Photosensitive resin film, method for forming a resist pattern, and method for forming a wiring pattern

Abstract

To provide a photosensitive resin film having superior pattern formation capability, a resist pattern forming method using the same, and a wiring pattern forming method.SOLUTION: The present invention pertains to a photosensitive resin film that contains a binder polymer, a photo-polymerizable compound, a photoinitiator, and a polymerization inhibitor, and that has a thickness of 35-300 μm.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present disclosure relates to a photosensitive resin film, a method for forming a resist pattern, and a method for forming a wiring pattern.

Background Art

[0002] In the field of manufacturing semiconductor integrated circuits (LSIs) or wiring boards, photosensitive materials are used as resists for fabricating conductor patterns. For example, in the manufacture of wiring boards, a resist is formed using a photosensitive resin composition, and then conductor patterns, metal posts, etc. are formed by plating. More specifically, a photosensitive layer is formed on a substrate using a photosensitive resin composition or the like, the photosensitive layer is exposed through a predetermined mask pattern, and then a resist pattern (resist) is formed by performing a development process so that portions where conductor patterns, metal posts, etc. are to be formed can be selectively removed (peeled off). Next, after forming a conductor such as copper on the removed portions by plating, the resist pattern is removed, whereby a wiring board provided with conductor patterns, metal posts, etc. can be manufactured (see, for example, Patent Documents 1 and 2).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0004] In recent years, for electronic components such as inductors, there has been research into increasing the thickness of the conductor layer to form wiring patterns with a high aspect ratio. However, with conventional thick-film photosensitive resists, light does not easily penetrate to the bottom of the photosensitive layer, which can lead to a deterioration of the pattern shape. Therefore, there is a need for a photosensitive resin film that has excellent pattern-forming properties even in thick films.

[0005] This disclosure has been made in view of the above circumstances and aims to provide a photosensitive resin film having excellent pattern-forming properties, a method for forming a resist pattern using the same, and a method for forming a wiring pattern. [Means for solving the problem]

[0006] The photosensitive resin film relating to this disclosure contains a binder polymer, a photopolymerizable compound, a photopolymerization initiator, and a polymerization inhibitor, and has a thickness of 35 to 300 μm.

[0007] The polymerization inhibitor described above may contain a catechol compound. The amount of polymerization inhibitor may be 0.01 to 0.3 parts by mass per 100 parts by mass of the total amount of the binder polymer and the photopolymerizable compound.

[0008] The above-mentioned photosensitive resin film may further contain a pyrazoline compound as a photosensitizer.

[0009] The above photopolymerizable compound may contain a (meth)acrylate having a urethane bond, and may also contain a polyalkylene glycol di(meth)acrylate.

[0010] The method for forming a resist pattern according to this disclosure comprises the steps of: providing a photosensitive layer on a substrate using the above-mentioned photosensitive resin film; irradiating at least a portion of the photosensitive layer with an active light to form a photocurable portion; and removing at least a portion of the photosensitive layer other than the photocurable portion to form a resist pattern.

[0011] The method for forming a wiring pattern according to this disclosure includes a step of forming a conductor pattern by plating a substrate on which a resist pattern has been formed by the resist pattern forming method described above. The method for forming a wiring pattern may further include a step of removing the photocured portion after the plating process. [Effects of the Invention]

[0012] According to this disclosure, it is possible to provide a photosensitive resin film having excellent pattern-forming properties, a method for forming a resist pattern using the same, and a method for forming a wiring pattern. [Brief explanation of the drawing]

[0013] [Figure 1] This is a schematic cross-sectional view showing one embodiment of a photosensitive resin film. [Figure 2] This diagram schematically illustrates one aspect of the process of forming a wiring pattern. [Modes for carrying out the invention]

[0014] The present disclosure will be described in detail below. In this specification, numerical ranges indicated using "~" represent a range that includes the numbers before and after "~" as the minimum and maximum values, respectively. Furthermore, in numerical ranges described in stages in this specification, the upper or lower limit of one stage of the numerical range may be replaced with the upper or lower limit of another stage of the numerical range. In numerical ranges described in this specification, the upper or lower limit of that numerical range may be replaced with the values ​​shown in the examples.

[0015] In this specification, "(meth)acrylic acid" means at least one of "acrylic acid" and its corresponding "methacrylic acid," and the same applies to other similar expressions such as (meth)acrylate.

[0016] In this specification, the "solid content" refers to the non-volatile content excluding volatile substances such as water and solvents contained in the photosensitive resin composition, indicating the components that remain without volatilization when the resin composition is dried, and also includes those in a liquid state, a treacle state, and a wax state at room temperature around 25°C.

[0017] [Photosensitive Resin Film] The photosensitive resin film according to this embodiment contains a binder polymer, a photopolymerizable compound, a photoinitiator, and a polymerization inhibitor, and has a thickness of 35 to 300 μm. The photosensitive resin film can be produced using a photosensitive resin composition containing a binder polymer, a photopolymerizable compound, a photoinitiator, and a polymerization inhibitor. Hereinafter, each component used in the photosensitive resin film and the photosensitive resin composition in this embodiment will be described in detail.

[0018] ((A) Binder Polymer) (A) The binder polymer (hereinafter also referred to as the "(A) component") can be produced, for example, by radical polymerization of a polymerizable monomer. Examples of the polymerizable monomer include styrene or styrene derivatives, acrylamides such as diacetone acrylamide, acrylonitrile, ethers of vinyl alcohol such as vinyl-n-butyl ether, alkyl (meth)acrylate, benzyl (meth)acrylate, tetrahydrofurfuryl (meth)acrylate, dimethylaminoethyl (meth)acrylate, diethylaminoethyl (meth)acrylate, glycidyl (meth)acrylate, 2,2,2-trifluoroethyl (meth)acrylate, 2,2,3,3-tetrafluoropropyl (meth)acrylate, (meth)acrylic acid, α-bromoacrylic acid, α-chloroacrylic acid, β-furyl (meth)acrylate, β-styryl (meth)acrylate, maleic acid, maleic anhydride, monomethyl maleate, monoethyl maleate, monoisopropyl maleate and other maleic acid monoesters, fumaric acid, cinnamic acid, α-cyanocinnamic acid, itaconic acid, crotonic acid, and propiolic acid. The polymerizable monomer can be used alone or in combination of two or more.

[0019] (A) component may have a carboxy group from the viewpoint of alkali developability. The (A) component having a carboxy group can be produced, for example, by radical polymerization of a polymerizable monomer having a carboxy group and other polymerizable monomers. The polymerizable monomer having a carboxy group may be (meth)acrylic acid or methacrylic acid.

[0020] From the viewpoint of improving the balance between alkali developability and alkali resistance, the content of the structural unit based on the polymerizable monomer having a carboxy group may be 10 to 50% by mass, 15 to 40% by mass, or 20 to 35% by mass based on the total amount of the (A) component. When the carboxy group content is 10% by mass or more, the alkali developability tends to be improved, and when it is 50% by mass or less, the alkali resistance tends to be excellent.

[0021] The acid value of the (A) component having a carboxy group may be 50 to 250 mgKOH / g, 50 to 200 mgKOH / g, or 100 to 200 mgKOH / g.

[0022] (A) component may have a structural unit based on styrene or a styrene derivative from the viewpoints of adhesion and peeling characteristics. The styrene derivative is a polymerizable compound in which a hydrogen atom at the α-position or aromatic ring of styrene such as vinyltoluene or α-methylstyrene is substituted. The content of the structural unit based on styrene or a styrene derivative in the (A) component may be 10 to 60% by mass, 15 to 50% by mass, 35 to 50% by mass, or 40 to 50% by mass. When this content is 10% by mass or more, the adhesion tends to be improved, and when it is 60% by mass or less, it is possible to suppress the increase in the size of the peeled piece during development, and the tendency for the time required for peeling to become long can be suppressed.

[0023] Component (A) may have structural units based on benzyl (meth)acrylate from the viewpoint of resolution and aspect ratio. The content of structural units derived from benzyl (meth)acrylate in component (A) may be 10-40% by mass, 15-35% by mass, or 20-30% by mass from the viewpoint of improving resolution and aspect ratio.

[0024] Component (A) may have structural units based on alkyl (meth)acrylate for the purpose of improving plasticity. Examples of alkyl (meth)acrylate include methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, butyl (meth)acrylate, pentyl (meth)acrylate, hexyl (meth)acrylate, heptyl (meth)acrylate, octyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, nonyl (meth)acrylate, decyl (meth)acrylate, undecyl (meth)acrylate, and dodecyl (meth)acrylate.

[0025] The weight-average molecular weight (Mw) of component (A) may be 10,000 to 300,000, 150,000 to 150,000, 200,000 to 100,000, or 25,000 to 80,000. When the Mw of component (A) is 10,000 or higher, it tends to have excellent developer resistance, and when it is 300,000 or lower, it tends to suppress the lengthening of the development time. The dispersion (weight-average molecular weight / number-average molecular weight) of component (A) may be 1.0 to 3.0, or 1.0 to 2.0. Resolution tends to improve as the dispersion decreases.

[0026] The weight-average molecular weight and number-average molecular weight in this specification were measured by gel permeation chromatography (GPC) and converted to values ​​using standard polystyrene as the standard sample.

[0027] Component (A) can be used alone or in combination of two or more. Examples of components (A) used in combination of two or more include two or more binder polymers consisting of different polymerizable monomers, two or more binder polymers with different Mw values, and two or more binder polymers with different degrees of dispersion.

[0028] The content of component (A) may be 30 to 80 parts by mass, 40 to 75 parts by mass, 50 to 70 parts by mass, or 50 to 60 parts by mass per 100 parts by mass of the total amount of component (A) and component (B) described later. When the content of component (A) is within this range, the strength of the photo-cured portion of the photosensitive resin film and photosensitive layer is improved.

[0029] ((B) Photopolymerizable compound) (B) As the photopolymerizable compound (hereinafter also referred to as "component (B)"), a compound having at least one ethylenically unsaturated bond in its molecule can be used. Component (B) can be used alone or in combination of two or more.

[0030] (B) The ethylenically unsaturated bond in component (B) is not particularly limited as long as it is photopolymerizable. Examples of ethylenically unsaturated bonds include α,β-unsaturated carbonyl groups such as (meth)acryloyl groups. Examples of photopolymerizable compounds having α,β-unsaturated carbonyl groups include α,β-unsaturated carboxylic acid esters of polyhydric alcohols, bisphenol-type (meth)acrylates, α,β-unsaturated carboxylic acid adducts of glycidyl group-containing compounds, (meth)acrylates having urethane bonds, nonylphenoxypolyethylene oxyacrylates, (meth)acrylates having a phthalic acid skeleton, and alkyl (meth)acrylates.

[0031] Examples of α,β-unsaturated carboxylic acid esters of polyhydric alcohols include polyethylene glycol di(meth)acrylate having 2 to 14 ethylene groups, polypropylene glycol di(meth)acrylate having 2 to 14 propylene groups, polyethylene-polypropylene glycol di(meth)acrylate having 2 to 14 ethylene groups and 2 to 14 propylene groups, trimethylolpropane di(meth)acrylate, trimethylolpropane tri(meth)acrylate, EO-modified trimethylolpropane tri(meth)acrylate, PO-modified trimethylolpropane tri(meth)acrylate, EO,PO-modified trimethylolpropane tri(meth)acrylate, tetramethylolmethane tri(meth)acrylate, tetramethylolmethane tetra(meth)acrylate, and (meth)acrylate compounds having a skeleton derived from dipentaerythritol or pentaerythritol. "EO-modified" means having a block structure of ethylene oxide (EO) groups, and "PO-modified" means having a block structure of propylene oxide (PO) groups.

[0032] Component (B) may include polyalkylene glycol di(meth)acrylate from the viewpoint of improving the flexibility of the resist pattern. The polyalkylene glycol di(meth)acrylate may have at least one of an EO group and a PO group, or it may have both an EO group and a PO group. In a polyalkylene glycol di(meth)acrylate having both an EO group and a PO group, the EO group and the PO group may be present in a continuous block-like manner or randomly. Furthermore, the PO group may be either an oxy-n-propylene group or an oxyisopropylene group. In the case of a (poly)oxyisopropylene group, the secondary carbon of the propylene group may be bonded to the oxygen atom, or the primary carbon may be bonded to the oxygen atom.

[0033] Examples of commercially available polyalkylene glycol di(meth)acrylates include FA-023M (manufactured by Hitachi Chemical Co., Ltd.), FA-024M (manufactured by Hitachi Chemical Co., Ltd.), and NK ester HEMA-9P (manufactured by Shin Nakamura Chemical Co., Ltd.).

[0034] Component (B) may include a (meth)acrylate having a urethane bond, from the viewpoint of improving the flexibility of the resist pattern. Examples of (meth)acrylates having a urethane bond include addition reaction products of a (meth)acrylic monomer having an OH group at the β position and a diisocyanate (isophorone diisocyanate, 2,6-toluene diisocyanate, 2,4-toluene diisocyanate, 1,6-hexamethylene diisocyanate, etc.), tris((meth)acryloxytetraethylene glycol isocyanate)hexamethylene isocyanurate, EO-modified urethane di(meth)acrylate, and EO,PO-modified urethane di(meth)acrylate.

[0035] Examples of commercially available EO-modified urethane di(meth)acrylate include "UA-11" and "UA-21EB" (manufactured by Shin-Nakamura Chemical Industry Co., Ltd.). An example of a commercially available EO,PO-modified urethane di(meth)acrylate is "UA-13" (manufactured by Shin-Nakamura Chemical Industry Co., Ltd.).

[0036] Component (B) may include a (meth)acrylate compound having a skeleton derived from dipentaerythritol or pentaerythritol, from the viewpoint of facilitating the formation of thick resist patterns and improving resolution and adhesion in a balanced manner. The (meth)acrylate compound having a skeleton derived from dipentaerythritol or pentaerythritol preferably has four or more (meth)acryloyl groups, and may be dipentaerythritol penta(meth)acrylate or dipentaerythritol hexa(meth)acrylate.

[0037] (B) The compound may contain a polyfunctional (meth)acrylate compound obtained by reacting a polyhydric alcohol with an α,β-unsaturated carboxylic acid. The polyfunctional (meth)acrylate compound may have at least one of an EO group and a PO group, or it may have both an EO group and a PO group. As such a compound, dipentaerythritol (meth)acrylate having an EO group can be used. A commercially available product of dipentaerythritol (meth)acrylate having an EO group is, for example, DPEA-12 (manufactured by Nippon Kayaku Co., Ltd.).

[0038] From the viewpoint of improving resolution and peelability after curing, component (B) may include bisphenol-type (meth)acrylate, and among bisphenol-type (meth)acrylates, it may include bisphenol A-type (meth)acrylate. Examples of bisphenol A-type (meth)acrylate include 2,2-bis(4-((meth)acryloxypolyethoxy)phenyl)propane, 2,2-bis(4-((meth)acryloxypolypropoxy)phenyl)propane, 2,2-bis(4-((meth)acryloxypolybutoxy)phenyl)propane, and 2,2-bis(4-((meth)acryloxypolyethoxypolypropoxy)phenyl)propane. Among these, 2,2-bis(4-((meth)acryloxypolyethoxy)phenyl)propane is preferred from the viewpoint of further improving resolution and pattern formation.

[0039] Commercially available examples include 2,2-bis(4-((meth)acryloxydipropoxy)phenyl)propane, such as BPE-200 (Shin-Nakamura Chemical Industry Co., Ltd.), and 2,2-bis(4-(methacryloxypentaethoxy)phenyl)propane, such as BPE-500 (Shin-Nakamura Chemical Industry Co., Ltd.) and FA-321M (Hitachi Chemical Co., Ltd.).

[0040] Examples of nonylphenoxypolyethylene oxyacrylates include nonylphenoxytetraethylene oxyacrylate, nonylphenoxypentaethylene oxyacrylate, nonylphenoxyhexaethylene oxyacrylate, nonylphenoxyheptaethylene oxyacrylate, nonylphenoxyoctaethylene oxyacrylate, nonylphenoxynonaethylene oxyacrylate, nonylphenoxydecaethylene oxyacrylate, and nonylphenoxyundaethylene oxyacrylate.

[0041] Examples of (meth)acrylates having a phthalate skeleton include γ-chloro-β-hydroxypropyl-β'-(meth)acryloyloxyethyl-o-phthalate, β-hydroxyethyl-β'-(meth)acryloyloxyethyl-o-phthalate, and β-hydroxypropyl-β'-(meth)acryloyloxyethyl-o-phthalate. γ-chloro-β-hydroxypropyl-β'-methacryloyloxyethyl-o-phthalate is commercially available as FA-MECH (Hitachi Chemical Co., Ltd.).

[0042] ((C) Photopolymerization initiator) (C) The photopolymerization initiator (hereinafter also referred to as "component (C)") is not particularly limited as long as it can polymerize component (B), and can be appropriately selected from commonly used photopolymerization initiators. Component (C) may include a hexaarylbiimidazole derivative or an acridine compound having one or more acridinyl groups in order to improve sensitivity and resolution in a balanced manner. Component (C) can be used alone or in combination of two or more.

[0043] Examples of hexaarylbiimidazole derivatives include 2-(o-chlorophenyl)-4,5-diphenylbiimidazole, 2,2',5-tris-(o-chlorophenyl)-4-(3,4-dimethoxyphenyl)-4',5'-diphenylbiimidazole, 2,4-bis-(o-chlorophenyl)-5-(3,4-dimethoxyphenyl)-diphenylbiimidazole, 2,4,5-tris-(o-chlorophenyl)-diphenylbiimidazole, 2-(o-chlorophenyl)-bis-4,5-(3,4-dimethoxyphenyl)-biimidazole, 2, Examples include 2'-bis-(2-fluorophenyl)-4,4',5,5'-tetrakis-(3-methoxyphenyl)-biimidazole, 2,2'-bis-(2,3-difluoromethylphenyl)-4,4',5,5'-tetrakis-(3-methoxyphenyl)-biimidazole, 2,2'-bis-(2,4-difluorophenyl)-4,4',5,5'-tetrakis-(3-methoxyphenyl)-biimidazole, and 2,2'-bis-(2,5-difluorophenyl)-4,4',5,5'-tetrakis-(3-methoxyphenyl)-biimidazole.

[0044] Examples of acridine compounds include 9-phenylacridine, 9-(p-methylphenyl)acridine, 9-(m-methylphenyl)acridine, 9-(p-chlorophenyl)acridine, 9-(m-chlorophenyl)acridine, 9-aminoacridine, 9-dimethylaminoacridine, 9-diethylaminoacridine, 9-pentylaminoacridine, 1,2-bis(9-acridinyl)ethane, 1,4-bis(9-acridinyl)butane, 1,6-bis(9-acridinyl)hexane, 1,8-bis(9-acridinyl)octane, Examples include bis(9-acridinyl)alkanes such as 1,10-bis(9-acridinyl)decane, 1,12-bis(9-acridinyl)dodecane, 1,14-bis(9-acridinyl)tetradecane, 1,16-bis(9-acridinyl)hexadecane, 1,18-bis(9-acridinyl)octadecane, and 1,20-bis(9-acridinyl)eicosane, as well as 1,3-bis(9-acridinyl)-2-oxapropane, 1,3-bis(9-acridinyl)-2-thiapropane, and 1,5-bis(9-acridinyl)-3-thiapentane.

[0045] The content of component (C) may be 0.1 to 10 parts by mass, 1 to 5 parts by mass, or 2 to 4.5 parts by mass per 100 parts by mass of the total amount of components (A) and (B). When the content of component (C) is 0.1 parts by mass or more, the photosensitivity, resolution, and adhesion tend to improve, and when it is 10 parts by mass or less, the resist pattern formation properties tend to be superior.

[0046] ((D) Polymerization inhibitors) The photosensitive resin film according to this embodiment can have improved pattern-forming properties by containing (D) polymerization inhibitor (hereinafter also referred to as "component (D)"). Component (D) can be used alone or in combination of two or more types.

[0047] Component (D) may include a compound represented by the following formula (I) from the viewpoint of further improving pattern formation. [ka]

[0048] In formula (I), R 5 is a halogen atom, a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, a cycloalkyl group having 3 to 10 carbon atoms, an amino group, an aryl group, a mercapto group, an alkylmercapto group having 1 to 10 carbon atoms, a carboxyalkyl group having 1 to 10 carbon atoms, an alkoxy group having 1 to 20 carbon atoms, or a heterocyclic group, where m and n are integers such that m is an integer of 2 or more and n is an integer of 0 or more such that m+n=6, and when n is an integer of 2 or more, R 5 These may be the same or different. The aryl group may be substituted with an alkyl group having 1 to 20 carbon atoms.

[0049] R 5 (A) may be a hydrogen atom or an alkyl group having 1 to 20 carbon atoms, from the viewpoint of further improving compatibility with component (A). 5 The alkyl group having 1 to 20 carbon atoms represented by may also be an alkyl group having 1 to 4 carbon atoms. From the viewpoint of further improving resolution, m may be 2 or 3, or it may be 2.

[0050] Examples of compounds represented by the above general formula (I) include catechol compounds such as catechol, 2-methylcatechol, 3-methylcatechol, 4-methylcatechol, 2-ethylcatechol, 3-ethylcatechol, 4-ethylcatechol, 2-propylcatechol, 3-propylcatechol, 4-propylcatechol, 2-n-butylcatechol, 3-n-butylcatechol, 4-n-butylcatechol, 2-tert-butylcatechol, 3-tert-butylcatechol, 4-tert-butylcatechol, and 3,5-di-tert-butylcatechol; resorcinol (resorcinol), 2-methylresorcinol, 4-methyl re Examples include resorcinol compounds such as zolsinol, 5-methylresorcinol (orsine), 2-ethylresorcinol, 4-ethylresorcinol, 2-propylresorcinol, 4-propylresorcinol, 2-n-butylresorcinol, 4-n-butylresorcinol, 2-tert-butylresorcinol, and 4-tert-butylresorcinol; hydroquinone compounds such as 1,4-hydroquinone, methylhydroquinone, ethylhydroquinone, propylhydroquinone, tert-butylhydroquinone, and 2,5-di-tert-butylhydroquinone; and trivalent phenol compounds such as pyrogallol and phloroglucinol.

[0051] Component (D) may contain a catechol compound from the viewpoint of improving resolution. Preferred catechol compounds are alkyl catechols such as 2-methylcatechol, 3-methylcatechol, 4-methylcatechol, 2-ethylcatechol, 3-ethylcatechol, 4-ethylcatechol, 2-propylcatechol, 3-propylcatechol, 4-propylcatechol, 2-n-butylcatechol, 3-n-butylcatechol, 4-n-butylcatechol, 2-tert-butylcatechol, 3-tert-butylcatechol, 4-tert-butylcatechol, and 3,5-di-tert-butylcatechol, with 3-tert-butylcatechol, 4-tert-butylcatechol, or 3,5-di-tert-butylcatechol being more preferred.

[0052] The content of component (D) may be 0.01 to 0.3 parts by mass, 0.02 to 0.2 parts by mass, 0.025 to 0.15 parts by mass, or 0.03 to 0.1 parts by mass per 100 parts by mass of the total amount of components (A) and (B). By reducing the content of component (D) to 0.3 parts by mass or less, the exposure time can be shortened. By increasing the content of component (D) to 0.01 parts by mass or more, the photoreaction of the photocured part can be sufficiently advanced, and the pattern formation ability can be further improved.

[0053] ((E) component: photosensitizer) The photosensitive resin film and photosensitive resin composition according to this embodiment may further contain (E) a photosensitizer (hereinafter also referred to as "component (E)"). By including component (E), the absorption wavelength of the active light used for exposure can be effectively utilized. Component (E) can be used alone or in combination of two or more types.

[0054] Examples of component (E) include dialkylaminobenzophenone compounds, pyrazoline compounds, anthracene compounds, coumarin compounds, xanthone compounds, thioxanthone compounds, oxazole compounds, benzoxazole compounds, thiazole compounds, benzothiazole compounds, triazole compounds, stilbene compounds, triazine compounds, thiophene compounds, naphthalimide compounds, triarylamine compounds, and aminoacridine compounds. Component (E) may also include pyrazoline compounds from the viewpoint of further improving resolution.

[0055] Examples of pyrazoline compounds include 1-(4-methoxyphenyl)-3-styryl-5-phenyl-pyrazoline, 1-phenyl-3-(4-methoxystyryl)-5-(4-methoxyphenyl)-pyrazoline, 1,5-bis-(4-methoxyphenyl)-3-(4-methoxystyryl)-pyrazoline, 1-(4-isopropylphenyl)-3-styryl-5-phenyl-pyrazoline, 1-phenyl-3-(4-isopropylstyryl)-5-(4-isopropylphenyl)-pyrazoline, and 1,5-bis-(4-isopropylphenyl)-3-(4- Isopropylstyryl)-pyrazoline, 1-(4-methoxyphenyl)-3-(4-tert-butyl-styryl)-5-(4-tert-butyl-phenyl)-pyrazoline, 1-(4-tert-butyl-phenyl)-3-(4-methoxystyryl)-5-(4-methoxyphenyl)-pyrazoline, 1-(4-isopropyl-phenyl)-3-(4-tert-butyl-styryl)-5-(4-tert-butyl-phenyl)-pyrazoline, 1-(4-tert-butyl-phenyl)-3-(4-isopropyl-styryl)-5-(4-isopropyl 1-(4-methoxyphenyl)-pyrazoline, 1-(4-methoxyphenyl)-3-(4-isopropylstyryl)-5-(4-isopropylphenyl)-pyrazoline, 1-(4-isopropylphenyl)-3-(4-methoxystyryl)-5-(4-methoxyphenyl)-pyrazoline, 1-phenyl-3-(3,5-dimethoxystyryl)-5-(3,5-dimethoxyphenyl)-pyrazoline, 1-phenyl-3-(3,4-dimethoxystyryl)-5-(3,4-dimethoxyphenyl)-pyrazoline, 1-phenyl-3-(2,6-dimethoxystyryl)-5 -(2,6-dimethoxyphenyl)-pyrazoline, 1-phenyl-3-(2,5-dimethoxystyryl)-5-(2,5-dimethoxyphenyl)-pyrazoline, 1-phenyl-3-(2,3-dimethoxystyryl)-5-(2,3-dimethoxyphenyl)-pyrazoline, 1-phenyl-3-(2,4-dimethoxystyryl)-5-(2,4-dimethoxyphenyl)-pyrazoline, 1-(4-methoxyphenyl)-3-(3,5-dimethoxystyryl)-5-(3,5-dimethoxyphenyl)-pyrazoline, 1-(4-methoxyphenyl)-3-(3,4-Dimethoxystyryl)-5-(3,4-Dimethoxyphenyl)-Pyrazolin, 1-(4-Methoxyphenyl)-3-(2,6-Dimethoxystyryl)-5-(2,6-Dimethoxyphenyl)-Pyrazolin, 1-(4-Methoxyphenyl)-3-(2,5-Dimethoxystyryl)-5-(2,5-Dimethoxyphenyl)-Pyrazolin, 1-(4-Methoxyphenyl)-3-(2,3-Dimethoxystyryl)-5-(2,3-Dimethoxyphenyl)-Pyrazolin, 1-(4-Methoxyphenyl)-3-(2,4-Dimethoxystyryl)-5-(2 ,4-dimethoxyphenyl)-pyrazoline, 1-(4-tert-butylphenyl)-3-(3,5-dimethoxystyryl)-5-(3,5-dimethoxyphenyl)-pyrazoline, 1-(4-tert-butylphenyl)-3-(3,4-dimethoxystyryl)-5-(3,4-dimethoxyphenyl)-pyrazoline, 1-(4-tert-butylphenyl)-3-(2,6-dimethoxystyryl)-5-(2,6-dimethoxyphenyl)-pyrazoline, 1-(4-tert-butylphenyl)-3-(2,5-dimethoxystyryl)-5 -(2,5-dimethoxyphenyl)-pyrazoline, 1-(4-tert-butylphenyl)-3-(2,3-dimethoxystyryl)-5-(2,3-dimethoxyphenyl)-pyrazoline, 1-(4-tert-butylphenyl)-3-(2,4-dimethoxystyryl)-5-(2,4-dimethoxyphenyl)-pyrazoline, 1-(4-isopropylphenyl)-3-(3,5-dimethoxystyryl)-5-(3,5-dimethoxyphenyl)-pyrazoline, 1-(4-isopropylphenyl)-3-(3,4-dimethoxystyryl)-5- (3,4-dimethoxyphenyl)-pyrazoline, 1-(4-isopropylphenyl)-3-(2,6-dimethoxystyryl)-5-(2,6-dimethoxyphenyl)-pyrazoline, 1-(4-isopropylphenyl)-3-(2,5-dimethoxystyryl)-5-(2,5-dimethoxyphenyl)-pyrazoline, 1-(4-isopropylphenyl)-3-(2,3-dimethoxystyryl)-5-(2,3-dimethoxyphenyl)-pyrazoline, and 1-(4-isopropylphenyl)-3-(2,4-dimethoxystyryl)-5-(2,4-dimethoxyphenyl)-pyrazoline is an example.

[0056] From the viewpoint of ease of synthesis and improved sensitivity, 1-phenyl-3-(4-methoxystyryl)-5-(4-methoxyphenyl)-pyrazoline is preferred, and from the viewpoint of ease of synthesis and improved solubility, 1-phenyl-3-(4-isopropylstyryl)-5-(4-isopropylphenyl)-pyrazoline is preferred.

[0057] The content of component (E) may be 0.01 to 5 parts by mass, 0.01 to 1 part by mass, or 0.01 to 0.2 parts by mass per 100 parts by mass of the total amount of components (A) and (B).

[0058] (Other ingredients) The photosensitive resin film and photosensitive resin composition according to this embodiment may further contain leucocrystal violet in addition to the above-mentioned components. This allows for a more balanced improvement in the photosensitivity and resolution of the photosensitive resin film. Leucocrystal violet has the property of a photochromic agent that absorbs light and produces a specific color, and it is believed that this property is responsible for the above-mentioned effect.

[0059] The leucocrystal violet content may be 0.01 to 10 parts by mass, 0.05 to 5 parts by mass, or 0.1 to 3 parts by mass per 100 parts by mass of the total amount of component (A) and component (B).

[0060] The photosensitive resin film and photosensitive resin composition of this embodiment may further contain, as needed, dyes such as malachite green, photochromicants other than tribromophenylsulfone and leucocrystal violet, thermal color inhibitors, plasticizers such as p-toluenesulfonamide, pigments, fillers, defoamers, flame retardants, stabilizers, adhesion promoters, leveling agents, peel accelerators, antioxidants, fragrances, imaging agents, thermal crosslinking agents, and the like.

[0061] Figure 1 is a schematic cross-sectional view showing one embodiment of a photosensitive resin film. The photosensitive resin film 1 according to this embodiment may be formed on a support film 2 using the above-described photosensitive resin composition. The photosensitive resin film according to this embodiment can be used in the form of a photosensitive element comprising a support film 2 and a photosensitive resin film 1 provided on the support film 2, as shown in Figure 1.

[0062] The thickness of the photosensitive resin film 1 is 35 to 300 μm. From the viewpoint of forming wiring patterns with a high aspect ratio, the thickness of the photosensitive resin film 1 may be 40 μm or more, 45 μm or more, or 50 μm or more. From the viewpoint of the release properties of the photosensitive resin film, the thickness of the photosensitive resin film 1 may be 250 μm or less, 200 μm or less, or 150 μm or less.

[0063] Examples of support films include polyester films such as polyethylene terephthalate (PET), polybutylene terephthalate (PBT), and polyethylene-2,6-naphthalate (PEN), as well as polyolefin films such as polypropylene and polyethylene.

[0064] The haze of the support film may be 0.01-5.0%, 0.01-1.5%, 0.01-1.0%, or 0.01-0.5%. Haze refers to the value measured using a commercially available turbidimeter in accordance with the method specified in JIS K7105. Haze can be measured with a commercially available turbidimeter such as the NDH-5000 (manufactured by Nippon Denshoku Industries Co., Ltd., product name).

[0065] The thickness of the support film may be 1-200 μm, 1-100 μm, 1-60 μm, 5-60 μm, 10-60 μm, 10-50 μm, 10-40 μm, 10-30 μm, or 10-25 μm. A support film thickness of 1 μm or more tends to suppress tearing of the support film when it is peeled off. Also, a support film thickness of 200 μm or less tends to yield greater economic benefits.

[0066] A protective film may be laminated on the side of the photosensitive resin film 1 opposite to the support film 2. A polymer film such as polyethylene or polypropylene may be used as the protective film. The same polymer film as the support film may be used, or a different polymer film may be used. It is preferable that the adhesive strength between the protective film and the photosensitive resin film 1 is less than the adhesive strength between the support film 2 and the photosensitive resin film 1.

[0067] The photosensitive resin film 1 can be formed, for example, by coating a photosensitive resin composition onto a support film 2 and then drying it. Coating can be done using known methods such as roll coating, comma coating, gravure coating, air knife coating, die coating, or bar coating. Drying can be done at 70 to 150°C for about 5 to 30 minutes.

[0068] When applying the photosensitive resin composition onto the support film 2, a solvent may be added to the photosensitive resin composition as needed to create a solution with a solid content of approximately 30-60% by mass. Examples of solvents include methanol, ethanol, acetone, methyl ethyl ketone, methyl cellosolve, ethyl cellosolve, toluene, N,N-dimethylformamide, and propylene glycol monomethyl ether. One solvent may be used alone or in combination of two or more. In this case, the amount of residual solvent in the photosensitive resin film is preferably 2% by mass or less to prevent the diffusion of the solvent in subsequent processes.

[0069] The form of the photosensitive element is not particularly limited. For example, it may be in the form of a sheet, or it may be wound in a roll on a core. When wound in a roll, the support film may be wound on the outside. Examples of the core include plastics such as polyethylene resin, polypropylene resin, polystyrene resin, polyvinyl chloride resin, or ABS resin (acrylonitrile-butadiene-styrene copolymer).

[0070] An end separator may be installed on the end face of the roll-shaped photosensitive element for end face protection, or a moisture-proof end separator may be installed to prevent edge fusion. The photosensitive element may be wrapped in a black sheet with low moisture permeability for packaging.

[0071] The photosensitive resin film according to this embodiment has excellent pattern-forming properties, and therefore can form a resist pattern with a high aspect ratio.

[0072] [Method for forming a resist pattern] The method for forming a resist pattern according to this embodiment comprises the steps of: providing a photosensitive layer on a substrate using the above-described photosensitive resin film (hereinafter also referred to as the "photosensitive formation step"); irradiating at least a part of the photosensitive layer with active light to form a photocured portion (hereinafter also referred to as the "exposure step"); and removing at least a part of the photosensitive layer other than the photocured portion to form a resist pattern (hereinafter also referred to as the "development step"). The resist pattern can also be called a photocured pattern of the photosensitive resin film or a relief pattern. Furthermore, the method for forming a resist pattern can also be called a method for manufacturing a substrate with a resist pattern.

[0073] In the photosensitive layer formation process, when using the above-mentioned photosensitive element, if the photosensitive element has a protective film, remove it, and then heat the photosensitive resin film to about 70-130°C while applying pressure of about 0.1-1 MPa (1-10 kgf / cm²) to the substrate under reduced pressure or normal pressure. 2 The layers are pressed together and laminated under pressure (to a certain degree) to form a photosensitive layer on the substrate. As the substrate, for example, a copper-clad laminate is used, in which copper foil is provided on one or both sides of a layer made of an insulating material such as glass fiber reinforced epoxy resin.

[0074] In the exposure process, the support film is removed, or the photosensitive layer is exposed with active light through the support film. Exposure methods include irradiating the active light in an image pattern through a negative or positive mask pattern called artwork (mask exposure method), irradiating the active light in an image pattern using projection exposure, and irradiating the active light in an image pattern using direct drawing exposure methods such as LDI (Laser Direct Imaging) exposure and DLP (Digital Light Processing) exposure.

[0075] As the light source for the active rays, known light sources can be used, such as carbon arc lamps, mercury vapor arc lamps, high-pressure mercury lamps, xenon lamps, gas lasers such as argon lasers, solid-state lasers such as YAG lasers, and semiconductor lasers that effectively emit ultraviolet and visible light.

[0076] From the viewpoint of improving adhesion, post-exposure baking (PEB) may be performed after exposure but before development. The temperature for PEB may be 50-100°C. A hot plate, box dryer, heated roll, etc. may be used as the heating device.

[0077] In the development process, at least a portion of the photosensitive layer other than the photocured portion is removed from the substrate, thereby forming a resist pattern on the substrate.

[0078] If a support film is present on the photosensitive layer, the support film is removed before removing (developing) the areas other than the photocured area (which can also be called the unexposed areas). There are two development methods: wet development and dry development, but wet development is more widely used.

[0079] In the case of wet development, development is carried out using a developer solution corresponding to the photosensitive resin composition and a known development method. Development methods include the dip method, paddle method, spray method, brushing, slapping, scrubbing, and agitation immersion. A high-pressure spray method may also be used to improve resolution. Two or more of these methods may be combined for development.

[0080] The composition of the developer is appropriately selected according to the composition of the photosensitive resin composition described above. Examples of developers include alkaline aqueous solutions and organic solvent developers.

[0081] From the standpoint of safety, stability, and good operability, an alkaline aqueous solution may be used as the developer. Examples of bases in the alkaline aqueous solution include alkali hydroxides such as lithium, sodium, or potassium hydroxide; alkali carbonates such as lithium, sodium, potassium, or ammonium carbonates or bicarbonates; alkali metal phosphates such as potassium phosphate and sodium phosphate; alkali metal pyrophosphates such as sodium pyrophosphate and potassium pyrophosphate; borax, sodium metasilicate, tetramethylammonium hydroxide, ethanolamine, ethylenediamine, diethylenetriamine, 2-amino-2-hydroxymethyl-1,3-propanediol, 1,3-diaminopropanol-2, and morpholine.

[0082] Examples of alkaline aqueous solutions used for developing include 0.1-5% by mass sodium carbonate aqueous solution, 0.1-5% by mass potassium carbonate aqueous solution, and 0.1-5% by mass sodium hydroxide aqueous solution. The pH of the alkaline aqueous solution may be in the range of 9-11, and the temperature of the alkaline aqueous solution can be adjusted according to the developing properties of the photosensitive layer.

[0083] The alkaline aqueous solution may contain, for example, a surfactant, an antifoaming agent, or a small amount of organic solvent to accelerate development. Examples of organic solvents used in the alkaline aqueous solution include acetone, ethyl acetate, alkoxyethanol having alkoxy groups with 1 to 4 carbon atoms, ethyl alcohol, isopropyl alcohol, butyl alcohol, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, and diethylene glycol monobutyl ether. Examples of organic solvents used in the organic solvent developer include 1,1,1-trichloroethane, N-methylpyrrolidone, N,N-dimethylformamide, cyclohexanone, methyl isobutyl ketone, and γ-butyrolactone. To prevent ignition, water may be added to the organic solvent in a range of 1 to 20% by mass to form the organic solvent developer.

[0084] In the resist pattern formation method of this embodiment, after removing the uncured portion in the development step, heating to approximately 60-250°C or 0.2-10 J / cm² is applied as needed. 2 The process may also include a step of further curing the resist pattern by performing a certain degree of exposure.

[0085] [Method for forming wiring patterns] The wiring pattern formation method according to this embodiment includes a step of forming a conductor pattern by plating a substrate on which a resist pattern has been formed by the resist pattern formation method described above. The wiring pattern formation method may further include a step of removing the photocured portion after the plating process.

[0086] In the plating process, a resist pattern formed on a substrate with a conductive layer is used as a mask, and copper or solder is plated onto the conductive layer of the substrate that is not covered by the resist. After the plating process, the resist is removed by removing the resist pattern as described later, and then the conductive layer that was covered by this resist is etched to form a conductive pattern.

[0087] The plating method may be electrolytic plating or electroless plating, but electroless plating is preferable. Examples of electroless plating include copper plating such as copper sulfate plating and copper pyrophosphate plating, solder plating such as high-slow solder plating, nickel plating such as Watt bath (nickel sulfate-nickel chloride) plating and nickel sulfamate plating, and gold plating such as hard gold plating and soft gold plating.

[0088] After the above plating process, the resist pattern on the substrate is removed. The resist pattern can be removed, for example, by using an aqueous solution that is even more strongly alkaline than the alkaline aqueous solution used in the above developing process. Examples of such strongly alkaline aqueous solutions include 1-10% by mass sodium hydroxide aqueous solution and 1-10% by mass potassium hydroxide aqueous solution. Among these, 1-5% by mass sodium hydroxide aqueous solution or potassium hydroxide aqueous solution may also be used.

[0089] After plating and removing the resist pattern, the desired printed circuit board can be manufactured by further etching the conductive layer covered with the resist to form a conductive pattern. The etching method used in this process is appropriately selected depending on the conductive layer to be removed. For example, the etching solution described above can be applied.

[0090] Methods for removing the resist pattern include, for example, immersion and spraying, which may be used individually or in combination.

[0091] Figure 2 shows one aspect of the process for forming a wiring pattern using a photosensitive resin film according to this embodiment.

[0092] In Figure 2(a), a photosensitive layer 20 is formed by laminating a photosensitive resin film 1 onto a substrate 10 on which a conductive layer has been formed on an insulating layer in the above photosensitive layer formation step. In Figure 2(b), an active light 30 is irradiated onto the photosensitive layer 20 in the above exposure step to form a photocurable area on the photosensitive layer 20. In Figure 2(c), a resist pattern 22, which is a photocurable area, is formed on the substrate 10 by removing the areas other than the photocurable area formed in the above exposure step from the substrate in the development step. In Figure 2(d), a plating layer 40 is formed on the substrate 10 that is not covered with resist by a plating process using the resist pattern 22 as a mask. In Figure 2(e), the resist pattern 22, which is a photocurable area, is peeled off with a strong alkaline aqueous solution to form a conductive pattern 42.

[0093] The photosensitive resin film according to this embodiment has excellent pattern-forming properties even when it is a thick film, and therefore can be suitably used, for example, in the manufacture of electronic circuit boards such as inductors. [Examples]

[0094] The objectives and advantages of this embodiment will be described in more detail below based on examples and comparative examples, but this embodiment is not limited to the following examples.

[0095] [Fabrication of photosensitive resin film] (Examples 1-5 and Comparative Example 1) Each component shown in Table 1 was mixed in the amounts shown in the table (the units of the values ​​in the table are parts by mass, and in the case of solutions, the amount is on a solid content basis) to prepare a solution of the photosensitive resin composition.

[0096] A solution of the photosensitive resin composition was uniformly applied to a 16 μm thick polyethylene terephthalate (PET) film (manufactured by Toray Industries, Inc., product name: FB-40), and dried in a hot air convection dryer at 70°C for 10 minutes and then at 100°C for 10 minutes to form a photosensitive resin film made of the above photosensitive resin composition on one side of the PET film used as a support film.

[0097] The details of each component shown in Table 1 are as follows:

[0098] (Component A) A-1: Ethylene glycol monomethyl ether / toluene solution of methacrylic acid / styrene / benzyl methacrylate copolymer (mass ratio: 32 / 45 / 23, Mw: 51000) (solids content: 47% by mass)

[0099] ((B) component) FA-321M: 2,2-Bis(4-(methacryloxypentaethoxy)phenyl)propane (Hitachi Chemical Co., Ltd., Number of EO groups: 10 (average value)) FA-024M: Polyalkylene glycol dimethacrylate (Hitachi Chemical Co., Ltd., Number of EO groups: 12 (average), Number of PO groups: 4 (average)) DPEA-12: Dipentaerythritol hexaacrylate containing EO groups (Nippon Kayaku Co., Ltd., Number of EO groups: 12 (average value)) UA-21EB: Triacrylate containing urethane bonds (Shin-Nakamura Chemical Industry Co., Ltd.)

[0100] ((C) component: photopolymerization initiator) B-CIM: 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetraphenylbiimidazole (Changzhou Strong Electronics New Materials Co., Ltd.)

[0101] (Component D: Polymerization inhibitor) TBC: 4-tert-butylcatechol (DIC Corporation)

[0102] ((E) component: photosensitizer) PZ-501D: 1-Phenyl-3-(4-methoxystyryl)-5-(4-methoxyphenyl)pyrazoline (Nippon Chemical Industries, Ltd.)

[0103] (Coloring agent) LCV: Leucocrystal violet (Yamada Chemical Industries Co., Ltd.) (dye) MKG: Malachite Green (Osaka Organic Chemical Industry Co., Ltd.) (Adhesion enhancer) SF-808H: A mixture of carboxybenzotriazole, 5-amino-1H-tetrazole, and methoxypropanol (Sanwa Chemical Co., Ltd.)

[0104] [resolution] A copper-clad laminate (manufactured by Hitachi Chemical Co., Ltd., product name "MCL-E-67"), in which copper foil (thickness: 12 μm) was laminated on both sides of a glass fiber reinforced epoxy resin layer, was washed with water, pickled, and then dried with an airflow. Next, the copper-clad laminate was heated to 80°C, and a photosensitive resin film was laminated onto the copper surface of the copper-clad laminate. Lamination was performed using a heat roll at 110°C with a pressing pressure of 0.4 MPa and a roll speed of 1.0 m / min. In this way, a laminate was obtained in which the copper-clad laminate, the photosensitive layer, and the PET film were laminated in this order.

[0105] A phototool with a 41-step tablet, each measuring 3mm x 12mm and with a density range of 0.00 to 2.00, a density step of 0.05, and a tablet size of 20mm x 187mm, was placed on a laminated PET film as a negative mask. The photosensitive layer was then exposed to a predetermined amount of energy using a parallel light exposure apparatus (manufactured by Oak Manufacturing Co., Ltd., product name "EXM-1201") that uses a high-pressure mercury lamp as a light source.

[0106] On the laminated PET film, two photomasks, Hitachi Test Pattern No. G2 (resolution evaluation negative: having a wiring pattern with line width / space width of x / x (x: 30~200, unit: μm)) and No. 3 (resolution evaluation negative: having a wiring pattern with line width / space width of x / x (x: 6~47, unit: μm)), were used as negatives for resolution evaluation. Exposure was performed at an energy level that resulted in 14.0 remaining step stages after development of the Hitachi 41-step tablet. After exposure, the PET film was peeled off, and a 1% by mass sodium carbonate aqueous solution at 30°C was sprayed for twice the shortest development time (the shortest time for the unexposed areas to be removed) to remove the unexposed areas.

[0107] After development, the resolution was evaluated using the smallest line width / space width value among the resist patterns formed with cleanly removed space areas (unexposed areas) and no meandering or missing lines. Resolution was evaluated by the minimum space width. A smaller value indicates better resolution.

[0108] [Flexibility] The copper-clad laminate was replaced with an FPC substrate (manufactured by Nikkan Industries Co., Ltd., product name: F-30VC1, substrate thickness: 25 μm, copper thickness: 18 μm), and a laminate was obtained in which the FPC substrate, photosensitive layer, and PET film were laminated in that order.

[0109] From the PET film side of the above laminate, exposure was performed using a parallel light exposure apparatus (EXM-1201) at an energy level that resulted in 14 remaining step stages after development of a 41-step tablet, thereby photocuring the photosensitive layer. After peeling off the PET film and developing it, a substrate for flexibility evaluation was obtained on the FPC substrate with a 10 mm × 100 mm resist pattern formed on it.

[0110] After rubbing a flexibleness evaluation substrate against a cylindrical rod five times at a 180° angle, the smallest cylindrical diameter (mm) at which peeling did not occur between the FPC substrate and the resist pattern was determined. The cylindrical diameters were evaluated at 2, 3, 4, 5, 6, 8, 9, 10, 11, 12, 13, 15, 20, 25, and 30 (units: mm). A smaller minimum cylindrical diameter indicates greater flexibility. When peeling was observed between the FPC substrate and the resist layer at a cylindrical diameter of 30 mm, the evaluation result was recorded as ">30".

[0111] [Table 1] [Explanation of Symbols]

[0112] 1...Photosensitive resin film, 2...Support film, 10...Substrate, 20...Photosensitive layer, 22...Resist pattern, 30...Activated light, 40...Plating layer, 42...Conductor pattern.

Claims

1. It contains a binder polymer, a photopolymerizable compound, a photopolymerization initiator, a polymerization inhibitor, and a photosensitizer. The photopolymerizable compound includes a (meth)acrylate having a urethane bond, The polymerization inhibitor comprises alkylcatechol, The photosensitizer comprises a pyrazoline compound, The amount of the polymerization inhibitor is 0.03 to 0.3 parts by mass per 100 parts by mass of the total amount of the binder polymer and the photopolymerizable compound. The amount of the photosensitizer is 0.01 to 5 parts by mass per 100 parts by mass of the total amount of the binder polymer and the photopolymerizable compound. A photosensitive resin film with a thickness of 35 to 300 μm.

2. The photosensitive resin film according to claim 1, wherein the photopolymerizable compound comprises a (meth)acrylate compound having a skeleton derived from dipentaerythritol or pentaerythritol.

3. The photosensitive resin film according to claim 1 or 2, wherein the photopolymerizable compound comprises polyalkylene glycol di(meth)acrylate.

4. The photosensitive resin film according to any one of claims 1 to 3, wherein the binder polymer has structural units based on (meth)acrylate benzyl ester.

5. A photosensitive resin film according to any one of claims 1 to 4, having a thickness of 50 to 300 μm.

6. A step of providing a photosensitive layer on a substrate using a photosensitive resin film according to any one of claims 1 to 5, The steps include irradiating at least a portion of the photosensitive layer with active light to form a photocured portion, A step of removing at least a portion of the photosensitive layer other than the photocured portion to form a resist pattern, A method for forming a resist pattern, comprising the following features.

7. A method for forming a wiring pattern, comprising the step of plating a substrate on which a resist pattern has been formed by the resist pattern forming method described in claim 6 to form a conductor pattern.

8. The method for forming a wiring pattern according to claim 7, further comprising the step of removing the photocured portion after the plating treatment.

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