Substrate processing apparatus and substrate processing method

Abstract

To provide a substrate processing apparatus and a substrate processing method capable of supplying a processing liquid containing less particles to a processing unit.SOLUTION: A substrate processing apparatus 100 includes a processing unit, a reservoir 31, a processing liquid pipe 32, a pump 34, a filter 35, a first flow unit 36, a first return pipe 51, a first adjustment valve 52, a second return pipe 41, a branch supply pipe 16, a second flow unit 42, and a control unit. The first flow unit 36 is arranged in the processing liquid pipe 32 and measures the flow rate or pressure of the processing liquid flowing through the processing liquid pipe 32. The first adjustment valve 52 is arranged in the first return pipe 51 and adjusts the flow rate of the processing liquid flowing through the first return pipe 51. The control unit controls the degree of opening of the first adjustment valve 52 on the basis of the flow rate or pressure of the processing liquid measured by the first flow unit 36.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a substrate processing apparatus and a substrate processing method.

Background Art

[0002] In the manufacturing process of semiconductor devices or liquid crystal display devices, etc., a substrate processing apparatus for processing substrates such as semiconductor wafers or glass substrates for liquid crystal display devices is used. A single-wafer substrate processing apparatus that processes substrates one by one has been disclosed. Such a substrate processing apparatus includes a processing unit, a processing liquid tank for storing the processing liquid supplied to the processing unit, a circulation pipe for circulating the processing liquid in the processing liquid tank, a pump for sending the processing liquid in the processing liquid tank to the circulation pipe, and a filter for filtering the processing liquid flowing through the circulation pipe (see, for example, Patent Document 1 and Patent Document 2).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, in the substrate processing apparatuses described in Patent Document 1 and Patent Document 2, there are cases where a plurality of particles in the processing liquid are not sufficiently removed by the filter.

[0005] The present invention has been made in view of the above problems, and an object thereof is to provide a substrate processing apparatus and a substrate processing method capable of supplying a processing liquid with a low particle content to a processing unit.

Means for Solving the Problems

[0006] The substrate processing apparatus according to the present invention comprises a processing unit, a storage unit, processing liquid piping, a pump, a filter, a first flow unit, a first return pipe, a first adjustment valve, a second return pipe, a branch supply pipe, a second flow unit, and a control unit. The processing unit processes the substrate with processing liquid. The storage unit stores the processing liquid. The processing liquid piping is connected to the storage unit, and the processing liquid flows through it. The pump is located in the processing liquid piping and supplies the processing liquid from the storage unit to the processing unit. The filter is located in the processing liquid piping and captures particles in the processing liquid. The first flow unit is located in the processing liquid piping and measures the flow rate or pressure of the processing liquid flowing through the processing liquid piping. The first return pipe is connected to the downstream end of the processing liquid piping and returns the processing liquid to the storage unit. The first adjustment valve is located in the first return pipe and adjusts the flow rate of the processing liquid flowing through the first return pipe. The second return pipe is connected to the downstream end of the processing liquid piping and returns the processing liquid to the storage unit. The branch supply pipe branches off from the second return pipe and supplies the processing liquid to the processing unit. The second flow unit measures the flow rate of the processing liquid flowing through the second return pipe. The control unit controls the opening degree of the first adjustment valve based on the flow rate or pressure of the processing liquid measured by the first flow unit.

[0007] There may be multiple second return pipes and second flow units. The substrate processing apparatus may include multiple second adjustment valves, each positioned in one of the multiple second return pipes, for adjusting the flow rate of the processing liquid flowing through the corresponding second return pipe. The control unit may control the opening degree of the second adjustment valve corresponding to the second flow unit based on the flow rate of the processing liquid measured in the second flow unit. The control unit may control the opening of a plurality of second adjustment valves so that the processing liquid flows through each of the plurality of second return pipes at a predetermined flow rate, and control the opening of the first adjustment valve so that the processing liquid flows through the processing liquid piping at a first flow rate, thereby realizing a first state in which the processing liquid flows through all of the plurality of second return pipes. The control unit may control the opening of a plurality of second adjustment valves so that the processing liquid does not flow into at least one of the plurality of second return pipes, and the processing liquid flows at a predetermined flow rate into the remaining second return pipes, and control the opening of the first adjustment valve so that the processing liquid flows at a first flow rate into the processing liquid piping, thereby realizing a second state in which the processing liquid does not flow into at least one of the plurality of second return pipes, and the processing liquid flows into the remaining second return pipes. The control unit may control the opening of the first adjustment valve based on the flow rate of the processing liquid measured in the first flow unit, so that the flow rate of the processing liquid flowing through the processing liquid piping becomes a predetermined flow rate. The control unit may also control the opening of the first adjustment valve without relying on the flow rate or pressure of the processing liquid measured in the second flow unit. The substrate processing apparatus according to the present invention comprises a processing unit, a storage unit, processing liquid piping, a pump, a filter, a first flow meter, a first return pipe, a first adjustment valve, a second return pipe, a branch supply pipe, a second flow meter, and a control unit. The processing unit processes the substrate with processing liquid. The storage unit stores the processing liquid. The processing liquid piping is connected to the storage unit, and the processing liquid flows through it. The pump is located in the processing liquid piping and supplies the processing liquid from the storage unit to the processing unit. The filter is located in the processing liquid piping and captures particles in the processing liquid. The first flow meter is located in the processing liquid piping and measures the flow rate of the processing liquid flowing through the processing liquid piping. The first return pipe is connected to the downstream end of the processing liquid piping and returns the processing liquid to the storage unit. The first adjustment valve is located in the first return pipe and adjusts the flow rate of the processing liquid flowing through the first return pipe. The second return pipe is connected to the downstream end of the processing liquid piping and returns the processing liquid to the storage unit. The branch supply pipe branches off from the second return pipe and supplies the processing liquid to the processing unit. The second flow meter is located on the second return pipe and upstream of the branch supply pipe, and measures the flow rate of the processing liquid flowing through the branch supply pipe. The control unit controls the opening degree of the first adjustment valve based on the flow rate of the processing liquid measured by the first flow meter. There may be multiple second return pipes and second flow meters. The substrate processing apparatus may include multiple second adjustment valves, each positioned in one of the multiple second return pipes, for adjusting the flow rate of the processing liquid flowing through the corresponding second return pipe. The control unit may control the opening degree of the second adjustment valve corresponding to the second flow meter based on the flow rate of the processing liquid measured by the second flow meter. The control unit may control the opening of the first adjustment valve based on the flow rate of the processing liquid measured by the first flow meter, so that the flow rate of the processing liquid flowing through the processing liquid piping becomes a predetermined flow rate. Alternatively, the control unit may control the opening of the first adjustment valve without relying on the flow rate of the processing liquid measured by the second flow meter.

[0008] In one embodiment, the second flow unit is located in the second return pipe, downstream of the branch supply pipe, and measures the pressure of the processing liquid flowing through the second return pipe.

[0009] In one embodiment, the control unit controls the opening degree of the first adjustment valve so that the flow rate of the processing liquid flowing through the processing liquid piping becomes a predetermined flow rate.

[0010] In one embodiment, the substrate processing apparatus further comprises a temperature controller located in the processing liquid piping. The temperature controller adjusts the temperature of the processing liquid flowing through the processing liquid piping.

[0011] In one embodiment, the substrate processing apparatus further includes a second adjustment valve located in the second return pipe for adjusting the flow rate of the processing liquid flowing through the second return pipe. The control unit controls the opening degree of the first adjustment valve and the opening degree of the second adjustment valve.

[0012] In one embodiment, the substrate processing apparatus further includes a thermometer placed in the processing liquid piping for measuring the temperature of the processing liquid flowing through the processing liquid piping, and the control unit controls the opening degree of the second adjustment valve based on the temperature of the processing liquid measured by the thermometer.

[0013] In one embodiment, the processing unit includes a nozzle located at the downstream end of the branch supply pipe, a switching unit for switching between supplying and stopping the processing liquid from the branch supply pipe to the nozzle, and a third return pipe that branches off from the branch supply pipe and is connected to the second return pipe downstream of the second adjustment valve.

[0014] The substrate processing method according to the present invention is a substrate processing apparatus comprising: a processing unit for processing a substrate with a processing liquid; a storage unit for storing the processing liquid; a processing liquid piping connected to the storage unit through which the processing liquid flows; a pump arranged in the processing liquid piping; a filter arranged in the processing liquid piping; a first flow unit arranged in the processing liquid piping; a first return pipe connected to the downstream end of the processing liquid piping for returning the processing liquid to the storage unit; a first adjustment valve arranged in the first return pipe for adjusting the flow rate of the processing liquid flowing through the first return pipe; a second return pipe connected to the downstream end of the processing liquid piping for returning the processing liquid to the storage unit; a branch supply pipe branching from the second return pipe for supplying the processing liquid to the processing unit; and a second flow unit arranged in the second return pipe. The substrate processing method includes the steps of supplying the processing liquid from the storage unit to the processing liquid piping, capturing particles in the processing liquid, and controlling the flow rate or pressure of the processing liquid flowing through the processing liquid piping. By the first flow section The process of measuring and the flow rate or pressure of the processing liquid flowing through the second return pipe By the second flow sectionIt includes a step of measurement and a step of controlling the opening degree of the first adjustment valve based on the flow rate or pressure of the processing liquid measured in the first flow rate section. There may be multiple second return pipes and second flow units. The substrate processing apparatus may also include multiple second adjustment valves, each positioned in one of the multiple second return pipes, for adjusting the flow rate of the processing liquid flowing through the corresponding second return pipe. The step of controlling the opening degree of the first adjustment valve may include the step of controlling the opening degree of a plurality of second adjustment valves so that a predetermined flow rate of the processing liquid flows through each of the plurality of second return pipes, based on the flow rate or pressure of the processing liquid measured at a plurality of second flow units, and controlling the opening degree of the first adjustment valve so that a first flow rate of the processing liquid flows through the processing liquid piping, based on the flow rate or pressure of the processing liquid measured at the first flow unit, thereby realizing a first state in which the processing liquid flows through all of the plurality of second return pipes. The substrate processing method may further include a step of controlling the opening degree of a plurality of second adjustment valves based on the flow rate or pressure of the processing liquid measured in a plurality of second flow units, such that the processing liquid does not flow into at least one of the plurality of second return pipes, and the processing liquid flows at a predetermined flow rate in the remaining second return pipes, and controlling the opening degree of a first adjustment valve based on the flow rate or pressure of the processing liquid measured in a first flow unit, such that the processing liquid flows at a first flow rate in the processing liquid piping, thereby realizing a second state in which the processing liquid does not flow into at least one of the predetermined second return pipes, and the processing liquid flows in the remaining second return pipes. The step of controlling the opening degree of the first adjustment valve may include a step of controlling the opening degree of the first adjustment valve based on the flow rate of the processing liquid measured in the first flow unit, so that the flow rate of the processing liquid flowing through the processing liquid piping becomes a predetermined flow rate. In the step of controlling the opening degree of the first adjustment valve, the opening degree of the first adjustment valve may be controlled without being based on the flow rate or pressure of the processing liquid measured in the second flow unit.

Advantages of the Invention

[0015] According to the substrate processing apparatus and the substrate processing method of the present invention, a processing liquid with a low particle content can be supplied to the processing unit.

Brief Description of the Drawings

[0016] [Figure 1] It is a schematic diagram of a substrate processing apparatus according to Embodiment 1 of the present invention. [Figure 2] It is a schematic diagram of a processing tower included in the substrate processing apparatus according to Embodiment 1. [Figure 3] It is a block diagram showing the substrate processing apparatus according to Embodiment 1. [Figure 4] It is a schematic diagram of a substrate processing apparatus according to Embodiment 1. [Figure 5] It is a flowchart showing the processing by the control unit included in the substrate processing apparatus of Embodiment 1. [Figure 6] It is a schematic diagram of a processing tower included in the substrate processing apparatus according to Embodiment 2 of the present invention. [Figure 7] It is a schematic diagram of a processing tower included in the substrate processing apparatus according to Embodiment 3 of the present invention. [Figure 8] It is a schematic diagram of a substrate processing apparatus according to Embodiment 4 of the present invention. [Figure 9] It is a schematic diagram of a processing tower included in the substrate processing apparatus according to Embodiment 4. [Figure 10] It is a block diagram showing the substrate processing apparatus according to Embodiment 4.

Modes for Carrying Out the Invention

[0017] Embodiments of the present invention will be described below with reference to the drawings (Figures 1 to 10). However, the present invention is not limited to the following embodiments. Note that explanations may be omitted where necessary to avoid repetition. Also, in the figures, the same or corresponding parts are denoted by the same reference numerals, and the explanation will not be repeated.

[0018] The substrate processing apparatus and substrate processing method according to the present invention can be applied to various types of substrates, including semiconductor wafers, photomask glass substrates, liquid crystal display glass substrates, plasma display glass substrates, FED (Field Emission Display) substrates, optical disk substrates, magnetic disk substrates, and magneto-optical disk substrates. In the following description, this embodiment will mainly be explained using a substrate processing apparatus and substrate processing method that processes a disc-shaped semiconductor wafer as an example, but the substrate processing apparatus and substrate processing method according to the present invention can be similarly applied to various types of substrates other than the semiconductor wafers mentioned above. Furthermore, the shape of the substrate is not limited to a disc shape, and the substrate processing apparatus and substrate processing method according to the present invention can be applied to substrates of various shapes.

[0019] In this embodiment, the "processing solution" includes an etching solution, a rinsing solution, SC1, and SC2. The etching solution etches the substrate W. The etching solution is, for example, hydrofluoric acid (a mixture of hydrofluoric acid (HF) and nitric acid (HNO3)), hydrofluoric acid, buffered hydrofluoric acid (BHF), ammonium fluoride, HFEG (a mixture of hydrofluoric acid and ethylene glycol), sulfuric acid (H2SO4), or phosphoric acid (H3PO4). The rinsing solution rinses the substrate W. Specifically, the rinsing solution is used to wash away any etching solution remaining on the substrate W. The rinsing solution is, for example, deionized water, carbonated water, electrolyzed ionized water, hydrogen water, ozonated water, hydrochloric acid water at a diluted concentration (e.g., about 10 ppm to 100 ppm), or an organic solvent. The organic solvent is, for example, IPA (isopropyl alcohol) or sulfuric acid. SC1 and SC2 each clean the substrate W. SC1 is, for example, a mixture containing NH4OH and H2O2. The processing solution is not particularly limited, but in embodiments 1 to 3 below, the case where the processing solution is IPA will be described.

[0020] [Embodiment 1] Embodiment 1 of the present invention will be described below with reference to Figures 1 to 5. First, the substrate processing apparatus 100 of Embodiment 1 will be described with reference to Figures 1 and 2. Figure 1 is a schematic diagram of the substrate processing apparatus 100 of Embodiment 1. More specifically, Figure 1 is a schematic cross-sectional view of the substrate processing apparatus 100. The substrate processing apparatus 100 processes a substrate W. More specifically, the substrate processing apparatus 100 is a single-wafer type apparatus.

[0021] As shown in Figure 1, the substrate processing apparatus 100 comprises a plurality of processing towers 10, a plurality of branch supply pipes 16, a plurality of external circulation pipes 41, a fluid cabinet 30, and a platform 20. Each of the plurality of external circulation pipes 41 is an example of a "second return pipe".

[0022] The fluid cabinet 30 includes a processing liquid tank 31. The processing liquid tank 31 is an example of a "storage section". The processing liquid tank 31 stores the processing liquid.

[0023] Each of the multiple external circulation pipes 41 returns the processed liquid supplied from the fluid cabinet 30 to the processed liquid tank 31. Each of the multiple external circulation pipes 41 is a tubular member having a flow passage through which the processed liquid flows. Specifically, the upstream end of each of the multiple external circulation pipes 41 is connected to the fluid cabinet 30. The downstream end of each of the multiple external circulation pipes 41 is connected to the processed liquid tank 31.

[0024] Specifically, the multiple external circulation pipes 41 include, for example, a first external circulation pipe 41A, a second external circulation pipe 41B, and a third external circulation pipe 41C. In other words, the substrate processing apparatus 100 according to Embodiment 1 is equipped with three external circulation pipes 41.

[0025] The multiple processing towers 10 include, for example, a first processing tower 10A, a second processing tower 10B, and a third processing tower 10C. In other words, the substrate processing apparatus 100 according to Embodiment 1 comprises three processing towers 10. The multiple processing towers 10 have similar configurations to each other.

[0026] The multiple branch supply pipes 16 include, for example, a first branch supply pipe 16A, a second branch supply pipe 16B, and a third branch supply pipe 16C. The first branch supply pipe 16A branches off from the first external circulation pipe 41A and supplies the treatment liquid to the first treatment tower 10A. The second branch supply pipe 16B branches off from the second external circulation pipe 41B and supplies the treatment liquid to the second treatment tower 10B. The third branch supply pipe 16C branches off from the third external circulation pipe 41C and supplies the treatment liquid to the third treatment tower 10C.

[0027] Next, with reference to Figure 2, the first processing tower 10A will be described. Figure 2 is a schematic diagram of the processing tower 10 included in the substrate processing apparatus 100 of Embodiment 1. More specifically, Figure 2 is a schematic cross-sectional view of the processing tower 10. As shown in Figure 2, the first processing tower 10A includes a plurality of processing units 11.

[0028] Each of the multiple processing units 11 supplies processing liquid to the substrate W and processes the substrate W. Each of the multiple processing units 11 is a single-wafer processing unit 11 that processes one substrate W at a time.

[0029] Specifically, the first processing tower 10A includes a plurality of processing units 11 stacked vertically. The plurality of processing units 11 include, for example, a first processing unit 11A, a second processing unit 11B, and a third processing unit 11C. In other words, the processing unit 11 according to Embodiment 1 comprises three processing units 11.

[0030] The first branch supply pipe 16A includes, for example, a first supply pipe 16AA, a second supply pipe 16AB, and a third supply pipe 16AC. Each of the first branch supply pipes 16A is a tubular member having a flow passage through which the processing liquid flows.

[0031] The first supply pipe 16AA supplies the processing liquid from the first external circulation pipe 41A to the first processing unit 11A. The second supply pipe 16AB supplies the processing liquid from the first external circulation pipe 41A to the second processing unit 11B. The third supply pipe 16AC supplies the processing liquid from the first external circulation pipe 41A to the third processing unit 11C. The multiple processing units 11 have similar configurations to each other. The first processing unit 11A will be described below.

[0032] The first processing unit 11A comprises a chamber 12, a spin chuck 13, a nozzle 14, and an on / off valve 15. The chamber 12 has a substantially box shape. The chamber 12 houses the substrate W, the spin chuck 13, and the nozzle 14. The spin chuck 13 rotates the substrate W around a vertical axis of rotation passing through the center of the substrate W while holding it in a horizontal position.

[0033] The nozzle 14 is connected to the downstream end of the first supply pipe 16AA. The nozzle 14 is positioned above the substrate W. As a result, the nozzle 14 discharges the processing liquid from above the substrate W toward the substrate W.

[0034] The on / off valve 15 opens and closes the first supply pipe 16AA. In other words, the on / off valve 15 switches the supply of processing liquid from the first external circulation pipe 41A to the nozzle 14 on and off. The on / off valve 15 is, for example, a motor needle valve whose opening and closing is controlled by electricity.

[0035] Next, the fluid cabinet 30 will be described in detail. Specifically, the fluid cabinet 30 further includes a processing liquid piping 32 and a first return pipe 51.

[0036] The processing liquid piping 32 is connected to the processing liquid tank 31. Specifically, the upstream end of the processing liquid piping 32 is connected to the processing liquid tank 31. The processing liquid piping 32 is a tubular member having a flow passage through which the processing liquid flows. Note that the cross-sectional area of ​​the flow passage of the processing liquid piping 32 in a plane perpendicular to the direction of flow of the processing liquid is greater than the total cross-sectional area. The total cross-sectional area is the sum of the cross-sectional areas of the flow passage of the first external circulation piping 41A, the cross-sectional area of ​​the flow passage of the second external circulation piping 41B, and the cross-sectional area of ​​the flow passage of the third external circulation piping 41C.

[0037] The fluid cabinet 30 further includes a pump 34, a filter 35, a first flow meter 36, and a heater 37. The first flow meter 36 is an example of a "first flow section". The heater 37 is an example of a "temperature controller". The first flow meter 36, pump 34, heater 37, and filter 35 are arranged in this order in the processing liquid piping 32 from upstream to downstream.

[0038] The first flow meter 36 measures the flow rate of the treatment liquid flowing through the treatment liquid piping 32. "Flow rate" refers, for example, to the flow rate of the treatment liquid passing through a unit area per unit time.

[0039] Pump 34 supplies the processing liquid from the processing liquid tank 31 to the processing liquid piping 32. Pump 34 is, for example, a bellows pump. The material of pump 34 is, for example, synthetic resin. For example, when high-temperature IPA (processing liquid) flows through pump 34, the synthetic resin constituting the bellows pump, etc., may dissolve, and multiple particles may be generated. Therefore, IPA (processing liquid) containing multiple particles may flow through the pump.

[0040] The heater 37 adjusts the temperature of the processing liquid flowing through the processing liquid piping 32. Specifically, the heater 37 heats the processing liquid flowing through the processing liquid piping 32.

[0041] The filter 35 captures multiple particles in the processing liquid. Specifically, the filter 35 has multiple pores. Each of the multiple pores penetrates in the direction of flow of the processing liquid. More specifically, the processing liquid flows from the upstream side to the downstream side of the filter 35 and passes through the multiple pores. Multiple particles contained in the processing liquid flowing upstream of the filter 35 are adsorbed by the walls that partition the multiple pores as they pass through the multiple pores. As a result, multiple particles are removed from the processing liquid.

[0042] Filter 35 includes, for example, a PTFE (polytetrafluoroethylene) hydrophilic membrane as a filtration membrane. The PTFE hydrophilic membrane is a membrane in which the surface of a PTFE substrate has been made hydrophilic. The pore diameter of the PTFE hydrophilic membrane used as filter 35 is, for example, smaller than 7 nm (a predetermined diameter). For example, particles with a diameter of 7 nm (a predetermined diameter) or larger cannot pass through the pore diameter, and particles smaller than 7 nm (a predetermined diameter) are adsorbed onto the wall surface depending on the capture capacity of filter 35, thereby removing multiple particles from the processing liquid. The capture capacity of filter 35 varies depending on, for example, the type of processing liquid passing through filter 35 (e.g., the solubility of synthetic resin in IPA), the flow rate of the processing liquid passing through filter 35 (the flow velocity acting on the particles), or the temperature of the processing liquid passing through filter 35.

[0043] The downstream end of the processing liquid piping 32 is connected to a plurality of external circulation piping 41. As a result, the particle-removed and heated processing liquid flows through each of the plurality of external circulation piping 41. In other words, the particle-removed and heated processing liquid is supplied to the plurality of processing towers 10.

[0044] The fluid cabinet 30 further includes a first return pipe 51 and a first regulating valve 52. The first return pipe 51 returns the processed liquid supplied from the processed liquid tank 31 to the processed liquid tank 31. Specifically, the upstream end of the first return pipe 51 is connected to the downstream end of the processed liquid piping 32. The downstream end of the first return pipe 51 is connected to the processed liquid tank 31. The first return pipe 51 is a tubular member having a flow passage through which the processed liquid flows. Note that the cross-sectional area of ​​the flow passage of the first return pipe 51 in a plane perpendicular to the flow direction of the processed liquid is greater than the total cross-sectional area. The total cross-sectional area is the sum of the cross-sectional area of ​​the flow passage of the first external circulation piping 41A, the cross-sectional area of ​​the flow passage of the second external circulation piping 41B, and the cross-sectional area of ​​the flow passage of the third external circulation piping 41C.

[0045] In detail, the cross-sectional area of ​​the flow passage of the first return pipe 51 is larger than the cross-sectional area of ​​each flow passage of the multiple external circulation pipes 41. Also, unlike the multiple external circulation pipes 41, the processing tower 10 is not connected to the first return pipe 51. Furthermore, unlike the multiple external circulation pipes 41, the first return pipe 51 is located inside the fluid cabinet 30.

[0046] The first adjustment valve 52 is located in the first return pipe 51. The first adjustment valve 52 adjusts the flow rate of the processing liquid flowing through the first return pipe 51. The first adjustment valve 52 adjusts the flow rate of the processing liquid flowing through the first return pipe 51 by adjusting its opening degree. The first adjustment valve 52 is, for example, a relief valve whose opening degree is controlled by air pressure. Because the opening degree can be controlled by air pressure, the control unit and the like can control the first adjustment valve 52 with good responsiveness.

[0047] As shown again in Figure 1, the fluid cabinet 30 further includes a plurality of external circulation flow meters 42. Each of the plurality of external circulation flow meters 42 is an example of a “second flow section”. The plurality of external circulation flow meters 42 include, for example, a first external circulation flow meter 42A, a second external circulation flow meter 42B, and a third external circulation flow meter 42C.

[0048] The first external circulation flow meter 42A is located in the first external circulation piping 41A. Specifically, the first external circulation flow meter 42A is located upstream of the first branch supply pipe 16A. The first external circulation flow meter 42A measures the flow rate of the treated liquid flowing through the first external circulation piping 41A.

[0049] The second external circulation flow meter 42B is located in the second external circulation piping 41B. Specifically, the second external circulation flow meter 42B is located upstream of the second branch supply pipe 16B. The second external circulation flow meter 42B measures the flow rate of the treated liquid flowing through the second external circulation piping 41B.

[0050] The third external circulation flow meter 42C is located in the third external circulation piping 41C. Specifically, the third external circulation flow meter 42C is located upstream of the third branch supply pipe 16C. The third external circulation flow meter 42C measures the flow rate of the treated liquid flowing through the third external circulation piping 41C.

[0051] The substrate processing apparatus 100 further includes a plurality of external circulation control valves 43. Each of the plurality of external circulation control valves 43 is an example of a "second control valve". The plurality of external circulation control valves 43 are located on the platform 20. In other words, the plurality of external circulation control valves 43 are located outside the fluid cabinet 30. The plurality of external circulation control valves 43 include, for example, a first external circulation control valve 43A, a second external circulation control valve 43B, and a third external circulation control valve 43C.

[0052] The first external circulation control valve 43A is located in the first external circulation piping 41A. Specifically, the first external circulation control valve 43A is located downstream of the first branch supply pipe 16A. The first external circulation control valve 43A adjusts the flow rate of the treated liquid flowing through the first external circulation piping 41A. The first external circulation control valve 43A adjusts the flow rate of the treated liquid flowing through the first external circulation piping 41A by adjusting its opening degree. The first external circulation control valve 43A is, for example, a relief valve whose opening degree is controlled by air pressure.

[0053] The second external circulation control valve 43B is located in the second external circulation piping 41B. Specifically, the second external circulation control valve 43B is located downstream of the second branch supply pipe 16B. The second external circulation control valve 43B adjusts the flow rate of the treated liquid flowing through the second external circulation piping 41B. The second external circulation control valve 43B adjusts the flow rate of the treated liquid flowing through the second external circulation piping 41B by adjusting its opening degree. The second external circulation control valve 43B is, for example, a relief valve whose opening degree is controlled by air pressure.

[0054] The third external circulation control valve 43C is located in the third external circulation piping 41C. Specifically, the third external circulation control valve 43C is located downstream of the third branch supply pipe 16C. The third external circulation control valve 43C adjusts the flow rate of the treated liquid flowing through the third external circulation piping 41C. The third external circulation control valve 43C adjusts the flow rate of the treated liquid flowing through the third external circulation piping 41C by adjusting its opening degree. The third external circulation control valve 43C is, for example, a relief valve whose opening degree is controlled by air pressure.

[0055] Next, the control device 60 will be described with reference to Figure 3. Figure 3 is a block diagram of the substrate processing apparatus 100. As shown in Figure 3, the control device 60 controls the operation of each part of the substrate processing apparatus 100. Specifically, the control device 60 includes a control unit 61 and a storage unit 62.

[0056] The control unit 61 has a processor. The control unit 61 has, for example, a CPU (Central Processing Unit) or an MPU (Micro Processing Unit). Alternatively, the control unit 61 may have a general-purpose computing machine.

[0057] The storage unit 62 stores data and computer programs. The data includes recipe data. The recipe data includes information indicating multiple recipes. Each of the multiple recipes specifies the processing content and processing procedure for the substrate W.

[0058] The storage unit 62 has a main memory. The main memory is, for example, a semiconductor memory. The storage unit 62 may further have an auxiliary storage device. The auxiliary storage device includes, for example, at least one of a semiconductor memory and a hard disk drive. The storage unit 62 may also include removable media.

[0059] The control unit 61 controls the operation of each part of the substrate processing apparatus 100 based on the computer program and data stored in the memory unit 62. For example, the control device 60 controls the first adjustment valve 52, the first external circulation adjustment valve 43A, the second external circulation adjustment valve 43B, and the third external circulation adjustment valve 43C. The control device 60 also acquires measurement results from the first flow meter 36, the first external circulation flow meter 42A, the second external circulation flow meter 42B, and the third external circulation flow meter 42C.

[0060] Here, with reference to Figures 1 and 3, the "first state" in which the substrate processing apparatus 100 processes the substrate W will be described. The "first state" refers to the state in which the substrate W is processed in all three processing towers: the first processing tower 10A, the second processing tower 10B, and the third processing tower 10C.

[0061] Specifically, the control unit 61 controls the first external circulation regulating valve 43A based on the flow rate of the processed liquid measured by the first external circulation flow meter 42A so that the processed liquid with flow rate RA flows through the first external circulation pipe 41A. It also controls the second external circulation regulating valve 43B based on the flow rate of the processed liquid measured by the second external circulation flow meter 42B so that the processed liquid with flow rate RB flows through the second external circulation pipe 41B. Furthermore, it controls the third external circulation regulating valve 43C based on the flow rate of the processed liquid measured by the third external circulation flow meter 42C so that the processed liquid with flow rate RC flows through the third external circulation pipe 41C.

[0062] Furthermore, the control unit 61 controls the first adjustment valve 52 based on the flow rate of the processing liquid measured by the first flow meter 36 so that a predetermined flow rate RT of processing liquid flows through the processing liquid piping 32. The predetermined flow rate RT is an arbitrary flow rate and is preset, for example, according to the capture capacity of the filter 35. As a result, the processing liquid at the predetermined flow rate RT passes through the heater 37 and the filter 35 in that order. Then, the processing liquid at flow rate RD flows through the first return pipe 51. The processing liquid at flow rate RD is the processing liquid at the predetermined flow rate RT from which the processing liquids at flow rates RA, RB, and RC have been removed.

[0063] Next, referring to Figure 4, we will describe the "second state" in which the substrate processing apparatus 100 processes the substrate W. Figure 4 is a schematic diagram of the substrate processing apparatus according to Embodiment 1. Figure 4 shows the state in which the substrate processing apparatus 100 is performing the "second state". Open valves are shown in white, and closed valves are shown in black. The "second state" indicates a state in which maintenance is performed on one of the processing towers 10 among the first processing tower 10A, the second processing tower 10B, and the third processing tower 10C. In the "second state", for example, the substrate W is processed in the first processing tower 10A and the second processing tower 10B, and the third processing tower 10C is maintained. Multiple processing towers 10 may be maintained simultaneously.

[0064] Specifically, maintenance workers close all on / off valves 15 included in the third treatment tower 10C. Then, the control unit 61 controls the first external circulation regulating valve 43A based on the flow rate of the treatment liquid measured by the first external circulation flow meter 42A so that the treatment liquid at flow rate RA flows through the first external circulation pipe 41A. Furthermore, the control unit 61 controls the second external circulation regulating valve 43B based on the flow rate of the treatment liquid measured by the second external circulation flow meter 42B so that the treatment liquid at flow rate RB flows through the second external circulation pipe 41B. In addition, the control unit 61 controls the third external circulation regulating valve 43C based on the flow rate of the treatment liquid measured by the third external circulation flow meter 42C so that the treatment liquid does not flow through the third external circulation pipe 41C.

[0065] Furthermore, the control unit 61 controls the first adjustment valve 52 based on the flow rate of the processing liquid measured by the first flow meter 36 so that a predetermined flow rate RT of processing liquid flows through the processing liquid piping 32. As a result, the processing liquid at the predetermined flow rate RT passes through the heater 37 and the filter 35 in that order. Then, processing liquid at a flow rate of (RD+RC) flows through the first return pipe 51. The processing liquid at a flow rate of (RD+RC) is the processing liquid at the predetermined flow rate RT minus the processing liquid at flow rates RA and RB.

[0066] Embodiment 1 of the present invention has been described above as shown in Figures 1 to 4. According to Embodiment 1, the control unit 61 controls the first adjustment valve 52 based on the flow rate of the processing liquid measured by the first flow meter 36. As a result, the flow rate of the processing liquid flowing through the processing liquid piping 32 is adjusted, so that the filter 35 can efficiently capture multiple particles in the processing liquid. Therefore, a processing liquid with a low particle content can be supplied to the processing tower 10.

[0067] Furthermore, the control unit 61 controls the opening of the first adjustment valve 52 so that the flow rate of the processing liquid flowing through the processing liquid piping 32 becomes a predetermined flow rate RT. As a result, the processing liquid flows through the processing liquid piping 32 at a predetermined flow rate RT, and the filter 35 exhibits a predetermined capture capacity. Therefore, processing liquid with a lower particle content can be supplied to the processing tower 10.

[0068] The control unit 61 then controls the opening degree of the first adjustment valve 52 and the opening degree of the external circulation adjustment valve 43. As a result, in both the "first state" and the "second state," a predetermined flow rate RT of processing liquid flows through the processing liquid piping 32, so that the filter 35 exhibits its predetermined capture capacity. Therefore, while maintaining the third processing tower 10C, processing liquid with a lower particle content can be supplied to the first processing tower 10A and the second processing tower 10B.

[0069] Furthermore, the heater 37 adjusts the temperature of the processing liquid flowing through the processing liquid piping 32. As a result, in both the "first state" and the "second state," a predetermined flow rate RT of processing liquid flows through the processing liquid piping 32, allowing the heater 37 to adjust the temperature of the processing liquid to a constant temperature. Therefore, processing liquid at a constant temperature can be supplied to the processing tower 10.

[0070] Next, the substrate processing method of Embodiment 1 will be described with reference to Figure 5. The substrate processing method of Embodiment 1 is performed by the substrate processing apparatus 100 described with reference to Figures 1 to 4. Figure 5 is a flowchart showing the processing performed by the control unit 61 of the substrate processing apparatus 100 of Embodiment 1.

[0071] As shown in Figure 5, first, the control unit 61 controls the first external circulation regulating valve 43A based on the flow rate of the processing liquid measured by the first external circulation flow meter 42A so that the processing liquid at flow rate RA flows through the first external circulation pipe 41A. Next, the control unit 61 controls the second external circulation regulating valve 43B based on the flow rate of the processing liquid measured by the second external circulation flow meter 42B so that the processing liquid at flow rate RB flows through the second external circulation pipe 41B. Furthermore, the control unit 61 controls the third external circulation regulating valve 43C based on the flow rate of the processing liquid measured by the third external circulation flow meter 42C so that the processing liquid at flow rate RC flows through the third external circulation pipe 41C. Finally, the control unit 61 controls the first regulating valve 52 based on the flow rate of the processing liquid measured by the first flow meter 36 so that the processing liquid at a predetermined flow rate RT flows through the processing liquid pipe 32 (step S101).

[0072] The control unit 61 determines whether the flow rate of the processing liquid measured by the first flow meter 36 is a predetermined flow rate RT (step S102). If the control unit 61 determines that the flow rate of the processing liquid measured by the first flow meter 36 is the predetermined flow rate RT (Yes in step S102), the process returns to step S102.

[0073] On the other hand, if the control unit 61 determines that the flow rate of the processing liquid measured by the first flow meter 36 is not the predetermined flow rate RT (No. in step S102), the control unit 61 controls the first adjustment valve 52 so that the flow rate of the processing liquid measured by the first flow meter 36 becomes the predetermined flow rate RT (step S103). When the processing is completed, the process returns to step S102.

[0074] [Embodiment 2] Embodiment 2 of the present invention will be described with reference to Figure 6. Figure 6 is a schematic diagram of the substrate processing apparatus 100 according to Embodiment 2. Figure 6 shows the state in which the substrate processing apparatus 100 is performing the "third state". The "third state" is a state in which the substrate W is processed in all of the first processing tower 10A, the second processing tower 10B, and the third processing tower 10C, and at least one processing unit 11 is being maintained. However, matters that differ from Embodiment 1 will be described, and explanations of matters that are the same as in Embodiment 1 will be omitted.

[0075] In the "third state," for example, the substrate W is processed in all three processing towers: the first processing tower 10A, the second processing tower 10B, and the third processing tower 10C, and one processing unit 11A in the first processing tower 10A is maintained. Specifically, maintenance workers close the on / off valve 15 located in the first supply pipe 16AA. The control unit 61 then controls the first external circulation adjustment valve 43A based on the flow rate of the processing liquid measured by the first external circulation flow meter 42A so that the processing liquid with a flow rate (RA-Ra) flows through the first external circulation pipe 41A. The control unit 61 also controls the second external circulation adjustment valve 43B based on the flow rate of the processing liquid measured by the second external circulation flow meter 42B so that the processing liquid with a flow rate RB flows through the second external circulation pipe 41B. Furthermore, the control unit 61 controls the third external circulation adjustment valve 43C based on the flow rate of the processing liquid measured by the third external circulation flow meter 42C so that the processing liquid with a flow rate RC flows through the third external circulation pipe 41C.

[0076] Furthermore, the control unit 61 controls the first adjustment valve 52 based on the flow rate of the processing liquid measured by the first flow meter 36 so that a predetermined flow rate RT of processing liquid flows through the processing liquid piping 32. As a result, the processing liquid at the predetermined flow rate RT passes through the heater 37 and the filter 35 in that order. Then, processing liquid at a flow rate of (RD+Ra) flows through the first return pipe 51. The processing liquid at a flow rate of (RD+Ra) is the processing liquid at the predetermined flow rate RT from which the processing liquid at flow rates (RA-Ra), RB, and RC has been removed.

[0077] As shown in Figure 6, Embodiment 2 of the present invention has been described above. According to Embodiment 2, the control unit 61 controls the first adjustment valve 52 based on the flow rate of the processing liquid measured by the first flow meter 36. As a result, in both the "first state" and the "third state," a predetermined flow rate RT of processing liquid flows through the processing liquid piping 32, so that the filter 35 exhibits a predetermined capture capacity. Therefore, processing liquid with a lower particle content can be supplied to other processing units 11 while maintaining the processing unit 11.

[0078] [Embodiment 3] Embodiment 3 of the present invention will be described with reference to Figure 7. Figure 7 is a schematic diagram of the substrate processing apparatus 100 according to Embodiment 3. Figure 7 shows the state in which the substrate processing apparatus 100 is performing the "third state". However, only the differences from Embodiment 2 will be described, and the same matters as in Embodiment 2 will be omitted. Embodiment 3 differs from Embodiment 2 in that it includes a third return pipe 18.

[0079] As shown in Figure 7, each of the multiple processing units 11 has an on / off valve 19 and a third return pipe 18. The on / off valve 19 is an example of a "switching unit". The on / off valve 19 switches the supply of processing liquid from the branch supply pipe 16 to the nozzle 14 and stops the supply. The on / off valve 19 is, for example, a motor needle valve whose opening and closing is controlled by electricity.

[0080] The third return pipe 18 branches off from the branch supply pipe 16A. The third return pipe 18 is connected to the external circulation piping 41 downstream of the external circulation control valve 43. The third return pipe 18 is a tubular member having a flow passage through which the processing liquid flows. When the on / off valve 19 is closed, the processing liquid flows into the third return pipe 18. As a result, the temperature of the nozzle 14 can be maintained by circulating the heated processing liquid through the third return pipe 18.

[0081] Specifically, maintenance workers close the on / off valve 19 of the nozzle 14 connected to the first supply pipe 16AA. Then, the control unit 61 controls the first external circulation regulating valve 43A based on the flow rate of the processed liquid measured by the first external circulation flow meter 42A so that the processed liquid with a flow rate (RA-Raa) flows through the first external circulation pipe 41A. Furthermore, the control unit 61 controls the second external circulation regulating valve 43B based on the flow rate of the processed liquid measured by the second external circulation flow meter 42B so that the processed liquid with a flow rate RB flows through the second external circulation pipe 41B. In addition, the control unit 61 controls the third external circulation regulating valve 43C based on the flow rate of the processed liquid measured by the third external circulation flow meter 42C so that the processed liquid with a flow rate RC flows through the third external circulation pipe 41C.

[0082] Furthermore, the control unit 61 controls the first adjustment valve 52 based on the flow rate of the processing liquid measured by the first flow meter 36 so that a predetermined flow rate RT of processing liquid flows through the processing liquid piping 32. As a result, the processing liquid at the predetermined flow rate RT passes through the heater 37 and the filter 35 in that order. Then, processing liquid at a flow rate of (RD+Raa) flows through the first return pipe 51. The processing liquid at a flow rate of (RD+Raa) is the processing liquid at the predetermined flow rate RT from which the processing liquid at flow rates (RA-Raa), RB, and RC has been removed.

[0083] As shown in Figure 7, Embodiment 3 of the present invention has been described above. According to Embodiment 3, the control unit 61 controls the first adjustment valve 52 based on the flow rate of the processing liquid measured by the first flow meter 36. In both the "first state" and the "third state," a predetermined flow rate RT of processing liquid flows through the processing liquid piping 32, so the filter 35 exhibits a predetermined capture capacity. Therefore, processing liquid with a lower particle content can be supplied to other processing units 11 while maintaining the processing unit 11.

[0084] [Embodiment 4] Embodiment 4 of the present invention will be described with reference to Figures 8 and 9. Figure 8 is a schematic diagram of the substrate processing apparatus 1100 according to Embodiment 4. Figure 9 is a schematic diagram of the processing tower 1010 included in the substrate processing apparatus 1100 of Embodiment 4. However, matters that differ from Embodiment 1 will be described, and explanations of matters that are the same as in Embodiment 1 will be omitted.

[0085] Embodiment 4 describes the case where the processing liquid is sulfuric acid. As shown in Figures 8 and 9, the processing liquid tank 31 stores the processing liquid. The processing liquid contains, for example, sulfuric acid. The viscosity of sulfuric acid is high at low temperatures and low at high temperatures. High-viscosity liquids can be difficult to measure accurately with a flow meter.

[0086] Embodiment 4 differs from Embodiment 1 in that it includes multiple external circulation pressure gauges 1042 instead of multiple external circulation flow meters 42. Specifically, the platform 20 further includes multiple external circulation pressure gauges 1042. Each of the multiple external circulation pressure gauges 1042 is an example of a "second flow section". The multiple external circulation pressure gauges 1042 include, for example, a first external circulation pressure gauge 1042A, a second external circulation pressure gauge 1042B, and a third external circulation pressure gauge 1042C.

[0087] The first external circulation pressure gauge 1042A is located in the first external circulation piping 41A. Specifically, the first external circulation pressure gauge 1042A is located downstream of the first branch supply pipe 16A. The first external circulation pressure gauge 1042A is located upstream of the first external circulation control valve 43A. The first external circulation pressure gauge 1042A measures the pressure of the treated liquid flowing through the first external circulation piping 41A.

[0088] The second external circulation pressure gauge 1042B is located in the second external circulation piping 41B. Specifically, the second external circulation pressure gauge 1042B is located downstream of the second branch supply pipe 16B. The second external circulation pressure gauge 1042B is located upstream of the second external circulation control valve 43B. The second external circulation pressure gauge 1042B measures the pressure of the treated fluid flowing through the second external circulation piping 41B.

[0089] The third external circulation pressure gauge 1042C is located in the third external circulation piping 41C. Specifically, the third external circulation pressure gauge 1042C is located downstream of the third branch supply pipe 16C. The third external circulation pressure gauge 1042C is located upstream of the third external circulation control valve 43C. The third external circulation pressure gauge 1042C measures the pressure of the treated fluid flowing through the third external circulation piping 41C.

[0090] The fluid cabinet 1030 further includes a pump 34, a filter 35, a first flow meter 36, a heater 37, and a thermometer 1038. The first flow meter 36, pump 34, heater 37, thermometer 1038, and filter 35 are arranged in the treatment liquid piping 32 in this order from upstream to downstream.

[0091] The thermometer 1038 measures the temperature of the processing liquid flowing through the processing liquid piping 32.

[0092] Next, the control device 1060 will be described with reference to Figure 10. Figure 4 is a block diagram of the substrate processing apparatus 1100. As shown in Figure 4, the control device 1060 includes a control unit 61 and a storage unit 1062.

[0093] The memory unit 1062 stores data and computer programs. The data includes first data showing the relationship between the temperature of the processing liquid flowing through the processing liquid piping 32, the pressure of the processing liquid flowing through the piping, and the flow rate of the processing liquid flowing through the piping. Alternatively, the data may include second data showing the relationship between the temperature of the processing liquid flowing through the processing liquid piping 32, the pressure of the processing liquid flowing through the piping, and the rotation speed of the pump 34, by understanding the relationship between the rotation speed of the pump 34 and the flow rate of the processing liquid flowing through the piping.

[0094] The control unit 61 controls the operation of each part of the substrate processing apparatus 100 based on the computer program and data stored in the memory unit 1062. For example, the control device 1060 acquires measurement results from the first flow meter 36, the first external circulation pressure meter 1042A, the second external circulation pressure meter 1042B, the third external circulation pressure meter 1042C, and the thermometer 1038. Based on the first data, the control device 1060 controls the first adjustment valve 52, the first external circulation adjustment valve 43A, the second external circulation adjustment valve 43B, the third external circulation adjustment valve 43C, and the pump 34. Specifically, the control device 1060 provides feedback control to the first adjustment valve 52, the first external circulation adjustment valve 43A, the second external circulation adjustment valve 43B, the third external circulation adjustment valve 43C, and the pump 34.

[0095] Embodiment 4 of the present invention has been described above as shown in Figures 8 to 10. According to Embodiment 4, the control unit 61 controls the first adjustment valve 52 based on the flow rate of the processing liquid measured by the first flow meter 36. As a result, the flow rate of the processing liquid flowing through the processing liquid piping 32 is adjusted, so that the filter 35 can efficiently capture multiple particles in the processing liquid. Therefore, a processing liquid with a low particle content can be supplied to the processing tower 10.

[0096] Furthermore, since Embodiment 4 is equipped with multiple external circulation pressure gauges 1042, the flow rate of the processing liquid flowing through the processing liquid piping 32 can be precisely adjusted even when the processing liquid is high-viscosity sulfuric acid. Therefore, a processing liquid with a low particle content can be supplied to the processing tower 10.

[0097] Embodiments of the present invention have been described above with reference to the drawings (Figures 1 to 10). However, the present invention is not limited to the embodiments described above, and can be implemented in various forms without departing from its spirit. Furthermore, the multiple components disclosed in the above embodiments can be modified as appropriate. For example, some components from all the components shown in one embodiment may be added to the components of another embodiment, or some components from all the components shown in one embodiment may be deleted from the embodiment.

[0098] The drawings schematically show each component in order to facilitate understanding of the invention, and the thickness, length, number, spacing, etc. of each component shown may differ from the actual dimensions due to the convenience of drawing creation. Furthermore, the configuration of each component shown in the above embodiments is merely an example and is not particularly limiting, and it goes without saying that various modifications are possible without substantially departing from the effects of the present invention.

[0099] (1) For example, in the "second state," the substrate W is processed in the first processing tower 10A and the second processing tower 10B, and the third processing tower 10C is maintained, but this is not particularly limited. In the "second state," the first processing tower 10A, the second processing tower 10B, and the third processing tower 10C may perform maintenance, including preparing to process the substrate W.

[0100] Specifically, all on-off valves 15 are closed. Then, the control unit 61 controls the first external circulation regulating valve 43A based on the flow rate of the processed liquid measured by the first external circulation flow meter 42A so that the processed liquid does not flow into the first external circulation pipe 41A. In addition, the control unit 61 controls the second external circulation regulating valve 43B based on the flow rate of the processed liquid measured by the second external circulation flow meter 42B so that the processed liquid does not flow into the second external circulation pipe 41B. Furthermore, the control unit 61 controls the third external circulation regulating valve 43C based on the flow rate of the processed liquid measured by the third external circulation flow meter 42C so that the processed liquid does not flow into the third external circulation pipe 41C.

[0101] Furthermore, the control unit 61 controls the first adjustment valve 52 based on the flow rate of the processing liquid measured by the first flow meter 36 so that a predetermined flow rate RT of processing liquid flows through the processing liquid piping 32. As a result, the processing liquid at the predetermined flow rate RT passes through the heater 37 and the filter 35 in that order. Then, the processing liquid with a flow rate of (RD+RA+RB+RC) flows through the first return pipe 51.

[0102] (2) For example, the downstream end of the first return pipe 51 is connected to the processing liquid tank 31, but is not particularly limited. The downstream end of the first return pipe 51 may be connected to the downstream end of the external circulation piping 41.

[0103] (3) For example, the first flow meter 36, the pump 34, the heater 37, and the filter 35 are arranged in the treatment liquid piping 32 from upstream to downstream in this order, but this is not particularly limited. The first flow meter 36 may be placed at any position in the treatment liquid piping 32.

[0104] (4) For example, the external circulation control valve 43 is located in the external circulation piping 41 downstream of the branch supply pipe 16, but is not particularly limited. The external circulation flow meter 42 may be located in the external circulation piping 41 upstream of the branch supply pipe 16.

[0105] (5) For example, a maintenance worker may operate the on / off valve 15 and the on / off valve 19, but this is not limited to any other operation. The control device 60 may also control the on / off valve 15 and the on / off valve 19.

[0106] (6) For example, the fluid cabinet 30 includes a first flow meter 36, but is not particularly limited. The fluid cabinet 30 may include a first pressure gauge instead of the first flow meter 36. [Industrial applicability]

[0107] This invention is useful in the field of substrate processing. [Explanation of Symbols]

[0108] 16: Branch supply pipe 31: Processing liquid tank (storage section) 32: Processing liquid piping 34: Pump 35: Filter 36: 1st flow meter 41: External circulation piping (second return pipe) 42:External circulation flowmeter (second flowmeter) 51: First return tube 52: First adjustment valve 100: Substrate processing equipment

Claims

1. A processing unit that processes the substrate with a processing solution, A storage section for storing the processing liquid, A processing liquid piping connected to the storage section through which the processing liquid flows, A pump is placed in the processing liquid piping and supplies the processing liquid from the storage unit to the processing liquid piping, A filter is placed in the processing liquid piping and captures particles in the processing liquid, A first flow unit is provided in the processing liquid piping and measures the flow rate or pressure of the processing liquid flowing through the processing liquid piping, A first return pipe is connected to the downstream end of the processing liquid piping and returns the processing liquid to the storage unit, A first adjustment valve is placed in the first return pipe and adjusts the flow rate of the processing liquid flowing through the first return pipe, Multiple second return pipes are connected to the downstream end of the processing liquid piping and return the processing liquid to the storage section, A branch supply pipe that branches off from a plurality of the second return pipes and supplies the processing liquid to the processing unit, A plurality of second flow units for measuring the flow rate or pressure of the processing liquid flowing through a plurality of the second return pipes, A plurality of second adjustment valves are arranged in each of the plurality of second return pipes to adjust the flow rate of the processing liquid flowing through the corresponding second return pipe, A control unit controls the opening degree of the first adjustment valve based on the flow rate or pressure of the processing liquid measured in the first flow unit, and controls the opening degree of the second adjustment valve corresponding to the second flow unit based on the flow rate or pressure of the processing liquid measured in the second flow unit. Equipped with, The control unit controls the opening of the multiple second adjustment valves so that the processing liquid flows through each of the multiple second return pipes at a predetermined flow rate, and controls the opening of the first adjustment valve so that the processing liquid flows through the processing liquid piping at a first flow rate, thereby realizing a first state in which the processing liquid flows through all of the multiple second return pipes. The control unit controls the opening of a plurality of second adjustment valves so that the processing liquid does not flow into at least one of the plurality of second return pipes, and the processing liquid flows at a predetermined flow rate into the remaining second return pipes, and controls the opening of a first adjustment valve so that the processing liquid flows at a first flow rate into the processing liquid piping, thereby realizing a second state in which the processing liquid does not flow into at least one of the plurality of second return pipes, and the processing liquid flows into the remaining second return pipes, thereby realizing a second state in which the processing liquid does not flow into at least one of the plurality of second return pipes, and the processing liquid flows into the remaining second return pipes, in a substrate processing apparatus.

2. A processing unit that processes the substrate with a processing solution, A storage section for storing the processing liquid, A processing liquid piping connected to the storage section through which the processing liquid flows, A pump is placed in the processing liquid piping and supplies the processing liquid from the storage unit to the processing liquid piping, A filter is placed in the processing liquid piping and captures particles in the processing liquid, A first flow meter is placed in the processing liquid piping and measures the flow rate of the processing liquid flowing through the processing liquid piping, A first return pipe is connected to the downstream end of the processing liquid piping and returns the processing liquid to the storage unit, A first adjustment valve is placed in the first return pipe and adjusts the flow rate of the processing liquid flowing through the first return pipe, Multiple second return pipes are connected to the downstream end of the processing liquid piping and return the processing liquid to the storage section, A branch supply pipe that branches off from a plurality of the second return pipes and supplies the processing liquid to the processing unit, Multiple second flow meters are arranged in each of the multiple second return pipes, located upstream of the branch supply pipe, and measure the flow rate of the processed liquid flowing through the branch supply pipe, The processing is arranged in each of the multiple second return pipes and flows through the corresponding second return pipe. Multiple second adjustment valves for adjusting the liquid flow rate, A control unit controls the opening degree of the first adjustment valve based on the flow rate of the processing liquid measured by the first flow meter, and controls the opening degree of the second adjustment valve corresponding to the second flow meter based on the flow rate of the processing liquid measured by the second flow meter. Equipped with, The control unit controls the opening of the multiple second adjustment valves so that the processing liquid flows through each of the multiple second return pipes at a predetermined flow rate, and controls the opening of the first adjustment valve so that the processing liquid flows through the processing liquid piping at a first flow rate, thereby realizing a first state in which the processing liquid flows through all of the multiple second return pipes. The control unit controls the opening of a plurality of second adjustment valves so that the processing liquid does not flow into at least one of the plurality of second return pipes, and the processing liquid flows at a predetermined flow rate into the remaining second return pipes, and controls the opening of a first adjustment valve so that the processing liquid flows at a first flow rate into the processing liquid piping, thereby realizing a second state in which the processing liquid does not flow into at least one of the plurality of second return pipes, and the processing liquid flows into the remaining second return pipes, thereby realizing a second state in which the processing liquid does not flow into at least one of the plurality of second return pipes, and the processing liquid flows into the remaining second return pipes, in a substrate processing apparatus.

3. The substrate processing apparatus according to claim 1, wherein the second flow unit is located in the second return pipe, downstream of the branch supply pipe, and measures the pressure of the processing liquid flowing through the second return pipe.

4. The system further includes a temperature controller located in the aforementioned processing liquid piping, The substrate processing apparatus according to any one of claims 1 to 3, wherein the temperature controller adjusts the temperature of the processing liquid flowing through the processing liquid piping.

5. The aforementioned processing liquid piping is further equipped with a thermometer that measures the temperature of the processing liquid flowing through the processing liquid piping, The substrate processing apparatus according to claim 4, wherein the control unit controls the opening degree of the second adjustment valve based on the temperature of the processing liquid measured by the thermometer.

6. The aforementioned processing unit is A nozzle located at the downstream end of the aforementioned branch supply pipe, A switching unit that switches between supplying and stopping the supply of the processing liquid from the branch supply pipe to the nozzle, A third return pipe that branches off from the aforementioned branch supply pipe and is connected to the second return pipe downstream of the second adjustment valve, A substrate processing apparatus according to claim 4 or claim 5, having the following features.

7. A processing unit that processes the substrate with a processing solution, A storage section for storing the processing liquid, A processing liquid piping connected to the storage section through which the processing liquid flows, A pump placed in the aforementioned processing liquid piping, A filter placed in the aforementioned processing liquid piping, A first flow unit is arranged in the processing liquid piping, A first return pipe is connected to the downstream end of the processing liquid piping and returns the processing liquid to the storage unit, A first adjustment valve is placed in the first return pipe and adjusts the flow rate of the processing liquid flowing through the first return pipe, Multiple second return pipes are connected to the downstream end of the processing liquid piping and return the processing liquid to the storage section, A branch supply pipe that branches off from a plurality of the second return pipes and supplies the processing liquid to the processing unit, A plurality of second flow units are arranged in each of the plurality of the second return pipes, A plurality of second adjustment valves are arranged in each of the plurality of second return pipes to adjust the flow rate of the processing liquid flowing through the corresponding second return pipe. A substrate processing method for a substrate processing apparatus comprising: A step of supplying the processing liquid from the storage unit to the processing liquid piping, A step of capturing particles in the processing liquid, A step of measuring the flow rate or pressure of the processing liquid flowing through the processing liquid piping using the first flow rate unit, A step of measuring the flow rate or pressure of the processing liquid flowing through the second return pipe using the second flow rate unit, A step of achieving a first state in which the processing liquid flows through all of the multiple second return pipes, by controlling the opening degree of multiple second adjustment valves so that a predetermined flow rate of the processing liquid flows through all of the multiple second return pipes based on the flow rate or pressure of the processing liquid measured in multiple second flow units, and by controlling the opening degree of the first adjustment valve so that a first flow rate of the processing liquid flows through the processing liquid piping based on the flow rate or pressure of the processing liquid measured in the first flow unit, A step of controlling the opening of a plurality of second adjustment valves based on the flow rate or pressure of the processing liquid measured in a plurality of second flow units, such that the processing liquid does not flow into at least one of the plurality of second return pipes, and a predetermined flow rate of the processing liquid flows into the remaining second return pipes, and controlling the opening of a first adjustment valve based on the flow rate or pressure of the processing liquid measured in the first flow unit, such that a first flow rate of the processing liquid flows into the processing liquid piping, thereby realizing a second state in which the processing liquid does not flow into at least one of the predetermined second return pipes, and the processing liquid flows into the remaining second return pipes. A substrate processing method, including the following.

8. A processing unit that processes the substrate with a processing solution, A storage section for storing the processing liquid, A processing liquid piping connected to the storage section through which the processing liquid flows, A pump is placed in the processing liquid piping and supplies the processing liquid from the storage unit to the processing liquid piping, A filter is placed in the processing liquid piping and captures particles in the processing liquid, A first flow rate unit is provided in the processing liquid piping and measures the flow rate of the processing liquid flowing through the processing liquid piping, A first return pipe is connected to the downstream end of the processing liquid piping and returns the processing liquid to the storage unit, A first adjustment valve is placed in the first return pipe and adjusts the flow rate of the processing liquid flowing through the first return pipe, A second return pipe is connected to the downstream end of the aforementioned processing liquid piping and returns the processing liquid to the storage section, A branch supply pipe that branches off from the second return pipe and supplies the processing liquid to the processing unit, A second flow unit for measuring the flow rate or pressure of the processing liquid flowing through the second return pipe, Based on the flow rate of the processing liquid measured in the first flow unit, a control unit controls the opening degree of the first adjustment valve so that the flow rate of the processing liquid flowing through the processing liquid piping becomes a predetermined flow rate. Equipped with, A substrate processing apparatus in which the control unit controls the opening degree of the first adjustment valve without regard to the flow rate or pressure of the processing liquid measured in the second flow unit.

9. A processing unit that processes the substrate with a processing solution, A storage section for storing the processing liquid, A processing liquid piping connected to the storage section through which the processing liquid flows, A pump is placed in the processing liquid piping and supplies the processing liquid from the storage unit to the processing liquid piping, A filter is placed in the processing liquid piping and captures particles in the processing liquid, A first flow meter is placed in the processing liquid piping and measures the flow rate of the processing liquid flowing through the processing liquid piping, A first return pipe is connected to the downstream end of the processing liquid piping and returns the processing liquid to the storage unit, A first adjustment valve is placed in the first return pipe and adjusts the flow rate of the processing liquid flowing through the first return pipe, A second return pipe is connected to the downstream end of the aforementioned processing liquid piping and returns the processing liquid to the storage section, A branch supply pipe that branches off from the second return pipe and supplies the processing liquid to the processing unit, A second flow meter is provided in the second return pipe, located upstream of the branch supply pipe, and measures the flow rate of the processing liquid flowing through the branch supply pipe. A control unit controls the opening degree of the first adjustment valve so that the flow rate of the processing liquid flowing through the processing liquid piping becomes a predetermined flow rate, based on the flow rate of the processing liquid measured by the first flow meter. Equipped with, The control unit controls the opening degree of the first adjustment valve without regard to the flow rate of the processing liquid measured by the second flow meter, in a substrate processing apparatus.

10. A processing unit that processes the substrate with a processing solution, A storage section for storing the processing liquid, A processing liquid piping connected to the storage section through which the processing liquid flows, A pump placed in the aforementioned processing liquid piping, A filter placed in the aforementioned processing liquid piping, A first flow unit is arranged in the processing liquid piping, A first return pipe is connected to the downstream end of the processing liquid piping and returns the processing liquid to the storage unit, A first adjustment valve is placed in the first return pipe and adjusts the flow rate of the processing liquid flowing through the first return pipe, A second return pipe is connected to the downstream end of the aforementioned processing liquid piping and returns the processing liquid to the storage section, A branch supply pipe that branches off from the second return pipe and supplies the processing liquid to the processing unit, The second flow section is located in the second return pipe and A substrate processing method for a substrate processing apparatus comprising: A step of supplying the processing liquid from the storage unit to the processing liquid piping, A step of capturing particles in the processing liquid, A step of measuring the flow rate of the processing liquid flowing through the processing liquid piping using the first flow rate unit, A step of measuring the flow rate or pressure of the processing liquid flowing through the second return pipe using the second flow rate unit, A step of controlling the opening degree of the first adjustment valve so that the flow rate of the processing liquid flowing through the processing liquid piping becomes a predetermined flow rate, based on the flow rate of the processing liquid measured in the first flow unit. Includes, A substrate processing method comprising the step of controlling the opening degree of the first adjustment valve, wherein the opening degree of the first adjustment valve is controlled without regard to the flow rate or pressure of the processing liquid measured in the second flow rate section.

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