Resin molding system and method for manufacturing resin molded products

Abstract

To provide a resin molding system capable of conducting positioning of a substrate to a mold with high accuracy and a manufacturing method of a resin molding.SOLUTION: A resin molding system includes: a mold C having a positioning part 37a for conducting positioning of a molding object Sa having a positioning hole 49a and where the molding object Sa is to be mounted in a state that the positioning part 37a is passing through the positioning hole 49a; and a transport device having an aligning mechanism 16 for conducting positioning to the positioning part 37a of the molding object Sa by bringing the positioning hole 49a into contact with the positioning part 37a.SELECTED DRAWING: Figure 7

Description

Technical Field

[0001] The present invention relates to a resin molding system and a method for manufacturing a resin molded product.

Background Art

[0002] A substrate on which a semiconductor chip or the like is fixed is generally used as an electronic component by resin encapsulation. Conventionally, a resin molding system provided with a mold for resin encapsulating a substrate or the like is known (for example, see Patent Document 1).

[0003] Patent Document 1 discloses a resin molding system (a semiconductor device in Patent Document 1) having a mold including an upper mold and a lower mold. In the resin molding system of Patent Document 1, a configuration for positioning a substrate with respect to the lower mold is described. The substrate includes a main positioning hole (a hole portion in Patent Document 1) having a circular opening shape serving as a reference point at the central portion in its longitudinal direction, and two sub-positioning holes having an elongated opening shape formed on both sides of the main positioning hole in the longitudinal direction. The lower mold has three positioning portions (pins in Patent Document 1) having a circular planar outer shape corresponding to the three positioning holes of the substrate. Then, the substrate is positioned with respect to the lower mold by passing the three positioning portions corresponding to the three positioning holes. In particular, the substrate is positioned by the main positioning hole and the corresponding positioning portion.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] In the resin molding system described in Patent Document 1, the inner diameter of the main positioning hole is made slightly larger than the outer diameter of the corresponding positioning part in order to facilitate the placement of the substrate on the lower mold. Furthermore, the length of the elongated opening of the secondary positioning hole, which runs along the shorter side of the substrate, is greater than the inner diameter of the main positioning hole. As a result, even when the substrate is placed on the lower mold, that is, when the positioning part is passed through the main positioning hole, the substrate can move slightly in all directions relative to the lower mold, and depending on the type of semiconductor chip, the required positioning accuracy may not be obtained.

[0006] Therefore, there is a need for a resin molding system and a method for manufacturing resin molded products that can accurately position the substrate relative to the mold. [Means for solving the problem]

[0007] One embodiment of the resin molding system according to the present invention comprises a molding die on which the molding object is placed, with the positioning unit having a positioning hole for positioning the molding object, and the positioning unit passing through the positioning hole; and a conveying device having a grabbing mechanism for positioning the molding object relative to the positioning unit by bringing the positioning hole into contact with the positioning unit.

[0008] One embodiment of the method for manufacturing a resin molded product according to the present invention is a method for manufacturing a resin molded product using the resin molding system described above, comprising: a supply step of placing the object to be molded on the mold so that the positioning portion passes through the positioning hole, then using the aligning mechanism to bring the positioning hole into contact with the positioning portion to position the object to be molded with respect to the positioning portion and supplying resin material; a mold clamping step of clamping the mold with a mold clamping mechanism; and a molding step of performing resin molding of the object to be molded. [Effects of the Invention]

[0009] According to embodiments of the present invention, it is possible to provide a resin molding system and a method for manufacturing resin molded products that can accurately position a substrate relative to a mold. [Brief explanation of the drawing]

[0010] [Figure 1] This is a schematic plan view illustrating a resin molding system. [Figure 2] This is a schematic front view of the molding die. [Figure 3] This is a schematic front view of the loader. [Figure 4] This is a cross-sectional view showing the movement of the loader when the substrate before molding is placed on the lower mold. [Figure 5] This is a cross-sectional view showing the movement of the loader when the substrate before molding is placed on the lower mold. [Figure 6] This is a cross-sectional view showing the movement of the loader when the substrate before molding is placed on the lower mold. [Figure 7] This is a schematic diagram illustrating the movement of the alignment mechanism when positioning the substrate relative to the lower mold before molding. [Modes for carrying out the invention]

[0011] The following describes embodiments of the resin molding system and resin molded product manufacturing method according to the present invention with reference to the drawings. However, the present invention is not limited to the following embodiments, and various modifications are possible without departing from the spirit of the invention.

[0012] A substrate (molded object) on which semiconductor chips and the like are fixed is used as an electronic component by resin encapsulation. Techniques for resin encapsulation of molded objects include the transfer method. One transfer method involves supplying a release film to the upper mold of a molding die, placing the molded object on the lower mold, supplying a resin tablet made of solidified powdered resin to the pot of the molding die, heating and melting it, and then supplying the molten resin to the cavity to resin-molde the molded object.

[0013] Resin tablets are formed from solid resin created by compressing granular resin, and melt upon heating to become liquid molten resin. Resin tablets may be made of either thermoplastic or thermosetting resin. Thermosetting resins decrease in viscosity when heated, and further heating causes polymerization and hardening to become cured resins. As explained below, it is desirable to use thermosetting resin when resin molding and sealing a pre-molded substrate on which semiconductor chips or the like are fixed.

[0014] [Overall structure] The following description will focus on a transfer-type resin molding system 30 as an example. Figure 1 shows a schematic plan view of the resin molding system 30 in this embodiment. The resin molding system 30 comprises a storage module 2, a molding module 3, a supply module 4, a control unit 6, a loader 10 (an example of a transport device), and an unloader 42. The molding module 3 is the part that resin-encapsulates the object to be molded and has a mold C that holds a pre-molding substrate Sa (an example of an object to be molded). The mold C has an upper mold UM and a lower mold LM. The resin molding system 30 in this embodiment is a device for resin-molding a pre-molding substrate Sa on which a semiconductor chip is fixed.

[0015] The supply module 4 is for supplying a pre-molded substrate Sa and a resin tablet T (an example of a resin material) to the molding module 3, and includes a substrate supply mechanism 43 and a resin supply mechanism 45. The substrate supply mechanism 43 stocks the pre-molded substrate Sa and arranges the pre-molded substrate Sa in a state suitable for transport. Multiple semiconductor chips are fixed to the pre-molded substrate Sa, aligned in the vertical and / or horizontal directions. The resin supply mechanism 45 stocks the resin tablet T and arranges the resin tablet T in a state suitable for transport. Note that the pre-molded substrate Sa may have only one semiconductor chip fixed to it.

[0016] The loader 10 waits within the supply module 4. The loader 10 receives the pre-formed substrate Sa from the substrate supply mechanism 43 within the supply module 4, and also receives the resin tablet T from the resin supply mechanism 45, and moves from the supply module 4 to the molding module 3 along a rail (not shown) disposed on the back side (the upper side in FIG. 1) from the supply module 4 to the molding module 3. Then, the loader 10 delivers the pre-formed substrate Sa and the resin tablet T to the lower mold LM of the molding module 3. After that, the loader 10 moves back along the rail to the supply module 4 again.

[0017] The molding module 3 uses the molding die C to resin-seal the pre-formed substrate Sa to form a molded substrate Sb (an example of a resin molded product). In the present embodiment, one molding module 3 is provided, but two or more may be provided. In the case of two or more, each molding module 3 can be independently attached or detached.

[0018] The housing module 2 has a substrate housing portion 46. The unloader 42 waits within the housing module 2, moves to the molding module 3 along a rail (not shown) disposed on the back side (the upper side in FIG. 1) from the housing module 2 to the molding module 3, takes out the molded substrate Sb from the molding module 3, and then moves back along the rail to the housing module 2 again to house the molded substrate Sb in the substrate housing portion 46. In the molded substrate Sb, the semiconductor chip is sealed with a cured resin in which the molten resin Ta (an example of a resin material) has solidified.

[0019] The control unit 6 includes a processor such as a CPU (Central Processing Unit) and a storage device such as a RAM (Random Access Memory). The control unit 6 controls the operation of the resin molding system 30 by executing a control program stored in the storage device with the processor. The operation of the resin molding system 30 described below is performed based on the operation command of the control unit 6 unless otherwise specified. In the following description, the operation command of the control unit 6 is omitted in principle, and the operation command of the control unit 6 will be described as necessary.

[0020] Hereinafter, the resin molding system 30 of the molding module 3 will be described in detail.

[0021] As shown in FIG. 2, the molding module 3 includes a lower mold LM of a mold C provided with a transfer mechanism 72, an upper mold UM provided opposite to the lower mold LM and having an upper mold cavity MCa into which molten resin Ta is injected, and a clamping mechanism 5 for clamping the lower mold LM and the upper mold UM. The lower mold LM is provided on a movable platen 35 that moves up and down by the clamping mechanism 5 via a lower mold holder 34. The upper mold UM is provided on an upper fixed plate (not shown) via an upper platen 32. The clamping mechanism 5 can use, for example, a combination of a servo motor and a ball screw mechanism, or a combination of an air cylinder or a hydraulic cylinder and a rod.

[0022] In the mold C of the present embodiment, pre-formed substrates Sa are placed one by one on both sides of the pot block 71 of the lower mold LM, and two pre-formed substrates Sa are resin-molded by a single resin molding operation. However, it is not particularly limited to this configuration, and a configuration in which one pre-formed substrate Sa is resin-molded by a single resin molding operation may also be used. The operation of the clamping mechanism 5 is controlled by the control unit 6. The pre-formed substrate Sa is transported between the upper mold UM and the lower mold LM by the loader 10 and then placed on the lower mold LM. A release film F is disposed on the upper mold UM in which the upper mold cavity MCa is formed. As the material of the release film F, a resin material having characteristics such as heat resistance, release property, flexibility, and stretchability is used. For example, PTFE (polytetrafluoroethylene), ETFE (ethylene / tetrafluoroethylene copolymer), PET (polyethylene terephthalate), FEP (tetrafluoroethylene / hexafluoropropylene copolymer), polypropylene, polystyrene, polyvinylidene chloride, etc. are used.

[0023] The resin injection mechanism 7 comprises a pot block 71 in which a pot 71a for containing resin tablets T is formed, and a transfer mechanism 72 having a plunger 72a provided inside the pot 71a. The transfer mechanism 72 includes a plunger 72a and a plunger drive mechanism 72c for driving the plunger 72a. The plunger 72a is responsible for pumping the molten resin Ta, which is formed when the resin tablets T contained in the pot 71a are heated and melted. The operation of the plunger drive mechanism 72c is controlled by the control unit 6.

[0024] The plunger drive mechanism 72c moves multiple plungers 72a simultaneously up and down with the same amount of movement relative to multiple pots 71a. In this embodiment, the plunger drive mechanism 72c is located on the underside of the plungers 72a. As this plunger drive mechanism 72c, for example, a combination of a servo motor and a ball screw mechanism, or a combination of an air cylinder or hydraulic cylinder and a rod can be used.

[0025] The pot block 71 is positioned so as to be at the same height as the unmolded substrate Sa when it is placed on the lower mold LM. In other words, the end face 71b of the pot block 71 protrudes from the upper surface 36 of the lower mold LM towards the upper mold UM.

[0026] The upper mold UM has an upper mold cavity MCa formed therein, which houses the semiconductor chip 48 fixed to the substrate Sa before molding and into which molten resin Ta is injected. The upper mold UM also has a recessed portion 81, which is a cal portion, formed in the part facing the pot 71a, and a runner portion 82 that connects the cal portion 81 to the upper mold cavity MCa. The upper mold UM has an air vent (not shown) formed on the side of the upper mold cavity MCa opposite to the pot 71a.

[0027] When the upper mold UM and lower mold LM are clamped together by the mold clamping mechanism 5, resin channels formed from the cal portion 81 and runner portion 82 connect the multiple pots 71a to the upper mold cavity MCa. At this time, the unmolded substrate Sa is sandwiched between the lower surface of the upper mold UM and the upper surface 36 of the lower mold LM. In this state, the plunger 72a is raised by the plunger drive mechanism 72c and molten resin Ta is injected into the upper mold cavity MCa, thereby resin-encapsulating the semiconductor chip 48 of the unmolded substrate Sa.

[0028] On the surface of the lower mold LM facing the upper mold UM, a plurality of positioning pins 37 (an example of a positioning part) are arranged toward the upper mold UM (three in this embodiment). The three positioning pins 37 are located on the upper surface 36 of the lower mold LM. More specifically, one of the three positioning pins 37 is located in the center of the upper surface 36 of the lower mold LM, on the side closer to the pot block 71 relative to the upper mold cavity MCa. The other two are arranged along the pot block 71, flanking the one positioning pin 37 located in the center of the upper surface 36 of the lower mold LM. Each of the three positioning pins 37 is, for example, cylindrical (circular cross-section) with a diameter of 1.5 mm and a height of 1.5 mm. Each of the three positioning pins 37 has a pin shape with a chamfered tip, and the tip is pointed.

[0029] In the following, a single positioning pin 37 located in the center of the upper surface 36 of the lower mold LM on the side closer to the pot block 71 is referred to as the first positioning pin 37a (an example of a positioning part). Two positioning pins 37 positioned on either side of the first positioning pin 37a are referred to as the second positioning pins 37b (see Figure 7). When the single first positioning pin 37a and the two second positioning pins 37b are not distinguished, they are simply referred to as positioning pins 37. The three positioning pins 37 are passed through each of the multiple (three in this embodiment) positioning holes 49 formed on the outer edge of the unmolded substrate Sa, thereby positioning the unmolded substrate Sa relative to the lower mold LM. Note that the positioning pins 37 may be stepped pins including a thicker lower portion and a thinner upper portion.

[0030] Of the three positioning holes 49 in the unmolded substrate Sa, the one positioning hole 49 through which the first positioning pin 37a passes is called the first positioning hole 49a (an example of a positioning hole), and the two positioning holes 49 through which the second positioning pin 37b passes are called the second positioning holes 49b (see Figure 7). When the one first positioning hole 49a and the two second positioning holes 49b are not distinguished, they are simply referred to as positioning holes 49. In this embodiment, the surface of the unmolded substrate Sa is rectangular. Hereinafter, of the four sides that constitute the surface of the unmolded substrate Sa, the two sides that are aligned with the direction of the arrangement of the three positioning holes 49 are called the long sides 47a, and the two sides perpendicular to the long sides 47a are called the short sides 47b. The first positioning hole 49a is square-shaped when viewed along a direction perpendicular to the surface of the substrate Sa before molding (a direction perpendicular to the upper surface 36 of the lower mold LM when the substrate Sa before molding is placed on the lower mold LM), and each side (each inner surface) of the first positioning hole 49a is parallel to the long side 47a and the short side 47b of the substrate Sa before molding. The second positioning hole 49b has a shape in which two sides parallel to the long side 47a are connected by a concave curve (e.g., a circular arc) that bulges outward relative to the two parallel sides. The distance between the two parallel sides of the second positioning hole 49b is such that the second positioning pin 37b fits in without gap (e.g., slightly more than 1.5 mm). The distance between the two opposite sides of the first positioning hole 49a is greater than that (e.g., 1.8 mm). Hereinafter, the direction parallel to the long side 47a of the substrate Sa before molding will be referred to as the longitudinal direction, and the direction parallel to the short side 47b will be referred to as the short direction. Furthermore, the shape of the first positioning hole 49a when viewed along a direction perpendicular to the surface of the substrate Sa before molding may be rectangular, as long as each side is parallel to the long side 47a and the short side 47b of the substrate Sa before molding.

[0031] [Loader configuration] Next, the specific configuration of the loader 10 in this embodiment will be described with reference to Figures 3 and 4. In Figures 3 to 6, the semiconductor chip 48 fixed to the pre-molded substrate Sa is not shown. Also, in Figures 3 to 6, the configuration of the loader 10 for one of the two pre-molded substrates Sa placed on both sides of the lower mold LM with the pot block 71 in between will be described. As mentioned above, the mold C in this embodiment is a mold C that resin-moldes two pre-molded substrates Sa in a single resin molding operation. Therefore, the same configuration is provided for the other of the two pre-molded substrates Sa (see Figure 2) placed on both sides of the lower mold LM with the pot block 71 in between.

[0032] As shown in Figure 3, the loader 10 includes a base member 11 that is movable along a rail (not shown), and a base member lifting mechanism (not shown) for moving the base member 11 up and down. The base member 11 includes a substrate holding portion 13 for holding the substrate Sa before molding, a pressing portion 14 for pressing down the substrate Sa placed on the lower mold LM, a aligning mechanism 16 for positioning the substrate Sa before molding, and a pressing portion lifting mechanism (not shown) for moving the pressing portion 14 up and down. The base member 11 is also provided with a resin holding portion (not shown) for holding the resin tablet T.

[0033] The substrate holding section 13 includes a holding claw 13a, a drive section 13b, a lever 13c, a link 13d, and a shaft 13e.

[0034] The retaining claws 13a according to this embodiment are for holding the pre-molding substrate Sa on the loader 10 by hooking the opposing long sides 47a of the rectangular pre-molding substrate Sa (see Figure 4). Multiple retaining claws 13a are arranged at the end on the pot 71a side (four in this embodiment) and multiple retaining claws 13a are arranged at the end opposite to the pot 71a side (four in this embodiment). The retaining claws 13a are configured to open and close by swinging around the shaft 13e. When the retaining claws 13a are closed, they hook the long sides 47a of the pre-molding substrate Sa and hold the pre-molding substrate Sa on the loader 10. When the retaining claws 13a are opened, the hooks on the pre-molding substrate Sa are released, and the pre-molding substrate Sa is released from being held. The released pre-molding substrate Sa falls from the loader 10 and is placed on the mold surface of the lower mold LM (see Figure 5).

[0035] The drive unit 13b is, for example, an air cylinder, which can move the lever 13c up and down. The lever 13c connects the drive unit 13b to the link 13d. The link 13d connects the lever 13c to the retaining claw 13a and is configured to swing relative to the lever 13c and the retaining claw 13a. The shaft 13e passes through multiple retaining claws 13a located at the pot-side end and multiple retaining claws 13a located at the opposite end, and serves as the pivot point for the retaining claws 13a.

[0036] The pressing portion 14 is positioned to press the unmolded substrate Sa, which is placed on the lower mold LM with the positioning pins 37 formed on the lower mold LM passing through the positioning holes 49, toward the lower mold LM by pushing the outer edge of the unmolded substrate Sa placed on the lower mold LM toward the lower mold LM. The pressing member 14b is connected to two connecting shafts 14a and moves up and down (vertically) together with the connecting shafts 14a. In this embodiment, both connecting shafts 14a pass through the base member 11 and are connected to each other above the base member 11. The unmolded substrate Sa is held by being sandwiched between the retaining claws 13a of the substrate holding portion 13 and the pressing portion 14.

[0037] The pressing portion 14 includes a pressing member 14b. The pressing member 14b is formed in a frame shape so that it can press the outer edge of the unmolded substrate Sa toward the lower die LM. The inside of the frame is recessed, and the semiconductor chip fixed to the unmolded substrate Sa is placed in this recess.

[0038] The lifting mechanism (not shown) adjusts the height position of the retaining portion 14 relative to the base member 11. The lifting mechanism is composed of an air cylinder or the like. The lifting mechanism can change the height position of the retaining portion 14 relative to the base member 11 by moving the connecting shaft 14a up and down relative to the base member 11.

[0039] The alignment mechanism 16 is a mechanism that positions the unmolded substrate Sa relative to the lower die LM by pressing the unmolded substrate Sa placed on the lower die LM. The alignment mechanism 16 includes a substrate pressing part 16a (an example of a molding object pressing part) that presses the short side 47b of the unmolded substrate Sa, and a drive part 16b that drives the substrate pressing part 16a. The alignment mechanism 16 is controlled by the control unit 6.

[0040] The drive unit 16b consists of an electric actuator and is located on the base member 11. The substrate pressing portion 16a is a pair of rod-shaped members, one end of which is attached to the drive unit 16b and extends through the base member 11. The other end of the substrate pressing portion 16a is located below the upper surface 36 of the lower die LM. Each of the pair of substrate pressing portions 16a is positioned to press both ends (near the long side 47a) of one short side 47b of the substrate Sa before molding, and moves simultaneously and identically by the drive unit 16b. The portion of the substrate pressing portion 16a facing the short side 47b of the substrate Sa before molding is curved (see Figure 7). The lower die LM has a pair of grooves 38 formed therein to avoid interference with the other end of the pair of substrate pressing portions 16a.

[0041] [Method for manufacturing resin molded products] Next, the manufacturing method of the resin molded product (molded substrate Sb) will be explained using Figures 1 to 7. First, the unmolded substrate Sa, released from the substrate holding part 13 of the loader 10, is placed on the lower mold LM so that the positioning pin 37 of the lower mold LM passes through the positioning hole 49. Then, the aligning mechanism 16 pushes the first positioning pin 37a until it contacts the contact surface 49c (an example of a surface) of the first positioning hole 49a to position the unmolded substrate Sa and supply the resin tablet T. This includes a substrate supply step (an example of a supply step), a mold clamping step in which the mold C is clamped by the mold clamping mechanism 5, and a molding step in which molten resin Ta is supplied to the upper mold cavity MCa to perform resin molding of the unmolded substrate Sa. The contact surface 49c of the first positioning hole 49a is planar.

[0042] The molding process is a process in which the resin molding system 30 resin-moldes the substrate Sa from the time the substrate Sa is loaded into the molding module 3 until the molded substrate Sb is unloaded from the molding module 3. In the molding process in this embodiment, molten resin Ta is supplied to the surface of the substrate Sa by the upper mold cavity MCa, thereby molding and producing the molded substrate Sb. Note that in Figures 1 and 3 to 6, the semiconductor chip 48 fixed to the substrate Sa is not shown. Also, in Figures 4 to 6, only one side (the right side in Figure 2) of the pot block 71 of the lower mold LM is shown. The configuration of the unshown parts is the same as the configuration of the shown parts. Furthermore, in Figures 4 to 6, the upper mold UM is not shown.

[0043] As shown in Figure 1, the loader 10 is preheated with the resin tablet T housing space insulated, and the mold C is also heated. Then, the pre-molding substrate Sa taken from the substrate supply mechanism 43 is placed on the loader 10. The resin tablets T, aligned by the resin supply mechanism 45, are then placed in the resin tablet T housing space of the loader 10. The loader 10 then transports the pre-molding substrate Sa and resin tablets T to the molding module 3. As shown by the dashed line in Figure 2, the loader 10 is positioned between the upper mold UM and the lower mold LM of the mold C, and places the pre-molding substrate Sa on the lower mold LM. Details of placing the pre-molding substrate Sa on the lower mold LM will be described later. The release film F is supplied to the lower surface of the upper mold UM before the pre-molding substrate Sa is placed on the lower mold LM, and is adsorbed and fixed to the lower surface of the upper mold UM by a release film suction mechanism (not shown) provided in the upper mold UM (see Figure 4). Figure 2 shows the state after the substrate Sa has been placed on the lower mold LM before molding.

[0044] As shown in Figure 4, with the loader 10 positioned between the upper mold UM and lower mold LM of the molding die C, the control unit 6 lowers the base member 11 using a base member lifting mechanism (not shown), and lowers the pressing portion 14 including the connecting shaft 14a. At this time, the substrate holding portion 13, the unmolded substrate Sa, and the aligning mechanism 16 also lower along with the lowering of the base member 11. As a result, the end of the substrate pressing portion 16a of the aligning mechanism 16 fits into the groove portion 38 of the lower mold LM. Figure 4 shows the state in which the base member 11 has been lowered. At this time, the pressing portion 14 is above the lower mold LM, and the unmolded substrate Sa held by the loader 10 is not in contact with the upper surface 36 of the lower mold LM.

[0045] Next, as shown in Figure 5, the substrate holding unit 13 moves the lever 13c downward (towards the lower die LM) by the drive unit 13b. When the lever 13c is moved downward, the end of the link 13d connected to the lever 13c moves downward. As a result, the retaining claw 13a connected to the other end of the link 13d swings around the shaft 13e and opens. When the retaining claw 13a opens, the pre-molding substrate Sa is released from its grip, and the pre-molding substrate Sa is released from being held. The released pre-molding substrate Sa falls from the loader 10 and is placed on the lower die LM. At this time, the first positioning pin 37a, located in the lower die LM, is passed through the first positioning hole 49a formed in the pre-molding substrate Sa, and the second positioning pin 37b, located in the lower die LM, is passed through the second positioning hole 49b.

[0046] Next, as shown in Figure 6, the pressing mechanism lowers the pressing section 14, including the connecting shaft 14a, and presses the unmolded substrate Sa placed on the lower mold LM toward the lower mold LM. This ensures that the entire unmolded substrate Sa is in contact with the upper surface 36 of the lower mold LM.

[0047] Subsequently, the pressing mechanism raises the pressing part 14 to the state shown in Figure 5. Then, as shown in Figure 7, the drive unit 16b of the grabbing mechanism 16 is driven to push one of the short sides 47b of the unmolded substrate Sa with the substrate pressing part 16a. At this time, the moving speed of the substrate pressing part 16a is initially set to a first moving speed, and just before contact with the short side 47b of the unmolded substrate Sa, it is decelerated to a second moving speed which is slower than the first moving speed. Then, the substrate pressing part 16a is brought into contact with the short side 47b of the unmolded substrate Sa at the second moving speed and pushed until the first positioning pin 37a contacts the contact surface 49c of the first positioning hole 49a formed in the unmolded substrate Sa. When the first positioning pin 37a contacts the contact surface 49c of the first positioning hole 49a, the drive unit 16b can no longer push the substrate pressing part 16a, so the drive current flowing to the drive unit 16b increases. When the control unit 6 detects a drive current exceeding a predetermined value, it stops supplying power to the drive unit 16b. Note that when the first positioning pin 37a contacts the contact surface 49c of the first positioning hole 49a, neither of the two second positioning pins 37b contacts the concave curved surface 49d of the second positioning hole 49b.

[0048] As described above, the distance between the two parallel sides of the second positioning hole 49b is such that the second positioning pin 37b fits in without any gap (for example, slightly over 1.5 mm). Therefore, when the aligning mechanism 16 pushes the unmolded substrate Sa, the unmolded substrate Sa can be moved along the longitudinal direction without moving or rotating in the short direction.

[0049] Next, the pressing mechanism (not shown) lowers the pressing mechanism 14, including the connecting shaft 14a, again, as shown in Figure 6, pressing the unmolded substrate Sa placed on the lower mold LM toward the lower mold LM. The suction mechanism (not shown) provided on the lower mold LM then suctions and fixes the unmolded substrate Sa to the upper surface 36 of the lower mold LM.

[0050] Then, the loader 10 presses the unmolded substrate Sa toward the mold surface of the lower mold LM with the pressing part 14 and places the resin tablet T into the pot 71a of the lower mold LM (supply process). By placing the resin tablet T into the pot 71a, the heater built into the lower mold LM heats the resin tablet T, turning it into molten resin Ta.

[0051] Next, the pressing section 14 is raised again by the pressing section lifting mechanism to the state shown in Figure 5. Then, the pressing section 14, including the connecting shaft 14a, is raised by the base member lifting mechanism. At this time, the substrate holding section 13 and the aligning mechanism 16 also rise along with the base member 11. As a result, the end of the substrate pressing section 16a of the aligning mechanism 16 comes out of the groove 38 of the lower die LM. The loader 10 then moves outside the molding die C from between the upper die UM and the lower die LM and returns to the supply module 4.

[0052] Next, the clamping mechanism 5, whose driving force is controlled by the control unit 6, moves the upper mold UM and the lower mold LM closer together to clamp them together. At this time, the lower surface of the upper mold UM contacts the peripheral edge of the side of the substrate Sa before molding on which the semiconductor chip 48 is fixed, and the lower mold LM and the upper mold UM hold the substrate Sa before molding (clamping process).

[0053] Next, the molten resin Ta, formed from the resin tablet T contained in the lower mold LM, is injected into the upper mold cavity MCa by a transfer mechanism 72 whose driving force is controlled by the control unit 6. This completes the resin molding of the substrate Sa before molding (molding process). After resin molding, the lower mold LM is moved downward to open the mold C.

[0054] Subsequently, the unloader 42 removes the excess resin and the molded substrate Sb from the mold C. The excess resin is discarded in the excess resin storage section (not shown), and the molded substrate Sb is stored in the substrate storage section 46 of the storage module 2 (see Figure 1). The package substrate (molded substrate Sb) manufactured by this resin molding system 30 is then cut to remove any unnecessary parts and to separate the substrate into individual pieces. The individual pieces undergo quality inspection and are then used as electronic components.

[0055] As described above, in the resin molding system 30 of this embodiment, the loader 10 has a aligning mechanism 16. Therefore, the positioning of the unmolded substrate Sa with respect to the lower mold LM can be accurately performed. Specifically, the unmolded substrate Sa placed on the lower mold LM is pressed by the substrate pressing part 16a, thereby bringing the first positioning pin 37a into contact with the contact surface 49c of the first positioning hole 49a for positioning. The first positioning pin 37a is cylindrical, and the surface facing the first positioning hole 49a is a convex curved surface, while the contact surface 49c of the first positioning hole 49a is planar. As a result, the first positioning pin 37a and the contact surface 49c make contact at a single point. This enables high-precision positioning of the unmolded substrate Sa. Therefore, for example, even when resin encapsulation is performed on multiple rows of semiconductor chips 48 arranged at equal intervals along the longitudinal direction of the unmolded substrate Sa, as shown in Figure 7, resin encapsulation can be performed after high-precision positioning of the unmolded substrate Sa in the longitudinal direction.

[0056] In particular, in this embodiment, an electric actuator is used as the drive unit 16b of the grabbing mechanism 16. Since the electric actuator has high controllability, the position, movement speed, and pressing force of the substrate pressing unit 16a can be accurately controlled. Specifically, as described above, the movement speed of the substrate pressing unit 16a is reduced just before it contacts the short side 47b of the substrate Sa before molding, and the substrate pressing unit 16a is brought into contact with the short side 47b of the substrate Sa before molding at a low speed to press the substrate Sa before molding, and the first positioning pin 37a is brought into contact with the contact surface 49c of the first positioning hole 49a. Therefore, deformation of the contact surface 49c that would occur when the first positioning pin 37a is brought into contact with the contact surface 49c of the first positioning hole 49a does not occur. In addition, in order to prevent deformation of the contact surface 49c when the position of the substrate pressing unit 16a is not controlled, there is no risk of insufficient pressing and a decrease in positioning accuracy.

[0057] [Another embodiment] The following describes another embodiment of the above-described embodiment. For the same components as in the above-described embodiment, the same terms and reference numerals will be used for explanation to facilitate understanding.

[0058] <1> In the embodiment described above, the speed and position were controlled by an electric actuator, but the pressing force may also be controlled. In this case, only the pressing force may be controlled from the start of control, or the speed and position may be controlled as in the embodiment above until partway through, and then the control may be changed to the pressing force just before the first positioning pin 37a contacts the contact surface 49c or at a certain position. Specifically, it is preferable to set the pressing force just before contact or at a certain position to a magnitude that does not cause deformation of the unmolded substrate Sa. This makes it possible to shorten the time until the first positioning pin 37a contacts the unmolded substrate Sa without deforming the unmolded substrate Sa, and consequently shorten the time required for resin molding.

[0059] <2> In the embodiment described above, the control unit 6 stopped supplying power to the drive unit 16b when it detected that the drive current flowing to the drive unit 16b exceeded a predetermined value, but it is not limited to this. Since the drive unit 16b uses a highly controllable electric actuator, the control unit 6 may be configured to stop supplying power to the drive unit 16b when it detects that the substrate pressing unit 16a has reached a position where the first positioning pin 37a contacts the contact surface 49c of the first positioning hole 49a.

[0060] <3> In the embodiment described above, the control unit 6 detected that the drive current flowing to the drive unit 16b exceeded a predetermined value and stopped the power supply to the drive unit 16b. However, at this time, there is a risk that the first positioning pin 37a is not in contact with the contact surface 49c of the first positioning hole 49a. Specifically, for example, this may occur if, before the first positioning pin 37a makes contact with the contact surface 49c of the first positioning hole 49a, at least one positioning pin 37 gets caught on the inner surface of the positioning hole 49, causing the drive current flowing to the drive unit 16b to exceed a predetermined value. Therefore, the control unit 6 may be configured to detect that the drive current flowing to the drive unit 16b initially exceeds a predetermined value and stop the power supply to the drive unit 16b, and then power the drive unit 16b again. Immediately after energizing the drive unit 16b again, the output torque of the drive unit 16b increases, so the substrate pressing unit 16a can overcome the snag and press the unmolded substrate Sa again until the first positioning pin 37a contacts the contact surface 49c of the first positioning hole 49a.

[0061] <4> In the embodiment described above, the positioning holes 49 were arranged along the long side 47a of the substrate Sa before molding. However, if it is necessary to perform positioning in the direction of the short side 47b with high precision, a plurality of positioning holes 49 may be arranged along the short side 47b, and the aligning mechanism 16 may be arranged so that the substrate Sa before molding can be pushed in the direction of the short side 47b.

[0062] <5> In the embodiment described above, the surface of the substrate Sa before molding was rectangular, but it is not limited to this, and any shape such as a circle can be applied. In this case, a plurality of positioning holes 49 may be arranged along the direction in which positioning accuracy is required, and a aligning mechanism 16 may be provided.

[0063] <6> In the embodiments described above, the first positioning hole 49a was square or rectangular when viewed along a direction perpendicular to the surface of the substrate Sa before molding, but is not limited to these. In the first positioning hole 49a, as long as the contact surface 49c that the first positioning pin 37a contacts is a flat surface parallel to the short side 47b, the shape of other parts may be any shape, such as a curved surface. Also, as long as the part of the first positioning pin 37a that contacts the contact surface 49c of the first positioning hole 49a is a convex curved surface, the cross-section perpendicular to the height direction may be any shape, such as an ellipse. Furthermore, as long as the first positioning hole 49a and the first positioning pin 37a contact a flat surface and a convex curved surface, the first positioning hole 49a may be a convex curved surface and the first positioning pin 37a may be a flat surface.

[0064] <7> In the embodiment described above, the distance between the two parallel sides of the second positioning hole 49b was set to a size such that the second positioning pin 37b could fit in without any gap (for example, slightly more than 1.5 mm), but it is not limited to this. For example, the distance between the two parallel sides of the second positioning hole 49b may be set to 1.5 mm to make the clearance with the second positioning pin 37b zero. Similarly, in the first positioning hole 49a, the length in the direction along the short side 47b may be set to 1.5 mm to make the clearance with the first positioning pin 37a zero.

[0065] <8> In the embodiment described above, the positioning pin 37 is positioned on the side closer to the pot block 71 relative to the upper mold cavity MCa, but the embodiment is not limited to this. The positioning pin 37 may also be configured to be positioned on the side further away from the pot block 71 relative to the cavity.

[0066] <9> In the embodiment described above, the resin tablet T was contained in the pot 71a of the lower mold LM when the pressing part 14 pressed the unmolded substrate Sa toward the lower mold LM for the second time, but it is not limited to this. The resin tablet T may also be contained in the pot 71a of the lower mold LM when the pressing part 14 pressed the unmolded substrate Sa toward the lower mold LM for the first time. Alternatively, the resin tablet T may be contained in the pot 71a of the lower mold LM when the pressing part 14 pressed the unmolded substrate Sa toward the lower mold LM and then raised away from the unmolded substrate Sa.

[0067] <10> In the embodiment described above, regarding the movement speed of the substrate pressing portion 16a, the movement speed was initially set to a first movement speed, and then reduced to a second movement speed lower than the first movement speed just before contact with the short side 47b of the substrate Sa before molding. However, the embodiment is not limited to this. The movement speed of the substrate pressing portion 16a may be kept constant as long as deformation of the contact surface 49c does not occur when it comes into contact with the contact surface 49c of the first positioning hole 49a, and the molding time of the substrate Sa before molding does not become redundant. Furthermore, the movement speed of the substrate pressing portion 16a may be configured to be changed in three or more stages.

[0068] <11> In the embodiment described above, the resin injection mechanism 7 is a method in which the unmolded substrate Sa placed on the lower mold LM is clamped between the lower mold LM and the upper mold UM to perform resin molding, and the molten resin Ta supplied from the pot 71a is supplied to the upper mold cavity MCa by passing over the edge of the unmolded substrate Sa (sometimes called a side gate method). However, it may also be a method in which the unmolded substrate Sa placed on the lower mold LM is clamped between the lower mold LM and the protruding part of the pot block to perform resin molding, and the molten resin Ta supplied from the pot 71a is supplied to the cavity without passing over the edge of the unmolded substrate Sa (sometimes called an edge gate method). Furthermore, even in the case of an edge gate method, the positioning mechanism 16 can be used to position the unmolded substrate Sa relative to the lower mold LM before clamping the mold C. In addition, the mold C may be equipped with an intermediate mold in addition to the lower mold LM and upper mold UM, and the excess resin may be removed by the intermediate mold when opening the mold after resin molding (sometimes called a top gate method).

[0069] <12> In the embodiment described above, molten resin Ta was supplied to only one side of the substrate Sa before molding to perform single-sided molding. However, double-sided molding may also be performed by providing a lower mold cavity in the lower mold LM and injecting molten resin Ta into the lower mold LM as well as the upper mold cavity MCa provided in the upper mold UM.

[0070] <13> In the above-described embodiment, the aligning mechanism 16 was applied to a transfer-type resin molding system 30, but it can also be applied to a compression-type resin molding system 30 when the pre-molding substrate Sa is placed on the lower mold LM.

[0071] <14> In the embodiment described above, a semiconductor chip 48 was fixed to the substrate to form the pre-molding substrate Sa, but this is not the only option. In addition to the semiconductor chip 48, any type of chip, such as a resistor or capacitor, may be fixed to the substrate to form the pre-molding substrate Sa.

[0072] <15> The substrate used for the pre-molded substrate Sa that is resin-molded in the resin molding system 30 in the above-described embodiment is, for example, a semiconductor substrate (such as a silicon wafer), a metal substrate (such as a lead frame), a glass substrate, a ceramic substrate, a resin substrate, or a printed circuit board, and also includes carriers without wiring.

[0073] [Summary of the above embodiment] The following describes the outline of the resin molding system 30 and the method for manufacturing the resin molded product (molded substrate Sb) as described in the above embodiment.

[0074] (1) The characteristic configuration of the resin molding system 30 is that it comprises a mold C on which the molded object (substrate Sa before molding) is placed with the positioning part (first positioning pin 37a) passing through the positioning part (first positioning pin 37a) and a positioning part (first positioning pin 37a) that positions the molded object (substrate Sa before molding) having a positioning hole (first positioning hole 49a), and a transport device (loader 10) having a aligning mechanism 16 that positions the molded object (substrate Sa before molding) relative to the positioning part (first positioning pin 37a) by bringing the positioning hole (first positioning hole 49a) into contact with the positioning part (first positioning pin 37a).

[0075] The resin molding system 30 according to this characteristic configuration has a aligning mechanism 16. Therefore, with the positioning portion (first positioning pin 37a) formed on the mold C passing through the positioning hole (first positioning hole 49a) formed on the object to be molded (pre-molding substrate Sa), the aligning mechanism 16 pushes the object to be molded (pre-molding substrate Sa) to bring the positioning hole (first positioning hole 49a) into contact with the positioning portion (first positioning pin 37a). This simple method allows for highly accurate positioning of the object to be molded (pre-molding substrate Sa) relative to the positioning portion (first positioning pin 37a). Furthermore, since the aligning mechanism 16 does not press down on the object to be molded (pre-molding substrate Sa), the object to be molded (pre-molding substrate Sa) does not deform. Therefore, if the object to be molded (pre-molding substrate Sa) is a carrier, the object to be molded (pre-molding substrate Sa) can be reused.

[0076] (2) The resin molding system 30 described in (1) above further comprises a control unit 6 for controlling the joining mechanism 16, and the joining mechanism 16 may have a molding object pressing unit (substrate pressing unit 16a) for pressing the molding object (substrate pressing unit Sa before molding) and a drive unit 16b for moving the molding object pressing unit (substrate pressing unit 16a).

[0077] With this configuration, the control unit 6 controls the object to be molded pressing unit (substrate pressing unit 16a) and the drive unit 16b, so that the object to be molded (substrate Sa before molding) is pressed by the object to be molded pressing unit (substrate pressing unit 16a), and the positioning of the object to be molded (substrate Sa before molding) can be performed with high precision.

[0078] (3) In the resin molding system 30 described in (2) above, the control unit 6 may control the drive unit 16b to move the object to be molded pressing unit (substrate pressing unit 16a) towards the object to be molded (substrate Sa before molding) at a first moving speed, decelerate to a second moving speed lower than the first moving speed just before contacting the object to be molded (substrate Sa before molding), and then make contact with the object to be molded (substrate Sa before molding) at the second moving speed to perform positioning.

[0079] With this configuration, the control unit 6 controls the molding object pressing part (substrate pressing part 16a) to approach the molding object (substrate Sa before molding) at a first moving speed, decelerate to a second moving speed lower than the first moving speed just before contacting the molding object (substrate Sa before molding), and then contact the molding object (substrate Sa before molding) at the second moving speed to perform positioning. As a result, there is no risk of deformation of the positioning hole (first positioning hole 49a) when the positioning part (first positioning pin 37a) comes into contact with the positioning hole (first positioning hole 49a). Furthermore, compared to the case where the molding object pressing part (substrate pressing part 16a) is moved only at the low second moving speed, the molding time of the molding object (substrate Sa before molding) can be shortened.

[0080] (4) In the resin molding system 30 described in (2) above, the control unit 6 may control the drive unit 16b to perform speed control until it reaches a position just before contact with the object to be molded (substrate Sa before molding), and then perform pressing force control at the position just before contact with the object to be molded (substrate Sa before molding) to perform positioning.

[0081] The control unit 6 controls the pressing force at a position just before contact with the object to be molded (pre-molding substrate Sa), for example, by setting the pressing force to a size that does not cause deformation of the object to be molded (pre-molding substrate Sa). This shortens the time until the positioning unit (first positioning pin 37a) contacts the object to be molded (pre-molding substrate Sa) without deforming the object to be molded (pre-molding substrate Sa), and consequently shortens the time required for resin molding.

[0082] (5) In the resin molding system 30 described in any one of (2) to (4) above, the drive unit 16b is an electric actuator, and the control unit 6 may stop the movement of the object to be molded pressing unit (substrate pressing unit 16a) by stopping the supply of power to the electric actuator when the drive current of the electric actuator exceeds a predetermined value.

[0083] When the positioning hole (first positioning hole 49a) comes into contact with the positioning part (first positioning pin 37a), the object pressing part (substrate pressing part 16a) can no longer press the object to be molded (substrate Sa before molding), so the drive current of the electric actuator increases. Therefore, with this configuration, the control unit 6 stops supplying power to the electric actuator when the drive current of the electric actuator exceeds a predetermined value, thereby enabling high-precision positioning of the object to be molded (substrate Sa before molding) without deforming the positioning hole (first positioning hole 49a).

[0084] (6) In the resin molding system 30 described in (5) above, the control unit 6 may, after the drive current of the electric actuator exceeds a predetermined value and the power supply to the electric actuator is stopped, power may be supplied to the electric actuator again.

[0085] For example, while the object to be molded (pre-molded substrate Sa) is being pressed by the object to be molded pressing section (substrate pressing section 16a), the drive current flowing to the drive unit 16b may exceed a predetermined value due to the positioning section (first positioning pin 37a) getting caught on the inner surface of the positioning hole (first positioning hole 49a). In such a case, the control unit 6 temporarily stops the drive of the drive unit 16b, but with this configuration, by then energizing the drive unit 16b again, the object to be molded (pre-molded substrate Sa) can be pressed until the positioning hole (first positioning hole 49a) makes contact with the positioning section (first positioning pin 37a).

[0086] (7) In the resin molding system 30 described in any one of (1) to (6) above, the positioning portion (first positioning pin 37a) is a pin with a circular cross-section, and at least the surface of the positioning hole (first positioning hole 49a) that contacts the positioning portion (first positioning pin 37a) (contact surface 49c) is flat.

[0087] With this configuration, the contact surface 49c of the positioning part (first positioning pin 37a) and the positioning hole (first positioning hole 49a) contacts at a single point, so the object to be molded (pre-molding substrate Sa) can be positioned with high precision relative to the mold C.

[0088] (8) In the resin molding system 30 described in any one of (1) to (7) above, the positioning hole (first positioning hole 49a) may be rectangular when viewed along a direction perpendicular to the surface (upper surface 36) of the mold C on which the object to be molded (substrate Sa before molding) is placed.

[0089] With this configuration, the resin molding system 30 can be precisely aligned with the object to be molded (substrate Sa before molding) for resin molding.

[0090] (9) The characteristics of the method for manufacturing a resin molded product (pre-molded substrate Sb) using the resin molding system 30 described in any one of (1) to (8) above are that the method includes a supply step in which the object to be molded (pre-molded substrate Sa) is placed on the mold C so that the positioning part (first positioning pin 37a) passes through the positioning hole (first positioning hole 49a), and then the alignment mechanism 16 brings the positioning hole (first positioning hole 49a) into contact with the positioning part (first positioning pin 37a) to position the object to be molded (pre-molded substrate Sa) relative to the positioning part (first positioning pin 37a) and supplies resin material (resin tablet T, molten resin Ta); a mold clamping step in which the mold C is clamped by the mold clamping mechanism 5; and a molding step in which the object to be molded (pre-molded substrate Sa) is resin molded.

[0091] In the manufacturing method of a resin molded product (pre-molded substrate Sb) having the above features, the object to be molded (pre-molded substrate Sa) is placed on the mold C so that the positioning part (first positioning pin 37a) passes through the positioning hole (first positioning hole 49a), and then the positioning hole (first positioning hole 49a) is brought into contact with the positioning part (first positioning pin 37a) by the alignment mechanism 16 to position the object to be molded (pre-molded substrate Sa) relative to the positioning part (first positioning pin 37a) and supply resin material (resin tablet T, molten resin Ta). This is followed by a mold clamping step in which the mold C is clamped by the mold clamping mechanism 5, and a molding step in which the resin molded object (pre-molded substrate Sa) is molded. As a result, the resin molded product (pre-molded substrate Sb) can be manufactured with high precision in positioning the object to be molded (pre-molded substrate Sa) relative to the mold C, and the resin molded product (pre-molded substrate Sb) can be manufactured with high precision using the mold C. [Industrial applicability]

[0092] This invention can be used in resin molding systems and methods for manufacturing resin molded products. [Explanation of Symbols]

[0093] 5: Clamping mechanism 6: Control Unit 10: Loader (conveyor device) 16: Accelerating mechanism 16a: Substrate pressing section (molding object pressing section) 16b: Drive unit 30: Resin molding system 36:Top surface (surface) 37a: First positioning pin (positioning part) 49a: First positioning hole (positioning hole) 49c: Contact surface (surface) C: Molding mold Sa: Pre-molding substrate (object to be molded) Sb: Pre-molded substrate (resin molded product) T: Resin tablet (resin material) Ta: Molten resin (resin material)

Claims

1. A molding die having a positioning section for positioning an object to be molded which has positioning holes, wherein the object to be molded is placed on the positioning section with the positioning section passing through the positioning holes, A conveying device having a aligning mechanism that positions the object to be molded relative to the positioning part by bringing the positioning hole into contact with the positioning part, The system further comprises a control unit that controls the aforementioned joining mechanism, The aforementioned molding mechanism is a resin molding system comprising a molding object pressing unit that presses the outer periphery of the molding object, and a drive unit that moves the molding object pressing unit.

2. A mold having a positioning unit for positioning an object to be molded having a positioning hole, wherein the object to be molded is placed on the mold with the positioning unit passing through the positioning hole, A conveying device having a aligning mechanism that positions the object to be molded relative to the positioning part by bringing the positioning hole into contact with the positioning part, The system further comprises a control unit that controls the aforementioned joining mechanism, The aforementioned pressing mechanism includes a molding object pressing unit that presses the molding object, and a drive unit that moves the molding object pressing unit. A resin molding system in which the control unit controls the drive unit to move the object pressing unit towards the object to be molded at a first moving speed, decelerate it to a second moving speed lower than the first moving speed just before contacting the object to be molded, and then bring it into contact with the object to be molded at the second moving speed to perform positioning.

3. A mold having a positioning unit for positioning an object to be molded having a positioning hole, wherein the object to be molded is placed on the mold with the positioning unit passing through the positioning hole, A conveying device having a aligning mechanism that positions the object to be molded relative to the positioning part by bringing the positioning hole into contact with the positioning part, The system further comprises a control unit that controls the aforementioned joining mechanism, The aforementioned pressing mechanism includes a molding object pressing unit that presses the molding object, and a drive unit that moves the molding object pressing unit. A resin molding system in which the control unit controls the drive unit to perform speed control until it reaches a position just before contact with the object to be molded, and then controls the pressing force at the position just before contact with the object to be molded to perform positioning.

4. A mold having a positioning unit for positioning an object to be molded having a positioning hole, wherein the object to be molded is placed on the mold with the positioning unit passing through the positioning hole, A conveying device having a aligning mechanism that positions the object to be molded relative to the positioning part by bringing the positioning hole into contact with the positioning part, The system further comprises a control unit that controls the aforementioned joining mechanism, The aforementioned pressing mechanism includes a molding object pressing unit that presses the molding object, and a drive unit that moves the molding object pressing unit. The aforementioned drive unit is an electric actuator, The resin molding system wherein the control unit stops the movement of the object pressing part by stopping the supply of power to the electric actuator when the drive current of the electric actuator exceeds a predetermined value.

5. The resin molding system according to claim 4, wherein the control unit stops supplying power to the electric actuator when the drive current of the electric actuator exceeds a predetermined value, and then supplies power to the electric actuator again.

6. The resin molding system according to claim 1, wherein the positioning portion is a pin with a circular cross-section, and at least one of the positioning holes that contacts the positioning portion is planar.

7. The resin molding system according to any one of claims 1 to 6, wherein the positioning hole is rectangular when viewed along a direction perpendicular to the surface of the mold on which the object to be molded is placed.

8. A method for manufacturing a resin molded product using the resin molding system described in claim 1, A supply step in which, after placing the object to be molded on the molded die so that the positioning part passes through the positioning hole, the positioning hole is brought into contact with the positioning part by the object pressing part of the aligning mechanism to press the outer periphery of the object to be molded, thereby positioning the object to be molded relative to the positioning part and supplying resin material, A mold clamping step in which the molding die is clamped by a mold clamping mechanism, A method for manufacturing a resin molded product, comprising a molding step of performing resin molding of the object to be molded.

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