Electronic device

Abstract

The present disclosure provides an electronic device, which includes a plurality of scan lines, a first scan transfer line, a second scan transfer line, at least one first conductive pattern, and at least one second conductive pattern. The first scan transfer line and the plurality of scan lines are staggered to form a plurality of first staggered portions, and the plurality of first staggered portions includes a first bridge portion in which the first scan transfer line and at least one of the plurality of scan lines are electrically connected. The second scan transfer line and the plurality of scan lines are staggered to form a plurality of second staggered portions, and the plurality of second staggered portions includes a second bridge portion in which the second scan transfer line and at least one of the plurality of scan lines are electrically connected. The at least one first conductive pattern is connected in parallel to the first scan transfer line and at least one of the plurality of scan lines, and has a first area. The at least one second conductive pattern is connected in parallel to the second scan transfer line and at least one of the plurality of scan lines, and has a second area. A length of the first scan transfer line is greater than a length of the second scan transfer line, and the first area is greater than the second area.

Description

Technical Field

[0001] This disclosure relates to an electronic device. Background Technology

[0002] With the advancement of technology, various multifunctional electronic devices have been developed, and correspondingly, these devices also have relatively complex circuit layouts. How to lay out these circuits to ensure good signal transmission quality is one of the problems to be solved in this field. Taking display devices as an example, how to lay out the circuits to ensure that the signal lines of the display device have similar resistance-capacitance loading (RC loading) and provide better brightness uniformity is an important issue. Summary of the Invention

[0003] This disclosure pertains to an electronic device.

[0004] In some embodiments disclosed herein, the electronic device includes multiple scan lines, a first scan transmission line, a second scan transmission line, at least one first conductive pattern, and at least one second conductive pattern. The multiple scan lines include both first and second scan lines. The first scan transmission line and the multiple scan lines are arranged in an alternating pattern to form multiple first intersections, each first intersection including a first bridging portion electrically connecting the first scan transmission line and the first scan line. The second scan transmission line and the multiple scan lines are arranged in an alternating pattern to form multiple second intersections, each second intersection including a second bridging portion electrically connecting the second scan transmission line and the second scan line. At least one first conductive pattern is connected in parallel to at least one of the first scan transmission line and the first scan line, and has a first area. At least one second conductive pattern is connected in parallel to at least one of the second scan transmission line and the second scan line, and has a second area. The length of the first scan transmission line is greater than the length of the second scan transmission line, and the first area is greater than the second area.

[0005] In some other embodiments disclosed herein, the electronic device includes multiple scan lines, a first scan transmission line, and a second scan transmission line. The multiple scan lines include first scan lines and second scan lines. The first scan transmission line is arranged interlaced with the multiple scan lines to form multiple first intersections, and includes a first main line and a first extension line electrically connected to the first main line. Each of the multiple first intersections includes a first bridging portion electrically connecting the first scan transmission line and the first scan line. In a top view, the first main line and the first extension line are respectively disposed on opposite sides of the first bridging portion. The second scan transmission line is arranged interlaced with the multiple scan lines to form multiple second intersections, and includes a second main line and a second extension line electrically connected to the second main line. Each of the multiple second intersections includes a second bridging portion electrically connecting the second scan transmission line and the second scan line. In a top view, the second main line and the second extension line are respectively disposed on opposite sides of the second bridging portion. The length of the first main line is greater than the length of the second main line, the length of the first extension line is less than or equal to the length of the second extension line, and the length of the first scan transmission line is different from the length of the second scan transmission line.

[0006] In some further embodiments disclosed herein, the electronic device includes a plurality of scan lines and a first scan transmission line. The plurality of scan lines include the first scan lines. The first scan transmission line and the plurality of scan lines are arranged in an alternating pattern to form a plurality of first intersections, and the plurality of first intersections include a first bridging portion electrically connecting the first scan transmission line and the first scan line. In a top view, the first scan lines are disposed on opposite sides of the first bridging portion with different shapes. Attached Figure Description

[0007] Figure 1A This is a circuit diagram of the electronic device according to the first embodiment of this disclosure;

[0008] Figure 1B Based on Figure 1A A magnified top view of region R1;

[0009] Figure 1C Based on Figure 1B A schematic diagram of the cross section along line A1-A1';

[0010] Figure 1D Based on Figure 1B A schematic diagram of the cross section along line A2-A2';

[0011] Figure 2A This is a top view schematic diagram showing the arrangement relationship between the conductive pattern, scan line and scan transmission line according to an embodiment of this disclosure;

[0012] Figure 2B This is a top view schematic diagram showing the arrangement relationship between the conductive pattern, scan line and scan transmission line in another embodiment of this disclosure;

[0013] Figure 3 This is a circuit diagram of the electronic device according to the second embodiment of the present disclosure;

[0014] Figure 4A This is a circuit diagram of the electronic device according to the third embodiment of this disclosure;

[0015] Figure 4B Based on Figure 4A A magnified top view of region R2;

[0016] Figure 4C Based on Figure 4B A schematic diagram of the cross section along line A3-A3';

[0017] Figure 5 This is a circuit diagram of the electronic device according to the fourth embodiment of this disclosure;

[0018] Figure 6 This is a circuit diagram of the electronic device according to the fifth embodiment of this disclosure;

[0019] Figure 7A This is a circuit diagram of the electronic device according to the sixth embodiment of this disclosure;

[0020] Figure 7B Based on Figure 7A A magnified top view of region R3;

[0021] Figure 8A This is a circuit diagram of the electronic device according to the seventh embodiment of this disclosure;

[0022] Figure 8B Based on Figure 8A A magnified top view of region R4;

[0023] Figure 9 This is a schematic diagram of a brightness measurement method of an electronic device according to an embodiment of the present disclosure. Detailed Implementation

[0024] This disclosure can be understood by referring to the following detailed description in conjunction with the accompanying drawings. It should be noted that, for ease of understanding and for the sake of brevity, many of the drawings in this disclosure depict only a portion of the electronic device, and certain components in the drawings are not drawn to scale. Furthermore, the number and dimensions of the components in the drawings are for illustrative purposes only and are not intended to limit the scope of this disclosure.

[0025] Throughout this disclosure and in the appended claims, certain terms are used to refer to specific elements. Those skilled in the art will understand that electronic device manufacturers may use different names to refer to the same element. This document is not intended to distinguish between elements that have the same function but different names. In the following description and claims, words such as “comprising,” “containing,” and “having” are open-ended terms and should therefore be interpreted as “containing but not limited to…”. Thus, when the terms “comprising,” “containing,” and / or “having” are used in the description of this disclosure, they specify the presence of the corresponding feature, area, step, operation, and / or component, but do not exclude the presence of one or more of the corresponding feature, area, step, operation, and / or component.

[0026] The directional terms used herein, such as "up," "down," "front," "back," "left," and "right," are for reference only when referring to the accompanying drawings. Therefore, the directional terms used are illustrative and not intended to limit this disclosure. In the accompanying drawings, each figure illustrates general features of the methods, structures, and / or materials used in specific embodiments. However, these figures should not be construed as defining or limiting the scope or nature covered by these embodiments. For example, for clarity, the relative dimensions, thicknesses, and locations of various films, regions, and / or structures may be reduced or enlarged.

[0027] When a component (e.g., a membrane or region) is referred to as "on another component," it can be directly on that component, or there may be other components between them. Conversely, when a component is referred to as "directly on another component," there are no components between them. Furthermore, when a component is referred to as "on another component," the two components have a vertical relationship in the planar view, and this component can be above or below the other component, depending on the orientation of the device.

[0028] The terms “equal to” or “same as”, “substantially” or “approximately” are generally interpreted as being within 20% of a given value or range, or as being within 10%, 5%, 3%, 2%, 1% or 0.5% of a given value or range.

[0029] The ordinal numbers used in the specification and claims, such as "first," "second," etc., to modify elements, do not in themselves imply or represent any prior ordinal number of that element (or those elements), nor do they represent the order of one element with another, or the order of manufacturing processes. The use of these ordinal numbers is solely to clearly distinguish one named element from another element with the same name. The claims and specification may not use the same terminology; therefore, a first element in the specification may be a second element in the claims.

[0030] It should be understood that the features in the following embodiments can be replaced, recombined, or mixed to complete other embodiments without departing from the spirit of this disclosure. Features between embodiments can be arbitrarily mixed and combined as long as they do not violate the spirit of the invention or conflict with it.

[0031] The electrical connections or couplings described in this disclosure can refer to direct or indirect connections. In the case of a direct connection, the endpoints of the components in two circuits are directly connected or connected to each other by a conductor segment. In the case of an indirect connection, there is a switch, diode, capacitor, inductor, other suitable component, or combination of the above components between the endpoints of the components in two circuits, but not limited to these.

[0032] In this disclosure, the thickness, length, width, and area can be measured using an optical microscope, and the thickness can be measured from a cross-sectional image using an electron microscope, but these methods are not limited to these. Furthermore, any two values ​​or directions used for comparison may have a certain degree of error. If the first value equals the second value, it implies an error of approximately 10% between the two values; if the first direction is perpendicular to the second direction, the angle between the first and second directions may be between 80 and 100 degrees; if the first direction is parallel to the second direction, the angle between the first and second directions may be between 0 and 10 degrees.

[0033] The electronic devices disclosed herein can be applied to display devices, automated equipment, clamping devices, computing devices, mechanical equipment, drug dispensing equipment, exposure devices, printing devices, 3D printing devices, automotive devices, image capturing devices, assembly devices, backlight devices, antenna devices, light-emitting devices, sensing devices, medical devices, touch devices, or splicing devices, but are not limited thereto. Electronic devices include, but are not limited to, rollable, bendable, or flexible electronic devices. Display devices can be non-self-emissive display devices, self-emissive display devices, transparent display devices, mirror display devices, transflective display devices, or reflective display devices. Electronic devices may include, for example, diodes, liquid crystals, light-emitting diodes (LEDs), quantum dots (QDs), fluorescence, phosphorescence, other suitable display media, or combinations thereof. Antenna devices can be liquid crystal type antenna devices or non-liquid crystal type antenna devices, and sensing devices can be sensing capacitance, light, heat, or ultrasound, but are not limited thereto. The splicing device may be, for example, a display splicing device or an antenna splicing device, but is not limited thereto. It should be noted that the electronic device may be any arrangement or combination of the aforementioned, but is not limited thereto. Furthermore, the electronic device may be rectangular, circular, polygonal, have curved edges, or other suitable shapes. The electronic device may have peripheral systems such as a drive system, a control system, and a light source system to support the display device, antenna device, wearable device (e.g., augmented reality or virtual reality), in-vehicle device (e.g., a car windshield), or splicing device.

[0034] Reference will now be made in detail to exemplary embodiments of the invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same element references are used in the drawings and description to denote the same or similar parts.

[0035] Figure 1A This is a circuit diagram of the electronic device according to the first embodiment of this disclosure. Figure 1B Based on Figure 1A A magnified top view of region R1. Figure 1C Based on Figure 1B A schematic diagram of the cross-section along line A1-A1', and Figure 1D Based on Figure 1B A schematic cross-sectional view along section line A2-A2'. It is worth noting that, for clarity and ease of explanation, the accompanying diagram is provided below. Figures 1A to 1D Several components are omitted.

[0036] Please refer to Figures 1A to 1DThe electronic device 10a of this embodiment includes a substrate SB, which may have an active region AA and a peripheral region (not shown). In some embodiments, the peripheral region is located on at least one side of the active region AA. In this embodiment, the peripheral region is disposed on one side of the active region AA in the Y direction, but is not limited thereto. It is worth noting that the electronic device 10a disclosed herein may be, for example, a display device, an antenna device, a sensing device, or a splicing device. For example, the electronic device 10a disclosed herein may be a transparent display device.

[0037] In this embodiment, the electronic device 10a includes multiple scan lines 100, multiple scan transmission lines 200, and at least one conductive pattern 300.

[0038] In some embodiments, the electronic device 10a may further include a driving element (not shown). The driving element is disposed, for example, on a substrate SB, and for example, in a peripheral region of the electronic device 10a. In some embodiments, the driving element may be disposed on the surface of the substrate SB in a chip-on-glass (COG) manner, but is not limited thereto. That is, in other embodiments, the driving element may be disposed on the surface of the substrate SB in a chip-on-plastic (COP) manner. Alternatively, in still other embodiments, the driving element includes a driving circuit and is directly disposed on the surface of the substrate SB (gate-on-panel (GOP)). The driving element may include, for example, a driving chip, a circuit board, or a combination thereof. In some embodiments, the driving chip may include driving units such as a timing control unit, a data driving unit, and a power driving unit, and the circuit board may include a flexible printed circuit board (FPC), but is not limited thereto.

[0039] The substrate SB can be made of, for example, glass, plastic, or a combination thereof. For instance, the substrate SB may be made of quartz, sapphire, polymethyl methacrylate (PMMA), polycarbonate (PC), polyimide (PI), polyethylene terephthalate (PET), or other suitable materials or combinations thereof, and is not limited thereto.

[0040] Multiple scan lines 100 are disposed, for example, on the active region AA of the substrate SB, and are electrically connected, for example, to a transistor (not shown), wherein one of the multiple scan lines 100 may, for example, provide a gate signal to the corresponding transistor. In this embodiment, the multiple scan lines 100 extend in the direction X and may include, but are not limited to, scan lines 101 to 116. For example, the multiple scan lines 100 may include a first scan line 101 and a second scan line 102. In this embodiment, the multiple scan lines 100 may have substantially the same length relative to each other in the direction X. In this disclosure, the length of the signal line may be measured along the direction of extension of the signal line. In some embodiments, the material of the multiple scan lines 100 may include titanium (Ti), molybdenum (Mo), chromium (Cr), aluminum (Al), copper (Cu), alloys thereof, other suitable conductive materials, or combinations thereof, and the multiple scan lines 100 may be a single-layer or multi-layer structure.

[0041] Multiple scan transmission lines 200 are disposed, for example, on the active region AA of the substrate SB, and are each electrically connected to one of the multiple scan lines 100. In this embodiment, the multiple scan transmission lines 200 and the multiple scan lines 100 are arranged in an alternating manner, and each forms multiple intersections I. Specifically, an intersection I is a position where one of the multiple scan transmission lines 200 and one of the multiple scan lines 100 overlaps with each other in the Z direction. Based on this, the longer one of the multiple scan transmission lines 200 is, the more intersections I it will have. For example, the number of intersections I1 between scan transmission line 201 and the multiple scan lines 100 is greater than the number of intersections I2 between scan transmission line 202 and the multiple scan lines 100. The material of the multiple scan transmission lines 200 can be the same as the material of the multiple scan lines 100, and the multiple scan transmission lines 200 can be a single-layer or multi-layer structure.

[0042] In this embodiment, multiple scan transmission lines 200 extend in the Y direction and may include scan transmission lines 201-216, wherein each scan transmission line 201-216 may form an intersection I1-I16 with scan lines 101-116. For example, the multiple scan transmission lines 200 may include a first scan transmission line 201 and a second scan transmission line 202, wherein the first scan transmission line 201 forms multiple first intersections I1 with scan lines 101-116, the second scan transmission line 202 forms multiple second intersections I2 with scan lines 101-116, and so on, which will not be elaborated here. It is worth noting that, although Figure 1A Only one intersection point I1 to I16 is indicated, but this does not mean that there is only one intersection point. In this embodiment, the multiple intersection points I include bridging portions B and non-bridging portions NB, wherein the bridging portion B is the location where one of the multiple scan transmission lines 200 is electrically connected to one of the multiple scan lines 100. Based on this, by electrically connecting the corresponding scan transmission line 200 to the scan line, a signal line CL can be formed. For example, please refer to... Figure 1A The first intersection I1 includes a first bridging portion B1 electrically connecting the first scan transmission line 201 and the first scan line 101, and a first non-bridging portion NB1 overlapping the first scan transmission line 201 with scan lines 102-116. The second intersection I2 includes a second bridging portion B2 electrically connecting the second scan transmission line 202 and the second scan line 102, and a second non-bridging portion NB2 overlapping the second scan transmission line 202 with scan lines 101, 103-116, and so on, which will not be elaborated here. In this embodiment, an insulating layer IL is provided between the plurality of scan lines 100 and the corresponding scan transmission lines 200, wherein the insulating layer IL has through holes Va, so that the plurality of scan transmission lines 200 can be electrically connected to the corresponding scan lines 100 through the bridging portions B provided in the corresponding through holes Va. For example, please refer to Figure 1B Scan transmission line 208 can be electrically connected to scan line 108 through via Va in insulating layer IL, and scan transmission line 209 can be electrically connected to scan line 109 through via Va in insulating layer IL. In some embodiments, the material of insulating layer IL may include silicon nitride (SiN). x ), silicon dioxide (SiO) x ), organic materials, other suitable insulating materials, or combinations thereof.

[0043] In this embodiment, the length of the first scan transmission line 201 is greater than the length of the second scan transmission line 202. More specifically, the scan transmission lines 201 to 216 may each have progressively shorter lengths in this order, but are not limited thereto.

[0044] In some embodiments, the scan transmission line 200 has a first width at the intersection I and a second width at the non-intersection, and the first width is less than or equal to the second width. For example, in this embodiment, the width W1 of the scan transmission line 209 at the intersection I9 (such as the non-bridging part NB9) is less than the width W2 at the non-intersection, but is not limited thereto. In some embodiments, the width W3 of the scan transmission line 209 at the bridging part B9 is greater than or equal to the width W1, but is not limited thereto. In this disclosure, the width of the signal line (i.e., the line width) can be measured along a direction perpendicular to the extension direction of the signal line. For example, the widths W1 to W3 of the scan transmission line 209 can be measured along a direction perpendicular to the extension direction of the scan transmission line 209 (direction X). In some embodiments, the line width of the scan transmission line 200 is greater than or equal to 2.5 micrometers, but is not limited thereto. At least one conductive pattern 300 is disposed, for example, on the active region AA of the substrate SB, and is connected in parallel, for example, to at least one of the plurality of scan transmission lines 200 and the plurality of scan lines 100. In this embodiment, at least one conductive pattern 300 and multiple scan transmission lines 200 belong to different layers and are connected in parallel to the corresponding scan transmission lines 200. The at least one conductive pattern 300 may include multiple conductive patterns 301-316 arranged in the Y direction. For example, the at least one conductive pattern 300 may include multiple first conductive patterns 301 and multiple second conductive patterns 302. The multiple first conductive patterns 301 are separated from each other in the Y direction and at least partially overlap with the first scan transmission lines 201 in the Z direction. The multiple second conductive patterns 302 are separated from each other in the Y direction and at least partially overlap with the second scan transmission lines 202 in the Z direction. In this disclosure, "at least partially overlap" includes partial or complete overlap in the Z direction. The arrangement relationship between the multiple conductive patterns 303-316 and the scan transmission lines 203-216 can be deduced similarly and will not be elaborated further here. The material of the at least one conductive pattern 300 may be the same as the material of the multiple scan lines 100, but is not limited thereto.

[0045] In this disclosure, the minimum distance between patterns formed by the same conductive layer can be, for example, greater than or equal to 2.5 micrometers. In this embodiment, at least one conductive pattern 300 and the scan line 100 are made of the same conductive layer, so the minimum distance between at least one conductive pattern 300 and the scan line 100 can be greater than or equal to 2.5 micrometers, but is not limited thereto.

[0046] In this disclosure, in a top-view orientation, the edge of at least one conductive pattern 300 is misaligned with the edge of the scanning transmission line 200, and the misalignment distance in direction X is greater than or equal to 1 micrometer, to improve the reliability of the electronic device 10a. For example, such as Figure 1BAt least one conductive pattern 307 has its two side edges recessed within the two side edges of the scan transmission line 207, but this is not a limitation. In some embodiments, in a top view, one side edge of the conductive pattern 300 is recessed within one side edge of the scan transmission line 200, and the other side edge of the conductive pattern 300 protrudes beyond the other side edge of the scan transmission line 200. In this disclosure, the width of the at least one conductive pattern 300 and the width of the scan transmission line 200 can be adjusted as needed, and are not limited to... Figure 1B Limited to.

[0047] In this embodiment, the insulating layer IL also has a plurality of vias Vb, wherein at least two vias Vb are disposed between adjacent staggered points I. The vias Vb can be disposed, for example, to electrically connect at least one conductive pattern 300 to a corresponding scan transmission line 200. For example, please refer to... Figure 1B Scan transmission line 207 can be electrically connected to conductive pattern 307 through via Vb in insulating layer IL, scan transmission line 208 can be electrically connected to conductive pattern 308 through via Vb in insulating layer IL, and so on, which will not be elaborated here. In some embodiments, at least one conductive pattern 300 is electrically connected to scan transmission line 200 through at least two via Vb. It is worth noting that... Figure 1B The number of vias Vb electrically connected to the scan transmission line 200 in a conductive pattern 300 shown is not limited to this.

[0048] Furthermore, in this embodiment, at least one conductive pattern 300 belongs to the same layer as the scan line 100. In other words, at least one conductive pattern 300 does not overlap with the scan line 100 in the Z direction, but this is not a limitation.

[0049] In this embodiment, each of the plurality of conductive patterns 301 to 316 has a corresponding total area. For example, the plurality of first conductive patterns 301 have a first area (or, in other words, the total area of ​​the plurality of first conductive patterns 301), and the plurality of second conductive patterns 302 have a second area (or, in other words, the total area of ​​the plurality of second conductive patterns 302). Since the number of the plurality of first conductive patterns 301 arranged in the Y direction is greater than the number of the plurality of second conductive patterns 302 arranged in the Y direction, the first area of ​​the plurality of first conductive patterns 301 will be greater than the second area of ​​the plurality of second conductive patterns 302. More specifically, the plurality of conductive patterns 301 to 316 may each have progressively smaller areas in this order, but are not limited thereto.

[0050] Please continue to refer to Figure 1AIn some embodiments, the electronic device 10a may include a plurality of pixels PX, wherein the plurality of pixels PX are arranged in an array on a plane formed by directions X and Y, but is not limited thereto. Pixel PX may, for example, be the smallest repeating unit of active region AA. In some embodiments, pixel PX may be defined by interlaced scan lines and data lines, but is not limited thereto. In some embodiments, one of the plurality of pixels PX may include a suitable circuit region (not shown), wherein the circuit region is electrically connected to a corresponding scan line 100, and may include active elements, passive elements, high-frequency elements, light-emitting elements, packaged elements, other suitable electronic elements, or combinations thereof, but is not limited thereto.

[0051] In addition, in some embodiments, the electronic device 10a may include, in addition to multiple scan lines 100 and multiple scan transmission lines 200, data lines (not shown), power lines (not shown), light-emitting lines (not shown) and / or other suitable signal lines, and is not limited thereto. In some embodiments, the extending directions of the data lines and power lines are parallel to the extending directions of the scan transmission lines, and the extending directions of the light-emitting lines are parallel to the extending directions of the scan lines.

[0052] Additionally, in some embodiments, the width of the plurality of scan lines 100 and their corresponding scan transmission lines 200 at the intersection I (e.g., the non-bridging point NB) may be less than or equal to the width of the plurality of scan lines 100 and their corresponding scan transmission lines 200 at the non-intersection, and the total increase in width of each scan line 100 and its corresponding scan transmission line 200 at the non-intersection may be substantially the same, so that each scan line 100 may have similar impedance values, but is not limited thereto. The width (i.e., linewidth) of the scan line 100 may be measured along a direction perpendicular to the extension direction of the scan line 100 (direction Y). In some embodiments, the linewidth of the scan line 100 is greater than or equal to 2.5 micrometers, but is not limited thereto.

[0053] In this embodiment, by stacking and paralleling at least one conductive pattern 300 with multiple scan transmission lines 200, the impedance of the multiple scan transmission lines 200 can be reduced. Although the scan transmission lines 201-216 have progressively shorter lengths in this order, the corresponding conductive patterns 301-316 can also have progressively smaller areas in this order, resulting in the longer scan transmission lines 200 having lower impedance values. Furthermore, by ensuring that at least one conductive pattern 300 does not overlap with the scan line 100 in the Z direction, the possibility of capacitive load between the at least one conductive pattern 300 and the scan line 100 can be reduced. Based on this, although the longer scan transmission lines 200 have larger capacitive loads due to the greater number of intersections with the scan line 100, each signal line CL can have similar resistance-capacitance loading (RC loading), thereby improving the signal transmission quality of the electronic device 10a.

[0054] Figure 2A This is a top view schematic diagram illustrating the arrangement relationship between the conductive pattern, scan lines, and scan transmission lines according to an embodiment of this disclosure. Figure 2B This is a top view schematic diagram illustrating the arrangement relationship between the conductive pattern, scan lines, and scan transmission lines according to another embodiment of this disclosure. It should be noted that... Figure 2A and Figure 2B Each of the embodiments can be used independently. Figure 1B The component references and partial contents of the embodiments are as follows, wherein the same or similar references are used to represent the same or similar components, and the description of the same technical content is omitted.

[0055] Please refer to Figure 2A In this embodiment, at least one conductive pattern 300 and multiple scan lines 100 belong to different layers. For example, at least one conductive pattern 300 is disposed above multiple scan lines 100 and multiple scan transmission lines 200, wherein multiple scan transmission lines 200 are disposed between at least one conductive pattern 300 and multiple scan lines 100 in the Z direction.

[0056] In this embodiment, the minimum distance between two adjacent conductive patterns 300 can be greater than or equal to 2.5 micrometers, and the minimum distance between two adjacent scan lines 100 can be greater than or equal to 2.5 micrometers, but is not limited thereto. In this embodiment, the two side edges of at least one conductive pattern 300 protrude outward from the two side edges of the scan transmission line 200, but is not limited thereto.

[0057] This design increases the distance between at least one conductive pattern 300 and multiple scan lines 100, thereby further reducing the possibility of capacitive load between at least one conductive pattern 300 and scan lines 100.

[0058] Please refer to Figure 2B In this embodiment, at least one conductive pattern 300 and multiple scan lines 100 belong to different layers, and at least one conductive pattern 300 may extend in the Y direction and partially overlap with multiple scan lines 100 in the Z direction, that is, it may overlap at at least one intersection I.

[0059] In some embodiments, the conductive patterns 301-316 connected in parallel to the scanning transmission lines 201-216 can be as follows: Figure 2B As shown, the number of conductive patterns 301 to 316 is one, and the conductive patterns 301 to 316 may have progressively smaller lengths and areas, but are not limited to this. For example, since the length of the first conductive pattern 301 in the Y direction is greater than the length of the second conductive pattern 302 in the Y direction, the first area of ​​the first conductive pattern 301 will be greater than the second area of ​​the second conductive pattern 302.

[0060] In some embodiments, a scan transmission line 200 can be connected in parallel simultaneously. Figure 2A and Figure 2B The conductive pattern 300 shown makes the scan transmission line 200 have at least two different lengths of conductive pattern 300, but is not limited thereto.

[0061] As mentioned above Figure 2A and Figure 2B As described in the embodiments, since multiple scan transmission lines 200 are disposed in the Z direction between at least one conductive pattern 300 and multiple scan lines 100, and the scan transmission lines 200 at least partially overlap with at least one conductive pattern 300 in the Z direction, even though a portion of at least one conductive pattern 300 overlaps with a portion of a corresponding scan line 100 in the Z direction, the scan transmission lines 200 can shield the signal coupling between at least one conductive pattern 300 and multiple scan lines 100, thereby further reducing the possibility of capacitive load between at least one conductive pattern 300 and scan lines 100.

[0062] It is worth noting that the arrangement of at least one conductive pattern 300, multiple scan lines 100, and multiple scan transmission lines 200 can be adjusted as needed and is not limited to this embodiment. In some embodiments, multiple scan lines 100 may be disposed above multiple scan transmission lines 200 and at least one conductive pattern 300. Alternatively, in some other embodiments, multiple scan lines 100 and at least one conductive pattern 300 may be disposed above multiple scan transmission lines 200, and the multiple scan lines 100 and at least one conductive pattern 300 may belong to the same layer or different layers.

[0063] Figure 3 This is a circuit diagram of the electronic device according to the second embodiment of this disclosure. It should be noted that... Figure 3 The embodiments can be used Figure 1A The component references and partial contents of the embodiments are as follows, wherein the same or similar references are used to represent the same or similar components, and the description of the same technical content is omitted.

[0064] In this embodiment, at least one conductive pattern 300 connected in parallel with the scanning transmission line 200 in the electronic device 10b is only provided between a portion of the intersections I. In other words, the conductive pattern 300 may not be provided between the portions of the intersections I.

[0065] In this embodiment, at least one conductive pattern 300 in the electronic device 10b is arranged alternately in the X direction. For example, taking the conductive pattern 300 located between scan line 114 and scan line 116 as an example, conductive patterns 301 to 316 are arranged alternately in the X direction.

[0066] In this embodiment, at least one conductive pattern 300 in the electronic device 10b is arranged alternately in the Y direction. For example, taking conductive pattern 301 and conductive pattern 302, which are electrically connected to scan transmission line 201 and scan transmission line 202, as an example, conductive pattern 301 and conductive pattern 302 are alternately arranged alternately in the Y direction.

[0067] In some embodiments, segments of the plurality of scan transmission lines 200 that do not overlap with at least one conductive pattern 300 may overlap with other signal lines (e.g., data lines), but are not limited thereto.

[0068] Figure 4A This is a circuit diagram of the electronic device according to the third embodiment of this disclosure. Figure 4B Based on Figure 4A A magnified top view of region R2, and Figure 4C Based on Figure 4B A schematic cross-sectional view along section line A3-A3'. It should be noted that... Figures 4A to 4C The embodiments can be used Figures 1A to 1DThe component references and partial contents of the embodiments are as follows, wherein the same or similar references are used to represent the same or similar components, and the description of the same technical content is omitted.

[0069] In this embodiment, the electronic device 10c includes at least one conductive pattern 300'.

[0070] In this embodiment, at least one conductive pattern 300' is connected in parallel to a corresponding scan line 100, and the at least one conductive pattern 300' may include a plurality of conductive patterns 301' to 316' arranged in the X direction. For example, the at least one conductive pattern 300' may include a plurality of first conductive patterns 301' and a plurality of second conductive patterns 302'. The plurality of first conductive patterns 301' are separated from each other in the X direction and at least partially overlap with the first scan line 101 in the Z direction. The plurality of second conductive patterns 302' are separated from each other in the X direction and at least partially overlap with the second scan line 102 in the Z direction. The arrangement relationship between the plurality of conductive patterns 303' to 316' and the scan lines 103 to 116 can be deduced similarly and will not be described in detail here. In this embodiment, the insulating layer IL has a through hole Vc so that at least one conductive pattern 300' can be electrically connected to the corresponding scan line 100 through the corresponding through hole Vc. For example, please refer to Figure 4B Scan line 107 can be electrically connected to conductive pattern 307' through through-hole Vc of insulating layer IL, and scan line 108 can be electrically connected to conductive pattern 308' through through-hole Vc of insulating layer IL, and so on, which will not be elaborated here. It is worth noting that... Figure 4B The number of vias Vc electrically connected to a conductive pattern 300' and scan line 100 shown is not limited to this. The material of at least one conductive pattern 300' may be the same as the material of multiple scan lines 100, but is not limited to this.

[0071] In this disclosure, in a top-view orientation, the edge of at least one conductive pattern 300' is misaligned with the edge of the scan line 100, and the misalignment distance in the Y direction is greater than or equal to 1 micrometer, thereby improving the reliability of the electronic device 10a. For example, such as Figure 4B At least one conductive pattern 307' has two side edges that protrude beyond the side edges of the scan line 107, but is not limited thereto. In this disclosure, the width of at least one conductive pattern 300' and the width of the scan line 100 can be adjusted as needed, and are not limited to this. Figure 4B Limited to.

[0072] In some embodiments, the width W4 of the scan line 109 and the corresponding scan transmission line 207 at the intersection (such as the non-bridging point NB7) may be less than or equal to the width W5 of the scan line 109 at the non-intersection, but is not limited thereto. In some embodiments, the width W6 of the scan line 109 at the bridging portion B9 is greater than or equal to the width W4, but is not limited thereto.

[0073] In this embodiment, at least one conductive pattern 300' belongs to the same layer as the scan transmission line 200. In other words, at least one conductive pattern 300' does not overlap with the scan transmission line 200 in direction Z, but is not limited thereto. Additionally, in this embodiment, the electronic device 10c may include an insulating layer IL0 disposed between at least one conductive pattern 300' (or scan transmission line 200) and the substrate SB, but is not limited thereto. In this embodiment, each of the plurality of conductive patterns 301' to 316' has a corresponding total area. For example, the plurality of first conductive patterns 301' has a first area (or, the total area of ​​the plurality of first conductive patterns 301'), and the plurality of second conductive patterns 302' has a second area (or, the total area of ​​the plurality of second conductive patterns 302'). In this embodiment, since the number of the plurality of first conductive patterns 301' arranged in direction X is greater than the number of the plurality of second conductive patterns 302' arranged in direction X, the first area of ​​the plurality of first conductive patterns 301' will be greater than the second area of ​​the plurality of second conductive patterns 302'. In detail, the multiple conductive patterns 301' to 316' can each have progressively smaller areas in this order, but are not limited to this.

[0074] In this embodiment, by stacking and paralleling at least one conductive pattern 300' with multiple scan lines 100, the impedance of the multiple scan lines 100 can be reduced. Although the scan transmission lines 201-216 each have progressively shorter lengths in this order, the multiple conductive patterns 301'-316' corresponding to the scan lines 101-116 can also each have progressively smaller areas in this order, which will result in the scan lines 100 electrically connected to the longer scan transmission lines 200 having lower impedance values. Furthermore, by designing that at least one conductive pattern 300' does not overlap with the scan transmission line 200 in the Z direction, the possibility of capacitive load being generated between the at least one conductive pattern 300 and the scan transmission line 200 can be reduced. Therefore, although the longer scan transmission line 200 has a larger capacitive load due to the greater number of intersections with the scan line 100, each signal line CL can have a similar resistance-capacitance loading (RC loading) to each other, thereby improving the signal transmission quality of the electronic device 10c.

[0075] It is worth noting that, Figure 4A The electronic device 10c shown can be connected with Figure 1A The electronic device 10a shown or Figure 1B The illustrated electronic device 10b includes at least one conductive pattern 300 and at least one conductive pattern 300'.

[0076] Figure 5This is a circuit diagram of the electronic device according to the fourth embodiment of this disclosure. It should be noted that... Figure 5 The embodiments can be used Figure 1A The component references and partial contents of the embodiments are as follows, wherein the same or similar references are used to represent the same or similar components, and the description of the same technical content is omitted.

[0077] In this embodiment, the multiple scan lines 100 have a first width at the intersection I and a second width at the non-intersection, wherein the first width is smaller than the second width. Specifically, the multiple scan lines 100 have multiple widening segments 100LW at the non-intersection, wherein the number of widening segments 100LW on scan lines 101 to 116 decreases sequentially, but is not limited thereto.

[0078] In this embodiment, the multiple scan transmission lines 200 have a third width at the intersection I and a fourth width at the non-intersection, wherein the third width is less than or equal to the fourth width. Specifically, the multiple scan transmission lines 200 have multiple widening segments 200LW at the non-intersection, wherein the number of widening segments 200LW on scan transmission lines 201 to 216 decreases sequentially, but is not limited thereto.

[0079] In some embodiments, multiple scan lines 100 and / or multiple scan transmission lines 200 may not have widening segments 100LW or 200LW at some non-interlaced locations, and the aforementioned non-interlaced locations may overlap with other signal lines (e.g., data lines), but are not limited thereto.

[0080] This design further reduces the impedance of multiple scan lines 100 and / or multiple scan transmission lines 200. Therefore, signal lines CL with a larger number of broadened segments 100LW and / or broadened segments 200LW can have significantly reduced impedance. Based on this, each signal line CL will have similar resistive-capacitive loads, thereby improving the signal transmission quality of the electronic device 10d.

[0081] Figure 6 This is a circuit diagram of an electronic device according to the fifth embodiment of this disclosure. It should be noted that... Figure 6 The embodiments may use the component references and some contents of the embodiments in FIG1, wherein the same or similar references are used to represent the same or similar components, and the description of the same technical contents is omitted.

[0082] In this embodiment, Figure 6 The multiple scanning transmission lines 200 in the illustrated electronic device 10e each include a main line 200a and an extension line 200b electrically connected to the main line 200a, and the main line 200a and the extension line 200b are respectively disposed on opposite sides of the bridging portion B.

[0083] In detail, in this embodiment, the multiple scan transmission lines 200 may include scan transmission lines 201 to 216, wherein each scan transmission line 201 to 216 may form an intersection point I1 to I16 with scan lines 101 to 116. Each scan transmission line 202 to 216 may include a main line 202a to 216a and an extension line 202b to 216b, and the main lines 202a to 216a and the extension lines 202b to 216b are respectively disposed on opposite sides of the corresponding bridging portions B2 to B16. For example, the multiple scan transmission lines 200 may include a first scan transmission line 203 and a second scan transmission line 204, wherein the first main line 203a and the first extension line 203b of the first scan transmission line 203 are respectively disposed on opposite sides of the first bridging portion B3, and the second main line 204a and the second extension line 204b of the second scan transmission line 204 are respectively disposed on opposite sides of the second bridging portion B4. It is worth noting that although the scanning transmission line 201 in this embodiment does not include an extension line, it is not limited thereto.

[0084] In this embodiment, at least two of the scan transmission lines 201-216 may have different lengths from each other. For example, the length of the first scan transmission line 203 (or the total length of the first main line 203a and the first extension line 203b) is different from the length of the second scan transmission line 204 (or the total length of the first main line 204a and the first extension line 204b). Furthermore, the scan transmission lines 201-216 may have progressively smaller lengths, wherein the main lines 202a-216a may have progressively smaller lengths, and the extension lines 202b-216b may have progressively smaller or equal lengths. For example, the length of the first main line 203a is greater than the length of the second main line 204a, and the length of the first extension line 203b is equal to the length of the second extension line 204b, such that the length of the first scan transmission line 203 may be greater than the length of the second scan transmission line 204. In some embodiments, adjacent scan transmission lines may, for example, have substantially equal lengths, but are not limited thereto.

[0085] From another perspective, extension lines 202b to 216b have portions that overlap with the corresponding scan lines 102 to 116 in the Z direction. In this embodiment, extension lines 202b to 216b may have increasingly larger or equal portions that overlap with the corresponding scan lines 102 to 116 in this order.

[0086] Based on this, in this embodiment, by making each of the multiple scanning transmission lines 200 include a main line 200a and an extension line 200b disposed on opposite sides of the bridging portion B, although the main lines 202a to 216a have progressively shorter lengths and lower impedance values ​​in that order, the corresponding extension lines 202b to 216b can have longer or equal lengths. Therefore, each signal line CL will have similar resistive and capacitive loads, thereby improving the signal transmission quality of the electronic device 10e.

[0087] It is worth noting that, Figure 6 The illustrated electronic device 10e can be combined with other embodiments disclosed herein. For example, the electronic device 10e can be combined with... Figure 1A The illustrated electronic device 10a is combined with, but is not limited to, an extension line 200b and at least one conductive pattern 300.

[0088] Figure 7A This is a circuit diagram of the electronic device according to the sixth embodiment of this disclosure, and Figure 7B Based on Figure 7A A magnified top view of region R3. It should be noted that... Figure 7A and Figure 7B Each of the embodiments can be used independently. Figures 1A to 1D The component references and partial contents of the embodiments are as follows, wherein the same or similar references are used to represent the same or similar components, and the description of the same technical content is omitted.

[0089] In this embodiment, Figure 7A and Figure 7B At least one of the multiple scan lines 100 in the illustrated electronic device 10f is provided on opposite sides of the bridging portion B and has a different shape.

[0090] In detail, in this embodiment, the multiple scan lines 100 may include scan lines 101 to 116, wherein each of the scan lines 102 to 116 has a different shape and is disposed on opposite sides of the corresponding bridging portions B2 to B16. Each of the scan lines 102 to 116 may include a first portion 102a to 116a and a second portion 102b to 116b, and the first portion 102a to 116a and the second portion 102b to 116b are respectively disposed on opposite sides of the corresponding bridging portions B2 to B16. For example, the multiple scan lines 100 may include a first scan line 103 and a second scan line 104, wherein the first portion 103a and the second portion 103b of the first scan line 103 are respectively disposed on opposite sides of the first bridging portion B3, and the first portion 104a and the second portion 104b of the second scan line 104 are respectively disposed on opposite sides of the second bridging portion B4. In this embodiment, the first portions 102a to 116a are straight sections, and the second portions 102b to 116b include a plurality of curved sections C. Specifically, the second portions 102b to 116b may be composed of straight sections in the X direction and straight sections in the Y direction, and may have a relatively long length (compared to a simple straight section). In this embodiment, the second portions 102b to 116b may sequentially have an increasing or equal number of curved sections C. For example, the number of curved sections C in the second portion 102b is equal to the number of curved sections C in the second portion 103b, and the number of curved sections C in the second portion 103b is greater than the number of curved sections C in the second portion 104b.

[0091] It is worth noting that although the scan line 101 in this embodiment does not include the second part, it is not limited thereto.

[0092] Please refer to Figure 7B In this embodiment, one of the plurality of pixels PX of the electronic device 10f includes a circuit region AL. It is worth noting that, although not shown in the above embodiment, electronic devices 10a to 10e may also include a circuit region AL.

[0093] The circuit region AL may include, for example, at least one conductive layer (not shown) and at least one insulating layer (not shown). In this embodiment, the circuit region AL is electrically connected to the corresponding scan line 100 and includes, but is not limited to, materials or elements that do not penetrate or affect light transmission, such as transistors (not shown), light-emitting elements (not shown), or other electronic components (e.g., capacitors, resistors, inductors, diodes, sensors). The transistor is electrically connected to the light-emitting element and may include a gate, a source, a drain, and a semiconductor layer. The semiconductor layer may be made of low-temperature polysilicon (LTPS), metal oxide, or amorphous silicon (a-Si), or a combination thereof, but is not limited to. The light-emitting element may include a light-emitting diode, an organic light-emitting diode (OLED), an inorganic light-emitting diode (LED), such as a miniLED or microLED, a quantum dot (QD), a quantum dot LED (QDLED), fluorescence, phosphorescence, other suitable materials, or combinations thereof. In this embodiment, the light-emitting element includes a light-emitting diode, but is not limited thereto.

[0094] In this embodiment, the electronic device 10f further includes a plurality of transparent regions TA, wherein at least a portion of the transparent regions TA may be disposed in corresponding pixels PX. The transparent regions TA may be regions formed by light-transmitting materials; for example, the light-transmitting materials may include organic materials, inorganic materials, adhesive materials, filling materials, or encapsulating materials, but are not limited thereto. In some embodiments, the transparent regions TA may be defined, for example, as regions other than circuit regions AL and signal lines, but are not limited thereto. In this embodiment, a curved portion C of the second portion 108b may accommodate a transparent region TA in the Y direction, but is not limited thereto. In this embodiment, as... Figure 7A Each scan line 102-116 includes multiple curved portions C that can be arranged in the direction X. In this embodiment, as... Figure 7B The curved portion C of scan line 108 and the curved portion C of scan line 109 are arranged in the Y direction, which reduces the possibility that the area of ​​transparent region TA will shrink due to the setting of the curved portion C.

[0095] Based on this, in this embodiment, by making each of the scan lines 102 to 116 include a second portion 102b to 116b having a plurality of bends C, and by making the second portions 102b to 116b sequentially have an increasing or equal number of bends C, the scan lines 102 to 116 can have longer or equal lengths in this sequential order, thus having larger or equal impedance values. Therefore, each signal line CL will have similar resistive-capacitive loads, thereby improving the signal transmission quality of the electronic device 10f.

[0096] Figure 8A This is a circuit diagram of the electronic device according to the seventh embodiment of this disclosure, and Figure 8B Based on Figure 8A A magnified top view of region R4. It should be noted that... Figure 8A and Figure 8B Each of the embodiments can be used independently. Figure 7A and Figure 7B The component references and partial contents of the embodiments are as follows, wherein the same or similar references are used to represent the same or similar components, and the description of the same technical content is omitted.

[0097] In this embodiment, the main difference between electronic device 10g and electronic device 10f is that the circuit area AL within a pixel PX can receive signals from two adjacent scan lines 100.

[0098] In detail, the electronic device 10g may further include scan lines 100-1, scan transmission lines 200-1, and extension segments 400. In this embodiment, adjacent scan lines 100-1 and 101 may each provide the same or different signals for the circuit region AL within the first column of pixels PX. Similarly, adjacent scan lines 115 and 116 may each provide the same or different signals for the circuit region AL within the sixteenth column of pixels PX, which will not be elaborated further here. The extension segment 400 is electrically connected, for example, to the first portions 100a to 116a of the corresponding scan lines 100. In this embodiment, the extension segment 400 extends along the Y direction and is electrically connected to the circuit region AL within the corresponding pixel PX. For example, the extension segment 400 electrically connected to the scan line 100-1 extends along the Y direction and is electrically connected to the circuit region AL within the first column of pixels PX.

[0099] Figure 9 This is a schematic diagram of a brightness measurement method of an electronic device according to an embodiment of the present disclosure.

[0100] This embodiment illustrates a brightness measurement method for an electronic device 10. Specifically, nine endpoints E1 to E9 can be selected to measure the uniformity of the electronic device 10. Endpoint E1 is located near the edges s1 and s2 of the active area AA, wherein the ratio of the shortest distance between endpoint E1 and edge s1 to the shortest distance between endpoint E1 and edge s3 is approximately 1:9, and the ratio of the shortest distance between endpoint E1 and edge s2 to the shortest distance between endpoint E1 and edge s4 is approximately 1:9. Endpoint E2 is located near the edge s1 of the active area AA, wherein the ratio of the shortest distance between endpoint E2 and edge s1 to the shortest distance between endpoint E2 and edge s3 is approximately 1:9, and the ratio of the shortest distance between endpoint E2 and edge s2 to the shortest distance between endpoint E3 and edge s4 is approximately 1:1. Endpoint E3 is located near the edges s1 and s4 of the active area AA, wherein the ratio of the shortest distance between endpoint E3 and edge s1 to the shortest distance between endpoint E3 and edge s3 is approximately 1:9, and the ratio of the shortest distance between endpoint E3 and edge s2 to the shortest distance between endpoint E3 and edge s4 is approximately 9:1. Endpoint E4 is close to the edge s2 of the active region AA, where the shortest distance between endpoint E4 and edge s1 and the shortest distance between endpoint E4 and edge s3 is approximately 1:1, and the shortest distance between endpoint E4 and edge s2 and the shortest distance between endpoint E4 and edge s4 is approximately 1:9. Endpoint E5 is the center of the active region AA. Endpoint E6 is close to the edge s4 of the active region AA, where the shortest distance between endpoint E6 and edge s1 and the shortest distance between endpoint E6 and edge s3 is approximately 1:1, and the shortest distance between endpoint E6 and edge s2 and the shortest distance between endpoint E6 and edge s4 is approximately 9:1. Endpoint E7 is close to both edges s2 and s3 of the active region AA, where the shortest distance between endpoint E7 and edge s1 and the shortest distance between endpoint E7 and edge s3 is approximately 9:1, and the shortest distance between endpoint E7 and edge s2 and the shortest distance between endpoint E7 and edge s4 is approximately 1:9. Endpoint E8 is close to edge s2 of active region AA, where the shortest distance between endpoint E8 and edge s1 and the shortest distance between endpoint E8 and edge s3 is approximately 9:1, and the shortest distance between endpoint E8 and edge s2 and the shortest distance between endpoint E8 and edge s4 is approximately 1:1. Endpoint E9 is close to edges s2 and s4 of active region AA, where the shortest distance between endpoint E9 and edge s1 and the shortest distance between endpoint E9 and edge s3 is approximately 9:1, and the shortest distance between endpoint E9 and edge s2 and the shortest distance between endpoint E9 and edge s4 is approximately 9:1.

[0101] In some embodiments, a spectrophotometer can be used to measure the luminance values ​​of nine endpoints (e.g., endpoints E1 to E9) to calculate the luminance uniformity of the electronic device 10. Specifically, the uniformity of a corresponding region of the electronic device 10 can be defined as the percentage of the luminance values ​​of the endpoints between the endpoint with the lowest luminance value and the endpoint with the highest luminance value among the nine endpoints, but is not limited thereto. In this embodiment, the luminance uniformity of the electronic device 10 is greater than or equal to 75%. It is worth noting that the electronic device 10 in this embodiment can be any of the electronic devices 10a to 10g described in the above embodiments; that is, the luminance measurement method of the electronic device 10 can be applied to electronic devices 10a to 10g.

[0102] In summary, in the electronic devices provided in some embodiments of this disclosure, at least one conductive pattern is provided in parallel with the scan line and / or scan transmission line. When the corresponding scan transmission line has a relatively large length, the area of ​​the at least one conductive pattern also increases, so that each signal line will have similar resistive and capacitive loads, thereby improving the signal transmission quality of the electronic devices provided in some embodiments of this disclosure.

[0103] In the electronic devices provided in other embodiments of this disclosure, by making each of the multiple scanning transmission lines include a main line and an extension line disposed on opposite sides of the bridging portion, although the main lines have progressively shorter lengths and lower impedance values ​​in that order, the corresponding extension lines can have longer or equal lengths. Therefore, each signal line will have similar resistive and capacitive loads, thereby improving the signal transmission quality of the electronic devices provided in other embodiments of this disclosure.

[0104] In the electronic device provided in some embodiments of this disclosure, by including a plurality of bends in a portion of the scan line, and by making the scan line have fewer or equal numbers of bends as the scan transmission line electrically connected to it becomes longer, each signal line will have similar resistive and capacitive loads, thereby improving the signal transmission quality of the electronic device provided in some embodiments of this disclosure.

[0105] In summary, in the electronic device provided in this disclosed embodiment, by adjusting the impedance value and / or capacitive load in each signal line, each signal line will have a similar resistive and capacitive load to each other, thereby improving the image quality of the electronic device provided in this disclosed embodiment.

[0106] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. An electronic device, characterized in that, include: Multiple scan lines, including a first scan line and a second scan line; The first scan transmission line is arranged in an alternating manner with the plurality of scan lines to form a plurality of first intersections, wherein the plurality of first intersections include a first bridging portion that electrically connects the first scan transmission line and the first scan line; The second scan transmission line is arranged in an alternating manner with the plurality of scan lines to form a plurality of second intersections, wherein the plurality of second intersections include a second bridging portion that electrically connects the second scan transmission line and the second scan line; At least one first conductive pattern is connected in parallel to at least one of the first scan transmission line and the first scan line, and has a first area; and At least one second conductive pattern is connected in parallel to at least one of the second scan transmission line and the second scan line, and has a second area. The length of the first scan transmission line is greater than the length of the second scan transmission line, and the first area is greater than the second area.

2. The electronic device of claim 1, wherein the number of the plurality of first interlacing points is greater than the number of the plurality of second interlacing points.

3. The electronic device of claim 1, wherein the at least one first conductive pattern is electrically connected to the first scanning transmission line through at least two conductive vias, wherein, in a top view, adjacent at least two conductive vias are disposed between adjacent plurality of first intersections.

4. The electronic device according to claim 1, wherein it has a brightness uniformity of 75% or greater.

5. An electronic device, characterized in that, include: Multiple scan lines, including a first scan line and a second scan line; The first scan transmission line is arranged in an alternating manner with the plurality of scan lines to form a plurality of first intersections, and includes a first main line and a first extension line electrically connected to the first main line. The plurality of first intersections include a first bridging portion electrically connected to the first scan line, and in the top view, the first main line and the first extension line are respectively disposed on opposite sides of the first bridging portion. as well as The second scan transmission line is arranged interlaced with the plurality of scan lines to form a plurality of second intersections, and includes a second main line and a second extension line electrically connected to the second main line. The plurality of second intersections include a second bridging portion electrically connecting the second scan transmission line and the second scan line. In the top view, the second main line and the second extension line are respectively disposed on opposite sides of the second bridging portion. Wherein, the length of the first main line is greater than the length of the second main line, the length of the first extension line is less than or equal to the length of the second extension line, and the length of the first scan transmission line is different from the length of the second scan transmission line.

6. The electronic device of claim 5, wherein the plurality of scan lines extend along a first direction and have the same length in the first direction, the first scan transmission line and the second scan transmission line extend along a second direction, and in the second direction, the length of the first scan transmission line is greater than the length of the second scan transmission line.

7. The electronic device according to claim 5, wherein it has a brightness uniformity of 75% or greater.

8. An electronic device, characterized in that, include: Multiple scan lines, including the first scan line; and The first scan transmission line is arranged in an alternating pattern with the plurality of scan lines to form a plurality of first intersections, and the plurality of first intersections include a first bridging portion that electrically connects the first scan transmission line to the first scan line. In the top view, the first scan line is arranged on the opposite sides of the first bridging portion with different shapes.

9. The electronic device according to claim 8, wherein it has a brightness uniformity of 75% or greater.

10. The electronic device of claim 8, further comprising: The circuit area is electrically connected to the first scan line; as well as A transparent region, wherein at least a portion of the transparent region is accommodated by one of the plurality of curved portions.

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