Composite component, laser processing method, and method for manufacturing a composite component

Abstract

This composite component is provided with a plurality of first fibers extending in a first direction, a plurality of second fibers extending in a second direction different from the first direction, and a matrix material filled between the plurality of first fibers and the plurality of second fibers. A plurality of holes are formed in each of at least one first row along the first direction and at least one second row along the second direction.

Description

Technical Field

[0001] The present disclosure relates to a composite component, a laser processing method, and a method for manufacturing a composite component.

Background Art

[0002] In recent years, in semiconductor exposure apparatuses, with the miniaturization and high integration of semiconductor integrated circuits, an improvement in resolution has been demanded. For this reason, the shortening of the wavelength of light emitted from an exposure light source has been promoted. For example, as a gas laser device for exposure, a KrF excimer laser device that outputs laser light with a wavelength of about 248.0 nm and an ArF excimer laser device that outputs laser light with a wavelength of about 193.4 nm are used.

[0003] The spectral linewidth of the spontaneous emission light of a KrF excimer laser device and an ArF excimer laser device is as wide as 350 pm to 400 pm. Therefore, when a projection lens is configured with a material that transmits ultraviolet light such as KrF and ArF laser light, chromatic aberration may occur. As a result, the resolution may decrease. Therefore, it is necessary to narrow the spectral linewidth of the laser light output from the gas laser device to such an extent that chromatic aberration can be ignored. For this reason, a narrowbanding module (Line Narrowing Module: LNM) including a narrowbanding element (etalon, grating, etc.) may be provided in the laser resonator of the gas laser device in order to narrow the spectral linewidth. Hereinafter, a gas laser device in which the spectral linewidth is narrowed is referred to as a narrowbanded gas laser device.

Prior Art Documents

Patent Documents

[0004] [[ID=2"]]

Patent Document 1

[0005] A composite component according to one aspect of the present disclosure comprises a plurality of first fibers extending in a first direction, a plurality of second fibers extending in a second direction different from the first direction, and a matrix material filling the spaces between the plurality of first fibers and the plurality of second fibers, wherein a plurality of holes may be provided in each of the at least one first row along the first direction and the at least one second row along the second direction.

[0006] A laser processing method according to one aspect of the present disclosure may include an irradiation step in which a laser beam is irradiated onto a workpiece comprising a plurality of first fibers extending in a first direction, a plurality of second fibers extending in a second direction different from the first direction, and a matrix material filling the spaces between the plurality of first fibers and the plurality of second fibers, thereby providing a plurality of holes in each of the at least one first row along the first direction and the at least one second row along the second direction.

[0007] A method for manufacturing a composite component according to one aspect of the present disclosure is a method for manufacturing a composite component by laser processing a workpiece, wherein the workpiece comprises a plurality of first fibers extending in a first direction, a plurality of second fibers extending in a second direction different from the first direction, and a matrix material filling the spaces between the plurality of first fibers and the plurality of second fibers, and the method may include a processing step of laser processing the workpiece to provide a plurality of holes in each of the at least one first row along the first direction and the at least one second row along the second direction. [Brief explanation of the drawing]

[0008] Some embodiments of this disclosure are described below, merely as examples, with reference to the accompanying drawings. [Figure 1] Figure 1 is a front view of a comparative example composite part. [Figure 2] Figure 2 is a schematic diagram showing an example of the overall configuration of a comparative example processing system. [Figure 3] Figure 3 is a flowchart showing an example of a flowchart for the manufacturing method of a composite component in a comparative example. [Figure 4] Figure 4 shows an example of a control flowchart for a comparative example laser processing method. [Figure 5] Figure 5 is a front view of the composite component according to Embodiment 1. [Figure 6] Figure 6 is a perspective view of the composite component of Embodiment 2. [Figure 7] Figure 7 is a side view of the table in Embodiment 2. Embodiment

[0009] 1. Overview 2. Description of the comparative example composite component, laser processing method, and manufacturing method of the composite component 2.1 Configuration of the composite component in the comparative example 2.2 Configuration of the laser processing system for manufacturing the composite component of the comparative example 2.3 Operation 2.4 Challenges 3. Description of the composite component of Embodiment 1, the laser processing method, and the manufacturing method of the composite component. 3.1 Configuration of the composite component of Embodiment 1 3.2 Configuration of the laser processing system for manufacturing the composite component of Embodiment 1 3.3 Operation 3.4 Action and Effects 4. Description of the composite component of Embodiment 2, the laser processing method, and the manufacturing method of the composite component. 4.1 Configuration of the composite component in Embodiment 2 4.2 Configuration of the laser processing system for manufacturing the composite component of Embodiment 2 4.3 Operation 4.4 Action and Effects

[0010] The embodiments of this disclosure will be described in detail below with reference to the drawings. The embodiments described below are examples of the disclosure and are not intended to limit the scope of this disclosure. Not all configurations and operations described in each embodiment are necessarily essential to the configurations and operations of the disclosure. The same reference numerals are used for identical components, and redundant descriptions are omitted.

[0011] 1. Overview Embodiments of the present disclosure relate to a composite component provided with a plurality of holes formed by removing a part of a workpiece by laser processing, a laser processing method, and a method for manufacturing a composite component.

[0012] 2. Description of the composite component, laser processing method, and method for manufacturing a composite component of the comparative example 2.1 Configuration of the composite component of the comparative example The composite component of the comparative example will be described. Note that the comparative example of the present disclosure is a form that the applicant recognizes as being known only to the applicant, and is not a known example recognized by the applicant.

[0013] FIG. 1 is a front view of the composite component of the comparative example. In FIG. 1, a part of the front of the composite component 10 is shown. Also, in FIG. 1, for ease of viewing, reference numerals are attached only to some of the similar components, and some reference numerals are omitted.

[0014] The composite component 10 is, for example, plate-shaped. The composite component 10 includes a plurality of first fibers 21a, a plurality of second fibers 21b, and a matrix material 25. Examples of the composite component 10 include a ceramic-based composite material (CMC: Ceramic Matrix Composites). In this case, each of the first fiber 21a and the second fiber 21b may be, for example, any one of a silicon carbide fiber, a carbon fiber, a silicon nitride fiber, an alumina fiber, and a boron nitride fiber. Note that each of the first fiber 21a and the second fiber 21b may be a fiber made of other appropriate ceramics. Also, examples of the matrix material 25 include silicon carbide.

[0015] The fiber bundles composed of the plurality of first fibers 21a and the plurality of second fibers 21b are arranged in a first direction and a second direction along the main surface of the composite component 10. Specifically, the plurality of first fibers 21a extend in the first direction, and the plurality of second fibers 21b extend in a second direction different from the first direction. The first direction is generally orthogonal to the second direction.

[0016] The plurality of first fibers 21a and the plurality of second fibers 21b are arranged in a square lattice. That is, the adjacent first fibers 21a are arranged in parallel, and the adjacent second fibers 21b are arranged in parallel. In addition, the adjacent first fibers 21a may be generally arranged in parallel. In this case, the adjacent first fibers 21a may be arranged in a range within ±10° of parallel, preferably within ±3° of parallel. Also, the adjacent second fibers 21b may be generally arranged in parallel in the same manner as the first fibers 21a.

[0017] The plurality of first fibers 21a are woven into the plurality of second fibers 21b. Examples of such weaving include plain weave. In plain weave, a fiber bundle composed of the plurality of first fibers 21a and the plurality of second fibers 21b is woven by crossing from two directions, the first direction and the second direction. The fiber bundle is impregnated with a matrix material 25, and the matrix material 25 is filled between the plurality of first fibers 21a and the plurality of second fibers 21b.

[0018] In the composite component 10 in which the first fibers 21a and the second fibers 21b are woven together as described above, a plurality of holes 30 are provided. The holes 30 are provided at the positions where the laser light is irradiated on the workpiece 40. The workpiece 40 is an object to be laser processed by the irradiation of laser light and is a member in which no plurality of holes 30 are provided. In contrast, the composite component 10 is a workpiece 40 provided with a plurality of holes 30. In the composite component 10 of this example, the holes 30 will be described as through holes. In the region of the composite component 10 where the holes 30 are provided, the first fibers 21a and the second fibers 21b are cut and removed, and the matrix material 25 is removed.

[0019] In FIG. 1, the cross-sectional shape of each hole 30 is circular, and an example in which each cross-section has the same diameter is shown. The diameter is larger than each of the thicknesses of the first fibers 21a and the second fibers 21b, the interval between the adjacent first fibers 21a, and the interval between the adjacent second fibers 21b. Note that the cross-sectional shape and diameter of each hole 30 are not particularly limited.

[0020] When the composite component 10 is viewed from the front, the center of each hole 30 is located at the vertices of a square, and therefore, the multiple holes 30 are arranged in a square grid, similar to the multiple first fibers 21a and the multiple second fibers 21b. However, the direction of the arrangement of the holes 30 is not the same as the direction of the arrangement of the multiple first fibers 21a and the multiple second fibers 21b, but is inclined approximately 45° counterclockwise with respect to the direction of the arrangement of the multiple first fibers 21a and the multiple second fibers 21b. Specifically, the arrangement of the holes 30 is described in more detail, with multiple holes 30 provided in each of the multiple first rows along the X direction and in each of the multiple second rows along the Y direction which is perpendicular to the X direction. The X direction is inclined approximately 45° counterclockwise with respect to the first direction, and the Y direction is inclined approximately 45° counterclockwise with respect to the second direction.

[0021] Since the multiple holes 30 are arranged in a square grid as described above, adjacent lines passing through the centers of the holes 30 in each of the first rows are arranged parallel to each other. One of the adjacent lines may be arranged approximately parallel to the other. In this case, the adjacent lines should be arranged within a range of parallel ±10°, preferably parallel ±3°. Similarly, adjacent lines passing through the centers of the holes 30 in each of the second rows are also arranged parallel to each other. One of the adjacent lines may be arranged approximately parallel to the other, similar to the adjacent lines in the first row described above.

[0022] 2.2 Configuration of the laser processing system for manufacturing the composite component of the comparative example Next, we will describe the laser processing system 50 used to manufacture the comparative example composite component 10.

[0023] Figure 2 is a schematic diagram showing an example of the overall configuration of a comparative example laser processing system. The laser processing system 50 mainly includes a gas laser device 100, a laser processing device 300, and an optical path tube 500 that connects the gas laser device 100 to the laser processing device 300.

[0024] The gas laser apparatus 100 is, for example, an ArF excimer laser apparatus that uses a mixed gas containing argon (Ar), fluorine (F2), and neon (Ne). This gas laser apparatus 100 outputs laser light with a central wavelength of approximately 193.4 nm. The gas laser apparatus 100 may be a gas laser apparatus other than an ArF excimer laser apparatus; for example, it may be a KrF excimer laser apparatus that uses a mixed gas containing krypton (Kr), F2, and Ne. In this case, the gas laser apparatus 100 emits laser light with a central wavelength of approximately 248.0 nm. The mixed gas containing Ar, F2, and Ne as the laser medium, or the mixed gas containing Kr, F2, and Ne as the laser medium, is sometimes called a laser gas. In the mixed gas used in the ArF excimer laser apparatus and the KrF excimer laser apparatus, helium (He) may be used instead of Ne.

[0025] The gas laser apparatus 100 mainly comprises a housing 110, a laser oscillator 130, a monitor module 150, a shutter 170, and a laser processor 190, all of which are located in the internal space of the housing 110.

[0026] The laser oscillator 130 includes a laser chamber 131, a charger 141, a pulse power module 143, a rear mirror 145, and an output coupling mirror 147. Figure 2 shows the internal configuration of the laser chamber 131 as viewed from a direction approximately perpendicular to the direction of laser beam propagation.

[0027] The laser chamber 131 includes an internal space where light is generated by the excitation of the laser medium in the laser gas. The laser gas is supplied to the internal space of the laser chamber 131 from a laser gas supply source (not shown) via piping (not shown). The light generated by the excitation of the laser medium travels to windows 139a and 139b, which will be described later.

[0028] Inside the laser chamber 131, a pair of electrodes 133a and 133b are arranged facing each other. The longitudinal direction of electrodes 133a and 133b is aligned with the direction of propagation of light generated by the high voltage applied between electrodes 133a and 133b. Electrodes 133a and 133b are discharge electrodes for exciting the laser medium by glow discharge. In this example, electrode 133a is the cathode and electrode 133b is the anode.

[0029] Electrode 133a is supported by an electrical insulating portion 135. The electrical insulating portion 135 closes an opening formed in the laser chamber 131. A conductive portion is embedded in the electrical insulating portion 135, and the conductive portion applies a high voltage supplied from the pulse power module 143 to electrode 133a. Electrode 133b is supported by a return plate 137. The return plate 137 is connected to the inner surface of the laser chamber 131 by wiring (not shown).

[0030] The charger 141 is a DC power supply that charges a charging capacitor (not shown) in the pulse power module 143 with a predetermined voltage. The pulse power module 143 includes a switch 143a controlled by a laser processor 190. When the switch 143a is turned from OFF to ON, the pulse power module 143 generates a pulsed high voltage from the electrical energy held in the charger 141 and applies this high voltage between electrodes 133a and 133b.

[0031] When a high voltage is applied between electrodes 133a and 133b, a discharge occurs between them. The energy of this discharge excites the laser medium in the laser chamber 131. Light is emitted when the excited laser medium transitions to the ground state.

[0032] The laser chamber 131 is provided with windows 139a and 139b. Window 139a is located at one end of the laser chamber 131 in the direction of laser beam propagation, and window 139b is located at the other end of the laser chamber 131 in the direction of laser beam propagation. Windows 139a and 139b sandwich the space between electrodes 133a and 133b. As described later, the oscillating laser beam is emitted to the outside of the laser chamber 131 through windows 139a and 139b. As described above, a pulsed high voltage is applied between electrodes 133a and 133b by the pulse power module 143, so this laser beam is pulsed laser beam.

[0033] The rear mirror 145 is positioned in the internal space of the housing 145a, which is connected to one end of the laser chamber 131, and reflects the laser light emitted from the window 139a back into the internal space of the laser chamber 131. The output coupling mirror 147 is positioned in the internal space of the optical path tube 147a, which is connected to the other end of the laser chamber 131, and transmits a portion of the laser light emitted from the window 139b, while reflecting the other portion back into the internal space of the laser chamber 131. In this way, the rear mirror 145 and the output coupling mirror 147 constitute a Fabry-Perot type laser resonator, and the laser chamber 131 is positioned on the optical path of the laser resonator.

[0034] The monitor module 150 is positioned on the optical path of the laser beam emitted from the output coupling mirror 147. The monitor module 150 includes a housing 151 and a beam splitter 153 and an optical sensor 155, which are located in the internal space of the housing 151. An opening is formed in the housing 151, and through this opening, the internal space of the housing 151 communicates with the internal space of the optical path tube 147a.

[0035] The beam splitter 153 transmits the laser light emitted from the output coupling mirror 147 towards the shutter 170 with high transmittance, and also reflects a portion of the laser light toward the light-receiving surface of the optical sensor 155. The optical sensor 155 measures the energy E of the laser light incident on the light-receiving surface. The optical sensor 155 is electrically connected to the laser processor 190 and outputs a signal indicating the measured energy E to the laser processor 190.

[0036] The laser processor 190 of this disclosure is a processing unit that includes a storage device 190a in which a control program is stored, and a CPU (Central Processing Unit) 190b that executes the control program. The laser processor 190 is specially configured or programmed to perform various processes included in this disclosure. The laser processor 190 controls the entire gas laser apparatus 100. The laser processor 190 also sends and receives various signals to and from the laser processing processor 310 of the laser processing apparatus 300.

[0037] The shutter 170 is positioned in the optical path of the laser light that has passed through the beam splitter 153, within the internal space of the optical path tube 171 connected to the housing 151 of the monitor module 150. The optical path tube 171 is connected to the side of the housing 151 opposite to the side to which the optical path tube 147a is connected, and the internal space of the optical path tube 171 communicates with the internal space of the housing 151 through an opening formed in the housing 151. The optical path tube 171 also communicates with the optical path tube 500 through an opening formed in the housing 110.

[0038] The shutter 170 is electrically connected to the laser processor 190. The laser processor 190 closes the shutter 170 until the difference ΔE between the energy E received from the monitor module 150 and the target energy Et received from the laser processing processor 310 falls within an acceptable range. The laser processor 190 also opens the shutter 170 when it receives a signal indicating an emission trigger Tr from the laser processing processor 310. When the shutter 170 is open, the laser light from the beam splitter 153 passes through the shutter 170 and the optical path tube 500 to reach the laser processing apparatus 300. The emission trigger Tr is defined by a predetermined repetition frequency f and a predetermined number of pulses P of the laser light, and is an external trigger that causes the laser processing processor 310 to cause the laser oscillator 130 to oscillate. The repetition frequency f of the laser light is, for example, between 1 kHz and 10 kHz.

[0039] The internal spaces of optical path tubes 171 and 147a, and the internal spaces of housings 151 and 145a, are filled with purge gas. The purge gas contains an inert gas such as high-purity nitrogen. The purge gas is supplied to the internal spaces from a purge gas supply source (not shown) through piping (not shown).

[0040] The laser processing apparatus 300 mainly comprises a laser processing processor 310, an optical system 330, a stage 351, a housing 355, and a frame 357. The optical system 330 and the stage 351 are arranged in the internal space of the housing 355. The housing 355 is fixed to the frame 357. An optical path tube 500 is connected to the housing 355, and the internal space of the housing 355 communicates with the internal space of the optical path tube 500 through an opening formed in the housing 355.

[0041] The laser processing processor 310 is a processing unit that includes a storage device 310a in which a control program is stored and a CPU 310b that executes the control program. The laser processing processor 310 is specially configured or programmed to perform various processes included in this disclosure. The laser processing processor 310 controls the entire laser processing apparatus 300. The storage device 310a stores parameters including the number of laser pulses required to create one hole 30, the processing order of each hole 30 to be made in the workpiece 40, and position data for each hole 30. The number of pulses is preset based on the material of the workpiece 40, the shape of the hole 30, the depth of the hole 30, and the intensity of the laser beam.

[0042] The optical system 330 includes high-reflection mirrors 331a, 331b, and 331c, an attenuator 333, a mask 335, and a transfer optical system 337. Each component of the optical system 330 is fixed to a holder (not shown) and positioned in a predetermined location within the housing 355.

[0043] The high-reflection mirrors 331a, 331b, and 331c reflect laser light with high reflectivity. High-reflection mirror 331a reflects the laser light incident from the gas laser device 100 toward the attenuator 333. High-reflection mirror 331b reflects the laser light from the attenuator 333 toward the high-reflection mirror 331c. High-reflection mirror 331c reflects the laser light toward the transfer optical system 337.

[0044] The attenuator 333 is positioned in the optical path between the high-reflection mirror 331a and the high-reflection mirror 331b. The attenuator 333 includes partial reflection mirrors 333c and 333d. The partial reflection mirrors 333c and 333d are individually fixed to rotating stages (not shown). Each rotating stage is electrically connected to a laser processing processor 310 and rotates around an axis according to a control signal from the laser processing processor 310. Each axis of the rotating stage is perpendicular to the fixed surface to which the partial reflection mirrors 333c and 333d of the rotating stage are fixed. The rotation of each rotating stage also rotates the partial reflection mirrors 333c and 333d. The partial reflection mirrors 333c and 333d are optical elements whose transmittance changes depending on the angle of incidence of the laser light onto the partial reflection mirrors 333c and 333d. The rotation angles of the partial reflection mirrors 333c and 333d are adjusted by the rotation of their respective rotation stages so that the incident angles of the laser beam coincide and the transmittance of the partial reflection mirrors 333c and 333d becomes the desired transmittance. As a result, the laser beam from the high reflection mirror 331a is attenuated to the desired energy before passing through the attenuator 333.

[0045] The mask 335 is positioned between the high-reflection mirror 331b and the high-reflection mirror 331c. The mask 335 is a plate-shaped member that, for example, forms a circular through-hole through which a portion of the laser light passes, while blocking the other portion of the laser light. The shape of the through-hole is not limited. The mask 335 is equipped with a variable mechanism (not shown) that can change the size of the through-hole, and the size of the through-hole can be adjusted according to the size of the hole 30 formed in the workpiece 40. As the laser light passes through the through-hole, a transfer pattern corresponding to the hole 30 is formed. As the transfer pattern is transferred to the workpiece 40, a hole 30 corresponding to the shape of the through-hole is formed in the workpiece 40.

[0046] The transfer optical system 337 focuses laser light onto the workpiece 40 so that the transfer pattern is imaged at an imaging position located at a predetermined depth from the surface of the workpiece 40. The transfer optical system 337 is composed of a combination of multiple lenses. The transfer optical system 337 is a reduction optical system that images a circular transfer pattern smaller in size than the dimensions of the transmission holes of the mask 335 at the imaging position. The magnification of the transfer optical system 337 is, for example, 1 / 10 to 1 / 5. Although the transfer optical system 337 is shown as an example of a combination of lenses, if a single small circular transfer pattern is to be imaged near the optical axis of the transfer optical system 337, the transfer optical system 337 may be composed of a single lens.

[0047] The stage 351 includes a table 353, which supports the workpiece 40. The main surface of the table 353 is approximately perpendicular to the optical axis of the laser beam that irradiates the workpiece 40. The stage 351 is located at the bottom of the housing 355 and, by control signals from the laser processing processor 310, the table 353 can be moved in the width, length, and thickness directions, thereby adjusting the position of the table 353. Thus, the stage 351 adjusts the position of the workpiece 40 by moving the workpiece 40 via the table 353 so that the laser beam emitted from the optical system 330 irradiates the workpiece 40.

[0048] An inert gas flows continuously through the internal space of the housing 355 while the laser processing system 50 is in operation. This inert gas is, for example, nitrogen (N2). The housing 355 is provided with an intake port (not shown) for drawing in the inert gas into the housing 355, and an exhaust port (not shown) for discharging the inert gas from the housing 355 to the outside. Intake pipes and exhaust pipes (not shown) are connected to the intake port and the exhaust port. An inert gas supply source (not shown) is connected to the intake port to supply the inert gas. The inert gas supplied from the intake port also flows through the optical path tube 500 which communicates with the housing 355. The housing 355 prevents impurities from entering the internal space of the housing 355 where the workpiece 40 is placed.

[0049] 2.3 Operation Figure 3 shows an example flowchart of the manufacturing method of the composite part 10 in a comparative example. The manufacturing method of the composite part 10 mainly consists of a preparation step SP1 and a processing step SP2. In the preparation step SP1, the workpiece 40 is supported on the table 353 of the stage 351. In the processing step SP2, the workpiece 40 is laser processed to manufacture the composite part 10 by laser processing.

[0050] Next, the operation of the laser processing system 50 in the processing step SP2 of the comparative example will be described. Figure 4 is a diagram showing an example of a control flowchart of the laser processing method in the processing step SP2 of the comparative example. The laser processing method includes steps SP11, SP12, and SP13.

[0051] First, let's explain the initial state shown in Figure 4. The initial state is the state before the gas laser device 100 emits laser light. In this state, the internal spaces of the optical path tubes 147a, 171, and 500, and the internal spaces of the housings 145a and 151 are filled with purge gas from a purge gas supply source (not shown). In addition, laser gas is supplied to the internal space of the laser chamber 131 from a laser gas supply source (not shown). Furthermore, in the laser processing device 300, an inert gas flows through the internal space of the housing 355.

[0052] Furthermore, in the initial state, the laser processing processor 310 in the laser processing apparatus 300 reads the parameters stored in the storage device 310a. After reading the parameters, the laser processing processor 310 moves the table 353 via the stage 351 so that laser light is irradiated to the position where the hole 30 will be made, based on the position data of the hole 30 to be processed first. The irradiation position is the imaging position where the above-described transfer pattern is imaged. As a result, the table 353 moves to the set initial irradiation position. Once the table 353 has moved, the control flow proceeds to step SP11. Note that the above operation in the initial state may also be performed in the preparation step SP1.

[0053] (Step SP11) In this step, first, the laser processing processor 310 controls the gas laser device 100 so that the laser light irradiated onto the workpiece 40 has the desired fluence Fm required for laser processing. In controlling the gas laser device 100, the laser processing processor 310 reads out the target energy Et stored in the laser processing processor 310. The target energy Et is the target value of energy required during laser processing. Next, the laser processing processor 310 transmits a signal indicating the read-out target energy Et to the laser processor 190 of the gas laser device 100. When the laser processor 190 receives the signal indicating the target energy Et, it sets the target energy Et as the energy Em required during laser processing. The target energy Et may be stored in the memory device 190a of the laser processor 190.

[0054] Incidentally, fluence Fm is the energy density of the laser light at the surface of the workpiece 40 that is irradiated with the laser light. In the optical system 330, there is a large loss of laser light that is shielded by the mask 335, and in order to obtain the desired fluence Fm, the energy Em is determined based on this optical loss.

[0055] The laser processor 190 closes the shutter 170 and operates the charger 141 so that the energy of the laser light becomes energy Em. The laser processor 190 also turns on the switch 143a of the pulse power module 143 by an internal trigger (not shown). As a result, the pulse power module 143 applies a pulsed high voltage between electrodes 133a and 133b using the electrical energy held in the charger 141. This high voltage causes a discharge between electrodes 133a and 133b, exciting the laser medium contained in the laser gas between electrodes 133a and 133b, and emitting light when the laser medium returns to its ground state. The emitted light resonates between the rear mirror 145 and the output coupling mirror 147, and is amplified each time it passes through the discharge space in the internal space of the laser chamber 131, causing laser oscillation. A portion of the laser light then passes through the output coupling mirror 147 and proceeds to the beam splitter 153.

[0056] A portion of the laser light that travels to the beam splitter 153 is reflected by the beam splitter 153 and received by the light sensor 155. The light sensor 155 measures the energy E of the received laser light. The light sensor 155 outputs a signal indicating the measured energy E to the laser processor 190. The laser processor 190 feedback-controls the charging voltage of the charger 141 so that the difference ΔE between the energy E and the target energy Et is within an acceptable range. After the difference ΔE is within an acceptable range, the laser processor 190 sends a ready-to-receive signal to the laser processing processor 310 to indicate that it is ready to receive the laser light emission trigger Tr.

[0057] When the laser processing processor 310 receives a signal indicating it is ready to receive, it controls the transmittance Tm of the attenuator 333 so that the laser light irradiated onto the workpiece 40 has the fluence Fm required for laser processing.

[0058] As described above, once the energy E and transmittance Tm are controlled, the laser processing processor 310 transmits an emission trigger Tr to the laser processor 190. As a result, in synchronization with the reception of the emission trigger Tr, the laser processor 190 opens the shutter 170, and the laser light that passes through the shutter 170 is incident on the laser processing apparatus 300. This laser light is, for example, pulsed laser light with a central wavelength of 193.4 nm.

[0059] The laser light incident on the laser processing apparatus 300 travels through the high-reflection mirror 331a, attenuator 333, high-reflection mirror 331b, mask 335, and high-reflection mirror 331c to the transfer optical system 337. The transfer pattern is imaged at the above-described imaging position by the laser light that has passed through the transfer optical system 337.

[0060] The laser beam irradiates the workpiece 40 according to the emission trigger Tr, which is defined by the repetition frequency f and pulse number P required for laser processing. As the laser beam irradiation continues, ablation occurs near the surface of the workpiece 40, resulting in defects. This creates holes 30 in the workpiece 40. Thus, this step is an irradiation step in which holes 30 are created in the workpiece 40 by irradiating it with laser beam.

[0061] In this step, the laser processing processor 310 drives the gas laser device 100 to irradiate the workpiece 40 supported by the table 353 with a number of pulses read from the parameters. This irradiation creates a hole 30 at the irradiation location in the workpiece 40. Once a hole 30 is created, the laser processing processor 310 closes the shutter 170 via the laser processor 190, stopping the progress of the laser beam to the laser processing device 300. Once the progress of the laser beam has stopped, the laser processing processor 310 proceeds to step SP12 of the control flow.

[0062] (Step SP12) In this step, the laser processing processor 310 reads the position data of the next hole 30 in the processing order after the hole 30 provided in step SP11 from the parameters stored in the memory device 310a. If the last hole 30 in the processing order has already been provided, there is no position data to read, and it is assumed that all holes 30 have been provided. In this case, the laser processing processor 310 terminates the control flow. If there is position data to read, it means that not all holes 30 have been provided and there are still holes 30 that have not yet been provided. In this case, the laser processing processor 310 proceeds to step SP13 of the control flow.

[0063] (Step SP13) This step is a movement step in which the table 353 is moved via the stage 351. In this step, the laser processing processor 310 moves the table 353 in the in-plane direction of the main surface via the stage 351 so that laser light is irradiated onto the position where the hole 30, whose position data was read in step SP12, will be made. In other words, the laser processing processor 310 moves the table 353 as described above to the position where the next hole 30 in the processing order after the hole 30 made in step SP11 will be made. Once the table 353 has moved, the laser processing processor 310 returns the control flow to step SP11.

[0064] In this example, as described above, once one hole 30 is made, the irradiation of the workpiece 40 with laser light stops. Next, the movement of the table 353 in the in-plane direction shifts the irradiation position of the laser light on the workpiece 40. When the laser light irradiates the workpiece 40 again after the table 353 has moved, a hole 30 is made at the shifted irradiation position. Once all the holes 30 are made in the workpiece 40, the composite part 10 is completed.

[0065] The laser processing method is not particularly limited as long as all the holes 30 are made in the workpiece 40. For example, all the holes 30 may be made almost simultaneously with a single irradiation of laser light. Alternatively, a portion of the irradiation in step SP11 for some of the holes 30 and a portion of the irradiation in step SP11 for other portions of the holes 30 may be performed alternately until each hole 30 is made.

[0066] 2.4 Challenges In the comparative example composite part 10, the direction of the arrangement of the holes 30 is not the same as the direction of the arrangement of the multiple first fibers 21a and multiple second fibers 21b. In this case, a large portion of the first fibers 21a and second fibers 21b may be cut by the holes 30, which can reduce the strength of the composite part 10.

[0067] Therefore, the following embodiments illustrate a composite component, a laser processing method, and a method for manufacturing the composite component, all of which can suppress a decrease in strength.

[0068] 3. Description of the composite component of Embodiment 1, the laser processing method, and the manufacturing method of the composite component. 3.1 Configuration of the composite component of Embodiment 1 The composite component of Embodiment 1 will now be described. Components similar to those described above will be denoted by the same reference numerals, and redundant descriptions will be omitted unless specifically stated. In the composite component of this embodiment, the holes will be described as through holes, similar to the comparative example. Furthermore, the depth direction of the through holes will be described as being perpendicular to the main surface of the workpiece, i.e., along the thickness direction of the workpiece.

[0069] Figure 5 is a front view of the composite component of this embodiment. Figure 5 shows a portion of the front view of the composite component 10. Also, in Figure 5, for ease of viewing, reference numerals are assigned to only some of the similar components, and some reference numerals are omitted.

[0070] In the composite component 10 of this embodiment, the direction of the arrangement of the holes 30 relative to the direction of the arrangement of the plurality of first fibers 21a and plurality of second fibers 21b differs from that of the comparative example. Specifically, the direction of the arrangement of the holes 30 in this embodiment is the same as the direction of the arrangement of the plurality of first fibers 21a and plurality of second fibers 21b. That is, the first row of the arrangement of the holes 30 in this embodiment is aligned with the first direction, and the second row of the arrangement is aligned with the second direction.

[0071] Similar to the comparative example, the center positions of each hole 30 in this embodiment are arranged in a square grid pattern, with multiple first rows and multiple second rows provided, and multiple holes 30 provided in each of the first rows and each of the second rows. In addition, each of the holes 30 provided in the first row also serves as a hole 30 provided in the second row.

[0072] The distance between the centers of adjacent holes 30 in the first direction is the same as the distance between the centers of adjacent holes 30 in the second direction. Also, the distance between the centers of adjacent holes 30 in the first direction is smaller than the distance between the centers of adjacent holes 30 in a direction oblique to the first direction. Furthermore, the distance between the centers of adjacent holes 30 in the first direction is the smallest among the distances between the centers of adjacent holes 30 among the multiple holes 30.

[0073] Figure 5 shows an example where the number of holes 30 in each of the first columns is the same, the number of holes 30 in each of the second columns is the same, and the number of holes 30 in the first column is the same as the number of holes 30 in the second column. Note that the number of holes 30 in each of the first columns may be different, the number of holes 30 in each of the second columns may be different, and the number of holes 30 in the first column may be more or less than the number of holes 30 in the second column.

[0074] Each hole 30 is spaced apart from the others, and the region between adjacent holes 30 is the region where the first fiber 21a, the second fiber 21b, and the matrix material 25 are provided. In each of the first rows, the first fiber 21a extending in the first direction between adjacent holes 30 in the first direction is a fiber that has been cut by the adjacent holes 30. Similarly, in each of the second rows, the second fiber 21b extending in the second direction between adjacent holes 30 in the second direction is a fiber that has been cut by the adjacent holes 30. In contrast, the first fiber 21a extending in the first direction between each of the adjacent first rows is a fiber that has not been cut by the holes 30 in the first row. Therefore, the holes 30 located in one of the adjacent first rows are provided on the opposite side from the holes 30 located in the other adjacent first row, with reference to the first fibers 21a that extend in the first direction without being cut by the holes 30. Also, the second fibers 21b that extend in the second direction between each of the adjacent second rows are fibers that are not cut by the holes 30 in the second row. Therefore, the holes 30 located in one of the adjacent second rows are provided on the opposite side from the holes 30 located in the other adjacent second row, with reference to the second fibers 21b that extend in the second direction without being cut by the holes 30.

[0075] The number of first fibers 21a extending in the first direction without being cut by the holes 30 is shown as one example between each adjacent first row, but there may be two or more. The number of first fibers 21a between each adjacent first row is shown as the same example, but there may be different. Similarly, the number of second fibers 21b extending in the second direction without being cut by the holes 30 is shown as one example between each adjacent second row, but there may be two or more. Similarly, the number of second fibers 21b between each adjacent second row is shown as the same example, but there may be different. Furthermore, an example is shown where the number of first fibers 21a between each adjacent first row is the same as the number of second fibers 21b between each adjacent second row. The number of first fibers 21a provided between each of the adjacent first rows may be greater than or less than the number of second fibers 21b provided between each of the adjacent second rows.

[0076] Since the multiple holes 30 are arranged in a square grid pattern, similar to the comparative example, adjacent lines passing through the centers of the holes 30 in each of the first rows along the first direction are arranged parallel to each other. Note that one of the adjacent lines may be arranged approximately parallel to the other, similar to the comparative example. Similarly, adjacent lines passing through the centers of the holes 30 in each of the second rows along the second direction are also arranged parallel to each other. Note that one of the adjacent lines may be arranged approximately parallel to the other, similar to the comparative example.

[0077] The composite component 10 of this embodiment is used as an engine component in fields such as aerospace, automotive, and power generation where lightness, high strength, and heat resistance are required. Specifically, the composite component 10 is used, for example, as at least one part of a shroud, combustion liner, fuel nozzle, swirler, compressor blade, and turbine blade. The through-hole 30 communicates with a pipe (not shown) on the back surface of the composite component 10, and the pipe communicates with a cooling source (not shown). The cooling source sends a cooling fluid to the hole 30 via the pipe. The fluid flows from the hole 30 to the surface of the composite component 10, cooling the surface of the composite component 10.

[0078] 3.2 Configuration of the laser processing system for manufacturing the composite component of Embodiment 1 The configuration of the laser processing system 50 in this embodiment is the same as that of the laser processing system 50 in the comparative example, so a description will be omitted.

[0079] 3.3 Operation The manufacturing method of the composite component 10 in this embodiment is the same as the manufacturing method of the composite component 10 in the comparative example. Furthermore, the laser processing method in this embodiment is the same as the laser processing method in the comparative example, except that the arrangement of the holes 30 in this embodiment is different from the arrangement of the holes 30 in the comparative example. In the laser processing method of this embodiment, the holes 30 are provided sequentially from left to right in the lowest first row of a plurality of first rows when the composite component 10 is viewed from the front, by moving the stage 351. When the rightmost hole 30 in that first row is provided, the holes 30 are provided sequentially from right to left in another first row one row above that first row. The holes 30 are arranged by repeating the above, and the direction of the arrangement of the holes 30 is the same as the direction of the arrangement of the plurality of first fibers 21a and plurality of second fibers 21b.

[0080] 3.4 Action and Effects The composite component 10 of this embodiment comprises a plurality of first fibers 21a extending in a first direction, a plurality of second fibers 21b extending in a second direction, and a matrix material 25 filling the spaces between the plurality of first fibers 21a and the plurality of second fibers 21b. In addition, the composite component 10 is provided with a plurality of holes 30 in each of the plurality of first rows along the first direction and the plurality of second rows along the second direction.

[0081] With the above configuration, the direction of the arrangement of the holes 30 in the first and second directions may be the same as the direction of the arrangement of the multiple first fibers 21a and multiple second fibers 21b. When the directions of arrangement are the same, the number of first fibers 21a and second fibers 21b that extend without being cut by the holes 30 may increase compared to when the directions of arrangement are not the same, and a decrease in the strength of the composite part 10 can be suppressed. In addition, in the above configuration, each of the adjacent first rows is provided with first fibers 21a that extend in the first direction without being cut by the holes 30. In addition, in the above configuration, each of the adjacent second rows is provided with second fibers 21b that extend in the second direction without being cut by the holes 30. Therefore, even if multiple first and second rows are provided, the number of first fibers 21a and second fibers 21b that are not cut by the holes 30 may increase, and a decrease in the strength of the composite part 10 can be suppressed. In this embodiment, the composite component 10 only needs to have multiple holes 30 in each of the at least one first row and at least one second row.

[0082] Furthermore, the laser processing method of this embodiment includes a step SP11 which is an irradiation step in which a laser beam is irradiated onto a workpiece 40, and a plurality of holes 30 are provided in each of at least one first row along a first direction and at least one second row along a second direction. The workpiece 40 comprises a plurality of first fibers 21a extending in the first direction, a plurality of second fibers 21b extending in the second direction, and a matrix material 25 filled between the plurality of first fibers 21a and the plurality of second fibers 21b. Furthermore, the manufacturing method of the composite part 10 of this embodiment includes a processing step SP2 in which the workpiece 40 is laser processed, and a plurality of holes 30 are provided in the workpiece 40 in each of at least one first row along a first direction and at least one second row along a second direction.

[0083] In the laser processing method and the method for manufacturing the composite part 10 of this embodiment, as described above, the direction of the arrangement of the holes 30 can be the same as the direction of the arrangement of the plurality of first fibers 21a and the plurality of second fibers 21b, so that a composite part 10 in which a decrease in strength is suppressed can be formed.

[0084] Furthermore, in the composite component 10 of this embodiment, each of the holes 30 provided in the first row also serves as one of the multiple holes 30 provided in the second row.

[0085] In the above configuration, the number of holes 30 may be reduced compared to the case where the holes 30 in the first row do not also serve as one of the multiple holes 30 in the second row. When the number of holes 30 is reduced, the number of first fibers 21a and second fibers 21b that are cut by the holes 30 may be reduced, and the reduction in the strength of the composite component 10 may be suppressed.

[0086] Furthermore, in the composite component 10 of this embodiment, the number of first fibers 21a provided between each of the adjacent first rows is the same as the number of second fibers 21b provided between each of the adjacent second rows.

[0087] In the above configuration, even if the composite component 10 is deflected by heat or external force, the difference between the amount of deflection of the composite component 10 in the first direction and the amount of deflection of the composite component 10 in the second direction may be smaller compared to the case where the number of first fibers 21a provided between each adjacent first row is not the same as the number of second fibers 21b provided between each adjacent second row.

[0088] 4. Description of the composite component of Embodiment 2, the laser processing method, and the manufacturing method of the composite component. 4.1 Configuration of the composite component in Embodiment 2 Next, the composite component of Embodiment 2 will be described. Components similar to those described above will be denoted by the same reference numerals, and redundant descriptions will be omitted unless otherwise specified.

[0089] Figure 6 is a perspective view of the composite component of this embodiment. In Figure 6, a portion of the side surface of the composite component 10 is shown in cross-section. Also, in Figure 6, for ease of viewing, reference numerals are assigned to only some of the similar components, and some reference numerals are omitted.

[0090] The composite component 10 of this embodiment further comprises a plurality of third fibers 21c extending in a third direction that is different from the first and second directions and is not perpendicular to the main surface of the composite component 10. The third direction is oblique to the main surface of the composite component 10, that is, oblique to the thickness direction of the composite component 10 which is perpendicular to the first and second directions. The third fibers 21c have the same configuration as the first fibers 21a or the second fibers 21b. Adjacent third fibers 21c are arranged in parallel. Adjacent third fibers 21c may be arranged in roughly parallel, similar to the first fibers 21a. The third fibers 21c are woven into the first fibers 21a and the second fibers 21b. A three-dimensional weave is an example of this weaving, in which case the fiber bundle consisting of a plurality of first fibers 21a, a plurality of second fibers 21b, and a plurality of third fibers 21c is woven in by intersecting from three directions: the first direction, the second direction, and the third direction.

[0091] The holes 30 in this embodiment are through holes, similar to the holes 30 in Embodiment 1, but each hole 30 in this embodiment differs from the through holes in Embodiment 1 in that it is provided along a third direction. Therefore, the depth direction of each hole 30 in this embodiment is along the third direction. This depth direction is the direction along which the central axis passing through the centroid of one of the holes 30 aligns, and is the through direction in the composite part 10.

[0092] As described above, since the depth direction of the holes 30 is aligned with the third direction, third fibers 21c extending in the third direction between adjacent holes 30 are fibers that are not cut by the holes 30. The number of third fibers 21c extending in the third direction without being cut by the holes 30 is shown as one between each of the adjacent holes 30, but there may be two or more. The number of third fibers 21c between each of the adjacent holes 30 is shown as the same, but they may be different. Furthermore, an example is shown in which the number of third fibers 21c provided between each of the adjacent holes 30 is the same as the number of first fibers 21a provided between each of the adjacent first rows. Furthermore, an example is shown in which the number of said third fibers 21c is the same as the number of second fibers 21b provided between each of the adjacent second rows. The number of the third fibers 21c may be greater than or less than the number of first fibers 21a provided between each of the adjacent first rows, and the number of second fibers 21b provided between each of the adjacent second rows.

[0093] 4.2 Configuration of the laser processing system for manufacturing the composite component of Embodiment 2 The configuration of the laser processing system 50 in this embodiment is the same as that of the laser processing system 50 in the comparative example, except for the configuration of the table 353. Figure 7 is a side view of the table in this embodiment. As shown in Figure 7, the table 353 is inclined such that the in-plane direction of the table 353 is oblique to the optical axis of the laser beam traveling through the table 353. In this case, the table 353 supports the workpiece 40 such that the thickness direction of the workpiece 40 is oblique to the optical axis of the laser beam incident on the workpiece 40, and the third direction is along the optical axis. When the workpiece 40 is supported on the table 353 as described above and the laser beam is irradiated onto the workpiece 40, a hole 30 extending in the third direction is formed.

[0094] 4.3 Operation The method for manufacturing the composite component 10 in this embodiment is the same as the method for manufacturing the composite component 10 in Embodiment 1, so a description will be omitted. Similarly, the laser processing method in this embodiment is the same as the laser processing method in Embodiment 1, so a description will be omitted. Since the workpiece 40 is supported on the table 353 as described above, in step SP11, which is the irradiation step, the laser beam is irradiated onto the workpiece 40 along the third direction.

[0095] 4.4 Action and Effects In the above configuration, compared to the case where the depth direction of each hole 30 is aligned with the thickness direction of the composite part 10, the number of third fibers 21c cut in the thickness direction of the composite part 10 may be reduced, and the decrease in strength of the composite part 10 may be further suppressed. Note that the third direction may be aligned with the thickness direction of the composite part 10, and the depth direction of the third fibers 21c and the holes 30 may be aligned with the thickness direction of the composite part 10. In this case, the main surface of the table 353 is approximately perpendicular to the optical axis of the laser beam that irradiates the workpiece 40, similar to Embodiment 1.

[0096] Although the above embodiments have been described as examples, this disclosure is not limited to these and can be modified as appropriate.

[0097] The composite component 10 is not limited to a plate shape. The composite component 10 does not need to be CMC as long as it comprises a first fiber 21a, a second fiber 21b, and a matrix material 25. Multiple fiber bundles consisting of multiple first fibers 21a and multiple second fibers 21b may be provided, and each fiber bundle may be laminated in the thickness direction of the composite component 10. The weaving of the multiple first fibers 21a and multiple second fibers 21b is not limited to plain weave, but may be twill weave or satin weave. The first fiber 21a only needs to be woven into the second fiber 21b, and does not need to be woven alternately across the second fiber 21b. The first direction does not need to be perpendicular to the second direction as long as it intersects with the second direction.

[0098] The multiple first fibers 21a and multiple second fibers 21b, and the center positions of their respective holes 30, may be arranged in a grid pattern other than a square grid, such as a triangle, rectangle, parallelogram, or other polygon. Furthermore, at least one hole 30 provided in at least one first row does not have to be one of the multiple holes 30 provided in the second row. The holes 30 do not have to be through holes.

[0099] The distance between the centers of adjacent holes 30 in the first direction does not need to be the same as the distance between the centers of adjacent holes 30 in the second direction; it may be smaller or larger than that distance.

[0100] Instead of the table 353 moving, the direction of light propagation from the laser processing device 300 to the workpiece 40 may be shifted in the in-plane direction by a galvanometer scanner or the like, causing the irradiation position on the workpiece 40, i.e., the irradiation spot of the laser beam on the workpiece 40, to shift in the in-plane direction. Alternatively, the table 353 may move, and the direction of light propagation from the laser processing device 300 to the workpiece 40 may also be shifted. The table 353 may rotate so that its in-plane direction is perpendicular or oblique to the optical axis of the laser beam traveling to the table 353, in accordance with the direction in which the third fiber 21c extends in the workpiece 40 supported by the table 353. The laser beam is preferably pulsed laser light because it increases the peak value of the laser beam irradiated onto the workpiece 40, resulting in efficient formation of the workpiece 40, but it may also be continuous light.

[0101] The above description is intended to be illustrative and not restrictive. It will therefore be apparent to those skilled in the art that modifications can be made to the embodiments of this disclosure without departing from the claims. It will also be apparent to those skilled in the art that the embodiments of this disclosure can be used in combination. Terms used throughout this specification and the claims should be interpreted as "non-limiting" unless otherwise specified. For example, the terms "include" or "contained" should be interpreted as "not limited to those listed as included." The term "possess" should be interpreted as "not limited to those listed as possessing." The indefinite article "one" should be interpreted as "at least one" or "one or more." The term "at least one of A, B, and C" should be interpreted as "A," "B," "C," "A+B," "A+C," "B+C," or "A+B+C." Furthermore, it should be interpreted as including combinations of these with anything other than "A," "B," and "C."

Claims

1. A plurality of first fibers extending in a first direction, A plurality of second fibers extending in a second direction perpendicular to the first direction, A matrix material filled between the plurality of first fibers and the plurality of second fibers, Equipped with, Multiple holes are provided in each of the multiple first rows along the first direction and the multiple second rows along the second direction. A composite component made from a ceramic matrix composite material, The first direction is the direction in which the distance between the centers of adjacent holes is minimized. At least one of the first fibers extends in the first direction between each of the adjacent holes in the second row, At least one of the second fibers extends in the second direction between each of the adjacent holes in the first row. Composite parts.

2. A composite component according to claim 1, At least one of the holes provided in at least one of the first rows also serves as one of the plurality of holes provided in the second row.

3. A composite component according to claim 1, The number of first fibers provided between each of the adjacent first rows is the same as the number of second fibers provided between each of the adjacent second rows.

4. A composite component according to claim 1, The aforementioned multiple holes are arranged in a square grid pattern.

5. A composite component according to claim 1, The present invention further comprises a plurality of third fibers extending in a third direction different from the first and second directions, The depth direction of each of the aforementioned holes is aligned with the third direction.

6. A composite component according to claim 5, The third direction is oblique to the thickness direction of the composite component.

7. A composite component according to claim 1, The aforementioned hole is a through hole.

8. A composite component according to claim 1, It is at least a part of at least one of the shroud, combustion liner, fuel nozzle, swirler, compressor blade, turbine blade, and turbine vane.

9. The method comprises an irradiation step in which a workpiece made of a ceramic matrix composite material comprising a plurality of first fibers extending in a first direction, a plurality of second fibers extending in a second direction perpendicular to the first direction, and a matrix material filling the spaces between the plurality of first fibers and the plurality of second fibers is irradiated with laser light, and a plurality of holes are provided in each of the plurality of first rows along the first direction and the plurality of second rows along the second direction. The first direction is the direction in which the distance between the centers of adjacent holes is minimized. At least one of the first fibers extends in the first direction between each of the adjacent holes in the second row, At least one of the second fibers extends in the second direction between each of the adjacent holes in the first row. Laser processing method.

10. A laser processing method according to claim 9, The workpiece further comprises a plurality of third fibers extending in a third direction different from the first and second directions, The depth direction of each of the aforementioned holes is aligned with the third direction.

11. A laser processing method according to claim 10, The third direction is oblique to the thickness direction of the workpiece.

12. A method for manufacturing composite parts by laser processing of a workpiece, The workpiece is composed of a ceramic matrix composite material comprising a plurality of first fibers extending in a first direction, a plurality of second fibers extending in a second direction perpendicular to the first direction, and a matrix material filling the spaces between the plurality of first fibers and the plurality of second fibers. The process includes laser processing of the workpiece, wherein multiple holes are provided in each of the multiple first rows along the first direction and the multiple second rows along the second direction. The first direction is the direction in which the distance between the centers of adjacent holes is minimized. At least one of the first fibers extends in the first direction between each of the adjacent holes in the second row, At least one of the second fibers extends in the second direction between each of the adjacent holes in the first row. Manufacturing method for composite components.

13. A method for manufacturing a composite component according to claim 12, The workpiece further comprises a plurality of third fibers extending in a third direction different from the first and second directions, The depth direction of each of the aforementioned holes is aligned with the third direction.

14. A method for manufacturing a composite component according to claim 13, The third direction is oblique to the thickness direction of the workpiece.

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