Substrate processing apparatus and substrate processing method

The substrate processing apparatus addresses cleanliness issues by using controlled pressure and filtration to minimize contamination and improve efficiency in the processing liquid supply system, enhancing system cleanliness and reducing costs.

JP7887337B2Active Publication Date: 2026-07-09TOKYO ELECTRON LTD
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
TOKYO ELECTRON LTD
Filing Date
2022-10-14
Publication Date
2026-07-09

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Abstract

To provide a substrate processing apparatus and a substrate processing method that can enhance the cleanliness of a processing liquid supply system.SOLUTION: A substrate processing apparatus includes a storage portion configured to temporarily store a processing liquid for processing a substrate, a replenishment portion configured to replenish the storage portion with the processing liquid, a flow rate measurement portion configured to measure the flow rate of the processing liquid with which the storage portion is refilled, a gas supply portion configured to supply gas to the storage portion and pressurize the inside of the storage portion, and a control portion, and the control portion controls the gas supply portion on the basis of the value measured by the flow rate measurement portion, and executes a process of replenishing the storage portion with the processing liquid from the replenishment portion while adjusting the magnitude of the pressure into the storage portion.SELECTED DRAWING: Figure 3
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