Thermal management loop
The thermal management circuit with three heat exchangers and a switching device enables easy adjustment of heat exchange efficiency, enhancing cooling and heat absorption performance, and allows for component miniaturization.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- TOYOTA JIDOSHA KK
- Filing Date
- 2023-10-02
- Publication Date
- 2026-06-23
Smart Images
Figure 0007878247000001 
Figure 0007878247000002 
Figure 0007878247000003
Abstract
Description
Technical Field
[0001] The present disclosure relates to a thermal management circuit.
Background Art
[0002] Japanese Unexamined Patent Application Publication No. 2020-185880 (Patent Document 1) discloses a cooling water circuit including a first heat exchanger and a second heat exchanger in which heat exchange between outside air and cooling water is performed. The cooling water circuit is configured to be able to switch between a circuit state in which the first heat exchanger and the second heat exchanger are connected in series and a circuit state in which the first heat exchanger and the second heat exchanger are connected in parallel. By switching the connection state between the first heat exchanger and the second heat exchanger, the heat exchange efficiency of the heat medium (cooling water) is adjusted.
Prior Art Documents
Patent Documents
[0003]
Patent Document 1
Summary of the Invention
Problems to be Solved by the Invention
[0004] In the cooling water circuit of Patent Document 1 described above, as described above, by switching the connection state between the first heat exchanger and the second heat exchanger, the heat exchange efficiency of the heat medium is adjusted. On the other hand, it is desired to make it possible to more easily adjust the heat exchange efficiency of the heat medium.
[0005] The present disclosure has been made to solve the above problems, and an object thereof is to provide a thermal management circuit capable of easily adjusting the heat exchange efficiency of a heat medium.
Means for Solving the Problems
[0006] A thermal management circuit according to one aspect of this disclosure is a thermal management circuit mounted on electrical equipment and comprises: an equipment layout circuit through which a heat transfer medium flows to a temperature-controlled equipment that is the equipment to be temperature-controlled; a refrigeration cycle connected to a chiller and a water-cooled condenser; a heat exchange device in which heat exchange between the outside air and the heat transfer medium takes place; and a switching device capable of switching the flow path of the heat transfer medium. The heat exchange device includes a first heat exchanger, a second heat exchanger, and a third heat exchanger, which are provided separately from each other. The connection state between each of the first heat exchanger, the second heat exchanger, and the third heat exchanger and each of the equipment layout circuit and the refrigeration cycle can be switched by the switching device.
[0007] In a thermal management circuit relating to one aspect of this disclosure, as described above, the connection state between each of the first heat exchanger, the second heat exchanger, and the third heat exchanger and each of the equipment layout circuit and refrigeration cycle is switched by a switching device. As a result, since the heat exchanger is equipped with three heat exchangers, the combination of heat exchangers used for heat exchange can be made more diverse compared to the case where there are two heat exchangers. As a result, it is possible to easily adjust the heat exchange efficiency of the heat exchanger. This makes it possible to easily adjust the temperature of the equipment to be temperature controlled in the equipment layout circuit and to easily respond to air conditioning requirements through the refrigeration cycle.
[0008] In the thermal management circuit relating to the first aspect described above, preferably, the third heat exchanger is connected to the refrigeration cycle. The water-cooled condenser includes a condensation section that changes the heat transfer medium from a gas phase to a liquid phase. In the third heat exchanger, heat is exchanged between the heat transfer medium, which has been changed to a liquid phase in the condensation section, and the outside air. With this configuration, the third heat exchanger can easily exchange heat between the outside air and the refrigerant of the refrigeration cycle.
[0009] In the thermal management circuit relating to the first aspect described above, preferably, the water-cooled condenser includes a condensation section that changes the heat transfer medium from a gas phase to a liquid phase, and a supercooling section that cools the heat transfer medium that has been changed to a liquid phase in the condensation section. The condensation section and the supercooling section are connected to a switching device by a first flow path and a second flow path, respectively. Each of the first and second flow paths has a first directional flow path through which the heat transfer medium flows toward the switching device, and a second directional flow path through which the heat transfer medium flows in the opposite direction to the first directional flow path. With this configuration, heat exchange of the heat transfer medium can be performed independently of each other in the closed circuit passing through the condensation section and the first flow path, and in the closed circuit passing through the supercooling section and the second flow path. As a result, the heat exchange efficiency of the heat transfer medium can be adjusted more easily.
[0010] In the thermal management circuit relating to the first aspect described above, preferably, the water-cooled condenser includes a condensation section that changes the heat transfer medium from a gas phase to a liquid phase, and a supercooling section that cools the heat transfer medium that has been changed to a liquid phase in the condensation section. The condensation section and the supercooling section are connected to a switching device by a third flow path and a fourth flow path, respectively. The third flow path is composed of a third-directional flow path through which the heat transfer medium flows from the condensation section toward the switching device. The fourth flow path is composed of a fourth-directional flow path through which the heat transfer medium flows from the switching device toward the supercooling section. With this configuration, the configuration of the thermal management circuit can be simplified compared to the case where each of the third flow path and the fourth flow path is composed of multiple flow paths.
[0011] In the thermal management circuit relating to the first aspect described above, preferably, the first heat exchanger and the third heat exchanger are positioned upstream of the second heat exchanger in the direction of flow of outside air into the heat exchanger. With this configuration, the outside air passes through the first and third heat exchangers before passing through the second heat exchanger, so the temperature of the outside air passing through the first and third heat exchangers can be kept relatively low. As a result, the amount of heat dissipated by the heat transfer medium in the first and third heat exchangers can be increased. [Effects of the Invention]
[0012] According to this disclosure, the heat exchange efficiency of the heat transfer medium can be easily adjusted by using the first to third heat exchangers. [Brief explanation of the drawing]
[0013] [Figure 1] This figure shows the configuration of the thermal management system according to the first embodiment. [Figure 2] This figure shows the circuit pattern 1A of the thermal management circuit according to the first embodiment. [Figure 3] This figure shows the circuit pattern 1B of the thermal management circuit according to the first embodiment. [Figure 4] This figure shows the circuit pattern 1C of the thermal management circuit according to the first embodiment. [Figure 5] This figure shows the circuit pattern 1D of the thermal management circuit according to the first embodiment. [Figure 6] This figure shows the circuit pattern 1E of the thermal management circuit according to the first embodiment. [Figure 7] This figure shows the correspondence between various temperature conditions and circuit patterns in the thermal management circuit according to the first embodiment. [Figure 8] This figure shows the configuration of the thermal management system according to the second embodiment. [Figure 9] This figure shows the circuit pattern 2A of the thermal management circuit according to the second embodiment. [Figure 10] This figure shows the circuit pattern 2B of the thermal management circuit according to the second embodiment. [Figure 11] This figure shows the circuit pattern 2C of the thermal management circuit according to the second embodiment. [Figure 12] This figure shows the circuit pattern 2D of the thermal management circuit according to the second embodiment. [Figure 13] This figure shows the circuit pattern 2E of the thermal management circuit according to the second embodiment. [Figure 14] This figure shows the correspondence between various temperature conditions and circuit patterns in the thermal management circuit according to the second embodiment. [Figure 15] This figure shows the configuration of the thermal management system according to the third embodiment. [Figure 16] It is a diagram showing circuit pattern 3A of the heat management circuit according to the third embodiment. [Figure 17] It is a diagram showing circuit pattern 3B of the heat management circuit according to the third embodiment. [Figure 18] It is a diagram showing circuit pattern 3C of the heat management circuit according to the third embodiment. [Figure 19] It is a diagram showing circuit pattern 3D of the heat management circuit according to the third embodiment. [Figure 20] It is a diagram showing circuit pattern 3E of the heat management circuit according to the third embodiment. [Figure 21] It is a diagram showing the correspondence between various temperature conditions and circuit patterns in the heat management circuit according to the third embodiment.
Mode for Carrying Out the Invention
[0014] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. In the drawings, the same or corresponding parts are denoted by the same reference numerals, and the description thereof will not be repeated.
[0015] [First Embodiment] FIG. 1 is a diagram showing the overall configuration of a heat management system 1 including a heat management circuit 10 according to the first embodiment. The heat management system 1 includes a heat management circuit 10, an electronic control unit (ECU: Electronic Control Unit) 80, and a human machine interface (HMI) 90. The heat management system 1 is mounted on, for example, an electric vehicle 1a (see FIG. 2). The electric vehicle 1a is an example of the "electrical equipment" of the present disclosure.
[0016] The heat management circuit 10 includes a battery circuit 100, a low-temperature circuit 200, a heat exchanger 300, a refrigeration cycle 400, a switching device 500, a heater core 600, and a water pump 700. In this specification, the heat medium flowing in the refrigeration cycle 400 is referred to as "refrigerant", and the heat medium flowing in other circuits is referred to as "coolant". Each of the refrigerant and the coolant is an example of the "heat medium" of the present disclosure.
[0017] The battery circuit 100 connects the chiller 410 and the switching device 500, which will be described later. The battery circuit 100 includes a battery 110 and a water pump 120. The battery 110 is the device to be temperature controlled (for example, cooled). Coolant flows through the battery circuit 100, exchanging heat with the battery 110. The battery 110 stores electricity used for driving the electric vehicle 1a, etc. The water pump 120 is located downstream of the battery 110 and upstream of the chiller 410 in the direction of coolant flow through the battery circuit 100. Note that the battery 110 and the battery circuit 100 are examples of the "temperature controlled device" and "device layout circuit" as described herein.
[0018] The low-temperature circuit 200 includes an eAxle 210 and a water pump 220. Coolant flows through the low-temperature circuit 200, exchanging heat with the eAxle 210. The eAxle 210 includes a PCU (Power Control Unit) and an oil cooler, etc., which are not shown. The eAxle 210 is the device to be temperature controlled (e.g., cooled). The water pump 220 is located upstream of the eAxle 210 in the direction of coolant flow through the low-temperature circuit 200. The eAxle 210 and the low-temperature circuit 200 are examples of the "temperature-controlled device" and "device layout circuit" as defined in this disclosure, respectively.
[0019] The heat exchanger 300 includes an LT (Low Temperature) radiator 310, an HT (High Temperature) radiator 320, and a subcooled condenser 330. The LT radiator 310, the HT radiator 320, and the subcooled condenser 330 are provided separately (independently) from each other. Heat exchange between the outside air and the cooling water takes place in the LT radiator 310 and the HT radiator 320, respectively. Heat exchange between the outside air and the refrigerant of the refrigeration cycle 400 takes place in the subcooled condenser 330. The refrigerant of the refrigeration cycle 400 is cooled more effectively because it directly exchanges heat with the outside air. The subcooled condenser 330 is connected to the refrigeration cycle 400. The LT radiator 310 and the HT radiator 320 are examples of the "first heat exchanger" and "second heat exchanger" of this disclosure, respectively. The subcooled condenser 330 is an example of the "third heat exchanger" of this disclosure.
[0020] The refrigeration cycle 400 includes a chiller 410, an evaporator 420, a compressor 430, a water-cooled condenser 440, an expansion valve 450, an expansion valve 460, a three-way valve 470, and a three-way valve 480.
[0021] The three-way valve 470 and the three-way valve 480 are connected by a flow path 475. The three-way valves 470 and 480 are configured to switch between allowing refrigerant from the water-cooled condenser 440 to flow to the subcooled condenser 330, or not flowing it to the subcooled condenser 330 by allowing it to flow through the flow path 475.
[0022] The chiller 410 is connected to both the refrigeration cycle 400 and the battery circuit 100. As a result, heat exchange occurs in the chiller 410 between the refrigerant flowing through the refrigeration cycle 400 and the coolant flowing through the battery circuit 100.
[0023] The refrigerant (gas-phase or liquid-phase refrigerant) circulating in the refrigeration cycle 400 flows through one or both of the following paths: a first path from compressor 430 - water-cooled condenser 440 - subcooled condenser 330 (or flow path 475) - expansion valve 460 - evaporator 420 - compressor 430, and a second path from compressor 430 - water-cooled condenser 440 - subcooled condenser 330 (or flow path 475) - expansion valve 450 - chiller 410 - compressor 430.
[0024] The water-cooled condenser 440 includes a condensing section 441 and a liquid storage section 442. The condensing section 441 condenses the high-temperature, high-pressure gaseous refrigerant pumped from the compressor 430 into a liquid refrigerant. The condensing section 441 also exchanges heat between the coolant from the switching device 500 and the liquid refrigerant. The liquid storage section 442 separates the liquid phase refrigerant that has passed through the condensing section 441. The subcooled condenser 330 exchanges heat between the liquid phase refrigerant that has passed through the liquid storage section 442 and the outside air.
[0025] The switching device 500 is configured to switch the flow path of the heat transfer medium (coolant). The switching device 500 has ports P1 to P16. Port P1 is an outlet port that discharges coolant toward the LT radiator 310. Port P2 is an inlet port into which coolant flows from the LT radiator 310. No flow paths are connected to ports P3 and P4. Port P5 is an outlet port that discharges coolant toward the HT radiator 320. Port P6 is an inlet port into which coolant flows from the HT radiator 320. Port P7 is an outlet port that discharges coolant toward the heater core 600. Port P8 is an inlet port into which coolant flows from the heater core 600.
[0026] Port P9 is an outlet port that discharges coolant toward the water pump 220 (eAxle 210). Port P10 is an inlet port into which coolant flows from the eAxle 210. Port P11 is an outlet port that discharges coolant toward the battery 110. Port P12 is an inlet port into which coolant flows from the chiller 410 that has flowed through the battery circuit 100. Port P13 is an inlet port into which coolant flows from the water pump 700, which is located between the condenser 441 and the switching device 500. Port P14 is an outlet port that discharges coolant toward the condenser 441. Ports P13 and P14 are connected to the condenser 441 by flow paths 710 and 720, respectively. The coolant that has discharged from the condenser 441 flows through flow path 710 and into the switching device 500 from port P13. The coolant discharged from port P14 flows through the flow path 720 into the condenser 441. The coolant that flows into the condenser 441 undergoes heat exchange with the refrigerant of the refrigeration cycle 400 before being discharged towards the water pump 700. No flow paths are connected to ports P15 and P16. Flow paths 710 and 720 are examples of the "first flow path" in this disclosure. Flow paths 710 and 720 are also examples of the "first directional flow path" and "second directional flow path" in this disclosure, respectively.
[0027] The ECU 80 controls the thermal management circuit 10. The ECU 80 includes a processor 81, memory 82, storage 83, and interface 84. The ECU 80 controls the state of the switching device 500, the three-way valve 470, and the three-way valve 480, and also adjusts the flow rate of each water pump.
[0028] Therefore, it is desirable to make it easier to adjust the heat exchange efficiency of the heat transfer medium (coolant, refrigerant) in conventional thermal management circuits.
[0029] Therefore, in the thermal management circuit 10 of the first embodiment, the connection state between each of the LT radiator 310, HT radiator 320, and subcooling condenser 330 and each of the battery circuit 100, low-temperature circuit 200, and refrigeration cycle 400 is switched by the switching device 500. Specifically, the thermal management circuit 10 can take the circuit patterns shown in Figures 2 to 6 below.
[0030] Figure 2 shows circuit pattern 1A of the thermal management circuit 10. In the example shown in Figure 2, eAxle 210 is connected to LT radiator 310 via switching device 500. Also, condenser 441 is connected to HT radiator 320 via switching device 500. Furthermore, by closing ports P11 and P12 (see Figure 1) of switching device 500, the coolant does not flow through chiller 410. Also, by closing ports P7 and P8 (see Figure 1) of switching device 500, the coolant does not flow through heater core 600. In addition, three-way valves 470 and 480 are controlled so that the refrigerant of refrigeration cycle 400 flows through subcooling condenser 330. Note that in circuit pattern 1A, HT radiator 320 and LT radiator 310 are separated.
[0031] Furthermore, as shown in Figure 2, the LT radiator 310 and the subcooled condenser 330 are positioned upstream of the HT radiator 320 in the direction of airflow for the outside air entering the heat exchanger 300. Specifically, outside air flows into the vehicle through the grille 1b located at the front end of the electric vehicle 1a. Therefore, the LT radiator 310 and the subcooled condenser 330 are positioned in front of the HT radiator 320 in the longitudinal direction of the electric vehicle 1a. Also, when viewed from the front of the electric vehicle 1a, the LT radiator 310 and the subcooled condenser 330 may be positioned so that at least a portion of them does not overlap with the HT radiator 320. This makes it possible to suppress outside air that has been warmed by passing through the LT radiator 310 and the subcooled condenser 330 from passing through the HT radiator 320.
[0032] Figure 3 shows circuit pattern 1B of the thermal management circuit 10. In the example shown in Figure 3, the eAxle 210 and the condenser 441 are connected to the LT radiator 310 and the HT radiator 320, respectively, via the switching device 500. The chiller 410 and the heater core 600 are the same as in Figure 2. The three-way valves 470 and 480 are controlled so that the refrigerant of the refrigeration cycle 400 flows through the subcooling condenser 330. Note that in circuit pattern 1B, the HT radiator 320 and the LT radiator 310 are integrated.
[0033] Figure 4 shows circuit pattern 1C of the thermal management circuit 10. In the example shown in Figure 4, the eAxle 210 and chiller 410 are connected to the LT radiator 310 and HT radiator 320, respectively, via the switching device 500. The condenser 441 is connected to the heater core 600 via the switching device 500. The three-way valves 470 and 480 are controlled so that the refrigerant of the refrigeration cycle 400 flows through the flow path 475 without flowing through the subcooling condenser 330. Note that in circuit pattern 1C, the HT radiator 320 and LT radiator 310 are integrated.
[0034] Figure 5 shows the circuit pattern 1D of the thermal management circuit 10. In the example shown in Figure 5, the chiller 410 is connected to the LT radiator 310 and the HT radiator 320 via a switching device 500. The condenser 441 is also connected to the heater core 600 via the switching device 500. The switching device 500 is controlled so that the eAxle 210 (low temperature circuit 200) is isolated from the other circuits. The three-way valves 470 and 480 are controlled so that the refrigerant of the refrigeration cycle 400 flows through the flow path 475 without flowing through the subcooling condenser 330. Note that in circuit pattern 1D, the HT radiator 320 and the LT radiator 310 are integrated.
[0035] Figure 6 shows the circuit pattern 1E of the thermal management circuit 10. In the example shown in Figure 6, the chiller 410 is connected to the HT radiator 320 via the switching device 500. The eAxle 210 is connected to the LT radiator 310 via the switching device 500. The condenser 441 is connected to the heater core 600 via the switching device 500. The three-way valves 470 and 480 are controlled so that the refrigerant of the refrigeration cycle 400 flows through the flow path 475 without flowing through the subcooling condenser 330. Note that in circuit pattern 1E, the HT radiator 320 and the LT radiator 310 are separated.
[0036] Figure 7 shows the circuit patterns of the thermal management circuit 10 corresponding to each of several temperature conditions. For example, in summer, the circuit pattern is switched based on the cooling requirement of the eAxle 210 and the heat dissipation requirement of the refrigerant (cooling requirement of the battery 110). If the cooling requirement of the eAxle 210 is high and the heat dissipation requirement of the refrigerant is high, the thermal management circuit 10 is switched to circuit pattern 1A (see Figure 2). If the cooling requirement of the eAxle 210 is low and the heat dissipation requirement of the refrigerant is high, the thermal management circuit 10 is switched to circuit pattern 1B (see Figure 3). If the cooling requirement of the eAxle 210 is high and the heat dissipation requirement of the refrigerant is low, the thermal management circuit 10 is switched to circuit pattern 1A. If the cooling requirement of the eAxle 210 is low and the heat dissipation requirement of the refrigerant is low, the thermal management circuit 10 is switched to circuit pattern 1A. High cooling requirements for eAxle210 may include, for example, cases where the temperature of the coolant flowing through the low-temperature circuit 200 is above a predetermined value, or cases where the temperature of eAxle210 is above a predetermined value. High heat dissipation requirements for the refrigerant may include, for example, cases where the temperature of the coolant flowing through the battery circuit 100 is above a predetermined value, or cases where the temperature of the battery 110 is above a predetermined value.
[0037] Furthermore, in winter, the circuit pattern is switched based on the cooling requirement of eAxle210 and the heat absorption requirement of the refrigerant. For example, if cooling of eAxle210 is required (e.g., eAxle210 has finished warming up) and the heat absorption requirement of the refrigerant is high, the thermal management circuit 10 is switched to circuit pattern 1C (see Figure 4). When eAxle210 is cold (i.e., there is no cooling requirement) and the heat absorption requirement of the refrigerant is high, the thermal management circuit 10 is switched to circuit pattern 1D (see Figure 5). When cooling of eAxle210 is required and the heat absorption requirement of the refrigerant is low, the thermal management circuit 10 is switched to circuit pattern 1E (see Figure 6). When eAxle210 is cold and the heat absorption requirement of the refrigerant is low, the thermal management circuit 10 is switched to circuit pattern 1D. Furthermore, a cooling request for eAxle210 may occur, for example, when the eAxle210 has finished warming up as described above, or when the temperature of eAxle210 (the coolant in the low-temperature circuit 200) is above a predetermined value. Also, a high heat absorption requirement for the refrigerant may occur when a heat pump heating output above a predetermined value is required.
[0038] As described above, in the first embodiment, the connection state between each of the LT radiator 310, HT radiator 320, and subcooled condenser 330 and each of the battery circuit 100, low-temperature circuit 200, and refrigeration cycle 400 is switched by the switching device 500. This allows heat exchange of the heat transfer medium (cooling water, refrigerant) using the LT radiator 310, HT radiator 320, and subcooled condenser 330 to be performed according to the temperature conditions required by each of the battery circuit 100, low-temperature circuit 200, and refrigeration cycle 400. As a result, the amount of heat exchange (efficiency) of the heat transfer medium can be easily adjusted. Consequently, the cooling performance of the battery 110 and eAxel 210 can be improved, as can the driving performance of the electric vehicle 1a and the charging performance of the battery 110. In addition, the heat absorption performance (heat pump heating performance) can be improved, and the driving range of the electric vehicle 1a can be increased.
[0039] Furthermore, the LT radiator 310 and the subcooled condenser 330 are positioned upstream of the HT radiator 320 in the direction of outside air flow into the heat exchanger 300. Here, the cooling water of the low-temperature circuit 200, which exchanges heat with the eAxle 210, has a relatively low upper temperature limit (for example, 65°C). Therefore, by positioning the LT radiator 310, which mainly cools the eAxle 210, upstream in the direction of outside air flow, it is possible to suppress the flow of outside air with a temperature above the lower temperature limit to the LT radiator 310. As a result, the temperature of the outside air flowing through the LT radiator 310 becomes relatively low, which allows for a larger air-water temperature difference in the LT radiator 310, enabling the same cooling performance with a smaller heat exchange area, thus allowing the LT radiator 310 to be miniaturized. Consequently, the space created by miniaturizing the LT radiator 310 can be used to position the subcooled condenser 330.
[0040] [Second Embodiment] Next, a second embodiment of the present disclosure will be described with reference to Figures 8 to 14. In the second embodiment, a supercooling section 443 is provided in the water-cooled condenser 440A. Components identical to those in the first embodiment will be denoted by the same reference numerals as in the first embodiment, and will not be described repeatedly.
[0041] Figure 8 shows the overall configuration of the thermal management system 2 equipped with the thermal management circuit 20 according to the second embodiment. The thermal management circuit 20 differs from the thermal management circuit 10 of the first embodiment in that it is equipped with a refrigeration cycle 400A instead of the refrigeration cycle 400, and with a heat exchanger 300A instead of the heat exchanger 300.
[0042] Refrigeration cycle 400A differs from refrigeration cycle 400 of the first embodiment in that it includes a water-cooled condenser 440A instead of the water-cooled condenser 440. The water-cooled condenser 440A includes a condensing section 441, a liquid storage section 442, and a subcooling section 443. The condensing section 441, the liquid storage section 442, and the subcooling section 443 are connected in series with each other in refrigeration cycle 400A (in the flow path of the refrigerant flowing through refrigeration cycle 400A). The refrigerant in refrigeration cycle 400A flows in the order of condensing section 441, liquid storage section 442, and subcooling section 443. The subcooling section 443 cools the refrigerant, which has been changed to a liquid phase in the condensing section 441, by heat exchange with the coolant flowing through the subcooling section 443. The refrigerant that has flowed to the subcooling section 443 flows toward the expansion valves 450 and 460.
[0043] The heat exchanger 300A differs from the heat exchanger 300 of the first embodiment in that it includes an HT sub-radiator 340 instead of a subcooled condenser 330. The position of the HT sub-radiator 340 is the same as the position of the subcooled condenser 330. The heat management circuit 30 has excellent heat absorption performance due to the provision of three radiators. The HT sub-radiator 340 is an example of the "third heat exchanger" of this disclosure.
[0044] Port P15 of the switching device 500 is an inlet port into which coolant flows from the supercooling section 443. Port P15 and the supercooling section 443 are connected by a flow path 730. Port P16 of the switching device 500 is an outlet port into which coolant flows out toward the supercooling section 443. Port P16 and the supercooling section 443 are connected by a flow path 740. Each of the flow paths 730 and 740 is an example of the "second flow path" of this disclosure. Each of the flow paths 730 and 740 is an example of the "first directional flow path" and "second directional flow path" of this disclosure, respectively.
[0045] Port P3 of the switching device 500 is an outlet port for coolant to flow out toward the HT sub-radiator 340. Port P4 of the switching device 500 is an inlet port for coolant to flow in from the HT sub-radiator 340.
[0046] Figure 9 shows circuit pattern 2A of the thermal management circuit 20. In the example shown in Figure 9, eAxle 210 is connected to LT radiator 310 via switching device 500. Condensing section 441 is connected to HT radiator 320 via switching device 500. Supercooling section 443 is connected to HT sub-radiator 340 via switching device 500. With ports P11 and P12 of switching device 500 (see Figure 8) closed, the coolant does not flow through chiller 410. With ports P7 and P8 of switching device 500 (see Figure 8) closed, the coolant does not flow through heater core 600. Note that in circuit pattern 2A, the HT radiator 320, LT radiator 310, and HT sub-radiator 340 are separated.
[0047] Figure 10 shows circuit pattern 2B of the thermal management circuit 20. In the example shown in Figure 10, the eAxle 210 and the condensing section 441 are connected to the LT radiator 310 and the HT radiator 320, respectively, via the switching device 500. The subcooling section 443 is connected to the HT sub-radiator 340 via the switching device 500. The chiller 410 and heater core 600 are the same as in Figure 9. Note that in circuit pattern 2B, the HT radiator 320 and the LT radiator 310 are integrated.
[0048] Figure 11 shows the circuit pattern 2C of the thermal management circuit 20. In the example shown in Figure 11, the eAxle 210 and chiller 410 are each connected to the LT radiator 310, HT radiator 320, and HT sub-radiator 340 via the switching device 500. The condensing section 441 and subcooling section 443 are each connected to the heater core 600 via the switching device 500. Note that in circuit pattern 2C, the HT radiator 320, LT radiator 310, and HT sub-radiator 340 are integrated.
[0049] Figure 12 shows the circuit pattern 2D of the thermal management circuit 20. In the example shown in Figure 12, the chiller 410 is connected to the LT radiator 310, the HT radiator 320, and the HT sub-radiator 340 via a switching device 500. The condensing section 441 and the subcooling section 443 are each connected to the heater core 600 via the switching device 500. The switching device 500 is controlled so that the eAxle 210 (low-temperature circuit 200) is isolated from the other circuits. Note that in circuit pattern 2D, the HT radiator 320, the LT radiator 310, and the HT sub-radiator 340 are integrated.
[0050] Figure 13 shows the circuit pattern 2E of the thermal management circuit 20. In the example shown in Figure 13, the chiller 410 is connected to the HT radiator 320 and the HT sub-radiator 340 via the switching device 500. The eAxle 210 is connected to the LT radiator 310 via the switching device 500. The condensing section 441 and the subcooling section 443 are each connected to the heater core 600 via the switching device 500. Note that in circuit pattern 2E, the HT radiator 320 and the HT sub-radiator 340 are integrated.
[0051] Figure 14 shows the circuit patterns of the thermal management circuit 20 corresponding to each of several temperature conditions. For example, in summer, if the cooling requirement of eAxle 210 is high and the heat dissipation requirement of the refrigerant is high, the thermal management circuit 20 is switched to circuit pattern 2A (see Figure 9). If the cooling requirement of eAxle 210 is low and the heat dissipation requirement of the refrigerant is high, the thermal management circuit 20 is switched to circuit pattern 2B (see Figure 10). If the cooling requirement of eAxle 210 is high and the heat dissipation requirement of the refrigerant is low, the thermal management circuit 20 is switched to circuit pattern 2A. If the cooling requirement of eAxle 210 is low and the heat dissipation requirement of the refrigerant is low, the thermal management circuit 20 is switched to circuit pattern 2A.
[0052] Furthermore, in winter, if cooling of the eAxle210 is required and the refrigerant's heat absorption requirement is high, the thermal management circuit 20 is switched to circuit pattern 2C (see Figure 11). When the eAxle210 is cold and the refrigerant's heat absorption requirement is high, the thermal management circuit 20 is switched to circuit pattern 2D (see Figure 12). When cooling of the eAxle210 is required and the refrigerant's heat absorption requirement is low, the thermal management circuit 20 is switched to circuit pattern 2E (see Figure 13). When the eAxle210 is cold and the refrigerant's heat absorption requirement is low, the thermal management circuit 20 is switched to circuit pattern 2D.
[0053] Furthermore, the other configurations and effects are the same as those of the first embodiment described above, so no further explanation will be given.
[0054] [Third Embodiment] Next, a third embodiment of the present disclosure will be described with reference to Figures 15 to 21. In the third embodiment, the configuration of the flow path between the water-cooled condenser 440A and the switching device 500 differs from that of the second embodiment. Components that are the same as those in the second embodiment will be denoted by the same reference numerals as in the second embodiment, and will not be described repeatedly.
[0055] Figure 15 shows the overall configuration of a thermal management system 3 equipped with a thermal management circuit 30 according to the third embodiment. The thermal management circuit 30 differs from the thermal management circuit 20 of the second embodiment in that it does not have flow paths 720 and 730 (both seen in Figure 8). That is, in the third embodiment, the condensing section 441 and the switching device 500 are connected only by flow path 710. In other words, the flow path connecting the condensing section 441 and the switching device 500 consists only of flow path 710. The supercooling section 443 and the switching device 500 are connected only by flow path 740. In other words, the flow path connecting the supercooling section 443 and the switching device 500 consists only of flow path 740. In this case, flow path 710 is an example of the "third flow path" and "third directional flow path" of this disclosure. Also, flow path 740 is an example of the "fourth flow path" and "fourth directional flow path" of this disclosure.
[0056] Figure 16 shows circuit pattern 3A of the thermal management circuit 30. In the example shown in Figure 16, the eAxle 210 is connected to the LT radiator 310 via the switching device 500. The water-cooled condenser 440A is connected to the HT radiator 320 and the HT sub-radiator 340 via the switching device 500. Also, when ports P11 and P12 of the switching device 500 (see Figure 15) are closed, the coolant does not flow through the chiller 410. Also, when ports P7 and P8 of the switching device 500 (see Figure 15) are closed, the coolant does not flow through the heater core 600. Note that in circuit pattern 3A, the HT radiator 320 and the HT sub-radiator 340 are integrated.
[0057] Figure 17 shows circuit pattern 3B of the thermal management circuit 30. In the example shown in Figure 17, the eAxle 210 and the water-cooled condenser 440A are connected to the LT radiator 310, HT radiator 320, and HT sub-radiator 340 via the switching device 500. The chiller 410 and heater core 600 are the same as in Figure 16. Note that in circuit pattern 3B, the HT radiator 320, LT radiator 310, and HT sub-radiator 340 are integrated.
[0058] Figure 18 shows the circuit pattern 3C of the thermal management circuit 30. In the example shown in Figure 18, the eAxle 210 and chiller 410 are connected to the LT radiator 310, HT radiator 320, and HT sub-radiator 340 via the switching device 500. The water-cooled condenser 440A is connected to the heater core 600 via the switching device 500. Note that in circuit pattern 3C, the HT radiator 320, LT radiator 310, and HT sub-radiator 340 are integrated.
[0059] Figure 19 shows the circuit pattern 3D of the thermal management circuit 30. In the example shown in Figure 19, the chiller 410 is connected to the LT radiator 310, HT radiator 320, and HT sub-radiator 340 via a switching device 500. The water-cooled condenser 440A is connected to the heater core 600 via the switching device 500. The switching device 500 is controlled so that the eAxle 210 (low-temperature circuit 200) is isolated from the other circuits. Note that in the circuit pattern 3D, the HT radiator 320, LT radiator 310, and HT sub-radiator 340 are integrated.
[0060] Figure 20 shows the circuit pattern 3E of the thermal management circuit 30. In the example shown in Figure 20, the chiller 410 is connected to the HT radiator 320 and the HT sub-radiator 340 via the switching device 500. The eAxle 210 is connected to the LT radiator 310 via the switching device 500. The water-cooled condenser 440A is connected to the heater core 600 via the switching device 500. Note that in circuit pattern 2E, the HT radiator 320 and the HT sub-radiator 340 are integrated.
[0061] Figure 21 shows the circuit patterns of the thermal management circuit 30 corresponding to each of several temperature conditions. For example, in summer, if the cooling requirement of eAxle 210 is high and the heat dissipation requirement of the refrigerant is high, the thermal management circuit 30 is switched to circuit pattern 3A (see Figure 16). If the cooling requirement of eAxle 210 is low and the heat dissipation requirement of the refrigerant is high, the thermal management circuit 30 is switched to circuit pattern 3B (see Figure 17). If the cooling requirement of eAxle 210 is high and the heat dissipation requirement of the refrigerant is low, the thermal management circuit 30 is switched to circuit pattern 3A. If the cooling requirement of eAxle 210 is low and the heat dissipation requirement of the refrigerant is low, the thermal management circuit 30 is switched to circuit pattern 3A.
[0062] Furthermore, in winter, if cooling of the eAxle210 is required and the refrigerant's heat absorption requirement is high, the thermal management circuit 30 is switched to circuit pattern 3C (see Figure 18). When the eAxle210 is cold and the refrigerant's heat absorption requirement is high, the thermal management circuit 30 is switched to circuit pattern 3D (see Figure 19). When cooling of the eAxle210 is required and the refrigerant's heat absorption requirement is low, the thermal management circuit 30 is switched to circuit pattern 3E (see Figure 20). When the eAxle210 is cold and the refrigerant's heat absorption requirement is low, the thermal management circuit 30 is switched to circuit pattern 3D.
[0063] Furthermore, the other configurations and effects are the same as those of the first and second embodiments described above, so no repeated explanations will be provided.
[0064] The first to third embodiments described above show examples in which the thermal management circuit is mounted on an electric vehicle, but the disclosure is not limited thereto. The thermal management circuit may also be mounted on electrical equipment other than electric vehicles (for example, a stationary energy storage device).
[0065] In the above embodiment, an example was shown in which the HT radiator 320 and the subcooled condenser 330 (HT sub-radiator 340) are located further forward (upstream of the airflow) in the longitudinal direction of the electric vehicle 1a than the LT radiator 310, but the disclosure is not limited to this. The positional relationship between the HT radiator 320 and the subcooled condenser 330 (HT sub-radiator 340) and the LT radiator 310 is not limited to the example in the above embodiment. For example, the HT radiator 320 and the subcooled condenser 330 (HT sub-radiator 340) and the LT radiator 310 may be arranged side by side in the left-right direction (a direction intersecting the airflow direction).
[0066] The embodiments disclosed herein should be considered in all respects to be illustrative and not restrictive. The scope of this disclosure is indicated by the claims rather than by the description of the embodiments above, and all modifications within the meaning and scope equivalent to the claims are intended to be included. [Explanation of symbols]
[0067] 1a Electric vehicle (electrical equipment), 10, 20, 30 Thermal management circuit, 100 Battery circuit (equipment layout circuit), 110 Battery (temperature-controlled equipment), 200 Low-temperature circuit (equipment layout circuit), 210 eAxel (temperature-controlled equipment), 300, 300A Heat exchanger, 310 LT radiator (first heat exchanger), 320 HT radiator (second heat exchanger), 330 Subcooling condenser (third heat exchanger), 340 HT sub-radiator (third heat exchanger), 400, 400A Refrigeration cycle, 410 Chiller, 440, 440A Water-cooled condenser, 441 Condensing section, 443 Subcooling section, 500 Switching device, 710 Flow path (first flow path) (first direction flow path) (third direction flow path), 720 Flow path (first flow path) (second direction flow path), 730 Flow channel (second flow channel) (first direction flow channel), 740 Flow channel (second flow channel) (second direction flow channel) (fourth direction flow channel).
Claims
1. A thermal management circuit installed in electrical equipment, through which a heat transfer medium flows, Of the aforementioned heat transfer fluids, a first heat transfer fluid that exchanges heat with the temperature-controlled equipment, which is the equipment whose temperature is to be adjusted, flows through an equipment layout circuit, A second heat transfer medium, different from the first heat transfer medium, flows through the refrigeration cycle connected to a chiller and a water-cooled condenser. A heat exchange device in which heat exchange takes place between the outside air and the heat transfer medium, A first switching device capable of switching the flow path of the first heat transfer medium, The system comprises a second switching device capable of switching the flow path of the second heat transfer medium, The heat exchange apparatus includes a first heat exchanger, a second heat exchanger, and a third heat exchanger, which are provided separately from each other. The third heat exchanger is connected to the refrigeration cycle, The water-cooled condenser includes a condensation section that changes the second heat transfer medium from a gas phase to a liquid phase, In the third heat exchanger, the second heat transfer medium, which has been converted to a liquid phase in the condensation section, and the outside air exchange heat. A thermal management circuit in which the connection state between each of the first heat exchanger and the second heat exchanger and the equipment layout circuit is switched by the first switching device, and the connection state between the third heat exchanger and the refrigeration cycle is switched by the second switching device.
2. A thermal management circuit mounted on an electrical device and through which a heat transfer medium flows, Of the aforementioned heat transfer fluids, a first heat transfer fluid that exchanges heat with the temperature-controlled equipment, which is the equipment whose temperature is to be adjusted, flows through an equipment layout circuit, A second heat transfer medium, different from the first heat transfer medium, flows through the refrigeration cycle connected to a chiller and a water-cooled condenser. A heat exchange device in which heat exchange takes place between the outside air and the heat transfer medium, The system includes a switching device capable of switching the flow path of the heat transfer medium, The heat exchange apparatus includes a first heat exchanger, a second heat exchanger, and a third heat exchanger, which are provided separately from each other. The water-cooled condenser includes a condensation section that changes the second heat transfer medium from a gas phase to a liquid phase, and a supercooling section that cools the second heat transfer medium that has been changed to a liquid phase in the condensation section. The condensing section and the supercooling section are connected to the switching device by a first flow path and a second flow path, respectively. Each of the first and second flow paths has a first directional flow path through which the first heat transfer medium flows toward the switching device, and a second directional flow path through which the first heat transfer medium flows in the opposite direction to the first directional flow path. A thermal management circuit in which the connection state between each of the first heat exchanger, the second heat exchanger, and the third heat exchanger and the equipment layout circuit is switched by the switching device.
3. A thermal management circuit mounted on an electrical device and through which a heat transfer medium flows, Of the aforementioned heat transfer fluids, a first heat transfer fluid that exchanges heat with the temperature-controlled equipment, which is the equipment whose temperature is to be adjusted, flows through an equipment layout circuit, A second heat transfer medium, different from the first heat transfer medium, flows through the refrigeration cycle connected to a chiller and a water-cooled condenser. A heat exchange device in which heat exchange takes place between the outside air and the heat transfer medium, The system includes a switching device capable of switching the flow path of the heat transfer medium, The heat exchange apparatus includes a first heat exchanger, a second heat exchanger, and a third heat exchanger, which are provided separately from each other. The water-cooled condenser includes a condensation section that changes the second heat transfer medium from a gas phase to a liquid phase, and a supercooling section that cools the second heat transfer medium that has been changed to a liquid phase in the condensation section. The condensing section and the supercooling section are connected to the switching device by a third flow path and a fourth flow path, respectively. The third flow path is configured as a third directional flow path through which the first heat transfer medium flows from the condensing section toward the switching device. The fourth flow path is configured as a fourth directional flow path through which the first heat transfer medium flows from the switching device toward the supercooling section. A thermal management circuit in which the connection state between each of the first heat exchanger, the second heat exchanger, and the third heat exchanger and the equipment layout circuit is switched by the switching device.
4. The thermal management circuit according to any one of claims 1 to 3, wherein each of the first heat exchanger and the third heat exchanger is located upstream of the second heat exchanger in the direction of flow of outside air into the heat exchanger.