Colorimetric device

Abstract

To solve the problem that in a color measuring device, heat generation tends to be remarkable in a light emitting unit and a light receiving unit, and a local temperature rise inside the device may adversely affect a color measurement result or the like.SOLUTION: A color measuring device comprises: an incident light processing unit that processes light incident through an opening; a light emitting part that emits light toward a measurement target; a first circuit board provided with the incident light processing unit; and a second circuit board provided with the light emitting part; and a frame assembly made of a metal material and provided with the first circuit board and the second circuit board. The frame assembly comprises a mainframe that forms the basis of the device, a first subframe that holds the first circuit board, and a second subframe that holds the second circuit board. The first and second subframes come into direct or indirect contact with the mainframe.SELECTED DRAWING: Figure 17

Description

Technical Field

[0001] The present invention relates to a color measurement device that performs color measurement based on light received from a measurement target.

Background Art

[0002] Conventionally, a color measurement device that performs color measurement based on light received from a measurement target has been known. For example, in a color measurement device, light received from a measurement target is made to enter a spectroscopic filter, a predetermined wavelength component is extracted by the spectroscopic filter, and the light is received by a photodiode, and color measurement is performed by detecting the voltage output from the photodiode. In Patent Document 1, an example of such a color measurement device is disclosed as an optical property measurement device.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In the above-described color measurement device, heat generation is likely to be significant in the light emitting unit, the light receiving unit, and the substrates that support them, and there is a risk that the local temperature inside the device rises, which may have an adverse effect on the color measurement result and the like.

Means for Solving the Problems

[0005] To solve the above problems, the colorimeter of the present invention comprises an opening formed in an opening-forming member located on the bottom surface of the apparatus for taking in light from a target to be measured into the apparatus; an incident light processing unit for processing the light incident through the opening; a light-emitting unit for emitting light toward the target to be measured; a first circuit board on which the incident light processing unit is provided; a second circuit board on which the light-emitting unit is provided; and a frame assembly made of a metal material that includes the first circuit board and the second circuit board, wherein the frame assembly comprises a main frame that forms the base of the apparatus; a first subframe that holds the first circuit board; and a second subframe that holds the second circuit board, and the first subframe and the second subframe are in direct or indirect contact with the main frame. [Brief explanation of the drawing]

[0006] [Figure 1] A block diagram showing the functions of a colorimeter. [Figure 2] Cross-sectional view of an optical filter device. [Figure 3] A perspective view of the colorimeter from above. [Figure 4] A perspective view of the colorimeter from below. [Figure 5] A top-down view of the colorimeter. [Figure 6] A plan view of the colorimeter, seen from below. [Figure 7] Perspective view of the main assembly. [Figure 8] A perspective view showing the arrangement of each circuit board and battery from above. [Figure 9] A perspective view showing the arrangement of each circuit board and battery from below. [Figure 10] The upper diagram is a perspective view showing the top surface of the panel substrate, and the lower diagram is a perspective view showing the bottom surface of the panel substrate. [Figure 11] The top diagram is a perspective view showing the top surface of the battery control board, and the bottom diagram is a perspective view showing the bottom surface of the battery control board. [Figure 12] The upper diagram is a perspective view showing the top surface of the light-receiving substrate, and the lower diagram is a perspective view showing the bottom surface of the light-receiving substrate. [Figure 13] The upper figure is a perspective view showing the upper surface of the light-emitting unit substrate, and the lower figure is a perspective view showing the lower surface of the light-emitting unit substrate. [Figure 14] Perspective view of the frame assembly seen from above. [Figure 15] Perspective view of the frame assembly seen from below. [Figure 16] Perspective view of the frame assembly seen from above. [Figure 17] Exploded perspective view of the frame assembly. [Figure 18] Perspective view of the main frame seen from above. [Figure 19] Cross-sectional view of the light-receiving unit substrate holding frame and the light-emitting unit substrate holding frame cut in the Y-Z plane. [Figure 20] Cross-sectional view taken along line A-A in FIG. 5. [Figure 21] Cross-sectional view taken along line B-B in FIG. 5. [Figure 22] Cross-sectional view taken along line C-C in FIG. 5. [Figure 23] Plan view of the color measuring device seen from above. [Figure 24] Plan view of the color measuring device seen from above. [Figure 25] Side view of the color measuring device. [Figure 26] Plan view of the color measuring device seen from above. [Figure 27] Plan view of the color measuring device seen from above. [Figure 28] Plan view of the color measuring device seen from above. [Figure 29] Plan view of the color measuring device seen from above. [Figure 30] Perspective view of the color measuring device with the bottom housing removed, seen from below, with the shutter unit in the closed position. [Figure 31] Perspective view of the color measuring device with the bottom housing removed, seen from below, with the shutter unit in the open position. [Figure 32] Perspective view of the color measuring device with the bottom housing removed, seen from below, with the shutter unit in the closed position. [Figure 33]This is a perspective view of a colorimeter with the bottom housing removed, seen from below, with the shutter unit in the open position. [Figure 34] This diagram corresponds to a portion of the DD cross-section in Figure 6, showing the shutter unit in the closed position. [Figure 35] These diagrams correspond to a portion of the EE cross-section in Figure 6, with the upper diagram showing the shutter unit in the closed position and the lower diagram showing the shutter unit in the open position. [Figure 36] This diagram corresponds to a part of the DD cross-section in Figure 6, omitting the bottom housing and showing the state where the shutter unit is in the -Y direction from the closed position. [Figure 37] This diagram corresponds to a portion of the DD cross-section in Figure 6, omitting the bottom housing and showing the shutter unit in the open position. [Figure 38] Side view of the shutter retaining member. [Figure 39] A partially enlarged perspective view of the shutter component. [Figure 40] Perspective view of the shutter retaining member and leaf spring. [Figure 41] This diagram corresponds to a portion of the EE cross-section in Figure 6, and shows the shutter unit in the closed position. [Figure 42] This diagram corresponds to a portion of the EE cross-section in Figure 6, and shows the state where the shutter unit is in the -Y direction from the closed position. [Figure 43] A magnified perspective view of a portion of the shutter unit. [Figure 44] This diagram corresponds to a portion of the GG cross-section in Figure 5, and shows the shutter unit in the open position. [Figure 45] This diagram corresponds to a portion of the GG cross-section in Figure 5, and shows the shutter unit in the closed position. [Figure 46] A schematic diagram showing the relationship between the operating area of ​​the shutter unit and the detection area of ​​the shutter detection unit. [Figure 47]A diagram showing another embodiment of the shutter unit, the diagram showing the shutter unit in the closed position. [Figure 48] A diagram showing another embodiment of the shutter unit, the diagram showing the shutter unit in the open position. [Figure 49] A diagram showing another embodiment of the shutter unit, the diagram showing the shutter unit in the closed position. [Figure 50] A diagram showing another embodiment of the shutter unit, the diagram showing the shutter unit in the open position. [Figure 51] A flowchart illustrating the processing steps taken by the control unit when it receives a power-off command. [Figure 52] A flowchart showing the processing steps of the control unit when acquiring a reference value. [Figure 53] A flowchart showing the processing steps of the control unit when performing color measurement. [Modes for carrying out the invention]

[0007] The present invention will be described in general terms below. The colorimeter according to the first embodiment comprises an opening formed in an opening-forming member disposed on the bottom surface of the apparatus for taking in light arriving from a target to be measured into the apparatus; an incident light processing unit for processing the light incident through the opening; a light-emitting unit for emitting light toward the target to be measured; a first circuit board on which the incident light processing unit is provided; a second circuit board on which the light-emitting unit is provided; and a frame assembly made of a metal material that includes the first circuit board and the second circuit board, wherein the frame assembly comprises a main frame that forms the base of the apparatus; a first subframe that holds the first circuit board; and a second subframe that holds the second circuit board, wherein the first subframe and the second subframe are in direct or indirect contact with the main frame.

[0008] According to this embodiment, the frame assembly formed of a metal material comprises a main frame, a first subframe, and a second frame. The first subframe, which holds the first circuit board, and the second subframe, which holds the second circuit board, are in direct or indirect contact with the main frame, which forms the base of the device. As a result, the heat generated in the first and second circuit boards is transferred to the entire frame assembly. This suppresses localized temperature increases inside the device, thereby preventing adverse effects on colorimetric results and the like.

[0009] The second embodiment is characterized in that, in the first embodiment, the main frame has plate portions extending in a first direction which intersects with respect to the bottom surface and the top surface which is the surface opposite to the bottom surface, and in a second direction which intersects with respect to the first direction and is the longitudinal direction of the device when viewed from the first direction. According to this embodiment, the main frame having the plate portion increases the surface area and improves heat dissipation efficiency.

[0010] A third aspect is characterized in that, in the second aspect, the incident light processing unit and the light-emitting unit are equipped with a battery that supplies power to them, and the frame assembly is equipped with a battery holding portion that surrounds the battery.

[0011] According to this embodiment, the frame assembly includes a battery holding portion that surrounds the battery, so that the heat generated from the battery is transferred to the battery holding portion and efficiently dissipated through the main frame.

[0012] A fourth aspect is characterized in that, in the third aspect, the battery holding portion comprises a first wall portion that supports the battery from below, a second wall portion that faces the first wall portion and forms the upper wall portion of the battery holding portion, and a third wall portion and a fourth wall portion that are positioned on either side of the battery in a third direction that intersects the second direction and is the short-side direction of the device when viewed from the first direction. According to this embodiment, the heat generated from the battery is efficiently dissipated by the first wall, the second wall, the third wall, and the fourth wall.

[0013] A fifth embodiment is characterized in that, in the third or fourth embodiment, it comprises a third circuit board located on the upper surface and to which a display unit for displaying various information is connected, and a fourth circuit board to which the battery is connected, wherein the second circuit board, the first circuit board, the fourth circuit board, the battery, and the third circuit board are arranged in a superposition in the first direction from the bottom surface toward the top surface.

[0014] According to this embodiment, the second circuit board, the first circuit board, the fourth circuit board, the battery, and the third circuit board are arranged in a superimposed manner from the bottom surface to the top surface in the first direction, so that the dimensions of the device in the direction intersecting the first direction can be suppressed.

[0015] The sixth aspect is characterized in that, in the fifth aspect, the third circuit board and the fourth circuit board are in direct or indirect contact with the main frame. According to this embodiment, the third circuit board and the fourth circuit board are in direct or indirect contact with the main frame, so that the heat generated from the third circuit board and the fourth circuit board is transferred to the main frame and dissipated effectively.

[0016] The seventh aspect is characterized in that, in any of the first to sixth aspects, the incident light processing unit comprises a wavelength-tunable optical filter that transmits a predetermined wavelength component of the incident light, and a light receiving unit that receives the light transmitted through the optical filter. According to this embodiment, in a configuration in which the incident light processing unit comprises a wavelength-tunable optical filter that transmits a predetermined wavelength component of the incident light and a light-receiving unit that receives the light transmitted through the optical filter, any of the effects of the first to sixth embodiments described above can be obtained.

[0017] The eighth aspect is characterized in that, in the seventh aspect, the optical filter is a Fabry-Perot etalone. According to this embodiment, the effects and advantages of the seventh embodiment described above can be obtained when the optical filter is a Fabry-Perot etalone.

[0018] The present invention will be described in detail below. Note that the XYZ coordinate system shown in each figure is a Cartesian coordinate system, where the XY plane is the horizontal plane and the YZ plane is the vertical plane. Furthermore, the Z-axis direction is the vertical direction and is an example of a first direction that intersects the upper surface 50e and the bottom surface 50f of the colorimeter 1. Furthermore, the Y-axis direction is the direction perpendicular to the first direction, i.e., the vertical direction, and is an example of a second direction that is the longitudinal direction when viewing the colorimeter 1 from the vertical direction. Furthermore, the X-axis direction is the direction perpendicular to the Y-axis direction and is an example of a third direction that is the short direction when viewing the colorimeter 1 from the vertical direction. In this specification, the configuration of the colorimeter 1 is described as having a base surface 50f that is placed on a mounting surface parallel to the horizontal plane, and the longitudinal direction of the colorimeter 1 is aligned with the Y-axis direction.

[0019] [Overall configuration of colorimeter 1] First, the overall configuration of the colorimeter 1 according to this embodiment will be described with reference to Figures 1 and 2. The colorimeter 1 is configured to measure color based on light received from the object to be measured 200. The light received from the object to be measured 200 includes light reflected by the object to be measured 200 and light emitted by the object to be measured 200 itself. The colorimeter 1 comprises a bandpass filter 7, an optical filter device 3, a light receiving unit 4, a capacitance detection unit 6, a light emitting unit 9, an MCU (Micro Controller Unit) 10, a wired IF (Interface) 12, a wireless communication unit 13, an operation unit 14, a display unit 15, a battery control unit 16, and a battery 17. Furthermore, the bandpass filter 7, the optical filter device 3, and the light receiving unit 4 constitute an incident light processing unit 2 that processes the light that arrives from the object to be measured 200 and is incident on it.

[0020] The bandpass filter 7 transmits light in the visible light range, for example, 380 nm to 720 nm, from the light that arrives and is incident on the object to be measured 200, while cutting out light in the ultraviolet and infrared ranges. As a result, only visible light enters the optical filter device 3. The light that arrives on the bandpass filter 7 from the object to be measured 200 reaches the bandpass filter 7 via the aperture 21a and the measurement window 87a (see Figure 20), which will be described later.

[0021] The optical filter device 3 selectively transmits arbitrary wavelength components from the visible light that has passed through the bandpass filter 7. The light transmitted through the optical filter device 3 is incident on a photodiode 4a (see Figure 20), which is an example of a light-receiving element, and is processed by a light-receiving unit 4 equipped with the photodiode 4a. The light-receiving unit 4 converts the intensity of the received light into a voltage value, and further converts that voltage value into a digital signal and outputs it to the MCU 10. The colorimeter 1 can measure the spectrum of the object to be measured 200 by repeatedly performing wavelength selection by the optical filter device 3 and acquisition of the received light intensity using the light-receiving unit 4.

[0022] The configuration of the optical filter device 3 will now be described with reference to Figure 2. In this embodiment, the optical filter device 3 is a wavelength-tunable Fabry-Perot etalon that transmits a predetermined wavelength component of the light that arrives and is incident on the object to be measured 200, and is a wavelength filter that utilizes the multiple interference of two opposing reflective surfaces. In Figure 2, the optical filter device 3 includes a tunable interference filter 45, which is housed inside an exterior composed of a first glass member 30, a second glass member 31, and a case 32.

[0023] The case 32 and the first glass member 30, and the case 32 and the second glass member 31 are joined by a bonding member 33 such as low-melting-point glass or epoxy resin. The tunable interference filter 45 and the case 32 are fixed together by a fixing material 34 such as adhesive. The electrodes 36 on the outer surface of the case 32 and the tunable interference filter 45 are electrically connected by wire bonding 35 and wiring inside the case 32.

[0024] The tunable interference filter 45 comprises a base substrate 37 and a diaphragm substrate 38. The base substrate 37 and the diaphragm substrate 38 are joined together by a bonding film 43. A mirror 39 is deposited on the base substrate 37 and the diaphragm substrate 38, respectively. The opposing mirrors 39 have their outermost surfaces made of a conductor. The capacitance between the opposing mirrors 39 is detected by the capacitance detection unit 6 (see Figure 1). The capacitance detection unit 6 consists of a CV (Capacitance to Voltage) converter, which converts the detected capacitance into a voltage value, then into a digital value, and transmits it to the MCU 10. The distance between the two opposing mirrors 39 is controlled by an electrostatic actuator consisting of a fixed electrode 40 and a movable electrode 41 that are concentrically formed when viewed from the Z-axis direction.

[0025] When a voltage is applied between the opposing fixed electrode 40 and movable electrode 41, an attractive force is generated between the fixed electrode 40 and the movable electrode 41 due to electrostatic force. At this time, the concentrically formed diaphragm portion 42 deforms, causing the mirror 39 of the diaphragm substrate 38 to be pulled towards the base substrate 37, thereby controlling the distance between the opposing mirrors 39. Then, the wavelength of light transmitted through the tunable interference filter 45 is selected in accordance with the distance between the opposing mirrors 39.

[0026] During spectroscopic measurement, light from the object to be measured 200 is incident on the optical filter device 3 from the second glass member 31 side to the first glass member 30 side along the optical axis CL. The optical axis CL is parallel to the Z-axis direction and is a line that passes through the centers of the aperture 21a (see Figure 20), the measurement window 87a (see Figure 20), the tunable interference filter 45, and the photodiode 4a (see Figure 20). In particular, the aperture 21a, the measurement window 87a, and the tunable interference filter 45 (see Figure 2) are circular when viewed from the Z-axis direction, and the optical axis CL passes through their centers. The optical axis CL may also be referred to as the center position CL below. The light incident on the optical filter device 3 interferes between the opposing mirrors 39, and the light of a wavelength selected according to the distance between the opposing mirrors 39 passes through the tunable interference filter 45. The light that has passed through the tunable interference filter 45 passes through the first glass member 30 and heads towards the light receiving unit 4. The above describes the configuration of the optical filter device 3.

[0027] Returning to Figure 1, the MCU10 is a microprocessor-based control device that incorporates a memory containing various programs and data necessary for controlling the colorimeter 1. The MCU10 sends control information necessary for driving the electrostatic actuator, which is configured with a fixed electrode 40 and a movable electrode 41 facing each other as explained with reference to Figure 2, to an amplifier (not shown), and this amplifier supplies a predetermined drive voltage to the optical filter device 3. The MPU10 then compares the information related to the voltage value output from the capacitance detection unit 6 with the stored value and performs feedback control of the optical filter device 3 based on this comparison.

[0028] The light-emitting unit 9 emits light for measurement toward the object to be measured 200. The light-emitting unit 9 is composed of multiple light-emitting elements with different wavelength distributions, specifically multiple LEDs. The MCU 10 controls the on / off state of the light-emitting unit 9.

[0029] The wired IF12 and wireless communication unit 13 are components for communicating with external devices. For communication via the wired IF12, the standard USB (Universal Serial Bus) can be used as an example. Similarly, the standard for the wireless communication unit 13 can be Bluetooth. USB and Bluetooth are registered trademarks. The MCU 10 sends various data to and receives various data from external devices via the wired IF12 or wireless communication unit 13. The colorimeter 1 can also charge its battery 17 by receiving power from an external device via the wired IF12.

[0030] The control unit 14 consists of a power button and various operation setting buttons, and sends signals to the MCU 10 according to the operation. The control unit 14 will be explained further later. The display unit 15 is, for example, composed of a liquid crystal panel and displays various information such as a user interface for setting color measurement conditions and color measurement results based on signals sent from the MCU 10. The magnetic sensor 128, which sends a detection signal to the MCU 10, is a sensor for detecting the position of the shutter unit 110, which will be described later. The magnetic sensor 128 will be explained in more detail later.

[0031] In this embodiment, the battery 17 is a lithium-ion secondary battery and supplies power to each component in the colorimeter 1 that requires power. The components that receive power from the battery 17 include the incident light processing unit 2, which will be described later. The battery control unit 16 performs various controls, such as charging control of the battery 17.

[0032] [External configuration of colorimeter 1] Next, the external configuration of the colorimeter 1 will be described with reference to Figures 3, 4, 5, and 6. The main body 50 of the colorimeter 1 is configured such that its outer casing as a whole is box-shaped, consisting of a main casing 51, an upper casing 52, and a bottom casing 53. In this embodiment, the main casing 51, upper casing 52, and bottom casing 53 are made of resin material. In each figure, reference numeral 50a indicates the side of the device body 50 in the +Y direction, and will be referred to as the front 50a below. Reference numeral 50b (see Figure 6) indicates the side of the device body 50 in the +X direction, and will be referred to as the right side 50b below. Reference numeral 50c indicates the side of the device body 50 in the -X direction, and will be referred to as the left side 50c below. Reference numeral 50d indicates the side of the device body 50 in the -Y direction, and will be referred to as the rear 50d below. In this specification, the terms "up," "down," "left," and "right" are used based on the direction as viewed from the user when the user of the colorimeter 1 is holding and using the colorimeter 1 as shown in Figure 27.

[0033] In Figures 3 to 6, the front surface 50a is formed by the front wall portion 51a of the main housing 51, the right side surface 50b is formed by the right wall portion 51b of the main housing 51, the left side surface 50c is formed by the left wall portion 51c of the main housing 51, and the rear surface 50d is formed by the rear wall portion 51d of the main housing 51. Reference numeral 50e indicates the surface of the device body 50 in the +Z direction, and will be referred to as the top surface 50e below. Reference numeral 50f indicates the surface of the device body 50 in the -Z direction, and will be referred to as the bottom surface 50f below.

[0034] The operating unit 14 and the display unit 15 are arranged along the Y-axis on the upper surface 50e of the main body 50 of the device. The control unit 14 is comprised of a power button 55, a select button 54, a back button 56, and a directional pad 60. The directional pad 60 consists of an up button 61, a down button 62, a left button 63, and a right button 64. In this embodiment, all the operation buttons of the colorimeter 1 are located on the top surface 50e and are integrated into the control unit 14.

[0035] The power button 55 is used to turn the power of the colorimeter 1 on and off. The confirmation button 54 is used to confirm the various settings displayed on the display unit 15, that is, to determine the colorimeter conditions, and also to execute the colorimeter. The confirmation button 54 has a perfect circle shape when viewed from the Z-axis direction. The back button 56 is a button used to return to the previous state in the user interface displayed on the display unit 15, and also a button used to cancel the execution of an operation.

[0036] The cross buttons 60 are buttons used to select various items in the user interface displayed on the display unit 15. The surface of the upper button 61 has a vertical line 58a parallel to the Y-axis direction, and the surface of the lower button 62 has a vertical line 58b parallel to the Y-axis direction. The vertical lines 58a and 58b are positioned so that when extended in the Y-axis direction, they pass through the center position CL. Furthermore, the surface of the left button 63 has a horizontal line 58c parallel to the X-axis direction, and the surface of the right button 64 has a horizontal line 58d parallel to the X-axis direction. The horizontal lines 58c and 58d are positioned so that when extended in the X-axis direction, they pass through the center position CL.

[0037] The display unit 15 displays various information, such as color measurement results. In this embodiment, the display unit 15 is composed of a liquid crystal display (LCD) 67 (see also Figure 8). Hereinafter, the liquid crystal display 67 will be abbreviated as LCD67. A transparent display unit cover 57 is provided on the upper part of the LCD67, and this display unit cover 57 forms a part of the upper surface 50e. In this embodiment, as shown in Figure 20, there is almost no step between the upper surface of the display cover 57 and the upper surface of the operation unit 14, so that the upper surface 50e is a flat surface with almost no step. However, the upper surface of the select button 54 is slightly recessed, as shown in Figure 20, and is shaped to fit comfortably in the fingertip of the user pressing the select button 54, as shown in Figure 27.

[0038] A shutter unit 110 is provided on the bottom surface 50f, as shown in Figures 4 and 6. Figure 4 shows the shutter unit 110 in the closed position, and Figure 6 shows the shutter unit 110 in the open position. The shutter unit 110 can be displaced between the closed position and the open position by sliding along the Y-axis. The shutter unit 110 is also provided so as to be able to hold both the closed position and the open position. The shutter unit 110 is composed of a shutter holding member 111 and a link member 113, which will be described in more detail later. The shutter holding member 111 has a plurality of ribs 111a on its surface. The user can slide the shutter unit 110 in the Y-axis direction by placing their fingertips on the ribs 111a.

[0039] By opening the shutter unit 110, the opening 21a and the measuring window 87a are exposed as shown in Figure 6. The opening 21a and the measuring window 87a are located at the bottom surface 50f of the device. Here, "opening" refers to an opening that allows light to enter, and it is acceptable for a transparent glass plate, for example, to be provided. As shown in Figure 20, the opening 21a is formed in the opening-forming member 21, and the measurement window 87a is formed in the light-gathering member 87 located in the +Z direction relative to the opening-forming member 21. The measurement light emitted from the light-emitting unit 9 passes between the light-gathering member 87 and the opening-forming member 21, as indicated by the arrow inside the opening 21a in Figure 20, and is emitted from the opening 21a toward the object to be measured 200. The light arriving from the object to be measured 200 is then taken into the device through the opening 21a and further enters the incident light processing unit 2 through the measurement window 87a.

[0040] As shown in Figures 5 and 6, the center position CL coincides with the center position of the opening 21a and the measurement window 87a. Line VCL is a straight line parallel to the Y-axis direction and passes through the center position CL when viewed from the Z-axis direction. Line HCL is a straight line parallel to the Y-axis direction and passes through the center position CL when viewed from the Z-axis direction. In this embodiment, the center position CL coincides with the center position of the confirmation button 54 in the XY plane, and also coincides with the center position of the cross button 60. The power button 55 and the back button 56 are arranged symmetrically with respect to the straight line VCL, as shown in Figure 5.

[0041] Next, as shown in Figure 3, a wired IF12 is provided on the front surface 50a of the device body 50. Also, as shown in Figure 4, an opening 50m is formed on the rear surface 50d of the device body 50, and a reset switch 71 (see Figures 9 and 20) is provided at the back of the opening 50m. The reset switch 71 is a switch used to return the various settings of the colorimeter 1 to their initial state. Furthermore, two openings 50n are formed at the -Z direction relative to the opening 50m, and a strap (not shown) is passed through these two openings 50n so that the user can easily carry the colorimeter 1.

[0042] As shown in Figures 3, 4, 21, and 22, gripping portions 50g are formed on the right side 50b and left side 50c of the main body 50 of the device. The gripping portions 50g are composed of recesses 51g formed on the right wall portion 51b and the left wall portion 51c of the main housing 51, respectively. The recesses 51g are formed by curved surfaces that move toward the center of the main body 50 in the X-axis direction as they move toward the -Z direction. The presence of a gripping portion 50g allows the user to easily and securely grip the device body 50.

[0043] [Circuit board configuration of colorimeter 1] Next, we will explain the circuit board configuration of the colorimeter 1. The main body assembly 1a shown in Figure 7 is an assembly body provided inside the main housing 51, and is constructed by assembling multiple circuit boards and the like to a frame assembly 100, which is an assembly of multiple frames. As shown in Figures 7, 8, and 9, the multiple circuit boards consist of a panel board 65 as the "third circuit board," a battery control board 70 as the "fourth circuit board," a light-receiving board 80 as the "first circuit board," and a light-emitting board 85 as the "second circuit board." These multiple circuit boards are arranged to overlap with a gap between them along the Z-axis. The battery 17 is positioned between the panel board 65 and the battery control board 70 in the Z-axis direction.

[0044] The configuration of each circuit board will be explained below with reference to Figures 10 to 13 and other figures as appropriate. In the following, the +Z-direction surface of each circuit board will be referred to as the "top surface," and the -Z-direction surface as the "bottom surface." Also, some electronic components mounted on the boards are omitted from the illustration in Figures 10 to 13. The panel substrate 65 has an LCD connection section 66 on its upper surface, as shown in the upper diagram of Figure 10. Furthermore, as shown in Figure 20, the LCD 67 is connected to the LCD connection part 66 by cable 67a.

[0045] In the upper diagram of Figure 10, contacts for detecting the pressing of each operation button are provided on the upper surface of the panel substrate 65 at positions corresponding to each operation button that constitutes the operation unit 14 described above. Reference numeral 54a indicates a contact provided at the position corresponding to the select button 54. Reference numeral 54a indicates a contact provided at the position corresponding to the select button 54. Reference numerals 61a, 62a, 63a, and 64a are contacts provided at positions corresponding to the up button 61, down button 62, left button 63, and right button 64 (see Figure 1, etc.), respectively. Reference numerals 55a and 56a are contacts provided at positions corresponding to the power button 55 and back button 56, respectively.

[0046] As shown in the lower part of Figure 10, a first board connection connector 68 is provided on the lower surface of the panel substrate 65. The first board connection connector 68 and the fourth board connection connector 83 shown in the lower part of Figure 12 are connected by an FFC (Flexible Flat Cable) 90 as shown in Figure 9, thereby connecting the panel substrate 65 to the light receiving unit substrate 80, which will be described later. Furthermore, as shown in the lower part of Figure 10, a wireless communication unit 13, which is a communication module, is provided on the lower surface of the panel substrate 65.

[0047] Next, the battery control board 70 will be described with reference to Figure 11. The battery control board 70 implements the functions of the battery control unit 16 (see Figure 1). As shown in the upper part of Figure 11, the battery control board 70 has a reset switch 71, a wired IF 12, a first battery connector 72, and a second battery connector 73 on its top surface. A battery control circuit, which is not shown in Figure 11, is provided on the top surface of the battery control board 70. The first battery connector 72 is connected to the battery 17 by a first battery cable 92 as shown in Figure 8, and the second battery connector 73 is connected to the battery 17 by a second battery cable 93 as shown in Figure 8.

[0048] The battery control board 70 is equipped with a second board connection connector 74, as shown in the lower diagram of Figure 11. The battery control board 70 and the light receiving board 80 are connected by mating the second board connection connector 74 with the third board connection connector 82, as shown in the upper diagram of Figure 12. This allows power from the battery 17 to be supplied to each circuit board via the light-receiving board 80.

[0049] Next, the light-receiving substrate 80 will be described with reference to Figure 12. The light-receiving substrate 80 has a PD (Photo Diode) substrate 5 on its upper surface and the third substrate connection connector 82 described above. The PD substrate 5 has a photodiode 4a on its lower surface, as shown in Figure 20. The PD substrate 5 is a circuit board that constitutes the light-receiving unit 4 (see Figure 1). In other words, the PD substrate 5 constitutes the incident light processing unit 2 (see Figure 1) that processes the incident light. The light-receiving substrate 80 is equipped with an optical filter device 3, a fourth substrate connector 83, and a fifth substrate connector 84 on its lower surface. The fifth substrate connector 84 and the sixth substrate connector 88, shown in the lower diagram of Figure 13, are connected by a connecting cable 91 as shown in Figure 9, thereby connecting the light-receiving substrate 80 to the light-emitting substrate 85, which will be described later.

[0050] Furthermore, the light-receiving substrate 80 is provided with electronic components that are not shown in Figure 11. These electronic components, which are not shown in Figure 11, include the MCU 10 (see Figure 1), a CV converter that constitutes the capacitance detection unit 6 (see Figure 1), a DC / DC converter that converts the voltage of the battery 17, an amplifier that adjusts the output from this DC / DC converter under the control of the MCU 10 and supplies it to the optical filter device 3, and a temperature sensor for detecting the temperature around the optical filter device 3.

[0051] Furthermore, as shown in Figure 11, a shielding sheet 29 is provided so as to surround the PD substrate 5 and the optical filter device 3 on the light-receiving substrate 80 (see also Figure 7). This suppresses the intrusion of ambient light into the PD substrate 5 and the optical filter device 3.

[0052] Next, the light-emitting substrate 85 will be described with reference to Figure 13. The light-emitting substrate 85 is equipped with a light-collecting member 87 extending between its upper and lower surfaces. The light-collecting member 87 has the aforementioned measurement window portion 87a formed therein. As shown in the lower part of Figure 13, a sixth substrate connection connector 88 is provided on the lower surface of the light-emitting substrate 85, and a plurality of light-emitting elements 86 are provided around the light-collecting member 87. The plurality of light-emitting elements 86 are composed of light-emitting elements with different wavelength distributions. Furthermore, a light-shielding member 89 is provided around the light-emitting element 86, and the light-shielding member 89 suppresses the leakage of measurement light emitted from the light-emitting element 86.

[0053] [Frame Assembly Configuration] Next, the frame assembly 100 that constitutes the base of the device body 50 will be described. In Figures 14 to 17, the frame assembly 100 is composed of a main frame 101, a battery holding frame 102, a light-receiving substrate holding frame 103, and a bottom frame 105. In this embodiment, all frames are formed by bending a metal material, and more specifically, aluminum is used as the material. Note that each frame can also be manufactured by die-casting or the like instead of bending a metal material.

[0054] The following describes each frame in turn. The main frame 101 is the frame that forms the base of the device body 50, and as shown in Figure 18, it has a main plate portion 101a that forms a wide frame surface in the Y-axis direction and the Z-axis direction, in other words, in the YZ plane. The main frame 101 also has a panel substrate support portion 101b that extends in the -X direction from the +Z direction end of the main plate portion 101a and forms a frame surface parallel to the XY plane. The panel substrate support portion 101b supports the panel substrate 65 from below, as shown in Figures 7 and 20. The panel substrate 65 is fixed to the panel substrate support portion 101b by screws (not shown). The panel substrate 65 is in surface contact with the panel substrate support portion 101b, thereby transferring heat from the panel substrate 65 to the panel substrate support portion 101b, i.e., the main frame 101.

[0055] As shown in Figure 18, at the -Z end of the main plate portion 101a, the +Y end is bent in the -X direction, and further the +Z end is bent in the -Y direction to form a battery control board support portion 101e parallel to the XY plane. Similarly, at the -Z end of the main plate portion 101a, the -Y end is bent in the -X direction, and further the +Z end is bent in the +Y direction to form a battery control board support portion 101e parallel to the XY plane.

[0056] The battery control board support 101e supports the battery control board 70 from below, as shown in Figures 7 and 20. The battery control board 70 is fixed to the battery control board support 101e by screws (not shown). The battery control board 70 is in surface contact with the battery control board support 101e, thereby transferring heat from the battery control board 70 to the battery control board support 101e, i.e., the main frame 101.

[0057] In Figures 14 to 18, a frame holding portion 101f is formed below the battery control board support portion 101e so as to be parallel to the XY plane. The frame holding portion 101f holds the light-emitting board holding frame 104 as shown in Figures 14 and 16. The light-emitting board holding frame 104 is fixed to the lower side of the frame holding portion 101f by screws (not shown). The light-emitting board holding frame 104 is in surface contact with the frame holding portion 101f. That is, the light-emitting board holding frame 104 is in direct contact with the main frame 101. As a result, heat from the light-emitting board holding frame 104 is transferred to the frame holding portion 101f, i.e., the main frame 101.

[0058] The light-emitting substrate holding frame 104 holds the light-emitting substrate 85 as shown in Figures 7 and 20. The light-emitting substrate holding frame 104 is an example of a second subframe that holds the light-emitting substrate 85. The light-emitting substrate 85 is fixed to the underside of the light-emitting substrate holding frame 104 by screws (not shown). The light-emitting substrate 85 is in surface contact with the light-emitting substrate holding frame 104, thereby transferring heat from the light-emitting substrate 85 to the light-emitting substrate holding frame 104, and subsequently to the main frame 101.

[0059] As shown in Figure 15, a bottom frame 105 is fixed to the lower surface of the light-emitting substrate holding frame 104 by screws (not shown). The bottom frame 105 is a frame for fixing one end of the torsion spring 117 (see Figure 32) that presses against the shutter unit 110 (see Figure 32), which will be explained in more detail later. The bottom frame 105 has a first plate portion 105a and a second plate portion 105b, with the second plate portion 105b in surface contact with the light-emitting substrate holding frame 104. This transfers heat from the light-emitting substrate holding frame 104 to the bottom frame 105. In other words, the bottom frame 105 functions as a heat sink that promotes heat dissipation from the light-emitting substrate holding frame 104.

[0060] In Figures 14 to 18, the main frame 101 has a subplate portion 101c that extends in the -Z direction from the -X direction end of the panel substrate support portion 101b and forms a frame surface parallel to the YZ plane. Here, the battery holding frame 102 is attached to the main frame 101. The subplate portion 101c and the panel substrate support portion 101b, when the battery holding frame 102 is attached, constitute a battery holding portion 100a that holds the battery 17 together with the battery holding frame 102.

[0061] The battery holding portion 100a will be described further below. The battery holding frame 102 has a battery support portion 102a that forms a frame surface parallel to the XY plane. As shown in Figure 20, the battery support portion 102a supports the battery 17 from below. The bottom surface of the battery 17 is in surface contact with the battery support portion 102a, thereby transferring heat from the battery 17 to the battery support portion 102a, i.e., the battery holding portion 100a.

[0062] In Figures 14 to 17, a first frame portion 102b, which forms a frame surface parallel to the YZ plane, rises in the +Z direction from the -X end of the battery support portion 102a. Also, a second frame portion 102c, which forms a frame surface parallel to the YZ plane, rises in the +Z direction from the +X end of the battery support portion 102a. The first frame portion 102b is positioned in the -X direction relative to the subplate portion 101c of the main frame 101 and is in surface contact with the subplate portion 101c. The second frame portion 102c is positioned in the -X direction relative to the mainplate portion 101a of the main frame 101 and is in surface contact with the mainplate portion 101a.

[0063] In this manner, the battery holding portion 100a is configured to surround the battery 17 with the battery holding frame 102, the panel substrate support portion 101b, and the subplate portion 101c. The battery support portion 102a is an example of a first wall portion that supports the battery 17 from below, and constitutes the battery holding portion 100a. The panel substrate support portion 101b is an example of a second wall portion that faces the battery support portion 102a, and constitutes the battery holding portion 100a. The subplate portion 101c is an example of a third wall portion located in the -X direction relative to the battery 17, and constitutes the battery holding portion 100a. The second frame portion 102c is an example of a fourth wall portion located in the +X direction relative to the battery 17, and constitutes the battery holding portion 100a.

[0064] Furthermore, as shown in Figures 7, 14, and 20, a restricting portion 101d is formed extending in the -Z direction from the +Y direction end of the panel substrate support portion 101b. The restricting portion 101d restricts the movement of the battery 17 in the +Y direction, as shown in Figures 7 and 20. As shown in Figure 20, an elastic material 28 is provided between the restricting portion 101d and the first end portion 17a, which is the +Y end of the battery 17. The elastic material 28 is also provided between the upper surface of the battery 17 and the panel substrate support portion 101b, as shown in Figure 20.

[0065] Next, as shown in Figures 14 and 16, the light-receiving substrate holding frame 103 has a base portion 103b that forms a frame surface parallel to the XY plane and a light-receiving substrate support portion 103a. The light-receiving substrate support portion 103a is located in the +Z direction relative to the base portion 103b. The light-receiving substrate support portion 103a supports the light-receiving substrate 80 from below, as shown in Figures 7 and 20. The light-receiving substrate 80 is fixed to the light-receiving substrate support portion 103a by screws (not shown). The light-receiving substrate holding frame 103 is an example of a first subframe that holds the light-receiving substrate 80. The light-receiving substrate 80 is in surface contact with the light-receiving substrate support portion 103a, thereby transferring heat from the light-receiving substrate 80 to the light-receiving substrate holding frame 103.

[0066] The light-receiving substrate holding frame 103 is supported from below by the light-emitting substrate holding frame 104, as shown in Figure 19. Reference numerals 104a and 104b indicate frame support portions, which are parts that support the light-receiving substrate holding frame 103. The frame support portions 104a and 104b form frame surfaces parallel to the XY plane and are in surface contact with the bottom surface of the light-receiving substrate holding frame 103. As a result, heat from the light-receiving substrate holding frame 103 is transferred to the light-emitting substrate holding frame 104. Since the light-emitting substrate holding frame 104 is in contact with the main frame 101, heat from the light-receiving substrate holding frame 103 is transferred to the main frame 101 via the light-emitting substrate holding frame 104. In other words, the light-receiving substrate holding frame 103 is indirectly in contact with the main frame 101.

[0067] [Other components of the colorimeter] The following describes the other components of the colorimeter 1, excluding the shutter unit 110. In Figure 23, the outline of the battery 17 as viewed from the Z-axis direction is shown by a dashed line, and the optical filter device 3, PD substrate 5, wireless communication unit 13, battery control substrate 70, and light receiving substrate 80 are shown by dashed lines. In this embodiment, the outlines of the battery control substrate 70 and the light receiving substrate 80 as viewed from the Z-axis direction coincide except for the -Y direction end, at which point the outline of the light receiving substrate 80 is slightly positioned in the +Y direction compared to the outline of the battery control substrate 70. As described above, the optical filter device 3 and the PD substrate 5 constitute the incident light processing unit 2 that processes the incident light. As shown in Figure 23, when viewed from the Z-axis direction, the incident light processing unit 2 and the battery 17 overlap.

[0068] More specifically, in this embodiment, the incident light processing unit 2 is located within the region of the battery 17 when viewed from the Z-axis direction. The bandpass filter 7 (see Figures 20 and 21), which constitutes the incident light processing unit 2, is not shown in Figure 23, but as is clear from Figures 20 and 21, it is located within the region of the PD substrate 5 when viewed from the Z-axis direction.

[0069] As shown above, the incident light processing unit 2 and the battery 17 have an overlapping portion when viewed from the Z-axis direction. Therefore, compared to a configuration in which the incident light processing unit 2 and the battery 17 are arranged in a direction intersecting the Z-axis direction, i.e., horizontally, the device dimensions in the X-axis and Y-axis directions, which are directions intersecting the Z-axis direction, can be suppressed. Furthermore, in this embodiment, the incident light processing unit 2, i.e., the optical filter device 3 and the PD substrate 5 are located within the area of ​​the battery 17 when viewed from the Z-axis direction, thus further reducing the horizontal dimensions of the device.

[0070] Furthermore, Figure 24 shows the outline of the battery holder 100a (see Figures 7 and 14) that holds the battery 17, instead of the outline of the battery 17 shown in Figure 23. In other words, from the viewpoint of the battery holder 100a as well, there is an overlapping portion between the incident light processing unit 2 and the battery holder 100a when viewed from the Z-axis direction. Therefore, the horizontal dimensions of the device can be reduced compared to a configuration in which the incident light processing unit 2 and the battery holder 100a are arranged in a direction intersecting the Z-axis direction, i.e., horizontally.

[0071] In this embodiment, the optical filter device 3 and the PD substrate 5, i.e., the incident light processing unit 2, are located within the area of ​​the battery 17 or battery holding unit 100a when viewed from the Z-axis direction. However, a part of the incident light processing unit 2 may be located outside the area of ​​the battery 17 or battery holding unit 100a.

[0072] In this embodiment, as shown in Figure 23, the battery 17 is located within the X-axis region of the light-receiving substrate 80 when viewed from the Z-axis direction. The +Y end of the battery 17 is located inward from the +Y end of the light-receiving substrate 80, and the -Y end of the battery 17 slightly protrudes from the -Y end of the light-receiving substrate 80. However, the battery 17 may be configured to fit completely within the region of the light-receiving substrate 80 when viewed from the Z-axis direction. By configuring it in this way, the horizontal dimensions of the device can be further reduced.

[0073] Furthermore, in this embodiment, as shown in Figure 23, there is a portion where the display unit 15 and the light-receiving substrate 80 overlap when viewed from the Z-axis direction.

[0074] The colorimeter 1 also includes a light-receiving substrate 80 equipped with an incident light processing unit 2, a panel substrate 65 to which the LCD 67 is connected, a battery control substrate 70 to which the battery 17 is connected, and a light-emitting substrate 85 equipped with a light-emitting unit 9 that emits light for measurement. Then, in the Z-axis direction, the light-emitting substrate 85, the light-receiving substrate 80, and the panel substrate 65 are arranged in superimposed order from the bottom surface 50f to the top surface 50e of the device body 50, as shown in Figure 8. Furthermore, in the Z-axis direction, the battery control board 70, the battery 17, and the panel board 65 are arranged in a superimposed manner from the bottom surface 50f to the top surface 50e of the device body 50. In this embodiment, the light-emitting substrate 85, light-receiving substrate 80, battery control substrate 70, battery 17, and panel substrate 65 are arranged in a superimposed manner in the Z-axis direction from the bottom surface 50f to the top surface 50e of the device body 50. This configuration allows for the suppression of device dimensions in the X-axis and Y-axis directions, which intersect with the Z-axis direction, i.e., the horizontal direction. Alternatively, instead of providing the battery control board 70, the electronic components that would be mounted on the battery control board 70 may be appropriately placed on the panel board 65 or the light-receiving board 80. Furthermore, the configuration that is arranged to overlap along the Z-axis direction may be any two or more combinations of the light-emitting substrate 85, light-receiving substrate 80, battery control substrate 70, battery 17, and panel substrate 65.

[0075] Furthermore, the battery 17 has a shape that extends in the Y-axis direction, which is the longitudinal direction of the device, and as shown in Figure 20, the first end 17a, which is the +Y end of the battery 17, faces the front inner wall surface 51e of the main housing 51. Also, the second end 17b, which is the -Y end of the battery 17, faces the rear inner wall surface 51f of the main housing 51. In other words, both ends of the battery 17 in the Y-axis direction face the inner surface of the side wall of the main housing 51 in the Y-axis direction. As a result, the weight balance of the device body 50 in the Y-axis direction is superior to that of a configuration in which the battery 17 is unevenly distributed in the Y-axis direction, improving the handling of the device. Furthermore, in this embodiment, as shown in Figures 21 and 22, the battery 17 is located at the center of the device in the X-axis direction, resulting in excellent weight balance of the device body 50 in the X-axis direction.

[0076] As explained with reference to Figures 3, 4, 21, and 22, recesses 51g constituting a gripping portion 50g are formed in the main housing 51 on the right side 50b and left side 50c of the device body 50, allowing the user to easily and securely grip the device body 50. In Figures 22 and 25, the area indicated by arrow Za is the area where the recess 51g is formed in the Z-axis direction, and as shown in Figure 25, the recess 51g and the battery 17 have overlapping portions when viewed from the X-axis direction. This configuration places the heavy battery 17 closer to the gripping position, improving the handling of the device.

[0077] Furthermore, as shown in Figure 22, in the right wall 51b and left wall 51c of the main housing 51, the portion from the recess 51g to the bottom surface 50f, i.e., in the -Z direction, is in the same position as a part of the LCD 67 in the X-axis direction. The portion of the right wall 51b and left wall 51c from the recess 51g in the -Z direction is the portion in the -Z direction from the position indicated by the symbol Z4. As a result, the portion of the right wall 51b and left wall 51c from the recess 51g in the -Z direction has a portion that overlaps with the LCD 67 when viewed from the Z-axis direction, as shown in Figure 26. This makes it possible to miniaturize the device portion in the X-axis direction from the recess 51g in the -Z direction, as shown in Figure 22.

[0078] Furthermore, as shown in Figure 23, the colorimeter 1 has a portion where the opening 21a and the operating section 14 overlap when viewed from the Z-axis direction. This allows the user to align the opening 21a to the measurement area of ​​the measurement target 200 (see Figure 1) based on the position of the operating section 14, meaning that the opening 21a can be aligned to the measurement area with a simple configuration. In particular, the colorimeter 1 is configured as a handheld type, and as shown in Figure 27, when the user operates the control unit 14 with their fingertip Fs, the position of the fingertip Fa and the position of the opening 21a are close together, making the position of the opening 21a easy to intuitively understand.

[0079] Furthermore, in this embodiment in particular, the center position of the opening 21a and the center position of the confirmation button 54 coincide when viewed from the Z-axis direction. This allows the opening 21a to be more accurately aligned with the measurement site.

[0080] As shown in Figure 5, the select button 54 is circular when viewed from the Z-axis direction, and a cross-shaped button 60 for selecting various items is arranged around the select button 54. The cross-shaped button 60 has marker lines that radiate outward from the center of the select button 54. These marker lines consist of vertical lines 58a and 58b and horizontal lines 58c and 58d. This makes it easier to determine the center position of the opening 21a when looking at the top surface 50e of the device.

[0081] Furthermore, the control unit 14 is configured to have the power button 55 and all measurement-related buttons on its upper surface 50e. This allows the power button 55 and all measurement-related buttons to be easily visible, making it easy to operate the device. Furthermore, the upper surface 50e, including the operating section 14, is formed in a flat shape. This allows for stable placement even when the device is placed with the upper surface 50e facing downwards.

[0082] Furthermore, as shown in Figure 28, there is a portion where the panel substrate 65 and the battery 17 overlap when viewed from the Z-axis direction. Figure 28 shows the outline of the panel substrate 65 instead of the outlines of the battery control board 70 and light receiving board 80 shown in Figure 23. By having a portion where the panel substrate 65 and the battery 17 overlap when viewed from the Z-axis direction, the horizontal dimensions of the device can be reduced compared to a configuration where the panel substrate 65 and the battery 17 are arranged in the X-axis direction or Y-axis direction, i.e., horizontally. Furthermore, the battery 17 may be configured to fit within the area of ​​the panel substrate 65 when viewed from the Z-axis direction. By configuring it in this way, the horizontal dimensions of the device can be further reduced. In this embodiment, the wireless communication unit 13 is located within the area of ​​the battery 17 when viewed from the Z-axis direction. However, a part of the wireless communication unit 13 may be located within the area of ​​the battery 17, or the entire wireless communication unit 13 may be located outside the area of ​​the battery 17.

[0083] Furthermore, Figure 29 shows the outline of the battery holding portion 100a (see Figures 7 and 14) that holds the battery 17, instead of the outline of the battery 17 shown in Figure 28. In other words, from the viewpoint of the battery holding portion 100a as well, there is an overlapping portion between the panel substrate 65 and the battery holding portion 100a when viewed from the Z-axis direction, so the horizontal dimensions of the device can be reduced compared to a configuration in which the panel substrate 65 and the battery holding portion 100a are arranged in a direction intersecting the Z-axis direction, i.e., horizontally.

[0084] As shown in Figure 7, the wireless communication unit 13 is located on the lower surface of the panel substrate 65, and with the panel substrate 65 supported by the panel substrate support 101b, the wireless communication unit 13 is positioned inside the battery holder 100a. By positioning the wireless communication unit 13 inside the battery holder 100a in this way, the device can be made smaller. There is a risk that heat dissipation from the battery holder 100a may adversely affect the wireless communication unit 13. However, a notch 100b is formed in the battery holder 100a (see also Figure 14), and the wireless communication unit 13 is positioned facing the notch 100b. That is, when the battery holder 100a is viewed from the -X direction, the wireless communication unit 13 is exposed through the notch 100b. This makes it possible to suppress the adverse effect of heat dissipation from the battery holder 100a on the wireless communication unit 13.

[0085] Next, in this embodiment, the battery 17 is provided between the operating unit 14 and the incident light processing unit 2 in the Z-axis direction, as shown in Figure 20. As described above, in this embodiment, the incident light processing unit 2 comprises an optical filter device 3 and a PD substrate 5. In Figure 20, the position indicated by the symbol Z1 is the position of the PD substrate 5 that is located furthest in the +Z direction within the incident light processing unit 2. The position indicated by the symbol Z3 is the position furthest in the -Z direction of the part constituting the operating unit 14, specifically the Z-direction position of each contact (indicated by symbols 54a, 61a, and 62a in Figure 20). The position indicated by the symbol Z2 is an intermediate position between position Z1 and position Z3. Here, the battery 17 is equipped with a thermistor 18 inside. The thermistor 18 is an example of a temperature detection unit, and when the internal temperature of the battery 17, as determined by the thermistor 18, exceeds a predetermined allowable temperature, the MCU 10 (see Figure 1) cuts off the power supply from the battery 17 to each component.

[0086] The thermistor 18 is located in the +Z direction from position Z2 in the Z-axis direction, that is, it is positioned closer to the operation unit 14 than the incident light processing unit 2. In this embodiment, the incident light processing unit 2 is one of the components of the colorimeter 1 in which a portion of the supplied power is converted into heat, and this heat generation adversely affects the temperature detection by the thermistor 18. In the incident light processing unit 2, heat generation is particularly significant in the PD substrate 5. However, since the thermistor 18 is located closer to the operation unit 14 than the incident light processing unit 2, the adverse effect of the heat generated in the incident light processing unit 2 on the thermistor 18 can be suppressed, and the temperature of the battery 17 can be detected more appropriately.

[0087] Furthermore, as described above, the frame assembly 100 includes a battery holding portion 100a that surrounds the battery 17 (see Figure 7), so that the heat generated from the battery 17 is effectively dissipated by the battery holding portion 100a.

[0088] Furthermore, the thermistor 18 and the incident light processing unit 2 are located at one end of the main assembly 1a (see Figure 7) in the Y-axis direction, that is, closer to the +Y direction end. Located closer to the +Y direction end means that it is located in the +Y direction more than the midpoint of the main assembly 1a in the Y-axis direction. The main assembly 1a is also equipped with a wired IF 12, which is a connection part for wired communication with external equipment, at one end of the main assembly 1a in the Y-axis direction, that is, closer to the +Y direction end. The wired IF 12 is located between the thermistor 18 and the incident light processing unit 2 in the Z-axis direction. Here, the wired IF12 is located inside the opening (see Figure 3), so heat dissipation from the inside to the outside of the device is promoted around the wired IF12. Furthermore, as shown in Figure 20, the wired IF12 is positioned between the thermistor 18 and the incident light processing unit 2 in the Z-axis direction, so the heat generated in the incident light processing unit 2 is dissipated from the wired IF12 to the outside of the device before it reaches the thermistor 18. This suppresses the adverse effect of the heat generated in the incident light processing unit 2 on the thermistor 18.

[0089] Furthermore, as shown in Figure 20, the display unit 15 and the operation unit 14 are arranged along the Y-axis, and the thermistor 18 is positioned within the area of ​​the operation unit 14 in the Y-axis direction. That is, the LCD 67 that constitutes the display unit 15 tends to generate more heat relatively easily than the operation unit 14, but in the configuration in which the display unit 15 and the operation unit 14 are arranged along the Y-axis direction as described above, the thermistor 18 is positioned within the area of ​​the operation unit 14 in the Y-axis direction, so the adverse effect of the heat generated by the LCD 67 on the thermistor 18 can be suppressed.

[0090] Furthermore, as shown in Figures 7, 14, and 15, the colorimeter 1 includes a light-receiving substrate 80 and a light-emitting substrate 85, as well as a frame assembly 100 made of a metal material. The frame assembly 100 includes a main frame 101 that forms the base of the device, a light-receiving substrate holding frame 103 that holds the light-receiving substrate 80, and a light-emitting substrate holding frame 104 that holds the light-emitting substrate 85. The light-receiving substrate holding frame 103 and the light-emitting substrate holding frame 104 are in direct or indirect contact with the main frame 101.

[0091] More specifically, in this embodiment, each frame constituting the frame assembly 100 is made of aluminum as described above. The light-emitting substrate holding frame 104 is in direct contact with the main frame 101 as described above, and the light-receiving substrate holding frame 103 is indirectly in contact with the main frame 101 via the light-emitting substrate holding frame 104. With this configuration, the heat generated in the light-receiving substrate 80 and the light-emitting substrate 85 is transmitted to the entire frame assembly 100, suppressing localized temperature increases inside the device and preventing adverse effects on color measurement results, etc.

[0092] In this embodiment, the light-receiving substrate holding frame 103 is indirectly in contact with the main frame 101, but it may also be in direct contact with the main frame 101. Also in this embodiment, the light-emitting substrate holding frame 104 is in direct contact with the main frame 101, but it may also be indirectly in contact with the main frame 101. Furthermore, if the light-receiving substrate holding frame 103 or the light-emitting substrate holding frame 104 indirectly contacts the main frame 101 via other members, it is preferable that the other members be made of a material with excellent thermal conductivity, such as a metal material.

[0093] Furthermore, as shown in Figure 18, the main frame 101 has frame surfaces extending in the Y-axis direction and the Z-axis direction, in other words, a main plate portion 101a that forms a wide frame surface in the YZ plane. This increases the surface area of ​​the main frame 101 and improves heat dissipation efficiency.

[0094] Furthermore, as described above with reference to Figure 7, the frame assembly 100 includes a battery holding portion 100a that surrounds the battery 17. Therefore, heat generated from the battery 17 is transferred to the battery holding portion 100a and efficiently dissipated through the main frame 101 and the battery holding frame 102.

[0095] The battery holder 100a also includes a battery support portion 102a as a first wall portion that supports the battery 17 from below, and a panel substrate support portion 101b as a second wall portion that faces the battery support portion 102a and forms the upper wall portion of the battery holder 100a. The battery holder 100a also includes a subplate portion 101c as a third wall portion and a second frame portion 102c as a fourth wall portion, which are located on either side of the battery 17 in the X-axis direction. With this configuration, heat generated from the battery 17 is efficiently dissipated.

[0096] Furthermore, in this embodiment, the panel substrate 65 and the battery control board 70 are in direct contact with the main frame 101, so the heat generated from the panel substrate 65 and the battery control board 70 is transferred to the main frame 101, resulting in efficient heat dissipation. Furthermore, the panel substrate 65 and the battery control board 70 may be configured to indirectly contact the main frame 101 via other components. In this case, the other components are preferably materials with excellent thermal conductivity, such as metal materials.

[0097] [Shutter unit configuration] Next, we will describe the shutter unit 110 located at the bottom of the main body 50 of the device. As shown in Figures 30 to 34, the shutter unit 110 is a unit comprising a shutter holding member 111, a shutter member 112, and a link member 113. In this embodiment, the shutter holding member 111, the shutter member 112, and the link member 113 are made of resin material.

[0098] The link member 113 is rotatably connected to the shutter holding member 111 via a connecting shaft 114 having a central axis parallel to the X-axis direction. The shutter holding member 111 is provided with a first guide shaft 121 and a second guide shaft 122 on its sides in the +X and -X directions. The link member 113 is also provided with a third guide shaft 123 on its sides in the +X and -X directions.

[0099] In the opening-forming member 21, a first lower guide portion 21c, a second lower guide portion 21d, and a third lower guide portion 21e are formed along the Y-axis direction at the +X-direction end and the -X-direction end, as shown in Figures 32, 33, and 35. Of these, the first lower guide portion 21c and the second lower guide portion 21d have a shape in which the -Y-direction end curves in the +Z direction toward the -Y direction. The third lower guide portion 21e is formed in a shape that is slightly inclined toward the -Z direction toward the -Y direction.

[0100] In the bottom housing 53, a first upper guide portion 53c is formed at the end in the +X direction and the end in the -X direction, as shown in Figure 35, so as to sandwich the first guide shaft 121 between the first lower guide portion 21c described above. Note that Figure 35 shows the first upper guide portion 53c located at the end in the +X direction. Similarly, at the bottom housing 53, a second upper guide portion 53d is formed at the end in the +X direction and the end in the -X direction, so as to sandwich the second guide shaft 122 between it and the second lower guide portion 21d described above. Figure 35 shows the second upper guide portion 53d located at the end in the +X direction. Similarly, at the bottom housing 53, a third upper guide portion 53e is formed at the +X end and the -X end so as to sandwich the third guide shaft 123 between the third lower guide portion 21e described above. Figure 35 shows the third upper guide portion 53e located at the +X end.

[0101] In this manner, the first guide shaft 121, the second guide shaft 122, and the third guide shaft 123 are sandwiched in the Z-axis direction between the opening forming member 21 and the bottom housing 53, and are guided in the Y-axis direction by the opening forming member 21 and the bottom housing 53. Of these, the first guide shaft 121 and the second guide shaft 122 are provided on the shutter holding member 111, so the movement trajectory of the shutter holding member 111 is defined by the first lower guide section 21c and the first upper guide section 53c, and the second lower guide section 21d and the second upper guide section 53d. Furthermore, since the third guide shaft 123 is provided on the link member 113, the movement trajectory of the link member 113 is defined by the third lower guide section 21e and the third upper guide section 53e, and the connecting shaft 114 in the shutter holding member 111.

[0102] Furthermore, the limit of movement of the shutter unit 110 in the +Y direction, i.e., the closed position, is defined by the first guide shaft 121 contacting the movement restricting portion 53f formed on the bottom housing 53. The limit of movement of the shutter unit 110 in the -Y direction, i.e., the open position, is defined by the first guide shaft 121 contacting the movement restricting portion 21f formed on the opening forming member 21. In this embodiment, the second guide shaft 122 and the third guide shaft 123 do not define the limit of movement of the shutter unit 110 in the Y direction.

[0103] Next, as shown in Figures 31, 33, 34, 36, and 37, the -Z direction surface of the portion of the opening 21a formed in the opening forming member 21 is indicated by the reference numeral 21g. Hereafter, this will be referred to as the shutter opposing surface 21g. The shutter opposing surface 21g is a flat surface that forms an annular shape in plan view. As shown in Figure 34, the shutter-facing surface 21g is located slightly in the +Z direction relative to the bottom surface 50f, meaning it does not protrude in the -Z direction relative to the bottom surface 50f. However, the shutter holding member 111 of the shutter unit 110 in the closed position protrudes in the -Z direction relative to the bottom surface 50f, as shown in Figure 34. Furthermore, in the closed position of the shutter unit 110, the link member 113 does not protrude in the -Z direction from at least the shutter holding member 111, and most of it does not protrude from the bottom surface 50f.

[0104] As the movement trajectory of the shutter holding member 111 is defined by the first lower guide portion 21c and the first upper guide portion 53c, and the second lower guide portion 21d and the second upper guide portion 53d, as shown in Figure 35, when the shutter holding member 111 moves from the closed position to the open position, it displaces in the -Y direction, as is clear from Figure 35, and then moves significantly in the +Z direction in the latter half of the displacement. As a result, when the shutter unit 110 is in the open position, the shutter holding member 111 does not protrude from the bottom surface 50f in the -Z direction, as shown in Figures 31 and 20.

[0105] Furthermore, when the shutter holding member 111 moves in the +Z direction, the link member 113 rotates relative to the shutter holding member 111 via the connecting shaft 114, as shown in the change from Figure 36 to Figure 37. Also, when the shutter unit 110 is in the open position, the link member 113 does not protrude beyond the shutter holding member 111 in the -Z direction, as shown in Figure 37. When the shutter unit 110 is in the open position, the entire link member 113 does not protrude from the bottom surface 50f in the -Z direction, as shown in Figure 20.

[0106] Next, as shown in Figure 15, bearing portions 105c are formed on the bottom frame 105 at intervals in the X-axis direction. A spring shaft 115 is pivotally supported on this bearing portion 105c, as shown in Figures 32, 34, 36, and 37. One end of a torsion spring 117, which is an example of a spring member, is rotatably fixed to this spring shaft 115. The tip of one end of the torsion spring 117 is formed in a coil shape so that it can pass through the spring shaft 115. The other end of the torsion spring 117 is rotatably fixed to a third guide shaft 123 provided on the link member 113. The tip of the other end of the torsion spring 117 is formed in a coil shape so that it can pass through the third guide shaft 123. As a result, the torsion spring 117 can rotate in the YZ plane, or in other words, its orientation can be changed.

[0107] When the shutter unit 110 is in the closed position, the external force F that the torsion spring 117 applies to the third guide shaft 123, i.e., the shutter unit 110, as shown in Figure 34, includes a -Z component and a +Y component. As a result, the torsion spring 117 presses the shutter unit 110 in the +Y direction, as indicated by the arrow Fy, that is, it presses the shutter unit 110 toward the closed position, thereby holding the shutter unit 110 in the closed position.

[0108] Figure 36 shows the state in which the shutter unit 110 has moved a predetermined amount in the -Y direction from the closed position. The pressing force F applied by the torsion spring 117 to the shutter unit 110 decreases in the +Y direction as the shutter unit 110 is displaced from the closed position to the neutral position described later, until the component in the Y direction becomes zero and only the component in the -Z direction remains. At this point, the torsion spring 117 does not press the shutter unit 110 in either the +Y or -Y direction. Hereafter, the position of the shutter unit 110 in this state will be referred to as the neutral position. Of course, similarly, when the shutter unit 110 is displaced from the open position to the neutral position, the Y-axis component of the pressing force F decreases and eventually becomes zero.

[0109] When the shutter unit 110 is displaced from the neutral position in the -Y direction, that is, displaced toward the open position, the pressing force F applied by the torsion spring 117 to the shutter unit 110 comes to include a -Y component, and this -Y component increases as the shutter unit 110 is displaced toward the open position. As a result, as shown in Figure 37, when the shutter unit 110 is in the open position, the pressing force F applied by the torsion spring 117 to the shutter unit 110 includes a pressing force Fy with a -Y component, and the shutter unit 110 is held in the open position.

[0110] Next, a shutter member 112 is provided on the +Z direction side of the shutter holding member 111. On the -Z direction side of the shutter member 112, a cylindrical portion 112e is formed, as shown in Figures 34, 36, 37, and 39. A recess 111c is formed in the shutter holding member 111 to receive the cylindrical portion 112e (see also Figure 40).

[0111] Furthermore, on the shutter member 112, a white plate 125 is provided on the +Z direction side, as shown in Figure 43, which serves as a reflective reference surface. The white plate 125 is white in such a way that its reflectivity is close to 100% in order to obtain the reflective reference value. The white plate 125 is located in the central region of the shutter member 112 in the planar direction, that is, in the XY plane. Here, the location of the white plate 125 in the central region of the shutter member 112 in the planar direction means that the area of ​​the white plate 125 includes the central position of the shutter member 112 in the planar direction. The central position of the shutter member 112 in the planar direction is the central position of the shutter member 112 in the Y-axis direction and the X-axis direction, and in this embodiment it generally coincides with the optical axis CL, or at least is in the vicinity of the optical axis CL.

[0112] The shutter member 112 is provided so as to be displaceable relative to the shutter holding member 111 in the Z-axis direction, that is, in the direction of approaching and moving away from the opening 21a. More specifically, as shown in Figures 38 and 39, projections 112d are provided on the +X and -X sides of the shutter member 112 at intervals in the Y-axis direction. On the other hand, openings 111b for receiving the projections 112d are provided on the +X and -X sides of the shutter holding member 111 at intervals in the Y-axis direction.

[0113] The size of the opening 111b in the Z-axis direction is larger than the size of the protrusion 112d in the Z-axis direction, so that the protrusion 112d can move in the Z-axis direction while being inserted into the opening 111b. As a result, the shutter member 112 is held in the shutter holding member 111 so as to be movable in the Z-axis direction.

[0114] As shown in Figure 40, the shutter holding member 111 is provided with a leaf spring 118 as a pressing member that presses the shutter member 112 in the +Z direction, i.e., toward the opening 21a. The leaf spring 118 has multiple pressing parts that press the shutter member 112, specifically three pressing parts 118a. The multiple pressing parts 118a are arranged at approximately equal intervals along the perimeter of the opening 21a.

[0115] When the shutter unit 110 is in the closed position, as shown in Figure 34, the contact surface 112a of the shutter member 112 that faces the shutter opposing surface 21g is pressed tightly against the shutter opposing surface 21g by the pressing force of the leaf spring 118. The contact surface 112a has an annular shape that follows the periphery of the opening 21a, that is, along the shutter opposing surface 21g (see Figure 43). When the contact surface 112a presses against the shutter opposing surface 21g, the opening 21a is closed, and the entry of dust and other debris into the inside of the device through the opening 21a is suppressed.

[0116] Next, as shown in Figures 31, 33, 41, and 42, first protruding ribs 21b are formed along the Y-axis direction on both sides in the X-axis direction relative to the shutter-facing surface 21g. The first protruding ribs 21b are ribs that protrude in the -Z direction from the opening-forming member 21. Furthermore, as shown in Figure 43, the shutter member 112 has second protruding ribs 112b formed along the Y-axis direction on both sides in the X-axis direction relative to the contact surface 112a. The second protruding ribs 112b are ribs that protrude from the shutter member 112 toward the opening forming member 21.

[0117] The second protruding rib 112b is formed in a position where it can come into contact with the first protruding rib 21b. As shown in Figure 41, when the shutter unit 110 is in the closed position, the second protruding rib 112b is located in the +Y direction relative to the first protruding rib 21b and does not come into contact with the first protruding rib 21b. At the -Y end of the second protruding rib 112b, an inclined surface 112c is formed that extends in the -Z direction toward the -Y direction. Similarly, at the +Y end of the first protruding rib 21b, an inclined surface 21h is formed that extends in the +Z direction toward the +Y direction. When the shutter unit 110 is in the closed position, the inclined surface 112c and the inclined surface 21h face each other.

[0118] As the shutter unit 110 is displaced toward the open position from this state, the second protruding rib 112b comes into contact with the first protruding rib 21b, and as shown in the change from Figure 41 to Figure 42, the second protruding rib 112b overlaps with the first protruding rib 21b in the Z-axis direction. As a result, the shutter member 112 moves in the -Z direction against the pressing force of the leaf spring 118, and a gap is formed between the shutter opposing surface 21g and the contact surface 112a, as shown in Figure 36. In this manner, the first protruding rib 21b and the second protruding rib 112b constitute a moving means 119 that moves the shutter member 112 in a direction away from the opening forming member 21 when the shutter unit 110, which is in the closed position, is displaced toward the open position. As a result, wear on the shutter-facing surface (21g) can be minimized.

[0119] Next, as shown in Figures 43 to 45, a window portion 112f is formed in the shutter member 112, and the magnet 127 is exposed through this window portion 112f. The magnet 127 is fixed to the shutter holding member 111 with adhesive or double-sided tape. A magnetic sensor 128 is provided on the lower surface of the light-emitting substrate 85.

[0120] When the shutter unit 110 is in the open position, the magnet 127 is positioned to overlap with the magnetic sensor 128 in the Y-axis direction, as shown in Figure 44. This state represents the shortest straight-line distance between the magnet 127 and the magnetic sensor 128. In contrast, when the shutter unit 110 is in the closed position, the straight-line distance between the magnet 127 and the magnetic sensor 128 is longer than when it is in the open position, as shown in Figure 45. This state represents the longest straight-line distance between the magnet 127 and the magnetic sensor 128. This configuration allows the magnetic sensor 128 to be positioned away from the opening 21a, thereby suppressing the need to increase the size of the device by placing the magnetic sensor 128 near the opening 21a.

[0121] The magnetic sensor 128 is a magnetic sensor that changes its detection signal according to the strength of the magnetic field. When the shutter unit 110 is in the open position, it sends a High detection signal to the MCU 10 (see Figure 1). When the shutter unit 110 is in the closed position, the magnetic sensor 128 sends a Low detection signal to the MCU 10 (see Figure 1). In other words, the magnetic sensor 128 is a detection means that changes its detection signal according to the displacement of the shutter unit 110. This allows the MCU 10 to detect whether the shutter unit 110 is in the closed position or the open position.

[0122] As described above, the shutter unit 110 is configured to include a shutter member 112 that closes the opening 21a when in the closed position, a shutter holding member 111 that holds the shutter member 112 so that the shutter member 112 can be displaced in directions approaching and moving away from the opening 21a, and a leaf spring 118 which is an example of a pressing member that presses the shutter member 112 toward the opening 21a. This prevents gaps from forming between the shutter member 112 and the opening 21a, even if manufacturing or assembly errors occur in the parts, or due to wear and tear during use, as the shutter member 112 is pressed toward the opening 21a. As a result, the intrusion of dust and other debris into the opening 21a can be effectively suppressed.

[0123] Furthermore, since the leaf spring 118 presses the shutter member 112 at multiple pressing points 118a, i.e., at multiple positions along the perimeter of the opening 21a, the shutter member 112 is prevented from being unevenly pressed at a specific position in the opening 21a, and the opening 21a can be properly closed by the shutter member 112.

[0124] Furthermore, when the shutter unit 110, which is in the closed position, is displaced toward the open position, a moving means 119 is provided to move the shutter member 112 in a direction away from the opening forming member 21. Therefore, wear between the shutter-facing surface 21g, which is the part of the opening forming member 21 that forms the opening 21a, and the contact surface 112a, which is the part of the shutter member 112 that closes the opening 21a, is suppressed. As a result, a gap is created between the opening 21a and the shutter member 112, and the risk of dust and other debris entering is suppressed.

[0125] Furthermore, the moving means 119 is configured to include a first protruding rib 21b formed on the opening forming member 21 and projecting toward the shutter member 112, and a second protruding rib 112b formed on the shutter member 112 and projecting toward the opening forming member 21. When the shutter unit 110 is in the closed position, the first protruding rib 21b is in a non-contact state with the second protruding rib 112b. When the shutter unit 110, which is in the closed position, is displaced toward the open position, the second protruding rib 112b rides up onto the first protruding rib 21b, causing the shutter member 112 to move toward the opening forming member 21. With this configuration, the moving means 119 can be constructed at low cost.

[0126] The shutter unit 110 is located on the open side of the shutter holding member 111 and includes a link member 113 that is rotatably connected to the shutter holding member 111. The shutter holding member 111 protrudes from the bottom surface 50f when the shutter unit 110 is in the closed position and does not protrude from the bottom surface 50f when the shutter unit 110 is in the open position. The link member 113 rotates relative to the shutter holding member 111, thereby maintaining a state in which it does not protrude from the bottom surface 50f more than the shutter holding member 111, regardless of the position of the shutter unit 110. This makes it possible to miniaturize the device, especially when the shutter unit 110 is in the closed position, compared to a configuration in which the shutter holding member 111 and the link member 113 are integrated.

[0127] The shutter unit 110 is also equipped with a torsion spring 117 that presses the link member 113 toward the open and closed positions, and the torsion spring 117 changes its orientation in accordance with the displacement of the shutter unit 110. As a result, when the shutter unit 110 is on the side of the closed position from the neutral position, the torsion spring 117 presses the link member 113 toward the closed position (see Figure 34). Also, when the shutter unit 110 is on the side of the open position from the neutral position, the torsion spring 117 presses the link member 113 toward the open position (see Figures 36 and 37). With this configuration, a means for maintaining the shutter unit 110 in the closed and open positions can be constructed at low cost.

[0128] Figure 46 schematically shows the position of the shutter unit 110, where position Ya1 indicates the closed position, position Ya2 indicates the open position, and position Yac indicates the neutral position. Reference numeral A1 indicates the range of movement of the shutter unit 110 between the closed position Ya1 and the neutral position Yac, and reference numeral A2 indicates the range of movement of the shutter unit 110 between the open position Ya2 and the neutral position Yac.

[0129] Here, due to friction between the first guide shaft 121, the second guide shaft 122, and the third guide shaft 123, as explained with reference to Figure 35, the opening forming member 21, and the bottom housing 53, the shutter unit 110 may remain stationary even when it is slightly closer to the closed position Ya1 than the neutral position Yac. Similarly, the shutter unit 110 may remain stationary even when it is slightly closer to the open position Ya2 than the neutral position Yac. In Figure 46, the area indicated by range K is the region in which the shutter unit 110 remains stopped. Hereafter, this will be referred to as the stopping region K of the shutter unit 110.

[0130] Next, as described above, a white plate 125 is provided in the shutter member 112 at a position facing the opening 21a, forming a reflective reference surface that serves as the basis for the reflectance. Furthermore, since the shutter member 112 is pressed toward the opening 21a by the leaf spring 118, the position and orientation of the white plate 125 are less likely to vary, and an appropriate reference value can be obtained.

[0131] Furthermore, the shutter unit 110 and its related configurations can be modified as shown in Figures 47 to 50. Note that components identical to those already described in Figures 47 to 50 are denoted by the same reference numerals, and redundant explanations will be avoided below. In Figures 47 and 48, the shutter unit 110A is configured to include a shutter holding member 111A, a link member 113A, and a second link member 130. The shutter holding member 111A and the link member 113A are connected via a connecting shaft 114 so as to be rotatable relative to each other. The link member 113A and the second link member 130 are connected via a second connecting shaft 131 so as to be rotatable relative to each other.

[0132] The opening-forming member 21A is supported by a rotation axis 132 parallel to the X-axis direction, and the second link member 130 is provided so as to be rotatable in the YZ plane around this rotation axis 132. Torsion springs 133 are provided on the opening-forming member 21A at intervals in the X-axis direction. One end of the torsion spring 133 is rotatably attached to a part of the opening-forming member 21A, and the other end of the torsion spring 133 is attached to the second link member 130.

[0133] Figure 47 shows the shutter unit 110A in the closed position, and Figure 48 shows the shutter unit 110A in the open position. As shown in the transition from Figure 47 to Figure 48, or from Figure 48 to Figure 47, the shutter holding member 111A and the link member 113A rotate relative to each other as the shutter unit 110A is displaced, and the link member 113A and the second link member 130 also rotate relative to each other. At this time, the torsion spring 133 changes its orientation in the same way as the torsion spring 117 (see Figure 32) described above. As a result, when the shutter unit 110A is between the closed position and the neutral position, the torsion spring 133 presses the shutter unit 110A toward the closed position. Also, when the shutter unit 110A is between the open position and the neutral position, the torsion spring 133 presses the shutter unit 110A toward the open position.

[0134] Next, in Figures 49 and 50, the shutter unit 110B is configured to include a shutter holding member 111B and a link member 113B. The shutter holding member 111B and the link member 113B are connected to each other so as to be rotatable relative to each other via a first connecting portion 140. The link member 113B has a second connecting portion 141 that extends along the X-axis direction. The connecting member 142 is fitted into the second connecting portion 141 so as to be slidable in the X-axis direction.

[0135] A rotating shaft 144 is integrally formed in the opening-forming member 21B, and an arm member 143 is provided on the rotating shaft 144 so as to be rotatable in the XY plane. The arm member 143 and the connecting member 142 are connected via a link shaft 143a having a central axis parallel to the Z-axis direction so as to be rotatable relative to each other. A torsion spring (not shown) is provided in the +Z direction relative to the arm member 143 to generate a spring force between the opening-forming member 21B and the arm member 143.

[0136] Figure 49 shows the shutter unit 110B in the closed position, and Figure 50 shows the shutter unit 110B in the open position. As shown in the transition from Figure 49 to Figure 50, or from Figure 50 to Figure 49, the shutter holding member 111B and the link member 113B rotate relative to each other as the shutter unit 110B is displaced. Furthermore, the arm member 143 rotates, and consequently, the arm member 143 and the connecting member 142 rotate relative to each other. At this time, the connecting member 142 slides the second connecting portion 141 along the X-axis direction.

[0137] As the arm member 143 rotates, a torsion spring (not shown) located in the +Z direction relative to the arm member 143 changes its orientation. As a result, when the shutter unit 110B is between the closed position and the neutral position, the torsion spring presses the shutter unit 110B toward the closed position. Also, when the shutter unit 110B is between the open position and the neutral position, the torsion spring presses the shutter unit 110B toward the open position. The shutter unit 110 and its related configuration can be modified as described above.

[0138] Next, as described above, the colorimeter 1 is equipped with a magnetic sensor 128 that changes the detection signal according to the displacement of the shutter unit 110. This allows the position of the shutter unit 110 to be determined, and appropriate control can be performed according to the position of the shutter unit 110.

[0139] Furthermore, since the magnetic sensor 128 is a sensor that changes the detection signal according to the strength of the magnetic field, there is no need to provide a dedicated aperture or the like for transmitting detection light, as is the case with optical sensors, and thus it is possible to avoid a decrease in the airtightness of the device that would result from the formation of extra apertures. However, as a detection means for detecting the position of the shutter unit 110, other types of non-contact sensors such as optical sensors, capacitive proximity sensors, and inductive proximity sensors, or contact sensors can also be used.

[0140] The control performed by the MCU10 (see Figure 1), which is the control unit that receives the detection signal from the magnetic sensor 128, will be explained below with reference to Figures 51 to 53. In Figure 51, when the power button 55 (see Figure 5, etc.) is pressed while the power is on, i.e., when the device receives a power-off command (Yes in step S101), the MCU 10 proceeds to the power-off process of the device (step S103) if the shutter unit 110 is in the closed position (Yes in step S102). In contrast, if the shutter unit 110 is in the open position (No in step S102), the transition to power off is postponed. In this embodiment, an alert indicating that the shutter unit 110 is in the open position is displayed on the display unit 15 (see Figure 5, etc.) (step S104).

[0141] This prevents the device from being powered off while the shutter unit 110 is in the open position, thus preventing dust and other debris from entering the device through the opening 21a while the device is powered off. Furthermore, an alert indicating that the shutter unit 110 is in the open position is displayed on the display unit 15, improving usability. The alert indicating that the shutter unit 110 is in the open position can be displayed as a message such as, for example, "The shutter is open. Please close it."

[0142] Next, in Figure 52, when the MCU 10 determines that it is time to acquire a reference value using the white plate 125 (see Figure 43, etc.) (Yes in step S201), it determines whether the shutter unit 110 is in the closed position (step S202). If the shutter unit 110 is in the closed position (Yes in step S202), it executes the reference value acquisition process (step S203). On the other hand, if the shutter unit 110 is in the open position (No in step S202), it postpones the acquisition of the reference value. In this case, in this embodiment, an alert indicating that the shutter unit 110 is in the open position is displayed on the display unit 15 (see Figure 5, etc.) (step S204). This allows the reference value to be acquired appropriately using the white plate 125. The timing for acquiring the reference value may include, for example, when the power button 55 (see Figure 5, etc.) is pressed from the power-off state, i.e., when the device receives a power-on command, or when a predetermined time has elapsed while the device is powered on.

[0143] Next, in Figure 53, when the confirmation button 54 (see Figure 5, etc.) is pressed, that is, when the command to perform color measurement is received (Yes in step S301), the MCU 10 performs the color measurement process (step S303) if the shutter unit 110 is in the open position (Yes in step S302). In contrast, if the shutter unit 110 is in the closed position (No in step S302), the transition to power off is postponed. In this embodiment, an alert indicating that the shutter unit 110 is in the closed position is displayed on the display unit 15 (see Figure 5, etc.) (step S304). Through this control, appropriate colorimetric values ​​can be obtained. Furthermore, when a command to perform color measurement is received (Yes in step S301), if the shutter unit 110 is in the open position (Yes in step S302), the color measurement process is performed (step S303). If the shutter unit 110 is in the open position (No in step S302), the process may proceed to step S304 after obtaining a reference value using the white plate 125.

[0144] Furthermore, in Figure 46, in the displacement region (A1+A2) of the shutter unit 110, the region B1 in which the magnetic sensor 128 sends a detection signal indicating the closed position of the shutter unit 110 is set with a margin M on the side of the neutral position Yac toward the closed position Ya1. Note that in Figure 46, position Ybc indicates the switching position of the detection signal of the magnetic sensor 128, and in region B1, a detection signal indicating that the shutter unit 110 is in the closed position is sent, and in region B2, a detection signal indicating that the shutter unit 110 is in the open position is sent. In particular, in this embodiment, region B1 is set further towards the closed position Ya1 than the stop region K of the shutter unit 110 described above. As a result, when the magnetic sensor 128 sends a detection signal indicating the closed position of the shutter unit 110, the shutter unit 110 is reliably in the closed position. This eliminates the risk of the shutter unit 110 being incorrectly judged as being in the closed position even when it is in an intermediate position, and consequently ensures reliable acquisition of the reference value using the white plate 125.

[0145] The present invention is not limited to the embodiments described above, and it goes without saying that various modifications are possible within the scope of the invention as described in the claims, and these modifications are also included within the scope of the present invention. For example, in the embodiment described above, the colorimeter 1 has a built-in battery 17, but the battery 17 may be configured to be removable, that is, the colorimeter 1 may not have a built-in battery 17. In that case, the battery 17 may be a primary battery that does not undergo repeated charging and discharging.

[0146] In this embodiment, the incident light processing unit 2 is configured to include an optical filter device 3 and a light receiving unit 4, and the optical filter device 3 is a wavelength-tunable Fabry-Perot etalon that transmits a predetermined wavelength component of the incident light, but is not limited to this. For example, a spectral method using a diffraction grating may be used as the spectral method. Alternatively, the device configuration may employ a direct stimulus reading method that directly measures the three stimulus values ​​that are the basis of color as the colorimetric principle. In this embodiment, an LED is used as the light-emitting element in the light-emitting section 9, but it is not limited to this, and for example, a xenon lamp may be used. [Explanation of symbols]

[0147] 1...Colorimeter, 1a...Main assembly, 2...Incident light processing unit, 3...Optical filter device, 4...Light receiving unit, 4a...Photodiode, 5...PD substrate, 6...Capacitance detection unit, 7...Bandpass filter, 9...Light emitting unit, 10...MCU, 11..., 12...Wired IF, 13...Wireless communication unit, 14...Operation unit, 15...Display unit, 16...Battery control unit, 17...Battery, 17a...First end, 17b...Second end, 18...Thermistor, 21...Opening forming member, 21a...Opening, 21b...First protruding rib, 21c... 1st lower guide section, 21d...2nd lower guide section, 21e...3rd lower guide section, 21f...movement restricting section, 21g...shutter opposing surface, 21h...inclined surface, 28...elastic material, 29...shielding sheet, 30...1st glass component, 31...2nd glass component, 32...case, 33...jointing component, 34...fixing material, 35...wire bonding, 36...electrode, 37...base substrate, 38...diaphragm substrate, 39...mirror, 40...fixed electrode, 41...movable electrode, 42...diaphragm section, 43...bonding film, 45...wavelength tunable interference filter, 50...Device body, 50a...Front, 50b...Right side, 50c...Left side, 50d...Rear, 50e...Top, 50f...Bottom, 50g...Gripping part, 50m...Opening, 51...Main housing, 51a...Front wall, 51b...Right wall, 51c...Left wall, 51d...Rear wall, 51e...Front inner wall, 51f...Rear inner wall, 51g...Recess, 52...Upper housing, 53...Bottom housing, 53a...Opening, 53c...First upper guide part, 53d...Second upper guide part, 53e...Third upper guide part, 53f...Movement restriction part, 54...Confirm button, 54a...Contact, 55...Power button, 55a...Contact, 56 ...back button, 56a...contact, 57...display cover, 58a, 58b...vertical line, 58c, 58d...horizontal line, 60...cross buttons, 61...up button, 61a...contact, 62...down button, 62a...contact, 63...left button, 63a...contact, 64...right button, 64a...contact, 65...panel board, 66...LCD connection, 67...LCD, 67a...cable, 68...first board connection connector, 70...battery control board, 71...reset switch, 72...first battery connector, 73...second battery connector, 74...second board connection connector, 80...Light receiving substrate, 81...Light receiving module, 82...Third board connection connector, 83...Fourth board connection connector, 84...Fifth board connection connector, 85...Light emitting substrate, 86...Light-emitting element, 87...Light-collecting member, 87a...Measurement window, 88...Sixth board connection connector, 89...Light-shielding member, 90...FFC, 91...Connection cable, 92...First battery cable, 93...Second battery cable, 100...frame assembly, 100a...battery holder, 100b...notch, 101...Main frame, 101a...Main plate section, 101b...Panel substrate support section, 101c...Subplate section, 101d...Regulating section, 101e...Battery control board support section, 101f...Frame holding section, 102...Battery holding frame, 102a...Battery support section, 102b...First frame section, 102c...Second frame section, 103...Light receiving section substrate holding frame, 103a...Light receiving section substrate support section, 103b...Base section, 104...Light emitting section substrate holding frame, 104a, 104b...Frame support section, 105...Bottom frame, 105a...First plate section, 105b...Second plate section, 105c...Bearing section, 110...Shutter unit, 111...Shutter holding member, 111a...Rib, 111b...Opening, 111c...Recess, 112...Shutter member, 112a...Contact surface, 112b...Second protruding rib, 112c...Inclined surface, 112d...Protruding part, 112e...Cylindrical part, 112f...Window part 113...Link member, 114...Connecting shaft, 115...Spring hanging shaft, 117...Torsion spring, 118...Leaf spring, 118a...Pressing part, 119...Moving means, 121...First guide shaft, 122...Second guide shaft, 123...Third guide shaft, 125...White plate, 127...Magnet, 128...Magnetic sensor, 130...Second link member, 131...Second connecting shaft, 132...Rotation shaft, 133...Torsion spring, 140...First connecting part, 141...Second connecting part, 142...Connecting member, 143...Arm member, 143a...Link shaft, 144...Rotation shaft, 200...Measurement target

Claims

1. An opening is formed to allow light from the object to be measured to enter the device, and an opening forming member is placed on the bottom surface of the device during measurement. An incident light processing unit that processes light incident through the aforementioned opening, A light-emitting unit that emits light toward the object to be measured, The first circuit board on which the incident light processing unit is provided, A second circuit board on which the light-emitting part is provided, A battery that supplies power to the incident light processing unit and the light-emitting unit, A connecting cable for connecting the first circuit board and the second circuit board, The device comprises a frame assembly formed of a metal material, on which the first circuit board and the second circuit board are provided, The aforementioned frame assembly is The main frame that forms the base of the device, A first subframe that holds the first circuit board, A second subframe that holds the second circuit board, It comprises a battery holding portion that forms a shape surrounding the aforementioned battery, The aforementioned mainframe is A frame holding section that holds the second subframe, It has a plate portion that extends in a first direction which intersects with the bottom surface and the top surface which is the surface opposite to the bottom surface, and in a second direction which intersects with the first direction and is the longitudinal direction of the device when viewed from the first direction, The second subframe has a frame support portion that supports the first subframe in surface contact, The aforementioned battery holder is The first wall portion supports the battery from below, A second wall portion, which faces the first wall portion and forms the upper wall portion of the battery holding portion, The device comprises a third wall portion and a fourth wall portion located on either side of the battery in a third direction that intersects the second direction and is the short-side direction of the device when viewed from the first direction, During the measurement, the aperture, the incident light processing unit, and the light-emitting unit overlap when viewed from the vertical direction. A colorimeter characterized by the following features.

2. In the colorimeter according to claim 1, the frame support portion is A first frame support portion fixed to the frame holding portion, It has a second frame support portion provided at a distance from the first frame support portion, A colorimeter characterized by the following features.

3. In the colorimeter according to claim 1, During the measurement, the first circuit board and the second circuit board overlap when viewed from the vertical direction. A colorimeter characterized by the following features.

4. In the colorimeter according to claim 1, It has a third subframe that is fixed to the second subframe, The third subframe has a third frame support portion that is in surface contact with the second subframe. A colorimeter characterized by the following features.

5. A colorimeter according to claim 1, comprising: a third circuit board located on the upper surface and to which a display unit for performing various displays is connected; The system comprises a fourth circuit board to which the aforementioned battery is connected, In the first direction, the second circuit board, the first circuit board, the fourth circuit board, the battery, and the third circuit board are arranged in order from the bottom surface toward the top surface, so that they overlap. A colorimeter characterized by the following features.

6. In the colorimeter according to claim 5, the third circuit board and the fourth circuit board are in direct or indirect contact with the main frame. A colorimeter characterized by the following features.

7. In the colorimeter according to claim 5, The third circuit board has a wireless communication unit that transmits and receives data to and from the outside of the device. The wireless communication unit is located inside the battery holding unit. A colorimeter characterized by the following features.

8. In the colorimeter according to claim 7, The wireless communication unit, when viewed from a third direction intersecting the first and second directions, overlaps with the opening provided in the battery holding portion. A colorimeter characterized by the following features.

9. In the colorimeter according to any one of claims 1 to 8, the incident light processing unit includes a wavelength-tunable optical filter that transmits a predetermined wavelength component of the incident light, The system includes a light-receiving unit that receives light transmitted through the optical filter, A colorimeter characterized by the following features.

10. In the colorimeter according to claim 9, the optical filter is a Fabry-Perot etalon. A colorimeter characterized by the following features.

11. In the colorimeter according to claim 1, The casing and The system comprises a fourth circuit board to which the aforementioned battery is connected, The fourth circuit board has a wired interface, The wired interface is located inside the window portion provided in the housing. A colorimeter characterized by the following features.

12. In the colorimeter according to claim 11, The battery has a temperature detection unit that detects the internal temperature of the battery, The wired interface is located between the incident light processing unit and the temperature detection unit. A colorimeter characterized by the following features.

13. In the colorimeter according to claim 1, It includes a light-gathering member that forms a window through which light taken in from the aforementioned opening passes, The light emitted from the light-emitting part passes between the light-collecting member and the opening-forming member. The light-gathering member forms an optical path through which light emitted from the light-emitting part passes, and an optical path for light incident through the opening. A colorimeter characterized by the following features.

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