Unit pixel and display device containing the same

Abstract

A unit pixel and a display device including the unit pixel are provided, the unit pixel including a transparent substrate and a plurality of light-emitting elements arranged on the transparent substrate, the transparent substrate including at least one light-scattering line disposed therein corresponding to each of the plurality of light-emitting elements.

Description

Technical Field

[0001] The present disclosure relates to a unit pixel and a display device having the same, and more particularly, to a unit pixel including a light-emitting element and a display device having the same.

Background Art

[0002] As a semiconductor device using a light-emitting diode which is an inorganic light source, a light-emitting element is variously used in various fields such as a display device, a vehicle lamp, and general lighting. Such a light-emitting diode has advantages of long life, low power consumption, and high response speed, and thus is replacing existing light sources at a high speed.

[0003] On the other hand, a conventional light-emitting diode has been mainly used as a backlight source in a display device. In recent years, however, a display device that directly implements an image using a light-emitting diode has been developed. Such a display device is also referred to as a micro LED display.

[0004] Such a display device generally includes a plurality of pixels in order to implement various colors and various images by using a mixed color of blue, green, and red. Each pixel includes blue, green, and red sub-pixels. The color of a specific pixel is determined through the colors of these sub-pixels, and an image is implemented by a combination of these pixels.

[0005] In micro-LED displays, micro-LEDs are arranged on a plane corresponding to each subpixel, and a very large number of micro-LEDs are mounted on a single substrate. However, micro-LEDs are extremely small, less than 200 μm, and even less than 100 μm, and this small size imposes certain limitations. For example, it is difficult to directly mount light-emitting diodes on the display panel in order to handle such small micro-LEDs. Furthermore, the directionality angles of the light emitted from the subpixels differ from one another, which can lead to uneven mixing of light, and therefore, the color may appear different depending on the angle at which the user views it. [Overview of the project] [Problems that the invention aims to solve]

[0006] The problem that this disclosure aims to solve is to provide a unit pixel and a display device having the same that can control the light pattern of a light-emitting element to mitigate color differences due to the viewing angle. In the exemplary embodiment, the light pattern of the micro-LED with respect to the viewing angle does not deteriorate even when its size is reduced. Therefore, in order to realize a display device using smaller micro-LEDs, the exemplary embodiment provides a technique for improving the light pattern of the micro-LED with respect to the viewing angle. [Means for solving the problem]

[0007] A unit pixel according to one embodiment of the present disclosure includes a transparent substrate and a plurality of light-emitting elements arranged on the transparent substrate, the transparent substrate including at least one light-scattering line arranged therein to correspond to each of the plurality of light-emitting elements.

[0008] The aforementioned at least one light scattering line may include continuous or spaced-apart voids.

[0009] The light scattering line can extend from one side of the transparent substrate to the other side opposite it.

[0010] The aforementioned at least one light scattering line may include a plurality of mutually orthogonal light scattering lines.

[0011] The aforementioned plurality of light scattering lines can be arranged to surround the upper region of the light-emitting element.

[0012] The aforementioned multiple light scattering lines may partially overlap with at least one of the light-emitting elements.

[0013] The plurality of light scattering lines may include lines that cross the upper region of the light-emitting element and lines that cross the upper region of each of the light-emitting elements.

[0014] The light-blocking layer may further include a light-blocking layer disposed between the transparent substrate and the light-emitting element. The light-blocking layer may have at least one window configured to transmit light generated by the light-emitting element, and the at least one light-scattering line may be arranged to correspond to the window.

[0015] The light-blocking layer may have a plurality of windows, each corresponding to one of the light-emitting elements, and the at least one light-scattering line may include a plurality of light-scattering lines arranged to surround the plurality of windows.

[0016] The aforementioned at least one light scattering line can cross the upper region of the aforementioned at least one window.

[0017] The aforementioned at least one light scattering line may have an average height of 10 μm or less.

[0018] According to one embodiment, a subpixel constituting a unit pixel is provided. The subpixel includes a transparent substrate and a light-emitting element disposed on the transparent substrate, the transparent substrate including at least one light-scattering line.

[0019] The at least one light scattering line may include continuous voids or voids that are spaced apart from each other.

[0020] The light scattering line can extend from one side surface of the transparent substrate to the other side surface opposite thereto.

[0021] A display device according to an embodiment includes a circuit board; and a plurality of unit pixels disposed on the circuit board. Each of the plurality of unit pixels includes a plurality of light emitting elements; and a transparent substrate covering the plurality of light emitting elements, and the transparent substrate includes at least one light scattering line disposed therein so as to correspond to each of the plurality of light emitting elements.

[0022] The at least one light scattering line can include continuous voids or voids spaced apart from each other.

[0023] The light scattering line can extend from one side surface of the transparent substrate to the other side surface opposite thereto.

[0024] The unit pixel can further include a light blocking layer disposed between the transparent substrate and the light emitting element, and the light blocking layer can have at least one window configured to transmit light generated by the light emitting element, and the at least one light scattering line can be disposed to correspond to the window.

[0025] The transparent substrate can include a plurality of regions spaced apart from each other and respectively disposed on the light emitting elements, and the light scattering line can be disposed in each region of the transparent substrate.

[0026] The circuit board has pads, and each of the unit pixels can be bonded to the pads by a bonding material.

[0027] A unit pixel according to an embodiment of the present disclosure includes a transparent substrate including a light incident surface and a light emitting surface; a plurality of light emitting elements arranged on the transparent substrate and emitting light of different colors from each other; and at least one light scattering line arranged in a predetermined pattern corresponding to one or more of the plurality of light emitting elements within the transparent substrate, and the light generated from the plurality of light emitting elements is incident on the transparent substrate through the light incident surface of the transparent substrate and exits the transparent substrate through the light emitting surface.

[0028] The at least one light scattering line can include continuous voids or voids separated from each other.

[0029] The at least one light scattering line can extend from one side surface of the transparent substrate to the other side surface opposite thereto.

[0030] The at least one light scattering line can include a plurality of light scattering lines positioned to be orthogonal to each other.

[0031] The plurality of light scattering lines can be arranged to surround the light emitting elements.

[0032] The unit pixel can include a plurality of windows corresponding to the plurality of light emitting elements and exposing one or more of the plurality of light emitting elements, and the plurality of light scattering lines can overlap at least one of the light emitting elements by extending across one or more of the plurality of windows.

[0033] The plurality of light scattering lines can include a first line crossing all of the light emitting elements and a plurality of second lines crossing each of the light emitting elements.

[0034] The unit pixel may further include a light-blocking layer disposed between the plurality of light-emitting elements arranged on the same plane as the transparent substrate, the light-blocking layer having at least one window configured to transmit light generated by the light-emitting elements, and the at least one light-scattering line may be arranged corresponding to the window.

[0035] The light-blocking layer may have a plurality of windows, each corresponding to one of the light-emitting elements, and the at least one light-scattering line may include a plurality of light-scattering lines arranged around or across the plurality of windows.

[0036] The aforementioned at least one light scattering line can cross the top of the aforementioned at least one window.

[0037] The aforementioned at least one light scattering line may have an average height of 10 μm or less.

[0038] A unit pixel according to one embodiment of the present disclosure comprises a plurality of subpixels, including a first subpixel and a second subpixel, wherein the first subpixel includes a first transparent substrate and a first light-emitting element disposed on the first transparent substrate and emitting light of a selected color, and the second subpixel includes a second transparent substrate and a second light-emitting element disposed on the second transparent substrate and emitting light of a different color from the first light-emitting element, wherein at least one light scattering line is disposed on the first transparent substrate, the second transparent substrate, or all of the first and second transparent substrates, but is located in at least one predetermined pattern around the first light-emitting element, the second light-emitting element, or the first and second light-emitting elements, or across the first light-emitting element, the second light-emitting element, or the first and second light-emitting elements.

[0039] In one embodiment, the first transparent substrate and the second transparent substrate can form a common transparent substrate including a light incident surface and a light exit surface, wherein the at least one light scattering line comprises continuous voids or voids spaced apart from each other arranged within the common transparent substrate, and the light scattering line extends from one side of the transparent substrate to the other side opposite it.

[0040] The first transparent substrate is aligned on the first light-emitting element, the second transparent substrate is aligned on the second light-emitting element, and the at least one light scattering line includes voids aligned and spaced apart within the first and second transparent substrates, and the first transparent substrate, the second transparent substrate, or all of the first and second transparent substrates include a growth substrate for growing the first light-emitting element, the second light-emitting element, or all of the first and second light-emitting elements.

[0041] A display device according to one embodiment includes a circuit board; and a plurality of unit pixels arranged on the circuit board, each of which is a plurality of light-emitting elements that emit light of different colors from each other; a transparent substrate covering the plurality of light-emitting elements and including a light-incident surface and a light-emitting surface; and at least one light-scattering line arranged in a predetermined pattern within the transparent substrate corresponding to one or more of the plurality of light-emitting elements, wherein the light generated by the plurality of light-emitting elements is incident on the transparent substrate through the light-incident surface and emitted from the transparent substrate through the light-emitting surface.

[0042] The at least one of the aforementioned light scattering lines may include continuous voids or voids that are spaced apart from each other.

[0043] The aforementioned at least one light scattering line can extend from one side of the transparent substrate to the other side opposite it.

[0044] The plurality of light-emitting elements are arranged on the transparent substrate at a distance from each other, and each unit pixel may further include a light-blocking layer disposed between the transparent substrate and each of the light-emitting elements, the light-blocking layer may have at least one window configured to transmit light generated by the light-emitting elements to the light-incident surface of the transparent substrate, and the at least one light-scattering line may be arranged to correspond to the window.

[0045] The transparent substrate may include a plurality of discontinuous regions that are spaced apart from each other and separated from each other, the plurality of discontinuous regions corresponding to the light-emitting elements and each being located on the corresponding light-emitting elements, and the at least one light-scattering line may be located in each region of the transparent substrate.

[0046] The circuit board may include a plurality of pads, and each unit pixel may be bonded to the plurality of pads through a bonding material. [Brief explanation of the drawing]

[0047] [Figure 1] This is a schematic plan view illustrating a display device according to one embodiment of the present disclosure. [Figure 2a] This is a schematic plan view illustrating a light-emitting element according to one embodiment of the present disclosure. [Figure 2b] This is a schematic cross-sectional view taken along the cut line A-A' in Figure 2a. [Figure 3a] This is a schematic plan view illustrating a unit pixel according to one embodiment of the present disclosure. [Figure 3b] This is a schematic rear view illustrating the light scattering lines of a unit pixel according to one embodiment of the present disclosure. [Figure 3c] This is a schematic cross-sectional view taken along the cut line B-B' in Figure 3a. [Figure 4] This is a schematic cross-sectional view illustrating a display device according to one embodiment of the present disclosure. [Figure 5]This is a schematic rear view illustrating the light scattering lines of a unit pixel according to yet another embodiment of the present disclosure. [Figure 6] This is a schematic cross-sectional view illustrating a unit pixel according to yet another embodiment of the present disclosure. [Figure 7] This is a schematic cross-sectional view illustrating a unit pixel according to yet another embodiment of the present disclosure. [Figure 8] This is a schematic diagram illustrating a method for manufacturing a unit pixel according to one embodiment of the present disclosure. [Figure 9] This is a schematic cross-sectional view illustrating a display device according to yet another embodiment of the present disclosure. [Figure 10a] This graph represents the optical directionality pattern of a light-emitting element within a unit pixel according to conventional technology, and the graph scanned in the x-direction shown in Figure 3b is an example. [Figure 10b] This graph represents the optical directionality pattern of a light-emitting element within a unit pixel according to conventional technology, and the graph scanned in the y direction shown in Figure 3b is an example.

[0048] [Figure 11a] This graph shows the optical directivity pattern of a light-emitting element within a unit pixel according to one embodiment of the present disclosure, with the graph scanned in the x-direction shown in Figure 3b being an example. [Figure 11b] This is a graph representing the optical directionality pattern of a light-emitting element within a unit pixel according to one embodiment of the present disclosure, and the graph scanned in the y direction shown in Figure 3b is an example.

[0049] [Figure 12a] This is a graph representing the optical directionality pattern of a light-emitting element within a unit pixel according to yet another embodiment of the present disclosure, and is a graph scanned in the x direction as shown in Figure 3b. [Figure 12b] This is a graph representing the optical directionality pattern of a light-emitting element within a unit pixel according to yet another embodiment of the present disclosure, and is a graph scanned in the y direction as shown in Figure 3b.

[0050] [Figure 13a] This diagram shows a schematic plan view illustrating light scattering lines or patterns according to various embodiments of the present disclosure, illustrating light scattering lines arranged in a rectangular shape to define the same area as the light-emitting element. [Figure 13b] This diagram shows a schematic plan view illustrating light scattering lines or patterns according to various embodiments of the present disclosure, illustrating light scattering lines arranged in a rectangular shape to define an area smaller than the light-emitting element. [Figure 13c] This diagram shows a schematic plan view illustrating light scattering lines or patterns according to various embodiments of the present disclosure, illustrating light scattering lines arranged vertically across each of the light-emitting elements. [Figure 13d] This diagram shows a schematic plan view illustrating light scattering lines or patterns according to various embodiments of the present disclosure, illustrating light scattering lines arranged diagonally across each light-emitting element. [Figure 13e] This diagram shows a schematic plan view illustrating light scattering lines or patterns according to various embodiments of the present disclosure, illustrating light scattering lines positioned to define an area larger than the light-emitting element. [Figure 13f] This diagram shows a schematic plan view illustrating light scattering lines or patterns according to various embodiments of the present disclosure, illustrating how rectangularly arranged light scattering lines and light scattering lines that cross the light-emitting element diagonally are arranged to overlap each other. [Modes for carrying out the invention]

[0051] The embodiments of this disclosure will be described in detail below with reference to the attached drawings. The embodiments described below are provided as examples to ensure that the ideas of this disclosure are fully understood by those ordinary people skilled in the art to which this disclosure pertains. Therefore, this disclosure is not limited to the embodiments described below, but can be embodied in other forms. In the drawings, the width, length, thickness, etc., of components may be exaggerated for convenience. Also, when one component is described as being "on top of" or "on top of" another component, this includes not only cases where each part is "directly on top of" or "directly on top of" the other part, but also cases where another component is interposed between each component and the other components. Throughout the specification, the same reference numeral represents the same component.

[0052] Figure 1 is a plan view illustrating a display device 10000 according to one embodiment of the present disclosure.

[0053] Referring to Figure 1, the display device 10000 may include a panel substrate 1000 and a plurality of unit pixels 100.

[0054] The display device 10000 may, but is not limited to, include a micro-LED TV, a smartwatch, a VR display device such as a VR headset, or an AR display device such as augmented reality glasses.

[0055] The panel substrate 1000 can be formed from a material such as PI (Polyimide), FR4 (FR-4 glass epoxy), or glass, and may include circuits for passive or active matrix driving. In one embodiment, the panel substrate 1000 may include wiring and resistors internally, and in another embodiment, the panel substrate 1000 may include wiring, transistors, and capacitors. The panel substrate 1000 may also have pads on its upper surface that can be electrically connected to internal circuits.

[0056] The aforementioned plurality of unit pixels 100 can be arranged on the panel substrate 1000. The plurality of unit pixels 100 can be arranged in a 6x6 grid as shown in Figure 1, but are not limited to this, and can be arranged in various matrices such as 2x2, 3x3, 5x5 (nxm, n=1,2,3,4...,; m=1,2,3,4...).

[0057] Each unit pixel 100 includes a plurality of light-emitting elements 10a, 10b, and 10c. The light-emitting elements 10a, 10b, and 10c can emit light of different colors from each other. The light-emitting elements 10a, 10b, and 10c within each unit pixel 100 can be arranged in a predetermined pattern, as shown in Figure 1. In one embodiment, the light-emitting elements 10a, 10b, and 10c can be arranged perpendicular to the display screen on which the image is displayed. However, the disclosure is not limited thereto, and the light-emitting elements 10a, 10b, and 10c may be arranged horizontally to the display screen on which the image is displayed.

[0058] The following describes in detail each component of the display device 10000, in the order of light-emitting elements 10a, 10b, 10c and unit pixels 100 arranged within the display device 10000.

[0059] Figures 2a and 2b are a plan view and a cross-sectional view illustrating a light-emitting element 10a according to one embodiment of the present disclosure.

[0060] Referring to Figures 2a and 2b, the light-emitting element 10a includes a light-emitting structure comprising a first conductivity type semiconductor layer 21, an active layer 23, and a second conductivity type semiconductor layer 25. The light-emitting element 10 may also include an ohmic contact layer 27, an insulating layer 29, a first contact pad 31, a second contact pad 33, a first electrode pad 41, and a second electrode pad 43.

[0061] The first conductivity type semiconductor layer 21, the active layer 23, and the second conductivity type semiconductor layer 25 can be grown on a growth substrate (not shown). The growth substrate can be a variety of substrates that can be used for semiconductor growth, such as gallium nitride substrates, GaAs substrates, Si substrates, sapphire substrates, and in particular, patterned sapphire substrates. After the growth of the semiconductor layer is complete, the growth substrate can be separated from the semiconductor layer using techniques such as mechanical polishing, laser lift-off, or chemical lift-off. However, the disclosure is not limited thereto, and a portion of the substrate may remain and constitute at least a portion of the first conductivity type semiconductor layer 21.

[0062] In this embodiment, the plurality of light-emitting elements 10a, 10b, and 10c can emit red light, green light, and blue light, respectively. In this embodiment, the red light-emitting element 10a, the green light-emitting element 10b, and the blue light-emitting element 10c are shown to be arranged in that order, but this disclosure is not necessarily limited to this arrangement.

[0063] On the other hand, in the case of a light-emitting element 10a that emits red light, the semiconductor layer may include aluminum gallium arsenide (AlGaAs), gallium arsenide phosphide (GaAsP), aluminum gallium indium phosphide (AlGaInP), and gallium phosphide (GaP).

[0064] In the case of a light-emitting element 10b that emits green light, the semiconductor layer may include indium gallium nitride (InGaN), gallium nitride (GaN), gallium phosphide (GaP), aluminum gallium indium phosphide (AlGaInP), or aluminum gallium phosphide (AlGaP).

[0065] In the case of a light-emitting element 10c that emits blue light, the semiconductor layer may include gallium nitride (GaN), indium gallium nitride (InGaN), or zinc selenide (ZnSe).

[0066] The first conductivity semiconductor layer 21, the active layer 23, and the second conductivity semiconductor layer 25 can be grown on a substrate in a chamber using a method such as metal-organic chemical vapor deposition (MOCVD). The first conductivity semiconductor layer 21 may contain n-type impurities such as Si, Ge, and Sn, and the second conductivity semiconductor layer 25 may contain p-type impurities such as Mg, Sr, and Ba. For example, the first conductivity semiconductor layer 21 may contain GaN or AlGaN containing Si as a dopant, and the second conductivity semiconductor layer 25 may contain GaN or AlGaN containing Mg as a dopant.

[0067] Referring again to Figure 2b, the first conductivity type semiconductor layer 21 and the second conductivity type semiconductor layer 25 are shown to be single layers, but these layers may be multiple layers, or they may include a superlattice layer. The active layer 23 may include a single quantum well structure or a multiple quantum well structure, and the composition ratio of the nitride semiconductor can be adjusted to emit the desired wavelength. For example, the active layer 23 may emit red light, green light, blue light, or ultraviolet light depending on the semiconductor material forming the layer and its composition ratio.

[0068] The second conductivity semiconductor layer 25 and the active layer 23 have a mesa M structure and may be arranged on the first conductivity semiconductor layer 21. The mesa M may include the active layer 23 and the second conductivity semiconductor layer 25. It may also include at least a portion of the first conductivity semiconductor layer 21. The mesa M is located on a portion of the first conductivity semiconductor layer 21, and the upper surface of the first conductivity semiconductor layer 21 may be exposed around the mesa M.

[0069] In the embodiments of this disclosure, the light-emitting element 10 is formed by separating it from the growth substrate, so that the first conductivity type semiconductor layer 21 can be exposed on the lower surface of the light-emitting element 10. The first conductivity type semiconductor layer 21 may have a surface textured pattern as shown in Figure 2b, but this disclosure is not limited thereto, and it may have a flat surface. The surface textured pattern may be formed by surface texturing using a dry or wet etching process.

[0070] The ohmic contact layer 27 may be in ohmic contact with the second conductivity semiconductor layer 25 and disposed on the second conductivity semiconductor layer 25. The ohmic contact layer 27 may be formed as a single layer or multiple layers. The ohmic contact layer 27 may be formed as a transparent conductive oxide film or a metal film. For example, the transparent conductive oxide film may contain ITO or ZnO, and the metal film may contain metals such as Al, Ti, Cr, Ni, and Au and alloys thereof.

[0071] The first contact pad 31 may be placed on the exposed first conductivity type semiconductor layer 21 where no mesa M is formed. The first contact pad 31 can make ohmic contact with the first conductivity type semiconductor layer 21. The first contact pad 31 may be formed of an ohmic metal layer that makes ohmic contact with the first conductivity type semiconductor layer 21. The ohmic metal layer of the first contact pad 31 can be selected to be suitable for the semiconductor material of the first conductivity type semiconductor layer 21.

[0072] The second contact pad 33 can be placed on the ohmic contact layer 27. The second contact pad 33 can be electrically connected to the ohmic contact layer 27.

[0073] The insulating layer 29 can cover at least a portion of the first conductivity semiconductor layer 21, the active layer 23, the second conductivity semiconductor layer 25, the first contact pad 31, and the second contact pad 33. In embodiments of this disclosure, the insulating layer 29 can be formed to cover substantially the entire surface of the second contact pad 33, excluding a portion of the second contact pad 33 and a portion of the first contact pad 31. That is, the insulating layer 29 can have a first opening 29a and a second opening 29b that expose the first contact pad 31 and the second contact pad 33. The insulating layer 29 can be formed as a distributed Bragg reflector by stacking insulating layers with different refractive indices, and the distributed Bragg reflector can be formed by alternately stacking at least two types of insulating layers selected from SiO2, TiO2, Nb2O5, Si3N4, SiON, Ta2O5, etc.

[0074] The distributed Bragg reflector can reflect light emitted from the active layer 23, and in this case, the distributed Bragg reflector can be formed to exhibit high reflectivity over a relatively wide wavelength range, including the peak wavelength of the light emitted from the active layer 23. Furthermore, it can be designed taking into account the angle of incidence of light as needed. As a result, the distributed Bragg reflector can reflect the light generated in the active layer 23 and cause it to exit through the first conductivity type semiconductor layer 21, which is exposed after the growth substrate is removed.

[0075] The light-emitting element 10c that emits blue light can have a higher internal quantum efficiency than the light-emitting elements 10a and 10b that emit red and green light. As a result, the light-emitting element 10c that emits blue light can exhibit a higher light extraction efficiency than the light-emitting elements 10a and 10b that emit red and green light. This can make it difficult to maintain an appropriate color mixing ratio of red, green, and blue light.

[0076] To adjust the mixing ratio of the red, green, and blue light, the light-emitting elements 10a, 10b, and 10c can be formed such that the applied distributed Bragg reflectors have different reflectances from each other. Specifically, the light-emitting element 10c that emits blue light can have a distributed Bragg reflector that has a relatively lower reflectance compared to the light-emitting elements 10a and 10b that emit red and green light.

[0077] In embodiments of this disclosure, the distributed Bragg reflectors applied to the red, green, and blue light-emitting elements 10a, 10b, and 10c can have roughly similar thicknesses. By making the thickness of the distributed Bragg reflectors similar, the process conditions applied to each of the light-emitting elements 10a, 10b, and 10c emitting red, green, and blue light can be set to be similar. Specifically, the process for patterning the insulating layer 29 can be set to be similar, and the distributed Bragg reflectors can have a similar number of layers. However, this disclosure is not limited thereto.

[0078] The first electrode pad 41 and the second electrode pad 43 may be positioned on the insulating layer 29. The first electrode pad 41 may extend from the top of the first contact pad 31 through the insulating layer 29 to the top of the ohmic contact layer 27. The second electrode pad 43 may be positioned within the upper region of the ohmic contact layer 27. More specifically, the second electrode pad 43 may extend from the top of the second contact pad 33 through the insulating layer 29 to the top of the ohmic contact layer 27. The first electrode pad 41 may be electrically connected to the first contact pad 31 through the first opening 29a of the insulating layer 29, and may, if necessary, directly contact the first conductivity semiconductor layer 21. In this case, the first contact pad 31 may be omitted. The second electrode pad 43 can be electrically connected to the second contact pad 33 through the second opening 29b of the insulating layer 29, and the second electrode pad 43 can directly contact the ohmic contact layer 27, and the second contact pad 33 can be omitted.

[0079] Although a light-emitting element 10a, 10b, and 10c according to one embodiment of the present disclosure has been briefly described, the light-emitting elements 10a, 10b, and 10c may further include layers having additional functions in addition to the layers described. For example, various layers such as a reflective layer that reflects light, an additional insulating layer for insulating specific components, and a solder-preventing layer that prevents solder diffusion may be included in the light-emitting elements 10a, 10b, and 10c.

[0080] Figure 3a is a schematic plan view illustrating a unit pixel according to one embodiment of the present disclosure, Figure 3b is a schematic rear view illustrating a unit pixel according to one embodiment of the present disclosure, and Figure 3c is a schematic cross-sectional view obtained by cutting along the cut line B-B' of Figure 3a.

[0081] Referring to Figures 3a, 3b, and 3c, the unit pixel 100 may include a transparent substrate 121, light-emitting elements 10a, 10b, 10c, and a light-blocking layer 123. The unit pixel 100 may also include an adhesive layer 125, a step-adjusting layer 127, connecting layers 129a, 129b, 129c, 129d, and an insulating material layer 131, and may further include a surface layer 122.

[0082] The unit pixel 100 may include at least three light-emitting elements 10a, 10b, and 10c. The plurality of light-emitting elements 10a, 10b, and 10c can emit light of different colors from each other. The plurality of light-emitting elements 10a, 10b, and 10c can emit red light, green light, and blue light, respectively. For example, the peak wavelength of the red light may be 600nm to 670nm. The peak wavelength of the green light may be 500nm to 590nm. The peak wavelength of the blue light may be 430nm to 490nm. The light-emitting elements 10a, 10b, and 10c have been described with reference to Figures 2a and 2b, so a detailed explanation is omitted. The light-emitting elements 10a, 10b, and 10c are arranged on the transparent substrate 121.

[0083] The transparent substrate 121 can be a light-transmitting substrate such as PET, glass, quartz, or sapphire. The transparent substrate 121 can be placed on the light-emitting surface of the display device 10000, and light generated by the light-emitting elements 10a, 10b, and 10c can be emitted to the outside through the transparent substrate 121. The transparent substrate 121 may have a light-emitting surface and a light-incident surface adjacent to the light-emitting elements 10a, 10b, and 10c. The light-incident surface of the transparent substrate 121 facing the light-emitting elements 10a, 10b, and 10c may be a flat surface, but is not limited to this; as shown in Figure 3c, the transparent substrate 121 may have an uneven pattern 121p on the light-incident surface facing the light-emitting elements 10a, 10b, and 10c.

[0084] The transparent substrate 121 may include an anti-reflective coating on its light-emitting surface, or it may include an anti-glare layer. The transparent substrate 121 may have a thickness of, for example, 30 μm to 300 μm. The thickness of the transparent substrate is illustrative and the disclosure is not limited thereto.

[0085] In the embodiments of this disclosure, light is emitted through the transparent substrate 121, and therefore the transparent substrate 121 does not contain any circuits. However, this disclosure is not limited thereto, and the transparent substrate 121 may contain circuits.

[0086] On the other hand, the transparent substrate 121 may include light scattering lines 121s internally. In embodiments of this disclosure, the light scattering lines 121s are described and shown in Figure 3b. Additionally or optionally, this disclosure includes light scattering patterns, light scattering line patterns, light scattering morphologies, light scattering arrays, light scattering configurations, etc.

[0087] The light scattering lines 121s may include voids, as shown in Figure 3c. The voids can form light scattering lines continuously or spaced apart from each other. As shown in Figure 3b, the light scattering lines 121s may be orthogonal to each other and can surround the light-emitting elements 10a, 10b, and 10c without overlapping with them. The light scattering lines 121s can be arranged to correspond to each of the light-emitting elements 10a, 10b, and 10c, thereby adjusting the light directivity patterns of the light-emitting elements 10a, 10b, and 10c. In one embodiment, identical forms of light scattering lines 121s may be arranged around each of the light-emitting elements 10a, 10b, and 10c, but the disclosure is not limited thereto, and different forms of light scattering lines 121s may be arranged depending on the characteristics of the light-emitting elements 10a, 10b, and 10c.

[0088] In the embodiments of this disclosure, the light scattering line 121s is for illustrative purposes only as shown in Figure 3b and includes a variety of light scattering patterns. In Figure 3b, it is shown as a dotted line and illustrated as a straight line, but this disclosure is not limited to this. The light scattering line may not be a straight line and may be represented as a three-dimensional form or pattern.

[0089] Furthermore, as shown in Figure 3b, each light scattering line 121s can extend from one side of the transparent substrate 121 to the opposite side. However, the disclosure is not limited thereto, and the light scattering lines 121s may be arranged within a portion of the transparent substrate 121 with a length shorter than the width of the transparent substrate 121. Also, in this embodiment, each light scattering line 121s is shown as a straight line, but the disclosure is not necessarily limited to this, and may be a curve.

[0090] As shown in Figure 3c, a modified region formed by the scribing line 121L may remain on the side surface of the transparent substrate 121. The scribing line 121L can be formed using a stealth laser, and the scribing line 121L can be positioned closer to the light-emitting elements 10a, 10b, and 10c than the light-scattering line 121s. However, the disclosure is not limited thereto, and the scribing line 121L may be located even further away from the light-emitting elements 10a, 10b, and 10c than the light-scattering line 121s.

[0091] Furthermore, although this embodiment illustrates and describes a single unit pixel 100 formed on a single transparent substrate 121, the disclosure is not limited thereto, and multiple unit pixels 100 may be formed on a single transparent substrate 121.

[0092] The surface layer 122 can be placed between the transparent substrate 121 and the light-blocking layer 123. The surface layer 122 can be formed to improve the adhesion between the light-blocking layer 123 and the transparent substrate 121. The surface layer 122 may be formed of, for example, a silicon oxide film SiO2. The surface layer 122 may be omitted depending on the type of transparent substrate 121 and light-blocking layer 123.

[0093] The light-blocking layer 123 is disposed between the transparent substrate 121 and the light-emitting elements 10a, 10b, and 10c. The light-blocking layer 123 may contain inorganic or organic materials and can be formed black by adding dyes such as carbon. For example, it may contain a light-absorbing material such as a black matrix. The light-absorbing material can improve the contrast of the display device 10000 by preventing the light generated by the plurality of light-emitting elements 10a, 10b, and 10c from being emitted to undesirable areas.

[0094] The light-blocking layer 123 may have a plurality of windows 123a on the light propagation path so that light generated by the light-emitting elements 10a, 10b, and 10c is incident on the transparent substrate 121. In one embodiment, the windows 123a may be defined as regions in which a part of the light-blocking layer 123 is open. The windows 123a may overlap at least partially with the light-emitting elements 10a, 10b, and 10c in the perpendicular direction. Furthermore, the width of the windows 123a may be wider than the width of the corresponding light-emitting elements 10a, 10b, and 10c, but the disclosure is not limited thereto. Alternatively, the width of the windows 123a may be narrower than or the same as the width of the corresponding light-emitting elements 10a, 10b, and 10c.

[0095] When the window 123a overlaps the light-emitting elements 10a, 10b, and 10c in a perpendicular direction, the window 123a can define the positions of the light-emitting elements 10a, 10b, and 10c, as shown in Figure 3b. Multiple windows 123a can be formed corresponding to the light-emitting elements 10a, 10b, and 10c. Since the positions of the light-emitting elements 10a, 10b, and 10c are defined by the window 123a, separate alignment markers for aligning the light-emitting elements 10a, 10b, and 10c can be omitted. However, the disclosure is not limited thereto, and alignment markers can be provided for aligning the light-emitting elements 10a, 10b, and 10c on the transparent substrate 121. The alignment markers can be formed, for example, on the transparent substrate 121, the light-blocking layer 123, or the adhesive layer 125, or a separate layer for generating the alignment markers can be formed on the transparent substrate 121, the light-blocking layer 123, or the adhesive layer 125.

[0096] In this embodiment, multiple windows 123a are formed corresponding to the light-emitting elements 10a, 10b, and 10c, as shown in the illustrations and description, but the disclosure is not limited thereto. For example, the light-blocking layer 123 may be provided with a single window 123a, and multiple light-emitting elements 10a, 10b, and 10c may be arranged so as to overlap perpendicularly with the single window 123a.

[0097] The thickness of the light-blocking layer 123 can be, for example, about 0.5 μm to about 2 μm, further about 0.5 μm to about 1.5 μm, or even further about 0.5 μm to about 1 μm. If the thickness of the light-blocking layer 123 is thin, such as 0.5 μm or less, it is difficult to achieve the purpose of blocking light, and if the thickness is thick, such as 2 μm or more, not only will the unit pixel 100 become thicker, but the increased amount of material used may lead to an increase in production costs.

[0098] The light scattering lines 121s may be positioned in correspondence with the windows 123a. For example, the light scattering lines 121s may pass around the windows 123a, and each window 123a may be surrounded by multiple light scattering lines 121s.

[0099] The adhesive layer 125 can be used to attach the light-emitting elements 10a, 10b, and 10c onto the transparent substrate 121. The adhesive layer 125 is positioned on the transparent substrate 121 and can cover at least a portion of the light-blocking layer 123. The adhesive layer 125 may be formed on the front surface of the transparent substrate 121, but is not limited thereto, and may be formed on a portion of the surface to expose a region near the edge of the transparent substrate 121. The adhesive layer 125 can fill the window 123a formed by the light-blocking layer 123.

[0100] The adhesive layer 125 may be formed of a light-transmitting material and can transmit light emitted from the light-emitting elements 10a, 10b, and 10c. The adhesive layer 125 may be formed using an organic adhesive; for example, the adhesive layer 125 may be formed using transparent epoxy and PDMS. The adhesive layer 125 may also contain diffusing materials such as SiO2, TiO2, and ZnO to diffuse light. The light-emitting elements 10a, 10b, and 10c can be prevented from being observed through the transparent substrate 110.

[0101] In this embodiment, the light-emitting elements 10a, 10b, and 10c are attached to the transparent substrate 121 by the adhesive layer 125. However, the invention is not limited to this, and the light-emitting elements 10a, 10b, and 10c can be bonded to the transparent substrate 121 using a different bonding member instead of the adhesive layer 125. For example, the light-emitting elements 10a, 10b, and 10c can be bonded to the transparent substrate 121 using a spacer. The spacer may be coated with an organic resin and have a predetermined shape, generally a pillar or a column. This allows a gas or liquid to fill the area between the light-emitting elements 10a, 10b, and 10c and the transparent substrate 121. This gas or liquid can form an optical layer that transmits light emitted from the light-emitting elements 10a, 10b, and 10c.

[0102] The step adjustment layer 127 can cover at least a portion of the light-emitting elements 10a, 10b, and 10c, as shown in Figure 3c. The step adjustment layer 127 has first and second openings 127a and 127b that expose the first and second electrode pads 41 and 43 of the light-emitting elements 10a, 10b, and 10c. The step adjustment layer 127 can adjust the height of the surface on which the connecting layers 129a, 129b, 129c, and 129d are formed to be constant, thereby helping to ensure that the connecting layers 129a, 129b, 129c, and 129d are formed safely. The step adjustment layer 127 can be formed of, for example, photosensitive polyimide.

[0103] The first, second, third, and fourth connecting layers 129a, 129b, 129c, and 129d are electrically connected to the multiple light-emitting elements 10a, 10b, and 10c, as shown in Figure 3a. The first, second, and third connecting layers 129a, 129b, and 129c can each be electrically connected to the second conductivity semiconductor layer 25 of the light-emitting elements 10a, 10b, and 10c. The fourth connecting layer 129d can be electrically connected to the first conductivity semiconductor layer 21 of the multiple light-emitting elements 10a, 10b, and 10c. Specifically, the first, second, and third connecting layers 129a, 129b, and 129c can be connected to the second electrode pads 43 of the multiple light-emitting elements 10a, 10b, and 10c through the second opening 127b of the step adjustment layer 127. Furthermore, as shown in Figure 3c, the fourth connecting layer 129d can be connected to the first electrode pads 41 of the multiple light-emitting elements 10a, 10b, and 10c through the first opening 127a of the step adjustment layer 127.

[0104] The first, second, third, and fourth connecting layers 129a, 129b, 129c, and 129d described above may be formed together on the step adjustment layer 127 and may include, for example, Au. In this embodiment, the first conductivity type semiconductor layer 21 of the light-emitting elements 10a, 10b, and 10c are commonly electrically connected, but the disclosure is not limited thereto. The second conductivity type semiconductor layer 25 of the light-emitting elements 10a, 10b, and 10c may be commonly electrically connected, and the first conductivity type semiconductor layer 21 may be electrically separated from each other.

[0105] The insulating material layer 131 can at least partially cover the step adjustment layer 127. The insulating material layer 131 may be formed thinner than the step adjustment layer 127. The combined thickness of the insulating material layer 131 and the step adjustment layer 127 may be, for example, about 1 μm to about 50 μm, but is not limited thereto.

[0106] As shown in Figure 3a, the insulating material layer 131 can cover at least a portion of the side surface of the step adjustment layer 127 and the connecting layers 129a, 129b, 129c, and 129d. As shown in Figure 3a, the insulating material layer 131 has openings 131a, 131b, 131c, and 131d that expose the connecting layers 129a, 129b, 129c, and 129d. The openings 131a, 131b, 131c, and 131d can, but are not limited to, be partially formed on the connecting layers 129a, 129b, 129c, and 129d. As shown in Figure 3a, the openings 131a, 131b, 131c, and 131d may have a shape that is open to the outside from regions adjacent to each corner of the transparent substrate 121. In other words, the insulating material layer 131 can be formed to expose the sides of the step adjustment layer 127 and the connecting layers 129a, 129b, 129c, and 129d near the corners of the transparent substrate 121. As shown in Figure 3a, the insulating material layer 131 can partially cover two sides of each connecting layer 129a, 129b, 129c, and 129d located near the corners of the transparent substrate 121, and completely cover the remaining two sides.

[0107] Furthermore, if the adhesive layer 125 is exposed to the outside of the step adjustment layer 127, the insulating material layer 131 can at least partially cover the exposed adhesive layer 125. The pad area of ​​the unit pixel 100 can be defined by the openings 131a, 131b, 131c, 131d of the insulating material layer 131 that expose the connecting layers 129a, 129b, 129c, 129d.

[0108] The insulating material layer 131 may be a translucent material and may be formed from an organic or inorganic material, for example, from a variety of materials such as epoxy, polyimide, SiO2, and SiNx. When the insulating material layer 131 is formed from polyimide together with the step adjustment layer 127, the connecting layers 129a, 129b, 129c, and 129d may have their bottom surface, sides, and at least a portion of their top surface all surrounded by polyimide, excluding the pad area.

[0109] The insulating material layer 131 can prevent defects from occurring in the unit pixels 100 during the transfer of the unit pixels 100.

[0110] On the other hand, the unit pixel 100 can be mounted on a circuit board using a bonding material such as solder, and the bonding material can bond the connecting layers 129a, 129b, 129c, 129d exposed at the openings 131a, 131b, 131c, 131d of the insulating material layer 131 to the pads on the circuit board.

[0111] Figure 4 is a schematic cross-sectional view illustrating a display device on which the unit pixels 100 are implemented.

[0112] Referring to Figure 4, unit pixels 100 are mounted on the panel substrate 1000 using bonding material 150. The panel substrate 1000 can also be replaced with a circuit board.

[0113] The connecting layers 129a, 129b, 129c, and 129d, exposed through the openings 131a, 131b, 131c, and 131d of the insulating material layer 131, can be bonded to the pads 130 on the panel substrate 1000 via the bonding material 150. However, the disclosure is not limited thereto, and eutectic bonding, epoxy bonding, and the like can also be used.

[0114] The bonding material 150 can be, for example, solder, and after the solder paste is placed on the pad 130 using a technique such as screen printing, the unit pixel 100 and the circuit board can be bonded through a reflow process.

[0115] The panel substrate 1000 may be formed from a material such as PI (Polyimide), FR4 (FR-4 glass epoxy), or glass, as described with reference to Figure 1, and may include circuits for passive or active matrix driving. In embodiments of this disclosure, the panel substrate 1000 may include wiring and resistors internally, and in other embodiments, the panel substrate 1000 may include wiring, transistors, and capacitors. The panel substrate 1000 may also have pads on its upper surface that can be electrically connected to the arranged circuits. The pads may be arranged in correspondence with the connection layers 129a, 129b, 129c, and 129d within the unit pixels 100 mounted on the pads. Furthermore, to improve the light-to-dark ratio, a molding portion may be formed on the panel substrate 1000 on which multiple unit pixels 100 are mounted.

[0116] Figure 5 is a schematic rear view illustrating a unit pixel according to yet another embodiment of the present disclosure.

[0117] Referring to Figure 5, the unit pixel in this embodiment is generally similar to the unit pixel 100 described with reference to Figures 3a, 3b, and 3c, except that the light scattering lines 121s are arranged to overlap with the light-emitting elements 10a, 10b, and 10c. The light scattering lines 121s may include light scattering lines that cross multiple light-emitting elements 10a, 10b, and 10c, and light scattering lines that cross each of the light-emitting elements 10a, 10b, and 10c. As shown in Figure 5, these light scattering lines 121s can be orthogonal to each other.

[0118] In this embodiment, two light scattering lines 121s are shown and described to be arranged orthogonally on each of the light-emitting elements 10a, 10b, and 10c, but the disclosure is not limited thereto. A larger number of light scattering lines 121s may be arranged to overlap each of the light-emitting elements 10a, 10b, and 10c. Furthermore, the two light scattering lines 121s on each of the light-emitting elements 10a, 10b, and 10c may not be orthogonal but intersect.

[0119] Figure 6 is a schematic cross-sectional view illustrating a unit pixel according to yet another embodiment.

[0120] Referring to Figure 6, the unit pixels in this embodiment are generally similar to the unit pixels 100 described with reference to Figures 3a, 3b, and 3c, but differ in that the light scattering lines 121s are arranged to overlap each other in the vertical direction. That is, the light scattering lines 121s containing voids may overlap in the thickness direction of the transparent substrate 121, thereby making the light directivity patterns of the light-emitting elements 10a, 10b, and 10c more uniform. In Figure 6, the transparent substrate 121 may include modified regions formed on the side surface of the transparent substrate 121 by scribing lines 121L formed using a stealth laser. In Figure 6, an example of a modified region formed by the scribing lines 121L is shown projected onto a cross-sectional view. The scribing lines 121L can be positioned closer to the light-emitting elements 10a, 10b, and 10c than the light scattering lines 121s, but the disclosure is not limited thereto.

[0121] Figure 7 is a schematic cross-sectional view illustrating a unit pixel according to yet another embodiment.

[0122] Referring to Figure 7, the unit pixel in this embodiment is generally similar to the unit pixel described with reference to Figure 6, except that the light scattering lines 121s are arranged in a double configuration. By arranging the light scattering lines 121s in a double configuration, more light can be scattered, thereby further adjusting the optical directionality patterns of the light-emitting elements 10a, 10b, and 10c. On the other hand, in Figure 7, the transparent substrate 121 may include a modified region formed on the side surface of the transparent substrate 121 by scribing lines 121L formed using a stealth laser. In Figure 7, an example of a modified region formed by the scribing lines 121L is shown projected onto a cross-sectional view. The scribing lines 121L can be positioned further away from the light-emitting elements 10a, 10b, and 10c than the light scattering lines 121s, but this disclosure is not limited thereto.

[0123] Figure 8 is a schematic diagram illustrating a method for manufacturing a unit pixel according to one embodiment of the present disclosure.

[0124] A unit pixel is manufactured by cutting a transparent substrate 121 having multiple pixel regions into individual pixel regions. Before cutting the transparent substrate 121, a light-blocking layer 123 and an adhesive layer 125 are formed in each pixel region as described with reference to Figures 3A, 3b, and 3c. The light-emitting elements 10a, 10b, and 10c are mounted on the transparent substrate 121 using the adhesive layer 125, and a step adjustment layer 127, first, second, third, and fourth connecting layers 129a, 129b, 129c, and 129d, and an insulating material layer 131 are formed.

[0125] Meanwhile, a scribing line 121L is formed inside the transparent substrate 121 using a stealth laser. Subsequently, the unit pixels are separated from each other by cracking the transparent substrate 121 along the scribing line 121L. Regions formed by the scribing line 121L may remain on the side surface of the transparent substrate 121 of the separated unit pixels.

[0126] On the other hand, in this embodiment, light scattering lines 121s can be formed inside the transparent substrate 121 before cracking the transparent substrate 121. The light scattering lines 121s can be formed using the same stealth laser used to form the scribing lines 121L. The light scattering lines 121s can be formed, for example, using a stealth laser with a wavelength of about 1000 nm to 1200 nm, and can be formed lower or deeper than the position where the scribing lines 121L are formed inside the transparent substrate 121 (see Figure 6). Meanwhile, the end portions of the light scattering lines 121s can be observed together with the modified region remaining due to the scribing lines 121L. The scribing lines 121L are formed on the side surface of the transparent substrate 121 that has been cracked by the scribing lines 121L (see Figure 3c). The scribing lines 121L and the light scattering lines 121s can be formed while moving the stage on which the transparent substrate 121 is placed, and thus can be formed in a linear fashion. The voids formed within the light scattering line 121s are formed while the stage moves, and therefore may be formed in a direction inclined with respect to the vertical direction of the transparent substrate 121, and may have a long shape. The light scattering line 121s can form continuous or discontinuous voids, and the voids in the light scattering line 121s can generally have a shorter vertical length than the voids formed in the scribing line 121L. Furthermore, the stage movement speed when forming the light scattering line 121s may be faster than the stage movement speed when forming the scribing line 121L, and therefore the spacing between voids in the light scattering line 121s may be larger than the spacing between voids in the scribing line 121L. In addition to the stage speed, the laser irradiation conditions may also differ, which may result in different morphologies of the voids and modified regions remaining in the light scattering line 121s and the scribing line 121L. On the other hand, in this embodiment, the light scattering line 121s is shown and described as being formed in a straight line, but the disclosure is not limited thereto, and the light scattering line 121s may be formed in a curve.

[0127] Alternatively, the light scattering line 121s can be formed first, followed by the scribing line 121L. Alternatively, the scribing line 121L can be formed first, followed by the light scattering line 121s. Another option is to form the scribing line 121L and the light scattering line 121s alternately.

[0128] Figure 9 is a schematic cross-sectional view illustrating a display device 20000 according to yet another embodiment of the present disclosure.

[0129] The display device 10000 described above includes a unit pixel 100 on which multiple light-emitting elements 10a, 10b, and 10c are mounted. In the display device according to this embodiment, each subpixel is arranged on the circuit board 2000, and multiple subpixels are grouped together to form a unit pixel.

[0130] Circuit board 2000 is the same as circuit board 1000, which was described with reference to Figure 1, so a detailed explanation will be omitted.

[0131] On the other hand, the subpixel includes light-emitting elements 10a, 10b, and 10c, and transparent substrates 221a, 221b, and 221c. The transparent substrates 221a, 221b, and 221c can be placed on the light-emitting elements 10a, 10b, and 10c, respectively.

[0132] Since the light-emitting elements 10a, 10b, and 10c are similar to those described with reference to Figures 2a and 2b, a detailed explanation will be omitted. On the other hand, the transparent substrates 221a, 221b, and 221c can, but are not limited to, growth substrates for growing the light-emitting elements 10a, 10b, and 10c, respectively.

[0133] Light scattering lines 221s can be formed within the transparent substrates 221a, 221b, and 221c. The light scattering lines 221s can be formed within the transparent substrates 221a, 221b, and 221c in various forms.

[0134] Figures 10a and 10b are graphs representing the light directivity patterns of light-emitting elements within a unit pixel according to the prior art. Figure 10a is a scan of Figure 3b in the x-direction, and Figure 10b is a scan of Figure 3b in the y-direction.

[0135] Referring to Figures 10a and 10b, it can be seen that the light directivity patterns R, G, and B of the light-emitting element differ significantly from each other in both the x and y directions. Figures 11a and 11b, and Figures 12a and 12b will be explained in detail below.

[0136] Figures 11a and 11b are graphs showing the optical directionality pattern of a light-emitting element in a unit pixel according to one embodiment of the present disclosure. The unit pixel according to this embodiment is identical to a unit pixel of the prior art, except that a light scattering line 121s, as described with reference to Figure 3b, is formed in the transparent substrate 121. Figure 11a is a scan in the x-direction of Figure 3b, and Figure 11b is a scan in the y-direction of Figure 3b.

[0137] Referring to Figures 11a and 11b, it can be seen that the optical directionality patterns R, G, B of the light-emitting element are more closely aligned in both the x and y directions compared to the optical directionality patterns in Figures 10a and 10b.

[0138] Figures 12a and 12b are graphs showing the optical directivity pattern of a light-emitting element in a unit pixel according to yet another embodiment of the present disclosure. The unit pixel according to this embodiment is identical to a unit pixel in the prior art, except that a light scattering line 121s, as described with reference to Figure 5, is formed in the transparent substrate 121.

[0139] Referring to Figures 12a and 12b, it can be seen that the optical directionality patterns R, G, B of the light-emitting element are more closely aligned in both the x and y directions compared to the optical directionality patterns in Figures 10a and 10b.

[0140] Figures 13a to 13f show schematic plan views illustrating various embodiments of the present disclosure.

[0141] Referring to Figures 13a to 13f, the light scattering lines can be positioned at various locations and in various shapes around the light-emitting elements 10a, 10b, and 10c. For example, as shown in Figure 13a, the light scattering lines can be arranged rectangularly along the edges of the light-emitting elements 10a, 10b, and 10c to define the same area as the light-emitting elements 10a, 10b, and 10c. As shown in Figure 13b, the light scattering lines can be arranged rectangularly to define an area smaller than the light-emitting elements 10a, 10b, and 10c. Alternatively, the light scattering lines can be positioned to define an area even larger than the light-emitting elements 10a, 10b, and 10c.

[0142] Additionally, or alternatively, the light scattering lines can be arranged so as to cross each light-emitting element 10a, 10b, 10c vertically, as shown in Figure 13c, or so as to cross diagonally, as shown in Figure 13d. Figure 13e illustrates light scattering lines arranged to define an area even larger than that of the light-emitting elements. Furthermore, the rectangles defined by the light scattering lines can be arranged so as to be tangent to each other, as shown in Figure 13e. Furthermore, as shown in Figure 13f, the rectangularly arranged light scattering lines and the diagonally crossing light scattering lines may overlap.

[0143] While various embodiments of this disclosure have been described above, this disclosure is not limited to these embodiments. Furthermore, the matters and components described in one embodiment can be applied to other embodiments as long as they do not deviate from the technical concept of this disclosure. [Explanation of Symbols]

[0144] 10 light-emitting elements 21 First Conductivity Semiconductor Layer 23 Active layer 25 Second Conductivity Semiconductor Layer 27 Ohmic Contact Layer 29 Insulating layer 31. First contact pad 33. Second contact pad 41 First electrode pad 43. Second electrode pad 100 unit pixels 110 Transparent substrate 121 Transparent substrate 122 Surface layer 123 Light-blocking layer 125 Adhesive layer 127 Step adjustment layer 129 Connecting Layer 130 pads 131 Insulating material layer 150 Bonding material 221 Transparent substrate 1000 circuit boards 1000 Panel boards 2000 Circuit board 10000 Display devices 20,000 display devices

Claims

1. In a unit pixel, A transparent substrate including a light-receiving surface and a light-emitting surface; A plurality of light-emitting elements arranged on the transparent substrate and emitting light of different colors from each other; and At least one light scattering line arranged in a predetermined pattern within the transparent substrate, corresponding to one or more of the plurality of light-emitting elements; Includes, Light generated from the plurality of light-emitting elements enters the transparent substrate through the light-incident surface of the transparent substrate and exits the transparent substrate through the light-emitting surface. The at least one light scattering line consists of a linear, continuous void and extends from one side of the transparent substrate to the other side opposite it. A unit pixel comprising at least one light scattering line and a plurality of light scattering lines positioned orthogonally to each other.

2. The unit pixel according to claim 1, wherein the plurality of light scattering lines are arranged to surround the light-emitting element.

3. The present invention further includes a plurality of windows corresponding to the plurality of light-emitting elements, each window exposing one or more of the plurality of light-emitting elements. The unit pixel according to claim 1, wherein the plurality of light scattering lines extend across one or more of the plurality of windows and overlap with at least one of the light-emitting elements.

4. The unit pixel according to claim 3, wherein the plurality of light scattering lines include a first line that crosses all of the light-emitting elements and a plurality of second lines that cross each of the light-emitting elements.

5. The transparent substrate further includes a light-blocking layer disposed between the plurality of light-emitting elements arranged on the same plane as the transparent substrate, The light-blocking layer has at least one window configured to transmit light generated by the light-emitting element, The unit pixel according to claim 1, wherein at least one light scattering line is arranged to correspond to the window.

6. The light-blocking layer has a plurality of windows corresponding to each of the light-emitting elements, The unit pixel according to claim 5, wherein the at least one light scattering line includes a plurality of light scattering lines arranged around or across the plurality of windows.

7. The unit pixel according to claim 5, wherein the at least one light scattering line crosses the top of the at least one window.

8. The unit pixel according to claim 1, wherein the at least one light scattering line has an average height of 10 μm or less.

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