Laser cutting apparatus, laser cutting method, and method for manufacturing a display
The laser cutting apparatus addresses inefficiencies in cutting large substrates by using a fixed stage and movable optical systems with dual-drive mechanisms, enhancing efficiency and reducing equipment size, suitable for cutting large glass and flexible displays.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- JSW AKTINA SYST CO LTD
- Filing Date
- 2021-11-17
- Publication Date
- 2026-07-06
AI Technical Summary
Existing laser cutting devices face inefficiencies in cutting large substrates, particularly for displays, as they struggle to efficiently process larger sizes without increasing equipment size and installation area.
A laser cutting apparatus with a fixed stage for holding the workpiece and movable optical systems guided by a dual-drive mechanism, allowing for precise laser irradiation positioning without moving the stage, combined with a transfer system for efficient loading and unloading of workpieces.
Enables efficient cutting of large substrates like 8th generation glass and flexible displays by reducing equipment footprint and cycle time, while preventing warping and wrinkling, and allowing simultaneous laser irradiation at multiple locations.
Smart Images

Figure 0007884937000001 
Figure 0007884937000002 
Figure 0007884937000003