Silicone adhesive compositions and methods for their preparation and use in the fabrication of electronic devices.

Abstract

UV-curable silicone adhesive compositions and methods for preparing the same are provided. The UV-curable silicone adhesive compositions are useful in electronic device fabrication for adhering components such as fingerprint sensors to substrates such as OLED display devices.

Claims

1. A silicone adhesive composition, 100 parts by weight of (A) a bis-vinyl-terminated polydiorganosiloxane polymer having a unit formula: (R Ｍ ２ R Ｕ SiO １／２ ), ｘ (R Ｍ R Ｕ SiO ２／２ ), ｚ (R Ｍ ２ SiO ２／２ ), ｗ where each R Ｍ is an independently selected monovalent hydrocarbon group having 1 to 30 carbon atoms and containing no aliphatic unsaturation, each R Ｕ is a group of the formula CH ２ =CH-D-, where each D is a covalent bond or an independently selected divalent hydrocarbon group having 1 to 28 carbon atoms, the subscripts w, x, and z are such that x = 2, z ≥ 0, and w ≥ 0, having a number average molecular weight of 10,000 to 300,000, and is i) a bis-dimethylvinylsiloxy-terminated polydimethylsiloxane, a bis-vinyl-terminated polydiorganosiloxane polymer, and 5 to 20 parts by weight of (B) polydiorganosiloxane gum, with unit formula: (R Ｍ ２ XSiO １／２ ) ｇ (R Ｍ ２ R Ｕ SiO １／２ ) ａ (R Ｍ ２ SiO ２／２ ) ｂ (R Ｍ R Ｕ SiO ２／２ ) ｃ (R Ｍ ３ SiO １／２ ) ｄ It consists of, in the formula, R Ｍ and R Ｕ As described above, X is a hydroxyl group, and the subscripts g, a, b, c, and d are 0 ≤ g ≤ 2, 0 ≤ a ≤ 2, 0 ≤ d ≤ 2, quantity (g + a + d) = 2, b ≥ 0, c > 0, and have a vinyl content of 0.1% by weight or more based on the weight of the gum, and the vinyl content of component (B) is the formula (CH) bonded to the carbon and / or silicon atoms in component (B). ２ = CH- refers to the amount of the group, and component (B) has 500,000 to 1,000,000 Mn. v) Bis-dimethylhexenylsiloxy-terminated poly(dimethylsiloxane / methylhexenylsiloxane), vi) Bis-dimethylhexenylsiloxy-terminated polymethylhexenylsiloxane, vii) Bis-trimethylsiloxy-terminated poly(dimethylsiloxane / methylhexenylsiloxane), viiii) Bis-trimethylsiloxy-terminated polymethylhexenylsiloxane, xi) Bis-dimethylhydroxylsiloxy-terminated poly(dimethylsiloxane / methylhexenylsiloxane), xi) Bis-dimethylhydroxylsiloxy-terminated polymethylhexenylsiloxane, and A polydiorganosiloxane gum selected from the group consisting of any two or more combinations of v) to viiii), xi), and xi), (C) A trimethylsiloxy-terminated polymethylhydrogensiloxane crosslinking agent in an amount that gives an SiH / Vi ratio of greater than 0.3 to 1.7, wherein the SiH / Vi ratio is such that the carbon and / or silicon atoms in the combined components (A) and (B) are bonded to the formula (CH ２ A trimethylsiloxy-terminated polymethylhydrogensiloxane crosslinking agent is defined as the molar amount of silicon-bonded hydrogen atoms in component (C) divided by the molar amount of the CH- group, (D) Based on the total weight of all components in the composition, an amount of (η-cyclopentadienyl)tri(σ-aliphatic)-platinum complex of 1 to 20 ppm of Pt, It consists of, (E) solvent A silicone adhesive composition that contains or does not contain [the specified substance].

2. The composition according to claim 1, wherein the SiH / Vi ratio is greater than 0.4 to 1.

7.

3. The composition according to claim 1, wherein component (D) is platinum, trimethyl[(1,2,3,4,5-η)-1-methyl-2,4-cyclopentadien-1-yl]-.

4. The composition according to claim 1, wherein component (D) is present in an amount of platinum of 5 ppm to 20 ppm.

5. The composition according to claim 4, wherein the amount is the amount of platinum greater than 5 ppm and less than 16 ppm.

6. (F) A polyorganosilicate resin, based on the total weight of all starting materials in the silicone adhesive composition, comprising 0 to less than 30% by weight, and having the formula: R １ ３ SiO １／２ Units and formula: SiO ４／２ The formula includes the units, and each R １ R as defined in claim 1 Ｍ and R Ｕ A polyorganosilicate resin, independently selected from the group consisting of the following: (G) Based on the total weight of all starting materials in the silicone adhesive composition, 0 to 5% by weight of an adhesion promoter, and (H)(F) and (G) combinations, It further includes additional components selected from the group consisting of, The composition according to claim 1, wherein component (F) has a structure different from that of component (C).

7. A method for preparing a silicone adhesive composition according to any one of claims 1 to 6, comprising mixing all the components.

8. A method for manufacturing an electronic device, wherein the method is 1) Distributing the silicone adhesive composition according to any one of claims 1 to 6 onto a substrate, Optionally, 2) remove all or part of the solvent of component (E) if present, 3) Exposing the silicone adhesive composition to near-UV radiation to initiate the curing reaction of the silicone adhesive composition, 4) Holding the adherend on the silicone adhesive composition on the opposite side of the substrate, thereby creating a laminated article, A method comprising optionally 5) heating the laminated articles.

9. The method according to claim 8, wherein the substrate is the back surface of an OLED display.

10. The method according to claim 8, wherein the adherend is a fingerprint sensor.

11. The UV exposure in step 3) was 1 J / cm². ２ ~3J / cm ２ The method according to claim 8.

12. The method according to claim 8, wherein step 4) is completed in less than 1 minute to 2 minutes.

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