Water-proof housing assembly and electronic device including the same

Abstract

An electronic device according to various embodiments disclosed in this document may include a frame forming at least a portion of the exterior of the electronic device, a seating portion formed concavely in a first direction at a position spaced apart from the outer surface of the frame, a first adhesive member attached to the seating portion and comprising a cushion layer, a support member received in the seating portion in the first direction and attached to the first adhesive member, a second adhesive member attached to the support member, and a cover member forming the exterior of the electronic device and disposed on the second adhesive member in a second direction opposite to the first direction, such that the position relative to the support member is fixed by the second adhesive member. Various other embodiments may also be possible.

Description

Technology Field

[0001] The various embodiments disclosed in this document relate to a housing assembly having a waterproof function and an electronic device including the same. Background Technology

[0003] A housing assembly that supports various components included in an electronic device and forms the exterior of the electronic device may include a plurality of pieces. The plurality of pieces included in the housing assembly may be secured to each other by various joining methods, such as a hook method, a taping method, a bonding method, a welding method, an insert joining method, etc.

[0004] Meanwhile, in response to user demand, the number of electronic devices including waterproofing functions has recently been increasing. Accordingly, the bonding method of the housing assembly is also adopting a method capable of achieving waterproofing. The problem to be solved

[0006] For example, the components of a housing assembly can be interconnected using an adhesive member capable of achieving a waterproof function. The waterproof adhesive member can block moisture or foreign substances entering from the outside, thereby forming a waterproof space inside the electronic device.

[0007] These adhesive members may include a cushion layer formed of an elastic material to implement a waterproof function. In order to bond and fix the components using the adhesive member including the cushion layer, a compression process of the adhesive member may be required. In this compression process, a gap is required for the two components to be compressed, and this gap may form a step difference on the exterior of the electronic device.

[0008] Various embodiments disclosed in this document may provide a housing assembly that reduces the external step of an electronic device while using an adhesive member that includes a waterproof function, and an electronic device including the same. means of solving the problem

[0010] An electronic device according to various embodiments disclosed in this document may include a frame forming at least a portion of the exterior of the electronic device, a seating portion formed concavely in a first direction at a position spaced apart from the outer surface of the frame, a first adhesive member attached to the seating portion and comprising a cushion layer, a support member received in the seating portion in the first direction and attached to the first adhesive member, a second adhesive member attached to the support member, and a cover member forming the exterior of the electronic device and disposed on the second adhesive member in a second direction opposite to the first direction, such that the position relative to the support member is fixed by the second adhesive member.

[0011] A housing assembly according to various embodiments disclosed in this document may include a frame, a seating portion formed concavely in a first direction at a position spaced apart from the outer surface of the frame, a first adhesive member attached to the seating portion and comprising a cushion layer, a support member received in the seating portion in the first direction and attached to the first adhesive member, a second adhesive member attached to the support member, and a cover member that forms the exterior of the electronic device and is disposed on the second adhesive member in a second direction opposite to the first direction, such that the position relative to the support member is fixed by the second adhesive member. Effects of the invention

[0013] According to the various embodiments disclosed in this document, the external step of an electronic device including a waterproof function can be reduced, thereby improving the aesthetic appeal of the electronic device. In addition, various problems caused by the step can be reduced, thereby improving the durability of the electronic device. Brief explanation of the drawing

[0015] In relation to the description of the drawings, the same or similar reference numerals may be used for identical or similar components. FIG. 1 is a block diagram of an electronic device in a network environment according to various embodiments. FIG. 2a is a front perspective view of an electronic device according to various embodiments disclosed in this document. FIG. 2b is a rear perspective view of the electronic device of FIG. 2a according to various embodiments disclosed in this document. FIG. 3 is an exploded perspective view of an electronic device according to various embodiments disclosed in this document. FIG. 4a is a cross-sectional view of an adhesive member not including a cushion layer according to various embodiments disclosed in this document. FIG. 4b is a cross-sectional view of an adhesive member including a cushion layer according to various embodiments disclosed in this document. FIG. 5 is a drawing for explaining an electronic device including an adhesive member including a cushion layer. FIG. 6a is a perspective view of a portion of the rear of an electronic device according to various embodiments disclosed in this document. FIG. 6b is an exploded perspective view of the electronic device shown in FIG. 6a. FIG. 6c is a cross-sectional view of the electronic device shown in FIG. 6a cut along line AA. FIGS. 7a through 7d are drawings for illustrating the assembly process of an electronic device according to various embodiments disclosed in this document. FIG. 8 is a cross-sectional view illustrating the assembly process of an electronic device according to various embodiments disclosed in this document. Specific details for implementing the invention

[0016] FIG. 1 is a block diagram of an electronic device (101) in a network environment (100) according to various embodiments. Referring to FIG. 1, in the network environment (100), the electronic device (101) may communicate with an electronic device (102) through a first network (198) (e.g., a short-range wireless communication network) or with an electronic device (104) or a server (108) through a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) through a server (108). According to one embodiment, the electronic device (101) may include a processor (120), memory (130), input module (150), sound output module (155), display module (160), audio module (170), sensor module (176), interface (177), connection terminal (178), haptic module (179), camera module (180), power management module (188), battery (189), communication module (190), subscriber identification module (196), or antenna module (197). In some embodiments, at least one of these components (e.g., connection terminal (178)) may be omitted from the electronic device (101), or one or more other components may be added. In some embodiments, some of these components (e.g., sensor module (176), camera module (180), or antenna module (197)) may be integrated into a single component (e.g., display module (160)).

[0017] The processor (120) can control at least one other component (e.g., hardware or software component) of the electronic device (101) connected to the processor (120) by executing software (e.g., program (140)), and can perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (120) can store commands or data received from other components (e.g., sensor module (176) or communication module (190)) in volatile memory (132), process the commands or data stored in volatile memory (132), and store the resulting data in non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., central processing unit or application processor) or an auxiliary processor (123) that can operate independently or together with it (e.g., graphics processing unit, neural processing unit (NPU), image signal processor, sensor hub processor, or communication processor). For example, if the electronic device (101) includes a main processor (121) and an auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a designated function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as part thereof.

[0018] The auxiliary processor (123) may control at least some of the functions or states associated with at least one component of the electronic device (101) (e.g., display module (160), sensor module (176), or communication module (190)) on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (123) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (180) or communication module (190)). According to one embodiment, the auxiliary processor (123) (e.g., neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, on the electronic device (101) itself where the artificial intelligence is performed, or through a separate server (e.g., server (108)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers.An artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may include a software structure, either additionally or substantially.

[0019] The memory (130) can store various data used by at least one component of the electronic device (101) (e.g., processor (120) or sensor module (176)). The data may include, for example, input data or output data for software (e.g., program (140)) and related commands. The memory (130) may include volatile memory (132) or non-volatile memory (134).

[0020] The program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0021] The input module (150) can receive commands or data to be used for a component of the electronic device (101) (e.g., processor (120)) from outside the electronic device (101) (e.g., user). The input module (150) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0022] The sound output module (155) can output a sound signal to the outside of the electronic device (101). The sound output module (155) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback. The receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0023] The display module (160) can visually provide information to an external (e.g., user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by said touch.

[0024] The audio module (170) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150) or output sound through the sound output module (155) or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphones) connected directly or wirelessly to the electronic device (101).

[0025] The sensor module (176) can detect the operating state of the electronic device (101) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (176) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0026] The interface (177) may support one or more specified protocols that can be used for the electronic device (101) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (102)). According to one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0027] The connection terminal (178) may include a connector through which the electronic device (101) can be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0028] The haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module (179) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0029] The camera module (180) can capture still images and video. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0030] The power management module (188) can manage the power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0031] The battery (189) can supply power to at least one component of the electronic device (101). According to one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0032] The communication module (190) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may include one or more communication processors that operate independently of the processor (120) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (194) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device (104) through a first network (198) (e.g., a short-range communication network such as Bluetooth, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (199) (e.g., a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can identify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (196).

[0033] The wireless communication module (192) can support 5G networks and next-generation communication technologies following 4G networks, for example, new radio access technology. NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (192) can support a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate, for example. The wireless communication module (192) can support various technologies for securing performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), external electronic device (e.g., electronic device (104)), or network system (e.g., second network (199)). According to one embodiment, the wireless communication module (192) can support a Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mMTC, or U-plane latency (e.g., downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) for realizing URLLC.

[0034] An antenna module (197) can transmit a signal or power to or from an external source (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (198) or a second network (199), may be selected from the plurality of antennas, for example, by a communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module (197).

[0035] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the specified high frequency band.

[0036] At least some of the above components can be connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., commands or data) with each other.

[0037] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) through a server (108) connected to a second network (199). Each of the external electronic devices (102, or 104) may be the same or different type of device as the electronic device (101). According to one embodiment, all or part of the operations performed on the electronic device (101) may be performed on one or more of the external electronic devices (102, 104, or 108). For example, if the electronic device (101) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (101) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (101) may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device (104) or the server (108) may be included within a second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0039] FIG. 2a is a front perspective view of an electronic device (200) according to various embodiments disclosed in this document. FIG. 2b is a rear perspective view of the electronic device (200) of FIG. 2a according to various embodiments disclosed in this document.

[0040] The electronic device (200) of FIGS. 2a and 2b may be at least partially similar to the electronic device (101) of FIG. 1, or may include other embodiments of the electronic device.

[0041] Referring to FIG. 2a and FIG. 2b, an electronic device (200) according to one embodiment may include a housing (210) comprising a first surface (or front) (210A), a second surface (or rear) (210B), and a side (210C) surrounding the space between the first surface (210A) and the second surface (210B). In other embodiments (not shown), the housing (210) may refer to a structure forming some of the first surface (210A), the second surface (210B), and the side (210C). According to one embodiment, the first surface (210A) may be formed by a front plate (202) (e.g., a glass plate or a polymer plate including various coating layers) in which at least a portion is substantially transparent. The second surface (210B) may be formed by a rear plate (211) that is substantially opaque. The rear plate (211) may be formed, for example, by coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials. The side (210C) may be formed by a side bezel structure (or "side member") (218) comprising metal and / or polymer, which is combined with the front plate (202) and the rear plate (211). In some embodiments, the rear plate (211) and the side bezel structure (218) may be formed integrally and may comprise the same material (e.g., a metallic material such as aluminum).

[0042] In the illustrated embodiment, the front plate (202) may include a first region (210D) that curves seamlessly from the first surface (210A) toward the rear plate at both ends of the long edge of the front plate. In the illustrated embodiment (see FIG. 2b), the rear plate (211) may include a second region (210E) that curves seamlessly from the second surface (210B) toward the front plate at both ends of the long edge. In some embodiments, the front plate (202) or the rear plate (211) may include only one of the first region (210D) or the second region (210E). In some embodiments, the front plate (202) may not include the first region and the second region, but may include only a flat plane positioned parallel to the second surface (210B). In the above embodiments, when viewed from the side of the electronic device, the side bezel structure (218) may have a first thickness (or width) on the side that does not include the first region (210D) or the second region (210E) as above, and may have a second thickness that is thinner than the first thickness on the side that includes the first region or the second region.

[0043] According to one embodiment, the electronic device (200) may include at least one of a display (201), an input device (203), an acoustic hole (207, 214), a sensor module (204, 219), a camera module (212, 213), a key input device (217), an indicator (not shown), and a connector (208). In some embodiments, the electronic device (200) may omit at least one of the components (e.g., a key input device (217), or an indicator) or additionally include other components.

[0044] The display (201) may be visually exposed, for example, through a significant portion of the front plate (202). In some embodiments, at least a portion of the display (201) may be visually exposed through the front plate (202) forming the first surface (210A) and the first area (210D) of the side (210C). The display (201) may be combined with or placed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of the touch, and / or a digitizer that detects a magnetic field-type stylus pen. In some embodiments, at least a portion of the sensor module (204, 219) and / or at least a portion of the key input device (217) may be placed in the first area (210D) and / or the second area (210E).

[0045] The input device (203) may include a microphone. In some embodiments, the input device (203) may include a plurality of microphones positioned to detect the direction of sound. Acoustic holes (207, 214) may be connected to speakers. In some embodiments, the microphone, speakers, and connector (208) are positioned in the space of the electronic device (200) and may be exposed to the external environment through at least one acoustic hole (207, 214) formed in the housing (210). In some embodiments, the acoustic hole (207, 214) formed in the housing (210) may be used for both the microphone and the speakers. In some embodiments, the acoustic output device may include a speaker (e.g., a piezo speaker) that operates with the hole formed in the housing (210) excluded.

[0046] The sensor module (204, 219) can generate an electrical signal or data value corresponding to an internal operating state of the electronic device (200) or an external environmental state. The sensor module (204, 219) may include, for example, a first sensor module (204) (e.g., proximity sensor) and / or a second sensor module (not shown) (e.g., fingerprint sensor) disposed on a first surface (210A) of the housing (210), and / or a third sensor module (219) (e.g., HRM sensor) disposed on a second surface (210B) of the housing (210). The fingerprint sensor may be disposed on the first surface (210A) of the housing (210). The fingerprint sensor (e.g., ultrasonic or optical fingerprint sensor) may be disposed below the display (201) on the first surface (210A). The electronic device (200) may further include at least one of an unillustrated sensor module, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor (204).

[0047] The camera module (212, 213) may include a first camera device (not shown) disposed on a first surface (210A) of the electronic device (200), a second camera device (212) disposed on a second surface (210B), and / or a flash (213). The camera module (212) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (213) may include, for example, a light-emitting diode or a xenon lamp. In some embodiments, two or more lenses (wide-angle and telephoto lenses) and image sensors may be disposed on one surface of the electronic device (200).

[0048] A key input device (217) may be placed on the side (210C) of the housing (210). In another embodiment, the electronic device (200) may not include some or all of the aforementioned key input devices (217), and the key input device (217) not included may be implemented in other forms, such as soft keys, on the display (201). In another embodiment, the key input device (217) may be implemented using a pressure sensor included in the display (201).

[0049] An indicator may be placed, for example, on a first surface (210A) of a housing (210). The indicator may, for example, provide status information of an electronic device (200) in the form of light. In another embodiment, a light-emitting element may, for example, provide a light source that is coupled with the operation of a camera module (212). The indicator may include, for example, an LED, an IR LED, and a xenon lamp.

[0050] The connector hole (208) may include a first connector hole (208) capable of accommodating a connector (e.g., a USB connector or an IF module (interface connector port module)) for transmitting and receiving power and / or data with an external electronic device, and / or a second connector hole (or earphone jack) capable of accommodating a connector for transmitting and receiving audio signals with an external electronic device.

[0051] Some of the camera modules (212), some of the sensor modules (204, 219), or indicators may be positioned to be exposed through the display (201). For example, the camera module, sensor module (204), or indicator may be positioned to be in contact with the external environment through an opening or a transparent area (205) perforated from the internal space of the electronic device (200) to the front plate (202) of the display (201). According to one embodiment, the camera hole (205) facing the display (201) and the camera module may be formed as a transparent area having a certain transmittance as part of the area for displaying content. According to one embodiment, the transparent area may be formed to have a transmittance in the range of about 5% to about 20%. Such a transparent area may include an area that overlaps with the effective area (e.g., field of view area) of the camera module through which light passes to form an image and generate an image by being formed by an image sensor. For example, the transparent area of ​​the display (201) may include an area with a lower pixel density than the surrounding area. For example, the transparent area may replace the opening. For example, the camera module may include an under-display camera (UDC). In another embodiment, some sensor modules (204) may be positioned to perform their functions without being visually exposed through the front plate (202) within the internal space of the electronic device. For example, in this case, the perforated opening may be unnecessary for the area of ​​the display (201) facing the sensor modules.

[0053] FIG. 3 is an exploded perspective view of an electronic device according to various embodiments disclosed in this document.

[0054] The electronic device (300) of FIG. 3 may be at least partially similar to the electronic device (101) of FIG. 1 and / or the electronic device (200) of FIG. 2a, or may include other embodiments of the electronic device.

[0055] Referring to FIG. 3, an electronic device (300) (e.g., the electronic device (101) of FIG. 1 or the electronic device (200) of FIG. 2a) may include a side member (310) (e.g., the side bezel structure (218) of FIG. 2a), a support member (311) (e.g., a bracket or support structure), a front cover (320) (e.g., the front plate (202) of FIG. 2a), a display (330) (e.g., the display (201) of FIG. 2a), at least one substrate (341, 342) (e.g., a printed circuit board (PCB), a flexible PCB (FPCB), or a rigid-flexible PCB (R-FPCB)), a battery (350), at least one additional support member (361, 362) (e.g., a rear case), an antenna (370), and a rear cover (380) (e.g., the rear plate (211) of FIG. 2b). In some embodiments, the electronic device (300) may omit at least one of the components (e.g., a support member (311), or at least one additional support member (361, 362)) or additionally include other components. At least one of the components of the electronic device (300) may be identical or similar to at least one of the components of the electronic device (101) of FIG. 1 or the electronic device (200) of FIG. 2a, and redundant descriptions may be omitted.

[0056] According to various embodiments, the side member (310) may include a first surface (3101) facing a first direction (e.g., z-axis direction), a second surface (3102) facing in a direction opposite to the first surface (3101), and a side (3103) surrounding the space between the first surface (3101) and the second surface (3102) (e.g., the internal space (401) in FIG. 6b). According to one embodiment, at least a portion of the side (3103) may form the exterior of the electronic device. According to one embodiment, the support member (311) may be positioned in such a way that it extends from the side member (310) toward the internal space of the electronic device (300) (e.g., the internal space (401) in FIG. 6b). In some embodiments, the support member (311) may be positioned separately from the side member (310). According to one embodiment, the side member (310) and / or the support member (311) may be formed of, for example, a metal material and / or a non-metal material (e.g., a polymer). According to one embodiment, the support member (311) may support at least a portion of the display (330) through a first surface (3101) and may be positioned to support at least a portion of at least one substrate (341, 342) and / or a battery (350) through a second surface (3102). According to one embodiment, the at least one substrate (341, 342) may include a first substrate (341) (e.g., a main substrate) positioned on one side relative to the battery (350) and a second substrate (342) (e.g., a sub-substrate) positioned on the other side within the internal space of the electronic device (300). According to one embodiment, the first substrate (341) and / or the second substrate (342) may include a processor, memory, and / or an interface. According to one embodiment, the processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. According to one embodiment, the memory may include, for example, volatile memory or non-volatile memory.According to one embodiment, the interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may, for example, electrically or physically connect the electronic device (300) to an external electronic device and may include a USB connector, an SD card / MMC connector, or an audio connector. According to one embodiment, the battery (350) is a device for supplying power to at least one component of the electronic device (300) and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (350) may be disposed substantially coplanar with, for example, at least one substrate (341, 342). According to one embodiment, the battery (350) may be disposed in a manner embedded in the electronic device (300). In some embodiments, the battery (350) may be disposed detachably from the electronic device (300).

[0057] According to various embodiments, the antenna (370) may be positioned between the rear cover (380) and the battery (350). According to one embodiment, the antenna (370) may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna (370) may, for example, communicate near-field with an external device or wirelessly transmit and receive power required for charging. In some embodiments, the antenna may be formed by a part or a combination thereof of the side member (310) and / or the support member (311). In some embodiments, the electronic device (300) may further include a digitizer for detecting an external electronic pen.

[0059] The electronic device and the housing assembly of the electronic device described below may be the electronic device (101, 200, 300) described in FIG. 1, FIG. 2a, FIG. 2b, and FIG. 3.

[0060] A housing assembly can be understood as a collective term for components that form the exterior of an electronic device and form or support a space in which various electrical components (electronic parts) and mechanical components included in the electronic device are placed. Here, “electrical component” may mean a component that includes at least one active or passive component and operates by receiving an electrical signal (e.g., control signal, power). The electrical component may include, for example, an electronic component and a printed circuit board (PCB) (481, 482) on which the electronic component is placed. Additionally, “mechanical component” may mean a component other than the electrical component, and may mean various components that assist in supporting the electrical component (e.g., bracket, plate, mold structure, and / or sealing structure).

[0061] Before proceeding with the explanation, the directions mentioned below will be defined. In the following description, the first direction may refer to the front direction of the electronic device. To illustrate with drawings, the first direction may be the +Z direction of FIG. 2a. In the following description, the second direction may refer to the rear direction of the electronic device. To illustrate with drawings, the second direction may be the -Z direction of FIG. 2a.

[0062] FIG. 4a is a cross-sectional view of an adhesive member not including a cushion layer according to various embodiments disclosed in this document. FIG. 4b is a cross-sectional view of an adhesive member including a cushion layer according to various embodiments disclosed in this document. FIG. 5 is a drawing for describing an electronic device including an adhesive member including a cushion layer. FIG. 6a is a perspective view of a portion of the rear surface of an electronic device according to various embodiments disclosed in this document. FIG. 6b is an exploded perspective view of the electronic device shown in FIG. 6a. FIG. 6c is a cross-sectional view of the electronic device shown in FIG. 6a cut along line AA.

[0063] According to various embodiments, the housing assembly may include a frame (610), a support member (630), an internal member, and a cover member (620). The components of the housing assembly described above are merely examples, and the components of the housing assembly may be varied in many ways.

[0064] The housing assembly can be formed from various materials. For example, it can be formed from various materials such as metal, metal alloy, carbon, synthetic resin, glass, and composite materials. When the housing assembly is composed of multiple components joined or connected to each other, the components constituting the housing assembly may be formed from the same material or different materials.

[0065] Multiple components included in the housing assembly can be joined together in various ways. For example, multiple components can be joined together by an adhesive member (410, 420) having adhesive properties. The adhesive member (410, 420) can be composed of multiple layers.

[0066] Referring to FIG. 4a, a general adhesive member (420) may include a structure in which adhesive layers (421, 422) are disposed on both sides of a base layer (423) made of a synthetic resin material (e.g., PET, PU). Referring to FIG. 4b, in the case of an adhesive member (410) that includes a waterproof function, a cushion layer (414) may be laminated on one side of the base layer (423). The adhesive layers (411, 412) may be laminated on the other side of the base layer (423) and one side of the cushion layer (414), respectively. The cushion layer (414) allows the adhesive member (410) to contract or restore, thereby blocking foreign substances or moisture that may enter between the components bonded by the adhesive member (410). An adhesive member (410) including the cushion layer (414) may require a compression process for bonding the adhesive member (410). The compression process can be understood as a process of compressing the components and the adhesive member (410) so that the adhesive layers (411, 412) included in the adhesive member (410) and the components joined by the adhesive member (410) can be attached with sufficient adhesive force. In the case of the adhesive member (410) including a cushion layer (414), the cushion layer (414) may be deformed during the compression process. Therefore, since the compression process is performed taking into account the deformation of the cushion layer (414), a larger compression displacement (change in distance between the two components attached to the adhesive member during the compression process) may be required compared to the adhesive member (420) that does not include a cushion layer (414). In the case of the adhesive member (420) that does not include a cushion layer (414), the compression process is not required, or sufficient adhesion can be achieved with only a smaller compression displacement. In the following, in order to distinguish the adhesive members based on the presence or absence of the cushion layer (414), the adhesive member including the cushion layer (414) is referred to as the first adhesive member (410), and the adhesive member not including the cushion layer (414) is referred to as the second adhesive member (420). Since the first adhesive member (410) includes the cushion layer (414), it can be formed thicker than the second adhesive member (420).In one embodiment, the first adhesive member (410) may be an adhesive member formed with a thickness of about 2 mm to about 5 mm. In one embodiment, the second adhesive member (420) may be an adhesive member formed with a thickness of about 0.01 mm to about 1.5 mm.

[0067] According to various embodiments, as illustrated in FIG. 6b, the first adhesive member (410) may be formed in a closed loop shape to ensure the waterproof function of the electronic device (600). Since external moisture and foreign substances may not enter the space (401) enclosed by the first adhesive member (410), various components of the electronic device (600) can be placed in the space enclosed by the first adhesive member (410) to achieve a waterproof function.

[0068] As illustrated in FIG. 5, when two components (510, 520) forming the exterior of an electronic device are bonded together with a first adhesive member (410), a gap (S1) may be required between the two components (510, 520) in consideration of the compression process. This gap (S1) can be determined by the minimum compression displacement required in the compression process. The two components (510, 520) come close to each other during the compression process, and after the compression process is completed and the first adhesive member (410) is restored, a step (W1) equal to the gap may be formed between the two components (510, 520). This step (W1) may detract from the aesthetic appeal of the electronic device. Additionally, foreign substances may enter the step (W1). Foreign substances introduced into the step (W1) may become fixed or increase in volume due to moisture, thereby increasing the physical distance between the two components and weakening the bonding force between the components.

[0069] In the various embodiments disclosed in this document, a housing assembly can be provided that reduces the step (W1) between components (510, 520) as shown in FIG. 5 while achieving a waterproof function using a first adhesive member (410).

[0070] Referring to FIGS. 6a through 6c, the frame (610) may constitute at least a portion of the side exterior of the electronic device (600). A seating portion (611) may be formed in the frame (610). As shown in FIG. 6c, the seating portion (611) may include a recess formed concavely at a position spaced apart in one direction from the outer surface of the frame (610). The seating portion (611) may include a portion formed concavely in a first direction (e.g., the -Z direction in FIG. 6b and FIG. 6c). Since the seating portion (611) is formed concavely at a position spaced apart from the outer surface of the frame (610), it may be formed in a shape surrounded by a part of the frame (610). The part of the frame (610) surrounding the seating portion (611) is referred to as a frame partition (610A). In one embodiment, the frame bulkhead (610A), which is part of the frame (610) surrounding the seating portion (611), may be referred to as a side wall. For example, the frame bulkhead (610A) (or frame side wall) may be formed such that at least a portion surrounds the seating portion (611) and protrudes from the seating portion (611) in a second direction (e.g., the +Z direction in FIG. 6c).

[0071] Referring to FIGS. 6b and 6c, an internal member (650) may be disposed in the inner direction of the frame (610). The frame (610) and the internal member (650) may form a camera mounting portion (613) that accommodates a camera module (700) included in the electronic device (600). The camera mounting portion (613) formed in the frame (610) and the internal member (650) may be formed in a shape corresponding to the outer shape of the camera module (700) (e.g., the camera module (180) of FIG. 1) to support the camera module (700) accommodated in the camera mounting portion (613).

[0072] In one embodiment, the first adhesive member (410) may be adhered to the seating portion (611) and the internal member (650). Referring to FIG. 6c, the first adhesive member (410) adhered to the seating portion (611) may be partially obscured by the frame partition (610A). For example, the height of the frame partition (610A) may be formed to be greater than the thickness of the first adhesive member (410) so that the first adhesive member (410) is obscured by the frame partition (610A) in the lateral direction (e.g., the -X direction in FIG. 6c).

[0073] As illustrated in FIG. 6c, a support member (630) positioned in a second direction (e.g., the +Z direction in FIG. 6c) with respect to the frame (610) can be fixed to the frame (610) by means of a first adhesive member (410) attached to the seating portion (611) and the internal member (650). Referring to FIG. 6c, one side of the first adhesive member (410) is attached to the seating portion (611) and the internal member (650) of the frame (610), and the other side of the first adhesive member (410) can be attached to the support member (630). Meanwhile, as illustrated in FIG. 6c, the other side of the first adhesive member (410) can also be attached to a rear cover (670) that constitutes at least a part of the rear exterior of the electronic device (600).

[0074] In one embodiment, a gap space (S2) may be formed between the seating portion (611) and the support member (630) that are bonded by the first adhesive member (410). This gap space (S2) may be a space for a compression process to press the first adhesive member (410) so that the first adhesive member (410) can be stably bonded to the seating portion (611) and the support member (630). The first adhesive member (410) may be compressed so that the first adhesive member (410) can be bonded to the seating portion (611) and the support member (630) with sufficient adhesive force. Since the first adhesive member (410) may be compressed during this compression process, a gap space (S2) may be required between the seating portion (611) and the support member (630) so that the seating portion (611) and the support member (630) do not interfere with each other due to this compression.

[0075] Referring to FIG. 6c, the gap space (S2) between the mounting portion (611) and the support member (630) can be covered from the side by the frame partition (610A). Therefore, the gap space (S2) between the mounting portion (611) and the support member (630) may not be visible from the outside of the electronic device (600). Additionally, since the mounting portion (611) and the support member (630) are joined together by a first adhesive member (410) including a cushion layer (414), foreign substances and moisture entering between the mounting portion (611) and the support member (630) can be blocked by the first adhesive member (410).

[0076] In one embodiment, the cover member (620) may be positioned on the support member (630) in a second direction so as to cover the support member (630). The cover member (620) and the support member (630) may be joined by a second adhesive member (420). The second adhesive member (420) is an adhesive member (420) without a cushion layer (414), so that a compression process for bonding the second adhesive member (420) is not required, or the compression process can be performed with a very small compression displacement. For example, the second adhesive member (420) may be an adhesive member having a thinner thickness than the first adhesive member (410). Accordingly, the gap between the cover member (620) and the support member (630) may be smaller than the gap between the support member (630) and the frame (610). Therefore, no spacing (S3) is required between the cover member (620) and the support member (630), or only a very small amount of spacing may be required. For example, the distance (S3) between the cover member (620) and the support member (630) may be smaller than the distance (S2) between the support member (630) and the seating portion (611).

[0077] The support member (630) and the cover member (620) are joined by a second adhesive member (420) that does not require a compression process, and the support member (630) is placed in a seating portion (611) that is concavely formed in the frame (610), so that the step (W2) between the frame partition (610A) and the cover member (620) can be reduced compared to the case described in FIG. 5 (step (W1) between the two components (510, 520)). By reducing the step (W2) between the frame (610) and the cover member (620) that form the appearance of the electronic device (600), the aesthetics of the electronic device (600) can be improved. In addition, it may be difficult for foreign substances to enter between the cover member (620) and the frame (610).

[0078] In one embodiment, a portion (631) of the support member (630) adjacent to the frame bulkhead (610A) may be formed with a thinner thickness compared to other portions. For example, as shown in FIG. 6c, if the end of the cover member (620) is rounded to correspond to the outer shape of the frame (610), the thickness of the cover member (620) may decrease as it approaches the end of the cover member (620). Since the support member (630) is formed thinly in the portion adjacent to the frame bulkhead (610A), the thickness of the end portion (621) of the cover member (620) can be secured, thereby securing the rigidity of the end portion (621) of the cover member (620).

[0079] According to various embodiments, a portion of the cover member (620) may cover a portion of the rear cover (670) that is bonded to the first adhesive member (410).

[0080] In one embodiment, referring to FIG. 6c, a window member (680) facing the lens portion (710) of the camera module (700) may be attached to a support member (630). The window member (680) may be formed of a material that is at least partially transparent so that external light can be incident on the lens portion (710). The window member (680) may be attached to the support member (630) through a third adhesive member (430). In one embodiment, the third adhesive member (430) may be an adhesive member that includes a cushion layer (414) to provide a waterproof function similar to the first adhesive member (410).

[0081] Although the above description was given using the part supporting the camera module (700) among the housing assembly of the electronic device (600) as an example, the structure described above can also be applied to various other parts constituting the external shape of the electronic device. By forming a recess to cover the first adhesive member (410) that requires a compression process and covering the component (support member (630)) attached to the first adhesive member (410), and configuring the structure so that the component (cover member (620)) attached to the component attached to the first adhesive member (410) with the second adhesive member (420) forms the external shape of the electronic device, the height difference of the external shape of the electronic device can be reduced while using the first adhesive member (410) that implements a waterproof function.

[0083] FIGS. 7a through 7d are drawings for illustrating the assembly process of an electronic device according to various embodiments disclosed in this document. FIG. 8 is a cross-sectional view for illustrating the assembly process of an electronic device according to various embodiments disclosed in this document.

[0084] The assembly process of the electronic device described below is merely an example to aid in understanding the present invention, and details such as the assembly sequence and assembly method may be varied. Additionally, for components identical to those described in the drawings above, the same reference numerals are used, and detailed descriptions are omitted.

[0085] In one embodiment, as illustrated in FIGS. 7a and 7b, a support member (630), a rear cover (670), a first adhesive member (410), and an internal member (650) can be combined. The support member (630) and the rear cover (670) may be attached to one side of the first adhesive member (410) (e.g., the side facing the +Z direction in FIG. 7a), and the internal member (650) may be attached to the other side of the first adhesive member (410) (e.g., the side facing the -Z direction in FIG. 7a).

[0086] Next, as illustrated in FIG. 7b, an assembly (700) composed of a support member (630), a rear cover (670), a first adhesive member (410), and an internal member (650) can be attached to a frame (610). The assembly (700) can be attached to the frame (610) by the other side of the first adhesive member (410) being adhered to the frame (610). The first adhesive member (410) is an adhesive member including a cushion layer, and during the process of attaching the first adhesive member (410) to the frame (610), a process of pressing the assembly (700) against the frame (610) may be required. Referring to FIG. 8, the first adhesive member (410) can be attached to the seating portion of the frame (610). At this time, since the outer surface of the assembly (700) in the assembly direction does not overlap with the bulkhead of the frame (610), the assembly (700) does not interfere with the bulkhead of the frame (610), so the assembly (700) can be pressed against the frame (610) without interference. The assembly (700) can be pressed sufficiently against the frame (610) so that the first adhesive member (410) can be sufficiently adhered to the frame (610).

[0087] When the assembly (700) and the frame (610) are combined, the cover member (620) can be attached to the support member (630) through the second adhesive member (420), as shown in FIGS. 7c and 7d. Since the second adhesive member (420) is an adhesive member that does not include a cushion layer, the process of attaching the cover member (620) to the support member (630) through the second adhesive member (420) does not require a compression process, unlike the process of attaching the first adhesive member (410) to the frame (610), or the cover member (620) can be attached to the support member (630) with a relatively small displacement of compression. Therefore, the gap between the cover member (620) and the support member (630) combined through the second adhesive member (420) may be smaller than the gap between the support member (630) and the frame (610) combined through the first adhesive member (410).

[0088] In the embodiment disclosed in this document, the frame (610) partition covers the gap between the support member (630) and the frame (610) so that it is not visible from the outside, and since the gap between the support member (630) and the cover member (620) is small as described above, the height difference in the exterior of the electronic device can be reduced.

[0090] An electronic device according to various embodiments disclosed in this document (e.g., electronic device (101) of FIG. 1, electronic device (200) of FIG. 2a and 2b, electronic device (300) of FIG. 3, electronic device (600) of FIG. 6a) comprises a frame (e.g., frame (610) of FIG. 6a) forming at least a part of the exterior of the electronic device, a seating portion (e.g., seating portion (611) of FIG. 6c) formed concavely in a first direction at a position spaced apart from the outer surface of the frame, a first adhesive member (e.g., first adhesive member (410) of FIG. 6c) attached to the seating portion and comprising a cushion layer (e.g., cushion layer (410) of FIG. 4b), a support member (e.g., support member (630) of FIG. 6c) received in the seating portion in the first direction and attached to the first adhesive member, a second adhesive member (e.g., second adhesive member (420) of FIG. 6c) attached to the support member, and the exterior of the electronic device It may include a cover member (e.g., cover member (620) of FIG. 6c) formed and disposed on the second adhesive member in a second direction opposite to the first direction, and having its position on the support member fixed by the second adhesive member.

[0091] Additionally, the above-mentioned seating portion may be formed deeper than the thickness of the first adhesive member so that the first adhesive member is covered on the outer surface of the frame.

[0092] In addition, the distance between the support member and the cover member joined by the second adhesive member may be smaller than the distance between the seating portion and the support member joined by the first adhesive member.

[0093] Additionally, it may further include an internal member (e.g., the internal member (650) of FIG. 6c) disposed on the inner side of the frame.

[0094] In addition, the first adhesive member can be adhered to the seating portion and the inner member.

[0095] Additionally, a camera module (e.g., camera module (700) of FIG. 6c) may be further included, and the camera module may be accommodated in a camera mounting portion (e.g., camera mounting portion (613) of FIG. 6c) formed by the frame and the internal member.

[0096] Additionally, it may further include a window member (e.g., window member (680) of FIG. 6c) that is formed of at least a portion of a transparent material and is attached to the support member in the second direction so as to face the lens portion (e.g., lens portion (710) of FIG. 6c) of the camera module.

[0097] Additionally, the window member may be bonded to the support member by a third adhesive member (e.g., the third adhesive member (430) of FIG. 6c).

[0098] In addition, the third adhesive member may include a cushion layer.

[0099] Additionally, the cover member may be positioned to cover a rear cover (e.g., the rear cover (670) of FIG. 6c) in which at least a portion is placed on the rear of the electronic device.

[0101] A housing assembly according to various embodiments disclosed in this document may include a frame (e.g., the frame (610) of FIG. 6a), a seating portion (e.g., the seating portion (611) of FIG. 6c) formed concavely in a first direction at a position spaced apart from the outer surface of the frame, a first adhesive member (e.g., the first adhesive member (410) of FIG. 6c) that is adhered to the seating portion and includes a cushion layer (e.g., the cushion layer (410) of FIG. 4b), a support member (e.g., the support member (630) of FIG. 6c) that is received in the seating portion in the first direction and adhered to the first adhesive member, a second adhesive member (e.g., the second adhesive member (420) of FIG. 6c) that is adhered to the support member, and a cover member (e.g., the cover member (620) of FIG. 6c) that forms the exterior of the electronic device and is positioned on the second adhesive member in a second direction opposite to the first direction, so that the position relative to the support member is fixed by the second adhesive member.

[0102] Additionally, the above-mentioned seating portion may be formed deeper than the thickness of the first adhesive member so that the first adhesive member is covered on the outer surface of the frame.

[0103] In addition, the distance between the support member and the cover member joined by the second adhesive member may be smaller than the distance between the seating portion and the support member joined by the first adhesive member.

[0104] Additionally, it may further include an internal member (e.g., the internal member (650) of FIG. 6c) disposed on the inner side of the frame.

[0105] In addition, the first adhesive member can be adhered to the seating portion and the inner member.

[0106] Additionally, it may further include a camera mounting portion (e.g., camera mounting portion (613) of FIG. 6c) formed by the frame and the internal member and accommodating a camera module (e.g., camera module (700) of FIG. 6c).

[0107] Additionally, it may further include a window member (e.g., window member (680) of FIG. 6c) that is formed of at least a portion of a transparent material and is attached to the support member in the second direction so as to face the lens portion (e.g., lens portion (710) of FIG. 6c) of the camera module.

[0108] Additionally, the window member may be bonded to the support member by a third adhesive member (e.g., the third adhesive member (430) of FIG. 6c).

[0109] In addition, the third adhesive member may include a cushion layer.

[0110] Additionally, the cover member may be positioned to cover a rear cover (e.g., the rear cover (670) of FIG. 6c) in which at least a portion is positioned on the rear of the housing assembly.

[0112] The electronic device according to the various embodiments disclosed in this document may be of various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a consumer electronics device. The electronic device according to the embodiments of this document is not limited to the devices described above.

[0113] The various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of said items unless the relevant context clearly indicates otherwise. In this document, phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B or C," "at least one of A, B and C," and "at least one of A, B, or C" may each include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used simply to distinguish said components from other said components and do not limit said components in any other aspect (e.g., importance or order). Where any (e.g., 1st) component is referred to as “coupled” or “connected” to another (e.g., 2nd) component, with or without the terms “functionally” or “communicationly,” it means that said any component may be connected to said other component directly (e.g., via a wire), wirelessly, or through a third component.

[0114] The term “module” as used in the various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. A module may be a component formed integrally, or a minimum unit of said component or a part thereof that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0115] Various embodiments of the present document may be implemented as software (e.g., program (140)) comprising one or more instructions stored in a storage medium (e.g., internal memory (136) or external memory (138)) readable by a machine (e.g., electronic device (101)). For example, a processor (e.g., processor (120)) of the machine (e.g., electronic device (101)) may call at least one of the one or more instructions stored in the storage medium and execute it. This enables the machine to be operated to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. The storage medium readable by the machine may be provided in the form of a non-transitory storage medium. Here, 'non-temporary' simply means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily.

[0116] According to one embodiment, the method according to the various embodiments disclosed herein may be provided by being included in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or an application store (e.g., Play Store). TM It can be distributed online (e.g., downloaded or uploaded) through ) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created on a device-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0117] According to various embodiments, each component (e.g., module or program) of the components described above may include a singular or multiple entities, and some of the multiple entities may be separated and placed in other components. According to various embodiments, one or more of the components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Generally or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as those performed by the corresponding component among the multiple components prior to integration. According to various embodiments, operations performed by the module, program, or other components may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added. Explanation of the symbols

[0119] 410: First adhesive member 420: Second adhesive member 600 : Electronic device 610 : Frame 620: Cover member 630: Support member

Claims

Claim 1 An electronic device comprising: a frame that forms at least a portion of the exterior of the electronic device and includes a seating portion formed concavely in a first direction on the outer surface and a side wall protruding in a second direction opposite to the first direction with respect to the seating portion; a display disposed on the front of the electronic device and supported by the frame; a first adhesive member that is adhered to the seating portion and includes a cushioning layer; a support member that is received in the seating portion in the first direction and adheres to the first adhesive member; a second adhesive member that is adhered to the support member; and a cover member disposed on the back of the electronic device to form the exterior of the electronic device and adheres to the second adhesive member in a second direction opposite to the first direction, so that the position relative to the support member is fixed by the second adhesive member; wherein the support member is disposed between the frame and the cover member and at least a portion is enclosed through the side wall of the frame so as not to be exposed to the outside of the electronic device. Claim 2 An electronic device according to claim 1, wherein the seating portion is formed deeper than the thickness of the first adhesive member so that the first adhesive member is covered on the outer surface of the frame. Claim 3 An electronic device according to claim 1, wherein the distance between the support member and the cover member joined by the second adhesive member is smaller than the distance between the seating portion and the support member joined by the first adhesive member. Claim 4 An electronic device comprising, in claim 1, an internal member disposed inside the frame. Claim 5 In paragraph 4, the first adhesive member is an electronic device that is adhered to the seating portion and the internal member. Claim 6 In paragraph 4, the electronic device further comprises a camera module, wherein the camera module is accommodated in a camera mounting portion formed by the frame and the internal member. Claim 7 An electronic device further comprising, in claim 6, a window member formed of at least a portion of a transparent material and attached to the support member in the second direction so as to face the lens portion of the camera module. Claim 8 In claim 7, the window member is an electronic device that is bonded to the support member by a third adhesive member. Claim 9 In claim 8, the third adhesive member is an electronic device comprising a cushion layer. Claim 10 In claim 1, the cover member is an electronic device arranged to cover a rear cover, at least a portion of which is disposed on the rear of the electronic device. Claim 11 A housing assembly comprising: a frame that forms at least a portion of the exterior of the housing assembly and includes a seating portion formed concavely in a first direction on the outer surface and a side wall protruding in a second direction opposite to the first direction with respect to the seating portion; a display disposed on the front of the housing assembly and supported by the frame; a first adhesive member that is adhered to the seating portion and includes a cushion layer; a support member that is received in the seating portion in the first direction and adheres to the first adhesive member; a second adhesive member that is adhered to the support member; and a cover member disposed on the back of the housing assembly to form the exterior of the housing assembly and adheres to the second adhesive member in a second direction opposite to the first direction, so that the position relative to the support member is fixed by the second adhesive member; wherein the support member is disposed between the frame and the cover member and at least a portion is enclosed by the side wall of the frame so as not to be exposed to the outside of the housing assembly. Claim 12 In claim 11, the above-mentioned seating portion is a housing assembly formed deeper than the thickness of the first adhesive member so that the first adhesive member is covered on the outer surface of the frame. Claim 13 A housing assembly in which the distance between the support member and the cover member joined by the second adhesive member is smaller than the distance between the seating portion and the support member joined by the first adhesive member. Claim 14 A housing assembly further comprising, in claim 11, an internal member disposed on the inner side of the frame. Claim 15 In paragraph 14, the first adhesive member is a housing assembly that is bonded to the seating portion and the internal member. Claim 16 A housing assembly further comprising, in claim 14, a camera mounting portion formed by the frame and the internal member and accommodating a camera module. Claim 17 A housing assembly further comprising, in claim 16, a window member formed of at least a portion of a transparent material and attached to the support member in the second direction so as to face the lens portion of the camera module. Claim 18 In paragraph 17, the window member is a housing assembly that is bonded to the support member by a third adhesive member. Claim 19 In paragraph 18, the third adhesive member is a housing assembly including a cushion layer. Claim 20 In claim 11, the above cover member is a housing assembly arranged to cover a rear cover, at least a portion of which is disposed on the rear of the housing assembly.

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