Reinforcement resin composition and electronic component device

Abstract

Provided is a reinforcing resin composition that shows little increase in viscosity even at low temperatures, can be stably supplied to reinforcement locations, and can sufficiently reinforce connections of electronic components. [Solution] A reinforcing resin composition 10 for reinforcing the bond between an electronic component 3 and a substrate 2, comprising an epoxy compound and a curing agent, wherein the epoxy compound is a mixture of bisphenol E type epoxy resin and bisphenol A type epoxy resin, or a mixture of bisphenol E type epoxy resin and bisphenol F type epoxy resin.

Description

Technical Field

[0001] The present invention relates to a reinforcing resin composition and an electronic component device using the reinforcing resin composition.

Background Art

[0002] With the increasing functionality and miniaturization of portable electronic devices such as mobile phones and tablet devices, as electronic components used in these electronic devices, many electronic components involving solder ball bonding such as BGA (Ball Grid Array) and CSP (Chip Size Package) are widely used. Such electronic components can be mounted on a substrate with high density, but on the other hand, the strength of the solder joints, especially against physical stresses such as drop impacts, is weak, so a resin composition for reinforcement is used. For example, Patent Documents 1 and 2 describe filling and sealing a resin composition as an underfill material between an electronic component such as a BGA package and a substrate. Patent Document 3 describes joining the four corners of a BGA package with a side fill material of a resin composition to reinforce the solder joints of the terminals.

[0003] In Prior Documents 1 to 3, examples of the reinforcing resin composition include those containing bisphenol A type and bisphenol F type epoxy resins as main components. These epoxy resins can physically adhere the electronic component and the substrate by curing in a state of being interposed between the electronic component and the substrate, and reinforce the connection between the two. Epoxy compounds such as these epoxy resins are suitable for use in joining and reinforcing electronic components because of their high heat resistance.

[0004] However, bisphenol A type epoxy resin is known to be harmful to the human body, and its use is desired to reduce its environmental impact. In addition, bisphenol A type epoxy resin is prone to crystallization, and in particular, it solidifies when stored for a long period of time at relatively low temperatures such as below room temperature, and its viscosity remains high even when the temperature is raised. Although bisphenol F type epoxy resin has a smaller environmental impact, it has the same problem of being prone to crystallization as bisphenol A type epoxy resin. When the viscosity of the resin composition becomes high, it becomes difficult to dispense, and the resin composition cannot be supplied stably, resulting in insufficient reinforcement. In particular, when the space between mounted components or between electronic components and the substrate is extremely small due to high-density mounting, high viscosity makes it extremely difficult to supply the resin composition stably. [Prior art documents] [Patent Documents]

[0005] [Patent Document 1] Japanese Patent Publication No. 2008-239822 [Patent Document 2] Japanese Patent Publication No. 2016-135888 [Patent Document 3] Japanese Patent Publication No. 2016-44277 [Overview of the Initiative] [Problems that the invention aims to solve]

[0006] This invention has been made in view of the problems of the prior art described above, and aims to provide a reinforcing resin composition that exhibits little increase in viscosity even at low temperatures, and therefore can be stably supplied to reinforcement points, and can sufficiently reinforce the connections of electronic components. The object of this invention is to provide an electronic component device in which the area around the solder joint is sufficiently reinforced. [Means for solving the problem]

[0007] The present invention comprises an epoxy compound and a curing agent. The aforementionedThe epoxy compound is a mixture of bisphenol E type epoxy resin, bisphenol A type epoxy resin, and bisphenol F type epoxy resin, wherein the mass mixing ratio of the epoxy resins in the mixture is bisphenol E type epoxy resin:bisphenol A type epoxy resin:bisphenol F type epoxy resin = (E) 100: (A) 3-15: (F) 30-250.

[0008] According to the present invention, the reinforcing resin composition exhibits little increase in viscosity even at relatively low temperatures, such as below room temperature. Therefore, the reinforcing resin composition can be stably supplied to the reinforcement area near the solder joint between the electronic component and the substrate, ensuring reliable reinforcement of the joint.

[0009] The present invention may further contain a gelling agent.

[0010] In this case, the gelling agent may be at least one selected from the group consisting of amide-based gelling agents, sorbitol-based gelling agents, and fatty acid triglycerides.

[0011] In the present invention, the epoxy compound is a mixture of a bisphenol E type epoxy resin and at least one selected from the group consisting of bisphenol A type epoxy resin and bisphenol F type epoxy resin.

[0012] In the present invention, the epoxy compound may be a mixture of bisphenol E type epoxy resin, bisphenol A type epoxy resin, and bisphenol F type epoxy resin.

[0013] In the present invention, the epoxy compound may be an epoxy resin having epoxy groups at both ends.

[0014] In the present invention, the chlorine content in the epoxy compound may be 900 ppm or less.

[0015] In the present invention, the curing agent may be at least one selected from the group consisting of alicyclic polyamines, aliphatic polyamines, and modified products thereof.

[0016] In the present invention, the epoxy compound may further contain a filler, and the content of the filler per 100 parts by mass of the epoxy compound may be 30 parts by mass or more and less than 180 parts by mass.

[0017] In the present invention, the curing temperature may be 80°C or higher and 200°C or lower.

[0018] The present invention related to an electronic component device is such that a substrate and an electronic component are joined via solder bumps, and a reinforcing portion made of any one of the above-described reinforcing resin compositions is provided between the substrate and the electronic component.

[0019] According to the present invention, in the electronic component device, since the substrate and the electronic component are joined via solder bumps and a reinforcing portion made of any one of the above-described reinforcing resin compositions is provided between the substrate and the electronic component, the viscosity of the reinforcing resin composition hardly increases even at a relatively low temperature such as room temperature, and the reinforcing portion can be surely formed at a reinforcing location near the solder joining of the electronic component and the substrate, and the joining is sufficiently reinforced.

[0020] In the present invention related to an electronic component device, the reinforcing portion may be formed between the peripheral portion of the electronic component and the substrate.

Advantages of the Invention

[0021] According to the present invention, it is possible to provide a reinforcing resin composition that hardly increases in viscosity even at a low temperature, and thus can be stably supplied to a reinforcing location and sufficiently reinforce the connection of an electronic component. Further, according to the present invention, it is possible to provide an electronic component device in which the vicinity of the solder joint portion is sufficiently reinforced.

Brief Description of the Drawings

[0022] [Figure 1] A cross-sectional view schematically showing an electronic component device according to an embodiment of the present invention. [Figure 2] A cross-sectional view schematically showing an electronic component device according to another embodiment of the present invention.

Modes for Carrying Out the Invention

[0023] Hereinafter, the reinforcing resin composition and the electronic component device according to the present invention will be described. The reinforcing resin composition of this embodiment (hereinafter also simply referred to as the resin composition) comprises an epoxy compound and a curing agent, wherein the content of bisphenol E type epoxy resin relative to the total amount of the epoxy compound is 25% by mass or more and 100% by mass or less.

[0024] The resin composition of this embodiment contains an epoxy compound as its main component. The epoxy compound is not particularly limited, and epoxy compounds such as liquid epoxy resins and solid epoxy resins can be used as appropriate. Specific epoxy compounds include, for example, epoxy resins having a bisphenol skeleton such as bisphenol A type epoxy resin, bisphenol E type epoxy resin, and bisphenol F type epoxy resin, biphenyl type epoxy resin, phthalene ring-containing epoxy resin and hydrogenated epoxy resins thereof, and alicyclic epoxy resins. These epoxy compounds can be used individually or in combination.

[0025] In this embodiment, the epoxy compound is preferably an epoxy resin having epoxy groups at both ends. Specifically, examples include thermosetting resins having a bisphenol skeleton, such as bisphenol A type epoxy resin, bisphenol E type epoxy resin, and bisphenol F type epoxy resin, which have epoxy groups at both ends. The epoxy compound is preferably one with an epoxy equivalent of 140 to 240 and a viscosity of 1 to 15 Pa·s. In this embodiment, epoxy equivalent (g / eq) refers to the mass of resin containing one equivalent of epoxy groups, and is measured according to JIS K7236:2001. The viscosity in this embodiment refers to the value measured by the measurement method shown in the examples described later.

[0026] The resin composition of this embodiment contains bisphenol E type epoxy resin as an essential component as an epoxy compound, but the content of bisphenol E type epoxy resin relative to the total amount of the epoxy compound is 25% by mass or more and 100% by mass or less, preferably 40% by mass or more and 70% by mass or less.

[0027] The resin composition of this embodiment contains a bisphenol E type epoxy resin, which suppresses crystallization at low temperatures. As a result, even when stored at relatively low temperatures such as below room temperature, the increase in viscosity can be suppressed.

[0028] The epoxy compound in this embodiment may be a mixture of a bisphenol E type epoxy resin and at least one selected from the group consisting of bisphenol A type epoxy resin and bisphenol F type epoxy resin.

[0029] Bisphenol A type epoxy resin has high heat resistance and is widely used as a reinforcing resin composition. However, it is preferable to limit its use from the viewpoint that bisphenol A, which is included as an impurity, is harmful to the human body. Although bisphenol F type epoxy resin is less harmful than type A, it is preferable to restrict its use from the standpoint that, like type A, crystallization progresses and viscosity tends to increase at low temperatures such as below room temperature. The resin composition of this embodiment, by using bisphenol E type epoxy resin as an essential component, can suppress crystallization at low temperatures without the need for additives, and therefore can also suppress an increase in viscosity.

[0030] Furthermore, when the epoxy compound includes a bisphenol A type epoxy resin, it is preferable that the amount of the epoxy compound be 10.0% by mass or less, preferably 3.0% by mass or more and 5.0% by mass or less, from the viewpoint of improving viscosity stability while reducing harmful effects on the human body.

[0031] The epoxy compound may be a bisphenol E type epoxy resin alone, but it may also be a mixture of, for example, a bisphenol E type epoxy resin and a bisphenol A type epoxy resin, a mixture of a bisphenol E type epoxy resin and a bisphenol F type epoxy resin, or a mixture of a bisphenol E type epoxy resin, a bisphenol A type epoxy resin, and a bisphenol F type epoxy resin. When the epoxy compound is a mixture of a bisphenol E type epoxy resin, a bisphenol A type epoxy resin, and a bisphenol F type epoxy resin, the increase in viscosity due to crystallization can be more suppressed, which is preferable.

[0032] When the epoxy compound is a mixture of bisphenol E type epoxy resin, bisphenol A type epoxy resin, and bisphenol F type epoxy resin, the mass mixing ratio of each epoxy resin can be, for example, bisphenol E type epoxy resin:bisphenol A type epoxy resin:bisphenol F type epoxy resin = (E)100:(A)3~15:(F)30~250, or even (E)100:(A)3~10:(F)30~180.

[0033] The resin composition of this embodiment has a chlorine content in the epoxy compound of 900 ppm or less, preferably 700 ppm, and more preferably 600 ppm or less. Chlorine can sometimes be introduced as an impurity during the manufacturing process of epoxy compounds. From the perspective of reducing environmental impact, it is preferable to use epoxy compounds with a low chlorine content. On the other hand, removing impurities such as chlorine can lead to a problem where epoxy compounds become more prone to crystallization. The resin composition of this embodiment can suppress the crystallization of epoxy compounds even after chlorine is removed, thus reducing the halogen content.

[0034] Examples of curing agents for the resin composition of this embodiment include alicyclic polyamines, aliphatic polyamines and their variants, boron trifluoride-amine complexes, dicyandiamides, and organic acid hydrazides. By using these curing agents, the curing reaction of epoxy compounds at temperatures below room temperature can be suppressed. Furthermore, these curing agents have latent curing properties, and using a curing agent with latent curing properties is preferable because it can further suppress the progress of the curing reaction and suppress the increase in viscosity. As curing agents, alicyclic polyamines, aliphatic polyamines, and their modified products are preferred because they have a relatively low halogen content and a suitable curing temperature.

[0035] The content of the curing agent can be 5 to 40 parts by mass, preferably 10 to 20 parts by mass, per 100 parts by mass of the epoxy compound. By staying within the above range, the increase in viscosity is suppressed, and a cured product with appropriate strength can be obtained.

[0036] The resin composition of this embodiment may further contain a filler. The filler is not particularly limited, and any known filler can be used as appropriate. Examples include inorganic fillers such as silica, talc, and alumina, and organic fillers. The particle size of the filler is not particularly limited, but from the viewpoint of filling ability and mechanical strength, for example, an average particle size of 10 nm to 30 μm is preferred. When a resin composition is used as an underfill, it is preferable that the average particle size be 1 μm or less from the viewpoint of filling performance. When a resin composition is used as a side filler, it is preferable that the average particle size be 1 μm or larger from the viewpoint of containing a large amount of filler to lower the coefficient of thermal expansion.

[0037] As for the filler content, for example, if the amount of epoxy compound is 100 parts by mass, the amount of filler relative to this amount is 30 parts by mass or more and less than 180 parts by mass, preferably 100 parts by mass or more and less than 150 parts by mass. With such a content, it is possible to suppress the increase in viscosity of the resin composition and reduce the thermal expansion coefficient of the cured product.

[0038] The resin composition of this embodiment may further contain a gelling agent. The inclusion of a gelling agent can suppress sagging when the resin composition is applied and heat-cured. The gelling agent in this embodiment is not particularly limited as long as it has the effect of gelling epoxy resin. Examples of gelling agents in this embodiment include amide-based gelling agents, sorbitol-based gelling agents, and fatty acid triglycerides. Examples of amide-based gelling agents include polyamides obtained by condensation polymerization of amines and carboxylic acids, fatty acid monoamides such as stearamide, lauric acidamide, oleamide, erucic acidamide, and 12-hydroxystearamide, substituted fatty acid amides such as N-oleylstearamide and N-stearylstearamide, substituted fatty acid bisamides such as N,N'-ethylenebislauric acidamide, N,N'-ethylenebisstearateamide, N,N'-hexamethylenebisstearateamide and N,N'-distearyladipamide, alkylolamides such as stearic acid monomethylolamide, hydrogenated castor oil, and beeswax. Examples of sorbitol-based gelling agents include 1,3:2,4-bis-O-(4-methylbenzylidene)-D-sorbitol and 1,3:2,4-bis-O-benzylidene-D-glucitol (manufactured by Shin Nippon Rika Co., Ltd.). Examples of fatty acid triglycerides include 12-hydroxystearic acid triglyceride (hydrogenated castor oil), Coconad ML (C8, C10, C12 fatty acid triglycerides), Coconad MT (C8, C10 fatty acid triglycerides), Coconad RK (C8 fatty acid triglyceride) (manufactured by Kao Corporation), Panacete 800B (2-ethylhexyl triglyceride), Panacete 810, and Panacete 810S (medium-chain fatty acid triglycerides) (manufactured by NOF Corporation).

[0039] The melting point of the gelling agent is, for example, 130°C or higher, preferably 165°C or higher. A gelling agent having the above melting point will exhibit shape retention properties at the thermosetting temperature.

[0040] As for the gelling agent content, for example, when the total amount of epoxy resin is 100 parts by mass, the amount may be 0.5 parts by mass or more but less than 20 parts by mass, and more specifically, 0.5 parts by mass or more but less than 15 parts by mass. In particular, when an amide-based gelling agent is used, it is preferable that the amount is 1 part by mass or more and 3 parts by mass or less when the total amount of epoxy resin is 100 parts by mass. Furthermore, if it is a fatty acid triglyceride, it is preferable that the amount is 2 parts by mass or more and 20 parts by mass or less when the total amount of epoxy resin is 100 parts by mass. Furthermore, in the case of a sorbitol-based gelling agent, it is preferable that the amount is 0.1 parts by mass or more and less than 10 parts by mass, and more preferably 0.5 parts by mass or more and less than 5 parts by mass, when the total amount of epoxy resin is 100 parts by mass.

[0041] The resin composition of this embodiment can suppress a decrease in the glass transition temperature after curing. If the glass transition temperature decreases after curing, the following problems occur. In other words, when a resin composition is used to reinforce the joints of electronic components, if the cured resin composition is heated to a temperature exceeding its glass transition temperature, the coefficient of thermal expansion of the cured material increases. This increases the difference in the coefficient of thermal expansion between the cured material and the reinforced electronic components or solder joints, resulting in excessive stress on the electronic components or solder joints, which can cause cracks or loss of function. This problem is particularly likely to occur when electronic components are subjected to temperature cycling tests, which are a type of reliability test. A decrease in the glass transition temperature is likely to occur when additives that suppress crystallization, such as reactive diluents, are incorporated into the resin composition. The resin composition of this embodiment can suppress crystallization even without the inclusion of additives such as reactive diluents. Therefore, it is possible to suppress crystallization while also suppressing a decrease in the glass transition temperature after curing. Preferred glass transition temperatures for the resin composition of this embodiment include 85°C to 180°C, and more specifically, 100°C to 170°C. In this embodiment, the glass transition temperature refers to the value measured by the measurement method described in the examples below.

[0042] The reinforcing resin composition of this embodiment preferably hardens at temperatures between 80°C and 200°C, and more preferably between 100°C and 170°C. The reinforcing resin composition of this embodiment can be used to reinforce solder joints of electronic components, etc. However, since solder joints fix electronic components to a substrate by melting solder, the resin composition is also heated. When the reinforcing resin composition is used in a component that is heated in this way, thermal sagging may occur, where the resin composition melts and spreads. If the resin composition undergoes thermal sagging, there is a risk that the reinforcement of the electronic component or other object to be reinforced will not be sufficient. If the reinforcing resin composition of this embodiment is a resin composition that hardens within the above range, it will harden when heated, and thermal sagging of the resin composition can be suppressed even when used in applications that require heating. Therefore, sufficient reinforcement hardening can be obtained.

[0043] The resin composition of this embodiment may further contain other known additives, provided that they do not impair the aforementioned effects.

[0044] Next, the electronic component device of this embodiment will be described with reference to Figures 1 and 2. In this embodiment, the electronic component device 1 has a substrate 2 and an electronic component 3 joined together via solder bumps 4, and a reinforcing portion 10 made of the reinforcing resin composition of this embodiment as described above is provided between the substrate 2 and the electronic component 3.

[0045] Examples of electronic components 3 in the electronic component device 1 of this embodiment include semiconductor packages such as CSPs and BGAs, and plate-shaped components such as bare chips. When mounting (electrically connecting) such electronic components 3 onto a circuit board 2 on which a circuit is formed, such as a printed circuit board, the electronic components 3 are mounted by soldering the solder bumps 4 formed on the electronic components 3 to the circuit portion of the circuit board 2.

[0046] Specifically, for example, in the case of an electronic component having a plate-shaped component, such as the semiconductor package mentioned above, one side of the plate-shaped component with solder balls arranged in a grid is brought into contact with the circuit board, and the plate-shaped component and the circuit board are positioned facing each other and heated. Solder bumps are formed as the solder balls melt, and the electronic component is mounted on the circuit board. With electronic components mounted on the circuit board, the above-mentioned resin composition is filled between the components and the board.

[0047] The method of filling the resin composition is not particularly limited, but for example, as shown in Figure 1, an electronic component 3 such as a CSP or BGA is placed on a substrate 2 via solder bumps 4, connected in a reflow process, and then the resin composition is dispensed to fill the gaps between the substrate 2, the electronic component 3 and the solder bumps 4, and further cured to form a reinforced portion 10.

[0048] Alternatively, as shown in Figure 2, an electronic component 3 is placed on a substrate 2 via solder bumps 4, connected in a reflow process, and then a resin composition is dispensed between the peripheral edge of the electronic component 3 and the substrate 2 and cured to form a reinforcing portion 10 as a side fill.

[0049] In this embodiment, the resin composition can be reliably dispensed into narrow gaps between the substrate 2 and the electronic component 3 because the viscosity increase of the resin composition is suppressed, thus ensuring reliable reinforcement. In particular, even in the case of an electronic component device where the reinforcing portion 10 is formed in fine gaps such as the periphery of the electronic component 3 as a side fill, the resin composition can be reliably dispensed.

[0050] Furthermore, the resin composition of this embodiment can suppress crystallization even without the addition of additives such as reactive diluents, thus preventing a decrease in the glass transition temperature after curing, and resulting in a reinforced section with a relatively high glass transition temperature. Therefore, even when electronic component devices are subjected to temperature cycle tests, differences in the coefficient of thermal expansion between the reinforced section and other parts are less likely to occur, making cracks and damage less likely.

[0051] In this embodiment, an example of using the resin composition to reinforce the bonding of electronic components was shown. However, the reinforcing resin composition of the present invention can be used as a reinforcing material to bond other components together or to reinforce the components themselves. For example, it can be used as a reinforcing material for composite materials such as insulating materials for electrical and electronic components (high-reliability semiconductor encapsulating materials, etc.), laminates (printed wiring boards, build-up substrates, etc.), CFRP and other composite materials, adhesives, and paints.

[0052] The resin composition and electronic component apparatus according to this embodiment are as described above, but the embodiments disclosed herein should be considered in all respects to be illustrative and not restrictive. The scope of the present invention is indicated by the claims rather than by the foregoing description, and all modifications within the meaning and scope equivalent to the claims are intended to be included. [Examples]

[0053] Next, regarding embodiments of the present invention... Test example, This will be explained in conjunction with comparative examples. Furthermore, the present invention is not limited to the following examples.

[0054] (Preparation of resin compositions) The materials shown below were used in the formulations described in Table 1 and Table 2 for each example. Test example, A comparative resin composition was prepared. The preparation method involved stirring each material under reduced pressure at 20-25°C using a planetary-type stirring device (5XDMV, manufactured by Shinagawa Kogyosho). In Example 4 and Comparative Example 4, the epoxy compound and amide-based thixotropic agent were heated in separate containers to disperse the thixotropic agent, and the intermediate was cooled before being added to the stirring device. Note that the percentages of the components in the table are in mass percent.

[0055] <Ingredients and proportions> Epoxy compound 1: Bisphenol A type epoxy resin, manufactured by Nippon Steel & Sumitomo Metal Chemical Co., Ltd., YD-8125 (epoxy groups at both ends, low halogen type) Epoxy compound 2: Bisphenol F type epoxy resin, manufactured by Nippon Steel & Sumitomo Metal Chemical Co., Ltd., YDF-8170 (epoxy groups at both ends, low halogen type) Epoxy compound 3: Bisphenol E type epoxy resin, manufactured by Printec Co., Ltd., EPO-MK R710 (epoxy groups at both ends) Epoxy compound 4: Bisphenol E type epoxy resin (low halogen), manufactured by Printec Co., Ltd., EPO-MK R1710 (epoxy groups at both ends). Epoxy compound 5: Bisphenol A type epoxy resin, manufactured by Nippon Steel & Sumitomo Metal Chemical Co., Ltd., YD-128 (with epoxy groups at both ends, a high-halogen type of epoxy compound 1) Epoxy compound 6: Bisphenol F type epoxy resin, manufactured by Nippon Steel & Sumitomo Metal Chemical Co., Ltd., YDF-170 (high halogen type of epoxy compound 2 with epoxy groups at both ends). Epoxy compound 7: 3',4'-Epoxycyclohexylmethyl-3,4-Epoxycyclohexanecarboxylate (manufactured by TCI Corporation) (an alicyclic epoxy compound with epoxy groups at both ends) Epoxy compound 8: Triglycidyl isocyanurate (manufactured by TCI Corporation) (epoxy compound with an isocyanurate skeleton) Epoxy compound 9: Novolac-type epoxy resin, Nippon Steel & Sumitomo Metal Chemical Co., Ltd. YDPN-638 (phenol novolac-type epoxy resin) Hardener 1: Modified alicyclic polyamine, manufactured by T&K TOKA, FXR-1121 Hardener 2: Modified aliphatic polyamine, manufactured by T&K TOKA, FXR-1030 Amid-based gelling agent 1: Polyamide, manufactured by Kyoeisha Chemical Co., Ltd., TALENE VA-79 Amid-based gelling agent 2: N,N'-ethylene-bis-12-hydroxystearylamide, Ito Oil Co., Ltd. ITOWAXJ-530 Sorbitol-based gelling agent: 1,3:2,4-bis-O-(4-methylbenzylidene)-D-sorbitol, Shin Nippon Rika Co., Ltd., Gelol MD Fatty acid triglycerides: 12-hydroxystearate triglyceride, Kawaken Fine Chemical K-3 Wax Silica filler 1: SR-324 manufactured by Ryusen Co., Ltd., average particle size 4 μm Silica Filler 2: OX 50, manufactured by Nippon Aerosil Co., Ltd., average particle size 50nm

[0056] Test 1 (Crystallization test) The crystallization test was performed using the following method. From the resin composition, only the epoxy compound was weighed and mixed, then filled into a glass container and sealed. The glass container was left undisturbed in a refrigerated test chamber maintained at 0-10°C, and after 180 days, the presence or absence of precipitates was visually observed. If precipitates were present, it was considered a failure (indicated as ×, the same applies below), and if no precipitates were present, it was considered a pass (indicated as ○, the same applies below).

[0057] (Viscosity stability test) Viscosity stability tests were conducted using the following method. The viscosity of the resin composition was measured using an E-type viscometer (RE-100U, manufactured by Toki Sangyo Co., Ltd.). The cone rotor was set to 3°-R7.7 and the rotation speed to 10 rpm, and the temperature of the resin composition was controlled with cooling water to 20±1℃. The resin composition was left to stand in a refrigerated test chamber maintained at 0~10℃, and the viscosity was measured after 180 days. The viscosity was compared with the viscosity before being placed in the refrigerated test chamber, and a change of less than 20% was considered a pass, while a change of 20% or more was considered a fail.

[0058] (Halogen test) The halogen test was conducted in accordance with BS EN 14582:2007 (combustion method). A DIONEX ICS-1500 ion chromatograph was used for measurement. The content of fluorine, chlorine, bromine, and iodine in the adhesive was calculated, and a pass was defined as when each content was 900 ppm or less.

[0059] (Glass transition temperature) The glass transition temperatures of each resin composition were measured as follows. The second run of the DSC was measured at a heating rate of 10°C / min up to 180°C, and the temperature at the intersection of the tangent line between the original baseline and the inflection point was defined as the glass transition point. Since the glass transition point is affected by the type and composition of the curing agent, it was determined whether it decreased or remained the same as a comparative example with the same curing agent components.

[0060] The results of each test are shown in Table 1.

[0061] [Table 1]

[0062] As shown in Table 1, each example passed the requirements for crystallization, viscosity stability, and halogen content, and no decrease in the glass transition temperature was observed. On the other hand, Comparative Examples 1 to 4 all failed in terms of crystallization and viscosity stability, and while Comparative Example 5 passed the requirements for crystallization and viscosity stability, its halogen content exceeded 900 ppm. In other words, in the examples of the present invention, good crystallization and viscosity stability were achieved without increasing the amount of halogen.

[0063] "Exam 2" (Heat-induced sagging test) The heat resistance was measured using the following method. Measurements were taken according to the method described in the print sagging test of JIS Z 3284-3. Specifically, the resin compositions of each example and comparative example listed in Table 2 were printed onto a copper plate using a stainless steel metal mask with a predetermined pattern specified in the JIS (two types of opening sizes: 3.0 mm × 0.7 mm and 3.0 mm × 1.5 mm, with opening spacings from 0.2 mm to 1.2 mm in 0.1 mm increments, and a mask thickness of 0.2 mm). After removing the metal mask, the plate was heated at 150°C for 10 minutes. Table 2 shows the minimum spacing at which the resin composition printed in the pattern does not come into contact with adjacent patterns after heating, based on the evaluation of the worse result among the two sizes of patterns printed on each copper plate. For example, "0.2mmPass" in the table means that there was no contact between the resin compositions when the spacing between the openings was 0.2mm, and "0.6mmPass" means that there was no contact between the resin compositions when the spacing between the openings was 0.6mm, but contact occurred when the spacing was 0.5mm.

[0064] [Table 2]

[0065] (Viscosity and structural viscosity ratio) Viscosity was measured using the following method. Using an E-type viscometer (RE-100U manufactured by Toki Sangyo Co., Ltd.), the cone rotor was set to 3°-R7.7 and the rotation speed to 10 rpm, and the temperature of the resin composition was controlled with cooling water to 20±1℃. The structural viscosity ratio was calculated using the following formula, with respect to the viscosity measured at a rotational speed of 10 rpm and the viscosity measured at a rotational speed of 1 rpm using the same measurement method. Structural viscosity ratio = viscosity at 1 rpm / viscosity at 10 rpm The results are shown in Table 2. Furthermore, the viscosity and structural viscosity ratio results on day 1, 7 days later, and 30 days later (1 month later) are shown in Table 3.

[0066] [Table 3]

[0067] As shown in Table 2, each example had a higher structural viscosity ratio compared to the comparative example. A higher structural viscosity ratio is a value that suppresses sagging. This was evident from the fact that in the thermal sagging test, the resin composition did not come into contact up to 0.2 mm in each example, compared to 0.6 mm in the comparative example. Furthermore, as shown in Table 3, the structural viscosity ratio remained high even after one month in each of the examples. On the other hand, the comparative example, which initially had a lower value than the examples, decreased even further after one month.

[0068] Furthermore, the following inventions are also included as other embodiments. (Other Embodiment 1) It contains an epoxy compound and a curing agent, A reinforcing resin composition comprising, as the epoxy compound, bisphenol E type epoxy resin in an amount of 25% by mass or more and 100% by mass or less based on the total amount of epoxy compounds. (Another Embodiment 2) The reinforcing resin composition according to another embodiment 1, further comprising a gelling agent. (Other Embodiment 3) The reinforcing resin composition according to another embodiment 2, wherein the gelling agent is at least one selected from the group consisting of amide-based gelling agents, sorbitol-based gelling agents, and fatty acid triglycerides. (Another Embodiment 4) The reinforcing resin composition according to any one of the other embodiments 1 to 3, wherein the epoxy compound is a mixture of a bisphenol E type epoxy resin and at least one selected from the group consisting of bisphenol A type epoxy resin and bisphenol F type epoxy resin. (Other Embodiments 5) The reinforcing resin composition according to any one of the other embodiments 1 to 4, wherein the epoxy compound is a mixture of bisphenol E type epoxy resin, bisphenol A type epoxy resin, and bisphenol F type epoxy resin. (Other Embodiment 6) The reinforcing resin composition according to any one of the other embodiments 1 to 5, wherein the epoxy compound is an epoxy resin having epoxy groups at both ends. (Other Embodiments 7) The reinforcing resin composition according to any one of the other embodiments 1 to 6, wherein the chlorine content in the epoxy compound is 900 ppm or less. (Other Embodiments 8) The reinforcing resin composition according to any one of the other embodiments 1 to 7, wherein the curing agent is at least one selected from the group consisting of alicyclic polyamines, aliphatic polyamines, and modified products thereof. (Other Embodiments 9) The reinforcing resin composition according to any one of the other embodiments 1 to 8, further comprising a filler, wherein the content of the filler per 100 parts by mass of the epoxy compound is 30 parts by mass or more and less than 180 parts by mass. (Other Embodiments 10) A reinforcing resin composition according to any one of the other embodiments 1 to 9, wherein the curing temperature is 80°C or higher and 200°C or lower. (Other Embodiments 11) The circuit board and electronic components are joined via solder bumps. An electronic component device comprising a reinforcing portion made of the reinforcing resin composition described in any one of the other embodiments 1 to 10 between the substrate and the electronic component. (Other Embodiments 12) The reinforcing portion is formed between the peripheral edge of the electronic component and the substrate, as described in another embodiment 11 of the electronic component device. [Explanation of Symbols]

[0069] 1: Electronic component device, 2: Circuit board, 3: Electronic component, 4: Solder bump, 10: Reinforcement part.

Claims

1. It contains an epoxy compound and a curing agent, The epoxy compound is a mixture of bisphenol E type epoxy resin, bisphenol A type epoxy resin, and bisphenol F type epoxy resin. The mass mixing ratio of the epoxy resins in the above mixture is bisphenol E type epoxy resin: bisphenol A type epoxy resin: bisphenol F type epoxy resin = (E) 100: (A) 3 to 15: (F) 30 to 250. A reinforcing resin composition for strengthening the bond between electronic components and a substrate.

2. The reinforcing resin composition according to claim 1, further comprising a gelling agent.

3. The reinforcing resin composition according to claim 2, wherein the gelling agent is at least one selected from the group consisting of amide-based gelling agents, sorbitol-based gelling agents, and fatty acid triglycerides.

4. The reinforcing resin composition according to any one of claims 1 to 3, wherein the bisphenol A type epoxy resin is contained in an amount of 10.0% by mass or less of the total amount of epoxy compounds.

5. The reinforcing resin composition according to any one of claims 1 to 4, comprising an epoxy resin having epoxy groups at both ends of the epoxy compound.

6. The reinforcing resin composition according to any one of claims 1 to 5, wherein the chlorine content in the epoxy compound is 900 ppm or less.

7. The reinforcing resin composition according to any one of claims 1 to 6, wherein the curing agent is at least one selected from the group consisting of alicyclic polyamines, aliphatic polyamines, and modified products thereof.

8. The reinforcing resin composition according to any one of claims 1 to 7, further comprising a filler, wherein the content of the filler per 100 parts by mass of the epoxy compound is 30 parts by mass or more and less than 180 parts by mass.

9. A reinforcing resin composition according to any one of claims 1 to 8, wherein the curing temperature is 80°C or higher and 200°C or lower.

10. The circuit board and electronic components are joined via solder bumps. An electronic component device comprising a reinforcing portion made of the reinforcing resin composition according to any one of claims 1 to 9 between the substrate and the electronic component.

11. The electronic component device according to claim 10, wherein the reinforcing portion is formed between the peripheral edge of the electronic component and the substrate.

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