Test handler for electronic component

Abstract

The present invention relates to an electronic component test handler. Specifically, according to one embodiment of the present invention, the device comprises: a cassette unit loaded with a ring frame on which an electronic component to be tested is mounted; a first pickup unit for removing the ring frame from the cassette unit and picking up the electronic component mounted on the ring frame; a shuttle on which the electronic component removed from the ring frame by the first pickup unit can be mounted; a second pickup unit for picking up the electronic component mounted on the shuttle; a chuck on which the electronic component transported by the second pickup unit can be mounted; and a picker module capable of picking up the electronic component to rearrange the electronic component mounted on the chuck by the second pickup unit to a correct position on the chuck. An electronic component test handler may be provided, comprising a test section in which a test of the electronic component seated at the correct position on the chuck is performed, wherein the chuck moves toward the picker module while the position of the picker module is maintained, and the picker module supports the electronic component when the electronic component is positioned within a predetermined distance from the picker module by the movement of the chuck.

Description

Technology Field

[0001] The present invention relates to an electronic component test handler. Background Technology

[0003] A test handler is a device that supports testing of electronic components, such as semiconductor devices, manufactured through a specified manufacturing process, and classifies the electronic components by grade based on the test results. Such a test handler can test electronic components, such as semiconductor devices, by electrically connecting them to a tester.

[0004] In addition, multiple electronic components can be electrically connected to the tester simultaneously, and multiple electronic components can be tested together. Testing is performed by electrically connecting these multiple electronic components while they are loaded onto a test tray.

[0005] Meanwhile, with the recent development of dies (DIE) in which multiple memory and logic devices are stacked together, test methods for testing these stacked dies are being developed. In particular, since a die is a structure in which multiple different semiconductor devices are stacked, separate equipment and processes are required to stack these different semiconductor devices. Consequently, it can be difficult to achieve precise stacking of dies, in which multiple different semiconductor devices are stacked through various processes, compared to single-layer semiconductor devices. This difficulty in manufacturing stacked dies may be one of the reasons for the higher defect rate of stacked dies compared to single-layer semiconductor devices.

[0006] Therefore, there is a need for a device that can precisely classify good dies and defective dies by testing stacked dies. The problem to be solved

[0008] Embodiments of the present invention were developed based on the background described above, and aim to provide an electronic component test handler capable of precisely classifying whether the condition of an electronic component is good or defective by arranging the electronic component in the correct position to improve the test precision of the electronic component.

[0009] In addition, we aim to provide an electronic component test handler capable of increasing the operational efficiency of equipment by simultaneously testing one or more stacked electronic components. means of solving the problem

[0011] According to one aspect of the present invention, a cassette unit loaded with a ring frame having an electronic component to be tested mounted thereon; a first pickup unit for removing the ring frame from the cassette unit and picking up the electronic component mounted on the ring frame; a shuttle on which the electronic component removed from the ring frame by the first pickup unit can be mounted; a second pickup unit for picking up the electronic component mounted on the shuttle; a chuck on which the electronic component transported by the second pickup unit can be mounted; and a picker module capable of picking up the electronic component to rearrange the electronic component mounted on the chuck by the second pickup unit to a correct position on the chuck. An electronic component test handler may be provided, comprising a test section in which a test of the electronic component seated at the correct position on the chuck is performed, wherein the chuck moves toward the picker module while the position of the picker module is maintained, and the picker module supports the electronic component when the electronic component is positioned within a predetermined distance from the picker module by the movement of the chuck.

[0012] Additionally, a plurality of electronic components may be placed on the shuttle, and the second pickup unit places at least a portion of the plurality of electronic components transported by the shuttle at an arbitrary position on the chuck, and the chuck moves so that when the picker module supports any one of the plurality of electronic components placed at the arbitrary position, any one of the plurality of electronic components can be placed at the correct position, and the picker module includes a picker camera and a picker capable of supporting the electronic components, and the picker camera scans another one of the plurality of electronic components placed at the arbitrary position while the electronic component supported by the picker is placed at the correct position as the chuck is raised and lowered, and the chuck moves so that when the picker supports the scanned other one, the other one can be placed at the correct position. An electronic component test handler may be provided.

[0013] Additionally, when a plurality of the electronic components are placed at an arbitrary position on the chuck, they are arranged in a matrix array having a plurality of rows and a plurality of columns, and an electronic component test handler may be provided such that the other electronic component scanned by the picker camera is placed at the closest position among a plurality of electronic components located diagonally opposite to any one electronic component transferred to the correct position.

[0014] Additionally, an electronic component test handler may be provided, which further includes a separation module capable of separating the electronic component to be tested from the ring frame, wherein the separation module applies heat to the portion of the ring frame on which the electronic component is seated and presses the electronic component so that a portion of the electronic component is separated from the ring frame to which the heat is applied, and the first pickup unit separates the electronic component from the ring frame by supporting and lifting the electronic component when a portion of the electronic component is separated from the ring frame by the separation module.

[0015] Additionally, an electronic component test handler may be provided, comprising: a second pickup unit for picking up a plurality of the electronic components; a chuck on which a plurality of the electronic components transferred by the second pickup unit can be placed; and a picker module capable of picking up the electronic components to rearrange the plurality of electronic components placed at an arbitrary position on the chuck by the second pickup unit to a correct position on the chuck, wherein when the plurality of electronic components are placed at the arbitrary position on the chuck, they form a matrix array having a plurality of rows and a plurality of columns, and are arranged asymmetrically in one of the front, back, left, or right directions with respect to a center point where an arbitrary first virtual line extending in the front-back direction and an arbitrary second virtual line extending in the left-right direction meet, and when the plurality of electronic components are rearranged to a correct position on the chuck by the picker module and the chuck, they are arranged symmetrically in all of the front, back, left, and right directions with respect to the center point. Effects of the invention

[0017] According to embodiments of the present invention, by arranging electronic components in the correct positions to improve the test precision of the electronic components, there is an effect of being able to accurately classify whether the condition of the electronic components is good or bad.

[0018] In addition, testing one or more stacked electronic components simultaneously has the effect of increasing the operating efficiency of the equipment. Brief explanation of the drawing

[0020] FIG. 1 is a schematic plan view of an electronic component test handler according to one embodiment of the present invention. Figure 2 is a diagram showing the process of separating electronic components from a ring frame removed from the cassette section of Figure 1. Figure 3 is a drawing showing the process of attaching electronic components to a ring frame to be introduced into the cassette section of Figure 1. Figure 4 is a diagram showing the process of rearranging electronic components into their correct positions on a chuck. FIG. 5 is a flowchart schematically illustrating a method for testing electronic components using an electronic component test handler according to an embodiment of the present invention. Figure 6 is a drawing showing the ring frame being removed from the cassette part of Figure 1. Figure 7 is a diagram showing an electronic component being seated on a ring frame in the attachment area. Figure 8 is a drawing showing an electronic component mounted on a ring frame being pushed up by a pusher of a heating unit. Specific details for implementing the invention

[0021] Hereinafter, specific embodiments for implementing the concept of the present invention will be described in detail with reference to the drawings.

[0022] In addition, in describing the present invention, if it is determined that a detailed description of related known components or functions may obscure the essence of the invention, such detailed description is omitted.

[0023] Furthermore, when it is mentioned that one component is 'connected,' 'supported,' or 'combined' with another component, it should be understood that while it may be directly connected, supported, or combined with that other component, there may also be other components present in between.

[0024] The terms used in this specification are used merely to describe specific embodiments and are not intended to limit the invention. Singular expressions include plural expressions unless the context clearly indicates otherwise.

[0025] Additionally, terms including ordinal numbers, such as first, second, etc., may be used to describe various components, but such components are not limited by such terms. These terms are used solely for the purpose of distinguishing one component from another.

[0026] The meaning of "comprising" as used in the specification is to specify certain characteristics, regions, integers, steps, actions, elements, and / or components, and does not exclude the existence or addition of other specific characteristics, regions, integers, steps, actions, elements, components, and / or groups.

[0027] In addition, it should be noted in advance that expressions such as front, back, left, and right in this specification are described based on the drawings, and may be expressed differently if the direction of the object changes. Meanwhile, the front-back direction in this specification is the direction in which L1 extends in FIG. 4, and the left-right direction is the direction in which L2 extends.

[0028] Hereinafter, a specific configuration of an electronic component test handler (1) according to an embodiment of the present invention will be described with reference to the drawings.

[0029] Referring to FIG. 1, an electronic component test handler (1) according to one embodiment of the present invention can electrically connect an electronic component (10) to a tester (not shown) to test the electronic component (10). Here, the electronic component (10) may be, for example, a die (DIE) in which one or more of memory elements and logic elements are stacked. The electronic component test handler (1) can separate the electronic component (10) from the ring frame (20), and when the test is completed, reattach it to the ring frame (20) and transfer it to another process. In addition, the electronic component test handler (1) can classify the electronic component (10) after the test is completed according to its state. This electronic component test handler (1) may include a cassette section (100), a pickup section (200), a separation module (300), a shuttle (400), a chuck (500), a picker module (600), a bridge section (700), a camera section (800), a bonding module (900), a test section (1000), and a stacker (1100).

[0030] Referring to FIGS. 2 and 3, the cassette section (100) may provide a space for receiving a ring frame (20) on which an electronic component (10) is mounted. A plurality of ring frames (20) may be loaded in this cassette section (100). Additionally, the cassette section (100) may include a loading cassette (110) on which a ring frame (20) on which an electronic component (10) to be tested is mounted may be loaded, and an unloading cassette (120) on which a ring frame (20) on which an electronic component (10) that has been tested is mounted may be loaded.

[0031] Meanwhile, a film may be provided on the ring frame (20). Multiple electronic components (10) may be placed on the film of the ring frame (20). Additionally, multiple electronic components (10) may be transported while placed on the ring frame (20).

[0032] The pickup unit (200) may include a first pickup unit (210) and a second pickup unit (220).

[0033] The first pickup unit (210) can take out the ring frame (20) from the loading cassette (110) and transfer it to the attachment area (A) (see FIG. 6). In addition, the first pickup unit (210) can take out the ring frame (20) from the loading cassette (110) and transfer it to the detach area (D). Alternatively, the first pickup unit (210) can transfer the ring frame (20) from the attachment area (A) or the detach area (D) and bring it into the cassette section (100). To this end, the first pickup unit (210) may include a grip section capable of gripping or releasing a portion of the ring frame (20). Here, the attachment area (A) refers to a space where the ring frame (20) to which the electronic component (10) is to be attached can be placed in order to attach the electronic component (10) to the ring frame (20). Additionally, the detach area (D) refers to a space where the ring frame (20) on which the electronic component (10) is mounted can be placed in order to separate the electronic component (10) from the ring frame (20).

[0034] Additionally, the first pickup unit (210) can pick up the electronic component (10) to separate it from the ring frame (20) in the detach area (D). In other words, the first pickup unit (210) can separate the electronic component (10) from the ring frame (20) by supporting and lifting the electronic component (10) that has been partially separated from the ring frame (20) by the separation module (300). This first pickup unit (210) can pick up the electronic component (10) through the grip portion described above. When the electronic component (10) is separated from the ring frame (20), this first pickup unit (210) can transfer the electronic component (10) to the first shuttle (410) described later. Additionally, the first pickup unit (210) can release the electronic component (10) and place it on the first shuttle (410). In this way, the first pickup unit (210) can separate the electronic components (10) from the ring frame (20) and transfer them to the first shuttle (410) by repeating the process a predetermined number of times, thereby allowing a plurality of electronic components (10) to be placed on the first shuttle (410).

[0035] Meanwhile, the first pickup unit (210) can pick up the electronic component (10) that has been tested and is placed on the second shuttle (420) described later, and transfer it to the ring frame (20) of the attachment area (A). Additionally, the first pickup unit (210) can release the electronic component (10) from the upper side of the ring frame (20) and place the electronic component (10) on the ring frame (20). The first pickup unit (210) can repeat the process of transferring the electronic component (10) from the second shuttle (420) and placing it on the ring frame (20) a predetermined number of times to place a plurality of electronic components (10) on the ring frame (20) of the attachment area (A).

[0036] The second pickup unit (220) can pick up one or more electronic components (10) from the first shuttle (410) and transfer them to the chuck (500), and can place one or more electronic components (10) on the chuck (500). The second pickup unit (220) can place the electronic components (10) at any position on the chuck. Additionally, the second pickup unit (220) can pick up the electronic components (10) that have completed testing from the chuck (500) and transfer them to the second shuttle (420), and can place one or more electronic components (10) on the second shuttle (420).

[0037] Referring again to FIG. 2, the separation module (300) can separate an electronic component (10) mounted on the upper surface of the ring frame (20). By adsorbing the bottom surface of the portion of the film of the ring frame (20) where the electronic component (10) is mounted through vacuum pressure, the separation module (300) can be attached to the portion of the film where the electronic component (10) is mounted. Additionally, the separation module (300) can apply heat to the film when the portion of the separation module (300) is attached to the film. In this way, when the film is heated, the physical state of the adhesive material between the film and the electronic component (10) is deformed so that the electronic component (10) can be easily separated from the film. Meanwhile, a pusher (320) protrudes from the end of the separation module (300) and pushes the portion of the film of the ring frame (20) on which the electronic component (10) is placed upward from the bottom, thereby allowing the edge of the electronic component (10) to be separated from the film. In other words, the separation module (300) can separate the electronic component (10) from the ring frame (20) by pushing the film on which the electronic component (10) is placed in a direction opposite to the direction in which the film is adsorbed by vacuum pressure. At this time, when a part of the electronic component (10) is separated from the film, the first pickup unit (210) can pick up the electronic component (10) and completely separate the electronic component (10) from the ring frame (20).

[0038] The shuttle (400) can move an electronic component (10) before testing from the detach area (D) to the chuck (500) and can move an electronic component (10) after testing from the chuck (500) to the attach area (A). Multiple shuttles (400) may be provided. Additionally, multiple shuttles (400) may include a first shuttle (410) and a second shuttle (420). The first shuttle (410) may include a first shuttle (410) that moves an electronic component (10) before testing from the detach area (D) to the chuck (500), and a second shuttle (420) that moves an electronic component (10) after testing from the chuck (500) to the attach area (A). Meanwhile, depending on the case, these multiple shuttles may all be operated to perform loading and unloading, or some may be operated to perform loading and the rest to perform unloading.

[0039] The chuck (500) can provide a space for the electronic component (10) to be placed, and the electronic component (10) transported through the second pickup unit (220) can be placed at any position on the chuck (500). This chuck (500) can move freely between the stage (S) and the test unit (1000). For example, the chuck (500) located on the stage (S) can move to the test unit (1000) when a plurality of electronic components (10) are placed in the correct position by the picker module (600). Also, when the test is completed, the chuck (500) located on the test unit (1000) can move to the stage (S). The movement distance and position of this chuck (500) can be controlled on a scale of several μm to approximately 10 μm, and as an example, it may be a probe station. Also, the chuck (500)

[0040] These chucks (500) may be provided in multiple numbers, and the multiple chucks (500) may include a first chuck (501) and a second chuck (502). These first chuck (501) and the second chuck (502) may be located on different stages (S). Accordingly, while an electronic component (10) arranged in a fixed position on the first chuck (501) is being tested in the test section (1000), an electronic component (10) may be placed at an arbitrary position on the second chuck (502). Additionally, at least a portion of the electronic component (10) placed at an arbitrary position on the second chuck (502) may be rearranged into a fixed position by the second chuck (500) and the picker module (600). While the electronic component (10) mounted on the first chuck (501) is being tested in the test section (1000), the electronic component (10) can be mounted on the second chuck (500). Additionally, when the electronic component (10) mounted on the first chuck (500) is moved to the stage (S) after the test is completed, the electronic component (10) mounted on the second chuck (500) can be moved to the test section (1000) and tested. In this way, the test efficiency can be improved by using multiple chucks (500). In this specification, the stage (S) may include a space where the electronic component (10) can be mounted on the chuck (500) through the second pickup unit (220) and a space where the electronic component (10) is rearranged on the chuck (500) through the picker module (600). These stages (S) may be provided in multiple numbers, and the multiple stages (S) may be in a space separate from the test section (1000).

[0041] Meanwhile, the chuck (500) can move relative to the picker module (600) to rearrange multiple electronic components (10). In other words, the chuck (500) can move a predetermined distance relative to the picker module (600) so that when the picker module (600) supports one of the multiple electronic components (10) placed at an arbitrary position, the supported electronic component (10) can be placed in the correct position. This movement of the chuck (500) can be configured to allow movement in the diagonal direction as well as in the forward, backward, left, and right directions relative to the picker module (600), and can also be configured to allow movement up and down. This includes moving up or down relative to the picker module (600). Meanwhile, the chuck (500) may be equipped with a sensing unit (510). This sensing unit (510) can recognize whether the chuck (500) is placed at the test position of the test section (1000). For example, the detection unit (510) may use a known sensor capable of determining whether it is in a straight line with the second camera (820) by working in conjunction with the camera or the second camera (820).

[0042] In this specification, an arbitrary position refers to an initial position in which a plurality of electronic components (10) are placed on a chuck (500) by a second pickup unit (220). Additionally, a fixed position is a position different from the arbitrary position and may be a position for electrically connecting the electronic components (10) to a tester. The arbitrary position and the fixed position on the chuck (500) may be provided in a number corresponding to the number of electronic components (10) placed on the chuck (500). Furthermore, some of the plurality of arbitrary positions and some of the plurality of fixed positions may overlap. For example, the arbitrary position of the first electronic component may overlap with the fixed position of the second electronic component.

[0043] A picker module (600) can support any one of a plurality of electronic components (10) located at an arbitrary position on the chuck (500) to arrange the plurality of electronic components (10) into a fixed position on the chuck (500). This picker module (600) is fixed to a frame, etc., to maintain its position. This picker module (600) may include a picker (610) and a picker camera (620).

[0044] The picker (610) can support any one of a plurality of electronic components (10) located at any position on the chuck (500). The picker (610) can support the electronic component (10) when the chuck (500) moves toward the picker (610) and the electronic component (10) approaches within a predetermined distance from the picker (610). Additionally, while the picker (610) is supporting any one of the plurality of electronic components (10) located at any position on the chuck (500), if the chuck (500) moves so that the supported electronic component (10) is positioned in the correct position, the picker (610) can release the support and place the electronic component (10) in the correct position on the chuck (500). The picker (610) can be fixed to the stage bridge (710) to be described later. These pickers (610) can be configured to support electronic components (10) by gripping, picking up, or adsorbing the electronic components (10).

[0045] The picker camera (620) can scan the electronic component (10) to obtain position information of the electronic component (10). For example, the picker camera (620) can scan another electronic component (10) placed at an arbitrary position while the picker (610) places one of the multiple electronic components (10) at a fixed position. The relative position of the picker camera (620) with respect to the picker (610) can be fixed. In other words, the picker (610) and the picker camera (620) can be spaced apart from each other by a predetermined distance so that when the picker (610) is located at one of the multiple fixed positions, the picker camera (620) is located at one of the multiple arbitrary positions.

[0046] Below, with reference to FIG. 4, a more detailed example of the process of rearranging a plurality of electronic components (10) using a chuck (500) and a picker module (600) is described.

[0047] The second pickup unit (220) can place a plurality of electronic components (10) onto the chuck (500) in a first position. Here, the first position means that a plurality of electronic components (10) are placed at an arbitrary position on the chuck (500) by the second pickup unit (220). In this way, a plurality of electronic components (10) can be placed from the first shuttle (410) to an arbitrary position on the chuck (500) by the second pickup unit (220). When such a plurality of electronic components (10) are placed at an arbitrary position on the chuck (500), the plurality of electronic components (10) can form a matrix array having a plurality of rows and a plurality of columns. Additionally, the picker camera (620) can scan an electronic component (10) placed on one side of an edge column among the plurality of electronic components (10) (for example, an electronic component (10) placed at a vertex position of the matrix array). Meanwhile, when a plurality of electronic components (10) are arranged in a matrix array, the plurality of electronic components (10) may be arranged asymmetrically in one of the directions of front, back, left, or right with respect to a center point (c). Here, the center point (c) is the point where an arbitrary first virtual line (L1) extending in the front-back direction on the chuck (500) and an arbitrary second virtual line (L2) extending in the left-right direction on the chuck (500) meet, and represents the center point of the chuck (500). For example, the first virtual line (L1) and the second virtual line (L2) may be orthogonal (see FIG. 4(a)).

[0048] According to one embodiment of the present invention, when a plurality of electronic components (10) are placed at any position on the chuck (500), the plurality of electronic components (10) may be arranged in a virtual matrix array. For example, the electronic components (10) may be arranged on the chuck (500) in a matrix array such as 4 x 8 or 8 x 8. As a more detailed example, when a plurality of electronic components (10) are placed at any position on the chuck (500), 40 electronic components (10) may be arranged in a 5 x 8 matrix array on one side (left side relative to L1 in FIG. 4) relative to the first virtual line (L1). Additionally, 24 electronic components (10) may be arranged in a 3 x 8 matrix array on the other side (right side relative to L1 in FIG. 4) relative to the first virtual line (L1). In this way, when a plurality of electronic components (10) are placed at any position on the chuck (500), the plurality of electronic components (10) can be arranged asymmetrically with respect to one or more of the first virtual line (L1) and the second virtual line (L2).

[0049] Meanwhile, when the picker camera (620) completes scanning of the electronic component (10), the chuck (500) can move forward, backward, left, and right based on the position information of the electronic component (10) obtained by the picker camera (620) so that the scanned electronic component (10) is positioned below the picker (610). Additionally, when the electronic component (10) is positioned directly below the picker (610), the chuck (500) moves up and down. In this way, when the raising and lowering of the chuck (500) is completed, the picker (610) can support the scanned electronic component (10) (see FIG. 4(b)).

[0050] When such a picker (610) supports an electronic component (10), the chuck (500) can move relative to the picker (610) so that the electronic component (10) supported by the picker (610) is positioned at an upright position on the chuck (500). Additionally, when the electronic component (10) supported by the chuck (500) moves to a position corresponding to the upright position on the chuck (500), the chuck (500) rises relative to the picker (610), and the picker (610) can release the support for the electronic component (10) and place it on the chuck (500) for secondary placement. Here, secondary placement means that the picker (610) places the electronic component (10) at an upright position, and the concept may include not only releasing the support for a single scanned electronic component (10) and placing it at an upright position on the chuck (500), but also placing all of multiple electronic components (10) at an upright position. Meanwhile, while the picker (610) is placing the electronic component (10), the picker camera (620) can scan another electronic component (10) among a plurality of electronic components (10) at an arbitrary position. As a more detailed example, while the picker (610) is placing the electronic component (10), the picker camera (620) can scan another electronic component (10) located diagonally adjacent to the electronic component (10) that has moved to the correct position among the plurality of electronic components (10) (see FIG. 4(c)). Here, the scanned other electronic component (10) may be the electronic component (10) placed at the closest position among the plurality of electronic components (10) located diagonally from the electronic component (10) that has moved to the correct position.

[0051] When the scanning of the picker camera (620) is completed, the chuck (500) can be moved so that another scanned electronic component (10) is positioned below the picker (610) based on the position information of the electronic component (10) obtained by the picker camera (620). In this way, when the movement of the chuck (500) is completed, the picker (610) can support the other scanned electronic component (10) (see FIG. 4(d)).

[0052] Additionally, the picker (610) supports another scanned electronic component (10) and the chuck (500) moves a predetermined distance, thereby allowing the other scanned electronic component (10) to move to a correct position. As described above, the chuck (500) and the picker module (600) can reorder multiple electronic components (10) to a correct position on the chuck (500) by repeating a secondary settling process of scanning multiple electronic components (10) and moving them to a correct position a predetermined number of times. Meanwhile, when multiple electronic components (10) are reordered to a correct position on the chuck, the multiple electronic components (10) are arranged symmetrically in all directions (front, back, left, and right) with respect to the center point (c). For example, when 64 electronic components (10) forming an 8 x 8 matrix array are positioned as shown in FIG. 4, the plurality of electronic components (10) are arranged so that they are symmetrical with respect to the first virtual line (L1), with 32 electronic components (10) on one side (left side with respect to L1 in FIG. 4) forming a 4 x 8 matrix array and 32 electronic components (10) on the other side (right side with respect to L1 in FIG. 4) forming a 4 x 8 matrix array. Additionally, the plurality of electronic components (10) are arranged so that they are symmetrical with respect to the second virtual line (L2), with 32 electronic components (10) on one side (front side with respect to L2 in FIG. 4) forming a 4 x 8 matrix array and 32 electronic components (10) on the other side (rear side with respect to L2 in FIG. 4) forming a 4 x 8 matrix array. Therefore, when multiple electronic components (10) are rearranged into their correct positions, they can be placed on the chuck (500) so as to be symmetrical in all directions (front, back, left, and right) with respect to the center point (c).

[0053] Thus, the reason for rearranging multiple electronic components (10) into the correct position so that they are symmetric in all directions (front, back, left, and right) with respect to the center point (center point (c)) of the chuck (500) is that the chuck (500) may undergo thermal expansion during heating, and if the chuck (500) undergoes thermal expansion, the distance between the multiple electronic components (10) and the distance from the center point (c) may change depending on the expansion of the chuck (500). In other words, if multiple electronic components (10) are arranged so that they are symmetric in all directions with respect to the center point (center point (c)) on the chuck (500) which expands uniformly in all directions, the distance between the multiple electronic components (10) increases at the same rate even if the chuck (500) expands, so that the multiple electronic components (10) can be precisely electrically connected to the tester at the correct position.

[0054] In addition, even if the movement of the electronic component (10) in devices such as the first pickup unit (210), the second pickup unit (220), and the shuttle (400) is precisely controlled, there is a possibility that an error may occur. In particular, the position of the electronic component (10) is very important for electrically connecting the electronic component (10) to the tester, and if an error occurs in the position of the electronic component (10), the reliability of the test result decreases. Therefore, in order to precisely adjust the position of the electronic component (10), the electronic component (10) is first placed at an arbitrary position on the chuck (500), and then a plurality of electronic components (10) are secondarily placed in the correct position through precise scanning of the electronic component (10) position and fine position adjustment of the picker module (600), thereby allowing the electronic component (10) to be accurately connected to the tester. In this way, by performing an additional step of rearranging the position of the electronic component (10) to the correct position in the middle, the reliability of the electronic component (10) test result can be improved.

[0055] The bridge section (700) may include a stage bridge (710) provided on the stage (S) and a test bridge (720) provided on the test section (1000). A picker module (600) may be supported on the stage bridge (710), and a second camera (820), which will be described later, may be provided on the test bridge (720).

[0056] The camera unit (800) may include a first camera (810), a second camera (820), and a third camera (830).

[0057] The first camera (810) is provided in the first pickup unit (210) and can acquire position information of the film of the ring frame (20). In addition, the first camera (810) can acquire position information of the electronic component (10) mounted on the film.

[0058] The second camera (820) can recognize whether the chuck (500) on which the electronic component (10) to be tested is mounted is positioned at the test location in the test section (1000). This second camera (820) can be provided on the test bridge (720).

[0059] A third camera (830) may be provided in the attachment area (A) and can acquire position information of an electronic component (10) picked up by the first pickup unit (210). When the electronic component (10) is picked up by the first pickup unit (210), the third camera (830) can acquire position information of the electronic component (10) from the lower side of the electronic component (10) because the first camera (810) cannot acquire position information of the electronic component (10). Additionally, the third camera (830) may also be provided in the detachment area (D) to acquire position information of the picked-up electronic component (10) when the first pickup unit (210) lifts the electronic component (10) from the ring frame (20) of the detachment area (D).

[0060] Referring again to FIG. 3, the adhesive module (900) can provide a space for the electronic component (10) to be attached to the ring frame (20). By adsorbing the portion of the film of the ring frame (20) where the electronic component (10) is to be placed through vacuum pressure, the adhesive module (900) can be attached to the portion of the film where the electronic component (10) is to be placed. Additionally, the adhesive module (900) can heat the entire film once the film is placed. In this way, when heat is applied to the film, the adhesive material of the film is deformed, allowing the film and the electronic component (10) to be easily attached. Therefore, when the adhesive module (900) adsorbs the portion of the film where the electronic component (10) is to be placed and heat is applied, and then the first pickup unit (210) places the electronic component (10) onto the film, the electronic component (10) can be attached to the film. This adhesive module (900) can raise the film before the first pickup unit (210) attaches the electronic component (10) to the film in order to assist the pickup unit (210) in placing the electronic component (10) onto the film (see FIG. 7). Once all the electronic components (10) are placed on the film, the first pickup unit (210) can pick up the ring frame (20) and place it on the unloading cassette (120).

[0061] The test section (1000) can provide a space where an electronic component (10) is connected to a tester and tested. A chuck (500) on which the electronic component (10) to be tested is mounted may be located in this test section (1000). A tester to perform testing of the electronic component (10) in the test section (1000) may be provided separately from the electronic component test handler (1). Meanwhile, the tester conducts the test when multiple electronic components (10) on the chuck (500) in the test section (1000) are arranged symmetrically in all directions (front, back, left, and right) with respect to the center point (c). In other words, the tester does not conduct the test if multiple electronic components (10) are arranged asymmetrically in any one direction (front, back, left, or right) with respect to the center point (c).

[0062] The stacker (1100) can provide a space for stacking electronic components (10) classified as defective. In other words, electronic components (10) classified as defective as a result of testing can be transferred to the stacker (1100) without being placed on the ring frame (20).

[0063] Meanwhile, below, with reference to FIG. 8, an exemplary configuration of a separation module (300) according to one embodiment of the present invention will be described in more detail. The separation module (300) according to this embodiment may include a heating unit (310) and a pusher (320).

[0064] The heating unit (310) can apply heat to the film so that the electronic component (10) can be easily separated from the film of the ring frame (20). When the film is heated by this heating unit (310), the physical state of the adhesive material between the film and the electronic component (10) in the heated portion can be deformed. For example, the adhesive material is a hard material at room temperature, but when heated by the heating unit (310), it can change into a viscous liquid. In this way, the electronic component (10) placed in the portion where the physical state of the adhesive material has been deformed by the heating unit (310) can be easily separated from the film even with a predetermined external force.

[0065] Meanwhile, the end of the heating unit (310) can adsorb the film to adhere the film to the end of the heating unit (310). For example, at least one vacuum hole (311) may be formed at the end of the heating unit (310) to form a vacuum. This vacuum hole (311) may be formed on the upper surface of the heating unit (310), and vacuum pressure may be formed inside the vacuum hole (311) and around the vacuum hole (311). In other words, the heating unit (310) may be in contact with the film of the ring frame (20) or positioned around the film, and can adsorb the film located around the end of the heating unit (310) through the vacuum pressure formed in the vacuum hole (311). In this way, the heating unit (310) can more effectively transfer heat to the film by adhering to the bottom surface of the part of the film of the ring frame (20) where the electronic component (10) is mounted through vacuum pressure.

[0066] The pusher (320) can assist in separating an electronic component (10) mounted on a film of a ring frame (20) from the film. This pusher (320) may be provided at one end of the heating unit (310) so as to be able to move up and down. In other words, the pusher (320) may be inserted inside the heating unit (310) or may protrude from the upper end of the heating unit (310). Additionally, the pusher (320) can separate a part of the electronic component (10) from the film by pushing up the portion of the film on which the electronic component (10) is mounted when the film is heated by the heating unit (310) and the adhesive material between the film and the electronic component (10) is deformed. For example, the pusher (320) can separate the film from the edge ring frame (20) of the electronic component (10) by pushing the film up in the opposite direction (e.g., the lower direction in FIG. 7) to the direction in which the film is adsorbed by vacuum pressure (e.g., the lower direction in FIG. 7) (e.g., the upper direction in FIG. 7).

[0067] When the edge of the electronic component (10) is separated from the film by the pusher (320), the electronic component (10) and the film can be completely separated by the first pickup unit (210) picking up the electronic component (10).

[0068] The operation and effects of an electronic component test handler (1) having the configuration described above will be explained below.

[0069] The user can electrically connect an electronic component (10) to a tester using an electronic component test handler (1). First, the user can use a first pickup unit (210) to eject a ring frame (20) from a loading cassette (110) and transfer it to a detachment area (D). Once the ring frame (20) is placed in the detachment area (D), the electronic component (10) can be separated from the ring frame (20) using a separation module (300) and a first pickup unit (210). The separated electronic component (10) can be transferred to a first shuttle (410) via the first pickup unit (210). The first shuttle (410) can transfer multiple electronic components (10) to a chuck (500) of a stage (S). At this time, when the first shuttle (410) reaches the vicinity of the chuck (500), the second pickup unit (220) can place a plurality of electronic components (10) at any position on the chuck (500).

[0070] When multiple electronic components (10) are placed at arbitrary positions on the chuck (500), the picker module (600) can rearrange the multiple electronic components (10) one by one into their correct positions. In this way, when multiple electronic components (10) are placed at their correct positions on the chuck (500), the chuck (500) can move to the test section (1000). The multiple electronic components (10) moved to the test section (1000) can be electrically connected to a tester and tested.

[0071] Meanwhile, when the test is completed, the chuck (500) returns to the stage (S), and the second pickup unit (220) can transfer the electronic component (10) that has completed the test to the second shuttle (420). The second shuttle (420) on which the electronic component (10) is placed can move to the attachment area (A). When the second shuttle (420) arrives at the attachment area (A), the first pickup unit (210) can discharge the ring frame (20) from the unloading cassette (120) and place it in the attachment area (A). Additionally, the first pickup unit (210) can transfer the electronic component (10) that has a good test condition as a result of the test to the attachment area (A) and place it on the ring frame (20) placed in the attachment area (A). At this time, the adhesive module (900) can adhere the electronic component (10) to the film of the ring frame (20) when the first pickup unit (210) places the electronic component (10).

[0072] An electronic component test handler (1) according to one embodiment of the present invention has the effect of increasing the operating efficiency of the electronic component test handler (1) by simultaneously testing one or more stacked electronic components (10). In addition, by improving the test precision of the electronic component (10), it has the effect of precisely classifying whether the condition of the electronic component (10) is good or bad.

[0073] Hereinafter, a method for testing electronic components using an electronic component test handler (1) according to one embodiment of the present invention is described.

[0074] A method for testing electronic components using an electronic component test handler (1) may include a detach step (S100), an electronic component transfer step before testing (S200), an electronic component rearrangement step (S300), a test step (S400), a test completion electronic component transfer step (S500), and an attach step (S600).

[0075] In the detachment step (S100), the ring frame (20) can be removed from the loading cassette (110), and the electronic component (10) can be separated from the ring frame (20). This detachment step (S100) may include a step for removing the ring frame for detachment (S110) and a step for separating the electronic component (S120).

[0076] In the detach ring frame removal step (S110), the detach ring frame (20) can be removed from the loading cassette (110) through the first pickup unit (210). Additionally, in the detach ring frame removal step (S110), the removed ring frame (20) can be placed in the detach area (D).

[0077] In the electronic component separation step (S120), a portion of the electronic component (10) can be separated from the film of the ring frame (20) through the separation module (300). In this electronic component separation step (S120), once the portion of the electronic component (10) is separated from the film, the electronic component (10) can be completely separated from the ring frame (20) through the first pickup unit (210).

[0078] In the pre-test electronic component transfer step (S200), the electronic component (10) to be tested can be transferred. This pre-test electronic component transfer step (S200) may include a step of transferring the electronic component to a shuttle (400) (S210), a step of transferring the shuttle (400) to near a stage (S220), and a step of transferring the electronic component to a chuck (S230).

[0079] In the step of transferring electronic components to a shuttle (S210), the first pickup unit (210) can transfer electronic components (10) separated from the ring frame (20) in the detach area (D) to the shuttle (400). This step of transferring electronic components to a shuttle (S210) can be repeated multiple times, and multiple electronic components (10) can be transferred to the shuttle (400).

[0080] In the step (S220) of transporting the shuttle (400) to the vicinity of the stage, the shuttle (400) on which a plurality of electronic components (10) are mounted can be transported to the vicinity of the stage (S). In the step (S220) of transporting the shuttle (400) to the vicinity of the stage, the shuttle (400) can be transported to one of the plurality of stages (S).

[0081] In the step of transferring electronic components to the chuck (S230), multiple electronic components (10) can be transferred to the chuck (500) from the shuttle (400) that has been transferred near the stage (S) via the second pickup unit (220). In the step of transferring electronic components to the chuck (S230), multiple electronic components (10) can be placed at any position on the chuck (500) via the second pickup unit (220).

[0082] In the electronic component rearrangement step (S300), multiple electronic components (10) placed at arbitrary positions on the chuck (500) can be rearranged to their correct positions. In this electronic component rearrangement step (S300), the electronic components (10) can be rearranged to their correct positions through the picker module (600).

[0083] In the test phase (S400), multiple electronic components (10) located in the correct positions can be connected to a tester and tested.

[0084] In the test-completed electronic component transfer step (S500), the test-completed electronic component can be transferred. This test-completed electronic component transfer step (S500) may include a step of transferring the electronic component to a second shuttle (S510) and a step of transferring the second shuttle to near an attachment area (S520).

[0085] In the step (S510) of transferring electronic components to the second shuttle, multiple electronic components (10) located on the chuck (500) after testing is completed can be transferred to the second shuttle (420) through the second pickup unit (220).

[0086] In the step (S520) of transporting the second shuttle to the vicinity of the attachment area, the second shuttle (420) on which a plurality of electronic components (10) are mounted can be transported to the vicinity of the attachment area (A).

[0087] In the attachment step (S600), among the multiple electronic components (10) for which testing has been completed, the electronic component (10) in good condition can be attached to the ring frame (20). This attachment step (S600) may include a ring frame removal step for attachment (S610) and an electronic component attachment step (S620).

[0088] In the attachment ring frame removal step (S610), the ring frame (20) can be removed from the unloading cassette (120) using the first pickup unit (210). Additionally, in the attachment ring frame removal step (S610), the removed ring frame (20) can be placed in the attachment area (A).

[0089] In the electronic component bonding step (S620), the electronic component (10) can be transferred from the second shuttle (420) onto the ring frame (20) of the attach area (A) using the first pickup unit (210). Additionally, when the electronic component (10) is transferred onto the ring frame (20), the electronic component (10) can be bonded to the ring frame (20) using the bonding module (900).

[0090] Although the embodiments of the present invention have been described above as specific embodiments, they are merely examples and the present invention is not limited thereto, but should be interpreted as having the broadest scope in accordance with the basic concept disclosed in this specification. Those skilled in the art may implement patterns of shapes not specified by combining or substituting the disclosed embodiments, and this also does not deviate from the scope of the present invention. Furthermore, those skilled in the art may easily modify or alter the disclosed embodiments based on this specification, and it is evident that such modifications or alterations also fall within the scope of the rights of the present invention. Explanation of the symbols

[0092] 1: Electronic component test handler 10: Electronic components 20: Ring frame 100: Cassette section 110: Loading cassette 120: Unloading cassette 200: Pickup Section 210: 1st Pickup Unit 220: Second pickup unit 300: Separation module 310: Heating section 311: Vacuum hole 320: Pusher 400: Shuttle 410: 1st Shuttle 420: 2nd Shuttle 500: Chuck 510: Detection Unit 600: Picker Module 610: Picker 620: Picker Camera 700: Bridge Section 710: Stage Bridge 720: Test Bridge 800: Camera Unit 810: 1st Camera 820: Second camera 830: Third camera 900: Adhesion Module 1000: Test Section 1100: Stacker S: Stage D: Detach area A: Attach area L1: 1st virtual line L2: 2nd virtual line C: Center point

Claims

Claim 1 A shuttle for moving electronic components; a first pickup unit capable of transporting electronic components before testing attached to a ring frame via the shuttle; a separation module that assists in separating electronic components from a ring frame when the first pickup unit picks up electronic components from the ring frame; a chuck providing a space for the electronic components to be placed; a second pickup unit capable of picking up electronic components before testing from the shuttle and transporting them to the chuck on a stage; a picker module capable of picking up electronic components placed at any position on the chuck by the second pickup unit to rearrange the electronic components to a correct position on the chuck; and a test section providing a space for the electronic components placed on the chuck to be connected to and tested; wherein the chuck may be located in the test section, and when the electronic components are placed in a correct position by the picker module, they move from the stage to the test section, and the separation module includes a heating section that applies heat to a film so that the electronic components can be easily separated from the film of the ring frame. An electronic component test handler comprising: a pusher that pushes up the portion on which the electronic component is mounted to assist in separating the electronic component mounted on the film of the ring frame from the film, wherein the pusher is provided at one end of the heating part so as to be able to move up and down. Claim 2 An electronic component test handler according to claim 1, wherein at least one vacuum hole is formed at the end of the heating part to form a vacuum. Claim 3 A separation module for an electronic component test handler comprising: a heating unit that applies heat to a film so that the electronic component can be easily separated from the ring frame when the pickup unit picks up the electronic component from the ring frame; and a pusher that pushes up the portion on which the electronic component is placed to assist in separating the electronic component placed on the film of the ring frame from the film, wherein the pusher is provided at one end of the heating unit so as to be able to move up and down. Claim 4 A separation module for an electronic component test handler according to claim 3, wherein at least one vacuum hole is formed at the end of the heating part to form a vacuum.

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