Conductive paste and connecting structure

A conductive paste with 5.0 μm solder particles, a high-melting-point flux, and a thermosetting component addresses storage stability issues, enhancing screen printability and reliability in electrode connections by efficiently placing solder particles.

JP7875068B2Active Publication Date: 2026-06-17SEKISUI CHEMICAL CO LTD
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
SEKISUI CHEMICAL CO LTD
Filing Date
2022-08-08
Publication Date
2026-06-17

AI Technical Summary

Technical Problem

Conventional conductive pastes with small solder particles suffer from poor storage stability (pot life), leading to issues such as thickening, screen clogging, and inefficient placement of solder particles, which affects conductivity and insulation reliability in electrode connections.

Method used

A conductive paste comprising solder particles with an average diameter of 5.0 μm or less, a flux with a melting point of 200°C or higher, and a 50°C or less difference in melting points, along with a thermosetting component, enhances storage stability and screen printability, ensuring efficient placement of solder particles between electrodes.

Benefits of technology

The conductive paste improves storage stability, enhances screen printability, and ensures reliable electrical connections by effectively arranging solder particles between upper and lower electrodes while reducing placement between unintended lateral electrodes, thus improving conductivity and insulation reliability.

✦ Generated by Eureka AI based on patent content.

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Abstract

To provide a conductive paste that enhances both storage stability and screen printing quality, while facilitating efficient solder particle placement on an electrode.SOLUTION: A conductive paste according to the present invention includes a thermosetting component, a plurality of solder particles, and flux. The solder particles have an average particle size of 5.0 μm or less. The flux has a melting point of 200°C or higher. An absolute value of a difference between the melting point of the solder particles and the melting point of the flux is 50°C or lower.SELECTED DRAWING: Figure 1
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