Suction

Abstract

To provide an aerosol generation device which can be reduced in size and cost.SOLUTION: A suction device comprises: a power source BAT; a receptacle RCP which can be electrically coupled to an outside power source; an MCU 1; a charging IC2 having an input terminal VBUS connected to the receptacle RCP, a charging terminal bat connected to the power source BAT, and an output terminal SYS connected to the MCU1, the charging being configured to convert power input to the input terminal VBUS for outputting the power from the charging terminal bat; and a discharge path which connects the power source BAT and a heater HTR without through the charging CI2. The charging IC2 can supply the power input from the power source BAT to the charging terminal bat through the output terminal SYS, to the MCU 1.SELECTED DRAWING: Figure 10

Description

[Technical Field]

[0001] This invention relates to a suction device. [Background technology]

[0002] Patent Document 1 describes an evaporator device having a converter capable of receiving voltage from a USB power source or battery and supplying the received voltage to a heating element. This converter is configured to enable battery charging using voltage from a USB power source.

[0003] Patent Document 2 describes a smoking system comprising a primary device including a primary power supply and a charging device for charging the primary power supply, and a secondary device including a secondary power supply charged by the primary power supply and a load that generates heat due to power supplied from the secondary power supply. In this smoking system, direct power supply from the primary power supply to the load is possible.

[0004] Patent Document 3 describes an electronic cigarette capable of supplying power from a charger to the heating element of a tobacco cartridge. [Prior art documents] [Patent Documents]

[0005] [Patent Document 1] U.S. Patent Publication 2020 / 0120991 [Patent Document 2] International Publication No. 2018 / 167817 [Patent Document 3] Japan Special Publication No. 2015-500647 [Overview of the project] [Problems that the invention aims to solve]

[0006] When a charging IC is installed in an aerosol generator that has a power supply, it is conceivable to use the Power Path function of the charging IC to supply power from an external or internal power supply to loads such as heaters and controllers. However, as the load connected to the output terminal of the charging IC increases, the current output from that output terminal will also increase, requiring the use of a large-scale and high-cost charging IC.

[0007] The objective of the present invention is to provide a suction device that can be miniaturized and cost-effective. [Means for solving the problem]

[0008] An aspirator according to one aspect of the present invention is an aspirator that generates an aerosol by heating a rod containing an aerosol source, and comprises: a heating unit; a power supply; a case having an opening into which the rod can be inserted and housing the heating unit and the power supply; a connector electrically connectable to an external power supply; a first load configured to control heating by the heating unit; a charging IC including a first terminal electrically connected to the connector and into which power supplied from the external power supply is input; a second terminal electrically connected to the power supply; and a third terminal electrically connected to the first load; a first discharge path that supplies power from the power supply to the heating unit without going through the charging IC; and a second discharge path that supplies power from the power supply to the first load via the charging IC. [Effects of the Invention]

[0009] According to the present invention, it is possible to provide a suction device that can be miniaturized and cost-effective. [Brief explanation of the drawing]

[0010] [Figure 1] This is a perspective view of a non-combustion type suction device. [Figure 2] This is a perspective view of a non-combustion type suction device with the rod attached. [Figure 3] Another perspective on non-combustion type suction devices. [Figure 4]This is a disassembled perspective view of a non-combustion type suction device. [Figure 5] This is a perspective view of the internal unit of a non-combustion type suction device. [Figure 6] Figure 5 is an exploded perspective view of the internal unit. [Figure 7] This is a perspective view of the internal unit with the power supply and chassis removed. [Figure 8] This is another perspective view of the internal unit with the power supply and chassis removed. [Figure 9] This is a schematic diagram illustrating the operating modes of a suction device. [Figure 10] This diagram shows the schematic configuration of the electrical circuit of the internal unit. [Figure 11] This diagram shows the schematic configuration of the electrical circuit of the internal unit. [Figure 12] This diagram shows the schematic configuration of the electrical circuit of the internal unit. [Figure 13] This diagram illustrates the operation of the electrical circuit in sleep mode. [Figure 14] This diagram illustrates the operation of an electrical circuit in active mode. [Figure 15] This diagram illustrates the operation of the electrical circuit in the initial heating setting mode. [Figure 16] This diagram illustrates the operation of the electrical circuit during heating in heating mode. [Figure 17] This diagram illustrates the operation of the electrical circuit when detecting the heater temperature in heating mode. [Figure 18] This diagram illustrates the operation of the electrical circuit in charging mode. [Figure 19] This diagram illustrates the operation of the electrical circuitry during an MCU reset (reboot). [Figure 20] This diagram shows the schematic internal configuration of a charging IC. [Modes for carrying out the invention]

[0011] Hereinafter, a suction system, which is one embodiment of the aerosol generating apparatus of the present invention, will be described with reference to the drawings. This suction system comprises a non-combustion type suction device 100 (hereinafter also simply referred to as "suction device 100"), which is one embodiment of the power supply unit of the present invention, and a rod 500 that is heated by the suction device 100. In the following description, the suction device 100 will be described as having a configuration in which the heating unit is not detachably housed. However, the heating unit may be configured to be detachably attached to the suction device 100. For example, the rod 500 and the heating unit may be integrated and configured to be detachably attached to the suction device 100. In other words, the power supply unit of the aerosol generating apparatus may not include a heating unit as a component. Hereinafter, "not detachable" refers to a configuration in which it cannot be removed to the extent of the intended use. Alternatively, an induction heating coil provided in the suction device 100 and a susceptor built into the rod 500 may cooperate to constitute the heating unit.

[0012] Figure 1 is a perspective view showing the overall configuration of the suction device 100. Figure 2 is a perspective view of the suction device 100 with the rod 500 attached. Figure 3 is another perspective view of the suction device 100. Figure 4 is an exploded perspective view of the suction device 100. Furthermore, in the following explanation, for convenience, the three mutually orthogonal directions are referred to as the front-back direction, the left-right direction, and the up-down direction, and the explanation will be based on a three-dimensional orthogonal coordinate system. In the figures, the front is indicated as Fr, the back as Rr, the right side as R, the left side as L, the top as U, and the bottom as D.

[0013] The aspirator 100 is configured to generate an aerosol containing flavor by heating an elongated, roughly cylindrical rod 500 (see Figure 2), which is an example of a flavor component generating substrate having a filling material containing an aerosol source and a flavor source.

[0014] <Flavor component generating base material (rod)> Rod 500 includes a filler containing an aerosol source that is heated to a predetermined temperature to generate an aerosol.

[0015] The type of aerosol source is not particularly limited, and various natural extracts and / or their constituent components can be selected depending on the application. The aerosol source may be a solid, or it may be a liquid such as a polyhydric alcohol such as glycerin or propylene glycol, or water. The aerosol source may contain flavor sources such as tobacco raw materials or extracts derived from tobacco raw materials that release flavor components when heated. The gas to which the flavor components are added is not limited to aerosols; for example, invisible vapor may be generated.

[0016] The filling of Rod 500 may contain shredded tobacco as a flavor source. The material of the shredded tobacco is not particularly limited, and known materials such as lamina or backbone can be used. The filling may contain one or more flavorings. The type of flavoring is not particularly limited, but menthol is preferred from the viewpoint of providing a good smoking taste. The flavor source may contain plants other than tobacco (e.g., mint, herbs, or other herbs). Depending on the application, Rod 500 may not contain a flavoring.

[0017] <Overall configuration of a non-combustion type suction device> Next, the overall configuration of the suction device 100 will be explained with reference to Figures 1 to 4. The suction device 100 includes a case 110 that is roughly rectangular in shape, having a front, rear, left, right, top, and bottom surface. The case 110 includes a bottomed cylindrical case body 112 in which the front, rear, top, bottom, and right surfaces are integrally formed, an outer panel 115 and an inner panel 118 that seal the opening 114 (see Figure 4) of the case body 112 and form the left side, and a slider 119.

[0018] The inner panel 118 is fixed to the case body 112 with bolts 120. The outer panel 115 is fixed to the case body 112 by magnets 124 held in a chassis 150 (see Figure 5), which will be described later and housed in the case body 112, so as to cover the outer surface of the inner panel 118. Because the outer panel 115 is fixed by magnets 124, the user can replace the outer panel 115 to suit their preference.

[0019] The inner panel 118 is provided with two through-holes 126 formed to allow the magnet 124 to pass through. Between the two vertically positioned through-holes 126, the inner panel 118 is further provided with a vertically elongated slot 127 and a circular slot 128. The elongated slot 127 is for transmitting light emitted from eight LEDs (Light Emitting Diodes) L1 to L8 built into the case body 112. The button-type operation switch OPS built into the case body 112 passes through the circular slot 128. This allows the user to detect the light emitted from the eight LEDs L1 to L8 through the LED window 116 of the outer panel 115. The user can also press down the operation switch OPS via the pressing portion 117 of the outer panel 115.

[0020] As shown in Figure 2, the top surface of the case body 112 is provided with an opening 132 into which the rod 500 can be inserted. The slider 119 is connected to the case body 112 so as to be movable in the front-rear direction between a position that closes the opening 132 (see Figure 1) and a position that opens the opening 132 (see Figure 2).

[0021] The operating switch OPS is used to perform various operations on the suction device 100. For example, the user operates the operating switch OPS via the pressing part 117 with the rod 500 inserted into the opening 132 as shown in Figure 2. This causes the heating part 170 (see Figure 5) to heat the rod 500 without combustion. When the rod 500 is heated, an aerosol is generated from the aerosol source contained in the rod 500, and the flavor from the flavor source contained in the rod 500 is added to the aerosol. The user can inhale the flavor-containing aerosol by putting the mouthpiece 502 of the rod 500, which protrudes from the opening 132, in their mouth and inhaling.

[0022] As shown in Figure 3, a charging terminal 134 is provided on the underside of the case body 112 for receiving power by electrically connecting to an external power source such as an electrical outlet or mobile battery. In this embodiment, the charging terminal 134 is a USB (Universal Serial Bus) Type-C shaped receptacle, but is not limited to this. The charging terminal 134 will also be referred to as the receptacle RCP below.

[0023] The charging terminal 134 may, for example, be equipped with a power receiving coil and configured to receive power from an external power source in a contactless manner. In this case, the power transmission method (wireless power transfer) may be electromagnetic induction type, magnetic resonance type, or a combination of electromagnetic induction type and magnetic resonance type. As another example, the charging terminal 134 may be connectable to various USB terminals, etc., and may also have the power receiving coil described above.

[0024] The configuration of the suction device 100 shown in Figures 1 to 4 is merely an example. The suction device 100 can be configured in various ways, such as by holding the rod 500 and applying an action such as heating, which generates a gas to which flavor components are imparted, and the user can then inhale the generated gas.

[0025] <Internal structure of a non-combustion type suction device> The internal unit 140 of the suction device 100 will be explained with reference to Figures 5 to 8. Figure 5 is a perspective view of the internal unit 140 of the suction device 100. Figure 6 is an exploded perspective view of the internal unit 140 of Figure 5. Figure 7 is a perspective view of the internal unit 140 with the power supply battery and chassis 150 removed. Figure 8 is another perspective view of the internal unit 140 with the power supply battery and chassis 150 removed.

[0026] The internal unit 140 housed in the internal space of the case 110 comprises a chassis 150, a power supply battery (BAT), a circuit section 160, a heating section 170, a notification section 180, and various sensors.

[0027] The chassis 150 comprises a plate-shaped chassis body 151 positioned approximately in the center of the internal space of the case 110 in the front-rear direction and extending in the vertical and front-rear directions; a plate-shaped front-rear dividing wall 152 positioned approximately in the center of the internal space of the case 110 in the front-rear direction and extending in the vertical and left-right directions; a plate-shaped upper-lower dividing wall 153 extending forward from approximately the center of the front-rear dividing wall 152 in the vertical direction; a plate-shaped upper chassis wall 154 extending rearward from the upper edges of the front-rear dividing wall 152 and the chassis body 151; and a plate-shaped lower chassis wall 155 extending rearward from the lower edges of the front-rear dividing wall 152 and the chassis body 151. The left side of the chassis body 151 is covered by the inner panel 118 and outer panel 115 of the case 110 described above.

[0028] The internal space of the case 110 is partitioned by the chassis 150, with a heating unit housing area 142 at the front upper part, a substrate housing area 144 at the front lower part, and a power supply housing space 146 extending vertically at the rear.

[0029] The heating section 170 housed in the heating section housing region 142 is composed of a plurality of cylindrical members, which are arranged concentrically to form a cylindrical body as a whole. The heating section 170 has a rod housing section 172 capable of housing a portion of the rod 500 inside, and a heater HTR (see Figures 10 to 19) that heats the rod 500 from its outer circumference or center. It is preferable that the rod housing section 172 is made of an insulating material, or that an insulating material is provided inside the rod housing section 172, so that the surface of the rod housing section 172 and the heater HTR are insulated. The heater HTR can be any element capable of heating the rod 500. The heater HTR is, for example, a heat-generating element. Examples of heat-generating elements include heat-generating resistors, ceramic heaters, and induction heaters. As the heater HTR, for example, one having a PTC (Positive Temperature Coefficient) characteristic in which the resistance value increases with increasing temperature is preferably used. Alternatively, a heater HTR having NTC (Negative Temperature Coefficient) characteristics, in which the resistance decreases with increasing temperature, may be used. The heating unit 170 has the function of defining the airflow path supplied to the rod 500 and the function of heating the rod 500. The case 110 is formed with a vent (not shown) for introducing air, and is configured so that air can flow into the heating unit 170.

[0030] The power supply BAT housed in the power supply housing space 146 is a rechargeable secondary battery, an electric double-layer capacitor, etc., and is preferably a lithium-ion secondary battery. The electrolyte of the power supply BAT may consist of one of a gel electrolyte, an electrolyte solution, a solid electrolyte, an ionic liquid, or a combination thereof.

[0031] The notification unit 180 notifies various information such as the State of Charge (SOC) indicating the charge status of the power supply BAT, the preheating time during suction, and the period during which suction is possible. The notification unit 180 in this embodiment includes eight LEDs L1 to L8 and a vibration motor M. The notification unit 180 may be composed of light-emitting elements such as LEDs L1 to L8, vibration elements such as the vibration motor M, or sound output elements. The notification unit 180 may also be a combination of two or more elements from among the light-emitting elements, vibration elements, and sound output elements.

[0032] The various sensors include an intake sensor that detects the user's puffing action (suction action), a power supply temperature sensor that detects the temperature of the power supply BAT, a heater temperature sensor that detects the temperature of the heater HTR, a case temperature sensor that detects the temperature of the case 110, a cover position sensor that detects the position of the slider 119, and a panel detection sensor that detects the attachment or detachment of the outer panel 115.

[0033] The intake sensor is mainly composed of a thermistor T2 located near the opening 132, for example. The power supply temperature sensor is mainly composed of a thermistor T1 located near the power supply BAT, for example. The heater temperature sensor is mainly composed of a thermistor T3 located near the heater HTR, for example. As described above, it is preferable that the rod housing 172 be insulated from the heater HTR. In this case, it is preferable that thermistor T3 is in contact with or close to the heater HTR inside the rod housing 172. If the heater HTR has PTC characteristics or NTC characteristics, the heater HTR itself may be used as the heater temperature sensor. The case temperature sensor is mainly composed of a thermistor T4 located near the left side of the case 110, for example. The cover position sensor is mainly composed of a Hall IC 14 including a Hall element located near the slider 119. The panel detection sensor is mainly composed of a Hall IC 13 including a Hall element located near the inner surface of the inner panel 118.

[0034] The circuit section 160 comprises four circuit boards, multiple ICs (Integrate Circuits), and multiple elements. The four circuit boards include an MCU-mounted board 161 on which the MCU (Micro Controller Unit) 1 and charging IC 2 described later are mainly arranged; a receptacle-mounted board 162 on which the charging terminals 134 are mainly arranged; an LED-mounted board 163 on which the operation switch OPS, LEDs L1 to L8, and the communication IC 15 described later are arranged; and a Hall IC-mounted board 164 on which the Hall IC 14 described later, including a Hall element that constitutes a cover position sensor, is arranged.

[0035] The MCU-mounted substrate 161 and the receptacle-mounted substrate 162 are arranged parallel to each other in the substrate housing area 144. Specifically, the element placement surfaces of the MCU-mounted substrate 161 and the receptacle-mounted substrate 162 are arranged along the left-right and up-down directions, with the MCU-mounted substrate 161 positioned in front of the receptacle-mounted substrate 162. The MCU-mounted substrate 161 and the receptacle-mounted substrate 162 are each provided with an opening. The MCU-mounted substrate 161 and the receptacle-mounted substrate 162 are fastened to the substrate fixing portion 156 of the front and rear dividing wall 152 with bolts 136, with cylindrical spacers 173 interposed between the peripheral edges of these openings. That is, the spacers 173 fix the positions of the MCU-mounted substrate 161 and the receptacle-mounted substrate 162 inside the case 110 and mechanically connect the MCU-mounted substrate 161 and the receptacle-mounted substrate 162. This prevents the MCU-mounted substrate 161 and the receptacle-mounted substrate 162 from coming into contact and thus prevents the generation of a short-circuit current between them.

[0036] For convenience, if we define the forward-facing surfaces of the MCU-mounted substrate 161 and the receptacle-mounted substrate 162 as the main surfaces 161a and 162a, respectively, and the opposite surfaces of the main surfaces 161a and 162a as the secondary surfaces 161b and 162b, respectively, then the secondary surface 161b of the MCU-mounted substrate 161 and the main surface 162a of the receptacle-mounted substrate 162 face each other with a predetermined gap between them. The main surface 161a of the MCU-mounted substrate 161 faces the front of the case 110, and the secondary surface 162b of the receptacle-mounted substrate 162 faces the front-to-rear dividing wall 152 of the chassis 150. The elements and ICs mounted on the MCU-mounted substrate 161 and the receptacle-mounted substrate 162 will be described later.

[0037] The LED mounting board 163 is positioned on the left side of the chassis body 151, between two magnets 124 positioned vertically. The element placement surface of the LED mounting board 163 is aligned along the vertical and front-to-back directions. In other words, the element placement surfaces of the MCU mounting board 161 and the receptacle mounting board 162 are orthogonal to the element placement surface of the LED mounting board 163. However, it is preferable that the element placement surfaces of the MCU mounting board 161 and the receptacle mounting board 162 are not only orthogonal to the element placement surface of the LED mounting board 163, but also intersect (are not parallel). The vibration motor M, which constitutes the notification unit 180 together with LEDs L1 to L8, is fixed to the lower surface of the chassis lower wall 155 and electrically connected to the MCU mounting board 161.

[0038] The Hall IC mounting board 164 is positioned on the upper surface of the chassis upper wall 154.

[0039] <Suction device operating modes> Figure 9 is a schematic diagram illustrating the operating modes of the suction device 100. As shown in Figure 9, the operating modes of the suction device 100 include charging mode, sleep mode, active mode, heating initial setting mode, heating mode, and heating end mode.

[0040] Sleep mode is a power-saving mode that primarily stops the power supply to electronic components necessary for heating control of the heater (HTR).

[0041] Active mode is a mode in which most functions are enabled except for heating control of the heater HTR. When the suction device 100 is operating in sleep mode, the operating mode is switched to active mode when the slider 119 is opened. When the suction device 100 is operating in active mode, the operating mode is switched to sleep mode when the slider 119 is closed or when the idle time of the operation switch OPS reaches a predetermined time.

[0042] The heating initial setup mode is a mode in which initial settings such as control parameters are performed to start heating control of the heater HTR. When the suction device 100 is operating in active mode and detects operation of the operation switch OPS, it switches the operating mode to the heating initial setup mode, and when the initial setup is completed, it switches the operating mode back to heating mode.

[0043] The heating mode is a mode in which the heater HTR performs heating control (heating control for aerosol generation and heating control for temperature detection). When the operating mode of the aspirator 100 switches to heating mode, it starts heating control of the heater HTR.

[0044] The heating termination mode is a mode in which the heating control termination process of the heater HTR (such as the storage of the heating history) is executed. When the suction device 100 is operating in heating mode, if the power supply time to the heater HTR or the number of suctions by the user reaches the upper limit, or if the slider 119 is closed, the operating mode is switched to the heating termination mode, and when the termination process is completed, the operating mode is switched to the active mode. When the suction device 100 is operating in heating mode and a USB connection is made, the operating mode is switched to the heating termination mode, and when the termination process is completed, the operating mode is switched to the charging mode. As shown in Figure 9, in this case, the operating mode may be switched to the active mode before switching to the charging mode. In other words, when the suction device 100 is operating in heating mode and a USB connection is made, the operating mode may be switched in the order of heating termination mode, active mode, and charging mode.

[0045] The charging mode is a mode in which the power battery (BAT) is charged by power supplied from an external power source connected to the receptacle RCP. When the suction device 100 is operating in sleep mode or active mode, it switches to charging mode when an external power source (USB connection) is connected to the receptacle RCP. When the suction device 100 is operating in charging mode, it switches to sleep mode when the power battery (BAT) has finished charging or when the connection between the receptacle RCP and the external power source is disconnected.

[0046] <Overview of the internal unit's circuitry> Figures 10, 11, and 12 show the schematic configuration of the electrical circuit of the internal unit 140. Figure 11 is the same as Figure 10 except that the area 161A (area enclosed by a thick dashed line) mounted on the MCU mounting board 161 and the area 163A (area enclosed by a thick solid line) mounted on the LED mounting board 163 are added to the electrical circuit shown in Figure 10. Figure 12 is the same as Figure 10 except that the area 162A mounted on the receptacle mounting board 162 and the area 164A mounted on the Hall IC mounting board 164 are added to the electrical circuit shown in Figure 10.

[0047] In Figure 10, the wiring shown by a thick solid line is wiring that is at the same potential as the reference potential (ground potential) of the internal unit 140 (wiring connected to the ground provided in the internal unit 140), and this wiring will be referred to as the ground line below. In Figure 10, an electronic component with multiple circuit elements integrated into a chip is shown as a rectangle, and the symbols of the various terminals are written inside this rectangle. The power supply terminals VCC and VDD mounted on the chip indicate the high-potential side power supply terminals, respectively. The power supply terminals VSS and GND mounted on the chip indicate the low-potential side (reference potential side) power supply terminals, respectively. For an integrated electronic component, the difference between the potential of the high-potential side power supply terminal and the potential of the low-potential side power supply terminal becomes the power supply voltage. The integrated electronic component uses this power supply voltage to perform various functions.

[0048] As shown in Figure 11, the MCU-mounted board 161 (range 161A) contains, as its main electronic components, an MCU 1 that provides overall control of the aspirator 100, a charging IC 2 that controls the charging of the power supply BAT, load switches (hereinafter referred to as LSWs) 3, 4, and 5 which are composed of a combination of capacitors, resistors, and transistors, and a ROM (Read Only The circuit includes Memory 6, a switch driver 7, a buck-boost DC / DC converter 8 (labeled as buck-boost DC / DC8 in the diagram), operational amplifier OP2, operational amplifier OP3, flip-flops (FF) 16 and 17, a connector Cn(t2) electrically connected to thermistor T2 which constitutes the intake sensor (in the diagram, thermistor T2 connected to this connector is shown), a connector Cn(t3) electrically connected to thermistor T3 which constitutes the heater temperature sensor (in the diagram, thermistor T3 connected to this connector is shown), a connector Cn(t4) electrically connected to thermistor T4 which constitutes the case temperature sensor (in the diagram, thermistor T4 connected to this connector is shown), and a voltage divider circuit Pc for USB connection detection.

[0049] The ground terminals GND of the charging IC2, LSW3, LSW4, LSW5, switch driver 7, step-up / step-down DC / DC converter 8, FF16, and FF17 are connected to the ground line. The power supply terminal VSS of ROM6 is connected to the ground line. The negative power supply terminals of op-amps OP2 and OP3 are connected to the ground line.

[0050] As shown in Figure 11, the LED mounting board 163 (range 163A) is equipped with the following main electronic components: a Hall IC 13 containing a Hall element that constitutes a panel detection sensor, LEDs L1 to L8, an operation switch OPS, and a communication IC 15. The communication IC 15 is a communication module for communicating with electronic devices such as smartphones. The power terminal VSS of the Hall IC 13 and the ground terminal GND of the communication IC 15 are both connected to the ground line. The communication IC 15 and the MCU 1 are configured to communicate via a communication line LN. One end of the operation switch OPS is connected to the ground line, and the other end of the operation switch OPS is connected to terminal P4 of the MCU 1.

[0051] As shown in Figure 12, the receptacle-mounted substrate 162 (range 162A) is provided with the following main electronic components: a power connector electrically connected to the power supply BAT (in the figure, the power supply BAT connected to this power connector is shown); a connector electrically connected to the thermistor T1 that constitutes the power supply temperature sensor (in the figure, the thermistor T1 connected to this connector is shown); a boost DC / DC converter 9 (in the figure, boost DC / DC 9); a protection IC 10; an overvoltage protection IC 11; a battery level indicator IC 12; a receptacle RCP; switches S3 to S6 composed of MOSFETs; an operational amplifier OP1; and a pair of heater connectors Cn (positive and negative sides) electrically connected to the heater HTR.

[0052] The two ground terminals GND of the receptacle RCP, the ground terminal GND of the boost DC / DC converter 9, the power supply terminal VSS of the protection IC 10, the power supply terminal VSS of the remaining charge indicator IC 12, the ground terminal GND of the overvoltage protection IC 11, and the negative power supply terminal of the operational amplifier OP1 are all connected to the ground line.

[0053] As shown in Figure 12, the Hall IC mounting board 164 (range 164A) is provided with a Hall IC 14, which includes a Hall element that constitutes a cover position sensor. The power terminal VSS of the Hall IC 14 is connected to the ground line. The output terminal OUT of the Hall IC 14 is connected to terminal P8 of the MCU 1. The MCU 1 detects the opening and closing of the slider 119 based on the signal input to terminal P8.

[0054] As shown in Figure 11, the connector electrically connected to the vibration motor M is provided on the MCU-mounted board 161.

[0055] <Details of the internal unit's circuitry> The following will explain the connections between each electronic component, referring to Figure 10.

[0056] The two power input terminals V of the receptacle RCP BUS Each of these is connected to the input terminal IN of the overvoltage protection IC11 via fuse Fs. When a USB plug is connected to the receptacle RCP and the USB cable containing this USB plug is connected to an external power supply, the two power input terminals V of the receptacle RCP BUS USB voltage V USB It will be supplied.

[0057] One end of a voltage divider circuit Pa, consisting of two resistors in series, is connected to the input terminal IN of the overvoltage protection IC11. The other end of the voltage divider circuit Pa is connected to the ground line. The connection point of the two resistors constituting the voltage divider circuit Pa is connected to the voltage detection terminal OVLo of the overvoltage protection IC11. When the voltage input to the voltage detection terminal OVLo is below the threshold, the overvoltage protection IC11 outputs the voltage input to the input terminal IN from the output terminal OUT. When the voltage input to the voltage detection terminal OVLo exceeds the threshold (overvoltage), the overvoltage protection IC11 stops the voltage output from the output terminal OUT (disconnecting the electrical connection between LSW3 and receptacle RCP), thereby protecting electronic components downstream of the overvoltage protection IC11. The output terminal OUT of the overvoltage protection IC11 is connected to the input terminal VIN of LSW3 and one end of the voltage divider circuit Pc (a series circuit of two resistors) connected to MCU1. The other end of the voltage divider circuit Pc is connected to the ground line. The connection point of the two resistors that make up the voltage divider circuit Pc is connected to terminal P17 of MCU1.

[0058] One end of a voltage divider circuit Pf, consisting of two resistors in series, is connected to the input terminal VIN of the LSW3. The other end of the voltage divider circuit Pf is connected to the ground line. The connection point of the two resistors constituting the voltage divider circuit Pf is connected to the control terminal ON of the LSW3. The collector terminal of bipolar transistor S2 is connected to the control terminal ON of the LSW3. The emitter terminal of bipolar transistor S2 is connected to the ground line. The base terminal of bipolar transistor S2 is connected to terminal P19 of the MCU1. When the signal input to the control terminal ON of the LSW3 becomes high level, the voltage input to the input terminal VIN is output from the output terminal VOUT of the LSW3. The output terminal VOUT of the LSW3 is connected to the input terminal VBUS of the charging IC2. The MCU1 turns on bipolar transistor S2 when the USB connection is not made. As a result, the control terminal ON of the LSW3 is connected to the ground line via bipolar transistor S2, and a low level signal is input to the control terminal ON of the LSW3. The bipolar transistor S2 connected to LSW3 is turned off by MCU1 when a USB connection is established. When bipolar transistor S2 is turned off, the USB voltage V divided by the voltage divider circuit Pf is turned off. USB This is input to the ON control terminal of LSW3. Therefore, when a USB connection is made and the bipolar transistor S2 is turned off, a high-level signal is input to the ON control terminal of LSW3. As a result, LSW3 receives the USB voltage V supplied from the USB cable. USB This signal is output from the VOUT output terminal. Note that even if a USB connection is made while the bipolar transistor S2 is not turned off, the LSW3 control terminal ON is connected to the ground line via the bipolar transistor S2. Therefore, please note that a low-level signal will continue to be input to the LSW3 control terminal ON unless the MCU1 turns off the bipolar transistor S2.

[0059] The positive terminal of power supply BAT is connected to the power supply terminal VDD of protection IC 10, the input terminal VIN of boost DC / DC converter 9, and the charging terminal bat of charging IC 2. Therefore, the power supply voltage V of power supply BAT is BAT The current is supplied to the protection IC 10, the charging IC 2, and the boost DC / DC converter 9. The negative terminal of the power supply BAT is connected in series in the following order: resistor Ra, switch Sa (composed of MOSFETs), switch Sb (composed of MOSFETs), and resistor Rb. The connection point between resistor Ra and switch Sa is connected to the current sensing terminal CS of the protection IC 10. The control terminals of switches Sa and Sb are connected to the protection IC 10. Both ends of resistor Rb are connected to the battery level indicator IC 12.

[0060] The protection IC 10 obtains the current value flowing through resistor Ra during charging and discharging of the power supply battery from the voltage input to the current sensing terminal CS. If this current value becomes excessive (overcurrent), it controls the opening and closing of switches Sa and Sb to stop charging or discharging the power supply battery, thereby protecting the power supply battery. More specifically, if the protection IC 10 obtains an excessive current value during charging of the power supply battery, it stops charging the power supply battery by turning off switch Sb. If the protection IC 10 obtains an excessive current value during discharging of the power supply battery, it stops discharging the power supply battery by turning off switch Sa. Furthermore, if the voltage value of the power supply battery becomes abnormal (overcharge or overvoltage) from the voltage input to the power supply terminal VDD, the protection IC 10 controls the opening and closing of switches Sa and Sb to stop charging or discharging the power supply battery, thereby protecting the power supply battery. More specifically, if the protection IC10 detects overcharging of the power battery, it stops charging the power battery by turning off switch Sb. If the protection IC10 detects over-discharging of the power battery, it stops discharging the power battery by turning off switch Sa.

[0061] A resistor Rt1 is connected to a connector that is connected to thermistor T1, which is located near the power supply BAT. The series circuit of resistor Rt1 and thermistor T1 is connected to the ground line and to the regulator terminal TREG of the fuel gauge IC12. The connection point of thermistor T1 and resistor Rt1 is connected to the thermistor terminal THM of the fuel gauge IC12. Thermistor T1 may be a PTC (Positive Temperature Coefficient) thermistor whose resistance increases with increasing temperature, or an NTC (Negative Temperature Coefficient) thermistor whose resistance decreases with increasing temperature.

[0062] The battery level indicator IC12 detects the current flowing through resistor Rb and, based on the detected current value, derives battery information such as the remaining capacity of the power supply BAT, the State of Charge (SOC) indicating the charge status, and the State of Health (SOH) indicating the healthy state. The battery level indicator IC12 supplies voltage from the built-in regulator connected to the regulator terminal TREG to the voltage divider circuit of thermistor T1 and resistor Rt1. The battery level indicator IC12 obtains the voltage divided by this voltage divider circuit from the thermistor terminal THM and, based on this voltage, obtains temperature information related to the temperature of the power supply BAT. The battery level indicator IC12 is connected to MCU1 by a communication line LN for serial communication and is configured to communicate with MCU1. The battery level indicator IC12 transmits the derived battery information and the acquired power supply BAT temperature information to MCU1 upon request from MCU1. Note that multiple signal lines, such as a data line for data transmission and a clock line for synchronization, are required for serial communication. Please note that in Figures 10-19, only one signal line is shown for simplification.

[0063] The battery level indicator IC12 is equipped with a notification terminal 12a. The notification terminal 12a is connected to terminal P6 of the MCU1 and the cathode of diode D2, which will be described later. When the battery level indicator IC12 detects an abnormality, such as an excessive temperature of the power supply battery, it notifies the MCU1 of the abnormality by outputting a low-level signal from the notification terminal 12a. This low-level signal is also input to the CLR(￣) terminal of FF17 via diode D2.

[0064] One end of reactor Lc is connected to the switching terminal SW of the boost DC / DC converter 9. The other end of reactor Lc is connected to the input terminal VIN of the boost DC / DC converter 9. The boost DC / DC converter 9 boosts the input voltage by controlling the on / off state of the built-in transistor connected to the switching terminal SW, and outputs it from the output terminal VOUT. The input terminal VIN of the boost DC / DC converter 9 constitutes the high-potential power supply terminal of the boost DC / DC converter 9. The boost DC / DC converter 9 performs boost operation when the signal input to the enable terminal EN is at a high level. When connected via USB, the signal input to the enable terminal EN of the boost DC / DC converter 9 may be controlled to a low level by the MCU1. Alternatively, when connected via USB, the MCU1 may not control the signal input to the enable terminal EN of the boost DC / DC converter 9, thereby making the potential of the enable terminal EN undefined.

[0065] The source terminal of switch S4, which is composed of a P-channel MOSFET, is connected to the output terminal VOUT of the boost DC / DC converter 9. The gate terminal of switch S4 is connected to terminal P15 of MCU1. One end of resistor Rs is connected to the drain terminal of switch S4. The other end of resistor Rs is connected to the positive side heater connector Cn, which is connected to one end of heater HTR. A voltage divider circuit Pb, consisting of two resistors, is connected to the connection point between switch S4 and resistor Rs. The connection point of the two resistors constituting the voltage divider circuit Pb is connected to terminal P18 of MCU1. The connection point between switch S4 and resistor Rs is further connected to the positive power supply terminal of operational amplifier OP1.

[0066] The source terminal of switch S3, which is composed of a P-channel MOSFET, is connected to the connection line between the output terminal VOUT of the boost DC / DC converter 9 and the source terminal of switch S4. The gate terminal of switch S3 is connected to terminal P16 of MCU1. The drain terminal of switch S3 is connected to the connection line between resistor Rs and the positive side heater connector Cn. In this way, a circuit including switch S3 and a circuit including switch S4 and resistor Rs are connected in parallel between the output terminal VOUT of the boost DC / DC converter 9 and the positive side of heater connector Cn. The circuit including switch S3 has no resistors and therefore has lower resistance than the circuit including switch S4 and resistor Rs.

[0067] The non-inverting input terminal of op-amp OP1 is connected to the connection line between resistor Rs and the positive side heater connector Cn. The inverting input terminal of op-amp OP1 is connected to the negative side heater connector Cn, which is connected to the other end of heater HTR, and to the drain terminal of switch S6, which is composed of an N-channel MOSFET. The source terminal of switch S6 is connected to the ground line. The gate terminal of switch S6 is connected to terminal P14 of MCU1, the anode of diode D4, and the enable terminal EN of boost DC / DC converter 9. The cathode of diode D4 is connected to terminal Q of FF17. One end of resistor R4 is connected to the output terminal of op-amp OP1. The other end of resistor R4 is connected to terminal P9 of MCU1 and to the drain terminal of switch S5, which is composed of an N-channel MOSFET. The source terminal of switch S5 is connected to the ground line. The gate terminal of switch S5 is connected to the connection line between resistor Rs and the positive side heater connector Cn.

[0068] The input terminal VBUS of the charging IC2 is connected to the anode of each of the LEDs L1 to L8. The cathode of each of the LEDs L1 to L8 is connected to the control terminals PD1 to PD8 of the MCU1 via resistors for current limiting. That is, the LEDs L1 to L8 are connected in parallel to the input terminal VBUS. The LEDs L1 to L8 are operated by the USB voltage V USB supplied from the USB cable connected to the receptacle RCP and the voltage supplied from the power supply BAT via the charging IC2, respectively. The MCU1 incorporates transistors (switching elements) connected to each of the control terminals PD1 to PD8 and the ground terminal GND. The MCU1 energizes the LED L1 by turning on the transistor connected to the control terminal PD1 to light it, and turns off the LED L1 by turning off the transistor connected to the control terminal PD1. By rapidly switching between on and off of the transistor connected to the control terminal PD1, the brightness and emission pattern of the LED L1 can be dynamically controlled. The LEDs L2 to L8 are similarly controlled for lighting by the MCU1.

[0069] The charging IC2 has a charging function for charging the power supply BAT based on the USB voltage V USB input to the input terminal VBUS. The charging IC2 obtains the charging current and charging voltage of the power supply BAT from terminals and wirings not shown, and based on these, performs charging control of the power supply BAT (power supply control from the charging terminal bat to the power supply BAT). Further, the charging IC2 may obtain the temperature information of the power supply BAT transmitted from the remaining amount meter IC12 to the MCU1 by serial communication using the communication line LN and use it for charging control.

[0070] The charging IC2 further has a BAT power pass function and an OTG function. The BAT power pass function is a function of outputting a system power supply voltage Vcc0 that substantially matches the power supply voltage V BAT input to the charging terminal bat from the output terminal SYS. The OTG function is a function of using the power supply voltage V BATThis function outputs the system power supply voltage Vcc4, obtained by boosting the voltage, from the input terminal VBUS. The on / off switching of the charging IC2's OTG function is controlled by the MCU1 via serial communication using the communication line LN. In the OTG function, the power supply voltage V is input to the charging terminal bat. BAT This can also be output directly from the input terminal VBUS. In this case, the power supply voltage V BAT The system power supply voltage Vcc4 is approximately equal to this.

[0071] The output terminal SYS of the charging IC2 is connected to the input terminal VIN of the buck-boost DC / DC converter 8. One end of the reactor La is connected to the switching terminal SW of the charging IC2. The other end of the reactor La is connected to the output terminal SYS of the charging IC2. The charge enable terminal CE(￣) of the charging IC2 is connected to terminal P22 of the MCU1 via a resistor. Furthermore, the collector terminal of the bipolar transistor S1 is connected to the charge enable terminal CE(￣) of the charging IC2. The emitter terminal of the bipolar transistor S1 is connected to the output terminal VOUT of the LSW4, which will be described later. The base terminal of the bipolar transistor S1 is connected to the Q terminal of the FF17. Furthermore, one end of the resistor Rc is connected to the charge enable terminal CE(￣) of the charging IC2. The other end of the resistor Rc is connected to the output terminal VOUT of the LSW4.

[0072] Resistors are connected to the input terminal VIN and enable terminal EN of the buck-boost DC / DC converter 8. When the system power supply voltage Vcc0 is input from the output terminal SYS of the charging IC2 to the input terminal VIN of the buck-boost DC / DC converter 8, the signal input to the enable terminal EN of the buck-boost DC / DC converter 8 becomes high level, and the buck-boost DC / DC converter 8 starts boosting or bucking operation. The buck-boost DC / DC converter 8 generates the system power supply voltage Vcc1 by boosting or bucking the system power supply voltage Vcc0 input to the input terminal VIN through switching control of the built-in transistor connected to the reactor Lb, and outputs it from the output terminal VOUT. The output terminal VOUT of the buck-boost DC / DC converter 8 is connected to the feedback terminal FB of the buck-boost DC / DC converter 8, the input terminal VIN of the LSW4, the input terminal VIN of the switch driver 7, and the power supply terminals VCC and D of the FF16. The wiring that supplies the system power supply voltage Vcc1 output from the output terminal VOUT of the buck-boost DC / DC converter 8 is referred to as the power line PL1.

[0073] When the signal input to the control terminal ON of LSW4 becomes high level, it outputs the system power supply voltage Vcc1, which is input to the input terminal VIN, from the output terminal VOUT. The control terminal ON of LSW4 and the power line PL1 are connected via a resistor. Therefore, when the system power supply voltage Vcc1 is supplied to the power line PL1, a high-level signal is input to the control terminal ON of LSW4. The voltage output by LSW4 is the same as the system power supply voltage Vcc1 if wiring resistance etc. is ignored, but in order to distinguish it from the system power supply voltage Vcc1, the voltage output from the output terminal VOUT of LSW4 will be referred to as the system power supply voltage Vcc2 below.

[0074] The output terminal VOUT of LSW4 is connected to the power terminal VDD of MCU1, the input terminal VIN of LSW5, the power terminal VDD of the remaining charge indicator IC12, the power terminal VCC of ROM6, the emitter terminal of bipolar transistor S1, resistor Rc, and the power terminal VCC of FF17. The wiring that supplies the system power supply voltage Vcc2 output from the output terminal VOUT of LSW4 is referred to as power line PL2.

[0075] When the signal input to the control terminal ON of LSW5 becomes high level, it outputs the system power supply voltage Vcc2, which is input to the input terminal VIN, from the output terminal VOUT. The control terminal ON of LSW5 is connected to terminal P23 of MCU1. The voltage output by LSW5 is the same as the system power supply voltage Vcc2 if wiring resistance etc. is ignored, but in order to distinguish it from the system power supply voltage Vcc2, the voltage output from the output terminal VOUT of LSW5 will be referred to as the system power supply voltage Vcc3 below. The wiring to which the system power supply voltage Vcc3 output from the output terminal VOUT of LSW5 is supplied will be referred to as the power line PL3.

[0076] A series circuit of thermistor T2 and resistor Rt2 is connected to power line PL3, with resistor Rt2 connected to the ground line. Thermistor T2 and resistor Rt2 form a voltage divider circuit, and their connection point is connected to terminal P21 of MCU1. Based on the voltage input to terminal P21, MCU1 detects the temperature fluctuation (resistance fluctuation) of thermistor T2 and determines whether or not puffing has occurred based on the amount of the temperature fluctuation.

[0077] A series circuit of thermistor T3 and resistor Rt3 is connected to power line PL3, with resistor Rt3 connected to the ground line. Thermistor T3 and resistor Rt3 form a voltage divider circuit, and their connection point is connected to terminal P13 of MCU1 and the inverting input terminal of operational amplifier OP2. MCU1 detects the temperature of thermistor T3 (corresponding to the temperature of heater HTR) based on the voltage input to terminal P13.

[0078] A series circuit of thermistor T4 and resistor Rt4 is connected to the power line PL3, with resistor Rt4 connected to the ground line. Thermistor T4 and resistor Rt4 form a voltage divider circuit, and their connection points are connected to terminal P12 of MCU1 and the inverting input terminal of op-amp OP3. MCU1 detects the temperature of thermistor T4 (corresponding to the temperature of case 110) based on the voltage input to terminal P12.

[0079] The source terminal of switch S7, which is composed of a MOSFET, is connected to power line PL2. The gate terminal of switch S7 is connected to terminal P20 of MCU1. The drain terminal of switch S7 is connected to one of a pair of connectors to which the vibration motor M is connected. The other of these connectors is connected to the ground line. By manipulating the potential of terminal P20, MCU1 can control the opening and closing of switch S7, thereby causing the vibration motor M to vibrate in a specific pattern. A dedicated driver IC may be used instead of switch S7.

[0080] The power supply line PL2 is connected to the positive power supply terminal of the operational amplifier OP2 and to a voltage divider circuit Pd (a series circuit of two resistors) which is connected to the non-inverting input terminal of the operational amplifier OP2. The connection point of the two resistors constituting the voltage divider circuit Pd is connected to the non-inverting input terminal of the operational amplifier OP2. The operational amplifier OP2 outputs a signal corresponding to the temperature of the heater HTR (a signal corresponding to the resistance value of thermistor T3). In this embodiment, since thermistor T3 has NTC characteristics, the higher the temperature of the heater HTR (temperature of thermistor T3), the lower the output voltage of the operational amplifier OP2. This is because the negative power supply terminal of the operational amplifier OP2 is connected to the ground line, and when the voltage value input to the inverting input terminal of the operational amplifier OP2 (the voltage divided by thermistor T3 and resistor Rt3) is higher than the voltage value input to the non-inverting input terminal of the operational amplifier OP2 (the voltage divided by the voltage divider circuit Pd), the output voltage value of the operational amplifier OP2 becomes approximately equal to the ground potential. In other words, when the temperature of the heater HTR (thermistor T3) becomes high, the output voltage of the operational amplifier OP2 becomes low. If a thermistor T3 with PTC characteristics is used, connect the output of the voltage divider circuit of thermistor T3 and resistor Rt3 to the non-inverting input terminal of op-amp OP2, and connect the output of the voltage divider circuit Pd to the inverting input terminal of op-amp OP2.

[0081] The power supply line PL2 is connected to the positive power supply terminal of the operational amplifier OP3 and to a voltage divider circuit Pe (a series circuit of two resistors) which is connected to the non-inverting input terminal of the operational amplifier OP3. The connection point of the two resistors constituting the voltage divider circuit Pe is connected to the non-inverting input terminal of the operational amplifier OP3. The operational amplifier OP3 outputs a signal corresponding to the temperature of case 110 (a signal corresponding to the resistance value of thermistor T4). In this embodiment, since a thermistor T4 with NTC characteristics is used, the higher the temperature of case 110, the lower the output voltage of the operational amplifier OP3 becomes. This is because the negative power supply terminal of the operational amplifier OP3 is connected to the ground line, and when the voltage value input to the inverting input terminal of the operational amplifier OP3 (the voltage divided by thermistor T4 and resistor Rt4) is higher than the voltage value input to the non-inverting input terminal of the operational amplifier OP3 (the voltage divided by the voltage divider circuit Pe), the output voltage value of the operational amplifier OP3 becomes approximately equal to the ground potential. In other words, when the temperature of thermistor T4 becomes high, the output voltage of operational amplifier OP3 becomes low. If a thermistor T4 with PTC characteristics is used, connect the output of the voltage divider circuit of thermistor T4 and resistor Rt4 to the non-inverting input terminal of op-amp OP3, and connect the output of the voltage divider circuit Pe to the inverting input terminal of op-amp OP3.

[0082] Resistor R1 is connected to the output terminal of op-amp OP2. The cathode of diode D1 is connected to resistor R1. The anode of diode D1 is connected to the output terminal of op-amp OP3, terminal D of FF17, and terminal CLR(￣) of FF17. Resistor R2, which is connected to power line PL1, is connected to the connection line between resistor R1 and diode D1. Also, terminal CLR(￣) of FF16 is connected to this connection line.

[0083] One end of resistor R3 is connected to the connection line between the anode of diode D1 and the output terminal of op-amp OP3, and the D terminal of FF17. The other end of resistor R3 is connected to the power line PL2. Furthermore, the anode of diode D2, which is connected to the notification terminal 12a of fuel gauge IC12, the anode of diode D3, and the CLR(￣) terminal of FF17 are also connected to this connection line. The cathode of diode D3 is connected to terminal P5 of MCU1.

[0084] When the heater HTR temperature of the FF16 becomes excessive, causing the signal output from the op-amp OP2 to decrease and the signal input to the CLR(￣) terminal to become low level, the FF16 inputs a high-level signal from the Q(￣) terminal to terminal P11 of the MCU1. The D terminal of the FF16 is supplied with a high-level system power supply voltage Vcc1 from the power supply line PL1. Therefore, as long as the signal input to the CLR(￣) terminal, which operates in negative logic, does not become low level, the Q(￣) terminal will continue to output a low-level signal.

[0085] The signal input to the CLR(￣) terminal of FF17 becomes low level in any of the following cases: when the heater HTR temperature becomes excessive, when the case 110 temperature becomes excessive, or when a low-level signal indicating abnormality detection is output from the notification terminal 12a of the remaining charge meter IC 12. When the signal input to the CLR(￣) terminal of FF17 becomes low level, it outputs a low-level signal from the Q terminal. This low-level signal is input to terminal P10 of MCU1, the gate terminal of switch S6, the enable terminal EN of the boost DC / DC converter 9, and the base terminal of the bipolar transistor S1 connected to the charging IC 2, respectively. When a low-level signal is input to the gate terminal of switch S6, the gate-source voltage of the N-channel MOSFET constituting switch S6 falls below the threshold voltage, causing switch S6 to turn off. When a low-level signal is input to the enable terminal EN of the boost DC / DC converter 9, the boost operation stops because the enable terminal EN of the boost DC / DC converter 9 is in positive logic. When a low-level signal is input to the base terminal of bipolar transistor S1, bipolar transistor S1 turns on (an amplified current is output from the collector terminal). When bipolar transistor S1 turns on, a high-level system power supply voltage Vcc2 is input to the CE(￣) terminal of charging IC2 via bipolar transistor S1. Since the CE(￣) terminal of charging IC2 is negative logic, charging of power supply BAT is stopped. As a result, heating of heater HTR and charging of power supply BAT are stopped. Note that even if MCU1 attempts to output a low-level enable signal from terminal P22 to the charge enable terminal CE(￣) of charging IC2, when bipolar transistor S1 turns on, an amplified current is input from the collector terminal to terminal P22 of MCU1 and the charge enable terminal CE(￣) of charging IC2. Therefore, a high-level signal is input to the charge enable terminal CE(￣) of charging IC2.

[0086] The D terminal of the FF17 is supplied with a high-level system power supply voltage Vcc2 from the power supply line PL2. Therefore, in the FF17, a high-level signal will continue to be output from the Q terminal as long as the signal input to the CLR(￣) terminal, which operates in negative logic, is not low level. When a low-level signal is output from the output terminal of op-amp OP3, a low-level signal is input to the CLR(￣) terminal of the FF17, regardless of the level of the signal output from the output terminal of op-amp OP2. Note that when a high-level signal is output from the output terminal of op-amp OP2, the low-level signal output from the output terminal of op-amp OP3 is not affected by this high-level signal due to diode D1. Also, when a low-level signal is output from the output terminal of op-amp OP2, even if a high-level signal is output from the output terminal of op-amp OP3, this high-level signal is replaced by a low-level signal via diode D1.

[0087] The power line PL2 further branches off from the MCU-mounted board 161 towards the LED-mounted board 163 and the Hall IC-mounted board 164. The power terminal VDD of the Hall IC 13, the power terminal VCC of the communication IC 15, and the power terminal VDD of the Hall IC 14 are connected to this branched power line PL2.

[0088] The output terminal OUT of the Hall IC 13 is connected to terminal P3 of the MCU 1 and terminal SW2 of the switch driver 7. When the outer panel 115 is removed, a low-level signal is output from the output terminal OUT of the Hall IC 13. The MCU 1 determines whether the outer panel 115 is installed or not based on the signal input to terminal P3.

[0089] The LED-mounted circuit board 163 is provided with a series circuit (a series circuit of a resistor and a capacitor) connected to the operation switch OPS. This series circuit is connected to the power line PL2. The connection point of the resistor and capacitor in this series circuit is connected to terminal P4 of the MCU1, the operation switch OPS, and terminal SW1 of the switch driver 7. When the operation switch OPS is not pressed, the operation switch OPS does not conduct, and the signals input to terminal P4 of the MCU1 and terminal SW1 of the switch driver 7 are high level due to the system power supply voltage Vcc2. When the operation switch OPS is pressed and conducts, the signals input to terminal P4 of the MCU1 and terminal SW1 of the switch driver 7 are connected to the ground line and become low level. The MCU1 detects the operation of the operation switch OPS by the signal input to terminal P4.

[0090] The switch driver 7 is provided with a reset input terminal RSTB. The reset input terminal RSTB is connected to the control terminal ON of LSW4. When the signal levels input to terminals SW1 and SW2 of the switch driver 7 become low (when the outer panel 115 is removed and the operation switch OPS is pressed), the switch driver 7 outputs a low-level signal from the reset input terminal RSTB to stop the output operation of LSW4. In other words, if the operation switch OPS, which is normally pressed down via the press portion 117 of the outer panel 115, is pressed down directly by the user when the outer panel 115 is removed, the signal levels input to terminals SW1 and SW2 of the switch driver 7 will both become low.

[0091] <Operation of the suction device in each operating mode> The operation of the electrical circuit shown in Figure 10 will be explained below with reference to Figures 13 to 19. Figure 13 is a diagram illustrating the operation of the electrical circuit in sleep mode. Figure 14 is a diagram illustrating the operation of the electrical circuit in active mode. Figure 15 is a diagram illustrating the operation of the electrical circuit in heating initial setting mode. Figure 16 is a diagram illustrating the operation of the electrical circuit when the heater HTR is heating in heating mode. Figure 17 is a diagram illustrating the operation of the electrical circuit when the temperature of the heater HTR is detected in heating mode. Figure 18 is a diagram illustrating the operation of the electrical circuit in charging mode. Figure 19 is a diagram illustrating the operation of the electrical circuit when the MCU1 is reset (rebooted). In each of Figures 13 to 19, among the terminals of the chipped electronic components, the terminals enclosed by the dashed ellipse are connected to the power supply voltage V BAT USB voltage V USB This indicates terminals to which input or output such as system power supply voltage is provided.

[0092] In any operating mode, the power supply voltage V BAT This power is input to the power terminal VDD of the protection IC 10, the input terminal VIN of the boost DC / DC converter 9, and the charging terminal bat of the charging IC 2.

[0093] <Sleep mode: Figure 13> MCU1 controls the voltage of charging IC2. BAT Enable the Power Pass function and disable the OTG function and charging function. Connect the USB voltage V to the VBUS input terminal of charging IC2. USB Because no input is received, the voltage of charging IC2 BAT The power path function is enabled. However, the OTG function is disabled because the signal to enable the OTG function is not output from MCU1 to charging IC2 via the communication line LN. Therefore, charging IC2 receives the power supply voltage V input to the charging terminal bat. BATThe system power supply voltage Vcc0 is generated from the switch and output from the output terminal SYS. The system power supply voltage Vcc0 output from the output terminal SYS is input to the input terminal VIN and the enable terminal EN of the buck-boost DC / DC converter 8. The buck-boost DC / DC converter 8 is enabled when a high level of system power supply voltage Vcc0 is input to the enable terminal EN, which is positive logic, and generates system power supply voltage Vcc1 from system power supply voltage Vcc0 and outputs it from the output terminal VOUT. The system power supply voltage Vcc1 output from the output terminal VOUT of the buck-boost DC / DC converter 8 is supplied to the input terminal VIN of the LSW4, the control terminal ON of the LSW4, the input terminal VIN of the switch driver 7, and the power terminals VCC and D of the FF16, respectively.

[0094] When the system power supply voltage Vcc1 is input to the control terminal ON of LSW4, it outputs the system power supply voltage Vcc1 input to the input terminal VIN as the system power supply voltage Vcc2 from the output terminal VOUT. The system power supply voltage Vcc2 output from LSW4 is input to the power supply terminal VDD of MCU1, the input terminal VIN of LSW5, the power supply terminal VDD of Hall IC13, the power supply terminal VCC of communication IC15, and the power supply terminal VDD of Hall IC14. Furthermore, the system power supply voltage Vcc2 is supplied to the power supply terminal VDD of battery level indicator IC12, the power supply terminal VCC of ROM6, the resistor Rc and bipolar transistor S1 connected to the charge enable terminal CE(￣) of charging IC2, the power supply terminal VCC of FF17, the positive power supply terminal of op-amp OP3, the voltage divider circuit Pe, the positive power supply terminal of op-amp OP2, and the voltage divider circuit Pd. The bipolar transistor S1 connected to charging IC2 is off unless a low-level signal is output from the Q terminal of FF17. Therefore, the system power supply voltage Vcc2 generated by LSW4 is also input to the charge enable terminal CE(￣) of the charge IC2. Since the charge enable terminal CE(￣) of the charge IC2 is negative logic, the charging function by the charge IC2 is turned off in this state.

[0095] Thus, in sleep mode, LSW5 stops outputting the system power supply voltage Vcc3, and therefore power is not supplied to the electronic components connected to power line PL3. Also, in sleep mode, the OTG function of charging IC2 is disabled, and therefore power is not supplied to LEDs L1 to L8.

[0096] <Active Mode: Figure 14> When the MCU1 detects that the signal input to terminal P8 has become high level and that slider 119 has opened, from the sleep mode state shown in Figure 13, it inputs a high-level signal from terminal P23 to the control terminal ON of the LSW5. As a result, the LSW5 outputs the system power supply voltage Vcc2, which is input to input terminal VIN, as the system power supply voltage Vcc3 from output terminal VOUT. The system power supply voltage Vcc3 output from the output terminal VOUT of the LSW5 is supplied to thermistors T2, T3, and T4.

[0097] Furthermore, when MCU1 detects that slider 119 is open, it enables the OTG function of charging IC2 via communication line LN. This allows charging IC2 to receive the power supply voltage V input from charging terminal bat. BAT The system power supply voltage Vcc4, obtained by boosting the voltage, is output from the input terminal VBUS. The system power supply voltage Vcc4 output from the input terminal VBUS is supplied to LEDs L1 to L8.

[0098] <Initial heating mode: Figure 15> From the state shown in Figure 14, when the signal input to terminal P4 becomes low level (operation switch OPS is pressed), the MCU1 performs various settings necessary for heating, and then inputs a high-level enable signal from terminal P14 to the enable terminal EN of the boost DC / DC converter 9. As a result, the boost DC / DC converter 9 operates on the power supply voltage V BAT The drive voltage V obtained by boosting the voltage bst The output voltage is VOUT. bstThis power is supplied to switches S3 and S4. In this state, switches S3 and S4 are off. Switch S6 is turned on by a high-level enable signal output from terminal P14. As a result, the negative terminal of heater HTR is connected to the ground line, and when switch S3 is turned ON, heater HTR can be heated. After a high-level enable signal is output from terminal P14 of MCU1, it transitions to heating mode.

[0099] <Heater heating in heating mode: Figure 16> In the state shown in Figure 15, the MCU1 starts switching control of switch S3 connected to terminal P16 and switch S4 connected to terminal P15. These switching controls may start automatically once the heating initial setting mode described above is completed, or they may be started by pressing the operation switch OPS. Specifically, as shown in Figure 16, the MCU1 turns on switch S3 and off switch S4, and the drive voltage V bst Heating control is performed to supply the aerosol to the heater HTR and heat the heater HTR for aerosol generation, and temperature detection control is performed to turn off switch S3 and turn on switch S4 as shown in Figure 17 to detect the temperature of the heater HTR.

[0100] As shown in Figure 16, during heating control, the drive voltage V bst This is also supplied to the gate of switch S5, turning switch S5 on. Furthermore, during heating control, the drive voltage V that passes through switch S3 is also supplied. bst However, this voltage is also input to the positive power supply terminal of the operational amplifier OP1 via resistor Rs. The resistance value of resistor Rs is negligibly small compared to the internal resistance value of the operational amplifier OP1. Therefore, during heating control, the voltage input to the positive power supply terminal of the operational amplifier OP1 is the drive voltage V bst It becomes almost equivalent to that.

[0101] Note that the resistance value of resistor R4 is greater than the on-resistance value of switch S5. Op-amp OP1 operates even during heating control, but switch S5 is turned on during heating control. When switch S5 is on, the output voltage of op-amp OP1 is divided by the voltage divider circuit of resistor R4 and switch S5 and input to terminal P9 of MCU1. Because the resistance value of resistor R4 is greater than the on-resistance value of switch S5, the voltage input to terminal P9 of MCU1 is sufficiently small. This prevents a large voltage from being input from op-amp OP1 to MCU1.

[0102] <Heater temperature detection during heating mode: Figure 17> As shown in Figure 17, during temperature detection control, the drive voltage V bst This voltage is input to the positive power supply terminal of the operational amplifier OP1 and also to the voltage divider circuit Pb. The voltage divided by the voltage divider circuit Pb is input to terminal P18 of the MCU1. Based on the voltage input to terminal P18, the MCU1 applies a reference voltage V to the series circuit of resistor Rs and heater HTR during temperature detection control. temp Obtain it.

[0103] Furthermore, during temperature detection control, the drive voltage V bst (Reference voltage V temp The drive voltage V is supplied to the series circuit of the resistor Rs and the heater HTR. bst (Reference voltage V temp The voltage V obtained by dividing the voltage between resistor Rs and heater HTR. heat However, this is input to the non-inverting input terminal of the operational amplifier OP1. Since the resistance value of resistor Rs is sufficiently larger than the resistance value of heater HTR, the voltage V heat The drive voltage V bst This value is significantly lower than [the specified value]. During temperature detection control, this low voltage V heat When this voltage is also supplied to the gate terminal of switch S5, switch S5 is turned off. The operational amplifier OP1 receives the voltage input to the inverting input terminal and the voltage V input to the non-inverting input terminal. heat The difference is amplified and output.

[0104] The output signal of operational amplifier OP1 is input to terminal P9 of MCU1. MCU1 obtains a reference voltage V based on the signal input to terminal P9 and the input voltage of terminal P18. temp Based on the electrical resistance value of the known resistor Rs, the temperature of the heater HTR is obtained. Based on the obtained temperature of the heater HTR, the MCU1 performs heating control of the heater HTR (for example, control so that the temperature of the heater HTR reaches the target temperature).

[0105] Furthermore, MCU1 can acquire the temperature of the heater HTR even when switches S3 and S4 are turned off (when no power is supplied to the heater HTR). Specifically, MCU1 acquires the temperature of the heater HTR based on the voltage input to terminal P13 (the output voltage of the voltage divider circuit consisting of thermistor T3 and resistor Rt3).

[0106] Furthermore, the MCU1 can acquire the temperature of case 110 at any time. Specifically, the MCU1 acquires the temperature of case 110 based on the voltage input to terminal P12 (the output voltage of the voltage divider circuit consisting of thermistor T4 and resistor Rt4).

[0107] <Charging mode: Figure 18> Figure 18 illustrates the case when a USB connection is made while the device is in sleep mode. When a USB connection is made, the USB voltage V USB The USB voltage V is input to the LSW3 input terminal VIN via the overvoltage protection IC11. USB This voltage is also supplied to the voltage divider circuit Pf connected to the input terminal VIN of the LSW3. Immediately after the USB connection is made, the bipolar transistor S2 is on, so the signal input to the control terminal ON of the LSW3 remains at a low level. USB voltage V USB This voltage is also supplied to the voltage divider circuit Pc connected to terminal P17 of the MCU1, and the voltage divided by this voltage divider circuit Pc is input to terminal P17. Based on the voltage input to terminal P17, the MCU1 detects that a USB connection has been made.

[0108] When MCU1 detects that a USB connection has been made, it turns off the bipolar transistor S2 connected to terminal P19. When a low-level signal is input to the gate terminal of bipolar transistor S2, the USB voltage V divided by the voltage divider circuit Pf is turned on. USB This is input to the ON control terminal of LSW3. As a result, a high-level signal is input to the ON control terminal of LSW3, and LSW3 receives the USB voltage V USB The output voltage VOUT is output from the output terminal. USB This is input to the VBUS input terminal of the charging IC2. Also, the USB voltage V output from LSW3 is input. USB This is then supplied directly as the system power supply voltage Vcc4 to LEDs L1~L8.

[0109] When MCU1 detects that a USB connection has been made, it further outputs a low-level enable signal from terminal P22 to the charge enable terminal CE(￣) of the charge IC2. This causes the charge IC2 to activate the charging function of power supply BAT, and the USB voltage V input to input terminal VBUS is connected. USB The power battery will begin charging.

[0110] Furthermore, when a USB connection is made while in active mode, MCU1 detects the USB connection, turns off the bipolar transistor S2 connected to terminal P19, outputs a low-level enable signal from terminal P22 to the charge enable terminal CE(￣) of the charge IC2, and then turns off the OTG function of the charge IC2 via serial communication using the communication line LN. As a result, the system power supply voltage Vcc4 supplied to LEDs L1~L8 is the voltage (power supply voltage V) that was generated by the OTG function of the charge IC2. BAT (Based on the voltage) USB voltage V output from LSW3 USB The switch is made. LEDs L1~L8 will not operate unless the built-in transistors are turned on by MCU1. This prevents unstable voltages from being supplied to LEDs L1~L8 during the transient period when the OTG function is turned on to off.

[0111] <Reset of MCU: Figure 19> When the outer panel 115 is removed and the output of the Hall IC 13 becomes low level, and when the on operation of the operation switch OPS is performed and the signal input to the terminal P4 of the MCU 1 becomes low level, both the terminal SW1 and the terminal SW2 of the switch driver 7 become low level. As a result, the switch driver 7 outputs a low-level signal from the reset input terminal RSTB. The low-level signal output from the reset input terminal RSTB is input to the control terminal ON of the LSW4. As a result, the LSW4 stops the output of the system power supply voltage Vcc2 from the output terminal VOUT. Since the system power supply voltage Vcc2 is no longer input to the power supply terminal VDD of the MCU 1 when the output of the system power supply voltage Vcc2 is stopped, the MCU 1 stops.

[0112] When the time during which the switch driver 7 outputs a low-level signal from the reset input terminal RSTB reaches the predetermined time, or when the signal input to either the terminal SW1 or the terminal SW2 becomes high level, the switch driver 7 returns the signal output from the reset input terminal RSTB to high level. As a result, the control terminal ON of the LSW4 becomes high level, and the state in which the system power supply voltage Vcc2 is supplied to each part returns.

[0113] <Details of the function of the charging IC) Figure 20 is a diagram showing the schematic configuration inside the charging IC 2. The charging IC 2 includes a processor 21, a gate driver 22, and switches Q1 to Q4 each composed of an N-channel MOSFET.

[0114] The source terminal of switch Q1 is connected to the input terminal VBUS. The drain terminal of switch Q1 is connected to the drain terminal of switch Q2. The source terminal of switch Q2 is connected to the switching terminal SW. The drain terminal of switch Q3 is connected to the connection node between switch Q2 and the switching terminal SW. The source terminal of switch Q3 is connected to the ground terminal GND. The drain terminal of switch Q4 is connected to the output terminal SYS. The source terminal of switch Q4 is connected to the charging terminal bat.

[0115] The gate driver 22 is connected to the gate terminals of switch Q2 and switch Q3, and controls the on / off state of switches Q2 and Q3 based on commands from processor 21.

[0116] The processor 21 is connected to the gate driver 22, the gate terminal of switch Q1, the gate terminal of switch Q4, and the charge enable terminal CE(￣). The processor 21 controls the on / off state of switches Q2 and Q3 via the gate driver 22, and also controls the on / off state of switches Q1 and Q4.

[0117] Charging IC2 has the aforementioned charging function, V BAT In addition to the Power Pass function and OTG function, V USB Power Pass function and V USB &V BAT It is equipped with a power pass function. The following describes the internal control of the charging IC2 when each of these functions is enabled. The specific numerical values ​​of the various voltages mentioned above are preferably the values ​​shown below.

[0118] Power supply voltage V BAT (Fully charged voltage) = 4.2V Power supply voltage V BAT (Nominal voltage) = 3.7V System power supply voltage Vcc1 = 3.3V System power supply voltage Vcc2 = 3.3V System power supply voltage Vcc3 = 3.3V System power supply voltage Vcc4 = 5.0V USB voltage V USB = 5.0V Drive voltage V bst =4.9V

[0119] (charging function) The processor 21 controls the on / off state of switches Q2 and Q4 while switch Q1 is on and switch Q3 is off. The on / off control of switch Q4 is performed to adjust the charging current of power supply BAT. The processor 21 controls the on / off state of switch Q2 so that the voltage at output terminal SYS is the same as the voltage suitable for charging power supply BAT. As a result, the USB voltage V input to input terminal VBUS is controlled USB The voltage is stepped down and output from output terminal SYS. The voltage output from output terminal SYS is input to input terminal VIN of the step-up / step-down DC / DC converter 8 as the system power supply voltage Vcc0, and is also output from the charging terminal bat of the charging IC 2. As a result, the USB voltage V USB The power supply BAT is charged using the voltage obtained by stepping down the voltage. When the charging function is enabled, the system power supply voltage Vcc0 will eventually be the same as the fully charged voltage of the power supply BAT. Therefore, the step-up / step-down DC / DC converter 8 steps down the 4.2V system power supply voltage Vcc0 input to the input terminal VIN to generate and output a system power supply voltage Vcc1 of 3.3V. When the charging function is enabled, the potential of the input terminal VBUS in the charging IC 2 is higher than the potential of the output terminal SYS, so no power from the power supply BAT is output from the input terminal VBUS.

[0120] (V USB Power Pass function) V USB The power path function is activated, for example, when the power battery (BAT) is unavailable due to over-discharge or other reasons. The processor 21 controls switch Q1 to ON, switch Q2 to ON, switch Q3 to OFF, and switch Q4 to OFF. This controls the USB voltage V input to the input terminal VBUS. USBThe voltage is output directly from the switching terminal SW without being stepped down. The voltage output from the switching terminal SW is input to the input terminal VIN of the buck-boost DC / DC converter 8 as the system power supply voltage Vcc0. In this case as well, the buck-boost DC / DC converter 8 steps down the 5V system power supply voltage Vcc0 input to the input terminal VIN to generate and output a 3.3V system power supply voltage Vcc1. USB Even when the power path function is enabled, the processor 21 may control the on / off state of switch Q2 while controlling switch Q1 to ON, switch Q3 to OFF, and switch Q4 to ON. In this way, the USB voltage V5.0V USB The step-down from the system power supply voltage Vcc1 to 3.3V can be shared between the charging IC2 and the step-up / step-up DC / DC converter 8. This prevents the concentration of load and heat on the step-up / step-up DC / DC converter 8.

[0121] (V USB &V BAT Power Pass function) V USB &V BAT The power pass function is enabled, for example, when the power battery has finished charging and the USB connection is maintained. The processor 21 controls the on / off state of switch Q2 while controlling switch Q1 to ON, switch Q3 to OFF, and switch Q4 to ON. The processor 21 determines that the voltage of output terminal SYS is equal to the voltage of power battery (power supply voltage V BAT Switch Q2 is controlled to be the same as ). This controls the USB voltage V input to the input terminal VBUS. USB The voltage is stepped down and output from the output terminal SYS. The USB voltage V input to the input terminal VBUS USB The voltage output from the output terminal SYS after being stepped down is the same as the voltage output from the output terminal SYS via the charging terminal bat from the power supply BAT. Therefore, the USB voltage V USB The power includes the voltage obtained by stepping down the voltage, and the power supply voltage V output from the output terminal SYS. BATThe power, including V, is combined and supplied to the input terminal VIN of the step-up / step-down DC / DC converter 8. USB &V BAT When the power pass function is enabled, the potential of the input terminal VBUS in the charging IC2 becomes higher than the potential of the output terminal SYS, so power from the power supply BAT is not output from the input terminal VBUS.

[0122] V USB &V BAT When the power path function is enabled, the step-up / step-down DC / DC converter 8 uses the power supply voltage V BAT The magnitude of the voltage determines whether to perform a boost or buck. The boost / buck DC / DC converter 8 uses the power supply voltage V BAT If the voltage is 3.3V or higher, the system power supply voltage Vcc0 input to the input terminal VIN is stepped down to generate and output a system power supply voltage Vcc1 of 3.3V. The step-up / step-down DC / DC converter 8 uses the power supply voltage V BAT If the voltage is less than 3.3V, the system power supply voltage Vcc0 input to the input terminal VIN is boosted to generate a system power supply voltage Vcc1 of 3.3V, which is then output.

[0123] (V BAT Power Pass function) V BAT The power path function is enabled in modes other than charging mode (for example, sleep mode). Processor 21 controls switches Q1 and Q3 to turn off. This reduces the power supply voltage V input to the charging terminal bat. BAT This is output directly from the output terminal SYS and input to the input terminal VIN of the step-up / step-down DC / DC converter 8 as the system power supply voltage Vcc0. This control blocks the power transfer path between the input terminal VBUS and the switching terminal SW of the charging IC 2 by the parasitic diode of switch Q1. Therefore, the power supply voltage Vcc0 output from the output terminal SYS is blocked. BAT However, no output is produced from the VBUS input terminal.

[0124] V BAT When the power path function is enabled, the step-up / step-down DC / DC converter 8 uses the power supply voltage VBAT Determine whether to perform step-up or step-down based on the magnitude of BAT . When the power supply voltage V BAT input to the input terminal VIN is 3.3V or higher, the power supply voltage V BAT is stepped down to generate and output a system power supply voltage Vcc1 of 3.3V. The buck-boost DC / DC converter 8 steps down the power supply voltage V BAT when the power supply voltage V

[0125] (OTG function) The OTG function becomes effective simultaneously with the V BAT power pass function, for example, it becomes effective in the active mode. When both the OTG function and the V BAT power pass function are effective, the processor 21 controls the switch Q3 to be on and off while controlling the switch Q1 to be on. As a result, the power supply voltage V BAT input to the charging terminal bat is directly output from the output terminal SYS and input to the input terminal VIN of the buck-boost DC / DC converter 8 as the system power supply voltage Vcc0. Also, the power supply voltage V BAT output from the output terminal SYS is input to the switching terminal SW of the charging IC2. The processor 21 controls the switch Q3 so that the power supply voltage V BAT input to the switching terminal SW is the same as the system power supply voltage Vcc4. As a result, the power supply voltage V BAT input to the switching terminal SW is stepped up and output from the input terminal VBUS. The voltage output from the input terminal VBUS is input to the LEDs L1~L8 as the system power supply voltage Vcc4.

[0126] In this way, the charging IC2 functions as a buck converter that steps down the USB voltage V USB , and the power supply voltage V BATIt also functions as a boost converter to increase the voltage. The voltage input from the charging IC2 to the buck-boost DC / DC converter 8 varies depending on the function enabled by the charging IC2. However, even with such fluctuations, the buck-boost DC / DC converter 8 can selectively perform boosting and bucking to keep the system power supply voltage Vcc1 (power including the system power supply voltage Vcc1) constant. Note that if the voltage of the system power supply voltage Vcc0 input to the input terminal VIN of the buck-boost DC / DC converter 8 is equal to the voltage of the system power supply voltage Vcc1, which is 3.3V, the buck-boost DC / DC converter 8 will not perform boosting or bucking, but will output the system power supply voltage Vcc0 as the system power supply voltage Vcc1 from the output terminal VOUT.

[0127] <Power consumption of electrical circuits> In a suction system including the suction unit 100, the heater HTR is the load that consumes the most power among all the loads included in the system. For example, the power consumption P of the heater HTR HTR The power consumption P of each LED L1 to L8 is LED It is larger than that. Also, the power consumption of the heater HTR is greater than the total power consumption of all electronic components connected to the output terminal SYS of the charging IC2. Therefore, it is preferable that the current value that the boost DC / DC converter 9 connected to the heater HTR can receive from the power supply BAT is greater than the maximum current value that the output terminal SYS of the charging IC2 can output.

[0128] <Preferred configuration of step-up / step-down DC / DC converter 8> From the standpoint of reducing the cost and size of the step-up / step-down DC / DC converter 8, it is preferable that at least one of the maximum input current and maximum output current of the step-up / step-down DC / DC converter 8 is smaller than the maximum current that the output terminal SYS of the charging IC 2 can output. In such a configuration, if the output terminal SYS of the charging IC 2 outputs the maximum current, there is a risk that an excessive current will be input to the step-up / step-down DC / DC converter 8. However, since the heater HTR, which consumes the most power, is not connected to the output terminal VOUT of the step-up / step-down DC / DC converter 8, an excessive current will not be input to the step-up / step-down DC / DC converter 8. Therefore, even with such a configuration, the cost and size can be reduced without causing any malfunction in the step-up / step-down DC / DC converter 8.

[0129] <Preferred configuration of the boost DC / DC converter 9> The boost DC / DC converter 9 is preferably a switching regulator. In the example shown in Figure 20, the boost DC / DC converter 9 performs voltage boosting by operating in either a PFM (Pulse Frequency Modulation) mode or a PWM (Pulse Width Modulation) mode. Specifically, the boost DC / DC converter 9 is equipped with a mode terminal MODE for mode switching, and is configured to switch the operating mode according to the potential of the mode terminal MODE. It is preferable that the maximum current that can be input to the switching terminal SW of the boost DC / DC converter 9 when it is operating in PFM mode is greater than the maximum current that can be input to the switching terminal SW of the boost DC / DC converter 9 when it is operating in PWM mode.

[0130] The voltage applied to the heater HTR differs significantly between heating control and temperature detection control. This means the load on the boost DC / DC converter 9 fluctuates between heavy and light loads. In PWM mode, the switching frequency remains constant regardless of the load, so at light loads, switching losses become dominant, reducing efficiency. On the other hand, in PFM mode, less additional power is needed at light loads, resulting in a lower switching frequency and reduced switching losses. Therefore, high efficiency can be maintained even at light loads. As the load increases from light to heavy, this efficiency relationship reverses, with PWM mode being more efficient than PFM mode. However, the range of loads at which PWM mode is more efficient is limited. Therefore, when the load on the boost DC / DC converter 9 fluctuates between heavy and light loads, it is preferable for the boost DC / DC converter 9 to operate in PFM mode.

[0131] Regardless of whether it operates in PWM mode or PFM mode, the efficiency of the boost DC / DC converter 9 tends to decrease near the maximum current that can be input to the boost DC / DC converter 9 or the maximum current that the boost DC / DC converter 9 can output. In particular, when operating in PFM mode, the efficiency decreases under heavy loads as described above, so the efficiency of the DC / DC converter decreases near the maximum current due to a dual factor. Therefore, as mentioned above, a boost DC / DC converter 9 is used in which the maximum current that can be input to the switching terminal SW of the boost DC / DC converter 9 when operating in PFM mode is greater than the maximum current that can be input to the switching terminal SW of the boost DC / DC converter 9 when operating in PWM mode. This makes it possible to suppress the decrease in efficiency under heavy loads even when the boost DC / DC converter 9 is operated in PFM mode.

[0132] From the perspective of efficiency mentioned above, it is preferable that the potential of the mode terminal MODE is maintained at a potential at which the PFM mode is selected. In the example in Figure 20, the mode terminal MODE is not connected anywhere, so the operating mode of the boost DC / DC converter 9 is fixed to the PFM mode. This allows a larger current to be input to the switching terminal SW of the boost DC / DC converter 9, making it possible to supply a larger current to the heater HTR. Note that this configuration in which the potential of the mode terminal MODE is undefined is just one example. Depending on the specifications of the boost DC / DC converter 9, the PFM mode may be selected by setting the potential of the mode terminal MODE to a high level or a low level. In such cases, it is sufficient that the potential of the mode terminal MODE is maintained at an appropriate potential so that the PFM mode is selected.

[0133] <Effects of the suction device> In the suction device 100, the LEDs L1-L8, which serve as notification units, are supplied with voltage not directly from the power supply battery, but via the charging IC 2. Although the voltage of the power supply battery fluctuates, by not supplying this fluctuating voltage directly to the LEDs L1-L8, the LEDs L1-L8 can be operated stably. Since the brightness of the LEDs depends on the supplied voltage, if a stable voltage can be supplied to the LEDs L1-L8, the brightness of the LEDs L1-L8 can be stabilized. Furthermore, since the charging IC 2, whose main function is to control the charging of the power supply battery, generates the system power supply voltage Vcc4 and supplies it to the LEDs L1-L8, a dedicated IC for generating the system power supply voltage Vcc4 is not required. This makes it possible to miniaturize and reduce the cost of the suction device 100. In addition, the charging IC 2 generates the power supply voltage Vcc4. BAT By boosting the voltage to generate the system power supply voltage Vcc4, high-voltage power can be supplied to LEDs L1-L8. This allows LEDs L1-L8 to light up at high brightness, resulting in a good user interface.

[0134] Furthermore, in the suction device 100, power is supplied to the MCU1 not directly from the power supply battery, but via the charging IC 2. The charging IC 2, whose main function is to control the charging of the power supply battery, generates the system power supply voltage Vcc0 and supplies it to the MCU1, thus eliminating the need for a dedicated IC to generate the system power supply voltage Vcc0. This makes it possible to miniaturize and reduce the cost of the suction device 100. In addition, a step-up / step-down DC / DC converter 8 is provided between the charging IC 2 and the MCU1, so that a constant power can be supplied to the MCU1. This makes it possible to stabilize the operation of the MCU1.

[0135] Furthermore, with the suction device 100, the OTG function is disabled when the USB connection is established and LSW3 is closed. This reduces power consumption of the power battery while the USB connection is established, allowing for a larger amount of usable power from the power battery. Also, since LSW3 is open immediately after the USB connection is established, noise and inrush current immediately after the USB connection are not supplied to LEDs L1-L8, reducing the possibility of LEDs L1-L8 failing. In addition, the OTG function is executable immediately after the USB connection is established. Therefore, even during the transitional period immediately after the USB connection when power from the external power supply cannot be supplied to LEDs L1-L8, the OTG function allows power to be supplied to LEDs L1-L8 from the power battery. Consequently, the opportunities for LEDs L1-L8 to operate can be increased, improving the marketability of the suction device 100.

[0136] Furthermore, with the suction device 100, the charging IC 2 can supply power from the power supply BAT to loads such as the MCU 1, eliminating the need for dedicated ICs to supply power to these loads and thus reducing the cost of the suction device 100.

[0137] Furthermore, the input terminal VBUS of the charging IC2 may also be connected to a notification unit separate from LEDs L1~L8. For example, the input terminal VBUS of the charging IC2 may be connected to the vibration motor M to receive notifications for the system power supply voltage Vcc4 and USB voltage V USBThe system power supply voltage Vcc4 and USB voltage V are supplied to the vibration motor M, and the input terminal VBUS of the charging IC2 is connected to a speaker (not shown), and the system power supply voltage Vcc4 and USB voltage V are connected. USB The configuration may also include supplying power to the speaker. Furthermore, the input terminal VBUS of the charging IC2 may be connected to an IC other than the notification unit (an IC separate from the one shown in Figure 10). Preferably, only at least one of the notification unit and this separate IC is connected as a load to the input terminal VBUS of the charging IC2.

[0138] Furthermore, the aspirator 100 has a first discharge path that supplies power from the power supply BAT to the MCU1 via the charging IC2, and a second discharge path that supplies power from the power supply BAT to the heater HTR without going through the charging IC2. Therefore, the current value that should flow through the first discharge path (the maximum current that the output terminal SYS of the charging IC2 can output) can be smaller than the current value that should flow through the second discharge path. Consequently, an expensive and large charging IC2 that can withstand high currents is not required, making it possible to miniaturize and reduce the cost of the aspirator 100. The MCU1 and the heater HTR can operate simultaneously, but even when they operate simultaneously, the existence of the first and second discharge paths allows sufficient power to be supplied to them without placing an excessive burden on the charging IC2.

[0139] Furthermore, in the suction device 100, the second discharge path, through which a large current flows, is provided on a separate substrate from the first discharge path. Specifically, the first discharge path is provided on the MCU-mounted substrate 161, and the second discharge path is provided on the receptacle-mounted substrate 162. This avoids heat concentration on a single substrate, thereby improving the durability of the suction device 100.

[0140] Furthermore, in the suction device 100, all electronic components that receive power from the power supply BAT without going through the charging IC 2 are mounted on the same circuit board (receptacle-mounted circuit board 162). This prevents the electrical circuit from becoming overly complex.

[0141] Furthermore, in the suction device 100, a boost DC / DC converter 9 is provided in the discharge path from the power supply BAT to the heater HTR. Therefore, a large amount of power can be supplied to the heater HTR by the boost DC / DC converter 9 without having to worry about the maximum current of the output terminal SYS of the charging IC2. Thus, the rod 500 can be heated efficiently by the heater HTR while achieving cost reduction and miniaturization of the suction device 100.

[0142] Furthermore, when connected via USB, the suction device 100 has a discharge path (a path from the receptacle RCP to LEDs L1 to L8) that discharges to LEDs L1 to L8 without going through the charging IC 2. This eliminates the need for an expensive and large-scale charging IC 2 capable of withstanding high currents, compared to a case where a discharge path is provided from an external power source to LEDs L1 to L8 via the charging IC 2. As a result, the suction device 100 can be made lower cost and smaller.

[0143] Furthermore, in the suction device 100, the electronic component connected to the input terminal VBUS of the charging IC 2 is a notification unit such as LEDs L1 to L8, or an IC separate from the IC shown in the diagram. Therefore, it is possible to prevent power from an external power supply, which is prone to noise and inrush current, from being supplied to precision electronic components such as the MCU 1, step-up / step-down DC / DC converter 8, ROM 6, battery level indicator IC 12, protection IC 10, and step-up DC / DC converter 9, thereby increasing durability.

[0144] Furthermore, in the suction device 100, an overvoltage protection IC 11 is provided between the LSW3 and the receptacle RCP. The presence of the overvoltage protection IC 11 allows noise and inrush current that may occur the moment the USB connection is made to be blocked not only by the LSW3 but also by the IC 11. This increases the durability of the suction device 100.

[0145] Furthermore, in the suction unit 100, each of the LEDs L1 to L8 will not operate unless the built-in switch in the MCU1 is turned on. This prevents noise and inrush current immediately after USB connection from being supplied to LEDs L1 to L8, thereby reducing the possibility of LEDs L1 to L8 failing. In addition, since the switch is built into the MCU1, the durability of the switch can be improved compared to when the switch is provided externally to the MCU1.

[0146] The major voltages supplied to the load by the suction device 100 are the system power supply voltage Vcc4 and the drive voltage V bst There is. The system power supply voltage Vcc4 is generated from power from the external power supply and power from the power supply BAT, respectively. On the other hand, the drive voltage V bst This is generated solely by power from the power supply BAT. Thus, the drive voltage V bst Regarding this, by designing it so that it is not generated from an external power supply, the lines through which high-voltage power flows can be kept simple. This avoids circuit complexity, thus reducing the cost of the suction device 100. In addition, the power supply line that receives power including the system power supply voltage Vcc4 and the drive voltage V bst It is located on a separate board from the power supply circuit that provides power including the drive voltage Vcc4. Specifically, the power supply circuit that provides power including the system power supply voltage Vcc4 is provided on the MCU mounting board 161 and the LED mounting board 163. bst The power supply circuit, which includes the power supplied, is provided on the receptacle-mounted substrate 162. In this way, by providing the two power supply circuits to which high voltage is applied on separate substrates, the superposition of noise from these power supply circuits, which would otherwise become more difficult to deal with, is suppressed. As a result, the suction device 100 can be operated stably.

[0147] Furthermore, in the suction device 100, the power connector connected to the power supply BAT, the receptacle RCP connected to the external power supply, and the heater connector Cn connected to the heater HTR are all provided on the same circuit board (receptacle-mounted circuit board 162). This suppresses heat generation at various points within the suction device 100, thereby improving the durability of the suction device 100.

[0148] Although various embodiments have been described above with reference to the drawings, it goes without saying that the present invention is not limited to these examples. It is clear to those skilled in the art that various modifications or alterations can be conceived within the scope of the claims, and these will naturally also fall within the technical scope of the present invention.

[0149] For example, a connector may be connected between the output terminal VOUT of the boost DC / DC converter 9 and the ground line to connect a heater other than the heater HTR (one that heats a different object than the heater HTR) or other loads.

[0150] Furthermore, in Figure 10, a parallel circuit consisting of a circuit including switch S3 and a circuit including switch S4 and resistor Rs is connected between the output terminal VOUT of the boost DC / DC converter 9 and the positive terminal of the heater connector Cn. However, this parallel circuit may also be connected between the negative terminal of the heater connector Cn and switch S6, thereby directly connecting the output terminal VOUT of the boost DC / DC converter 9 and the positive terminal of the heater connector Cn.

[0151] This specification contains at least the following information. Note that the components etc. in parentheses indicate those corresponding to the embodiments described above, but are not limited thereto.

[0152] (1) A power supply unit (suction device 100) for an aerosol generating device that generates an aerosol by heating an aerosol source (rod 500), Power supply (power battery), A connector (receptacle RCP) that can be electrically connected to an external power supply, First load (MCU1), A charging IC (charging IC2) includes an input terminal (input terminal VBUS) connected to the connector, a charging terminal (charging terminal bat) connected to the power supply, and an output terminal (output terminal SYS) connected to the first load, and is configured to convert the power input to the input terminal and output it from the charging terminal, The system includes a discharge path that connects the power supply and the second load (heater HTR) without going through the charging IC, The charging IC is configured to supply power input from the power source to the charging terminal to the first load via the output terminal. Power supply unit for an aerosol generator.

[0153] According to (1), having a discharge path that discharges to a second load without going through the charging IC reduces the load connected to the output terminal of the charging IC. This eliminates the need for expensive and large-scale charging ICs that can withstand high currents, enabling lower costs and miniaturization of the aerosol generation device.

[0154] (2) (1) The power supply unit of the aerosol generating apparatus described above, The first load and the second load operate simultaneously. Power supply unit for an aerosol generator.

[0155] According to (2), even when the two loads operate simultaneously, the charging IC is not subjected to excessive load. Therefore, sufficient power can be supplied to the two loads, allowing them to operate properly.

[0156] (3) (2) The power supply unit for the aerosol generating apparatus described above, The first board (MCU-equipped board 161), The system comprises a second substrate (receptacle-mounted substrate 162) separate from the first substrate, The charging IC and the first load are provided on the first substrate. The discharge path is provided on the second substrate, Power supply unit for an aerosol generator.

[0157] According to (3), the path from the power supply to the first load via the charging IC and the path from the power supply to the second load are located on different substrates. Therefore, heat concentration on a single substrate can be avoided, and the durability of the aerosol generator can be improved.

[0158] (4) A power supply unit for an aerosol generating apparatus as described in any of (1) to (3), The power consumption of the first load is less than the power consumption of the second load. Power supply unit for an aerosol generator.

[0159] According to (4), the charging IC does not need to discharge to the second load, which consumes a large amount of power. Therefore, a cheaper and smaller charging IC can be used, enabling lower costs and miniaturization of the aerosol generation device.

[0160] (5) (4) The power supply unit for the aerosol generating apparatus described above, The second load is the load that consumes the most power among the loads provided in the aerosol generator. Power supply unit for an aerosol generator.

[0161] According to (5), the charging IC does not need to discharge to the second load, which consumes the most power. Therefore, a cheaper and smaller charging IC can be used, enabling lower costs and miniaturization of the aerosol generation device.

[0162] (6) A power supply unit for an aerosol generating apparatus as described in any of (1) to (5), The discharge path is the output voltage of the power supply (power supply voltage V BAT Includes a boost converter (boost DC / DC converter 9) capable of boosting the voltage of the second load and applying it to the second load, Power supply unit for an aerosol generator.

[0163] According to (6), the operating efficiency of the second load is improved, and the boosted or boosted high power does not need to be passed through the charging IC, thereby reducing the cost and size of the aerosol generator while increasing the effect of the second load.

[0164] (7) (6) The power supply unit for the aerosol generating apparatus described above, The discharge path includes a third load (protection IC 10) connected to a node between the power supply and the boost converter, and operated by power supplied from the node, Power supply unit for an aerosol generator.

[0165] According to (7), the existence of a discharge path that discharges to the third load without going through a charging IC eliminates the need for an expensive and large-scale charging IC capable of withstanding high currents. This makes it possible to reduce the cost and miniaturize the aerosol generation device.

[0166] (8) (7) The power supply unit for the aerosol generating apparatus described above, The power connector to which the aforementioned power supply is connected, The first board (MCU-equipped board 161), The system comprises a second substrate (receptacle-mounted substrate 162) separate from the first substrate, The charging IC is provided on the first substrate, The discharge path and the third load are provided on the second substrate. Power supply unit for an aerosol generator.

[0167] According to (8), the discharge route that does not go through the charging IC is consolidated onto a single substrate. This suppresses the complexity of the circuit on the substrate, enabling lower costs and miniaturization of the aerosol generation device.

[0168] (9) A power supply unit for an aerosol generating apparatus as described in any of (1) to (8), The system includes a voltage converter (step-up / step-down DC / DC converter 8) connected between the output terminal and the first load, configured to output a constant voltage. Power supply unit for an aerosol generator.

[0169] According to (9), a constant voltage can be supplied to the first load, so the operation of the first load becomes stable.

[0170] (10) (9) The power supply unit of the aerosol generating apparatus described above, The charging IC can supply power input to the input terminal to the first load via the output terminal (V USB (Power Pass function) The aforementioned voltage converter is When the power input from the charging terminal is output from the output terminal (V BAT (When the power pass function is enabled), the voltage input from the charging IC is increased or decreased to output the constant voltage. When the power input from the input terminal is output from the output terminal (V USB When the power pass function is enabled, the device is configured to step down the voltage input from the charging IC and output the constant voltage. Power supply unit for an aerosol generator.

[0171] According to (10), whether an external power supply or a power supply is used, a constant voltage is supplied to the first load, so the operation of the first load is stable.

[0172] Although various embodiments have been described above with reference to the drawings, it goes without saying that the present invention is not limited to these examples. It is clear to those skilled in the art that various modifications or alterations can be conceived within the scope of the claims, and these will naturally also fall within the technical scope of the present invention. Furthermore, the components of the above embodiments may be combined in any way without departing from the spirit of the invention.

[0173] This application is based on Japanese Patent Application No. 2021-079870 filed on May 10, 2021, and its contents are incorporated herein by reference. [Explanation of Symbols]

[0174] 100 Aspirator 1 MCU HTR Heater BAT power supply Cn Heater Connector RCP Receptacle 2 Charging IC L1~L8 LED

Claims

1. A suction device that generates an aerosol by heating a rod containing an aerosol source, A heating section for heating the aforementioned rod, Power supply and Circuit board and The heating unit, the power supply, and the case housing the circuit board, A connector that can be electrically connected to an external power supply, A first load configured to control heating by the heating unit, A charging IC comprising a first terminal electrically connected to the connector and receiving power supplied from the external power supply, a second terminal electrically connected to the power supply, and a third terminal electrically connected to the first load, the charging IC being mounted on the circuit board, A first discharge path that supplies power from the power source to the heating section without going through the charging IC, The system includes a second discharge path that supplies power from the power source to the first load via the charging IC, The circuit board includes a plurality of circuit boards that are electrically connected to each other. Aspirator.

2. A suction device according to claim 1, The charging IC is configured to convert the power input to the first terminal and output it from the second terminal, in the suction device.

3. A suction device according to claim 1 or 2, A suction device comprising a third discharge path that supplies power supplied from the external power source to the first load via the charging IC.

4. A suction device according to any one of claims 1 to 3, The charging IC is configured to acquire the charging current and / or charging voltage of the power supply and to control the power supply based on the charging current and / or charging voltage, in a suction device.

5. A suction device according to any one of claims 1 to 4, A suction device in which the first load and the heating unit operate simultaneously.

6. A suction device according to any one of claims 1 to 5, A suction device in which the power consumption of the first load is less than the power consumption of the heating unit.

7. A suction device according to claim 6, The heating unit is the suction device that consumes the most power among the loads provided in the suction device.

8. A suction device according to any one of claims 1 to 7, The first discharge path is a suction device configured to boost the output voltage of the power supply and apply it to the heating section.

9. A suction device according to any one of claims 1 to 8, A suction device comprising a voltage converter connected between the third terminal and the first load and configured to output a constant voltage.

10. A suction device according to claim 9, The voltage converter is configured to step down the voltage input from the charging IC and output the constant voltage, and is a suction device.

11. A suction device according to any one of claims 1 to 10, The first load is a suction device, which is an MCU.

12. A suction device according to any one of claims 1 to 11, The heating unit is a suction device composed of an induction heating coil and a susceptor working together.

13. A suction device according to any one of claims 1 to 12, The circuit board includes a first board and a second board arranged parallel to each other, and is a suction device.

14. A suction device according to any one of claims 1 to 12, The circuit board includes a second board equipped with a heating unit connector connected to the heating unit, The first discharge path is a suction device provided on the second substrate.

15. A suction device according to claim 14, The circuit board further includes a first board that is different from the second board, The first load is a suction device provided on the first substrate.

16. A suction device according to claim 15, The first discharge path is a suction device that is not provided on the first substrate.

17. A suction device according to claim 15 or 16, A suction device in which the first substrate and the second substrate are arranged parallel to each other.

18. A suction device according to any one of claims 1 to 17, It includes a notification unit that includes a light-emitting element, A suction device in which power is supplied from the power source to the notification unit via the charging IC.

19. A suction device according to any one of claims 1 to 18, A suction device comprising the heating element and a support element for supporting the circuit board.

20. A suction device according to claim 19, The support portion is provided with a heating portion housing area for housing the heating portion on one end in the first direction, and a circuit board housing area for housing the circuit board on the other end in the first direction, wherein the support portion is provided with a circuit board housing area for housing the circuit board.

21. A suction device according to claim 20, The support portion is provided with a power supply housing area for housing the power supply on one end of a second direction perpendicular to the first direction, in the suction device.

22. A suction device according to claim 21, The power supply housing area is partitioned and formed from one end to the other in the first direction, in the suction device.

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