Laser cutting apparatus, laser cutting method, and method for manufacturing a display

The laser cutting apparatus addresses inefficiencies in cutting large substrates by using a fixed stage and movable optical systems with dual-drive mechanisms, enhancing efficiency and reducing equipment size, suitable for cutting large glass and flexible displays.

JP7884937B2Active Publication Date: 2026-07-06JSW AKTINA SYST CO LTD
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Patent Information

Application Number
JP2021186715
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2021-11-17
Publication Date
2026-07-06
Estimated Expiration
2041-11-17

AI Technical Summary

Technical Problem

Existing laser cutting devices face inefficiencies in cutting large substrates, particularly for displays, as they struggle to efficiently process larger sizes without increasing equipment size and installation area.

Method used

A laser cutting apparatus with a fixed stage for holding the workpiece and movable optical systems guided by a dual-drive mechanism, allowing for precise laser irradiation positioning without moving the stage, combined with a transfer system for efficient loading and unloading of workpieces.

Benefits of technology

Enables efficient cutting of large substrates like 8th generation glass and flexible displays by reducing equipment footprint and cycle time, while preventing warping and wrinkling, and allowing simultaneous laser irradiation at multiple locations.

✦ Generated by Eureka AI based on patent content.

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Patent Text Reader

Abstract

To provide a laser cutting device which performs cutting process efficiently, and to provide a manufacturing method of a display.SOLUTION: A laser cutting device 1 according to an embodiment includes: a stage 20 which suctions and holds a workpiece W; an optical system 30 which guides a laser beam for cutting the workpiece W to the workpiece W; a guide mechanism which movably holds the optical system 30 in a first direction in a top view; a first drive mechanism which moves the optical system along the guide mechanism; and a second drive mechanism which moves the guide mechanism in a second direction different from the first direction in the top view.SELECTED DRAWING: Figure 1
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Citation Information

Patent Citations

  • Fixing device for body to be worked for laser beam machining

    JP1988090386A

  • Plotter device with laser cutter

    JP1991081285U

  • Method for cutting work

    JP1995060467A

  • Laser processing device

    JP2000005891A

  • Laser cutting substrate, liquid crystal display panel and manufacture of the panel

    JP2000167681A