Resin encapsulation apparatus and resin encapsulation method
JP7880136B2Active Publication Date: 2026-06-25YAMAHA ROBOTICS HLDG CO LTD
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- YAMAHA ROBOTICS HLDG CO LTD
- Filing Date
- 2022-08-24
- Publication Date
- 2026-06-25
AI Technical Summary
Benefits of technology
【0013】 本発明によれば、プレスローダが金型内に進退する回数を増やさずに枚葉状のリリースフィルムを使用可能な樹脂封止装置及び樹脂封止方法を提供することができる。
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Abstract
To provide a resin sealing device which enables a sheet-like release film to be used without increasing the number of forward movements of a press loader into a die, and to provide a resin sealing method.SOLUTION: A resin sealing device 1 includes a resin sealing die 60 and a loader hand 88. The resin sealing die 60 includes an upper die 62 and a lower die 61, in which a cavity recessed part 63 is formed at the side facing the upper die 62, and performs resin sealing to an electronic component E with a resin material R supplied to the cavity recessed part 63 through a release film F. The loader hand 88 is configured to be able to enter a space 60S between the upper die 62 and the lower die 61 and retreat from the space 60S. The loader hand 88 holds the used release film F' and a resin sealing component M while entering the space 60S and retreats from the space 60S while holding the release film F' and the resin sealing component M.SELECTED DRAWING: Figure 2D
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Citation Information
Patent Citations
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