Method for manufacturing a photosensitive film, a photosensitive element, and a laminate.

Abstract

Provided are: a photosensitive film containing (A) a binder polymer, (B) a photopolymerisable compound, (C) a photoinitiator, (D) at least one selected from the group consisting of an anthracene compound, a pyrazoline compound and a distrylbenzene compound, and (E) a naphthalene compound; a photosensitive element 1 comprising a support 2 and a photosensitive resin layer 3 placed on the support 2, the photosensitive resin layer 3 being said photosensitive film; and a laminate production method comprising a step for using the above-mentioned photosensitive film to place a photosensitive resin layer on a base material, a step for photocuring part of the photosensitive resin layer, a step for forming a cured pattern by removing at least part of the non-cured part of the photosensitive resin layer, and a step for forming a metal layer on at least part of a portion of the base material where the cured pattern was not formed.

Description

[Technical Field]

[0001] This disclosure relates to a method for manufacturing a photosensitive film, a photosensitive element, and a laminate. [Background technology]

[0002] In the manufacture of laminates that can be used as wiring substrates, a resist pattern is formed to obtain the desired wiring. The resist pattern can be formed by exposing and developing a photosensitive resin layer obtained using a photosensitive resin composition. Various compositions have been investigated as photosensitive resin compositions. For example, Patent Document 1 below describes a photosensitive resin composition containing a binder polymer, a photopolymerizable compound, and a specific photopolymerization initiator. A photosensitive film can be obtained by molding the photosensitive resin composition into a film. [Prior art documents] [Patent Documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2019-028398 [Overview of the project] [Problems that the invention aims to solve]

[0004] When forming a cured pattern that can be used as a resist pattern using a photosensitive film or photosensitive resin composition, the cured pattern may have linear line portions and linear space portions adjacent to the line portions. When forming a cured pattern in which the width of the space portions is smaller than the width of the line portions, excellent resolution is required as a characteristic for good formation of the line portions and space portions. Also, when forming a cured pattern in which the line width is smaller than the space width, excellent adhesion is required as a characteristic for good formation of the line portions and space portions.

[0005] One aspect of the present disclosure aims to provide a photosensitive film capable of obtaining excellent resolution when forming a cured pattern in which the space width is smaller than the line width, and excellent adhesion when forming a cured pattern in which the line width is smaller than the space width. Another aspect of the present disclosure aims to provide a photosensitive element using the photosensitive film. Another aspect of the present disclosure aims to provide a method for manufacturing a laminate using the above-mentioned photosensitive film.

Means for Solving the Problems

[0006] One aspect of the present disclosure relates to a photosensitive film containing (A) a binder polymer, (B) a photopolymerizable compound, (C) a photoinitiator, (D) at least one selected from the group consisting of anthracene compounds, pyrazoline compounds, and distyrylbenzene compounds, and (E) a naphthalene compound.

[0007] According to such a photosensitive film, excellent resolution when forming a cured pattern in which the space width is smaller than the line width, and excellent adhesion when forming a cured pattern in which the line width is smaller than the space width can be obtained.

[0008] Another aspect of the present disclosure relates to a photosensitive element including a support and a photosensitive resin layer disposed on the support, wherein the photosensitive resin layer is the above-mentioned photosensitive film.

[0009] Another aspect of the present disclosure relates to a method for manufacturing a laminate, comprising a step of disposing a photosensitive resin layer on a substrate using the above-mentioned photosensitive film, a step of photocuring a part of the photosensitive resin layer, a step of removing at least a part of the uncured portion of the photosensitive resin layer to form a cured pattern, and a step of forming a metal layer on at least a part of the portion of the substrate where the cured pattern is not formed.

Advantages of the Invention

[0010] According to one aspect of this disclosure, a photosensitive film can be provided that can obtain excellent resolution when forming a cured material pattern in which the space width is smaller than the line width, and excellent adhesion when forming a cured material pattern in which the line width is smaller than the space width. According to another aspect of this disclosure, a photosensitive element using the photosensitive film can be provided. According to yet another aspect of this disclosure, a method for manufacturing a laminate using the above-mentioned photosensitive film can be provided. [Brief explanation of the drawing]

[0011] [Figure 1] This is a schematic cross-sectional view showing an example of a photosensitive element. [Figure 2] This is a schematic diagram illustrating an example of a method for manufacturing a laminate. [Modes for carrying out the invention]

[0012] The embodiments of this disclosure will be described in detail below.

[0013] In this specification, numerical ranges indicated using "~" represent a range that includes the numbers before and after "~" as the minimum and maximum values, respectively. "A or greater" in a numerical range means A and the range exceeding A. "A or less" in a numerical range means A and the range less than A. In numerical ranges described stepwise in this specification, the upper or lower limit of a numerical range in one step can be arbitrarily combined with the upper or lower limit of a numerical range in another step. In numerical ranges described in this specification, the upper or lower limit of that numerical range may be replaced with the values ​​shown in the examples. "A or B" means that either A or B is included, or both are included. Unless otherwise specified, the materials exemplified in this specification can be used individually or in combination of two or more. The content of each component in a composition means the total amount of multiple substances present in the composition if there are multiple substances corresponding to each component, unless otherwise specified. The term "layer" includes not only structures formed on the entire surface when observed as a plan view, but also structures formed on only a part of it. The term "process" includes not only independent processes but also any process that is not clearly distinguishable from others, as long as its intended function is achieved. "(Meth)acrylate" means at least one of acrylate and its corresponding methacrylate. The same applies to other similar expressions such as "(meth)acrylic acid." Unless otherwise specified, "alkyl group" may be linear, branched, or cyclic.

[0014] In this specification, the solid content of a photosensitive resin composition refers to the non-volatile content of the photosensitive resin composition excluding volatile substances (water, solvent, etc.). That is, the solid content refers to the components that remain without volatilizing during the drying of the photosensitive resin composition (components other than the solvent), and includes components that are liquid, syrup-like, or waxy at room temperature (25°C).

[0015] <Photosensitive film, photosensitive resin composition, and cured product> The photosensitive film and photosensitive resin composition according to this embodiment contain (A) a binder polymer, (B) a photopolymerizable compound, (C) a photopolymerization initiator, (D) at least one selected from the group consisting of anthracene compounds, pyrazoline compounds, and distylylbenzene compounds, and (E) a naphthalene compound. The photosensitive film according to this embodiment can be obtained by forming the photosensitive resin composition according to this embodiment into a film.

[0016] According to the photosensitive film and photosensitive resin composition of this embodiment, excellent resolution and excellent adhesion can be obtained when forming a cured product pattern in which the space width is smaller than the line width. According to the photosensitive film and photosensitive resin composition of this embodiment, in the evaluation described in the examples, for example, a resolution of 13 μm or less and an adhesion of 3 μm or less can be obtained. The shape of the cured product pattern that can be obtained with the photosensitive film and photosensitive resin composition of this embodiment is not particularly limited.

[0017] The inventors speculate that the factors contributing to the excellent resolution and adhesion obtained by the photosensitive film and photosensitive resin composition according to this embodiment are as follows. However, the factors are not limited to those described below. Specifically, by using component (D) when using components (A), (B), and (C) in combination, component (D) absorbs light well and supplies a sufficient amount of energy to component (C), thereby enabling good photosensitivity (for example, a sufficient amount of radicals are generated in the exposed area and the diffusion of radicals to the unexposed area is suppressed, thereby enabling good photosensitivity). Furthermore, by using component (E), this effect of component (D) can be enhanced. As a result, excellent resolution and adhesion are obtained.

[0018] According to the photosensitive film and photosensitive resin composition of this embodiment, excellent sensitivity to active light can also be obtained. According to the photosensitive film and photosensitive resin composition of this embodiment, in the evaluation described in the examples, for example, 108 mJ / cm² 2 The following exposure levels can be obtained.

[0019] The photosensitive film and photosensitive resin composition according to this embodiment are photocurable, and a cured product can be obtained by photocuring the photosensitive film or photosensitive resin composition. The cured product according to this embodiment is a cured product (photocured product) of the photosensitive film or photosensitive resin composition according to this embodiment. The cured product according to this embodiment may be patterned (cured product pattern) or may be a resist pattern.

[0020] The thickness of the photosensitive film and cured product according to this embodiment may be 1 μm or more, 3 μm or more, 5 μm or more, 7 μm or more, 10 μm or more, 15 μm or more, 18 μm or more, or 19 μm or more, from the viewpoint of easily obtaining a resist pattern for obtaining wiring of sufficient thickness. The thickness of the photosensitive film and cured product according to this embodiment may be 100 μm or less, 50 μm or less, 40 μm or less, 30 μm or less, 25 μm or less, 20 μm or less, or 19 μm or less, from the viewpoint of easily obtaining excellent resolution and adhesion. From these viewpoints, the thickness of the photosensitive film and cured product according to this embodiment may be 1 to 100 μm, 5 to 100 μm, or 15 to 25 μm.

[0021] The wavelengths at which photosensitivity is exhibited in the photosensitive film and photosensitive resin composition according to this embodiment are not particularly limited. The photosensitive film and photosensitive resin composition according to this embodiment may have photosensitivity to light with wavelengths of, for example, 300 nm or more, 340 nm or more, 350 nm or more, 355 nm or more, 365 nm or more, 375 nm or more, 390 nm or more, 395 nm or more, or 405 nm or more. The photosensitive film and photosensitive resin composition according to this embodiment may have photosensitivity to light with wavelengths of, for example, 500 nm or less, 440 nm or less, less than 440 nm, 436 nm or less, 420 nm or less, 410 nm or less, or 405 nm or less. In the exposure process described later, active light having peaks within these wavelength ranges can be used. The photosensitive film and photosensitive resin composition according to this embodiment can be used, for example, as a negative-type photosensitive film and photosensitive resin composition.

[0022] The absorbance of the photosensitive film and photosensitive resin composition according to this embodiment for light with a wavelength of 405 nm (for example, the absorbance when the thickness is 19 μm) may be within the following ranges. The absorbance for light with a wavelength of 405 nm may be greater than 0 and may be 0.01 or more, 0.05 or more, 0.1 or more, 0.15 or more, 0.2 or more, 0.25 or more, 0.27 or more, or 0.3 or more. The absorbance for light with a wavelength of 405 nm may be 0.5 or less, 0.45 or less, 0.4 or less, 0.35 or less, 0.3 or less, or 0.27 or less. From these viewpoints, the absorbance for light with a wavelength of 405 nm may be greater than 0 and 0.5 or less.

[0023] According to this embodiment, it is possible to provide applications of photosensitive resin compositions, photosensitive films, or photosensitive elements for the formation of cured patterns (e.g., resist patterns). According to another aspect of this disclosure, it is possible to provide applications of photosensitive resin compositions, photosensitive films, or photosensitive elements for the manufacture of wiring boards.

[0024] The photosensitive film and photosensitive resin composition according to this embodiment contain a binder polymer as component (A). Examples of component (A) include acrylic resins, styrene resins, epoxy resins, amide resins, amide epoxy resins, alkyd resins, phenolic resins, etc. Acrylic resins are resins having compounds having (meth)acryloyl groups ((meth)acrylic acid compounds) as monomer units, and styrene resins, epoxy resins, amide resins, amide epoxy resins, alkyd resins, and phenolic resins having such monomer units belong to acrylic resins. Component (A) may contain a binder polymer that does not have phenolic hydroxyl groups, but does not have to contain a binder polymer that has phenolic hydroxyl groups. Component (A) may contain a binder polymer that does not have epoxy groups, but does not have to contain a binder polymer that has epoxy groups.

[0025] Component (A) may contain an acrylic resin, from the viewpoint of easily obtaining excellent resolution and adhesion. The acrylic resin content may be 50% by mass or more, more than 50% by mass, 70% by mass or more, 90% by mass or more, 95% by mass or more, 98% by mass or more, 99% by mass or more, or substantially 100% by mass (a form in which component (A) is substantially composed of an acrylic resin), based on the total mass of component (A).

[0026] Compounds having a (meth)acryloyl group include (meth)acrylic acid and (meth)acrylic acid esters. Examples of (meth)acrylic acid esters include alkyl (meth)acrylate ((meth)acrylate ester, excluding compounds corresponding to cycloalkyl (meth)acrylate), cycloalkyl (meth)acrylate ((meth)acrylate ester), aryl (meth)acrylate ((meth)acrylate ester), (meth)acrylamide compounds (such as diacetone acrylamide), glycidyl (meth)acrylate, and styryl (meth)acrylic acid.

[0027] Component (A) may contain (meth)acrylic acid as a monomer unit, from the viewpoint of easily obtaining excellent resolution and adhesion. When component (A) contains (meth)acrylic acid as a monomer unit, the content of (meth)acrylic acid monomer units may be within the following ranges based on the total amount of monomer units constituting component (A), from the viewpoint of easily obtaining excellent resolution and adhesion. The content of (meth)acrylic acid monomer units may be 1% by mass or more, 5% by mass or more, 10% by mass or more, 15% by mass or more, 20% by mass or more, or 25% by mass or more. The content of (meth)acrylic acid monomer units may be 50% by mass or less, less than 50% by mass, 45% by mass or less, 40% by mass or less, 35% by mass or less, or 30% by mass or less. From these viewpoints, the content of (meth)acrylic acid monomer units may be 1 to 50% by mass.

[0028] Component (A) may have an alkyl (meth)acrylate monomer unit from the viewpoint of easily obtaining excellent resolution and adhesion. Examples of alkyl groups of alkyl (meth)acrylate include methyl, ethyl, propyl, butyl, pentyl, hexyl, heptyl, octyl, nonyl, decyl, undecyl, and dodecyl groups, and the alkyl group may be any structural isomer. The number of carbon atoms in the alkyl group of alkyl (meth)acrylate may be 1-4, 1-3, 2-3, or 1-2 from the viewpoint of easily obtaining excellent resolution and adhesion.

[0029] The alkyl group of (meth)acrylate may have substituents. Examples of substituents include hydroxyl groups, carboxyl groups, carboxylic acid bases, aldehyde groups, alkoxy groups (unsubstituted alkoxy groups (structures having an unsubstituted alkyl group bonded to an oxygen atom), or substituted alkoxy groups (such as hydroxyalkoxy groups)), carbonyl groups, alkoxycarbonyl groups, alkanoyl groups (such as alkanoyl groups with 2 to 12 carbon atoms), oxycarbonyl groups, carbonyloxy groups, amino groups, epoxy groups, furyl groups, cyano groups, halogeno groups (such as fluoro groups, chloro groups, and bromo groups), nitro groups, acetyl groups, sulfonyl groups, and sulfonamide groups. Examples of (meth)acrylate include dimethylaminoethyl (meth)acrylate, diethylaminoethyl (meth)acrylate, 2,2,2-trifluoroethyl (meth)acrylate, 2,2,3,3-tetrafluoropropyl (meth)acrylate, α-chloro(meth)acrylic acid, and α-bromo(meth)acrylic acid.

[0030] (A) Component may have a monomer unit of hydroxyalkyl (meth)acrylate, from the viewpoint of easily obtaining excellent resolution and adhesion. Examples of hydroxyalkyl (meth)acrylate include hydroxymethyl (meth)acrylate, hydroxyethyl (meth)acrylate, hydroxypropyl (meth)acrylate, hydroxybutyl (meth)acrylate, hydroxypentyl (meth)acrylate, and hydroxyhexyl (meth)acrylate.

[0031] When component (A) contains alkyl (meth)acrylate as a monomer unit, the content of monomer units of alkyl (meth)acrylate, or when component (A) contains hydroxyalkyl (meth)acrylate as a monomer unit, the content of monomer units of hydroxyalkyl (meth)acrylate, may be within the following ranges based on the total amount of monomer units constituting component (A), from the viewpoint of easily obtaining excellent resolution and adhesion. The content of the above monomer units may be 0.1% by mass or more, 0.5% by mass or more, 1% by mass or more, 2% by mass or more, or 3% by mass or more. The content of the above monomer units may be 20% by mass or less, 15% by mass or less, 10% by mass or less, 8% by mass or less, 5% by mass or less, or 3% by mass or less. From these viewpoints, the content of the above monomer units may be 0.1 to 20% by mass.

[0032] (A) Component may contain aryl (meth)acrylate as a monomer unit, from the viewpoint of easily obtaining excellent resolution and adhesion. Examples of aryl (meth)acrylate include benzyl (meth)acrylate, phenyl (meth)acrylate, naphthyl (meth)acrylate, etc.

[0033] If component (A) contains aryl (meth)acrylate as a monomer unit, the content of aryl (meth)acrylate monomer units may be within the following ranges based on the total amount of monomer units constituting component (A), from the viewpoint of easily obtaining excellent resolution and adhesion. The content of aryl (meth)acrylate monomer units may be 1% by mass or more, 5% by mass or more, 10% by mass or more, 15% by mass or more, or 20% by mass or more. The content of aryl (meth)acrylate monomer units may be 50% by mass or less, less than 50% by mass, 45% by mass or less, 40% by mass or less, 35% by mass or less, 30% by mass or less, 25% by mass or less, or 20% by mass or less. From these viewpoints, the content of aryl (meth)acrylate monomer units may be between 1 and 50% by mass.

[0034] Component (A) may contain a styrene compound (excluding compounds having a (meth)acryloyl group) as a monomer unit, from the viewpoint of easily obtaining excellent resolution and adhesion. Examples of styrene compounds include styrene and styrene derivatives. Examples of styrene derivatives include vinyltoluene and α-methylstyrene. Component (A) may contain (meth)acrylic acid and a styrene compound as monomer units, or hydroxyalkyl (meth)acrylate and a styrene compound as monomer units, or aryl (meth)acrylate and a styrene compound as monomer units, from the viewpoint of easily obtaining excellent resolution and adhesion.

[0035] If component (A) contains styrene compounds as monomer units, the content of monomer units of styrene compounds may be within the following ranges based on the total amount of monomer units constituting component (A), from the viewpoint of easily obtaining excellent resolution and adhesion. The content of monomer units of styrene compounds may be 10% by mass or more, more than 10% by mass, 15% by mass or more, more than 15% by mass, 20% by mass or more, more than 20% by mass, 25% by mass or more, more than 25% by mass, 30% by mass or more, more than 30% by mass, 35% by mass or more, more than 35% by mass, 40% by mass or more, more than 40% by mass, 45% by mass or more, more than 45% by mass, 47% by mass or more, or 50% by mass or more. The monomer content of the styrene compound may be 90% by mass or less, 85% by mass or less, 80% by mass or less, 75% by mass or less, 70% by mass or less, 65% by mass or less, 60% by mass or less, 55% by mass or less, or 50% by mass or less. From these viewpoints, the monomer content of the styrene compound may be 10 to 90% by mass.

[0036] When component (A) contains styrene compounds as monomer units, the content of styrene compound monomer units may be within the following ranges based on the total amount of monomer units constituting component (A), from the viewpoint of easily obtaining excellent resolution and adhesion. The content of styrene compound monomer units may be 10 mol% or more, more than 10 mol%, 15 mol% or more, 20 mol% or more, more than 20 mol%, 25 mol% or more, 30 mol% or more, more than 30 mol%, 35 mol% or more, 40 mol% or more, more than 40 mol%, 45 mol% or more, 50 mol% or more, or more than 50 mol%. The content of styrene compound monomer units may be 90 mol% or less, 85 mol% or less, 80 mol% or less, 75 mol% or less, 70 mol% or less, 65 mol% or less, 60 mol% or less, or 55 mol% or less. From these viewpoints, the content of styrene compound monomer units may be 10 to 90 mol%.

[0037] Component (A) may contain other monomers as monomer units. Examples of such monomers include vinyl alcohol ethers (vinyl-n-butyl ether, etc.), (meth)acrylonitrile, maleic acid, maleic anhydride, maleic acid monoesters (monomethyl maleic acid, monoethyl maleic acid, monoisopropyl maleic acid, etc.), fumaric acid, cinnamic acid, α-cyanocinnamic acid, itaconic acid, crotonic acid, and propiolic acid.

[0038] Component (A) may contain a binder polymer that does not contain nitrogen-containing groups, but does not have to contain a binder polymer that contains nitrogen-containing groups (for example, a binder polymer that has a compound containing nitrogen-containing groups as a monomer unit). In component (A), the content of monomer units of the compound containing nitrogen-containing groups may be 1 mol% or less, less than 1 mol%, 0.1 mol% or less, or 0.01 mol% or less, based on the total amount of monomer units constituting component (A).

[0039] The acid value of component (A) may be within the following ranges from the viewpoint of easily obtaining excellent resolution and adhesion. The acid value of component (A) may be 80 mg KOH / g or more, 90 mg KOH / g or more, 100 mg KOH / g or more, greater than 100 mg KOH / g, 120 mg KOH / g or more, 140 mg KOH / g or more, 150 mg KOH / g or more, 160 mg KOH / g or more, or 170 mg KOH / g or more. The acid value of component (A) may be 250 mg KOH / g or less, 240 mg KOH / g or less, 230 mg KOH / g or less, 210 mg KOH / g or less, 200 mg KOH / g or less, or 180 mg KOH / g or less. From these viewpoints, the acid value of component (A) may be between 80 and 250 mg KOH / g. The acid value of component (A) can be adjusted by the content of monomer units constituting component (A) (e.g., monomer units of (meth)acrylic acid). The acid value of component (A) can be measured by the method described in the examples.

[0040] The weight-average molecular weight (Mw) of component (A) may be within the following ranges from the viewpoint of easily obtaining excellent resolution and adhesion: The weight-average molecular weight of component (A) may be 10,000 or more, 20,000 or more, 25,000 or more, 30,000 or more, or 35,000 or more. The weight-average molecular weight of component (A) may be 100,000 or less, 80,000 or less, 70,000 or less, less than 70,000, 65,000 or less, 60,000 or less, 50,000 or less, 40,000 or less, or 35,000 or less. From these viewpoints, the weight-average molecular weight of component (A) may be between 10,000 and 100,000, 20,000 and 50,000, or 30,000 and 40,000.

[0041] The number-average molecular weight (Mn) of component (A) may be within the following ranges from the viewpoint of easily obtaining excellent resolution and adhesion: The number-average molecular weight of component (A) may be 5000 or more, 10000 or more, 12000 or more, 15000 or more, or 16000 or more. The number-average molecular weight of component (A) may be 50000 or less, 40000 or less, 35000 or less, 30000 or less, 25000 or less, 20000 or less, or 16000 or less. From these viewpoints, the number-average molecular weight of component (A) may be 5000 to 50000, 10000 to 25000, or 15000 to 20000.

[0042] (A) The degree of dispersion (weight-average molecular weight / number-average molecular weight) of component (A) may be within the following ranges from the viewpoint of easily obtaining excellent resolution and adhesion: The degree of dispersion of component (A) may be 1.0 or higher, 1.5 or higher, 1.8 or higher, 2.0 or higher, or 2.1 or higher. The degree of dispersion of component (A) may be 3.0 or lower, 2.8 or lower, 2.5 or lower, 2.3 or lower, or 2.2 or lower. From these viewpoints, the degree of dispersion of component (A) may be between 1.0 and 3.0.

[0043] The weight-average molecular weight and number-average molecular weight can be measured, for example, by gel permeation chromatography (GPC) using a calibration curve for standard polystyrene. More specifically, they can be measured under the conditions described in the examples. For compounds with low molecular weight, if it is difficult to measure the weight-average molecular weight and number-average molecular weight using the above-described methods, the molecular weight can be measured by other methods and its average value can be calculated.

[0044] The content of component (A) may be within the following ranges based on the total amount of the photosensitive film or the total amount of the photosensitive resin composition (total amount of solids). The content of component (A) may be 10% by mass or more, 20% by mass or more, 30% by mass or more, 40% by mass or more, 45% by mass or more, or 50% by mass or more, from the viewpoint of easily obtaining excellent resolution and adhesion, and from the viewpoint of excellent moldability of the film. The content of component (A) may be 90% by mass or less, 80% by mass or less, 75% by mass or less, 70% by mass or less, 65% by mass or less, 60% by mass or less, or 55% by mass or less, from the viewpoint of easily obtaining excellent resolution and adhesion. From these viewpoints, the content of component (A) may be 10 to 90% by mass.

[0045] The content of component (A) may be within the following ranges relative to 100 parts by mass of the total amount of components (A) and (B). The content of component (A) may be 10 parts by mass or more, 20 parts by mass or more, 30 parts by mass or more, 40 parts by mass or more, 45 parts by mass or more, 50 parts by mass or more, or 55 parts by mass or more, from the viewpoint of easily obtaining excellent resolution and adhesion, and from the viewpoint of excellent film moldability. The content of component (A) may be 90 parts by mass or less, 80 parts by mass or less, 75 parts by mass or less, 70 parts by mass or less, 65 parts by mass or less, or 60 parts by mass or less, from the viewpoint of easily obtaining excellent resolution and adhesion. From these viewpoints, the content of component (A) may be 10 to 90 parts by mass, or 40 to 70 parts by mass.

[0046] The photosensitive film and photosensitive resin composition according to this embodiment contain a photopolymerizable compound (excluding compounds corresponding to anthracene compounds, pyrazoline compounds, distylylbenzene compounds, or naphthalene compounds) as component (B). The photopolymerizable compound is a compound that polymerizes upon exposure to light. Component (B) may be a compound having an ethylenically unsaturated bond, or a compound having a (meth)acryloyl group ((meth)acrylic acid compound).

[0047] (B) Components include bisphenol A type (meth)acrylic acid compounds, EO-modified di(meth)acrylate, PO-modified di(meth)acrylate, EO-PO-modified di(meth)acrylate, polyalkylene glycol di(meth)acrylate (polyethylene glycol di(meth)acrylate, polypropylene glycol di(meth)acrylate, etc.), EO-modified polyalkylene glycol di(meth)acrylate, PO-modified polyalkylene glycol di(meth)acrylate, EO-PO-modified polyalkylene glycol di(meth)acrylate, trimethylolpropane di(meth)acrylate, trimethylolpropane tri(meth)acrylate, EO-modified trimethylolpropane tri(meth)acrylate, PO-modified trimethylolpropane tri(meth)acrylate, EO-PO-modified Examples include limethylolpropane tri(meth)acrylate, tetramethylolmethane tri(meth)acrylate, tetramethylolmethane tetra(meth)acrylate, EO-modified pentaerythritol tetra(meth)acrylate, PO-modified pentaerythritol tetra(meth)acrylate, EO-PO-modified pentaerythritol tetra(meth)acrylate, EO-modified dipentaerythritol hexa(meth)acrylate, PO-modified dipentaerythritol hexa(meth)acrylate, EO-PO-modified dipentaerythritol hexa(meth)acrylate, nonylphenoxypolyethylene oxyacrylate, phthalate compounds, alkyl (meth)acrylates, and photopolymerizable compounds having at least one cationically polymerizable cyclic ether group in the molecule (such as oxetane compounds). "EO-modified" means that the compound has a (poly)oxyethylene group. "PO-modified" means that the compound has a (poly)oxypropylene group. "EO·PO modified" means a compound having a (poly)oxyethylene group and / or a (poly)oxypropylene group.

[0048] Component (B) may contain a photopolymerizable compound having a (poly)oxyethylene group (for example, a (meth)acrylic acid compound having a (poly)oxyethylene group) where the number of structural units of the oxyethylene group is within the following ranges, from the viewpoint of easily obtaining excellent resolution and adhesion. The number of structural units of the oxyethylene group may be 1 or more, 2 or more, 3 or more, 4 or more, greater than 4, 5 or more, 6 or more, 8 or more, or 10 or more. The number of structural units of the oxyethylene group may be 20 or less, 18 or less, 16 or less, 14 or less, 12 or less, 10 or less, 8 or less, 6 or less, 5 or less, 4 or less, less than 4, or 3 or less. From these viewpoints, the number of structural units of the oxyethylene group may be 1 to 20, 2 to 18, 4 to 16, or 6 to 10. The above-mentioned number of structural units of the oxyethylene group is the total number of structural units of the oxyethylene group in the (poly)oxyethylene group contained in the photopolymerizable compound. For example, if a photopolymerizable compound has two (poly)oxyethylene groups, the number of structural units of the oxyethylene groups mentioned above refers to the sum of the number of structural units of the oxyethylene group in one (poly)oxyethylene group and the number of structural units of the oxyethylene group in the other (poly)oxyethylene group.

[0049] (B) Component may contain a bisphenol A type (meth)acrylic acid compound from the viewpoint of easily obtaining excellent resolution and adhesion. Examples of bisphenol A type (meth)acrylic acid compounds include 2,2-bis(4-((meth)acryloxypolyethoxy)phenyl)propane (2,2-bis(4-((meth)acryloxypentaethoxy)phenyl)propane, 2,2-bis(4-((meth)acryloxypolypropoxy)phenyl)propane, 2,2-bis(4-((meth)acryloxypolybutoxy)phenyl)propane, and 2,2-bis(4-((meth)acryloxypolyethoxypolypropoxy)phenyl)propane. Component (B) may contain 2,2-bis(4-((meth)acryloxypolyethoxy)phenyl)propane, or 2,2-bis(4-((meth)acryloxypentaethoxy)phenyl)propane, from the viewpoint of easily obtaining excellent resolution and adhesion.

[0050] The molecular weight of the bisphenol A type (meth)acrylic acid compound may be within the following ranges from the viewpoint of easily obtaining excellent resolution and adhesion: The molecular weight may be 100 or more, 200 or more, 300 or more, 400 or more, 450 or more, 500 or more, 600 or more, 700 or more, or 800 or more. The molecular weight may be 10000 or less, less than 10000, 8000 or less, 6000 or less, 5000 or less, 3000 or less, 2000 or less, 1500 or less, 1000 or less, 900 or less, 800 or less, 700 or less, 600 or less, or 500 or less. From these viewpoints, the molecular weight may be between 100 and 10000.

[0051] From the viewpoint of obtaining excellent resolution and adhesion, the content of the bisphenol A type (meth)acrylic acid compound may be within the following ranges based on the total mass of component (B): The content of the bisphenol A type (meth)acrylic acid compound may be 50% by mass or more, more than 50% by mass, 60% by mass or more, 70% by mass or more, 80% by mass or more, 85% by mass or more, or 90% by mass or more. The content of the bisphenol A type (meth)acrylic acid compound may be 100% by mass or less, less than 100% by mass, 99% by mass or less, 98% by mass or less, 97% by mass or less, 95% by mass or less, 92% by mass or less, or 91% by mass or less. From these viewpoints, the content of the bisphenol A type (meth)acrylic acid compound may be between 50% and 100% by mass.

[0052] From the viewpoint of obtaining excellent resolution and adhesion, the content of the bisphenol A type (meth)acrylic acid compound may be within the following ranges per 100 parts by mass of the total amount of component (A) and component (B): The content of the bisphenol A type (meth)acrylic acid compound may be 1 part by mass or more, 5 parts by mass or more, 10 parts by mass or more, 20 parts by mass or more, 30 parts by mass or more, or 40 parts by mass or more. The content of the bisphenol A type (meth)acrylic acid compound may be less than 100 parts by mass, 90 parts by mass or less, 80 parts by mass or less, 70 parts by mass or less, 60 parts by mass or less, 50 parts by mass or less, or 40 parts by mass or less. From these viewpoints, the content of the bisphenol A type (meth)acrylic acid compound may be 1 part by mass or more and less than 100 parts by mass.

[0053] Component (B) may contain a (meth)acrylic acid compound having a polyoxyalkylene group (a group in which two or more alkylene groups are linked by an ether bond) (excluding compounds that correspond to bisphenol A type (meth)acrylic acid compounds), and may also contain a (meth)acrylic acid compound having at least one selected from the group consisting of a polyoxyethylene group and a polyoxypropylene group (excluding compounds that correspond to bisphenol A type (meth)acrylic acid compounds).

[0054] The molecular weight of the (meth)acrylic acid compound having a polyoxyalkylene group may be within the following ranges from the viewpoint of easily obtaining excellent resolution and adhesion. The molecular weight may be 100 or more, 200 or more, 300 or more, 400 or more, 500 or more, 600 or more, 700 or more, 800 or more, 900 or more, 1000 or more, or 1100 or more. The molecular weight may be 10000 or less, less than 10000, 8000 or less, 6000 or less, 5000 or less, 3000 or less, 2000 or less, 1500 or less, or 1200 or less. From these viewpoints, the molecular weight may be between 100 and 10000.

[0055] The content of the (meth)acrylic acid compound having a polyoxyalkylene group may be within the following ranges based on the total mass of component (B), from the viewpoint of easily obtaining excellent resolution and adhesion. The content of the (meth)acrylic acid compound having a polyoxyalkylene group may be greater than 0% by mass and may be 1% or more by mass, 2% or more by mass, 3% or more by mass, 5% or more by mass, 8% or more by mass, or 9% or more by mass. The content of the (meth)acrylic acid compound having a polyoxyalkylene group may be 50% or less by mass, less than 50% by mass, 40% or less by mass, 30% or less by mass, 20% or less by mass, 15% or less by mass, or 10% or less by mass. From these viewpoints, the content of the (meth)acrylic acid compound having a polyoxyalkylene group may be greater than 0% by mass and 50% or less by mass.

[0056] From the viewpoint of obtaining excellent resolution and adhesion, the content of the (meth)acrylic acid compound having a polyoxyalkylene group may be within the following ranges per 100 parts by mass of the total amount of component (A) and component (B). The content of the (meth)acrylic acid compound having a polyoxyalkylene group may be 0.1 parts by mass or more, 0.5 parts by mass or more, 1 part by mass or more, 2 parts by mass or more, 3 parts by mass or more, or 4 parts by mass or more. The content of the (meth)acrylic acid compound having a polyoxyalkylene group may be 50 parts by mass or less, 30 parts by mass or less, 10 parts by mass or less, 8 parts by mass or less, 6 parts by mass or less, 5 parts by mass or less, less than 5 parts by mass, or 4 parts by mass or less. From these viewpoints, the content of the (meth)acrylic acid compound having a polyoxyalkylene group may be between 0.1 and 50 parts by mass.

[0057] If component (B) contains a bisphenol A type (meth)acrylic acid compound and a (meth)acrylic acid compound having a polyoxyalkylene group, the content of the bisphenol A type (meth)acrylic acid compound may be within the following ranges per 100 parts by mass of the (meth)acrylic acid compound having a polyoxyalkylene group, from the viewpoint of easily obtaining excellent resolution and adhesion. The content of the bisphenol A type (meth)acrylic acid compound may be 1 part by mass or more, 2 parts by mass or more, 3 parts by mass or more, 5 parts by mass or more, 8 parts by mass or more, or 10 parts by mass or more. The content of the bisphenol A type (meth)acrylic acid compound may be 100 parts by mass or less, less than 100 parts by mass, 80 parts by mass or less, 50 parts by mass or less, 30 parts by mass or less, 20 parts by mass or less, or 10 parts by mass or less. From these viewpoints, the content of the bisphenol A type (meth)acrylic acid compound may be 1 to 100 parts by mass.

[0058] From the viewpoint of obtaining excellent resolution and adhesion, the content of component (B) may be within the following ranges based on the total amount of the photosensitive film or the total amount of the photosensitive resin composition (total amount of solids): The content of component (B) may be 10% by mass or more, 15% by mass or more, 20% by mass or more, 25% by mass or more, 30% by mass or more, 35% by mass or more, or 40% by mass or more. The content of component (B) may be 90% by mass or less, 80% by mass or less, 70% by mass or less, 65% by mass or less, 60% by mass or less, 55% by mass or less, 50% by mass or less, or 45% by mass or less. From these viewpoints, the content of component (B) may be between 10% and 90% by mass.

[0059] From the viewpoint of obtaining excellent resolution and adhesion, the content of component (B) may be within the following ranges relative to 100 parts by mass of the total amount of components (A) and (B): The content of component (B) may be 10 parts by mass or more, 20 parts by mass or more, 25 parts by mass or more, 30 parts by mass or more, 35 parts by mass or more, or 40 parts by mass or more. The content of component (B) may be 90 parts by mass or less, 80 parts by mass or less, 70 parts by mass or less, 60 parts by mass or less, 55 parts by mass or less, 50 parts by mass or less, or 45 parts by mass or less. From these viewpoints, the content of component (B) may be 10 to 90 parts by mass, or 30 to 60 parts by mass.

[0060] The photosensitive film and photosensitive resin composition according to this embodiment contain a photopolymerization initiator (excluding compounds corresponding to anthracene compounds, pyrazoline compounds, distylylbenzene compounds, or naphthalene compounds) as component (C).

[0061] (C) Components include hexaarylbiimidazole compounds; aromatic ketones such as benzophenone, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-1-butanone, 2-(dimethylamino)-2-[(4-methylphenyl)methyl]-1-[4-(4-morpholinyl)phenyl]-1-butanone, 4-(2-hydroxyethoxy)phenyl-2-(hydroxy-2-propyl)ketone, 2-methyl-1-[4-(methylthio)phenyl]-2-morpholino-propanone-1; and Examples include quinone compounds such as lucylantraquinone; benzoin ether compounds such as benzoin alkyl ethers; benzoin compounds such as benzoin and alkylbenzoin; benzyl derivatives such as benzyldimethylketal; bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide; bis(2,6-dimethylbenzoyl)-2,4,4-trimethylpentylphosphine oxide; and (2,4,6-trimethylbenzoyl)ethoxyphenylphosphine oxide.

[0062] Component (C) may contain a hexaarylbiimidazole compound, from the viewpoint of easily obtaining excellent resolution and adhesion. The aryl group in the hexaarylbiimidazole compound may be a phenyl group or the like. The hydrogen atom bonded to the aryl group in the hexaarylbiimidazole compound may be substituted with a halogen atom (such as a chlorine atom).

[0063] The hexaarylbiimidazole compound may be a 2,4,5-triarylimidazole dimer. Examples of 2,4,5-triarylimidazole dimers include 2-(o-chlorophenyl)-4,5-diphenylimidazole dimer, 2-(o-chlorophenyl)-4,5-bis-(m-methoxyphenyl)imidazole dimer, and 2-(p-methoxyphenyl)-4,5-diphenylimidazole dimer. From the viewpoint of easily obtaining excellent resolution and adhesion, the hexaarylbiimidazole compound may contain a 2-(o-chlorophenyl)-4,5-diphenylimidazole dimer and may also contain 2,2'-bis(o-chlorophenyl)-4,4',5,5'-tetraphenyl-1,2'-biimidazole.

[0064] The content of the hexaarylbiimidazole compound may be 50% by mass or more, more than 50% by mass, 70% by mass or more, 90% by mass or more, 95% by mass or more, 98% by mass or more, 99% by mass or more, or substantially 100% by mass (in which case component (C) consists substantially of the hexaarylbiimidazole compound), based on the total amount of component (C).

[0065] From the viewpoint of obtaining excellent resolution and adhesion, the content of component (C) may be within the following ranges based on the total amount of the photosensitive film or the total amount of the photosensitive resin composition (total amount of solids): The content of component (C) may be 0.1% by mass or more, 0.5% by mass or more, 1% by mass or more, 2% by mass or more, 3% by mass or more, 4% by mass or more, 5% by mass or more, or 5.5% by mass or more. The content of component (C) may be 20% by mass or less, 15% by mass or less, 12% by mass or less, 10% by mass or less, 8% by mass or less, 7% by mass or less, or 6% by mass or less. From these viewpoints, the content of component (C) may be 0.1 to 20% by mass.

[0066] From the viewpoint of obtaining excellent resolution and adhesion, the content of component (C) may be within the following ranges relative to 100 parts by mass of the total amount of components (A) and (B): The content of component (C) may be 0.1 parts by mass or more, 0.5 parts by mass or more, 1 part by mass or more, 2 parts by mass or more, 3 parts by mass or more, 4 parts by mass or more, 5 parts by mass or more, 5.5 parts by mass or more, or 6 parts by mass or more. The content of component (C) may be 20 parts by mass or less, 15 parts by mass or less, 12 parts by mass or less, 10 parts by mass or less, 8 parts by mass or less, 7 parts by mass or less, or 6 parts by mass or less. From these viewpoints, the content of component (C) may be between 0.1 and 20 parts by mass.

[0067] The photosensitive film and photosensitive resin composition according to this embodiment contain, as component (D), at least one selected from the group consisting of anthracene compounds (compounds having an anthracene ring; excluding compounds corresponding to naphthalene compounds), pyrazoline compounds (compounds having a pyrazoline ring; excluding compounds corresponding to anthracene compounds or naphthalene compounds), and distylylbenzene compounds (compounds having a benzene ring with two styryl groups bonded to it; excluding compounds corresponding to anthracene compounds, pyrazoline compounds, or naphthalene compounds). Component (D) can be used as a sensitizer (photosensitizer). The photosensitive film and photosensitive resin composition according to this embodiment may be in an embodiment that does not contain anthracene compounds, may not contain pyrazoline compounds, or may be in an embodiment that does not contain distylylbenzene compounds. The molecular weight of component (D) may be less than 10,000.

[0068] (D) component contains an anthracene compound, whereby particularly excellent resolution can be obtained. The anthracene compound may have a substituent bonded to the anthracene ring, and may have a substituent bonded to at least one selected from the group consisting of the 9-position and 10-position of the anthracene ring. Examples of the substituent include an alkyl group (an acyclic alkyl group having 1 to 20 carbon atoms, a cycloalkyl group having 5 to 12 carbon atoms, etc.), an aryl group (a phenyl group, an aralkyl group (a benzyl group, a phenethyl group, etc.), a benzoyl group, a styryl group, etc.), a vinyl group, a hydroxy group, a carboxy group, a carboxylate group, an aldehyde group, an alkoxy group (an unsubstituted alkoxy group or a substituted alkoxy group (a hydroxyalkoxy group, etc.)), a carbonyl group, an alkoxycarbonyl group, an alkanoyl group (an alkanoyl group having 2 to 12 carbon atoms, etc.), an oxycarbonyl group, a carbonyloxy group, an amino group, an epoxy group, a furyl group, a cyano group, a halogeno group (a fluoro group, a chloro group, a bromo group, etc.), a nitro group, an acetyl group, a sulfonyl group, a sulfonamide group, etc.).

[0069] (D) component may contain a compound represented by the following general formula (d1) from the viewpoint of easily obtaining excellent resolution and adhesion.

[0070] [Chemical formula] [In formula (d1), R d10 and R d11 each independently represent an alkyl group (an acyclic alkyl group having 1 to 20 carbon atoms, a cycloalkyl group having 5 to 12 carbon atoms, etc.), a phenyl group, a benzyl group, an alkanoyl group (for example, an alkanoyl group having 2 to 12 carbon atoms), or a benzoyl group. R d12 , R d13 , R d14 , R d15 , R d16 , R d17 , R d18 and R d19Each of these independently represents a hydrogen atom, an alkyl group (e.g., an alkyl group having 1 to 12 carbon atoms), a halogen group, a cyano group, a carboxyl group, a phenyl group, an alkoxycarbonyl group (e.g., an alkoxycarbonyl group having 2 to 6 carbon atoms), or a benzoyl group.

[0071] In formula (d1), if the alkyl group has two or more carbon atoms (e.g., 2 to 12), the alkyl group may have oxygen atoms between the carbon atoms of the main chain and may be substituted with a hydroxyl group. The cycloalkyl group may have oxygen atoms in the ring and may be substituted with a hydroxyl group. Each of the phenyl group, benzyl group, and benzoyl group may be substituted with at least one selected from the group consisting of alkyl groups (e.g., alkyl groups having 1 to 6 carbon atoms), hydroxyl groups, halogeno groups, cyano groups, carboxyl groups, phenyl groups, alkoxy groups (e.g., alkoxy groups having 1 to 6 carbon atoms), phenoxy groups, and alkoxycarbonyl groups (e.g., alkoxycarbonyl groups having 2 to 6 carbon atoms). d12 , R d13 , R d14 , R d15 , R d16 , R d17 , R d18 and R d19 From the viewpoint of easily obtaining excellent resolution and adhesion, it may be a hydrogen atom.

[0072] Anthracene compounds do not need to have a hydroxyl group in their molecule, nor do they need to have a hydroxyalkoxy group bonded to the anthracene ring. Anthracene compounds do not need to have a COO group (C(=O)O group) in their molecule, nor do they need to have a COO group (C(=O)O group) bonded to the anthracene ring. Anthracene compounds do not need to have substituents at positions other than the 9th and 10th positions of the anthracene ring.

[0073] Component (D) does not need to contain an anthracene compound having a hydroxyl group in its molecule, nor does it need to contain an anthracene compound having a hydroxyalkoxy group bonded to the anthracene ring. Component (D) does not need to contain an anthracene compound having a COO group (C(=O)O group) in its molecule, nor does it need to contain an anthracene compound having a COO group (C(=O)O group) bonded to the anthracene ring. Component (D) does not need to contain an anthracene compound having substituents at positions other than the 9th and 10th positions of the anthracene ring. Component (D) does not need to contain an anthracene compound having substituents with 2 or more oxygen atoms bonded to the anthracene ring.

[0074] The number of carbon atoms in the alkoxy group may be within the following range, from the viewpoint of obtaining excellent resolution and adhesion. For example, in the above formula (d1), R d10 and R d11 If at least one selected from the group consisting of is an alkyl group, then OR d10 OR d11 The number of carbon atoms in the alkoxy group may be within the following ranges from the viewpoint of easily obtaining excellent resolution and adhesion. The number of carbon atoms in the alkoxy group may be 1 or more, 2 or more, 3 or more, or 4 or more. The number of carbon atoms in the alkoxy group may be 10 or less, 8 or less, 6 or less, 5 or less, 4 or less, or 3 or less. From these viewpoints, the number of carbon atoms in the alkoxy group may be between 1 and 10.

[0075] Examples of anthracene compounds include 1-methylanthracene, 2-methylanthracene, 9-methylanthracene, 2-ethylanthracene, 2-butylanthracene, 9-vinylanthracene, 9-phenylanthracene, 1-aminoanthracene, 2-aminoanthracene, 9-(methylaminomethyl)anthracene, 9-acetylanthracene, 9-antraldehyde, 9,10-dimethylanthracene, 9,10-diethoxyanthracene, 9,10-dipropoxyanthracene, 9,10-dibutoxyanthracene, 9,10-di(2-ethylhexyloxy)anthracene, 9,10-diphenylanthracene, 2-bromo-9,10-diphenylanthracene, 9-(4-bromophenyl)-10-phenylanthracene, 10-methyl-9-antraldehyde, and 1,4,9,10-tetrahydroxyanthracene.

[0076] The anthracene compound may include a compound having an unsubstituted alkoxy group bonded to the anthracene ring (for example, a dialkoxyanthracene compound having two unsubstituted alkoxy groups bonded to the anthracene ring) from the viewpoint of easily obtaining excellent resolution and adhesion, and may include a compound having an unsubstituted alkoxy group bonded to at least one selected from the group consisting of the 9th and 10th positions of the anthracene ring, and may include at least one selected from the group consisting of 9,10-dipropoxyanthracene and 9,10-dibutoxyanthracene, and may include 9,10-dibutoxyanthracene. Component (D) may not include any compounds other than those having an unsubstituted alkoxy group bonded to the 9th and 10th positions of the anthracene ring as the anthracene compound, from the viewpoint of easily obtaining excellent resolution and adhesion. That is, the anthracene compound in component (D) may consist of a compound having an unsubstituted alkoxy group bonded to the 9th and 10th positions of the anthracene ring.

[0077] The content of compounds having unsubstituted alkoxy groups bonded to the anthracene ring, or anthracene compounds having unsubstituted alkoxy groups bonded to the 9th and 10th positions of the anthracene ring, may be 50% by mass or more, more than 50% by mass, 70% by mass or more, 90% by mass or more, 95% by mass or more, 98% by mass or more, 99% by mass or more, or substantially 100% by mass (an embodiment in which the anthracene compound substantially consists of compounds having unsubstituted alkoxy groups bonded to the anthracene ring), or 50 to 100% by mass, based on the total mass of the anthracene compound (the total mass of anthracene compounds contained in the photosensitive film or photosensitive resin composition).

[0078] (D) The inclusion of a pyrazoline compound in the component makes it easier to obtain excellent sensitivity. Examples of pyrazoline compounds include 1-pyrazoline compounds, 2-pyrazoline compounds, and 3-pyrazoline compounds. The pyrazoline compound may include a 2-pyrazoline compound from the viewpoint of easily obtaining excellent resolution and adhesion.

[0079] Pyrazoline compounds may have substituents bonded to the pyrazoline ring, and may include compounds having substituents bonded to at least one selected from the group consisting of the 1st, 3rd, and 5th positions of the pyrazoline ring. Examples of substituents include alkyl groups (alkyl groups having 1 to 20 carbon atoms (acyclic alkyl groups), cycloalkyl groups having 5 to 12 carbon atoms, etc.), aryl groups (phenyl groups, aralkyl groups (benzyl groups, phenethyl groups, etc.), benzoyl groups, styryl groups, etc.), vinyl groups, hydroxyl groups, carboxyl groups, carboxylic acid bases, aldehyde groups, alkoxy groups (unsubstituted alkoxy groups or substituted alkoxy groups (hydroxyalkoxy groups, etc.)), carbonyl groups, alkoxycarbonyl groups, alkanoyl groups (alkanoyl groups having 2 to 12 carbon atoms, etc.), oxycarbonyl groups, carbonyloxy groups, amino groups, epoxy groups, furyl groups, cyano groups, halogeno groups (fluoro groups, chloro groups, bromo groups, etc.), nitro groups, acetyl groups, sulfonyl groups, and sulfonamide groups. The benzene ring of the aryl group may have substituents, and examples of substituents include alkyl groups, alkoxy groups (methoxy, ethoxy, propoxy, etc.), halogeno groups (fluoro, chloro, bromo, etc.), and sulfonamide groups. The substituents may also be alkyl ester groups (e.g., alkyl ester groups having 1 to 6 carbon atoms), alkylamino groups (e.g., alkylamino groups having 1 to 20 carbon atoms), etc.

[0080] Component (D) may include at least one selected from the group consisting of compounds represented by the following general formula (d21) and compounds represented by the following general formula (d22), from the viewpoint of easily obtaining excellent resolution and adhesion.

[0081] [ka] [In formula (d21), R d211 , R d212 and R d213 Each of these independently represents an alkoxy group (e.g., an alkoxy group with 1 to 10 carbon atoms) or an alkyl group (e.g., an alkyl group with 1 to 3 carbon atoms), and each of d211, d212, and d213 independently represents an integer from 0 to 5. When d211 is 2 or more, there are multiple Rd211 These may be identical to each other, or they may be different to each other, and there may be multiple R if d212 is 2 or more. d212 These may be identical to each other, or they may be different to each other, and there may be multiple R if d213 is 2 or more. d213 They may be identical to each other, or they may be different to each other.

[0082] In equation (d21), R d211 , R d212 and R d213 At least one of these may be an alkoxy group (e.g., an alkoxy group having 1 to 10 carbon atoms) or an alkyl group (e.g., an alkyl group having 1 to 3 carbon atoms). d212 and R d213 At least one selected from the group consisting of the above may be an alkoxy group, a methoxy group, an ethoxy group, or a propoxy group, from the viewpoint of easily obtaining excellent resolution and adhesion. d211 may be 0, from the viewpoint of easily obtaining excellent resolution and adhesion. At least one selected from the group consisting of d212 and d213 may be 0, 1, 2, or 3, or 1, from the viewpoint of easily obtaining excellent resolution and adhesion. The sum of d211, d212, and d213 may be 0 to 6 or 1 to 6.

[0083] [ka] [In formula (d22), R d221 and R d222 Each of these independently represents an alkyl group (acyclic alkyl group with 1 to 20 carbon atoms, a cycloalkyl group with 5 to 12 carbon atoms, etc.), an alkoxy group (e.g., an alkoxy group with 1 to 6 carbon atoms), an amino group, a halogeno group, a carboxyl group, a cyano group, a nitro group, an acetyl group, a sulfonyl group, or a sulfonamide group, and d221 and d222 each independently represent an integer from 0 to 5. When d221 is 2 or more, there are multiple R groups. d221 These may be identical to each other, or they may be different to each other, and there may be multiple R if d222 is 2 or more. d222They may be identical to each other, or they may be different to each other.

[0084] In equation (d22), R d221 From the viewpoint of easily obtaining excellent resolution and adhesion, this may be a halogeno group, a fluoro group, a chloro group, or a bromo group. d222 From the viewpoint of easily obtaining excellent resolution and adhesion, it may be a sulfonamide group. At least one selected from the group consisting of d221 and d222 may be 0, 1, 2, or 3, or 1, from the viewpoint of easily obtaining excellent resolution and adhesion.

[0085] Examples of pyrazoline compounds include 1-phenyl-3-(4-isopropylstyryl)-5-(4-isopropylphenyl)-pyrazoline, 1-phenyl-3-(4-tert-butylstyryl)-5-(4-tert-butylphenyl)-pyrazoline, 1-phenyl-3-(4-methoxystyryl)-5-(4-methoxyphenyl)-pyrazoline, 1-phenyl-3-(3,5-dimethoxystyryl)-5-(3,5-dimethoxyphenyl)-pyrazoline, 1- Examples include phenyl-3-(2,6-dimethoxystyryl)-5-(2,6-dimethoxyphenyl)-pyrazoline, 1-phenyl-3-(2,5-dimethoxystyryl)-5-(2,5-dimethoxyphenyl)-pyrazoline, 1-phenyl-3-(2,3-dimethoxystyryl)-5-(2,3-dimethoxyphenyl)-pyrazoline, 1-phenyl-3-(2,4-dimethoxystyryl)-5-(2,4-dimethoxyphenyl)-pyrazoline, and 4-[[3-(4-chlorophenyl)-4,5-dihydro-1H-pyrazole]-1-yl]benzenesulfonamide.

[0086] The pyrazoline compound may include a compound having an aryl group bonded to the pyrazoline ring (a compound having two or more (e.g., 2-3) aryl groups bonded to the pyrazoline ring), a compound having an aryl group bonded to at least one selected from the group consisting of the 1st, 3rd, and 5th positions of the pyrazoline ring, a compound having a phenyl group (a phenyl group that may have substituents) bonded to at least one selected from the group consisting of the 1st, 3rd, and 5th positions of the pyrazoline ring, and may include at least one selected from the group consisting of 1-phenyl-3-(4-methoxystyryl)-5-(4-methoxyphenyl)-pyrazoline and 4-[[3-(4-chlorophenyl)-4,5-dihydro-1H-pyrazole]-1-yl]benzenesulfonamide.

[0087] (D) By including a distylylbenzene compound, particularly excellent sensitivity can be obtained. In the distylylbenzene compound, the benzene ring with a styryl group and the benzene ring with two styryl groups bonded to it may have substituents. Substituents include alkyl groups (alkyl groups with 1 to 20 carbon atoms (acyclic alkyl groups), cycloalkyl groups with 5 to 12 carbon atoms, etc.), aryl groups (phenyl group, aralkyl group (benzyl group, phenethyl group, etc.), benzoyl group, etc.), vinyl group, hydroxyl group, carboxyl group, carboxylic acid base, aldehyde group, alkoxy group (unsubstituted alkoxy group or substituted alkoxy group (hydroxyalkoxy group, etc.)), carbonyl group, alkoxycarbonyl group, alkanoyl group (alkanoyl group with 2 to 12 carbon atoms, etc.), oxycarbonyl group, carbonyloxy group, amino group, epoxy group, furyl group, cyano group, halogeno group (fluoro group, chloro group, bromo group, etc.), nitro group, acetyl group, sulfonyl group, sulfonamide group, and the like.

[0088] Component (D) may include a compound represented by the following general formula (d3) from the viewpoint of easily obtaining excellent resolution and adhesion.

[0089] [ka] [In equation (d3), R d31 , R d32 and R d33 d31 represents a cyano group, d31 and d32 independently represent integers from 0 to 5, and d33 represents an integer from 0 to 4.

[0090] In formula (d3), at least one selected from the group consisting of d31 and d32 may be 1, 2, 3, 4, or 5, or 1, from the viewpoint of easily obtaining excellent resolution and adhesion. d33 may be 0, 1, 2, or 3, or 0, from the viewpoint of easily obtaining excellent resolution and adhesion.

[0091] Examples of distyrylbenzene compounds include distyrylbenzene and dicyanodistyrylbenzene compounds. Examples of dicyanodistyrylbenzene compounds include 4'-(2-cyanostyryl)-2-stilbene carbonitride, 4'-(2-cyanostyryl)-3-stilbene carbonitride, 4'-(2-cyanostyryl)-4-stilbene carbonitride, and 1,4-bis(4-cyanostyryl)benzene. Distyrylbenzene compounds may contain dicyanodistyrylbenzene compounds and may also contain 4'-(2-cyanostyryl)-3-stilbene carbonitride from the viewpoint of easily obtaining excellent resolution and adhesion.

[0092] The content D1, which is the total amount of component (D) (anthracene compound, pyrazoline compound, and distylylbenzene compound; the same applies hereinafter), the content of the anthracene compound, the content of the pyrazoline compound, or the content of the distylylbenzene compound, may be within the following ranges based on the total amount of the photosensitive film or the total amount of the photosensitive resin composition (total amount of solids), from the viewpoint of easily obtaining excellent resolution and adhesion. The content D1 may be 0.01% by mass or more, 0.05% by mass or more, 0.1% by mass or more, 0.2% by mass or more, 0.25% by mass or more, 0.3% by mass or more, 0.4% by mass or more, 0.5% by mass or more, or 0.6% by mass or more. The content D1 may be 5% by mass or less, 3% by mass or less, 1% by mass or less, 0.8% by mass or less, 0.7% by mass or less, 0.6% by mass or less, 0.5% by mass or less, 0.4% by mass or less, 0.3% by mass or less, or 0.25% by mass or less. From these viewpoints, the content D1 may be 0.01 to 5% by mass, or 0.1 to 1% by mass.

[0093] The content D2, which includes the content of component (D), the content of anthracene compound, the content of pyrazoline compound, or the content of distylylbenzene compound, may be within the following ranges relative to 100 parts by mass of the total amount of components (A) and (B), from the viewpoint of easily obtaining excellent resolution and adhesion. The content D2 may be 0.01 parts by mass or more, 0.05 parts by mass or more, 0.1 parts by mass or more, 0.2 parts by mass or more, 0.25 parts by mass or more, 0.3 parts by mass or more, 0.4 parts by mass or more, 0.5 parts by mass or more, 0.6 parts by mass or more, or 0.65 parts by mass or more. The content D2 may be 5 parts by mass or less, 3 parts by mass or less, 1 part by mass or less, 0.8 parts by mass or less, 0.7 parts by mass or less, 0.65 parts by mass or less, 0.6 parts by mass or less, 0.5 parts by mass or less, 0.4 parts by mass or less, 0.3 parts by mass or less, or 0.25 parts by mass or less. From these perspectives, the content D2 may be 0.01 to 5 parts by mass, or 0.1 to 1 part by mass.

[0094] The content of component D3, whether it be the content of component (D), the content of anthracene compound, or the content of distylylbenzene compound, may be within the following ranges relative to 100 parts by mass of component (A), from the viewpoint of easily obtaining excellent resolution and adhesion. The content of D3 may be 0.1 parts by mass or more, 0.3 parts by mass or more, 0.4 parts by mass or more, 0.5 parts by mass or more, 0.8 parts by mass or more, 1 part by mass or more, more than 1 part by mass, or 1.1 parts by mass or more. The content of D3 may be 10 parts by mass or less, 8 parts by mass or less, 5 parts by mass or less, 3 parts by mass or less, 2 parts by mass or less, 1.5 parts by mass or less, 1.2 parts by mass or less, 1.1 parts by mass or less, 1 part by mass or less, less than 1 part by mass, 0.8 parts by mass or less, or 0.5 parts by mass or less. From these viewpoints, the content of D3 may be 0.1 to 10 parts by mass, 0.5 to 5 parts by mass, or 1 to 3 parts by mass.

[0095] The photosensitive film and photosensitive resin composition according to this embodiment contain a naphthalene compound (a compound having a naphthalene ring) as component (E). Component (E) can be used as a photosensitizer. The molecular weight of component (E) may be less than 10,000.

[0096] The naphthalene compound may have substituents bonded to the naphthalene ring, and may have substituents bonded to at least one selected from the group consisting of positions 1 and 4 of the naphthalene ring. Examples of substituents include alkyl groups (alkyl groups with 1 to 20 carbon atoms (acyclic alkyl groups), cycloalkyl groups with 5 to 12 carbon atoms, etc.), aryl groups (phenyl group, aralkyl group (benzyl group, phenethyl group, etc.), benzoyl group, styryl group, etc.), vinyl group, hydroxyl group, carboxyl group, carboxylic acid base, aldehyde group, alkoxy group (unsubstituted alkoxy group or substituted alkoxy group (hydroxyalkoxy group, etc.)), carbonyl group, alkoxycarbonyl group, alkanoyl group (alkanoyl group with 2 to 12 carbon atoms, etc.), oxycarbonyl group, carbonyloxy group, amino group, epoxy group, furyl group, cyano group, halogeno group (fluoro group, chloro group, bromo group, etc.), nitro group, acetyl group, sulfonyl group, sulfonamide group, aryloxy group (phenoxy group, etc.). Naphthalene compounds do not need to have substituents at positions other than the 1st and 4th positions of the naphthalene ring.

[0097] The naphthalene compound may be a naphthalene compound that does not have an oxazole skeleton. The naphthalene compound may be a compound different from the vinylnaphthalene compound. The naphthalene compound may be a naphthalene compound that does not have an ethylenically unsaturated bond. The naphthalene compound may be a naphthalene compound that does not have an anthracene ring.

[0098] The number of carbon atoms in the alkoxy group of a naphthalene compound may be within the following ranges from the viewpoint of easily obtaining excellent resolution and adhesion. The number of carbon atoms in the alkoxy group may be 1 or more, or 2 or more. The number of carbon atoms in the alkoxy group may be 10 or less, 8 or less, 6 or less, 5 or less, 4 or less, 3 or less, or 2 or less. From these viewpoints, the number of carbon atoms in the alkoxy group may be between 1 and 10.

[0099] Naphthalene compounds may include compounds represented by the following general formula (e) from the viewpoint of easily obtaining excellent resolution and adhesion.

[0100] [ka] [In equation (e), R e1 and R e2 Each independently represents a halogen group, an alkyl group (e.g., an alkyl group having 1 to 8 carbon atoms), an aralkyl group, an alkoxy group, or an aryloxy group, R e3 and R e4 Each independently represents an alkyl group or a glycidyl group, where e1 is an integer from 0 to 2, and e2 is an integer from 0 to 4. When e1 is 2, there are multiple R e1 R may be identical to each other, or different to each other, and there may be multiple R when e2 is 2 or greater. e2 They may be identical to each other, or they may be different to each other.

[0101] In equation (e), R e1 , R e2 , R e3 and R e4 The alkyl group may be a C1-C9 alkyl group that may have an oxygen atom substituted on it. Examples of such alkyl groups include methyl group, ethyl group, n-propyl group, i-propyl group, n-butyl group, i-butyl group, n-pentyl group, n-hexyl group, n-heptyl group, n-octyl group, 2-ethylhexyl group, n-nonyl group, 2-hydroxyethyl group, 3-hydroxyethyl group, 2-hydroxypropyl group, 2-methoxyethoxy group, 2-ethoxyethoxy group, 2-phenoxyethoxy group, etc. e1 and R e2 Examples of halogen groups include fluoro groups, chloro groups, and bromo groups; examples of aralkyl groups include benzyl groups and phenethyl groups; examples of alkoxy groups include methoxy groups and ethoxy groups; and examples of aryloxy groups include phenoxy groups.

[0102] Naphthalene compounds include 1-methoxynaphthalene, 1-ethoxynaphthalene, 1-propoxynaphthalene, 1-butoxynaphthalene, 1,4-dimethoxynaphthalene, 1-ethoxy-4-methoxynaphthalene, 1,4-diethoxynaphthalene, 1,4-bis(n-propoxy)naphthalene, 1,4-bis(n-butoxy)naphthalene, 1,4-bis(i-butoxy)naphthalene, 1,4-bis(n-pentyloxy)naphthalene, 1,4-bis(i-pentyloxy)naphthalene, and 1,4-bis(n-hexyloxy)naphthalene. Examples include 1,4-bis(n-heptyloxy)naphthalene, 1,4-bis(n-octyloxy)naphthalene, 1,4-bis(2-ethylhexyloxy)naphthalene, 1,4-bis(n-nonyloxy)naphthalene, 1,4-dibenzyloxynaphthalene, 1,4-diphenethyloxynaphthalene, 1,4-diglycidyloxynaphthalene, 1,4-bis(2-methylglycidyloxy)naphthalene, 1-naphthol, 2-naphthol, 1-(2-hydroxyethoxy)naphthalene, and 2-(2-hydroxyethoxy)naphthalene.

[0103] The naphthalene compound may include a compound having an alkoxy group bonded to the naphthalene ring (for example, a compound having two alkoxy groups bonded to the naphthalene ring), a compound having an alkoxy group bonded to at least one selected from the group consisting of the 1st and 4th positions of the naphthalene ring, at least one selected from the group consisting of 1,4-dimethoxynaphthalene and 1,4-diethoxynaphthalene, and may also include 1,4-diethoxynaphthalene.

[0104] The content of component (E) may be within the following ranges based on the total amount of the photosensitive film or the total amount of the photosensitive resin composition (total amount of solids): The content of component (E) may be 0.01% by mass or more, 0.05% by mass or more, 0.1% by mass or more, 0.15% by mass or more, 0.19% by mass or more, 0.2% by mass or more, 0.4% by mass or more, 0.5% by mass or more, 0.8% by mass or more, 0.9% by mass or more, 1% by mass or more, 1.5% by mass or more, 2% by mass or more, or 2.3% by mass or more, from the viewpoint of obtaining excellent adhesion and sensitivity. The content of component (E) may be 10% by mass or less, 8% by mass or less, 5% by mass or less, 3% by mass or less, 2.5% by mass or less, 2.3% by mass or less, 2% by mass or less, 1.5% by mass or less, 1% by mass or less, 0.9% by mass or less, 0.8% by mass or less, 0.5% by mass or less, 0.4% by mass or less, or 0.2% by mass or less, from the viewpoint of easily obtaining excellent resolution and adhesion. From these viewpoints, the content of component (E) may be 0.01 to 10% by mass, or 0.1 to 5% by mass.

[0105] The content of component (E) may be within the following ranges relative to 100 parts by mass of the total amount of components (A) and (B). The content of component (E) may be 0.01 parts by mass or more, 0.05 parts by mass or more, 0.1 parts by mass or more, 0.15 parts by mass or more, 0.2 parts by mass or more, 0.3 parts by mass or more, 0.5 parts by mass or more, 0.8 parts by mass or more, 1 part by mass or more, 1.5 parts by mass or more, 2 parts by mass or more, 2.5 parts by mass or more, or 2.6 parts by mass or more, from the viewpoint of easily obtaining excellent adhesion and sensitivity. The content of component (E) may be 10 parts by mass or less, 5 parts by mass or less, 3 parts by mass or less, 2.6 parts by mass or less, 2.5 parts by mass or less, 2 parts by mass or less, 1.5 parts by mass or less, 1 part by mass or less, 0.8 parts by mass or less, 0.5 parts by mass or less, 0.3 parts by mass or less, or 0.2 parts by mass or less, from the viewpoint of easily obtaining excellent resolution and adhesion. From these perspectives, the content of component (E) may be 0.01 to 10 parts by mass, or 0.1 to 5 parts by mass.

[0106] The content of component (E) may be within the following ranges relative to 100 parts by mass of component (D): From the viewpoint of obtaining excellent adhesion and sensitivity, the content of component (E) may be 1 part by mass or more, 5 parts by mass or more, 10 parts by mass or more, 30 parts by mass or more, 40 parts by mass or more, 50 parts by mass or more, 70 parts by mass or more, 80 parts by mass or more, 90 parts by mass or more, 100 parts by mass or more, 150 parts by mass or more, 200 parts by mass or more, 300 parts by mass or more, or 400 parts by mass or more. From the viewpoint of obtaining excellent resolution and adhesion, the content of component (E) may be 1000 parts by mass or less, 800 parts by mass or less, 500 parts by mass or less, 400 parts by mass or less, 300 parts by mass or less, 200 parts by mass or less, 150 parts by mass or less, 100 parts by mass or less, 90 parts by mass or less, 80 parts by mass or less, 70 parts by mass or less, 50 parts by mass or less, or 40 parts by mass or less. From these perspectives, the content of component (E) may be 1 to 1000 parts by mass, or 10 to 500 parts by mass.

[0107] The photosensitive film and photosensitive resin composition according to this embodiment may contain a polymerization inhibitor as component (F) (excluding compounds corresponding to any of components (A) to (E)). Component (F) suppresses polymerization in unexposed areas during resist pattern formation and easily improves resolution. Examples of polymerization inhibitors include tert-butylcatechol (e.g., 4-tert-butylcatechol), hindered amines (e.g., 2,2,6,6-tetramethyl-4-hydroxypiperidine-1-oxyl), and 4-hydroxy-2,2,6,6-tetramethylpiperidine-N-oxyl.

[0108] The content of component (F) may be within the following ranges relative to 100 parts by mass of the total amount of components (A) and (B). From the viewpoint of easily obtaining excellent resolution and adhesion, the content of component (F) may be 0.001 parts by mass or more, 0.003 parts by mass or more, 0.005 parts by mass or more, 0.01 parts by mass or more, or 0.015 parts by mass or more. From the viewpoint of easily obtaining excellent resolution and adhesion, the content of component (F) may be 0.1 parts by mass or less, 0.05 parts by mass or less, 0.04 parts by mass or less, 0.03 parts by mass or less, or 0.02 parts by mass or less. From these viewpoints, the content of component (F) may be 0.001 to 0.1 parts by mass.

[0109] The photosensitive resin composition according to this embodiment may contain an organic solvent. Examples of organic solvents include methanol, ethanol, acetone, methyl ethyl ketone, methyl cellosolve, ethyl cellosolve, toluene, N,N-dimethylformamide, and propylene glycol monomethyl ether.

[0110] The photosensitive film and photosensitive resin composition according to this embodiment may contain other components (excluding compounds corresponding to any of components (A) to (E)) other than those described above. Examples of other components include hydrogen donors (bis[4-(dimethylamino)phenyl]methane, bis[4-(diethylamino)phenyl]methane, leucocrystal violet, N-phenylglycine, etc.), dyes (malachite green, etc.), sensitizers, tribromophenylsulfone, photochromicants, thermal color inhibitors, plasticizers (p-toluenesulfonamide, etc.), pigments, fillers, defoamers, flame retardants, stabilizers, adhesion promoters, leveling agents, peel accelerators, antioxidants, fragrances, imaging agents, thermal crosslinking agents, and the like.

[0111] In the photosensitive film and photosensitive resin composition according to this embodiment, the content of the thermal radical polymerization initiator may be 0.5% by mass or less, less than 0.5% by mass, 0.1% by mass or less, 0.01% by mass or less, or 0.001% by mass or less, based on the total amount of the photosensitive film or the total amount of the photosensitive resin composition (total amount of solids). The photosensitive film and photosensitive resin composition according to this embodiment do not need to contain a thermal radical polymerization initiator (the above-mentioned content may be substantially 0% by mass).

[0112] In the photosensitive film and photosensitive resin composition according to this embodiment, the content of at least one selected from the group consisting of vinyl polymers (e.g., vinyl polymers containing side chains having epoxy groups) and oxetane compounds (e.g., oxetane compounds having two or more oxetane rings which may have substituents) may be 20% by mass or less, less than 20% by mass, 10% by mass or less, 1% by mass or less, 0.1% by mass or less, 0.01% by mass or less, or 0.001% by mass or less, based on the total amount of the photosensitive film or the total amount of the photosensitive resin composition (total amount of solids). The photosensitive film and photosensitive resin composition according to this embodiment do not need to contain at least one selected from the group consisting of vinyl polymers (e.g., vinyl polymers containing side chains having epoxy groups) and oxetane compounds (e.g., oxetane compounds having two or more oxetane rings which may have substituents) (the above content may be substantially 0% by mass).

[0113] In the photosensitive film and photosensitive resin composition according to this embodiment, the content of copolymers having epoxy groups and carboxyl groups may be 20% by mass or less, less than 20% by mass, 10% by mass or less, 1% by mass or less, 0.1% by mass or less, or 0.01% by mass or less, based on the total amount of the photosensitive film or the total amount of the photosensitive resin composition (total amount of solids). The photosensitive film and photosensitive resin composition according to this embodiment do not need to contain copolymers having epoxy groups and carboxyl groups (the above-mentioned content may be substantially 0% by mass).

[0114] In the photosensitive film and photosensitive resin composition according to this embodiment, the content of aromatic iodonium salt may be 0.5% by mass or less, less than 0.5% by mass, 0.1% by mass or less, 0.01% by mass or less, or 0.001% by mass or less, based on the total amount of the photosensitive film or the total amount of the photosensitive resin composition (total amount of solids). The photosensitive film and photosensitive resin composition according to this embodiment do not need to contain aromatic iodonium salt (the above-mentioned content may be substantially 0% by mass).

[0115] In the photosensitive film and photosensitive resin composition according to this embodiment, the content of the resin having phenolic hydroxyl groups, or the content of the novolac resin having phenolic hydroxyl groups, may be 30% by mass or less, less than 30% by mass, 15% by mass or less, less than 15% by mass, 10% by mass or less, 1% by mass or less, 0.1% by mass or less, or 0.01% by mass or less, based on the total amount of the photosensitive film or the total amount of the photosensitive resin composition (total amount of solids). The photosensitive film and photosensitive resin composition according to this embodiment do not need to contain the resin having phenolic hydroxyl groups (the above-mentioned content may be substantially 0% by mass), and do not need to contain the novolac resin having phenolic hydroxyl groups (the above-mentioned content may be substantially 0% by mass).

[0116] In the photosensitive film and photosensitive resin composition according to this embodiment, the content of epoxy compounds having two or more oxirane rings, or the content of aliphatic or alicyclic epoxy compounds having two or more oxirane rings, may be 40 parts by mass or less, less than 40 parts by mass, 20 parts by mass or less, less than 20 parts by mass, 10 parts by mass or less, less than 10 parts by mass, 1 part by mass or less, 0.1 parts by mass or less, or 0.01 parts by mass or less, per 100 parts by mass of component (A). The photosensitive film and photosensitive resin composition according to this embodiment do not need to contain epoxy compounds having two or more oxirane rings (the above content may be substantially 0 parts by mass), and do not need to contain aliphatic or alicyclic epoxy compounds having two or more oxirane rings (the above content may be substantially 0 parts by mass).

[0117] The photosensitive film and photosensitive resin composition according to this embodiment do not need to contain polymerizable compounds having cyclic aliphatic groups (the content of such polymerizable compounds may be substantially 0% by mass based on the total amount of the photosensitive film or the total amount of the photosensitive resin composition (total amount of solids)).

[0118] In the photosensitive film and photosensitive resin composition according to this embodiment, the total amount of onium borate salt and onium gallate salt may be 0.1 parts by mass or less, less than 0.1 parts by mass, 0.01 parts by mass or less, or 0.001 parts by mass or less, per 100 parts by mass of component (A). The photosensitive film and photosensitive resin composition according to this embodiment do not need to contain onium borate salt and onium gallate salt (the total amount described above may be substantially 0 parts by mass).

[0119] In the photosensitive film and photosensitive resin composition according to this embodiment, the content of the polyfunctional epoxy resin may be 75% by mass or less, less than 75% by mass, 50% by mass or less, 10% by mass or less, 1% by mass or less, 0.1% by mass or less, or 0.01% by mass or less, based on the total amount of the photosensitive film or the total amount of the photosensitive resin composition (total amount of solids). The photosensitive film and photosensitive resin composition according to this embodiment do not need to contain the polyfunctional epoxy resin (the above-mentioned content may be substantially 0% by mass).

[0120] The photosensitive film and photosensitive resin composition according to this embodiment do not need to contain a polyimide having at least one selected from the group consisting of a carboxyl group, a phenolic hydroxyl group, a sulfonic acid group, and a thiol group (the polyimide content may be substantially 0% by mass based on the total amount of the photosensitive film or the total amount of the photosensitive resin composition (total amount of solids)).

[0121] In the photosensitive film and photosensitive resin composition according to this embodiment, the content of the compound having a mercapto group may be 0.001 parts by mass or less, less than 0.001 parts by mass, 0.0001 parts by mass or less, or 0.00001 parts by mass or less, based on 100 parts by mass of the total amount of component (A) and component (B). The photosensitive film and photosensitive resin composition according to this embodiment do not need to contain a compound having a mercapto group (the above-mentioned content may be substantially 0 parts by mass).

[0122] In the photosensitive film and photosensitive resin composition according to this embodiment, the content of bisphenol F type (meth)acrylic acid compound (a (meth)acrylic acid compound having a bisphenol F structure), or the content of bisphenol F type acrylic acid compound, may be 5% by mass or less, less than 5% by mass, 1% by mass or less, less than 1% by mass, 0.1% by mass or less, 0.01% by mass or less, or 0.001% by mass or less, based on the total mass of component (B). In the photosensitive film and photosensitive resin composition according to this embodiment, the content of bisphenol F type (meth)acrylic acid compound, or the content of bisphenol F type acrylic acid compound, may be 0.2% by mass or less, 0.15% by mass or less, less than 0.15% by mass, 0.1% by mass or less, or 0.01% by mass or less, based on the total amount of the photosensitive film or the total amount of the photosensitive resin composition (total amount of solids). The photosensitive film and photosensitive resin composition according to this embodiment do not need to contain bisphenol F-type (meth)acrylic acid compounds (the content of each of the above-mentioned compounds may be substantially 0% by mass), and do not need to contain bisphenol F-type acrylic acid compounds (the content of each of the above-mentioned compounds may be substantially 0% by mass).

[0123] In the photosensitive film and photosensitive resin composition according to this embodiment, the content (total solid content) of components other than component (A) and component (B) may be 15 parts by mass or more, 19 parts by mass or more, more than 19 parts by mass, 20 parts by mass or more, 21 parts by mass or more, 22 parts by mass or more, or 23 parts by mass or more, per 100 parts by mass of component (B).

[0124] The photosensitive film and photosensitive resin composition according to this embodiment do not need to contain polymers having nitrogen-containing groups (the content of polymers having nitrogen-containing groups may be substantially 0% by mass based on the total amount of the photosensitive film or the total amount of the photosensitive resin composition (total amount of solids)).

[0125] In the photosensitive film and photosensitive resin composition according to this embodiment, the content of the acridine compound (a compound having an acridine ring) may be 0.1% by mass or less, less than 0.1% by mass, 0.01% by mass or less, or 0.001% by mass or less, based on the total amount of the photosensitive film or the total amount of the photosensitive resin composition (total amount of solids). The photosensitive film and photosensitive resin composition according to this embodiment do not need to contain an acridine compound (the above-mentioned content may be substantially 0% by mass).

[0126] <Photosensitive element> The photosensitive element according to this embodiment comprises a support and a photosensitive resin layer disposed on the support, wherein the photosensitive resin layer is a photosensitive film according to this embodiment. The photosensitive element according to this embodiment may include a protective layer disposed on the photosensitive resin layer. The photosensitive element according to this embodiment may include a cushion layer, an adhesive layer, a light-absorbing layer, a gas barrier layer, etc. The photosensitive element may be in the form of a sheet, or it may be in the form of a photosensitive element roll wound in a roll shape on a core.

[0127] Figure 1 is a schematic cross-sectional view showing an example of a photosensitive element. As shown in Figure 1, the photosensitive element 1 comprises a support (support film) 2, a photosensitive resin layer (photosensitive film) 3 disposed on the support 2, and a protective layer (protective film) 4 disposed on the photosensitive resin layer 3. The photosensitive resin layer 3 is made of a photosensitive resin composition according to this embodiment.

[0128] The photosensitive element 1 can be obtained, for example, by the following procedure. First, a photosensitive resin layer 3 is formed on the support 2. The photosensitive resin layer 3 can be formed, for example, by applying a photosensitive resin composition containing an organic solvent and drying the resulting coating layer. Next, a protective layer 4 is placed on the photosensitive resin layer 3.

[0129] The support and protective layer may each be a polymer film having heat resistance and solvent resistance, and may be polyester film (polyethylene terephthalate film, etc.), polyolefin film (polyethylene film, polypropylene film, etc.), hydrocarbon polymer (excluding polyolefin film), etc. The type of film constituting the protective layer and the type of film constituting the support may be the same or different.

[0130] The thickness of the support may be 1 μm or more, 5 μm or more, 10 μm or more, or 15 μm or more, from the viewpoint of easily suppressing damage to the support when peeling the support from the photosensitive resin layer. The thickness of the support may be 100 μm or less, 50 μm or less, 30 μm or less, or 20 μm or less, from the viewpoint of easily exposing the support when exposure is performed through the support.

[0131] The thickness of the protective layer may be 1 μm or more, 5 μm or more, 10 μm or more, or 15 μm or more, from the viewpoint of easily suppressing damage to the protective layer when laminating the photosensitive resin layer and support onto the substrate while peeling off the protective layer. The thickness of the protective layer may be 100 μm or less, 50 μm or less, or 30 μm or less, from the viewpoint of easily improving productivity.

[0132] <Method for manufacturing laminates> The method for manufacturing a laminate according to this embodiment comprises: a photosensitive resin layer placement step of arranging a photosensitive resin layer on a substrate (e.g., a substrate) using a photosensitive element or photosensitive resin composition according to this embodiment; an exposure step of photocuring (exposing) a part of the photosensitive resin layer; a developing step of removing at least a part of the uncured (unexposed) part of the photosensitive resin layer to form a cured product pattern; and a metal layer formation step of forming a metal layer on at least a part of the portion of the substrate where the cured product pattern has not been formed. The laminate according to this embodiment is obtained by the method for manufacturing a laminate according to this embodiment and may be a wiring board (e.g., a printed circuit board). The laminate according to this embodiment may also comprise a substrate, a cured product pattern (cured product according to this embodiment) arranged on the substrate, and a metal layer arranged on at least a part of the portion of the substrate where the cured product pattern has not been formed.

[0133] In the photosensitive resin layer placement step, a photosensitive resin layer made of the photosensitive resin composition according to this embodiment is placed on the substrate. For example, the photosensitive resin layer may be formed by removing the protective layer from the photosensitive element and then pressing the photosensitive resin layer of the photosensitive element onto the substrate while heating it, or it may be formed by coating and drying the photosensitive resin composition on the substrate.

[0134] In the exposure process, an active light may be irradiated onto the photosensitive resin layer with a mask placed on it to expose and photocure the areas of the photosensitive resin layer other than the area where the mask is placed. Alternatively, without using a mask, an active light may be irradiated in a desired pattern using a direct writing exposure method such as LDI exposure or DLP exposure to expose and photocure a portion of the photosensitive resin layer. As a light source for the active light, an ultraviolet light source or a visible light source may be used, and examples include carbon arc lamps, mercury vapor arc lamps, high-pressure mercury lamps, xenon lamps, gas lasers (argon lasers, etc.), solid-state lasers (YAG lasers, etc.), and semiconductor lasers.

[0135] The development method in the development process may be, for example, wet development or dry development. Wet development can be performed using a developer corresponding to the photosensitive resin composition, for example, by methods such as dipping, paddle, spraying, brushing, slapping, scrubbing, or agitation immersion. The developer is appropriately selected according to the composition of the photosensitive resin composition and may be an alkaline developer or an organic solvent developer.

[0136] The alkaline developer may be an aqueous solution containing a base such as: alkali hydroxides such as lithium, sodium, or potassium hydroxide; alkali carbonates such as lithium, sodium, potassium, or ammonium carbonates or bicarbonates; alkali metal phosphates such as potassium phosphate and sodium phosphate; alkali metal pyrophosphates such as sodium pyrophosphate and potassium pyrophosphate; borax; sodium metasilicate; tetramethylammonium hydroxide; ethanolamine; ethylenediamine; diethylenetriamine; 2-amino-2-hydroxymethyl-1,3-propanediol; 1,3-diamino-2-propanol; or morpholine.

[0137] The organic solvent developer may contain organic solvents such as 1,1,1-trichloroethane, N-methylpyrrolidone, N,N-dimethylformamide, cyclohexanone, methyl isobutyl ketone, and γ-butyrolactone.

[0138] The metal layer in the metal layer formation process may be, for example, a metallic copper layer. The metal layer can be formed, for example, by plating. The plating process may be either electrolytic plating or electroless plating, or both.

[0139] The manufacturing method of the laminate according to this embodiment involves heating at 60 to 250°C or 0.2 to 10 J / cm² after the development step. 2 The process may include a step of further curing the resist pattern by exposure.

[0140] The manufacturing method of the laminate according to this embodiment may include a step of removing the cured material pattern after the metal layer formation step. The cured material pattern can be removed, for example, by developing using a strongly alkaline aqueous solution in an immersion method, spray method, or the like.

[0141] Figure 2 is a schematic diagram showing an example of a method for manufacturing a laminate (a method for manufacturing a wiring board). In this example of a method for manufacturing a laminate, first, a substrate (for example, a circuit-forming substrate) 10 is prepared, which comprises an insulating layer 10a and a conductor layer 10b disposed on the insulating layer 10a, as shown in Figure 2(a). The conductor layer 10b may be, for example, a metallic copper layer.

[0142] Next, as shown in Figure 2(b), a photosensitive resin layer 12 is placed on the conductive layer 10b of the substrate 10 (photosensitive resin layer placement step). In the photosensitive resin layer placement step, the photosensitive resin layer 12 is placed on the conductive layer 10b of the substrate 10 using a photosensitive element or photosensitive resin composition according to this embodiment.

[0143] Next, as shown in Figure 2(c), with the mask 14 placed on the photosensitive resin layer 12, the active light L is irradiated to expose and photo-cure the areas of the photosensitive resin layer 12 other than the area where the mask 14 is placed.

[0144] Next, after removing the mask 14, as shown in Figure 2(d), the areas of the photosensitive resin layer other than the photocured portion (uncured portion) are removed from the substrate 10 by development to form a resist pattern 12a consisting of the photocured portion (cured product of the photosensitive resin layer).

[0145] Next, as shown in Figure 2(e), a wiring layer (metal layer) 16 is formed in the portion of the conductive layer 10b of the substrate 10 where the resist pattern 12a is not formed. The wiring layer 16 may be made of the same material as the conductive layer 10b, or it may be made of a different material.

[0146] Next, as shown in Figure 2(f), the resist pattern 12a is removed, and the conductive layer 10b located at the position corresponding to the resist pattern 12a is removed to form the conductive layer 10c. This results in a wiring board 18 having a conductive layer 10c and a wiring layer 16 arranged on the insulating layer 10a. The conductive layer 10b can be removed by etching. The etching solution is appropriately selected according to the type of conductive layer 10b, and may be, for example, a cupric chloride solution, a ferric chloride solution, an alkaline etching solution, a hydrogen peroxide etching solution, etc. [Examples]

[0147] The present disclosure will be further described below with reference to examples, but the present disclosure is not limited to these examples.

[0148] <Synthesis of binder polymers> Solution (a) was prepared by mixing 27 parts by mass of methacrylic acid, 3 parts by mass of 2-hydroxyethyl methacrylate, 20 parts by mass of benzyl methacrylate, 50 parts by mass of styrene, and 0.9 parts by mass of azobisisobutyronitrile. Solution (b) was prepared by dissolving 0.5 parts by mass of azobisisobutyronitrile in 50 parts by mass of a mixture of 30 parts by mass of methyl cellosolve and 20 parts by mass of toluene. 500 g of the mixture of 30 parts by mass of methyl cellosolve and 20 parts by mass of toluene was placed in a flask equipped with a stirrer, reflux condenser, thermometer, dropping funnel, and nitrogen gas inlet tube. The flask was then stirred while blowing nitrogen gas into it, and the temperature was raised to 80°C. Solution (a) was added dropwise to the flask over 4 hours at a constant dropping rate, and then the solution in the flask was stirred at 80°C for 2 hours. Next, solution (b) was added dropwise to the flask at a constant dropping rate over 10 minutes, and the solution in the flask was stirred at 80°C for 3 hours. Furthermore, the temperature of the solution in the flask was raised to 90°C over 30 minutes, and the temperature was maintained at 90°C for 2 hours. After that, stirring was stopped and the solution was cooled to room temperature (25°C) to obtain the binder polymer solution. The non-volatile content (solids) of the binder polymer solution was 49% by mass.

[0149] The acid value of the binder polymer was 176 mg KOH / g. The acid value was measured using the following procedure: First, the binder polymer was weighed into an Erlenmeyer flask. Next, a mixed solvent (mass ratio: toluene / methanol = 70 / 30) was added to dissolve the binder polymer, and then phenolphthalein solution was added as an indicator. The acid value was then obtained by titration with a 0.1 mol / L (N / 10) potassium hydroxide solution (alcohol solution).

[0150] The weight-average molecular weight (Mw) of the binder polymer was 35,000, and the number-average molecular weight (Mn) was 16,000. The weight-average and number-average molecular weights were measured by gel permeation chromatography (GPC) under the following conditions and derived by conversion using a calibration curve for standard polystyrene.

[0151] (GPC conditions) Pump: Hitachi L-6000 model (manufactured by Hitachi, Ltd., product name) Columns: A total of 3 (manufactured by Showa Denko Materials Co., Ltd., product name) Gelpack GL-R440 Gelpack GL-R450 Gelpack GL-R400M Eluent: Tetrahydrofuran Measurement temperature: 40℃ Injection volume: 200μL Flow rate: 2.05mL / min Detector: Hitachi L-3300 RI (manufactured by Hitachi, Ltd., product name)

[0152] <Preparation of photosensitive resin composition> (Example 1) The above-mentioned binder polymer solution (binder polymer (non-volatile content): 56 parts by mass), 35 parts by mass of propylene glycol monomethyl ether of 2,2-bis(4-(methacryloxypentaethoxy)phenyl)propane (EO average 10 mol adduct, molecular weight: 804) (manufactured by Showa Denko Materials Co., Ltd., product name: FA-321M), and 2,2-bis(4-(methacryloxypolyethoxy)phenyl)propane (EO group: 2.6 (total value) 5 parts by mass of (PO)(EO)(PO) modified dimethacrylate (EO average 6 mol and PO average 12 mol adduct (total value), molecular weight: 1114, Showa Denko Materials K.K., product name: FA-024M) and a photopolymerization initiator (2,2'-bis(o-chlorophenyl)-4,4',5,5'-tetraphenyl-1,2'-biimidazole, BCIM, Ham 6 parts by mass of pford (manufactured by Kawasaki Chemical Industries, Ltd.), 0.650 parts by mass of sensitizer A1 (9,10-dibutoxyanthracene, DBA, manufactured by Kawasaki Chemical Industries, Ltd.), 0.2 parts by mass of sensitizing agent A (1,4-diethoxynaphthalene, manufactured by Kawasaki Chemical Industries, Ltd., trade name: UVS-2171), 0.015 parts by mass of polymerization inhibitor (4-tert-butylcatechol, manufactured by DIC Corporation, trade name: DIC-TBC), and colorant (leucocrystal violet, LCV, manufactured by Yamada Chemical Industries, Ltd.) A photosensitive resin composition was prepared by mixing 0.5 parts by mass of (manufactured by Kogyo Co., Ltd.), 0.02 parts by mass of dye (malachite green, MKG, manufactured by Osaka Organic Chemical Industry Co., Ltd.), 0.5 parts by mass of additive (a mixture of carboxybenzotriazole, 5-amino-1H-tetrazole, and methoxypropanol; manufactured by Sanwa Chemical Co., Ltd., trade name: SF-808H), 16 parts by mass of toluene, 6 parts by mass of methanol, and 10 parts by mass of acetone.

[0153] (Examples 2-4) A photosensitive resin composition was prepared in the same manner as in Example 1, except that the amount of sensitizer A used was changed to the amount shown in Table 1.

[0154] (Example 5) A photosensitive resin composition was prepared in the same manner as in Example 1, except that sensitizer A was replaced with sensitizer B (1,4-dimethoxynaphthalene, Fujifilm Wako Pure Chemical Industries, Ltd.).

[0155] (Example 6) A photosensitive resin composition was prepared in the same manner as in Example 1, except that sensitizer A1 was replaced with sensitizer A2 (9,10-dipropoxyanthracene).

[0156] (Example 7) A photosensitive resin composition was prepared in the same manner as in Example 1, except that 0.650 parts by mass of sensitizer A1 was replaced with 0.234 parts by mass of sensitizer B1 (1-phenyl-3-(4-methoxystyryl)-5-(4-methoxyphenyl)-pyrazoline, manufactured by Nippon Chemical Industries, Ltd., trade name: PZ-501D).

[0157] (Example 8) A photosensitive resin composition was prepared in the same manner as in Example 7, except that sensitizer A was replaced with sensitizer B.

[0158] (Example 9) A photosensitive resin composition was prepared in the same manner as in Example 1, except that 0.650 parts by mass of sensitizer A1 was replaced with 0.400 parts by mass of sensitizer B2 (4-[[3-(4-chlorophenyl)-4,5-dihydro-1H-pyrazole]-1-yl]benzenesulfonamide, manufactured by Tanatex Chemicals Japan, trade name: Blankophor MAN 01).

[0159] (Example 10) A photosensitive resin composition was prepared in the same manner as in Example 1, except that sensitizer A1 was replaced with sensitizer C (4'-(2-cyanostyryl)-3-stilbene carbonitride, manufactured by BOC Sciences, trade name: Fluorescent Brightener ER-III).

[0160] (Comparative Example 1) A photosensitive resin composition was prepared in the same manner as in Example 1, except that the sensitizing agent A was not used.

[0161] (Comparative Example 2) A photosensitive resin composition was prepared in the same manner as in Example 7, except that the sensitizing agent A was not used.

[0162] (Comparative Example 3) A photosensitive resin composition was prepared in the same manner as in Example 9, except that the sensitizing agent A was not used.

[0163] (Comparative Example 4) A photosensitive resin composition was prepared in the same manner as in Example 10, except that the sensitizing agent A was not used.

[0164] <Fabrication of photosensitive elements> A polyethylene terephthalate film with a thickness of 16 μm (manufactured by Toray Industries, Inc., product name "FB-40") was prepared as a support. After applying the above-mentioned photosensitive resin composition to the support so as to ensure uniform thickness, a photosensitive resin layer (photosensitive film; thickness after drying: 19 μm) was formed by sequentially drying it in a hot air convection dryer at 70°C and 110°C. By laminating a polyethylene film (manufactured by Tamapoly Co., Ltd., product name "NF-15") as a protective layer to this photosensitive resin layer, a photosensitive element comprising the support, photosensitive resin layer, and protective layer in that order was obtained.

[0165] <Rating> (Evaluation of absorbance) The absorbance (Abs) at a wavelength of 405 nm in the photosensitive resin layer of the above-mentioned photosensitive element was measured using a UV-Vis spectrophotometer (Hitachi High-Technologies Corporation, product name: U-3310 Spectrophotometer). Polyethylene terephthalate film and polyethylene film were used as references. The results are shown in Table 1.

[0166] (Fabrication of laminates) A copper-clad laminate (substrate, manufactured by Showa Denko Materials Co., Ltd., product name: MCL-E-67) with copper foil (thickness: 18 μm) arranged on both sides of a glass epoxy material was pickled and washed with water, then dried with an airflow. Next, the copper-clad laminate was heated to 80°C, and while peeling off the protective layer, the above-mentioned photosensitive element was laminated so that the photosensitive resin layer was in contact with the copper surface, thereby obtaining a laminate comprising the copper-clad laminate, the photosensitive resin layer, and the support in that order. Lamination was performed using a 110°C heat roll with a pressing pressure of 0.4 MPa and a roll speed of 1.5 m / min.

[0167] (Sensitivity evaluation) After placing a 41-step tablet (manufactured by Showa Denko Materials Co., Ltd.) on the laminated support described above, the photosensitive resin layer was exposed through the support using a direct writing exposure machine (manufactured by Via Mechanics Co., Ltd., product name: DE-1UH) with a blue-violet laser diode of wavelength 405 nm as the light source, at an exposure dose (irradiation energy amount) such that 15 steps remained after development of the 41-step tablet. The exposure dose at this time (unit: mJ / cm²) 2 Sensitivity (light sensitivity) was evaluated using the following method. The results are shown in Table 1. A lower exposure amount indicates better sensitivity.

[0168] (Evaluation of resolution) After placing a 41-step tablet (manufactured by Showa Denko Materials K.K.) on the laminated support described above, a direct-writing exposure machine (manufactured by Via Mechanics Co., Ltd., product name: DE-1UH) using a blue-violet laser diode with a wavelength of 405 nm as the light source was used to expose (write) the photosensitive resin layer through the support without offset, using a line width (L) / space width (S) (hereinafter referred to as "L / S") of 3x / x (x=1~20, unit: μm, 1 μm interval). The exposure amount (irradiation energy amount) was such that 15 steps remained after development of the 41-step tablet. Within 3 minutes after exposure, post-exposure baking (PEB) was performed using a heated oven at 80°C for 30 seconds.

[0169] After exposure, the support was peeled from the laminate to expose the photosensitive resin layer, and the unexposed areas were removed by spraying a 1% by mass sodium carbonate aqueous solution at 30°C for twice the minimum development time. After development, the resolution was evaluated by the minimum space width (in μm) in the resist pattern where the space areas (unexposed areas) were completely removed without residue, and the line areas (exposed areas) were formed without meandering or missing lines. The results are shown in Table 1. A smaller value indicates better resolution.

[0170] The minimum development time mentioned above was evaluated in advance using the following procedure. First, the laminate described above was cut into a square shape (5 cm × 5 cm), and then the support was peeled off to obtain a test specimen. Next, the unexposed photosensitive resin layer on the test specimen was spray-developed at a pressure of 0.15 MPa using a 1 mass% sodium carbonate aqueous solution at 30°C, and the shortest time at which the removal of the unexposed photosensitive resin layer could be visually confirmed was obtained as the minimum development time (MD). A full-cone type nozzle was used. The distance between the test specimen and the nozzle tip was 6 cm, and the specimen was positioned so that its center coincided with the center of the nozzle.

[0171] (Evaluation of adhesion) After placing a 41-step tablet (manufactured by Showa Denko Materials K.K.) on the aforementioned laminated support, exposure (writing) was performed on the photosensitive resin layer through the support without offset, using a direct writing exposure machine (manufactured by Via Mechanics Co., Ltd., product name: DE-1UH) with a blue-violet laser diode of wavelength 405 nm as the light source, with an exposure amount (irradiation energy amount) such that 15 steps remained after development of the 41-step tablet. Within 3 minutes after exposure, post-exposure baking (PEB) was performed using a heated oven at 80°C for 30 seconds.

[0172] After exposure, the support was peeled from the laminate to expose the photosensitive resin layer, and the unexposed areas were removed by spraying a 1% by mass sodium carbonate aqueous solution at 30°C for twice the minimum development time. After development, adhesion was evaluated by the minimum line width (in μm) of the resist pattern formed where the empty areas (unexposed areas) were completely removed and the line areas (exposed areas) were formed without meandering or chipping. The results are shown in Table 1. A smaller value indicates better adhesion.

[0173] [Table 1] [Explanation of Symbols]

[0174] 1...Photosensitive element, 2...Support, 3,12...Photosensitive resin layer, 4...Protective layer, 10...Substrate, 10a...Insulating layer, 10b,10c...Conducting layer, 12a...Resist pattern, 14...Mask, 16...Wiring layer, 18...Wiring substrate, L...Activating light.

Claims

1. (A) Binder polymer and (B) Photopolymerizable compounds, (C) Photopolymerization initiator and (D) Anthracene compounds and (E) Contains a naphthalene compound, A vinyl polymer containing side chains having epoxy groups, It does not contain copolymers having epoxy groups and carboxyl groups. The aforementioned component (A) is an acrylic resin having (meth)acrylic acid as a monomer unit, The above component (B) is a compound having a (meth)acryloyl group, A photosensitive film wherein component (C) is at least one selected from the group consisting of hexaarylbiimidazole compounds, aromatic ketones, quinone compounds, benzoin ether compounds, benzoin compounds, benzyl derivatives, bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide, bis(2,6-dimethylbenzoyl)-2,4,4-trimethyl-pentylphosphine oxide, and (2,4,6-trimethylbenzoyl)ethoxyphenylphosphine oxide.

2. The photosensitive film according to claim 1, wherein the content of an anthracene compound having unsubstituted alkoxy groups bonded to the 9th and 10th positions of an anthracene ring is 50 to 100% by mass, based on the total mass of component (D).

3. The photosensitive film according to claim 2, wherein component (D) does not contain an anthracene compound other than an anthracene compound having an unsubstituted alkoxy group bonded to the 9th and 10th positions of the anthracene ring.

4. (A) Binder polymer and (B) Photopolymerizable compounds, (C) Photopolymerization initiator and (D) At least one selected from the group consisting of pyrazoline compounds and distylylbenzene compounds, (E) Contains a naphthalene compound, The aforementioned component (A) is an acrylic resin having (meth)acrylic acid as a monomer unit, The above component (B) is a compound having a (meth)acryloyl group, A photosensitive film wherein component (C) is at least one selected from the group consisting of hexaarylbiimidazole compounds, aromatic ketones, quinone compounds, benzoin ether compounds, benzoin compounds, benzyl derivatives, bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide, bis(2,6-dimethylbenzoyl)-2,4,4-trimethyl-pentylphosphine oxide, and (2,4,6-trimethylbenzoyl)ethoxyphenylphosphine oxide.

5. The photosensitive film according to claim 4, wherein the component (D) comprises a compound having two or more aryl groups bonded to a pyrazoline ring.

6. The photosensitive film according to claim 4 or 5, wherein component (D) comprises a dicyanodistyrylbenzene compound.

7. The photosensitive film according to any one of claims 1 to 6, wherein the component (A) comprises an aryl (meth)acrylate and a styrene compound as monomer units.

8. The photosensitive film according to any one of claims 1 to 7, wherein the content of monomer units of the styrene compound in component (A) is 40% by mass or more based on the total amount of monomer units constituting component (A).

9. The photosensitive film according to any one of claims 1 to 8, wherein the weight-average molecular weight of component (A) is 20,000 to 50,000.

10. The photosensitive film according to any one of claims 1 to 9, wherein component (B) contains a bisphenol A type (meth)acrylic acid compound.

11. The photosensitive film according to any one of claims 1 to 10, wherein the component (B) comprises a (meth)acrylic acid compound having a polyoxyalkylene group.

12. The photosensitive film according to any one of claims 1 to 11, wherein the content of component (B) is 30 to 60 parts by mass per 100 parts by mass of the total amount of component (A) and component (B).

13. The photosensitive film according to any one of claims 1 to 12, wherein the content of component (D) is 0.1 to 1 part by mass per 100 parts by mass of the total amount of component (A) and component (B).

14. The photosensitive film according to any one of claims 1 to 13, wherein the component (E) comprises a compound having two alkoxy groups bonded to a naphthalene ring.

15. The photosensitive film according to any one of claims 1 to 14, wherein the content of component (E) is 0.1 to 5 parts by mass per 100 parts by mass of the total amount of component (A) and component (B).

16. The photosensitive film according to any one of claims 1 to 15, wherein the content of component (E) is 10 to 500 parts by mass per 100 parts by mass of component (D).

17. It comprises a support and a photosensitive resin layer disposed on the support, A photosensitive element wherein the photosensitive resin layer is a photosensitive film according to any one of claims 1 to 16.

18. A step of placing a photosensitive resin layer on a substrate using a photosensitive film according to any one of claims 1 to 16, A step of photocuring a portion of the photosensitive resin layer, A step of removing at least a portion of the uncured portion of the photosensitive resin layer to form a cured product pattern, A method for manufacturing a laminate, comprising the step of forming a metal layer on at least a portion of the portion of the substrate on which the cured material pattern is not formed.

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