Automatic placement of the substrate to the center of the chamber

Abstract

Multiple embodiments of the present disclosure include a method of placing a substrate at the center within a chamber. In one embodiment, the method includes inserting the substrate into the chamber using a robotic arm, obtaining a delta time value of a second thermometer relative to a first thermometer, where the delta time value is the duration between the time when the first thermometer is covered by the substrate and the time when the second thermometer is covered by the substrate, obtaining the delta time value, calculating a time offset value of the delta time value relative to an ideal delta time value, where the ideal delta time value is the delta time value when the substrate is perfectly centered in a first direction perpendicular to the movement of the substrate, calculating the time offset value, and comparing the time offset value with a graph or look-up table that correlates the time offset value with a distance offset value.

Description

[Technical Field]

[0001] Cross-reference of related applications This application claims priority to U.S. Patent Application No. 17 / 866,315, filed on 15 July 2022, the entire contents of which said U.S. Patent Application are incorporated herein by reference.

[0002] Embodiments of this disclosure relate to the field of semiconductor processing, and more particularly to a method of centering a substrate in a chamber using a pyrometer. [Background technology]

[0003] In semiconductor manufacturing, properly centering the substrate within the chamber is crucial for achieving highly uniform processing results. For example, in a heat treatment chamber, the substrate is ideally positioned at the center below the array of lamps. The lamps can be controlled in zones (e.g., a central region, an intermediate region, and an outer region). By properly centering the substrate, the zones on the substrate can be appropriately oriented to provide the desired heating to each zone.

[0004] The substrate is inserted into the chamber using a robotic arm (e.g., an end effector). The robotic arm is controlled by a processor. The processor provides a number of commands for moving the robotic arm within the chamber. For example, the robotic arm may include functions for moving the substrate in the X and Y directions. As used herein, the X direction may be perpendicular to the direction of movement during insertion of the substrate into the chamber, and the Y direction may be parallel to the direction of movement during insertion of the substrate into the chamber.

[0005] The processor may include multiple instructions for properly positioning the substrate. However, in some cases, the center position may drift during use and / or during tool maintenance (e.g., scheduled maintenance (PM)). Therefore, the robot may need to be recalibrated to properly center the substrate. Typically, this calibration is done manually; that is, a trained engineer or similar person may be responsible for improving the centering of the substrate. This involves opening the chamber and visually inspecting the centering of the substrate. Opening the chamber is a time-consuming process because the chamber may require requalification and / or reconfiguration after it has been opened. Furthermore, centering is susceptible to human error. Therefore, existing centering techniques are not ideal for many semiconductor processes. [Overview of the project]

[0006] Multiple embodiments of the present disclosure include methods for positioning a substrate at the center of a chamber. In one embodiment, the method includes inserting a substrate into the chamber using a robotic arm; obtaining a delta time value of a second pyrometer relative to a first pyrometer, where the delta time value is the duration between the time the first pyrometer is covered by the substrate and the time the second pyrometer is covered by the substrate; calculating a time offset value of the delta time value relative to an ideal delta time value, where the ideal delta time value is the delta time value when the substrate is perfectly centered in a first direction perpendicular to the movement of the substrate; comparing the time offset value with a graph or lookup table that correlates the time offset value with a distance offset value, where the distance offset value is the value of how far the substrate is from the center when the substrate is perfectly centered in the first direction; moving the substrate backward; moving the robotic arm by the distance offset value in the first direction; and inserting the substrate into the chamber using the robotic arm.

[0007] Multiple embodiments may also include a method for positioning a substrate at the center of a chamber. The method includes inserting a substrate into a chamber using a robotic arm, the chamber comprising a first pyrometer below the substrate and a plurality of second pyrometers, measuring the delta time values ​​of the plurality of second pyrometers relative to the first pyrometer, calculating a time offset value of the delta time value relative to an ideal delta time value, where the ideal delta time value is the delta time value when the substrate is perfectly centered in a first direction perpendicular to the movement of the substrate, and finding the best match in a graph or lookup table correlating the time offset value with a distance offset value, where the distance offset value is the value of how far the substrate is from the center when the substrate is perfectly centered in the first direction, and finding the best match.

[0008] Multiple embodiments may also include semiconductor processing tools. In one embodiment, the semiconductor processing tool includes a chamber, a plurality of pyrometers arranged around the lower or upper surface of the chamber, a plurality of lamps facing the plurality of pyrometers, a robotic arm for inserting a substrate into the chamber, the robotic arm being movable in a first direction and a second direction perpendicular to the first direction, and a processor that uses measurements from the plurality of pyrometers to provide a plurality of instructions for positioning the substrate in the center of the chamber without opening the chamber. [Brief explanation of the drawing]

[0009] [Figure 1A] This is a cross-sectional view of a semiconductor processing tool having a robotic arm for inserting a substrate, according to one embodiment. [Figure 1B] This is a plan view of a semiconductor processing tool in one embodiment, as shown in Figure 1A. [Figure 1C]A plan view showing an X-Y robot plane defined by the reach of a robot handler according to one embodiment, and an X-Y chamber plane parallel to the X-Y robot plane. [Figure 2A] A view showing the insertion of a substrate into a chamber according to one embodiment, where the substrate is fully aligned in the X direction. [Figure 2B] A graph showing a normalized pyrometer signal during the insertion of a substrate into a chamber according to one embodiment. [Figure 3A] A view showing a substrate arranged completely centered and a substrate having an offset in the X direction according to one embodiment. [Figure 3B] A graph showing the time offset value and the corresponding X direction offset according to one embodiment. [Figure 3C] A process flow diagram showing a process for measuring the offset of a substrate in the X direction according to one embodiment. [Figure 4A] A view showing a substrate inserted into a chamber in a manner that provides proper centering in the Y direction according to one embodiment. [Figure 4B] A process flow diagram showing a process for measuring the offset of a substrate in the Y direction according to one embodiment. [Figure 5] A block diagram of an exemplary computer system according to one embodiment of the present disclosure.

Mode for Carrying Out the Invention

[0010] A method of placing a substrate at the center within a chamber using a pyrometer is described herein. In the following description, numerous specific details are set forth in order to provide a comprehensive understanding of the various embodiments. It will be apparent to one skilled in the art that the various embodiments may be practiced without these specific details. In other instances, well-known aspects are not described in detail so as not to obscure the various embodiments needlessly. Further, it should be understood that the various embodiments shown in the accompanying figures are exemplary representations and are not necessarily drawn to scale.

[0011] As described above, current processes for placing a substrate at the center within a chamber are human-involved and require opening the chamber. Thus, the process is susceptible to human error and results in significant downtime for the chamber. Accordingly, the various embodiments disclosed herein include a substrate centering process that can be implemented by a processor without the need to open the chamber. In particular, the various embodiments utilize a pyrometer present within the chamber to detect the presence of the substrate. The positions of the multiple pyrometers relative to the center of the chamber are known. Thus, the edges of the substrate can be detected at multiple positions and at multiple times. This enables the calculation of the offset of the substrate from the center of the chamber. The various embodiments disclosed herein enable centering in both the X and Y directions.

[0012] In one embodiment, edge detection is possible due to the structure of the chamber. Multiple lamps can be provided opposite the pyrometer. For example, the lamps can be used to heat the substrate during a heat treatment process such as thermal oxidation. In one embodiment, the lamps remain lit during the processing of different substrates for heat retention. Thus, the pyrometer detects a relatively strong signal when the substrate is not present. When the next substrate is inserted into the chamber, the substrate blocks the heat signal from the lamps. Thus, the signal from the pyrometer decreases. The decrease in the signal can be used as an indicator of the presence of the edge of the substrate. By monitoring the times at which the various pyrometers detect the edge, the offset of the substrate can be measured.

[0013] Next, referring to Figure 1A, a cross-sectional view of a semiconductor processing tool 100 according to one embodiment is shown. In one embodiment, the semiconductor processing tool 100 may be a heat treatment tool such as a rapid heat treatment (RTP) tool. Processing steps such as thermal oxidation and annealing can be performed using the semiconductor processing tool 100. In one embodiment, the semiconductor processing tool 100 may include a lower part 105 and a lid 112. The lower part 105 and the lid 112 may be part of a housing that forms an internal space where processing takes place.

[0014] In one embodiment, a plurality of lamps 113 may be provided above the lid 112. The lid 112 may be substantially transparent to infrared light. Thus, the lamps 113 can provide energy into the internal space of the semiconductor processing tool 100 for processing a substrate such as a substrate 101. The lamps 113 may be controlled in multiple zones. For example, the lamps 113 may include an inner zone, an intermediate zone, and an outer zone. However, it should be understood that multiple embodiments may include any number of lamp zones (e.g., one or more zones).

[0015] In one embodiment, multiple pyrometers 120 may be provided through the lower part 105 of the semiconductor processing tool 100. In one illustrated embodiment, pyrometers 120A to 120D are shown in a single plane for ease of illustration. However, it should be understood that the pyrometers 120 may be in different planes from each other, as will be shown in the plan view of Figure 1B. As illustrated, the pyrometers 120 receive a signal (e.g., a thermal signal) from the lamp 113, as indicated by the arrows. However, the signal to the first pyrometer 120A is blocked by the substrate 101. The signal to the second pyrometer 120B passes through the substrate 101, even though it is shown as being covered by the substrate 101. In fact, as will be shown in Figure 1B, the second pyrometer 120B is not covered by the substrate 101.

[0016] In one embodiment, the substrate 101 may be inserted into a semiconductor processing tool 100. For example, a robotic arm 110 (e.g., an end effector) may be fixed to the substrate 101 and feed the substrate 101 into the semiconductor processing tool 100. The robotic arm 110 may position the substrate 101 within the edge ring 107. The robotic arm 110 may include functions for moving the substrate 101 in both the X direction (into and out of the plane in Figure 1A) and the Y direction (from left to right in Figure 1A). In one embodiment, the substrate 101 may be any substrate suitable for a semiconductor processing process. In a particular embodiment, the substrate 101 may be a silicon substrate having any form factor (e.g., 300 mm, 450 mm, etc.). However, other semiconductor substrates 101 or substrates 101 of any other material may also be used.

[0017] Next, referring to Figure 1B, a plan view of a semiconductor processing tool 100 according to one embodiment is shown. In the illustrated embodiment, the lid 112 and ramp 113 are omitted to clearly view the substrate 101 and the pyrometers 120. As shown, the substrate 101 is inserted by a robotic arm 110. The pyrometers 120 are covered as the substrate 101 is inserted into the semiconductor processing tool 100. For example, at the point shown in Figure 1B, the first pyrometer 120A is covered by the substrate 101, while the remaining pyrometers 120B, 120C, and 120D remain exposed. As the substrate 101 moves into the semiconductor processing tool, the remaining pyrometers 120 are also covered. As each pyrometer is covered, as will be described in more detail below, a signal indicating edge detection is provided. By combining the edge detection signal with the time the edge was detected, it can be confirmed that the substrate 101 is centered. A more detailed process of how the centering is calculated is provided below.

[0018] In one illustrated embodiment, a set of four pyrometers 120A-120D is shown. However, it should be understood that the center placement process can be performed with two pyrometers. Additionally, five or more pyrometers 120 can also be used. By increasing the number of pyrometers, the substrate 101 can be placed more precisely at the center. For example, placing the substrate at the center can provide an error of approximately 0.25 mm or less. Since the existing process is a manual process, such an error is considered acceptable. This is because, generally, it is more precise than the error currently provided by humans.

[0019] Next, referring to FIG. 1C, a plan view showing the plane (in the X-Y dimensions) of a robot handler and a chamber according to one embodiment is shown. Specifically, the robot has a plane 196 defined by X chamber , robot , robot , chamber , robot , chamber , robot , robot , chamber , robot and Y robot and a plane 197 defined by X chamber and Y chamber The robot blade 198 can be moved within the robot plane 196. The robot plane 196 overlaps a portion of the chamber plane 197. Thus, the robot blade 198 can be inserted into the chamber 197.

[0020] It should be understood that the placement is performed by the robot blade 198 reaching waypoints on the X chamber , Y chamber plane parallel to the X robot , Y robot plane defined by the reach range of the robot handler center. The waypoints of the chamber are taught to coincide with the center of the chamber. This is done by finding the robot plane values X chamber , Y chamber that represent the point X robot , Y robot (e.g., (A, B)) on the chamber plane 197 at (0, 0). More generally, the process maps the coordinate system (X robot , Y robot ) of the robot to the coordinate system (X chamber , Y chamberThis includes matching with ). This process can generally be called "robot education."

[0021] Next, referring to Figure 2A, a diagram of edge detection over time according to one embodiment is shown. In the embodiment shown in Figure 2A, the substrate 201 is shown to be perfectly centered in the X-axis (vertical direction). This is considered an ideal situation and is used to illustrate the edge detection process. As shown in Figure 2A, a series of substrate edges 2011-2015 are shown as the substrate 201 moves through the semiconductor processing tool. The detected edges 2011-2014 correspond to the positions of altimeters 220A-220D. Edge 2015 is the ideal end position where the center of the substrate is at the center L0 of the chamber (i.e., (0,0)). A more detailed explanation of how the Y-axis centering is achieved is provided below.

[0022] In the ideal scenario shown in Figure 2A, the center points (L1-L4) of the substrate 201 at each position are given at X=0. The position in the Y direction can be calculated using trigonometry, since the position (X, Y) of the pyrometer 220 is known and the radius of the substrate is known. For example, in the fourth pyrometer 220D, the X-Y position is X=140 and Y=0. Assuming the radius of the substrate is 150 mm, the center L4 of the substrate 201 at time 2013 is given by Equation 1. That is, Y(L4) = Y(220D) - (R 2 -X(220D) 2 ) 1 / 2 = -53.8 Formula 1 Similar formulas can be constructed using trigonometry to find the Y values ​​of other center points.

[0023] In one embodiment, the substrate 201 passes through the pyrometers 220A to 220D at a constant speed. The substrate then decelerates and may reach the endpoint position at time 2015. Thus, the time difference between positions L1 to L4 is proportional to the distance in the graph. As will be described in more detail below, the time values ​​at different positions 220A to 220D can be used to measure the offset in the X direction.

[0024] Next, referring to Figure 2B, a graph of signals 2211–2214 detected by each pyrometer against time is shown. The graphs in Figure 2B are normalized graphs with a maximum of 1 and a minimum of 0. As illustrated, each signal 2211–2214 decreases sharply at the point when the substrate covers the pyrometer. This is because the substrate blocks the heat radiation from the lamp overlapping it, while the lamp is kept at a constant power. As shown in Figure 2B, the time at which the pyrometer is considered covered is when signal 221 passes the 0.5 mark of signal intensity. As illustrated, the slopes of signals 2211–2214 may not be uniform. For example, signal 2214 has a smaller slope than signal 2211. This may be due to the position of the pyrometer; that is, a pyrometer with an X coordinate closer to 0 may have a relatively steeper slope than a pyrometer with an X coordinate further from 0.

[0025] In one illustrated embodiment, each pyrometer is covered at different times (e.g., t(L1), t(L2), t(L3), and t(L4)). One of the pyrometers is used as a reference point to correlate each of the times with the others. For example, the delta time value (Δt) is provided with respect to the first time t(L1). That is, the Δt value can be found using Equation 2. Δt(L2)=t(L2)-t(L1)=0.05 Formula 2 Similar formulas may be provided to find the Δt value for other pyrometers.

[0026] Next, referring to Figure 3A, a perfectly centered substrate 301 according to one embodiment.A and substrate 301 offset by distance dx B A diagram illustrating this is shown. Figure 3A is shown to illustrate how the time offset value (dΔt(Ln)) is calculated for various X offsets. For example, in Figure 3A, the dx distance is 30 mm. First, an ideal substrate 301 A However, it has a calculated center point y(L2). The center point y(L2) can be calculated using Equation 1. Then, the center point y'(L2) is obtained using Equation 3, offset substrate 301 B It is calculated based on this. y'(L2)=y(320B)-(R 2 -(x(320B)-dx) 2 ) 1 / 2 Formula 3 Similar formulas can be provided for the other L values ​​(L1, L3, and L4).

[0027] Then, the delta y value (dy(Ln)) is calculated using equation 4. dy(Ln) = y'(Ln) - y(Ln) Equation 4

[0028] Since distance is proportional to time, the time associated with each deltay can be given by equation 5. dt(Ln) = dy(Ln) / v (Equation 5) In equation 5, v is the velocity of the robot arm. Ultimately, the time offset dΔt(Ln) can be obtained by subtracting dt(L1) from the time associated with each of the other delta y values. By changing the value of offset dx, the time offset dΔt(Ln) can be identified for all values ​​of offset dx. These values ​​can be stored as a graph or a lookup table. In an alternative embodiment, the time offset dΔt(Ln) can be determined by experiment and / or machine learning.

[0029] Next, referring to Figure 3B, a graph is shown showing a plot of time offsets dΔt(L2), dΔt(L3), and dΔt(L4) with the corresponding dx values ​​according to one embodiment. The circles represent the time offset values ​​calculated for the offset substrate. The time offset values ​​are fitted to multiple lines to provide the most accurate value of dx. For example, in Figure 3B, the time offset value corresponds to a dx of approximately 1.4 mm. Therefore, the robot arm needs to be offset by 1.4 mm to correct the centering of the substrate. Although shown in graph form, it should be understood that the offset dx can also be determined using lookup tables, etc. Furthermore, it should be understood that the dx value can be determined using fewer than three time offset values ​​or more than three time offset values. For example, a single dΔt(L2) value can be determined using a set of two pyrometers. dx can be determined using a single dΔt(L2) value.

[0030] Next, referring to Figure 3C, a process flow diagram is shown illustrating a process 380 for determining the offset of a substrate in a direction perpendicular to the robot's movement, according to one embodiment. The process 380 described uses a set of two pyrometers. However, it should be understood that in some embodiments, more than two pyrometers may be used.

[0031] In one embodiment, process 380 begins with step 381, which includes inserting a substrate into a chamber using a robotic arm. The chamber may be any suitable chamber having a heating lamp and two or more pyrometers. For example, a semiconductor processing tool similar to the semiconductor processing tool 100 described in more detail above may be used. In one embodiment, the robotic arm may insert the substrate into the chamber in a linear direction. In the context of the multiple embodiments described herein, the linear direction may be the Y-axis as described above. In one embodiment, the robotic arm may not be properly aligned with the center of the chamber. That is, the robotic arm may have an offset in the X direction (i.e., perpendicular to the direction of movement of the robotic arm).

[0032] In one embodiment, process 380 may follow step 382, ​​which includes obtaining a delta time value for a second pyrometer relative to a first pyrometer. The delta time value may be the time between the time the edge of the substrate is detected using the first pyrometer and the time the edge of the substrate is detected using the second pyrometer. Edge detection of the substrate may be determined by observing the pyrometer signal. For example, as the substrate passes over the pyrometer, the signal may drop significantly, as shown in Figure 2B. In a particular embodiment, edge detection may use a normalized midpoint of the pyrometer signal as the time at which the pyrometer is considered covered.

[0033] In one embodiment, process 380 may follow step 383, which includes calculating a time offset value of the delta time value relative to an ideal delta time value. In one embodiment, the ideal delta time value may be the delta time value between a first pyrometer and a second pyrometer when the substrate is perfectly aligned. The ideal delta time value may be a measured value stored in memory, or it may be a calculated value stored in memory.

[0034] In one embodiment, process 380 may follow step 384, which includes comparing the time offset values ​​with a graph or lookup table that correlates the time offset values ​​with the distance offset values. In one embodiment, when a graph is used, the graph may be similar to the graph shown in Figure 3B. The graph or lookup table may be generated analytically as described above and stored in memory. In several other embodiments, the graph or lookup table may be determined experimentally using machine learning algorithms or the like. In one embodiment, the distance offset value is the distance the substrate is offset from its true center in a direction perpendicular to the direction of substrate movement (i.e., in the X direction using the coordinate system described herein).

[0035] In one embodiment, process 380 may be followed by step 385, which includes retracting the substrate from the chamber. In one embodiment, the substrate may be retracted along the same path used to insert the substrate into the chamber.

[0036] In one embodiment, process 380 may follow step 386, which includes moving the robot arm by a distance offset value in a direction perpendicular to the direction of movement of the substrate entering and exiting the chamber. Ideally, the distance offset value corrects the misalignment of the substrate.

[0037] In one embodiment, process 380 may be followed by step 387, which includes inserting the substrate into the chamber using a robotic arm. Ideally, this corrects the alignment. However, it should be understood that the alignment can be re-verified by repeating process 380 any number of times. In a particular embodiment, process 380 may be repeated until the measured offset falls within a given specification. For example, the specification may be within 5 mm from the true center, within 2 mm from the true center, or within 0.25 mm from the true center.

[0038] However, it should be understood that process 380 can be performed without human intervention. That is, a processor that can access the thermometer signal or values ​​stored in memory can perform process 380 automatically. Process 380 can be performed after a predetermined number of boards have been processed, after planned maintenance, or after any other desired duration or predetermined event.

[0039] Next, referring to Figure 4A, a diagram is shown illustrating a method for centering the substrate in the direction of motion (i.e., the Y direction in Figure 4A) according to one embodiment. In one embodiment, the centering in the direction of motion is complex because the speed of the substrate is not constant. That is, after passing the pyrometer, the robot arm must decelerate in order to stop at the appropriate center point in the Y direction. In one embodiment, the centering in the Y direction may be performed after the centering in the X direction is completed.

[0040] When the substrate is properly aligned in the X direction, the position of the center point L1 of the substrate 4011 when the first pyrometer 420A is covered becomes known. Therefore, when the substrate is stopped on the first pyrometer 420A using a deceleration process, the substrate is at point 401 E To ensure the substrate has a center point at L0 when the robot is in a certain position, a simple offset (equal to the distance between L1 and L0, i.e., (0,0)) can be applied to the robot. The first pyrometer 420A can be considered covered when the normalized pyrometer signal is approximately 0.5. If the signal strength is above or below 0.5 (outside the threshold around 0.5), the deceleration process is adjusted and re-checking is performed until the signal strength is within 0.5 or a predetermined threshold. In one embodiment described, only the measurement 420A of a single pyrometer is required to center the substrate in the Y direction. Of course, the center point can be further confirmed by using a further pyrometer (e.g., a second pyrometer 420B at position 4012).

[0041] Next, referring to Figure 4B, a process flow diagram illustrating a process 490 for centering a substrate in the direction of motion (i.e., the Y-direction as described herein) according to one embodiment is shown.

[0042] In one embodiment, process 490 begins with step 491, which includes using a robotic arm to insert the substrate into the chamber by a first distance so that the substrate stops at the first pyrometer. Step 491 may begin after the substrate has been properly aligned in the vertical direction (i.e., the X direction as described herein). Since the center in the X direction is known, the distance to the first pyrometer should be known. This known distance can be used as the starting point for the first distance. In one embodiment, the first distance may be followed at a constant speed until near the end of the first distance. At this point, a deceleration process may be performed to stop the substrate at the first pyrometer.

[0043] In one embodiment, process 490 may be followed by step 492, which includes determining whether the substrate has come to a proper stop at a first pyrometer. In one embodiment, the substrate is considered to have come to a proper stop if the normalized pyrometer signal is within a predetermined range of 0.5 or 0.5. If the substrate does not come to a desired position, steps 491 and 492 are repeated, modifying the first distance and / or deceleration process, until a suitable position is obtained. A positive offset is provided if the pyrometer signal is greater than 0.5, and a negative offset is provided if the pyrometer signal is less than 0.5. The required amount of movement may be given by the slope of the pyrometer signal and the pyrometer signal value. That is, the time axis in Figure 2B is converted to Y values ​​using the formula Y=v*t, where v is velocity and t is time.

[0044] In one embodiment, process 490 may be followed by step 493. Step 493 includes adding a centering offset to a first distance when the substrate has properly stopped on the first pyrometer. In one embodiment, the centering offset may be equal to the Y value of the center point of the substrate when the first pyrometer was first covered. Thus, by adding the Y value, the endpoint 401 E It is properly centered at the (0,0) coordinates (i.e., the center of the chamber).

[0045] In one embodiment, process 490 may be followed by step 494, which includes retracting the substrate from the chamber. In one embodiment, the retraction of the substrate may be the reverse of the speed, acceleration, distance, etc., used to insert the substrate into the chamber.

[0046] In one embodiment, process 490 may follow step 495. Step 495 includes inserting the substrate into the chamber by a second distance equal to the sum of a first distance and a centering offset. Furthermore, the acceleration and deceleration processes used to find the centering offset may also be used in this insertion of the substrate. Thus, the substrate should land within a desired threshold of L0 (i.e., (0,0)) or (0,0). More specifically, the acceleration, deceleration, and constant velocity of the substrate are the same between the process for finding the centering offset and the insertion included in step 495. What is changed is the duration of the constant velocity. The duration of the constant velocity may be determined using the centering offset (for example, the centering offset is divided by the constant velocity to determine a further duration applied to the constant velocity in order to land at (0,0)).

[0047] Figure 5 shows a schematic diagram of an exemplary form of machine, computer system 500, in which a set of instructions for causing the machine to perform any one or more of the methods described herein can be executed internally. In several alternative embodiments, the machine may be connected to (e.g., networked) other machines in a local area network (LAN), intranet, extranet, or internet. The machine may operate as a server or client machine in a client-server network environment, or as a peer machine in a peer-to-peer (or distributed) network environment. The machine may be a personal computer (PC), tablet PC, set-top box (STB), portable information terminal (PDA), mobile phone, web device, server, network router, switch or bridge, or any machine capable of executing a set of instructions (sequential or different) that specify the actions to be performed by the machine. Furthermore, although only a single machine is shown, the term “machine” is to be interpreted as including any collection of machines (e.g., computers) that individually or collectively execute a set of instructions (or sets of instructions) for performing any one or more of the methods described herein.

[0048] An exemplary computer system 500 includes a processor 502, main memory 504 (e.g., read-only memory (ROM), flash memory, dynamic random access memory (DRAM) such as synchronous DRAM (SDRAM) or rhombus DRAM (RDRAM), etc.), static memory 506 (e.g., flash memory, static random access memory (SRAM), MRAM, etc.), and auxiliary memory 518 (e.g., data storage device), all communicating with each other via a bus 530.

[0049] The processor 502 represents one or more general-purpose processing devices, such as a microprocessor or a central processing unit. More specifically, the processor 502 may be a composite instruction set computing (CISC) microprocessor, a reduced instruction set computing (RISC) microprocessor, a very long instruction word (VLIW) microprocessor, a processor implementing another instruction set, or a processor implementing a combination of instruction sets. The processor 502 may also be one or more special-purpose processing devices, such as an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA), a digital signal processor (DSP), or a network processor. The processor 502 is configured to execute processing logic 526 for carrying out the processes described herein.

[0050] The computer system 500 may further include a network interface device 508. The computer system 500 may also include a video display unit 510 (e.g., a liquid crystal display (LCD), a light-emitting diode display (LED), or a cathode ray tube (CRT)), an alphanumeric input device 512 (e.g., a keyboard), a cursor control device 514 (e.g., a mouse), and a signal generating device 516 (e.g., a speaker).

[0051] Auxiliary memory 518 may include a machine-accessible storage medium (or more specifically, a computer-readable storage medium) 532 that stores a plurality of sets of one or more instructions (e.g., software 522) that embody any one or more of the methods or functions described herein. This software 522 may also reside in main memory 504 and / or processor 502 while being executed by computer system 500, and the main memory 504 and processor 502 also constitute a machine-readable storage medium. This software 522 may be further transmitted or received over network 520 via network interface device 508.

[0052] In one exemplary embodiment, the machine-accessible storage medium 532 is shown as a single medium, but the term “machine-readable storage medium” should be understood to include a single medium or multiple mediums (e.g., a centralized or distributed database, and / or associated caches and servers) that store one or more sets of instructions. The term “machine-readable storage medium” should also be interpreted to include any medium capable of storing or encoding a set of instructions executed by a machine, which causes the machine to execute any one or more of the methods of the Disclosure. Accordingly, the term “machine-readable storage medium” should be interpreted to include, but not be limited to, solid memory, optical media, and magnetic media.

[0053] According to one embodiment of the present disclosure, a machine-accessible storage medium stores a number of instructions causing a data processing system to perform a method of positioning a substrate in the center of a chamber using a pyrometer. The method includes measuring a delta time value between the time a first pyrometer covers and the time a second pyrometer covers. The method includes calculating a time offset value of the delta time value relative to an ideal delta time value. The method includes comparing the time offset value with a graph or lookup table that correlates the time offset value with a distance offset value. The method includes retracting the substrate, adjusting a robotic arm by the distance offset value, and reinserting the substrate into the chamber.

[0054] Therefore, a method for centering a substrate using data from a pyrometer is disclosed.

Claims

1. A method of placing a substrate in the center of a chamber, Inserting the substrate into the chamber using a robotic arm, Obtaining a delta time value of a second pyrometer relative to a first pyrometer, wherein the delta time value is the duration between the time the first pyrometer was covered by the substrate and the time the second pyrometer was covered by the substrate. Calculating a time offset value for an ideal delta time value, wherein the ideal delta time value is the delta time value when the substrate is perfectly centered in a first direction perpendicular to the movement of the substrate. A graph or lookup table that correlates the time offset value with the distance offset value, wherein the distance offset value is the value of how far the substrate is from the center when the substrate is perfectly centered in the first direction, and the time offset value is compared with the graph or lookup table that correlates the time offset value with the distance offset value, wherein the distance offset value is the value of how far the substrate is from the center when the substrate is perfectly centered in the first direction, To retract the aforementioned substrate, Moving the robot arm by the distance offset value in the first direction, and This includes inserting the substrate into the chamber using the robot arm, The robot arm has a constant speed in a second direction parallel to the movement of the substrate as the substrate passes over the first and second thermometers.

2. The method according to claim 1, wherein the graph or the lookup table is obtained by experiment and machine learning or calculated analytically.

3. The method according to claim 1, wherein the first pyrometer has a first normalized pyrometer signal between 0 and 1, the second pyrometer has a second normalized pyrometer signal between 0 and 1, and the first and second pyrometers are deemed covered when the normalized pyrometer signal passes through 0.

5.

4. The method according to claim 3, wherein the slope of the first normalized pyrometer signal is different from the slope of the second normalized pyrometer signal.

5. The method according to claim 1, further comprising repeating the above method one or more times.

6. The method according to claim 5, wherein the method is stopped when the distance offset value is 0.25 mm or less.

7. The method according to claim 1, further comprising a third thermometer and a fourth thermometer.

8. Obtaining a second delta time value of the third pyrometer relative to the first pyrometer, wherein the second delta time value is the duration between the time the first pyrometer was covered by the substrate and the time the third pyrometer was covered by the substrate. Obtaining a third delta time value of the fourth pyrometer relative to the first pyrometer, wherein the third delta time value is the duration between the time the first pyrometer was covered by the substrate and the time the fourth pyrometer was covered by the substrate. Calculating time offset values ​​for the second and third delta time values ​​with respect to an ideal delta time value, wherein the ideal delta time value is the delta time value when the substrate is perfectly centered in the first direction, and The method according to claim 7, further comprising comparing the time offset value with the graph or lookup table that correlates the time offset value with the distance offset value, wherein the distance offset value is the value of how far the substrate is from the center when the substrate is perfectly centered in the first direction.

9. The method according to claim 1, further comprising positioning the substrate at the center in the first direction, and then positioning the substrate at the center in the second direction parallel to the movement of the substrate.

10. In the second direction described above, arranging the substrate centrally is Insert the substrate into the chamber by a first distance using the robot arm so that the substrate stops in the first thermometer. To determine whether the substrate has stopped properly in the first thermometer, When the substrate is properly stopped in front of the first thermometer, a centering offset is added to the first distance. Retracting the substrate from the chamber, and The method according to claim 9, comprising inserting the substrate into the chamber by a second distance equal to the sum of the first distance and the centering offset.

11. A method of placing a substrate in the center of a chamber, Inserting the substrate into the chamber using a robotic arm, wherein the chamber comprises a first thermometer below the substrate and a plurality of second thermometers, Measuring the delta time values ​​of the plurality of second pyrometers relative to the first pyrometer, wherein each delta time value is the duration between the time the first pyrometer was covered by the substrate and the time the corresponding second pyrometer was covered by the substrate. Calculating a time offset value of the delta time value relative to an ideal delta time value, wherein the ideal delta time value is the delta time value when the substrate is perfectly centered in a first direction perpendicular to the movement of the substrate, and Finding the best match in a graph or lookup table that correlates the time offset value with the distance offset value, wherein the distance offset value is the value of how far the substrate is from the center when the substrate is perfectly centered in the first direction, and finding the best match, A method wherein the substrate is moved at a constant speed over the first thermometer and the plurality of second thermometers.

12. To retract the aforementioned substrate, Moving the substrate by the distance offset value in the first direction, and The method according to claim 11, further comprising inserting the substrate into the chamber.

13. The method according to claim 11, wherein the plurality of second thermometers include three thermometers.

14. The method according to claim 11, further comprising repeating the above method multiple times.

15. The method according to claim 14, wherein the method is stopped when the distance offset value is approximately 0.25 mm or less.

16. It is a semiconductor processing tool, Chamber, Multiple pyrometers arranged around the lower or upper surface of the chamber, Multiple lamps facing the aforementioned multiple thermometers, A robotic arm for inserting a substrate into the chamber, the robotic arm being movable in a first direction and a second direction perpendicular to the first direction, and A semiconductor processing tool comprising a processor including a plurality of instructions, wherein the processor is configured to perform the method according to any one of claims 1 to 15 by executing the plurality of instructions without opening the chamber.

17. The semiconductor processing tool according to claim 16, wherein the robot arm is configured to be taught to automatically position a specific substrate of the same dimensions in the center of the chamber.

18. The semiconductor processing tool according to claim 17, wherein waypoints are stored in the semiconductor processing tool so as to be reused to position any further substrates without using the plurality of instructions.

Images