubstituted imine group, a substituted or unsubstituted silyl group, a substituted or unsubstituted C1-C10 alkoxy group, a substituted or unsubstituted C1-C10 carbonyl group, and a substituted or unsubstituted C2-C10 unsaturated alkyl group.

[0020] Specifically, in one embodiment, the anisotropic conductive film containing the compound represented by Chemical Formula 1 can be provided, where R of the compound represented by Chemical Formula 1 is any one of a halogen element, a hydroxy group, a substituted or unsubstituted imine group, a substituted or unsubstituted C2-C10 unsaturated alkyl group, and those represented by the following Chemical Formulas R-1 to R-3. The anisotropic conductive film containing the compound represented by Chemical Formula 1 in the specific embodiment can further improve the adhesiveness and mechanical physical properties of the anisotropic conductive film and further improve the corrosion resistance of the display panel by minimizing the reaction between the compound represented by Chemical Formula 1 and the cationic polymerizable resin during the curing reaction. [Chemical Formula]

[0021] Each of the above R1, R2, and R3 is independently one of hydrogen, deuterium, a substituted or unsubstituted C1-C10 alkyl group, or a substituted or unsubstituted C6-C10 aryl group. [ka]

[0022] The aforementioned R4 is a substituted or unsubstituted C1-C10 alkyl group, or a substituted or unsubstituted C6-C10 aryl group. [ka]

[0023] R5, R6, R7, and R8 are each independently of hydrogen, deuterium, a substituted or unsubstituted C1-C10 alkyl group, or a substituted or unsubstituted C6-C10 aryl group.

[0024] The compound represented by chemical formula 1 according to this disclosure is added to an anisotropic conductive film and has the effect of significantly improving the corrosion resistance of the display panel without reducing the tackiness or mechanical properties of the anisotropic conductive film. [Modes for carrying out the invention]

[0025] The advantages and features of this disclosure, and the methods for achieving them, will become clearer by referring to the embodiments described below. However, this disclosure is not limited to the embodiments disclosed below, but can be embodied in a variety of different forms, provided that these embodiments complete the disclosure and allow a person ordinary skill in the art to fully understand the scope of the invention, and this disclosure is defined solely by the scope of the claims.

[0026] Unless otherwise defined, all terms used in this disclosure (including technical and scientific terms) are used in the sense that would be generally understood by a person of ordinary skill in the art to which this disclosure pertains. Throughout the specification, where a part of the specification “includes” a component, this means that, unless otherwise stated, it may include other components rather than excluding them. Also, singular forms include plural forms unless otherwise specified.

[0027] In this disclosure, when a part such as a layer, film, region, or plate is described as being "on top of" or "above" another part, this includes not only cases where it is "directly on top of" another part, but also cases where there are other parts in between them.

[0028] Unless otherwise defined in this disclosure, “substituted” means that a hydrogen atom in a compound is substituted with one or more substituents selected from halogen atoms (F, Br, Cl, or I), hydroxyl groups, alkoxy groups, nitro groups, nitrile groups, cyano groups, azide groups, hydrazino groups, hydrazono groups, carbonyl groups, carbamyl groups, thiol groups, ester groups, carboxyl groups or salts thereof, sulfonic acid groups or salts thereof, phosphoric acid or salts thereof, alkyl groups, C2-C20 alkenyl groups, C2-C20 alkynyl groups, C6-C30 aryl groups, C7-C30 arylalkyl groups, C1-C4 alkoxy groups, C1-C20 heteroalkyl groups, C3-C20 heteroarylalkyl groups, cycloalkyl groups, C3-C15 cycloalkenyl groups, C6-C15 cycloalkynyl groups, heterocycloalkyl groups, and combinations thereof.

[0029] Anisotropic conductive film (ACF) is generally a film-type adhesive in which conductive particles are dispersed in a resin insulating layer. It is a polymer film that exhibits electrical anisotropy and adhesive properties, being conductive in the thickness direction and insulating in the plane direction. Anisotropic conductive films play a variety of roles, such as bonding display panels to printed circuit boards, electrical connection between display panels and printed circuit boards, and maintaining insulation between display panels.

[0030] This disclosure relates to an anisotropic conductive film and a display device including the same, and more particularly to an anisotropic conductive film that can prevent corrosion of a display panel electrically connected to the anisotropic conductive film. Specifically, this embodiment provides an anisotropic conductive film containing a compound represented by the following chemical formula 1, thereby preventing corrosion of the display panel and preventing screen defects of the display device.

[0031] More specifically, the compound represented by chemical formula 1 can block contact between the display panel and various electrolyte ions that induce corrosion by forming chemical bonds, such as lone pairs of electrons on nitrogen atoms in the compound and the metal surface layer of the display panel, or hydrogen bonds between compounds represented by chemical formula 1 that are chemically bonded to the metal surface layer of the display panel. As a result, the compound represented by chemical formula 1 can perform a rust-preventive effect that prevents corrosion of the display panel. [ka]

[0032] In the above chemical formula 1, R is one of the following: a halogen element, a hydroxyl group, a substituted or unsubstituted imine group, a substituted or unsubstituted silyl group, a substituted or unsubstituted C1-C10 alkoxy group, a substituted or unsubstituted C1-C10 carbonyl group, a substituted or unsubstituted C2-C10 alkenyl group, or a substituted or unsubstituted C2-C10 alkynyl group.

[0033] In one embodiment, the halogen element may be any of F, Cl, Br, or I. In a specific embodiment, if R is a halogen element and is Cl, the compound of chemical formula 1 may be 1-(chloromethyl)-1H-benzotriazole.

[0034] In one specific embodiment, when R is a hydroxyl group, the compound of chemical formula 1 may be 1H-benzotriazole-1-methanol.

[0035] In this disclosure, the imine group means a functional group containing a carbon-nitrogen double bond and is not particularly limited, but may have 1 to 30 carbon atoms. The imine group may be substituted with alkyl groups, aryl groups, heterocyclic groups, alkenyl groups, cycloalkyl groups, and combinations thereof. Specific examples of imine groups include, but are not limited to, amidinium groups, guanidinium groups, and cyclic amidine groups.

[0036] In this disclosure, the silyl group may be represented by the following chemical formula R-1. [ka]

[0037] Each of the above R1, R2, and R3 is independently one of the following: hydrogen, deuterium, a substituted or unsubstituted C1-C10 alkyl group, a substituted or unsubstituted C2-C10 alkenyl group, a substituted or unsubstituted C2-C10 alkynyl group, a substituted or unsubstituted C6-C10 aryl group, a substituted or unsubstituted C3-C10 heteroaryl group, or a substituted or unsubstituted C3-C10 heterocyclyl group.

[0038] Specific examples of silyl groups include, but are not limited to, trimethylsilyl, triethylsilyl, tert-butyldimethylsilyl, vinyldimethylsilyl, propyldimethylsilyl, triphenylsilyl, diphenylsilyl, and phenylsilyl groups. In one specific embodiment, when R is a silyl group and specifically a trimethylsilyl group, the compound of chemical formula 1 may be 1-[(trimethylsilyl)methyl]benzotriazole.

[0039] In one specific embodiment, when the chemical formula R has a silyl group with the structure of chemical formula R-1, the adhesion between the printed circuit board and the display panel can be further improved, and corrosion of the display panel can be further suppressed.

[0040] In one embodiment, the alkoxy group may be linear, branched, or cyclic.

[0041] In this disclosure, the alkoxy group may be represented by the following chemical formula R-2. [ka]

[0042] The aforementioned R4 is one of the following: a substituted or unsubstituted C1-C10 alkyl group, a substituted or unsubstituted C2-C10 alkenyl group, a substituted or unsubstituted C2-C10 alkynyl group, a substituted or unsubstituted C6-C10 aryl group, a substituted or unsubstituted C3-C10 heteroaryl group, or a substituted or unsubstituted C3-C10 heterocyclyl group.

[0043] Specific examples of alkoxy groups include, but are not limited to, methoxy, ethoxy, n-propoxy, isopropoxy, i-propyloxy, n-butoxy, isobutoxy, tert-butoxy, sec-butoxy, n-pentyloxy, neopentyloxy, isopentyloxy, n-hexyloxy, 3,3-dimethylbutyloxy, 2-ethylbutyloxy, n-octyloxy, n-nonyloxy, n-decyloxy, benzyloxy, and p-methylbenzyloxy.

[0044] In one specific embodiment, if the alkoxy group is a methoxy group, it may be 1-(methoxymethyl)-1H-benzotriazole.

[0045] In this disclosure, the carbonyl group may be represented by the following chemical formula R-3. [ka]

[0046] R5, R6, R7, and R8 are each independently of hydrogen, deuterium, a substituted or unsubstituted C1-C10 alkyl group, a substituted or unsubstituted C2-C10 alkenyl group, a substituted or unsubstituted C2-C10 alkynyl group, a substituted or unsubstituted C6-C10 aryl group, a substituted or unsubstituted C3-C10 heteroaryl group, and a substituted or unsubstituted C3-C10 heterocyclyl group.

[0047] Specific examples of carbonyl groups include formyl group, acetyl group, propionyl group, propioloyl group, butanoyl group (butyryl group), isobutanoyl group (isobutyryl group), pivaloyl group, pentanoyl group, hexanoyl group, acryloyl group, methacryloyl group, crotonoyl group, heptanoyl group, octanoyl group, nonanoyl group, decanoyl group, benzoyl group, 4-methylbenzoyl group, 3-methylbenzoyl group, and 4-cyanobenzoyl group. Examples include, but are not limited to, formyl or ketone groups such as 3-cyanobenzoyl group, 4-propylbenzoyl group, 2-ethoxybenzoyl group, and 4-t-butylbenzoyl group, as well as alkoxycarbonyl groups such as methoxycarbonyl group, ethoxycarbonyl group, n-propoxycarbonyl group, isopropoxycarbonyl group, n-butoxycarbonyl group, t-butoxycarbonyl group, and amyloxycarbonyl group, and amide groups.

[0048] In one specific embodiment, if the carbonyl group is a benzoyl group, it may be 1-benzoyl-1H-benzotriazole.

[0049] In this disclosure, an alkenyl group means an unsaturated aliphatic hydrocarbon group containing a double bond, and an alkynyl group means an unsaturated aliphatic hydrocarbon group containing a triple bond.

[0050] In one specific embodiment, if the alkynyl group is a propargyl group, it may be 1-propargyl-1H-benzotiazole.

[0051] If compounds commonly used as metal corrosion inhibitors, such as polyoxyalkenyl compounds, silane compounds, or 1-dodecanethiol, are used instead of the compound represented by Chemical Formula 1 of this disclosure, they cannot block the electrolyte ions that induce corrosion of the metal surface layer of the display panel, as the compound represented by Chemical Formula 1 of this disclosure does. Therefore, the technical problem of suppressing corrosion of the display panel that this disclosure aims to solve cannot be resolved. In addition, the curing reaction of the anisotropic conductive film may be inhibited, potentially leading to a decrease in desired tackiness and mechanical properties.

[0052] On the other hand, when benzotriazole itself is added to an anisotropic conductive film, the benzotriazole binds with the cationic polymerizable resin, significantly inhibiting the curing reaction. As a result, there is a possibility that sufficient tackiness and mechanical properties of the anisotropic conductive film cannot be obtained. This may lead to a large number of surface indentations on the elements during the bonding process between the display panel and the printed circuit board, potentially reducing the adhesion between the display panel and the printed circuit board. In contrast, the compound represented by chemical formula 1 according to this disclosure does not react with the cationic polymerizable resin, thus providing sufficient tackiness and mechanical properties of the anisotropic conductive film, as well as the excellent effect of suppressing corrosion of the display panel.

[0053] By including the compound represented by chemical formula 1 of the above embodiment in the anisotropic conductive film, corrosion of the display panel can be suppressed and the objectives of this disclosure can be fully achieved. Therefore, the composition of the anisotropic conductive film is not particularly limited. However, the anisotropic conductive film of one embodiment may further include a binder resin, a cationic polymerizable resin, and conductive particles in addition to the compound represented by chemical formula 1.

[0054] The binder resin of one embodiment may be added to improve the high-temperature rigidity, flowability, adhesion, etc., of the anisotropic conductive film. For example, the binder resin may be, but is not limited to, polyimide resin, polyamide resin, phenoxy resin, polymethacrylate resin, polyacrylate resin, polyurethane resin, polyester resin, polyester urethane resin, polyvinyl butyral resin, styrene-butylene-styrene (SBS) resin, and epoxy modified products, styrene-ethylene-butylene-styrene (SEBS) resin and its modified products, or acrylonitrile butadiene rubber (NBR) and its hydrogenated products, epoxy resins, and copolymers of bisphenol-type epoxy compounds and fluorene compounds, either alone or in combination.

[0055] Non-limiting examples of bisphenol-type epoxy compounds include bisphenol A-type epoxy compounds, bisphenol F-type epoxy compounds, bisphenol AD-type epoxy compounds, bisphenol E-type epoxy compounds, bisphenol S-type epoxy compounds, or combinations thereof. Examples include bisphenol A-type epoxy compounds or bisphenol F-type epoxy compounds.

[0056] Fluorene compounds can be used without limitation as long as they contain a fluorene structure in their molecular structure, and may contain two or more hydroxyl groups for copolymerization with bisphenol-type epoxy compounds.

[0057] Non-limiting examples of epoxy resins include bisphenol-type epoxy compounds such as bisphenol A type epoxy resin, bisphenol A type epoxy acrylate resin, bisphenol F type epoxy resin, bisphenol AD ​​type epoxy resin, bisphenol E type epoxy resin, and bisphenol S type epoxy resin; aromatic epoxy compounds such as polyglycidyl ether epoxy resin, polyglycidyl ester epoxy resin, and naphthalene epoxy resin; alicyclic epoxy compounds; novolac-type epoxy compounds such as cresol novolac type epoxy resin and phenol novolac type epoxy resin; glycidylamine-based epoxy compounds; glycidyl ester-based epoxy compounds; and biphenyl diglycidyl ether epoxy compounds.

[0058] In one embodiment, the glass transition temperature (Tg) of the binder resin may be 80°C or higher, 90°C or higher, and 220°C or lower, or 200°C or lower. Specifically, the glass transition temperature (Tg) of the binder resin may be 80 to 200°C or 90 to 200°C. Within the range of the glass transition temperature (Tg), the flowability of the anisotropic conductive film containing it can be improved, the capture rate of conductive particles can be increased, and the mechanical properties can be further improved.

[0059] In one embodiment, the polymerization average molecular weight (Mw) of the binder resin may be in the range of 30,000 to 100,000, and more specifically, in the range of 50,000 to 100,000. Within this range, the mechanical properties of the anisotropic conductive film containing it can be further improved.

[0060] In one embodiment, the number-average molecular weight (Mn) of the binder resin may be in the range of 10,000 to 20,000, and more specifically, in the range of 10,000 to 18,000. Within this range, the mechanical properties of the anisotropic conductive film containing it can be further improved.

[0061] The cationic polymerizable resin of one embodiment can be added to improve the adhesion of anisotropic conductive films and may contain any monomer, oligomer, or polymer having an epoxy group.

[0062] The monomer having an epoxy group may be, but is not limited to, cycloaliphatic diepoxide, trimethylolpropane oxetane, bisphenol A, or polyfunctional three-membered cyclic ethers such as cycloaliphatic epoxide, or polyfunctional four-membered cyclic ethers such as tetra-functional cycloaliphatic oxetane. The monomer having an epoxy group can be used alone or in combination of two or more.

[0063] The cationic polymerizable resin according to the above embodiment may be provided by polymerization using a cationic polymerization initiator. A cationic polymerization initiator is a cation species that crosslinks the epoxy resin by opening the rings of the epoxy groups at the ends of the epoxy resin. Examples of cationic polymerization initiators include, but are not limited to, aromatic sulfonium salts, aromatic diazonium salts, iodonium salts, phosphonium salts, selenonium salts, or borates. More specifically, the cationic polymerization initiator may be an aromatic sulfonium salt, which exhibits excellent reactivity at low temperatures and can extend the usable time.

[0064] The glass transition temperature (Tg) of the cationic polymerizable resin in one embodiment may be 100°C or higher, 120°C or higher, 130°C or higher, 250°C or lower, or a value between the above. Cationic polymerizable resins having the glass transition temperature (Tg) range described above can have improved curability and / or viscosity, and further improve the ability to capture conductive particles.

[0065] The equivalent weight of the cationic polymerizable resin in one specific embodiment may be 80 or more, 90 or more, 250 or less, 230 or less, or a value between the above values. Cationic polymerizable resins having the above equivalent weight range can have further improved curability and / or viscosity.

[0066] In one embodiment, the conductive particles may be any conductive particles commonly used as conductive particles in anisotropic conductive films. Examples of conductive particles include metal particles, metal-coated particles, and conductive polymer particles.

[0067] In one embodiment, the average particle size of the conductive particles may be 0.5 μm or more, 1 μm or more, 1.5 μm or more, 2 μm or more, 50 μm or less, 30 μm or less, 20 μm or less, 10 μm or less, 5 μm or less, or a value between the above values, taking conductivity into consideration. Specifically, the average particle size of the conductive particles may be 0.5 to 50 μm, 1 to 30 μm, 1.5 to 20 μm, 2 to 10 μm, or 2 to 5 μm, but is not limited to these.

[0068] In one embodiment, considering the mechanical properties of the anisotropic conductive film, such as strength and elasticity, the strength of the conductive particles is 5000 N / mm². 2 More than 6000N / mm 2 More than 7000N / mm 2 More than 10000N / mm 2 The following values, or values ​​between the aforementioned values, may also be used.

[0069] Examples of metal particles include, but are not limited to, metal particles containing one or more of the following: gold, silver, copper, palladium, aluminum, nickel, iron, titanium, manganese, zinc, tungsten, platinum, lead, and tin.

[0070] Examples of metal-coated particles include, but are not limited to, particles in which the surface of resin particles such as acrylic resin and epoxy resin is coated with metal, and particles in which the surface of inorganic particles such as glass and ceramic is coated with metal.

[0071] Examples of conductive polymer particles include, but are not limited to, carbon, polyacetene nanoparticles, and polypyrrole nanoparticles.

[0072] In one embodiment, the anisotropic conductive film may contain 10 to 70% by weight of binder resin, 1 to 45% by weight of cationic polymerizable resin, 10 to 35% by weight of conductive particles, and 0.1 to 10% by weight of a compound represented by chemical formula 1, and within this range, the corrosion resistance of the display panel electrically connected to the anisotropic conductive film can be further improved.

[0073] A specific embodiment of an anisotropic conductive film for further improving curability and / or viscosity may contain a cationic polymerizable resin in an amount of 2-40% by weight, 3-35% by weight, or 5-30% by weight relative to the total solids weight of the anisotropic conductive film.

[0074] A specific embodiment of an anisotropic conductive film for further improving mechanical properties may contain conductive particles in an amount of 10-30% by weight, 15-30% by weight, or 15-25% by weight relative to the total solid content weight of the anisotropic conductive film.

[0075] A specific embodiment of an anisotropic conductive film for further suppressing corrosion of a display panel may contain the compound represented by chemical formula 1 in amounts of 0.2-10% by weight, 0.25-10% by weight, 0.3-10% by weight, 0.5-10% by weight, 0.1-8% by weight, 0.2-8% by weight, 0.25-8% by weight, 0.3-8% by weight, 0.5-8% by weight, 0.1-5% by weight, 0.2-5% by weight, 0.25-5% by weight, or 0.3-5% by weight, relative to the total solid content weight of the anisotropic conductive film.

[0076] The anisotropic conductive film of this disclosure can be manufactured by conventional methods for manufacturing anisotropic conductive films in the art, and there are no limitations on the manufacturing method. As a non-limiting example of a method for manufacturing anisotropic conductive film, a binder resin, a cationic polymerizable resin, an inorganic filler, a compound represented by chemical formula 1, conductive particles, and a cationic polymerizable initiator may be added to a mixer sequentially or simultaneously and stirred. The anisotropic conductive film can then be manufactured by extruding the stirred product through a coater and drying it, followed by winding, drying, and other processing.

[0077] The anisotropic conductive film of this disclosure may further contain, as necessary, cationic polymerization initiators, inorganic fillers, curing agents, plasticizers, ultraviolet stabilizers, antioxidants, colorants, reinforcing agents or fillers, and its composition is not particularly limited. Inorganic fillers can control the fluidity of anisotropic conductive films and adjust the particle capture rate. Non-limiting examples of inorganic fillers include silica, humed silica, talc, titanium dioxide, calcium carbonate, and magnesium oxide.

[0078] For example, the specific surface area of ​​an inorganic filler is 50 m². 2 / g or more, 80m 2 / g or more, 300m 2 / g or less, 250m 2 The value may be less than or equal to / g, or between the aforementioned values, but is not limited to these.

[0079] For example, the average particle size of the inorganic filler may be 1 nm or more, 1.5 nm or more, 2 nm or more, 3 nm or more, 200 nm or less, 150 nm or less, 120 nm or less, or a value between these values, but is not limited to these.

[0080] Preferred embodiments and comparative examples of the present disclosure are described below. However, the following embodiments are merely preferred embodiments of the present disclosure, and the present disclosure is not limited to these embodiments. [Examples]

[0081] Manufacturing of anisotropic conductive films Based on the total solid content weight, 10 to 70% by weight of a binder resin, 1 to 45% by weight of a cationic polymerizable resin, 10 to 35% by weight of conductive particles, and 1% by weight of the compound described in Table 1 were charged into a mixer. Further, as an inorganic filler, fumed silica with a specific surface area of 220 m 2 / g, fumed silica with a specific surface area of 110 m 2 / g, silica with a diameter of 0.1 μm, and a borate initiator as an initiator were charged into the mixer and then stirred.

[0082] The composition of the binder resin was 15 to 20% by weight of a phenoxy-based binder (Mw: 60,000, Mn: 16,000, Tg: 98°C), 50 to 60% by weight of a high molecular weight epoxy resin (Mw: 80,000, Mn: 12,000, Tg: 150°C), and 25 to 40% by weight of a polycondensation binder of bisphenol diglycidyl ether and bisphenol fluorene (Mw: 80,000, Mn: 13,000, Tg: 198°C) based on the total weight of the added binder resin.

[0083] The composition of the cationic polymerizable resin was 5 to 10% by weight of a cyclic aliphatic diepoxide monomer, 20 to 30% by weight of a trimethylolpropane oxetane monomer, 5 to 10% by weight of a bisphenol A monomer, 15 to 25% by weight of a cyclic aliphatic monomer, 10 to 20% by weight of a fast-curing bisphenol A monomer, and 15 to 25% by weight of a tetrafunctional cyclic aliphatic monomer based on the total weight of the added cationic polymerizable resin.

[0084] As the conductive particles, gold-nickel plated polymer balls were used.

[0085] The stirred product was filtered, and the discharged crude liquid was applied onto a film using a bar coater and dried in an oven to produce an anisotropic conductive film.

[0086] The examples and comparative examples were manufactured under identical conditions except for the type of additive compound, and the content of the additive compound, the types and contents of other components were all the same. The types of additive compounds added to the anisotropic conductive films of the examples and comparative examples are as follows:

[0087] -Example 1: 1-[(trimethylsilyl)methyl]benzotriazole -Comparative Example 1: No additives - Comparative Example 2: Polyoxyalkenyl-based (WAcorrG50 from ECHEMI) -Comparative Example 3: Silane-based (WACorrSil CX2 from ECHEMI) -Comparative Example 4: Polyoxyalkenyl (ECHEMI's WSCorr-G50-Zi) -Comparative Example 5: Polyoxyalkenyl (ECHEMI's WSCorr-Cu-0100) - Comparative Example 6: Benzotriazole -Comparative Example 7: 1-Dodecanethiol

[0088] Manufacturing of evaluation samples To evaluate whether the manufactured anisotropic conductive film can suppress the corrosion of the display panel, evaluation samples were prepared under the following conditions. After contaminating the copper substrate display panel portion with 0.9% NaCl salt solution and fingerprints, the contaminated display panel and printed circuit board were bonded with the manufactured anisotropic conductive films of the examples and comparative examples at 130°C and 70 MPa, and cured for 5 seconds to produce evaluation samples.

[0089] The physical properties of each evaluation sample were assessed under the following conditions.

[0090] 1. Corrosion resistance evaluation After placing the evaluation samples in a chamber with high temperature (60°C) and high humidity (90%), the time until corrosion occurred was measured, and the corrosion resistance was evaluated as follows. - Corrosion occurrence time is 300 hours or less: Defective (X) - Corrosion occurrence time: Over 300 hours but 600 hours or less: Normal (△) - Corrosion occurrence time exceeds 600 hours: Excellent (○)

[0091] 2. Evaluation of hardening rate The curing rate was evaluated for the evaluation samples under bonding conditions of 130°C and 70 MPa.

[0092] 3. Surface property evaluation The indentation level was evaluated for each sample under bonding conditions of 130°C and 70 MPa. The condition with the most indentations was rated as 1, and the condition with the fewest indentations was rated as 5.

[0093] 4. Foaming level The foaming level was confirmed for the evaluation samples under bonding conditions of 130°C and 70 MPa. - Mass outbreak: Strong -Weight generation: Medium -Small amount generated: Weak

[0094] The evaluation results for each example and comparative example are summarized in Table 1 below. [Table 1]

[0095] Refer to Table 1 to evaluate each example and comparative example.

[0096] Example 1, which satisfies one embodiment of the present disclosure, showed a significant improvement in the corrosion resistance of the display panel. Despite the addition of the additive compound, the hardening rate did not decrease compared to Comparative Example 1, which did not contain the additive compound, and the surface properties were good, and no bubbles were generated.

[0097] In Comparative Example 1, corrosion of the display panel occurred within a short period of time because the additive compound described herein for improving corrosivity was not added.

[0098] The additive compounds in Comparative Examples 2 to 5 are known as corrosion inhibitors that improve corrosivity, but they could not block the electrolyte ions that induce corrosion of the metal surface layer of the display panel, and therefore the corrosion resistance of the display panel did not improve. In addition, in Comparative Examples 4 and 5, the additive compounds inhibited the curing reaction of the anisotropic conductive film, causing bubbles to form. The curing rate of the anisotropic conductive film was lower than in Example 1, and the mechanical properties deteriorated, resulting in numerous indentations and other defects on the surface.

[0099] In Comparative Example 6, although the corrosion resistance of the display panel improved, the curing reaction was significantly reduced, resulting in a curing rate of 9.4%. This led to the generation of a large number of bubbles, deterioration of mechanical properties, and the most numerous indentations. Furthermore, due to the extremely low curing rate, the adhesion between the display panel and the printed circuit board decreased, and the ability of the anisotropic conductive film to capture conductive particles also decreased.

[0100] In Comparative Example 7, corrosion resistance was slightly improved, but the improvement was less significant compared to Example 1. The curing reaction of the anisotropic conductive film was slightly inhibited, resulting in the generation of a small amount of bubbles and deterioration of mechanical properties.

Claims

1. An anisotropic conductive film comprising a compound represented by the following chemical formula 1, 【Chemistry 1】 In the aforementioned chemical formula 1, R is a trimethylsilyl group, It further comprises a binder resin, a cationic polymerizable resin, and conductive particles. An anisotropic conductive film comprising 10 to 70% by weight of a binder resin, 1 to 45% by weight of a cationic polymerizable resin, 10 to 35% by weight of conductive particles, and 1% by weight of a compound represented by chemical formula 1, based on the total solid content weight of the anisotropic conductive film.

2. The anisotropic conductive film according to claim 1, further comprising an inorganic filler.

3. The anisotropic conductive film according to claim 1, further comprising a cationic polymerization initiator.

4. A display device comprising an anisotropic conductive film according to any one of claims 1 to 3.

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