Magnetron with controller for monitoring and control

Abstract

A magnetron structure for use in a sputtering apparatus is described. The magnetron structure includes a magnetron (100, 200, 300, 401) and a controller (106, 206, 301, 402) rigidly connected to the magnetron (100, 200, 300, 401). The controller (106, 206, 301, 402) is adapted to at least partially control the state and / or function of the sputtering unit.

Description

Technical Field

[0001] The present invention relates to a sputtering unit that sputters a material from a target to cover a substrate. More specifically, the present invention relates to a magnetron structure or a sputtering unit including such a magnetron structure, whereby it is possible to monitor and control the function or state of the sputtering unit.

Background Art

[0002] Sputtering a material from a target to cover a substrate is commonly performed in a wide range of technical fields, such as the manufacture of integrated circuits, large-area glass coating, and more recently, coating of flat panel displays. Such sputtering is carried out in a reduced-pressure atmosphere, and a sputtering gas or a reactive gas, or a mixture of both, is introduced in a controlled manner. Free electrons hopping within a magnetically confined racetrack ionize gas atoms or molecules near the target surface. These ions are then accelerated towards the negatively biased target, thereby removing target atoms and imparting sufficient kinetic energy to the target atoms to reach the substrate and coat it. The shape of the racetrack is defined by a static magnetic array near the target surface on the side opposite to the surface being sputtered. Such a deposition process is generally referred to as "magnetron sputtering" because of the presence of the magnetic array.

[0003] Numerous devices have been developed, designed, and built with specific applications in mind. The first small magnetron sputtering units used stationary planar targets, initially predominantly circular targets (i.e., the same shape as the silicon wafer being sputtered). Later, elongated rectangular targets became available for coating larger substrates that pass beneath them (see, for example, Patent Document 1). Such elongated planar targets are now commonly used in dedicated "display coaters" for the manufacture of flat-panel displays such as liquid crystal displays (LCDs) and plasma screens. These planar targets are typically mounted on the access door of the device, with the target surface easily accessible (when the door is open), and extending along the length of the substrate, and even across the width of the substrate. In a display coater, the substrate to be covered is held at an angle from vertical to inclined (7° to 15°) and tilted relative to the transport system. Because the target needs to be parallel to the substrate to obtain a uniform coating, the targets must be mounted at substantially the same angle.

[0004] While stationary targets are easy to cool and power (because they are static relative to the device), they have the disadvantage that the target material is eroded only under the racetrack. Therefore, the usable life of the target is limited to the time immediately before the target is first punctured. The problem of uneven erosion can be addressed by introducing a magnet array that rotates relative to the target surface (e.g., a circular planar magnetron is described in Patent Document 2) or a magnet array that translates relative to the target surface (e.g., an elongated planar magnetron is described in Patent Document 3). Although such structures greatly reduce the problem of uneven erosion, the system becomes more complex.

[0005] For example, large-area coaters for coating window glass with all types of functional coatings typically feature a rotating cylindrical sputtering target. The economic driving force in this application is low material cost and throughput with good quality. Rotating cylindrical targets are an ideal choice for this purpose because they have a large width and can be used for long periods. The trade-off is that the target itself rotates relative to the apparatus. Thus, a complex and space-consuming "end block" is required, which supports, rotates, powers, cools, and isolates (from coolant, air, and electricity) the rotating target while holding the magnet array inside and configuring it to be fixed or rotatable. Several types of arrangements exist, for example, a double right-angle end block, a single DC end block, or a single-angle end block.

[0006] In double right-angle end blocks, such as those disclosed in Patent Documents 4 and 5, means for bearing, rotation, power supply, cooling, and isolation (from air, coolant, and electricity) are divided between two blocks located at both ends of the target. Right-angle means that the end blocks are mounted on the wall parallel to the rotation axis of the target. These end blocks are typically mounted at the bottom of a top box that includes auxiliary equipment. The top box with the end blocks and mounted target can be lifted as a whole from a large-area coater, facilitating target replacement and servicing. In a single DC end block, such as the one disclosed in Patent Document 6, means for bearing, rotation, power supply, cooling, and isolation are all integrated into a single end block, and the target is cantilevered within a large-area coater. "DC type" means that the axis of rotation of the target is perpendicular to the wall on which the end block is mounted. A "semi-cantilever" arrangement is also described (Patent Document 7), where the end of the target furthest from the end block is held by a mechanical support (which does not incorporate any other functions).

[0007] The different functions provided by the magnetron (for use with planar or cylindrical targets), or more generally, the different functions of the current sputtering unit, are typically controlled using an external controller. Therefore, control is achieved by transmitting control signals from the external controller to the magnetron in a vacuum via a signal transmission cable. Furthermore, while sensors are known to be used to detect the characteristics of sputtering units, there is room for improvement in monitoring sputtering units. [Prior art documents] [Patent Documents]

[0008] [Patent Document 1] U.S. Patent No. 3,878,085 [Patent Document 2] U.S. Patent No. 4,995,958 [Patent Document 3] U.S. Patent No. 6,322,679 [Patent Document 4] U.S. Patent No. 5,096,562 (Figures 2 and 6) [Patent Document 5] U.S. Patent Publication 2003 / 0136672 [Patent Document 6] U.S. Patent No. 5,200,049 (Figure 1) [Patent Document 7] U.S. Patent No. 5,620,577 [Overview of the project]

[0009] An object of embodiments of the present invention is to enable good monitoring and / or control of the function and / or state of a sputtering unit or a sputtering process performed by such unit, by providing a magnetron structure and / or a sputtering unit including such magnetron structure.

[0010] An advantage of the embodiments of the present invention is that by providing a magnetron structure and / or a sputtering unit including such a magnetron structure, at least some of the monitoring and / or control functions within the sputtering unit are automatically installed when the magnetron is installed, thus facilitating installation.

[0011] An advantage of the embodiments of the present invention is that by providing a magnetron structure and / or a sputtering unit including such a magnetron structure, it is possible to more easily modify the magnetron structure during maintenance. This is because information regarding its operation, including deviations from normal operation, can be obtained from the magnetron structure even when it has been removed from the sputtering unit. In this way, for example, fault operation can be more easily detected.

[0012] An advantage of embodiments of the present invention is, for example, that failure conditions of magnetron components can be easily detected during magnetron refurbishment. The latter can be advantageously implemented in embodiments where monitoring data of the function and / or state of the magnetron or sputtering unit is available over time. In embodiments of the present invention, such data may be advantageously available on the magnetron itself, and as a result, the data is easily accessible during magnetron refurbishment. This, in particular, allows for monitoring of the actual usage time of components, thus enabling proactive replacement of components or allowing components to operate for a longer period.

[0013] In a first embodiment, a magnetron structure for use in a sputtering apparatus is provided. The magnetron structure includes a magnetron and a controller which may be implemented as an integrated circuit, the controller being rigidly connected to the magnetron. The controller may be implemented as an integrated circuit but is configured (e.g., programmed) to control at least partially the state and / or function of the sputtering apparatus. The controller may be a microcontroller. In some embodiments, the controller may be a low-voltage microcontroller. An advantage of embodiments of the present invention is that the controller can actually perform data processing and as a result the state or function of the sputtering apparatus can be controlled by the controller.

[0014] The controller may also be further adapted to at least partially perform monitoring of the status and / or function of the sputtering equipment.

[0015] An advantage of the embodiments of the present invention is that at least a portion of the data processing can be integrated into the magnetron. Another advantage of the embodiments of the present invention is that there is no need for human interaction to process the data.

[0016] In some embodiments of the present invention, the magnetron structure controller, for example, an integrated circuit, includes a data processor for processing signals into data and / or vice versa.

[0017] In some embodiments of the present invention, the controller, for example, an integrated circuit, further includes data storage for storing data relating to at least partial monitoring and / or control of the state and / or function of the sputtering apparatus.

[0018] The advantages of the embodiments relate to the ability to locally store data related to the monitoring and / or control of the state and / or function of a sputtering apparatus over time. An advantage of embodiments of the present invention is that information regarding the state or function of the sputtering apparatus is stored in the magnetron, whereby the state or function of the sputtering apparatus can be evaluated during revision or malfunction. An advantage of embodiments of the present invention is to store data, compare it with data acquired at different times, thereby dynamically monitoring the state of the sputtering apparatus and enabling long-term follow-up and early detection of state deterioration (such as the aging of seals, etc.).

[0019] In some embodiments of the present invention, the magnetron is an end block adapted to support a tubular (e.g., cylindrical) magnet bar and a sputter target.

[0020] In some embodiments, the magnetron can be adapted to mount a planar target and sputter from the planar target.

[0021] In some embodiments of the present invention, the magnetron structure further includes a sensor for detecting sensor signals related to the sputtering apparatus or the sputtering process. A controller, e.g., an integrated circuit, is adapted to receive and process signals from the sensor.

[0022] An advantage of embodiments of the present invention is that the state of the process, target, or any other subsystem (such as bearings or cooling systems) can be monitored in-situ and during the use of the sputtering apparatus.

[0023] In some embodiments of the present invention, a controller, for example, an integrated circuit, further includes a communication component for exchanging data with a controller outside the vacuum part of the sputtering apparatus. In certain embodiments, the communication component is adapted to conduct wireless communication (using any one of WIFI communication, Bluetooth communication, optical communication, or any other type of EM radiation) or to conduct wired communication (using either optical fiber communication or electrical communication).

[0024] The communication component may include a connector for exchanging data between the non-vacuum part outside the sputtering apparatus and a controller, for example, an integrated circuit.

[0025] An advantage of embodiments of the present invention is that data can be read or an alarm can be activated and / or a readout for command input can be used in combination with a magnetron.

[0026] In some embodiments of the present invention, the magnetron further includes a controller for controlling at least one actuator and adjusts parameters related to the sputtering process in the sputtering apparatus.

[0027] An advantage of embodiments of the present invention is that the process can be automated.

[0028] Furthermore, the controller can be adapted to control at least one actuator within a desired window to adjust parameters.

[0029] An advantage of embodiments of the present invention is that the processor can reduce the need for human interaction and automatically control parameters within a certain range, thereby achieving a high degree of independence from the outside.

[0030] In some embodiments of the present invention, the magnetron structure further includes a power supply for powering a controller, such as an integrated circuit. The power supply may be a battery or a power extractor adapted to obtain power from a coolant flow in a target tube or an electrical power supply.

[0031] In some embodiments of the present invention, power supply to a controller, for example, an integrated circuit, is based on a wired connection from an external non-vacuum part of the sputtering apparatus.

[0032] An advantage of some embodiments of the present invention is that, because the use of batteries is avoided, maintenance is required less.

[0033] In some embodiments of the present invention, the magnetron includes an upper component for holding a target and a lower component that can be attached to the upper component. A controller, for example, an integrated circuit, may be rigidly connected to the lower component.

[0034] An advantage of the embodiments of the present invention is that the controller, for example, an integrated circuit, is easily accessible from outside the unit and can be easily installed and maintained.

[0035] In some embodiments of the present invention, the magnetron structure includes a wireless connector, which includes an antenna for transmitting data to the outside of the system.

[0036] An advantage of the embodiments of the present invention is that, since there is no need for a wired connection to an external control system (such as a computer), it is possible to obtain a very compact end block that does not require extra wires for data transmission either within or outside the unit.

[0037] An advantage of embodiments of the present invention is that an end-block system can be simplified by using a single connection (e.g., a single wired connection, or even a single wireless connection) to power a controller, e.g., an integrated circuit, and to exchange data with the controller, e.g., an integrated circuit, thereby reducing the amount of connection to external controls and / or power supplies. Alternatively, different connections or multi-wire connections may be used.

[0038] In some embodiments of the present invention, the data is one of the following: coolant-related information, sputtering power-related information, magnetic-related information, magnetron state-related information, or target drive-related information, or a combination thereof.

[0039] Coolant-related information may include, but is not limited to, the incident temperature, exit temperature, pressure, flow rate, or resistivity of the coolant, or a combination thereof. Sputtering power-related information may include, but is not limited to, the voltage directed toward the target, such as the voltage on a specific component due to induction, the current through the system, the spectral content, or the impedance, or a combination thereof. Magnetic information may include, but is not limited to, the type of magnet configuration, the positioning of the magnet configuration such as global positioning like translational or rotational position or travel speed, local positioning, temperature, or magnetic intensity, or a combination thereof. Magnetron state-related information may include, but is not limited to, the temperature near the target, the temperature on a specific part of the magnetron, the pressure in the system, humidity, or coolant, or a combination thereof. Target drive-related information may include, but is not limited to, the rotational or travel speed over time or temperature, the operating life, the drive unit current, or the torque level, or a combination thereof.

[0040] A controller, such as an integrated circuit, may provide information to facilitate maintenance during use, including information about its status and the predicted timing of necessary preventive maintenance.

[0041] A controller, such as an integrated circuit, provides information to facilitate maintenance during revisions in order to understand historical data, thereby enabling proper revision and maintenance.

[0042] In a second embodiment, a sputtering apparatus is provided, the apparatus including a magnetron structure according to any embodiment of the first embodiment and a magnet configuration.

[0043] In a third aspect, the use of a controller within the magnetron structure, such as an integrated circuit, is provided for at least partially controlling the state and / or function of the sputtering apparatus. The controller may be further configured to at least partially monitor the state and / or function of the sputtering apparatus.

[0044] An advantage of the embodiments of the present invention is that a processing-capable circuit can be used in combination with a magnetron. This enables an easy control and / or readout interface by reducing setup hurdles such as software installation and connections between an external computing system and multiple connectors from the sputtering unit's sensors. A very compact, "smart" magnetron is obtained.

[0045] Specific preferred embodiments of the present invention are described in the attached independent and dependent claims. Features from the dependent claims are not merely expressly stated in the claims, but may be combined with features of the independent claims and other dependent claims as needed.

[0046] These and other aspects of the present invention will be made clear and evident by referring to the embodiments(s) described below. [Brief explanation of the drawing]

[0047] [Figure 1] An exploded view shows a magnetron structure according to an embodiment of the present invention, including a motor. [Figure 2] An exploded view shows a magnetron structure according to an embodiment of the present invention, including a cooling (sub)system. [Figure 3] This shows a front view of an end block equipped with an integrated circuit according to an embodiment of the present invention, facing a ring to which a target may be attached. [Figure 4] A perspective view of the end block, with some parts removed for better visualization, is shown, illustrating an exemplary arrangement of an integrated module containing an integrated circuit according to an embodiment of the present invention.

[0048] The drawings are merely schematic and not limiting. In the drawings, the sizes of some elements may be exaggerated for illustrative purposes and may not be drawn to scale.

[0049] No reference numeral in a claim should be construed as limiting the scope of the claim.

[0050] In different drawings, the same reference numeral refers to the same or similar element. [Modes for carrying out the invention]

[0051] The present invention will be described with respect to specific embodiments and with reference to specific drawings, but will not be limited thereto, and will be limited only by the claims. Dimensions and relative dimensions do not correspond to actual reductions in the implementation of the invention.

[0052] Furthermore, terms such as “first,” “second,” etc., in the specification and claims are used to distinguish similar elements, not necessarily to describe a sequence in time, space, ranking, or any other form. It should be understood that such terms are interchangeable under appropriate circumstances, and that embodiments of the invention described herein may operate in an order other than those described or shown herein.

[0053] Furthermore, terms such as "top," "bottom," etc., in the description and claims are used for descriptive purposes and not necessarily to describe relative positions. Terms used in this manner are interchangeable under appropriate circumstances, and it should be understood that embodiments of the invention described herein may operate in orientations other than those described or shown herein.

[0054] It should be noted that the term “comprising” as used in the claims should not be interpreted as limiting the means listed thereafter, nor as excluding other elements or steps. Therefore, it should be interpreted as specifying the presence of the described features, integers, steps, or components as mentioned, but not as excluding the presence or addition of one or more other features, integers, steps, or components, or groups thereof. Thus, the term “comprising” encompasses situations where only the described features exist, as well as situations where these features and one or more other features exist. Therefore, the scope of the expression “device comprising means A and B” should not be interpreted as limiting the device to a device consisting only of components A and B. It means, with respect to the present invention, that only the relevant components of the device are A and B.

[0055] Throughout this specification, any reference to “one embodiment” or “embodiment” means that any particular feature, structure, or characteristic described in relation to an embodiment is included in at least one embodiment of the present invention. Therefore, the occurrence of the phrase “in one embodiment” or “in an embodiment” in various places throughout this specification does not necessarily refer to the same embodiment, but it may. Furthermore, as will be apparent to those skilled in the art from this disclosure, in one or more embodiments, particular features, structures, or characteristics can be combined in any preferred manner.

[0056] Similarly, in the description of exemplary embodiments of the present invention, it should be understood that various features of the invention may be summarized in a single embodiment, figure, or description thereof for the purpose of simplifying the disclosure and aiding in the understanding of one or more of the various embodiments of the invention. However, this method of disclosure should not be interpreted as reflecting an intention that the claimed invention requires more features than are explicitly enumerated in each claim. Rather, as reflected in the claims below, the embodiments of the invention are fewer than all the features of a single, aforementioned disclosed embodiment. Thus, the claims following the detailed description are explicitly incorporated into this detailed description, and each claim stands independently as a separate embodiment of the invention.

[0057] Furthermore, some embodiments described herein include some features included in other embodiments but do not include others, meaning that combinations of features from different embodiments fall within the scope of the invention and form different embodiments, as will be understood by those skilled in the art. For example, in the following claims, any of the claimed embodiments may be used in any combination.

[0058] Numerous specific details are given in the description provided herein. However, it will be understood that embodiments of the present invention may be carried out without these specific details. In other examples, well-known methods, structures, and techniques are not shown in detail so as not to obscure the understanding of this description.

[0059] In embodiments of the present invention, when a magnetron structure is referred to, a magnetron and controller, such as an integrated circuit, rigidly connected thereto is also referred to. The integrated circuit may be positioned inside the magnetron or mounted on the magnetron, a particular part thereof, or its housing. The magnetron may include an upper component for mounting a target on it, a housing, and a bottom component for mounting the magnetron to the rest of the sputtering unit. Thereafter, the controller, such as an integrated circuit, may be rigidly mounted to the upper component, housing, or bottom component, or may be located inside any of these components.

[0060] Furthermore, when referring to a magnetron structure, one may also refer to a system for use with a planar target, as well as a system for use with a cylindrical target. In the latter case, the magnetron structure may also be referred to as an end block structure, and the magnetron may be referred to as an end block. In some specific embodiments, the upper component may correspond to an end block head for mounting a cylindrical target and / or a corresponding magnet bar. In such embodiments, the bottom component may also correspond to a base plate typically used to mount the end block to the rest of the sputtering apparatus.

[0061] The superstructure of the magnetron may be subjected to harsh plasma environments (e.g., heating, impact, etc.) and may include all critical components of the magnetron structure that require periodic inspection or maintenance. For example, it may include wear parts (e.g., dynamic seals, brushes for transmitting signals or power, sliding and rolling parts, etc.) or that may require cleanup or lubrication or any other intervention. The superstructure consists of or may include subassemblies that can be easily removed or replaced for revision and rapid replacement. This allows for minimal downtime of the sputtering equipment, while revision or updating of subassemblies can be performed separately (off-site or in an area not necessarily linked to the sputtering equipment) without affecting the function of the sputtering equipment.

[0062] The bottom component may be rigidly connected by the sputtering apparatus, for example, bolted to a wall, cover, lid, or part of the sputtering apparatus, such as a part of the vacuum chamber. The bottom component may be less susceptible to aging, less susceptible to harsh environments, and may not require any periodic inspection or revision as a priority. The bottom component may be a component that interfaces with the upper component to enable the sputtering process to operate, but in most cases it is considered to belong to the sputtering apparatus. Thus the magnetron structure may consist of a single large structure or multiple structures as described herein, having an upper component and a bottom component.

[0063] In embodiments of the present invention, when referring to a sputtering unit, it refers to a system comprising a magnetron structure and a magnetic configuration (i.e., a magnetic bar in the case of a system for a cylindrical target). The sputtering unit is typically positioned within a vacuum chamber, thereby forming part of a sputtering apparatus. Other components of such a sputtering apparatus may be a vacuum pump system, a substrate holder, etc., which are well known to those skilled in the art.

[0064] In embodiments of the present invention, when referring to signal processing or data processing, it may refer to modifying, altering, calculating, or applying a predetermined algorithm thereto. In embodiments, when referring to communication, this may include transmitting, storing, and retrieving.

[0065] In a first aspect, the present invention relates to a magnetron structure for use in a sputtering apparatus. The magnetron structure includes a magnetron and a controller which may be implemented as an integrated circuit, the controller being rigidly connected to the magnetron. The controller is configured to control the state and / or function of the sputtering apparatus. In some embodiments, the controller may be further configured to at least partially monitor the state and / or function of the sputtering apparatus. In some specific embodiments, the controller may include a data processor for processing signals into data and / or vice versa. Such data may be stored and / or used for monitoring or controlling the sputtering apparatus. The controller may be a microcontroller, such as a low-voltage microcontroller.

[0066] It should be noted that the magnetron structures according to embodiments of the present invention may be structures for use with flat targets as well as structures for use with cylindrical targets. Hereafter, magnetron structures for use with cylindrical targets are often referred to (in such cases, by referring to end block structures and end blocks). This is because they present some additional issues in terms of target movement used in vacuum systems under vacuum conditions, where monitoring and control according to embodiments of the present invention can be advantageously used. Nevertheless, similar teachings can be applied mutatis mutandis to structures for flat targets, and such structures are also envisioned.

[0067] While end blocks integrated into the wall are also possible, it is preferable that they be mountable as a single unit on the sputtering apparatus. Components detachable with the target tube, or detachable magnet bar assemblies, may not be considered part of the end block. The primary function of the end block is to support the target. The end block may also be configured to rotate the target around a rotation axis. Because sputtering is performed under low gas pressure, the end block must always be airtight, and especially when rotating. Sputtering a target generates a significant amount of heat on the target surface, so it is usually necessary to cool the target using water or another suitable coolant or refrigerant. This coolant must be supplied and discharged through the end block. Additionally, an electric current must be supplied to the target to maintain it above a certain potential. This current must also pass through the end block. To incorporate all these functions, the end block may include various means.

[0068] A) A driving means for rotating the target (e.g., a driver), e.g., a worm gear system, or a cylindrical gear system, or a conical gear cross axis system, or a pulley belt system, or any other means known in the art for rotating the target.

[0069] B) Electrical contact means (e.g., rotatable contact, connector) that supply current to the target. This can be achieved by an electric commutator with a commutator ring and brushes in sliding contact. Instead of the arrangement of brushes and rings, two rings that slide against each other can also be used, or a conductive belt-type connection such as a metal belt can be used. With the latter solution, the driving means is radially conveniently combined with the electrical contact means.

[0070] C) Bearing refers, for example, to a single bearing. Depending on the weight of the target, two or more bearings may be required. A person skilled in the art will readily be able to select the appropriate type of bearing from different known types, such as ball bearings, roller bearings, plain bearings, axial bearings, or any other type known to a person skilled in the art.

[0071] D) At least one coolant seal, e.g., a rotary coolant seal. These coolant seals prevent coolant from leaking into the end block, or worse, into the vacuum apparatus or sputtering chamber, as the fixed rotatable portion of the end block rotates relative to it. To mitigate this risk, several coolant seals are introduced in a cascade. Typically, lip seals are used as coolant seals, as is well known in the art. However, this does not exclude other types of seals (but not exhaustive), such as mechanical face seals or labyrinth seals.

[0072] E) Finally, it may include at least one vacuum seal, such as a rotary vacuum seal. These vacuum seals ensure a complete vacuum while the fixed and rotating parts of the end block rotate relative to each other. To reduce the risk of vacuum leakage, a cascaded series of vacuum seals (protecting the vacuum in stages) is recommended. Also, different seals are known, of which lip seals are the most common, but other types of seals, such as magnetic fluid seals, can of course be used as well.

[0073] As described above, a magnetron may typically include a magnetron upper component that houses the different means described above, and a magnetron bottom component for mounting the magnetron to the system and connecting it between the vacuum side and the non-vacuum side of the sputtering apparatus.

[0074] According to embodiments of the present invention, a controller, for example, an integrated circuit, is rigidly mounted to the magnetron, i.e., to an upper component, a bottom component, or a housing. In some embodiments, the controller may be positioned inside the upper component or the bottom component of the magnetron. According to at least some embodiments of the present invention, at least part of the signal-to-data processing, or vice versa, is also performed within the controller.

[0075] In some embodiments of the present invention, signals, for example, signals from a sensor (sensor signals), can be received within the controller and processed into data for monitoring or controlling the state of the sputtering apparatus or its components, or the state of the sputtering process. The data can be further used, stored, or communicated by further devices, such as outside the vacuum chamber. Thus, the magnetron structure may also include data storage means and / or data communication means.

[0076] In some embodiments of the present invention, control data optionally originating from outside the vacuum portion of the sputtering apparatus may also be transferred to and processed within the controller to generate control signals within the magnetron for controlling the magnetron or components of the sputtering apparatus. For example, control signals may be received and processed from an input command console (e.g., outside the vacuum portion of the sputtering apparatus). These can also be stored. Using control data related to the control of the state of a unit or sputtering process, the controller can control actuators within the vacuum portion of the sputtering apparatus, such as those in the magnetron.

[0077] In some embodiments, both monitoring data and control data can be handled by the magnetron's controller.

[0078] In some embodiments, the controller can receive signals from sensors, provide processed monitoring data, use such information to generate control data, and use this control data to control, adjust, or fine-tune the sputtering apparatus or sputtering process by transmitting it to actuators that require minimal human interaction. In this way, an automated sputtering process can be provided that requires little to no communication with the space outside the vacuum chamber.

[0079] For illustrative purposes, the embodiments of the present invention are not limited thereto, and standard and optional features will be described further with reference to the drawings. Here again, the magnetron structure is referred to for a cylindrical target, but it can also be applied to a magnetron structure for a planar target.

[0080] Figures 1 and 2 show two exploded views of different types of magnetron structures 100, 200, including upper components 101, 201 and lower components 102, 202. The upper components 101, 201 are used to mount the target, and the lower components act as a link between the upper components and external subsystems (typically located outside the vacuum system), such as a motor and cooling system. Magnetron 100 in Figure 1 is a magnetron that provides a driving function so that it can drive a cylindrical target. Magnetron 200 in Figure 2 provides a cooling and power supply function for introducing a coolant to cool the target and for setting the target at a sputtering voltage. However, the present invention is not limited to these types of magnetrons. All of the functions described above may be concentrated in a single magnetron or may be divided differently on different magnetrons. Furthermore, the lower and upper components may be integrated.

[0081] The magnetron shown in Figure 1 includes an upper part 101 that can be attached to a bottom part 102, for example, by screwing the threaded neck 103 of the upper part 101 into the corresponding portion 104 of the bottom part 102. Any other suitable connection system may be used. In the example in Figure 1, a motor set 105 is connectable to the bottom part 102, which can transmit the driving force of the motor 105 to the upper part 101 of the magnetron 100. The upper part 101 then rotates a rotatable target attached to the upper part 101. In some embodiments of the present invention, the motor set may also be integrated with the upper part into a single piece.

[0082] According to embodiments of the present invention, the controller 106, which optionally includes a processor (e.g., a processing unit), may be contained within the upper part 101 of the magnetron (e.g., mounted on the static part). However, it may also be contained within the bottom part (e.g., mounted on the bottom part).

[0083] In Figure 2, the cooling circuit 203 is contained within the bottom component 202 to introduce a coolant (e.g., water, treated water, any other suitable liquid, or gas) into the target through the upper component 201 via the inlet 204, and to discharge the used coolant via the outlet 205. In this particular example, power lines are connected to bolts 208 above the inlet and outlet, supplying power to the upper component 201 through pins on the base plate. A controller 206, including a processor, can be mounted in either the upper or bottom component of the end block.

[0084] In some embodiments, the controller 206 may be positioned on the vacuum side of the magnetron structure, thereby enabling the direct transmission of any signal from within the unit. The present invention is not limited to this configuration, and an integrated circuit may be located on the atmospheric side of the magnetron structure, for example, to process data related to the function of the cantilever magnetron.

[0085] In any case, wherever the controller is mounted, it will be advantageously protected from the material, plasma, and coolant deposited during the sputtering process.

[0086] In some embodiments of the present invention, at least one sensor or actuator 207 may be incorporated into the magnetron itself, thereby providing a highly integrated magnetron. For example, the sensor or actuator may be part of the magnetron's controller. For instance, in-situ monitoring can be performed during sputtering, which is a compact method that does not require further installation or connection.

[0087] As an example, although the embodiments are not limited thereto, we will further describe examples of monitoring and / or controlling specific parameters in a controller within a magnetron structure.

[0088] An example of surveillance. Power monitoring The signal may be provided to the controller 206 from, for example, at least one sensor (not shown). The at least one sensor may detect parameters related to sputtering power, such as the voltage supplied to the target, the current through the system, the spectral content of the signal (e.g., changes in AC shape, frequency, etc.), impedance, etc. This may provide information about target-related issues such as surges, process stability, power transmission status, and arcs. The sensor for generating such a signal may be included in the magnetron as part of the controller, for example. For example, the sensor may detect the power transmission status. For example, the condition of the brushes (used to transmit power from the stationary part of the magnetron to the rotating part of the magnetron) can be detected to detect wear, etc. (e.g., by monitoring resistance). Additionally or alternatively, the sensor signal may be provided from outside the magnetron structure, for example, into the vacuum system.

[0089] Sensors can be used to detect electrical parameters such as resistance sensors, voltmeters, current sensors, and waveform detectors. These parameters can be measured locally on the target, within the magnetron, or at the input ports of electrical signals to the unit. Measuring directly on the magnetron structure rather than through a conventional power supply provides a richer signal morphology and more accurate information. Existing setups require the use of long cables to obtain measurements, resulting in signals at the power supply not accurately reflecting the signal near the target. Wiring can have impedance losses, which can prevent the actual impedance of the plasma from being easily measured at the power supply. Furthermore, high-frequency signals can be attenuated by the connection lines. This effect makes it difficult to investigate signal disturbances. These disturbances are important sources of information because they can be caused by plasma vibrations or physical limitations of the target finish or the power transmission means of the magnetron. In embodiments of the present invention, target measurement provides faster and more accurate signals without capacitive or inductive losses from cables and / or the magnetron connection system.

[0090] The controller 206 collects signals and provides processed data therefrom, thereby providing information related to monitoring the sputtering process (e.g., power supply stability).

[0091] Monitoring the coolant level. In another example, signals may be provided to the controller 206 in Figure 2 from at least one sensor 207 capable of detecting parameters related to the coolant, such as the temperature of the fluid passing through the inlet 204 and the temperature of the fluid passing through the outlet 205 (and the difference between them). This can be used to evaluate the efficiency of the cooling process. Alternatively, or in addition to these, parameters related to pressure or flow rate can also be detected, which can be used to detect pressure drops or spikes, and even leaks. Another parameter is the resistivity of the coolant, which may be useful for monitoring the amount of salt and other additives in the coolant.

[0092] As before, the controller 206 collects signals and provides data that has been favorably processed therefrom, thereby providing information relevant to monitoring the cooling process.

[0093] The sensor can be incorporated back into the magnetron (for example, in the upper or lower component) as part of the cooling system components present in the magnetron. For example, flow sensors at the inlet and outlet can be used to measure the coolant flow rate, and the controller can process and monitor the differential flow. This may, for example, enable the detection of leaks. Additionally or alternatively, the sensor signal may be provided from another location, for example, from the portion of the target tube receiving the coolant.

[0094] Monitoring of magnetic configuration In some embodiments, the controller may capture and process sensor signals and obtain information related to the magnetic configuration, for example, one or more of the following non-exhaustive examples of magnetic sensor signals. - The type of magnetic configuration, and / or the magnetic configuration, for example, global (detection of translational or rotational position, movement speed, etc.) and / or local positioning (for example, from magnetic sensors such as optical sensors and Hall sensors). - The temperature of the magnetic source (thermocouples, etc., can affect the strength of the magnetic field). - Magnetic intensity (for example, at multiple points along a magnetron). The controller collects sensor signals and provides processed data related to the magnetic field, which can be used to monitor issues in the sputtering process or sputtering equipment, such as plasma racetrack, ion collisions, and process efficiency.

[0095] Monitoring the characteristics of other sputtering equipment In some embodiments, controllers 106, 206 may capture the following non-exhaustive examples of sensor signals or actuator settings related to the state or function of the sputtering system, or may also capture from the rest of the sputtering apparatus (e.g., from the vacuum chamber). - Temperature near the target (e.g., the backing structure of the target). - The temperature of specific parts of the magnetron (housing, connectors, seals, etc.). - Pressure within the system. For example, some components may be in the atmosphere or have a pressure difference between the atmosphere and the pressure within the vacuum system, which could lead to the detection of a gas leak. - A sensor specifically adapted to detect humidity, or, for example, coolant outside a cooling system or outside a target, in order to check and detect a liquid leak.

[0096] The controller collects sensor signals and, advantageously, provides processed data from them related to the state of the magnetron. This can be used to monitor issues related to sealing, etc.

[0097] For magnetrons used with cylindrical targets, the controller can also handle information related to target drive, such as target movement speed (e.g., target rotation) and cumulative rotation amount. This information may be processed to monitor the operating life. Note that processing performed by the electronic circuitry may take other characteristics (e.g., other characteristics also monitored by the controller), such as load level and temperature, into account as weighting factors for processing the operating life.

[0098] Current, torque level, and their historical information (e.g., historical information over time or historical information within one rotation), as well as the temperature of the drive unit, can also be monitored.

[0099] Furthermore, the state of the drive mechanism within the magnetron and the state of the bearings (e.g., pressure on the bearings) can be detected, transmitted to the controller, and processed into monitoring data.

[0100] In some embodiments of the present invention, the processed data can be transmitted to an external location outside the vacuum section of the sputtering apparatus, such as a readout device (screen, monitor, color-coded light panel, etc.), external memory, or an external data processing unit, for further processing, such as data analysis. For data exchange, the magnetron structure may have an interface to external devices for communication. This may be wireless (e.g., Wi-Fi, Bluetooth, optical, or any other type of EM radiation) or wired, with connectors (electrical connectors, optical connectors, etc.) for transferring data. Additionally, or alternatively, processed data may be stored in the memory included in the controller. For example, by building a history record of the monitoring data, long-term monitoring and follow-up of the sputtering apparatus, which can also be identified by the controller according to embodiments of the present invention, is possible. Based on such historical data, deterioration of the unit's condition (such as aging of seals or bearings, wear of contact brushes, increased friction or torque, increased temperature, consumption or damage to targets, or any other characteristics) can be detected early, before damage spreads to other parts or the sputtering process deteriorates.

[0101] In alternative or additional embodiments of the present invention, control data can be processed by a magnetron controller.

[0102] For example, a control signal can be sent to the magnetron, and a controller can provide signal processing. The processed control data can be used to control an actuator connected to the controller. The magnetron structure or the electronic circuitry within it can be adapted to control the actuator according to the control data processed by the processor. Thus, only an input console is required to control the aforementioned actuators, and no processing power (computer) outside the vacuum section of the sputtering apparatus is required to control these actuators. The actuators may be located outside the vacuum section of the sputtering apparatus (e.g., a power supply actuator or a cooling system actuator), or inside the sputtering apparatus (e.g., on the magnetron, or on a gas inlet valve, or drive system), or inside the magnetron (e.g., on a cooling system inlet valve, or drive system). As before, an interface for transferring control data may be provided, which may be the same as or of a different type as the interface for transferring monitor data.

[0103] Control examples The following are examples of process control means that can be processed as control data by a magnetron structure, and the corresponding process parameters. - Power supply: Process parameters related to the power supply include, for example, waveforms or power levels related to the energy applied to the system, such as voltage levels or current levels. The power supply level is typically a global process parameter; that is, the power supply level cannot be changed in only one location. Increasing the power supply level while keeping other deposition parameters constant may, for example, increase the thickness. In a sputtering process, the power supply is typically connected to a magnetron to power the target. However, additional power supplies may be provided in parallel, for example, to power the active anode system or to power the ion source.

[0104] In embodiments of the present invention, control data related to the power supply and power level can be processed, which includes controlling the power of the ion source and / or magnetron. - Main gas supply: The process parameter related to the main gas supply is gas flow. The gas distribution determines the location-dependent partial pressure within the process chamber. Gas distribution is a complex parameter because different gases can be generated, either pure or in various mixing ratios. The impact of the main gas supply can be limited so as not to exceed the size of the delivery system within the process chamber. - Reactive gas supply: Process parameters related to reactive gas supply include gas distribution and the partial pressure or gas flow rate involved. Higher reactive gas flow typically produces a lower sputtering rate. The thickness of the deposited layer can be controlled by changing the reactive gas flow, although its composition and properties can also have an effect. -Target (e.g., rotational speed). The actuator may be positioned within the magnetron structure to adjust the rotational speed, for example, by adjusting the drive system or by directly adjusting the motor. - Magnetic configuration: Process parameters related to the magnetron include, for example, magnetic field strength, magnet movement, or rotational speed. Magnet movement includes the orientation and position of the magnet bar. The position of the magnet bar determines the plasma density, i.e., the sputtering rate. If the magnet bar contains sections, the effect of the magnet bar can be localized. The stronger the local magnetic field, the higher the local sputtering rate. - Anode: The process parameter related to the anode is the anode tuning level, for example, the resistance to the ground level. - Heating: The process parameter related to heating is the temperature level. Different temperatures can be applied in different locations. - Coolant: Process parameters related to the coolant may be flow rate, temperature, conductivity, purity, and amount of debris (e.g., particles in the fluid that can wear down dynamic seals). For example, a controller may be used to steer and / or control valves mounted inside the magnetron structure to control (e.g., optimize) the coolant properties (e.g., flow rate).

[0105] Control can be provided externally, for example, by sending a signal to a controller and processing it to obtain control data. The present invention is not limited to these, and control can be provided internally. For example, control of the target and / or magnetic configuration may be performed internally, for example, based on monitoring data, using a controller included in the magnetron structure.

[0106] The control data may include any or a combination of these enumerated parameters. The parameters may be controlled by changing different actuators in different systems. Control data related to the movement of the magnet may be processed, for example, in the electronic circuitry of a magnetron structure and used via an actuator linked to a controller to influence the aforementioned movement, for example, the orientation of a bar.

[0107] In some additional or alternative embodiments, the controller is adapted to both monitoring the status of the sputtering apparatus (or sputtering process) and controlling the sputtering apparatus (or sputtering process).

[0108] In one example, a magnetron-structured controller can receive or capture sensor signals. These signals are processed into monitor data. In response to the monitor data, the controller generates control data, which can be used to control a part of the sputtering process or sputtering apparatus. Thus, a feedback loop with good self-regulation of the process or sputtering apparatus can be established. This brings high stability to sputtering and reduces the need for human feedback or intervention. Generally, the reduced human interaction gives an advantage to highly automated units.

[0109] In this embodiment, it is not necessary to strictly connect the actuators that can be controlled from within the controller. During the installation of the sputtering apparatus, it is only necessary to connect the actuators and sensors to the magnetron structure circuit, and it is not necessary to connect and configure the actuators and / or sensors to any external computer or control system. This results in a compact, stable, and modular unit with fewer external connections. Connections can be provided as needed for initial setup or to introduce external control (e.g., to override feedback control), or to output monitor data or alarm signals generated within the controller based on monitor data. This allows for human interaction, but to a limited degree. For example, the sputtering apparatus may be independent within the range of the operating point. For example, a system with a self-contained magnetron structure may be provided in which only high-level data can be transmitted externally. For example, maintenance is usually required during the coating process, for example, on the coater stop. The present invention allows the remaining fluctuations to be handled internally. This enables the next coater stop to be achieved smoothly without intermediate failures.

[0110] Specific examples of monitoring and control combinations Multiple configurations of a magnetron, including a controller for controlling and / or monitoring the state of the sputtering process and sputtering apparatus, can be provided. Any suitable combination of monitoring data and control data can be used, for example, power control when the power level drops, increased coolant flow when the monitoring data indicates an increase in power level or temperature, or a combination of both, fluctuations in sputtering gas flow when the racetrack becomes unstable, and other combinations.

[0111] In a specific example of this feedback configuration, a controller in a magnetron structure can monitor the sputtering process and / or power. When the monitored data indicates stable sputtering and low power consumption, the controller can use this information to generate control data and control the actuators of the cooling system to reduce the coolant flow, thereby reducing fluid (e.g., water) consumption. However, the processor can be programmed to reduce the coolant flow rate only within a predetermined range from a safe operating point. Alternatively, the controller can be programmed to notify the operator for verification if the flow exceeds this range (for example, if the control data indicates that the flow is decreasing below a predetermined threshold).

[0112] In some applications, the magnetron may overheat, leading to energy loss, thermal expansion, and degradation over time. This can damage vacuum seals, coolant seals, etc. In some embodiments of the present invention, sensors within the housing or within the magnetron may detect temperature and / or thermal expansion, and the signals can be transmitted directly to a controller for processing. If one or more sensor signals are interpreted and the data indicates that the signal exceeds a predetermined threshold, the processed data can be used to generate control data for controlling an external alarm of the magnetron unit, or control data for reducing power supply and / or frequency and / or rotational speed, or one of a number of parameters. In certain embodiments, the sensor for monitoring the state of the magnetron structure may be part of the controller, resulting in a very compact arrangement.

[0113] In certain examples, the sensor may be included in a magnetron structure that detects torque. A controller may capture the sensor signal (for example, the sensor signal may be sent to the controller for processing), and a processor may interpret the signal into monitor data, thereby monitoring the target torque. The processor may be programmed to turn off an alarm by sending a signal to an alarm system if the torque falls outside a predetermined range. If the torque falls outside a predetermined range, this may mean that the target is not properly mounted to the magnetron or that there is excessive friction. The monitor data may also show periodic changes in torque, which may mean that the target is deformed (e.g., bent) and damaging some components of the sputtering apparatus. The torque data can also be linked to the target velocity, which can be introduced directly via a data interface or it can be detected.

[0114] Controller example The controller may include a processor to provide processed data. The controller can be programmed to process sensor signals (e.g., signals generated by and received from a sensor), thereby providing monitoring data. In such cases, the controller may include signal inputs, such as optical inputs, electronic inputs (wired or wireless inputs, e.g., via high-frequency RF), pressure inputs, etc. Analog-to-digital converters and / or digital-to-analog converters may be included in the circuit.

[0115] Additionally, or alternatively, the processor can be programmed to generate control data from commands. In such cases, input for external commands may be included. In some embodiments, the control data can be programmed to generate control data derived from sensor signals, for example, from monitor data processed by the electronic unit itself. Controllers can generally be adapted to drive and control actuators in magnetron structures within sputtering equipment or associated subsystems. These may be located inside or outside the vacuum portion of the sputtering equipment (cooling system, power supply, etc.).

[0116] The controller may include data storage (e.g., memory) for storing data, lookup tables, algorithms, etc. These can be accessed by the processor and / or external systems to provide long-term monitoring, etc. The stored information may relate to monitoring data (such as history records), control data (for actuator control), or data related to the monitoring and / or control of the sputtering process or sputtering equipment.

[0117] The controller may be adapted to provide feedback to control the actuator, for example, in response to processed monitor data and / or in response to a comparison of the values ​​of the monitor data in memory with predetermined data.

[0118] The magnetron has an interface to external devices for communicating and exchanging data with external devices. This may be wireless (e.g., Wi-Fi, Bluetooth, optical, or any other type of EM radiation) or wired, with a connector (electrical, optical, etc.) for transferring data to a controller. The interface may include a connector that extends outside the vacuum portion of the sputtering apparatus through the magnetron and / or its housing, from which it can connect to external devices, for example, via a wired connection. In some embodiments, as shown in Figure 1, the interface 108 or its connector includes an antenna 109 for exchanging signals with external devices.

[0119] In some specific embodiments, the magnetron interface can transmit and / or receive data (monitoring data and / or control data), and can also receive power to supply power to a controller, for example, using a single connector. The number of connections, wires, etc., can be reduced. This dual connector for data and power signals can be wired or wireless.

[0120] The interface may be part of the controller. In other embodiments, the controller may connect to an interface located elsewhere, for example, on the magnetron, separate from other circuits. For example, as shown in Figure 1, the controller 106 may be located within the upper part 101 of the magnetron, which may exchange data with an interface 108 located within a mountable bottom part 102. Data exchange between the interface and the controller may be via a wired connection. It may also be wireless, in which case both the interface 108 and the controller 106 may include a wireless data transmitter / receiver, thereby obtaining a fully modular magnetron assembly that is easily replaceable and interchangeable. For example, it is also possible to use upper parts of different magnetrons with the same bottom part, pairing only the wireless connection between them.

[0121] The controller can be powered by a local source such as an integrated battery. In some embodiments of the present invention, the circuit may be powered by extracting energy (e.g., in a power extractor) from an available source such as a coolant flow (hydraulic conversion) or electrical power supply to the target tube. In some embodiments, the circuit may be powered by an external connector, which does not require maintenance such as opening the vacuum system of the sputtering apparatus to change the battery.

[0122] The controller may include a cooling system. For example, the cooling system of a sputtering apparatus may provide cooling to the controller.

[0123] In some embodiments of the present invention, at least the processor may be a monolithic circuit, but more elements may be included as part of the controller.

[0124] In some embodiments, as shown in Figure 3, the controller is an integrated module 301, which includes a processor (e.g., a monolithic processor 302), and further includes an ADC, DAC, data connector, signal input for capturing sensor signals, a driver, and even sensors and / or actuators. Thus, a highly integrated device is obtained that can be adapted and tuned to a particular shape of the magnetron 300.

[0125] Figure 4 shows a perspective view of the magnetron 401 with its cross-section removed for internal viewing. An exemplary arrangement of an integrated module 402 containing a processor embedded within the magnetron 401 is shown. Module 402 may be mounted on a stationary part of section 401 to facilitate any necessary connections. The shape of module 402 may be adapted to allow for the introduction of any necessary power pins, cooling systems, etc. The example shown in Figure 4 is an example of an integrated magnetron without separate top or bottom components.

[0126] In a second aspect, the present invention provides a sputtering apparatus comprising at least one magnetron structure according to an embodiment of the first aspect of the present invention.

[0127] Further features and characteristics may correspond to features of specific embodiments of the magnetron structure described in the first aspect of the present invention.

[0128] In a third aspect, the present invention relates to the use of a controller in a magnetron structure for use in a sputtering apparatus. The magnetron structure may, but is not limited to, be used with a rotatable magnetron sputtering source for use with a tubular target. The controller may be adapted (e.g., programmed) for monitoring parameters related to the sputtering process and / or the sputtering apparatus, or for controlling their functions, or for a combination of both. The controller may be adapted for processing data into signals and / or vice versa. The controller may be fully integrated within the magnetron structure, for example, in the upper part of the magnetron, the bottom part of the magnetron, or its housing. For example, the circuit(s) forming the controller may be mounted on or integrated with the magnetron (e.g., on the base plate of the magnetron or on its head) for use with a cylindrical target. Further features may correspond to the functions of the components described in the first and second aspects.

Claims

1. A structure for use in a sputtering apparatus, An end block for removably supporting a target tube to constitute a magnetron, wherein the end block does not include any parts that are removable together with the target tube, A sensor (207) for detecting sensor signals related to the sputtering apparatus or sputtering process, The system comprises controllers (106, 206, 301, 402) adapted to receive and process signals from the sensor (207), The controllers (106, 206, 301, 402) are fixedly positioned on the end block in the vacuum section during the operation of the sputtering apparatus. The controllers (106, 206, 301, 402) are configured to receive signals from the sensor (207) and to monitor and / or control the state of the sputtering apparatus or its components, or the state of the sputtering process.

2. The structure according to claim 1, wherein the controllers (106, 206, 301, 402) include a data processor (302) for processing signals into data and vice versa.

3. The structure according to claim 1 or 2, wherein the controllers (106, 206, 301, 402) further include data storage for storing the data relating to at least partially monitoring and / or controlling the state and / or function of the sputtering apparatus.

4. The structure according to any one of claims 1 to 3, wherein the end block is adapted to support a cylindrical magnet bar and the sputtering target.

5. The structure according to any one of claims 1 to 4, wherein the controllers (106, 206, 301, 402) further include communication components for exchanging data with a controller outside the vacuum portion of the sputtering apparatus.

6. The structure according to claim 5, wherein the communication component is adapted for performing wireless communication using any of Wi-Fi communication, Bluetooth communication, optical communication, or any EM radiation, or for performing wired communication using any of optical fiber communication or telecommunications.

7. The structure according to any one of claims 1 to 6, further comprising a controller for controlling at least one actuator for adjusting parameters related to the sputtering process in the sputtering apparatus.

8. A magnetron structure comprising the structure according to any one of claims 1 to 7, and a target tube detachably supported on the end block, A magnetron structure comprising a portion located inside the vacuum portion of the sputtering apparatus and a non-vacuum portion located outside the vacuum portion, further comprising a power supply for supplying power to the controller, wherein the power supply is one of a battery or a power extractor adapted to obtain power from the coolant flow of the target tube or from a power supply.

9. The magnetron structure according to claim 8, wherein the power supply to the controller is based on a wired connection from an external non-vacuum portion of the sputtering apparatus.

10. The magnetron structure according to claim 8 or 9, comprising an upper part (201) for holding the target and a bottom part (202) that can be attached to the upper part (201), wherein the controller (206) is rigidly connected to the bottom part.

11. The magnetron structure according to any one of claims 8 to 10, comprising a wireless connector including an antenna (109) for transmitting data to the outside of the magnetron structure.

12. The magnetron structure according to claim 11, wherein the data is any of the following: coolant-related information, sputtering power-related information, magnetic-related information, magnetron state-related information, or target drive-related information, or a combination thereof.

13. The magnetron structure according to any one of claims 8 to 12, wherein the controllers (106, 206, 301, 402) provide information to facilitate maintenance during use, providing information regarding their status and information regarding the predicted timing of necessary preventive maintenance.

14. The magnetron structure according to any one of claims 8 to 13, wherein the controllers (106, 206, 301, 402) provide information to facilitate maintenance during revision in order to understand historical data, thereby facilitating appropriate revision and maintenance.

15. The magnetron structure according to any one of claims 8 to 14, wherein the controller is a microcontroller.

16. The magnetron structure according to claim 15, wherein the controller is a low-voltage microcontroller.

17. A sputtering apparatus comprising a magnetron structure and a magnet configuration according to any one of claims 8 to 16.

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