Photosensitive resin composition, cured product, partition, organic electroluminescent element, color filter, and image display device

Abstract

Provided is a photosensitive resin composition capable of achieving both adequate liquid repellency and ink jet application properties. The photosensitive resin composition of the present invention contains (A) a copolymer, (B) an alkali-soluble resin, and (D) a photopolymerizable compound, and the (A) copolymer contains a monomer (a1): monomer having an active group that generates radicals upon irradiation by active energy rays and a monomer (a2): a monomer having a fluorine atom and / or silicon atom, as constituent monomers.

Description

Technical Field

[0001] The present invention relates to a photosensitive resin composition, a cured product, a partition wall, an organic electroluminescent element, a color filter, and an image display device. This application claims priority based on Japanese Patent Application No. 2021-012736 filed in Japan on January 29, 2021, and incorporates the content herein by reference.

Background Art

[0002] Conventionally, an organic electroluminescent element included in an organic electric display or the like is manufactured by forming a partition wall (bank) on a substrate and then laminating various functional layers in a region surrounded by the partition wall. As a method for easily forming such a partition wall, a method of forming by a photolithography method using a photosensitive resin composition is known.

[0003] In addition, as a method for laminating various functional layers in a region surrounded by a partition wall, a method is known in which first, ink containing a material constituting the functional layer is prepared, and then the prepared ink is injected into the region surrounded by the partition wall. Among these methods, the inkjet method is often adopted because it is easy to accurately inject a predetermined amount of ink to a predetermined location.

[0004] Furthermore, when forming a functional layer using ink, it may be required to impart ink repellency (liquid repellency) to the partition wall for the purpose of preventing the adhesion of ink to the partition wall and preventing the mixing of inks injected between adjacent regions.

[0005] When forming an organic light-emitting layer by an inkjet method, a region surrounded by a partition wall (hereinafter also referred to as an opening) needs to have a property that ink easily wets and spreads in order to prevent white spots in the organic electroluminescent element and to laminate a flat organic light-emitting layer.

[0006] Patent Document 1 describes a fluorine-containing curable resin and composition that is effective in providing stain resistance for use as an ultraviolet-curable hard coat material for protective film coatings, and which has poly(perfluoroalkylene ether chain) and photopolymerization initiation ability.

[0007] Patent Document 2 describes that by using a photosensitive composition containing an acrylic resin having a polycyclic saturated hydrocarbon skeleton and an ethylenic double bond, good ink repellency is achieved even after UV cleaning treatment. [Prior art documents] [Patent Documents]

[0008] [Patent Document 1] Japanese Patent No. 5353632 [Patent Document 2] International Publication No. 2019 / 146680 [Overview of the Initiative] [Problems that the invention aims to solve]

[0009] The inventors investigated and found that it was difficult to create partitions by patterning through development using the composition described in Patent Document 1. Furthermore, they found that when partitions were formed using the composition described in Patent Document 2 and ink was applied to the area surrounded by the partitions using an inkjet method, the ink sometimes did not spread easily.

[0010] Therefore, the present invention aims to provide a photosensitive resin composition that can achieve both sufficient liquid repellency and inkjet coating properties. The present invention also provides a cured product obtained by curing a photosensitive resin composition, a partition made of the cured product, an organic electroluminescent element equipped with the partition, a color filter equipped with the partition, and an image display device including the organic electroluminescent element and an image display device including the color filter. [Means for solving the problem]

[0011] As a result of diligent research by the inventors, we discovered that the above problems can be solved by using a combination of a specific copolymer, an alkali-soluble resin, and a photopolymerizable compound, and thus completed the present invention. In other words, the gist of this invention is as follows.

[0012] [1] A photosensitive resin composition comprising (A) a copolymer, (B) an alkali-soluble resin, and (D) a photopolymerizable compound, A photosensitive resin composition in which the copolymer (A) contains the following monomer (a1) and monomer (a2) as constituent monomers. Monomer (a1): A monomer having an active group that generates radicals upon irradiation with active energy rays. Monomer (a2): A monomer having a fluorine atom and / or a silicon atom. [2] A photosensitive resin composition of [1] wherein the monomer (a2) is a monomer having a fluorine atom. [3] A photosensitive resin composition of [2] wherein the monomer (a2) is a monomer having a fluoroalkyl group. [4] The photosensitive resin composition according to [3], wherein the monomer (a2) is a monomer having a group represented by the following formula (1). -CFXR f ...Equation (1) (In formula (1), X is a hydrogen atom, a fluorine atom, or a trifluoromethyl group, and R f (This may contain an etheric oxygen atom, a fluoroalkyl group having 1 to 20 carbon atoms, or a fluorine atom.) [5] A photosensitive resin composition of any of [1] to [4] wherein the fluorine atom content in the copolymer (A) is 5 to 40% by mass. [6] A photosensitive resin composition according to any of [1] to [5], wherein the active group in the monomer (a1) is one or more selected from the group consisting of a benzophenone group, an acetophenone group, an α-hydroxyketone group, an α-aminoketone group, an α-diketone group, and an α-diketone dialkylacetal group. [7] A photosensitive resin composition further comprising (C) a photopolymerization initiator, any of [1] to [6]. [8] A photosensitive resin composition further comprising (E) a colorant, any of [1] to [7]. [9] Any of the photosensitive resin compositions [1] to [8] for forming partitions. A cured product obtained by curing any of the photosensitive resin compositions

[10] [1] to [9]. A partition made of hardened material

[11]

[10] . Organic electroluminescent element with partitions

[12]

[11] . A color filter containing luminescent nanocrystalline particles with partitions

[13]

[11] . Image display device including organic electroluminescent element

[14]

[12] . Image display device including the color filters

[15]

[13] . [Effects of the Invention]

[0013] The present invention provides a photosensitive resin composition that can achieve both sufficient liquid repellency and inkjet coating properties. [Brief explanation of the drawing]

[0014] [Figure 1] Figure 1 is a schematic cross-sectional view of an example of a color filter equipped with a partition wall according to the present invention. [Modes for carrying out the invention]

[0015] The present invention will be described in detail below. The following description is an example of an embodiment of the present invention, and the present invention is not limited thereto unless it exceeds the gist of the invention. In this invention, "(meth)acrylic" means "acrylic and / or methacrylic". In the present invention, "total solids" means all components other than the solvent in the photosensitive resin composition. Even if a component other than the solvent is liquid at room temperature, that component is not included in the solvent but is included in the total solids. In this invention, a numerical range represented using "~" means a range that includes the numbers written before and after "~" as the lower limit and upper limit, respectively. In the present invention, "A and / or B" means either A and B or both, and specifically means A, B, or A and B. In the present invention, "(co)polymer" means including both monopolymers (homopolymers) and copolymers, and "polybasic acid (anhydride)" means "polybasic acid and / or polybasic acid anhydride." In this invention, weight-average molecular weight refers to the weight-average molecular weight (Mw) calculated on a polystyrene basis by GPC (gel permeation chromatography). In this invention, the acid value refers to the acid value on an effective solids basis and is calculated by neutralization titration.

[0016] In this invention, "partition material" refers to bank material, wall material, and wall material, and similarly, "partition" refers to bank, wall, and wall. In this invention, the light-emitting part (pixel part) refers to the part that emits light when electrical energy is applied to it.

[0017] [1] Photosensitive resin composition The photosensitive resin composition of the present invention contains (A) a copolymer, (B) an alkali-soluble resin, and (D) a photopolymerizable compound, wherein (A) the copolymer contains monomers (a1) and (a2), described later, as constituent monomers. The photosensitive resin composition of the present invention may optionally contain other components, such as (C) a photopolymerization initiator, (E) a colorant, (F) a chain transfer agent, etc.

[0018] In the present invention, the partition wall is, for example, used to partition the functional layer (organic layer, light-emitting part) in an actively driven organic electroluminescent element, and is used to form a pixel including the functional layer and the partition wall by, for example, dispensing and drying ink, which is a material for constituting the functional layer, into the partitioned region (pixel region).

[0019] [1-1] Components and composition of photosensitive resin composition The photosensitive resin composition of the present invention contains (A) a copolymer, (B) an alkali-soluble resin, and (D) a photopolymerizable compound.

[0020] [1-1-1](A) component; copolymer The copolymer (A) of the present invention contains the following monomers (a1) and (a2) as constituent monomers. That is, the copolymer (A) of the present invention contains constituent units derived from monomer (a1) and constituent units derived from monomer (a2). Monomer (a1): A monomer having an active group that generates radicals upon irradiation with active energy rays. Monomer (a2): A monomer having a fluorine atom and / or a silicon atom. When forming a partition using the photosensitive resin composition of the present invention, when an active energy ray is irradiated onto the coating film coated with the photosensitive resin composition, radicals are generated from the active groups of the copolymer (A), and a polymerization reaction proceeds with the photopolymerizable compound (D) starting from the generated radicals. As a result, the copolymer (A) is likely to be immobilized near the surface of the coating film. Consequently, even after the process of developing the coating film after exposure, the liquid-repellent properties of the upper surface of the partition can be maintained. Therefore, when applying ink to an area surrounded by the partition, for example, to a pixel area, using an inkjet method, it is possible to suppress the occurrence of color mixing between adjacent pixel areas.

[0021] [Monomer (a1)] Monomer (a1) is a monomer that has an active group (hereinafter also simply referred to as "active group") that generates radicals upon irradiation with active energy rays. In addition to the active group, monomer (a1) further has radical polymerizable groups that allow each monomer to copolymerize.

[0022] The active group of monomer (a1) can be any structure that generates radicals upon irradiation with active energy rays (a structure that has photopolymerization initiation properties). Various known structures can be used as the photopolymerization initiation properties, such as hydrogen abstraction type, electron transfer type, and intramolecular cleavage type. Examples of active groups include benzophenone groups, acetophenone groups, benzoin groups, α-hydroxyketone groups (for example, the group obtained by removing one hydrogen atom from the "hydroxyl group in 2-hydroxyethoxy" of 1-[4-(2-hydroxyethoxy)-phenyl]-2-hydroxy-2-methyl-1-propanone), α-aminoketone groups, α-diketone groups, α-diketone dialkylacetal groups, anthraquinone groups, thioxanthone groups, and phosphine oxide groups. Benzophenone groups, acetophenone groups, α-hydroxyketone groups, α-aminoketone groups, α-diketone groups, and α-diketone dialkylacetal groups are preferred in terms of high radical generation efficiency, benzophenone groups, acetophenone groups, and α-hydroxyketone groups are more preferred, and α-hydroxyketone groups are particularly preferred.

[0023] Examples of radical polymerizable groups in monomer (a1) include functional groups containing radical polymerizable unsaturated bonds (such as carbon-carbon double bonds), such as (meth)acryloyl groups and vinyl groups.

[0024] As monomer (a1), (meth)acrylic acid esters having active groups are preferred from the viewpoint of ease of synthesis of the (A) copolymer and ease of adjusting the amount of active groups introduced. Examples of monomer (a1) include 4-methacryloyloxybenzophenone and 2-[4-(2-hydroxy-2-methyl-1-oxopropyl)phenoxy]ethyl methacrylate, with 2-[4-(2-hydroxy-2-methyl-1-oxopropyl)phenoxy]ethyl methacrylate being preferred. Monomer (a1) may be used alone or in combination of two or more types.

[0025] [Monomer (a2)] Monomer (a2) is a monomer having a fluorine atom and / or a silicon atom. In addition to the fluorine atom and / or silicon atom, monomer (a2) further has radical polymerizable groups for copolymerization of each monomer. The radical polymerizable groups of monomer (a2) are the same as those of monomer (a1).

[0026] The units based on monomer (a2) impart at least one of water-repellent and oil-repellent properties to the cured product, contributing to the liquid-repellent properties of the cured product. If the copolymer (A) has units based on monomer (a2), when it forms a coating film of the photosensitive resin composition, the copolymer (A) tends to segregate to the surface side of the coating film. When the copolymer (A) segregates to the surface side of the coating film, the concentration of units based on monomer (a2) on the surface side of the coating film increases, and liquid repellency can be efficiently imparted to the surface of the cured product.

[0027] (A) The copolymer segregates to the surface side of the coating film, increasing the concentration of active groups on the surface side of the coating film. When irradiated with active energy rays, radicals are generated from the active groups of (A) copolymer, and a polymerization reaction proceeds with (D) the photopolymerizable compound, starting from the generated radicals. Therefore, it is thought that (A) copolymer is easily immobilized near the surface of the coating film. As a result, the liquid-repellent properties of the upper surface of the partition can be maintained even after the development process of the coating film after exposure. For this reason, it is thought that when applying ink to a region surrounded by partitions, such as the pixel area, using the inkjet method, the occurrence of color mixing between adjacent pixel areas can be suppressed. The degree of curing of the coating film can be adjusted by the amount of radical polymerizable groups and active groups in the photosensitive resin composition, i.e., the amounts of (A) copolymer and (C) photopolymerization initiator, as well as the amount of exposure during plate making.

[0028] From the viewpoint of liquid repellency, monomer (a2) is preferably composed of a fluorine atom. While its structure is not particularly limited as long as it contains a fluorine atom, it is preferable to include one or more monomers selected from, for example, monomers having a fluoroalkyl group and monomers having a fluoroalkylene group. Monomers having a fluoroalkyl group are more preferable because they produce fewer volatile components upon thermal decomposition and are less likely to form gels during synthesis.

[0029] The fluoroalkyl group in monomer (a2) preferably has a structure represented by the following general formula (1). -CFXR f ...Equation (1) (In formula (1), X is a hydrogen atom, a fluorine atom, or a trifluoromethyl group, and R f (This may contain an etheric oxygen atom, a fluoroalkyl group having 1 to 20 carbon atoms, or a fluorine atom.)

[0030] R in equation (1) f The carbon number is 1 or more, preferably 2 or more, more preferably 3 or more, even more preferably 5 or more, and also 20 or less, preferably 10 or less, and even more preferably 6 or less. Setting it above the lower limit tends to result in liquid repellency. Setting it below the upper limit tends to improve compatibility with other components constituting the photosensitive resin composition. The upper and lower limits can be arbitrarily combined; for example, 1 to 20 is preferred, 2 to 20 is more preferred, 3 to 10 is even more preferred, and 5 to 6 is particularly preferred.

[0031] Examples of compounds having a fluoroalkyl group and a radical polymerizable group include (meth)acrylic acid esters having a fluoroalkyl group, and among (meth)acrylic acid esters having a fluoroalkyl group, (meth)acrylic acid esters having a perfluoroalkyl group are more preferred.

[0032] Examples of (meth)acrylic acid esters containing fluoroalkyl groups include 2,2,2-trifluoroethyl acrylate (Osaka Organic Chemical Industry Co., Ltd., Viscoat 3F), 2,2,3,3-tetrafluoropropyl acrylate (Osaka Organic Chemical Industry Co., Ltd., Viscoat 4F), 1H,1H,5H-octafluoropentyl acrylate (Osaka Organic Chemical Industry Co., Ltd., Viscoat 8F), 1H,1H,5H-octafluoropentyl methacrylate (Osaka Organic Chemical Industry Co., Ltd., Viscoat 8FM), 1H,1H,2H,2H-tridecafluorooctyl acrylate (Osaka Organic Chemical Industry Co., Ltd., Viscoat 13F), 1H,1H,2H,2H-nonafluorohexyl acrylate (Unimatec Co., Ltd., CHEMINOX FAAC-4), and 1H,1H,2H,2H-nonafluorohexyl methacrylate (Unimatec Co., Ltd., CHEMINOX Examples include FAMAC-4) and 1H,1H,2H,2H-tridecafluorooctyl methacrylate (manufactured by Unimatec, CHEMINOX FAMAC-6).

[0033] The fluoroalkylene group in monomer (a2) is not particularly limited, but examples include -CF2-O-, -(CF2)2-O-, -(CF2)3-O-, -CF2-C(CF3)O-, -C(CF3)-CF2-O-, and divalent groups having repeating units of these. Of these, having a fluoroalkylene ether chain is preferable from the viewpoint of compatibility. Examples of compounds having a fluoroalkylene group and a radical polymerizable group include the following monomers.

[0034] [ka]

[0035] In the above formula, PFPE represents a perfluoroalkylene polyether chain. Monomer (a2) may be used alone or in combination of two or more types.

[0036] [Monomer (a3)] (A) The copolymer may further contain monomer (a3) ​​having a hydrogen-donating functional group as a constituent monomer. In addition to the hydrogen-donating functional group, monomer (a3) ​​further has radical polymerizable groups for copolymerization of each monomer. The radical polymerizable groups of monomer (a3) ​​are the same as those of monomer (a1). In particular, if monomer (a1) has a hydrogen abstraction type active group, it is preferable to include units based on monomer (a3). If the copolymer (A) has units based on monomer (a3), it is possible to suppress polymerization inhibition by oxygen from the surface of the photosensitive resin composition coating, which tends to allow for effective curing of the coating and facilitate the development of liquid repellency. Examples of hydrogen-donating functional groups include hydroxyl groups, amino groups, mercapto groups, and amide groups. From the viewpoint of efficiently advancing the curing reaction and having high reactivity with oxygen radicals, hydroxyl groups, amino groups, and amide groups are preferred.

[0037] As monomer (a3), (meth)acrylic acid esters and (meth)acrylamides having hydrogen-donating functional groups are preferred from the viewpoint of ease of compound synthesis and ease of adjusting the amount of hydrogen-donating functional group introduced.

[0038] Examples of monomers (a3) ​​include hydroxyl group-containing monomers such as 2-hydroxyethyl (meth)acrylate, 3-hydroxypropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, 6-hydroxyhexyl (meth)acrylate, 8-hydroxyoctyl (meth)acrylate, 10-hydroxydecyl (meth)acrylate, 12-hydroxylauryl (meth)acrylate, monobutyl hydrochlor fumarate, monobutyl hydroxyitaconate; N,N-dimethyl (meth)acrylamide, N,N-diethyl (meth)acrylamide, N-vinylcaprolactam, N-vinylpyrrolidone, N-isopropyl (meth)acrylamide Examples of monomers containing amino or amide groups include mid, N,N-dimethylaminoethyl (meth)acrylate, 2-[(butylamino)carbonyl]oxy]ethyl (meth)acrylate, N,N-dimethylaminopropyl (meth)acrylamide, N,N-diethylaminopropyl (meth)acrylamide, N,N-diethylaminoethyl (meth)acrylate, N,N-dimethylaminopropyl (meth)acrylate, N,N-diethylaminopropyl (meth)acrylate, N,N-dimethylaminoethyl (meth)acrylamide, N,N-diethylaminoethyl (meth)acrylamide, (meth)acryloylmorpholine, vinylacetamide, etc. In terms of excellent curing acceleration effect when used in combination with an active group, 2-hydroxyethyl (meth)acrylate, 3-hydroxypropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, (N,N-dimethylacrylamide, N,N-dimethylaminoethyl (meth)acrylate, and N,N-diethylaminoethyl (meth)acrylate are preferred. N,N-diethylaminoethyl (meth)acrylate is more preferred from the viewpoint that it can suppress polymerization inhibition by oxygen, effectively cure, and facilitate the development of liquid repellency. Monomer (a3) ​​may be used alone or in combination of two or more types.

[0039] [Monomer (a4)] (A) copolymer may further contain monomer (a4) having an alkyl group with 4 or more carbon atoms as a constituent monomer, from the viewpoint of more effectively segregating the copolymer (A) copolymer onto the surface of the coating film. Monomer (a4) has an alkyl group with 4 or more carbon atoms, as well as radical polymerizable groups for copolymerization of each monomer. The radical polymerizable groups of monomer (a4) are the same as those of monomer (a1).

[0040] The alkyl group having 4 or more carbon atoms may be linear, branched, or cyclic. The cyclic alkyl group may be monocyclic or polycyclic. (A) From the viewpoint of more effectively segregating the copolymer onto the surface of the coating film, the alkyl group is preferably linear. The number of carbon atoms in the alkyl group having 4 or more carbon atoms is preferably 4 to 30, more preferably 6 to 20, and even more preferably 6 to 18, from the viewpoint of more effectively segregating the (A) copolymer on the surface of the coating film.

[0041] Examples of monomers (a4) include compounds having an alkyl group with 4 or more carbon atoms and a radical polymerizable group. From the viewpoint of ease of compound synthesis and ease of adjusting the amount of alkyl group with 4 or more carbon atoms introduced, alkyl (meth)acrylate esters having an alkyl group with 4 or more carbon atoms are preferred. Examples of monomers (a4) include butyl (meth)acrylate, pentyl (meth)acrylate, hexyl (meth)acrylate, cyclohexyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, octyl (meth)acrylate, isooctyl (meth)acrylate, decyl (meth)acrylate, nonyl (meth)acrylate, isononyl (meth)acrylate, decyl (meth)acrylate, isodecyl (meth)acrylate, dodecyl (meth)acrylate, myristyl ( Examples include meth)acrylate, cetyl(meth)acrylate, stearyl(meth)acrylate, isostearyl(meth)acrylate, tridecyl(meth)acrylate, dicyclopentenyloxyethyl(meth)acrylate, tricyclodecane(meth)acrylate, dicyclopentanyl(meth)acrylate, isobornyl(meth)acrylate, and adamantyl(meth)acrylate, and it is preferable to include alkyl (meth)acrylate esters having a linear alkyl group with 4 or more carbon atoms. As alkyl (meth)acrylate esters having a linear alkyl group with 4 or more carbon atoms, for example, considering ease of production, 2-ethylhexyl(meth)acrylate, octyl(meth)acrylate, dodecyl(meth)acrylate, and stearyl(meth)acrylate are more preferred, and stearyl(meth)acrylate is particularly preferred. Monomer (a4) may be used alone or in combination of two or more types.

[0042] (A) The copolymer may optionally further have units based on other monomers other than monomer (a1), monomer (a2), monomer (a3), and monomer (a4) as constituent monomers. Examples of other monomers include compounds that have a radical polymerizable group and do not have an active group, an alkyl group having 4 or more carbon atoms, a fluorine atom, and a hydrogen-donating functional group. Other monomers include, for example, carboxyl group-containing monomers and their salts such as acrylic acid, methacrylic acid, crotonic acid, itaconic acid, fumaric acid, maleic acid, and citraconic acid; (meth)acrylates such as methyl (meth)acrylate, ethyl (meth)acrylate, and propyl (meth)acrylate; nitrogen-containing monomers such as (meth)acrylonitrile; styrene compounds such as styrene, α-methylstyrene, divinylbenzene, and vinyltoluene; vinyl esters such as vinyl propionate and vinyl acetate; phosphorus-containing vinyl monomers; vinyl halides such as vinyl chloride and pyridene chloride; and conjugated dienes such as butadiene.

[0043] The active group may be located at the end of the main chain of the copolymer (A), or it may be located within the units based on the monomers that make up the copolymer (A). (A) The copolymer preferably has multiple active groups in its molecule. This tends to increase the concentration of active groups near the surface of the coating film. (A) The content of active groups per gram of copolymer is preferably 0.1 mmol / g or more, more preferably 0.5 mmol / g or more, even more preferably 0.8 mmol / g or more, and also preferably 2.5 mmol / g or less, and more preferably 2.0 mmol / g or less. When the content of active groups is above the lower limit of the above range, the curability tends to be better and high liquid repellency can be exhibited. Also, when it is below the upper limit, the storage stability of the photosensitive resin composition tends to be better. The upper and lower limits can be arbitrarily combined, for example, 0.1 to 2.5 mmol / g is preferred, 0.5 to 2.5 mmol / g is more preferred, and 0.8 to 2.0 mmol / g is even more preferred.

[0044] (A) The ratio of units based on monomer (a1) to the total mass of all units constituting the copolymer is preferably 1% by mass or more, more preferably 10% by mass or more, even more preferably 20% by mass or more, particularly preferably 30% by mass or more, and also preferably 99% by mass or less, more preferably 90% by mass or less, even more preferably 80% by mass or less, even more preferably 70% by mass or less, and particularly preferably 60% by mass or less. The upper and lower limits can be combined arbitrarily, for example, 1 to 99% by mass is preferred, 10 to 90% by mass is more preferred, 20 to 80% by mass is even more preferred, 30 to 70% by mass is even more preferred, and 30 to 60% by mass is particularly preferred. When the ratio of units based on monomer (a1) is above the lower limit of the above range, the curability tends to be better and high liquid repellency can be exhibited. When it is below the upper limit, the storage stability of the photosensitive resin composition tends to be better.

[0045] The ratio of units based on monomer (a2) to the total mass of all units constituting the copolymer (A) is, for example, 1% by mass or more, preferably 5% by mass or more, more preferably 10% by mass or more, even more preferably 15% by mass or more, even more preferably 20% by mass or more, and particularly preferably 25% by mass. Also, it is preferably 70% by mass or less, more preferably 60% by mass or less, and even more preferably 50% by mass or less. The upper and lower limits can be combined arbitrarily, for example, 1 to 70% by mass is preferred, 5 to 60% by mass is more preferred, 10 to 50% by mass is even more preferred, 15 to 50% by mass is even more preferred, 20 to 50% by mass is particularly preferred, and 25 to 50% by mass is extremely preferred. When the ratio of units based on monomer (a2) is above the lower limit of the above range, it tends to exhibit more effective liquid repellency. When it is below the upper limit, it tends to have better compatibility between the copolymer (A) and the photopolymerizable compound (D).

[0046] The ratio of units based on monomer (a2) to units based on monomer (a1) is preferably 10% by mass, more preferably 30% by mass or more, and even more preferably 50% by mass, based on 100% by mass of units based on monomer (a1). The above is true, with a particularly preferred amount of 70% by mass. Furthermore, it is preferably 500% by mass or less, more preferably 300% by mass or less, and even more preferably 100% by mass or less. For example, 10 to 500% by mass is preferred, 30 to 300% by mass is more preferred, 50 to 100% by mass is even more preferred, and 70 to 100% by mass is even more preferred. When the ratio of units based on monomer (a2) to units based on monomer (a1) is above the lower limit of the above range, high liquid repellency tends to be achieved. When it is below the upper limit, liquid repellency tends to be achieved even with low UV irradiation. Furthermore, the compatibility between the (A) copolymer and the (D) photopolymerizable compound tends to be superior.

[0047] When copolymer (A) contains monomer (a3) ​​as a constituent monomer, the ratio of units based on monomer (a3) ​​to the total mass of all units constituting copolymer (A) is preferably 1% by mass or more, more preferably 3% by mass or more, and even more preferably 5% by mass or more. Also preferably 80% by mass or less, more preferably 60% by mass or less, even more preferably 50% by mass or less, and particularly preferably 40% by mass or less. The upper and lower limits can be combined arbitrarily, for example, 1 to 80% by mass is preferred, 1 to 60% by mass is more preferred, 3 to 50% by mass is even more preferred, and 5 to 40% by mass is particularly preferred. When the ratio of units based on monomer (a3) ​​is within the above range, it tends to exhibit more effective liquid repellency.

[0048] When copolymer (A) contains monomer (a4) as a constituent monomer, the ratio of units based on monomer (a4) to the total mass of all units constituting copolymer (A) is preferably 1% by mass or more, more preferably 5% by mass or more, even more preferably 10% by mass or more, even more preferably 20% by mass or more, and particularly preferably 25% by mass or more. Also preferably 80% by mass or less, more preferably 70% by mass or less, even more preferably 60% by mass or less, and particularly preferably 50% by mass or less. The upper and lower limits can be arbitrarily combined, for example, 1 to 80% by mass is preferred, 5 to 70% by mass is more preferred, 10 to 60% by mass is even more preferred, 20 to 50% by mass is even more preferred, and 25 to 50% by mass is particularly preferred. When the ratio of units based on monomer (a4) is within the above range, it tends to exhibit more effective liquid repellency.

[0049] (A) The fluorine atom content in the copolymer is preferably 5% by mass or more, more preferably 10% by mass or more, even more preferably 12% by mass or more, even more preferably 15% by mass or more, and particularly preferably 18% by mass or more. Also, it is preferably 40% by mass or less, more preferably 35% by mass or less, and even more preferably 30% by mass or less. The upper and lower limits can be combined arbitrarily, for example, 5 to 40% by mass is preferred, 10 to 35% by mass is more preferred, 12 to 35% by mass is even more preferred, 15 to 30% by mass is even more preferred, and 18 to 30% by mass is particularly preferred. (A) When the fluorine atom content in the copolymer is above the lower limit of the above range, the liquid repellency of the upper surface of the partition wall tends to be high. Also, when it is below the upper limit of the above range, the compatibility with other materials tends to be good.

[0050] (A) The weight-average molecular weight (Mw) of the copolymer is preferably 1000 or more, more preferably 10000 or more, even more preferably 50000 or more, and even more preferably 100000 or more. It is also preferably 500000 or less, more preferably 300000 or less, and even more preferably 200000 or less. The upper and lower limits can be combined arbitrarily, for example, 1000 to 500000 is preferred, 10000 to 300000 is more preferred, 50000 to 200000 is even more preferred, and 100000 to 200000 is particularly preferred. When Mw is above the lower limit of the above range, it tends to exhibit more effective liquid repellency. When it is below the upper limit, the coatability of the photosensitive resin composition tends to be better.

[0051] (A) The Mw of the copolymer is a value equivalent to standard polystyrene, measured by gel permeation chromatography (GPC). The detailed measurement conditions are as described in the examples below.

[0052] The glass transition temperature (Tg) of the copolymer (A) is preferably -30°C or higher, more preferably 0°C or higher, even more preferably 25°C or higher, and also preferably 180°C or lower, more preferably 150°C or lower, and even more preferably 100°C or lower. The upper and lower limits can be combined arbitrarily; for example, -30 to 180°C is preferred, 0 to 150°C is more preferred, and 25 to 100°C is even more preferred. When Tg is above the lower limit of the above range, it tends to exhibit more effective liquid repellency. When Tg is below the upper limit, it tends to have better compatibility between the copolymer (A) and the photopolymerizable compound (D).

[0053] (A) The copolymer is obtained, for example, by polymerizing a monomer component comprising monomer (a1) and monomer (a2). The monomer component may further optionally contain one or more of monomer (a3), monomer (a4), and other monomers.

[0054] Polymerization of monomer components is typically carried out in the presence of a polymerization initiator. A chain transfer agent may also be used during polymerization, if necessary. Known polymerization methods include solution polymerization, suspension polymerization, bulk polymerization, and emulsion polymerization. Among these, solution polymerization is preferred because it is easy to operate and highly productive.

[0055] The content of copolymer (A) in the photosensitive resin composition of the present invention is not particularly limited, but is preferably 0.01% by mass or more, more preferably 0.05% by mass or more, even more preferably 0.1% by mass or more, and even more preferably 0.25% by mass or more, in the total solid content of the photosensitive resin composition, and also preferably 30% by mass or less, more preferably 20% by mass or less, even more preferably 10% by mass or less, and even more preferably 5% by mass or less. The upper and lower limits can be arbitrarily combined, for example, 0.01 to 30% by mass is preferred, 0.05 to 20% by mass is more preferred, 0.1 to 10% by mass is even more preferred, and 0.25 to 5% by mass is particularly preferred. Setting it above the lower limit tends to improve ink repellency. Setting it below the upper limit tends to improve compatibility with other components.

[0056] [1-1-2] (B) Component; alkali-soluble resin The photosensitive resin composition of the present invention contains (B) an alkali-soluble resin. The alkali-soluble resin is not particularly limited as long as it is a resin that can be developed with an alkaline developer. In the present invention, (B) the alkali-soluble resin is a component separate from (A) the copolymer, and if there is an alkali-soluble resin that corresponds to (A) the copolymer, it is treated as (A) the copolymer. Examples of alkali-soluble resins include various resins containing carboxyl groups and / or hydroxyl groups. Among these, resins having carboxyl groups are preferred from the viewpoint of obtaining partitions with an appropriate taper angle, suppressing the outflow of the liquid repellent due to thermal melting of the partition surface during post-baking, and maintaining ink repellency.

[0057] [Alkali-soluble resin having an ethylenic double bond (b)] In the photosensitive resin composition of the present invention, it is preferable that (B) the alkali-soluble resin contains an alkali-soluble resin (b) having an ethylenically double bond (hereinafter sometimes abbreviated as "alkali-soluble resin (b)"). Including an alkali-soluble resin (b) having an ethylenically double bond tends to increase sensitivity and improve the ink-repellent properties of the partition obtained by suppressing the outflow of the liquid repellent during development.

[0058] The specific structure of the alkali-soluble resin (b) having an ethylenic double bond is not particularly limited, but from the viewpoint of developability, epoxy (meth)acrylate resin (b1) and / or acrylic copolymer resin (b2) are preferred, and from the viewpoint of reducing outgassing, epoxy (meth)acrylate resin (b1) is more preferred.

[0059] [Epoxy (meth)acrylate resin (b1)] Epoxy (meth)acrylate resin (b1) is a resin obtained by adding an acid or ester compound having an ethylenically unsaturated bond (ethylenically double bond) to an epoxy resin, and then adding a polybasic acid or its anhydride. For example, an ethylenically unsaturated bond is added to the epoxy group of an epoxy resin via ring-opening addition of the carboxyl group of an acid having an ethylenically unsaturated bond, thereby adding an ethylenically unsaturated bond to the epoxy resin via an ester bond (-COO-), and at the same time, one of the carboxyl groups of a polybasic acid anhydride is added to the resulting hydroxyl group. Another example is when a polyhydric alcohol is added simultaneously when adding the polybasic acid anhydride. Furthermore, resins obtained by reacting the carboxyl group of the resin obtained in the above reaction with a compound having a further reactive functional group are also included in epoxy (meth)acrylate resin (b1). Thus, epoxy (meth)acrylate resins do not substantially contain epoxy groups in terms of their chemical structure and are not limited to "(meth)acrylate," but since epoxy compounds (epoxy resins) are used as raw materials and "(meth)acrylate" is a representative example, they are named in this way according to convention. Furthermore, from the viewpoint of patternability, epoxy (meth)acrylate resins (b1) having aromatic rings in the main chain can be more preferably used.

[0060] Here, the term epoxy resin includes the raw material compounds before the resin is formed by thermal curing, and the epoxy resin can be appropriately selected from known epoxy resins. Furthermore, the epoxy resin can be a compound obtained by reacting a phenolic compound with an epihalohydrin. The phenolic compound is preferably a compound having two or more phenolic hydroxyl groups, and may be a monomer or a polymer. Specifically, examples include bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, phenol novolac epoxy resin, cresol novolac epoxy resin, biphenyl novolac epoxy resin, trisphenol epoxy resin, epoxidized polymers of phenol and dicyclopentadiene, dihydrooxylfluorene type epoxy resin, dihydrooxylalkylene oxylfluorene type epoxy resin, diglycidyl ether of 9,9-bis(4'-hydroxyphenyl)fluorene, and diglycidyl ether of 1,1-bis(4'-hydroxyphenyl)adamantane, and those having aromatic rings in the main chain can be preferably used.

[0061] In particular, from the viewpoint of cured film strength, bisphenol A type epoxy resin, phenol novolac epoxy resin, cresol novolac epoxy resin, epoxidized polymers of phenol and dicyclopentadiene, and epoxidized polymers of 9,9-bis(4'-hydroxyphenyl)fluorene are preferred, with bisphenol A type epoxy resin being even more preferred.

[0062] Examples of acids having an ethylenically unsaturated bond include (meth)acrylic acid, crotonic acid, maleic acid, fumaric acid, citraconic acid, pentaerythritol tri(meth)acrylate succinic anhydride adduct, pentaerythritol tri(meth)acrylate tetrahydrophthalic anhydride adduct, dipentaerythritol penta(meth)acrylate succinic anhydride adduct, dipentaerythritol penta(meth)acrylate phthalic anhydride adduct, dipentaerythritol penta(meth)acrylate tetrahydrophthalic anhydride adduct, and reaction products of (meth)acrylic acid and ε-caprolactone. Among these, (meth)acrylic acid is preferred from the viewpoint of sensitivity.

[0063] Examples of polybasic acids (anhydrides) include succinic acid, maleic acid, itaconic acid, phthalic acid, tetrahydrophthalic acid, 3-methyltetrahydrophthalic acid, 4-methyltetrahydrophthalic acid, 3-ethyltetrahydrophthalic acid, 4-ethyltetrahydrophthalic acid, hexahydrophthalic acid, 3-methylhexahydrophthalic acid, 4-methylhexahydrophthalic acid, 3-ethylhexahydrophthalic acid, 4-ethylhexahydrophthalic acid, trimellitic acid, pyromellitic acid, benzophenonetetracarboxylic acid, biphenyltetracarboxylic acid, and their anhydrides. These may be used individually or in combination of two or more. Among these, succinic anhydride, maleic anhydride, and itaconic anhydride are preferred from the viewpoint of reducing pixel residue after development, with succinic anhydride being more preferred.

[0064] By using polyhydric alcohols, the molecular weight of epoxy (meth)acrylate resin (b1) can be increased, allowing for the introduction of branching within the molecule and a tendency to balance molecular weight and viscosity. Furthermore, the rate of introduction of acidic groups into the molecule can be increased, which tends to balance sensitivity and adhesion. Examples of polyhydric alcohols include trimethylolpropane, ditrimethylolpropane, pentaerythritol, dipentaerythritol, trimethylolethane, and 1,2,3-propanetriol. These may be used individually or in combination of two or more.

[0065] The acid value of the epoxy (meth)acrylate resin (b1) is not particularly limited, but is preferably 10 mg KOH / g or more, more preferably 20 mg KOH / g or more, even more preferably 40 mg KOH / g or more, even more preferably 60 mg KOH / g or more, and also preferably 200 mg KOH / g or less, more preferably 180 mg KOH / g or less, even more preferably 150 mg KOH / g or less, even more preferably 120 mg KOH / g or less, and particularly preferably 100 mg KOH / g or less. The upper and lower limits can be arbitrarily combined, for example, 10 to 200 mg KOH / g is preferred, 10 to 180 mg KOH / g is more preferred, 20 to 150 mg KOH / g is even more preferred, even more preferably 40 to 120 mg KOH / g, and particularly preferably 60 to 100 mg KOH / g. Setting it above the lower limit makes it easier to reduce residue. Furthermore, setting the value below the aforementioned upper limit tends to reduce outgassing during element emission.

[0066] The weight-average molecular weight (Mw) of the epoxy (meth)acrylate resin (b1) is not particularly limited, but is preferably 1000 or more, more preferably 2000 or more, even more preferably 3000 or more, even more preferably 4000 or more, especially preferably 5000 or more, particularly preferably 6000 or more, most preferably 7000 or more, and also preferably 30000 or less, more preferably 20000 or less, even more preferably 15000 or less, and particularly preferably 10000 or less. The upper and lower limits can be arbitrarily combined, with 1000 to 30000 being preferred, 2000 to 30000 being more preferred, 3000 to 20000 being even more preferred, 4000 to 20000 being even more preferred, 5000 to 15000 being particularly preferred, 6000 to 15000 being particularly preferred, and 7000 to 10000 being most preferred. Setting it above the lower limit tends to reduce outgassing during device emission. Furthermore, setting the value below the aforementioned upper limit tends to reduce residue.

[0067] (B) When the alkali-soluble resin contains epoxy (meth)acrylate resin (b1), the content of epoxy (meth)acrylate resin (b1) in (B) the alkali-soluble resin is not particularly limited, but is preferably 30% by mass or more, more preferably 50% by mass or more, even more preferably 70% by mass or more, even more preferably 80% by mass or more, particularly preferably 90% by mass or more, and usually 100% by mass or less. The upper and lower limits can be arbitrarily combined, for example, 30 to 100% by mass is preferred, 50 to 100% by mass is more preferred, 70 to 100% by mass is even more preferred, 80 to 100% by mass is even more preferred, and 90 to 100% by mass is particularly preferred. Setting the value above the lower limit tends to reduce outgassing.

[0068] The epoxy (meth)acrylate resin (b1) can be synthesized by conventionally known methods. Specifically, the epoxy resin can be dissolved in an organic solvent, and in the presence of a catalyst and a thermal polymerization inhibitor, an acid or ester compound having an ethylenically unsaturated bond can be added to carry out an addition reaction, and then a polybasic acid or its anhydride can be added to continue the reaction.

[0069] Examples of organic solvents include methyl ethyl ketone, cyclohexanone, diethylene glycol ethyl ether acetate, and propylene glycol monomethyl ether acetate. Examples of catalysts include tertiary amines such as triethylamine, benzyldimethylamine, and tripenzylamine; quaternary ammonium salts such as tetramethylammonium chloride, methyltriethylammonium chloride, tetraethylammonium chloride, tetrabutylammonium chloride, and trimethylbenzylammonium chloride; phosphorus compounds such as triphenylphosphine; and stibins such as triphenylstibin. Examples of thermal polymerization inhibitors include hydroquinone, hydroquinone monomethyl ether, and methylhydroquinone. These may be used individually or in combination of two or more types.

[0070] The acid or ester compound having an ethylenically unsaturated bond can be used in an amount that is preferably 0.7 to 1.3 chemical equivalents, more preferably 0.9 to 1.1 chemical equivalents, per 1 chemical equivalent of the epoxy group of the epoxy resin. The temperature during the addition reaction is preferably 60 to 150°C, more preferably 80 to 120°C. The polybasic acid (anhydride) can be used in an amount that is preferably 0.1 to 1.2 chemical equivalents, more preferably 0.2 to 1.1 chemical equivalents, per 1 chemical equivalent of the hydroxyl group produced in the addition reaction.

[0071] From the perspective of outgassing during device emission, the epoxy (meth)acrylate resin (b1) preferably contains at least one selected from the group consisting of an epoxy (meth)acrylate resin (b1-1) containing a partial structure represented by the following general formula (i) (hereinafter, may be referred to as "epoxy (meth)acrylate resin (b1-1)"), an epoxy (meth)acrylate resin (b1-2) containing a partial structure represented by the following general formula (ii) (hereinafter, may be referred to as "epoxy (meth)acrylate resin (b1-2)"), and an epoxy (meth)acrylate resin (b1-3) containing a partial structure represented by the following general formula (iii) (hereinafter, may be referred to as "epoxy (meth)acrylate resin (b1-3)").

[0072] Among these, from the perspective of reducing outgassing during device emission, the epoxy (meth)acrylate resin (b1) preferably contains an epoxy (meth)acrylate resin (b1-1) containing a partial structure represented by the following general formula (i), and more preferably, it is an epoxy (meth)acrylate resin (b1-1) containing a partial structure represented by the following general formula (i). One of the reasons is presumably that it has a rigid main skeleton and is difficult to decompose with heat.

[0073] [Chemical formula]

[0074] In formula (i), R a represents a hydrogen atom or a methyl group, and R b represents a divalent hydrocarbon group that may have a substituent. The benzene ring in formula (i) may be further substituted with any substituent. * represents a bond.

[0075] (R b ) In formula (i), R b represents a divalent hydrocarbon group that may have a substituent. Examples of divalent hydrocarbon groups include divalent aliphatic groups, divalent aromatic ring groups, and groups formed by linking one or more divalent aliphatic groups with one or more divalent aromatic ring groups.

[0076] Divalent aliphatic groups include linear, branched, and cyclic aliphatic groups. Of these, linear aliphatic groups are preferred from the viewpoint of developability, while cyclic aliphatic groups are preferred from the viewpoint of reducing the penetration of developer into the exposed area. The number of carbon atoms is usually 1 or more, preferably 3 or more, more preferably 6 or more, preferably 20 or less, more preferably 15 or less, and still preferably 10 or less. The upper and lower limits can be arbitrarily combined; for example, 1 to 20 is preferred, 3 to 15 is more preferred, and 6 to 10 is still preferred. Setting the value above the lower limit tends to improve developability. Also, setting the value below the upper limit tends to reduce residue.

[0077] Examples of divalent linear aliphatic groups include methylene, ethylene, n-propylene, n-butylene, n-hexylene, and n-heptylene groups. Among these, methylene is preferred from the viewpoint of reducing residue. Examples of divalent branched aliphatic groups include structures in which a divalent linear aliphatic group has a methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, sec-butyl group, or tert-butyl group as a side chain. The number of rings in a divalent cyclic aliphatic group is not particularly limited, but is usually 1 or more, preferably 2 or more, preferably 10 or less, and more preferably 5 or less. The upper and lower limits can be arbitrarily combined; for example, 1 to 10 is preferred, 1 to 5 is more preferred, and 2 to 5 is even more preferred. Setting the value above the lower limit tends to improve the residual film rate. Also, setting the value below the upper limit tends to reduce the residue. Examples of divalent cyclic aliphatic groups include groups obtained by removing two hydrogen atoms from a cyclohexane ring, cycloheptane ring, cyclodecane ring, cyclododecane ring, norbornane ring, isobornane ring, and adamantane ring. Among these, from the viewpoint of development adhesion, a group obtained by removing two hydrogen atoms from an adamantane ring is preferred.

[0078] Examples of substituents that the divalent aliphatic group may have include alkoxy groups having 1 to 5 carbon atoms, such as methoxy and ethoxy groups; hydroxyl groups; nitro groups; cyano groups; and carboxyl groups. From the viewpoint of ease of synthesis, unsubstituted groups are preferred.

[0079] Examples of divalent aromatic ring groups include divalent aromatic hydrocarbon ring groups and divalent aromatic heterocyclic ring groups. The number of carbon atoms is usually 4 or more, preferably 5 or more, more preferably 6 or more, preferably 20 or less, more preferably 15 or less, and still preferably 10 or less. The upper and lower limits can be arbitrarily combined; for example, 4 to 20 is preferred, 5 to 15 is more preferred, and 6 to 10 is still preferred. Setting the value above the lower limit tends to improve development adhesion. Also, setting the value below the upper limit tends to reduce residue.

[0080] The aromatic hydrocarbon ring in a divalent aromatic hydrocarbon ring group may be a monoring or a fused ring. Examples of divalent aromatic hydrocarbon ring groups include benzene rings, naphthalene rings, anthracene rings, phenanthrene rings, perylene rings, tetracene rings, pyrene rings, benzpyrene rings, chrysene rings, triphenylene rings, acenaphthene rings, fluorantene rings, and fluorene rings, all of which have two free valencies. The aromatic heterocyclic group in a divalent aromatic heterocyclic group may be a monocyclic or a fused ring. Examples of divalent aromatic heterocyclic groups include furan rings, benzofuran rings, thiophene rings, benzothiophene rings, pyrrole rings, pyrazole rings, imidazole rings, oxadiazole rings, indole rings, carbazole rings, pyrroloimidazole rings, pyrrolopyrrole rings, pyrrolopyrrole rings, thienopyrrole rings, thienothiophene rings, phlopyrrole rings, phlofuran rings, thienofuran rings, benzoisoxazole rings, benzoisothiazole rings, benzimidazole rings, pyridine rings, pyrazine rings, pyridazine rings, pyrimidine rings, triazine rings, quinoline rings, isoquinoline rings, cinoline rings, quinoxaline rings, phenanthidine rings, perimidine rings, quinazoline rings, quinazolinone rings, and azulene rings, all of which have two free valencies. Among these, from the viewpoint of photocurability, a benzene ring or naphthalene ring having two free valencies is preferred, and a benzene ring having two free valencies is more preferred.

[0081] Examples of substituents that the divalent aromatic ring group may have include hydroxyl, methyl, methoxy, ethyl, ethoxy, propyl, propoxy, and glycidyl ether groups. Among these, unsubstituted groups are preferred from the viewpoint of curability.

[0082] Examples of groups formed by linking one or more divalent aliphatic groups and one or more divalent aromatic ring groups include groups formed by linking one or more of the aforementioned divalent aliphatic groups and one or more of the aforementioned divalent aromatic ring groups. The number of divalent aliphatic groups is not particularly limited, but is usually 1 or more, preferably 2 or more, preferably 10 or less, more preferably 5 or less, and even more preferably 3 or less. The upper and lower limits can be combined arbitrarily; for example, 1 to 10 is preferred, 1 to 5 is more preferred, and 2 to 3 is even more preferred. Setting the value above the lower limit tends to improve development adhesion. Also, setting the value below the upper limit tends to reduce residue. The number of divalent aromatic ring groups is not particularly limited, but is usually 1 or more, preferably 2 or more, preferably 10 or less, more preferably 5 or less, and even more preferably 3 or less. The upper and lower limits can be combined arbitrarily; for example, 1 to 10 is preferred, 1 to 5 is more preferred, and 2 to 3 is even more preferred. Setting the value above the lower limit tends to improve development adhesion. Also, setting the value below the upper limit tends to reduce residue.

[0083] Examples of groups formed by linking one or more divalent aliphatic groups with one or more divalent aromatic ring groups include the groups represented by the following formulas (iA) to (iF). Among these, the group represented by the following formula (iA) is preferred from the viewpoint of rigidity of the skeleton and hydrophobicity of the membrane. * in the chemical formula represents a bond.

[0084] [ka]

[0085] The benzene ring in formula (i) may be further substituted with any substituent. Examples of substituents on the benzene ring in formula (i) include hydroxyl, methyl, methoxy, ethyl, ethoxy, propyl, and propoxy groups. The number of substituents is not particularly limited and may be one or more, as long as it is chemically permissible. From the viewpoint of curability, no substitution is preferred.

[0086] From the viewpoint of development solubility, the substructure represented by formula (i) is preferably the substructure represented by the following formula (i-1).

[0087] [ka]

[0088] In formula (i-1), R a and R b This is equivalent to equation (i). 1represents a divalent hydrocarbon group having 1 to 4 carbon atoms, which may have substituents. * represents a bond. The benzene ring in formula (i-1) may be further substituted with any substituent.

[0089] (R 1 ) In equation (i-1), R 1 represents a divalent hydrocarbon group having 1 to 4 carbon atoms, which may have substituents. Examples of divalent hydrocarbon groups include alkylene groups and alkenylene groups.

[0090] The alkylene group may be linear or branched, but linear is preferred from the viewpoint of developability and solubility. The number of carbon atoms is not particularly limited, but is usually 1 or more, 2 or more, 4 or less, and more preferably 3 or less. The upper and lower limits can be arbitrarily combined; for example, 1 to 4 is preferred, 1 to 3 is more preferred, and 2 to 3 is even more preferred. Setting the value above the lower limit tends to increase the residual film rate. Also, setting the value below the upper limit tends to reduce the amount of outgassing during device emission.

[0091] Examples of alkylene groups include methylene, ethylene, propylene, and butylene groups. From the viewpoint of reducing outgassing, methylene and ethylene groups are preferred, and ethylene groups are more preferred.

[0092] The alkenylene group may be linear or branched, but it is preferable to be linear from the viewpoint of developability and solubility. The number of carbon atoms is not particularly limited, but is usually 2 or more, preferably 4 or less, and more preferably 3 or less. For example, 2 to 4 is preferred, and 2 to 3 is more preferred. Setting it above the lower limit tends to increase the residual film rate. Also, setting it below the upper limit tends to reduce the amount of outgassing during device emission.

[0093] Examples of alkenylene groups include ethenylene, propenylene, and butyrene, with ethenylene being preferred from the viewpoint of outgassing.

[0094] The substituents that a divalent hydrocarbon group having 1 to 4 carbon atoms may have are not particularly limited, but examples include halogen atoms, alkoxy groups, benzoyl groups, and hydroxyl groups. From the viewpoint of ease of synthesis, unsubstituted groups are preferred.

[0095] Among these, from the perspective of reducing outgassing, R 1 It is preferably a divalent alkylene group having 1 to 4 carbon atoms, more preferably a methylene group or an ethylene group, and even more preferably an ethylene group.

[0096] The substructure represented by formula (i-1) contained in one molecule of epoxy (meth)acrylate resin (b1-1) may be one type or two or more types.

[0097] The number of substructures represented by formula (i) contained in one molecule of epoxy (meth)acrylate resin (b1-1) is not particularly limited, but is preferably 1 or more, more preferably 2 or more, even more preferably 3 or more, and preferably 10 or less, and even more preferably 8 or less. The upper and lower limits can be arbitrarily combined, for example, preferably 1 to 10, more preferably 2 to 10, and even more preferably 3 to 8. Setting the value above the lower limit tends to improve development adhesion. Also, setting the value below the upper limit tends to reduce residue.

[0098] The number of substructures represented by formula (i-1) contained in one molecule of epoxy (meth)acrylate resin (b1-1) is not particularly limited, but is preferably 1 or more, more preferably 2 or more, even more preferably 3 or more, and preferably 10 or less, and even more preferably 8 or less. The upper and lower limits can be arbitrarily combined, for example, 1 to 10 is preferred, 2 to 10 is more preferred, and 3 to 8 is even more preferred. Setting the value above the lower limit tends to improve development adhesion. Also, setting the value below the upper limit tends to reduce residue.

[0099] The following are specific examples of epoxy (meth)acrylate resin (b1-1).

[0100] [ka]

[0101] [ka]

[0102] [ka]

[0103] [ka]

[0104] [ka]

[0105] [ka]

[0106] [ka]

[0107] In another embodiment, the epoxy (meth)acrylate resin (b1) is preferably an epoxy (meth)acrylate resin (b1-2) containing a substructure represented by the following formula (ii) from the viewpoint of development adhesion.

[0108] [ka]

[0109] In formula (ii), R c Each of these independently represents either a hydrogen atom or a methyl group. d * represents a divalent hydrocarbon group having a cyclic hydrocarbon group as a side chain. * represents a bond.

[0110] (R d ) In equation (ii), R d This represents a divalent hydrocarbon group having a cyclic hydrocarbon group as a side chain. Examples of cyclic hydrocarbon groups include aliphatic ring groups and aromatic ring groups.

[0111] The number of rings in the aliphatic ring group is not particularly limited, but is usually 1 or more, preferably 2 or more, preferably 10 or less, more preferably 5 or less, and even more preferably 3 or less. The upper and lower limits can be combined arbitrarily; for example, 1 to 10 is preferred, 1 to 5 is more preferred, and 2 to 3 is even more preferred. Setting the value above the lower limit tends to improve development adhesion. Also, setting the value below the upper limit tends to reduce residue. The aliphatic ring group typically has 4 or more carbon atoms, preferably 6 or more, more preferably 8 or more, preferably 40 or less, more preferably 30 or less, even more preferably 20 or less, and particularly preferably 15 or less. The upper and lower limits can be combined arbitrarily; for example, 4 to 40 is preferred, 4 to 30 is more preferred, 6 to 20 is even more preferred, and 8 to 15 is particularly preferred. Setting the value above the lower limit tends to improve development adhesion. Also, setting the value below the upper limit tends to reduce residue. Examples of aliphatic rings in the aliphatic ring group include cyclohexane rings, cycloheptane rings, cyclodecane rings, cyclododecane rings, norbornane rings, isobornane rings, and adamantane rings. Among these, the adamantane ring is preferred from the viewpoint of development adhesion.

[0112] The number of rings in the aromatic ring group is not particularly limited, but is usually 1 or more, preferably 2 or more, more preferably 3 or more, preferably 10 or less, more preferably 5 or less, and still preferably 4 or less. The upper and lower limits can be combined arbitrarily; for example, 1 to 10 is preferred, 2 to 5 is more preferred, and 3 to 4 is still preferred. Setting the value above the lower limit tends to reduce residue. Also, setting the value below the upper limit tends to improve development adhesion. Examples of aromatic ring groups include aromatic hydrocarbon ring groups and aromatic heterocyclic ring groups. The number of carbon atoms in the aromatic ring group is usually 4 or more, preferably 6 or more, more preferably 8 or more, even more preferably 10 or more, particularly preferably 12 or more, and also preferably 40 or less, more preferably 30 or less, even more preferably 20 or less, and particularly preferably 15 or less. The upper and lower limits can be arbitrarily combined; for example, 4 to 40 is preferred, 6 to 40 is more preferred, 8 to 30 is even preferred, 10 to 20 is even more preferred, and 12 to 15 is particularly preferred. Setting the value above the lower limit tends to reduce residue. Also, setting the value below the upper limit tends to improve development adhesion. Examples of aromatic rings in an aromatic ring group include benzene rings, naphthalene rings, anthracene rings, phenanthrene rings, perylene rings, tetracene rings, pyrene rings, benzpyrene rings, chrysene rings, triphenylene rings, acenaphthene rings, fluorantene rings, and fluorene rings. Among these, fluorene rings are preferred from the viewpoint of patterning properties.

[0113] In a divalent hydrocarbon group having a cyclic hydrocarbon group as a side chain, the divalent hydrocarbon group is not particularly limited, but examples include a divalent aliphatic group, a divalent aromatic ring group, and a group formed by linking one or more divalent aliphatic groups and one or more divalent aromatic ring groups.

[0114] Divalent aliphatic groups include linear, branched, and cyclic aliphatic groups. Of these, linear aliphatic groups are preferred from the viewpoint of developability, while cyclic aliphatic groups are preferred from the viewpoint of reducing the penetration of developer into the exposed area. The number of carbon atoms is usually 1 or more, preferably 3 or more, more preferably 6 or more, preferably 25 or less, more preferably 20 or less, and still preferably 15 or less. The upper and lower limits can be arbitrarily combined; for example, 1 to 25 is preferred, 3 to 20 is more preferred, and 6 to 15 is still preferred. Setting the value above the lower limit tends to improve developability. Also, setting the value below the upper limit tends to reduce residue.

[0115] Examples of divalent linear aliphatic groups include methylene, ethylene, n-propylene, n-butylene, n-hexylene, and n-heptylene groups. Among these, methylene is preferred from the viewpoint of residue. Examples of divalent branched aliphatic groups include structures in which a divalent linear aliphatic group has a methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, sec-butyl group, or tert-butyl group as a side chain. The number of rings in a divalent cyclic aliphatic group is not particularly limited, but is usually 1 or more, preferably 2 or more, preferably 10 or less, more preferably 5 or less, and even more preferably 3 or less. The upper and lower limits can be combined arbitrarily; for example, 1 to 10 is preferred, 1 to 5 is more preferred, and 2 to 3 is even more preferred. Setting the value above the lower limit tends to improve development adhesion. Also, setting the value below the upper limit tends to reduce residue. Examples of divalent cyclic aliphatic groups include cyclohexane rings, cycloheptane rings, cyclodecane rings, cyclododecane rings, norbornane rings, isobornane rings, and adamantane rings with two hydrogen atoms removed. Among these, the adamantane ring with two hydrogen atoms removed is preferred from the viewpoint of development adhesion.

[0116] Examples of substituents that the divalent aliphatic group may have include alkoxy groups having 1 to 5 carbon atoms, such as methoxy and ethoxy groups; hydroxyl groups; nitro groups; cyano groups; and carboxyl groups. From the viewpoint of ease of synthesis, unsubstituted groups are preferred.

[0117] Examples of divalent aromatic ring groups include divalent aromatic hydrocarbon ring groups and divalent aromatic heterocyclic ring groups. The number of carbon atoms is usually 4 or more, preferably 5 or more, more preferably 6 or more, preferably 30 or less, more preferably 20 or less, and even more preferably 15 or less. The upper and lower limits can be arbitrarily combined; for example, 4 to 30 is preferred, 5 to 20 is more preferred, and 6 to 15 is even more preferred. Setting the value above the lower limit tends to improve development adhesion. Conversely, setting the value below the upper limit tends to reduce residue.

[0118] The aromatic hydrocarbon ring in a divalent aromatic hydrocarbon ring group may be a monoring or a fused ring. Examples of divalent aromatic hydrocarbon ring groups include benzene rings, naphthalene rings, anthracene rings, phenanthrene rings, perylene rings, tetracene rings, pyrene rings, benzpyrene rings, chrysene rings, triphenylene rings, acenaphthene rings, fluorantene rings, and fluorene rings, all of which have two free valencies. The aromatic heterocyclic group in a divalent aromatic heterocyclic group may be a monocyclic or a fused ring. Examples of divalent aromatic heterocyclic groups include furan rings, benzofuran rings, thiophene rings, benzothiophene rings, pyrrole rings, pyrazole rings, imidazole rings, oxadiazole rings, indole rings, carbazole rings, pyrroloimidazole rings, pyrrolopyrrole rings, pyrrolopyrrole rings, thienopyrrole rings, thienothiophene rings, phlopyrrole rings, phlofuran rings, thienofuran rings, benzoisoxazole rings, benzoisothiazole rings, benzimidazole rings, pyridine rings, pyrazine rings, pyridazine rings, pyrimidine rings, triazine rings, quinoline rings, isoquinoline rings, cinoline rings, quinoxaline rings, phenanthidine rings, perimidine rings, quinazoline rings, quinazolinone rings, and azulene rings, all of which have two free valencies. Among these, from the viewpoint of photocurability, a benzene ring or naphthalene ring having two free valencies is preferred, and a benzene ring having two free valencies is more preferred.

[0119] Examples of substituents that the divalent aromatic ring group may have include hydroxyl, methyl, methoxy, ethyl, ethoxy, propyl, and propoxy groups. Among these, unsubstituted groups are preferred from the viewpoint of curability.

[0120] Examples of groups formed by linking one or more divalent aliphatic groups and one or more divalent aromatic ring groups include groups formed by linking one or more of the aforementioned divalent aliphatic groups and one or more of the aforementioned divalent aromatic ring groups. The number of divalent aliphatic groups is not particularly limited, but is usually 1 or more, preferably 2 or more, preferably 10 or less, more preferably 5 or less, and even more preferably 3 or less. The upper and lower limits can be combined arbitrarily; for example, 1 to 10 is preferred, 1 to 5 is more preferred, and 2 to 3 is even more preferred. Setting the value above the lower limit tends to improve development adhesion. Also, setting the value below the upper limit tends to reduce residue. The number of divalent aromatic ring groups is not particularly limited, but is usually 1 or more, preferably 2 or more, preferably 10 or less, more preferably 5 or less, and even more preferably 3 or less. The upper and lower limits can be combined arbitrarily; for example, 1 to 10 is preferred, 1 to 5 is more preferred, and 2 to 3 is even more preferred. Setting the value above the lower limit tends to improve development adhesion. Also, setting the value below the upper limit tends to reduce residue.

[0121] Examples of groups formed by linking one or more divalent aliphatic groups with one or more divalent aromatic ring groups include the groups represented by formulas (iA) to (iF). Among these, the group represented by formula (iC) is preferred from the viewpoint of reducing residue.

[0122] The manner in which the cyclic hydrocarbon group forming the side chain is bonded to these divalent hydrocarbon groups is not particularly limited, but examples include a configuration in which one hydrogen atom of the aliphatic group or aromatic ring group is substituted by the side chain, or a configuration in which the cyclic hydrocarbon group forming the side chain includes one of the carbon atoms of the aliphatic group.

[0123] From the viewpoint of development adhesion, the substructure represented by formula (ii) is preferably the substructure represented by the following formula (ii-1).

[0124] [ka]

[0125] In formula (ii-1), R c This is equivalent to equation (ii). α represents a monovalent cyclic hydrocarbon group which may have substituents. n is an integer of 1 or more. The benzene ring in formula (ii-1) may be further substituted with any substituent. * represents a bond.

[0126] (R α ) In equation (ii-1), R α This represents a monovalent cyclic hydrocarbon group which may have substituents. Examples of cyclic hydrocarbon groups include aliphatic ring groups and aromatic ring groups.

[0127] The number of rings in the aliphatic ring group is not particularly limited, but is usually 1 or more, preferably 2 or more, preferably 6 or less, more preferably 4 or less, and even more preferably 3 or less. The upper and lower limits can be combined arbitrarily; for example, 1 to 6 is preferred, 1 to 4 is more preferred, and 2 to 3 is even more preferred. Setting the value above the lower limit tends to improve development adhesion. Also, setting the value below the upper limit tends to reduce residue. Furthermore, the number of carbon atoms in the aliphatic ring group is usually 4 or more, preferably 6 or more, more preferably 8 or more, preferably 40 or less, more preferably 30 or less, even more preferably 20 or less, and particularly preferably 15 or less. The upper and lower limits can be combined arbitrarily; for example, 4 to 40 is preferred, 4 to 30 is more preferred, 6 to 20 is even more preferred, and 8 to 15 is particularly preferred. Setting the value above the lower limit tends to improve development adhesion. Also, setting the value below the upper limit tends to reduce residue. Examples of aliphatic rings in the aliphatic ring group include cyclohexane rings, cycloheptane rings, cyclodecane rings, cyclododecane rings, norbornane rings, isobornane rings, and adamantane rings. Among these, the adamantane ring is preferred from the viewpoint of development adhesion.

[0128] The number of rings in the aromatic ring group is not particularly limited, but is usually 1 or more, preferably 2 or more, more preferably 3 or more, preferably 10 or less, and more preferably 5 or less. The upper and lower limits can be combined arbitrarily; for example, 1 to 10 is preferred, 2 to 10 is more preferred, and 3 to 5 is even more preferred. Setting the value above the lower limit tends to improve development adhesion. Also, setting the value below the upper limit tends to reduce residue. Examples of aromatic ring groups include aromatic hydrocarbon ring groups and aromatic heterocyclic ring groups. The number of carbon atoms in the aromatic ring group is usually 4 or more, preferably 5 or more, more preferably 6 or more, preferably 30 or less, more preferably 20 or less, and still preferably 15 or less. The upper and lower limits can be combined arbitrarily; for example, 4 to 30 is preferred, 5 to 20 is more preferred, and 6 to 15 is still preferred. Setting the value above the lower limit tends to improve development adhesion. Also, setting the value below the upper limit tends to reduce residue. Examples of aromatic rings in an aromatic ring group include benzene rings, naphthalene rings, anthracene rings, phenanthrene rings, and fluorene rings. Among these, fluorene rings are preferred from the viewpoint of development adhesion.

[0129] Examples of substituents that the cyclic hydrocarbon group may have include C1-C5 alkyl groups such as methyl, ethyl, n-propyl, isopropyl, n-butyl, sec-butyl, tert-butyl, amyl, and isoamyl groups; C1-C5 alkoxy groups such as methoxy and ethoxy groups; hydroxyl groups; nitro groups; cyano groups; and carboxyl groups. From the viewpoint of ease of synthesis, unsubstituted groups are preferred.

[0130] n represents an integer greater than or equal to 1, preferably 2 or greater, and preferably 3 or less. For example, 1 to 3 is preferred, and 2 to 3 is more preferred. Setting it above the lower limit tends to improve development adhesion. Also, setting it below the upper limit tends to reduce residue.

[0131] Among these, R α It is preferable that the group is a monovalent aliphatic ring group, and more preferably an adamantyl group.

[0132] As described above, the benzene ring in formula (ii-1) may be further substituted with any substituent. Examples of substituents include hydroxyl, methyl, methoxy, ethyl, ethoxy, propyl, and propoxy groups. The number of substituents is not particularly limited and may be one or two or more. From the viewpoint of curability, unsubstituted is preferred.

[0133] The following are specific examples of substructures represented by equation (ii-1).

[0134] [ka]

[0135] [ka]

[0136] [ka]

[0137] [ka]

[0138] [ka]

[0139] From the viewpoint of development adhesion, the substructure represented by formula (ii) above is preferably the substructure represented by the following formula (ii-2).

[0140] [ka]

[0141] In formula (ii-2), R c This is equivalent to equation (ii). β represents a divalent cyclic hydrocarbon group which may have substituents. The benzene ring in formula (ii-2) may be further substituted with any substituent. * represents a bond.

[0142] (R β ) In equation (ii-2), R β This represents a divalent cyclic hydrocarbon group which may have substituents. Examples of cyclic hydrocarbon groups include aliphatic ring groups and aromatic ring groups.

[0143] The number of rings in the aliphatic ring group is not particularly limited, but is usually 1 or more, preferably 2 or more, preferably 10 or less, and more preferably 5 or less. The upper and lower limits can be combined arbitrarily; for example, 1 to 10 is preferred, and 2 to 5 is more preferred. Setting the value above the lower limit tends to improve development adhesion. Also, setting the value below the upper limit tends to reduce residue. Furthermore, the number of carbon atoms in the aliphatic ring group is usually 4 or more, preferably 6 or more, more preferably 8 or more, preferably 40 or less, more preferably 35 or less, and still preferably 30 or less. The upper and lower limits can be combined arbitrarily; for example, 4 to 40 is preferred, 6 to 35 is more preferred, and 8 to 30 is still preferred. Setting the value above the lower limit tends to improve development adhesion. Also, setting the value below the upper limit tends to reduce residue. Examples of aliphatic rings in the aliphatic ring group include cyclohexane rings, cycloheptane rings, cyclodecane rings, cyclododecane rings, norbornane rings, isobornane rings, and adamantane rings. Among these, the adamantane ring is preferred from the viewpoint of development adhesion.

[0144] The number of rings in the aromatic ring group is not particularly limited, but is usually 1 or more, preferably 2 or more, more preferably 3 or more, preferably 10 or less, and preferably 5 or less. The upper and lower limits can be combined arbitrarily; for example, 1 to 10 is preferred, 2 to 10 is more preferred, and 3 to 5 is even more preferred. Setting the value above the lower limit tends to improve development adhesion. Also, setting the value below the upper limit tends to reduce residue. Examples of aromatic ring groups include aromatic hydrocarbon ring groups and aromatic heterocyclic ring groups. The number of carbon atoms in the aromatic ring group is usually 4 or more, preferably 6 or more, more preferably 8 or more, even more preferably 10 or more, preferably 40 or less, more preferably 30 or less, even more preferably 20 or less, and particularly preferably 15 or less. The upper and lower limits can be combined arbitrarily; for example, 4 to 40 is preferred, 6 to 30 is more preferred, 8 to 20 is even more preferred, and 10 to 15 is particularly preferred. Setting the value above the lower limit tends to improve development adhesion. Also, setting the value below the upper limit tends to reduce residue. Examples of aromatic rings in an aromatic ring group include benzene rings, naphthalene rings, anthracene rings, phenanthrene rings, and fluorene rings. Among these, fluorene rings are preferred from the viewpoint of development adhesion.

[0145] Examples of substituents that the cyclic hydrocarbon group may have include C1-C5 alkyl groups such as methyl, ethyl, n-propyl, isopropyl, n-butyl, sec-butyl, tert-butyl, amyl, and isoamyl groups; C1-C5 alkoxy groups such as methoxy and ethoxy groups; hydroxyl groups; nitro groups; cyano groups; and carboxyl groups. Among these, unsubstituted groups are preferred from the viewpoint of ease of synthesis.

[0146] Among these, from the perspective of curability, R β It is preferable that the group is a divalent aliphatic ring group, and more preferably a divalent adamantane ring group. In another aspect, from the viewpoint of development adhesion, R β It is preferable that the ring is a divalent aromatic ring group, and more preferably a divalent fluorene ring group.

[0147] The benzene ring in formula (ii-2) may be further substituted with any substituent. Examples of substituents on the benzene ring in formula (ii-2) include hydroxyl, methyl, methoxy, ethyl, ethoxy, propyl, and propoxy groups. The number of substituents is not particularly limited and may be one or two or more. From the viewpoint of curability, unsubstituted is preferred.

[0148] The following are specific examples of the substructure represented by equation (ii-2).

[0149] [ka]

[0150] [ka]

[0151] [ka]

[0152] [ka]

[0153] From the viewpoint of curability, the substructure represented by formula (ii) is preferably the substructure represented by the following formula (ii-3).

[0154] [ka]

[0155] In formula (ii-3), R c and R d This is equivalent to equation (ii). 1 This is equivalent to equation (i-1). * represents a bond.

[0156] The substructure represented by formula (ii-3) contained in one molecule of epoxy (meth)acrylate resin (b1-2) may be one type or two or more types.

[0157] The number of substructures represented by formula (ii) contained in one molecule of epoxy (meth)acrylate resin (b1-2) is not particularly limited, but is preferably 1 or more, more preferably 3 or more, preferably 20 or less, more preferably 15 or less, and still preferably 10 or less. The upper and lower limits can be arbitrarily combined, for example, preferably 1 to 20, more preferably 1 to 15, and still preferably 3 to 10. Setting the value above the lower limit tends to improve development adhesion. Also, setting the value below the upper limit tends to reduce residue.

[0158] In yet another embodiment, the epoxy (meth)acrylate resin (b1) is preferably an epoxy (meth)acrylate resin (b1-3) that includes a substructure represented by the following general formula (iii) from the viewpoint of reducing outgassing during device emission.

[0159] [ka]

[0160] In formula (iii), R e ' is a hydrogen atom or a methyl group, and γ is a single bond, -CO-, an optionally substituted alkylene group, or an optionally substituted divalent cyclic hydrocarbon group. The benzene ring in formula (iii) may be further substituted with any substituent. * represents a bond.

[0161] (γ) In formula (iii), γ represents a single bond, a -CO-, an optionally substituted alkylene group, or an optionally substituted divalent cyclic hydrocarbon group.

[0162] The alkylene group may be linear or branched, but linear is preferred from the viewpoint of solubility in development, and branched is preferred from the viewpoint of adhesion in development. The number of carbon atoms is not particularly limited, but is usually 1 or more, 2 or more, 6 or less, and more preferably 4 or less. The upper and lower limits can be arbitrarily combined, for example, 1 to 6 is preferred, and 2 to 4 is more preferred. Setting the value above the lower limit tends to improve adhesion in development. Also, setting the value below the upper limit tends to reduce residue.

[0163] Examples of alkylene groups include methylene, ethylene, propylene, butylene, hexylene, and heptylene groups. From the viewpoint of achieving both good development adhesion and development solubility, methylene, ethylene, and propylene groups are preferred, and dimethylmethylene (2,2-propylene) groups are more preferred.

[0164] Examples of substituents that the alkylene group may have include alkoxy groups having 1 to 5 carbon atoms, such as methoxy and ethoxy groups; hydroxyl groups; nitro groups; cyano groups; and carboxyl groups. From the viewpoint of achieving both good development adhesion and development solubility, unsubstituted groups are preferred.

[0165] Examples of divalent cyclic hydrocarbon groups include divalent aliphatic ring groups and divalent aromatic ring groups.

[0166] The number of rings in the aliphatic ring group is not particularly limited, but is usually 1 or more, preferably 2 or more, preferably 10 or less, and more preferably 5 or less. The upper and lower limits can be combined arbitrarily; for example, 1 to 10 is preferred, and 2 to 5 is more preferred. Setting the value above the lower limit tends to improve development adhesion. Also, setting the value below the upper limit tends to reduce residue. Furthermore, the number of carbon atoms in the aliphatic ring group is usually 4 or more, preferably 6 or more, more preferably 8 or more, preferably 40 or less, more preferably 35 or less, and still preferably 30 or less. The upper and lower limits can be combined arbitrarily; for example, 4 to 40 is preferred, 6 to 35 is more preferred, and 8 to 30 is still preferred. Setting the value above the lower limit tends to improve development adhesion. Also, setting the value below the upper limit tends to reduce residue. Examples of aliphatic rings in the aliphatic ring group include cyclohexane rings, cycloheptane rings, cyclodecane rings, cyclododecane rings, norbornane rings, isobornane rings, and adamantane rings. Among these, the adamantane ring is preferred from the viewpoint of development adhesion.

[0167] The number of rings in the aromatic ring group is not particularly limited, but is usually 1 or more, preferably 2 or more, more preferably 3 or more, preferably 10 or less, and more preferably 5 or less. The upper and lower limits can be combined arbitrarily; for example, 1 to 10 is preferred, 2 to 10 is more preferred, and 3 to 5 is even more preferred. Setting the value above the lower limit tends to improve development adhesion. Also, setting the value below the upper limit tends to reduce residue. Examples of aromatic ring groups include aromatic hydrocarbon ring groups and aromatic heterocyclic ring groups. The number of carbon atoms in the aromatic ring group is usually 4 or more, preferably 6 or more, more preferably 8 or more, even more preferably 10 or more, preferably 40 or less, more preferably 30 or less, even more preferably 20 or less, and particularly preferably 15 or less. The upper and lower limits can be arbitrarily combined; for example, 4 to 40 is preferred, 6 to 30 is more preferred, 8 to 20 is even more preferred, and 10 to 15 is particularly preferred. Setting the value above the lower limit tends to improve development adhesion. Also, setting the value below the upper limit tends to reduce residue. Examples of aromatic rings in an aromatic ring group include benzene rings, naphthalene rings, anthracene rings, phenanthrene rings, and fluorene rings. Among these, fluorene rings are preferred from the viewpoint of development adhesion.

[0168] Examples of substituents that the cyclic hydrocarbon group may have include C1-C5 alkyl groups such as methyl, ethyl, n-propyl, isopropyl, n-butyl, sec-butyl, tert-butyl, amyl, and isoamyl groups; C1-C5 alkoxy groups such as methoxy and ethoxy groups; hydroxyl groups; nitro groups; cyano groups; and carboxyl groups. From the viewpoint of ease of synthesis, unsubstituted groups are preferred.

[0169] Among these, from the viewpoint of reducing residue, γ is preferably an alkylene group which may have substituents, and more preferably a dimethylmethylene group.

[0170] The benzene ring in formula (iii) may be further substituted with any substituent. Examples of substituents on the benzene ring in formula (iii) include hydroxyl, methyl, methoxy, ethyl, ethoxy, propyl, and propoxy groups. The number of substituents is not particularly limited and may be one or two or more. From the viewpoint of curability, unsubstituted is preferred.

[0171] From the viewpoint of development solubility, the substructure represented by formula (iii) is preferably the substructure represented by the following formula (iii-1).

[0172] [ka]

[0173] In formula (iii-1), R e And γ is synonymous with equation (iii). R 1 This is equivalent to formula (i-1). * represents a bond. The benzene ring in formula (iii-1) may be further substituted with any substituent.

[0174] The benzene ring in formula (iii-1) may be further substituted with any substituent. Examples of substituents on the benzene ring in formula (iii-1) include hydroxyl, methyl, methoxy, ethyl, ethoxy, propyl, and propoxy groups. The number of substituents is not particularly limited and may be one or two or more. From the viewpoint of curability, unsubstituted is preferred.

[0175] The number of substructures represented by formula (iii) contained in one molecule of epoxy (meth)acrylate resin (b1-3) is not particularly limited, but is preferably 1 or more, more preferably 5 or more, even more preferably 10 or more, and preferably 18 or less, and even more preferably 15 or less. The upper and lower limits can be arbitrarily combined, for example, preferably 1 to 18, more preferably 5 to 18, and even more preferably 10 to 15. Setting the value above the lower limit tends to improve development adhesion. Also, setting the value below the upper limit tends to reduce residue.

[0176] The number of substructures represented by formula (iii-1) contained in one molecule of epoxy (meth)acrylate resin (b1-3) is not particularly limited, but is preferably 1 or more, more preferably 3 or more, even more preferably 5 or more, and preferably 18 or less, and even more preferably 15 or less. The upper and lower limits can be arbitrarily combined, for example, 1 to 18 is preferred, 3 to 18 is more preferred, and 5 to 15 is even more preferred. Setting the value above the lower limit tends to improve development adhesion. Also, setting the value below the upper limit tends to reduce residue.

[0177] The following are specific examples of epoxy (meth)acrylate resins (b1-3).

[0178] [ka]

[0179] [ka]

[0180] [Chemical formula]

[0181] [Acrylic copolymer resin (b2)] From the viewpoint of curability, the acrylic copolymer resin (b2) preferably has an ethylenic double bond in its side chain.

[0182] Among the acrylic copolymer resins (b2), from the viewpoint of development solubility, an acrylic copolymer resin (b2-1) containing a partial structure represented by the following general formula (I) is preferable.

[0183] [Chemical formula]

[0184] In formula (I), R A and R B each independently represent a hydrogen atom or a methyl group. * represents a bond.

[0185] From the viewpoint of developability, the partial structure represented by formula (I) is preferably a partial structure represented by the following general formula (I-1).

[0186] [Chemical formula]

[0187] In formula (I-1), R A and R B are synonymous with formula (I). R 1 is synonymous with formula (i-1).

[0188] From the viewpoint of sensitivity, the partial structure represented by formula (I) is preferably a partial structure represented by the following formula (I-2).

[0189] [Chemical formula]

[0190] In formula (I-2), R A and R B This is equivalent to equation (I).

[0191] When the acrylic copolymer resin (b2-1) contains a substructure represented by formula (I), the content of the substructure represented by formula (I) in the acrylic copolymer resin (b2-1) is not particularly limited, but is preferably 5 mol% or more, more preferably 20 mol% or more, even more preferably 30 mol% or more, even more preferably 50 mol% or more, particularly preferably 70 mol% or more, most preferably 80 mol% or more, and also preferably 99 mol% or less, more preferably 97 mol% or less, and even more preferably 95 mol% or less. The upper and lower limits can be arbitrarily combined, for example, 5 to 99 mol% is preferred, 20 to 99 mol% is more preferred, 30 to 97 mol% is even preferred, 50 to 97 mol% is even more preferred, particularly preferred 70 to 95 mol%, and most preferably 80 to 95 mol%. Setting the value above the lower limit tends to reduce residue. Also, setting the value below the upper limit tends to improve developability.

[0192] When the acrylic copolymer resin (b2-1) contains a substructure represented by formula (I-1), the content of the substructure represented by formula (I-1) in the acrylic copolymer resin (b2-1) is not particularly limited, but is preferably 1 mol% or more, more preferably 5 mol% or more, even more preferably 8 mol% or more, even more preferably 10 mol% or more, and also preferably 99 mol% or less, more preferably 60 mol% or less, even more preferably 40 mol% or less, even more preferably 30 mol% or less, and particularly preferably 20 mol% or less. The upper and lower limits can be arbitrarily combined, for example, 1 to 99 mol% is preferred, 1 to 60 mol% is more preferred, 5 to 40 mol% is even more preferred, 8 to 30 mol% is even more preferred, and 10 to 20 mol% is particularly preferred. Setting the value above the lower limit tends to increase sensitivity and reduce residue. Also, setting the value below the upper limit tends to improve development adhesion.

[0193] When the acrylic copolymer resin (b2-1) contains a substructure represented by formula (I-2), the content of the substructure represented by formula (I-2) in the acrylic copolymer resin (b2-1) is not particularly limited, but is preferably 10 mol% or more, more preferably 20 mol% or more, even more preferably 30 mol% or more, even more preferably 40 mol% or more, particularly preferably 50 mol% or more, most preferably 70 mol% or more, and also preferably 99 mol% or less, more preferably 95 mol% or less, even more preferably 90 mol% or less, and particularly preferably 85 mol% or less. The upper and lower limits can be arbitrarily combined, for example, 10 to 99 mol% is preferred, 20 to 99 mol% is more preferred, 30 to 95 mol% is even more preferred, 40 to 95 mol% is even more preferred, particularly preferably 50 to 90 mol%, and most preferably 70 to 85 mol%. Sensitivity tends to increase when the value is above the lower limit. Also, developability tends to improve when the value is below the upper limit.

[0194] When the acrylic copolymer resin (b2-1) contains a substructure represented by formula (I), there are no particular limitations on other substructures that may be included, but from the viewpoint of development adhesion, it is preferable to include, for example, a substructure represented by the following general formula (I').

[0195] [ka]

[0196] In formula (I'), R D R represents a hydrogen atom or a methyl group. E This represents an optionally substituted alkyl group, an optionally substituted aryl group (aromatic ring group), or an optionally substituted alkenyl group.

[0197] (R E ) In equation (I'), R E This represents an optionally substituted alkyl group, an optionally substituted aryl group, or an optionally substituted alkenyl group. RE Examples of alkyl groups in this compound include linear, branched, or cyclic alkyl groups. The number of carbon atoms is preferably 1 or more, more preferably 3 or more, even more preferably 5 or more, preferably 20 or less, more preferably 18 or less, even more preferably 16 or less, even more preferably 14 or less, and particularly preferably 12 or less. The upper and lower limits can be combined arbitrarily; for example, 1 to 20 is preferred, 1 to 18 is more preferred, 3 to 16 is even more preferred, 3 to 14 is even more preferred, and 5 to 12 is particularly preferred. Setting the value above the lower limit tends to increase film strength and improve development adhesion. Also, setting the value below the upper limit tends to reduce residue.

[0198] Examples of alkyl groups include methyl, ethyl, cyclohexyl, dicyclopentanyl, and dodecanyl groups. Among these, dicyclopentanyl and dodecanyl groups are preferred from the viewpoint of film strength, and dicyclopentanyl is more preferred. Examples of substituents that the alkyl group may have include methoxy, ethoxy, chloro, bromo, fluoro, hydroxy, amino, epoxy, oligoethylene glycol, phenyl, carboxy, acryloyl, and methacryloyl groups. From the viewpoint of developability, hydroxy and oligoethylene glycol groups are preferred.

[0199] R E Examples of aryl groups (aromatic ring groups) in this context include monovalent aromatic hydrocarbon ring groups and monovalent aromatic heterocyclic ring groups. The number of carbon atoms is preferably 4 or more, more preferably 6 or more, preferably 24 or less, more preferably 22 or less, even more preferably 20 or less, and particularly preferably 18 or less. The upper and lower limits can be arbitrarily combined; for example, 4 to 24 is preferred, 4 to 22 is more preferred, 6 to 20 is even more preferred, and 6 to 18 is particularly preferred. Setting the value above the lower limit tends to improve development adhesion. Also, setting the value below the upper limit tends to reduce residue. The aromatic hydrocarbon ring in the aromatic hydrocarbon ring group may be a monoring or a fused ring, and examples include a benzene ring, naphthalene ring, anthracene ring, phenanthrene ring, perylene ring, tetracene ring, pyrene ring, benzpyrene ring, chrysene ring, triphenylene ring, acenaphthene ring, fluorantene ring, and fluorene ring. The aromatic heterocyclic group can be a monocyclic or fused ring, and examples include furan rings, benzofuran rings, thiophene rings, benzothiophene rings, pyrrole rings, pyrazole rings, imidazole rings, oxadiazole rings, indole rings, carbazole rings, pyrroloimidazole rings, pyrrolopyrrole rings, pyrrolopyrrole rings, thienopyrrole rings, thienothiophene rings, phlopyrrole rings, phlofuran rings, thienofuran rings, benzoisoxazole rings, benzoisothiazole rings, benzimidazole rings, pyridine rings, pyrazine rings, pyridazine rings, pyrimidine rings, triazine rings, quinoline rings, isoquinoline rings, cinoline rings, quinoxaline rings, phenanthridine rings, perimidine rings, quinazoline rings, quinazolinone rings, and azulene rings. Among these, benzene ring groups and naphthalene ring groups are preferred from the viewpoint of curability, and benzene ring groups are more preferred. Examples of substituents that the aryl group may have include methyl, ethyl, propyl, methoxy, ethoxy, chloro, bromo, fluoro, hydroxy, amino, epoxy, oligoethylene glycol, phenyl, and carboxyl groups. From the viewpoint of developability, hydroxy and oligoethylene glycol groups are preferred.

[0200] R EExamples of alkenyl groups include linear, branched, or cyclic alkenyl groups. The number of carbon atoms is preferably 2 or more, more preferably 22 or less, more preferably 20 or less, even more preferably 18 or less, even more preferably 16 or less, and particularly preferably 14 or less. For example, 2 to 22 is preferred, more preferably 2 to 20, even more preferably 2 to 18, even more preferably 2 to 16, and particularly preferably 2 to 14. Setting the value above the lower limit tends to improve development adhesion. Also, setting the value below the upper limit tends to reduce residue.

[0201] Examples of alkenyl groups include ethenyl, propenyl, butenyl, and cyclohexenyl groups. Of these, ethenyl and propenyl groups are preferred from the viewpoint of curability, and ethenyl groups are more preferred. Examples of substituents that the alkenyl group may have include methoxy, ethoxy, chloro, bromo, fluoro, hydroxy, amino, epoxy, oligoethylene glycol, phenyl, and carboxyl groups. From the viewpoint of developability, hydroxy and oligoethylene glycol groups are preferred.

[0202] Among these, from the perspective of developability, R E Preferably, alkyl groups and alkenyl groups are used, alkyl groups are more preferred, and dicyclopentanyl groups are even more preferred.

[0203] When the acrylic copolymer resin (b2-1) contains a partial structure represented by the formula (I’), the content of the partial structure represented by the formula (I’) contained in the acrylic copolymer resin (b2-1) is not particularly limited, but is preferably 0.5 mol% or more, more preferably 1 mol% or more, still more preferably 1.5 mol% or more, particularly preferably 2 mol% or more. Also, it is preferably 90 mol% or less, more preferably 70 mol% or less, still more preferably 50 mol% or less, even more preferably 30 mol% or less, and particularly preferably 10 mol% or less. The above upper and lower limits can be arbitrarily combined. For example, 0.5 to 90 mol% is preferable, 0.5 to 70 mol% is more preferable, 1 to 50 mol% is still more preferable, 1.5 to 30 mol% is even more preferable, and 2 to 10 mol% is particularly preferable. By setting the value to be not less than the lower limit value, the development adhesion tends to improve. Also, by setting the value to be not more than the upper limit value, the residue tends to decrease.

[0204] When the acrylic copolymer resin (b2-1) contains a partial structure represented by the formula (I), from the viewpoints of heat resistance and film strength, it is preferable that the acrylic copolymer resin (b2-1) further contains a partial structure represented by the formula (I’’).

[0205]

Chemical formula

[0206] In the formula (I’’), R F represents a hydrogen atom or a methyl group, and R G represents an alkyl group which may have a substituent, an alkenyl group which may have a substituent, a hydroxy group, a carboxy group, a halogen atom, an alkoxy group which may have a substituent, a thiol group, or an alkyl sulfide group which may have a substituent. t represents an integer of 0 to 5.

[0207] (R G ) In the formula (I’’), R GThis represents an optionally substituted alkyl group, an optionally substituted alkenyl group, a hydroxyl group, a carboxyl group, a halogen atom, an optionally substituted alkoxy group, a thiol group, or an optionally substituted alkyl sulfide group. R G Examples of alkyl groups include linear, branched, or cyclic alkyl groups. The number of carbon atoms is preferably 1 or more, more preferably 3 or more, even more preferably 5 or more, preferably 20 or less, more preferably 18 or less, even more preferably 16 or less, even more preferably 14 or less, and particularly preferably 12 or less. The upper and lower limits can be combined arbitrarily; for example, 1 to 20 is preferred, 1 to 18 is preferred, 3 to 16 is even preferred, 3 to 14 is even more preferred, and 5 to 12 is particularly preferred. Setting the value above the lower limit tends to improve development adhesion. Also, setting the value below the upper limit tends to reduce residue.

[0208] Examples of alkyl groups include methyl, ethyl, cyclohexyl, dicyclopentanyl, and dodecanyl groups. Among these, dicyclopentanyl and dodecanyl groups are preferred from the viewpoint of development adhesion, and dicyclopentanyl is more preferred. Examples of substituents that the alkyl group may have include methoxy, ethoxy, chloro, bromo, fluoro, hydroxy, amino, epoxy, oligoethylene glycol, phenyl, carboxy, acryloyl, and methacryloyl groups. From the viewpoint of developability, hydroxy and oligoethylene glycol groups are preferred.

[0209] R GExamples of alkenyl groups include linear, branched, or cyclic alkenyl groups. The number of carbon atoms is preferably 2 or more, preferably 22 or less, more preferably 20 or less, even more preferably 18 or less, even more preferably 16 or less, and particularly preferably 14 or less. The upper and lower limits can be combined arbitrarily; for example, 2 to 22 is preferred, 2 to 20 is more preferred, 2 to 18 is even preferred, 2 to 16 is even more preferred, and 2 to 14 is particularly preferred. Setting the value above the lower limit tends to improve development adhesion. Also, setting the value below the upper limit tends to reduce residue.

[0210] Examples of alkenyl groups include ethenyl, propenyl, butenyl, and cyclohexenyl groups. Of these, ethenyl and propenyl groups are preferred from the viewpoint of curability, and ethenyl groups are more preferred. Examples of substituents that the alkenyl group may have include methoxy, ethoxy, chloro, bromo, fluoro, hydroxy, amino, epoxy, oligoethylene glycol, phenyl, and carboxyl groups. From the viewpoint of developability, hydroxy and oligoethylene glycol groups are preferred.

[0211] R G Examples of halogen atoms in this product include fluorine, chlorine, bromine, and iodine atoms, and among these, fluorine is preferred from the viewpoint of ink repellency.

[0212] R GExamples of alkoxy groups include linear, branched, or cyclic alkoxy groups. The number of carbon atoms is preferably 1 or more, preferably 20 or less, more preferably 18 or less, even more preferably 16 or less, even more preferably 14 or less, and particularly preferably 12 or less. The upper and lower limits can be combined arbitrarily; for example, 1 to 20 is preferred, 1 to 18 is more preferred, 1 to 16 is even preferred, 1 to 14 is even more preferred, and 1 to 12 is particularly preferred. Setting the value above the lower limit tends to improve development adhesion. Also, setting the value below the upper limit tends to reduce residue.

[0213] Examples of substituents that the alkoxy group may have include methoxy, ethoxy, chloro, bromo, fluoro, hydroxy, amino, epoxy, oligoethylene glycol, phenyl, carboxy, acryloyl, and methacryloyl groups, with hydroxy and oligoethylene glycol groups being preferred from the viewpoint of developability.

[0214] R G Examples of alkyl sulfide groups include linear, branched, or cyclic alkyl sulfide groups. The number of carbon atoms is preferably 1 or more, preferably 20 or less, more preferably 18 or less, even more preferably 16 or less, even more preferably 14 or less, and particularly preferably 12 or less. The upper and lower limits can be combined arbitrarily; for example, 1 to 20 is preferred, 1 to 18 is more preferred, 1 to 16 is even preferred, 1 to 14 is even more preferred, and 1 to 12 is particularly preferred. Setting the value above the lower limit tends to improve development adhesion. Also, setting the value below the upper limit tends to reduce residue.

[0215] Examples of alkyl sulfide groups include methyl sulfide, ethyl sulfide, propyl sulfide, and butyl sulfide groups. Among these, methyl sulfide and ethyl sulfide groups are preferred from the viewpoint of developability. Examples of substituents that the alkyl group in the alkyl sulfide group may have include methoxy, ethoxy, chloro, bromo, fluoro, hydroxy, amino, epoxy, oligoethylene glycol, phenyl, carboxy, acryloyl, and methacryloyl groups, with hydroxy and oligoethylene glycol groups being preferred from the viewpoint of developability.

[0216] Among these, from the perspective of developability, R G A hydroxyl group and a carboxyl group are preferred, with a carboxyl group being more preferred.

[0217] (t) In equation (I''), t represents an integer between 0 and 5. From the viewpoint of developmentability, values ​​between 0 and 2 are preferred, values ​​between 0 and 1 are more preferred, and values ​​of 0 are even more preferred.

[0218] When the acrylic copolymer resin (b2-1) contains a substructure represented by formula (I''), the content of the substructure represented by formula (I'') in the acrylic copolymer resin (b2-1) is not particularly limited, but is preferably 1 mol% or more, more preferably 2 mol% or more, even more preferably 3 mol% or more, particularly preferably 5 mol% or more, and also preferably 90 mol% or less, more preferably 70 mol% or less, even more preferably 50 mol% or less, even more preferably 30 mol% or less, particularly preferably 20 mol% or less, and most preferably 10 mol% or less. The upper and lower limits can be arbitrarily combined, for example, 1 to 90 mol% is preferred, 1 to 70 mol% is more preferred, 2 to 50 mol% is even more preferred, 2 to 30 mol% is even more preferred, particularly preferably 3 to 20 mol%, and most preferably 5 to 10 mol%. Setting the value above the lower limit tends to improve development adhesion. Also, setting the value below the upper limit tends to reduce residue.

[0219] If the acrylic copolymer resin (b2-1) contains a substructure represented by formula (I), it is preferable from the viewpoint of developability to further contain a substructure represented by the following general formula (I''').

[0220] [ka]

[0221] In the above equation (I'''), R H represents a hydrogen atom or a methyl group.

[0222] When the acrylic copolymer resin (b2-1) contains a substructure represented by formula (I'''), the content of the substructure represented by formula (I''') in the acrylic copolymer resin (b2-1) is not particularly limited, but is preferably 5 mol% or more, more preferably 10 mol% or more, even more preferably 30 mol% or more, and also preferably 90 mol% or less, more preferably 80 mol% or less, even more preferably 70 mol% or less, and particularly preferably 50 mol% or less. The upper and lower limits can be arbitrarily combined, for example, 5 to 90 mol% is preferred, 5 to 80 mol% is more preferred, 10 to 70 mol% is even more preferred, and 30 to 50 mol% is particularly preferred. Setting the value above the lower limit tends to reduce residue. Also, setting the value below the upper limit tends to improve developability.

[0223] The acid value of the acrylic copolymer resin (b2) is not particularly limited, but is preferably 5 mg KOH / g or higher, more preferably 10 mg KOH / g or higher, even more preferably 20 mg KOH / g or higher, and even more preferably 25 mg KOH / g or higher. It is also preferably 100 mg KOH / g or less, more preferably 80 mg KOH / g or less, even more preferably 60 mg KOH / g or less, and even more preferably 40 mg KOH / g or less. The upper and lower limits can be arbitrarily combined, for example, 5 to 100 mg KOH / g is preferred, 10 to 80 mg KOH / g is more preferred, 20 to 60 mg KOH / g is even more preferred, and 25 to 40 mg KOH / g is even more preferred. Setting it above the lower limit tends to reduce residue. Also, setting it below the upper limit tends to improve developability.

[0224] The weight-average molecular weight (Mw) of the acrylic copolymer resin (b2) is not particularly limited, but is preferably 1000 or more, more preferably 2000 or more, even more preferably 3000 or more, even more preferably 4000 or more, and especially preferably 5000 or more. It is also preferably 30000 or less, more preferably 20000 or less, even more preferably 15000 or less, and even more preferably 10000 or less. It is especially preferably 8000 or less. The upper and lower limits can be arbitrarily combined, for example, 1000 to 30000 is preferred, 2000 to 20000 is more preferred, 3000 to 15000 is even more preferred, 4000 to 10000 is even more preferred, and 5000 to 8000 is especially preferred. Setting it above the lower limit tends to improve development adhesion. Also, setting it below the upper limit tends to reduce residue.

[0225] (B) When the alkali-soluble resin contains an acrylic copolymer resin (b2), the content of the acrylic copolymer resin (b2) in the alkali-soluble resin (B) is not particularly limited, but is preferably 5% by mass or more, more preferably 10% by mass or more, even more preferably 15% by mass or more, particularly preferably 20% by mass or more, and usually preferably 100% by mass or less, more preferably 80% by mass or less, and even more preferably 50% by mass or less. The upper and lower limits can be arbitrarily combined, for example, 5 to 100% by mass is preferred, 10 to 100% by mass is more preferred, 15 to 80% by mass is even more preferred, and 20 to 50% by mass is particularly preferred. Setting it above the lower limit tends to result in good developability and solubility. Setting it below the upper limit tends to result in a higher taper angle.

[0226] (B) The alkali-soluble resin may contain either epoxy (meth)acrylate resin (b1) or acrylic copolymer resin (b2) alone, or both. Furthermore, the alkali-soluble resin (B) may contain alkali-soluble resins other than alkali-soluble resin (b).

[0227] The content of (B) alkali-soluble resin in the photosensitive resin composition of the present invention is preferably 5% by mass or more, more preferably 10% by mass or more, even more preferably 20% by mass or more, even more preferably 30% by mass or more, particularly preferably 40% by mass or more, and also preferably 90% by mass or less, more preferably 80% by mass or less, and even more preferably 70% by mass or less, in the total solid content of the photosensitive resin composition. The upper and lower limits can be arbitrarily combined, for example, 5 to 90% by mass is preferred, 10 to 90% by mass is more preferred, 20 to 80% by mass is even more preferred, and 30 to 70% by mass is even more preferred. Setting the value above the lower limit tends to improve developability. Also, setting the value below the upper limit tends to reduce outgassing when the element emits light.

[0228] When the photosensitive resin composition of the present invention contains epoxy (meth)acrylate resin (b1), the content of epoxy (meth)acrylate resin (b1) is not particularly limited, but is preferably 5% by mass or more, more preferably 10% by mass or more, even more preferably 20% by mass or more, even more preferably 30% by mass or more, particularly preferably 40% by mass or more, and also preferably 90% by mass or less, more preferably 70% by mass or less, even more preferably 60% by mass or less, particularly preferably 50% by mass or less. The upper and lower limits can be arbitrarily combined, for example, 5 to 90% by mass is preferred, 10 to 90% by mass is more preferred, 20 to 70% by mass is even more preferred, 30 to 60% by mass is even more preferred, and 40 to 50% by mass is particularly preferred. Setting the value above the lower limit tends to improve developability. Also, setting the value below the upper limit tends to reduce outgassing during element emission.

[0229] Furthermore, when the photosensitive resin composition of the present invention contains an acrylic copolymer resin (b2), the content of the acrylic copolymer resin (b2) is not particularly limited, but is preferably 5% by mass or more, more preferably 10% by mass or more, even more preferably 20% by mass or more, even more preferably 30% by mass or more, particularly preferably 40% by mass or more, and also preferably 90% by mass or less, more preferably 80% by mass or less, and even more preferably 70% by mass or less, in the total solid content of the photosensitive resin composition. The upper and lower limits can be arbitrarily combined, for example, 5 to 90% by mass is preferred, 10 to 90% by mass is more preferred, 20 to 80% by mass is even more preferred, and 30 to 70% by mass is even more preferred. Setting the value above the lower limit tends to improve developability. Also, setting the value below the upper limit tends to reduce outgassing when the element emits light.

[0230] Furthermore, the total content of (B) alkali-soluble resin and (D) photopolymerizable compound in the total solid content of the photosensitive resin composition is preferably 5% by mass or more, more preferably 10% by mass or more, even more preferably 30% by mass or more, even more preferably 50% by mass or more, particularly preferably 70% by mass or more, even more particularly preferably 80% by mass or more, most preferably 90% by mass or more, and also preferably 99% by mass or less, more preferably 97% by mass or less, and even more preferably 95% by mass or less. The upper and lower limits can be arbitrarily combined, for example, 5 to 99% by mass is preferred, 10 to 99% by mass is more preferred, 30 to 99% by mass is even more preferred, 50 to 97% by mass is even more preferred, 70 to 97% by mass is particularly preferred, 80 to 95% by mass is particularly preferred, and 90 to 95% by mass is most preferred. Setting the value above the lower limit tends to improve curability. Also, setting the value below the upper limit tends to reduce outgassing during element emission.

[0231] The blending ratio of (B) alkali-soluble resin to (D) photopolymerizable compound in the photosensitive resin composition is preferably 50 parts by mass or more, more preferably 60 parts by mass or more, even more preferably 70 parts by mass or more, particularly preferably 80 parts by mass or more, and also preferably 500 parts by mass or less, more preferably 400 parts by mass or less, and even more preferably 300 parts by mass or less, per 100 parts by mass of (D) photopolymerizable compound. The total upper and lower limits can be arbitrarily combined, for example, preferably 50 to 500 parts by mass, more preferably 60 to 400 parts by mass, and even more preferably 70 to 300 parts by mass. Setting the ratio above the lower limit tends to improve developability. Also, setting the ratio below the upper limit tends to improve curability.

[0232] [1-1-3](C) component; photopolymerization initiator The photosensitive resin composition of the present invention may further contain (C) a photopolymerization initiator in addition to (A) the copolymer. The (C) photopolymerization initiator is not particularly limited as long as it is a compound that polymerizes (D) the photopolymerizable compound with active light, for example, a compound that polymerizes the ethylenically unsaturated bonds of (D) the photopolymerizable compound.

[0233] If the photosensitive resin composition of the present invention contains (C) a photopolymerization initiator, a photopolymerization initiator commonly used in this art can be used. Examples of such photopolymerization initiators include metallocene compounds containing titanocene compounds as described in Japanese Patent Publication No. 59-152396 and Japanese Patent Publication No. 61-151197; hexaarylbiimidazole derivatives as described in Japanese Patent Publication No. 2000-56118; radical activators such as halomethylated oxadiazole derivatives, halomethyl-s-triazine derivatives, N-aryl-α-amino acids such as N-phenylglycine, N-aryl-α-amino acid salts, N-aryl-α-amino acid esters, and α-aminoalkylphenone derivatives as described in Japanese Patent Publication No. 10-39503; and oxime ester compounds as described in Japanese Patent Publication No. 2000-80068 and Japanese Patent Publication No. 2006-36750.

[0234] Examples of metallocene compounds include dicyclopentadienyltitanium dichloride, dicyclopentadienyltitanium bisphenyl, dicyclopentadienyltitanium bis(2,3,4,5,6-pentafluorophenyl), dicyclopentadienyltitanium bis(2,3,5,6-tetrafluorophenyl), dicyclopentadienyltitanium bis(2,4,6-trifluorophenyl), dicyclopentadienyltitanium di(2,6-difluorophenyl), dicyclopentadienyltitanium di(2,4-difluorophenyl), di(methylcyclopentadienyl)titanium bis(2,3,4,5,6-pentafluorophenyl), di(methylcyclopentadienyl)titanium bis(2,6-difluorophenyl), and dicyclopentadienyltitanium [2,6-di-fluoro-3-(pyro-1-yl)-phenyl].

[0235] Examples of biimidazole derivatives include 2-(2'-chlorophenyl)-4,5-diphenylimidazole dimer, 2-(2'-chlorophenyl)-4,5-bis(3'-methoxyphenyl)imidazole dimer, 2-(2'-fluorophenyl)-4,5-diphenylimidazole dimer, 2-(2'-methoxyphenyl)-4,5-diphenylimidazole dimer, and (4'-methoxyphenyl)-4,5-diphenylimidazole dimer.

[0236] Examples of halomethylated oxadiazole derivatives include 2-trichloromethyl-5-(2'-benzofuryl)-1,3,4-oxadiazole, 2-trichloromethyl-5-[β-(2'-benzofuryl)vinyl]-1,3,4-oxadiazole, 2-trichloromethyl-5-[β-(2'-(6''-benzofuryl)vinyl)]-1,3,4-oxadiazole, and 2-trichloromethyl-5-furyl-1,3,4-oxadiazole.

[0237] Examples of halomethyl-s-triazine derivatives include 2-(4-methoxyphenyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4-methoxynaphthyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4-ethoxynaphthyl)-4,6-bis(trichloromethyl)-s-triazine, and 2-(4-ethoxycarbonylnaphthyl)-4,6-bis(trichloromethyl)-s-triazine.

[0238] Examples of α-aminoalkylphenone derivatives include 2-methyl-1[4-(methylthio)phenyl]-2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)butan-1-one, 2-dimethylamino-2-(4-methylbenzyl)-1-(4-morpholinophenyl)butan-1-one, and 3,6-bis(2-methyl-2-morpholinopropionyl)-9-octylcarbazole.

[0239] (C) As photopolymerization initiators, oxime ester compounds are particularly effective in terms of sensitivity and printability. For example, when using alkali-soluble resins containing phenolic hydroxyl groups, sensitivity is unfavorable, so oxime ester compounds with excellent sensitivity are particularly useful. Oxime ester compounds have a high quantum yield of photoreactions and the radicals they generate are highly active, making them stable against thermal reactions, and it is possible to obtain highly sensitive photosensitive resin compositions with small amounts.

[0240] Examples of oxime ester compounds include those represented by the following general formula (IV).

[0241] [ka]

[0242] In formula (IV), R 21a This represents a hydrogen atom, an optionally substituted alkyl group, or an optionally substituted aromatic ring group. R 21brepresents any substituent containing an aromatic ring. R 22a This represents an optionally substituted alkanoyl group or an optionally substituted allyloyl group. n represents an integer, either 0 or 1.

[0243] R 21a The number of carbon atoms in the alkyl group is not particularly limited, but from the viewpoint of solubility in the solvent, sensitivity, and inkjet coating properties, it is preferably 1 or more, more preferably 2 or more, preferably 20 or less, more preferably 15 or less, and even more preferably 10 or less. Examples of alkyl groups include methyl group, ethyl group, propyl group, cyclopentylethyl group, and propyl group. Examples of substituents that the alkyl group may have include aromatic ring groups, hydroxyl groups, carboxyl groups, halogen atoms, amino groups, amide groups, 4-(2-methoxy-1-methyl)ethoxy-2-methylphenyl groups, and N-acetyl-N-acetoxyamino groups. From the viewpoint of ease of synthesis, the alkyl group is preferably unsubstituted.

[0244] R 21a Examples of aromatic ring groups include aromatic hydrocarbon ring groups and aromatic heterocyclic ring groups. The number of carbon atoms in the aromatic ring group is not particularly limited, but it is preferably 5 or more from the viewpoint of solubility in the photosensitive resin composition. Furthermore, from the viewpoint of developability, it is preferably 30 or less, more preferably 20 or less, and even more preferably 12 or less. The upper and lower limits can be arbitrarily combined, for example, 5 to 30 is preferred, 5 to 20 is more preferred, and 5 to 12 is even more preferred.

[0245] Examples of aromatic ring groups include phenyl, naphthyl, pyridyl, and furyl groups. Of these, phenyl and naphthyl groups are preferred from the viewpoint of developability, and phenyl groups are more preferred. Examples of substituents that the aromatic ring group may have include hydroxyl groups, carboxyl groups, halogen atoms, amino groups, amide groups, alkyl groups, alkoxy groups, and groups formed by linking these substituents. From the viewpoint of developability, alkyl groups, alkoxy groups, and groups formed by linking them are preferred, and linked alkoxy groups are more preferred. Among these, from the perspective of inkjet coating properties, R 21a It is preferable that the alkyl group may have substituents.

[0246] R 21b Preferably, the group may be a substituted carbazolyl group, a substituted tioxantonyl group, a substituted diphenyl sulfide group, a substituted fluorenyl group, or a substituted indolyl group. Among these, a substituted diphenyl sulfide group is preferred from the viewpoint of inkjet coating properties.

[0247] R 22a The number of carbon atoms in the alkanoyl group is not particularly limited, but from the viewpoint of solubility in the solvent and sensitivity, it is preferably 2 or more, preferably 20 or less, more preferably 15 or less, even more preferably 10 or less, and even more preferably 5 or less. Examples of alkanoyl groups include acetyl, ethiloyl, propanoyl, and butanoyl groups. Examples of substituents that the alkanoyl group may have include aromatic ring groups, hydroxyl groups, carboxyl groups, halogen atoms, amino groups, and amide groups. From the viewpoint of ease of synthesis, the alkanoyl group is preferably unsubstituted.

[0248] R 22a The number of carbon atoms in the allyroyl group is not particularly limited, but from the viewpoint of solubility in the solvent and sensitivity, it is preferably 7 or more, more preferably 8 or more, preferably 20 or less, more preferably 15 or less, and even more preferably 10 or less. Examples of allyroyl groups include benzoyl groups and naphthoyl groups. Examples of substituents that the allyroyl group may have include hydroxyl groups, carboxyl groups, halogen atoms, amino groups, amide groups, and alkyl groups. From the viewpoint of ease of synthesis, the allyroyl group is preferably unsubstituted. Among these, from the perspective of sensitivity, R 22a It is preferably an alkanoyl group which may have substituents, more preferably an unsubstituted alkanoyl group, and even more preferably an acetyl group.

[0249] For example, photopolymerization initiators described in Japanese Patent No. 4454067, International Publication 2002 / 100903, International Publication 2012 / 45736, International Publication 2015 / 36910, International Publication 2006 / 18973, International Publication 2008 / 78678, Japanese Patent No. 4818458, International Publication 2005 / 80338, International Publication 2008 / 75564, International Publication 2009 / 131189, International Publication 2009 / 131189, International Publication 2010 / 133077, International Publication 2010 / 102502, and International Publication 2012 / 68879 can be used.

[0250] The photopolymerization initiator may be used alone or in combination of two or more types. If necessary, the photopolymerization initiator may be combined with a sensitizing dye and polymerization accelerator corresponding to the wavelength of the image exposure light source to increase sensitivity. Examples of sensitizing dyes include xanthene dyes described in Japanese Patent Publication No. 4-221958 and Japanese Patent Publication No. 4-219756, heterocyclic coumarin dyes described in Japanese Patent Publication No. 3-239703 and Japanese Patent Publication No. 5-289335, 3-ketocoumarin compounds described in Japanese Patent Publication No. 3-239703 and Japanese Patent Publication No. 5-289335, pyrometene dyes described in Japanese Patent Publication No. 6-19240, Japanese Patent Publication No. 47-2528 and Japanese Patent Publication No. 54-155292. Examples of dyes having a dialkylaminobenzene skeleton described in Japanese Patent Publication No. 45-37377, Japanese Patent Publication No. 48-84183, Japanese Patent Publication No. 52-112681, Japanese Patent Publication No. 58-15503, Japanese Patent Publication No. 60-88005, Japanese Patent Publication No. 59-56403, Japanese Patent Publication No. 2-69, Japanese Patent Publication No. 57-168088, Japanese Patent Publication No. 5-107761, Japanese Patent Publication No. 5-210240, and Japanese Patent Publication No. 4-288818 are examples.

[0251] Among these sensitizing dyes, amino group-containing sensitizing dyes are preferred, and compounds having an amino group and a phenyl group in the same molecule are more preferred. For example, benzophenone compounds such as 4,4'-dimethylaminobenzophenone, 4,4'-diethylaminobenzophenone, 2-aminobenzophenone, 4-aminobenzophenone, 4,4'-diaminobenzophenone, 3,3'-diaminobenzophenone, 3,4-diaminobenzophenone; 2-(p-dimethylaminophenyl)benzoxazole, 2-(p-diethylaminophenyl)benzoxazole, 2-(p-dimethylaminophenyl)benzo[4,5]benzoxazole, 2-(p-dimethylaminophenyl)benzo[6,7]benzoxazole, 2,5-bis(p-diethylaminophenyl)-1,3,4-oxazole, 2 Compounds containing a p-dialkylaminophenyl group, such as -(p-dimethylaminophenyl)benzothiazole, 2-(p-diethylaminophenyl)benzothiazole, 2-(p-dimethylaminophenyl)benzimidazole, 2-(p-diethylaminophenyl)benzimidazole, 2,5-bis(p-diethylaminophenyl)-1,3,4-thiadiazole, (p-dimethylaminophenyl)pyridine, (p-diethylaminophenyl)pyridine, (p-dimethylaminophenyl)quinoline, (p-diethylaminophenyl)quinoline, (p-dimethylaminophenyl)pyrimidine, and (p-diethylaminophenyl)pyrimidine, are even more preferred. Among these, 4,4'-dialkylaminobenzophenone is particularly preferred. Sensitizing dyes may be used individually or in combination of two or more.

[0252] Examples of polymerization accelerators include aromatic amines such as ethyl p-dimethylaminobenzoate and 2-dimethylaminoethyl benzoate, and aliphatic amines such as n-butylamine and N-methyldiethanolamine. The polymerization accelerator may be used alone or in combination of two or more.

[0253] If the photosensitive resin composition of the present invention contains (C) a photopolymerization initiator, the content of (C) the photopolymerization initiator is not particularly limited, but is preferably 0.01% by mass or more, more preferably 0.1% by mass or more, even more preferably 1% by mass or more, even more preferably 2% by mass or more, particularly preferably 3% by mass or more, and also preferably 25% by mass or less, more preferably 20% by mass or less, even more preferably 15% by mass or less, even more preferably 10% by mass or less, particularly preferably 7% by mass or less, and most preferably 5% by mass or less. The upper and lower limits can be arbitrarily combined, for example, 0.01 to 25% by mass is preferred, 0.01 to 20% by mass is more preferred, 0.1 to 15% by mass is even more preferred, 1 to 10% by mass is even more preferred, 2 to 7% by mass is particularly preferred, and 3 to 5% by mass is particularly preferred. Setting it above the lower limit tends to improve ink repellency. Setting it below the upper limit tends to reduce residue.

[0254] The blending ratio of (C) photopolymerization initiator to (D) photopolymerizable compound in the photosensitive resin composition is preferably 1 part by mass or more, more preferably 5 parts by mass or more, even more preferably 10 parts by mass or more, even more preferably 15 parts by mass or more, particularly preferably 20 parts by mass or more, and also preferably 200 parts by mass or less, more preferably 100 parts by mass or less, even more preferably 50 parts by mass or less, and particularly preferably 30 parts by mass or less. The upper and lower limits can be arbitrarily combined, for example, 1 to 200 parts by mass is preferred, 5 to 200 parts by mass is more preferred, 10 to 100 parts by mass is even more preferred, 15 to 50 parts by mass is even more preferred, and particularly preferably 20 to 30 parts by mass. Setting the value above the lower limit tends to improve ink repellency. Setting the value below the upper limit tends to reduce residue.

[0255] [1-1-4](D) component; photopolymerizable compound The photosensitive resin composition of the present invention contains (D) a photopolymerizable compound. It is believed that the inclusion of (D) the photopolymerizable compound results in high sensitivity. In the present invention, (D) the photopolymerizable compound is a component different from (A) the copolymer, and if a photopolymerizable compound corresponding to (A) exists, it is treated as (A) the copolymer. The photopolymerizable compounds used here refer to compounds having one or more ethylenically unsaturated bonds (ethylenically double bonds) in their molecules. However, from the standpoint of increasing polymerizability, crosslinkability, and the resulting difference in developer solubility between the exposed and unexposed areas, it is preferable that the compounds have two or more ethylenically unsaturated bonds in their molecules. Furthermore, it is even more preferable that the unsaturated bonds originate from (meth)acryloyloxy groups, i.e., that the compounds are (meth)acrylate compounds.

[0256] In the photosensitive resin composition of the present invention, it is particularly desirable to use a polyfunctional ethylenic monomer having two or more ethylenic unsaturated bonds in one molecule as (D) the photopolymerizable compound. The number of ethylenic unsaturated groups in the polyfunctional ethylenic monomer is not particularly limited, but is preferably two or more, more preferably three or more, even more preferably four or more, particularly preferably five or more, and also preferably 15 or less, more preferably 10 or less, even more preferably 8 or less, particularly preferably 7 or less. The upper and lower limits can be arbitrarily combined, for example, 2 to 15 is preferred, 3 to 10 is more preferred, 4 to 8 is even more preferred, and 5 to 7 is particularly preferred. Setting the value above the lower limit tends to improve polymerizability and result in higher sensitivity. Setting the value below the upper limit tends to result in better developability. (D) Examples of photopolymerizable compounds include esters of aliphatic polyhydroxy compounds and unsaturated carboxylic acids; esters of aromatic polyhydroxy compounds and unsaturated carboxylic acids; and esters obtained by esterification reactions of polyhydric hydroxy compounds such as aliphatic polyhydroxy compounds and aromatic polyhydroxy compounds with unsaturated carboxylic acids and polybasic carboxylic acids.

[0257] Examples of esters of aliphatic polyhydroxy compounds with unsaturated carboxylic acids include acrylic acid esters of aliphatic polyhydroxy compounds such as ethylene glycol diacrylate, triethylene glycol diacrylate, trimethylolpropane triacrylate, trimethylolethane triacrylate, pentaerythritol diacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol tetraacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, and glycerol acrylate; methacrylic acid esters obtained by replacing the acrylate of these compounds with methacrylate; itaconic acid esters obtained by replacing the acrylate of these compounds with itaconate; crotonic acid esters obtained by replacing the acrylate of these compounds with cronate; and maleic acid esters obtained by replacing the acrylate of these compounds with maleate.

[0258] Examples of esters of aromatic polyhydroxy compounds with unsaturated carboxylic acids include acrylic acid esters and methacrylic acid esters of aromatic polyhydroxy compounds such as hydroquinone diacrylate, hydroquinone dimethacrylate, resorcinol diacrylate, resorcinol dimethacrylate, and pyrogallol triacrylate. Esters obtained by the esterification reaction of polyhydroxy compounds, such as aliphatic polyhydroxy compounds and aromatic polyhydroxy compounds, with unsaturated carboxylic acids and polybasic carboxylic acids are not necessarily single compounds, but examples include: condensates of acrylic acid, phthalic acid, and ethylene glycol; condensates of acrylic acid, maleic acid, and diethylene glycol; condensates of methacrylic acid, terephthalic acid, and pentaerythritol; and condensates of acrylic acid, adipic acid, butanediol, and glycerin.

[0259] Other examples of photopolymerizable compounds used in the photosensitive resin composition of the present invention include, for example, urethane (meth)acrylates obtained by reacting a polyisocyanate compound with a hydroxyl group-containing (meth)acrylic acid ester or a polyisocyanate compound with a polyol and a hydroxyl group-containing (meth)acrylic acid ester; epoxy acrylates such as addition products of a polyvalent epoxy compound with a hydroxyl group-containing (meth)acrylic acid ester or (meth)acrylic acid; acrylamides such as ethylenebisacrylamide; allyl esters such as diallyl phthalate; and vinyl group-containing compounds such as divinyl phthalate. Examples of urethane (meth)acrylates include DPHA-40H, UX-5000, UX-5002D-P20, UX-5003D, UX-5005 (manufactured by Nippon Kayaku Co., Ltd.), U-2PPA, U-6LPA, U-10PA, U-33H, UA-53H, UA-32P, UA-1100H (manufactured by Shin Nakamura Chemical Industry Co., Ltd.), UA-306H, UA-510H, UF-8001G (manufactured by Kyoei Chemical Co., Ltd.), UV-1700B, UV-7600B, UV-7605B, UV-7630B, and UV7640B (manufactured by Nippon Synthetic Chemical Industry Co., Ltd.).

[0260] Among these, from the viewpoint of appropriate taper angle and sensitivity, it is preferable to use ester (meth)acrylates or urethane (meth)acrylates as (D) photopolymerizable compounds, and it is more preferable to use dipentaerythritol hexa(meth)acrylate, dipentaerythritol penta(meth)acrylate, 2-tris(meth)acryloyloxymethylethylphthalic acid, pentaerythritol tetra(meth)acrylate, pentaerythritol tri(meth)acrylate, dibasic acid anhydride adducts of dipentaerythritol penta(meth)acrylate, or dibasic acid anhydride adducts of pentaerythritol tri(meth)acrylate. These may be used individually or in combination of two or more types.

[0261] In the photosensitive resin composition of the present invention, the molecular weight of the (D) photopolymerizable compound is not particularly limited, but from the viewpoint of sensitivity, ink repellency, and taper angle, it is preferably 100 or more, more preferably 150 or more, even more preferably 200 or more, even more preferably 300 or more, particularly preferably 400 or more, most preferably 500 or more, and also preferably 1000 or less, more preferably 700 or less. The upper and lower limits can be arbitrarily combined, for example, 100 to 1000 is preferred, 150 to 1000 is more preferred, 200 to 1000 is even more preferred, 300 to 700 is even more preferred, 400 to 700 is particularly preferred, and 500 to 700 is most preferred. (D) The number of carbon atoms in the photopolymerizable compound is not particularly limited, but from the viewpoint of sensitivity, ink repellency and taper angle, it is preferably 7 or more, more preferably 10 or more, even more preferably 15 or more, even more preferably 20 or more, particularly preferably 25 or more, and also preferably 50 or less, more preferably 40 or less, even more preferably 35 or less, particularly preferably 30 or less. The upper and lower limits can be arbitrarily combined, for example, 7 to 50 is preferred, 10 to 50 is more preferred, 15 to 40 is even more preferred, 20 to 35 is even more preferred, and 25 to 30 is particularly preferred. From the viewpoint of sensitivity, ink repellency, and taper angle, ester (meth)acrylates, epoxy (meth)acrylates, and urethane (meth)acrylates are preferred, and among these, triplicate or more triplicate ester (meth)acrylates such as pentaerythritol tetra(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol hexa(meth)acrylate, and dipentaerythritol penta(meth)acrylate, and addents of acid anhydrides to triplicate or more triplicate ester (meth)acrylates such as 2,2,2-tris(meth)acryloyloxymethylethylphthalic acid and dipentaerythritol penta(meth)acrylate adducts are even more preferred.

[0262] The content of (D) the photopolymerizable compound in the photosensitive resin composition of the present invention is preferably 5% by mass or more, more preferably 10% by mass or more, even more preferably 20% by mass or more, even more preferably 30% by mass or more, particularly preferably 40% by mass or more, and also preferably 80% by mass or less, more preferably 70% by mass or less, even more preferably 60% by mass or less, even more preferably 55% by mass or less, and particularly preferably 50% by mass or less. The upper and lower limits can be arbitrarily combined, for example, 5 to 80% by mass is preferred, 10 to 70% by mass is more preferred, 20 to 60% by mass is even more preferred, 30 to 55% by mass or less is even more preferred, and 40 to 50% by mass is particularly preferred. Setting the value above the lower limit tends to result in appropriate internal curing properties. Setting the value below the upper limit tends to result in good developability.

[0263] [1-1-5](E) Coloring agent The photosensitive resin composition of the present invention may contain a coloring agent for the purpose of coloring the partition wall. Known coloring agents such as pigments and dyes can be used as the coloring agent. The type of colorant (E) used in the present invention is not particularly limited, and pigments or dyes may be used. Among these, pigments are preferred from the viewpoint of durability.

[0264] (E) The colorant may contain one or more pigments. In particular, from the viewpoint of uniformly blocking light in the visible region, it is preferable to have two or more pigments. (E) The types of pigments that can be used as colorants are not particularly limited, but examples include organic pigments and inorganic pigments. Among these, organic pigments are preferred from the viewpoint of controlling the transmission wavelength of the photosensitive resin composition and curing it efficiently. Examples of organic pigments include organic colored pigments and organic black pigments. Here, organic colored pigments refer to organic pigments that exhibit colors other than black, and include red pigments, orange pigments, blue pigments, purple pigments, green pigments, yellow pigments, etc.

[0265] Among organic pigments, it is preferable to use organic coloring pigments from the viewpoint of ultraviolet absorption. Organic coloring pigments may be used individually or in combination of two or more. In particular, when used for light-shielding applications, it is more preferable to use a combination of organic coloring pigments of different colors, and even more preferable to use a combination of organic coloring pigments that produce a color close to black.

[0266] The chemical structures of these organic pigments are not particularly limited, but examples include azo, phthalocyanine, quinacridone, benzimidazolon, isoindolinone, dioxazine, indanthrene, and perylene pigments. Specific examples of usable pigments are shown below by their pigment numbers. Terms such as "CI Pigment Red 2" below refer to the Color Index (CI).

[0267] As for red pigments, CI Pigment Red 1, 2, 3, 4, 5, 6, 7, 8, 9, 12, 14, 15, 16, 17, 21, 22, 23, 31, 32, 37, 38, 41, 47, 48, 48:1, 48:2, 48:3, 48:4, 49, 49:1, 49:2, 50:1, 52:1, 52:2, 53, 53:1, 53:2, 53:3, 57, 57:1, 57:2, 58:4, 60, 63, 63:1, 63:2, 64, 64:1, 68, 69, 81, 81:1, 81:2, 81:3, 81:4, 83, 88, 90:1, 101, 101:1, 104, 108, 108:1, 109, 112, 113, 114, 122, 123, 144, 146, 147, 149, 15 1, 166, 168, 169, 170, 172, 173, 174, 175, 176, 177, 178, 179, 181, 184, 185, 187, 188, 190, 193, 194, 200, 202, 206, 207, 208, 209, 210, 214, 216, 220, 221, 224, 230, 231, 232, 233, 23 We can list 5, 236, 237, 238, 239, 242, 243, 245, 247, 249, 250, 251, 253, 254, 255, 256, 257, 258, 259, 260, 262, 263, 264, 265, 266, 267, 268, 269, 270, 271, 272, 273, 274, 275, and 276. Among these, from the viewpoint of light-shielding and dispersive properties, CI pigment red 48:1, 122, 149, 168, 177, 179, 194, 202, 206, 207, 209, 224, 242, and 254 are preferred, and even more preferably CI pigment red 177, 209, 224, and 254. Furthermore, in terms of dispersibility and light-shielding properties, it is preferable to use CI Pigment Red 177, 254, and 272. When curing the photosensitive resin composition with ultraviolet light, it is preferable to use a red pigment with a low ultraviolet absorption rate, and from this viewpoint, it is even more preferable to use CI Pigment Red 254 and 272.

[0268] Examples of orange pigments include CI Pigment Orange 1, 2, 5, 13, 16, 17, 19, 20, 21, 22, 23, 24, 34, 36, 38, 39, 43, 46, 48, 49, 61, 62, 64, 65, 67, 68, 69, 70, 71, 72, 73, 74, 75, 77, 78, and 79. Among these, from the viewpoint of dispersibility and light-shielding properties, it is preferable to use CI Pigment Orange 13, 43, 64, and 72. When curing the photosensitive resin composition with ultraviolet light, it is preferable to use an orange pigment with a low ultraviolet absorption rate, and from this viewpoint, it is even more preferable to use CI Pigment Orange 64 and 72.

[0269] Examples of blue pigments include CI Pigment Blue 1, 1:2, 9, 14, 15, 15:1, 15:2, 15:3, 15:4, 15:6, 16, 17, 19, 25, 27, 28, 29, 33, 35, 36, 56, 56:1, 60, 61, 61:1, 62, 63, 66, 67, 68, 71, 72, 73, 74, 75, 76, 78, and 79. Among these, from the viewpoint of light-blocking properties, preferred are CI Pigment Blue 15, 15:1, 15:2, 15:3, 15:4, 15:6, and 60, and even more preferably CI Pigment Blue 15:6. Furthermore, in terms of dispersibility and light-shielding properties, it is preferable to use CI Pigment Blue 15:6, 16, or 60. When curing the photosensitive resin composition with ultraviolet light, it is preferable to use a blue pigment with a low ultraviolet absorption rate, and from this viewpoint, it is even more preferable to use CI Pigment Blue 60.

[0270] Examples of purple pigments include CI Pigment Violet 1, 1:1, 2, 2:2, 3, 3:1, 3:3, 5, 5:1, 14, 15, 16, 19, 23, 25, 27, 29, 31, 32, 37, 39, 42, 44, 47, 49, and 50. Among these, from the viewpoint of light-shielding properties, CI pigment violet 19 and 23 are preferred, and CI pigment violet 23 is even more preferred. Furthermore, in terms of dispersibility and light-shielding properties, it is preferable to use CI pigment violet 23 and 29. When curing the photosensitive resin composition with ultraviolet light, it is preferable to use a purple pigment with a low ultraviolet absorption rate, and from this viewpoint, it is more preferable to use CI pigment violet 29.

[0271] In addition to red, orange, blue, and purple pigments, other organic coloring pigments that can be used include, for example, green and yellow pigments. Examples of green pigments include CI Pigment Green 1, 2, 4, 7, 8, 10, 13, 14, 15, 17, 18, 19, 26, 36, 45, 48, 50, 51, 54, and 55. Among these, CI Pigment Green 7 and 36 are particularly preferred. As for yellow pigments, CI Pigment Yellow 1, 1:1, 2, 3, 4, 5, 6, 9, 10, 12, 13, 14, 16, 17, 24, 31, 32, 34, 35, 35:1, 36, 36:1, 37, 37:1, 40, 41, 42, 43, 48, 53, 55, 61, 62, 62:1, 63, 65, 73, 74, 75, 81, 83, 87, 93, 94, 95, 97, 100, 101, 104, 105, 108, 109, 110, 111, 116, 117, 119, 120, 126, 127, 127:1, 128, 129, 133, 134, 1 We can list 36, 138, 139, 142, 147, 148, 150, 151, 153, 154, 155, 157, 158, 159, 160, 161, 162, 163, 164, 165, 166, 167, 168, 169, 170, 172, 173, 174, 175, 176, 180, 181, 182, 183, 184, 185, 188, 189, 190, 191, 191:1, 192, 193, 194, 195, 196, 197, 198, 199, 200, 202, 203, 204, 205, 206, 207, and 208. Among these, CI Pigment Yellow 83, 117, 129, 138, 139, 150, 154, 155, 180, and 185 are preferred, and even more preferred are CI Pigment Yellow 83, 138, 139, 150, and 180.

[0272] Among these, it is preferable to use at least one selected from the group consisting of red pigment, orange pigment, blue pigment, and purple pigment, from the viewpoint of light-shielding properties and ink-repellent properties.

[0273] Among these, from the viewpoint of curability and ink repellency, it is preferable to include at least one of the following pigments. Red pigments: CI Pigment Red 177, 254, 272 Orange pigment: CI Pigment Orange 43, 64, 72 Blue pigment: CI Pigment Blue 15:6, 60 Purple pigment: CI Pigment Violet 23, 29

[0274] Furthermore, from the viewpoint of light-shielding properties, it is preferable to use an organic black pigment as the (E) coloring agent. Examples of organic black pigments include aniline black, perylene black, and the organic black pigment represented by the following general formula (2). Of these, the organic black pigment represented by formula (2) is more preferable from the viewpoint of light-shielding properties and dispersibility.

[0275] [ka]

[0276] Inorganic pigments can also be used. Examples of inorganic black pigments include carbon black, acetylene black, lamp black, bone black, graphite, iron black, cyanine black, and titanium black. Among these, carbon black is preferably used from the viewpoint of light-shielding properties and dispersibility.

[0277] When using pigments, known dispersants and dispersing aids may be used in combination to ensure that the pigments remain stable in the photosensitive resin composition without agglomerating.

[0278] If the photosensitive resin composition of the present invention contains (E) a coloring agent, the content of the coloring agent is preferably 60% by mass or less, more preferably 40% by mass or less, in the total solid content of the photosensitive resin composition, from the viewpoint of plate-making properties and color characteristics. The lower limit is not particularly limited, but is preferably 0.01% by mass or more. In another aspect, when a colorant is included in the photosensitive resin composition, the curability of the partition wall decreases, the liquid repellency of the partition wall decreases, and outgassing tends to occur more easily. For this reason, it is desirable that the colorant content in the photosensitive resin composition be low, for example, 20% by mass or less and more preferably 10% by mass or less relative to the total solid content of the photosensitive resin composition.

[0279] [1-1-6](F) Chain transfer agent The photosensitive resin composition of the present invention may contain (F) a chain transfer agent. Including a chain transfer agent improves radical deactivation due to oxygen inhibition near the surface, thereby enhancing surface hardness and tending to increase the taper angle. Furthermore, by enhancing surface hardness, the outflow of the liquid repellent can be suppressed, making it easier to fix the liquid repellent near the surface of the partition and tending to increase the contact angle. (F) Examples of chain transfer agents include mercapto group-containing compounds and carbon tetrachloride, with mercapto group-containing compounds being more preferred due to their tendency to exhibit a high chain transfer effect. Mercapto group-containing compounds tend to enhance surface hardening because their SH bond energy is low, which facilitates bond cleavage and chain transfer reactions.

[0280] Among chain transfer agents, compounds containing aromatic rings and aliphatic mercapto groups are preferred from the viewpoint of taper angle and surface hardening properties. Examples of aliphatic mercapto group-containing compounds include butanediol bis(3-mercaptopropionate), butanediol bisthioglycolate, ethylene glycol bis(3-mercaptopropionate), ethylene glycol bisthioglycolate, trimethylolpropane tris(3-mercaptopropionate), trimethylolpropane tristhioglycolate, trishydroxyethyl tristhiopropionate, pentaerythritol tetrakis(3-mercaptopropionate), penta Examples include erythritol tris(3-mercaptopropionate), butanediol bis(3-mercaptobutyrate), ethylene glycol bis(3-mercaptobutyrate), trimethylolpropane tris(3-mercaptobutyrate), pentaerythritol tetrakis(3-mercaptobutyrate), pentaerythritol tris(3-mercaptobutyrate), and 1,3,5-tris(3-mercaptobutyloxyethyl)-1,3,5-triazine-2,4,6(1H,3H,5H)-trione.

[0281] Of these, trimethylolpropane tris(3-mercaptopropionate), pentaerythritol tetrakis(3-mercaptopropionate), pentaerythritol tris(3-mercaptopropionate), trimethylolpropane tris(3-mercaptobutyrate), pentaerythritol tetrakis(3-mercaptobutyrate), pentaerythritol tris(3-mercaptobutyrate), and 1,3,5-tris(3-mercaptobutyloxyethyl)-1,3,5-triazine-2,4,6(1H,3H,5H)-trione are preferred, and pentaerythritol tetrakis(3-mercaptopropionate) and pentaerythritol tetrakis(3-mercaptobutyrate) are more preferred. (F) A single chain transfer agent may be used alone, or two or more may be used in combination.

[0282] From the viewpoint of improving ink repellency, it is preferable to use a photopolymerization initiator system in which one or more selected from the group consisting of 2-mercaptobenzothiazole, 2-mercaptobenzimidazole, and 2-mercaptobenzoxazole are used as the (F) chain transfer agent, and it is more preferable to use a combination with biimidazole derivatives. For example, 2-mercaptobenzothiazole may be used, 2-mercaptobenzimidazole may be used, or 2-mercaptobenzothiazole and 2-mercaptobenzimidazole may be used in combination. In another embodiment, from the viewpoint of surface hardening properties, it is preferable to use one or more selected from the group consisting of pentaerythritol tetrakis(3-mercaptopropionate) and pentaerythritol tetrakis(3-mercaptobutyrate).

[0283] When the photosensitive resin composition of the present invention contains (F) a chain transfer agent, its content is not particularly limited, but is preferably 0.01% by mass or more, more preferably 0.025% by mass or more, even more preferably 0.05% by mass or more, even more preferably 0.1% by mass or more, particularly preferably 1% by mass or more, and also preferably 5% by mass or less, more preferably 4% by mass or less, and even more preferably 3% by mass or less. The upper and lower limits can be arbitrarily combined, for example, 0.01 to 5% by mass is preferred, 0.025 to 5% by mass is more preferred, 0.05 to 4% by mass is even more preferred, 0.1 to 4% by mass is even more preferred, and 1 to 3% by mass is particularly preferred. Setting the value above the lower limit tends to increase surface hardening properties and liquid repellency. Setting the value below the upper limit tends to make it easier to form the desired pattern.

[0284] When using a combination of a mercapto group-containing compound having an aromatic ring and an aliphatic mercapto group-containing compound as a chain transfer agent, the content of the aliphatic mercapto group-containing compound is preferably 10 parts by mass or more, more preferably 50 parts by mass or more, even more preferably 80 parts by mass or more, and preferably 400 parts by mass or less, more preferably 300 parts by mass or less, even more preferably 200 parts by mass or less, and particularly preferably 150 parts by mass or less. The upper and lower limits can be arbitrarily combined; for example, 10 to 400 parts by mass is preferred, 10 to 300 parts by mass is more preferred, 50 to 200 parts by mass is even more preferred, and 80 to 150 parts by mass is particularly preferred. Ink repellency tends to increase when the value is above the lower limit. Sensitivity tends to increase when the value is below the upper limit.

[0285] When the photosensitive resin composition of the present invention contains (F) a chain transfer agent and (C) a photopolymerization initiator, the blending ratio of (F) chain transfer agent to (C) photopolymerization initiator in the photosensitive resin composition is preferably 1 part by mass or more, more preferably 5 parts by mass or more, even more preferably 10 parts by mass or more, particularly preferably 20 parts by mass or more, and also preferably 500 parts by mass or less, more preferably 400 parts by mass or less, even more preferably 300 parts by mass or less, even more preferably 200 parts by mass or less, and particularly preferably 150 parts by mass or less. The above upper and lower limits can be arbitrarily combined, for example, 10 to 500 parts by mass is preferred, 10 to 400 parts by mass is preferred, 20 to 300 parts by mass is even more preferred, even more preferably 20 to 200 parts by mass, and particularly preferably 20 to 150 parts by mass. Setting the value above the lower limit tends to increase surface hardening properties and liquid repellency. Furthermore, setting the value below the aforementioned upper limit tends to make it easier to form the desired pattern.

[0286] [1-1-7](G) Component; liquid repellent The photosensitive resin composition of the present invention may further contain (G) a liquid repellent in addition to (A) the copolymer. A fluorine atom-containing resin having a crosslinking group is preferred as the (G) liquid repellent. It is believed that by including a fluorine atom-containing resin having a crosslinking group, ink-repellent properties can be imparted to the surface of the resulting partition, thereby preventing color mixing between pixels.

[0287] Examples of crosslinking groups include epoxy groups and ethylenically unsaturated groups, and ethylenically unsaturated groups are preferred from the viewpoint of suppressing the leaching of the liquid repellent into the developer. By using a liquid repellent having crosslinking groups, the crosslinking reaction on the surface of the formed coating film can be accelerated when exposed to light. This makes it less likely for the liquid repellent to wash out during the developing process, and as a result, the resulting partition wall can exhibit high ink repellency.

[0288] Furthermore, the (G) liquid repellent, which is a fluorine atom-containing resin, tends to orient itself on the surface of the partition wall, preventing ink bleeding and mixing. More specifically, the groups containing fluorine atoms tend to repel ink, preventing ink bleeding and mixing caused by the ink penetrating beyond the partition wall into adjacent areas.

[0289] The fluorine atom-containing resin having a crosslinking group preferably has either a perfluoroalkyl group or a perfluoroalkylene ether chain, or both. Having either a perfluoroalkyl group or a perfluoroalkylene ether chain, the fluorine atom-containing resin is more likely to orient itself to the surface of the partition wall, resulting in higher ink repellency and a tendency to further prevent ink bleeding and color mixing.

[0290] Examples of perfluoroalkyl groups include perfluorobutyl, perfluorohexyl, and perfluorooctyl groups. Examples of perfluoroalkylene ether chains include -CF2-O-, -(CF2)2-O-, -(CF2)3-O-, -CF2-C(CF3)O-, -C(CF3)-CF2-O-, and divalent groups having repeating units of these groups.

[0291] Examples of fluorine atom-containing resins having crosslinking groups include acrylic copolymer resins having epoxy groups and perfluoroalkyl groups, acrylic copolymer resins having epoxy groups and perfluoroalkylene ether chains, acrylic copolymer resins having ethylenically unsaturated groups and perfluoroalkyl groups, acrylic copolymer resins having ethylenically unsaturated groups and perfluoroalkylene ether chains, epoxy (meth)acrylate resins having epoxy groups and perfluoroalkyl groups, epoxy (meth)acrylate resins having epoxy groups and perfluoroalkyl groups, epoxy (meth)acrylate resins having ethylenically unsaturated groups and perfluoroalkyl groups, and epoxy (meth)acrylate resins having ethylenically unsaturated groups and perfluoroalkylene ether chains. Among these, from the viewpoint of ink repellency, acrylic copolymer resins having ethylenically unsaturated groups and perfluoroalkyl groups, and acrylic copolymer resins having ethylenically unsaturated groups and perfluoroalkylene ether chains are preferred, and acrylic copolymer resins having ethylenically unsaturated groups and perfluoroalkylene ether chains are even more preferred.

[0292] Commercially available fluorine atom-containing resins having these crosslinking groups include DIC's "Megafac (registered trademark, hereinafter the same) F116", "Megafac F120", "Megafac F142D", "Megafac F144D", "Megafac F150", "Megafac F160", "Megafac F171", "Megafac F172", "Megafac F173", "Megafac F177", "Megafac F178A", "Megafac F178K", ​​"Megafac F179", "Megafac F183", "Megafac F184", "Megafac F191", and "Megafac F812". "Megafuck F815", "Megafuck F824", "Megafuck F833", "Megafuck RS101", "Megafuck RS102", "Megafuck RS105", "Megafuck RS201", "Megafuck RS202", "Megafuck RS301", "Megafuck RS303", "Megafuck RS304", "Megafuck RS401", "Megafuck RS402", "Megafuck RS501", "Megafuck RS502", "Megafuck RS-72-K", "Megafuck RS-78", "Megafuck RS-90", "DEFENSA (registered trademark, same applies hereinafter)" You can use fluorine-containing organic compounds that are commercially available under product names such as "MCF300", "DEFENSA MCF310", "DEFENSA MCF312", "DEFENSA MCF323", "Florard FC430", "Florard FC431", "FC-4430", and "FC4432" from 3M Japan, and "Asahi Guard (registered trademark) AG710", "Surflon (registered trademark, same applies hereinafter) S-382", "Surflon SC-101", "Surflon SC-102", "Surflon SC-103", "Surflon SC-104", "Surflon SC-105", and "Surflon SC-106" from AGC Inc. Among these, "Megafac RS-72-K", "Megafac RS-78", and "Megafac RS-90" can be suitably used as acrylic copolymer resins having ethylenically unsaturated groups and perfluoroalkylene groups.

[0293] The fluorine atom content in the fluorine atom-containing resin having a crosslinking group is not particularly limited, but it is preferably 5% by mass or more, more preferably 10% by mass or more, even more preferably 20% by mass or more, and even more preferably 25% by mass or more. Also, it is preferably 50% by mass or less, and more preferably 35% by mass or less. The upper and lower limits can be arbitrarily combined, for example, 5 to 50% by mass is preferred, 10 to 50% by mass is more preferred, 20 to 35% by mass is even more preferred, and 25 to 35% by mass is particularly preferred. Setting it above the lower limit tends to suppress outflow to the pixel area. Setting it below the upper limit tends to show a high contact angle.

[0294] The molecular weight of the fluorine atom-containing resin having a crosslinking group is not particularly limited, and it may be a low molecular weight compound or a high molecular weight compound. A high molecular weight compound is preferred because it suppresses fluidity after baking and can suppress outflow from the septum. When the fluorine atom-containing resin having a crosslinking group is a high molecular weight compound, the number average molecular weight of the fluorine atom-containing resin having a crosslinking group is preferably 100 or more, more preferably 500 or more, preferably 100,000 or less, and more preferably 10,000 or less. The upper and lower limits can be arbitrarily combined, for example, preferably 100 to 100,000, and more preferably 500 to 10,000.

[0295] When the photosensitive resin composition of the present invention contains (G) a liquid repellent, the content ratio of (G) the liquid repellent in the photosensitive resin composition of the present invention is not particularly limited, but is preferably 0.01% by mass or more, more preferably 0.1% by mass or more, even more preferably 0.5% by mass or more, and also preferably 5% by mass or less, more preferably 3% by mass or less, and even more preferably 2% by mass or less, in the total solid content of the photosensitive resin composition. The upper and lower limits can be arbitrarily combined, for example, 0.01 to 5% by mass is preferred, 0.1 to 3% by mass is more preferred, and 0.5 to 2% by mass is even more preferred. Setting it above the lower limit tends to improve ink repellency. Setting it below the upper limit tends to make it easier to obtain a uniform coating film when applying ink to the pixel portion after partition formation.

[0296] When the photosensitive resin composition of the present invention contains a fluorine atom-containing resin having a crosslinking group, the content ratio of the fluorine atom-containing resin having a crosslinking group in the photosensitive resin composition of the present invention is not particularly limited, but is preferably 0.01% by mass or more, more preferably 0.1% by mass or more, even more preferably 0.5% by mass or more, and also preferably 5% by mass or less, more preferably 3% by mass or less, and even more preferably 2% by mass or less, in the total solid content of the photosensitive resin composition. The upper and lower limits can be arbitrarily combined, for example, 0.01 to 5% by mass is preferred, 0.1 to 3% by mass is more preferred, and 0.5 to 2% by mass is even more preferred. Setting it above the lower limit tends to improve ink repellency. Setting it below the upper limit tends to make it easier to obtain a uniform coating film when applying ink to the pixel portion after partition formation.

[0297] [1-1-8] Coatability improvers, developer improvers The photosensitive resin composition of the present invention may contain a coating agent or a developer modifier to improve coating properties and developer solubility. For example, known surfactants can be used as coating improvers or developer improvers. Surfactants can be used to improve the coatability of photosensitive resin compositions as coating solutions and the developability of the coating films, with fluorine-based surfactants or silicone-based surfactants being preferred. In particular, silicone-based surfactants are preferred, and polyether-modified silicone-based surfactants are even more preferred, because they have the effect of removing residue of the photosensitive resin composition from unexposed areas during development and also have the function of exhibiting wettability.

[0298] As fluorine-based surfactants, compounds having a fluoroalkyl or fluoroalkylene group at least one of the terminal, main chain, or side chains are preferred. Specifically, examples include 1,1,2,2-tetrafluorooctyl(1,1,2,2-tetrafluoropropyl) ether, 1,1,2,2-tetrafluorooctylhexyl ether, octaethylene glycol di(1,1,2,2-tetrafluorobutyl) ether, hexaethylene glycol di(1,1,2,2,3,3-hexafluoropentyl) ether, octapropylene glycol di(1,1,2,2-tetrafluorobutyl) ether, hexapropylene glycol di(1,1,2,2,3,3-hexafluoropentyl) ether, sodium perfluorododecylsulfonate, 1,1,2,2,8,8,9,9,10,10-decafluorododecane, and 1,1,2,2,3,3-hexafluorodecane. Examples of these commercially available products include BM Chemie's "BM-1000" and "BM-1100," DIC's "MegaFac F470," "MegaFac F475," "MegaFac F554," and "MegaFac F559," 3M Japan's "FC430," and Neos' "DFX-18."

[0299] Examples of silicone-based surfactants include "DC3PA," "SH7PA," "DC11PA," "SH21PA," "SH28PA," "SH29PA," "8032Additive," and "SH8400" from Toray Dow Corning, and "BYK(registered trademark, hereinafter the same) 323" and "BYK330" from BIC Chemie. The surfactant may include other surfactants besides fluorine-based surfactants and silicone-based surfactants. Examples of other surfactants include nonionic, anionic, cationic, and amphoteric surfactants.

[0300] Examples of nonionic surfactants include polyoxyethylene alkyl ethers, polyoxyethylene polyoxypropylene alkyl ethers, polyoxyethylene alkylphenyl ethers, polyoxyethylene alkyl esters, polyoxyethylene fatty acid esters, glycerin fatty acid esters, polyoxyethylene glycerin fatty acid esters, pentaerythritol fatty acid esters, polyoxyethylene pentaerythritol fatty acid esters, sorbitan fatty acid esters, polyoxyethylene sorbitan fatty acid esters, sorbitol fatty acid esters, and polyoxyethylene sorbitol fatty acid esters. Examples of commercially available products include polyoxyethylene-based surfactants such as Kao Corporation's "Emulgen (registered trademark; hereinafter the same) 104P" and "Emulgen A60".

[0301] Examples of anionic surfactants include alkyl sulfonates, alkylbenzene sulfonates, alkylnaphthalene sulfonates, polyoxyethylene alkyl ether sulfonates, alkyl sulfates, alkyl sulfate esters, higher alcohol sulfate esters, aliphatic alcohol sulfate esters, polyoxyethylene alkyl ether sulfates, polyoxyethylene alkylphenyl ether sulfates, alkyl phosphate esters, polyoxyethylene alkyl ether phosphates, polyoxyethylene alkylphenyl ether phosphates, and special polymer surfactants. Among these, special polymer surfactants are preferred, and special polycarboxylic acid type polymer surfactants are even more preferred. Examples of anionic surfactants include Kao's "Emal (registered trademark) 10" among alkyl sulfate esters, Kao's "Perex (registered trademark) NB-L" among alkylnaphthalene sulfonates, and Kao's "Homogenol (registered trademark, hereinafter the same) L-18" and "Homogenol L-100" among special polymer surfactants.

[0302] Examples of cationic surfactants include quaternary ammonium salts, imidazoline derivatives, and alkylamine salts. Examples of amphoteric surfactants include betaine-type compounds, imidazolium salts, imidazolines, and amino acids. Of these, quaternary ammonium salts are preferred, and stearyltrimethylammonium salts are even more preferred. Examples of cationic surfactants or benign surfactants include, as alkylamine salts, Kao's "Acetamine (registered trademark) 24", and as quaternary ammonium salts, Kao's "Cotamin (registered trademark, hereinafter the same) 24P" and "Cotamin 86W". Surfactants may be used individually or in combination of two or more. For example, combinations of silicone-based surfactants and fluorine-based surfactants, silicone-based surfactants and special polymer-based surfactants, and fluorine-based surfactants and special polymer-based surfactants are possible. Among these, the combination of silicone-based surfactants and fluorine-based surfactants is preferred. Examples of this silicone-based surfactant / fluorine-based surfactant combination include BYK-300 or BYK-330 from BIC Chemie and DFX-18 from NEOS Corporation, BYK-300 or BYK-330 from BIC Chemie and S-393 from AGC Seimi Chemical Co., Ltd., BYK-300 or BYK-330 from BIC Chemie and F-554 or F-559 from DIC Corporation, KP340 from Shin-Etsu Silicone Co., Ltd. and F-478 or F-475 from DIC Corporation, SH7PA from Toray Dow Corning Co., Ltd. and DS-401 from Daikin Industries, Ltd., and L-77 from NUC Corporation and FC4430 from 3M Japan Corporation. As a developer improver, for example, a known developer improver containing an organic carboxylic acid or its anhydride can also be used. When the photosensitive resin composition of the present invention contains a coating agent and a developer improver, the content of the coating agent and the developer improver is preferably 20% by mass or less, and more preferably 10% by mass or less, of the total solid content of the photosensitive resin composition, from the viewpoint of sensitivity.

[0303] [1-1-9] UV absorber The photosensitive resin composition of the present invention may contain an ultraviolet absorber. The ultraviolet absorber is added for the purpose of controlling the photocuring distribution by absorbing specific wavelengths of the light source used for exposure. Including an ultraviolet absorber tends to provide effects such as improving the tapered angle shape after development and reducing the residue remaining in the unexposed areas after development. As for the ultraviolet absorber, a compound having an absorption maximum between wavelengths of 250 nm and 400 nm can be used, for example, from the viewpoint of inhibiting light absorption by the photopolymerization initiator. Examples of ultraviolet absorbers include benzotriazole compounds, triazine compounds, benzophenone compounds, benzoate compounds, cinnamic acid derivatives, naphthalene derivatives, anthracene and its derivatives, dinaphthalene compounds, phenanthroline compounds, and dyes. These UV absorbers may be used individually or in combination of two or more types. Examples of benzotriazole compounds include 2-(5-methyl-2-hydroxyphenyl)benzotriazole, 2-(2-hydroxy-5-t-butylphenyl)-2H-benzotriazole, 3-[3-tert-butyl-5-(5-chloro-2H-benzotriazole-2-yl)-4-hydroxyphenyl]octyl propionate, 3-[3-tert-butyl-5-(5-chloro-2H-benzotriazole-2-yl)-4-hydroxyphenyl]ethylhexyl propionate, 2-[2-hydroxy-3,5-bis(α,α-dimethylbenzyl)phenyl]-2H-benzotriazole, 2-(3-t-butyl-5-methyl-2-hydroxyphenyl)-5-chlorobenzotriazole, and 2-(3,5-di-t-amyl-2-hydroxyphenyl)ben Examples include zotriazole, 2-(2'-hydroxy-5'-t-octylphenyl)benzotriazole, heptyl 3-[3-tert-butyl-5-(2H-benzotriazole-2-yl)-4-hydroxyphenyl]propionate, octyl 3-[3-tert-butyl-5-(2H-benzotriazole-2-yl)-4-hydroxyphenyl]propionate, nonyl 3-[3-tert-butyl-5-(2H-benzotriazole-2-yl)-4-hydroxyphenyl]propionate, 2-(2H-benzotriazole-2-yl)-4,6-bis(1-methyl-1-phenylethyl)phenol, and 2-(2H-benzotriazole-2-yl)-6-(1-methyl-1-phenylethyl)-4-(1,1,3,3-tetramethylbutyl)phenol. Among these, from the viewpoint of taper angle and exposure sensitivity, heptyl 3-[3-tert-butyl-5-(2H-benzotriazol-2-yl)-4-hydroxyphenyl]propionic acid, octyl 3-[3-tert-butyl-5-(2H-benzotriazol-2-yl)-4-hydroxyphenyl]propionic acid, nonyl 3-[3-tert-butyl-5-(2H-benzotriazol-2-yl)-4-hydroxyphenyl]propionic acid, and mixtures thereof are preferred.

[0304] Examples of commercially available benzotriazole compounds include Sumisorb (registered trademark, hereinafter the same) 200, Sumisorb 250, Sumisorb 300, Sumisorb 340, Sumisorb 350 (manufactured by Sumitomo Chemical Co., Ltd.), JF77, JF78, JF79, JF80, JF83 (manufactured by Johoku Chemical Industry Co., Ltd.), TINUVIN (registered trademark, hereinafter the same) PS, TINUVIN99-2, TINUVIN109, TINUVIN384-2, TINUVIN326, TINUVIN900, TINUVIN928, TINUVIN1130 (manufactured by BASF), EVERSORB70, EVERSORB71, EVERSORB72, EVE Examples include RSORB73, EVERSORB74, EVERSORB75, EVERSORB76, EVERSORB234, EVERSORB77, EVERSORB78, EVERSORB80, EVERSORB81 (manufactured by Yongguang Chemical Industry Co., Ltd., Taiwan), Tomisorb (registered trademark, same applies hereinafter) 100, Tomisorb 600 (manufactured by API Corporation), SEESORB (registered trademark, same applies hereinafter) 701, SEESORB702, SEESORB703, SEESORB704, SEESORB706, SEESORB707, SEESORB709 (manufactured by Cipro Chemical Co., Ltd.), and RUVA-93 (manufactured by Otsuka Chemical Co., Ltd.).

[0305] Examples of triazine compounds include 2-[4,6-di(2,4-xylyl)-1,3,5-triazine-2-yl]-5-octyloxyphenol, 2-[4,6-bis(2,4-dimethylphenyl)-1,3,5-triazine-2-yl]-5-[3-(dodecyloxy)-2-hydroxypropoxy]phenol, reaction products of 2-(2,4-dihydroxyphenyl)-4,6-bis(2,4-dimethylphenyl)-1,3,5-triazine and 2-ethylhexylglycidyl ether, and 2,4-bis[2-hydroxy-4-butoxyphenyl]-6-(2,4-dibutoxyphenyl)-1,3,5-triazine. Among these, hydroxyphenyltriazine compounds are preferred from the viewpoint of taper angle and exposure sensitivity. Examples of commercially available triazine compounds include TINUVIN400, TINUVIN405, TINUVIN460, TINUVIN477, and TINUVIN479 (manufactured by BASF).

[0306] Other UV absorbers include, for example, benzophenone compounds such as Sumisorb 130 (manufactured by Sumitomo Chemical Co., Ltd.), EVERSORB 10, EVERSORB 11, EVERSORB 12 (manufactured by Yongguang Chemical Industry Co., Ltd., Taiwan), Tomisorb 800 (manufactured by API Corporation), SEESORB 100, SEESORB 101, SEESORB 101S, SEESORB 102, SEESORB 103, SEESORB 105, SEESORB 106, SEESORB 107, and SEESORB 151 (manufactured by Cipro Chemical Co., Ltd.); benzoate compounds such as Sumisorb 400 (manufactured by Sumitomo Chemical Co., Ltd.) and phenyl salicylate; cinnamic acid derivatives such as 2-ethylhexyl cinnamate, 2-ethylhexyl paramethoxycinnamate, isopropyl methoxycinnamate, and isoamyl methoxycinnamate; and α-naphthol. Examples include naphthalene derivatives such as β-naphthol, α-naphthol methyl ether, α-naphthol ethyl ether, 1,2-dihydroxynaphthalene, 1,3-dihydroxynaphthalene, 1,4-dihydroxynaphthalene, 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 1,7-dihydroxynaphthalene, 1,8-dihydroxynaphthalene, 2,3-dihydroxynaphthalene, 2,6-dihydroxynaphthalene, and 2,7-dihydroxynaphthalene; anthracenes such as anthracenes and 9,10-dihydroxyanthracenes and their derivatives; and dyes such as azo dyes, benzophenone dyes, aminoketone dyes, quinoline dyes, anthraquinone dyes, diphenylcyanoacrylate dyes, triazine dyes, and p-aminobenzoic acid dyes. Among these, from the viewpoint of exposure sensitivity, it is preferable to use cinnamic acid derivatives and naphthalene derivatives, and it is particularly preferable to use cinnamic acid derivatives.

[0307] When the photosensitive resin composition of the present invention contains an ultraviolet absorber, the amount of ultraviolet absorber in the photosensitive resin composition is preferably 0.01% by mass or more, more preferably 0.05% by mass or more, even more preferably 0.1% by mass or more, even more preferably 0.5% by mass or more, and particularly preferably 1% by mass or more, and also preferably 15% by mass or less, more preferably 10% by mass or less, even more preferably 5% by mass or less, and particularly preferably 3% by mass or less. The upper and lower limits can be arbitrarily combined, for example, 0.01 to 15% by mass is preferred, 0.05 to 15% by mass is more preferred, 0.1 to 10% by mass is even more preferred, 0.5 to 5% by mass is even more preferred, and 1 to 3% by mass is particularly preferred. Setting the value above the lower limit tends to increase the taper angle. Also, setting the value below the upper limit tends to increase sensitivity.

[0308] When the photosensitive resin composition of the present invention contains an ultraviolet absorber, the blending ratio to (C) photopolymerization initiator is preferably 1 part by mass or more, more preferably 10 parts by mass or more, even more preferably 30 parts by mass or more, even more preferably 50 parts by mass or more, and particularly preferably 80 parts by mass or more, per 100 parts by mass of (C) photopolymerization initiator, and also preferably 500 parts by mass or less, more preferably 300 parts by mass or less, even more preferably 200 parts by mass or less, and particularly preferably 150 parts by mass or less. The upper and lower limits can be arbitrarily combined, for example, 10 to 500 parts by mass is preferred, 30 to 300 parts by mass is more preferred, 50 to 200 parts by mass is even more preferred, and 80 to 150 parts by mass is particularly preferred. Setting the value above the lower limit tends to result in a larger taper angle. Also, setting the value below the upper limit tends to result in higher sensitivity.

[0309] [1-1-10] Polymerization inhibitors The photosensitive resin composition of the present invention may contain a polymerization inhibitor. It is believed that the inclusion of a polymerization inhibitor inhibits radical polymerization, thereby increasing the taper angle of the resulting partition wall. Examples of polymerization inhibitors include hydroquinone, hydroquinone monomethyl ether, methylhydroquinone, methoxyphenol, and 2,6-di-tert-butyl-4-cresol (BHT). Among these, methylhydroquinone and methoxyphenol are preferred from the viewpoint of polymerization inhibitory ability, and methylhydroquinone is more preferred.

[0310] Polymerization inhibitors may be used individually or in combination of two or more. Typically, when (B) alkali-soluble resins are manufactured, polymerization inhibitors may be present in the resin, and these may be used as polymerization inhibitors in the photosensitive resin composition of the present invention. Alternatively, in addition to the polymerization inhibitors present in the resin, the same or different polymerization inhibitors may be added during the manufacture of the photosensitive resin composition.

[0311] When the photosensitive resin composition of the present invention contains a polymerization inhibitor, the content of the polymerization inhibitor in the photosensitive resin composition is preferably 0.0005% by mass or more, more preferably 0.001% by mass or more, even more preferably 0.01% by mass or more, and also preferably 0.3% by mass or less, more preferably 0.2% by mass or less, and even more preferably 0.1% by mass or less, in the total solid content of the photosensitive resin composition. The upper and lower limits can be arbitrarily combined, for example, 0.0005 to 0.3% by mass is preferred, 0.001 to 0.2% by mass is more preferred, and 0.01 to 0.1% by mass is even more preferred. Setting the value above the lower limit tends to allow for a higher taper angle. Also, setting the value below the upper limit tends to allow for maintaining high sensitivity.

[0312] [1-1-11] Silane coupling agent The photosensitive resin composition of the present invention may contain a silane coupling agent to improve adhesion to the substrate. Examples of silane coupling agents that can be used include epoxy, methacrylic, amino, and imidazole-based silane coupling agents. From the viewpoint of improving adhesion, epoxy and imidazole-based silane coupling agents are particularly preferred. When the photosensitive resin composition of the present invention contains a silane coupling agent, the content of the silane coupling agent is preferably 20% by mass or less, and more preferably 15% by mass or less, of the total solid content of the photosensitive resin composition, from the viewpoint of adhesion.

[0313] [1-1-12] Phosphate-based adhesion enhancer The photosensitive resin composition of the present invention may contain a phosphate-based adhesion enhancer to improve adhesion to the substrate. Among the phosphate-based adhesion enhancers, (meth)acryloyloxy group-containing phosphates are preferred, and those represented by the following general formulas (Va), (Vb), and (Vc) are particularly preferred.

[0314] [ka]

[0315] In equations (Va), (Vb), and (Vc), R 8 represents a hydrogen atom or a methyl group, r and r' are integers from 1 to 10, and s is 1, 2, or 3.

[0316] When the photosensitive resin composition of the present invention contains a phosphoric acid-based adhesion enhancer, the amount is not particularly limited, but is preferably 0.1% by mass or more, more preferably 0.2% by mass or more, even more preferably 0.3% by mass or more, and also preferably 5% by mass or less, more preferably 3% by mass or less, and even more preferably 1% by mass or less, relative to the total solid content of the photosensitive resin composition. The upper and lower limits can be arbitrarily combined, for example, preferably 0.1 to 5% by mass, more preferably 0.2 to 3% by mass, and even more preferably 0.3 to 1% by mass. There is a tendency for adhesion to the substrate to improve when the amount is above the lower limit. Also, there is a tendency for surface curability to improve when the amount is below the upper limit.

[0317] [1-1-13] Solvent The photosensitive resin composition of the present invention typically contains a solvent and is used in a state in which each of the aforementioned components is dissolved or dispersed in the solvent. There are no particular restrictions on the solvent, but examples include the organic solvents listed below.

[0318] Glycol monoalkyl ethers such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monopropyl ether, ethylene glycol monobutyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol mono-n-butyl ether, propylene glycol-t-butyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol mono-n-butyl ether, methoxymethyl pentanol, dipropylene glycol monoethyl ether, dipropylene glycol monomethyl ether, 3-methyl-3-methoxybutanol, 3-methoxy-1-butanol, triethylene glycol monomethyl ether, triethylene glycol monoethyl ether, tripropylene glycol methyl ether, etc.; ethylene glycol dimethyl ether, ethylene glycol diethyl ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol dipropyl ether, di Glycol dialkyl ethers such as ethylene glycol dibutyl ether and dipropylene glycol dimethyl ether; glycol alkyl ether acetates such as ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, ethylene glycol mono-n-butyl ether acetate, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, propylene glycol monopropyl ether acetate, propylene glycol monobutyl ether acetate, methoxybutyl acetate, 3-methoxybutyl acetate, methoxypentyl acetate, diethylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether acetate, diethylene glycol mono-n-butyl ether acetate, dipropylene glycol monomethyl ether acetate, triethylene glycol monomethyl ether acetate, triethylene glycol monoethyl ether acetate, 3-methyl-3-methoxybutyl acetate, and 3-methoxy-1-butyl acetate;Glycol diacetates such as ethylene glycol diacetate, 1,3-butylene glycol diacetate, and 1,6-hexanol diacetate; alkyl acetates such as cyclohexanol acetate; ethers such as amyl ether, diethyl ether, dipropyl ether, diisopropyl ether, dibutyl ether, diamyl ether, ethyl isobutyl ether, and dihexyl ether; acetone, methyl ethyl ketone, methyl amyl ketone, methyl isopropyl ketone, methyl isoamyl ketone, diisopropyl ketone, di Ketones such as butyl ketone, methyl isobutyl ketone, cyclohexanone, ethyl amyl ketone, methyl butyl ketone, methylhexyl ketone, methyl nonyl ketone, and methoxymethylpentanone; monohydric or polyhydric alcohols such as methanol, ethanol, propanol, butanol, hexanol, cyclohexanol, ethylene glycol, propylene glycol, butanediol, diethylene glycol, dipropylene glycol, triethylene glycol, methoxymethylpentanol, glycerin, and benzyl alcohol; n-pentane Aliphatic hydrocarbons such as n-octane, diisobutylene, n-hexane, hexene, isoprene, dipentene, and dodecane; alicyclic hydrocarbons such as cyclohexane, methylcyclohexane, methylcyclohexene, and bicyclohexyl; aromatic hydrocarbons such as benzene, toluene, xylene, and cumene; amyl formate, ethyl formate, ethyl acetate, butyl acetate, propyl acetate, amyl acetate, methyl isobutyrate, ethylene glycol acetate, ethyl propionate, propyl propionate, butyl butyrate, isobutyl butyrate, and isobutyrate. Chain-like or cyclic esters such as ethyl caprylate, butyl stearate, ethyl benzoate, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, methyl 3-methoxypropionate, ethyl 3-methoxypropionate, propyl 3-methoxypropionate, butyl 3-methoxypropionate, and γ-butyrolactone; alkoxycarboxylic acids such as 3-methoxypropionic acid and 3-ethoxypropionic acid; halogenated hydrocarbons such as butyl chloride and amyl chloride; ether ketones such as methoxymethylpentanone;Nitriles such as acetonitrile and benzonitrile; and tetrahydrofurans such as tetrahydrofuran, dimethyltetrahydrofuran, and dimethoxytetrahydrofuran.

[0319] Examples of commercially available solvents that fall under the above categories include Mineral Spirit, Balsol #2, Apco #18 Solvent, Apco Thinner, Socal Solvent No. 1 and No. 2, Solvesso #150, Shell TS28 Solvent, Carbitol, Ethyl Carbitol, Butyl Carbitol, Methyl Cellosolve, Ethyl Cellosolve Acetate, Methyl Cellosolve Acetate, and Digrime (all brand names).

[0320] The solvent can dissolve or disperse each component in the photosensitive resin composition and is selected according to the method of use of the photosensitive resin composition of the present invention. From the viewpoint of coatability, a solvent with a boiling point of 60 to 280°C at atmospheric pressure (1013.25 hPa) is preferred, and a solvent with a boiling point of 70 to 260°C is more preferred. For example, propylene glycol monomethyl ether, 3-methoxy-1-butanol, propylene glycol monomethyl ether acetate, and 3-methoxy-1-butyl acetate are preferred.

[0321] The solvent may be used alone or in combination of two or more types. The solvent is preferably used such that the total solid content in the photosensitive resin composition is preferably 10% by mass or more, more preferably 15% by mass or more, even more preferably 18% by mass or more, and preferably 90% by mass or less, more preferably 50% by mass or less, even more preferably 40% by mass or less, and particularly preferably 30% by mass or less. The upper and lower limits can be combined arbitrarily; for example, 10 to 90% by mass is preferred, 10 to 50% by mass is more preferred, 15 to 40% by mass is even more preferred, and 18 to 30% by mass is particularly preferred. Setting the value above the lower limit tends to yield a coating even with high film thickness. Also, setting the value below the upper limit tends to yield a moderate coating uniformity.

[0322] [1-2] Method for preparing a photosensitive resin composition The photosensitive resin composition of the present invention is prepared by mixing the above components in a stirrer. The prepared photosensitive resin composition may be filtered, for example, using a membrane filter, to ensure uniformity.

[0323] [2] Cured products, partitions and methods for forming them The photosensitive resin composition of the present invention can be suitably used to form partitions, particularly partitions for separating the organic layer (light-emitting portion) of an organic electroluminescent device. The partition of the present invention consists of a cured product obtained by curing the photosensitive resin composition of the present invention. The method for forming a partition using the photosensitive resin composition of the present invention is not particularly limited, and conventionally known methods can be employed. For example, a method for forming a partition includes a coating step of coating the photosensitive resin composition onto a substrate to form a photosensitive resin composition layer, and an exposure step of exposing the photosensitive resin composition layer to light. For example, a method for forming such a partition is photolithography.

[0324] In photolithography, a photosensitive resin composition is applied to the entire surface of the substrate where the partition walls are to be formed to form a photosensitive resin composition layer. After the formed photosensitive resin composition layer is exposed according to a predetermined partition wall pattern, the exposed photosensitive resin composition layer is developed to form partition walls on the substrate.

[0325] The substrate used to form the partition wall is not particularly limited and is appropriately selected according to the type of organic electroluminescent device manufactured using the substrate on which the partition wall is formed. Suitable substrate materials include glass and various resin materials. Examples of resin materials include polyester such as polyethylene terephthalate; polyolefins such as polyethylene and polypropylene; polycarbonate; poly(meth)methacrylic resin; polysulfone; and polyimide. Among these substrate materials, glass and polyimide are preferred due to their excellent heat resistance. Depending on the type of organic electroluminescent device to be manufactured, a transparent electrode layer such as ITO or ZnO may be provided in advance on the surface of the substrate on which the partition wall is formed.

[0326] In the photolithography process, in the coating step of applying a photosensitive resin composition to a substrate, the photosensitive resin composition is applied to the substrate on which partitions are to be formed using contact transfer type coating devices such as roll coaters, reverse coaters, and bar coaters, or non-contact type coating devices such as spinners (rotary coating devices) and curtain flow coaters. If necessary, the solvent is removed by drying to form a photosensitive resin composition layer.

[0327] The amount of coating applied varies depending on the application, but for example, in the case of partitions, the dry film thickness is usually 0.5 to 30 μm, preferably 1 to 15 μm, and particularly preferably 1 to 5 μm. It is important that the dry film thickness or the height of the final partition is uniform across the entire substrate. If the variation is small, uneven defects that occur in the display device can be suppressed.

[0328] Drying of the photosensitive resin composition after it has been supplied onto the substrate is preferably done using a drying method that utilizes a hot plate, an IR oven, or a convection oven. A vacuum drying method, in which drying is performed in a vacuum chamber without raising the temperature, may also be used in combination.

[0329] Drying conditions can be appropriately selected depending on the type of solvent component, the performance of the dryer used, etc. Drying time is usually selected in the range of 15 seconds to 5 minutes at a temperature of 40 to 130°C, and preferably in the range of 30 seconds to 3 minutes at a temperature of 50 to 110°C, etc., depending on the type of solvent component, the performance of the dryer used, etc.

[0330] Next, in the exposure process, a negative-type mask is used to irradiate the photosensitive resin composition with active energy rays such as ultraviolet light or excimer laser light, partially exposing the photosensitive resin composition layer according to the pattern of the partitions. For exposure, a light source that emits ultraviolet light such as a high-pressure mercury lamp, an ultra-high-pressure mercury lamp, a xenon lamp, or a carbon arc lamp can be used. The exposure amount varies depending on the composition of the photosensitive resin composition, but for example, it is 10 to 400 mJ / cm². 2 A certain degree is desirable.

[0331] Next, in the developing process, the photosensitive resin composition layer exposed according to the partition pattern is developed with a developer to form the partition pattern. The developing method is not particularly limited, and immersion methods, spray methods, etc., can be used. Examples of developers include organic ones such as dimethylbenzylamine, monoethanolamine, diethanolamine, and triethanolamine, as well as aqueous solutions of sodium hydroxide, potassium hydroxide, sodium carbonate, ammonia, and quaternary ammonium salts. In addition, defoamers and surfactants may be added to the developer.

[0332] Subsequently, the partitions are obtained by post-baking and heat-curing the developed partition pattern. Post-baking is preferably performed at 150-250°C for 15-60 minutes.

[0333] After the partition wall is formed, a cleaning process can be performed to clean the unexposed areas. The cleaning method is not particularly limited and includes plasma irradiation, excimer light irradiation, and UV irradiation. With excimer light irradiation and UV irradiation, reactive oxygen species can decompose and remove organic matter attached to the pixel area.

[0334] [3] Organic electroluminescent element The organic electroluminescent element of the present invention is equipped with the partition wall of the present invention. Various organic electroluminescent devices are manufactured using a substrate equipped with a partition pattern produced by the method described above. The method for forming the organic electroluminescent device is not particularly limited, but preferably, after forming a partition pattern on the substrate by the method described above, an organic electroluminescent device is manufactured by injecting ink into the region surrounded by the partitions on the substrate to form an organic layer such as a pixel. Examples of organic electroluminescent devices include bottom-emission and top-emission types. In the bottom emission type, for example, a partition wall is formed on a glass substrate with stacked transparent electrodes, and a hole transport layer, light-emitting layer, electron transport layer, and metal electrode layer are stacked in the opening surrounded by the partition wall. In the top emission type, for example, a partition wall is formed on a glass substrate with stacked metal electrode layers, and an electron transport layer, light-emitting layer, hole transport layer, and transparent electrode layer are stacked in the opening surrounded by the partition wall. Examples of light-emitting layers include organic electroluminescent layers as described in Japanese Patent Publication No. 2009-146691 and Japanese Patent No. 5734681. Quantum dots as described in Japanese Patent No. 5653387 and Japanese Patent No. 5653101 may also be used.

[0335] Water, organic solvents, and mixtures thereof can be used as solvents when forming the ink for organic layer formation. The organic solvent is not particularly limited as long as it can be removed from the film formed after the ink is injected. Examples of organic solvents include toluene, xylene, anisole, mesitylene, tetralin, cyclohexylbenzene, acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, methanol, ethanol, isopropyl alcohol, ethyl acetate, butyl acetate, and 3-phenoxytoluene. In addition, surfactants, antioxidants, viscosity modifiers, and ultraviolet absorbers can be added to the ink, for example.

[0336] As a method for injecting ink into an area enclosed by partitions, the inkjet method is preferred because it allows for easy injection of small amounts of ink into predetermined locations. The ink used to form the organic layer is appropriately selected depending on the type of organic electroluminescent device to be manufactured. When injecting ink by the inkjet method, the viscosity of the ink is not particularly limited as long as the ink can be ejected well from the inkjet head, but 4 to 20 mPa·s is preferred, and 5 to 10 mPa·s is more preferred. The viscosity of the ink can be adjusted by adjusting the solid content in the ink, changing the solvent, adding a viscosity modifier, etc.

[0337] [4] Color filter The color filter of the present invention is not particularly limited as long as it contains luminescent nanocrystalline particles and is equipped with the partition wall of the present invention, and includes cases in which pixels are formed in regions partitioned by the partition wall.

[0338] Figure 1 is a schematic cross-sectional view of an example of a color filter equipped with a partition wall according to the present invention. As shown in Figure 1, the color filter 100 comprises a substrate 10, a partition wall 20 provided on the substrate, red pixels 30, green pixels 40, and blue pixels 50. The red pixels 30, green pixels 40, and blue pixels 50 are arranged in a grid pattern, repeating in this order. The partition wall 20 is provided between these adjacent pixels. In other words, these adjacent pixels are separated from each other by the partition wall 20.

[0339] The red pixels 30 contain red-emitting nanocrystalline particles 2, and the green pixels 40 contain green-emitting nanocrystalline particles 1. The blue pixels 50 are pixels that transmit blue light from the light source.

[0340] These nanocrystalline particles are nano-sized crystals that absorb excitation light and emit fluorescence or phosphorescence, for example, crystals with a maximum particle diameter of 100 nm or less as measured by a transmission electron microscope or scanning electron microscope.

[0341] Luminescent nanocrystalline particles can emit light of a different wavelength (fluorescence or phosphorescence) by absorbing light of a predetermined wavelength. For example, red-luminescent nanocrystalline particle 2 emits light (red light) with an emission peak wavelength in the range of 605 to 665 nm, and green-luminescent nanocrystalline particle 1 emits light (green light) with an emission peak wavelength in the range of 500 to 560 nm.

[0342] The wavelength (emission color) of light emitted by luminescent nanocrystalline particles depends on the size (e.g., particle diameter) of the luminescent nanocrystalline particles, according to the solution to the Schrödinger wave equation in the square-well model, but also on the energy gap of the luminescent nanocrystalline particles. Therefore, the emission color can be selected by changing the constituent material and size of the luminescent nanocrystalline particles used. Examples of luminescent nanocrystalline particles include quantum dots.

[0343] The method for manufacturing a color filter containing luminescent nanocrystalline particles is not particularly limited, but one method involves preparing a substrate equipped with partitions made from the cured product of the present invention, and forming a layer containing luminescent nanocrystalline particles in the region partitioned by the partitions. The method for forming the layer containing luminescent nanocrystalline particles is not particularly limited, but for example, it can be manufactured by selectively attaching an ink composition containing luminescent nanocrystalline particles using an inkjet method, and curing the ink composition by irradiation with active energy rays or heating.

[0344] [5] Image display device One embodiment of the image display device of the present invention includes the organic electroluminescent element of the present invention. As long as the image display device includes the organic electroluminescent element of the present invention, there are no particular restrictions on the type or structure of the image display device, and it can be assembled according to conventional methods using, for example, an actively driven organic electroluminescent element. For example, the image display device of the present invention can be formed by a method such as that described in "Organic EL Display" (Ohmsha, published August 20, 2004, by Shizuka Tokito, Chihaya Adachi, and Hideyuki Murata). For example, an image may be displayed by combining an organic electroluminescent element that emits white light with a color filter, or an image may be displayed by combining organic electroluminescent elements with different emission colors such as RGB.

[0345] Another embodiment of the image display device of the present invention includes a color filter of the present invention. Examples of image display devices include liquid crystal displays and image display devices that include organic electroluminescent elements. In the case of liquid crystal displays, examples include those that include a liquid crystal layer equipped with a light source with blue LEDs and electrodes that control the blue light emitted from the light source for each pixel.

[0346] On the other hand, an image display device including an organic electroluminescent element may be one in which a blue-emitting organic electroluminescent element is arranged at a position corresponding to each pixel of the color filter. Specifically, the method described in Japanese Patent Publication No. 2019-87746 is an example. [Examples]

[0347] The photosensitive resin composition of the present invention will be described with reference to examples, but the present invention is not limited to the following examples unless it exceeds the gist of the invention. The components of the photosensitive resin composition used in the following examples are as follows:

[0348] Copolymer (a-1): A copolymer comprising 1H,1H,2H,2H-tridecafluorooctyl acrylate, stearyl methacrylate, 2-ethylhexyl methacrylate, and 2-[4-(2-hydroxy-2-methyl-1-oxopropyl)phenoxy]ethyl methacrylate (weight ratio: 0.35 / 0.15 / 0.10 / 0.40) as constituent monomers, obtained by following the procedures of Synthesis Example 1, Production Example 1, and Production Example 2 below. 2-[4-(2-hydroxy-2-methyl-1-oxopropyl)phenoxy]ethyl methacrylate corresponds to monomer (a1), and 1H,1H,2H,2H-tridecafluorooctyl acrylate corresponds to monomer (a2).

[0349] (Synthesis Example 1: Synthesis of 2-[4-(2-hydroxy-2-methyl-1-oxopropyl)phenoxy]ethyl methacrylate) Methacrylic anhydride (manufactured by Tokyo Chemical Industry Co., Ltd.) was subjected to vacuum distillation, and the fraction with a purity of 99.8% or higher was recovered to obtain the methacrylic anhydride distillate. Vacuum distillation was carried out by gradually raising the temperature from room temperature to 90°C at a pressure of 30 Pa. Separately, 22.4 g (0.1 mol) of 1-[4-(2-hydroxyethoxy)phenyl]-2-hydroxy-2-methyl-1-propanone (manufactured by Tokyo Chemical Industry Co., Ltd.) and 30.4 g (0.3 mol) of triethylamine (manufactured by Tokyo Chemical Industry Co., Ltd.) were dissolved in 500 mL of methylene chloride (manufactured by Tokyo Chemical Industry Co., Ltd.). 23.1 g (0.15 mol) of the distillate of the above methacrylic anhydride was added dropwise at room temperature, and the mixture was stirred for 12 hours. The resulting reaction mixture was washed three times with 500 mL of deionized water, the organic phase was concentrated, and the solvent was removed by distillation. The residue was purified by column chromatography (ethyl acetate / hexane = 10 / 90 (volume ratio)) to obtain 21.6 g of the target compound (yield 74%). 1 ¹H-NMR analysis confirmed that the obtained compound was 2-[4-(2-hydroxy-2-methyl-1-oxopropyl)phenoxy]ethyl methacrylate. 1H NMR (300MHz, chloroform-d): δ8.06(d,J=9.0Hz,2H),6.96(d,J=9.0Hz,2H),6.13(d,J=0.6Hz,1H),5.5 9(s,1H),4.50(d,J=5.1Hz,2H),4.29(dd,J=5.5,4.1Hz,3H),1.94(dd,J=1.6,1.0Hz,3H),1.61(s,6H).

[0350] (Manufacturing Example 1: Manufacturing of copolymer (a-1)) 70 parts of methyl isobutyl ketone (MIBK) were placed in a flask equipped with a stirrer, condenser, and thermometer. Then, the flask was purged with nitrogen and the temperature was raised to 65°C. A mixed solution of 40 parts by mass of 2-[4-(2-hydroxy-2-methyl-1-oxopropyl)phenoxy]ethyl methacrylate, 15 parts by mass of stearyl methacrylate (Mitsubishi Chemical's "Acryester S"), 20 parts by mass of 2-ethylhexyl methacrylate (Mitsubishi Chemical's "Acryester EH"), 35 parts by mass of 1H,1H,2H,2H-tridecafluorooctyl acrylate (Osaka Organic Chemical Industry's "Viscoat 13F"), 0.75 parts by mass of 2,2'-azobis(2,4-dimethylvaleronitrile) as a polymerization initiator, and 78 parts by mass of MIBK was added dropwise over 2 hours. After another 2 hours, to increase the polymerization rate, a mixture of 0.5 parts by mass of 2,2'-azobis(2,4-dimethylvaleronitrile) and 0.6 parts by mass of MIBK was added and held for 5 hours. The reaction solution was then cooled to 40°C to obtain a MIBK solution of the copolymer (solution (a-1)). Hereinafter, the solid content in solution (a-1) will be referred to as copolymer (a-1). The solid content (non-volatile content) of solution (a-1) was 40% by mass. The weight-average molecular weight (Mw) of copolymer (a-1) was 132,000, and the active group content per gram of copolymer (a-1) was 1.31 (mmol / g).

[0351] 20 parts by mass of solution (a-1) prepared in Production Example 1 and 20 parts by mass of MIBK were added to a 100 mL dropping funnel, and pipetting was performed until homogeneous. Next, 160 parts by mass of methanol and a stirring bar were added to a 500 mL beaker and stirred. The mixed solution of solution (a-1) and MIBK from the previously prepared dropping funnel was added dropwise to the methanol solution over 10 minutes. After the addition was complete, stirring was continued for another 30 minutes, and then the stirring was stopped. After stopping the stirring, the presence of a precipitate of copolymer (a-1) was confirmed at the bottom of the beaker. After removing the supernatant, 30 parts by mass of MIBK were added to the beaker, and the precipitate was redissolved until homogeneous. The redissolved solution was reprecipitated and purified with 160 parts by mass of methanol as described above, and the recovered precipitate was further dried under reduced pressure at 80°C for 2 hours to obtain the purified copolymer (a-1).

[0352] The weight-average molecular weight (Mw) of copolymer (a-1) was measured by Gel Permeation Chromatography (GPC) under the following conditions. (Measurement conditions) Equipment: Waters "e2695" Column: "TSKgel Super H3000+H4000+H6000" manufactured by Tosoh Corporation Detector: Differential refractive index detector (RI detector / built-in) Solvent: tetrahydrofuran Temperature: 40℃ Flow rate: 0.5mL / min Injection volume: 10μL Concentration: 0.2% by mass Calibration sample: Monodisperse polystyrene Calibration method: Polystyrene equivalent

[0353] Alkali-soluble resin (b-1): An alkali-soluble acrylic copolymer resin obtained by adding acrylic acid in an equal amount to glycidyl methacrylate to a copolymer resin composed of tricyclodecane methacrylate / styrene / glycidyl methacrylate (molar ratio: 0.3 / 0.1 / 0.6), and then adding tetrahydrophthalic anhydride in an amount of 0.36 moles per mole of the copolymer resin. The weight-average molecular weight (Mw) in polystyrene equivalent, measured by GPC, is 3100, and the solid content acid value is 40 mgKOH / g.

[0354] Photopolymerizable compound (c-1): Dipentaerythritol hexaacrylate (KAYARAD DPHA, manufactured by Nippon Kayaku Co., Ltd.)

[0355] Photopolymerization initiator (d-1): Compound with the following chemical structure (oxime ester compound)

[0356] [ka]

[0357] Chain transfer agent (f-1): Karenz MT PE1 (Pentaerythritol tetrakis(3-mercaptobutyrate)) manufactured by Showa Denko Corporation

[0358] Additive-1: KAYAMER PM-21 (manufactured by Nippon Kayaku Co., Ltd.)

[0359] Dispersant-1: BYK-LPN21116 manufactured by BIC Chemie (amine value: 70 mg KOH / g. acid value: 1 mg KOH / g or less.)

[0360] Solvent-1: Propylene glycol monomethyl ether acetate (PGMEA) Solvent-2:3-Methoxy-1-butanol (MB)

[0361] <Preparation of Pigment Dispersion 1> The pigment, dispersant, alkali-soluble resin, and solvent were mixed in the mass ratios shown in Table 1. This solution was dispersed using a paint shaker at a temperature range of 25-45°C for 3 hours. 0.5 mm diameter zirconia beads were used, added in an amount equal to 2.5 times the mass of the dispersion. After dispersion, the beads and dispersion were separated by filter to prepare pigment dispersion 1.

[0362] [Table 1]

[0363] [Example 1] Using pigment dispersion 1, each component was added so that the ratio of solids of each component in the total solids of the photosensitive resin composition matched the blending ratios in Table 2. Solvent-1 was then added so that the total solids content was 34% by mass, and the mixture was stirred and dissolved to prepare photosensitive resin composition 1. The blending ratios of pigment dispersion, alkali-soluble resin, and copolymer in Table 2 are based on solids content. The photosensitive resin composition 1 was evaluated using the method described below.

[0364] (Measurement of contact angle between water and diiodomethane) Photosensitive resin composition 1 was applied to a glass substrate using a spinner to a thickness of 10.0 μm after heat curing. The resulting coating was then heated and dried on a hot plate at 100°C for 2 minutes. Without using a photomask, the resulting coating was exposed to a 50 mJ / cm² exposure using a Dainippon Kaken MA-1100 exposure machine. 2 The entire surface was exposed. The intensity at a wavelength of 365 nm at this time was 40 mW / cm². 2 Next, the substrate was spray-developed with a 0.033 mass% KOH (potassium hydroxide) aqueous solution at 24°C for 70 seconds, and then washed with pure water for 10 seconds. This substrate was then heated and cured in an oven at 230°C for 30 minutes to obtain a contact angle measuring substrate with cured material.

[0365] Contact angle measurements were performed using a Drop Master 500 contact angle measuring device manufactured by Kyowa Interface Science Co., Ltd., under conditions of 23°C and 50% humidity. 0.7 μL of water or diiodomethane was dropped onto the cured substrate for contact angle measurement, and the contact angle was measured after 1 second.

[0366] (Measurement of liquid-repellent volatile components) Photosensitive resin composition 1 was applied to a glass substrate using a spinner to a thickness of 10.0 μm after heat curing. The resulting coating was then heated and dried on a hot plate at 100°C for 2 minutes. Without using a photomask, the resulting coating was exposed to a 50 mJ / cm² exposure using a Dainippon Kaken MA-1100 exposure machine. 2 The entire surface was exposed to light to obtain substrate 1. A 100 μm gap was created opposite substrate 1 using a spacer, and glass substrate 2 was placed facing the coating on substrate 1 to prepare a test specimen. After heating and curing this test specimen in an oven at 230°C for 30 minutes, glass substrate 2 was removed and used as the substrate for measuring liquid-repellent volatile components.

[0367] The adhesion of liquid-repellent volatile components from the coating film to the glass substrate 2 was confirmed by measuring the contact angle (indicated as "Contact Angle A" in Table 2) of the glass substrate 2 surface placed opposite the coating film. Contact angle measurements were performed using a Drop Master 500 contact angle measuring device manufactured by Kyowa Interface Science Co., Ltd., under conditions of 23°C and 50% humidity. 0.7 μL of water was dropped onto the surface of glass substrate 2 placed opposite the coating film, and the contact angle was measured after 1 second.

[0368] [Table 2]

[0369] In Example 1, it was confirmed that the coating film of the photosensitive resin composition of the present invention exhibited high liquid repellency. This is thought to be because monomer (a1) and monomer (a2) are present in the same resin as constituent monomers, causing monomer (a2) units to be fixed to the upper surface of the coating film, thereby suppressing the outflow of the liquid repellent component into the developer during development. On the other hand, regarding the evaluation of the liquid-repellent volatile component in Example 1, the water contact angle on the substrate surface used for measuring the liquid-repellent volatile component was 74°, confirming low liquid repellency. The water contact angle on the glass substrate surface before the adhesion of the liquid-repellent volatile component was 62°, and the increase in liquid repellency due to the adhesion of the liquid-repellent volatile component was small, suggesting that the amount of liquid-repellent volatile component generated by heating the photosensitive resin composition of Example 1 was small. As a result, when a partition is formed using the photosensitive resin composition of Example 1, the generation of liquid-repellent volatile component by thermal decomposition and its adhesion to the area surrounded by the partition is suppressed, and when ink is applied to the area surrounded by the partition using an inkjet method, good inkjet coating properties are observed. [Explanation of Symbols]

[0370] 1. Green-emitting nanocrystalline particles 2. Red-emitting nanocrystalline particles 10 circuit boards 20 Bulkhead 30 red pixels 40 green pixels 50 blue pixels 100 Color Filters

Claims

1. A photosensitive resin composition comprising (A) a copolymer, (B) an alkali-soluble resin, and (D) a photopolymerizable compound, The copolymer (A) contains the following monomers (a1) and (a2) as constituent monomers, A photosensitive resin composition in which the (B) alkali-soluble resin contains an alkali-soluble resin (b) having an ethylenically double bond. Monomer (a1): A monomer having an active group that generates radicals upon irradiation with active energy rays, wherein the active group is an α-hydroxyketone group. Monomer (a2): A monomer having a fluorine atom and / or a silicon atom.

2. The photosensitive resin composition according to claim 1, wherein the monomer (a2) is a monomer having a fluorine atom.

3. The photosensitive resin composition according to claim 2, wherein the monomer (a2) is a monomer having a fluoroalkyl group.

4. The photosensitive resin composition according to claim 3, wherein the monomer (a2) is a monomer having a group represented by the following formula (1). -CFXR ｆ ・・・Form (1) (In formula (1), X is a hydrogen atom, a fluorine atom, or a trifluoromethyl group, and R ｆ (This may contain an etheric oxygen atom, a fluoroalkyl group having 1 to 20 carbon atoms, or a fluorine atom.)

5. The photosensitive resin composition according to any one of claims 1 to 4, wherein the fluorine atom content in the copolymer (A) is 5 to 40% by mass.

6. The photosensitive resin composition according to any one of claims 1 to 5, further comprising (C) a photopolymerization initiator.

7. The photosensitive resin composition according to any one of claims 1 to 6, further comprising (E) a coloring agent.

8. A photosensitive resin composition according to any one of claims 1 to 7, for use in forming partitions.

9. A cured product obtained by curing the photosensitive resin composition according to any one of claims 1 to 8.

10. A partition wall made of the cured material described in claim 9.

11. An organic electroluminescent element comprising a partition wall as described in claim 10.

12. A color filter comprising luminescent nanocrystalline particles having a partition as described in claim 10.

13. An image display device comprising an organic electroluminescent element according to claim 11.

14. An image display device including the color filter according to claim 12.

Images