Laser processing quality monitoring method, monitoring assembly, processing equipment, and storage medium

Abstract

The present invention discloses a laser processing quality monitoring method, a monitoring assembly, a processing facility, and a storage medium. The laser processing quality monitoring method includes: when executing a current laser processing process, sequentially detecting the light intensity of the reflected light for each laser pulse on the product processing surface; comparing the light intensity of the reflected light for each laser pulse with a preset light intensity in sequence to determine whether the light intensity of the reflected light of the corresponding laser pulse meets the standard; counting the number of laser pulses whose standards are met; and determining whether the number of laser pulses whose standards are met is within a preset range. The present invention can determine whether the processing with each laser pulse is qualified by detecting the light intensity of the reflected light for each laser pulse, and further monitor the processing quality of the entire current laser processing process. Furthermore, when executing the monitoring step, there is no need for the involvement of operators, and the real-time processing effect of the laser processing facility by the control system can be automatically monitored, so the purpose of reducing man-hours and improving the automatic production rate is achieved.

Description

Technical Field

[0001] The present invention relates to the technical field of laser processing, and particularly relates to a laser processing quality monitoring method, a monitoring assembly, processing equipment, and a storage medium.

Background Art

[0002] In various laser processing equipment, such as laser markers, during the marking process, due to problems such as software defects or hardware failures of each component, the marked graphics are often missing or the marking effect is not ideal. In severe cases, the marking material may even be discarded, which may cause corresponding losses. Currently, in order to ensure that the products marked by laser markers meet the qualified quality requirements, laser markers need to be monitored by operators during operation, and the qualification rate of each product is manually detected. However, the setting of the manual detection step not only increases the marking cost of the products but also affects the automatic production efficiency of the products.

Summary of the Invention

Problems to be Solved by the Invention

[0003] In view of the above drawbacks of the prior art, the present application provides a laser processing quality monitoring method, a monitoring assembly, processing equipment, and a storage medium that can realize the automated monitoring of laser processing quality and improve the yield rate of laser processing.

Means for Solving the Problems

[0004] This embodiment uses the following technical means.

[0005] A laser processing quality monitoring method applied to a pulsed laser machine includes: sequentially detecting the light intensity of the reflected light for each laser pulse on the product processing surface when executing the current laser processing process; The steps include sequentially comparing the light intensity of the reflected light for each laser pulse with a preset light intensity to determine whether the light intensity of the reflected light for the corresponding laser pulse meets the standard, and A step of counting the number of laser pulses that meet the criteria, A step of determining whether the number of laser pulses that satisfy the criteria is within a predetermined range, The process includes the step of determining that the processing quality of the current laser processing process is acceptable if the number of laser pulses that satisfy the criteria is within a preset range, and otherwise determining that the processing quality of the current laser processing process is unacceptable.

[0006] Furthermore, in the laser processing quality monitoring method, the step of sequentially detecting the light intensity of reflected light for each laser pulse on the product processing surface when executing the current laser processing process is: The process includes sequentially collecting the optical signals reflected by each laser pulse on the product processing surface and converting the optical signals into corresponding voltage signals.

[0007] Furthermore, in the laser processing quality monitoring method, the step of sequentially comparing the light intensity of the reflected light for each laser pulse with a preset light intensity to determine whether the light intensity of the reflected light for the corresponding laser pulse meets the standard is: The process includes the step of sequentially comparing the converted voltage signal value with a preset voltage signal value, and generating a count signal if the converted voltage signal value is greater than the preset voltage signal value.

[0008] Furthermore, in the laser processing quality monitoring method, the step of counting the number of laser pulses that satisfy the criteria is: The process includes a step of statistically determining the number of laser pulses that satisfy a criterion, based on the number of count signals generated.

[0009] Furthermore, in the laser processing quality monitoring method, as a follow-up step to the step of determining that the processing quality in the current laser processing process is unacceptable, the method is: The further step includes stopping the pulse laser machine and generating an alarm signal.

[0010] Furthermore, in the laser processing quality monitoring method, as a continuation step of the step in which the processing quality in the current laser processing process is determined to be acceptable, the method is: It further includes a step that automatically proceeds to the next laser processing step.

[0011] Furthermore, in the laser processing quality monitoring method, as a preliminary step to the step of sequentially detecting the light intensity of reflected light for each laser pulse on the product processing surface when executing the current laser processing process, the method is: The process further includes a step of resetting the number of laser pulses that satisfy the statistically determined criteria for the immediately preceding processing step.

[0012] Laser processing quality monitoring assemblies applied to pulsed laser machines are A detection module that sequentially detects the light intensity of reflected light for each laser pulse on the product processing surface, A comparison module that sequentially compares the light intensity of the reflected light for each laser pulse with a preset light intensity to determine whether the light intensity of the reflected light for the corresponding laser pulse meets the standard, A counting module that counts the number of laser pulses that meet the criteria, The system includes a determination module that determines whether the number of laser pulses that satisfy a criterion is within a preset range, and if the number of laser pulses that satisfy the criterion is within a preset range, determines that the processing quality of the current laser processing process is acceptable, and otherwise determines that the processing quality of the current laser processing process is unacceptable.

[0013] The laser processing equipment includes a memory and a processor, the memory storing a computer program, and the processor, when executing the computer program, realizes the laser processing quality monitoring method described in any one of the above items.

[0014] The computer-readable storage medium stores computer-executable instructions, and the computer-executable instructions are configured to execute the laser processing quality monitoring method according to any one of the above items.

Advantages of the Invention

[0015] Compared with the prior art, the laser processing quality monitoring method, monitoring assembly, processing device, and storage medium according to the present application can determine whether the processing with each laser pulse is qualified by detecting the light intensity of the reflected light for each laser pulse, and further monitor the processing quality of the entire current laser processing process. Furthermore, when executing the monitoring step, there is no need for the operator to participate, and the real-time processing effect of the laser processing equipment by the control system can be automatically monitored, so the purpose of reducing the man-hour and improving the automatic production rate is achieved.

Brief Description of the Drawings

[0016] [Figure 1] It is a flowchart of the laser processing quality monitoring method according to the present application. [Figure 2] It is a block configuration diagram of the laser processing quality monitoring assembly and the pulsed laser machine according to the present application. [Figure 3] It is a block configuration diagram of the laser processing equipment according to the present application.

Modes for Carrying Out the Invention

[0017] To make the object, technical means, and effects of the present application more clear, the present application will be further described in detail with reference to the drawings and examples below. As can be understood, the specific examples described here are only for explaining the present application and do not limit the present application. If not further described, the elements, structures, and features in one embodiment can also be beneficially combined with those in other embodiments.

[0018] This application provides a laser processing quality monitoring method applied to a pulsed laser machine. A pulsed laser machine is a laser device with a single laser pulse width less than 0.25 seconds, operating once at regular time intervals, having a large output power, and being able to accurately control the light emission at each pulse time point. Therefore, it can be used in fine laser processing scenarios such as laser marking, cutting, distance measurement, and rust removal.

[0019] Taking a pulsed laser marker using a pulsed laser machine as an example, it mainly consists of an industrial computer, a galvanometer head, a marking card, and a pulsed laser machine. In order to complete the marking task, each module of the pulsed laser marker must cooperate closely and has strict requirements for technology and working environment. Therefore, during the marking process, due to problems such as software defects or hardware failures of each component, the marked graphics are often missing or the marking effect is not ideal. In severe cases, the marking material may even be discarded, which may cause significant losses.

[0020] The laser processing quality monitoring method according to this application automatically monitors the effect of laser processing and determines whether the current laser processed product meets the qualified quality requirements. As shown in Figure 1, the laser processing quality monitoring method includes When executing the current laser processing process, step S100 of sequentially detecting the light intensity of the reflected light for each laser pulse on the product processing surface; Step S200 of sequentially comparing the light intensity of the reflected light for each laser pulse with a preset light intensity to determine whether the light intensity of the reflected light of the corresponding laser pulse meets the standard; Step S300 of counting the number of laser pulses whose standards are met; Step S400 of determining whether the number of laser pulses whose standards are met is within a preset range; Step S500 includes determining that the processing quality of the current laser processing process is acceptable if the number of laser pulses that satisfy the criteria is within a preset range, and otherwise determining that the processing quality of the current laser processing process is unacceptable.

[0021] When performing the above monitoring steps, the equipment can simultaneously detect the light intensity of the reflected light of the laser pulse on the product processing surface without affecting the normal laser processing process, i.e., while performing the original laser processing steps of the equipment. Furthermore, by pre-setting or calculating a normal light intensity threshold for the reflected light of the laser pulse, i.e., a preset light intensity, and then comparing the light intensity of the reflected light for each laser pulse with the preset light intensity, it is possible to determine whether the current pulse is acceptable or not.

[0022] Furthermore, in the current laser processing process, if the product processing is successful, the pulse laser machine generates a normal number of pulses within a predetermined range, which is either pre-set or calculated. The number of successful pulses obtained is then compared with this predetermined range to determine if the number of successful pulses falls within the predetermined range. If the number of successful pulses does not reach this range, it indicates that the quality of the laser processing is unsatisfactory.

[0023] Therefore, by detecting the light intensity of the reflected light for each laser pulse, this invention can determine whether the processing with each laser pulse is satisfactory, and furthermore, monitor the processing quality of the entire current laser processing process. Moreover, since the monitoring step does not require operator involvement and the control system can automatically monitor the real-time processing effect of the laser processing equipment, the objective of reducing man-hours and improving the automated production rate is achieved.

[0024] In some embodiments, step S100 is, The process includes sequentially collecting the optical signals reflected by each laser pulse on the product processing surface and converting the optical signals into corresponding voltage signals.

[0025] During actual processing, as shown in Figure 2, a detection module 10, such as a photoelectric probe or photoelectric sensor, can be added to the laser processing equipment to detect optical signals. This detection module 10 converts the optical signal of the reflected light of the laser pulse into a corresponding voltage signal, thereby enabling the detection of the optical intensity of the reflected light for each laser pulse.

[0026] In the installation process of the detection module 10, taking the example of attaching a photoelectric probe to a pulsed laser marker, it is first necessary to select a photoelectric probe of the appropriate model. A photoelectric probe detects light intensity by generating an electric current when illuminated with light using a built-in photodiode. However, since different photodiodes have different detection sensitivities to light of different wavelengths, it is necessary to accurately detect the intensity of reflected light by matching a photoelectric probe of the appropriate model to pulsed laser machines of different wavelengths.

[0027] Next, regarding the selection of the mounting position of the photoelectric probe, first, it is necessary to ensure that it does not interfere with normal marking work, and at the same time, that the photoelectric probe can detect the optical pulse waveform when the pulsed laser machine is operating at low power. For example, the photoelectric probe may be fixed to the vibrating mirror square head, or it may be fixed to an appropriate position on the marking workbench by installing a bracket.

[0028] In some embodiments, step S200 is, The process includes a step of sequentially comparing the converted voltage signal value with a preset voltage signal value, and generating a count signal if the converted voltage signal value is greater than the preset voltage signal value.

[0029] The preset voltage signal value is typically the lowest voltage value obtained by a photoelectric probe after detecting and converting the reflected light of a normal laser pulse. During actual processing, as shown in Figure 2, a comparison module 20, such as a comparator or comparison circuit, is installed in the laser processing equipment. The comparison module 20 compares the converted voltage signal value with the preset voltage signal value to determine whether the converted voltage signal value exceeds the preset voltage signal value, and if it does, generates a count signal.

[0030] In some embodiments, step S300 is, The process includes a step of statistically determining the number of laser pulses that satisfy a criterion, based on the number of count signals generated.

[0031] During actual processing, as shown in Figure 2, a count module 30 can be installed in the laser processing equipment. The count module 30 is connected to a comparison module 20 and can receive and count count signals transmitted from the comparison module 20. When the comparison module 20 generates one count signal, it increases the number of laser pulses that satisfy the criterion by one.

[0032] Specifically, the count module 30 may be implemented by combining an FPGA control chip and an A / D conversion circuit. The FPGA control chip may be LatticeXP2, or another FPGA control chip with similar functionality may be selected.

[0033] During counting, the FPGA control chip is connected to the negative terminal of the comparator via an A / D conversion circuit and receives a preset voltage signal value that serves as the reference for comparator comparison. The voltage signal converted by the photoelectric probe is input via the positive terminal of the comparator. If the peak value of the Gaussian waveform of the voltage signal is higher than the set voltage at the negative terminal of the comparator, the output terminal of the comparator outputs a high level to the FPGA control chip. After receiving this high level, the FPGA control chip counts once.

[0034] Of course, the count module 30 may use a DSP chip with model number TMS320VC5509A, or a DSP chip with a similar function but a different model number; an MCU chip with model number stm32f4, or a MCU chip with a similar function but a different model number; or a DAC chip with model number TLV5608, or a DAC chip with a similar function but a different model number, etc., to implement the count statistics function, and this invention is not limited thereto.

[0035] In some embodiments, step S400 may be implemented by a decision module 40, the decision module 40 can directly implement its function using the original industrial computer of the laser processing equipment, namely, reading the number of laser pulses that satisfy the criteria and determining whether the number of laser pulses that satisfy the criteria is within a preset range.

[0036] Specifically, the count module 30 is connected to an industrial computer via a serial port or other means to enable communication. During laser processing, the laser processing software first estimates the normal range of laser pulses for the current laser processing process. After the processing is complete, the laser processing software reads the count statistically measured by the count module 30 and determines whether the count of the count module 30 is within the normal range, thereby determining whether the quality of the laser processing is acceptable.

[0037] In some embodiments, after performing step S500 to determine the processing quality, the method is as follows: The procedure further includes step S600, which involves stopping the pulse laser machine and generating an alarm signal if it is determined that the processing quality is unacceptable.

[0038] If the count statistically determined by the count module 30 is not within the acceptable range, the industrial computer stops the pulse laser machine, halts the marking process, and generates an alarm signal. Subsequently, the field operator is notified by receiving the alarm signal via an alarm lamp or by receiving the alarm signal via a display and displaying it on the operating interface. After the field operator handles the malfunction or resets the laser processing parameters, laser processing is resumed.

[0039] Furthermore, after step S500 is performed, the method is Step S700 further includes automatically proceeding to the next laser processing process once it is determined that the processing quality is acceptable.

[0040] After determining that the processing quality in the current laser processing process is acceptable, the system automatically proceeds to the next laser processing process, initiates the next processing quality monitoring step, enables continuous processing, improves processing efficiency, and ensures processing quality.

[0041] In some embodiments, after step S700 or before step S100, the method is performed. The process further includes step S50, which resets the number of laser pulses that satisfy the criteria statistically determined in the immediately preceding processing process.

[0042] Specifically, the laser processing software in the industrial computer resets the count previously recorded by the count module 30 before each laser processing cycle, preventing the stored count from interfering with the monitoring of the current laser processing quality and improving the accuracy of the monitoring.

[0043] As shown in Figure 2, the present invention relates to a laser processing quality monitoring assembly applied to a pulsed laser machine, A detection module 10 sequentially detects the light intensity of reflected light for each laser pulse on the product processing surface, A comparison module 20 sequentially compares the light intensity of the reflected light for each laser pulse with a preset light intensity to determine whether the light intensity of the reflected light for the corresponding laser pulse meets the standard. A counting module 30 that counts the number of laser pulses that meet the criteria, The laser processing quality monitoring assembly further includes a determination module 40 that determines whether the number of laser pulses that satisfy a criterion is within a preset range, and if the number of laser pulses that satisfy the criterion is within a preset range, determines that the processing quality in the current laser processing process is acceptable, and otherwise determines that the processing quality in the current laser processing process is unacceptable.

[0044] In some embodiments, the detection module 10 may use devices such as photoelectric probes or photoelectric sensors, and the detection module 10 converts the optical signal of the reflected light of the laser pulse into a corresponding voltage signal, thereby enabling detection of the optical intensity of the reflected light for each laser pulse.

[0045] The comparison module 20 may use devices such as a comparator or a comparison circuit. The comparison module 20 compares the converted voltage signal value with a preset voltage signal value, determines whether the converted voltage signal value exceeds the preset voltage signal value, and generates a count signal if it does.

[0046] The count module 30 may be implemented by combining an FPGA control chip and an A / D conversion circuit, or by using another control chip with similar functionality. During counting, the FPGA control chip is connected to the negative terminal of the comparator via the A / D conversion circuit and receives a preset voltage signal value that serves as a reference for comparator comparison. The voltage signal converted by the photoelectric probe is input via the positive terminal of the comparator, and if the peak value of the Gaussian waveform of the voltage signal is higher than the set voltage at the negative terminal of the comparator, the output terminal of the comparator outputs a high level to the FPGA control chip. After receiving the high level, the FPGA control chip counts once.

[0047] The judgment module 40 can implement the relevant functions using the original industrial computer of the laser processing equipment, and the industrial computer is connected to the count module 30 via a serial port or other means for communication. During laser processing, the laser processing software first estimates the normal range of laser pulses for the current laser processing process. After processing is complete, the laser processing software reads the count statistically measured by the count module 30 and determines whether the count of the count module 30 is within the normal range, thereby determining whether the quality of the current laser processing is acceptable.

[0048] In some embodiments, the decision module 40 further stops the pulse laser machine and generates an alarm signal to notify the field worker after determining that the processing quality is unacceptable. Laser processing is then resumed after the field worker has dealt with the malfunction or reset the laser processing parameters.

[0049] Furthermore, after the decision module 40 determines that the processing quality in the current laser processing process is acceptable, it automatically proceeds to the next laser processing process, enabling continuous processing. The decision module 40 also resets the count previously recorded by the count module 30 before each laser processing to ensure that the calculations for the current processing process are accurate.

[0050] The present invention further provides a non-temporary computer-readable storage medium that stores computer-executable instructions configured to perform the laser processing monitoring method in the above embodiment.

[0051] As shown in Figure 3, the present invention further provides a laser processing apparatus that includes at least one central processing unit A1 (processor) (one central processing unit A1 is shown as an example in Figure 3), memory A2 (memory), and may further include a display A3, a laser processing head A4, a pulsed laser machine A5, a laser processing quality monitoring assembly A6, a bus, and a communications interface.

[0052] The central processing unit A1, memory A2, display A3, laser processing head A4, pulse laser machine A5, laser processing quality monitoring assembly A6, and communication interface can communicate with each other via a bus. Display A3 is configured to display a predetermined user operation interface in initial setup mode. Furthermore, display A3 can display a process control window. The communication interface can transmit information. The central processing unit A1 can execute the method in the above embodiment by calling logical instructions in memory A2 and controlling the pulse laser machine A5, laser processing head A4, and laser processing quality monitoring assembly A6.

[0053] The central processing unit A1 may be a central processing unit (CPU), and the central processing unit A1 may be another general-purpose processor, a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA), or another programmable logic device, discrete gate or transistor logic device, discrete hardware component, etc.

[0054] Furthermore, the logical instructions in memory A2 may be implemented in the form of a software function unit and, if sold or used as an independent workpiece, stored on a single computer-readable storage medium.

[0055] Memory A2 may be configured as a computer-readable storage medium to store software programs, computer-executable programs, such as program instructions or modules corresponding to the method in the embodiment of the present application. The central processing unit A1 executes the software programs, instructions or modules stored in memory A2 to perform functional applications and data processing, that is, to realize the method in the embodiment described above.

[0056] Memory A2 may include a program storage area and a data storage area. The program storage area can store an operating system and application programs necessary for at least one function, and the data storage area can store data created in accordance with the use of the terminal device. Memory A2 may also include high-speed random access memory and non-volatile memory.

[0057] All or part of the steps of the above embodiment may be completed by hardware, or by a program that instructs the relevant hardware to be completed, and the program may be stored on a computer-readable storage medium, which may be a non-temporary storage medium including various media capable of storing program code such as a USB flash drive, a portable hard disk, read-only memory (ROM), random access memory (RAM), a magnetic disk, or an optical disk, or it may be a temporary storage medium.

[0058] Furthermore, a person skilled in the art may make equivalent substitutions or modifications based on the technical means and concept of the present application, and all such modifications or substitutions are all included within the scope of protection of the present application.

Claims

1. A laser processing quality monitoring method applied to pulsed laser machines, In the current laser processing process, there is a step of sequentially detecting the light intensity of the reflected light for each laser pulse on the product processing surface, The steps include sequentially comparing the light intensity of the reflected light for each laser pulse with a preset light intensity to determine whether the light intensity of the reflected light for the corresponding laser pulse meets the standard, and A step of counting the number of laser pulses that meet the criteria, The industrial computer equipped with the pulsed laser machine reads the number of laser pulses that satisfy the criteria and determines whether the number of laser pulses that satisfy the criteria is within a preset range. The process includes the step of determining that the processing quality of the current laser processing process is acceptable if the number of laser pulses that satisfy the criteria is within a preset range, and otherwise determining that the processing quality of the current laser processing process is unacceptable. A laser processing quality monitoring method characterized by the following features.

2. When performing the current laser processing process described above, the step of sequentially detecting the light intensity of the reflected light for each laser pulse on the product processing surface is: The process includes sequentially collecting the optical signals reflected by each laser pulse on the product processing surface and converting the optical signals into corresponding voltage signals. The laser processing quality monitoring method according to feature 1.

3. The step of sequentially comparing the light intensity of the reflected light for each laser pulse with a preset light intensity to determine whether the light intensity of the reflected light for the corresponding laser pulse meets the standard is as follows: The process includes the step of sequentially comparing the converted voltage signal value with a preset voltage signal value, and if the converted voltage signal value is greater than the preset voltage signal value, generating a single count signal. The laser processing quality monitoring method according to feature 2.

4. The step of counting the number of laser pulses that satisfy the aforementioned criteria is: The process includes the step of statistically determining the number of laser pulses that satisfy a criterion based on the number of count signals generated, The laser processing quality monitoring method according to feature 3.

5. As a follow-up step to the step in determining that the processing quality in the current laser processing process is unacceptable, The further step includes stopping the pulse laser machine and generating an alarm signal. The laser processing quality monitoring method according to feature 1.

6. As a continuation of the step in determining whether the processing quality in the current laser processing process is acceptable, This further includes a step that automatically moves into the next laser processing process, The laser processing quality monitoring method according to feature 1.

7. In the current laser processing process, as a preliminary step to the step of sequentially detecting the light intensity of the reflected light for each laser pulse on the product processing surface, The step further includes resetting the number of laser pulses that satisfy the criteria statistically determined in the immediately preceding processing process, The laser processing quality monitoring method according to feature 1.

8. A laser processing quality monitoring assembly applied to a pulsed laser machine, A detection module that sequentially detects the light intensity of reflected light for each laser pulse on the product processing surface, A comparison module that sequentially compares the light intensity of the reflected light for each laser pulse with a preset light intensity to determine whether the light intensity of the reflected light for the corresponding laser pulse meets the standard, A counting module that counts the number of laser pulses that meet the criteria, A determination module that reads the number of laser pulses that satisfy a criterion, determines whether the number of laser pulses that satisfy the criterion is within a preset range, determines that the processing quality of the current laser processing process is acceptable if the number of laser pulses that satisfy the criterion is within the preset range, and determines that the processing quality of the current laser processing process is unacceptable otherwise, A laser processing quality monitoring assembly characterized by the following features.

9. A laser processing apparatus including memory and a processor, The memory stores a computer program, and when the processor executes the computer program, it realizes the laser processing quality monitoring method described in any one of claims 1 to 7. A laser processing apparatus characterized by the following features.

10. A computer-readable storage medium, The computer-readable storage medium stores computer-executable instructions, and the computer-executable instructions are configured to perform the laser processing quality monitoring method described in any one of claims 1 to 7.

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