Surface removal method and surface removal apparatus

Abstract

To provide, for example, a novel surface layer removing method and a novel surface layer removing device which are further improved.SOLUTION: The surface layer removing method is for, for example, removing a surface layer to be machined by applying a laser beam including a plurality of beams to the machining object, and removes the surface layer to be machined by sweeping a plurality of spots formed by the beams in a second direction intersecting a first direction in the state of being arranged in the first direction on the surface to be machined. The surface layer removing device comprises, for example, a light-emitting device, a delivery optical fiber that transmits a laser beam from the light-emitting device, an optical head that applies the laser beam from the delivery optical fiber to the surface to be machined, and a sweeping mechanism for sweeping the plurality of spots formed by the beams on the surface to be machined. The surface layer to be machined is removed by sweeping the plurality of spots in the second direction intersecting the first direction in the state of being arranged in the first direction on the surface to be machined.SELECTED DRAWING: Figure 4