Components for semiconductor manufacturing equipment

Abstract

A wafer mounting table 10, which is one example of a member for a semiconductor manufacturing apparatus, comprises: a ceramic plate 20 that has, on the upper surface thereof, at least one of a wafer mounting surface 21 and a focus ring mounting surface 26; a plug placement hole 24 that penetrates the ceramic plate 20 in the vertical direction and has a tapered inner peripheral surface 24a tapering toward the lower side thereof; and a plug 50 that is fitted into the plug placement hole 24, has a tapered outer peripheral surface 50a tapering toward the lower side thereof, and allows gas to flow in the vertical direction. The outer peripheral surface 50a of the plug 50 has a steeper slope than the inner peripheral surface 24a of the plug placement hole 24.

Claims

1. A ceramic plate having at least one of a wafer mounting surface and a focus ring mounting surface on its upper surface, The aforementioned ceramic plate has a plug placement hole that penetrates vertically and has a tapered inner surface that narrows towards the bottom, A plug that fits into the aforementioned plug placement hole, has a tapered outer surface that narrows towards the bottom, and allows gas to flow in the vertical direction, Equipped with, A component for semiconductor manufacturing equipment, wherein the outer surface of the plug is steeper than the inner surface of the plug placement hole.

2. The semiconductor manufacturing apparatus component according to claim 1, wherein the difference between the inclination angle α of the outer surface of the plug and the inclination angle θ of the inner surface of the plug placement hole is 0.2° or less.

3. The semiconductor manufacturing apparatus component according to claim 1, wherein the difference between the inclination angle α of the outer surface of the plug and the inclination angle θ of the inner surface of the plug placement hole is 0.05° or more and 0.10° or less.

4. The semiconductor manufacturing apparatus component according to any one of claims 1 to 3, wherein the inclination angle θ of the inner circumferential surface of the plug arrangement hole is 70° or more and less than 88°.

5. The component for semiconductor manufacturing apparatus according to any one of claims 1 to 3, wherein the extraction strength required to pull out the plug toward the wafer mounting surface is 150 N or more.

6. A semiconductor manufacturing apparatus component according to any one of claims 1 to 3, A conductive substrate is bonded to the lower surface of the ceramic plate and provided with a gas supply passage that communicates with the plug placement hole, A component for semiconductor manufacturing equipment, equipped with the following features.

7. The ceramic plate has an electrode built in, the semiconductor manufacturing apparatus component according to any one of claims 1 to 3.

8. The component for semiconductor manufacturing apparatus according to any one of claims 1 to 3, wherein the plug is press-fitted into the plug placement hole.

9. The semiconductor manufacturing apparatus component according to any one of claims 1 to 3, excluding the case in which the plug and the plug placement hole are bonded together with an adhesive layer.

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