Electronic components
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- MURATA MFG CO LTD
- Filing Date
- 2023-06-27
- Publication Date
- 2026-06-23
AI Technical Summary
【0013】 本発明によれば、ヘリカルコイルの磁束の開口方向が基板に平行に配置されたヘリカルコイルを有する電子部品において、他の導電体や電子部品等の要素と共に実装する場合に、ヘリカルコイルを有する電子部品と他の要素とが実装される電子機器の小型化が可能な電子部品が得られ、また、所定のインダクタンスを有するインダクタと共に内部配線を備える小型の電子部品が得られる。
Smart Images

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Abstract
Claims
1. The device comprises a substrate, an insulating layer formed along the surface of the substrate, an inductor formed within the insulating layer, one or more planar conductors formed on the substrate or the insulating layer and extending along the substrate, and one or more planar conductor connecting conductors that conduct to the planar conductors. The inductor includes a plurality of planar conductors extending in a plurality of layers along the surface of the substrate, and a plurality of inductor via conductors connecting the planar conductors extending in different layers among the plurality of layers, and is an inductor made of a helical coil having a winding axis along the surface of the substrate. One of the plurality of inductor via conductors runs adjacent to the planar conductor connecting conductor in a direction parallel to the winding axis, and the direction of the current flowing through the adjacent parallel inductor via conductor and the direction of the current flowing through the planar conductor connecting conductor are opposite to each other. The planar conductor is formed at a position closer to the substrate than the plurality of planar conductors. Electronic components.
2. The planar conductor connecting conductor is composed of three or more parts, one of which is formed in the same layer as the planar conductor, The electronic component according to claim 1.
3. A substrate, an insulating layer formed along the surface of the substrate, an inductor formed in the insulating layer, one or more planar conductors formed on the substrate or the insulating layer and extending along the substrate, and one or more planar conductor connecting conductors that conduct to the planar conductors, The inductor includes a plurality of planar conductors extending in a plurality of layers along the surface of the substrate, and a plurality of inductor via conductors connecting the planar conductors extending in different layers among the plurality of layers, and is an inductor made of a helical coil having a winding axis along the surface of the substrate. One of the plurality of inductor via conductors runs adjacent to the planar conductor connecting conductor in a direction parallel to the winding axis, and the direction of the current flowing through the adjacent parallel inductor via conductor and the direction of the current flowing through the planar conductor connecting conductor are opposite to each other. The substrate is a low-resistance semiconductor substrate, The planar conductor, together with the semiconductor substrate, is a capacitor electrode that constitutes a capacitor. Electronic components.
4. A substrate, an insulating layer formed along the surface of the substrate, an inductor formed in the insulating layer, one or more planar conductors formed on the substrate or the insulating layer and extending along the substrate, and one or more planar conductor connecting conductors that conduct to the planar conductors, The inductor includes a plurality of planar conductors extending in a plurality of layers along the surface of the substrate, and a plurality of inductor via conductors connecting the planar conductors extending in different layers among the plurality of layers, and is an inductor made of a helical coil having a winding axis along the surface of the substrate. One of the plurality of inductor via conductors runs adjacent to the planar conductor connecting conductor in a direction parallel to the winding axis, and the direction of the current flowing through the adjacent parallel inductor via conductor and the direction of the current flowing through the planar conductor connecting conductor are opposite to each other. The planar conductor is a resistive film. Electronic components.
5. A substrate, an insulating layer formed along the surface of the substrate, an inductor formed in the insulating layer, one or more planar conductors formed on the substrate or the insulating layer and extending along the substrate, and one or more planar conductor connecting conductors that conduct to the planar conductors, The inductor includes a plurality of planar conductors extending in a plurality of layers along the surface of the substrate, and a plurality of inductor via conductors connecting the planar conductors extending in different layers among the plurality of layers, and is an inductor made of a helical coil having a winding axis along the surface of the substrate. One of the plurality of inductor via conductors runs adjacent to the planar conductor connecting conductor in a direction parallel to the winding axis, and the direction of the current flowing through the adjacent parallel inductor via conductor and the direction of the current flowing through the planar conductor connecting conductor are opposite to each other. The aforementioned substrate is a semiconductor substrate, The planar conductor, together with the semiconductor substrate, constitutes a semiconductor element. Electronic components.
6. A substrate, an insulating layer formed along the surface of the substrate, an inductor formed in the insulating layer, one or more planar conductors formed on the substrate or the insulating layer and extending along the substrate, and one or more planar conductor connecting conductors that conduct to the planar conductors, The inductor includes a plurality of planar conductors extending in a plurality of layers along the surface of the substrate, and a plurality of inductor via conductors connecting the planar conductors extending in different layers among the plurality of layers, and is an inductor made of a helical coil having a winding axis along the surface of the substrate. One of the plurality of inductor via conductors runs adjacent to the planar conductor connecting conductor in a direction parallel to the winding axis, and the direction of the current flowing through the adjacent parallel inductor via conductor and the direction of the current flowing through the planar conductor connecting conductor are opposite to each other. The inductor via conductors are arranged in two rows, and the planar conductor connecting conductors are positioned alongside the ends of the two rows of inductor via conductors. The end of the via conductor for the inductor and the conductor for connecting the planar conductor are arranged at equal intervals. Electronic components.
7. The planar conductor connecting conductor is located at the end of the helical coil in the direction of the winding axis, The electronic component according to any one of claims 1 to 6.